Cooling apparatus and cooling control method

Abstract

A cooling apparatus and a cooling control method, which relate to the field of heat dissipation. The cooling apparatus is configured to cool an electronic device. The electronic device comprises a first housing, and a primary heat-generating component and a secondary heat-generating component that are separately disposed in the first housing, the first housing being provided with a liquid outlet and a liquid inlet that are separately in communication with an inner cavity of the first housing. The cooling apparatus comprises a container for containing a cooling medium, a cooling member, a first cooling pipe, and a second cooling pipe, wherein the container is arranged above the first housing; one end of the first cooling pipe is in communication with the container and at least partially runs through the first housing, and the other end thereof extends from the first housing; the cooling member is arranged in the first housing, surrounds the outer side of the primary heat-generating component, and is connected to the first cooling pipe; and one end of the second cooling pipe is in communication with the container, and the other end of the second cooling pipe is connected to the liquid inlet.

Description

Cooling device and cooling control method

[0001] Cross-reference to related applications

[0002] The present application claims priority to the Chinese patent application No. 202411279260.7, filed on September 12, 2024, and entitled "Cooling device and cooling control method", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0003] The present application belongs to the technical field of heat dissipation, and particularly relates to a cooling device and a cooling control method. BACKGROUND

[0004] In the context of the digital era, with the continuous improvement of computing power, the power consumption and heat flux density of chips also continue to increase, and traditional air-cooled heat dissipation devices cannot meet the demand. Following this is an immersion liquid cooling device, which can take away heat through flowing cooling liquid to achieve the purpose of efficient heat dissipation of the chip.

[0005] Some immersion liquid cooling devices in the related art mainly realize single cooling loop cooling of the chip under the driving action of a circulating pump, however, this kind of mode not only has limited cooling effect, but also the circulating pump is continuously turned on, resulting in large energy consumption. SUMMARY

[0006] The purpose of the embodiments of the present application is to provide a cooling device and a cooling control method, which can solve the problems of limited cooling effect and large energy consumption.

[0007] The embodiments of the present application provide a cooling device for cooling an electronic device; the electronic device includes a first shell and a main heat generating component and a secondary heat generating component respectively arranged in the first shell, and the first shell is provided with a liquid outlet and a liquid inlet respectively communicating with an inner cavity of the first shell; the cooling device includes a container for containing a cooling medium, a cooling component, a first cooling pipeline and a second cooling pipeline; the container is arranged above the first shell; one end of the first cooling pipeline communicates with the container, at least partially penetrates the first shell, and the other end penetrates out of the first shell; the cooling component is arranged in the first shell, surrounds the outside of the main heat generating component, and is connected to the first cooling pipeline; one end of the second cooling pipeline communicates with the container, and the other end of the second cooling pipeline is connected to the liquid inlet.

[0008] The embodiment of the present application further provides a cooling control method applied to the cooling device, and the cooling control method comprises the following steps: in the case that the main heat generating device and the secondary heat generating device are not over-temperature, opening the liquid supplement port of the container, reducing the flow of the cooling medium in the liquid supply pipeline and the liquid return pipeline respectively, so that the cooling device switches to the energy-saving heat dissipation mode; in the case that the main heat generating device is over-temperature and the secondary heat generating device has a first temperature margin, opening the liquid supplement port of the container, maintaining the flow of the cooling medium in the liquid supply pipeline and the liquid return pipeline, increasing the flow of the cooling medium in the first cooling pipeline, and reducing the flow of the cooling medium in the second cooling pipeline, so that the cooling device switches to the first low-power heat dissipation mode; in the case that the main heat generating device is over-temperature and the secondary heat generating device has a second temperature margin which is smaller than the first temperature margin, opening the liquid supplement port of the container, and increasing the flow of the cooling medium in the liquid supply pipeline and the liquid return pipeline, so that the cooling device switches to the second low-power heat dissipation mode; in the case that the main heat generating device is over-temperature and the secondary heat generating device has the second temperature margin, and the flow of the cooling medium in the liquid supply pipeline and the liquid return pipeline reaches the maximum and still cannot meet the cooling requirement, closing the liquid supplement port of the container, and keeping the cooling medium in the liquid supply pipeline and the liquid return pipeline at the maximum flow, so that the cooling device switches to the high-power heat dissipation mode. BRIEF DESCRIPTION OF DRAWINGS

[0009] Fig. 1 is a structural schematic diagram of the cooling device disclosed by the embodiment of the present application;

[0010] Fig. 2 is a structural schematic diagram of the cooling device without the outer shell disclosed by the embodiment of the present application;

[0011] Fig. 3 is a schematic diagram of the structure of the container, the liquid supply pipeline, the first cooling pipeline, the second cooling pipeline and the liquid return pipeline disclosed by the embodiment of the present application;

[0012] Fig. 4 is a structural schematic diagram of the inner shell and the electronic device disclosed by the embodiment of the present application;

[0013] Fig. 5 is a structural schematic diagram of the outer shell disclosed by the embodiment of the present application;

[0014] Fig. 6 is a structural schematic diagram of the liquid supply pipeline, the first cooling pipeline, the second cooling pipeline, the liquid return pipeline and the electronic device disclosed by the embodiment of the present application;

[0015] Fig. 7 is a structural schematic diagram of the first cooling pipeline and the electronic device disclosed by the embodiment of the present application;

[0016] Fig. 8 is a schematic view of the container, liquid supply pipeline, first cooling pipeline, second cooling pipeline, liquid return pipeline, circulating pump, heat exchange device and electronic device according to the embodiment of the present application.

