Circuit board, connection member, and element

Abstract

According to an aspect of the present invention, a circuit board which includes a base material and a terminal capable of connecting an element to the base material and is constituted such that a color of a target region, which is at least a part of the base material, changes in accordance with a temperature of the target region is provided.

Description

Circuit boards, connecting members and elements

[0001] The present invention relates to a circuit board, a connection member, and an element.

[0002] Patent Document 1 discloses a technology relating to an electronic circuit and an overheat detection method that can detect a temperature rise of a heat-generating component without providing a special temperature detection element. For example, Patent Document 1 discloses an electronic circuit in which a power semiconductor, which is a heat-generating component, is mounted on a substrate, the electronic circuit including: a tin wiring portion made of tin or a wiring material containing tin provided in a part of a wiring pattern that is a current path of a current flowing through the power semiconductor; a voltage detection portion that detects the resistance value of the tin wiring portion as a voltage drop value due to the tin wiring portion; and an overheat determination portion that determines abnormal overheating of the power semiconductor based on the voltage drop value detected by the voltage detection portion.

[0003] Japanese Patent Application Laid-Open No. 2018-129969

[0004] When a current flows through an element, the element may generate heat. For example, if an element generates abnormal heat due to an abnormal operation of the element or an inflow of an overcurrent, the temperature rise of the element or circuit board due to the heat generation may cause deterioration or damage to the element, circuit board, etc. Therefore, there is a need for a technology that can detect such temperature rises in elements, circuit boards, etc. at an early stage.

[0005] According to one aspect of the present invention, there is provided a circuit board comprising a base material and terminals capable of connecting an element to the base material, wherein the color of a target area that is at least a part of the base material is configured to change depending on the temperature of the target area.

[0006] With this configuration, the heat generation state of the element can be visually grasped, and temperature rises in the circuit board or the like can be easily detected at an early stage.

[0007] FIG. 1 is a diagram showing a perspective view of an example of the configuration of a circuit board according to the present embodiment; FIG. 2 is a diagram showing a plan view of the circuit board shown in FIG. 1; FIG. 3 is a diagram showing an example of a change in appearance of an element in the circuit board shown in FIG. 2 due to a change in temperature; FIG. 4 is a diagram showing an example of a circuit board including a reference area; FIG. 5 is a diagram showing a perspective view of an example of the configuration of a circuit board including a connector using a temperature indicating color material; FIG. 6 is a diagram showing an example of a change in appearance of an element in a circuit board including a connector due to a change in temperature; and FIG. 7 is a diagram showing an example of a change in appearance of a circuit board due to a change in temperature of an element when the element has a target area.

[0008] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the accompanying drawings. Various features shown in the following embodiments can be combined with each other.

[0009] FIG. 1 is a perspective view of an exemplary configuration of a circuit board according to this embodiment. FIG. 2 is a plan view of the circuit board shown in FIG. 1. As shown in FIGS. 1 and 2, the circuit board 1 is configured to allow connection of an element 100. As a result, the circuit board 1 is configured to function as an electrical circuit together with the element 100. The element 100 may be an electrical component such as a resistor, capacitor, or inductor, or a composite electronic component such as an integrated circuit component, an LED light source, an amplifier, or a sensor. The element 100 is connected to the circuit board 1 (specifically, a terminal 3 of the circuit board 1). For convenience of explanation, in this embodiment, the element 100 is an integrated circuit component (IC chip). The element 100 includes a housing 101 and connection pins 102. The housing 101 houses an electronic circuit including electronic components such as a semiconductor chip. The connection pins 102 are conductors for connecting the electronic circuit housed inside the housing 101 to the outside. In this embodiment, the circuit board 1 includes a base material 2 and terminals 3.

