Domain controller and movable platform

Abstract

The present application provides a domain controller and a movable platform. The domain controller comprises a housing, a first circuit board and a second circuit board. The housing comprises a body, a first end cover and a second end cover; a first mounting recess is formed on a first side of the body in a first direction; the first end cover covers the first mounting recess; a second mounting recess is formed on a second side of the body in the first direction; the second end cover covers the second mounting recess. The first circuit board is disposed in the first mounting recess, and the first circuit board comprises a first heat dissipation chip. The second circuit board is disposed in the second mounting recess, the first circuit board is communicatively connected to the second circuit board, and the second circuit board comprises a second heat dissipation chip. The body further comprises a cooling apparatus, and both the first heat dissipation chip and the second heat dissipation chip abut against the cooling apparatus. The present application can reduce the layout complexity and cost of the domain controller, and also provides a better heat dissipation effect, thereby ensuring that the domain controller has a better information processing capability.

Description

Domain controllers and mobile platforms

[0001] This application claims priority to Chinese Patent Application No. 202422150465.7, filed on September 2, 2024, entitled “Domain Controller and Mobile Platform”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to circuit assembly technology, and more particularly to a domain controller and a mobile platform. Background Technology

[0003] A domain controller is a critical network server used to manage and control computers, users, and resources within a domain. For example, in the automotive field, a domain controller manages and controls various vehicle functions, including but not limited to powertrain, chassis control, and information processing in the smart cockpit. With technological advancements, the requirements for domain controllers are becoming increasingly demanding. For instance, Level 3 / Level 4 autonomous driving technology requires two independent domain controllers; if one domain controller fails, the other can ensure the system's continued operation. However, setting up two domain controllers increases layout complexity and cost. Summary of the Invention

[0004] In order to overcome the above-mentioned defects in related technologies, the purpose of this application is to provide a domain controller and a mobile platform. This application integrates two circuit boards into the same housing, and the two circuit boards are communicatively connected to reduce the layout complexity and cost of the domain controller. In addition, by setting a cooling device, the domain controller has a better heat dissipation effect.

[0005] On one hand, this application provides a domain controller, including:

[0006] The housing includes a body, a first end cap, and a second end cap. The body has a first mounting groove on a first side along a first direction, and the first end cap is disposed on the first mounting groove. The body has a second mounting groove on a second side along the first direction, and the second end cap is disposed on the second mounting groove.

[0007] A first circuit board is disposed in the first mounting slot, and the first circuit board includes a first heat dissipation chip;

[0008] The second circuit board is disposed in the second mounting slot, and the first circuit board is communicatively connected to the second circuit board. The second circuit board includes a second heat dissipation chip.

[0009] The main body also includes a cooling device, and both the first heat dissipation chip and the second heat dissipation chip are in contact with the cooling device.

[0010] In one possible implementation, the cooling device includes a water cooling device and a plurality of heat dissipation fins. The water cooling device is disposed in the body, and the plurality of heat dissipation fins are disposed in the second mounting groove and abut against the water cooling device.

[0011] The first mounting slot is provided with a first heat dissipation protrusion. In a plane perpendicular to the first direction, the projection of the first heat dissipation protrusion is located within the projection range of the plurality of heat dissipation fins. The first heat dissipation chip is abutted against the first heat dissipation protrusion by a first heat dissipation adhesive layer.

[0012] The second mounting slot is provided with a second heat dissipation protrusion, which is connected to the water cooling device. The second heat dissipation chip is abutted against the second heat dissipation protrusion through a second heat dissipation adhesive layer.

[0013] In one possible implementation, the water cooling device includes a water cooling channel and a water cooling end cap formed within the body, the water cooling end cap being disposed on the water cooling channel; the body also includes an inlet pipe and an outlet pipe communicating with the water cooling channel.

[0014] The water-cooled flow channel is provided with multiple guide columns arranged along the first direction;

[0015] The water-cooled flow channel is also provided with two opposing first guide plates and two opposing second guide plates; the two first guide plates are arranged close to the water inlet pipe, and the gap between the two first guide plates gradually decreases towards the water inlet pipe; the two second guide plates are arranged close to the water outlet pipe, and the gap between the two second guide plates gradually decreases towards the water outlet pipe.

[0016] In one possible implementation, a first diverting column may be provided between the two first guide plates, the first diverting column being positioned close to the guide column; and / or, a second diverting column may be provided between the two second guide plates, the second diverting column being positioned close to the guide column.

[0017] In one possible implementation, along the first direction, a plurality of first solder points are provided on a first side of the first circuit board, and the plurality of first solder points are arranged around the perimeter of the first circuit board; a plurality of second solder points are provided on a second side of the first circuit board, and the plurality of second solder points are arranged around the perimeter of the first circuit board.

[0018] The first end cap includes a first cover plate, and the first cover plate is provided with a first flange on the side facing the first mounting groove. In a plane perpendicular to the first direction, the projection of the first flange coincides with the projection of a plurality of first solder points, and the first flange abuts against the plurality of first solder points.

[0019] The first mounting groove further includes a second flange, and in a plane perpendicular to the first direction, the projection of the second flange coincides with the projection of a plurality of second solder points, and the second flange abuts against the plurality of second solder points.

[0020] In one possible implementation, the first end cap further includes a first sidewall, which is disposed around the perimeter of the first cover plate and located on the side of the first cover plate facing the first mounting groove, and a water-blocking groove is formed between the first flange and the first sidewall; the body is also provided with a water-blocking flange on the side facing the first end cap, and the water-blocking flange is located in the water-blocking groove.

[0021] In one possible implementation, the body is further provided with a plurality of first connecting posts on the side facing the first end cap, each of the first connecting posts having a first connecting hole, and the first end cap having a plurality of first through holes, the plurality of first through holes and the plurality of first connecting holes corresponding one to one, and the first fastener being fixedly connected to the corresponding first connecting hole after passing through the first through hole.

