Immersion cooling module and immersion cooling device comprising immersion cooling module

Abstract

The present invention relates to a cooling device using an immersion cooling module. An immersion cooling device according to one embodiment of the present invention comprises: a server rack that stores a coolant and has a plurality of slots for inserting modules; and a coupling plate that selectively engages with a module inserted into a slot according to the function of the module, wherein the coupling plate includes a first coupler for supplying the introduced coolant to the module and a second coupler for supplying an electrical signal. According to the present invention, significantly higher thermal conductivity and cooling efficiency can be achieved compared to conventional air-cooling methods. The present invention can have the effect of rapidly removing heat generated in a high-performance computing environment, thereby ensuring stable operation of a server and preventing performance degradation.

Description

Immersion cooling module and immersion cooling device including immersion cooling module

[0001] The present invention relates to a cooling device using an immersion cooling module.

[0002] Liquid cooling technology has recently been attracting attention as a data center thermal management technology to overcome the limitations of air cooling.

[0003] Liquid cooling technology can be broadly divided into cold plate-based water cooling technology that circulates liquid to cool high-heat server chips, and liquid immersion cooling technology that uses non-conductive fluid.

[0004] Immersion cooling is a technology that immerses the entire server in a non-conductive liquid. Depending on whether the working fluid undergoes a phase change, it is divided into single-phase immersion cooling and multi-phase (or two-phase) immersion cooling.

[0005] However, despite the advantages of liquid immersion cooling, its commercialization is currently delayed due to the stability and flexibility of air cooling or water cooling methods, and therefore, technologies are being developed to improve stability for the commercialization of liquid immersion cooling.

[0006] For example, in an immersion cooling system, a separate cooling system may be required for each rack, and when these racks need to be cooled at different rates, differences in coolant levels within the various racks may be introduced when varying the cooling rates of the racks by exploiting small flow differences, which may cause a hazard in other racks if the coolant level cooling the other rack is too low or too high. To address this, a configuration is proposed in which at least one of the inlet conduit or the outlet conduit selectively restricts the coolant fluid flow between the coolant manifold and each of the immersion cooling racks (Korean Patent Publication No. 10-2023-0104918 (2023.07.11)).

[0007] To commercialize this type of liquid immersion cooling, it is necessary to develop a server system that is highly stable in its liquid immersion cooling structure and is flexible and expandable compared to existing cooling technologies.

[0008] The present invention aims to propose a device for quickly and efficiently removing heat generated in an electronic device by completely immersing the server module in a non-conductive liquid.

[0009] Specifically, the present invention aims to increase the efficiency of operation and maintenance of a data center by providing a slot structure designed to flexibly arrange server modules, auxiliary cooling modules, dummy modules, auxiliary battery modules, etc.

[0010] The present invention aims to enable management and operation of server racks to be performed more efficiently and stably by enabling various modules to be combined through a multi-plate type joint and supporting various functions such as refrigerant supply, power supply, and data communication.

[0011] The present invention aims to prevent heat concentration and maximize cooling efficiency by strategically placing idle slots or utilizing auxiliary cooling modules, thereby ensuring long-term stability and reliability of the system.

[0012] The present invention aims to ensure continuity of data center operation by supplying power to essential systems such as a Cooling Unit Module (CDU) through an auxiliary battery module even in situations where the main power supply is limited or interrupted.

[0013] The present invention aims to optimize power consumption, reduce the load on the cooling system, thereby reducing the operating costs of a data center and realizing sustainable energy management.

[0014] The purpose of the present invention is not limited to the purposes mentioned above, and other purposes not mentioned can be clearly understood from the description below.

[0015] In order to achieve the above-described object, an immersion cooling device according to one embodiment of the present invention comprises: a server rack having a plurality of slots for storing a refrigerant and inserting a module; and a coupling plate for selectively coupling with a module inserted into the slot according to the function of the module, wherein the coupling plate includes a first coupler for supplying the introduced refrigerant to the module and a second coupler for supplying an electric signal.

[0016] The above module is a server module, and the server module includes: a module case; an electrical device; and a first coupling portion coupled to a first coupler and a second coupler of the coupling plate on one surface of the module case to receive refrigerant and an electrical signal.

