Flexible printed circuit board and electronic device comprising same

Abstract

A flexible printed circuit board according to one embodiment of the present disclosure may comprise a conductive pattern including a plurality of first conductive lines each connecting a plurality of first contacts and a plurality of second contacts, and a second conduction line positioned between two adjacent first conductive lines among the plurality of first conductive lines and not connected to the plurality of first contacts and the plurality of second contacts.

Description

Flexible printed circuit board and electronic device including the same

[0001] The various embodiments disclosed in this document relate to electronic devices, for example, electronic devices including a flexible printed circuit board.

[0002] Driven by remarkable advancements in information and communication technology and semiconductor technology, the distribution and use of various electronic devices are increasing rapidly. In particular, recent electronic devices are being developed to enable portable communication.

[0003] The term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, and in-car navigation systems. For example, these electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions can now be integrated into a single electronic device, such as a mobile communication terminal. For instance, not only communication functions but also entertainment functions like games, multimedia functions like music / video playback, communication and security functions like mobile banking, and functions such as schedule management or electronic wallets are being integrated into a single electronic device. These electronic devices are being miniaturized to allow users to carry them conveniently.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] A flexible printed circuit board according to one embodiment of the present disclosure comprises a first region in which a plurality of first contacts are arranged, a second region in which a plurality of second contacts are arranged, and a third region located between the first region and the second region, wherein the third region of the flexible printed circuit board comprises a flexible substrate layer, a conductive pattern disposed on one surface of the substrate layer comprising a plurality of first conductive lines connecting the plurality of first contacts and the plurality of second contacts respectively, and a conductive pattern comprising a second conductive line located between two adjacent first conductive lines among the plurality of first conductive lines and not connected to the plurality of first contacts and the plurality of second contacts, a cover layer covering the conductive pattern comprising a first open region in which a portion of at least one of the plurality of first conductive lines is exposed, and a second open region in which a portion of the second conductive line is exposed, and electrically connecting the at least one first conductive line and the second conductive line through the first open region and the second open region. It may include a bridge.

[0006] A flexible printed circuit board according to one embodiment of the present disclosure comprises a first region having a plurality of first contacts, a second region having a plurality of second contacts, and a third region disposed between the first region and the second region, wherein the third region of the flexible printed circuit board may include a substrate layer and a conductive pattern disposed on one surface of the substrate layer, and wherein the conductive pattern comprises a plurality of first conductive lines including a first section extending from the plurality of first contacts, a second section extending from the plurality of second contacts, and a third section disposed between the first section and the second section, and a second conductive line disposed between the third sections of two adjacent first conductive lines and not directly connected to the plurality of first contacts and the plurality of second contacts, and wherein the spacing between the third sections of the two adjacent first conductive lines is the spacing between the first sections of the two adjacent first conductive lines and / or the two adjacent first The spacing between the second sections of the conductive lines is larger than the spacing between the plurality of first conductive lines, and at least one of the first conductive lines corresponds to a ground line and can be electrically connected to the second conductive line through a bridge.

[0007] An electronic device according to one embodiment of the present disclosure comprises a housing forming at least a portion of the exterior of the electronic device and a flexible printed circuit board disposed inside the housing, wherein the flexible printed circuit board comprises a first region in which a plurality of first contacts are disposed, a second region in which a plurality of second contacts are disposed, and a third region located between the first region and the second region, and the third region of the flexible printed circuit board comprises a flexible substrate layer, a conductive pattern disposed on one surface of the substrate layer comprising a plurality of first conductive lines connecting the plurality of first contacts and the plurality of second contacts respectively, and a conductive pattern comprising a second conductive line located between two adjacent first conductive lines among the plurality of first conductive lines and not connected to the plurality of first contacts and the plurality of second contacts, a cover layer covering the conductive pattern comprising a first open region in which a portion of at least one of the plurality of first conductive lines is exposed and a second open region in which a portion of the second conductive line is exposed, and the It may include a bridge that electrically connects at least one first conductive line and the second conductive line through the first open area and the second open area.

[0008] An electronic device according to one embodiment of the present disclosure comprises a housing forming at least a portion of the exterior of the electronic device, a first electronic component and a second electronic component disposed inside the housing, and a flexible printed circuit board disposed inside the housing and connecting the first electronic component and the second electronic component, wherein the flexible printed circuit board comprises a first region having a plurality of first pins disposed therein, a second region having a plurality of second pins disposed therein, and a third region located between the first region and the second region, wherein the third region of the flexible printed circuit board comprises a flexible substrate layer, a conductive pattern disposed on one surface of the substrate layer, wherein the conductive pattern comprises a plurality of first conductive lines connecting the plurality of first contacts and the plurality of second contacts respectively, the plurality of first conductive lines including a signal line and a first ground line, and a conductive pattern extending parallel to the signal line and including a second ground line not directly connected to the plurality of first contacts and the plurality of second contacts, and a conductive pattern spaced apart from the conductive pattern, and the first ground line and the second It may include a bridge that electrically connects the ground line.

[0009] FIG. 1 is a block diagram showing an electronic device in a network environment according to one embodiment of the present disclosure.

[0010] FIG. 2 is a perspective view of an electronic device showing the front of the electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is a perspective view of a flexible printed circuit board according to one embodiment of the present disclosure.

[0013] FIG. 5 is a plan view of a flexible cable according to one embodiment of the present disclosure, showing a flexible cable with the cover layer removed.

[0014] FIG. 6 is a cross-sectional view of a flexible cable according to one embodiment of the present disclosure, cut along the XX' line shown in FIG. 5.

[0015] FIG. 7 is a cross-sectional view of a flexible cable according to one embodiment of the present disclosure, cut along the YY' line shown in FIG. 5.

[0016] FIG. 8 is a partial enlarged view of a flexible cable according to one embodiment of the present disclosure illustrated in FIG. 5.

[0017] FIG. 9 is a partial enlarged view of a flexible cable according to one embodiment of the present disclosure illustrated in FIG. 5.

[0018] FIGS. 10 to 12 are magnified partial views of a portion of a conductive pattern according to one embodiment of the present disclosure shown in FIG. 8.

[0019] FIG. 13 is a plan view of a flexible cable according to one embodiment of the present disclosure, showing a flexible cable with the cover layer removed.

[0020] FIG. 14 is a plan view of a flexible cable according to a comparative example.

[0021] FIG. 15 is a graph showing the results of an electromagnetic radiation test of a flexible cable according to the comparative embodiment shown in FIG. 14.

[0022] FIG. 16 is a graph showing the results of an electromagnetic radiation test of a flexible cable according to one embodiment of the present disclosure illustrated in FIG. 5.