[0017] Label explanation: 01-cooling device; 10-container; 11-liquid supplement port; 20-cooling member; 31-first cooling pipeline; 32-second cooling pipeline; 33-liquid supply pipeline; 34-liquid return pipeline; 40-second shell; 41-inner shell; 411-receiving groove; 4111-first sliding structure; 412-overflow groove; 4121-liquid discharge port; 42-outer shell; 50-circulating pump; 60-heat exchange device; 71-first control valve; 72-second control valve; 73-third control valve; 81-first liquid level meter; 82-second liquid level meter; 83-third liquid level meter; 91-first pressure detection element; 92-second pressure detection element; 02-electronic device; 021-first shell; 0211-liquid outlet; 0212-liquid inlet; 0213-second sliding structure; 022-primary heat generating component; 023-secondary heat generating component. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0019] The terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a particular order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second" and the like are generally of a kind, and are not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally represents a "or" relationship between the front and rear associated objects.

[0020] The embodiments of the present application will be described in detail below with reference to the drawings and by examples and their application scenarios.

[0021] Referring to Figs. 1 to 8, the present application discloses a cooling device 01 for cooling an electronic device 02 to prevent the electronic device 02 from being damaged due to high temperature during operation and ensure the normal and efficient operation of the electronic device 02.

[0022] Exemplarily, the cooling device 01 can be a horizontal immersion liquid cooling machine box; in an example, the cooling device 01 can be a single-phase immersion liquid cooling device, and can also be a two-phase immersion liquid cooling device, etc. The electronic device 02 can be a server, a switch, etc., and can be applied to high-performance electronic devices 02 with high computing power requirements in aerospace, artificial intelligence, etc. Of course, it can also be in other forms, which are not limited here.

[0023] Referring to FIG. 7, the electronic device 02 can include a first shell 021, a main heat generating component 022, and a secondary heat generating component 023. Among them, the main heat generating component 022 generates more heat during operation, and its temperature is relatively high; the secondary heat generating component 023 generates less heat than the main heat generating component 022 during operation, and its temperature is lower than that of the main heat generating component 022. Exemplarily, the main heat generating component 022 can be a chip such as a GPU, a CPU, etc., and the secondary heat generating component 023 can be some low-power electrical elements. In addition to the above structure, the electronic device 02 can also include other components, which can be referred to in related technologies, and will not be described in detail here.

[0024] In the embodiment of the present application, the main heat generating component 022 and the secondary heat generating component 023 are arranged in the first shell 021 to accommodate the main heat generating component 022 and the secondary heat generating component 023, and also play a protective role.

[0025] To cool the main heat generating component 022 and the secondary heat generating component 023, the first shell 021 can be provided with a liquid outlet 0211 and a liquid inlet 0212, as shown in FIG. 6, and the liquid outlet 0211 and the liquid inlet 0212 are respectively communicated with the inner cavity of the first shell 021. In this way, the cooling medium can be injected into the inner cavity of the first shell 021 through the liquid inlet 0212, so that the cooling medium contacts the main heat generating component 022 and the secondary heat generating component 023 respectively, thereby cooling the main heat generating component 022 and the secondary heat generating component 023. The cooling medium after absorbing heat can be discharged through the liquid outlet 0211, thereby realizing the circulation flow of the cooling medium in the first shell 021. Exemplarily, the cooling medium can be an electronic dielectric cooling liquid such as fluorinated liquid, a mineral oil such as insulating oil, etc. Of course, it can also be in other forms, which are not limited here.

[0026] In some embodiments, the liquid inlet 0212 and the liquid outlet 0211 of the first shell 021 can be respectively communicated with the cooling device 01, so as to realize the circulation supply of the cooling medium into the first shell 021 under the action of the cooling device 01.

[0027] In the embodiments of the present application, the cooling device 01 can include a container 10, a cooling member 20, a first cooling pipeline 31 and a second cooling pipeline 32. The container 10 is used to contain cooling medium. One end of the first cooling pipeline 31 is in communication with the container 10. Thus, the cooling medium in the container 10 can flow into the first cooling pipeline 31 and flow downstream through the first cooling pipeline 31 so that the cooling medium reaches the area that needs to be cooled. At least part of the first cooling pipeline 31 penetrates the first shell 021, and the other end of the first cooling pipeline 31 penetrates out of the first shell 021. Thus, in the process of flowing of the cooling medium through the first cooling pipeline 31, the cooling medium can absorb the heat in the first shell 021 and flow out of the first shell 021, thereby achieving the cooling effect on the inside of the first shell 021.

[0028] Exemplarily, the position where the first cooling pipeline 31 penetrates into the first shell 021 and the position where the first cooling pipeline 31 penetrates out of the first shell 021 can be provided with quick connectors, so that the first cooling pipeline 31 and the first shell 021 can be quickly disassembled and assembled, thereby facilitating the disassembly and assembly of the electronic device 02.

[0029] The cooling member 20 is used to be arranged in the first shell 021 and surround the outside of the main heat generating device 022. The cooling member 20 is also connected to the first cooling pipeline 31. Thus, the cooling medium in the container 10 can be delivered to the cooling member 20 through the first cooling pipeline 31, and the cooling medium can absorb the heat emitted by the main heat generating device 022 at the cooling member 20, thereby achieving the cooling effect on the main heat generating device 022 to prevent the temperature of the main heat generating device 022 from being too high.

