Electronic device including antenna module

Abstract

An electronic device according to various embodiments of the present invention may comprise: a front plate; a rear plate; a side member surrounding a space between the front plate and the rear plate; a first non-conductive portion and a second non-conductive portion formed in the side member; a conductive portion disposed between the first non-conductive portion and the second non-conductive portion; an opening formed through the conductive portion; an antenna module disposed at the position overlapping the opening and at the inner side of the conductive portion; and a conductive pattern disposed on the inner side of the rear plate between the opening and the antenna module.

Description

Electronic device including an antenna module

[0001] Various embodiments of the present invention disclose an electronic device including an antenna module.

[0002] The use of electronic devices such as bar type, foldable type, rollable type or sliding type is increasing, and various functions are being provided to electronic devices.

[0003] The above electronic device can transmit and receive phone calls and various data with other electronic devices via wireless communication.

[0004] The electronic device may include at least one antenna module for performing wireless communication with another electronic device. For example, the electronic device may include at least one antenna module capable of performing wireless communication in a high frequency band (e.g., about 3 GHz to 300 GHz).

[0005] The electronic device uses at least one antenna module to support 5G (5 th generation) can perform wireless communication functions corresponding to the communication band.

[0006] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0007] Next-generation wireless communication technology can transmit and receive wireless signals using a frequency band ranging from approximately 3 GHz to 300 GHz.

[0008] Electronic devices are 5G (5 th generation) communication (e.g., millimeter wave (mmWave) communication), may include at least one antenna module.

[0009] For example, at least one antenna module may be positioned in an inner space of a side member (e.g., a housing) forming the exterior of the electronic device. The antenna module may radiate a wireless signal through an opening formed in the side member.

[0010] As electronic devices become thinner, the height (e.g., width) of the opening formed in the side member may be reduced. If the height of the opening for radiating the wireless signal of the antenna module is reduced, radiation toward the side of the electronic device may decrease, and radiation toward the rear may increase.

[0011] For example, if the radiation of the antenna module decreases in the side direction and increases in the rear direction, the radiation performance of the antenna module may deteriorate.

[0012] Various embodiments of the present invention can provide an electronic device that suppresses a wireless signal of an antenna module from being radiated toward the rear of the electronic device and allows it to be radiated toward the side of the electronic device by using a conductive pattern disposed on a rear plate.

[0013] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0014] An electronic device according to one embodiment of the present invention may include a front plate, a rear plate, and a side member surrounding a space between the front plate and the rear plate. In one embodiment, the electronic device may include a first non-conductive portion and a second non-conductive portion formed on the side member. In one embodiment, the electronic device may include a conductive portion disposed between the first non-conductive portion and the second non-conductive portion. In one embodiment, the electronic device may include an opening formed in the conductive portion and an antenna module disposed at a position overlapping the opening within the conductive portion. In one embodiment, the electronic device may include a conductive pattern disposed on the inner side of the rear plate between the opening and the antenna module.

[0015] According to various embodiments of the present invention, by using a conductive pattern disposed on a rear plate, the radiation performance of the antenna module can be improved by suppressing the radio signal of the antenna module from being radiated toward the rear of the electronic device and allowing it to be radiated toward the side of the electronic device.

[0016] In addition, various effects may be provided, either directly or indirectly, through this document.

[0017] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0018] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0019] FIG. 2 is a block diagram of an electronic device for supporting legacy network communication and 5G network communication according to various embodiments of the present invention.

[0020] FIG. 3A is a perspective view of the front of an electronic device according to various embodiments of the present invention.

[0021] FIG. 3b is a perspective view of the rear surface of an electronic device according to various embodiments of the present invention.

[0022] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0023] FIG. 5a is a schematic diagram showing the configuration of an antenna module according to one embodiment of the present invention.

[0024] FIG. 5b is a cross-sectional view of a YY' portion of the antenna module illustrated in (a) of FIG. 5a according to one embodiment of the present invention.

[0025] FIG. 6 is a cross-sectional view schematically illustrating a portion of an electronic device according to one embodiment of the present invention.

[0026] FIG. 7 is a perspective view schematically showing the arrangement structure of a conductive portion and a conductive pattern of an electronic device according to one embodiment of the present invention.

[0027] FIG. 8 is a drawing schematically showing the radiation characteristics of an antenna module of an electronic device according to one embodiment of the present invention.

[0028] FIG. 9A is a front view of an unfolded state of a foldable electronic device according to various embodiments of the present invention.

[0029] FIG. 9b is a rear view of a foldable electronic device in an unfolded state according to various embodiments of the present invention.

[0030] FIG. 10 is a cross-sectional view schematically illustrating a portion of a foldable electronic device according to various embodiments of the present invention.

[0031] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present invention.

[0032] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0033] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0034] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0035] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0036] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0037] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0039] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0040] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0041] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0043] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0044] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0045] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0047] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0048] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0049] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0050] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0051] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0052] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0053] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0054] FIG. 2 is a block diagram (200) of an electronic device (101) for supporting legacy network communication and 5G network communication according to various embodiments of the present invention.

[0055] Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first radio frequency integrated circuit (RFIC) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), and an antenna (248). The electronic device (101) may further include a processor (120) and a memory (130). The second network (199) may include a first cellular network (292) (e.g., a legacy network) and a second cellular network (294) (e.g., a 5G network).

[0056] According to various embodiments, the electronic device (101) may further include at least one of the components described in FIG. 1, and the second network (199) may further include at least one other network. According to one embodiment, the first communication processor (212), the second communication processor (214), the first RFIC (222), the second RFIC (224), the fourth RFIC (228), the first RFFE (232), and the second RFFE (234) may form at least a portion of the wireless communication module (192). According to various embodiments, the fourth RFIC (228) may be omitted or may be included as a part of the third RFIC (226).

[0057] The first communication processor (212) may support the establishment of a communication channel in a band to be used for wireless communication with the first cellular network (292) and legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network.

[0058] The second communication processor (214) may establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network (294), and may support 5G network communication through the established communication channel. According to various embodiments, the second cellular network (294) may be a 5G network defined by 3GPP. Additionally, according to one embodiment, the first communication processor (212) or the second communication processor (214) may establish a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network (294), and may support 5G network communication through the established communication channel. According to one embodiment, the first communication processor (212) and the second communication processor (214) may be implemented in a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed within a single chip or single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0059] The first RFIC (222) may, upon transmission, convert a baseband signal generated by the first communication processor (212) into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first cellular network (292) (e.g., a legacy network). Upon reception, the RF signal may be acquired from the first cellular network (292) (e.g., a legacy network) via an antenna (e.g., the first antenna module (242)) and preprocessed via an RFFE (e.g., the first RFFE (232)). The first RFIC (222) may convert the preprocessed RF signal into a baseband signal so that it may be processed by the first communication processor (212).

[0060] The second RFIC (224) may, upon transmission, convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal (hereinafter, a 5G Sub6 RF signal) of a Sub6 band (e.g., about 6 GHz or less) used in the second cellular network (294) (e.g., a 5G network). Upon reception, the 5G Sub6 RF signal may be acquired from the second cellular network (294) (e.g., a 5G network) via an antenna (e.g., the second antenna module (244)) and preprocessed via an RFFE (e.g., the second RFFE (234)). The second RFIC (224) may convert the preprocessed 5G Sub6 RF signal into a baseband signal so that the preprocessed 5G Sub6 RF signal may be processed by a corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0061] The third RFIC (226) can convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter, 5G Above6 RF signal) of a 5G Above6 band (e.g., about 6 GHz to about 60 GHz) to be used in the second cellular network (294) (e.g., 5G network). Upon reception, the 5G Above6 RF signal can be acquired from the second cellular network (294) (e.g., 5G network) via an antenna (e.g., antenna (248)) and preprocessed via the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that it can be processed by the second communication processor (214). According to one embodiment, the third RFFE (236) can be formed as a part of the third RFIC (226).

[0062] According to one embodiment, the electronic device (101) may include a fourth RFIC (228) separately from or at least as a part of the third RFIC (226). The fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter, referred to as an IF signal) of an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second network (294) (e.g., a 5G network) via an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) can convert the IF signal into a baseband signal so that the second communication processor (214) can process it.

[0063] In one embodiment, the first RFIC (222) and the second RFIC (224) may be implemented as a single chip or at least a portion of a single package. For example, the first RFFE (232) and the second RFFE (234) may be implemented as a single chip or at least a portion of a single package. In one embodiment, at least one antenna module of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of corresponding multiple bands.