[0023] The following description relating to the attached drawings may provide an understanding of various exemplary embodiments of the present disclosure, including the claims and their corresponding contents. While the exemplary embodiments disclosed in the following description include various specific details to aid understanding, they are to be considered as one of various exemplary embodiments. Accordingly, those skilled in the art will understand that various changes and modifications to the various embodiments described herein may be made without departing from the scope and technical spirit of the disclosure. Additionally, for clarity and brevity, descriptions of well-known functions and configurations may be omitted.

[0024] The terms and words used in the following description and claims are not limited to their literal meanings but may be used to clearly and consistently describe an embodiment of the present disclosure. Accordingly, it will be apparent to a person skilled in the art that the following description of various embodiments of the disclosure is provided for illustrative purposes, not for the purpose of limiting the scope of the rights or the disclosure defined as equivalent thereto.

[0025] Unless the context clearly indicates otherwise, it should be understood that the singular forms of "a," "an," and "the" include a plural meaning. Thus, for example, "component surface" can be understood to include one or more of the component surfaces.

[0026] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise.

[0027] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0028] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in other aspects (e.g., importance or order).

[0029] The statement that a certain component is connected to or coupled with another component should be understood to include both cases where the said certain component is directly connected to the said other component and cases where another component intervenes between the said certain component and the said other component. On the other hand, the statement that the said certain component is directly connected to or directly coupled with the said other component should be understood to mean that no other component intervenes between the said certain component and the said other component. Meanwhile, the statement that the said certain component is not directly connected to or directly coupled with the said other component should be understood to include both cases where the said certain component and the said other component are not connected to each other and cases where the said certain component and the said other component are connected by another component intervened between them.

[0030] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to one embodiment of the present disclosure. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or may communicate with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In one embodiment, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In one embodiment, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0031] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0032] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0033] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0034] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0035] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0036] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0037] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0038] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected to the electronic device (101) via wired or wireless connection.

[0039] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0040] The interface (177) may support one or more specified protocols that can be used to connect the electronic device (101) to an external electronic device (e.g., electronic device (102)) via wired or wireless connection. According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0041] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0042] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0043] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0044] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0045] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0046] The communication module (190) can support the establishment of a wired communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support wired communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0047] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified by the electronic device (101), an external electronic device (e.g., electronic device (104)), or a network system (e.g., a second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0048] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to one embodiment, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0049] According to one embodiment, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0050] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0051] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104 or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0052] FIG. 2 is a perspective view of an electronic device (101) showing the front view of the electronic device (101) according to one embodiment of the present disclosure. FIG. 3 is an exploded perspective view of an electronic device (101) according to one embodiment of the present disclosure.

[0053] Referring to FIGS. 2 and FIGS. 3, an electronic device (101) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In one embodiment (not shown), the housing (210) may refer to a structure forming some of the first surface (210A) of FIG. 2, the second surface (210B) of FIG. 3, and the side (210C).

[0054] According to one embodiment of the present disclosure, the first surface (210A) may be formed by a front plate (202) in which at least a portion is substantially transparent (e.g., a glass plate including various coating layers, or a polymer plate). The second surface (210B) may be formed by a rear plate (280) in which it is substantially opaque. The rear plate (280) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.

[0055] According to one embodiment of the present disclosure, the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204), a camera module (270), a key input device (217), a light-emitting element (206), and a connector hole (208, 209). In one embodiment, the electronic device (101) may omit at least one of the components (e.g., a key input device (217), or a light-emitting element (206)) or additionally include other components.

[0056] According to one embodiment of the present disclosure, the display (220) may be visually exposed, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually exposed through the front plate (202) forming the first surface (210A) or through a portion of the side (210C). In one embodiment, the corners of the display (220) may be formed to be generally identical to the adjacent outer shape of the front plate (202).

[0057] According to one embodiment of the present disclosure, an audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (207, 214). A microphone for acquiring external sound may be disposed inside the microphone hole (203), and in one embodiment, a plurality of microphones may be disposed to detect the direction of sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for communication.

[0058] According to one embodiment of the present disclosure, a sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of an electronic device (101) or an external environmental state. The sensor module (204) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) and / or a third sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of a housing (210). The fingerprint sensor may be disposed on a second surface (210B) or a side (210C) as well as on the first surface (210A) (e.g., a display (220)) of the housing (210). The electronic device (101) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0059] According to one embodiment of the present disclosure, a camera module may include a first camera device (205) disposed on a first surface (210A) of an electronic device (101) and a second camera device (270) disposed on a second surface (210B). The camera devices (205, 270) may include one or more lenses, an image sensor, and / or an image signal processor.

[0060] According to one embodiment of the present disclosure, a key input device (217) may be disposed on a side (210C) of a housing (210). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on a display (220).

[0061] According to one embodiment of the present disclosure, a light-emitting element (206) may be disposed on, for example, a first surface (210A) of a housing (210). The light-emitting element (206) may, for example, provide state information of an electronic device (101) in the form of light. In one embodiment, the light-emitting element (206) may, for example, provide a light source that is coupled with the operation of the camera module. The light-emitting element (206) may include, for example, an LED, an IR LED, and a xenon lamp.

[0062] According to one embodiment of the present disclosure, the connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0063] According to one embodiment of the present disclosure, the housing (210) of an electronic device (101) (e.g., the electronic device (101) of FIG. 1 or FIG. 2) may include a first support member (211) (e.g., a bracket), a front plate (202), a display (220), at least one printed circuit board (or board assembly) (261, 262), a battery (250), a second support member (291, 292) (e.g., a rear case), an antenna, and a rear plate (280). When including a plurality of printed circuit boards (261, 262), the electronic device (101) may electrically connect different printed circuit boards by including at least one flexible printed circuit board (300). For example, the printed circuit boards (261, 262) may include a first circuit board (261) positioned above the battery (250) and a second circuit board (262) positioned below it, and the flexible printed circuit board (300) may electrically connect the first circuit board (261) and the second circuit board (262).

[0064] According to one embodiment of the present disclosure, a flexible printed circuit board (300) can connect two electronic components disposed inside an electronic device (101). For example, the flexible printed circuit board (300) can connect two board assemblies (261, 262). A flexible printed circuit board (300) according to one embodiment of the present disclosure will be described in detail later with reference to FIGS. 4 to 10 and FIGS. 12.

[0065] According to one embodiment of the present disclosure, the first support member (211) may be provided in a flat shape for at least a portion. The first support member (211) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. A display (220) may be supported on one side of the first support member (211), and a printed circuit board (261, 262) may be disposed on the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (261, 262). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0066] According to one embodiment of the present disclosure, the first support member (211) may be named a "support bracket." The first support member (211) may face the front plate (202). The first support member (211) may face the rear plate (280). The support member (211) may be made of reinforced plastic or metal.

[0067] According to one embodiment of the present disclosure, a front plate (202) may be joined to a support member (211) through an adhesive member. The front plate (202) may be named "cover" or "front cover". A rear plate (280) may be named "cover" or "rear cover". The rear cover (280) may face the first support member (211).