[0017] The above module is a distribution module, and the distribution module includes: a module case; and a second coupling portion coupled to the first coupler of the coupling plate on one side of the module case to receive refrigerant; and a guide portion that guides the outflow of the refrigerant supplied according to the coupling of the second coupling portion and the first coupler on one side of the module case.

[0018] The above module is a battery module, and the battery module includes: a module case; a battery to be charged and discharged; and a third coupling part coupled to a second coupler of the coupling plate on one side of the module case to receive an electrical signal.

[0019] The above module is a dummy module, and the dummy module includes: a module case; and a third coupling portion that is decoupled from the first coupler of the coupling plate on one side of the module case to prevent the inflow of refrigerant into the module case.

[0020] The server module and distribution module can be alternately coupled to the slots according to the arrangement order of the slots, and the module case of the server module forms a second guide part inward for forming a vortex by refrigerant flowing out from the guide part of the facing distribution module and refrigerant supplied through the first coupler of the server module.

[0021] The above battery module supplies power to the refrigerant distribution device or the server module through the second coupler when discharged.

[0022] The present invention achieves significantly higher thermal conductivity and cooling efficiency than conventional air-cooling methods. The invention rapidly removes heat generated in high-performance computing environments, ensuring stable server operation and preventing performance degradation.

[0023] The present invention is designed to flexibly place various modules (server modules, auxiliary cooling modules, dummy modules, auxiliary battery modules, etc.) in slots of a server rack, thereby easily changing the system configuration according to the needs of a data center and increasing the operational efficiency of the data center.

[0024] The present invention can prevent heat concentration between server modules and maximize the cooling efficiency of the entire system by strategically placing idle slots or using auxiliary cooling modules.

[0025] Additionally, the auxiliary battery module can ensure the operational continuity of the data center by stably supplying power to essential systems even when the main power supply is interrupted, thereby preventing losses due to system downtime.

[0026] Figure 1 is an exemplary diagram illustrating the configuration of a liquid immersion cooling device according to one embodiment of the present invention.

[0027] FIG. 2 is a diagram illustrating the configuration of a module for providing a multipurpose interface according to one embodiment of the present invention.

[0028] FIG. 3 is a diagram illustrating a server module according to one embodiment of the present invention.

[0029] FIG. 4 is an exemplary diagram illustrating the configuration of a distribution module and a plate according to one embodiment of the present invention.

[0030] Figures 5 and 6 are exemplary diagrams illustrating a detailed configuration of a distribution module according to one embodiment of the present invention.

[0031] Fig. 7 is a diagram illustrating an auxiliary cooling module according to the present embodiment.

[0032] FIG. 8 is a diagram illustrating an auxiliary battery module according to one embodiment of the present invention.

[0033] FIG. 9 is a diagram illustrating a dummy module according to one embodiment of the present invention.

[0034] The following merely exemplifies the principles of the invention. Therefore, those skilled in the art will be able to implement the principles of the invention and invent various devices within the scope and spirit of the invention, even if not explicitly described or illustrated herein. Furthermore, all conditional terms and embodiments listed herein are expressly intended, in principle, to facilitate understanding of the invention, and are not intended to be limiting to the specifically enumerated embodiments and conditions.

[0035] The above-described purposes, features and advantages will become clearer through the following detailed description with reference to the attached drawings, so that a person having ordinary skill in the art to which the invention pertains can easily practice the technical idea of ​​the invention.

[0036] Furthermore, when describing the invention, detailed descriptions of known technologies related to the invention will be omitted if they are deemed to unnecessarily obscure the gist of the invention. Below, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0037] FIG. 1 is an exemplary diagram illustrating the configuration of an immersion cooling device (300) according to one embodiment of the present invention.

[0038] Referring to FIG. 1, the liquid immersion cooling device (300) may be a system that effectively manages the heat generation of a server using a non-conductive liquid. The purpose of this system is to quickly remove the heat generated when server modules (210) are immersed in liquid.

[0039] Below, the main components of the liquid immersion cooling device (300) are described.

[0040] The immersion cooling device (300) includes a server rack (110) that accommodates multiple server modules (210). The server rack (110) can contain a non-conductive liquid to immerse the server modules (210) in the liquid.

[0041] The server modules (210) are arranged in a vertical configuration and can be installed in a plurality of removable slots (105). Each slot (105) is designed to allow easy insertion and removal of the server modules (210), thereby facilitating maintenance and management.

