Electronic device

Abstract

The present application relates to the technical field of structures. Provided in the present application is an electronic device, comprising: a housing, the housing enclosing an accommodating chamber, and the housing being provided with at least one through hole; a circuit board, the circuit board being arranged in the accommodating chamber, the circuit board comprising a substrate and a plurality of electronic components arranged on the surface of the substrate, the plane where the substrate is located dividing the accommodating chamber into a first chamber and a second chamber, the at least one through hole of the housing being communicated with the second chamber, and the substrate consisting of a first portion and a second portion that surrounds the outer side of the first portion; and a connecting part, the connecting part sealingly connecting the second portion of the substrate and the chamber wall of the accommodating chamber. At least some of the electronic components of the plurality of components are arranged on the surface of the substrate facing the first chamber. The present application can have good waterproof performance while maintaining a light and thin structure.

Description

Electronic device

[0001] The present application claims priority to the Chinese patent application No. 202411313567.4 filed on September 19, 2024, and entitled "Electronic device", the whole content of the above application is incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of structure, in particular to an electronic device. BACKGROUND

[0003] Compared with in-ear earphones, open earphones can reduce the pressure on the ear canal and avoid potential health risks. In addition, open earphones allow ambient sounds to enter the ear, so that the user can still perceive the ambient sounds when listening to music or talking using the open earphones, which is very useful in outdoor activities or scenarios that require environmental awareness (e.g., when crossing a zebra crossing).

[0004] However, since the sound emitting unit of the open earphone is far away from the ear canal, a sound emitting unit with a larger amplitude needs to be used, which makes the sound hole and the back vent area of the open earphone significantly increase. In order to ensure the air flow of the earphone, the sound hole and the back vent are provided with a sound net with a larger hole area. In this way, external liquids or water vapor can easily enter the main board inside the earphone through the back vent, causing corrosion to the electronic components on the main board. SUMMARY

[0005] Some embodiments of the present application provide an electronic device for improving the waterproof performance of the electronic device.

[0006] In a first aspect, the present application provides an electronic device, which includes a housing, a circuit board and a connecting part. The housing encloses a receiving cavity, and the circuit board is arranged in the receiving cavity. The circuit board includes a substrate and a plurality of electronic components arranged on the surface of the substrate, and the plane of the substrate divides the receiving cavity into a first chamber and a second chamber. At least part of the plurality of electronic components is arranged on the surface of the substrate facing the first chamber. In addition, at least one through hole is formed in the housing, and the at least one through hole is in communication with the second chamber. Furthermore, the substrate is composed of a first part and a second part surrounding the outside of the first part (i.e., the first part can be understood as the central part of the substrate, and the second part can be understood as the edge part of the substrate). The connecting part sealingly connects the second part of the substrate and the cavity wall of the receiving cavity.

[0007] According to the embodiment of the present application, the accommodating cavity enclosed by the shell is divided into a first chamber and a second chamber by the plane where the substrate is located. The surface of the substrate facing the first chamber is provided with at least part of the electronic components of the circuit board, and it can be understood that the at least part of the electronic components is located in the first chamber. In addition, since the at least one through hole on the shell is in communication with the second chamber, external water vapor can enter the second chamber through the at least one through hole. In order to prevent the water vapor in the second chamber from further entering the first chamber and corroding the electronic components in the first chamber, the electronic device further comprises a connecting portion which can be sealingly connected to the edge portion of the substrate and the cavity wall of the accommodating cavity, so that the connecting portion and the substrate can jointly form a sealing structure which can block the communication channel between the first chamber and the second chamber. That is, the sealing structure jointly formed by the connecting portion and the substrate can block the spread of water vapor in the second chamber to the first chamber, thereby waterproofing the electronic components in the first chamber.

[0008] In addition, since the sealing structure is formed by the structure of the substrate itself in the embodiment of the present application, it is not necessary to additionally provide a waterproof structure covering the entire connecting channel, thereby reducing the thickness and weight of the electronic device.

[0009] In some embodiments, the connecting portion is located in the first chamber. In the embodiment of the present application, the connecting portion is multiplexed with the electronic components in the first chamber at the same height, which is beneficial to further reduce the thickness of the electronic device.

[0010] In some embodiments, the cavity wall of the first chamber comprises a top wall and a side wall, and the top wall and the substrate are oppositely arranged along the height direction of the first chamber. The connecting portion comprises an annular block arranged between the top wall of the first chamber and the substrate, and the annular block extends along the periphery of the substrate. The bottom surface of the annular block is sealingly connected to the second portion of the substrate. In addition, the side surface of the annular block is sealingly connected to the side wall of the first chamber, or the top surface of the annular block is sealingly connected to the top wall of the first chamber.

[0011] According to the embodiment of the present application, the sealing connection between the second portion of the substrate and the cavity wall of the accommodating cavity is realized by the annular block, which can realize the sealing connection between the second portion of the substrate and the cavity wall of the accommodating cavity with a smaller volume, so that the structure of the electronic device is relatively simple and compact.

[0012] In some embodiments, the shell comprises a first shell and a second shell, and the second shell comprises a first opening, and the first shell is located in the first opening. The first shell forms the top wall of the first chamber, and the second shell forms the side wall of the first chamber. In addition, the top surface of the annular block is sealingly connected to the top wall of the first chamber.

[0013] According to the embodiment of the present application, the annular block can not only be used for sealing the first chamber, but also can be used as a bearing surface of the first shell, which is beneficial to simplify the structure of the electronic device.

[0014] In some embodiments, the side surface of the annular block is integrally connected with the side wall of the first chamber. The embodiments of the present application not only simplify the forming method of the annular block, but also realize reliable sealing connection between the annular block and the side wall of the first chamber.

[0015] In some embodiments, the shell comprises a first shell and a second shell. The second shell comprises a barrel and an extension. The extension is connected with the inner wall of the barrel and extends along the radial direction of the barrel. The extension and the base plate are oppositely arranged along the height direction. The first shell is located on the side of the extension away from the base plate. The first shell and the extension jointly form the top wall of the first chamber. The main body of the middle shell forms the side wall of the first chamber.

[0016] According to the embodiments of the present application, the second shell is provided with the extension. The strength of the second shell itself is improved. The extension serves as a bearing structure of the first shell. The connection strength between the first shell and the second shell is improved. The overall strength of the shell is improved.

[0017] In some embodiments, the top surface of the annular block is sealingly connected with the bottom surface of the extension. According to the embodiments of the present application, in addition to forming a seal between the bottom surface of the annular block and the base plate, a seal is also formed between the top surface of the annular block and the extension. The sealing path is prolonged. The sealing performance is improved.

[0018] In some embodiments, the first shell is sealingly connected with the extension. The embodiments of the present application are conducive to preventing external water vapor from entering the first chamber.

[0019] In some embodiments, the shell comprises a first shell and a second shell. The second shell comprises a barrel and an extension. The extension is arranged on the inner wall of the barrel around the axis of the barrel. The extension forms a second opening around the axis of the barrel. The first shell is located in the second opening. The first shell and the extension jointly form the top wall of the first chamber. The barrel forms the side wall of the first chamber. The top surface of the annular block comprises a first region and a second region surrounding the outside of the first region. The second region of the top surface of the annular block is sealingly connected with the extension.