[0068] According to one embodiment, the housing (210) may be understood as a structure for generally accommodating, protecting, or housing a printed circuit board (261, 262) or a battery (250). In one embodiment, the housing (210) may be understood to include a structure that a user can visually or tactilely perceive from the exterior of the electronic device (101), such as a front plate (202) and / or a rear plate (280). The housing (210) may include a side structure (210C), a first support member (211), a front plate (202), and a rear plate (280). In one embodiment, the phrase “front or rear of the housing (210)” may refer to the first surface (210A) of FIG. 1 or the second surface (210B) of FIG. 2. In one embodiment, the first support member (211) is positioned between the front plate (202) (e.g., the first surface (210A) of FIG. 1) and the rear plate (280) (e.g., the second surface (210B) of FIG. 2) and can function as a structure for positioning electrical / electronic components such as printed circuit boards (261, 262).

[0069] According to one embodiment of the present disclosure, the second support member (291, 292) may include, for example, an upper support member (291) and a lower support member (292). In one embodiment, the upper support member (291) may be arranged to surround a printed circuit board (261, 262) (e.g., a first circuit board (261)) together with a part of the first support member (211). For example, the upper support member (291) of the second support member (291) may be arranged to face the first support member (211) with the first circuit board (261) in between. In one embodiment, the lower support member (292) of the second support member (291, 292) may be arranged to face the first support member (211) with the second circuit board (262) in between.

[0070] In one embodiment of the present disclosure, the lower support member (292) may be utilized as a structure capable of arranging electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector). In one embodiment, electrical / electronic components such as a speaker module and an interface (e.g., a USB connector, an SD card / MMC connector, or an audio connector) may be arranged on an additional printed circuit board not illustrated. For example, the lower support member (292) may be arranged to enclose an additional printed circuit board together with another part of the first support member (211).

[0071] According to one embodiment of the present disclosure, the battery (250) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially coplanar with, for example, printed circuit boards (261, 262). The battery (250) may be disposed integrally within the electronic device (101) or may be disposed detachably from the electronic device (101).

[0072] FIG. 4 is a perspective view of a flexible printed circuit board (300) according to one embodiment of the present disclosure.

[0073] Referring to FIG. 4, a flexible printed circuit board (300) according to one embodiment of the present disclosure may include a flexible cable (301). The flexible printed circuit board (300) may include a first board (310) and a second board (320) disposed at the end portion of the flexible cable (301). The first board (310) and the second board (320) may be named a first stiffener and a second stiffener, respectively. A first connector (311) and a second connector (321) may be disposed at the end portion of the flexible cable (301). The first connector (311) may be reliably connected to another electronic component (e.g., the second printed circuit board (262) of FIG. 3) by the first board (310). The second connector (321) can be reliably connected to another electronic component (e.g., the first printed circuit board (261) of FIG. 3) by the second board (320).

[0074] According to one embodiment of the present disclosure, a flexible printed circuit board (300) may include a first region (A1, region) in which a first board (310) and a first connector (311) are disposed. The flexible printed circuit board (300) may include a second region (A2, region) in which a second board (320) and a second connector (321) are disposed. The flexible printed circuit board (300) may include a third region (A3) located between the first region (A1) and the second region (A2). The first region (A1) to the third region (A3) will be described in detail later.

[0075] FIG. 5 is a plan view of a flexible cable (301) according to one embodiment of the present disclosure, showing a flexible cable (301) with a cover layer (e.g., the first cover layer (S1) of FIG. 6) removed.

[0076] According to one embodiment of the present disclosure, a first region (A1), a second region (A2), and a third region (A3) of a flexible printed circuit board (300) may overlap with a first region (A1), a second region (A2), and a third region (A3) of a flexible cable (301), as illustrated in FIG. 5. The first region (A1) of the flexible cable (301) may be named a first terminal portion, and the second region (A2) of the flexible cable (301) may be named a second terminal portion.

[0077] According to one embodiment of the present disclosure, a plurality of first contacts (360, electrical contacts) may be disposed in a first region (A1) of a flexible cable (301). A plurality of second contacts (370) may be disposed in a second region (A2) of a flexible cable (301). The contacts (360, 370) may be understood as part of a conductive pattern (P) exposed externally for electrical connection with an electronic component (e.g., a first circuit board (261) or a second circuit board (262) of FIG. 3) and may be named as a pin, a pad, or a terminal.

[0078] According to one embodiment of the present disclosure, a third region (A3) of a flexible printed circuit board (300) may include a conductive pattern (P) disposed on the substrate layer (B) (e.g., one side (BS1) of FIG. 6). The conductive pattern (P) may be disposed on either side (BS1) of two opposite sides (BS1, BS2, see FIG. 6) of the substrate layer (B). The flexible printed circuit board (300) may include a single signal layer comprising the conductive pattern (P) configured to transmit electrical signals. As an example, the conductive pattern (P) may be formed by etching. The conductive pattern (P) may include a plurality of first conductive lines (330, 340, 350) connecting a plurality of first contacts (360) and a plurality of second contacts (370).

[0079] According to one embodiment of the present disclosure, a third region (A3) of a flexible printed circuit board (300) may include a bending section and an extension section extending from the bending section. The bending section may be understood as a portion of the flexible printed circuit board (300) that is bent inside the electronic device (101). As an example, the bending section may be located at the center of the third region (A3). The extension section may be understood as a section extending from the bending section and connecting the bending section to a first region (A1) and / or a second region (A2). The extension section may be understood as a section that is bent to a lesser degree than the bending section or as a section that is not bent.

[0080] According to one embodiment of the present disclosure, the bridge (380) may be located at the end of the third region (A3) of the flexible printed circuit board (300). The bridge (380) may be located in the extended section of the third region (A3) of the flexible printed circuit board (300). Thus, an electrical connection between at least one first ground line (340) and the second conductive line (410, 420) through the bridge (380) can be stably maintained. However, the location of the bridge (380) is not limited to the extended section, and according to other embodiments, it may also be located in the bending section.

[0081] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include at least one power line (330). For example, power supplied from a battery (250, see FIG. 4) may be transmitted to other electronic components (e.g., printed circuit boards (261, 262) of FIG. 4) through the power line (330).

[0082] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include a plurality of signal lines (350) configured to transmit electrical signals for the operation of an electronic component (e.g., the processor (120) of FIG. 1). The plurality of signal lines (350) may include a plurality of first signal lines (351) adjacent to each other and a plurality of second signal lines (352) adjacent to each other. The plurality of first signal lines (351) may be positioned between the plurality of second signal lines (352) and at least one power line (330).

[0083] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include a plurality of ground lines (340) located between the plurality of second signal lines (352). The ground lines (340) may extend side by side with the second signal lines (352). The plurality of ground lines (340) may be located next to the plurality of second signal lines (352). Electromagnetic waves radiated from the plurality of second signal lines (352) may be reduced by the plurality of ground lines (340). The ground line (340) connected to the contact (360, 370) may be named the first ground line and may be distinguished from the second ground line (410) and the third ground line (420) not connected to the contact (360, 370).