[0042] The liquid used in the immersion cooling device (300) has non-conductive properties, making it safe for use on electronic components. This liquid has high thermal conductivity, allowing it to effectively absorb and remove heat generated from the server module (210).

[0043] A Coolant Distribution Unit (CDU) (not shown) may be a device that manages and circulates non-conductive liquid in a server rack (110). This module can control the temperature of the liquid and circulate the liquid through a pump to release heat generated in the server module (210) to the outside.

[0044] The CDU can also provide the ability to monitor the condition of the liquid and replenish or replace the liquid when necessary.

[0045] The liquid immersion cooling device (300) is designed to efficiently manage heat generated in a high-performance computing environment, thereby optimizing server performance, reducing power consumption, and extending the life of the server.

[0046] Under the control of the CDU, cooled refrigerant is introduced through the inlet (102) at the bottom, and the refrigerant warmed by the generated heat can be discharged through the outlet (107) at the top.

[0047] The immersion cooling device (300) may have an idle slot (105) in which no server module (210) is coupled, and the coupling position may be determined so that the idle slot (105) is located between the server modules (210). The immersion cooling device (300) may consider such a configuration to improve thermal management and system efficiency.

[0048] When server modules (210) are densely packed, heat can be concentrated in certain areas. By interposing idle slots (105), heat can be evenly distributed, minimizing temperature rise in each server module (210). This increases the efficiency of the cooling system and maintains a balanced temperature across each server.

[0049] The immersion cooling device (300) can secure flexibility when adding server modules (210) in the future by appropriately arranging idle slots (105). The immersion cooling device (300) can prepare for an increase in the capacity of the server rack (110) by securing space in advance for adding new server modules (210) when necessary.

[0050] When the idle slot (105) is located between the server modules (210), more space is created for the flow of non-conductive liquid, thereby increasing the cooling efficiency of the entire system. Compared to when the idle slot (105) is not present, the flow of liquid becomes smoother, thereby increasing the heat removal effect.

[0051] For example, the location of idle slots (105) among n slots (105) can be planned in advance. For example, slots (105) can be numbered from 1 to n, and then server modules (210) can be placed in even numbers and idle slots (105) can be placed in odd numbers, etc., so that idle slots (105) can be evenly placed among server modules (210).

[0052] The method of providing idle slots (105) can also be advantageous in improving accessibility for maintenance. Providing space between each server module (210) facilitates physical access and facilitates maintenance work.

[0053] The immersion cooling device (300) can determine the optimal layout based on utilization by comprehensively considering the above factors when considering the layout of the server module (210) and idle slot (105). This maximizes system efficiency and ensures flexibility for future expansion and maintenance.

[0054] The ratio of the used slots (105) to the total slots (105) in the immersion cooling device (300) indicates the usage rate of the server module (210), and the method of utilizing the idle slots (105) may vary depending on this ratio.

[0055] When the temperature exceeds a certain threshold, utilizing the idle slot (105) as an auxiliary cooling module (230) may be a strategy to enhance the cooling performance of the system and optimize thermal management.

[0056] The ratio of used slots (105) to total slots (105) can be calculated as the number of server module (210) slots (105) in use / the number of total slots (105).

[0057] If there are 10 total slots (105), and 7 of them are filled with server modules (210), the utilization rate can be 70%.

[0058] If this ratio exceeds a certain threshold (e.g., 70% or 80%), the idle slot (105) can be utilized as an additional cooling means. This threshold may vary depending on the system's thermal management policy and design.

[0059] The purpose of setting the threshold may be to prevent excessive heat generation and maintain the performance and stability of the server module (210).

[0060] In this embodiment, the immersion cooling device (300) may be coupled with an auxiliary cooling module (230), a dummy module (280), etc., in addition to a server module (210) in an idle slot (105), and in some cases, the slot (105) may be empty.

[0061] Additionally, in order to accommodate flexible configuration possibilities, the immersion cooling device (300) may have a multi-purpose interface at the joint of the slot (105) that can support various devices and functions.

[0062] FIG. 2 is a diagram illustrating the configuration of a module for providing a multipurpose interface according to one embodiment of the present invention.

[0063] Referring to FIG. 2, a module coupled to a slot (105) according to the present embodiment can be coupled with a coupling plate (120) of a multi-plate type (120A).

