Electronic device comprising antenna structure

Abstract

An electronic device according to various embodiments of the present invention comprises: a housing including a front plate, a rear plate, and a side member surrounding a space between the front plate and the rear plate; a printed circuit board disposed inside the housing; first wiring formed on the printed circuit board; and an antenna structure disposed between the printed circuit board and the rear plate. The antenna structure may include a first slit formed at a position corresponding to the first wiring.

Description

Electronic device including an antenna structure

[0001] Various embodiments of the present invention disclose electronic devices including antenna structures.

[0002] The use of electronic devices such as bar type, foldable type, rollable type or sliding type is increasing, and various functions are being provided to electronic devices.

[0003] The above electronic device can transmit and receive various data with other electronic devices (e.g., hearing aids) via wireless communication.

[0004] The electronic device may include at least one antenna for performing wireless communication with another electronic device.

[0005] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0006] An electronic device may include a printed circuit board (PCB) on which various electronic components are arranged. For example, the PCB may include at least one wire that supplies power from a battery to various electronic components. For example, when power from the battery is supplied to the electronic components through at least one wire arranged on the PCB, current flows, and a magnetic field (e.g., an H-field) may be generated according to the flow of the current.

[0007] A shielding member including at least one antenna may be disposed on the back surface of the printed circuit board. For example, the shielding member may shield noise generated from the printed circuit board. For example, the shielding member may reduce a magnetic field (e.g., H-field) generated from the printed circuit board from being radiated to the back surface of the electronic device, and may allow it to be radiated to the front and side surfaces of the electronic device.

[0008] For example, if a magnetic field generated from a printed circuit board radiates to the front and sides of an electronic device, test performance related to hearing aid compatibility (HAC) of the electronic device and other electronic devices (e.g., hearing aids) may be degraded.

[0009] For example, if a magnetic field generated from a printed circuit board radiates toward the front and sides of an electronic device, the communication performance of another electronic device (e.g., a hearing aid) paired with the electronic device may be degraded. For example, the other electronic device may be a hearing aid that includes a telecoil.

[0010] Various embodiments of the present invention can provide an electronic device that forms a slit in an antenna structure and allows a portion of a magnetic field generated from a printed circuit board to be radiated to the back of the electronic device, thereby reducing the amount radiated to the front and side of the electronic device.

[0011] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.

[0012] An electronic device according to one embodiment of the present invention may include a housing including a front plate, a rear plate, and a side member surrounding a space between the front plate and the rear plate. According to one embodiment, the electronic device may include a printed circuit board disposed inside the housing, a first wire formed on the printed circuit board, and an antenna structure disposed between the printed circuit board and the rear plate. According to one embodiment, the antenna structure may include a first slit formed at a position corresponding to the first wire.

[0013] According to various embodiments of the present invention, by allowing a portion of a magnetic field generated from a printed circuit board to be radiated to the back of an electronic device through at least one slit formed in an antenna structure and reducing the amount radiated to the front and side of the electronic device, test performance and communication performance related to compatibility of the electronic device and other electronic devices (e.g., hearing aids) can be improved.

[0014] In addition, various effects may be provided, either directly or indirectly, through this document.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0016] FIG. 1A is a block diagram of an electronic device within a network environment according to various embodiments of the present invention.

[0017] FIG. 1b is a block diagram of a power management module and a battery according to various embodiments of the present invention.

[0018] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present invention.

[0019] FIG. 2b is a perspective view of the rear surface of an electronic device according to various embodiments of the present invention.

[0020] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0021] FIG. 4 is a schematic diagram illustrating an antenna structure included in the electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0022] FIG. 5 is a drawing schematically showing the configuration of a printed circuit board according to one embodiment of the present invention.

[0023] FIG. 6 is a drawing schematically showing the radial distribution of a magnetic field formed on a printed circuit board according to one embodiment of the present invention.

[0024] FIG. 7 is a schematic diagram showing a state in which an antenna structure is arranged on a printed circuit board of an electronic device according to one embodiment of the present invention.

[0025] Fig. 8 is a diagram schematically showing the radiation distribution of a magnetic field of an electronic device according to a comparative example.

[0026] FIG. 9 is a diagram schematically showing the radial distribution of a magnetic field of an electronic device according to one embodiment of the present invention.

[0027] FIG. 10 is a schematic drawing of a portion of an antenna structure including an opening according to various embodiments of the present invention.

[0028] FIG. 11 is a schematic drawing of a portion of an antenna structure including a first slit according to various embodiments of the present invention.

[0029] FIG. 12 is a schematic diagram illustrating an antenna structure including at least one conductive pattern according to various embodiments of the present invention.

[0030] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments of the present invention.

[0031] Referring to FIG. 1A, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0032] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0033] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0034] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0035] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0036] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0037] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0038] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0039] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0040] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0041] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0042] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0043] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0044] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0045] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0046] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0047] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0048] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0049] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0050] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0051] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0052] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0053] FIG. 1b is a block diagram of a power management module (188) and a battery (189) according to various embodiments of the present invention.

[0054] Referring to FIG. 1B, the power management module (188) may include a charging circuit (181), a power regulator (183), or a power gauge (185). The charging circuit (181) may charge the battery (189) using power supplied from an external power source for the electronic device (101). According to one embodiment, the charging circuit (181) may select a charging method (e.g., normal charging or rapid charging) based on at least some of the type of the external power source (e.g., power adapter, USB, or wireless charging), the amount of power that can be supplied from the external power source (e.g., about 20 watts or more), or the properties of the battery (189), and may charge the battery (189) using the selected charging method. The external power source may be connected to the electronic device (101) by a wire, for example, through a connection terminal (178), or may be connected wirelessly through an antenna module (197).