[0084] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include a plurality of signal lines (350). The plurality of signal lines (350) may include a first signal line (351), a second signal line (352), a third signal line (353), a fourth signal line (354), and / or a fifth signal line (355).

[0085] According to one embodiment of the present disclosure, the second signal line (352) can be understood as a signal line in which electromagnetic waves radiated during the signal transmission process are greater than those of the first signal line (351). As an example, the second signal line (352) can be understood as a high-speed signal line, and the first signal line (351) can be understood as a low-speed signal line. The high-speed signal line and the low-speed signal line are relative terms based on the transmission speed of data; for example, the high-speed signal line may include an RF (radio frequency) line that transmits a communication signal, and the low-speed signal line may include a signal line that transmits simple input and output signals. However, the first signal line (351) and the second signal line (352) are not necessarily limited to the high-speed signal line and the low-speed signal line, and it is understood that they may be configured differently without being distinguished as the high-speed signal line and the low-speed signal line as described above.

[0086] According to one embodiment of the present disclosure, the conductive pattern (P) may include a second conductive line (410, 420) located between two adjacent first conductive lines (353, 354, 355) among the plurality of first conductive lines (330, 340, 350). FIG. 5 illustrates, exemplarily, a case where the second conductive line (410, 420) is located between a third signal line (353), a fourth signal line (354), and a fifth signal line. However, the second conductive line (410, 420) may also be placed between two adjacent first signal lines (351), between second signal lines (352), and / or between two adjacent power lines (330).

[0087] According to one embodiment of the present disclosure, the second conductive line (410, 420) may be located between the first region (A1) and the second region (A2). The second conductive line (410, 420) may be composed of a plurality of them. The second conductive line (410, 420) may include a second-1 conductive line (410) and a second-2 conductive line (420) extended along the third signal line (353). The second-1 conductive line (410) may be named a second ground line, and the second-2 conductive line (420) may be named a third ground line.

[0088] According to one embodiment of the present disclosure, the second conductive line (410, 420) may not be directly connected to the plurality of first contacts (360) and the plurality of second contacts (370). The second conductive line (410, 420) may be connected to the plurality of first contacts (360) and the plurality of second contacts (370) through a bridge (380). Both ends of the second conductive line (410, 420) (e.g., the second-1 pad portion (421) and the second-2 pad portion (422) of FIG. 8) may be spaced apart from the plurality of first contacts (360) and the plurality of second contacts (370). The length of the second conductive line (410, 420) (e.g., the second-1 conductive line (410)) may be shorter than the length of the first conductive line (330, 340, 350) connecting the first contact (360) and the second contact (370).

[0089] According to one embodiment of the present disclosure, the two adjacent first conductive lines (353, 354, 355) may include a signal line (353) located between the second-1 conductive line (410) and the second-2 conductive line (420). The signal line (353) located between the second-1 conductive line (410) and the second-2 conductive line (420) may be named a "third signal line" for the convenience of explanation and distinction.

[0090] According to one embodiment of the present disclosure, a flexible printed circuit board (300) may include a bridge (380) that electrically connects at least one first ground line (340) and a second conductive line (410, 420). The bridge (380) may include a first bridge (381) connecting one side of the ground line (340) and the second conductive line (410, 420), and a second bridge (382) connecting the other side of the ground line (340) and the second conductive line (410, 420). The second-1 conductive line (410) and the second-2 conductive line (420) connected to the first ground line (340) through the bridge (380) may be named the second ground line (410) and the third ground line (420), respectively. The connection relationship between the bridge (380), the first ground line (340), the second ground line (410), and the third ground line (420) will be described in detail later with reference to FIG. 6.

[0091] FIG. 6 is a cross-sectional view of a flexible cable (301) according to one embodiment of the present disclosure, cut along the line XX' shown in FIG. 5. FIG. 7 is a cross-sectional view of a flexible cable (301) according to one embodiment of the present disclosure, cut along the line YY' shown in FIG. 5. The cross-sectional view of the flexible cable (301) shown in FIG. 6 can also be understood as a cross-sectional view of a flexible printed circuit board (300) cut along the line XX' shown in FIG. 5. The cross-sectional view of the flexible cable (301) shown in FIG. 7 can also be understood as a cross-sectional view of a flexible printed circuit board (300) cut along the line YY' shown in FIG. 5.

[0092] Referring to FIGS. 6 and 7, according to one embodiment of the present disclosure, the flexible printed circuit board (300) may include a flexible substrate layer (B). As an example, the substrate layer (B) may be formed of a polyimide material having excellent heat resistance and flexibility. A conductive pattern (P) may be disposed on the surface (BS1, BS2) of the substrate layer (B). The surface of the substrate layer (B) may be named one side (BS1) and the other side (BS2), or a first side (BS1) and a second side (BS2).

[0093] According to one embodiment of the present disclosure, a flexible printed circuit board (300) may include cover layers (S1, S2) that cover the conductive pattern (P). The cover layers (S1, S2) may be named as coating layers. For convenience of explanation, the cover layer (S1) covering one side (BS1) of the substrate layer (B) may be named the first cover layer, and the cover layer (S2) covering the other side (BS2) of the substrate layer (B) may be named the second cover layer. As an example, the cover layers (S1, S2) may be understood as a solder mask containing epoxy resin, which is a layer coated to cover the conductive pattern (P). The cover layers (S1, S2) can protect the conductive pattern (P) from the outside.

[0094] According to one embodiment of the present disclosure, the first cover layer (S1) may include a first open area in which some (341, 342) of the plurality of first conductive lines (330, 340, 350) are exposed. The first cover layer (S1) may include a second open area in which some (411, 412, 421, 422) of the second conductive lines (410, 420) are exposed. As an example, the first open area and the second open area may be understood as areas formed through a photolithography process to expose a conductive material to the outside.

[0095] According to one embodiment of the present disclosure, the bridge (380) (e.g., the first bridge (381)) is disposed on the cover layer (S1) and may be spaced apart from the conductive pattern (P) by the cover layer (S1). Thus, the bridge (380) and the conductive pattern (P) may be connected to a conductive portion (e.g., a pad portion (341, 411, see FIG. 8)) exposed through the first open area and the second open area.

[0096] According to one embodiment of the present disclosure, a first ground line (340) and a second conductive line (410, 420) (e.g., a third ground line (420)) of a conductive pattern (P) may be electrically connected to a bridge (380) through a conductive material (381a, 381b). The conductive material (381a, 381b) may include a first conductive material (381a) disposed between the second conductive line (410, 420) (e.g., a third ground line (420)) and the bridge (380) (e.g., a first bridge (381)). FIG. 6 illustrates the conductive material (381a, 381b) disposed in the first open area and the second open area.