[0064] The coupling plate (120) may be a multi-purpose interface supporting various modules (e.g., server module (210), auxiliary cooling module (230), dummy module (280)). The coupling plate (120) may include various ports that can perform various functions such as electrical connection, communication, and refrigerant supply.

[0065] This type of joint plate (120) is modular, allowing for easy connection or removal of various devices as needed. This facilitates maintenance and upgrades of the server rack (110).

[0066] The coupling plate (120) includes a communication device that can monitor the status of the modules coupled to each slot (105) and receive control signals. For example, the power status, temperature, usage rate, etc. of the server module (210) can be monitored, or a signal for controlling the operation of the auxiliary cooling module (230) can be transmitted.

[0067] The communication device also includes a data transmission function, enabling data communication between server modules (210) or transmission of system management information to a central server or management system. This can enable overall management and optimization of the system.

[0068] To enable the auxiliary cooling module (230) to be coupled, the multi-plate (120) may include a coupler for supplying refrigerant. This coupler manages the inflow and outflow of refrigerant and can supply appropriate refrigerant to each slot (105) as needed.

[0069] The refrigerant coupler has a flow control function, allowing it to be adjusted to supply more refrigerant to a specific module (e.g., a server module (210) with a high-heat GPU). This optimizes the cooling efficiency of the system.

[0070] The coupling plate (120) may include a power connector capable of supplying power to each module. This allows for a stable supply of power for the operation of the server module (210) or auxiliary cooling module (230).

[0071] In addition to data communication, the multi-plate (120) may include a connection capable of transmitting various signals, such as control signals and status monitoring signals. This enables detailed control and monitoring of the system.

[0072] Safety features can be included to monitor the connection and operating status of each module and automatically issue alerts or disable modules if a problem occurs. This can contribute to increased system stability and reliability.

[0073] In this embodiment, the coupling plate (120) can provide an integrated management interface so that a system administrator can easily monitor and control the status of each module.

[0074] The coupling plate (120) provides a multi-purpose interface that can connect and control various modules in each slot (105) of the server rack (110), thereby maximizing the flexibility and efficiency of the system. This enables more efficient and stable management and operation of the server rack (110).

[0075] FIG. 3 is a diagram illustrating a server module (210) according to one embodiment of the present invention.

[0076] The configuration of the basic server module (210) according to the present invention can be designed to provide optimal performance and flexibility in combination with the coupling plate (120).

[0077] The server module (210) integrates multiple functions for efficient operation and management in a high-performance computing environment such as a data center.

[0078] The server module (210) is coupled within a module case (212), and the module case (212) protects the exterior of the server module (210) and stably accommodates the main electronic components inside.

[0079] The server module (210) includes major electronic devices (215) such as a CPU, GPU, memory, and storage devices. These components are responsible for high-performance calculations and data processing, and devices such as high-heat GPUs in particular require efficient heat management.

[0080] The upper part (220A) of the server module (210) includes a port for data transmission and communication.

[0081] Additionally, a port for power supply to the server module (210) may be located at the top. The power port handles basic power supply.

[0082] Furthermore, the server module (210) may include an additional port that is coupled to the lower multi-plate (120) as the first coupling portion. The additional auxiliary power coupling portion (235) is connected to the second coupler (135) of the coupling plate (120) to perform data communication or system management information transmission between servers.

[0083] The auxiliary power port monitors and controls the status of the server module (210) and can manage the power status, temperature, usage rate, etc. of the server module (210) in real time.

[0084] The server module (210) is designed to be able to receive additional power by being combined with the coupling plate (120), so that even when there are high-heat components or additional power demands, power can be stably supplied to maintain the performance of the module.

[0085] In addition, the server module (210) can efficiently remove heat inside the module by receiving refrigerant through the first coupler (125) of the combined coupling plate (120) including a hydraulic coupler (225) for refrigerant supply.

[0086] The communication port and control port of the server module (210) can be integrated with the central system through coupling with the coupling plate (120). This allows the status of the module to be monitored in real time and control signals to be transmitted when necessary, thereby optimizing the operation of the server module (210).

[0087] FIG. 4 is an exemplary diagram illustrating the configuration of a distribution module (220) and a coupling plate (120) according to one embodiment of the present invention.