[0030] Exemplarily, as shown in FIGS. 6 and 7, the cooling member 20 can have a cooling cavity, and the main heat generating device 022 is arranged in the cooling cavity. In addition, the first cooling pipeline 31 can be divided into two sections. One section extends from one end of the first shell 021 into the inner cavity of the first shell 021 and is in communication with the cooling cavity through an inlet end. The other section is in communication with the cooling cavity through an outlet end and extends out of the first shell 021 from the other end of the first shell 021. Thus, the one section of the first cooling pipeline 31, the cooling cavity and the other section are in communication in sequence to achieve the transmission of the cooling medium. At the same time, when the cooling medium flows into the cooling cavity, the cooling medium can contact the main heat generating device 022 and absorb the heat emitted by the main heat generating device 022, thereby achieving the cooling effect on the main heat generating device 022. In an example, the one section and the other section of the first cooling pipeline 31 can be a hose or a hard pipe.

[0031] In other embodiments, the cooling member 20 can also be arranged on the outer wall of the first cooling pipeline 31, so that when the cooling medium flows through the first cooling pipeline 31, the cooling member 20 can absorb the heat emitted by the main heat generating device 022 to the cooling member 20, thereby achieving the cooling effect on the main heat generating device 022.

[0032] In other embodiments, the cooling member 20 can also partially surround the outside of the main heat generating device 022.

[0033] In addition, at least a part of the first cooling pipeline 31 can be a bent pipe section, which can be a hose, so that the first cooling pipeline 31 can be adapted to the installation position of the electronic device 02.

[0034] The first cooling pipeline 31 can also include a quick connection section connected to the above-mentioned bent pipe section, and can also be connected to the container 10 or the liquid supply pipeline 33, so as to facilitate the disassembly and assembly of the first cooling pipeline 31.

[0035] One end of the second cooling pipeline 32 is in communication with the container 10, and the other end of the second cooling pipeline 32 is used to be connected to the liquid inlet 0212, so that the cooling medium in the container 10 can also be transmitted through the second cooling pipeline 32 and flow into the inner cavity of the first shell 021 through the liquid inlet 0212, so that the part of the cooling medium can contact the secondary heat generating device 023 in the first shell 021 and absorb heat, thereby achieving the cooling effect on the secondary heat generating device 023.

[0036] In addition, the container 10 is arranged above the first shell 021, so that under the action of gravity, the cooling medium in the container 10 can flow into the first cooling pipeline 31 and the second cooling pipeline 32 respectively, and flow to the cooling member 20 through the first cooling pipeline 31 to absorb the heat of the main heat generating device 022 at the cooling member 20 to achieve the cooling of the main heat generating device 022, and flow into the inner cavity of the first shell 021 through the second cooling pipeline 32 to absorb the heat of the secondary heat generating device 023 to achieve the cooling of the secondary heat generating device 023.

[0037] Based on the above arrangement, the embodiments of the present application can cool the main heat generating device 022 located in the cooling member 20 through the cooperation of the first cooling pipeline 31 and the cooling member 20 to prevent the temperature of the main heat generating device 022 from being too high, and the secondary heat generating device 023 located in the first shell 021 can be cooled through the second cooling pipeline 32 to prevent the temperature of the secondary heat generating device 023 from being too high.

[0038] Based on this, the embodiments of the present application can cool the main heat generating device 022 and the secondary heat generating device 023 respectively through the double cooling pipelines, thereby improving the cooling effect. In addition, the embodiments of the present application make full use of the gravity effect to make the cooling medium flow by itself, without the need to additionally set a pump body, thereby reducing the energy consumption in the cooling process, reducing the use of parts, and reducing the structural complexity of the cooling device 01.

[0039] Referring to FIGS. 1, 2, 4 and 5, in some embodiments, the cooling device 01 can further include a second shell 40 provided with a containing groove 411 and an overflow groove 412. The containing groove 411 is used to contain the electronic device 02 and the cooling medium, and the containing groove 411 is used to communicate with the liquid outlet 0211. In this way, the cooling medium in the inner cavity of the first shell 021 of the electronic device 02 flowing in through the second cooling pipeline 32 can be discharged through the liquid outlet 0211 and enter the containing groove 411, so that the cooling medium in the containing groove 411 can be in contact with the first shell 021 of the electronic device 02, thereby further achieving the cooling effect of the electronic device 02 to some extent and improving the cooling efficiency.

[0040] The slot of the overflow groove 412 communicates with the slot of the containing groove 411, and the slot wall of the overflow groove 412 is provided with a liquid discharge port 4121. Based on this, as the cooling medium continuously flows into the containing groove 411 through the liquid outlet 0211, the liquid level in the containing groove 411 gradually rises. When the liquid level reaches the height of the slot of the containing groove 411, it flows into the overflow groove 412, so that the cooling medium flows into the overflow groove 412. The cooling medium in the containing groove 411 is collected through the overflow groove 412, and is discharged through the liquid discharge port 4121.

[0041] In an example, the slot of the containing groove 411 can be located at the top of itself. In this way, the cooling medium in the containing groove 411 can overflow into the overflow groove 412 only when the liquid level reaches a certain height, so that the liquid level in the containing groove 411 is relatively high, so that most of the first shell 021 is immersed in the cooling medium, thereby increasing the contact area between the cooling medium and the first shell 021, and further improving the cooling effect of the first shell 021 and the main heat generating device 022 and the secondary heat generating device 023 inside it.

[0042] Exemplarily, the liquid discharge hole can be provided on the bottom wall of the overflow groove 412, and of course, it can also be provided on the side wall, etc., which can be set according to the actual working condition.

[0043] In some embodiments, the containing groove 411 and the overflow groove 412 can be arranged side by side; in other embodiments, the overflow groove 412 can also surround the outside of the containing groove 411. No matter which arrangement, the overflow effect can be achieved.