[0097] According to one embodiment of the present disclosure, a bridge (380) (e.g., a first bridge (381)) may be connected to a second conductive line (420) (e.g., a pad portion (421)) through a first conductive material (381a). A bridge (380) (e.g., a first bridge (381)) may be connected to a first ground line (340) (e.g., a pad portion (341)) through a second conductive material (381b). For example, the conductive materials (381a, 381b) may include flexible conductive tape or silver paste.

[0098] According to one embodiment of the present disclosure, a flexible printed circuit board (300) may include a flexible protective layer (390) covering a bridge (380). The protective layer (390) may be configured to protect the bridge (380) from external impact. As an example, the protective layer (390) may include a polyimide film.

[0099] FIG. 8 is a partial enlarged view of a flexible cable (301) according to one embodiment of the present disclosure illustrated in FIG. 5. FIG. 9 is a partial enlarged view of a flexible cable (301) according to one embodiment of the present disclosure illustrated in FIG. 5.

[0100] Referring to FIGS. 5 through 9, according to one embodiment of the present disclosure, a first ground line (340) may include a first pad portion (341, 342) connected to the bridge (380) through the first open area. Through the first open area, the first bridge (381) may be connected to the first-1 pad portion (341). Through the first open area, the second bridge (382) may be connected to the first-2 pad portion (342).

[0101] According to one embodiment of the present disclosure, the first ground line (340) may include a first line portion (343) extending from the first pad portion (341). The first-1 pad portion (341) and the first-2 pad portion (342) may be connected by the first line portion (343). The width of the first-1 pad portion (341) may be greater than the width of the first line portion (343). The width of the first-2 pad portion (342) may be greater than the width of the first line portion (343). Thus, the first pad portions (341, 342) of the first ground line (340) and the bridge (380) can be reliably connected through the first open area.

[0102] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second pad portion (411, 412, 421, 422) connected to the bridge (380) through the second open area. The first bridge (381) may be connected to the second-1 pad portion (411, 421) through the second open area. The second bridge (382) may be connected to the second-2 pad portion (412, 422) through the second open area.

[0103] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second line portion (413, 423) extending from the second pad portion (411, 421). The second-1 pad portion (411, 421) and the second-2 pad portion (412, 422) may be connected by the second line portion (413, 423). The width of the second-1 pad portion (411, 421) may be greater than the width of the second line portion (413, 423). The width of the second-2 pad portion (412, 422) may be greater than the width of the second line portion (413, 423). Accordingly, the second pad portion (411, 412, 421, 422) of the second conductive line (410, 420) and the bridge (380) can be stably connected through the second open area.

[0104] According to one embodiment of the present disclosure, in the longitudinal direction (e.g., Y-axis direction) of the first ground line (340) and the second conductive line (410, 420), the first pad portion (341, 342) and the second pad portion (421, 422) may be spaced apart from each other. Thus, the space efficiency of the flexible cable (301) may be increased.

[0105] According to one embodiment of the present disclosure, the second line portion (413, 423) of the second conductive line (410, 420) may be located between the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422). The second line portion (413, 423) may connect the second-1 pad portion (411) and the second-2 pad portion (422). The width of the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422) may be greater than the width of the second line portion (413, 423).

[0106] According to one embodiment of the present disclosure, the ground line (340) may include a first line portion (343) positioned between the first-1 pad portion (341) and the first-2 pad portion (342). The first line portion (343) may connect the first-1 pad portion (341) and the first-2 pad portion (342). The width of the first-1 pad portion (341) and the first-2 pad portion (342) may be greater than the width of the first line portion (343).

[0107] FIGS. 10 to 12 are partial enlarged views illustrating a portion of a conductive pattern (P) according to one embodiment of the present disclosure illustrated in FIG. 8.

[0108] Referring to FIGS. 10 to 12, according to one embodiment of the present disclosure, a plurality of first conductive lines (330, 340, 350) (e.g., a third signal line (353) and a fourth signal line (354)) may include a first section (P1, Q1, R1) extended from the plurality of first contacts (360). A plurality of first conductive lines (330, 340, 350) (e.g., a third signal line (353) and a fourth signal line (354)) may include a second section (P2, Q2, R2) extended from the plurality of second contacts (370). A plurality of first conductive lines (330, 340, 350) (e.g., third signal line (353) and fourth signal line (354)) may include a third section (P3, Q3, R3) disposed between the first section (P1, Q1, R1) and the second section (P2, Q2, R2). The third section (P3, Q3, R3) may connect the first section (P1, Q1, R1) and the second section (P2, Q2, R2).

[0109] According to one embodiment of the present disclosure, the second ground line (410) of the second conductive line (410, 420) may be positioned between the third signal line (353) and the fourth signal line (354). The second ground line (410) of the second conductive line (410, 420) may be positioned between the third section (P3) of the third signal line (353) and the third section (Q3) of the fourth signal line (354).

[0110] According to one embodiment of the present disclosure, the spacing between the third section (P3) of the third signal line (353) and the third section (Q3) of the fourth signal line (354) may be greater than the spacing between the first section (P1) of the third signal line (353) and the first section (Q1) of the fourth signal line (354) and / or the spacing between the second section (P2) of the third signal line (353) and the second section (Q2) of the fourth signal line (354). At least one of the third section (P3) of the third signal line (353) and the third section (Q3) of the fourth signal line (354) may be bent from the first section (P1, Q1) and / or the second section (P2, Q2) to bypass the second ground line (410). The third section (P3) of the third signal line (353) and the third section (Q3) of the fourth signal line (354) can be bent to bypass the second ground line (410) and then extended side by side with the second ground line (410).

[0111] According to one embodiment of the present disclosure, the spacing between the third section (Q3) of the fourth signal line (354) and the third section (R3) of the fifth signal line (355) may be greater than the spacing between the first section (Q1) of the fourth signal line (354) and the first section (R1) of the fifth signal line (355) and / or the spacing between the second section (Q2) of the fourth signal line (354) and the second section (R2) of the fifth signal line (355). At least one of the third section (Q3) of the fourth signal line (354) and the third section (R3) of the fifth signal line (355) may be bent from the first section (Q1, R1) and / or the second section (Q2, R2) to bypass the second ground line (410) or the third ground line (420). The third section (Q3) of the fourth signal line (354) and the third section (R3) of the fifth signal line (355) may be bent to bypass the second ground line (410) or the third ground line (420) and then extended side by side with the second ground line (410).

[0112] According to one embodiment of the present disclosure, a second ground line (410) may be extended parallel to a third signal line (353). The second ground line (410) may be located next to the third signal line (353). A third ground line (420) may be extended parallel to a third signal line (353). The third ground line (420) may be located next to the third signal line (353).