[0088] A distribution module (220) can be combined and utilized in an idle slot (105) according to a threshold value.

[0089] A distribution module (220) may be installed in an idle slot (105) to provide additional heat removal. Such a module may be an additional fan, a heat exchanger, or a device that enhances the circulation of non-conductive liquid.

[0090] The distribution module (220) may include a second coupling portion (225) that is coupled to the first coupler (125) of the coupling plate (120) on one side of the module case (222) to receive refrigerant. In addition, the module case (222) may include a guide portion (228) that guides the outflow of the refrigerant supplied by coupling the second coupling portion (225) and the first coupler (125) on one side.

[0091] By installing a distribution module (220) in an idle slot (105), liquid circulation inside the server rack (110) can be optimized and heat removal efficiency can be increased.

[0092] This will help prevent overheating, reduce the load on existing cooling systems, and improve the thermal management capabilities of the entire system.

[0093] When the density of server modules (210) is high, heat concentration may occur. This may result in a decrease in performance and a shortened lifespan of the server modules (210).

[0094] A distribution module (220) can be used to prevent these problems and ensure efficient operation of the entire server rack (110).

[0095] The use of a distribution module (220) can be an important measure to ensure long-term system stability and reliability. This is particularly important in high-density server rack (110) environments, and can contribute to optimizing power consumption and reducing operating costs.

[0096] Therefore, combining a distribution module (220) to an idle slot (105) when the slot (105) utilization ratio exceeds a certain threshold value maintains effective thermal management and system stability.

[0097] Below, a structure designed to effectively cool a server module (210) with a distribution module (220) located on both sides is described.

[0098] Figures 5 and 6 are exemplary diagrams illustrating the detailed configuration of a distribution module (220) according to one embodiment of the present invention.

[0099] The distribution module (220) has a specific physical structure and cooling mechanism, and can play a role in efficiently removing heat inside the server module (210) and controlling the temperature of major components, especially high-heat components such as GPUs.

[0100] Heat can be concentrated in specific areas within the server module (210). To prevent this, the distribution module (220) can form a vortex (circular flow) to evenly distribute the non-conductive liquid. The vortex can effectively circulate the refrigerant around the server module (210), helping to quickly remove heat.

[0101] To form a vortex, the distribution module (220) may include specially designed vanes or fan structures. The guide unit (228) controls the flow of the cooling liquid, helping to ensure continuous movement without heat accumulation. Furthermore, the flow of the liquid can be strengthened to maximize the cooling effect.

[0102] The distribution module (220) can first form a guide section (228) according to the position of the server module (220) to supply refrigerant to a device requiring cooling.

[0103] The server module (210) contains high-performance components such as a CPU and GPU, and the GPU can generate high heat. To effectively manage the temperature of these components, the distribution module (220) may be configured to supply coolant in a concentrated manner to specific areas.

[0104] The distribution module (220) may include a pipeline or channel that directly supplies refrigerant to specific components within the server module (210). This structure allows refrigerant to be preferentially delivered to locations where high-heat components are located, thereby rapidly lowering the temperature of these components.

[0105] Referring to FIG. 6, the server module (210) and the distribution module (220) can be alternately coupled to the slots according to the arrangement order of the slots.

[0106] At this time, the module case of the server module (210) can form a second guide part (218) on the inside of the module case (A) so that the refrigerant flowing out from the guide part (228) of the facing distribution module (220) and the refrigerant supplied through the first coupler of the server module (210) form a vortex.

[0107] That is, the second guide portion (218) formed in the module case of the server module (210) can induce the refrigerant flowing out of the distribution module and the refrigerant supplied to the server module to flow in a specific manner.

[0108] The refrigerant flows toward the server module (210) through the first guide section (228) of the distribution module (220). The flowed refrigerant forms a vortex inside the case of the server module (210). The formation of the vortex can promote efficient flow and heat exchange of the refrigerant.

[0109] Refrigerant is supplied through the first coupler of the server module (210), and the refrigerant forms a vortex within the server module case together with the refrigerant flowing out from the distribution module. The second guide portion (218) on the server module side is a structural element that assists in the formation of this vortex, and can play a role in controlling the flow of the refrigerant and inducing effective heat exchange.

[0110] In this embodiment, heat can be evenly removed from all parts within the server module (210) by forming a vortex. This can prevent system instability due to high heat and contribute to maintaining the overall performance and stability of the server.