[0044] Further, an overflow hole plate can be arranged between the slot of the accommodating groove 411 and the slot of the overflow groove 412, which can play a certain blocking role on one hand, and can also realize the overflow of the cooling medium by arranging the openings on the other hand.

[0045] Since the electronic device 02 is arranged in the accommodating groove 411, in order to facilitate the disassembly and assembly of the electronic device 02, a detachable connection mode can be adopted between the first shell 021 of the electronic device 02 and the side wall of the accommodating groove 411, so that the electronic device 02 can be disassembled and assembled as needed.

[0046] In addition, the first cooling pipeline 31, the second cooling pipeline 32, the liquid return pipeline 34, the liquid supply pipeline 33, etc. can all be arranged in the second shell 40, so as to play a containing and protecting role through the second shell 40.

[0047] In an example, as shown in FIG. 1, the second shell 40 can include an outer shell 42 and an inner shell 41 arranged in the outer shell 42, and the outer shell 42 and the inner shell 41 can provide mounting spaces for the first cooling pipeline 31, the second cooling pipeline 32, the liquid supply pipeline 33, the liquid return pipeline 34, etc.

[0048] In addition, the inner shell 41 can include an accommodating groove 411 and an overflow groove 412.

[0049] Referring to FIGS. 1, 2 and 4, in some embodiments, the side wall of the accommodating groove 411 can be provided with a first sliding structure 4111 extending from the slot of the accommodating groove 411 to the bottom of the groove. Exemplarily, the first sliding structure 4111 can be a strip-shaped structure, such as a strip-shaped protrusion, a strip-shaped groove, etc., and of course, can also be other shapes, which are not limited here.

[0050] Correspondingly, the outer wall of the first shell 021 can be provided with a second sliding structure 0213, and the first sliding structure 4111 is used for sliding connection with the second sliding structure 0213. Based on this, the electronic device 02 can be slid along the slot of the accommodating groove 411 to the bottom of the groove, so as to be installed into the accommodating groove 411, or be slid from the bottom of the groove to the slot, so as to be disassembled from the accommodating groove 411. Therefore, the convenient disassembly and assembly between the electronic device 02 and the accommodating groove 411 is realized through the sliding connection mode, so as to facilitate the subsequent modification of the electronic device 02. In addition, through the sliding cooperation of the first sliding structure 4111 and the second sliding structure 0213, the positioning of the electronic device 02 can also be realized, so as to ensure the position accuracy of the electronic device 02 in the accommodating groove 411.

[0051] Exemplarily, one of the first sliding structure 4111 and the second sliding structure 0213 can be a sliding rail, and the other can be a sliding groove. The sliding cooperation between the sliding rail and the sliding groove can ensure the stability and reliability of the connection and facilitate disassembly and assembly.

[0052] In consideration of the disassembly of the electronic device 02, in the embodiment of the present application, the first cooling pipeline 31 and the second cooling pipeline 32 are respectively relatively separable from the first shell 021, so as to facilitate the disassembly of the electronic device 02. Of course, the requirement that the first cooling pipeline 31 and the second cooling pipeline 32 respectively deliver cooling medium to the electronic device 02 also needs to be met.

[0053] In some embodiments, the side wall of the accommodating groove 411 can be provided with a mounting hole (not shown in the figure), the other end of the second cooling pipeline 32 is arranged in the mounting hole, and when the electronic device 02 is placed in the accommodating groove 411, the other end of the second cooling pipeline 32 is used to be opposite and communicate with the liquid inlet 0212. Based on the arrangement of the mounting hole, the side wall of the first shell 021 can be avoided to hinder the second cooling pipeline 32 to deliver cooling medium into the inner cavity of the first shell 021, so as to ensure that the cooling medium can flow into the inner cavity of the first shell 021.

[0054] Of course, the first cooling pipeline 31 can pass into the first shell 021 through the first perforation and pass out of the first shell 021 through the second perforation. In this way, the cooling medium can be delivered to the cooling member 20 located in the first shell 021 through the first cooling pipeline 31, and the cooling medium absorbing heat can be transmitted out.

[0055] In order to make the cooling medium in the container 10 be respectively delivered to the first cooling pipeline 31 and the second cooling pipeline 32, the cooling device 01 can also include a liquid supply pipeline 33, which is in communication with the container 10, and the first cooling pipeline 31 and the second cooling pipeline 32 are respectively in communication with the liquid supply pipeline 33. Based on this, the cooling medium in the container 10 can be respectively delivered to the first cooling pipeline 31 and the second cooling pipeline 32 through the liquid supply pipeline 33, so as to realize the cooling of the main heat generating device 022 through the delivery of the first cooling pipeline 31 to the cooling member 20, and realize the cooling of the secondary heat generating device 023 through the delivery of the second cooling pipeline 32 to the inner cavity of the first shell 021.

[0056] Exemplarily, the liquid supply pipeline 33 can extend horizontally, and of course, it can also extend at an angle with the horizontal direction, which can be selected according to the actual working condition.

[0057] To realize the circulating flow of the cooling medium, the cooling device 01 can further comprise a return liquid pipeline 34, a circulating pump 50 and a heat exchange device 60, as shown in FIGS. 1-3. The return liquid pipeline 34 is in communication with the other end of the first cooling pipeline 31 and the liquid outlet 4121 respectively, and the circulating pump 50 and the heat exchange device 60 are arranged in the return liquid pipeline 34.

[0058] Based on the above arrangement, the cooling medium absorbing the heat emitted by the main heat generating device 022 at the cooling member 20 flows into the return liquid pipeline 34 through the other end of the first cooling pipeline 31; at the same time, the cooling medium absorbing the heat emitted by the secondary heat generating device 023 in the first shell 021 flows into the containing groove 411 through the liquid outlet 0211, and then overflows to the overflow groove 412, and flows into the return liquid pipeline 34 from the liquid outlet 4121, so that the cooling medium absorbing the heat is collected and flows back through the return liquid pipeline 34.

