Laser-assisted hybrid bonding system and method

Abstract

An electronic device placement system includes a positioning system having a carriage movable between a picking location and a placement location, a spindle assembly coupled to the carriage, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle mounted to the transparent spindle body, a downward facing laser coupled to the carriage or the spindle assembly and positionable above the transparent spindle body, and a controller configured to control the positioning system to place the electronic device on a substrate using the transparent spindle body and activate the downward facing laser to heat the electronic device through the transparent spindle body.

Description

LASER-ASSISTED HYBRID BONDING SYSTEM AND METHODRELATED APPLICATION

[0001] The present application claims priority to U.S. Provisional Patent Application No. 63 / 687,956 filed on August 28, 2024 and titled “LASER GENERATED HEATING OF A DIE DURING PLACEMENT IN A HYBRID BONDER” the entirety of which is incorporated by reference herein.FIELD OF INVENTION

[0002] The present disclosure relates to generally to placement of electronic devices, components and / or dies on a substrate, such as a wafer, printed circuit board, fan out panel, die or the like. More particularly, the present invention relates to placement methods and systems that includes both improved placement accuracy while adding a power laser such that a placed die can be quickly ramped up in temperature by a laser light.BACKGROUND

[0003] Electronic device placement systems play a crucial role in the manufacturing of modem electronic products. These systems arc responsible for accurately positioning and attaching components such as semiconductor dies, integrated circuits, and other electronic devices onto substrates like printed circuit boards, wafers, or panels. As electronic devices continue to shrink in size while increasing in complexity, the demands on placement accuracy and efficiency have grown substantially.

[0004] State of the art pick and place and bonding equipment uses many ways to heat a component and bond, or often solder the connections of an electronic component to the substrate, while the placement nozzle provides controlled pressure on the component. Frequently resistive heating is integrated in the nozzle. Alternatively, a contactless heat transfer over a small gap between the nozzle and the resistive heating element is used. In a method called hotbar bonding a bar of resistive material is pressed down on the leads, or on the back of flexible electronics materials, to solder the connections during placement. Heat may also be applied from below the substrate to aid in creating a quick bond or solder connection on the top of the substrate.

[0005] However, these conventional heating methods can face limitations in terms of speed, precision, and thermal management. Resistive heating elements may require significant time to reach desired temperatures and cool down between operations. This can impact overall production throughput. Additionally, applying heat across larger areas of components or substrates may lead to thermal expansion issues or potentially damage heat-sensitive materials.

[0006] As the electronics industry pushes towards higher density assemblies and more advanced packaging techniques, there is an ongoing need for placement systems that can achieve greater accuracywhile also improving thermal control and bonding speed. Innovations in this field have the potential to enable new device designs, enhance reliability, and increase manufacturing efficiency.SUMMARY

[0007] In one aspect, an electronic device placement system includes: a positioning system having a carriage movable between a picking location and a placement location; a spindle assembly coupled to the carriage, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle mounted to the transparent spindle body; a downward facing laser coupled to the carriage or the spindle assembly and positionable above the transparent spindle body; and a controller configured to control the positioning system to place the electronic device on a substrate using the transparent spindle body and activate the downward facing laser to heat the electronic device through the transparent spindle body.

[0008] Additionally or alternatively, the nozzle is made of a transparent material.

[0009] Additionally or alternatively, the electronic device placement system further comprises a downward facing camera coupled to the carriage or the spindle assembly and positionablc above the transparent spindle body, wherein the controller is further configured to control the downward facing camera to image the electronic device through the transparent spindle body during placement.

[0010] Additionally or alternatively, the downward facing laser and the downward facing camera are mounted on a rotatable assembly configmed to selectively position either the downward facing laser or the downward facing camera above the transparent spindle body.

[0011] Additionally or alternatively, the transparent spindle body includes a pair of transparent plates with a nozzle opening between the plates, wherein the spindle assembly further includes a theta drive configured to rotate the nozzle to enable pickup and placement of the electronic device at different angles.

[0012] Additionally or alternatively, the controller is further configured to: activate the downward facing laser to heat the electronic device for an initial ramping period; and deactivate the downward facing laser after the initial ramping period to allow for subsequent mass annealing of the electronic device.

[0013] Additionally or alternatively, the controller is further configured to maintain pressure between the electronic device and the substrate via contact with the electronic device by the nozzle during the initial ramping period and release the pressure after deactivating the downward facing laser.

[0014] Additionally or alternatively, the transparent spindle body comprises a material selected from the group consisting of glass, quartz, and sapphire.

[0015] Additionally or alternatively, the downward facing laser is configmed to emit laser light at a wavelength that is substantially transmitted through the transparent spindle body and substantially absorbed by the electronic device.

[0016] Additionally or alternatively, the transparent spindle body is configured to allow imaging of the electronic device through the transparent spindle body during placement operations.

[0017] In another aspect, a method of placing an electronic device comprises: picking up an electronic device using a nozzle mounted to a transparent spindle body of a spindle assembly; moving the spindle assembly to position the electronic device over a substrate; placing the electronic device on the substrate while maintaining contact between the nozzle and the electronic device; positioning a downward facing laser above the transparent spindle body; and activating the downward facing laser to heat the electronic device through the transparent spindle body.

[0018] Additionally or alternatively, the method further comprises: maintaining pressure on the electronic device with the nozzle during the activating the downward facing laser to heat the electronic device through the transparent spindle body.

[0019] Additionally or alternatively, the method further comprises imaging the electronic device through the transparent spindle body using a downward facing camera during placement of the electronic device on the substrate.

[0020] Additionally or alternatively, the downward facing laser and the downward facing camera are mounted on a rotatable assembly, the method further comprising rotating the rotatable assembly to selectively position either the downward facing laser or the downward facing camera above the transparent spindle body.

[0021] Additionally or alternatively, the nozzle is made of a transparent material and wherein the spindle body includes a pair of transparent plates with a nozzle opening between the plates, the method further comprising rotating the pair of transparent plates to enable pickup and placement of the electronic device at different angles.

[0022] Additionally or alternatively, the method further comprises: activating the downward facing laser to heat the electronic device for an initial ramping period; and deactivating the downward facing laser after the initial ramping period to allow for subsequent mass annealing of the electronic device.

[0023] Additionally or alternatively, the method further comprises maintaining pressure between the electronic device and the substrate via contact with the electronic device by the nozzle during the initial ramping period and releasing the pressure after deactivating the downward facing laser.

[0024] Additionally or alternatively, the transparent spindle body comprises a material selected from the group consisting of glass, quartz, and sapphire.

[0025] Additionally or alternatively, activating the downward facing laser comprises emitting laser light at a wavelength that is substantially transmitted through the transparent spindle body and substantially absorbed by the electronic device.

[0026] Additionally or alternatively, the transparent spindle body is configured to allow imaging of the electronic device through the transparent spindle body during placement operations.BRIEF DESCRIPTION OF FIGURES

[0027] The above and further advantages of this invention may be better understood by referring to the following description in conjunction with the accompanying drawings, in which like numerals indicate like structural elements and features in the various figures. For clarity, not every element may be labeled in every figure. The drawings are not necessarily to scale, emphasis instead being placed upon illustrating the principles of the invention.

[0028] FIG. 1 depicts a schematic view of an electronic device placement system, in accordance with one embodiment.

