Circuit board

Abstract

This circuit board comprises: a build-up layer having a plurality of insulating layers stacked therein; and circuit layers disposed on the plurality of insulating layers, wherein the plurality of insulating layers include a first insulating layer, the plurality of circuit layers include an inductor disposed on the first insulating layer, the inductor includes a pattern part disposed on one surface of the first insulating layer and a magnetic part disposed on the other surface of the first insulating layer, and the magnetic part includes a first portion vertically overlapping the first insulating layer and a second portion vertically overlapping the first insulating layer and the pattern part.

Description

circuit board

[0001] This embodiment relates to a circuit board.

[0002]

[0003] Recently, technology related to electronic products has been progressing toward multifunctionality and high speed, and to respond to this trend, semiconductor chip manufacturing technology is also developing rapidly.

[0004] In particular, the thickness of circuit boards used for the miniaturization of finished electronic products is also being reduced, and technologies related to multilayer circuit boards, which comprise more circuit layers within a circuit board of the same thickness, are being actively researched.

[0005] A circuit board is formed by printing circuit line patterns using a conductive material, such as copper, onto an electrically insulating substrate; it is a general term for a board immediately before electronic components are mounted. To densely mount many different types of electronic components on a flat surface, the mounting positions of each component are determined, and circuit patterns connecting the components are printed on the surface of the flat plate to secure them.

[0006] The circuit board includes a plurality of insulating layers arranged in a vertical direction. The plurality of insulating layers can be electrically connected by wiring layers arranged on each surface and via electrodes connecting different wiring layers.

[0007] Electronic components are placed on circuit boards. As the capacity of electronic components increases for high efficiency and multifunctionality, their size also increases; in this case, it becomes difficult to secure space for component placement within the circuit board.

[0008]

[0009] The present invention provides a circuit board that can secure a larger component placement space and improve production efficiency by placing an inductor inside the circuit board.

[0010]

[0011] A circuit board according to the present embodiment comprises a build-up layer having a plurality of insulating layers stacked thereon; and a circuit layer disposed on the plurality of insulating layers, wherein the plurality of insulating layers comprises a first insulating layer, and the plurality of circuit layers comprises an inductor disposed on the first insulating layer, wherein the inductor comprises a pattern portion disposed on one side of the first insulating layer and a magnetic portion disposed on the other side of the first insulating layer, and wherein the magnetic portion comprises a first portion vertically superimposed with the first insulating layer and a second portion vertically superimposed with the first insulating layer and the pattern portion.

[0012] The above first part may not overlap vertically with the above pattern part.

[0013] The above magnetic part may include at least one material selected from the group consisting of NiFe alloy, NiCr alloy, and CoP alloy.

[0014] It includes a magnetic coupling portion disposed on the first insulating layer, and the magnetic portion may be disposed on the magnetic coupling portion.

[0015] The magnetic part may be dry-plated or wet-plated on the magnetic part coupling part.

[0016] The above pattern portion may include a plurality of lines and a fold portion disposed between adjacent lines.

[0017] It includes a shielding portion disposed on the first insulating layer, and the shielding portion may overlap the pattern portion in a vertical direction.

[0018] The shielding portion includes a first shielding portion and a second shielding portion spaced apart in the horizontal direction, and the spaced area between the first shielding portion and the second shielding portion may overlap with the magnetic portion in the vertical direction.

[0019] The shielding part can be electrically connected to the pattern part.

[0020] The circuit layer may include a wiring portion disposed in the plurality of insulating layers and a via portion penetrating at least a portion of the plurality of insulating layers to electrically connect the shielding portion and the wiring portion.

[0021]

[0022] Through this embodiment, the inductor is placed in an embedded form within the circuit board, which has the advantage of securing a larger placement space for the inductor and enabling the implementation of a large-capacity inductor.

[0023] In addition, since an inductor can be implemented during the circuit layer formation process, there is an advantage in improving production efficiency by reducing assembly steps.