[0111] The distribution module (220) can reduce the overall heat load of the server rack (110) by preferentially cooling the components.

[0112] The distribution module (220) may need to be designed to take into account space constraints within the server rack (110). Additionally, it may need to be installed with accessibility in mind to facilitate maintenance and management.

[0113] The design of the distribution module (220) may need to be optimized to provide maximum cooling efficiency while minimizing energy consumption.

[0114] The distribution module (220) can play an important role in optimizing the heat management of the server by effectively cooling the server modules (210) located on both sides of the server rack (110) and, in particular, by preferentially supplying coolant to high-heat devices such as GPUs.

[0115] In this embodiment, the distribution module (220) may include an additional configuration for performing auxiliary cooling of the internal cooling liquid through the coupling plate (120).

[0116] For example, the distribution module (220) can be utilized as an auxiliary cooling module (230) that additionally cools the cooling liquid within the distribution module (220) by configuring a heat sink with secondary cooling.

[0117] Fig. 7 is a diagram illustrating an auxiliary cooling module (230) according to the present embodiment.

[0118] Referring to FIG. 7, the auxiliary cooling module (230) according to an embodiment of the present invention may be an additional cooling device designed to maximize the efficiency of the liquid immersion cooling device (300).

[0119] The auxiliary cooling module (230) effectively cools the server modules (210) located on both sides of the server rack (110), and optimizes heat management of high-heat components such as GPUs in particular.

[0120] In a system where an auxiliary cooling module (230) is positioned, primary cooling is achieved through immersion cooling. The server module (210) is completely immersed in a non-conductive liquid, which effectively absorbs and removes heat from the server module (210). Immersion cooling has high thermal conductivity, so it quickly removes heat generated from the server module (210) and minimizes temperature rise in the server.

[0121] At this time, the auxiliary cooling module (230) can serve as a secondary cooling system to further cool the internal cooling liquid. In this process, the auxiliary cooling module (230) can further lower the temperature of the cooling liquid by configuring a heat sink (236).

[0122] Specifically, the heat sink (236) is positioned in the path through which the coolant passes, so that the coolant can release additional heat as it passes through the heat sink.

[0123] Through this, the cooling liquid, which has already been cooled to a certain extent by the primary immersion cooling, is additionally cooled so that it can maintain a lower temperature when it returns to the server module (210), and the secondary cooling process enables efficient heat removal, especially in the server module (210) with high-heat generating components.

[0124] That is, the additionally cooled cooling liquid passing through the heat sink (236) via the auxiliary cooling module (230) is preferentially supplied to high-heat components, such as the GPU, thereby enabling the temperature of these components to be controlled more effectively.

[0125] Furthermore, in this embodiment, the liquid immersion cooling device (300) can provide power to the main components of the system in situations where power supply is limited by installing an auxiliary battery module (240) in an idle module slot (105) of the server rack (110).

[0126] The liquid immersion cooling unit (300) may be essential to supply power to critical components, such as, for example, the CDU (Cooling Unit (300) Module), to ensure continuity of data center operations.

[0127] FIG. 8 is a diagram illustrating an auxiliary battery module (240) according to one embodiment of the present invention.

[0128] Referring to FIG. 8, the auxiliary battery module (240) according to the present embodiment can serve to supply power to critical systems of the server rack (110) when the main power supply is interrupted or unstable. This can ensure that essential devices, such as the cooling system (CDU), continue to operate.

[0129] The battery module (240) may include a battery (242) that is charged and discharged within a module case, and may include a third coupling portion (245) that is coupled to a second coupler (135) of a coupling plate (120) on one side of the module case to receive an electrical signal.

[0130] These battery modules (240) help the system operate normally by immediately supplying power when power supply is limited or a power outage occurs.

[0131] The CDU (350) effectively cools the server module (210) and may be required to operate to ensure system stability. Therefore, in the event of a power outage, power may need to be quickly supplied from the auxiliary battery module (240) to the CDU (350).

[0132] The auxiliary battery module (240) may include an automatic power supply switching function. This may enable the main power supply to be automatically switched to the auxiliary battery when the main power supply is interrupted, thereby enabling the power supply to be supplied without interruption.