[0020] According to the embodiments of the present application, the annular block not only can be used for sealing the first chamber, but also can serve as a bearing structure of the second shell. The structure of the electronic device is simplified.

[0021] In some embodiments, the first region of the top surface is integrally connected with the first shell. The embodiments of the present application not only simplify the forming method of the annular block, but also realize reliable sealing connection between the annular block and the side wall of the first chamber.

[0022] In some embodiments, the at least part of the electronic components of the circuit board comprises at least one of a chip, a gyroscope, a capacitor or an inductor. The embodiments of the present application can realize waterproof protection for important electronic components on the circuit board.

[0023] In some embodiments, the test contact of the circuit board is arranged on the surface of the substrate facing the second cavity. The embodiments of the present application move the test contact to the surface of the substrate facing the second cavity, which can free up more layout space on the surface of the substrate facing the first cavity, so as to arrange more important electronic components in the first cavity.

[0024] In some embodiments, a loudspeaker is arranged in the second cavity; the second cavity comprises a front cavity and a rear cavity, the front cavity is located between the diaphragm of the loudspeaker and the bottom wall of the accommodating cavity, and the rear cavity is located between the diaphragm of the loudspeaker and the substrate; wherein at least one through hole is arranged on the side wall of the rear cavity. In the embodiments of the present application, the through hole is arranged on the side wall of the rear cavity, so that external air can enter the rear cavity through the through hole during the sound production of the loudspeaker, so as to maintain the air pressure balance in the second cavity.

[0025] In some embodiments, the loudspeaker is electrically connected to the surface of the substrate facing the second cavity, so that the electrical connection between the loudspeaker and the circuit board can be realized without affecting the sealing effect of the first cavity.

[0026] In some embodiments, the loudspeaker is electrically connected to the surface of the substrate facing the second cavity through a flexible circuit board or a spring needle.

[0027] In some embodiments, the flexible circuit board is electrically connected to the surface of the substrate facing the second cavity through welding. Since the welding method can realize the electrical connection between the flexible circuit board and the circuit board with a smaller thickness, it is beneficial to the thinness of the electronic device.

[0028] In some embodiments, the flexible circuit board is electrically connected to the surface of the substrate facing the second cavity through a board-to-board connector, so as to simplify the electrical connection process between the flexible circuit board and the substrate.

[0029] In some embodiments, the electronic device comprises an ear hook connected to the housing. For example, the electronic device can be an open earphone. For the open earphone, external liquid or water vapor is easy to enter the inside of the earphone through the rear vent hole, so the open earphone has a higher requirement for the waterproof structure. In the embodiments of the present application, the first cavity can be effectively sealed by using the structure of the substrate itself, so as to reliably protect the electronic components in the first cavity, which can be applied to devices with higher waterproof requirements such as open earphones. BRIEF DESCRIPTION OF DRAWINGS

[0030] FIG. 1 is an exemplary structural diagram of an open earphone provided by the embodiments of the present application;

[0031] FIG. 2 is an exemplary structural diagram of an electronic device in some embodiments;

[0032] FIG. 3A is an exemplary structural diagram of an electronic device in some embodiments of the present application;

[0033] FIG. 3B is a distribution diagram of a first region and a second region of a substrate in some embodiments of the present application;

[0034] FIG. 3C is a diagram of a sealing structure in some embodiments of the present application;

[0035] FIG. 3D is a diagram of a connection structure in some embodiments of the present application;

[0036] FIG. 4A is an exemplary structural diagram of an electronic device in some embodiments of the present application;

[0037] FIG. 4B is a diagram of a middle shell structure in some embodiments of the present application;

[0038] FIG. 5A is an exemplary structural diagram of an electronic device in some embodiments of the present application;

[0039] FIG. 5B is a distribution diagram of a first region and a second region of a top surface of a ring-shaped block in some embodiments of the present application;

[0040] FIG. 6 is a diagram of a connection structure in some embodiments of the present application;

[0041] FIG. 7 is a diagram of a speaker arrangement in some embodiments of the present application;

[0042] FIG. 8 is a diagram of an electrical connection between a speaker and a main board in some embodiments of the present application;

[0043] FIG. 9 is a diagram of an electrical connection between a speaker and a main board in some embodiments of the present application;

[0044] FIG. 10A is a diagram of a main board arrangement in some embodiments of the present application;

[0045] FIG. 10B is an exemplary structural diagram of an electronic device in some embodiments of the present application;

[0046] FIG. 10C is an exemplary structural diagram of an electronic device in some embodiments of the present application. DETAILED DESCRIPTION

[0047] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0048] Embodiments of the present application are used to provide an electronic device which can have good waterproof performance while maintaining thin structure. The electronic device can be an open earphone, an in-ear earphone, a watch, a walkie-talkie, a POS machine, a virtual reality device, smart glasses, a helmet, a gamepad, a music player, a handheld device, etc., which is not limited in the present application.

[0049] Hereinafter, the open earphone is taken as an example of the electronic device to introduce the technical solutions of the present application.

[0050] Referring to FIG. 1, the earphone 100 includes a main body 101 and an ear hook 102. The main body 101 is the main functional unit of the earphone 100, for example, the main body 101 is provided with a speaker for the earphone 100 to produce sound, a mainboard for providing the speaker with an audio signal, a power supply for powering the speaker, etc. The ear hook 102 is used to wear the main body 101 of the earphone 100 on the user's ear. When the earphone 100 is worn on the user's ear, the sound outlet hole 51 on the main body 101 of the earphone 100 can be directed towards the user's ear canal, so that the user can clearly hear the sound played by the earphone 100. When the earphone 100 is worn on the user's ear, the main body 101 can be located outside the user's ear canal to reduce the pressure on the user's ear canal. For example, when the earphone 100 is worn on the user's ear, the main body 101 can be a distance away from the entrance of the user's ear canal, for example, 0.5cm-2cm.

[0051] It can be understood that FIG. 1 is only an exemplary structure of the earphone 100. In other examples, the earphone 100 can include more or fewer components. For example, in other embodiments, the earphone 100 can be a headset, etc.

[0052] In each of the figures herein, the X direction can be the length direction of the earphone main body 101, the Y direction can be the width direction of the earphone main body 101, and the Z direction can be the height direction (or thickness direction) of the earphone main body 101. The X direction, the Y direction and the Z direction can be perpendicular to each other.

[0053] In addition, the direction indicated by the positive direction of the Z axis is "top" or "up", and the opposite direction is "bottom" or "down". In some embodiments, the negative direction of the Z axis can be the sound outlet direction of the earphone.