[0022] The first circuit board is provided with a plurality of first fixing holes, and the second flange is also provided with a plurality of locking holes. The plurality of first fixing holes and the plurality of locking holes correspond one-to-one. The second fastener is fixedly connected to the corresponding locking hole after passing through the first fixing hole.

[0023] The first circuit board is also provided with several first stress relief grooves, which are located around the first fixing hole near the first heat sink chip, and the first stress relief grooves are located between the first fixing hole and the first heat sink chip.

[0024] In one possible implementation, along the first direction, a plurality of different functional areas are formed on the first side of the second circuit board, and a plurality of third solder points are also provided on the first side of the second circuit board. The plurality of third solder points are located between two adjacent functional areas and around the second circuit board. A plurality of fourth solder points are provided on the second side of the second circuit board. The plurality of fourth solder points include several first sub-solder points and an array of second sub-solder points. The several first sub-solder points are located on one side of the second circuit board, and the array of second sub-solder points are evenly distributed on the second circuit board.

[0025] The second mounting groove further includes a third flange, and in a plane perpendicular to the first direction, the projection of the third flange coincides with the projection of the plurality of third solder points, and the third flange abuts against the plurality of third solder points;

[0026] The second end cap includes a second cover plate. The second cover plate has a fourth flange and a plurality of second connecting posts on the side facing the second mounting groove. In a plane perpendicular to the first direction, the projection of the fourth flange coincides with the projection of a plurality of first sub-solder points, and the projection of the plurality of second connecting posts coincides with the projection of an array of second sub-solder points one by one. The fourth flange abuts against a plurality of first sub-solder points, and the plurality of second connecting posts abut against an array of second sub-solder points respectively.

[0027] In one possible implementation, the second end cap further includes a second sidewall, which is disposed around the second cover plate and located on the side of the second cover plate facing the second mounting groove. The sidewall facing the second cover plate has a plurality of protrusions. A labyrinth groove is also formed between the sidewall of the second mounting groove and the third flange. The second sidewall is located in the labyrinth groove, and the plurality of protrusions abut against the third flange.

[0028] In one possible implementation, the second connecting post is provided with a second through hole, the second mounting groove is provided with a plurality of second connecting holes, the second circuit board is provided with a plurality of second fixing holes, the plurality of second through holes, the plurality of second fixing holes and the plurality of second connecting holes correspond one-to-one, and the third fastener passes through the second through hole and the second fixing hole in sequence and is fixedly connected to the corresponding second connecting hole.

[0029] The second circuit board is also provided with several second stress relief grooves. The second stress relief grooves are located around the second fixing hole near the second heat sink chip, and the second stress relief grooves are located between the second fixing hole and the second heat sink chip.

[0030] In one possible implementation, the body further includes a connector mounting portion, which is disposed through the body along the first direction; a first connector is provided on the first circuit board, and a second connector is provided on the second circuit board; the first connector and the second connector are plugged into each other, and both the first connector and the second connector are located within the connector mounting portion.

[0031] The first end cap includes a first abutting portion, and in a plane perpendicular to the first direction, the projection of the first abutting portion coincides with the projection of the first connector, and the first abutting portion abuts against the first circuit board;

[0032] The second end cap includes a second abutment portion. In a plane perpendicular to the first direction, the projection of the second abutment portion coincides with the projection of the second connector, and the second abutment portion abuts against the second circuit board.

[0033] In one possible implementation, the first circuit board is further provided with a plurality of fifth solder points, which are arranged around the first connector; the first end of the connector mounting portion abuts against the plurality of fifth solder points.

[0034] In one possible implementation, the second circuit board is further provided with a plurality of sixth solder points, which are arranged around the second connector; the second end of the connector mounting portion abuts against the plurality of sixth solder points.

[0035] In one possible implementation, the first circuit board further includes a first cable outlet, and the second circuit board further includes a second cable outlet, with the first cable outlet and the second cable outlet located on opposite sides of the housing along a second direction, respectively.

[0036] The first end cap is provided with a first water-blocking brim, which is used to cover the first outlet.

[0037] The main body is provided with a second water-blocking brim, which is used to cover the second outlet.

[0038] In one possible implementation, one of the first circuit board and the second circuit board is a motherboard, and the other is a backup board. When the motherboard fails, the backup board takes over the functions of the motherboard.

[0039] In one possible implementation, the body may also be provided with multiple connecting parts for connecting to a movable platform.

[0040] On the other hand, this application provides a mobile platform including any of the domain controllers described above.

[0041] This application provides a domain controller and a portable platform. The domain controller includes a housing, a first circuit board, and a second circuit board. The housing includes a body, a first end cover, and a second end cover. The body has a first mounting groove on a first side along a first direction, and the first end cover is disposed on the first mounting groove. The body has a second mounting groove on a second side along the first direction, and the second end cover is disposed on the second mounting groove. The first circuit board is disposed in the first mounting groove and includes a first heat sink chip. The second circuit board is disposed in the second mounting groove, and the first circuit board and the second circuit board are communicatively connected. The second circuit board includes a second heat sink chip. The body also includes a cooling device, and both the first heat sink chip and the second heat sink chip abut against the cooling device. This application integrates the first circuit board and the second circuit board simultaneously within the housing, and the first circuit board and the second circuit board are communicatively connected. Both can realize the functions of the domain controller, thereby reducing the layout complexity and cost of the domain controller. In addition, by setting a cooling device within the housing and having both the first heat sink chip and the second heat sink chip abut against the cooling device, the first heat sink chip and the second heat sink chip are ensured to have good heat dissipation effect, thereby ensuring that the domain controller has good information processing capabilities. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 is a simplified structural diagram of a domain controller provided in an embodiment of this application from a first perspective.