[0059] Further, the circulating pump 50 arranged in the return liquid pipeline 34 can provide a pressure head for the flow of the cooling medium, and keep the inlet maintained in a negative pressure state to drive the collected cooling medium to flow, so as to realize the circulating flow of the cooling medium.

[0060] Considering that the temperature of the cooling medium after absorbing the heat is increased, if the cooling medium is directly flowed again to the inner cavity of the cooling medium and the first shell 021 respectively, the temperature difference between the cooling medium and the main heat generating device 022 and the secondary heat generating device 023 will be relatively small, which will reduce the cooling effect.

[0061] Based on the above situation, the heat exchange device 60 is arranged in the return liquid pipeline 34 in the embodiment of the present application, so that the collected cooling medium can flow into the heat exchange device 60 through the return liquid pipeline 34 for heat exchange treatment, and the temperature of the cooling medium flowing out of the heat exchange device 60 is reduced, i.e. lower than the temperature of the cooling medium flowing into the heat exchange device 60. The cooling medium flowing out of the heat exchange device 60 after heat exchange can flow back to the container 10, so as to flow again to the first cooling pipeline 31 and the second cooling pipeline 32, so as to cool the main heat generating device 022 and the secondary heat generating device 023 again respectively.

[0062] In an example, as shown in FIG. 3, a plurality of return pipeline segments in communication with the return liquid pipeline 34 can be connected to the return liquid pipeline 34, wherein a part of the return pipeline segments are in communication with the other end of the first cooling pipeline 31, and another part of the return pipeline segments are in communication with the liquid outlet 4121. Based on this, the two parts of the cooling medium can be collected by flowing back to the return liquid pipeline 34 through the plurality of return pipeline segments, so as to uniformly flow back.

[0063] To control the flow of the cooling medium, the cooling device 01 can further comprise a first control valve 71, as shown in FIG. 3, which is arranged in the second cooling pipeline 32 and used to regulate the flow of the cooling medium in the second cooling pipeline 32, and of course, the pressure loss in the second cooling pipeline 32, so that the flow of the cooling medium for cooling the secondary heat generating device 023 can be adjusted according to the actual working condition.

[0064] It should be noted that when the container 10 or the liquid supply pipeline 33 outputs a certain flow of the cooling medium and distributes it to the first cooling pipeline 31 and the second cooling pipeline 32, adjusting the flow of the cooling medium in the second cooling pipeline 32 by the first control valve 71 will also cause the flow of the cooling medium in the first cooling pipeline 31 to change, thereby indirectly controlling the flow of the cooling medium in the first cooling pipeline 31.

[0065] For example, the first control valve 71 can be a flow valve, and of course, can also be in other forms, which are not limited here.

[0066] As shown in FIG. 8, in some embodiments, a second control valve 72 can be arranged at the liquid outlet 4121, which is used to regulate the flow of the cooling medium at the liquid outlet 4121, so that the liquid level of the cooling medium in the overflow tank 412 can be regulated by controlling the flow at the liquid outlet 4121.

[0067] Referring to FIGS. 1-3, in some embodiments, the container 10 can be provided with a liquid supplement port 11, and the liquid supplement port 11 is provided with a third control valve 73 for opening or closing the liquid supplement port 11. It should be noted that considering that the volume of the cooling medium will decrease due to evaporation, leakage and other reasons after the cooling device 01 is operated for a long time, which will affect the cooling effect. Based on this, the embodiments of the present application can supplement the cooling medium into the container 10 through the liquid supplement port 11 to ensure that the cooling medium is sufficient and prevent the cooling effect from being affected due to the decrease of the cooling medium.

[0068] In addition to the above functions, the liquid supplement port 11 can also regulate the air pressure in the container 10. When the liquid supplement port 11 is opened, the air pressure in the container 10 is the same as the atmospheric pressure, and at this time, the cooling medium in the container 10 can flow to the first shell 021 under the action of gravity; when the liquid supplement port 11 is closed, the inner cavity of the container 10 is isolated from the outside atmosphere, so that even if the cooling medium is subjected to the action of gravity, it will not flow to the first shell 021 located below the container 10.

[0069] In some embodiments, a first liquid level meter 81 can be arranged in the container 10 to measure the liquid level of the cooling medium in the container 10.

[0070] The second liquid level gauge 82 can be arranged in the accommodating groove 411 to measure the liquid level of the cooling medium in the accommodating groove 411.

[0071] The third liquid level gauge 83 can be arranged in the overflow groove 412 to measure the liquid level of the cooling medium in the overflow groove 412.

[0072] In consideration of the fact that the number of electronic devices 02 can be multiple, in order to save the number of cooling devices 01 and reduce the cost, the embodiment of the present application can cool multiple electronic devices 02 respectively by one set of cooling device 01, so as to achieve the effect of one machine with multiple uses.

[0073] The cooling device 01 can include multiple cooling members 20, multiple first cooling pipelines 31 and multiple second cooling pipelines 32. One end of each of the multiple first cooling pipelines 31 is in communication with the container 10, at least part of each first cooling pipeline 31 is arranged in the first shell 021 of the corresponding electronic device 02, and the other end of the first cooling pipeline 31 penetrates out of the first shell 021. Each cooling member 20 is arranged in the first shell 021 of the corresponding electronic device 02 and surrounds the outside of the main heat generating device 022, and each cooling member 20 is connected to the corresponding first cooling pipeline 31. Based on this arrangement, the main heat generating device 022 of the corresponding electronic device 02 can be cooled by each set of cooperating first cooling pipeline 31 and cooling member 20.