[0055] The power regulator (183) can generate a plurality of powers having different voltages or different current levels by adjusting the voltage level or current level of the power supplied from, for example, an external power source or a battery (189). The power regulator (183) can adjust the power of the external power source or the battery (189) to a voltage or current level suitable for each of the components included in the electronic device (101). According to one embodiment, the power regulator (183) can be implemented in the form of an LDO (low drop out) regulator or a switching regulator. The power gauge (185) can measure usage status information for the battery (189) (e.g., capacity, number of charge / discharge cycles, voltage, or temperature of the battery (189).

[0056] The power management module (188) can determine charging state information (e.g., lifespan, overvoltage, undervoltage, overcurrent, overcharge, overdischarge, overheat, short circuit, or swelling) related to charging of the battery (189) based at least in part on the measured usage state information, for example, using the charging circuit (181), the voltage regulator (183), or the power gauge (185). The power management module (188) can determine whether the battery (189) is normal or abnormal based at least in part on the determined charging state information. If the state of the battery (189) is determined to be abnormal, the power management module (188) can adjust charging of the battery (189) (e.g., reducing the charging current or voltage, or stopping charging). According to one embodiment, at least some of the functions of the power management module (188) can be performed by an external control device (e.g., the processor (120)).

[0057] According to one embodiment, the battery (189) may include a battery protection circuit module (PCM) (187). The battery protection circuit (187) may perform one or more of various functions (e.g., a pre-cut function) to prevent degradation or damage to the battery (189). The battery protection circuit (187) may additionally or alternatively be configured as at least a part of a battery management system (BMS) that may perform various functions including cell balancing, capacity measurement of the battery, charge / discharge cycle measurement, temperature measurement, or voltage measurement.

[0058] According to one embodiment, at least a portion of the usage status information or the charging status information of the battery (189) may be measured using a corresponding sensor (e.g., a temperature sensor) among the sensor modules (176), a power gauge (185), or a power management module (188). According to one embodiment, the corresponding sensor (e.g., a temperature sensor) among the sensor modules (176) may be included as a part of the battery protection circuit (187), or may be placed near the battery (189) as a separate device.

[0059] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present invention. FIG. 2B is a perspective view of the rear of an electronic device according to various embodiments of the present invention.

[0060] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment, the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIGS. 2A and 2B . According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0061] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate (211), at both ends of a long edge of the front plate (202). In the illustrated embodiment (e.g., see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate (202), at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region (210D) and the second region (210E), and may only include a flat surface that is arranged parallel to the second side (210B). In the above embodiments, when viewed from the side of the electronic device (200), the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0062] According to one embodiment, the electronic device (200) may include at least one of a display (201), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator, and a connector hole (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0063] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). In some embodiments, the corners of the display (201) may be formed to be substantially identical to the adjacent outer shape of the front plate (202). In other embodiments, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be substantially identical in order to expand the area over which the display (201) is exposed.

[0064] The audio module may include a microphone hole (203) and speaker holes (207, 214). The microphone hole (203) may have a microphone positioned therein for acquiring external sounds, and in some embodiments, multiple microphones may be positioned therein to detect the direction of sounds. The speaker holes (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker holes (207, 214) (e.g., a piezo speaker).

[0065] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first side (210A) of the housing (210) (e.g., the display (201) as well as the second side (210B). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0066] The camera modules (205, 212, 213) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0067] The key input device (217) may be disposed on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include a sensor module disposed on a second surface (210B) of the housing (210).

[0068] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0069] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0070] FIG. 3 is an exploded perspective view of an electronic device according to various embodiments of the present invention.

[0071] Referring to FIG. 3, the electronic device (300) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket), a front plate (320), a display (330), a printed circuit board (340), a battery (350), an antenna structure (400), and / or a rear plate (380).

[0072] According to one embodiment, the electronic device (300) may omit at least one of the above-described components (e.g., the first support member (311)) or may additionally include other components. For example, a second support member (e.g., a rear case), not shown, may be disposed between the printed circuit board (340) and the rear plate (380). At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (101) of FIG. 1A, or the electronic device (200) of FIG. 2A and / or FIG. 2B, and any redundant description thereof will be omitted below.

[0073] In one embodiment, the side member (310) (e.g., the housing (210) of FIG. 2A) may form at least a portion of the exterior of the electronic device (300). The side member (310) (e.g., the housing (210) of FIG. 2A) may enclose a space between the front plate (320) and the back plate (380). For example, the side member (310) may include the side member (210C), the side member (218), or the housing (210) disclosed in FIGS. 2A and 2B.

[0074] According to one embodiment, the first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310) (e.g., the side member (218) or the housing (210) of FIGS. 2A and 2B) or may be formed integrally with the side member (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., a polymer) material. The first support member (311) may have a display (330) coupled to one surface (e.g., in the z-axis direction) and a printed circuit board (340) coupled to the other surface (e.g., in the −z-axis direction).

[0075] According to one embodiment, the printed circuit board (340) may be disposed inside the side member (310) (e.g., the housing (210) of FIG. 2A). For example, the printed circuit board (340) may be disposed in the -z-axis direction of the first support member (311). The printed circuit board (340) may include a first PCB (340a) and / or a second PCB (340b). For example, the first PCB (340a) and the second PCB (340b) may be disposed to be spaced apart from each other and may be electrically connected using a connecting member (345) (e.g., a coaxial cable and / or an FPCB). For example, the printed circuit board (340) may include a structure in which a plurality of printed circuit boards (PCBs) are stacked. For example, the printed circuit board (340) may include an interposer structure. For example, the printed circuit board (340) may be implemented in the form of a flexible printed circuit board (FPCB) and / or a rigid printed circuit board (PCB). For example, the printed circuit board (340) may include at least one wiring and / or at least one conductive path.

[0076] According to one embodiment, a printed circuit board (340) may be disposed with a processor (120), a memory (130), an interface (177), a wireless communication module (192), and / or a power management module (188) as disclosed in FIG. 1.