[0029] FIG. 2 depicts a side schematic view of an electronic device placement system, in accordance with one embodiment.

[0030] FIG. 3 A depicts a top schematic view of the electronic device placement system of FIG. 2 with a downward facing laser located over a placed electronic component, in accordance with one embodiment.

[0031] FIG. 3B depicts a top schematic view of the electronic device placement system of FIG. 2 during rotation of the downward facing laser and a downward facing camera, in accordance with one embodiment.

[0032] FIG. 3C depicts a top schematic view of the electronic device placement system of FIG. 2 with the downward facing camera located over a placed electronic component, in accordance with one embodiment.

[0033] FIG. 4 depicts a top schematic view of an electronic device placement system including three independently movable carriages, in accordance with one embodiment.

[0034] FIG. 5 depicts a side schematic view of the electronic device placement system of FIG. 4, in accordance with one embodiment.

[0035] FIG. 6 depicts a method for laser heating a placed electronic component, in accordance with one embodiment.

[0036] FIG. 7 depicts a method for imaging and laser heating a placed electronic component, in accordance with one embodiment.DETAILED DESCRIPTION

[0037] The following description sets forth exemplary aspects of the present disclosure. It should be recognized, however, that such description is not intended as a limitation on the scope of the present disclosure. Rather, the description also encompasses combinations and modifications to those exemplary aspects described herein.

[0038] In brief overview, the present disclosure relates to electronic device placement systems that combine precision positioning capabilities with laser-assisted heating for improved bonding operations.The systems may incorporate a transparent spindle body and / or transparent nozzle that enables optical access for both imaging and laser heating operations while maintaining mechanical contact with electronic devices during placement.

[0039] The disclosed systems may include a positioning system with a movable carriage that transports electronic devices between picking and placement locations. A spindle assembly coupled to the carriage may feature a transparent spindle body made from materials such as glass, quartz, or sapphire, with a nozzle mounted to the transparent structure for engaging electronic devices. The transparent nature of the spindle body may allow optical transmission for various wavelengths of light.

[0040] A downward facing laser may be positioned above the transparent spindle body and configured to emit laser light that passes through the transparent material and may be absorbed by the electronic device. This arrangement may enable direct heating of placed electronic devices without requiring removal of the placement nozzle or interruption of applied pressure during bonding operations. The laser heating may provide rapid temperature ramping for initiating bonding processes such as hybrid bonding of copper contacts.

[0041] The systems may also incorporate imaging capabilities through a downward facing camera that can view electronic devices through the same transparent spindle body. In some cases, both the laser and camera may be mounted on a rotatable or otherwise movable assembly that selectively positions either the laser or the camera above the transparent spindle body, enabling sequential imaging and heating operations. The laser can also be mounted to the camera carriage, such that the camera moves away from the nozzle with the same mechanism as the laser is moved over the nozzle. The laser can also be mounted at an angle next to the camera and heat the die at an angle while the camera stays in position over the glass nozzle. The laser could also move a mirror, or fiber bundle betw een the camera and the glass nozzle to heat the die through the glass nozzle.

[0042] The disclosed methods may involve picking up electronic devices, positioning them over substrates, placing them while maintaining nozzle contact, and then applying laser heating through the transparent spindle body. The laser heating may occur during an initial ramping period while pressure is maintained, followed by deactivation of the laser to allow for subsequent mass annealing operations. This approach may enable rapid individual device heating combined with efficient batch processing for completing bonding operations.

[0043] The combination of transparent optics, precision positioning, and laser heating may provide enhanced thermal control, improved bonding speed, and greater placement accuracy compared to conventional resistive heating methods. The systems may support various electronic packaging applications including semiconductor die placement, integrated circuit assembly, and advanced packaging techniques requiring precise thermal management.

[0044] FIG. 1 depicts a schematic view of an electronic device placement system 1, in accordance with one embodiment. The electronic device placement system 1 may be configured to precisely placeand heat electronic devices during manufacturing operations. The electronic device placement system 1 includes a positioning system 2 that enables controlled movement and positioning of components during placement operations. A carriage 3 may be movably coupled to the positioning system 2. where the carriage 3 may be movable between a picking location and a placement location to facilitate the transfer of electronic devices from a source to a target substrate 11. The positioning sy stem 2 may provide multiaxis movement capabilities to enable precise positioning of electronic devices during placement operations.

[0045] A spindle assembly 4 may be coupled to the carriage 3 and configured to handle electronic devices during placement operations. The spindle assembly 4 includes a spindle 5 having a transparent spindle body 6 that allows optical access through the spindle structure. The spindle 5 includes a nozzle 7 mounted to the transparent spindle body 6, where the nozzle 7 may be configured to engage and hold an electronic device 15 during transport and placement operations. In some cases, the nozzle 7 may be made of a transparent material to further enhance optical transmission capabilities through the spindle assembly 4. The transparent spindle body 6 may be configured to allow imaging of the electronic device 15 through the transparent spindle body 6 during placement operations, enabling visual feedback and alignment verification.

[0046] As further shown in FIG. 1, a downward facing laser 8 may be coupled to the carriage 3 or the spindle assembly 4. The downward facing laser 8 may be positionable above the transparent spindle body 6. The downward facing laser 8 may be configured to emit laser light at a wavelength that may be substantially transmitted through the transparent spindle body 6 and substantially absorbed by the electronic device 15. In some cases, the downward facing laser 8 may be a He-Ne laser operating in the visible light range, providing controlled heating capabilities for bonding operations. The positioning of the downward facing laser 8 above the transparent spindle body 6 enables direct heating of electronic devices through the transparent structure without requiring removal of the spindle assembly 4 from contact with the electronic device 15.

[0047] A controller 9 may be communicatively coupled to various components of the electronic device placement system 1 and configured to coordmate system operations. The controller 9 may be configured to control the positioning system 2 to place the electronic device 15 on a substrate 11 using the transparent spindle body 6 and activate the downward facing laser 8 to heat the electronic device 15 through the transparent spindle body 6. The controller 9 may manage the timing and sequencing of placement and heating operations to achieve proper bonding conditions. A board handling sy stem 10 may be configured to support and / or move the substrate 11 prior to and / or during placement operations, further providing a stable platform for receiving electronic devices.

[0048] The electronic device placement system 1 may further include a downward facing camera 12 coupled to the carriage 3 or the spindle assembly 4. The downward facing camera 12 may be positionable above the transparent spindle body 6. The downward facing camera 12 may enable imaging of electronic devices through the transparent spindle body 6 during placement operations. In some cases, a rotatableassembly 13 and / or any other selective movement system may be configured to selectively position either the downward facing laser 8 or the downward facing camera 12 above the transparent spindle body 6, allowing for sequential imaging and heating operations. In other embodiments, the downward facing laser 8 and / or tire downward facing camera 12 may be positioned in an angled manner so that each may be pointed at a placed electronic device simultaneously. A theta drive 14 may be coupled to the spindle assembly 4 to provide rotational positioning capabilities for the electronic device 15 during placement operations. An upward facing camera 16 may be positioned to provide additional imaging capabilities from below the picked electronic device 15.