[0133] The multi-plate (120) may include a power bus (243) connected to an auxiliary battery module (240). The power bus (243) may serve to transmit power generated by the auxiliary battery module (240) to the CDU and other important systems.

[0134] The multi-plate (120) also includes a communication interface that monitors the status of the auxiliary battery module (240) and receives and transmits control signals. This allows for real-time monitoring of the charging status, power supply status, etc. of the auxiliary battery.

[0135] A multi-plate (120) with safety features such as overload protection and overvoltage protection can enhance the stability of power supply to the auxiliary battery module (240) and the entire server rack (110). These protection features can prevent damage to the system and ensure safe operation.

[0136] The auxiliary battery module (240) may need to continuously monitor and manage its charging status. The multi-plate (120) is connected to a charging control and management system for this purpose, so that the auxiliary battery can always be kept ready.

[0137] The multi-plate (120) may need to be integrated with the existing server rack (110) power management system. This can efficiently manage the power supply of the entire system and enable rapid switching when necessary.

[0138] This configuration of the auxiliary battery module (240) and multi-plate (120) can be a critical element in enhancing the reliability of a data center. It ensures that the system can operate normally even in situations where power supply is limited or interrupted, and in particular, helps ensure the continued operation of essential components such as the cooling system.

[0139] Additionally, it is also possible to place an auxiliary cooling module (230) or use a dummy module (280) depending on the slot (105) usage rate of the server rack (110).

[0140] FIG. 9 is a diagram illustrating a dummy module (280) according to one embodiment of the present invention.

[0141] Referring to FIG. 9, a dummy module (280) may be utilized to optimize thermal management and operational efficiency of a server system. While the dummy module (280) does not actually provide cooling, it is used to fill a physical space, which may provide several advantages.

[0142] Dummy modules (280) may serve to physically fill empty slots (105) of a server rack (110). They may be simple structures without actual cooling functions, and may help maintain the physical stability of the server rack (110) and control the flow of cooling air or refrigerant.

[0143] The dummy module (280) may include a third coupling portion (285) that prevents the inflow of refrigerant into the module case by being disengaged from the first coupler (125) of the coupling plate (120).

[0144] If there are many empty slots (105), the flow of refrigerant may be guided along an unexpected path, which may reduce efficiency. The dummy module (280) can fill these empty spaces, allowing the refrigerant to flow along the intended path, thereby increasing cooling efficiency.

[0145] The amount of refrigerant required for the entire server rack (110) can be adjusted based on the usage rate of the server modules (210). For example, if the server modules (210) are used less frequently, the amount of refrigerant required may also be reduced. This can be a way to reduce the load on the refrigerant system and save energy.

[0146] The dummy module (280) can contribute to efficient distribution of refrigerant by preventing the refrigerant from flowing to unnecessary locations. This allows cooling efficiency to be concentrated where needed.

[0147] Utilizing a dummy module (280) can reduce the possibility of uncooled air or refrigerant being concentrated in a specific server module (210). This can allow for more sophisticated thermal management within the server rack (110).

[0148] By optimizing the amount of refrigerant and the use of auxiliary cooling modules (230), the operating costs of the entire cooling system can be reduced. By avoiding the use of excessive refrigerant or the excessive installation of auxiliary cooling modules (230), costs associated with energy consumption can be reduced.

[0149] The approach of using a dummy module (280) can increase the flexibility of the server rack (110). It becomes easy to remove the dummy module (280) and install an actual server module (210) or auxiliary cooling module (230) when necessary, and can also be easily handled when reconfiguring or upgrading the server rack (110).

[0150] It becomes possible to adjust the cooling strategy based on changes in system utilization. For example, as server utilization increases, the dummy module (280) can be replaced with an auxiliary cooling module (230) or additional refrigerant supply can be considered.

[0151] This approach can be used to improve the overall thermal management and operational efficiency of a server rack (110), and can play a particularly important role in reducing energy consumption and operating costs.

[0152] Referring to FIG. 10, in some embodiments of the present invention, the immersion cooling device (300) may be implemented in the form of a computing device. At least one of each module constituting the immersion cooling device (300) is implemented on a general-purpose computing processor and thus may include a processor (308), an input / output I / O (302), a memory (340), an interface (306), and a bus (314). The processor (308), the input / output device (302), the memory (340), and / or the interface (306) may be coupled to each other via the bus (314). The bus (314) corresponds to a path through which data is transferred.

