Sputtering target and coating system having a sputtering target

Abstract

The invention relates to a sputtering target (10, 110), to a coating system (30) having a sputtering target (10, 110), and to a coating method using a sputtering target (10, 110). The sputtering target (10, 110) comprises a target plate (14) made of a first sputtering material. At least one first and one second recess (18a, 18b) formed in the target plate are each bordered on the plate surface (16) by the first sputtering material so as to be enclosed. A first insert (20a) made of a second sputtering material is provided in the first recess (18a), and a second insert (20b) made of the second sputtering material is provided in the second recess (18b). The first and the second recess (18a, 18b) have a connection (26) at at least one passage point spaced apart from the plate surface (16). The first and the second insert (20a, 20b) are in contact with each other in the region of the passage point.

Description

[0001] (20091.9)

[0002] Description of atomizing target and coating system with atomizing target

[0003] The invention relates to an atomizing target, a coating system with an atomizing target and a coating process using an atomizing target.

[0004] A sputtering target is used to coat substrates by sputtering the target with particles and using the sputtered components as materials for surface coatings of the substrates. In PVD coating processes that utilize cathode sputtering, a sputtering target is connected as the cathode in a coating chamber of a coating system and sputtered by positively charged particles, especially gas and / or metal ions.

[0005] For atomizing targets comprising different atomizing materials, especially metals, it is known to provide a target plate made of a first atomizing material and to provide inserts made of a second atomizing material in recesses formed therein.

[0006] For example, US6852201 B2 discloses an atomizing component for performing a PVD coating process in which atomization by bombardment with gas ions deposits a layer containing multiple metallic elements onto a substrate. The atomizing component consists of a titanium base plate with holes into which aluminum plugs are pressed. The sputtering rate for aluminum is higher than for titanium, so the aluminum plugs have a concave curvature of the exposed surface relative to the base plate.

[0007] WO 2022 / 180055 Ai and DE102021104255A1 relate to an atomizing target and a coating system, as well as a coating process therein. The atomizing target comprises a base plate with a target plate attached to it, made of a first atomizing material having a surface and a plurality of recesses formed therein. A plurality of inserts are arranged in the recesses. At least some of the inserts are made of a second atomizing material, the second atomizing material having a higher sputtering yield than the first atomizing material. To achieve coatings of exceptional uniformity, the inserts made of the second atomizing material are shaped such that their dimensions, measured in a direction parallel to the surface, increase along a depth direction from the surface towards the base plate.

[0008] The task hereby can be seen as proposing an atomization target, a coating system and a coating process with which a desired coating composition can be achieved in a targeted manner under different operating conditions.

[0009] With regard to the problem, an atomization target according to claim 1, a coating system according to claim 13, and a coating method according to claim 14 are proposed. Dependent claims relate to advantageous embodiments of the invention.

[0010] The atomizing target according to the invention comprises a target plate made of a first atomizing material. The target plate has a surface that is preferably flat and on which the atomizing target is atomized by acting particles during use. An opposite back side of the target plate can, for example, be used for mechanical mounting of the atomizing target and / or for cooling it, as will be explained below for preferred embodiments.

[0011] While the target plate can have various shapes and dimensions, it is preferably rectangular. Preferably, the target plate is elongated, which here is understood to mean a shape whose extension in its longest direction is at least twice as large as its extension in a direction perpendicular to it. Preferably, the length of the target plate is at least three times, and particularly preferably at least five times, its width.

[0012] The first atomizing material from which the target plate is formed is a material suitable for atomization, preferably a metal, although other solid materials such as carbon can also be used. While alloys or powder metallurgical mixtures of different metals are possible as atomizing material, the first atomizing material is preferably a pure metal. Within the scope of the present invention, target plates made of titanium or chromium are preferred. This means that the material of the plates consists at least predominantly, i.e., more than 75%, of the aforementioned metal, preferably more than 95%. Particularly preferably, the metal is pure (possibly with only minor impurities; for example, the titanium plate may contain tantalum and / or zirconium in small quantities).