[0044] Figure 2 is a simplified structural diagram of a domain controller provided in an embodiment of this application from a second perspective;

[0045] Figure 3 is a top view of a domain controller provided in an embodiment of this application;

[0046] Figure 4 is a cross-sectional view AA of Figure 3;

[0047] Figure 5 is an exploded view of a domain controller provided in an embodiment of this application;

[0048] Figure 6 is a simplified structural diagram of the body of the shell provided in an embodiment of this application from a first perspective;

[0049] Figure 7 is a top view of Figure 6;

[0050] Figure 8 is a simplified structural diagram of the body of the shell provided in an embodiment of this application from a second perspective;

[0051] Figure 9 is a simplified structural diagram of the first end cap provided in an embodiment of this application from a first perspective.

[0052] Figure 10 is a simplified structural diagram of the first end cap provided in an embodiment of this application from a second perspective;

[0053] Figure 11 is a simplified structural diagram of a first circuit board provided in an embodiment of this application from a first perspective.

[0054] Figure 12 is a simplified structural diagram of a first circuit board provided in an embodiment of this application from a second perspective;

[0055] Figure 13 is a simplified structural diagram of a second circuit board provided in an embodiment of this application from a first perspective;

[0056] Figure 14 is a simplified structural diagram of the second circuit board provided in an embodiment of this application from a second perspective;

[0057] Figure 15 is a simplified structural diagram of the second end cap provided in an embodiment of this application;

[0058] Figure 16 is a magnified view of part A in Figure 15.

[0059] Reference numerals: 100-Outer shell; 110-Body; 111-First mounting groove; 1111-First heat dissipation boss; 1112-Second flange; 1113-Locking hole; 112-Second mounting groove; 1121-Second heat dissipation boss; 1122-Third flange; 1123-Maze groove; 1124-Second connecting hole; 113-Water-blocking flange; 114-First connecting post; 115-Connector mounting part; 116-Second water-blocking cap; 120-First end cap; 121-First cover plate; 122-First flange; 123-First side wall; 124-Water-blocking groove; 125-First through hole; 126-First abutment part; 127-First water-blocking cap; 130-Second end cap; 131-Second cover plate; 132-Fourth flange; 133-Second connecting post; 134- Second sidewall; 1341-Protrusion; 135-Second abutment; 140-Cooling device; 141-Water cooling device; 1411-Water cooling channel; 1412-Water cooling end cap; 1413-Inlet pipe; 1414-Outlet pipe; 1415-Guide column; 1416-First guide plate; 1417-Second guide plate; 1418-First diverter column; 1419-Second diverter column; 142-Heat dissipation fins; 150-Connecting part; 151-Connecting through hole; 200-First circuit board; 210-First heat dissipation chip; 220-First solder point; 230-Second solder point; 240-First fixing hole; 250-First stress relief groove; 260-First connector; 270-Fifth solder point; 280-First cable outlet; 300 - Second circuit board; 310 - Second heat sink chip; 320 - Third solder point; 331 - First sub-solder point; 332 - Second sub-solder point; 340 - Second fixing hole; 350 - Second stress relief groove; 360 - Second connector; 370 - Sixth solder point; 380 - Second cable outlet; 410 - First fastener; 420 - Second fastener; 430 - Third fastener; X - First direction; Y - Second direction. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this application, but not all embodiments.

[0061] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0062] As described in the background section, Level 3 / Level 4 autonomous driving technology requires two independent domain controllers. If one domain controller fails, the other can still ensure the system continues to operate normally. However, setting up two domain controllers increases the complexity and cost of the system layout.

[0063] In view of this, the embodiments of this application aim to provide a domain controller and a portable platform. By integrating a first circuit board and a second circuit board simultaneously within a housing, and with the first and second circuit boards communicatively connected, both can realize the functions of a domain controller, thereby reducing the layout complexity and cost of the domain controller. Furthermore, by providing a cooling device within the housing, and ensuring that both the first and second heat dissipation chips abut against the cooling device, good heat dissipation performance is guaranteed for both the first and second heat dissipation chips, thus ensuring that the domain controller has good information processing capabilities.

[0064] The embodiments of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can gain a more detailed understanding of the content of this application. It should be noted that, in the description of this embodiment, the first direction X and the second direction Y can be, for example, two mutually perpendicular directions in three-dimensional space, wherein the first direction X can be, for example, a vertical direction, and the second direction Y can be, for example, a horizontal direction.

[0065] Please refer to Figures 1-5. This embodiment provides a domain controller, including:

[0066] The outer casing 100 has a shape that can be customized according to assembly requirements. For example, it can be a regular shape such as a prism or cylinder; or it can be an irregular shape. The outer casing 100 includes a body 110, a first end cap 120, and a second end cap 130. The body 110 has a first mounting groove 111 on a first side along a first direction X. The first end cap 120 is fitted onto the first mounting groove 111 and can be fixedly connected to the body 110, for example, by snap-fit ​​or screw connection. The body 110 has a second mounting groove 112 on a second side along the first direction X. The second end cap 130 is fitted onto the second mounting groove 112 and can be fixedly connected to the body 110, for example, by snap-fit ​​or screw connection.

[0067] The first circuit board 200 is disposed within the first mounting groove 111, that is, the first circuit board 200 is disposed within the space enclosed by the first end cover 120 and the first mounting groove 111. The first circuit board 200 includes a first heat dissipation chip 210, and it is understood that the first circuit board 200 also has multiple other electronic components.

[0068] The second circuit board 300 is disposed within the second mounting slot 112, that is, within the space enclosed by the second end cover 130 and the second mounting slot 112. The first circuit board 200 and the second circuit board 300 are communicatively connected, for example, via a communication cable. The second circuit board 300 includes a second heat sink chip 310, and it is understood that the second circuit board 300 also has multiple other electronic components.