[0010] The base material 2 is a member that forms the base of the circuit board 1. The base material 2 may have any shape, but in this embodiment, it is a rectangular plate. A conductive pattern (not shown) is formed on the surface or inside of the base material 2, allowing the connected elements 100 to be electrically connected to each other. The base material 2 has a first main surface 21, a second main surface 22, and a side surface 23. Each of the first main surface 21 and the second main surface has a normal along the plane-perpendicular direction D1 and is located opposite the base material 2 in the plane-perpendicular direction D1. The side surface 23 connects the outer periphery of the first main surface 21 and the outer periphery of the second main surface 22 along the plane-perpendicular direction D1. For ease of explanation, two directions perpendicular to the plane-perpendicular direction D1 are referred to as a first in-plane direction D2 and a second in-plane direction D3. The first in-plane direction D2 and the second in-plane direction D3 are perpendicular to each other, and the plane-normal direction D1, the first in-plane direction D2, and the second in-plane direction D3 form a three-dimensional orthogonal coordinate system. The first in-plane direction D2 and the second in-plane direction D3 are directions that can define the in-plane positions of the first main surface 21 and the second main surface 22.

[0011] The terminals 3 are configured to connect an element to the base material 2. The terminals 3 are configured to connect an element 100. For example, the terminals 3 are configured to allow the element 100 to be attached and detached. For example, the terminals 3 may be formed as insertion holes into which the connection pins 102 of the element 100 can be inserted. Examples of circuit boards 1 having such terminals 3 include breadboards and electronic blocks. This configuration makes it easier to intuitively identify areas to avoid touching on circuit boards 1 used for teaching electronic circuits, such as breadboards and electronic blocks. Note that the specific form of the terminals 3 is not limited thereto and may be any form. For example, the terminals 3 may be part of a conductive pattern soldered to the connection pins 102 or a connector connected to the conductive pattern. In this embodiment, the terminals 3 are provided on the second main surface 22 of the base material 2 at equal intervals in each of the first in-plane direction D2 and the second in-plane direction D3, but the form is not limited thereto and may be any form.

[0012] At least a portion of the base material 2 (for example, at least a portion of the second main surface 22 on which the terminals 3 are provided) may be formed using a temperature-indicating color material. For ease of explanation, the region of the second main surface 22 formed using a temperature-indicating color material will be referred to as a target region R1 below.

[0013] A thermochromic material, also known as a thermochromic material, exhibits thermochromic properties that change with temperature. A thermochromic material is, for example, a resin (such as PLA resin) containing a thermochromic pigment (a so-called thermochromic pigment). A thermochromic material is configured to change color by, for example, changing its absorption spectrum in the visible light region in response to temperature changes. For example, as the temperature of the target region R1 increases, the temperature changes so that colors with shorter wavelengths are visible (e.g., purple → blue → green → yellow → orange → red) in order of decreasing temperature. This configuration allows the temperature of the target region R1 to match the color-temperature relationship perceived by humans, thereby enabling the temperature of the target region R1 to be more intuitively grasped. The base material 2 can be formed using a thermochromic material by any method, including 3D printing using the thermochromic material as a raw material or injection molding of the thermochromic material. In this embodiment, since the base material 2 is formed using a temperature-changing color material, the target region R1 can be the entire area of ​​the base material 2 that is visible from the outside. With this configuration, it is possible to obtain a circuit board 1 that changes color depending on the temperature with a relatively simple structure.

[0014] Next, an example of how the appearance of the circuit board 1 changes with temperature changes of the element 100 in the circuit board 1 will be described. FIG. 3 is a diagram showing an example of how the appearance of the circuit board 1 changes with temperature changes of the element in the circuit board shown in FIG. 2. As shown in FIG. 3, first, when the element 100 is not driven, the entire second main surface 22 of the base material 2 shows a substantially uniform color. Then, when the element 100 is driven, the temperature of the element 100 rises due to power loss. Then, heat from the element 100 is transferred to the base material 2 via the second main surface 22. As a result, the temperature of a region R2 of the second main surface 22 adjacent to the element 100 (hereinafter referred to as the temperature-rising region R2) rises due to the transferred heat. Then, the color of the temperature-rising region R2 changes to a color different from that of the region other than the temperature-rising region R2 on the second main surface 22. This allows the heat generation of the element 100 to be visually recognized as a change in color of the base material 2.