[0113] According to one embodiment of the present disclosure, a second ground line (410) and a third ground line (420) may extend along the third signal line (353) around the third signal line (353). The second ground line (410) and the third ground line (420) may extend parallel to the third signal line (353) on both sides of the third signal line (353). The second ground line (410) and the third ground line (420) may at least partially surround the third signal line (353). Thus, electromagnetic waves radiated from the third signal line (353) can be effectively reduced by the second ground line (410) and the third ground line (420).

[0114] FIG. 13 is a plan view of a flexible cable (1301) according to one embodiment of the present disclosure, showing a flexible cable (1301) with a cover layer (e.g., the first cover layer (S1) of FIG. 6) removed.

[0115] The description of the bridge (380) of the flexible cable (301) according to one embodiment of the present disclosure described with reference to FIG. 5 to 9 can be substantially applied to the bridge (1380) according to one embodiment of the present disclosure described with reference to FIG. 13, provided that they are not arranged with each other.

[0116] According to one embodiment of the present disclosure, the first conductive line (330, 340) may include a first-1 pad portion (341) and a first-2 pad portion (342) connected to the bridge (1380) through the first open area. The first conductive line (330, 340) may include a first line portion (343) located between the first-1 pad portion (341) and the first-2 pad portion (342). The first line portion (343) may connect the first-1 pad portion (341) and the first-2 pad portion (342). The width of the first-1 pad portion (341) and the first-2 pad portion (342) may be greater than the width of the first line portion (343). Accordingly, the first pad portion (341, 342) of the first conductive line (330, 340) and the bridge (1380) can be stably connected through the first open area.

[0117] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second-1 pad portion (411, 421) and a second-2 pad portion (412, 422) connected to the bridge (1380) through the second open area. The second conductive line (410, 420) may include a second line portion (413, 423) extending from the second pad portion (411, 421). The second-1 pad portion (411, 421) and the second-2 pad portion (412, 422) may be connected by the second line portion (413, 423). The width of the second-1 pad portion (411, 421) may be greater than the width of the second line portion (413, 423). The width of the second pad portion (412, 422) may be larger than the width of the second line portion (413, 423). Thus, the second pad portion (411, 412, 421, 422) of the second conductive line (410, 420) and the bridge (1380) can be stably connected through the second open area.

[0118] FIG. 14 is a plan view of a flexible cable (301') according to a comparative embodiment. FIG. 15 is a graph showing the results of an electromagnetic radiation test of a flexible cable according to the comparative embodiment shown in FIG. 14. FIG. 16 is a graph showing the results of an electromagnetic radiation test of a flexible cable according to one embodiment of the present disclosure shown in FIG. 5.

[0119] The flexible cable (301') according to the comparative embodiment shown in FIG. 14 can be understood as having pad portions (341, 342), a second conductive line (410, 420), and a bridge (380) omitted compared to the flexible cable (301) according to one embodiment of the present disclosure described with reference to FIG. 5 to 9.

[0120] The description of the components of a flexible cable (301) according to one embodiment of the present disclosure described with reference to FIG. 5 through 12 (e.g., at least one power line (330), a plurality of ground lines (340), a plurality of signal lines (350), a first signal line (351), a second signal line (352), a third signal line (353), and / or a contact (360)) may be applied substantially the same to the components according to a comparative embodiment described with reference to FIG. 14 (e.g., at least one power line (330'), a plurality of ground lines (340'), a plurality of signal lines (350'), a first signal line (351'), a second signal line (352'), a third signal line (353'), and / or a contact (360')) to the extent that they are not arranged with each other.

[0121] The electromagnetic radiation test result graphs shown in FIGS. 15 and 16 represent the results of measuring electromagnetic waves radiated from a conductive pattern (P) using antennas positioned in the vertical and horizontal directions, respectively. The boundary line indicated by a dashed line represents a reference level for stable operation without interference with surrounding electronic components, and, for example, can be understood as the upper limit measurement value of the radiation noise regulation item in international standards regarding electromagnetic compatibility testing. The graph shown by the dashed line represents the noise level measured when the antenna is positioned in the vertical direction, and peak values ​​exceeding the reference level are indicated as O. The graph shown by the solid line represents the results measured when the antenna is positioned in the horizontal direction, and peak values ​​exceeding the reference level are indicated as X.

[0122] Comparing FIG. 15 and FIG. 16, it can be seen that in the case of the flexible cable (301') according to the comparative embodiment, the peak value of the detected noise level exceeds the reference level, and the noise exceeding the reference level may be due to at least one specified signal line (353') of the flexible cable (301') shown in FIG. 14. According to one embodiment of the present disclosure, the flexible cable (301) can reduce the noise generated in the specified signal line (e.g., the third signal line (353)) by forming a ground structure (e.g., a second conductive line (410, 420) and / or a bridge (380)) that is not directly connected to the contact (360, 370) around the specific signal line (e.g., the third signal line (353)) which may be the cause of noise generation. In the case of a flexible cable (301) according to one embodiment of the present disclosure, it can be confirmed that the peak value of the detected noise level is maintained lower than the reference level.

[0123] Accordingly, according to one embodiment of the present disclosure, a flexible printed circuit board (300) and an electronic device (101) including the same can reduce noise radiated from a conductive pattern (P) without increasing the number of contacts (360, 370) of the flexible printed circuit board (300), and a flexible printed circuit board (300) with improved electromagnetic compatibility can be provided.

[0124] Due to the limited size of circuit boards (e.g., FPCBs), the number of ground lines or ground layers required to minimize electromagnetic radiation from signal lines placed on the circuit board may be limited. Due to these spatial limitations, there may be limitations in improving the grounding performance of circuit boards of limited size. Accordingly, many studies are being conducted to improve the grounding performance of circuit boards of limited size.

[0125] The problem to be solved in the present disclosure may be to improve the grounding performance of a circuit board without increasing the number of electrical contacts (e.g., pins, terminals) arranged at the terminals of the circuit board (e.g., FPCB).

[0126] However, the problems to be solved in this disclosure are not limited to those mentioned above, and may be determined in various ways without departing from the spirit and scope of this disclosure.

[0127] A flexible printed circuit board and an electronic device including the same according to various embodiments of the present disclosure can improve the grounding performance of a circuit board by placing a conductive line that is not connected to a terminal of the circuit board around a signal line.

[0128] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0129] According to one embodiment of the present disclosure, a flexible printed circuit board (300) may include a first region (A1) in which a plurality of first contacts (360) are arranged, a second region (A2) in which a plurality of second contacts (370) are arranged, and a third region (A3) located between the first region (A1) and the second region (A2).

[0130] According to one embodiment of the present disclosure, the third region (A3) of the flexible printed circuit board (300) may include a substrate layer (B).

[0131] According to one embodiment of the present disclosure, a third region (A3) of a flexible printed circuit board (300) may include a conductive pattern (P) disposed on one side (BS1) of the substrate layer (B).

[0132] According to one embodiment of the present disclosure, the conductive pattern (P) may include a plurality of first conductive lines (330, 340, 350) connecting the plurality of first contacts (360) and the plurality of second contacts (370).