[0054] It can be understood that the mutual perpendicularity in the present application is not absolute perpendicularity, and the approximate perpendicularity (for example, the included angle between two structural features is 89.9°) caused by processing errors and assembly errors is also within the range of mutual perpendicularity in the present application. The mutual parallelism in the present application is not absolute parallelism, and the approximate parallelism (for example, the included angle between two structural features is 0.1°) caused by processing errors and assembly errors is also within the range of mutual parallelism in the present application. The definition of mutual parallelism and mutual perpendicularity hereinafter will not be repeated.

[0055] In addition, it should be noted that the orientation terms such as "upper", "lower", "left", "right", "front", "back", "top", "bottom" and the like herein are exemplary orientations of the earphone and its components, and are not intended to indicate or imply that the components referred to must have a particular orientation, which can be changed accordingly according to actual use, and cannot be understood as a limitation on the present application.

[0056] Fig. 2 shows a structural diagram of the main body 101 of the earphone 100 in some embodiments. Referring to Fig. 2, the main body 101 of the earphone 100 includes a shell 10, a main board 30 and a loudspeaker 40. The shell 10 has an accommodation cavity 20 formed inside, and the main board 30 and the loudspeaker 40 are arranged in the accommodation cavity 20. The shell 10 is provided with a sound outlet hole 51 and a back vent hole 52. The sound waves emitted by the loudspeaker 40 can be transmitted to the outside of the main body 101 through the sound outlet hole 51, and the air from the outside can enter the inside of the main body 101 through the back vent hole 52. By providing the back vent hole 52, the balance of the air pressure inside the main body 101 can be maintained.

[0057] It can be understood that the water vapor and the like from the outside will enter the accommodation cavity 20 through the back vent hole 52. In order to avoid the water vapor entering the accommodation cavity 20 from corroding the electronic components on the main board 30, a waterproof support 60a is further arranged in the accommodation cavity 20. The waterproof support 60a covers the entire cross section (cross section perpendicular to the z direction) of the accommodation cavity 20 and is sealingly connected with the cavity wall of the accommodation cavity 20, so as to divide the accommodation cavity 20 into a first chamber 21 and a second chamber 22 which are not in communication with each other. The main board 30 and the loudspeaker 40 are respectively located in the first chamber 21 and the second chamber 22. In this way, the water vapor entering the second chamber 22 through the back vent hole 52 will not enter the first chamber 21, so that the electronic components on the main board 30 can be protected from water.

[0058] In the embodiment shown in Fig. 2, in order to protect the electronic components on the main board 30 from water, an additional waterproof support 60a covering the entire cross section of the accommodation cavity 20 is needed, which will increase the thickness and weight of the earphone 100. In addition, since the loudspeaker 40 needs to be electrically connected with the main board 30 through a connecting wire, a via hole for passing the connecting wire needs to be formed on the waterproof support 60a, which brings a challenge to the waterproof reliability of the electronic components on the main board 30.

[0059] Therefore, the embodiments of the present application provide a structure of an earphone 100, which can achieve waterproof protection of the electronic components on the main board while maintaining the thinness of the main body of the earphone 100.

[0060] FIG. 3A shows a structural schematic diagram of the main body 101 of the earphone 100 according to an embodiment of the present application, specifically, a cross-sectional view along A-A of FIG. 1. Referring to FIG. 3A, the main body 101 of the earphone 100 can include a housing 10, a circuit board 30, and a speaker 40. In this embodiment, the circuit board 30 is a main board of the earphone 100, and thus, the circuit board 30 is referred to as a main board 30 hereinafter. In other embodiments, the circuit board 30 can not be a main board, but can be a communication board, a power control board, or the like of the earphone 100, which is not limited in the present application.

[0061] The housing 10 can enclose a receiving cavity 20. The receiving cavity 20 can accommodate electronic devices such as the main board 30, the speaker 40 (not shown), a microphone (not shown), a power supply (not shown), and the like. The material of the housing 10 can be plastic, metal, alloy, or the like, which is not limited in the present application. It can be understood that the housing 10 can form cavity walls of the receiving cavity 20, wherein the top wall 20a of the receiving cavity 20 is located at the top of the receiving cavity 20, the bottom wall 20b of the receiving cavity 20 is located at the bottom of the receiving cavity 20, and the side wall 20c of the receiving cavity 20 is located between the top wall 20a and the bottom wall 20b.

[0062] In this embodiment, the housing 10 can include an upper housing 11 (as a first housing), a middle housing 12 (as a second housing), and a lower housing 13 which are independent in structure. Along the Z direction, the upper housing 11 and the lower housing 13 are located on opposite sides of the middle housing 12. That is, the upper housing 11 covers the upper side of the middle housing 12, and the lower housing 13 covers the lower side of the middle housing 12. The upper housing 11 and the middle housing 12, and the middle housing 12 and the lower housing 13 can be fixedly connected by bonding, clamping, interference fitting, or the like. In other embodiments, the housing 10 can also have other arrangements, for example, the upper housing 11 and the middle housing 12 can be integrated, or the middle housing 12 and the lower housing 13 can be integrated, and the like.

[0063] The main board 30 includes a substrate 31 and a plurality of electronic components 32 arranged on the surface of the substrate 31. The substrate 31 can have a flat plate structure. For example, the substrate 31 can be arranged horizontally, i.e., the substrate 31 is perpendicular to the Z direction. In other examples, the substrate 31 can also be inclined to a certain extent, for example, the substrate 31 can form an angle of 30° with the horizontal plane (i.e., the X-Y plane), and the like. In addition, the substrate 31 can be in contact with the side wall 20c of the receiving cavity 20, or can have a certain spacing with the side wall 20c of the receiving cavity 20.

[0064] The plane P on which the substrate 31 is located can divide the receiving cavity 20 into a first chamber 21 and a second chamber 22 from top to bottom, i.e., the first chamber 21 is located above the second chamber 22. It can be understood that the top wall 20a of the receiving cavity 20 is arranged opposite to the substrate 31 along the Z direction, and the bottom wall 20b of the receiving cavity 20 is arranged opposite to the substrate 31 along the Z direction.

[0065] The substrate 31 includes a surface 311 and a surface 312 arranged opposite to each other along the Z direction. The surface 311 faces the first chamber 21, and the surface 312 faces the second chamber 22. The plane P can be the surface 311, or the surface 312, or any plane between the surface 311 and the surface 312, for example, a plane having the same distance from the surface 311 and the surface 312, etc., which is not limited in the present application.

[0066] The electronic components 32 on the surface of the substrate 31 can include chips, gyroscopes, resistors, capacitors, inductors, diodes, transistors, sensors, test contacts, crystal oscillators, transformers, switches, etc., which are not limited in the present application. The substrate 31 can be a printed circuit board (PCB), which can include an insulating medium plate and a trace arranged in the insulating medium plate, and the electronic components 32 on the surface of the substrate 31 can be electrically connected through the trace in the substrate 31.