[0015] In this manner, the color of the target region R1, which is at least a portion of the base material 2, is configured to change depending on the temperature of the target region. With this configuration, when the temperature of the target region changes due to a temperature change in the element 100 caused by, for example, an abnormal operation of the element 100, the temperature of the element 100 can be visually grasped as the color of the target region. In particular, when the temperature of the target region R1 reaches a specific temperature indicating an abnormal operation of the element 100 (e.g., an operation in which an overcurrent flows, such as a short circuit), the color of the target region R1 can change in a manner that is visually distinguishable from other regions. With this configuration, abnormal operation of the element 100 can be visually grasped, making it possible to provide a circuit board 1 that takes safety into consideration when educating beginners about electrical circuits.

[0016] When the temperature of the heated element 100 subsequently drops due to cooling of the heated element 100, the temperature of the heated region R2 drops as the temperature of the element 100 drops. At this time, the color of the heated region R2 in the target region R1 returns to the color it had before the temperature was raised. In this way, the color of the target region R1 can be configured to change reversibly in response to a change in temperature of the target region R1. With this configuration, the circuit board 1 can be used repeatedly compared to a case where the color changes irreversibly in response to a change in temperature, thereby improving the convenience of the circuit board 1.

[0017] Furthermore, the target region R1 in the circuit board 1 may include a reference region R3. FIG. 4 illustrates an example of a circuit board including a reference region. As shown in FIG. 4, the reference region R3 changes color with temperature in a manner different from that of the target region R1. For example, the reference region R3 may have a color that is difficult to distinguish from that of the target region R1 when the device 100 is not operating or is operating normally. For example, the reference region R3 may be formed of a material other than a temperature-indicating color material. For example, the reference region R3 may be disposed in the peripheral region of the terminal 3. In this embodiment, the reference region R3 is positioned in the second in-plane direction D3 relative to the terminal to which the device 100 is connected. The shape of the reference region R3 is arbitrary, but may be, for example, a symbol (the shape of the words "Caution: High Temperature") to restrict touching the temperature-rising region R2. This configuration intuitively indicates the danger of a temperature rise in the temperature-rising region R2 of the circuit board 1 due to an abnormal operation of the device 100, etc. For example, the reference region R3 may have a color (e.g., a protective color or the same color) that is difficult to discern from the target region R1 when the temperature of the reference region R3 is at a specified temperature that indicates that the element 100 is operating normally (or is not operating).

[0018] Any method can be used to form the reference region R3, and examples of such methods include forming only the region of such a specific pattern using a material other than a temperature color material during 3D printing, or forming the base material 2 using a temperature color material and forming a layer of a material other than a temperature color material on the surface of the second main surface 22 of the base material 2. Note that the reference region R3 may be formed using a different temperature color material having a different relationship between color and temperature from the temperature color material forming the target region R1.

[0019] The target region R1 may be implemented by a connector (an example of a connecting member) using a temperature-indicating color material. FIG. 5 is a perspective view showing an example configuration of a circuit board including a connector using a temperature-indicating color material. As shown in FIG. 5 , the circuit board 1 may further include a connector 4 (two connectors 4a and 4b in this embodiment). The connectors 4a and 4b are members for connecting the element 100 to terminals of the circuit board 1. The connectors 4a and 4b include a housing 41 and contacts 42. The housing 41 is made of an insulator such as resin. The contacts 42 are electrically connected to the terminals 3 and are configured to accept connection of the connection pins 102. A conduction path between the terminals 3 and the connection pins 102 via the contacts 42 is housed within the housing 41. In this embodiment, the contacts 42 are configured to allow the connection pins 102 to be inserted therein.