[0024]

[0025] FIG. 1 is a cross-sectional view of a circuit board according to a first embodiment of the present invention.

[0026] FIG. 2 is a cross-sectional view of a pattern portion according to a first embodiment of the present invention.

[0027] FIG. 3 is a cross-sectional view of a circuit board according to a second embodiment of the present invention.

[0028] FIG. 4 is a plan view of a pattern portion according to a second embodiment of the present invention.

[0029] FIG. 5 is a drawing for explaining the arrangement structure of a pattern part, a magnetic part, and a wire according to a second embodiment of the present invention.

[0030]

[0031] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0033] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a sense that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0034] Additionally, the terms used in the embodiments of the present invention are for describing the embodiments and are not intended to limit the present invention. In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as “at least one of A and B and C (or more than one),” it may include one or more of all combinations that can be combined with A, B, and C.

[0035] In addition, terms such as first, second, A, B, (a), (b), etc. may be used when describing the components of the embodiments of the present invention.

[0036] These terms are intended merely to distinguish a component from other components and are not limited by the nature, order, sequence, etc., of the said component.

[0037] And, where it is stated that a component is 'connected', 'combined', or 'joined' to another component, this may include not only cases where the component is directly connected, combined, or joined to the other component, but also cases where it is 'connected', 'combined', or 'joined' due to another component located between the component and the other component.

[0038] Furthermore, when described as being formed or placed "above or below" each component, "above or below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above or below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0039] In addition, the expression that configuration A is positioned between configuration B and configuration C must include the meaning that configuration A is positioned such that at least a portion of it overlaps with configurations B and C in the horizontal and / or vertical directions.

[0040] Expressions referring to directions include horizontal and vertical directions, and the horizontal direction includes a first horizontal direction and a second horizontal direction perpendicular to the first horizontal direction. These are referred to as the first horizontal direction (X-axis), the second horizontal direction (Y-axis), and the vertical direction (Z-axis) according to the Cartesian coordinate system, and the meaning of being superimposed along the horizontal direction must include the meaning of being superimposed along the first horizontal direction and / or superimposed along the second horizontal direction.

[0041] FIG. 1 is a cross-sectional view of a circuit board according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of a pattern portion according to a first embodiment of the present invention.

[0042] Referring to FIGS. 1 and 2, a circuit board (10) according to the first embodiment of the present invention may include a build-up layer (100), a wiring portion, a via portion, a pattern portion (150), and a magnetic portion (160).

[0043] The build-up layer (100) may include a plurality of insulating layers. The plurality of insulating layers may be stacked along a vertical direction. For example, the plurality of insulating layers may include a first insulating layer (101), a second insulating layer (102) disposed below the first insulating layer (101), a third insulating layer (103) disposed below the second insulating layer (102), a fourth insulating layer (104) disposed below the third insulating layer (103), a fifth insulating layer (105) disposed below the fourth insulating layer (104), and a sixth insulating layer (106) disposed below the fifth insulating layer (105).

[0044] The first to sixth insulating layers (101, 102, 103, 104, 105, 106) may each be any insulating material, such as photocurable and / or thermosetting materials. As thermosetting insulating materials, an insulating material in which inorganic and / or organic fillers are dispersed within a resin, such as ABF (Ajinomoto Build-up Film), a product released by Ajinomoto, may be used, and a prepreg (PPG) containing glass fibers within a resin may be used. In addition, the resins described above may be, for example, epoxy resin, bismaleimide triazine resin (BT resin), phenolic resin, etc., and the inorganic and / or organic fillers may be provided with materials such as silica or plastic. When an insulating resin is used as a core, it may include a reinforcing material provided with glass fibers or aramid fibers. When the first to sixth insulating layers (101, 102, 103, 104, 105, 106) are photocurable insulators, the first to sixth insulating layers (101, 102, 103, 104, 105, 106) may each be a PID (Photo Imageable Dielectric).