[0064] In one embodiment, the third RFIC (226) and the antenna (248) may be disposed on the same substrate to form a third antenna module (246). For example, the wireless communication module (192) or the processor (120) may be disposed on the first substrate (e.g., the main PCB). For example, the third RFIC (226) may be disposed on a portion (e.g., the bottom surface) of a second substrate (e.g., the sub PCB) separate from the first substrate, and the antenna (248) may be disposed on another portion (e.g., the top surface) of the second substrate, thereby forming the third antenna module (246). By disposing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line therebetween. For example, it is possible to reduce the loss (e.g., attenuation) of signals in a high-frequency band (e.g., about 6 GHz to about 60 GHz) used in 5G network communications due to transmission lines. For example, the electronic device (101) can improve the quality or speed of communication with a second cellular network (294) (e.g., a 5G network). For example, the third antenna module (246) disclosed in FIG. 2 may include the antenna module (197) disclosed in FIG. 1.

[0065] In one embodiment, the antenna (248) may be formed as an antenna array including a plurality of antenna elements that may be used for beamforming. For example, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements as part of the third RFFE (236). Upon transmission, each of the plurality of phase shifters (238) may shift the phase of a 5G Above6 RF signal to be transmitted to an external source (e.g., a base station of a 5G network) of the electronic device (101) via its corresponding antenna element. Upon reception, each of the plurality of phase shifters (238) may shift the phase of a 5G Above6 RF signal received from the external source via its corresponding antenna element to the same or substantially the same phase. This enables transmission or reception via beamforming between the electronic device (101) and the external source.

[0066] The second cellular network (294) (e.g., a 5G network) may operate independently (e.g., Stand-Alone (SA)) or connected to (e.g., Non-Stand Alone (NSA)) the first cellular network (292) (e.g., a legacy network). For example, the 5G network may only have an access network (e.g., a 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In such a case, the electronic device (101) may access an external network (e.g., the Internet) under the control of the core network (e.g., evolved packed core (EPC)) of the legacy network after accessing the access network of the 5G network. Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) may be stored in the memory (130) and accessed by other components (e.g., the processor (120), the first communication processor (212), or the second communication processor (214)).

[0067] FIG. 3A is a perspective view of the front of an electronic device according to various embodiments of the present invention. FIG. 3B is a perspective view of the rear of an electronic device according to various embodiments of the present invention.

[0068] Referring to FIGS. 3A and 3B , an electronic device (300) may include a housing (310) that includes a first side (or front side) (310A), a second side (or back side) (310B), and a side surface (310C) that surrounds a space between the first side (310A) and the second side (310B). In another embodiment (not shown), the housing (310) may refer to a structure that forms a portion of the first side (310A), the second side (310B), and the side surface (310C) of FIGS. 2A and 2B . In one embodiment, the first side (310A) may be formed by a front plate (302) that is at least partially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (310B) may be formed by a substantially opaque back plate (311). The rear plate (311) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side (310C) may be formed by a side bezel structure (318) (or “side member”) that is coupled to the front plate (302) and the rear plate (311) and comprises a metal and / or polymer. In some embodiments, the rear plate (311) and the side bezel structure (318) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0069] In the illustrated embodiment, the front plate (302) may include a first region (310D) that extends seamlessly from the first surface (310A) toward the rear plate (311), at both ends of a long edge of the front plate (302). In the illustrated embodiment, the rear plate (311) may include a second region (310E) that extends seamlessly from the second surface (310B) toward the front plate (302), at both ends of a long edge. In some embodiments, the front plate (302) or the rear plate (311) may include only one of the first region (310D) or the second region (310E). In some embodiments, the front plate (302) may not include the first region (310D) and the second region (310E), and may only include a flat plane that is arranged parallel to the second side (310B). In the above embodiments, when viewed from the side of the electronic device (300), the side bezel structure (318) may have a first thickness (or width) on the side that does not include the first region (310D) or the second region (310E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (310D) or the second region (310E).

[0070] According to one embodiment, the electronic device (300) may include at least one of a display (301), an audio module (303, 307, 314), a sensor module (304, 319), a camera module (305, 312, 313), a key input device (317), an indicator (not shown), and a connector hole (308). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the key input device (317) or the indicator) or may additionally include other components.

[0071] The display (301) may be exposed, for example, through a significant portion of the front plate (302). In some embodiments, at least a portion of the display (301) may be exposed through the front plate (302) forming the first surface (310A) and the first region (310D) of the side surface (310C). In some embodiments, the corners of the display (301) may be formed to be substantially identical to the adjacent outer shape of the front plate (302). In other embodiments (not shown), the gap between the outer edge of the display (301) and the outer edge of the front plate (302) may be formed to be substantially identical in order to expand the area over which the display (301) is exposed.

[0072] In another embodiment (not shown), a recess or opening may be formed in a portion of a screen display area of ​​the display (301), and at least one of an audio module (314), a sensor module (304), and a camera module (305) may be included aligned with the recess or opening. In another embodiment (not shown), at least one of an audio module (314), a sensor module (304), and a camera module (305) may be included on a back surface of the screen display area of ​​the display (301). In another embodiment (not shown), the display (301) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor module (304, 319) and / or at least a portion of the key input device (317) may be disposed in the first area (310D) and / or the second area (310E).

[0073] The audio module (303, 307, 314) may include a microphone hole (303) and a speaker hole (307, 314). The microphone hole (303) may have a microphone disposed inside to acquire external sounds, and in some embodiments, multiple microphones may be disposed to detect the direction of sounds. The speaker hole (307, 314) may include an external speaker hole (307) and a receiver hole (314) for calls. In some embodiments, the speaker hole (307, 314) and the microphone hole (303) may be implemented as a single hole, or a speaker may be included without the speaker hole (307, 314) (e.g., a piezo speaker).

[0074] The sensor module (304, 319) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (300) or an external environmental state. The sensor module (304, 319) can include, for example, a first sensor module (304) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (310A) of the housing (310), and / or a third sensor module (319) (e.g., an HRM sensor) disposed on a second surface (310B) of the housing (310). The fingerprint sensor may be disposed on the first side (310A) of the housing (310) (e.g., the display (301) as well as the second side (310B). The electronic device (300) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0075] The camera modules (305, 312, 313) may include a first camera module (305) disposed on a first side (310A) of the electronic device (300), a second camera module (312) disposed on a second side (310B), and / or a flash (313). The camera modules (305, 312) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (313) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (300).

[0076] The key input device (317) may be disposed on a side surface (310C) of the housing (310). In other embodiments, the electronic device (300) may not include some or all of the above-mentioned key input devices (317), and the key input devices (317) that are not included may be implemented in other forms, such as soft keys, on the display (301). In other embodiments, the key input device (317) may be implemented using a pressure sensor included in the display (301). In some embodiments, the key input device (317) may include a sensor module disposed on a second surface (310B) of the housing (310).

[0077] The indicator may be disposed, for example, on the first surface (310A) of the housing (310). The indicator may provide, for example, status information of the electronic device (300) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of the camera module (305), for example. The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0078] The connector hole (308) may include a first connector hole (308) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0079] Referring to FIG. 3A, a side member (318) (e.g., a side bezel structure) according to one embodiment of the present invention may form at least a portion of the exterior of the electronic device (300). The side member (318) (e.g., a housing (310)) may be formed to surround a space between the front plate (302) and the rear plate (311). For example, the rear plate (311) may be formed of a non-conductive material.

[0080] According to one embodiment, the side member (318) (e.g., the housing (310)) may be formed with a first non-conductive portion (3101) and a second non-conductive portion (3102). For example, the first non-conductive portion (3101) and the second non-conductive portion (3102) may include segments or slits.

[0081] According to one embodiment, a conductive portion (610) (e.g., an antenna radiator) may be formed between the first non-conductive portion (3101) and the second non-conductive portion (3102). For example, the conductive portion (610) may be positioned between the first non-conductive portion (3101) and the second non-conductive portion (3102).

[0082] In one embodiment, the conductive portion (610) may be formed with an opening (605) (e.g., a hole or a slit). For example, the conductive portion (610) may include the opening (605). The opening (605) may radiate a wireless signal of the antenna module (620) in a lateral direction (e.g., in the x-axis direction) of the electronic device (300).

[0083] According to one embodiment, an antenna module (620) (mmWave antenna module) may be disposed inside the conductive portion (610). For example, at least one antenna module (620) may be disposed at a designated location inside the side member (318) or the housing (310) of the electronic device (300). For example, the antenna module (620) may be disposed at a location overlapping an opening (605) formed in the conductive portion (610). The wireless signal of the antenna module (620) may be radiated in the lateral direction (e.g., x-axis direction) of the electronic device (300) through the opening (605). For example, the antenna module (620) may be configured to transmit a 5G (5 th generation) communication (e.g., millimeter wave (mmWave) communication). For example, the antenna module (620) can transmit and / or receive wireless signals using a frequency band ranging from about 3 GHz to 300 GHz.

[0084] FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0085] Referring to FIG. 4, the electronic device (400) may include a side member (410) (e.g., a side bezel structure), a first support member (411) (e.g., a bracket), a front plate (420), a display (430), a printed circuit board (440), a battery (450), a second support member (460) (e.g., a rear case), an antenna (470), and a rear plate (480). In some embodiments, the electronic device (400) may omit at least one of the components (e.g., the first support member (411) or the second support member (460)) or may additionally include other components. At least one of the components of the electronic device (400) may be the same as or similar to at least one of the components of the electronic device (101) of FIGS. 1 and 2, or the electronic device (300) of FIGS. 3A and / or 3B, and any overlapping descriptions will be omitted below.