[0020] The connector 4 may include a target region R1 whose color changes depending on the temperature of the connector 4. As an example, the target region R1 may be implemented by forming the housing 41 of the connector 4 using the above-described temperature-indicating color material. Such a connector 4 may be manufactured by various methods, such as 3D printing using a temperature-indicating color material or injection molding. In this embodiment, the entire connector 4 is formed using a temperature-indicating color material, and therefore the target region R1 may correspond to the entire surface of the connector 4.

[0021] The color of the target region R1 defined by the connector 4 can change, for example, in the following manner. FIG. 6 illustrates an example of how the appearance of a circuit board including a connector changes with temperature changes of an element 100. As shown in FIG. 6, the temperature of the element 100 rises due to power loss associated with the operation of the element 100. Accordingly, heat generated by the element 100 flows into the connector 4 via various paths, such as the connection pin 102, air, and a heat dissipation circuit (not shown). This causes the temperature of the housing 41 of the connector 4 to rise. Subsequently, as the temperature of the housing 41 rises, the temperature of at least the temperature-rising region R2 of the target region R1 changes, and the color of the temperature-rising color material included in the temperature-rising region R2 changes accordingly. This allows the temperature rise or abnormal operation of the element 100 to be intuitively recognized as a color change in the connector 4. By using such a connector 4, the operating status and temperature of the element 100 can be intuitively recognized through color, even for a circuit board not formed with a temperature-rising color material. Therefore, not only the circuit board 1 including the connector 4, but also the connector 4 alone can constitute an independent technical concept.

[0022] Furthermore, in this embodiment, when the temperature of the temperature-rising region R2 decreases due to cooling of the element 100, the color of the temperature-rising region R2 can also change reversibly. In other words, the target region R1 can be configured to reversibly change color in response to temperature changes in the connector 4. This configuration allows the connector 4 to be used repeatedly compared to when the color changes irreversibly in response to temperature changes, thereby improving the convenience of the connector 4. Specifically, when the temperature of the temperature-rising region R2 reaches the same temperature as before the temperature rise due to driving of the element 100, the color of the temperature-rising region R2 changes to the same color as the color of the temperature-rising region R2 before the temperature rise. Note that the target region R1 of the connector 4 may also include a reference region R3, similar to the target region R1 of the circuit board 1. The connector 4 may form part of the base material 2.

[0023] The circuit board 1 may also include an element 100 that includes the target region R1. In this case, at least a portion of the housing 101 of the element 100 may be formed using a temperature colorant. The method for forming the housing 101 may be the same as that for the connector 4 described above, for example.

[0024] Here, we will explain the change in appearance of the circuit board 1 to which the element 100 is connected. FIG. 7 is a diagram showing an example of the change in appearance of a circuit board with a change in the temperature of the element when the element includes a target region. As shown in FIG. 7, as the temperature of the element 100 increases, the temperature of the housing 101 also increases. At this time, instead of (or in addition to) the second main surface 22 described above, the color of at least a portion (i.e., the temperature-rising region R2) of the housing 101 (i.e., the target region R1) changes. In this way, the housing 101 of the element 100 may include a target region R1 visible from the outside. The color of the target region R1 may be configured to change depending on the temperature of the target region R1. By using such an element 100, it is possible to visually notify an operational abnormality of the element 100 even on a circuit board that does not include a temperature indicator. Therefore, when the circuit board 1 includes the element 100, the target region R1 on the circuit board 1 may include at least a portion of the element 100. Furthermore, the element 100 containing such a temperature indicator alone may also constitute an independent technical concept. The element 100 in this case may form part of the base material 2 .