[0069] The main body 110 also includes a cooling device 140. Both the first heat dissipation chip 210 and the second heat dissipation chip 310 abut against the cooling device 140, thereby utilizing the cooling device 140 to dissipate the heat generated by the first heat dissipation chip 210 and the second heat dissipation chip 310 during operation, ensuring that the first heat dissipation chip 210 and the second heat dissipation chip 310 have good information processing capabilities. For example, both the first heat dissipation chip 210 and the second heat dissipation chip 310 can abut against the cooling device 140 through a thermally conductive adhesive layer or a thermally conductive pad, thereby better guiding the generated heat into the cooling device 140.

[0070] As described above, this embodiment integrates the first circuit board 200 and the second circuit board 300 within the housing 100, and the first circuit board 200 and the second circuit board 300 are communicatively connected. Both can perform the functions of a domain controller, thus effectively integrating two domain controllers within a single housing 100, reducing the layout complexity and cost of the domain controller. Furthermore, in use, one of the first circuit board 200 and the second circuit board 300 can serve as the mainboard, while the other can serve as a backup board. When the mainboard fails, the backup board can take over and continue to perform the domain controller functions.

[0071] In addition, by providing a cooling device 140 inside the housing 100, and by having the first heat dissipation chip 210 and the second heat dissipation chip 310 both abut against the cooling device 140, the first heat dissipation chip 210 and the second heat dissipation chip 310 are guaranteed to have good heat dissipation effect, thereby ensuring that the domain controller has good information processing capability.

[0072] Referring to Figures 6-8, the cooling device 140 of this embodiment includes a water cooling device 141 and a plurality of heat dissipation fins 142. The water cooling device 141 is disposed inside the main body 110, and the plurality of heat dissipation fins 142 are disposed in the second mounting groove 112, and the plurality of heat dissipation fins 142 are in contact with the water cooling device 141, thereby using the water cooling device 141 to accelerate the heat dissipation speed of the heat dissipation fins 142 and improve the heat dissipation efficiency.

[0073] A first heat dissipation protrusion 1111 is provided in the first mounting groove 111. In a plane perpendicular to the first direction X, the projection of the first heat dissipation protrusion 1111 is located within the projection range of the multiple heat dissipation fins 142. The first heat dissipation chip 210 abuts against the first heat dissipation protrusion 1111 through the first heat dissipation adhesive layer, thereby indirectly abutting against the heat dissipation fins 142. That is to say, in this embodiment, the first heat dissipation chip 210 transfers the dissipated heat to the multiple heat dissipation fins 142 through the first heat dissipation adhesive layer and the first heat dissipation protrusion 1111, thereby dissipating the heat generated by the first heat dissipation chip 210.

[0074] The second mounting groove 112 is provided with a second heat dissipation protrusion 1121, which is connected to the water cooling device 141. The second heat dissipation chip 310 abuts against the second heat dissipation protrusion 1121 through a second heat dissipation adhesive layer, thereby indirectly abutting against the water cooling device 141. In this embodiment, the second heat dissipation protrusion 1121 is formed on the outer shell of the water cooling device 141. The second heat dissipation chip 310 transfers the dissipated heat to the water cooling device 141 through the second heat dissipation adhesive layer and the second heat dissipation protrusion 1121, thereby dissipating the heat generated by the second heat dissipation chip 310.

[0075] Furthermore, the water-cooling device 141 of this embodiment includes a water-cooling flow channel 1411 and a water-cooling end cap 1412 formed within the body 110. The shape of the water-cooling flow channel 1411 can be configured as needed, for example, it can be U-shaped. The water-cooling end cap 1412 covers the water-cooling flow channel 1411. Exemplarily, the water-cooling flow channel 1411 and the water-cooling end cap 1412 can be welded together by means of friction stir welding, brazing, laser welding, etc. Welding can ensure the integration of the water-cooling flow channel 1411 and the water-cooling end cap 1412 and prevent the refrigerant in the water-cooling flow channel 1411 from leaking out. The body 110 also includes an inlet pipe 1413 and an outlet pipe 1414 communicating with the water-cooling flow channel 1411. The inlet pipe 1413 and the outlet pipe 1414 are used to connect to an external water-cooling system, thereby realizing the circulation of refrigerant.

[0076] The water-cooled flow channel 1411 is provided with a plurality of guide columns 1415 arranged along the first direction X. The guide columns 1415 can not only increase the heat dissipation area, but also interfere with the refrigerant flowing through it, forming turbulence and destroying the boundary layer formed between the refrigerant and the inner wall of the water-cooled flow channel 1411, thereby improving the heat dissipation performance of the water-cooling device 141.

[0077] The water-cooled flow channel 1411 is further provided with two opposing first guide plates 1416 and two opposing second guide plates 1417. The two first guide plates 1416 are located close to the inlet pipe 1413, and the gap between the two first guide plates 1416 gradually decreases towards the inlet pipe 1413. The two second guide plates 1417 are located close to the outlet pipe 1414, and the gap between the two second guide plates 1417 gradually decreases towards the outlet pipe 1414. In this embodiment, the two first guide plates 1416 can evenly separate the incoming refrigerant, and the two second guide plates 1417 can evenly merge the outgoing refrigerant, preventing the refrigerant from forming eddies in the water-cooled flow channel 1411 and reducing heat dissipation performance.

[0078] Furthermore, a first diversion column 1418 can be set between the two first guide plates 1416. The first diversion column 1418 is set close to the guide column 1415. By setting the first diversion column 1418, the incoming refrigerant can be better and more evenly separated, which helps to improve the heat dissipation effect.

[0079] A second diversion column 1419 can also be set between the two second guide plates 1417. The second diversion column 1419 is set close to the guide column 1415. By setting the second diversion column 1419, the outflowing refrigerant can be better evenly divided, which helps to improve the heat dissipation effect.