[0086] The first support member (411) may be disposed inside the electronic device (400) and connected to the side member (410), or may be formed integrally with the side member (410). The first support member (411) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (411) may have a display (430) coupled to one surface and a printed circuit board (440) coupled to the other surface. The printed circuit board (440) may be equipped with, for example, a processor (120), a memory (130), and / or an interface (177) disclosed in FIG. 1. The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0087] The memory (e.g., memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0088] An interface (e.g., interface (177) of FIG. 1) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (400) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0089] The battery (450) is a device for supplying power to at least one component of the electronic device (400), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (450) may be disposed substantially on the same plane as, for example, the printed circuit board (440). The battery (450) may be integrally disposed within the electronic device (400). In another embodiment, the battery (450) may be disposed so as to be detachable from the electronic device (400).

[0090] Antenna (470) may be positioned between the rear plate (480) and the battery (450). The antenna (470) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (470) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side member (410) and / or the first support member (411).

[0091] Referring to FIG. 4, a side member (410) according to one embodiment of the present invention (e.g., side member (318) and / or housing (310) of FIG. 3A) may form at least a portion of the exterior of the electronic device (400). The side member (410) (e.g., housing (310) of FIG. 3A) may be formed to surround a space between a front plate (420) and a rear plate (480). For example, the rear plate (480) may be formed of a non-conductive material.

[0092] According to various embodiments, the side member (410) disclosed in FIG. 4 may be formed substantially identically to the side member (318) and / or housing (310) disclosed in FIG. 3a, with only the reference numbers in the drawings being different.

[0093] According to one embodiment, the side member (410) may be formed with a first non-conductive portion (3101) and a second non-conductive portion (3102). For example, the first non-conductive portion (3101) and the second non-conductive portion (3102) may include segments or slits.

[0094] According to one embodiment, a conductive portion (610) (e.g., an antenna radiator) may be formed between the first non-conductive portion (3101) and the second non-conductive portion (3102). For example, the conductive portion (610) may be positioned between the first non-conductive portion (3101) and the second non-conductive portion (3102).

[0095] In one embodiment, the conductive portion (610) may be formed with an opening (605) (e.g., a hole or a slit). For example, the conductive portion (610) may include the opening (605). The opening (605) may radiate a wireless signal of the antenna module (620) in a lateral direction (e.g., in the x-axis direction) of the electronic device (400).

[0096] According to one embodiment, an antenna module (620) (mmWave antenna module) may be disposed inside the conductive portion (610). For example, at least one antenna module (620) may be disposed at a designated location inside the side member (410) of the electronic device (400). For example, the antenna module (620) may be disposed at a location overlapping an opening (605) formed in the conductive portion (610). A wireless signal of the antenna module (620) may be radiated in the lateral direction (e.g., x-axis direction) of the electronic device (400) through the opening (605). For example, the antenna module (620) may be configured to transmit a 5G (5 thgeneration) communication (e.g., millimeter wave (mmWave) communication). For example, the antenna module (620) can transmit and / or receive wireless signals using a frequency band ranging from about 3 GHz to 300 GHz.

[0097] According to one embodiment, a printed circuit board (440) may be disposed on one surface (e.g., in the -z-axis direction) of a first support member (411). The printed circuit board (440) may include a first PCB (440a) and / or a second PCB (440b). For example, the first PCB (440a) and the second PCB (440b) may be disposed to be spaced apart from each other and may be electrically connected using a connecting member (445) (e.g., a coaxial cable and / or an FPCB). In one embodiment, the printed circuit board (440) may include a structure in which a plurality of printed circuit boards are stacked. For example, the printed circuit board (440) may include an interposer structure. In one embodiment, the printed circuit board (440) may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB).

[0098] According to one embodiment, a printed circuit board (440) is disposed within the side member (410) and may include at least one of a wireless communication module (192) (e.g., a radio frequency integrated circuit) and a processor (120) disclosed in FIGS. 1 and 2.

[0099] According to one embodiment, the conductive portion (610) is electrically connected to a wireless communication module (192) and can operate as a first antenna for transmitting and receiving a wireless signal in a first frequency band (e.g., about 500 MHz to 10 GHz).

[0100] According to one embodiment, the antenna module (620) is electrically connected to the wireless communication module (192) and may operate as a second antenna for transmitting and receiving wireless signals in a second frequency band (e.g., about 3 GHz to 300 GHz). For example, the antenna module (620) may operate through a radio frequency integrated circuit (RFIC) included therein.

[0101] According to various embodiments, the electronic device (400) disclosed in FIG. 4 may substantially identically include the embodiments disclosed in the electronic device (101) of FIGS. 1 and 2 and the electronic device (300) of FIGS. 3A and 3B.

[0102] FIG. 5a is a schematic diagram showing the configuration of an antenna module according to one embodiment of the present invention.

[0103] For example, (a) of FIG. 5A is a perspective view of an antenna module (620) according to an embodiment of the present invention as viewed from one side. For example, (b) of FIG. 5A is a perspective view of an antenna module (620) according to an embodiment of the present invention as viewed from the other side. For example, (c) of FIG. 5A is a cross-sectional view of the X-X' portion of the antenna module (620) disclosed in (a) of FIG. 5A according to an embodiment of the present invention.

[0104] According to various embodiments, the embodiment related to the antenna module (620) according to one embodiment of the present invention can be substantially equally applied to the antenna module (197) disclosed in FIG. 1 or the third antenna (246) disclosed in FIG. 2.

[0105] Referring to (a) to (c) of FIG. 5A, an antenna module (620) according to one embodiment of the present invention may include a circuit board (510) (e.g., a printed circuit board), an antenna array (530), a radio frequency integrated circuit (RFIC) (552), and / or a power management integrated circuit (PMIC) (554). For example, the antenna module (620) may further include a shielding member (590). In one embodiment, at least one of the above-described components may be omitted, or at least two of them may be formed integrally.

[0106] According to one embodiment, the circuit board (510) may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The circuit board (510) may provide electrical connections to various electronic components arranged on the circuit board (510) and / or externally using wires and conductive vias formed on the conductive layers.

[0107] According to one embodiment, the antenna array (530) (e.g., antenna (248) of FIG. 2) may include a plurality of antenna elements (532, 534, 536, or 538) (e.g., conductive patches) arranged to form a directional beam. For example, the antenna elements (532, 534, 536, or 538) may be formed on a first surface (e.g., a top surface) of the circuit board (510). The antenna array (530) may be formed within the circuit board (510). For example, the antenna array (530) may include a plurality of antenna arrays (e.g., dipole antenna arrays and / or patch antenna arrays) of the same shape or different shapes and / or different types.

[0108] In one embodiment, the antenna array (530) of the antenna module (620) may be positioned to overlap with the opening (605) formed in the conductive portion (610) of FIG. 3A or FIG. 4. The antenna array (530) of the antenna module (620) may radiate a wireless signal in a lateral direction (e.g., in the x-axis direction) of the electronic device (400) through the opening (605).

[0109] According to one embodiment, the RFIC (552) (e.g., the third RFIC (226) of FIG. 2) may be disposed on another area of ​​the circuit board (510) (e.g., a second surface (e.g., a bottom surface) opposite the first surface (e.g., the top surface)) that is spaced apart from the antenna array (530). The RFIC (552) may be configured to process signals of a selected frequency band transmitted and / or received via the antenna array (530). For example, the RFIC (552) may, upon transmission, convert a baseband signal obtained from the second communication processor (214) disclosed in FIG. 2 into an RF signal of a designated band. For example, the RFIC (552) may, upon reception, convert an RF signal received via the antenna array (530) into a baseband signal and transmit the converted signal to a communication processor (e.g., the second communication processor (214) disclosed in FIG. 2).

[0110] According to one embodiment, the RFIC (552) may, upon transmission, up-convert an IF signal (e.g., about 9 GHz to 11 GHz) obtained from an intermediate frequency integrated circuit (IFIC) (e.g., the fourth RFIC (228) of FIG. 2) to an RF signal of a selected band. For example, upon reception, the RFIC (552) may down-convert an RF signal obtained through an antenna array (530) to an IF signal and transmit the same to the IFIC (e.g., the fourth RFIC (228) of FIG. 2).

[0111] According to one embodiment, the RFIC (552) may be electrically connected to a first antenna element (532) (e.g., a first conductive patch) via a first feed line (501). The RFIC (552) may be electrically connected to a second antenna element (534) (e.g., a second conductive patch) via a second feed line (502). The RFIC (552) may be electrically connected to a third antenna element (536) (e.g., a third conductive patch) via a third feed line (503). The RFIC (552) may be electrically connected to a fourth antenna element (538) (e.g., a fourth conductive patch) via a fourth feed line (504).