[0077] According to one embodiment, the processor (120) may include one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0078] According to one embodiment, the memory (130) may include, for example, volatile memory or non-volatile memory.

[0079] According to one embodiment, the interface (177) may include a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. For example, the interface (177) may electrically or physically connect the electronic device (300) to an external electronic device (e.g., the electronic device (102, 104) of FIG. 1A) and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0080] In one embodiment, the wireless communication module (192) may include a radio frequency integrated circuit (RFIC). For example, the wireless communication module (192) may supply a power signal to the antenna structure (400). For example, the wireless communication module (192) may transmit a radio frequency signal to the antenna structure (400).

[0081] According to one embodiment, the power management module (188) can manage the power of the electronic device (300). For example, the power management module (188) can include at least one power management integrated circuit (PMIC). For example, when the electronic device (300) is turned on, the power management module (188) can supply power from the battery (189) to other components (e.g., the processor (120), the memory (130), the wireless communication module (192)). For example, the power management module (188) can receive a command from the processor (120) and manage the power supplied to other components in response to the received command. The power management module (188) (e.g., the PMIC) can support wired and / or wireless charging methods. For example, the wireless charging method includes at least one of a magnetic resonance method, a magnetic induction method, or an electromagnetic wave method, and may include additional circuitry for wireless charging (e.g., a coil loop, a resonant circuit, or a rectifier).

[0082] In one embodiment, the battery (350) may power at least one component of the electronic device (300). For example, the battery (350) may power the wireless communication module (192) and / or the power management module (188). For example, the battery (350) may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. For example, at least a portion of the battery (350) may be disposed substantially flush with the printed circuit board (340). For example, at least a portion of the battery (350) may be disposed between the first PCB (340a) and the second PCB (340b). The battery (350) may be integrally disposed within the electronic device (300). For example, the battery (350) may be detachably disposed from the electronic device (300).

[0083] In one embodiment, the antenna structure (400) may be disposed between the printed circuit board (340) and the back plate (380). For example, the antenna structure (400) may be disposed between the battery (350) and the back plate (380). For example, the antenna structure (400) may include at least one slit (e.g., the first slit (410), the second slit (420), and / or the third slit (430)). For example, the antenna structure (400) may include a near field communication (NFC) antenna (e.g., the NFC antenna (441) of FIG. 4), a wireless charging antenna (e.g., the wireless charging antenna (442) of FIG. 4), and / or a magnetic secure transmission (MST) antenna (e.g., the MST antenna (443) of FIG. 4). For example, the antenna structure (400) may include a shielding member (e.g., the shielding member (405) of FIG. 4) (e.g., a conductive sheet). For example, the antenna structure (400) may perform short-range communication with an external electronic device (e.g., the electronic device (102, 104) of FIG. 1A) or wirelessly transmit and receive power required for charging. For example, the external electronic device (e.g., the electronic device (102, 104) of FIG. 1A) may include a hearing aid and / or wireless earphone. According to various embodiments, the antenna structure (400) may be formed by a portion or a combination of the side member (310) and / or the first support member (311).

[0084] According to one embodiment, the electronic device (300) of FIG. 3 may substantially include the embodiments disclosed in the electronic device (101) of FIG. 1A, the electronic device (200) of FIG. 2A and / or FIG. 2B. For example, the embodiments of the electronic device (300) disclosed in FIG. 3 may be configured substantially identically to the embodiments disclosed in the electronic device (200) of FIGS. 2A and 2B, with only the reference numerals in the drawings being different.

[0085] According to various embodiments, the electronic device (300) of FIG. 3 may include at least some similar or different embodiments from the electronic device (101) of FIG. 1A, the electronic device (200) of FIG. 2A and / or FIG. 2B.

[0086] According to one embodiment, the embodiments related to the electronic device (200) of FIGS. 2A and 2B and the electronic device (300) of FIG. 3 are described with respect to a bar-type electronic device, but various embodiments of the present invention are not limited to the above-described examples and can be substantially equally applied to electronic devices such as a foldable type, a rollable type, a sliding type, or a wearable type.

[0087] According to various embodiments, in the description of the electronic device (300) disclosed below, the same reference numerals are given to components that are substantially the same as those described in the electronic device (101) of FIG. 1A, the electronic device (200) of FIGS. 2A and 2B, and the electronic device (300) of FIG. 3, and a duplicate description thereof may be omitted.

[0088] FIG. 4 is a schematic diagram illustrating an antenna structure included in the electronic device disclosed in FIG. 3 according to one embodiment of the present invention.

[0089] Referring to FIGS. 3 and 4, the antenna structure (400) may be positioned between the printed circuit board (340) and the back plate (380). For example, the antenna structure (400) may perform wireless communication with an external electronic device (e.g., the electronic device (102, 104) of FIG. 1A). For example, the antenna structure (400) may shield noise and / or magnetic fields generated from the printed circuit board (340).

[0090] According to one embodiment, the antenna structure (400) may include a connector (401), a shielding member (405), a first slit (410), a second slit (420), a third slit (430), an NFC antenna (441) (e.g., a first antenna), a wireless charging antenna (442) (e.g., a second antenna), and / or an MST antenna (443) (e.g., a third antenna).

[0091] In one embodiment, the connector (401) may be electrically connected to the printed circuit board (340). The connector (401) may transmit signals and / or currents transmitted through the printed circuit board (340) to the antenna structure (400). For example, the connector (401) may be electrically connected to a wireless communication module (192) (e.g., a wireless communication circuit) and / or a power management module (188) disposed on the printed circuit board (340). For example, the connector (401) may be electrically connected to an NFC antenna (441) (e.g., a first antenna), a wireless charging antenna (442) (e.g., a second antenna), and an MST antenna (443) (e.g., a third antenna) via a conductive path (e.g., a wire).