[0080] Please refer to Figures 1-12. Along the first direction X, the first circuit board 200 of this embodiment has a plurality of first solder points 220 on its first side, which surround the perimeter of the first circuit board 200. The second side of the first circuit board 200 has a plurality of second solder points 230, which surround the perimeter of the first circuit board 200. The first solder points 220 and second solder points 230 can be generated by directly drilling holes in the corresponding surface mount stencils and then applying solder paste, according to layout requirements.

[0081] The first end cap 120 includes a first cover plate 121. The first cover plate 121 has a first flange 122 on the side facing the first mounting groove 111. In a plane perpendicular to the first direction X, the projection of the first flange 122 coincides with the projection of a plurality of first solder points 220, and the first flange 122 abuts against the plurality of first solder points 220. It is understood that the first end cap 120 is made of metal. By abutting the first flange 122 against the plurality of first solder points 220, the abutting force of the first flange 122 causes the plurality of first solder points 220 to deform and uniformly abut against the first flange 122 and the first circuit board 200, thereby improving the EMC (Electromagnetic Compatibility) shielding performance.

[0082] The first mounting groove 111 also includes a second flange 1112. In a plane perpendicular to the first direction X, the projection of the second flange 1112 coincides with the projection of a plurality of second solder points 230, and the second flange 1112 abuts against the plurality of second solder points 230. It can be understood that, similar to the function of the first solder point 220, the plurality of second solder points 230 can be uniformly abutted between the second flange 1112 and the first circuit board 200 under the action of the abutting force of the second flange 1112, thereby improving the EMC (Electromagnetic Compatibility) shielding performance.

[0083] Furthermore, the first end cap 120 in this embodiment also includes a first sidewall 123, which surrounds the first cover plate 121 and is located on the side of the first cover plate 121 facing the first mounting groove 111. A water-blocking groove 124 is formed between the first flange 122 and the first sidewall 123. It can be understood that the water-blocking groove 124 is formed by the first flange 122, the first sidewall 123, and the first cover plate 121. A water-blocking flange 113 is also provided on the side of the body 110 facing the first end cap 120. The water-blocking flange 113 is located in the water-blocking groove 124. By inserting the water-blocking flange 113 into the water-blocking groove 124, the waterproof performance between the first end cap 120 and the body 110 can be improved, preventing external moisture from affecting the first circuit board 200.

[0084] For example, in this embodiment, the body 110 facing the first end cap 120 is further provided with a plurality of first connecting posts 114, each with a first connecting hole; the first end cap 120 is provided with a plurality of first through holes 125; the plurality of first through holes 125 and the plurality of first connecting holes correspond one-to-one, and the first fastener 410 is fixedly connected to the corresponding first connecting hole after passing through the first through hole 125. The first fastener 410 can be, for example, a screw, which locks the first end cap 120 and the body 110 together. In this embodiment, the specific number of first through holes 125 and first connecting posts 114 can be set as needed, for example, both can be 2-6.

[0085] The first circuit board 200 has a plurality of first fixing holes 240, and the second flange 1112 has a plurality of locking holes 1113. The plurality of first fixing holes 240 and the plurality of locking holes 1113 correspond one-to-one. A second fastener 420 passes through the first fixing hole 240 and is then fixedly connected to the corresponding locking hole 1113. The second fastener 420 can be, for example, a screw, which secures the first circuit board 200 and the body 110 together. In this embodiment, the specific number of first fixing holes 240 and locking holes 1113 can be set as needed, for example, 2-6 for each.

[0086] When the first circuit board 200 is attached to the body 110, the first solder joints 220 and 230 around the first fixing hole 240 experience greater stress, while the first solder joints 220 and 230 in other areas experience less stress. This height difference may lead to overstress on the first circuit board 200. To prevent damage to critical electronic components on the first circuit board 200 due to excessive stress, this embodiment also provides several first stress relief grooves 250 on the first circuit board 200. These first stress relief grooves 250 are located near the first fixing hole 240 of the first heat sink chip 210, and are situated between the first fixing hole 240 and the first heat sink chip 210. By providing the first stress relief grooves 250, the stress around the first fixing hole 240 can be blocked from being transmitted to the critical electronic component areas on the first circuit board 200, thereby reducing the risk of damage to the critical electronic components on the first circuit board 200.

[0087] Please refer to Figures 1-8 and 13-16. Along the first direction X, the first side of the second circuit board 300 in this embodiment has multiple different functional areas, and the division of different functional areas can be set according to actual needs. The first side of the second circuit board 300 is also provided with multiple third solder points 320, which are located between two adjacent functional areas and around the second circuit board 300. The second side of the second circuit board 300 is provided with multiple fourth solder points, which include several first sub-solder points 331 and an array of second sub-solder points 332. The several first sub-solder points 331 are located on one side of the second circuit board 300, and the array of second sub-solder points 332 are evenly distributed on the second circuit board 300. The second sub-solder points 332 in each group are arranged in multiple rings of different diameters. The third solder points 320 and fourth solder points can be generated by directly drilling holes in the corresponding surface mount stencils and then applying solder paste, according to layout requirements.

[0088] The second mounting groove 112 also includes a third flange 1122. In a plane perpendicular to the first direction X, the projection of the third flange 1122 coincides with the projection of a plurality of third solder points 320, and the third flange 1122 abuts against the plurality of third solder points 320. It can be understood that by abutting the third flange 1122 against the plurality of third solder points 320, the plurality of third solder points 320 can be evenly abutted between the third flange 1122 and the second circuit board 300 under the action of the abutting force of the third flange 1122, thereby improving the EMC shielding performance. In addition, as shown in FIG8, the third flange 1122 is set to correspond to different functional areas on the second circuit board 300, dividing the second mounting groove 112 into multiple independent shielding chambers, which can also improve the EMC shielding performance between different functional areas on the second circuit board 300.