[0112] According to one embodiment, the PMIC (554) may be placed on another area (e.g., the second side) of the circuit board (510) that is spaced apart from the antenna array (530). The PMIC (554) may receive voltage from a printed circuit board (e.g., the first PCB (440a) of FIG. 4) to provide power required for various components (e.g., RFIC (552)) placed on the antenna module (620).

[0113] In one embodiment, a shielding member (590) may be disposed on a portion (e.g., a second side) of the circuit board (510) to electromagnetically shield at least one of the RFIC (552) or the PMIC (554). For example, the shielding member (590) may comprise a shield can.

[0114] According to various embodiments, the antenna module (620) may be electrically connected to another printed circuit board (e.g., the first PCB (440a) of FIG. 4) via a module interface. For example, the module interface may include a conductive connection member (e.g., a coaxial cable, a connector, a board to board connector, a C-clip, an interposer, or a flexible printed circuit board (FPCB). For example, the RFIC (552) and / or PMIC (554) of the antenna module (620) may be electrically connected to a printed circuit board (e.g., the first PCB (440a) of FIG. 4) via a conductive connection member.

[0115] FIG. 5b is a cross-sectional view of the YY' portion of the antenna module illustrated in (a) of FIG. 5a according to one embodiment of the present invention.

[0116] Referring to FIG. 5b, the circuit board (510) may include an antenna layer (511) and a network layer (513).

[0117] According to one embodiment, the antenna layer (511) may include at least one dielectric layer (537-1) and an antenna element (536) (e.g., a third antenna element or a third conductive patch) formed on an outer surface or interior of the dielectric layer (537-1) and / or a feed portion (525). For example, the feed portion (525) may include a feed point (527) and / or a feed line (503) (e.g., a third feed line).

[0118] According to one embodiment, the network layer (513) may include at least one dielectric layer (537-2), at least one ground layer (533), at least one conductive via (535), a transmission line (523), and / or a signal line (539) formed on an outer surface or interior of the dielectric layer (537-2).

[0119] According to one embodiment, the RFIC (552) illustrated in (c) of FIG. 5a (e.g., the third RFIC (226) of FIG. 2) may be electrically connected to the network layer (513) via the first connection portion (540-1) and / or the second connection portion (540-2). For example, the RFIC (552) may be electrically connected to the network layer (513) via various connection members (e.g., solder bumps) in addition to the first connection portion (540-1) and the second connection portion (540-2).

[0120] In one embodiment, the RFIC (552) may be electrically connected to the antenna element (536) via the first connection portion (540-1), the transmission line (523), and the feed portion (525). For example, the RFIC (552) may be electrically connected to the ground layer (533) via the second connection portion (540-2) and the conductive via (535). For example, the RFIC (552) may be electrically connected to the module interface described above via the signal line (539).

[0121] FIG. 6 is a cross-sectional view schematically illustrating a portion of an electronic device according to one embodiment of the present invention.

[0122] According to one embodiment, FIG. 6 may be a cross-sectional view of a section 6-6' of the electronic device (300) disclosed in FIG. 3A, viewed in the y-axis direction or the -y-axis direction. According to various embodiments, FIG. 6 may be a schematic cross-sectional view of a portion of the display (430), the rear plate (480), and the conductive portion (610) of the electronic device (400) disclosed in FIG. 4 in a coupled state, viewed in the y-axis direction or the -y-axis direction.

[0123] According to various embodiments, the embodiments of the electronic device (400) disclosed below may substantially include the embodiments disclosed in FIGS. 1 to 5B described above. In the description of the electronic device (400) disclosed below, the same reference numerals are given to components that are substantially the same as those in the embodiments disclosed in FIGS. 1 to 5B described above, and redundant descriptions thereof may be omitted.

[0124] Referring to FIG. 6, according to one embodiment of the present invention, an electronic device (400) may include a display (430), a back plate (480), a conductive portion (610), an opening (605), an antenna module (620), and / or a conductive pattern (630).

[0125] According to one embodiment, a display (430) (e.g., display (301) of FIG. 3A) may be disposed in the z-axis direction of the electronic device (400). A front plate (420) (e.g., front plate (302) of FIG. 3A) may be disposed in the z-axis direction of the display (430). The display (430) may be disposed adjacent to the front plate (420). At least a portion of the display (430) may be exposed to the outside of the electronic device (400) through the front plate (420).

[0126] According to one embodiment, the back plate (480) (e.g., the back plate (311) of FIG. 3A) may be positioned in the −z-axis direction of the electronic device (400). For example, the back plate (480) may be formed of a non-conductive material. For example, the back plate (480) may partially include the non-conductive material.

[0127] According to one embodiment, a conductive portion (610) (e.g., an antenna radiator) may be formed on a side member (410) surrounding a space between a front plate (420) (or a display (430)) and a back plate (480). For example, the conductive portion (610) may be disposed between a first non-conductive portion (3101) and a second non-conductive portion (3102) formed on the side member (410). For example, the conductive portion (610) may be electrically connected to a wireless communication module (192) (e.g., an RFIC) included in a printed circuit board (440) (e.g., a first PCB (440a)) and may operate as a first antenna for transmitting and receiving a wireless signal in a first frequency band. For example, the first frequency band may include a range of about 500 MHz to 10 GHz.

[0128] In one embodiment, the conductive portion (610) may include an opening (605). For example, the opening (605) may be formed in the x-axis direction of the side member (410). The opening (605) may include a hole or slit formed in the conductive portion (610).

[0129] In one embodiment, an opening (605) can be formed in the conductive portion (610). The opening (605) can transmit and receive a wireless signal of the antenna module (620). For example, the opening (605) can radiate a first polarization (e.g., vertical polarization) in the x-axis direction of the antenna module (620). For example, the opening (605) can be formed in the conductive portion (610) to have a height less than half a wavelength based on the lowest frequency of a second frequency band (e.g., about 3 GHz to 300 GHz) of the antenna module (620).

[0130] According to various embodiments, the opening (605) may include at least one of a first non-conductive member (601) and a second non-conductive member (602). For example, at least one of the first non-conductive member (601) and the second non-conductive member (602) may be disposed in the opening (605).

[0131] According to various embodiments, the first non-conductive member (601) may be positioned in the x-axis direction within the opening (605). For example, the first non-conductive member (602) may include a material having a first permittivity (e.g., 7 to 10).

[0132] According to various embodiments, the second non-conductive member (602) can be disposed in the -x-axis direction within the opening (605). For example, the second non-conductive member (602) can be disposed inside (e.g., in the -x-axis direction) of the first non-conductive member (601) disposed in the opening (605). For example, the second non-conductive member (602) can include a material having a second permittivity (e.g., about 11 to 13) that is higher than a first permittivity (e.g., about 7 to 10) of the first non-conductive member (601).

[0133] According to one embodiment, the antenna module (620) may be disposed inside (e.g., in the -x-axis direction) of the side member (410) (e.g., the housing (310) of FIG. 3A). For example, the antenna module (620) may be disposed at a position adjacent to the conductive portion (610) formed on the side member (410). For example, the antenna module (620) may be disposed in the y-axis direction perpendicular to the x-axis direction of the electronic device (400). For example, the antenna module (620) may be disposed in substantially the same direction as the y-axis direction of the electronic device (400).

[0134] According to one embodiment, the antenna module (620) may be positioned to overlap with the opening (605) formed in the conductive portion (610). For example, the antenna module (620) may be positioned on the inside (e.g., in the -x-axis direction) of the conductive portion (610). The wireless signal of the antenna module (620) may be radiated (e.g., first polarization or vertical polarization) to the side (e.g., in the x-axis direction) of the electronic device (400) through the opening (605). For example, the antenna module (620) may be positioned to overlap with the opening (605) formed in the conductive portion (610). th generation) can perform communication. For example, the antenna module (620) can operate as a second antenna that transmits and receives a wireless signal of a second frequency band. For example, the second frequency band can include a range of about 3 GHz to 300 GHz.

[0135] According to various embodiments, the antenna module (620) can radiate a first polarization (e.g., vertical polarization) through the opening (605). For example, the antenna module (620) can radiate a second polarization (e.g., horizontal polarization) through the rear plate (480). For example, when the antenna module (620) is disposed in the y-axis direction perpendicular to the x-axis direction of the electronic device (400), if the second polarization (e.g., horizontal polarization) is radiated through the rear plate (480), the radiation performance of the antenna module (620) may be degraded. For example, the second polarization (e.g., horizontal polarization) of the antenna module (620) can be suppressed and / or attenuated through the conductive pattern (630) disposed on the rear plate (480).