[0074] In addition, one end of each of the multiple second cooling pipelines 32 is in communication with the container 10, and the other end of each second cooling pipeline 32 is connected to the liquid inlet 0212 of the first shell 021 of the corresponding electronic device 02. Based on this arrangement, the secondary heat generating device 023 of the corresponding electronic device 02 can be cooled by each second cooling pipeline 32.

[0075] In order to respectively deliver the cooling medium to the multiple first cooling pipelines 31 and the multiple second cooling pipelines 32, the cooling device 01 can further include a liquid supply pipeline 33 in communication with the container 10, and the multiple first cooling pipelines 31 and the multiple second cooling pipelines 32 are respectively in communication with the liquid supply pipeline 33 to respectively deliver the cooling medium through the liquid supply pipeline 33.

[0076] In some embodiments, the cooling device 01 can further include a first pressure detection element 91 arranged in the liquid return pipeline 34 and located at the inlet of the circulating pump 50, for detecting the liquid pressure at the inlet of the circulating pump 50 in the liquid return pipeline 34. Exemplarily, the first pressure detection element 91 can be a pressure sensor.

[0077] In some embodiments, the cooling device 01 can further comprise a second pressure detecting element 92 arranged in the second cooling pipeline 32 for detecting the liquid pressure in the second cooling pipeline 32.

[0078] The installation process of the cooling device 01 in the embodiments of the present application is as follows: connecting the liquid return pipeline 34 with the outer shell 42 of the second shell 40, which can be fastened by support welding or by screwing, clamping, etc.; connecting the liquid return pipeline 34 with the inner shell 41 of the second shell 40 through a connecting piece; connecting the liquid supply pipeline 33, the container 10, the first cooling pipeline 31, the second cooling pipeline 32, etc. by welding or screw fastening, and finally installing the assembled body with the inner shell 41 of the second shell 40 together; opening the liquid inlet 0212 on the side wall of the first shell 021; installing the cooling member 20, the first cooling pipeline 31, the quick connector, the main heat generating device 022, the secondary heat generating device 023, etc. in the first shell 021; slidingly installing the electronic device 02 into the accommodating groove 411, and ensuring that the first cooling pipeline 31 can communicate with the liquid return pipeline 34, and the second cooling pipeline 32 is connected to the liquid inlet 0212 and connected through a blind plug connecting piece; connecting the first cooling pipeline 31 with the first shell 021 through the quick connector; connecting the liquid supply pipeline 33 and the liquid return pipeline 34 with the heat dissipation device respectively, and arranging the circulating pump 50 in the liquid return pipeline 34; arranging the first control valve 71, the second control valve 72, the third control valve 73, the first liquid level meter 81, the second liquid level meter 82, the third liquid level meter 83, the first pressure detecting element 91, the second pressure detecting element 92, etc., and thus the assembly of the cooling device 01 is completed.

[0079] Based on the cooling device 01, the application further discloses a cooling control method applied to the cooling device 01. The disclosed cooling control method comprises: in the case that the main heat generating device 022 and the secondary heat generating device 023 are not over-temperature, controlling to open the liquid supplement port 11 of the container 10, and reducing the flow of the cooling medium in each of the liquid supply pipeline 33 and the liquid return pipeline 34, so that the cooling device 01 is switched to the boundary heat dissipation mode; in the case that the main heat generating device 022 is over-temperature and the secondary heat generating device 023 has a first temperature margin, controlling to open the liquid supplement port 11 of the container 10, maintaining the flow of the cooling medium in each of the liquid supply pipeline 33 and the liquid return pipeline 34, increasing the flow of the cooling medium in the first cooling pipeline 31, and reducing the flow of the cooling medium in the second cooling pipeline 32, so that the cooling device 01 is switched to the first low-power heat dissipation mode; in the case that the main heat generating device 022 is over-temperature and the secondary heat generating device 023 has a second temperature margin smaller than the first temperature margin, controlling to open the liquid supplement port 11 of the container 10, and increasing the flow of the cooling medium in each of the liquid supply pipeline 33 and the liquid return pipeline 34, so that the cooling device 01 is switched to the second low-power heat dissipation mode; in the case that the main heat generating device 022 is over-temperature and the secondary heat generating device 023 has the second temperature margin, and in the case that the flow of the cooling medium in each of the liquid supply pipeline 33 and the liquid return pipeline 34 reaches the maximum and still cannot meet the cooling requirement, controlling to close the liquid supplement port 11 of the container 10, and keeping the cooling medium in each of the liquid supply pipeline 33 and the liquid return pipeline 34 at the maximum flow, so that the cooling medium is switched to the high-power heat dissipation mode.