[0045] The materials of the first to sixth insulating layers (101, 102, 103, 104, 105, 106) described above are exemplary, and some of the insulating layers may be made of materials different from those of others.

[0046] In this embodiment, the circuit board (10) is described as having a coreless structure in which the core layer is omitted, but this is not limited thereto, and the circuit board (10) may include a core layer that forms the basis of the circuit board (10). In this case, the core layer may be placed between the third insulating layer (103) and the fourth insulating layer (104).

[0047] The circuit board (10) may include a circuit layer.

[0048] The circuit layer may include a plurality of wiring portions and a plurality of via portions.

[0049] A plurality of wiring portions may each be disposed on the surface of a plurality of insulating layers. Here, the meaning of being disposed on the surface may also include the meaning that at least a portion of the plurality of wiring portions is embedded within the plurality of insulating layers and exposed to the outside from the surface.

[0050] A plurality of wiring sections may include a first wiring section (121) disposed on the upper surface of a first insulating layer (101), a second wiring section (122) disposed on the upper surface of a second insulating layer (102), a third wiring section (123) disposed on the upper surface of a third insulating layer (103), a fourth wiring section (124) disposed on the upper surface of a fourth insulating layer (104), a fifth wiring section (125) disposed on the upper surface of a fifth insulating layer (105), a sixth wiring section (126) disposed on the upper surface of a sixth insulating layer (106), and a seventh wiring section (127) disposed on the lower surface of the sixth insulating layer (106). The first to seventh wiring sections (121, 122, 123, 124, 125, 126, 127) may have a predetermined length in the horizontal direction. The first wiring section (121) disposed on the upper surface of the first insulating layer (101) may be named the first pad section. The seventh wiring section (127) disposed on the lower surface of the sixth insulating layer (106) may be named the second pad section.

[0051] The via may be a metallic material disposed in a via hole formed within a plurality of insulating layers to connect a plurality of wiring portions facing each other in a vertical direction. Here, the via hole may have a shape that penetrates each of the plurality of insulating layers in a vertical direction.

[0052] The via section may include a first via section (131) penetrating the first insulating layer (101), a second via section (132) penetrating the second insulating layer (102), a third via section (133) penetrating the third insulating layer (103), a fourth via section (134) penetrating the fourth insulating layer (104), a fifth via section (135) penetrating the fifth insulating layer (105), and a sixth via section (136) penetrating the sixth insulating layer (106).

[0053] The first via section (131) can electrically connect the first wiring section (121) and the second wiring section (122). The second via section (132) can electrically connect the second wiring section (122) and the third wiring section (123). The third via section (133) can electrically connect the third wiring section (123) and the fourth wiring section (124). The first to third via sections (131, 132, 133) may have a shape in which the horizontal width decreases as it goes downward.

[0054] The fourth via (134) can electrically connect the fourth wiring section (124) and the fifth wiring section (125). The fifth via (135) can electrically connect the fifth wiring section (125) and the sixth wiring section (126). The sixth via (136) can electrically connect the sixth wiring section (126) and the seventh wiring section (127). The fourth to sixth vias (134, 135, 136) may have a shape in which the horizontal width increases as it goes downward.

[0055] The first to sixth vias (131, 132, 133, 134, 135, 136) may be arranged to overlap in the vertical direction.

[0056] A protective layer may be disposed on the surface of the circuit board (10). The protective layer may include an upper protective layer (191) disposed on the upper surface of the first insulating layer (101) and a lower protective layer (192) disposed on the lower surface of the sixth insulating layer (106). The upper protective layer (191) and the lower protective layer (192) can each perform the function of preventing short circuits between solders due to low wettability with the solder when a semiconductor device is disposed on the surface of the circuit board (10) using a material such as solder. The upper protective layer (191) and the lower protective layer (192) may each utilize a photocurable insulating material. As an example, the upper protective layer (191) and the lower protective layer (192) may utilize a solder resist or a PID (Photo Imageable Dielectric).