[0049] The transparent spindle body 6 may comprise a material selected from the group consisting of glass, quartz, and sapphire, where each material may provide different optical transmission characteristics for various laser wavelengths. Glass may provide suitable transmission for visible light applications, while quartz material may offer enhanced transmission properties and thermal stability for higher power laser operations. Sapphire material may provide exceptional durability and transmission characteristics across a broader wavelength range, making the transparent spindle body 6 suitable for various laser heating applications. The selection of transparent material may depend on the specific laser wavelength, power requirements, and operating conditions of the electronic device placement system 1.

[0050] FIG. 2 depicts a side schematic view of an electronic device placement system 101, in accordance with one embodiment. The electronic device placement system 101 may include a rotatable assembly 113 that provides a mechanical switching mechanism for selective positioning of optical components above a transparent spindle body 110. The rotatable assembly 113 may be mounted to a spindle carriage 120 and configured to enable alternating access of a downward facing camera 151 (rotated and hidden from view, shown in FIGS. 3 A - 3B) and a downward facing laser 100 to the transparent spindle body 110 during placement operations. The spindle carriage 120 may be coupled to an additional moving carriage 116 (shown in FIGS. 3 A - 3B) to provide general X and Y gantry movement for the spindle carriage 120. The spindle carriage 120 may be configured to move in a Z-direction (upwards and downwards) relative to this moving carriage 116. thereby providing full 3-axis movement.

[0051] The rotatable assembly 113 may provide a space-efficient solution for integrating both imaging and heating capabilities within the electronic device placement system 101 without requiring separate positioning mechanisms for each optical component. The mechanical arrangement of the rotatable assembly 113 may allow for rapid switching between imaging and heating modes during electronic device placement sequences.

[0052] The transparent spindle body 110 may comprise a first glass plate 126a and a second glass plate 126b with a nozzle 112 positioned between the glass plates. The nozzle 112 may include a nozzle opening 118 and may be configured to engage and hold an electronic device 115 during transport and placement operations onto a substrate 111. The transparent spindle body 110 may enable optical access from above through both the first glass plate 126a and the second glass plate 126b, allowing the downward facing camera 151 and the downward facing laser 100 to operate through the same optical pathwhen positioned above the transparent spindle body 110. A substrate holding system and / or board handling system 142 may support the substrate 111 during placement operations, providing a stable platform for receiving the electronic device 115 from the nozzle 112.

[0053] A spindle assembly 104 may be coupled to the spindle carriage 120 through a piezo stage 121 (to enable precise positioning control during pick and place operations) and a z-drive 122. The piezo stage 121 may be configured to make fine positioning adjustments in multiple axial directions, providing sub-micron positioning accuracy for the electronic device 115 during placement onto the substrate 111. The z-drive 122 may provide vertical movement capabilities for the spindle assembly 104, allowing the nozzle 112 to approach and contact the substrate 111 during placement operations. A theta drive 131 may be coupled to the spindle assembly 104 to provide rotational positioning capabilities, enabling the electronic device 115 to be oriented at different angles during pickup and placement operations.

[0054] As further shown in FIG. 2. the rotatable assembly 113 may operate through a mechanical rotation mechanism that alternately positions the downward facing camera 105 and the downward facing laser 100 above the transparent spindle body 110. During imaging operations, the rotatable assembly 113 may position the downward facing camera 105 directly above the transparent spindle body 110 to enable imaging of the electronic device 115 through the first glass plate 126a and the second glass plate 126b. The downward facing camera 105 may capture images of the electronic device 115 during placement operations to provide visual feedback for alignment verification and placement accuracy assessment. Following completion of imaging operations, the rotatable assembly 113 may rotate to position the downward facing laser 100 above the transparent spindle body 110 for heating operations while the nozzle 112 maintains contact with the electronic device 115.

[0055] In some cases, the downward facing laser 1 0 may be mounted at an angle next to the downward facing camera 105 within the rotatable assembly 113 to heat the electronic device 115 at an angle while the downward facing camera 105 remains in position over the transparent spindle body 110. This angled mounting configuration may allow simultaneous imaging and heating operations without requiring rotation of the rotatable assembly 113 between operational modes. The angled laser positioning may direct laser energy through the transparent spindle body 110 at an oblique angle while maintaining optical access for the downward facing camera 105 along a vertical axis above the transparent spindle body 110. An upward facing camera 130 may be positioned adjacent to the substrate holding system 142 to provide additional imaging capabilities from below the substrate 111 during placement operations.

[0056] The rotatable assembly 113 may incorporate optical redirection mechanisms to enable flexible positioning of laser energy delivery to the electronic device 115 through the transparent spindle body 110. In some cases, the downward facing laser 100 may move a mirror betw een the downward facing camera 105 and the transparent spindle body 110 to heat the electronic device 115 through the transparent spindle body 110. The mirror may be positioned and oriented to redirect laser energy’ from the downward facing laser 100 through the transparent spindle body 110 while allowing the downward facing camera 105 to maintain imaging access through an alternate optical path. In some cases, the downw ardfacing laser 100 may move a fiber bundle dining movement thereof. The fiber bundle may provide flexible laser energy deliver}' while occupying minimal space within the rotatable assembly 113, allowing both the downward facing camera 105 and the downward facing laser 100 to operate through the same general optical access area above the transparent spindle body 110.

[0057] FIG. 3A depicts a top schematic view of the electronic device placement system 101 of FIG. 2 with the downward facing laser 100 located over a placed electronic component, in accordance with one embodiment. The electronic device placement system 101 may include a positioning system that provides multi-axis movement capabilities for precise positioning of electronic devices during placement operations. The positioning system may include a x-directional movement beam 114 that extends horizontally and provides a structural framework for supporting movable components. A y-directional movement carriage 116 may be movably coupled to the x-directional movement beam 114, where the y- directional movement carriage 116 may be configured to translate along the x-directional movement beam 114 to position the spindle assembly 104 at different locations during placement operations. The positioning system, in combination with a controller or computer system such as the controller 9, may enable controlled movement of the spindle assembly 104 between picking locations and placement locations while maintaining precise positioning accuracy throughout the movement range.

[0058] The positioning system may further include a first rail for providing x-directional movement 1 5a and a second rail for providing x-directional movement 155b that extend perpendicular to the x- directional movement beam 114. Bearings 156 for x-directional movement may be positioned along the first rail 155a and the second rail 155b to enable smooth linear motion of components along the x- directional axis. The x-directional movement beam 114 may be movably coupled to the bearings 156 for x-directional movement thereof and configured to translate along the first rail 155a and the second rail 155b. The combination of the x-directional movement beam 114 and y-directional movement carriage 116 may provide two-axis positioning capabilities that enable the spindle assembly 104 to access different locations within a working area of the electronic device placement system 101.

[0059] With continued reference to FIG. 3A, the positioning system 106 may include bearings 166 for that facilitate movement of the y-directional movement carriage 116 along the x-directional movement beam 114. A first rail for providing y-directional movement 165a and a second rail for providing y- directional movement 165b may extend parallel to each other and provide structural support for the x- dircctional movement beam 114. The bearings 166 may be positioned between the first rail 165a and the second rail 165b to enable smooth translation of the x-directional movement beam 114 along the y- directional axis. Bearings 176 for z-directional movement may be incorporated within the positioning system 106 to provide vertical movement capabilities for the spindle assembly 104 and the spindle carriage 120 thereof, allowing the nozzle 112 to approach and contact the substrate 111 during placement operations.