[0080] The control process for switching the cooling mode in the embodiments of the present application is as follows: after the cooling device 01 is assembled, the third control valve 73 is closed, the cooling medium is injected into the containing groove 411, and the liquid level of the cooling medium reaches the height of the lowest emptying row of the overflow orifice plate; the first control valve 71 and the second control valve 72 are opened, and the first pressure detection element 91, the second pressure detection element 92, the first liquid level meter 81, the second liquid level meter 82, and the third liquid level meter 83 are powered on; at this time, the electronic device 02 is in a power-off state; the circulating pump 50 is started, so that the cooling medium in the entire cooling device 01 circulates and flows, and the liquid level at each position is monitored in real time until the liquid level in the containing groove 411 reaches the first liquid level; the stable operation parameters of the first pressure detection element 91, the second pressure detection element 92, the first liquid level meter 81, the second liquid level meter 82, and the third liquid level meter 83 are set; the third control valve 73 is opened, and the opening degree of the first control valve 71 and the second control valve 72 is reduced until the liquid level in the overflow groove 412 reaches the second liquid level; the electronic device 02 is powered on, and after the electronic device 02 reaches the rated power P, the feedback signals of the first pressure detection element 91, the second pressure detection element 92, the first liquid level meter 81, the second liquid level meter 82, and the third liquid level meter 83 are monitored; at the same time, the third control valve 73 is kept in a fully open state, and the cooling medium is added so that the liquid level in the container 10 reaches the third liquid level; the temperatures of the electronic components of the electronic device 02, such as the main heat generating component 022 and the secondary heat generating component 023, are monitored.

[0081] For different working conditions of the electronic device 02, the cooling device 01 in the embodiments of the present application can switch different heat dissipation modes, as follows: energy-saving heat dissipation mode: if the temperatures of the main heat generating component 022 and the secondary heat generating component 023 are both within the working allowable range, that is, neither of them is over-temperature, the third control valve 73 is controlled to open the liquid supplement port 11 of the container 10, and the operating power of the circulating pump 50 is appropriately reduced to reduce the flow rates of the cooling medium in the liquid supply pipeline 33 and the liquid return pipeline 34, so that the flow rate of the cooling medium in the entire cooling device 01 is reduced, so that the cooling device 01 switches to the energy-saving heat dissipation mode to achieve the effect of saving power consumption.

[0082] First low-power heat dissipation mode: in the case that the main heat generating component 022 is over-temperature, the secondary heat generating component 023 is not over-temperature, and there is a large first temperature margin, the third control valve 73 is controlled to open the liquid supplement port 11 of the container 10, the power of the circulating pump 50 is maintained, the flow rates of the cooling medium in the liquid supply pipeline 33 and the liquid return pipeline 34 are maintained, and the opening degree of the third control valve 73 is reduced to reduce the flow rate of the cooling medium in the second cooling pipeline 32, so that the flow rate of the cooling medium in the first cooling pipeline 31 is increased, so that the cooling device 01 switches to the first low-power heat dissipation mode.

[0083] The second low-power dissipation cooling mode: in the case that the main heat generating device 022 is overheated, the secondary heat generating device 023 is not overheated, and there is a small second temperature margin (the second temperature margin is smaller than the first temperature margin), the third control valve 73 is controlled to open the liquid supplement port 11 of the container 10, and the power of the circulating pump 50 is increased to increase the flow of the cooling medium in the liquid supply pipeline 33 and the liquid return pipeline 34, and the opening degree of each control valve is kept unchanged, so that the cooling device 01 switches to the second low-power dissipation cooling mode.

[0084] The high-power dissipation cooling mode: in the case that the main heat generating device 022 is overheated, the secondary heat generating device 023 is not overheated, and there is a small second temperature margin, but the flow of the cooling medium in the liquid supply pipeline 33 and the liquid return pipeline 34 cannot be continuously increased by increasing the power of the circulating pump 50, so that the maximum flow of the cooling medium in the liquid supply pipeline 33 and the liquid return pipeline 34 still cannot meet the cooling demand of the electronic device 02. Based on this, the third control valve 73 is controlled to close the liquid supplement port 11 of the container 10 to close the gravity enhancement effect, and the circulating pump 50 is kept at maximum power to make the cooling medium in the liquid supply pipeline 33 and the liquid return pipeline 34 at the maximum flow, so that the cooling device 01 switches to the high-power dissipation cooling mode.

[0085] In summary, the embodiment of the present application can make full use of the gravity effect of the cooling medium by arranging the container 10 above the electronic device 02, so that the cooling pipeline circulates by itself to cool the low-power devices (such as the main heat generating device 022 in the low-power operation mode, the secondary heat generating device 023, etc.). The double cooling pipeline mode is adopted to isolate and separately cool the main heat generating device 022 and the secondary heat generating device 023, so as to improve the cooling efficiency through targeted cooling. The sliding connection between the electronic device 02 and the second shell 40 can facilitate the modification of the electronic device 02, and can realize the flow communication between the liquid inlet 0212 of the first shell 021 and the second cooling pipeline 32, which can reduce the resistance to the cooling medium compared with the arrangement of multiple small holes. The collection of the cooling medium in the double pipeline realizes the same recovery, and the self-suction negative pressure of the circulating pump 50 cooperates with the gravity effect to realize the recovery and return of the cooling medium at a small power consumption. In the case that the gravity effect cannot meet the cooling demand, the high-power dissipation cooling mode can be switched to meet the peak power dissipation demand of the high-power device. The whole cooling device 01 adopts a set of heat exchange device 60, which realizes the regulation of the flow of the cooling medium in the cooling pipeline through the cooperation of the circulating pump 50 and multiple control valves, so as to achieve a wide range of cooling regulation ability, and keep the cooling device 01 at the optimal PUE operation.

[0086] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims.

Claims

1. A cooling device for cooling an electronic device (02), the electronic device (02) comprising a first casing (021) and a main heat generating component (022) and a secondary heat generating component (023) respectively arranged in the first casing (021), the first casing (021) being provided with a liquid outlet (0211) and a liquid inlet (0212) respectively communicating with an inner cavity of the first casing (021); the cooling device (01) comprising a container (10) for containing a cooling medium, a cooling component (20), a first cooling pipeline (31) and a second cooling pipeline (32); the container (10) is arranged above the first casing (021); one end of the first cooling pipeline (31) communicates with the container (10), at least partially penetrates the first casing (021), and the other end penetrates out of the first casing (021); the cooling component (20) is arranged in the first casing (021), surrounds the outside of the main heat generating component (022), and is connected to the first cooling pipeline (31); one end of the second cooling pipeline (32) communicates with the container (10), and the other end of the second cooling pipeline (32) is connected to the liquid inlet (0212).