[0136] In one embodiment, the conductive pattern (630) may be disposed between the opening (605) and the back plate (480). For example, the conductive pattern (630) may be disposed between the antenna module (620) and the back plate (480). For example, the conductive pattern (630) may be disposed on the inside of the back plate (480) between the opening (605) and the antenna module (620). For example, the conductive pattern (630) may be disposed between the conductive portion (610) and the conductive electrical material (650). For example, the conductive pattern (630) may be disposed on a portion of the back plate (480). For example, the conductive pattern (630) may be spaced apart from the conductive portion (610). For example, the separation distance between the conductive pattern (630) and the conductive portion (610) may be about 0.5 mm to 0.7 mm. The conductive pattern (630) may not be electrically connected to the conductive portion (610). For example, the conductive pattern (630) may include a reflector. For example, the conductive pattern (630) may include a conductive plate, a conductive sheet, a conductive coating layer, or a conductive plating layer.

[0137] In one embodiment, the conductive pattern (630) can attenuate at least a portion of a second polarization (e.g., a horizontal polarization) of the antenna module (620). For example, at least a portion of the second polarization attenuated through the conductive pattern (630) can be radiated through the aperture (605). For example, at least a portion of the second polarization attenuated through the conductive pattern (630) can be radiated with substantially the same directivity as a first polarization (e.g., a vertical polarization) toward the aperture (605). For example, if at least a portion of the first polarization of the antenna module (620) and the second polarization attenuated through the conductive pattern (630) are radiated through the aperture (605), the radiation performance of the antenna module (620) can be improved.

[0138] According to various embodiments, a non-conductive injection-molded material (615) (e.g., a polymer) may be disposed between the opening (605) and the antenna module (620). For example, the non-conductive injection-molded material (615) may be disposed between a second non-conductive member (602) disposed on the inner side (e.g., in the -x-axis direction) of the opening (605) and the antenna module (620). For example, the non-conductive injection-molded material (615) may be formed between the second non-conductive member (602) and the antenna module (620).

[0139] According to various embodiments, a first adhesive member (641) may be disposed between the second non-conductive member (602) and the non-conductive injection-molded article (615). The second non-conductive member (602) and the non-conductive injection-molded article (615) may be bonded via the first adhesive member (641). For example, the first adhesive member (641) may include a waterproof tape.

[0140] According to various embodiments, a second adhesive member (642) may be disposed between the non-conductive injection molding (615) and the rear plate (480). For example, the non-conductive injection molding (615) and the rear plate (480) may be adhered via the second adhesive member (642). For example, the conductive pattern (630) may be disposed between the second adhesive member (642) and the rear plate (480). For example, the second adhesive member (642) may include a waterproof tape.

[0141] According to various embodiments, a conductive electrical material (650) may be disposed between the antenna module (620) and the back plate (480). For example, at least a portion of the conductive electrical material (650) may partially overlap the antenna module (620). For example, the conductive electrical material (650) may cover at least a portion of the antenna module (620). The conductive electrical material (650) may suppress and / or attenuate at least a portion of a second polarization (e.g., a horizontal polarization) in the −z-axis direction of the antenna module (620). For example, at least a portion of the second polarization attenuated by the conductive electrical material (650) may be radiated through the opening (605). For example, the conductive electrical material (650) may be bonded to at least a portion of the back plate (480) via the third adhesive member (643). For example, the conductive electrical material (650) may include the first support member (411) (e.g., bracket), the second support member (460) (e.g., rear case), or the antenna (470) disclosed in FIG. 4. For example, the conductive electrical material (650) may include a copper sheet, an FPCB, or a camera structure (e.g., a camera support member).

[0142] In one embodiment, the separation distance between the conductive portion (610) and the conductive electrical material (650) may be about 2 mm to 4 mm.

[0143] In one embodiment, the thickness of the conductive pattern (630) disposed inside the back plate (480) between the conductive portion (610) and the conductive electrical material (650) may be about 0.5 mm to 0.7 mm.

[0144] According to one embodiment, the separation distance between the conductive pattern (630) and the conductive electrical material (650) may be about 0.5 mm to 0.7 mm.

[0145] FIG. 7 is a perspective view schematically showing the arrangement structure of a conductive portion and a conductive pattern of an electronic device according to one embodiment of the present invention.

[0146] According to one embodiment, FIG. 7 may be a schematic diagram illustrating a portion of the electronic device (400) disclosed in FIG. 6.

[0147] Referring to FIG. 7, the conductive portion (610) may be spaced apart from the conductive pattern (630). For example, the conductive portion (610) may not be electrically connected to the conductive pattern (630). For example, the distance between the conductive portion (610) and the conductive pattern (630) may be about 0.5 mm to 0.7 mm. For example, a non-conductive injection-molded material (615) may be placed between the conductive portion (610) and the conductive pattern (630). For example, when the conductive portion (610) and the conductive pattern (630) are not electrically connected and are spaced apart by the non-conductive injection-molded material (615), the deterioration of the radiation performance of the conductive portion (610) operating as a first antenna (e.g., antenna radiator) may be reduced.

[0148] FIG. 8 is a drawing schematically showing the radiation characteristics of an antenna module of an electronic device according to one embodiment of the present invention.

[0149] According to one embodiment, the electronic device (400) according to one embodiment of the present invention may include a first non-conductive member (602) having a first permittivity (e.g., about 7 to 10) and disposed in the x-axis direction of the opening (605), and a second non-conductive member (602) having a second permittivity (e.g., about 11 to 13) and disposed in the -x-axis direction of the opening (605), as disclosed in FIG. 6. For example, the electronic device (400) may suppress and / or attenuate a second polarization (e.g., a horizontal polarization) of the antenna module (620) through the conductive pattern (630) disposed on the rear plate (480).

[0150] Referring to FIG. 8, the first polarization (e.g., vertical polarization (V-pol.)) of the antenna module (620) can be radiated through the x-axis direction (e.g., opening (605)) of the electronic device (400). It can be confirmed that the second polarization (e.g., horizontal polarization (H-pol.)) of the antenna module (620) is suppressed and / or attenuated through the conductive pattern (630) and radiated with substantially the same directivity as the first polarization (e.g., vertical polarization (V-pol.)).

[0151] According to one embodiment, when at least a portion of the first polarization (e.g., V-Pol.) of the antenna module (620) and the second polarization (e.g., H-Pol.) attenuated through the conductive pattern (630) are radiated in the x-axis direction where the opening (605) is formed, the radiation performance of the antenna module (620) can be improved.

[0152] FIG. 9A is a front view of an unfolded state of a foldable electronic device according to various embodiments of the present invention. FIG. 9B is a rear view of an unfolded state of a foldable electronic device according to various embodiments of the present invention.

[0153] According to various embodiments, the embodiments disclosed in FIGS. 1 to 8 described above may be substantially identically integrated and / or applied to the foldable electronic device (900) disclosed below. In the description of the foldable electronic device (900) disclosed below, components that are substantially identical to those disclosed in the embodiments disclosed in FIGS. 1 to 8 described above are given the same reference numerals, and redundant descriptions thereof may be omitted.

[0154] Referring to FIGS. 9A and 9B , a foldable electronic device (900) according to various embodiments of the present invention may include a pair of housings (910, 920) (e.g., a foldable housing structure) arranged to be foldable and / or unfoldable relative to each other based on a folding axis (A) of a hinge module (905), a flexible display (930) (e.g., a first display, a foldable display, or a main display) arranged through the pair of housings (910, 920), and / or a sub-display (960) (e.g., a second display) arranged through the second housing (920).

[0155] In this document, the surface on which the flexible display (930) is placed may be defined as the front side (e.g., in the z-axis direction) of the foldable electronic device (900), and the surface opposite the front side may be defined as the back side (e.g., in the -z-axis direction) of the foldable electronic device (900). The surface surrounding the space between the front side and the back side may be defined as the side surface of the foldable electronic device (900).

[0156] According to various embodiments, the first housing (910) and the second housing (920) may be arranged to be foldable and / or unfoldable relative to each other with respect to the folding axis (A) of the hinge module (905). For example, the first housing (910) and the second housing (920) may be arranged on both sides with respect to the folding axis (A) and may have an overall symmetrical shape with respect to the folding axis (A). According to various embodiments, the first housing (910) and the second housing (920) may also be folded asymmetrically with respect to the folding axis (A). The angle or distance between the first housing (910) and the second housing (920) may vary depending on whether the foldable electronic device (900) is in an unfolded state, a folded state, or an intermediate state.

[0157] According to various embodiments, the first housing (910) may include a first side (911) that is at least partially coupled to a first side (e.g., in the x-axis direction) of the hinge module (905) in an unfolded state of the foldable electronic device (900), and may include a second side member (912) that faces the front of the foldable electronic device (900), and / or a first side member (913) that surrounds at least a portion of a first space (2101) between the first side (911) and the second side (912).

[0158] According to various embodiments, the second housing (920) may include a third side (921) that is at least partially coupled to a second side (e.g., in the -x-axis direction) of the hinge module (905) in an unfolded state of the foldable electronic device (900), a fourth side (922) that faces the front of the foldable electronic device (900), and / or a second side member (923) that surrounds at least a portion of a second space (2201) between the third side (921) and the fourth side (922).