[0060] As further shown in FIG. 3 A. the rotatable assembly 113 may be moimted above the transparent spindle body 110 and configured to selectively position optical components for imaging andheating operations. The rotatable assembly 113 may include a downward facing laser 100 that may be positioned to direct laser energy through the transparent spindle body 110 toward the electronic device 115 during heating operations. A downward facing camera 150 may also be incorporated within the rotatable assembly 113 to provide imaging capabilities through the transparent spindle body 110 during placement operations. The rotatable assembly 113 may enable alternating access of the downward facing camera 150 and the downward facing laser 100 to the transparent spindle body 110 without requiring separate positioning mechanisms for each optical component.

[0061] In the embodiment shown in FIG. 3A. the downward facing laser 100 has been positioned directly over the transparent spindle body 110 toward the electronic device 115 in order to perform a heating operation. As such, the electronic device and nozzle 12 is hidden by the downward facing laser 100 during the positioning state shown in this view.

[0062] Thus, the positioning system may incorporate linear bearings that provide structural support and guidance for movement components within the electronic device placement system 101. The spindle carriage 120 may be movably coupled to the linear bearing and configured to support the spindle assembly 104 during placement operations. While a particular positioning system is shown in FIG. 3, it should be understood that any positioning system enabling three dimensional precise movement of the spindle carriage 120 and spindle assembly 104 is contemplated in accordance with various embodiments. The connection between these bearings, beams and carriages may take any form, such as wheels / rollers, sliding movement, or any other type of controllable precision bearing system. The bearing and / or positioning systems described herein may provide low-friction movement capabilities that enable smooth and precise positioning of the spindle assembly 104 throughout the working range of the electronic device placement system 101. The positioning systems described herein may include any type of positioning or bearing system configured to allow for precise movement and control of the spindle assemblies.

[0063] FIG. 3B depicts a top schematic view' of the electronic device placement system 101 of FIG. 2 during rotation of the downward facing laser 100 and a downward facing camera 150, in accordance with one embodiment. FIG. 3C depicts a top schematic view7of the electronic device placement 101 system of FIG. 2 w ith the downward facing camera 150 located over a placed electronic component, in accordance w ith one embodiment. A controller may be communicatively coupled to the positioning system 106 and configured to coordinate movement operations of the various positioning components. The controller may also coordinate the operation of the downw ard facing laser 100 and the downward facing camera 150 through control of the rotatable assembly 113, enabling sequential imaging and heating operations during electronic device placement sequences. The controller may receive feedback from position sensors and imaging systems to maintain accurate positioning control throughout the placement process.

[0064] FIG. 4 depicts a top schematic view7of an electronic device placement system 200 including three independently movable carriages 216a, 216b, 216c, in accordance with one embodiment. FIG. 5depicts a side schematic view of the electronic device placement system 200 of FIG. 4. in accordance with one embodiment. As shown, the electronic device placement system 200 includes a positioning system that includes a pair of parallel linear rails 255a, 255b disposed and extending in a x-direction. The positioning system further includes three beams extending betw een the pair of linear rails 255a, 255b: a first beam 214a, a second beam 214b, and a third beam 214c.

[0065] The first beam 214a is movably coupled to the linear rails 255a, 255b. Likewise, the second beam 214b is movably coupled to the linear rails 255a, 255b, and the third beam 214c is movably coupled to the linear bearings 255a, 255b. Thus, each of the first, second and third beams 214a, 214b, 214c are parallel beams and disposed in a spaced apart manner. In particular, the third beam 214c is located between tire first beam 214a and the second beam 214b. In other words, the first beam 214a is located on a first side of the electronic device placement system 200, while the second beam 214b is located on a second side of the electronic device placement system 200, with the third beam 214c located there between. The first, second and third beams 214a, 214b, 214c are each configured to independently move with respect to the linear rails 255a, 255b in the x-direction.

[0066] As shown, the positioning system includes a first carriage 216a that is movably coupled to the first beam 214a. The first carriage 216a is configured to move with respect to the first beam 214a in the y-direction. Likewise, the positioning system further includes a second carriage 216b that is movably coupled to the second beam 214b. The second carriage 216a is configured to move with respect to the second beam 214b in the y-direction. Similarly, the positioning system includes a third carriage 216c that is movably coupled to the third beam 214c. The third carriage 216c is configured to move with respect to the third beam 214c in the y-direction.

[0067] A first spindle assembly 204a is movably coupled to the first carriage 216a. In particular, the first spindle assembly 204a is attached or otherwise coupled to a first spindle assembly Z-drive 222a and / or a first piezo stage. In particular, the first spindle assembly Z-drive 222a is movably coupled to the first carriage 216a and is configured to move a first spindle carriage 220a with respect to the first carriage 216a in the z-direction.

[0068] A second spindle assembly 204b is movably coupled to the second carriage 216b. In particular, the second spindle assembly 204b is attached or otherwise coupled to a second spindle assembly Z-drive 222b and / or a first piezo stage. In particular, the second spindle assembly Z-drive 222b is movably coupled to the second carriage 216b and is configured to move a second spindle carriage 220b with respect to the second carriage 216b in the z-direction.

[0069] The first and second spindle assemblies 204a, 204b may be spindle assemblies which include a transparent first spindle body 210a, and a second transparent spindle body 210b. respectively. The transparent first and second spindle bodies 210a, 210b may each include a pair of glass plates, one above and one below the structure of the spindles. Instead of a glass plates, other transparent materials may be used especially if different wavelength light may be used for illumination, like infrared light or X-ray.Further, the primary structure of the spindle assemblies 204a. 204b may be made of transparent material. The first and second spindles assemblies 204a. 204b may include a vertically aligned nozzle 212a, 212b, respectively. The spindle nozzles 212a, 212b may be made of a transparent material as well in some embodiments. Still further, the first and second spindles assemblies 204a, 204b may each be configured to provide air distribution to the spindle nozzles 212a, 212b, respectively, in order to create a vacuum suction and / or air emission from the nozzles 212a, 212b. The spindles assemblies 204a, 204b may further contain a theta drive 230a, 230b, respectively, to rotate the glass plates enabling pick up and placement at different angles. As shown, the nozzles 212a, 212b have each picked up a respective electronic device 215a, 215b, such as a component, die or the like.

[0070] The combination of the positioning system of the linear rails 255a, 255b, the beams 214a, 214b, and the Z-drives 222a, 222b, and the theta drives 230a, 230b enable the electronic device placement system 200 to pick up an electronic device 215a, 215b, and move the electronic device 215a, 215b during all the large distances by the positioning system in the X, Y, Z axes and the theta (rotational) axis. Once the first and second spindle assemblies 204a, 204b, with a picked electronic device 215a, 215b attached or otherw ise on the nozzles 212a, 212b, the electronic devices 215a, 215b may be transported from a picking location, such as a feeder area and / or feeder bank (not shown), to a device imaging location and / or a placement location over a substrate or other target, as described herein.