[0133] According to one embodiment of the present disclosure, the conductive pattern (P) may include a first section (P1, Q1, R1) extending from the plurality of first contacts (360), a second section (P2, Q2, R2) extending from the plurality of second contacts (370), and a third section (P3, Q3, R3) disposed between the first section (P1, Q1, R1) and the second section (P2, Q2, R2).

[0134] According to one embodiment of the present disclosure, the conductive pattern (P) may include a second conductive line (410, 420) located between two adjacent first conductive lines (353, 354, 355) among the plurality of first conductive lines (330, 340, 350).

[0135] According to one embodiment of the present disclosure, the second conductive line (410, 420) may not be directly connected to the plurality of first contacts (360) and the plurality of second contacts (370).

[0136] According to one embodiment of the present disclosure, a third region (A3) of a flexible printed circuit board (300) may include a cover layer (S1) that covers the conductive pattern (P).

[0137] According to one embodiment of the present disclosure, the cover layer (S1) may include a first open area in which a portion (341, 342) of at least one first conductive line (340) among the plurality of first conductive lines (330, 340, 350) is exposed.

[0138] According to one embodiment of the present disclosure, the cover layer (S1) may include a second open area in which a portion (411, 412, 421, 422) of the second conductive line (410, 420) is exposed.

[0139] According to one embodiment of the present disclosure, a bridge (380) may be included to electrically connect the at least one first conductive line (340) and the second conductive line (410, 420) through the first open area and the second open area.

[0140] According to one embodiment of the present disclosure, the spacing between the third sections (P3, Q3, R3) of the two adjacent first conductive lines (353, 354, 355) may be greater than the spacing between the first sections (P1, Q1, R1) of the two adjacent first conductive lines (353, 354, 355) and / or the spacing between the second sections (P2, Q2, R2) of the two adjacent first conductive lines (353, 354, 355).

[0141] According to one embodiment of the present disclosure, at least one of the plurality of first conductive lines (330, 340, 350) corresponds to a ground line (340) and can be electrically connected to the second conductive lines (410, 420) through a bridge (380).

[0142] According to one embodiment of the present disclosure, the grounding line (340) can form a grounding area between the plurality of first contacts (360) and the plurality of second contacts (370) together with the second conductive line (410, 420).

[0143] According to one embodiment of the present disclosure, the flexible printed circuit board (300) includes a bending section and an extension section extending from the bending section, and the bridge (380) may be located in the extension section of the flexible printed circuit board (300).

[0144] According to one embodiment of the present disclosure, the conductive pattern (P) may be disposed on either one of two opposite sides (BS1, BS2) of the substrate layer (B), specifically on side (BS1).

[0145] According to one embodiment of the present disclosure, the flexible printed circuit board (300) may include a single signal layer comprising a conductive pattern (P) configured to transmit electrical signals.

[0146] According to one embodiment of the present disclosure, at least one of the two adjacent first conductive lines (353, 354, 355) may be extended parallel to the second conductive line (410, 420) after being bent from the first section (P1, Q1, R1) and / or the second section (P2, Q2, R2) so as to bypass the second conductive line (410, 420).

[0147] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second-1 conductive line (410) and a second-2 conductive line (420) that are substantially parallel to each other.

[0148] According to one embodiment of the present disclosure, the two adjacent first conductive lines (353, 354, 355) may include a signal line (353) configured to transmit an electrical signal and disposed between the second-1 conductive line (410) and the second-2 conductive line (420).

[0149] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include at least one power line (330).

[0150] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include a plurality of high-speed signal lines (351, 353, 354, 355) spaced apart from the at least one power line (330).

[0151] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include a plurality of low-speed signal lines (352) located between the plurality of high-speed signal lines (351) and the at least one power line (330).

[0152] According to one embodiment of the present disclosure, the plurality of first conductive lines (330, 340, 350) may include at least one ground line (340) located between the plurality of high-speed signal lines (351, 353).

[0153] According to one embodiment of the present disclosure, the second conductive line (410, 420) may be extended parallel to the high-speed signal line (353).

[0154] According to one embodiment of the present disclosure, the at least one first conductive line (340) corresponding to the ground line (340) may include a first pad portion (341) connected to the bridge (380).

[0155] According to one embodiment of the present disclosure, the at least one first conductive line (340) may include a first line portion (343) extending from the first pad portion (341).

[0156] According to one embodiment of the present disclosure, the width of the first pad portion (341) may be greater than the width of the first line portion (343).

[0157] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second pad portion (411, 421) connected to the bridge (380).

[0158] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second line portion (413, 423) extending from the second pad portion (411, 421).

[0159] According to one embodiment of the present disclosure, the width of the second pad portion (411, 421) may be greater than the width of the second line portion (413, 423).

[0160] According to one embodiment of the present disclosure, in the longitudinal direction of the at least one first conductive line (340) corresponding to the ground line (340) and the second conductive line (410, 420), the first pad portion (341) and the second pad portion (411, 421) may be spaced apart from each other.

[0161] According to one embodiment of the present disclosure, the bridge (380) is disposed on the cover layer (S1) and can be spaced apart from the conductive pattern (P) by the cover layer (S1).

[0162] According to one embodiment of the present disclosure, the at least one first conductive line (330, 340) may include a first-1 pad portion (341) and a first-2 pad portion (342) connected to the bridge (1380).

[0163] According to one embodiment of the present disclosure, the at least one first conductive line (330, 340) may include a first line portion (343) located between the first-1 pad portion (341) and the first-2 pad portion (342).

[0164] According to one embodiment of the present disclosure, the first line portion (343) can connect the first-1 pad portion (341) and the first-2 pad portion (342).

[0165] According to one embodiment of the present disclosure, the width of the first-1 pad portion (341) and the first-2 pad portion (342) may be greater than the width of the first line portion (343).

[0166] According to one embodiment of the present disclosure, the second conductive line (410, 420) may include a second-1 pad portion (411, 421) and a second-2 pad portion (412, 422) connected to the bridge (1380).

[0167] According to one embodiment of the present disclosure, the second conductive line (410, 420) may be located between the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422).

[0168] According to one embodiment of the present disclosure, the second line portion (413, 423) can connect the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422).

[0169] A flexible printed circuit board in which the width of the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422) is greater than the width of the second line portion (413, 423).

[0170] According to one embodiment of the present disclosure, the length of the second conductive line (410, 420) may be shorter than the length of the first conductive line (330, 340, 350) connecting the first contact (360) and the second contact (370).

[0171] According to one embodiment of the present disclosure, an electronic device (101) may include a housing (210) forming at least a portion of the exterior of the electronic device (101), a first electronic component and a second electronic component disposed inside the housing (210), and a flexible printed circuit board (300) disposed inside the housing (210) and connecting the first electronic component and the second electronic component.