[0025] Furthermore, in this embodiment, when the temperature of the temperature-rising region R2 decreases due to cooling or the like of the element 100, the color of the temperature-rising region R2 also changes reversibly. In this way, the target region R1 of the element 100 can be configured to reversibly change color in response to temperature changes of the element 100. This configuration reduces the possibility of damaging the aesthetic appearance of the element 100 due to temperature changes such as abnormal operation, compared to when the color changes irreversibly in response to temperature changes. Specifically, when the temperature of the temperature-rising region R2 reaches the same temperature as before the temperature rise due to driving or the like of the element 100, the color of the temperature-rising region R2 changes to the same color as the color of the temperature-rising region R2 before the temperature rise.

[0026] 7, the target region R1 of the element 100 may also include a reference region R3, similar to the target region R1 of the circuit board 1 and the target region R1 of the connector 4. For example, the target region R1 of the housing 101 may include a reference region R3 shaped to indicate a symbol (the words "Caution: High Temperature") to restrict touching the heated region R2. This causes the symbol to appear as the temperature of the element 100 rises, alerting the user to the rising temperature of the element 100.

[0027] With the above configuration, it becomes easier to detect a temperature rise of the circuit board 1 or the like at an early stage as a temperature rise region R2 from a change in color of the circuit board 1 or the like, which makes it easier to identify, for example, a portion on the circuit board 1 where an overcurrent is likely to flow (e.g., the element 100).

[0028] Furthermore, since the color change is reversible with respect to the temperature change of the target region R1, for example, the color indicates the current temperature of the target region R1, and therefore it is possible to intuitively present areas that the user should preferably avoid touching directly.

[0029] Furthermore, if the color change occurs in the visible light range, the user can directly see the color change, and therefore, for example, high temperature areas can be immediately identified by the color of the circuit board 1. This makes it easy to visually identify areas on the circuit board 1 where an overcurrent is likely to flow. This also makes it possible to more intuitively present, through the eye, areas that the user should preferably avoid touching directly.

[0030] Furthermore, by including the reference region R3 in the target region R1, the color change in the target region R1 becomes more clearly visible due to the contrast with the reference region R3, which makes it possible to more intuitively and easily convey to the user the temperature rise of the circuit board 1, etc.

[0031] In particular, when the circuit board 1 provided using the above-mentioned thermochromic material has terminals 3 configured so that the elements 100 can be attached and detached, for example, by using the circuit board 1 as a circuit board for teaching electrical circuits, such as a breadboard or electronic blocks, users who are unfamiliar with implementing electrical circuits can be prevented from accidentally touching high-temperature parts through the change in color.

[0032] [Others] The above embodiment can be implemented in the following aspects.

[0033] It is not necessary that the entire reference region R3 is included in the target region R1, but it is sufficient that at least a portion of the reference region R3 is included in the target region R1.

[0034] The target region R1 does not have to be obtained by forming the entire base material 2 using a temperature color indicator. For example, the target region R1 can be obtained by providing a layer containing a temperature color indicator on the surface of the base material 2 formed using a material other than a temperature color indicator, such as a silicon substrate. In other words, the target region R1 can be formed using a temperature color indicator that is configured to change color depending on temperature.

[0035] The connection member is not limited to the connector 4 described above, but may be any connection interface such as a socket, a port, a dock, or a plug.

[0036] The circuit board 1 is not limited to a standardized electronic component such as a printed circuit board, but may represent any component having terminals 3 connectable to the elements 100. For example, the circuit board 1 may function as a component mounted on a substrate (e.g., a component representing a conductive path in an educational electrical circuit kit, an electronic block, etc.). In short, the circuit board 1 may include a base material 2 and any electrical component having terminals 3 connectable to any element 100.

[0037] It may be provided in the following manner.

[0038] (1) A circuit board comprising a base material and a terminal capable of connecting an element to the base material, wherein the color of a target area that is at least a part of the base material is configured to change depending on the temperature of the target area.

[0039] With this configuration, when the temperature of the target area changes due to a change in the temperature of the element caused by abnormal operation of the element or the like, the temperature of the element can be visually grasped as the color of the target area.

[0040] (2) The circuit board according to (1) above, wherein the color of the target area is configured to change reversibly in response to a change in temperature of the target area.