[0071] In the embodiment shown, the electronic device placement system 200 further includes a first upward facing camera 236 facing upward that is configured to image a bottom of an electronic device. In particular, the first upward facing camera 236 may be configured to image an electronic device picked up by the first spindle assembly 204a, such as the first electronic device 215a. The imaging of the first upward facing camera 236 occurs prior to the placement stroke of the first spindle assembly 204a for placing the first electronic device 215a. Like the first upward facing camera 236, the electronic device placement system 200 further includes a second upward facing camera 238 facing upward and configured to image a bottom an electronic device. In particular, the second upward facing camera 238 may be configured to image an electronic device picked up by the second spindle assembly 204b, such as the second electronic device 215b. The imaging of the second upward facing camera 238 occurs prior to the placement stroke of the second spindle assembly 204b for placing the second electronic device 215b.

[0072] The electronic device placement sy stem 10 may further includes a machine base and / or board handling system located under the positioning system. The positioning sy stem may be operably attached or connected to the machine base of the electronic device placement sy stem 200. The machine base may include a substrate support having a substrate holder system and / or board handling system for holding and / or moving the substrate, upon which electronic devices such as the first and second electronic devices 115a, 115b are placeable during a placement stroke of the respective first and second spindle assemblies 204a. 204b2. The first upward facing camera 36 facing upward is located on a first side of the substrate holder system and the second upward facing camera 238 facing upward is located on a second side of the substrate holder.

[0073] The electronic device placement system 200 further includes a downward facing laser 250 coupled to the third carriage 16c. While the embodiment shown includes a single downward facing laser 50, it should be understood that embodiments are contemplated where more than one downward facing laser arc deployed. For example, a downward facing laser may be deployed for each individual placement head and / or spindle assembly. As shown, the downward facing laser 250 is movable above the first spindle assembly 204a during placement of a first electronic device by the first spindle assembly 204a, such as the first electronic device 215a. The downward facing laser 250 may be positionable over the target (e.g., within 100 micron) in the X, Y, Z axes and the rotational axis.

[0074] Once in position, the downward facing laser 250 is configured to operate like the downward facing laser 100 described hereinabove and quickly heat up a placed die after placement. This will cause the copper contacts on the die to start the fusion with the contacts on the substrate. In operation, the carriage with the camera may be configmed to move along the beam axis, while the glass nozzle maintains contact and downward pressure on the placed die in order to put pressure between the placed die and the substrate. This pressure may continue until the laser is aligned with the center of the glass nozzle and activated to heat up the die. Once the pre-heating process is complete, the die is ready to be released by the nozzle such that pressure is removed. The finishing fusion of the contacts can then take place in a mass annealing process after the substrate leaves the machine.

[0075] The downward facing laser 250 is movable above the second spindle assembly 204b during and / or after placement of a second electronic device by the second spindle assembly 204b, such as the second device 215b. In order for this to occur, the first beam 214a may be moved along the linear rails 255a, 255b away from the substrate and toward the upward facing camera 236 and / or a feeder bank or picking location. Then, the third beam 214c may be moved above or over the substrate. Here, the downward facing laser 250 may thereby be configured to heat the placed component after a placement stroke of the second spindle assembly 204b (as described above) through the transparent second spindle body (as described above). The downward facing laser 250 is also capable of, or configmed to, being moved in the vertical Z-direction, via a laser Z-drive to enable better laser focus heating on electronic devices.

[0076] Thus, the first and second beams 214a, 214b (i.e. placement beams) of the system 200 carries the spindle assemblies 204a, 204b, respectively, and can move each spindle independent of the third beam 214c (i.c. the laser beam) in the X, Y, and Z axes as long as the first and second beams 214a, 214b stay on respective sides of die third beam 214c. In other words, the first, second and third beams 214a, 214b, 214c may not be capable of passing each other in the x-direction along the linear rails 255a, 255b.

[0077] In order to provide room for the downward facing laser 250, the spindle assemblies may be extended from the respective placement head-beam (i.e. the first and second beams 214a, 214b) in the direction of the third beam 214c such that it can position the spindles underneath the downward facing laser 250, when the beams get close to each other. For example, the glass plates 210a, 210b and nozzlewhen the first beam 214a is proximate the third beam 214c, and glass plates 210a, 210b and nozzle 212b of the second spindle assembly 204b is positionable directly under the downward facing laser 250 when the second beam 214b is proximate the third beam 214c.

[0078] The third carriage 216c may also include a downward facing camera 2 1 configured to image a component prior to, during or after placement, similar to the downward facing camera 150 described hereinabove. Once in position, the downward facing camera 251 is configured to image outer edges of picked electronic devices during a placement stroke of the first spindle assembly 204a through the transparent first spindle body plates 210a, 210b and / or nozzle 212a thereof. Once the imaging is complete, the camera may be configured to move away from the nozzle 212a and / or no longer remain above the nozzle in order to make room for the downward facing laser 250. This may be provided by a rotatable bearing system, as described hereinabove. In another example, the downward facing laser 250 may be mounted at an angle next to the downward facing camera 251 on the third carriage 216c in order to heat the die while the camera stays in position over the nozzle and does not move. In still other embodiments, the laser may move a mirror, or fiber bundle betw een the camera and die glass nozzle in order to heat the die through the glass nozzle.

[0079] Referring to FIG. 6, a method for laser heating a placed electronic component 300 may provide a systematic approach for combining precision placement operations with controlled laser heating to achieve hybrid bonding of electronic devices onto substrates. The method for laser heating a placed electronic component 300 may begin with a step 310 of picking up an electronic device using the nozzle mounted to the transparent spindle body of the spindle assembly. The step 310 may involve engaging the electronic device through vacuum suction applied through the nozzle, where the transparent spindle body may enable optical access for verification of proper electronic device engagement during the pickup operation. The transparent spindle body may comprise a material selected from the group consisting of glass, quartz, and sapphire, where each material may provide different optical transmission characteristics for subsequent laser heating operations. The step 310 may establish the initial contact between the nozzle and the electronic device that may be maintained throughout the subsequent placement and heating sequence.

[0080] The method for laser heating a placed electronic component 300 may continue with a step 312 of moving the spindle assembly to position the electronic device over the substrate. The step 312 may involve coordinated movement of the positioning system to transport the electronic device from a picking location to a placement location above the target substrate. The step 312 may utilize multi-axis positioning capabilities of the carriage and associated movement systems to achieve precise positioning of the electronic device relative to connection features on the substrate surface. The transparent spindle body may be configured to allow imaging of the electronic device through the transparent spindle body during placement operations, enabling visual feedback and alignment verification during the step 312. The positioning accuracy achieved during the step 312 may establish the foundation for subsequent placement and bonding operations that depend on precise aligmnent between the electronic device and the substrate.

[0081] With continued reference to FIG. 6, the method for laser heating a placed electronic component 300 may proceed to a step 314 of placing the electronic device on the substrate while maintaining contact between the nozzle and the electronic device. The step 314 may involve controlled descent of the spindle assembly to bring the electronic device into physical contact with the substrate surface while preserving the vacuum engagement between die nozzle and the electronic device. The step 314 may establish the mechanical interface between the electronic device and the substrate that may be maintained under controlled pressure during subsequent laser heating operations. The transparent spindle body may enable continued optical access to the electronic device during the step 314, allowing for verification of proper placement and contact establishment. The maintenance of contact between the nozzle and the electronic device during the step 314 may provide the foundation for applying controlled pressure during the heating phase of the hybrid bonding process.