[0092] In one embodiment, the shielding member (405) can shield noise generated from the printed circuit board (340). For example, the shielding member (405) can reduce a magnetic field (e.g., H-field) generated from the printed circuit board (340) from being radiated toward the back plate (380). For example, the shielding member (405) can reduce a noise signal and / or a magnetic field generated from the printed circuit board (340) from being radiated toward the back surface (e.g., in the -z-axis direction) of the electronic device (300). For example, the shielding member (405) can include a conductive sheet or a conductive shielding member. For example, the shielding member (405) can include an at least partially formed dielectric substrate (not shown).

[0093] In one embodiment, the shielding member (405) may include at least one of the connector (401), the first slit (410), the second slit (420), the third slit (430), the NFC antenna (441) (e.g., the first antenna), the wireless charging antenna (442) (e.g., the second antenna), and the MST antenna (443) (e.g., the third antenna). For example, the connector (401), the NFC antenna (441) (e.g., the first antenna), the wireless charging antenna (442) (e.g., the second antenna), and the MST antenna (443) (e.g., the third antenna) may be disposed on a dielectric substrate (not shown) at least partially formed on the shielding member (405).

[0094] According to one embodiment, the first slit (410) may be formed in the y-axis direction of the shielding member (405). For example, the first slit (410) may include an opening formed in the y-axis direction of the shielding member (405). For example, the first slit (410) may be formed in the shielding member (405) such that a magnetic field (e.g., H-field) generated from the printed circuit board (340) is radiated toward the rear plate (380). For example, the magnetic field generated from the printed circuit board (340) may be radiated toward the rear plate (380) through the first slit (410). For example, the magnetic field generated from the printed circuit board (340) may be radiated toward the rear surface (e.g., in the -z-axis direction) of the electronic device (300) through the first slit (410). For example, when a magnetic field generated from a printed circuit board (340) is radiated to the rear plate (380) or the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the first slit (410), the amount of the magnetic field generated from the printed circuit board (340) radiated to the front surface (e.g., in the z-axis direction) and the side surface (e.g., in the x-axis direction and the -x-axis direction) of the electronic device (300) can be reduced.

[0095] According to one embodiment, when the amount of the magnetic field generated from the printed circuit board (340) radiated toward the front (e.g., in the z-axis direction) and the side (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) is reduced, test performance related to hearing aid compatibility (HAC) of the electronic device (300) and other electronic devices (e.g., hearing aids) may be improved. For example, when the amount of the magnetic field generated from the printed circuit board (340) radiated toward the front (e.g., in the z-axis direction) and the side (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) is reduced, communication performance of the electronic device (300) and other electronic devices (e.g., hearing aids) paired with the electronic device (300) may be improved.

[0096] In one embodiment, the second slit (420) may be formed in the shielding member (405) in the -x-axis direction perpendicular to the first slit (410). For example, the first slit (410) and the second slit (420) may be formed to be connected. For example, the first slit (410) and the second slit (420) may include an opening formed integrally. For example, the second slit (420) may be formed in the shielding member (405) closer to the connector (401) in the y-axis direction than the third slit (430). For example, the second slit (420) may be formed in the shielding member (405) closer to the y-axis direction than the third slit (430). The second slit (420) may be formed in the shielding member (405) so that a magnetic field (e.g., H-field) generated from the printed circuit board (340) is radiated toward the rear plate (380). For example, the magnetic field generated from the printed circuit board (340) may be radiated toward the rear plate (380) through the first slit (410) and the second slit (420). For example, the magnetic field generated from the printed circuit board (340) may be radiated toward the rear surface (e.g., in the -z-axis direction) of the electronic device (300) through the first slit (410) and the second slit (420). For example, when a magnetic field generated from a printed circuit board (340) is radiated to the rear plate (380) or the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the first slit (410) and the second slit (420), the amount of the magnetic field generated from the printed circuit board (340) radiated to the front surface (e.g., in the z-axis direction) and the side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0097] According to one embodiment, the third slit (430) may be formed in the shielding member (405) in the -x-axis direction perpendicular to the first slit (410). For example, the first slit (410) and the third slit (430) may be formed to be connected. For example, the first slit (410) and the third slit (430) may include an opening formed integrally. For example, the third slit (430) may be formed in the shielding member (405) closer to the NFC antenna (441) in the -y-axis direction than the second slit (420). The third slit (430) may be formed in the shielding member (405) such that a magnetic field (e.g., H-field) generated from the printed circuit board (340) is radiated toward the rear plate (380). For example, a magnetic field generated from the printed circuit board (340) may be radiated toward the back plate (380) through at least one of the first slit (410), the second slit (420), and the third slit (430). For example, a magnetic field generated from the printed circuit board (340) may be radiated toward the back surface (e.g., in the -z-axis direction) of the electronic device (300) through at least one of the first slit (410), the second slit (420), and the third slit (430). For example, when a magnetic field generated from a printed circuit board (340) is radiated toward the rear plate (380) or the back surface (e.g., in the -z-axis direction) of the electronic device (300) through at least one of the first slit (410), the second slit (420), and the third slit (430), the amount of the magnetic field generated from the printed circuit board (340) radiated toward the front surface (e.g., in the z-axis direction) and the side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0098] According to various embodiments, although the antenna structure (400) disclosed in FIG. 4 is described as including a first slit (410), a second slit (420), and a third slit (430), only one of the first slit (410), the second slit (420), or the third slit (430) may be formed in the shielding member (405) as long as the amount of magnetic fields generated from the printed circuit board (340) radiated toward the front (e.g., in the z-axis direction) and the side (e.g., in the x-axis direction and the -x-axis direction) of the electronic device (300) can be reduced.

[0099] According to various embodiments, the first slit (410), the second slit (420), and / or the third slit (430) formed in the antenna structure (400) may be filled with a non-conductive material (e.g., a polymer). According to various embodiments, although the first slit (410), the second slit (420), and / or the third slit (430) formed in the antenna structure (400) has been described as being an opening, the present invention is not limited thereto, and a non-conductive material (e.g., a non-conductive portion) may be formed in a region corresponding to the first slit (410), the second slit (420), and / or the third slit (430). For example, the shielding member (405) of the antenna structure (400) may include at least one non-conductive portion formed in an area corresponding to the first slit (410), the second slit (420), and / or the third slit (430).