[0089] The second end cap 130 includes a second cover plate 131. The second cover plate 131 is provided with a fourth flange 132 and a plurality of second connecting posts 133 on the side facing the second mounting groove 112. In a plane perpendicular to the first direction X, the projection of the fourth flange 132 coincides with the projection of a plurality of first sub-solder points 331, and the projection of the plurality of second connecting posts 133 coincides with the projection of an array of second sub-solder points 332 one by one. The fourth flange 132 abuts against the plurality of first sub-solder points 331, and the plurality of second connecting posts 133 abut against the array of second sub-solder points 332 respectively. It is understandable that by abutting the fourth flange 132 against several first sub-solder points 331, the abutting force of the fourth flange 132 can make the several first sub-solder points 331 evenly abut between the fourth flange 132 and the second circuit board 300; by abutting the second connecting post 133 against the corresponding second sub-solder point 332, the second connecting post 133 can make the second sub-solder point 332 evenly abut between the second connecting post 133 and the second circuit board 300; through the above settings, the EMC shielding performance can be improved.

[0090] Furthermore, the second end cap 130 in this embodiment also includes a second sidewall 134, which surrounds the second cover plate 131 and is located on the side of the second cover plate 131 facing the second mounting groove 112. The sidewall 134 facing the second cover plate 131 has multiple protrusions 1341. A labyrinth groove 1123 is also formed between the sidewall of the second mounting groove 112 and the third flange 1122. The second sidewall 134 is located within the labyrinth groove 1123, and the multiple protrusions 1341 abut against the third flange 1122. This embodiment improves the EMC shielding performance between the second end cap 130 and the body 110 by inserting the second sidewall 134 into the labyrinth groove 1123 and by using an interference fit to abut against the sidewall of the labyrinth groove 1123 through the protrusions 1341 on the second sidewall 134. In addition, this connection structure can also improve the grounding performance of the domain controller.

[0091] In this embodiment, the second connecting post 133 has a second through hole; the second mounting groove 112 has multiple second connecting holes 1124; the second circuit board 300 has multiple second fixing holes 340; the multiple second through holes, multiple second fixing holes 340, and multiple second connecting holes 1124 correspond one-to-one, and the third fastener 430 passes through the second through hole and the second fixing hole 340 in sequence and is fixedly connected to the corresponding second connecting hole 1124. The third fastener 430 can be, for example, a screw, which locks the second end cover 130, the second circuit board 300, and the body 110 together. In this embodiment, the specific number of the second through hole, the second fixing hole 340, and the second connecting hole 1124 can be set as needed, for example, 3-10 each.

[0092] When the second circuit board 300 is attached to the body 110, the third solder points 320 and 4th solder points around the second fixing hole 340 experience greater stress, while the third solder points 320 and 4th solder points in other areas experience less stress. The height difference between these two areas may lead to the risk of overstress on the second circuit board 300. To prevent damage to critical electronic components on the second circuit board 300 due to excessive stress, this embodiment also provides several second stress relief grooves 350 on the second circuit board 300. The second stress relief grooves 350 are located around the second fixing hole 340 near the second heat sink chip 310, and are located between the second fixing hole 340 and the second heat sink chip 310. By providing the second stress relief grooves 350, the stress around the second fixing hole 340 can be blocked from being transmitted to the critical electronic component area on the second circuit board 300, thereby reducing the risk of damage to the critical electronic components on the second circuit board 300.

[0093] Please refer to Figures 5-15. In this embodiment, the main body 110 further includes a connector mounting portion 115, which extends through the main body 110 along a first direction X. A first connector 260 is provided on the first circuit board 200, and a second connector 360 is provided on the second circuit board 300. The first connector 260 and the second connector 360 are plugged into each other, and both the first connector 260 and the second connector 360 are located within the connector mounting portion 115. This embodiment avoids signal interference between the first connector 260 and the second connector 360 and other electronic components on the first circuit board 200 and the second circuit board 300 by confining them within the connector mounting portion 115.

[0094] Furthermore, the first end cap 120 in this embodiment includes a first abutting portion 126. In a plane perpendicular to the first direction X, the projection of the first abutting portion 126 coincides with the projection of the first connector 260. The first abutting portion 126 abuts against the first circuit board 200, thereby preventing the connection of the first connector 260 from becoming loose and ensuring communication quality.

[0095] Correspondingly, the second end cap 130 includes a second abutment portion 135. In a plane perpendicular to the first direction X, the projection of the second abutment portion 135 coincides with the projection of the second connector 360. The second abutment portion 135 abuts against the second circuit board 300, thereby preventing the connection of the second connector 360 from becoming loose and ensuring communication quality.

[0096] In this embodiment, the first circuit board 200 is further provided with a plurality of fifth solder points 270, which surround the first connector 260; the first end of the connector mounting portion 115 abuts against the plurality of fifth solder points 270. It can be understood that by abutting the first end of the connector mounting portion 115 against the plurality of fifth solder points 270, the plurality of fifth solder points 270 can be evenly abutted between the connector mounting portion 115 and the first circuit board 200 under the action of the abutting force of the connector mounting portion 115, thereby improving the EMC shielding performance and preventing the communication between the first connector 260 and the second connector 360 from interfering with the electronic components on the first circuit board 200.

[0097] Correspondingly, the second circuit board 300 is also provided with a plurality of sixth solder points 370, which are arranged around the second connector 360; the second end of the connector mounting portion 115 abuts against the plurality of sixth solder points 370. It can be understood that by abutting the second end of the connector mounting portion 115 against the plurality of sixth solder points 370, the plurality of sixth solder points 370 can be evenly abutted between the connector mounting portion 115 and the second circuit board 300 under the action of the abutting force of the connector mounting portion 115, thereby improving the EMC shielding performance and preventing the communication between the first connector 260 and the second connector 360 from interfering with the electronic components on the second circuit board 300.