[0159] According to various embodiments, the first side (911) may face substantially in the same direction as the third side (921) in the unfolded state and at least partially face the third side (921) in the folded state.

[0160] According to various embodiments, the foldable electronic device (900) may include a recess (901) formed to accommodate a flexible display (930) through a structural combination of the first housing (910) and the second housing (920). The recess (901) may have substantially the same size as the flexible display (930).

[0161] According to various embodiments, when the foldable electronic device (900) is in an unfolded state, the first housing (910) and the second housing (920) form an angle of about 180°, and the first region (930a), the second region (930b), and the folding region (930c) of the flexible display (930) form the same plane and may be arranged to face substantially the same direction (e.g., the z-axis direction). For example, when the foldable electronic device (900) is in an unfolded state, the first housing (910) may be rotated by an angle of about 360° with respect to the second housing (920) so that the second side (912) and the fourth side (922) face each other and may be folded in the opposite direction (e.g., in an out folding manner).

[0162] According to various embodiments, when the foldable electronic device (900) is in a folded state, the first side (911) of the first housing (910) and the third side (921) of the second housing (920) may be arranged to face each other. For example, the first region (930a) and the second region (930b) of the flexible display (930) may be arranged to face each other by forming a narrow angle (e.g., in the range of 0 degrees to about 10 degrees) with each other through the folding region (930c).

[0163] According to various embodiments, the folding area (930c) of the foldable electronic device (900) can be deformed into a curved shape having at least a portion of a predetermined curvature. When the foldable electronic device (900) is in an intermediate state, the first housing (910) and the second housing (920) can be arranged at a certain angle with respect to each other. For example, the first area (930a) and the second area (930b) of the flexible display (930) can form an angle that is greater than that in the folded state and less than that in the unfolded state, and the curvature of the folding area (930c) can be less than that in the folded state and greater than that in the unfolded state.

[0164] According to various embodiments, the first housing (910) and the second housing (920) may form an angle that allows them to stop at a specified folding angle between a folded state and an unfolded state via the hinge module (905) (e.g., a free stop function). For example, the first housing (910) and the second housing (920) may be continuously operated while being pressed in the unfolding or folding direction based on the specified inflection angle via the hinge module (905).

[0165] According to various embodiments, the foldable electronic device (900) may include at least one display (e.g., a flexible display (930) and / or a sub-display (960)) disposed in the first housing (910) and / or the second housing (920), an input device (915), an audio output device (927, 928), a sensor module (917a, 917b, 926), a camera module (916a, 916b, 925), a key input device (919), an indicator (not shown), or a connector port (929). For example, the foldable electronic device (900) may omit at least one of the above-described components or may additionally include at least one other component.

[0166] According to various embodiments, the at least one display (e.g., flexible display (930) and / or sub-display (960)) may include a flexible display (930) (e.g., first display) that is arranged to be supported by a third side (921) of a second housing (920) via a hinge module (905) from a first side (911) of a first housing (910), and a sub-display (960) (e.g., second display) that is arranged to be at least partially visible from the outside through a fourth side (922) in an interior space of the second housing (920). For example, the sub-display (960) may be arranged to be visible from the outside through the second side (912) in an interior space of the first housing (910).

[0167] According to one embodiment, the flexible display (930) may be primarily used in the unfolded state of the foldable electronic device (900), and the sub-display (960) may be primarily used in the folded state of the foldable electronic device (900). According to one embodiment, the foldable electronic device (900) may control the flexible display (930) and / or the sub-display (960) to be usable based on the folding angles of the first housing (910) and the second housing (920) in the intermediate state.

[0168] According to various embodiments, the flexible display (930) may be placed in a receiving space formed by a pair of housings (910, 920). For example, the flexible display (930) may be placed in a recess (901) formed by a pair of housings (910, 920), and may be placed so as to occupy substantially most of the front surface of the foldable electronic device (900) when unfolded. According to one embodiment, at least a portion of the flexible display (930) may be deformed into a flat or curved surface. The flexible display (930) may include a first region (930a) facing the first housing (910), a second region (930b) facing the second housing (920), and a folding region (930c) connecting the first region (930a) and the second region (930b) and facing the hinge module (905). According to one embodiment, the region division of the flexible display (930) is merely an exemplary physical division by a pair of housings (910, 920) and a hinge module (905), and in reality, the flexible display (930) may be displayed as a seamless, full screen through a pair of housings (910, 920) and a hinge module (905). The first region (930a) and the second region (930b) may have an overall symmetrical shape with respect to the folding region (930c) or may have a partially asymmetrical shape.

[0169] According to various embodiments, the foldable electronic device (900) may include a first back cover (940) (e.g., a first back plate) disposed on a second side (912) of the first housing (910) and a second back cover (950) (e.g., a second back plate) disposed on a fourth side (922) of the second housing (920). In some embodiments, at least a portion of the first back cover (940) may be formed integrally with the first side member (913). In some embodiments, at least a portion of the second back cover (950) may be formed integrally with the second side member (923). In one embodiment, at least one of the first back cover (940) and the second back cover (950) may be formed of a substantially transparent plate (e.g., a glass plate including various coating layers, or a polymer plate) or an opaque plate.

[0170] According to various embodiments, the first back cover (940) (e.g., the first back plate) may be formed by an opaque plate, such as, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The second back cover (950) (e.g., the second back plate) may be formed by a substantially transparent plate, such as, for example, glass or polymer. For example, the sub-display (960) (e.g., the second display) may be arranged in the interior space of the second housing (920) so as to be visible from the outside through the second back cover (950).

[0171] According to various embodiments, the input module (915) may include a microphone. For example, the input module (915) may include a plurality of microphones arranged to detect the direction of sound. The input module (915) may include the input module (150) disclosed in FIG. 1.

[0172] According to various embodiments, the audio output module (927, 928) may include speakers. For example, the audio output module (927, 928) may include a call receiver (927) disposed through the fourth side (922) of the second housing (920) and an external speaker (928) disposed through at least a portion of the second side member (923) of the second housing (920). For example, the input module (915), the audio output module (927, 928) and the connector (929) may be disposed in spaces of the first housing (910) and / or the second housing (920) and may be exposed to the external environment through at least one hole formed in the first housing (910) and / or the second housing (920). For example, the holes formed in the first housing (910) and / or the second housing (920) may be used in common for the input module (915) and the audio output modules (927, 928). For example, the audio output modules (927, 928) may include a speaker (e.g., a piezo speaker) that operates in a state where the holes formed in the first housing (910) and / or the second housing (920) are excluded. For example, the audio output modules (927, 928) may include the audio output module (155) disclosed in FIG. 1.

[0173] According to various embodiments, the camera modules (916a, 916b, 925) may include a first camera module (916a) disposed on a first side (911) of the first housing (910), a second camera module (916b) disposed on a second side (912) of the first housing (910), and / or a third camera module (925) disposed on a fourth side (922) of the second housing (920). According to one embodiment, the foldable electronic device (900) may include a flash (918) disposed near the second camera module (916b). The flash (918) may include, for example, a light emitting diode or a xenon lamp. For example, the camera modules (916a, 916b, 925) may include one or more lenses, an image sensor, and / or an image signal processor. For example, at least one of the camera modules (916a, 916b, 925) may include two or more lenses (e.g., wide-angle and telephoto lenses) and image sensors, and may be arranged together on either side of the first housing (910) and / or the second housing (920). For example, the camera modules (916a, 916b, 925) may include the camera module (180) disclosed in FIG. 1.

[0174] According to various embodiments, the sensor modules (917a, 917b, 926) may generate electrical signals or data values ​​corresponding to the internal operating state or the external environmental state of the foldable electronic device (900). For example, the sensor modules (917a, 917b, 926) may include a first sensor module (917a) disposed on a first side (911) of the first housing (910), a second sensor module (917b) disposed on a second side (912) of the first housing (910), and / or a third sensor module (326) disposed on a fourth side (922) of the second housing (920). For example, the sensor modules (917a, 917b, 926) may include the sensor module (176) disclosed in FIG. 1.

[0175] According to various embodiments, the foldable electronic device (900) may further include at least one of a sensor module not shown, for example, a pressure sensor, a magnetic sensor, a biometric sensor, a temperature sensor, a humidity sensor, a Hall sensor, a six-axis sensor, an acceleration sensor, an angular velocity sensor, and a fingerprint recognition sensor. For example, the fingerprint recognition sensor may be disposed through at least one of the first side member (913) of the first housing (910) and / or the second side member (923) of the second housing (920).

[0176] According to various embodiments, the key input device (919) may be arranged to be exposed to the outside through the first side member (913) of the first housing (910). For example, the key input device (919) may also be arranged to be exposed to the outside through the second side member (923) of the second housing (920). For example, the foldable electronic device (900) may not include some or all of the key input devices (919), and the key input devices (919) that are not included may be implemented in another form, such as a soft key, on at least one display (930, 960). For example, the key input device (919) may be implemented using a pressure sensor included in at least one display (930, 960). The key input device (919) may turn the power of the foldable electronic device (900) on or off, or adjust the volume.