[0057] The circuit board (10) may include an inductor. The inductor may form part of the circuit layer. The inductor may be embedded within the circuit board (10). The inductor may be implemented in an embedded form within the circuit board (10). The inductor may be a solenoid-type inductor.

[0058] The inductor may include a pattern portion (150) and a magnetic portion (160). The pattern portion (150) and the magnetic portion (160) may be arranged within a plurality of insulating layers. The pattern portion (150) and the magnetic portion (160) may be arranged opposite each other in a vertical direction. The pattern portion (150) and the magnetic portion (160) may overlap in a vertical direction.

[0059] The pattern portion (150) may be disposed between the second insulating layer (102) and the third insulating layer (103). The pattern portion (150) may be disposed on the lower surface of the second insulating layer (102). The pattern portion (150) may be embedded in the lower surface of the second insulating layer (102). The pattern portion (150) may be disposed on the upper surface of the third insulating layer (103). The pattern portion (150) may be disposed to overlap the third wiring portion (123) in a horizontal direction. The horizontal length of the pattern portion (150) may be formed to be longer than the horizontal length of the third wiring portion (123). The pattern portion (150) may be electrically connected to the second wiring portion (122) through the second via portion (132). A plurality of second wiring sections (122) spaced apart in the horizontal direction may be arranged on the upper surface of the second insulating layer (102) that overlaps the pattern section (150) in the vertical direction. Each of the plurality of second wiring sections (122) may be arranged to overlap vertically with one end of the pattern section (150) and the other end facing the one end in the horizontal direction.

[0060] As illustrated in FIG. 2, the pattern section (150) may include a first end section (151) forming one end, a second end section (152) facing the first end section (151) and forming the other end, and a connecting pattern (155) connecting the first end section (151) and the second end section (152). Here, the first end section (151) and the second end section (152) may be arranged to overlap in a vertical direction with each of the aforementioned plurality of second wiring sections (122).

[0061] The first end (151) and the second end (152) can each be electrically connected to the second wiring section (122) through the second via section (132). The connection pattern (155) can be formed in a zigzag shape. The connection pattern (155) may include a plurality of lines and a bending section positioned between two adjacent lines. Accordingly, the area overlapping in a vertical direction with the magnetic section (160) can be increased.

[0062] The magnetic part (160) may be disposed between the first insulating layer (101) and the second insulating layer (102). The magnetic part (160) may be disposed on the lower surface of the first insulating layer (101). The magnetic part (160) may be embedded in the lower surface of the first insulating layer (101). The magnetic part (160) may be disposed on the second insulating layer (102). The magnetic part (160) may be disposed on the upper surface of the second insulating layer (102).

[0063] The pattern portion (150) and the magnetic portion (160) are each positioned on one side and the other side of the second insulating layer (102), respectively, and are positioned opposite each other in a vertical direction relative to the second insulating layer (102), so the second insulating layer (102) can also be named the first insulating layer.

[0064] The magnetic part (160) may include a ferromagnetic material. The magnetic part (160) may include at least one material selected from the group consisting of NiFe alloy, NiCr alloy, and CoP alloy. The magnetic part (160) may interact electromagnetically with the pattern part (150). Accordingly, an inductor may be implemented.

[0065] The magnetic part (160) may be arranged to overlap vertically with the horizontal center of the pattern part (150). At least a portion of the magnetic part (160) may be arranged to overlap vertically with the pattern part (150).

[0066] Based on the pattern portion (150), the pattern portion (150) may include a first region (158) that overlaps vertically with the magnetic portion (160) and a second region (159) that does not overlap vertically. Similarly, based on the magnetic portion (160), the magnetic portion (160) may include a first portion (168) that overlaps vertically with a plurality of insulating layers of the build-up layer (100) and a second portion (169) that overlaps vertically with the pattern portion (150) and a plurality of insulating layers. Here, the first portion (168) may be a region that does not overlap vertically with the pattern portion (150).