[0067] In the embodiment, the main board 30 adopts a single-sided layout, that is, the electronic components 32 of the main board 30 are arranged on the surface 311 of the substrate 31. In this way, the electronic components 32 of the circuit board are all located in the first chamber 21. It can be understood that, in order to accommodate the electronic components 32 on the surface 311 of the substrate 31, the first chamber 21 needs to have a certain height H1. The speaker 40 of the earphone 100 is arranged in the second chamber 22. The speaker 40 is a sound generating device of the earphone 100. After receiving an audio signal, the diaphragm 41 of the speaker 40 generates vibration corresponding to the audio signal, and the diaphragm 41 can push the air to generate pressure waves when vibrating, so as to emit sound. Exemplarily, the speaker 40 can be electrically connected with the main board 30 to receive the audio signal from the main board 30.

[0068] The shell 10 is provided with a sound outlet hole 51, and the pressure waves generated by the diaphragm 41 can be transmitted to the outside through the sound outlet hole 51, so that the user can hear the sound emitted by the speaker 40. In addition, the shell 10 can also be provided with a back vent hole 52, and the external airflow can enter the second chamber 22 through the back vent hole 52 to maintain the balance of the air pressure in the second chamber 22. The sound outlet hole 51 and the back vent hole 52 can be covered with a sound mesh 53 and a sound mesh 54, respectively.

[0069] For the open earphone 100, the amplitude of the diaphragm 41 is larger, which makes the areas of the sound outlet hole 51 and the back vent hole 52 increase significantly. In order to ensure the air flow of the earphone 100, the hole areas of the sound mesh 53 and the sound mesh 54 are also larger. In this way, external liquids or water vapor, etc. are more likely to enter the first chamber 21 through the back vent hole 52. When the external liquids or water vapor enter the first chamber 21, they can cause corrosion to the electronic components 32 of the main board 30.

[0070] In order to prevent external liquid or water vapor from entering into the first chamber 21, the earphone 100 is further provided with a sealing structure 60. The sealing structure 60 is used to block the communication passage between the first chamber 21 and the second chamber 22. That is, by arranging the sealing structure 60, water vapor in the first chamber 21 can be prevented from entering into the second chamber 22, so as to provide waterproof protection for the electronic components 32 on the main board 30.

[0071] In the embodiment of the present application, the sealing structure 60 is formed by the main board 31 and the connecting portion 61. The following will be described in detail in combination with FIG. 3B and FIG. 3C. FIG. 3B is a top view of the main board 30, and FIG. 3C is a partial view of FIG. 3A. In order to facilitate observation, FIG. 3B shows the projection of the connecting portion 61 on the main board 31 along the Z direction by using a shaded area.

[0072] Referring to FIG. 3B, the main board 31 is composed of a first portion 313 and a second portion 314 which surrounds the first portion 313. In order to facilitate observation, FIG. 3B shows the boundary line between the first portion 313 and the second portion 314 by using a dashed line L1. In addition, the first portion 313 can also be referred to as the central portion 313 of the main board 31, and the second portion 314 can also be referred to as the edge portion 314 of the main board 31. The width w1 of each position of the edge portion 314 can be the same or different.

[0073] Referring to FIG. 3C, the communication passage 70 between the first chamber 21 and the second chamber 22 can be composed of a region 71 and a region 72 which surrounds the region 71. The central portion 313 of the main board 31 can cover the region 71, and the connecting portion 61 can seal the connection between the edge portion 314 of the main board 31 and the cavity wall of the accommodating cavity 20. Therefore, the connecting portion 61 and the edge portion 314 of the main board 31 can cover the region 72. In this way, the main board 31 and the connecting portion 61 can jointly cover the entire cross-sectional area of the communication passage 70 (i.e., the region 71 plus the region 72). That is, the main board 31 and the connecting portion 61 can jointly form the sealing structure 60 for blocking the communication passage 70 between the first chamber 21 and the second chamber 22, so as to provide waterproof protection for the components (for example, the electronic components 32 arranged on the surface 311 of the main board 31) in the first chamber 21. For the sake of continuity of the description, the specific structure of the connecting portion 61 will be described below.

[0074] That is, in the embodiment, the sealing structure 60 is formed by using the structure of the main board 31 itself, so as to provide waterproof protection for the electronic components 32 of the main board 30. Compared with the scheme shown in FIG. 2, it is not necessary to additionally arrange a waterproof support 60a which covers the entire communication passage 70, so as to reduce the thickness and weight of the main body 101 of the earphone 100.

[0075] Exemplarily, the electronic components 32 of the main board 30 can be arranged on the central portion 313 of the substrate 31, i.e., the central portion 313 can be understood as the effective layout area of the main board 30. The area ratio of the edge portion 314 to the central portion 313 can be 0.1 to 0.3. Through this arrangement, not only does the substrate 31 have a larger layout area, but the layout space requirement of the connecting portion 61 can also be met. In addition, the projection of the connecting portion 61 on the substrate 31 in the Z direction does not overlap the central portion 313 of the substrate 31, i.e., the connecting portion 61 is located outside the radial direction (R direction shown in FIG. 3B) of the central portion 313 of the substrate 31.

[0076] Further, the connecting portion 61 can be arranged in the first cavity 21, so that the connecting portion 61 can share the same height H1 as the electronic components 32 of the main board 30. That is, the waterproof solution of the present embodiment does not need to additionally increase the thickness of the earphone 100 body 101, which is conducive to the thinning of the earphone 100.

[0077] In addition, in the present embodiment, the main board 30 adopts a single-sided layout manner, which can save the height of one layer of electronic components 32 compared with a double-sided layout manner (i.e., a manner in which electronic components 32 are arranged on both surfaces 311 and 312 of the substrate 31), thereby further reducing the height of the earphone 100 body 101.

[0078] Referring to FIGS. 3B and 3C, in the present embodiment, the connecting portion 61 includes an annular block 611 arranged between the top wall 20a of the shell 10 and the substrate 31, and the annular block 611 is annular and extends along the peripheral edge 316 of the substrate 31. In the present embodiment, the cross section of the annular block 611 is rectangular. The cross section of the annular block 611 is a cross section perpendicular to the circumferential direction (C direction shown in FIG. 3B) of the annular block 611. In other embodiments, the cross section of the annular block 611 can also be trapezoidal, drum-shaped or other shapes. The cross section dimensions of each part of the annular block 611 can be the same to simplify the manufacturing process. In other embodiments, the cross section dimensions of each part of the annular block 611 can also be different. In addition, the annular block 611 can be a solid structure, for example, the cross section of the annular block 611 is a solid rectangle; the annular block 611 can also be a hollow structure, for example, the cross section of the annular block 611 is a hollow frame.

[0079] In the present embodiment, the annular block 611 realizes the sealed connection between the edge portion 314 of the substrate 31 and the cavity wall of the accommodating cavity 20, which can realize the sealed connection between the edge portion 314 of the substrate 31 and the cavity wall of the accommodating cavity 20 with a smaller volume, so that the electronic device structure is relatively simple and compact.