2. The cooling device of claim 1, wherein, the cooling device (01) further comprises a second casing (40), the second casing (40) is provided with a containing groove (411) and an overflow groove (412), the containing groove (411) is used for containing the electronic device (02); the containing groove (411) is used for communicating with the liquid outlet (0211); the slot of the overflow groove (412) communicates with the slot of the containing groove (411), and the slot wall of the overflow groove (412) is provided with a liquid outlet (4121).

3. Cooling apparatus according to claim 2, wherein, the side wall of the containing groove (411) is provided with a first sliding structure (4111), the first sliding structure (4111) extends from the slot of the containing groove (411) to the bottom of the slot; the first sliding structure (4111) is used for slidingly connecting with a second sliding structure (0213) provided on the outer wall of the first casing (021).

4. The cooling device of claim 3, wherein, the slot wall of the containing groove (411) is provided with a mounting hole, and the other end of the second cooling pipeline (32) penetrates the mounting hole; when the electronic device (02) is placed in the containing groove (411), the other end of the second cooling pipeline (32) is used for communicating with the liquid inlet (0212) opposite to the liquid inlet (0212).

5. The cooling device of claim 1, wherein, the cooling device (01) further comprises a liquid supply pipeline (33), the liquid supply pipeline (33) communicates with the container (10), and the first cooling pipeline (31) and the second cooling pipeline (32) respectively communicate with the liquid supply pipeline (33).

6. The cooling device of claim 2, wherein, the cooling device (01) further comprises a liquid return pipeline (34), a circulating pump (50) and a heat exchange device (60). The return liquid pipeline (34) is in communication with the other end of the first cooling pipeline (31) and the liquid outlet (4121) respectively, and the circulating pump (50) and the heat exchange device (60) are arranged in the return liquid pipeline (34) respectively.

7. The cooling device according to claim 1 or 5, wherein The cooling device (01) further comprises a first control valve (71) arranged in the second cooling pipeline (32) and used for regulating the flow of the cooling medium in the second cooling pipeline (32).

8. The cooling device of claim 2, wherein, A second control valve (72) is arranged at the liquid outlet (4121) and used for regulating the flow of the cooling medium at the liquid outlet (4121).

9. The cooling device of claim 1, wherein, The container (10) is provided with a liquid supplementing opening (11), and a third control valve (73) is arranged at the liquid supplementing opening (11) and used for opening or closing the liquid supplementing opening (11).

10. The cooling device of claim 2, wherein, The container (10) is provided with a first liquid level meter (81); And / or, the containing groove (411) is provided with a second liquid level meter (82); And / or, the overflow groove (412) is provided with a third liquid level meter (83).

11. The cooling device according to any one of claims 1 to 10, wherein The cooling device (01) comprises a plurality of the cooling members (20), a plurality of the first cooling pipelines (31) and a plurality of the second cooling pipelines (32); One end of each of the first cooling pipelines (31) is in communication with the container (10), at least part of each of the first cooling pipelines (31) is arranged in the first shell (021) of the corresponding electronic device (02), and the other end of the first cooling pipeline (31) penetrates out of the first shell (021); Each of the cooling members (20) is arranged in the first shell (021) of the corresponding electronic device (02) and surrounds the outside of the main heat generating device (022), and each of the cooling members (20) is connected to the corresponding first cooling pipeline (31); One end of each of the second cooling pipelines (32) is in communication with the container (10), and the other end of each of the second cooling pipelines (32) is connected to the liquid inlet (0212) of the first shell (021) of the corresponding electronic device (02).

12. A cooling control method applied to the cooling device (01) of any one of claims 1 to 11, the cooling control method comprising: when the main heat generating device (022) and the secondary heat generating device (023) are not over-temperature, controlling to open the liquid supplementing opening (11) of the container (10) and to reduce the flow of the cooling medium in the supply liquid pipeline (33) and the return liquid pipeline (34) respectively, so that the cooling device (01) is switched to an energy-saving heat dissipation mode. In the case that the primary heat generating device (022) is over-temperature and the secondary heat generating device (023) has a first temperature margin, the control opens the liquid supplement port (11) of the container (10), maintains the flow of the cooling medium in each of the liquid supply pipeline (33) and the liquid return pipeline (34), increases the flow of the cooling medium in the first cooling pipeline (31), and reduces the flow of the cooling medium in the second cooling pipeline (32), so that the cooling device (01) switches to a first low-power heat dissipation mode; In the case that the primary heat generating device (022) is over-temperature and the secondary heat generating device (023) has a second temperature margin smaller than the first temperature margin, the control opens the liquid supplement port (11) of the container (10), and increases the flow of the cooling medium in each of the liquid supply pipeline (33) and the liquid return pipeline (34), so that the cooling device (01) switches to a second low-power heat dissipation mode; In the case that the primary heat generating device (022) is over-temperature and the secondary heat generating device (023) has the second temperature margin, and the flow of the cooling medium in each of the liquid supply pipeline (33) and the liquid return pipeline (34) reaches the maximum and still cannot meet the cooling requirement, the control closes the liquid supplement port (11) of the container (10), and keeps the cooling medium in each of the liquid supply pipeline (33) and the liquid return pipeline (34) at the maximum flow, so that the cooling device (01) switches to a high-power heat dissipation mode.

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