[0067] Accordingly, the amount of plating on the pattern portion (150) forming the inductor can be reduced, which has the advantage of facilitating productivity. In addition, the lines within the pattern portion (150) can be concentrated to face the magnetic portion (160), thereby improving the efficiency of the inductor.

[0068] The magnetic part (160) can be formed on the second insulating layer (102) by dry or wet plating.

[0069] A magnetic part coupling part (165) for securing a placement area of ​​a magnetic part (160) may be disposed on the upper surface of the second insulating layer (102). The magnetic part coupling part (165) may be a metal pattern plated on the second insulating layer (102). The magnetic part coupling part (165) may be disposed so as to overlap horizontally with the second wiring part (122).

[0070] The magnetic part coupling portion (165) has a predetermined thickness in the vertical direction and can form an arrangement area of ​​the magnetic part (160) on the surface of the second insulating layer (102). The magnetic part (160) can be plated on the second insulating layer (102) through the magnetic part coupling portion (165). The magnetic part coupling portion (165) may be made of the same material as the second wiring portion (122). The horizontal length of the magnetic part coupling portion (165) may be longer than the horizontal length of the magnetic part (160). The magnetic part coupling portion (165) may be arranged to overlap the pattern portion (150) in the vertical direction. The formation process of the magnetic part (160) can be performed more easily through the magnetic part coupling portion (165).

[0071] A shielding portion (170) may be disposed on the upper surface of the first insulating layer (101). The shielding portion (170) may be disposed such that at least a portion overlaps the pattern portion (150) in a vertical direction. The shielding portion (170) may be disposed such that at least a portion overlaps the magnetic portion (160) in a vertical direction. The shielding portion (170) may be a metal pattern plated on the first insulating layer (101). The shielding portion (170) may be covered by an upper protective layer (191). The shielding portion (170) may be embedded within the upper protective layer (191).

[0072] The shielding portion (170) may be arranged to overlap the first wiring portion (121) in a horizontal direction. The horizontal length of the shielding portion (170) may be longer than the horizontal length of the first wiring portion (121).

[0073] The shielding section (170) can be electrically connected to the second wiring section (122) through the first via section (131).

[0074] The shielding portion (170) may include a first shielding portion (171) and a second shielding portion (172) that are spaced apart in the horizontal direction. The first shielding portion (171) and the second shielding portion (172) may be spaced apart in the horizontal direction. A spacing portion (175) is disposed between the first shielding portion (171) and the second shielding portion (172), and the spacing portion (175) may be disposed to overlap in the vertical direction with at least a part of the magnetic portion (160).

[0075] The inductor can be protected from external electrical noise through the shielding portion (170) due to the cover structure of the magnetic portion (160) or the pattern portion (150). Additionally, the rigidity within the circuit board (10) in the placement area of ​​the inductor can be reinforced due to the vertical overlapping structure of the pattern portion (150) and the magnetic portion (160).

[0076] According to the above structure, by placing the inductor in an embedded form within the circuit board, a larger placement space for the inductor can be secured, and there is an advantage in that a large-capacity inductor can be implemented.

[0077] In addition, since an inductor can be implemented during the formation process of multiple wiring sections and via sections, there is an advantage in that production efficiency can be improved by reducing assembly work.

[0078] Hereinafter, a circuit board according to the second embodiment of the present invention will be described.

[0079] FIG. 3 is a cross-sectional view of a circuit board according to a second embodiment of the present invention, FIG. 4 is a plan view of a pattern portion according to a second embodiment of the present invention, and FIG. 5 is a drawing for explaining the arrangement structure of a pattern portion, a magnetic portion, and a wire according to a second embodiment of the present invention.

[0080] In this embodiment, other parts are identical to the first embodiment, except for differences in the arrangement positions of the pattern portion and the magnetic portion, and the shape of the connection pattern within the pattern portion. Therefore, only the characteristic parts of this embodiment will be described below, and for the remaining parts, the description according to the first embodiment will be used. Components having the same function and structure as the circuit board according to the first embodiment are described by assigning the same reference numerals.