[0080] The bottom surface 611b of the annular block 611 is sealingly connected to the edge portion 314 of the substrate 31 (hereinafter, the connection is referred to as "connection C1"). In addition, the side surface 611c of the annular block 611 is sealingly connected to the side wall 20c of the first chamber 21 (hereinafter, the connection is referred to as "connection C2"), and / or the top surface 611a of the annular block 611 is sealingly connected to the top wall 20a of the accommodation cavity 20 (hereinafter, the connection is referred to as "connection C3"). It can be understood that the top wall 20a of the first chamber 21 is also the top wall 20a of the accommodation cavity 20, and the side wall 20c of the first chamber 21 is also the side wall 20c of the accommodation cavity 20, which will not be distinguished hereinafter.

[0081] In addition, in the embodiments of the present application, the sealing connection between the two components can be sealing glue connection, sealing compression ring connection, integral connection, compression connection, welding, threaded sealing connection, etc., which is not limited in the present application. Hereinafter, the sealing glue connection or the integral connection is taken as an example of the sealing connection.

[0082] Through one of the connection C2 and the connection C3, and the connection C1, the sealing connection between the edge portion 314 of the substrate 31 and the cavity wall of the accommodation cavity 20 can be achieved. The following introduces several exemplary setting modes of the connection portion 61.

[0083] (1) First example of the connection portion 61

[0084] Referring to FIGS. 3A and 3C, in the present example, the middle shell 12 can include an opening 12a (as a first opening), and the upper shell 11 is located in the opening 12a. The upper shell 11 is used to form the top wall 20a of the first chamber 21, and the middle shell 12 is used to form the side wall 20c of the first chamber 21. Exemplarily, the middle shell 12 can be a cylinder body surrounding the axis SO, and the axis SO is an axis extending along the Z-axis direction.

[0085] The connection portion 61 includes an annular block 611 and a sealing glue 612. The annular block 611 is in an integral structure with the middle shell 12. That is, the side surface 611c of the annular block 611 is integrally connected to the side wall 20c of the first chamber 21. It can be understood that through the integral connection, the side surface 611c of the annular block 611 and the side wall 20c of the first chamber 21 naturally form a sealing connection (i.e., the connection C2). For ease of observation, the boundary between the annular block 611 and the middle shell 12 is shown by a dashed line in FIG. 3A.

[0086] The application does not limit the specific manner of the integral connection. For example, the annular block 611 and the middle shell 12 can be integrally formed injection molded parts, or the annular block 611 can be machined on the shell 10 blank by cutting machining. The manner of the integral connection will not be described below. In the embodiment, the annular block 611 is integrally connected with the middle shell 12, which not only can simplify the forming manner of the annular block 611, but also can realize reliable sealing connection between the annular block 611 and the side wall 20c of the first chamber 21.

[0087] The bottom surface 611b of the annular block 611 and the edge portion 314 of the base plate 31 are sealingly connected by the sealing glue 612 (i.e., connection C1). In the embodiment, the sealing glue can be hot melt glue or foam glue. In other embodiments, the sealing glue can also be pressure-sensitive glue, UV glue, or other material glue. The material of the sealing glue will not be described below.

[0088] It can be understood that through the connection C1 and the connection C2, the sealing connection between the edge portion 314 of the base plate 31 and the cavity wall of the accommodating cavity 20 can be realized.

[0089] In addition, in the example, the top surface 611a of the annular block 611 can also serve as a bearing surface of the upper shell 11. That is, the upper shell 11 can be mounted on the top surface 611a of the annular block 611. Exemplarily, the top surface 611a of the annular block 611 and the upper shell 11 can be sealingly connected by the sealing glue 81 to prevent external water vapor from entering the first chamber 21 through the gap between the upper shell 11 and the annular block 611.

[0090] In the assembly process of the earphone 100 body 101, the middle shell 12 can be first inverted, the bottom surface 611b of the annular block 611 is glued, and then the base plate 31 of the main board 30 is pressed on the bottom surface 611b of the annular block 611. After the glue on the bottom surface 611b of the annular block 611 is cured, the sealing glue 612 can be formed. Then, the middle shell 12 is upright, the top surface 611a of the annular block 611 is glued, and then the upper shell 11 is pressed on the top surface 611a of the annular block 611. After the glue on the top surface 611a is cured, the sealing glue 81 can be formed.

[0091] In addition, in the example, the annular block 611 and the middle shell 12 are an integral structure. The application is not limited thereto. In other examples, referring to FIG. 3D, the annular block 611 and the middle shell 12 can also be independent structures. In the example, the side surface 611c of the annular block 611 and the side wall 20c of the first chamber 21 can be connected by the sealing glue 89.

[0092] (2) Connection part 61 example two

[0093] FIG. 4A shows an exemplary structural diagram of the main body 101 of the earphone 100 provided in the present example, and FIG. 4B shows an exemplary structural diagram of the middle shell 12 provided in the present example (specifically, a D-D cross-sectional view of FIG. 4A). Referring to FIGS. 4A and 4B, in the present example, the middle shell 12 includes a barrel 121 and an extension 122 connected to the barrel 121. For ease of observation, FIG. 4B shows the boundary between the barrel 121 and the extension 122 with a dashed line. The barrel 121 is disposed around the axis SO. That is, the axis of the barrel 121 is the axis SO. Here, the axis SO is an axis extending in the Z direction.

[0094] The barrel 121 can be a body of revolution around the axis SO. In some embodiments, the barrel 121 can be a symmetric structure. For example, referring to FIG. 4A, the portion of the barrel 121 located on the left side of the axis SO and the portion of the barrel 121 located on the right side of the axis SO are symmetric about the axis SO. In some embodiments, the barrel 121 can be a rotationally symmetric structure, that is, the barrel 121 is rotationally symmetric about the axis SO. In this embodiment, the cross section (interface perpendicular to the Z axis direction) of the barrel 121 can be a circular ring shape. In other embodiments, the barrel 121 can also be an asymmetric structure.

[0095] The extension 122 is connected to the inner wall of the barrel 121 and extends in the radial direction (the R1 direction shown in FIG. 4B) of the barrel 121. The radial direction of the barrel 121 can be a direction parallel to the X-Y plane and intersecting the axis SO. Exemplarily, the extension 122 can be a ring-shaped plate structure parallel to the X-Y plane.

[0096] The extension 122 is disposed opposite the substrate 31 along the Z axis. Specifically, the extension 122 is located above the substrate 31. In addition, referring to FIG. 4A, the extension 122 can be spaced apart from the top end of the barrel 121 by a distance DO, that is, the barrel 121 can include a portion 1211 located above the extension 122.

[0097] The upper shell 11 is located on the side of the extension 122 away from the substrate 31, that is, the upper shell 11 is disposed above the extension 122. Specifically, the upper shell 11 can be located between the extension 122 and the portion 1211 of the barrel 121.

[0098] The barrel 121 of the middle shell 12 is used to form the side wall 20c of the first chamber 21, and the extension 122 and the upper shell 11 together form the top wall 20a of the first chamber 21. That is, the extension 122 forms a partial region of the top wall 20a of the accommodation cavity 20, and the upper shell 11 forms another partial region of the top wall 20a of the accommodation cavity 20.