[0098] Understandably, since the first circuit board 200 and the second circuit board 300 are respectively located on both sides of the body 110 in the first direction X, and a corresponding EMC shielding structure is also provided between the connector mounting part 115 and the first circuit board 200 and the second circuit board 300, it is possible to avoid the other circuit board from being affected by the same problem, thus reducing the risk of common cause failure. For example, when water or other liquids intrude, the probability of the first circuit board 200 and the second circuit board 300 failing to work simultaneously can be reduced, thereby reducing the risk of autonomous driving function failure.

[0099] Please refer to Figures 1, 2, 6, and 9. In this embodiment, the first circuit board 200 further includes a first cable outlet 280, and the second circuit board 300 further includes a second cable outlet 380. The first cable outlet 280 and the second cable outlet 380 are respectively located on both sides of the housing 100 along the second direction Y. By placing the first cable outlet 280 and the second cable outlet 380 on both sides of the domain controller along the second direction Y, this embodiment can prevent both cable outlets from being damaged when the domain controller is subjected to external pressure, drops, impacts, etc., thereby improving the reliability of the domain controller and reducing the risk of autonomous driving function failure.

[0100] In this embodiment, the first end cap 120 is provided with a first water-blocking brim 127, which is used to cover the first outlet 280, thereby improving the waterproof performance at the first outlet 280. The body 110 is provided with a second water-blocking brim 116, which is used to cover the second outlet 380, thereby improving the waterproof performance at the second outlet 380.

[0101] Please continue referring to Figures 1 and 2. The main body 110 of this embodiment may also be provided with multiple connecting portions 150. The connecting portions 150 are used to connect to a movable platform, thereby fixing the domain controller to the movable platform. For example, the connecting portion 150 may include a connecting through hole 151, through which fasteners such as screws and bolts can pass and be locked to the movable platform.

[0102] In this embodiment, one of the first circuit board 200 and the second circuit board 300 is the main board, and the other is the backup board. When the main board fails, the backup board takes over the functions of the main board.

[0103] The main body 110 may also be provided with multiple connecting parts for connecting to the movable platform. For example, the connecting part may be a flange provided on the main body 110, with a through hole, through which a fastener passes to connect to the movable platform.

[0104] This embodiment also provides a mobile platform, including the domain controller described above.

[0105] Specifically, the mobile platform in this embodiment can be, for example, a vehicle, a drone, or a robot. The domain controller is located within the mobile platform and processes data to manage and control its various functions. Because of the domain controller, the functions of two domain controllers can be integrated into a single enclosure, reducing layout complexity and cost. The domain controller also has good heat dissipation, ensuring good information processing capabilities. Furthermore, the domain controller can reduce the risk of potential common-cause failures.

[0106] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0107] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0108] It should be noted that in the description of this application, the terms "first" and "second" are used only for convenience in describing different components and should not be construed as indicating or implying a sequential relationship, relative importance, or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of those features.

[0109] The embodiments or implementation methods in this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0110] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with an embodiment or example that are included in at least one embodiment or example of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A domain controller, characterized in that, include: The housing includes a body, a first end cap, and a second end cap. The body has a first mounting groove on a first side along a first direction, and the first end cap is disposed on the first mounting groove. The body has a second mounting groove on a second side along the first direction, and the second end cap is disposed on the second mounting groove. A first circuit board is disposed in the first mounting slot, and the first circuit board includes a first heat dissipation chip; The second circuit board is disposed in the second mounting slot, and the first circuit board is communicatively connected to the second circuit board. The second circuit board includes a second heat dissipation chip. The main body also includes a cooling device, and both the first heat dissipation chip and the second heat dissipation chip are in contact with the cooling device.

2. The domain controller according to claim 1, characterized in that, The cooling device includes a water cooling device and multiple heat dissipation fins. The water cooling device is disposed in the main body, and the multiple heat dissipation fins are disposed in the second mounting slot, and the multiple heat dissipation fins abut against the water cooling device. The first mounting slot is provided with a first heat dissipation protrusion. In a plane perpendicular to the first direction, the projection of the first heat dissipation protrusion is located within the projection range of the plurality of heat dissipation fins. The first heat dissipation chip is abutted against the first heat dissipation protrusion by a first heat dissipation adhesive layer. The second mounting slot is provided with a second heat dissipation protrusion, which is connected to the water cooling device. The second heat dissipation chip is abutted against the second heat dissipation protrusion through a second heat dissipation adhesive layer.

3. The domain controller according to claim 2, characterized in that, The water-cooling device includes a water-cooling channel and a water-cooling end cap formed in the body, the water-cooling end cap being disposed on the water-cooling channel; the body also includes an inlet pipe and an outlet pipe communicating with the water-cooling channel. The water-cooled flow channel is provided with multiple guide columns arranged along the first direction; The water-cooled flow channel is also provided with two opposing first guide plates and two opposing second guide plates; the two first guide plates are arranged close to the water inlet pipe, and the gap between the two first guide plates gradually decreases towards the water inlet pipe; the two second guide plates are arranged close to the water outlet pipe, and the gap between the two second guide plates gradually decreases towards the water outlet pipe.

4. The domain controller according to claim 3, characterized in that, A first diverter column may also be provided between the two first guide plates, with the first diverter column positioned close to the guide column; and / or, a second diverter column may also be provided between the two second guide plates, with the second diverter column positioned close to the guide column.