[0081] Referring to FIGS. 3 to 5, a circuit board (20) according to a second embodiment of the present invention may include a build-up layer including a plurality of insulating layers, a wiring portion, a via portion, a pattern portion (250), a magnetic portion (260), and a molding portion (280).

[0082] The pattern portion (250) may be disposed between the first insulating layer (101) and the second insulating layer (102). The pattern portion (250) may be disposed on the lower surface of the first insulating layer (101). The pattern portion (250) may be embedded in the lower surface of the first insulating layer (101). The pattern portion (250) may be disposed on the upper surface of the second insulating layer (102). The pattern portion (250) may be disposed to overlap the second wiring portion (122) in a horizontal direction. The horizontal length of the pattern portion (250) may be formed to be longer than the horizontal length of the second wiring portion (132). The pattern portion (250) may be electrically connected to the shielding portion (240) through the first via portion (131). When the shielding portion (240) is omitted, the pattern portion (250) can be electrically connected to the first wiring portion (121) through the first via portion (131).

[0083] As illustrated in FIG. 4, the pattern portion (250) may include a first end portion (251) forming one end, a second end portion (252) opposite to the first end portion (251) and forming the other end, and a plurality of metal lines (253) arranged between the first end portion (251) and the second end portion (252).

[0084] The first end (251) and the second end (252) can be electrically connected to the first wiring section (121) or the shielding section (240) through the first via section (131).

[0085] A plurality of metal lines (253) may be arranged spaced apart from each other along a horizontal direction. A plurality of metal lines (253) may be arranged diagonally with respect to a line connecting a first end (251) and a second end (252) in a horizontal direction. At both ends of each of the plurality of metal lines (253), a connecting part (254, 255) for connecting a wire (270) to be described later may be provided. Accordingly, the wire (270) has both ends connected to the connecting part (254) of one of the two adjacent metal lines (253) and the connecting part (255) of the other metal line (253), thereby electrically connecting two metal lines (253) spaced apart in a horizontal direction.

[0086] At least a portion of the metal line (253) may be exposed above the first insulating layer (101) through the cavity (108) of the first insulating layer (101).

[0087] The magnetic part (260) can be placed on the upper surface of the first insulating layer (101).

[0088] The magnetic part (260) may include a ferromagnetic material. The magnetic part (260) may include at least one material selected from the group consisting of NiFe alloy, NiCr alloy, and CoP alloy. The magnetic part (260) may interact electromagnetically with the pattern part (250). Accordingly, an inductor may be implemented.

[0089] The magnetic part (260) may be arranged to overlap vertically with the horizontal center of the pattern part (250). At least a portion of the magnetic part (260) may be arranged to overlap vertically with the pattern part (250).

[0090] Based on the pattern portion (250), the pattern portion (250) may include a first region (258) that overlaps vertically with the magnetic portion (260) and a second region (259) that does not overlap vertically. Similarly, based on the magnetic portion (260), the magnetic portion (260) may include a first portion (268) that overlaps vertically with a plurality of insulating layers of the build-up layer (100) and a second portion (269) that overlaps vertically with the pattern portion (250) and a plurality of insulating layers. Here, the first portion (268) may be a region that does not overlap vertically with the pattern portion (250).

[0091] Accordingly, the amount of plating on the pattern portion (250) forming the inductor can be reduced, which has the advantage of facilitating productivity. In addition, the lines within the pattern portion (250) can be concentrated to face the magnetic portion (260), thereby improving the efficiency of the inductor.

[0092] The magnetic part (260) can be formed on the first insulating layer (101) through dry or wet plating.