[0082] The method for laser heating a placed electronic component 300 may advance to a step 316 of positioning the downward facing laser above the transparent spindle body. The step 316 may involve movement of the downward facing laser from a standby position to an active position directly above the transparent spindle body, where the downward facing laser may be aligned with the optical axis through the transparent spindle body to the electronic device. In some cases, the step 316 may involve rotation of the rotatable assembly to position the downward facing laser above the transparent spindle body while moving the downward facing camera away from the optical path. The step 316 may include vertical positioning adjustments of the downward facing laser to achieve optimal focal distance for laser energy delivery through the transparent spindle body to the electronic device. The positioning achieved during the step 316 may enable direct laser heating of the electronic device without requiring removal of the nozzle or interruption of the pressure contact established during the step 314.

[0083] As further shown in FIG. 6, the method for laser heating a placed electronic component 300 may proceed to a step 318 of activating the downward facing laser to heat the electronic device through the transparent spindle body. The step 318 may involve emitting laser light at a wavelength that may be substantially transmitted through the transparent spindle body and substantially absorbed by the electronic device, enabling efficient energy transfer for heating operations. The step 318 may maintain pressure on the electronic device with the nozzle during the activating the downward facing laser to heat the electronic device through the transparent spindle body, where the maintained pressure may facilitate the hybrid bonding process between the electronic device and the substrate. The downward facing laser heating may initiate fusion of copper contacts on the electronic device with contacts on the substrate during the hybrid bonding process, where the combination of heat and pressure may promote metallurgical bonding betw een the contact surfaces. The step 318 may provide controlled heating that may rapidly elevate the temperature of the electronic device to initiate the bonding process w hile maintaining precise positioning through the continued contact with the nozzle.

[0084] The method for laser heating a placed electronic component 300 may include a decision point 320 that determines whether the ramping period may be complete. The decision point 320 mayevaluate the duration of laser heating applied during the step 318 against a predetermined initial ramping period that may be optimized for the specific electronic device and substrate materials involved in the bonding operation. The decision point 320 may monitor heating parameters such as laser power, exposure time, and temperature feedback to determine when the initial ramping period may have achieved the desired heating conditions for initiating tire hy brid bonding process. In some cases, the decision point 320 may incorporate feedback from temperature sensors or optical monitoring systems to assess the progress of the heating operation and determine when the ramping period objectives may have been met. The decision point 320 may provide a control mechanism for ensuring that the electronic device receives appropriate heating exposure without exceeding thennal limits that could damage the electronic device or substrate.

[0085] When the decision point 320 determines that the ramping period may not be complete, the method for laser heating a placed electronic component 300 may return to the step 318 to continue laser heating operations. The return path from the decision point 320 to the step 318 may enable continued application of laser energy to the electronic device until the initial ramping period requirements may be satisfied. The iterative process between the step 318 and the decision point 320 may provide controlled heating that may be adjusted based on real-time assessment of heating progress and bonding conditions. The continued laser heating during repeated execution of the step 318 may gradually elevate the temperature of the electronic device and promote progressive development of metallurgical bonds between the copper contacts on the electronic device and the corresponding contacts on the substrate.

[0086] With continued reference to FIG. 6, when the decision point 320 determines that the ramping period may be complete, the method for laser heating a placed electronic component 300 may advance to a step 322 of deactivating the downward facing laser. The step 322 may terminate the laser heating operation after the initial ramping period to allow for subsequent mass annealing of the electronic device, where the initial ramping period may have initiated the bonding process without completing the full metallurgical fusion. The step 322 may involve controlled shutdown of the laser power to prevent overheating of the electronic device while preserving the thermal conditions established during the ramping period. The deactivation of the downward facing laser during the step 322 may mark the completion of the active heating phase of the hybrid bonding process, where the initial thermal energy input may have established the foundation for subsequent bonding completion through mass annealing operations.

[0087] The method for laser heating a placed electronic component 300 may proceed to a step 324 of releasing pressure on the electronic device. The step 324 may involve termination of the vacuum suction applied through the nozzle and withdrawal of the nozzle from contact with the electronic device, where the release of pressure may allow the electronic device to remain in position on the substrate without mechanical constraint from the placement system. The step 324 may maintain pressure between the electronic device and the substrate via contact with the electronic device by the nozzle during the initial ramping period and release the pressure after deactivating the downward facing laser, enabling thetransition from active placement operations to passive bonding completion. The timing of the step 324 may be coordinated with the step 322 to ensure that the electronic device may have received appropriate thermal conditioning before the mechanical support provided by the nozzle may be removed. The step 324 may enable the spindle assembly to be moved away from the placed electronic device to allow access for subsequent processing operations or placement of additional electronic devices.

[0088] As further shown in FIG. 6. the method for laser heating a placed electronic component 300 may conclude with a step 326 that allows for subsequent mass annealing of the placed electronic device. The step 326 may represent the transition from individual device processing to batch processing operations, where multiple electronic devices placed on the substrate may undergo simultaneous thermal treatment to complete the hybrid bonding process. The step 326 may involve transfer of the substrate to a separate annealing system or oven where controlled heating may be applied to the entire substrate and all placed electronic devices simultaneously. The mass annealing process during the step 326 may complete the metallurgical fusion of the copper contacts that may have been initiated during the initial ramping period of the step 318, where the combination of the initial laser heating and the subsequent mass annealing may achieve full bonding strength between the electronic devices and the substrate. The step 326 may enable high-throughput processing where individual electronic devices may receive rapid initial heating through laser application followed by efficient batch completion of the bonding process through mass annealing operations.

[0089] Referring to FIG. 7, a method for imaging and laser heating a placed electronic component 400 may provide an integrated approach that combines precision imaging capabilities with controlled laser heating operations to achieve enhanced placement accuracy and hybrid bonding of electronic devices onto substrates. The method for imaging and laser heating a placed electronic component 400 may incorporate sequential imaging and heating operations through the same optical access path provided by the transparent spindle body, where tire rotatable assembly may enable alternating positioning of the downward facing camera and the downward facing laser above the transparent spindle body during different phases of the placement sequence. The method for imaging and laser heating a placed electronic component 400 may begin with a step 410 of picking up the electronic device using the nozzle mounted to the transparent spindle body of the spindle assembly. The step 410 may establish vacuum engagement between the nozzle and the electronic device, where the transparent spindle body may enable optical verification of proper electronic device attachment during the pickup operation. The transparent spindle body may use infrared light or X-ray wavelengths instead of visible light, with corresponding transparent materials selected for those wavelengths to optimize optical transmission characteristics for specific imaging and heating applications.

[0090] The method for imaging and laser heating a placed electronic component 400 may continue with a step 412 of moving the spindle assembly to position the electronic device over the substrate. The step 412 may involve coordinated operation of the positioning system to transport the electronic device from a picking location to a placement location above the target substrate, where the carriage mayfacilitate precise positioning of the spindle assembly dining the transport operation. The step 412 may utilize multi-axis movement capabilities provided by the y-directional movement beam, the x-directional movement beam, and associated bearings for x-directional movement and bearings for y-directional movement to achieve accurate positioning of the electronic device relative to connection features on the substrate surface. The transparent spindle body may maintain optical access to the electronic device throughout the step 412, enabling continuous monitoring of electronic device orientation and position during the transport sequence. The positioning accuracy achieved during the step 412 may establish the foundation for subsequent imaging operations that depend on precise alignment betw een the electronic device and the optical axis of the downward facing camera.