[0177] According to various embodiments, the connector port (929) may include a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device (e.g., the external electronic devices 102, 104, 108 of FIG. 1). For example, the connector port (929) may perform a function for transmitting and receiving audio signals with the external electronic device, or may further include a separate connector port (e.g., an ear jack hole) for performing a function for transmitting and receiving audio signals. For example, the connector port (929) may include a connection terminal (178) disclosed in FIG. 1.

[0178] According to various embodiments, at least one of the camera modules (916a, 916b, 925), at least one of the sensor modules (917a, 917b, 926), and / or an indicator may be arranged to be exposed through at least one display (930, 960). For example, at least one of the camera modules (916a, 925), at least one of the sensor modules (917a, 926), and / or an indicator may be arranged to be exposed through at least one display (930, 960) in the interior space of at least one housing (910, 920), below an active area of ​​at least one display (930, 960), and may be arranged to be in contact with the external environment through an opening or transparent area perforated up to a cover member (e.g., a window layer (not shown) of the flexible display (930) and / or a second rear cover (950)).

[0179] Referring to FIG. 9B, a second side member (923) of a foldable electronic device (900) according to various embodiments of the present invention may be formed with a first non-conductive portion (3101) and a second non-conductive portion (3102). For example, the first non-conductive portion (3101) and the second non-conductive portion (3102) may include a segment or a slit.

[0180] According to one embodiment, a conductive portion (610) (e.g., an antenna radiator) may be formed between the first non-conductive portion (3101) and the second non-conductive portion (3102). For example, the conductive portion (610) (e.g., an antenna radiator) may be positioned between the first non-conductive portion (3101) and the second non-conductive portion (3102).

[0181] In one embodiment, the conductive portion (610) may be formed with an opening (605) (e.g., a hole or a slit). For example, the conductive portion (610) may include the opening (605). The opening (605) may radiate a wireless signal of the antenna module (620).

[0182] According to one embodiment, an antenna module (620) (mmWave antenna module) may be disposed inside the conductive portion (610). For example, at least one antenna module (620) may be disposed at a designated location inside the second side member (923) of the foldable electronic device (900). For example, the antenna module (620) may be disposed at a location overlapping an opening (605) formed in the conductive portion (610). A wireless signal of the antenna module (620) may be radiated toward the side (e.g., in the -x-axis direction) of the electronic device (300) through the opening (605).

[0183] FIG. 10 is a cross-sectional view schematically illustrating a portion of a foldable electronic device according to various embodiments of the present invention.

[0184] According to various embodiments, FIG. 10 may be a cross-sectional view of a 10-10' section of the foldable electronic device (900) disclosed in FIG. 9b viewed in the -y-axis direction.

[0185] According to various embodiments, embodiments of the foldable electronic device (900) disclosed below may substantially include the embodiments disclosed in FIGS. 1 to 9B described above. In the description of the foldable electronic device (900) disclosed below, components that are substantially the same as those disclosed in the embodiments disclosed in FIGS. 1 to 9B described above are given the same reference numerals, and redundant descriptions thereof may be omitted.

[0186] Referring to FIG. 10, according to various embodiments of the present invention, a foldable electronic device (900) may include a flexible display (930), a second rear cover (950), a conductive portion (610), an opening (605), an antenna module (620), and / or a conductive pattern (630).

[0187] According to various embodiments, the flexible display (930) (e.g., the first display) may be positioned in the z-axis direction of the foldable electronic device (900).

[0188] According to various embodiments, the second rear cover (950) (e.g., the second rear plate) may be disposed in the -z-axis direction of the foldable electronic device (900). For example, the second rear cover (950) (e.g., the second rear plate) may be formed of a non-conductive material. For example, the second rear cover (950) (e.g., the second rear plate) may include a non-conductive material.

[0189] According to various embodiments, the conductive portion (610) (e.g., antenna radiator) may be formed on the second side member (923) surrounding the space between the flexible display (930) and the second rear cover (950). For example, the conductive portion (610) may be disposed between the first non-conductive portion (3101) and the second non-conductive portion (3102) formed on the second side member (923). For example, the conductive portion (610) may be electrically connected to the wireless communication module (192) (e.g., RFIC) disclosed in FIG. 1 and may operate as a first antenna for transmitting and receiving a wireless signal in a first frequency band. For example, the first frequency band may include a range of about 500 MHz to 10 GHz.

[0190] According to various embodiments, the conductive portion (610) may include an opening (605). The opening (605) may include a hole or slit formed in the conductive portion (610).

[0191] According to various embodiments, an opening (605) may be formed in the conductive portion (610). The opening (605) may transmit and receive a wireless signal of the antenna module (620). For example, the opening (605) may radiate a first polarization (e.g., vertical polarization) in the -x-axis direction of the antenna module (620). For example, the opening (605) may be formed in the conductive portion (610) to have a height less than half a wavelength based on the lowest frequency of the second frequency band (e.g., about 3 GHz to 300 GHz) of the antenna module (620).

[0192] According to various embodiments, the opening (605) may include at least one of a first non-conductive member (601) and a second non-conductive member (602). For example, at least one of the first non-conductive member (601) and the second non-conductive member (602) may be disposed in the opening (605).

[0193] According to various embodiments, the first non-conductive member (601) may be disposed in the -x-axis direction of the opening (605). For example, the first non-conductive member (602) may include a material having a first permittivity (e.g., 7 to 10).

[0194] According to various embodiments, the second non-conductive member (602) can be disposed inside (e.g., in the x-axis direction) of the opening (605). For example, the second non-conductive member (602) can be disposed inside (e.g., in the x-axis direction) of the first non-conductive member (601) disposed in the opening (605). For example, the second non-conductive member (602) can include a material having a second permittivity (e.g., about 11 to 13) that is higher than the first permittivity (e.g., about 7 to 10) of the first non-conductive member (601).

[0195] According to various embodiments, the antenna module (620) may be disposed inside (e.g., in the x-axis direction) of the second side member (923). For example, the antenna module (620) may be disposed at a position adjacent to the conductive portion (610) formed on the second side member (923). For example, the antenna module (620) may be disposed in the y-axis direction perpendicular to the -x-axis direction of the foldable electronic device (900). For example, the antenna module (620) may be disposed in substantially the same direction as the y-axis direction of the foldable electronic device (900).

[0196] According to various embodiments, the antenna module (620) may be positioned to overlap with the opening (605) formed in the conductive portion (610). The wireless signal of the antenna module (620) may be radiated (e.g., first polarization or vertical polarization) in the lateral direction (e.g., -x-axis direction) of the foldable electronic device (900) through the opening (605). For example, the antenna module (620) may be configured to radiate 5G (5 th generation) can perform communication. For example, the antenna module (620) can operate as a second antenna that transmits and receives a wireless signal of a second frequency band. For example, the second frequency band can include a range of about 3 GHz to 300 GHz.

[0197] According to various embodiments, the antenna module (620) can radiate a first polarization (e.g., vertical polarization) through the opening (605). For example, the antenna module (620) can radiate a second polarization (e.g., horizontal polarization) through the second rear cover (950). For example, when the antenna module (620) is disposed in the y-axis direction perpendicular to the -x-axis direction of the foldable electronic device (900), if the second polarization (e.g., horizontal polarization) is radiated through the second rear cover (950), the radiation performance of the antenna module (620) may be degraded. For example, the second polarization (e.g., horizontal polarization) of the antenna module (620) can be suppressed and / or attenuated through the conductive pattern (630) disposed on the second rear cover (950).

[0198] According to various embodiments, the conductive pattern (630) may be disposed between the opening (605) and the second rear cover (950). For example, the conductive pattern (630) may be disposed between the antenna module (620) and the second rear cover (950). For example, the conductive pattern (630) may be disposed on the inner side of the second rear cover (950) between the opening (605) and the antenna module (620). For example, the conductive pattern (630) may be disposed on a portion of the second rear cover (950). For example, the conductive pattern (630) may be spaced apart from the conductive portion (610). The conductive pattern (630) may not be electrically connected to the conductive portion (610). For example, the conductive pattern (630) may include a reflector. For example, the conductive pattern (630) may include a conductive plate, a conductive sheet, a conductive coating layer, or a conductive plating layer.

[0199] In one embodiment, the conductive pattern (630) can attenuate at least a portion of a second polarization (e.g., a horizontal polarization) of the antenna module (620). For example, at least a portion of the second polarization attenuated through the conductive pattern (630) can be radiated through the aperture (605). For example, at least a portion of the second polarization attenuated through the conductive pattern (630) can be radiated with substantially the same directivity as a first polarization (e.g., a vertical polarization) toward the aperture (605). For example, if at least a portion of the first polarization of the antenna module (620) and the second polarization attenuated through the conductive pattern (630) are radiated through the aperture (605), the radiation performance of the antenna module (620) can be improved.