[0041] According to this configuration, the circuit board can be used repeatedly compared to a circuit board whose color changes irreversibly in response to a temperature change, thereby improving the convenience of the circuit board.

[0042] (3) The circuit board according to (1) or (2) above, wherein the target area is formed using a thermochromic material that changes color depending on the temperature of the target area.

[0043] (4) In the circuit board described in (3) above, the target area is configured to change according to the temperature of the target area by forming the base material using the temperature-indicating color material.

[0044] With this configuration, a circuit board whose color changes depending on the temperature can be obtained with a relatively simple structure.

[0045] (5) A circuit board according to any one of (1) to (4) above, wherein the target area includes a reference area whose color changes with temperature in a manner different from that of the target area, and the reference area is configured to make a specific pattern visible within the target area as the temperature of the target area changes.

[0046] With this configuration, it becomes easier to visually distinguish temperature changes in the circuit board.

[0047] (6) The circuit board according to any one of (1) to (5) above, wherein the terminals are configured to allow the elements to be attached and detached.

[0048] With this configuration, it becomes easier to intuitively identify areas that should be avoided from touching on circuit boards such as breadboards and electronic blocks that are used in teaching about electronic circuits.

[0049] (7) A connection member for connecting an element to a terminal of a circuit board, the connection member having a target area that changes color depending on the temperature of the connection member.

[0050] (8) The connection member according to (7) above, wherein the color of the target area is configured to reversibly change in response to a change in temperature of the target area.

[0051] (9) An element connected to a substrate, the element including a target area visible from the outside, the color of the target area being configured to change depending on the temperature of the target area.

[0052] (10) The element according to (9) above, wherein the color of the target area is configured to reversibly change in response to a change in temperature of the element. Of course, this is not a limitation.

[0053] Finally, while various embodiments of the present disclosure have been described, they are presented as examples and are not intended to limit the scope of the invention. The novel embodiments may be embodied in various other forms, and various omissions, substitutions, and modifications may be made without departing from the spirit of the invention. Such embodiments and modifications are intended to be included within the scope and spirit of the invention, as well as within the scope of the inventions and their equivalents as defined in the claims.

[0054] 1: circuit board, 2: base material, 3: terminal, 4: connector, 4a: connector, 4b: connector, 21: first main surface, 22: second main surface, 23: side, 41: housing, 42: contact, 100: element, 101: housing, 102: connection pin, D1: perpendicular direction, D2: first in-plane direction, D3: second in-plane direction, R1: target region, R2: heated region, R3: reference region

Claims

1. A circuit board comprising: a base material; and terminals capable of connecting an element to the base material; wherein a target area that is at least a part of the base material is configured to change color depending on the temperature of the target area.

2. The circuit board according to claim 1, wherein the color of the target area is configured to change reversibly in response to a change in temperature of the target area.

3. A circuit board according to claim 1 or 2, wherein the target area is formed using a thermochromic material that changes color depending on the temperature of the target area.

4. A circuit board according to claim 3, wherein the target area is configured to change in accordance with the temperature of the target area by forming the base material using the thermochromic material.

5. A circuit board according to any one of claims 1 to 4, wherein the target area includes a reference area whose color changes with temperature in a manner different from that of the target area, and the reference area is configured so that a specific pattern can be seen within the target area as the temperature of the target area changes.

6. A circuit board according to any one of claims 1 to 5, wherein the terminals are configured to allow the elements to be attached and detached.

7. A connection member for connecting a component to a terminal of a circuit board, the connection member having a target area that changes color depending on the temperature of the connection member.

8. A connection member according to claim 7, wherein the color of the target area is configured to reversibly change in response to a change in temperature of the target area.

9. An element connected to a substrate, the element including an externally visible target area, the color of the target area being configured to change depending on the temperature of the target area.

10. The device of claim 9, wherein the color of the target area is configured to change reversibly in response to a change in temperature of the device.

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