5. The domain controller according to any one of claims 1-4, characterized in that, Along the first direction, a plurality of first solder points are provided on the first side of the first circuit board, and the plurality of first solder points are arranged around the perimeter of the first circuit board; a plurality of second solder points are provided on the second side of the first circuit board, and the plurality of second solder points are arranged around the perimeter of the first circuit board. The first end cap includes a first cover plate, and the first cover plate is provided with a first flange on the side facing the first mounting groove. In a plane perpendicular to the first direction, the projection of the first flange coincides with the projection of a plurality of first solder points, and the first flange abuts against the plurality of first solder points. The first mounting groove further includes a second flange, and in a plane perpendicular to the first direction, the projection of the second flange coincides with the projection of a plurality of second solder points, and the second flange abuts against the plurality of second solder points.

6. The domain controller according to claim 5, characterized in that, The first end cap further includes a first sidewall, which is arranged around the first cover plate and located on the side of the first cover plate facing the first mounting groove. A water-blocking groove is formed between the first flange and the first sidewall. The body is also provided with a water-blocking flange on the side facing the first end cap, and the water-blocking flange is located in the water-blocking groove.

7. The domain controller according to claim 5, characterized in that, The main body is also provided with a plurality of first connecting posts on the side facing the first end cap. Each first connecting post is provided with a first connecting hole. The first end cap is provided with a plurality of first through holes. The plurality of first through holes and the plurality of first connecting holes correspond one-to-one. The first fastener is fixedly connected to the corresponding first connecting hole after passing through the first through hole. The first circuit board is provided with a plurality of first fixing holes, and the second flange is also provided with a plurality of locking holes. The plurality of first fixing holes and the plurality of locking holes correspond one-to-one. The second fastener is fixedly connected to the corresponding locking hole after passing through the first fixing hole. The first circuit board is also provided with several first stress relief grooves, which are located around the first fixing hole near the first heat sink chip, and the first stress relief grooves are located between the first fixing hole and the first heat sink chip.

8. The domain controller according to any one of claims 1-4, characterized in that, Along the first direction, a plurality of different functional areas are formed on the first side of the second circuit board, and a plurality of third solder points are also provided on the first side of the second circuit board. The plurality of third solder points are located between two adjacent functional areas and around the second circuit board. A plurality of fourth solder points are provided on the second side of the second circuit board. The plurality of fourth solder points include several first sub-solder points and an array of second sub-solder points. The several first sub-solder points are located on one side of the second circuit board, and the array of second sub-solder points are evenly distributed on the second circuit board. The second mounting groove further includes a third flange, and in a plane perpendicular to the first direction, the projection of the third flange coincides with the projection of the plurality of third solder points, and the third flange abuts against the plurality of third solder points; The second end cap includes a second cover plate. The second cover plate has a fourth flange and a plurality of second connecting posts on the side facing the second mounting groove. In a plane perpendicular to the first direction, the projection of the fourth flange coincides with the projection of a plurality of first sub-solder points, and the projection of the plurality of second connecting posts coincides with the projection of an array of second sub-solder points one by one. The fourth flange abuts against a plurality of first sub-solder points, and the plurality of second connecting posts abut against an array of second sub-solder points respectively.

9. The domain controller according to claim 8, characterized in that, The second end cap also includes a second sidewall, which is arranged around the second cover plate and located on the side of the second cover plate facing the second mounting groove. The sidewall facing the second cover plate has a plurality of protrusions. A labyrinth groove is also formed between the sidewall of the second mounting groove and the third flange. The second sidewall is located in the labyrinth groove, and the plurality of protrusions abut against the third flange.

10. The domain controller according to claim 8, characterized in that, The second connecting post is provided with a second through hole, the second mounting groove is provided with a plurality of second connecting holes, the second circuit board is provided with a plurality of second fixing holes, the plurality of second through holes, the plurality of second fixing holes and the plurality of second connecting holes correspond one to one, and the third fastener passes through the second through hole and the second fixing hole in sequence and is fixedly connected to the corresponding second connecting hole. The second circuit board is also provided with several second stress relief grooves. The second stress relief grooves are located around the second fixing hole near the second heat sink chip, and the second stress relief grooves are located between the second fixing hole and the second heat sink chip.

11. The domain controller according to any one of claims 1-4, characterized in that, The body also includes a connector mounting portion, which is disposed through the body along the first direction; a first connector is provided on the first circuit board, and a second connector is provided on the second circuit board, the first connector and the second connector are plugged into each other, and both the first connector and the second connector are located within the connector mounting portion; The first end cap includes a first abutting portion, and in a plane perpendicular to the first direction, the projection of the first abutting portion coincides with the projection of the first connector, and the first abutting portion abuts against the first circuit board; The second end cap includes a second abutment portion. In a plane perpendicular to the first direction, the projection of the second abutment portion coincides with the projection of the second connector, and the second abutment portion abuts against the second circuit board.

12. The domain controller according to claim 11, characterized in that, The first circuit board is also provided with a plurality of fifth solder points, which are arranged around the first connector; the first end of the connector mounting part abuts against the plurality of fifth solder points.

13. The domain controller according to claim 11 or 12, characterized in that, The second circuit board is also provided with a plurality of sixth solder points, which are arranged around the second connector; the second end of the connector mounting portion abuts against the plurality of sixth solder points.

14. The domain controller according to any one of claims 1-4, characterized in that, The first circuit board further includes a first cable outlet, and the second circuit board further includes a second cable outlet, with the first cable outlet and the second cable outlet located on both sides of the housing along the second direction, respectively. The first end cap is provided with a first water-blocking brim, which is used to cover the first outlet. The main body is provided with a second water-blocking brim, which is used to cover the second outlet.

15. The domain controller according to any one of claims 1-4, characterized in that, One of the first circuit board and the second circuit board is the main board, and the other is the backup board. When the main board fails, the backup board takes over the functions of the main board.

16. The domain controller according to any one of claims 1-4, characterized in that, The main body may also be provided with multiple connecting parts, which are used to connect to a movable platform.

17. A mobile platform, characterized in that, This includes the domain controller as described in any one of claims 1-16.

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