[0093] A magnetic part coupling part (265) for securing a placement area for a magnetic part (260) may be disposed on the upper surface of the first insulating layer (101). The magnetic part coupling part (265) may be a metal pattern plated on the core layer (110). The magnetic part coupling part (265) may be made of the same material as the first wiring part (121). The magnetic part coupling part (265) may be disposed so as to overlap horizontally with the first wiring part (121). The horizontal length of the magnetic part coupling part (265) may be longer than the horizontal length of the magnetic part (260). It may be disposed so as to overlap vertically with the magnetic part coupling part (265) or the pattern part (250). Through the magnetic part coupling part (265), the plating process for forming the magnetic part (260) can be performed more easily.

[0094] A wire (270) may be arranged to connect two adjacent metal lines (253). To secure a space for the arrangement of the wire (270), the first insulating layer (101) may include a cavity (108) formed in a vertical direction. Based on a single wire (270), the first insulating layer (101) may include a plurality of cavities (108) through which both ends of the wire (270) pass. The plurality of cavities (108) may be arranged spaced apart in a horizontal direction. A magnetic part (260) and a magnetic part coupling part (265) may be arranged between the plurality of cavities (108).

[0095] One of the plurality of cavities (108) may be arranged to overlap perpendicularly with the first coupling portion (254) of the metal line (253). Another of the plurality of cavities (108) may be arranged to overlap perpendicularly with the second coupling portion (255) of the metal line (253). Accordingly, due to the structure in which the coupling portions (254, 255) of the metal line (253) are exposed through the cavity (108), a wire (270) can be connected. As shown in FIG. 5, the wire (270) may be provided in multiple numbers corresponding to the number of metal lines (253).

[0096] A protective layer (191) may be disposed on the upper surface of the first insulating layer (101). In this case, to secure a placement space for the magnetic part (260), a through hole (195) may be disposed in the area of ​​the protective layer (191) that overlaps vertically with the magnetic part (260) and the pattern part (250). The protective layer (191) may not be disposed in the area where the through hole (195) is formed. The horizontal length of the through hole (195) may be longer than the vertical length of the magnetic part (260) or the pattern part (250). Accordingly, the placement area of ​​the molding part (280), which will be described later, can be formed widely. The magnetic part (260) and the wire (270) may be exposed above the circuit board (20) through the through hole (295). In this case, the uppermost part of the wire (270) can be positioned above the upper surface of the protective layer (191).

[0097] To protect the wire (270) and the magnetic part (260) from external impact, a molding part (280) may be placed on the upper surface of the circuit board (20). The molding part (280) is placed in the through hole (195), and the wire (270) and the magnetic part (260) may be embedded by the molding part (280). In this case, as shown in FIG. 5, the wire (270) and the magnetic part (260) embedded within the molding part (280) may have a contact area with each other. Accordingly, a support structure for the wire (270) within the molding part (280) can be implemented through the magnetic part (260). Within the molding part (280), the magnetic part (260) may be wrapped by the wire (2770).

[0098] Considering the vertical height of the wire (270), the upper surface of the molding portion (280) may protrude upward above the upper surface of the protective layer (191). That is, the vertical thickness of the molding portion (280) may be thicker than the vertical thickness of the protective layer (191). The molding portion (280) may also be filled within the cavity (108).

[0099] A shielding portion (240) may be disposed on the upper surface of the first insulating layer (101). The shielding portion (240) may be disposed such that at least a portion overlaps vertically with the pattern portion (250). The shielding portion (240) may be disposed such that at least a portion overlaps horizontally with the magnetic coupling portion (265) or the first wiring portion (121). The shielding portion (240) may be a metal pattern plated on the first insulating layer (101). The shielding portion (240) may be covered by a molding portion (280). The shielding portion (240) may be embedded within the molding portion (280).

[0100] The shielding portion (240) may be electrically connected to the pattern portion (250) through the first via portion (131). The shielding portion (240) may include a first shielding portion and a second shielding portion spaced apart in the horizontal direction, in which case the magnetic portion (260) and the magnetic portion coupling portion (265) may be positioned between the first shielding portion and the second shielding portion. The first shielding portion and the second shielding portion may be positioned to overlap in the vertical direction at one end of the pattern portion (250) and the other end of the pattern portion (250), respectively.