[0099] In this example, the connecting portion 61 comprises a ring-shaped block 611, a sealant 612 and a sealant 613. The ring-shaped block 611 is a separate structure, i.e., the ring-shaped block 611 is neither integrally connected with the upper shell 11 nor integrally connected with the middle shell 12. The top surface 611a of the ring-shaped block 611 is sealingly connected with the bottom surface 611b of the extension portion 122 via the sealant 613 (i.e., the connection C3), and the bottom surface 611b of the ring-shaped block 611 is sealingly connected with the edge portion 314 of the substrate 31 via the sealant 612 (i.e., the connection C1).

[0100] It can be understood that, by the connection C1 and the connection C3, the edge portion 314 of the substrate 31 can be sealingly connected with the cavity wall of the accommodating cavity 20. In addition, the side surface 611c of the ring-shaped block 611 can be in abutment with the side wall 20c of the first chamber 21 or can have a certain gap therebetween.

[0101] In addition, in addition to forming a seal between the bottom surface 611b of the ring-shaped block 611 and the substrate 31, the present embodiment also forms a seal between the top surface 611a of the ring-shaped block 611 and the extension portion 122, which is conducive to prolonging the sealing path and improving the sealing performance.

[0102] In this example, the top surface of the extension portion 122 can also serve as a bearing surface of the upper shell 11. The top surface of the extension portion 122 and the upper shell 11 can be sealingly connected via the sealant 82 to prevent external moisture from entering the first chamber 21 through the gap between the upper shell 11 and the extension portion 122. In the present embodiment, the middle shell 12 is provided with the extension portion 122, which not only improves the strength of the middle shell 12 itself but also serves as a bearing structure of the upper shell 11, which is conducive to improving the connection strength between the upper shell 11 and the middle shell 12 and thus improving the overall strength of the shell 10.

[0103] For example, in the assembly process of the earphone 100 body 101, the top surface 611a of the ring-shaped block 611 and the bottom surface of the extension portion 122 can be connected via the sealant 613 first, then the edge portion 314 of the substrate 31 and the bottom surface 611b of the ring-shaped block 611 can be connected via the sealant 612, and finally the upper shell 11 and the top surface of the extension portion 122 of the middle shell 12 can be connected via the sealant 82.

[0104] (3) Connection portion 61 example three

[0105] FIG. 5A shows an exemplary structural diagram of the body 101 of the earphone 100 provided in the present example. Referring to FIG. 5A, in the present example, the middle shell 12 comprises a cylinder 121 and an extension portion 122 connected with the cylinder 121, and the cylinder 121 is arranged around the axis SO. The extension portion 122 is connected with the inner wall of the cylinder 121 and extends along the radial direction of the cylinder 121.

[0106] Different from Example Two, in the present example, the extension 122 can be located at the top end of the barrel 121. For example, the top surface 122a of the extension 122 and the top surface 121a of the barrel 121 are continuous surfaces.

[0107] Referring to FIG. 5A, the extension 122 can be provided on the inner wall of the barrel 121 and disposed around the axis S0 of the barrel 121. In the present example, the extension 122 can form an opening 122a (as the second opening) around the axis S0. Exemplarily, the extension 122 can be a ring-shaped plate structure parallel to the X-Y plane. Other details of the barrel 121 and the extension 122 can be referred to the description in Example Two, and will not be repeated here.

[0108] The upper shell 11 is provided in the opening 122a. It can be understood that the barrel 121 of the middle shell 12 is used to form the side wall 20c of the first chamber 21, and the extension 122 and the upper shell 11 jointly form the top wall 20a of the first chamber 22. That is, the extension 122 forms a partial area of the top wall 20a of the first chamber 21, and the upper shell 11 forms another partial area of the top wall 20a of the first chamber 21.

[0109] The connecting portion 61 includes a ring-shaped block 611 and a sealing glue 612. The top surface 611a of the ring-shaped block 611 is composed of a first area 611a1 and a second area 611a2 surrounding the outside of the first area 611a1. FIG. 5B shows a schematic view of the top surface 611a of the ring-shaped block 611, and the boundary between the first area 611a1 and the second area 611a2 is shown by a dashed line L2. It can be understood that the first area 611a1 is the central area of the top surface 611a of the ring-shaped block 611, and the second area 611a2 is the edge area of the top surface 611a of the ring-shaped block 611.

[0110] The ring-shaped block 611 is in one-piece structure with the upper shell 11. That is, the first area 611a1 of the top surface 611a of the ring-shaped block 611 is in one-piece connection with the top wall 20a of the first chamber 21. It can be understood that through the one-piece connection, a sealing connection (i.e., connection C3) is naturally formed between the top surface 611a of the ring-shaped block 611 and the top wall 20a of the first chamber 21. The present embodiment can not only simplify the forming mode of the ring-shaped block 611, but also can realize the reliable sealing connection between the ring-shaped block 611 and the side wall 20c of the first chamber 21.

[0111] The bottom surface 611b of the ring-shaped block 611 and the edge portion 314 of the base plate 31 are sealingly connected through the sealing glue 612 (i.e., connection C1). It can be understood that through the connection C1 and the connection C3, the sealing connection of the edge portion 314 of the base plate 31 and the cavity wall of the accommodating cavity 20 can be realized.

[0112] In the example, the extension 122B of the middle shell 12 covers the second region 611a2 of the top surface 611a. The extension 122 and the second region 611a2 of the top surface 611a can be connected by the sealant 83. By arranging the sealant 83, the moisture from the outside can be prevented from entering the inside of the earphone 100. In addition, the ring block 611 can not only be used for sealing the first chamber 21, but also be used as a bearing structure of the middle shell 12, which is beneficial to simplify the structure of the earphone 100.

[0113] However, the present application is not limited thereto. In other examples, the middle shell 12 can not include the extension 122, and the upper shell 11 can extend to the edge of the main body 101 along the X-Y plane. All regions of the top surface 611a of the ring block 611 can be integrally connected with the upper shell 11. In addition, the upper shell 11 and the middle shell 12 can be connected by the sealant 84 to prevent the moisture from the outside from entering the inside of the earphone 100 through the gap between the upper shell 11 and the middle shell 12.

[0114] With reference to FIG. 5A, in the example, during the assembly of the main body 101 of the earphone 100, the substrate 31 and the ring block 611 can be connected by the sealant 612, and then the middle shell 12 and the ring block 611 can be connected by the sealant 83.

[0115] It can be understood that, in the above examples, the ring block 611 is used to achieve the sealed connection between the edge portion 314 of the substrate 31 and the cavity wall of the accommodating cavity 20, and the present application is not limited thereto. Those skilled in the art can make other modifications.

[0116] For example, in other embodiments, with reference to FIG. 6, the connecting portion 61 includes a connecting sheet 85, one end 851 of the connecting sheet 85 is connected to the edge portion 314 of the substrate 31 by the sealant, and the other end 852 is connected to the side wall 20c of the first chamber 21 by the sealant, so as to achieve the sealed connection between the edge portion 314 of the substrate 31 and the cavity wall of the accommodating cavity 20.