[0091] With continued reference to FIG. 7, the method for imaging and laser heating a placed electronic component 400 may proceed to a step 414 of placing the electronic device on the substrate while maintaining contact betw een the nozzle and the electronic device. The step 414 may involve controlled descent of the spindle assembly through operation of the z-drive to bring the electronic device into physical contact with the substrate surface while preserving the vacuimr engagement between the nozzle and the electronic device. The step 414 may establish the mechanical interface betw een the electronic device and the substrate that may be maintained under controlled pressure during subsequent imaging and laser heating operations. The nozzle may be made of a transparent material to enhance optical transmission capabilities through the spindle assembly during the step 414. where the transparent nozzle material may complement the optical properties of the transparent spindle body. The spindle body may include a pair of transparent plates with the nozzle opening between the plates, where the transparent plates may provide structural support for the nozzle while maintaining optical access for imaging operations during the step 414.

[0092] The method for imaging and laser heating a placed electronic component 400 may advance to a step 416 of imaging the electronic device through the transparent spindle body using the dow nw ard facing camera during placement of the electronic device on the substrate. The step 416 may involve positioning the downward facing camera above the transparent spindle body through operation of the rotatable assembly, where the downward facing camera may capture images of the electronic device through the transparent plates and the transparent nozzle material. The step 416 may provide visual feedback for alignment verification and placement accuracy assessment, where the images captured by the downward facing camera may reveal the position and orientation of the electronic device relative to connection features on the substrate surface. The step 416 may enable real-time monitoring of the placement operation, w here the controller may process the imaging data to verily proper alignment and contact establishment between the electronic device and the substrate. The imaging capabilities provided during the step 416 may facilitate active alignment corrections through operation of the piezo stage, where fine positioning adjustments may be made based on the visual feedback obtained through the transparent spindle body.

[0093] As further shown in FIG. 7, the method for imaging and laser heating a placed electronic component 400 may proceed to a step 418 of rotating the downward facing camera and laser assembly. The step 418 may involve operation of the rotatable assembly to transition from imaging mode to heating mode, where the rotatable assembly may selectively position cither the downward facing laser or the downward facing camera above the transparent spindle body. The step 418 may rotate the rotatable assembly to move the downward facing camera away from the optical path above the transparent spindle body while simultaneously positioning the downward facing laser in alignment with the optical axis through the transparent spindle body to the electronic device. The rotational movement during the step 418 may occur while the nozzle maintains contact and pressure on the electronic device, ensuring that the mechanical positioning established during the step 414 may be preserved throughout the transition from imaging to heating operations. The step 418 may enable rapid switching between imaging and heating capabilities without requiring separate positioning mechanisms for the downward facing camera and the downward facing laser.

[0094] The method for imaging and laser heating a placed electronic component 400 may continue with a step 420 of positioning the downward facing laser above the transparent spindle body. The step 420 may involve final aligmnent of the downward facing laser with the optical axis through the transparent spindle body following completion of the rotational movement initiated during the step 418. The step 420 may include vertical positioning adjustments of the downward facing laser through operation of the laser z-drive to achieve optimal focal distance for laser energy delivery through the transparent spindle body to the electronic device. The positioning achieved during the step 420 may enable direct laser heating of the electronic device without requiring removal of the nozzle or interruption of the pressure contact established during the step 414. The step 420 may coordinate the positioning of the downward facing laser with the maintained contact between the nozzle and the electronic device, where the transparent spindle body may provide the optical pathway for laser energy transmission while the nozzle may provide mechanical support and pressure application during heating operations.

[0095] With continued reference to FIG. 7, the method for imaging and laser heating a placed electronic component 400 may proceed to a step 422 of activating the downward facing laser to heat the electronic device through the transparent spindle body. The step 422 may involve emitting laser light at a wavelength that may be substantially transmitted through the transparent spindle body and substantially absorbed by the electronic device, enabling efficient energy transfer for heating operations during the hybrid bonding process. The step 422 may maintain pressure on the electronic device with the nozzle during the laser heating operation, where the combination of heat and pressure may promote metallurgical bonding between copper contacts on the electronic device and corresponding contacts on the substrate. The step 422 may provide controlled heating that may rapidly elevate the temperature of the electronic device to initiate fusion of the copper contacts while maintaining precise positioning through the continued contact with the nozzle. The laser heating during the step 422 may be optimized for the specific wavelength transmission characteristics of the transparent spindle body material, where glass, quartz, orsapphire materials may provide different optical properties for various laser wavelengths and power levels.

[0096] The method for imaging and laser heating a placed electronic component 400 may include a decision point 424 that determines whether the ramping period may be complete. The decision point 424 may evaluate the duration of laser heating applied during the step 422 against a predetermined initial ramping period that may be optimized for the specific electronic device and substrate materials involved in the bonding operation. The decision point 424 may monitor heating parameters such as laser power, exposure time, and temperature feedback to determine when the initial ramping period may have achieved the desired heating conditions for initiating the hybrid bonding process. The decision point 424 may incorporate feedback from temperature sensors or optical monitoring systems to assess the progress of the heating operation and determine when the ramping period objectives may have been met. The decision point 424 may provide a control mechanism for ensuring that the electronic device receives appropriate heating exposure without exceeding thermal limits that could damage the electronic device or substrate during the bonding process.

[0097] When the decision point 424 determines that the ramping period may not be complete, the method for imaging and laser heating a placed electronic component 400 may return to the step 422 to continue laser heating operations. The return path from the decision point 424 to the step 422 may enable continued application of laser energy to the electronic device until the initial ramping period requirements may be satisfied, where the iterative process may provide controlled heating that may be adjusted based on real-time assessment of heating progress and bonding conditions. The continued laser heating during repeated execution of the step 422 may gradually elevate the temperature of the electronic device and promote progressive development of metallurgical bonds between the copper contacts on the electronic device and the corresponding contacts on the substrate. The rotatable assembly may maintain the positioning of the downward facing laser above the transparent spindle body throughout the iterative heating process, ensuring consistent laser energy delivery through the transparent plates and the transparent nozzle material during the extended heating sequence.

[0098] As further shown in FIG. 7, when the decision point 424 determines that the ramping period may be complete, the method for imaging and laser heating a placed electronic component 400 may advance to a step 426 of deactivating the downward facing laser. The step 426 may terminate the laser heating operation after the initial ramping period to allow for subsequent mass annealing of the electronic device, where the initial ramping period may have initiated the bonding process without completing the full metallurgical fusion. The step 426 may involve controlled shutdown of the laser power to prevent overheating of the electronic device while preserving the thermal conditions established during the ramping period through the transparent spindle body. The deactivation of the downward facing laser during the step 426 may mark the completion of the active heating phase of the hybrid bonding process, where the initial thennal energy' input may have established the foundation for subsequent bonding completion through mass annealing operations. The step 426 may coordinate with the rotatable assemblyto maintain the positioning of the downward facing laser above the transparent spindle body until the laser power may be safely terminated.