[0100] According to various embodiments, although the first slit (410), the second slit (420), and the third slit (430) formed in the antenna structure (400) disclosed in FIG. 4 are described as being interconnected openings, the first slit (410), the second slit (420), or the third slit (430) may be formed in the shielding member (405) spaced apart from each other, as long as the amount of the magnetic field generated from the printed circuit board (340) radiated and / or emitted toward the front (e.g., z-axis direction) and side (e.g., x-axis direction, -x-axis direction, y-axis direction, and / or -y-axis direction) of the electronic device (300) can be reduced.

[0101] According to one embodiment, the NFC antenna (441) (e.g., the first antenna) may be disposed in the y-axis direction of the shielding member (405). The NFC antenna (441) may be formed to surround the first slit (410), the second slit (420), and / or the third slit (430). The NFC antenna (441) may perform short-range communication with an external electronic device (e.g., the electronic device (102, 104) of FIG. 1A). For example, the NFC antenna (441) may be disposed in the y-axis direction of the antenna structure (400). The NFC antenna (441) may be electrically connected to the connector (401) via a conductive path. For example, the NFC antenna (441) may be disposed on a dielectric substrate formed on the shielding member (405).

[0102] In one embodiment, a wireless charging antenna (442) (e.g., a second antenna) may be disposed between an NFC antenna (441) and an MST antenna (443). The wireless charging antenna (442) may charge the electronic device (300) or wirelessly supply power to an external electronic device (e.g., the electronic device (102, 104) of FIG. 1A). The wireless charging antenna (442) may be electrically connected to the connector (401) via a conductive path. For example, the wireless charging antenna (442) may be disposed on a dielectric substrate formed on a shielding member (405).

[0103] According to one embodiment, the MST antenna (443) (e.g., the third antenna) may be disposed in the -y-axis direction of the shielding member (405). The MST antenna (443) may be used for electronic payment of the electronic device (300). The MST antenna (443) may be electrically connected to the connector (401) through a conductive path. For example, the MST antenna (443) may be disposed on a dielectric substrate formed on the shielding member (405).

[0104] Fig. 5 is a drawing schematically illustrating the configuration of a printed circuit board according to one embodiment of the present invention. Fig. 6 is a drawing schematically illustrating the radial distribution of a magnetic field formed on a printed circuit board according to one embodiment of the present invention.

[0105] Referring to FIGS. 5 and 6, a printed circuit board (340) (e.g., first PCB (340a)) according to one embodiment of the present invention may include a first wiring (501), a second wiring (502), and / or a third wiring (503).

[0106] According to one embodiment, the first wiring (501) can electrically connect the battery (350) (e.g., the battery (189) of FIG. 1A) and the wireless communication circuit (510). For example, the first wiring (501) can be formed in a path (e.g., the first path) that electrically connects the battery (350) and the wireless communication circuit (510) (e.g., the RFIC). For example, the first wiring (501) can be a path that transfers power from the battery (350) to the wireless communication circuit (510) (e.g., the RFIC). For example, when power from the battery (350) is transferred to the wireless communication circuit (510) and current flows in the first wiring (501), a magnetic field (e.g., an H-field) can be generated around the first wiring (501) as disclosed in FIG. 6.

[0107] According to various embodiments, the first wiring (501) may include at least one of a conductive connecting member, a wire, a plating layer, and an FPCB. For example, the wireless communication circuit (510) may transmit a power supply signal and / or a radio frequency signal to the antenna structure (400). The wireless communication circuit (510) may include the wireless communication module (192) disclosed in FIG. 1, and may include embodiments substantially identical to the wireless communication module (192).

[0108] In one embodiment, the second wiring (502) may electrically connect the battery (350) and the first power management circuit (521) (e.g., the first PMIC). For example, the second wiring (502) may be formed in a path (e.g., the second path) that electrically connects the battery (350) and the first power management circuit (521). For example, the second wiring (502) may be a path that transmits power of the battery (350) to the first power management circuit (521). For example, power of the battery (350) may be transmitted to the first power management circuit (521) through a portion of the first wiring (501) and the second wiring (502). For example, when power from the battery (350) is transmitted to the first power management circuit (521) and current flows through the second wiring (502), a magnetic field may be generated around the second wiring (502) as disclosed in FIG. 6.

[0109] According to various embodiments, the second wiring (502) may include at least one of a conductive connecting member, a wire, a plating layer, and an FPCB. For example, the first power management circuit (521) may include the power management module (188) disclosed in FIG. 1 and may include embodiments substantially identical to the power management module (188).

[0110] In one embodiment, the third wiring (503) may electrically connect the battery (350) and the second power management circuit (522) (e.g., the second PMIC). For example, the third wiring (503) may be arranged in a path (e.g., the third path) that electrically connects the battery (350) and the second power management circuit (522). For example, the third wiring (503) may be a path that transmits power from the battery (350) to the second power management circuit (522). For example, power from the battery (350) may be transmitted to the second power management circuit (522) through a portion of the first wiring (501) and the third wiring (503). For example, when power from the battery (350) is transmitted to the second power management circuit (522) and current flows through the third wiring (503), a magnetic field may be generated around the third wiring (503) as disclosed in FIG. 6.

[0111] According to various embodiments, the third wiring (503) may include at least one of a conductive connecting member, a wire, a plating layer, and an FPCB. For example, the second power management circuit (522) may include the power management module (188) disclosed in FIG. 1 and may include embodiments substantially identical to the power management module (188).

[0112] FIG. 7 is a schematic diagram showing a state in which an antenna structure is arranged on a printed circuit board of an electronic device according to one embodiment of the present invention.