[0200] According to various embodiments, a non-conductive injection molding (615) may be disposed between the opening (605) and the antenna module (620). For example, the non-conductive injection molding (615) may be disposed between a second non-conductive member (602) disposed on the inside (e.g., in the x-axis direction) of the opening (605) and the antenna module (620). For example, the non-conductive injection molding (615) may be formed between the second non-conductive member (602) and the antenna module (620).

[0201] According to various embodiments, a sub-display (960) (e.g., a second display) may be disposed between the antenna module (620) and the second rear cover (950). For example, at least a portion of the sub-display (960) may partially overlap the antenna module (620). For example, the sub-display (960) may cover at least a portion of the antenna module (620). The sub-display (960) may suppress and / or attenuate at least a portion of a second polarization (e.g., a horizontal polarization) in the −z-axis direction of the antenna module (620). For example, at least a portion of the second polarization attenuated through the sub-display (960) may be radiated through the opening (605).

[0202] According to various embodiments, the separation distance between the conductive portion (610) and the conductive pattern (630) may be about 0.5 mm to 0.7 mm.

[0203] According to various embodiments, the separation distance between the conductive portion (610) and the sub-display (960) (e.g., the second display) may be about 2 mm to 4 mm.

[0204] According to various embodiments, the thickness of the conductive pattern (630) disposed on the inner side of the second rear cover (950) between the conductive portion (610) and the sub-display (960) (e.g., the second display) may be about 0.5 mm to 0.7 mm.

[0205] According to various embodiments, the separation distance between the conductive pattern (630) and the sub-display (960) (e.g., the second display) may be about 0.5 mm to 0.7 mm.

[0206] An electronic device (400) according to various embodiments of the present invention may include a front plate (420), a rear plate (480), and a side member (410) surrounding a space between the front plate (420) and the rear plate (480). According to one embodiment, the electronic device (400) may include a first non-conductive portion (3101) and a second non-conductive portion (3102) formed on the side member (410). According to one embodiment, the electronic device (400) may include a conductive portion (610) disposed between the first non-conductive portion (3101) and the second non-conductive portion (3102). According to one embodiment, the electronic device (400) may include an opening (605) formed in the conductive portion (610) and an antenna module (620) positioned at an overlapping position with the opening (605) inside the conductive portion (610). According to one embodiment, the electronic device (400) may include a conductive pattern (630) positioned on the inner side of the rear plate (380) between the opening (605) and the antenna module (620).

[0207] According to one embodiment, the antenna module (620) radiates a first polarization and a second polarization, wherein the first polarization is radiated through the opening (605) and at least a portion of the second polarization is attenuated through the conductive pattern (630).

[0208] According to one embodiment, at least a portion of the second polarization attenuated through the conductive pattern (630) may be radiated through the opening (605).

[0209] In one embodiment, the opening (605) may include a first non-conductive member (601) having a first permittivity.

[0210] According to one embodiment, the opening (605) may further include a second non-conductive member (602) having a second permittivity higher than the first permittivity and disposed inside the first non-conductive member (601).

[0211] According to one embodiment, the electronic device (400) may further include a non-conductive injection molded body (615) disposed between the second non-conductive member (602) and the antenna module (620).

[0212] According to one embodiment, the electronic device (400) may further include a first adhesive member (641) disposed between the second non-conductive member (602) and the non-conductive injection-molded material (615).

[0213] According to one embodiment, the electronic device (400) may further include a second adhesive member (642) disposed between the inner side of the rear plate (480) on which the conductive pattern (630) is disposed and the non-conductive injection-molded material (615).

[0214] According to one embodiment, the electronic device (400) may further include a printed circuit board (440) disposed inside the side member (410), and a wireless communication module (192) disposed on the printed circuit board (440). According to one embodiment, the conductive portion (610) may be electrically connected to the wireless communication module (192) and may operate as a first antenna for transmitting and receiving a signal of a first frequency band. According to one embodiment, the antenna module (620) may be electrically connected to the wireless communication module (192) and may operate as a second antenna for transmitting and receiving a signal of a second frequency band.

[0215] According to one embodiment, the opening (605) may be formed to have a height less than half a wavelength based on the lowest frequency among the second frequency bands of the antenna module (620).

[0216] According to one embodiment, the back plate (480) may include a non-conductive material. The first dielectric constant may be 7 to 10, and the second dielectric constant may be 11 to 13.

[0217] According to one embodiment, the distance between the conductive portion (610) and the conductive pattern (630) may be 0.5 mm to 0.7 mm.

[0218] According to one embodiment, at least a portion of the second polarization attenuated through the conductive pattern (630) may be radiated with substantially the same directivity as the first polarization.

[0219] According to one embodiment, the electronic device (400) may further include a conductive electrical material (650) disposed between the antenna module (620) and the rear plate (480).

[0220] According to one embodiment, the conductive electrical material (650) may be arranged to cover at least a portion of the antenna module (620).

[0221] According to one embodiment, the electronic device (400) may further include a third adhesive member (643) disposed between the conductive electrical material (650) and the rear plate (480).

[0222] According to one embodiment, the distance between the conductive portion (610) and the conductive electrical material (650) may be 2 mm to 4 mm.

[0223] According to one embodiment, the distance between the conductive pattern (630) and the conductive electrical material (650) may be 0.5 mm to 0.7 mm.

[0224] According to one embodiment, the thickness of the conductive pattern (630) may be 0.5 mm to 0.7 mm.

[0225] In various embodiments of the present invention, a bar-type electronic device (101, 300, 400) and a foldable electronic device (900) have been described as examples, but the embodiments disclosed in the present invention are not limited thereto and can be substantially equally applied to a multi-foldable electronic device that is folded and / or unfolded at least twice.

[0226] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0227] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0228] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0229] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0230] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0231] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0232] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples presented to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of one embodiment of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical features of one embodiment of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In electronic devices (101, 300, 400), A front plate (420), a rear plate (480), and a side member (410) surrounding the space between the front plate (420) and the rear plate (480); A first non-conductive portion (3101) and a second non-conductive portion (3102) formed on the above side member (410); A conductive portion (610) disposed between the first non-conductive portion (3101) and the second non-conductive portion (3102); An opening (605) formed in the above-mentioned conductive portion (610); An antenna module (620) positioned at a position overlapping the opening (605) inside the conductive portion (610); and An electronic device comprising a conductive pattern (630) disposed on the inner side of the rear plate (380) between the opening (605) and the antenna module (620).

2. In paragraph 1, The above antenna module (620) radiates the first polarized wave and the second polarized wave, The above first polarization is radiated through the opening (605), An electronic device configured such that at least a portion of the second polarization is attenuated through the conductive pattern (630).

3. In paragraph 2, An electronic device configured such that at least a portion of the second polarization attenuated through the conductive pattern (630) is radiated through the opening (605).

4. In any one of paragraphs 1 to 3, An electronic device in which the above opening (605) includes a first non-conductive member (601) having a first dielectric constant.

5. In paragraph 4, An electronic device wherein the opening (605) further includes a second non-conductive member (602) having a second permittivity higher than the first permittivity and arranged inside the first non-conductive member (601).

6. In paragraph 5, An electronic device further comprising a non-conductive injection molded body (615) disposed between the second non-conductive member (602) and the antenna module (620).

7. In paragraph 6, An electronic device further comprising a first adhesive member (641) disposed between the second non-conductive member (602) and the non-conductive injection-molded material (615).

8. In paragraph 7, An electronic device further comprising a second adhesive member (642) disposed between the inner side of the rear plate (480) on which the conductive pattern (630) is disposed and the non-conductive injection-molded material (615).

9. In any one of paragraphs 1 to 8, A printed circuit board (440) placed inside the above side member (410); and Further comprising a wireless communication module (192) arranged on the printed circuit board (440), The above conductive portion (610) is electrically connected to the wireless communication module (192) and operates as a first antenna that transmits and receives a signal of the first frequency band. The above antenna module (620) is an electronic device electrically connected to the wireless communication module (192) and configured to operate as a second antenna for transmitting and receiving signals of a second frequency band.

10. In paragraph 9, An electronic device in which the above opening (605) is formed to have a height less than half a wavelength based on the lowest frequency among the second frequency bands of the above antenna module (620).

11. In paragraphs 1 to 10, The above rear plate (480) is an electronic device including a non-conductive material.

12. In paragraph 5, An electronic device wherein the first dielectric constant is 7 to 10 and the second dielectric constant is 11 to 13.

13. In any one of paragraphs 1 to 12, An electronic device in which the distance between the conductive portion (610) and the conductive pattern (630) is 0.5 mm to 0.7 mm.

14. In paragraph 3, An electronic device in which at least a portion of the second polarization attenuated through the conductive pattern (630) is radiated with substantially the same directivity as the first polarization.

15. In any one of paragraphs 1 to 14, An electronic device further comprising a conductive electrical material (650) disposed between the antenna module (620) and the rear plate (480).

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