[0013] According to the invention, at least one first and one second recess are formed in the target plate. As can be seen from the exemplary embodiments, more than two recesses are preferably provided. At least the first and the second recesses are formed in the target plate such that they are each bordered on the plate surface of the target plate by the first atomizing material, i.e., a closed border line of the recesses on the first atomizing material is formed on the plate surface. Preferably, at least the first and the second recesses are therefore not arranged at the edge of the target plate, but in the interior of the plate surface at a distance from the edge.

[0014] The recesses can have various shapes and dimensions. Preferably, the first and second recesses, and more preferably any further recesses, can be of the same shape and size. The recesses can have a cross-sectional shape (viewed parallel to the plate surface) that can be, for example, round, oval, rectangular, strip-shaped, polygonal, or irregularly shaped. A circular shape and / or an elongated strip shape are preferred as cross-sectional shapes, particularly preferably with rounded ends.

[0015] The recesses each extend from the surface of the target plate. While shorter recesses would be possible, the recesses preferably penetrate the target plate completely. Furthermore, at least the first recess, the second recess, and preferably any further recesses have the same depth.

[0016] According to the invention, inserts made of a second atomizing material are arranged in the recesses. The second atomizing material is also designed and suitable for atomization and, as with the first atomizing material, can be an alloy or a powder metallurgical mixture, but preferably a pure metal. Preferably, the inserts consist of aluminum or of aluminum and silicon. Inserts made of aluminum and silicon preferably contain predominantly aluminum, and particularly preferably at least 90% aluminum.

[0017] The first insert is positioned in the first recess, and the second insert in the second recess. Preferably, the inserts completely fill their respective recesses, leaving no free space between the inserts and the surrounding material of the target plate. More preferably, the inserts are firmly fixed in the recesses, for example, by compression, so that they cannot be removed or detached.

[0018] According to the invention, the first and second recesses have a connection at at least one passage point spaced away from the plate surface. While the first or second recess is each closed at the plate surface and thus separated from each other, they are connected at the connection point located below the plate surface in such a way that a passage is formed.

[0019] According to the invention, the first and second inserts are in contact with each other in the area of ​​the passage point. While the first and second inserts are separated and spaced apart from each other on the plate surface by the first atomizing material, they lie directly against each other in the area of ​​the passage point.

[0020] Such an arrangement has surprisingly proven to be very advantageous under various process conditions during the coating process. The atomization of the sputtering targets typically takes place in a plasma, which can result in a very different and inhomogeneous temperature distribution and plasma effect across the plate surface. Thus, significantly different temperatures can occur at different locations and especially on different inserts, which—in addition to potential mechanical stresses—can lead to varying levels of wear, since the sputtering yield is temperature-dependent.

[0021] Since the inserts are in contact with each other at the interface according to the invention, at least partial temperature equalization can be achieved through direct heat conduction at the contact point. This improves the homogeneity of the sputtering process and thus results in a precisely adjustable, uniform composition of the coating.

[0022] The coating system according to claim 13 comprises a coating chamber, means for generating a vacuum in the coating chamber, means for arranging a substrate to be coated in the coating chamber, and at least one cathode arranged in the coating chamber. Such coating systems are known per se as PVD coating systems, so a detailed discussion of the individual components mentioned is omitted here. The special feature of the coating system according to the invention is that an atomization target of the type described above is arranged on the cathode, with which favorable coating properties can be achieved by contacting the inserts at a transition point under different process conditions.

[0023] The coating method according to claim 14 provides that an atomizing target as described above is atomized in a vacuum by means of cathode atomization and a coating of atomized components of the atomizing target is applied to a substrate. Such coating methods are also known per se, except for the design of the atomizing target, so further detailed explanations are omitted. For the reasons mentioned above, the coating method benefits from the contact of the inserts at a point of passage.