[0113] For example, FIG. 7 may be a drawing of a part of an antenna structure (400) arranged on a printed circuit board (340) of an electronic device (300) disclosed in FIG. 4, viewed from the -z axis.

[0114] According to one embodiment, the first slit (410) formed in the antenna structure (400) may be formed at a position corresponding to the first wire (501) of the printed circuit board (340). For example, the first slit (410) may be formed in the antenna structure (400) (e.g., the shielding member (405)) so as to at least partially overlap the first wire (501) disposed on the printed circuit board (340). For example, referring to FIG. 5, the first wire (501) may be disposed in a path (e.g., the first path) that electrically connects the battery (350) and the wireless communication circuit (510). For example, a high level of magnetic field radiation may be generated around the first wire (501) that electrically connects the battery (350) and the wireless communication circuit (510). For example, the first slit (410) formed at a position corresponding to the first wiring (501) can radiate a magnetic field generated around the first wiring (501) to the back surface (e.g., -z-axis direction) of the electronic device (300). For example, when the magnetic field generated in the first wiring (501) is radiated and / or released to the back surface (e.g., -z-axis direction) of the electronic device (300) through the first slit (410), the amount radiated to the front surface (e.g., z-axis direction) and side surface (e.g., x-axis direction, -x-axis direction, y-axis direction, and / or -y-axis direction) of the electronic device (300) can be reduced.

[0115] According to one embodiment, the second slit (420) formed in the antenna structure (400) may be formed at a position corresponding to the second wire (502) of the printed circuit board (340). For example, the second slit (420) may be formed in the antenna structure (400) (e.g., the shielding member (405)) so as to at least partially overlap the second wire (502) disposed on the printed circuit board (340). For example, referring to FIG. 5, the second wire (502) may be disposed in a path (e.g., the second path) that electrically connects the battery (350) and the first power management circuit (521). For example, a high level of magnetic field radiation may be generated around the second wire (502) that electrically connects the battery (350) and the first power management circuit (521). For example, a second slit (420) formed at a position corresponding to the second wiring (502) can radiate a magnetic field generated around the second wiring (502) to the back surface (e.g., in the -z-axis direction) of the electronic device (300). For example, when a magnetic field generated in the second wiring (502) is radiated to the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the second slit (420), the amount radiated to the front surface (e.g., in the z-axis direction) and side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0116] According to one embodiment, the third slit (430) formed in the antenna structure (400) may be formed at a position corresponding to the third wire (503) of the printed circuit board (340). For example, the third slit (430) may be formed in the antenna structure (400) (e.g., the shielding member (405)) so as to at least partially overlap the third wire (503) disposed on the printed circuit board (340). For example, referring to FIG. 5, the third wire (503) may be disposed in a path (e.g., the third path) that electrically connects the battery (350) and the second power management circuit (522). For example, a high level of magnetic field radiation may be generated around the third wire (503) that electrically connects the battery (350) and the second power management circuit (522). For example, a third slit (430) formed at a position corresponding to a third wire (503) can radiate a magnetic field generated around the third wire (503) to the back surface (e.g., in the -z-axis direction) of the electronic device (300). For example, when a magnetic field generated around the third wire (503) is radiated to the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the third slit (430), the amount radiated to the front surface (e.g., in the z-axis direction) and side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0117] Fig. 8 is a diagram schematically illustrating the radial distribution of a magnetic field of an electronic device according to a comparative example. Fig. 9 is a diagram schematically illustrating the radial distribution of a magnetic field of an electronic device according to an embodiment of the present invention.

[0118] For example, an electronic device according to a comparative example may be an embodiment in which a shielding member without a slit is disposed on the back surface of a printed circuit board. For example, FIG. 7 may be a drawing schematically showing the radial distribution of a magnetic field generated from a printed circuit board radiated to the front and side surfaces of an electronic device in a state in which a shielding member without a slit is disposed on the back surface of the printed circuit board.

[0119] For example, an electronic device (300) according to one embodiment of the present invention may be an embodiment in which an antenna structure (400) (e.g., a shielding member (405)) having at least one slit (e.g., a first slit (410), a second slit (420), and / or a third slit (430)) formed on a back surface (e.g., in the -z-axis direction) of a printed circuit board (340) is disposed. For example, FIG. 8 may be a drawing schematically showing a radiation distribution in which a magnetic field generated from a printed circuit board (340) is emitted to the front and side surfaces of the electronic device (300) in a state in which an antenna structure (400) (e.g., a shielding member (405)) having at least one slit formed on a back surface (e.g., in the -z-axis direction) of the printed circuit board (340) is disposed.

[0120] Referring to FIG. 8, in an electronic device according to a comparative example, a shielding member without a slit formed thereon is placed on the back surface of a printed circuit board, and a magnetic field generated from the printed circuit board is not radiated to the back surface of the electronic device, so that the radiation distribution of the magnetic field emitted to the front and side surfaces of the electronic device can be represented as in the first graph (G1).

[0121] Referring to FIG. 9, an electronic device (300) according to an embodiment of the present invention has an antenna structure (400) (e.g., a shielding member (405)) having at least one slit (e.g., a first slit (410), a second slit (420), and / or a third slit (430)) formed therein, disposed on a back surface (e.g., in the -z-axis direction) of a printed circuit board (340), and a magnetic field generated from the printed circuit board (340) is radiated to the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the at least one slit, so that a radiation distribution of a magnetic field radiated to the front surface (e.g., in the z-axis direction) and the side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) may be represented as in the second graph (G2).