[0101] In the foregoing, although all components constituting an embodiment of the present invention have been described as being combined or operating in combination, the present invention is not necessarily limited to such embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined in one or more ways to operate. Furthermore, terms such as "include," "constitute," or "have" described above, unless specifically stated otherwise, mean that the relevant component may be inherent; thus, they should be interpreted as allowing for the inclusion of additional components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains, unless otherwise defined. Terms commonly used, such as those defined in advance, should be interpreted in accordance with their meaning in the context of the relevant technology and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the present invention.

[0102] The foregoing description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are intended to explain, not limit, the technical concept of the present invention, and the scope of the technical concept of the present invention is not limited by such embodiments. The scope of protection of the present invention shall be interpreted by the claims below, and all technical concepts within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.

[0103] Meanwhile, when a circuit board having the features of the invention described above is used in IT devices or home appliances such as smartphones, server computers, and TVs, it can stably perform functions such as signal transmission or power supply. For example, when a circuit board having the features of the invention performs a semiconductor package function, it can safely protect the semiconductor chip from external moisture or contaminants, and can resolve issues such as leakage current, electrical short circuits between terminals, or electrical open circuits of terminals supplying power to the semiconductor chip. In addition, when it is responsible for signal transmission, it can resolve noise issues. Through this, the circuit board having the features of the invention described above enables the stable operation of IT devices or home appliances, thereby allowing the entire product and the circuit board to which the invention is applied to achieve functional integration or technical interoperability.

[0104] When a circuit board having the features of the invention described above is used in a transportation device such as a vehicle, it can resolve the problem of signal distortion transmitted to the transportation device, or safely protect a semiconductor chip controlling the transportation device from the outside, and further improve the stability of the transportation device by resolving problems such as leakage current, electrical short circuits between terminals, or electrical open circuits of terminals supplying power to the semiconductor chip. Accordingly, the transportation device and the circuit board to which the present invention is applied can achieve functional integration or technical interoperability with each other.

Claims

1. A build-up layer having a plurality of insulating layers stacked thereon; and It includes a circuit layer disposed on the plurality of insulating layers above, and The above plurality of insulating layers includes a first insulating layer, and The above plurality of circuit layers includes an inductor disposed in the first insulating layer, and The above inductor includes a pattern portion disposed on one side of the first insulating layer and a magnetic portion disposed on the other side of the first insulating layer, and The above magnetic part is a circuit board comprising a first part vertically superimposed with the first insulating layer and a second part vertically superimposed with the first insulating layer and the pattern part.

2. In Paragraph 1, The first part above is a circuit board that does not overlap vertically with the pattern part.

3. In Paragraph 1, The above magnetic part is a circuit board comprising at least one material selected from the group consisting of NiFe alloy, NiCr alloy, and CoP alloy.

4. In Paragraph 1, It includes a magnetic coupling portion disposed on the first insulating layer, and The above magnetic part is a circuit board disposed on the above magnetic part coupling part.

5. In Paragraph 4, The above magnetic part is a circuit board that is dry-plated or wet-plated on the above magnetic part coupling part.

6. In Paragraph 1, The above pattern portion is a circuit board comprising a plurality of lines and a fold portion disposed between adjacent lines.

7. In Paragraph 1, It includes a shielding portion disposed on the first insulating layer, and The above shielding portion is a circuit board that overlaps the above pattern portion in a vertical direction.

8. In Paragraph 7, The above shielding part includes a first shielding part and a second shielding part spaced apart in the horizontal direction, and The separation area between the first shielding part and the second shielding part is a circuit board that overlaps in a direction perpendicular to the magnetic part.

9. In Paragraph 7, The shielding portion is a circuit board electrically connected to the pattern portion.

10. In Paragraph 7, The circuit layer comprises a wiring portion disposed in the plurality of insulating layers and a via portion penetrating at least a portion of the plurality of insulating layers to electrically connect the shielding portion and the wiring portion.

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