[0024] The shape, dimensions, and relative arrangement of the first and second recesses can be selected in various ways to create a connection between them. For example, the recesses in the target plate can be formed by subtractive machining, such as milling. The first and second recesses (and preferably also the first and second inserts) can be, for example, at least substantially cylindrical. In this case, a connection between the recesses can be achieved by having the recesses extend from the plate surface at different angles so that they meet below the plate surface at the connection point. It is also possible, in principle, for the first insert, the second insert, and any further inserts to extend separately from the plate surface at a distance from each other, forming shapes such as...They have a cylindrical shape, but connecting sections projecting laterally from the respective shape extend to the point of passage and form a connection there.

[0025] In a preferred embodiment, the first and / or the second insert is shaped such that the respective cross-sectional area, measured parallel to the plate surface, increases with increasing distance from the plate surface. The same preferably applies to the first and second recesses in which the inserts are arranged. Thus, the recesses and the inserts arranged therein can be spaced apart from one another on the plate surface and each be enclosed by the first atomizing material. Due to the enlargement in the transverse direction, the recesses and inserts approach each other below the plate surface, and the connection is formed at the point of contact where the inserts meet.Although a truncated cone shape is preferred for the inserts, a shape for the inserts and recesses that increases in size in the depth direction will be referred to here, for simplicity, as "conical," without necessarily implying a restriction of the cross-sectional shape to round cross-sections. Such a conical shape has proven particularly advantageous for material combinations where the second atomizing material has a higher sputtering rate than the first, because it allows for a reasonably constant composition of the coating formed during operation, even with progressive, inhomogeneous material removal due to the different behavior of the atomizing materials.

[0026] In a preferred embodiment, the first and second inserts, and preferably one or more further inserts, and particularly preferably all inserts, have round cross-sectional shapes. For the preferred conical shape of the inserts described above, a taper angle can be defined as the angle of the insert's outer surface, visible in the longitudinal section of the insert, relative to a perpendicular on the plate surface. For example, the taper angle can be 3° to 20°, preferably 5°. 0 up to 15 0 .

[0027] The first and second atomizing materials may in particular be selected from the group comprising C, B, Al, Si and the elements of groups 4-6 of the periodic table according to IUP AC (1988) in pure form or as compounds, alloys or sintered materials thereof.

[0028] In preferred embodiments of the invention, the second sputtering material has a higher sputtering rate than the first sputtering material. As is known to those skilled in the art, the sputtering rate is a material-dependent parameter that indicates the average number of target atoms emitted per incident ion during the sputtering process. Consequently, with uniformly incident ions, the inserts formed from the second sputtering material exhibit a higher sputtering removal per unit area compared to the target plate. The second sputtering material can, for example, have a sputtering rate at least 20% higher than the first sputtering material, preferably at least 50% higher, and particularly preferably at least 80% higher. In the particularly preferred combination of a titanium target plate with aluminum inserts, the ratio of the sputtering rates is approximately 1:2.

[0029] According to a preferred embodiment of the invention, the second atomizing material has a higher thermal conductivity than the first atomizing material. In this case, the contact between the inserts offers particular advantages in equalizing the temperatures within the insert, because heat conduction from a higher-temperature insert to a lower-temperature insert is favored at the point of contact between the inserts. For example, the thermal conductivity of the second atomizing material can be at least twice that of the first atomizing material, and preferably at least four times that of the first. In the particularly preferred combination of a titanium target plate with aluminum inserts, the ratio of the thermal conductivities is approximately 1:12.

[0030] The respective surface area of ​​the first and second atomizing materials on the plate surface can be appropriately selected taking into account the sputtering rates of the atomizing materials and the desired composition of the layer formed.