[0122] Comparing the first graph (G1) showing the radiation distribution for the front and side surfaces of the electronic device according to the comparative embodiment disclosed in FIG. 8 with the second graph (G2) showing the radiation distribution for the front and side surfaces of the electronic device (300) according to the embodiment of the present invention disclosed in FIG. 9, it can be seen that the magnetic field generated from the printed circuit board (340) of the electronic device (300) according to the embodiment of the present invention is radiated to the rear surface (e.g., in the -z-axis direction, rear plate (380)) of the electronic device (300) through at least one slit (e.g., the first slit (410), the second slit (420), and / or the third slit (430)), and therefore, the radiation amount of the magnetic field emitted to the front surface (e.g., in the z-axis direction) and side surfaces (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) is lower than the radiation amount of the electronic device according to the comparative embodiment.

[0123] FIG. 10 is a schematic drawing of a portion of an antenna structure including an opening according to various embodiments of the present invention.

[0124] According to various embodiments, the antenna structure (400) may include an opening (1010) instead of, for example, the first slit (410), the second slit (420), and / or the third slit (430) disclosed in FIG. 4. For example, the opening (1010) may be formed in the shielding member (405) of the antenna structure (400). For example, the opening (1010) may be formed at a location and / or area corresponding to the first wire (501), the second wire (502), and the third wire (503) disclosed in FIG. 5. The opening (1010) may be formed in an area covering the first wire (501), the second wire (502), and the third wire (503) disclosed in FIG. 5. For example, an opening (1010) may be formed in the antenna structure (400) (e.g., shielding member (405)) to overlap the first wiring (501), the second wiring (502), and the third wiring (503) arranged on the printed circuit board (340) of FIG. 5.

[0125] According to various embodiments, the opening (1010) formed in the antenna structure (400) (e.g., the shielding member (405)) can radiate a magnetic field generated from the printed circuit board (340) toward the back surface (e.g., in the -z-axis direction) of the electronic device (300). For example, when the magnetic field generated from the printed circuit board (340) is radiated toward the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the opening (1010), the amount of the magnetic field generated from the printed circuit board (340) radiated toward the front surface (e.g., in the z-axis direction) and the side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0126] FIG. 11 is a schematic drawing of a portion of an antenna structure including a first slit according to various embodiments of the present invention.

[0127] According to various embodiments, the antenna structure (400) may include, for example, a first slit (410) as disclosed in FIG. 4. For example, the first slit (410) may be formed in a shielding member (405) of the antenna structure (400). For example, the first slit (410) may be formed at a position and / or area corresponding to the first wiring (501) disclosed in FIG. 5. The first slit (410) may be formed in an area covering the first wiring (501) disclosed in FIG. 5. For example, the first slit (410) may be formed in the antenna structure (400) (e.g., the shielding member (405)) to overlap the first wiring (501) disposed on the printed circuit board (340) of FIG. 5.

[0128] According to various embodiments, the first slit (410) formed in the antenna structure (400) (e.g., the shielding member (405)) can radiate a magnetic field generated from the first wiring (501) of the printed circuit board (340) to the back surface (e.g., in the -z-axis direction) of the electronic device (300). For example, when the magnetic field generated from the first wiring (501) of the printed circuit board (340) is radiated to the back surface (e.g., in the -z-axis direction) of the electronic device (300) through the first slit (410), the amount of the magnetic field generated from the first wiring (501) of the printed circuit board (340) radiated to the front surface (e.g., in the z-axis direction) and side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0129] FIG. 12 is a schematic diagram illustrating an antenna structure including at least one conductive pattern according to various embodiments of the present invention.

[0130] According to various embodiments, the antenna structure (400) may be formed to include at least one conductive pattern (1210) and at least one hole (1220), instead of being formed in the form of, for example, the first slit (410) disclosed in FIG. 4. For example, the first slit (410) disclosed in FIG. 4 may include at least one conductive pattern (1210). For example, the antenna structure (400) (e.g., the shielding member (405)) may include at least one hole (1220) separated by at least one conductive pattern (1210) disposed within the first slit (410). For example, the first slit (410) may include at least one hole (1220) formed by at least one conductive pattern (1210). For example, the first slit (410) may be separated into at least one hole (1220) by at least one conductive pattern (1210) formed in the shielding member (405). For example, the at least one hole (1220) formed by the at least one conductive pattern (1210) may be formed at a position and / or area corresponding to the first wiring (501) disclosed in FIG. 5. For example, the at least one hole (1220) may be formed in the antenna structure (400) (e.g., the shielding member (405)) to at least partially overlap the first wiring (501) disposed on the printed circuit board (340) of FIG. 5.

[0131] According to various embodiments, at least one hole (1220) formed in the antenna structure (400) (e.g., shielding member (405)) can radiate a magnetic field generated from the printed circuit board (340) toward the back surface (e.g., in the -z-axis direction) of the electronic device (300). For example, when the magnetic field generated from the printed circuit board (340) is radiated through the at least one hole (1220) toward the back surface (e.g., in the -z-axis direction) of the electronic device (300), the amount of the magnetic field generated from the printed circuit board (340) radiated toward the front surface (e.g., in the z-axis direction) and the side surface (e.g., in the x-axis direction, the -x-axis direction, the y-axis direction, and / or the -y-axis direction) of the electronic device (300) can be reduced.

[0132] An electronic device (101, 200, 300) according to one embodiment of the present invention may include a housing (210) including a front plate (320), a rear plate (380), and a side member (310) surrounding a space between the front plate (320) and the rear plate (380). According to one embodiment, the electronic device (300) may include a printed circuit board (340) disposed inside the housing (210), a first wiring (501) formed on the printed circuit board (340), and an antenna structure (400) disposed between the printed circuit board (340) and the rear plate (380). According to one embodiment, the antenna structure (400) may include a first slit (410) formed at a position corresponding to the first wiring (501).

[0133] According to one embodiment, the electronic device (300) further includes a battery (350) and a wireless communication circuit (510), and the first wiring (501) can be formed in a path that electrically connects the battery (350) and the wireless communication circuit (510).