[0117] In addition, in the above examples, the width of the sealing surface of each sealant can be selected according to the waterproof level, for example, the earphone 100 with high waterproof level can have a sealant with wide sealing surface, and the present application is not limited thereto.

[0118] The following describes an example arrangement of the loudspeaker 40 in the second chamber 22.

[0119] Fig. 7 shows an exemplary structural diagram of the loudspeaker 40. Referring to Fig. 7, the loudspeaker 40 comprises, in addition to the diaphragm 41, a magnetic circuit structure 42 and a voice coil 43. The magnetic circuit structure 42 can generate a magnetic field, and the voice coil 43 is located in the magnetic field generated by the magnetic circuit structure 42. When the voice coil 43 receives an audio signal, an electric current corresponding to the audio signal can be generated in the voice coil 43. According to Faraday's law of electromagnetic induction, when the electric current is generated in the voice coil 43, the magnetic field can generate a driving force on the voice coil 43 to make the voice coil 43 vibrate. When the voice coil 43 vibrates, it drives the diaphragm 41 connected thereto to vibrate, and the vibration of the diaphragm 41 pushes the air to generate pressure waves, which are the sound we hear.

[0120] Exemplarily, the vibration direction of the diaphragm 41 is the Z direction. The second chamber 22 can comprise a front chamber 221 and a rear chamber 222, wherein the space between the diaphragm 41 and the bottom wall 20b of the accommodating cavity 20 is the front chamber 221, and the space between the diaphragm 41 and the base plate 31 is the rear chamber 222. In order to ensure the sound production effect of the loudspeaker 40, the outer side wall 20c of the loudspeaker 40 and the side wall 20c of the second chamber 22 can be sealingly connected by a sealing glue 86 to block the air communication between the front chamber 221 and the rear chamber 222.

[0121] The housing 10 can be provided with a sound outlet hole 51 and a rear vent hole 52. The sound outlet hole 51 is provided on the bottom wall 20b of the accommodating cavity 20 and communicates with the front chamber 221. The rear vent hole 52 is provided on the side wall 20c of the rear chamber 222 and communicates with the rear chamber 222. When the diaphragm 41 vibrates downward along the Z direction, the air in the front chamber 221 is compressed, so that it can flow to the outside of the earphone 100 through the sound outlet hole 51; at the same time, the air pressure in the rear chamber 222 decreases, and the external air can flow into the rear chamber 222 through the rear vent hole 52. That is, by providing the rear vent hole 52, the balance of the internal air pressure of the earphone 100 can be maintained.

[0122] From the appearance of the loudspeaker 40, the loudspeaker 40 can comprise a first part 40a for arranging the magnetic circuit structure 42 and a second part 40b surrounding the outside of the first part 40a. Generally, the first part 40a has a greater thickness than the second part 40b. That is, the distance H3 between the second part 40b and the base plate 31 is greater than the distance H2 between the first part 40a and the base plate 31.

[0123] One or more sound leakage holes 44 can be provided on the loudspeaker 40, and the sound leakage holes 44 are used to communicate the air passages inside and outside the loudspeaker 40. It can be understood that the air outside the earphone 100 can flow into the inside of the loudspeaker 40 through the rear vent hole 52 and the sound leakage hole 44 in turn, or flow in the opposite direction.

[0124] In this embodiment, the loudspeaker 40 includes three sound leakage holes 44, i.e., a sound leakage hole 441, a sound leakage hole 442 and a sound leakage hole 443. The sound leakage hole 441 is located on the first portion of the loudspeaker 40, and the sound leakage hole 442 and the sound leakage hole 443 are located on the second portion of the loudspeaker 40. In other embodiments, the loudspeaker 40 can also have only one sound leakage hole 44, for example, the sound leakage hole 441. In addition, each sound leakage hole 44 can be covered with a breathable film.

[0125] In order to ensure the sound effect of the loudspeaker 40, a certain distance is required between the sound leakage hole 44 and the substrate 31 to improve the air flow in the rear cavity 222. When the loudspeaker 40 has three sound leakage holes as shown in FIG. 7, because the sound leakage hole 442, the sound leakage hole 443 and the substrate 31 have a large air flow distance H3, the sound leakage hole 441 and the substrate 31 can have a small distance H2, for example, H2 is 0.2mm-0.5mm. That is, in this embodiment, by arranging the sound leakage hole on the second portion 40b of the loudspeaker 40, the distance between the loudspeaker 40 and the substrate 31 can be reduced, so as to further reduce the height of the earphone 100 body 101.

[0126] In other embodiments, when the loudspeaker 40 has only one sound leakage hole (i.e., the sound leakage hole 441), the loudspeaker 40 and the substrate 31 can have a large distance H2, for example, H2 is 0.3mm-1.0mm.

[0127] As described above, one or more electronic devices, for example, the loudspeaker 40, a microphone (not shown), a motor (not shown), a battery (not shown) and the like, can be accommodated in the second chamber 22. These electronic devices can be electrically connected to the main board 30 to interact with the main board 30.

[0128] The following takes the loudspeaker 40 as an example to introduce the electrical connection mode of the electronic device and the main board 30. Referring to FIG. 8 (FIG. 8 is an enlarged view of part C of FIG. 7), the loudspeaker 40 can be electrically connected to the main board 30 through a flexible circuit board 90 (FPC). That is, one end 91 of the FPC 90 is electrically connected to the loudspeaker 40, and the other end 92 is electrically connected to the surface 312 of the main board 30 facing the second chamber 22.

[0129] The FPC 90 can be electrically connected to the main board 30 by a laser welding process. Specifically, the FPC 90 includes pins 93, and the surface 312 of the main board 31 includes pads 315. The pins 93 and the pads 315 can be welded by a laser welding process to electrically connect the FPC 90 and the main board 30. This laser welding process of welding the FPC 90 on the main board 30 can be referred to as a FOB (FPC on Board) process. In other examples, the FPC 90 includes pads, and the main board 30 includes pins. The pins of the main board 30 can be welded on the pads of the FPC 90 by a laser welding process. This laser welding process can be referred to as a BOF (Board on FPC) process.

[0130] In this embodiment, the FPC 90 and the main board 30 can be electrically connected by a laser welding process with a small thickness, thereby facilitating the thinning of the earphone 100 body 101. Meanwhile, since the area of the electrical connection point is small in the laser welding process, the laser welding process can be applied to a case where there are many electronic devices in the second chamber 22 and many electrical connection points need to be arranged on the surface 312 of the main board 31.

[0131] In other embodiments, referring to FIG. 9, the FPC 90 can also be electrically connected to the main board 30 by a BTB (Board to Board) connector 92 to improve the convenience of electrical connection. The BTB connector 92 can be arranged between the second part 40b of the speaker 40 and the main board 31. As described above, since there is a large distance H3 between the second part 40b of the speaker 40 and the main board 31, the distance H3 can be used to arrange the BTB connector 92 in this example, thereby electrically connecting the speaker 40 and the main board 30 without increasing the height of the second chamber 22. When there are few electrical connection points on the surface 312 of the main board 31, the electrical connection between the speaker 40 and the main board 30 can be achieved by this connection mode to improve the convenience of electrical connection.