[0031] For example, a high surface area of ​​the first atomizing material on the plate surface can be achieved by widely spaced arrangement of the inserts and recesses on the plate surface, or a higher surface area of ​​the second atomizing material can be achieved by closely spaced arrangement of the recesses and inserts. Preferably, the surface area of ​​the first atomizing material on the plate surface is predominant, i.e., more than 50%. A preferred surface area of ​​the second atomizing material on the plate surface is, for example, 15–35%.

[0032] The target plate can, for example, be rectangular with a width in the range of 50 to 200 mm, preferably 70 to 150 mm. The length can, for example, be in the range of 200 to 1000 mm, preferably 300 to 700 mm. The thickness of the target plate is preferably relatively small compared to its length and width and can preferably be, for example, in the range of 3 to 30 mm, particularly preferably 5 to 15 mm.

[0033] As already explained, the target plate preferably has not only the first and second recesses and the first and second inserts arranged therein, but also further recesses and inserts placed therein. One or more of these may be arranged in isolation, i.e., in such a way that they are not in direct, physical contact with any other insert. Preferably, however, several, more preferably the majority, of the inserts of the atomizing target are in direct contact with at least one other insert, and most preferably all inserts are in direct contact with at least one other insert.

[0034] Groups of more than two inserts can also be formed, which are at least indirectly in contact with each other. According to a preferred embodiment, the target plate has at least one third recess and a third insert made of the second atomizing material arranged therein. Preferably, the third recess then has a connection to the second recess at at least one further passage point spaced away from the plate surface, and the third insert and the second insert touch in the area of ​​the further passage point. Then, even if the first insert and the third insert do not touch directly, they are at least indirectly in contact through the linkage via the second insert and the respective contact areas formed by it. More preferably, the chain of inserts in indirect contact with each other can be extended by further inserts, so that, for example,The majority of the atomizing target elements are in contact with each other, with each individual element being in direct contact with, for example, only one, two or three other elements, but these in turn being in touching contact with other elements, etc.

[0035] According to a preferred embodiment, a base plate is arranged below the target plate. The base plate can have at least substantially the same shape as the target plate. The target plate is preferably arranged directly on the base plate and thus firmly connected, preferably by a material bond. A strong, material bond can be created, for example, by applying high compressive forces to the two plates, e.g., by pressing or forging. Alternatively, the material bond can also be created by softening one or both plates, e.g., by friction welding, and then pressing them together. The base plate can serve for mechanical fastening and / or for cooling the target plate. For this purpose, the base plate can have fastening devices such as screw holes. The base plate preferably consists of a material with good thermal conductivity, preferably a metal such as...Copper, aluminum, or an alloy in which copper or aluminum makes up the largest proportion.

[0036] In a preferred embodiment, recesses are formed in the base plate and the inserts extend into these recesses. This further improves the heat distribution of the inserts.

[0037] According to a preferred embodiment, the passage point is located at a distance from the plate surface that is at least 20% of the thickness of the target plate. More preferably, the distance of the passage point from the plate surface is at least 30% of the thickness of the target plate, and particularly preferably at least 40%.

[0038] Preferably, the first and second inserts are arranged on the plate surface at a small distance from each other, which can be, for example, 0.3–5 mm, preferably 0.8–2 mm. According to a preferred embodiment, the distance can be 3 to 15% of the largest cross-sectional area of ​​the first insert parallel to the plate surface, i.e., in the case of a cylindrical or truncated conical shape of the first insert, of its diameter.

[0039] The passage between the recesses preferably has a sufficiently large cross-section to allow for the largest possible contact area between the inserts and thus improved heat conduction. For example, the passage formed in the target plate can have a width (measured at its widest point) of 2–12 mm, preferably 3–8 mm, and a height (measured at its highest point) of 2–10 mm, preferably 3–6 mm. A direction of passage can be defined, for example, as centrally from the first recess to the second recess, i.e., for example, in the case of cylindrical or frustoconical recesses, from one central axis to the other.According to a preferred embodiment, the cross-sectional area of ​​the passage in the target plate, measured orthogonally to the direction of passage, is at least 5%, preferably at least 8%, of the maximum cross-sectional area of ​​the first recess, also measured orthogonally to the direction of passage. Embodiments of the invention are described in more detail below with reference to the drawings. The drawings show:

[0040] Fig. 1 shows a first embodiment of a atomizing target in top view;

[0041] Fig. 2 shows the atomizing target from Fig. 1 in side view;

[0042] Fig. 3 shows a cross-sectional view through the atomizing target from Fig. i along the line A1..A2;

[0043] Fig. 4 shows a view of part of a cross-section of the atomizing target from Fig. 1 along the line A3..A4;

[0044] Fig. 5 is an enlarged view of area A5 from Fig. 1;

[0045] Fig. 6 in perspective view the atomizing target from Fig. 1 with partially removed inserts;

[0046] Fig. 7 shows an enlarged view of area A6 from Fig. 6;

[0047] Fig. 8 shows a partial cross-sectional view of the target from Fig. 1 along the line

[0048] A3..A4 analogous to Fig. 4, but in an enlarged view with dimensions. Fig. 9 shows a coating system in schematic representation.

[0049] Fig. 10 shows a second embodiment of a atomizing target in top view;

[0050] Fig. 11 shows an application of the atomizing target from Fig. 10 in perspective view.

[0051] The drawings are to be understood as illustrative and not necessarily to scale.

[0052] An atomizing target 10, shown in top view in Fig. 1 and in side view in Fig. 2, according to a first embodiment, is rectangular and elongated, with a base plate 12 made of copper and a target plate 14 made of a first atomizing material, preferably pure titanium, attached thereto. The target plate 14 and the base plate 12 arranged below it have recesses 22 for screws at the corners and in the center, with which the atomizing target 10 can be attached to a cathode 40 of a coating system 30, as shown, for example, in Fig. 9.

[0053] On a plate surface 16 of the target plate 14, recesses 18 are provided in which inserts 20 made of a second atomizing material, preferably pure aluminum, are inserted. The inserts 20 completely fill the recesses 18, so that they form a continuous flat surface with the plate surface 16 of the target plate 14. In alternative embodiments (not shown), the inserts can also have a concave upper indentation on the plate surface 16. Corresponding to the recesses 18 of the target plate 14, the base plate 12 has depressions into which the inserts 20 extend (see, for example, Figs. 3, 4, 8).

[0054] By arranging the inserts 20 in the target plate 14, the atomizing target is formed as a body made of two different atomizing materials. When one or more of these atomizing targets are used in the coating system 30, the atomizing materials are used to produce a coating on a substrate.

[0055] The coating system 30, shown schematically in Fig. 9, comprises a vacuum chamber 32 in which, by way of example, four magnetron cathodes 40, designed as unbalanced magnetrons, are arranged around a substrate table 38 on which holders for substrates to be coated are arranged (not shown here). Each of the magnetron cathodes 40 is equipped with a sputtering target 10. A vacuum generation system 34 (pump system) and a supply system 36 for process gas and, if applicable, reactive gas are connected to the vacuum chamber 32. The magnetron cathodes 40, the substrate table 38, and an anode 44, also arranged in the vacuum chamber 32, are connected to an electrical power supply system 42. The coating system 30 can, for example, be constructed and operated as disclosed in WO 98 / 46807 Ai of the applicant.The content of this printed document concerning the electrical configuration of the depicted elements of the coating system 30, as well as concerning the processes during coating, is included here.