[0153] Specifically, the processor (308) may include at least one of a CPU (Central Processing Unit), an MPU (Micro Processor Unit), an MCU (Micro Controller Unit), a GPU (Graphics Processing Unit), a microprocessor, a digital signal processor, a microcontroller, an application processor (AP), and logic elements capable of performing functions similar thereto.

[0154] The input / output device (302) may include at least one of a keypad, a keyboard, a touchscreen, and a display device. The memory device (340) may store data and / or programs, etc.

[0155] The interface (306) may perform a function of transmitting data to or receiving data from a communication network. The interface (306) may be wired or wireless. For example, the interface (306) may include an antenna or a wired / wireless transceiver. The memory (340) may further include high-speed DRAM and / or SRAM, etc., as a volatile operating memory that enhances the operation of the processor (308) while protecting personal information.

[0156] Additionally, the memory (340) stores programming and data configurations that provide the functionality of some or all of the modules described herein. For example, it may include logic for performing selected aspects of the learning method described above.

[0157] A program or application is loaded as a set of instructions including each step of performing the above-described learning method stored in memory (340) and the processor is enabled to perform each step.

[0158] The various embodiments described herein may be implemented in a recording medium readable by a computer or similar device, for example, using software, hardware, or a combination thereof.

[0159] In terms of hardware implementation, the embodiments described herein can be implemented using at least one of ASICs (application specific integrated circuits), DSPs (digital signal processors), DSPDs (digital signal processing devices), PLDs (programmable logic devices), FPGAs (field programmable gate arrays), processors, controllers, micro-controllers, microprocessors, and other electrical modules for performing functions. In some cases, the embodiments described herein can be implemented as a control module itself.

[0160] In a software implementation, the procedures and functions described herein, as well as other embodiments, may be implemented as separate software modules. Each of these software modules may perform one or more of the functions and operations described herein. The software code may be implemented as a software application written in a suitable programming language. The software code may be stored in a memory module and executed by a control module.

[0161] The above description is merely an example of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications, changes, and substitutions can be made without departing from the essential characteristics of the present invention.

[0162] Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate, rather than limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by these embodiments and the accompanying drawings. The protection scope of the present invention should be interpreted by the following claims, and all technical concepts within the scope equivalent thereto should be interpreted as being included within the scope of the rights of the present invention.

Claims

1. In the liquid immersion cooling device, A server rack having a plurality of slots for storing refrigerant and inserting modules; and Includes a coupling plate that provides selective coupling with the module according to the function of the module inserted into the slot, The above-mentioned coupling plate is an immersion cooling device including a first coupler for supplying the introduced refrigerant to the module and a second coupler for supplying an electric signal.

2. In paragraph 1, The above module is a server module, The above server module, module case; electrical devices; and A first coupling part is included on one side of the module case, and is coupled to the first coupler and the second coupler of the coupling plate to receive refrigerant and an electrical signal. Liquid immersion cooling device.

3. In paragraph 2, The above module is a distribution module, The above distribution module, module case; and A second coupling part coupled to the first coupler of the coupling plate on one side of the module case and supplied with refrigerant; and A guide part that guides the outflow of the refrigerant supplied according to the combination of the second coupling part and the first coupler on one side of the module case, Liquid immersion cooling device.

4. In paragraph 1, The above module is a battery module, The above battery module, module case; A rechargeable battery; and A third coupling part is included on one side of the module case and is coupled to the second coupler of the coupling plate to receive an electrical signal. Liquid immersion cooling device.

5. In paragraph 1, The above module is a dummy module, The above dummy module is, module case; and A third coupling portion is included on one side of the module case to prevent the inflow of refrigerant into the module case by being disconnected from the first coupler of the coupling plate. Liquid immersion cooling device.

6. In paragraph 3, The above server module and distribution module can be alternately coupled to the slots according to the arrangement order of the slots, The module case of the above server module forms a second guide part inward for vortex formation by the refrigerant flowing out from the guide part of the facing distribution module and the refrigerant supplied through the first coupler of the server module. Liquid immersion cooling device.

7. In paragraph 4, The above battery module supplies power to the refrigerant distribution device or the server module through the second coupler when discharged. Liquid immersion cooling device.

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