[0099] The method for imaging and laser heating a placed electronic component 400 may proceed to a step 428 of releasing pressure on the electronic device. The step 428 may involve termination of the vacuum suction applied through the nozzle and withdrawal of the nozzle from contact with the electronic device, where the release of pressure may allow the electronic device to remain in position on the substrate without mechanical constraint from the spindle assembly. The step 428 may maintain pressure between the electronic device and the substrate via contact with the electronic device by the nozzle during the initial ramping period and release the pressure after deactivating the downward facing laser, enabling the transition from active placement operations to passive bonding completion. The timing of the step 428 may be coordinated with the step 426 to ensure that the electronic device may have received appropriate thermal conditioning through the transparent spindle body before the mechanical support provided by the nozzle may be removed. The step 428 may enable the spindle assembly to be moved away from the placed electronic device through operation of the positioning system, allowing access for subsequent processing operations or placement of additional electronic devices.

[0100] With continued reference to FIG. 7, the method for imaging and laser heating a placed electronic component 400 may conclude with a step 430 that allows for subsequent mass annealing of the placed electronic device. The step 430 may represent the transition from individual device processing to batch processing operations, where multiple electronic devices placed on the substrate may undergo simultaneous thermal treatment to complete the hybrid bonding process initiated during the laser heating operations. The step 430 may involve transfer of the substrate to a separate annealing system where controlled heating may be applied to the entire substrate and all placed electronic devices simultaneously. The mass annealing process during the step 430 may complete the metallurgical fusion of the copper contacts that may have been initiated during the initial ramping period of the step 422, where the combination of the initial laser heating through the transparent spindle body and the subsequent mass annealing may achieve full bonding strength between tire electronic devices and the substrate. The step 430 may enable high-throughput processing where individual electronic devices may receive rapid initial heating through laser application and precision imaging verification followed by efficient batch completion of the bonding process through mass annealing operations. The method for imaging and laser heating a placed electronic component 400 may further comprise rotating the pair of transparent plates to enable pickup and placement of the electronic device at different angles, where the theta drive may provide rotational positioning capabilities that may be coordinated with the imaging and heating operations to achieve optimal alignment and bonding conditions.

[0101] Thus, the present disclosure describes the use of an independently movable glass nozzle and an independently movable downward looking camera in a placement machine that has a die feeding area, a stationary upward looking camera and a substrate / wafer placement area. The disclosure concerns the ability to add a power laser to the downward looking camera, or independently movable from thedownward looking camera such that after the die has been placed accurately on the substrate / wafer and before the glass nozzle releases the die, the laser gets activated, or aligned with the glass nozzle and subsequently activated in such a way that the die is quickly ramped up in temperature by the laser light that travels through the glass nozzle. Embodiments described herein enable very’ fast and controlled ramping of the temperature of the die and start tire "Hybrid Bonding" process, which consists of a combination of pressure and heat.

[0102] In various embodiments, the movement of the camera and the downward facing laser may be mechanically related. For example, the laser and the camera may be attached to each other and rotatable about a vertical axis of rotation. Thus, rotating the laser into position may automatically rotate camera out of position and vice versa. In other embodiments, the camera and the downward facing laser may each be separately attached to the spindle carriage 120 to allow for completely independent movement of the downward facing camera and the downward facing laser 100 relative to the spindle carriage 120.

[0103] A number of implementations have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the disclosure. Accordingly, other implementations are within the scope of the following claims.

Claims

CLAIMS1. An electronic device placement system, comprising: a positioning system having a carriage movable between a picking location and a placement location; a spindle assembly coupled to the carriage, the spindle assembly including a spindle having a transparent spindle body, the spindle including a nozzle mounted to the transparent spindle body; a downward facing laser coupled to the carriage or the spindle assembly and positionable above the transparent spindle body; and a controller configured to control the positioning system to place the electronic device on a substrate using the transparent spindle body and activate the downward facing laser to heat tire electronic device through the transparent spindle body.

2. The electronic device placement system of claim 1, wherein the nozzle is made of a transparent material.

3. The electronic device placement system of claim 1, further comprising a downward facing camera coupled to the carriage or the spindle assembly and positionable above tire transparent spindle body, wherein the controller is further configured to control the downward facing camera to image the electronic device through the transparent spindle body during placement.

4. The electronic device placement system of claim 3, wherein the downward facing laser and the downward facing camera are mormted on a rotatable assembly configured to selectively position either the downward facing laser or the downward facing camera above the transparent spindle body.

5. The electronic device placement system of claim 1, wherein the transparent spindle body includes a pair of transparent plates with a nozzle opening between the plates, wherein the spindle assembly further includes a theta drive configured to rotate the nozzle to enable pickup and placement of the electronic device at different angles.

6. The electronic device placement system of claim 1. wherein the controller is further configured to: activate the downward facing laser to heat the electronic device for an initial ramping period; and deactivate the dow nw ard facing laser after the initial ramping period to allow for subsequent mass annealing of the electronic device.

7. The electronic device placement system of claim 6, wTierein the controller is further configured to maintain pressure between the electronic device and the substrate via contact with the electronic deviceby the nozzle during the initial ramping period and release the pressure after deactivating the downward facing laser.

8. The electronic device placement system of claim 1, wherein the transparent spindle body comprises a material selected from the group consisting of glass, quartz, and sapphire.

9. The electronic device placement system of claim 1, wherein the downward facing laser is configured to emit laser light at a wavelength that is substantially transmitted through the transparent spindle body and substantially absorbed by the electronic device.

10. The electronic device placement system of claim 1, wherein the transparent spindle body is configured to allow imaging of the electronic device through the transparent spindle body during placement operations.

11. A method of placing an electronic device, comprising: picking up an electronic device using a nozzle mounted to a transparent spindle body of a spindle assembly; moving the spindle assembly to position the electronic device over a substrate; placing the electronic device on the substrate while maintaining contact between the nozzle and the electronic device; positioning a downward facing laser above the transparent spindle body; and activating the downward facing laser to heat the electronic device through the transparent spindle body.

12. The method of claim 11, further comprising: maintaining pressure on the electronic device with the nozzle during the activating the downward facing laser to heat the electronic device through the transparent spindle body.

13. The method of claim 11, further comprising imaging the electronic device through the transparent spindle body using a downward facing camera during placement of the electronic device on the substrate.

14. The method of claim 13, wherein the downward facing laser and the downward facing camera are mounted on a rotatable assembly, the method further comprising rotating the rotatable assembly to selectively position either the downward facing laser or the downward facing camera above the transparent spindle body.

15. The method of claim 11, wherein the nozzle is made of a transparent material and wherein the spindle body includes a pair of transparent plates with a nozzle opening between the plates, the methodfurther comprising rotating the pair of transparent plates to enable pickup and placement of the electronic device at different angles.

16. The method of claim 11, further comprising: activating the downward facing laser to heat the electronic device for an initial ramping period; and deactivating the downward facing laser after the initial ramping period to allow for subsequent mass annealing of the electronic device.

17. The method of claim 16, further comprising maintaining pressure between the electronic device and the substrate via contact with the electronic device by the nozzle during the initial ramping period and releasing the pressure after deactivating the downward facing laser.

18. The method of claim 11, wherein the transparent spindle body comprises a material selected from the group consisting of glass, quartz, and sapphire.

19. The method of claim 11, wherein activating the downward facing laser comprises emitting laser light at a wavelength that is substantially transmitted through the transparent spindle body and substantially absorbed by the electronic device.

20. The method of claim 11, wherein the transparent spindle body is configured to allow imaging of the electronic device through the transparent spindle body during placement operations.

Images