[0134] According to one embodiment, the electronic device (300) may further include a first power management circuit (521), the printed circuit board (340) may further include a second wiring (502) formed in a path electrically connecting the battery (350) and the first power management circuit (521), and the antenna structure (400) may further include a second slit (420) formed at a position corresponding to the second wiring (502).

[0135] According to one embodiment, the electronic device (300) may further include a second power management circuit (522), the printed circuit board (340) may further include a third wiring (503) formed in a path electrically connecting the battery (350) and the second power management circuit (522), and the antenna structure (400) may further include a third slit (430) formed at a position corresponding to the third wiring (503).

[0136] According to one embodiment, the antenna structure (400) further includes a shielding member (405), and the first slit (410), the second slit (420), and the third slit (430) can be formed in the shielding member (405).

[0137] According to one embodiment, a magnetic field generated from the printed circuit board (340) may be radiated toward the rear plate (380) through at least one of the first slit (410), the second slit (420), and the third slit (430).

[0138] According to one embodiment, the antenna structure (400) may include at least one hole (1220) separated by at least one conductive pattern (1210) formed within the first slit (410).

[0139] According to one embodiment, the antenna structure (400) may further include a connector (401) electrically connected to the wireless communication circuit (510).

[0140] According to one embodiment, the antenna structure (400) further includes a near field communication (NFC) antenna (441) electrically connected to the connector (401), and the NFC antenna (441) may be configured to surround the first slit (410).

[0141] According to one embodiment, the antenna structure (400) may further include at least one of a wireless charging antenna (442) and a magnetic secure transmission (MST) antenna (443) electrically connected to the connector (401).

[0142] According to various embodiments of the present invention, an electronic device (101, 200, 300) includes a housing (210), a battery (350), a wireless communication circuit (510), at least one power management circuit (521, 522), a printed circuit board (340) disposed inside the housing (210) and including a plurality of wires (501, 502, 503) configured to electrically connect the battery (350) to the wireless communication circuit (510) and the at least one power management circuit (521, 522), respectively, and an antenna structure (400) disposed in a thickness direction of the electronic device between the printed circuit board (340) and the housing (210), wherein the antenna structure (400) may include a plurality of slits (410, 420, 430) corresponding to positions of the plurality of wires (501, 502, 503).

[0143] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0144] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0145] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0146] The embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples presented to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of one embodiment of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical features of one embodiment of the present disclosure, in addition to the embodiments disclosed herein.

Claims

1. In electronic devices (101, 200, 300), A housing (210) including a front plate (320), a rear plate (380), and a side member (310) surrounding a space between the front plate (320) and the rear plate (380); A printed circuit board (340) placed inside the above housing (210); A first wiring (501) formed on the printed circuit board (340); and Including an antenna structure (400) disposed between the printed circuit board (340) and the rear plate (380), An electronic device in which the antenna structure (400) includes a first slit (410) formed at a position corresponding to the first wiring (501).

2. In paragraph 1, Further comprising a battery (350) and a wireless communication circuit (510), The above first wiring (501) is an electronic device formed in a path that electrically connects the battery (350) and the wireless communication circuit (510).

3. In paragraph 2, Further comprising a first power management circuit (521), The printed circuit board (340) further includes a second wiring (502) formed in a path electrically connecting the battery (350) and the first power management circuit (521). An electronic device in which the antenna structure (400) further includes a second slit (420) formed at a position corresponding to the second wiring (502).

4. In paragraph 2 or 3, Further comprising a second power management circuit (522), The printed circuit board (340) further includes a third wiring (503) formed in a path electrically connecting the battery (350) and the second power management circuit (522). An electronic device in which the antenna structure (400) further includes a third slit (430) formed at a position corresponding to the third wiring (503).

5. In paragraph 4, The above antenna structure (400) further includes a shielding member (405), The first slit (410), the second slit (420) and the third slit (430) are electronic devices formed in the shielding member (405).

6. In paragraph 5, An electronic device in which a magnetic field generated from the printed circuit board (340) is radiated toward the rear plate (380) through at least one of the first slit (410), the second slit (420), and the third slit (430).

7. In paragraph 1, The above antenna structure (400) is An electronic device comprising at least one hole (1220) separated by at least one conductive pattern (1210) formed within the first slit (410).

8. In paragraph 2, An electronic device wherein the antenna structure (400) further includes a connector (401) configured to be electrically connected to the wireless communication circuit (510).

9. In paragraph 8, The above antenna structure (400) further includes an NFC (near field communication) antenna (441) electrically connected to the connector (401), An electronic device in which the NFC antenna (441) is configured to surround the first slit (410).

10. In paragraph 8 or 9, An electronic device in which the antenna structure (400) further includes at least one of a wireless charging antenna (442) and an MST (magnetic secure transmission) antenna (443) electrically connected to the connector (401).

11. In paragraph 4, An electronic device in which the first slit (410), the second slit (420) and the third slit (430) are formed integrally.

12. In electronic devices (101, 200, 300), Housing (210); Battery (350); Wireless communication circuit (510); At least one power management circuit (521, 522); A printed circuit board (340) disposed inside the housing (210) and including a plurality of wires (501, 502, 503) configured to electrically connect the battery (350) to the wireless communication circuit (510) and the at least one power management circuit (521, 522), respectively; and It includes an antenna structure (400) arranged in the thickness direction of the electronic device between the printed circuit board (340) and the housing (210), An electronic device in which the antenna structure (400) includes a plurality of slits (410, 420, 430) corresponding to the positions of the plurality of wires (501, 502, 503).

13. In paragraph 12, The above antenna structure (400) further includes a shielding member (405), The above plurality of slits (410, 420, 430) are electronic devices formed within the shielding member (405).

14. In paragraph 12, The above antenna structure (400) further includes an NFC (near field communication) antenna (441), An electronic device in which the NFC antenna (441) is configured to surround the plurality of slits (410, 420, 430).

15. In paragraph 12, An electronic device in which the above plurality of slits (410, 420, 430) are formed integrally.

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