[0172] According to one embodiment of the present disclosure, the conductive pattern (P) of the electronic device (101) may include a plurality of first conductive lines (330, 340, 350) that each connect the plurality of first contacts (360) and the plurality of second contacts (370), and may include a plurality of first conductive lines (330, 340, 350) including a signal line (353) and a first ground line (340).

[0173] According to one embodiment of the present disclosure, a conductive pattern (P) of an electronic device (101) may include a second ground line (410) that extends side by side with the signal line (353) and is not directly connected to the plurality of first contacts (360) and the plurality of second contacts (370).

[0174] According to one embodiment of the present disclosure, the conductive pattern (P) of the electronic device (101) may include a third ground line (420) that is connected to the bridge (380) and is not directly connected to the plurality of first contacts (360) and the plurality of second contacts (370), and extends side by side with the signal line (353).

[0175] According to one embodiment of the present disclosure, the signal line (353) may be extended between the second ground line (410) and the third ground line (420).

[0176] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of this document.

Claims

1. In a flexible printed circuit board (300), A first area (A1) in which a plurality of first contact points (360) are arranged; A second area (A2) in which a plurality of second contact points (370) are arranged; and It includes a third region (A3) positioned between the first region (A1) and the second region (A2), and The third region (A3) of the flexible printed circuit board (300) is: Base layer (B); As a conductive pattern (P) disposed on one side (BS1) of the above substrate layer (B): A plurality of first conductive lines (330, 340, 350) comprising a first section (P1, Q1, R1) extending from the plurality of first contacts (360), a second section (P2, Q2, R2) extending from the plurality of second contacts (370), and a third section (P3, Q3, R3) disposed between the first section (P1, Q1, R1) and the second section (P2, Q2, R2); and A conductive pattern (P) comprising a second conductive line (410, 420) disposed between the third sections (P3, Q3, R3) of two adjacent first conductive lines (353, 354, 355) among the plurality of first conductive lines (330, 340, 350) and not directly connected to the plurality of first contacts (360) and the plurality of second contacts (370), and The spacing between the third sections (P3, Q3, R3) of the two adjacent first conductive lines (353, 354, 355) is greater than the spacing between the first sections (P1, Q1, R1) of the two adjacent first conductive lines (353, 354, 355) and / or the spacing between the second sections (P2, Q2, R2) of the two adjacent first conductive lines (353, 354, 355). A flexible printed circuit board in which at least one of the plurality of first conductive lines (330, 340, 350) corresponds to a ground line (340) and is electrically connected to the second conductive lines (410, 420) through a bridge (380).

2. In Paragraph 1, The conductive pattern (P) is a flexible printed circuit board disposed on one of two opposite sides (BS1, BS2) of the substrate layer (B), specifically on side (BS1).

3. In Paragraph 2, The above flexible printed circuit board (300) is, A flexible printed circuit board comprising a single signal layer including a conductive pattern (P) configured to transmit electrical signals.

4. In any one of paragraphs 1 to 3, A flexible printed circuit board in which at least one of the two adjacent first conductive lines (353, 354, 355) of the third section (P3, Q3, R3) extends parallel to the second conductive line (410, 420) after being bent from the first section (P1, Q1, R1) and / or the second section (P2, Q2, R2) to bypass the second conductive line (410, 420).

5. In any one of paragraphs 1 through 4, The above second conductive lines (410, 420) are, It includes a second-1 conductive line (410) and a second-2 conductive line (420) that are substantially parallel to each other, The two adjacent first conductive lines (353, 354, 355) are, A flexible printed circuit board comprising a signal line (353) disposed between the second-1 conductive line (410) and the second-2 conductive line (420) and configured to transmit an electrical signal.

6. In any one of paragraphs 1 through 5, The above plurality of first conductive lines (330, 340, 350) are: At least one power line (330); A plurality of high-speed signal lines (351, 353, 354, 355) spaced apart from the above at least one power line (330); A plurality of low-speed signal lines (352) located between the plurality of high-speed signal lines (351) and the at least one power line (330); and It includes at least one ground line (340) located between the plurality of high-speed signal lines (351, 353), and The above second conductive lines (410, 420) are, A flexible printed circuit board extended parallel to the high-speed signal line (353) above.

7. In any one of paragraphs 1 through 6, The at least one first conductive line (340) corresponding to the ground line (340) is: A first pad portion (341) connected to the above bridge (380); and It includes a first line portion (343) extending from the first pad portion (341), and A flexible printed circuit board in which the width of the first pad portion (341) is greater than the width of the first line portion (343).

8. In Paragraph 7, The above second conductive lines (410, 420) are, A second pad portion (411, 421) connected to the above bridge (380); and It includes a second line portion (413, 423) extending from the second pad portion (411, 421), and A flexible printed circuit board in which the width of the second pad portion (411, 421) is greater than the width of the second line portion (413, 423).

9. In Paragraph 8, A flexible printed circuit board in which the first pad portion (341) and the second pad portion (411, 421) are spaced apart from each other in the longitudinal direction of the at least one first conductive line (340) and the second conductive line (410, 420) corresponding to the ground line (340).

10. In any one of paragraphs 1 through 9, It further includes a cover layer (S1) covering the conductive pattern (P) above, and The above bridge (380) is, A flexible printed circuit board disposed on the cover layer (S1) and spaced apart from the conductive pattern (P) by the cover layer (S1).

11. In any one of paragraphs 1 through 10, The above at least one first conductive line (330, 340) is: A first-1 pad portion (341) and a first-2 pad portion (342) connected to the above bridge (1380); and It includes a first line portion (343) located between the first-1 pad portion (341) and the first-2 pad portion (342) and connecting the first-1 pad portion (341) and the first-2 pad portion (342). A flexible printed circuit board in which the width of the first-1 pad portion (341) and the first-2 pad portion (342) is greater than the width of the first line portion (343).

12. In any one of paragraphs 1 through 11, The above second conductive lines (410, 420) are, A second-1 pad portion (411, 421) and a second-2 pad portion (412, 422) connected to the above bridge (1380); and It includes a second line portion (413, 423) located between the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422), and connecting the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422). A flexible printed circuit board in which the width of the second-1 pad portion (411, 421) and the second-2 pad portion (412, 422) is greater than the width of the second line portion (413, 423).

13. In any one of paragraphs 1 through 12, A flexible printed circuit board in which the length of the second conductive line (410, 420) is shorter than the length of the first conductive line (330, 340, 350) connecting the first contact (360) and the second contact (370).

14. In any one of paragraphs 1 through 13, The grounding line (340) forms a grounding area between the plurality of first contacts (360) and the plurality of second contacts (370) together with the second conductive line (410, 420) of the flexible printed circuit board.

15. In any one of paragraphs 1 through 14, The flexible printed circuit board (300) includes a bending section and an extension section extending from the bending section, and the bridge (380) is a flexible printed circuit board located in the extension section of the flexible printed circuit board (300).

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