[0132] It can be understood that in other embodiments, the electronic devices can also be electrically connected to the main board 30 by a POGOPIN, a spring sheet, soldering, etc. The present application is not limited in this regard. In addition, a sealing structure (e.g., sealing glue) can be arranged on the surface of the electrical connection point to protect the electrical connection point from water.

[0133] In addition, the above embodiments are only exemplary descriptions of the technical solutions of the present application, and other modifications can be made by those skilled in the art.

[0134] For example, in the above embodiment, the electronic components 32 of the main board 30 are all arranged on the surface 311 of the substrate 31. In another embodiment, referring to FIG. 10A, a part of the electronic components 32 of the main board 30 can be arranged on the surface 311, and the other part of the electronic components 32 can be arranged on the surface 312. By moving a part of the electronic components 32 to the surface 312, more space can be left on the surface 311 for arranging the electronic components 32 (e.g., important electronic components 32 with higher waterproof requirements) on the surface 311.

[0135] For example, the electronic components 32 arranged on the surface 311 can include electronic components with higher importance level, higher waterproof requirements, or electronic components that are not suitable for arranging waterproof structures on the surface, such as chips, gyroscopes, and some capacitors and inductors.

[0136] For example, the electronic components 32 arranged on the surface 312 can include electronic components with lower waterproof requirements or lower usage frequency, such as test contacts of the main board 30. In addition, for the electronic components 32 arranged on the surface 312, waterproof structures (e.g., sealing glue) can be arranged on the surfaces of the electronic components 32. In another example, the test contacts of the main board 30 can also be arranged outside the substrate 31.

[0137] For example, in the above embodiment, the connecting portion 61 is arranged in the first chamber 21 to have the same height as the electronic components 32 of the main board 30, so as to reduce the total height of the earphone 100 body 101. In another embodiment, referring to FIG. 10B, the connecting portion 61 can also be arranged in the second chamber 22. For example, the connecting portion 61 can be sealing glue arranged between the edge portion 314 of the substrate 31 and the side wall 20c of the accommodating cavity 20.

[0138] For example, in the above embodiment, the connecting portion 61 is arranged in the first chamber 21 to have the same height as the electronic components 32 of the main board 30, so as to reduce the total height of the earphone 100 body 101. In another embodiment, referring to FIG. 10B, the connecting portion 61 can also be arranged in the second chamber 22. For example, the connecting portion 61 can be sealing glue arranged between the edge portion 314 of the substrate 31 and the side wall 20c of the accommodating cavity 20.

[0139] In the above description of the present embodiment, unless otherwise specified, " / " represents the meaning of or, for example, A / B can represent A or B; "and / or" in the present embodiment only represents a description of the relationship between the associated objects, and can represent three relationships, for example, A and / or B, which can represent three cases of A alone, B alone, and A and B together. In addition, in the present embodiment, the values of each data range include the end values. For example, A = 10-50, which means that A can be 10 or 50.

Claims

1. An electronic device, comprising: The application relates to a housing, a circuit board and a connecting part. The housing comprises a housing body defining a receiving cavity, and at least one through hole is formed in the housing body; The circuit board is arranged in the receiving cavity, and comprises a substrate and a plurality of electronic components arranged on the surface of the substrate. The plane of the substrate divides the receiving cavity into a first chamber and a second chamber, and the at least one through hole is in communication with the second chamber. The substrate comprises a first part and a second part surrounding the first part; The connecting part is sealingly connected between the second part of the substrate and the cavity wall of the receiving cavity; At least part of the electronic components is arranged on the surface of the substrate facing the first chamber.

2. The electronic device of claim 1, wherein, The connecting part is located in the first chamber.

3. The electronic device of claim 2, wherein, The cavity wall of the first chamber comprises a top wall and a side wall, and the top wall and the substrate are oppositely arranged along the height direction of the first chamber. The connecting part comprises an annular block arranged between the top wall of the first chamber and the substrate, and the annular block extends along the periphery of the substrate. The bottom surface of the annular block is sealingly connected with the second part of the substrate. The side surface of the annular block is sealingly connected with the side wall of the first chamber, or the top surface of the annular block is sealingly connected with the top wall of the first chamber.

4. The electronic device of claim 3, wherein, The housing comprises a first housing and a second housing, the second housing comprises a first opening, the first housing is located in the first opening, the first housing forms the top wall of the first chamber, and the second housing forms the side wall of the first chamber. The top surface of the annular block is sealingly connected with the top wall of the first chamber.

5. The electronic device of claim 3 or 4, wherein, The side surface of the annular block is integrally connected with the side wall of the first chamber.

6. The electronic device of claim 3, wherein, The housing comprises a first housing and a second housing, the second housing comprises a barrel and an extension part, and the extension part is connected with the inner wall of the barrel and extends along the radial direction of the barrel. The extension part and the substrate are oppositely arranged along the height direction, the first housing is located on the side of the extension part away from the substrate, the first housing and the extension part jointly form the top wall of the first chamber, and the barrel forms the side wall of the first chamber.

7. The electronic device of claim 6, wherein, The top surface of the annular block is sealingly connected with the bottom surface of the extension part.

8. The electronic device of claim 6 or 7, wherein, The first housing is sealingly connected with the extension part.

9. The electronic device of claim 3, wherein, The housing comprises a first housing and a second housing, the second housing comprises a barrel and an extension part, the extension part is arranged on the inner wall of the barrel around the axis of the barrel, and forms a second opening around the axis; The first housing is located in the second opening, the first housing and the extension part jointly form the top wall of the first chamber, and the barrel forms the side wall of the first chamber; The top surface of the annular block comprises a first region and a second region surrounding the first region, and the second region of the top surface of the annular block is sealingly connected with the extension part.

10. The electronic device of claim 9, wherein, The first region of the top surface is integrally connected with the first housing.

11. The electronic device of claim 1, wherein, The at least part of the electronic components of the circuit board comprises at least one of a chip, a gyroscope, a capacitor or an inductor.

12. The electronic device of claim 1, wherein, The test contact of the circuit board is arranged on the surface of the substrate facing the second chamber.

13. The electronic device of claim 1, wherein, A speaker is arranged in the second chamber. The second chamber comprises a front chamber and a rear chamber, the front chamber is located between the diaphragm of the speaker and the bottom wall of the accommodating cavity, and the rear chamber is located between the diaphragm of the speaker and the base plate; wherein the at least one through hole is arranged on the side wall of the rear chamber.

14. The electronic device of claim 13, wherein, The surface of the speaker and the base plate facing the second chamber are electrically connected.

15. The electronic device of claim 14, wherein, The speaker is electrically connected to the surface of the base plate facing the second chamber through a flexible circuit board or a spring needle.

16. The electronic device of claim 15, wherein, The flexible circuit board is electrically connected to the surface of the base plate facing the second chamber through welding or a board-to-board connector.

17. The electronic device of claim 1, wherein, The electronic device comprises an ear hook connected with the shell.

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