[0056] In the operation of the coating system 10, a plasma is generated in the vacuum chamber 32 by the electrical power supply system 42 by means of an electrical voltage between the magnetron cathodes 40 and the anode 44, so that the atomization targets 10 on the plate surfaces 16 are atomized by ions. Substrates arranged on the substrate table 38 are thus provided with a coating of the atomized components of the atomization targets 10, whereby the material removal from the plate surface 16 of the atomization targets 10 occurs primarily along an erosion trench, the course of which is determined by a magnet system of the magnetron cathodes 40. The composition of the removed material and the resulting coating on the substrate is determined by the surfaces of the first and second atomization materials exposed on the plate surface 16, as well as the respective sputtering rate (sputtering yield) of these materials.For the titanium / aluminum material pairing preferred in this embodiment, the sputtering yield of the second sputtering material, aluminum, is twice as high as that of the first sputtering material, titanium. To counteract any resulting inhomogeneity of the composition during progressive material removal, the recesses 18 and the inserts 20 arranged therein have a conical shape, as can be seen in the sectional views in Figures 3 and 4. The diameter, and thus the cross-sectional area, increases with increasing distance from the plate surface 16. Regarding the conicity and the preferred shape of the inserts 20, which depend on the sputtering properties of the respective materials, reference is made to WO 2022 / 180055 Ai of the applicant, the content of which is incorporated here with respect to these aspects.

[0057] Fig. 1 shows the arrangement of the recesses 18 and the inserts 20 on the atomizing target 10. On the plate surface 16, the recesses 18 and the inserts 20 placed therein are arranged close together, but spaced apart from each other, along a circumferential path in the form of a rectangle with rounded narrow ends. The circumferential path essentially corresponds to the course of the erosion gully that forms during operation. The recesses 18 are each completely surrounded on the plate surface 16 by the first atomizing material of the target plate 16.

[0058] The recesses 18 are arranged directly adjacent to each other. Fig. 4 shows, as an example of two adjacent recesses 18, a section along line A3-A4 in Fig. 1: a first recess 18a with an insert 20a arranged therein, and a second recess 18b arranged directly next to it with an insert 20b arranged therein. Fig. 8 shows the same section in an enlarged view with dimensions. On the plate surface 16, the recesses 18a, 18b and the inserts 20a, 20b are separated from each other by a remaining web 24 of the target plate 14 and spaced apart by a distance d. Due to the conical shape with a cone angle α of approximately 10°, the recesses 18a, 18b widen such that a passage 26 is formed as an opening between the recesses 18a, 18b at a distance A from the plate surface 16.At passage 26, the bridge 24 between the recesses 18a and 18b is cut through, and these are continuously connected to each other. The recesses in the base plate 12, into which the inserts 20a and 20b extend, are also connected to each other.

[0059] The same connection is formed between all immediately adjacent recesses 18 in the target plate 14. The arrangement of the recesses 18, in particular the first and second recesses 18a, 18b, and the passages 26 formed between them, are also clearly visible in the perspective views in Figs. 6 and 7. Although inserts 20 are present in all recesses 18 of the atomizing target 10, as shown in Fig. 1, some inserts 20 are not shown in the recesses 18 in Figs. 6 and 7 for illustrative reasons, so that the shape of the recesses 18 and the passages 26 is visible.

[0060] At the passage points, i.e., at the positions of the passages 26 and at the connections between adjacent recesses 18a, 18b in the base plate 12, the inserts 20, 20a, 20b are in direct contact with each other and form contact surfaces 28. There, the inserts 20a, 20b, each consisting of the second atomizing material (in this embodiment: aluminum), touch each other, so that in case of differing temperatures, direct heat conduction occurs between the inserts 20a, 20b.

[0061] Fig. 8 illustrates the size relationships. For example, the thickness T of the target plate 14 can be approximately 6 mm, while the length L of the inserts 20, 20a, 20b can be about 25% greater, so that they also fill the underlying recesses in the base plate 12. The upper diameter Di of the inserts 20, 20a, 20b on the plate surface 16 can be about 15 mm, for example, and increase by about 12% due to the taper to a lower diameter D2. The distance d, i.e., the width of the web 24 between the recesses 18, 18a, 18b, can be about 1–2 mm on the plate surface 16, for example. The web 24 extends to a depth A that corresponds to about half the thickness T of the target plate 14. Thus, the passages 26 are spaced from the plate surface 16 by the amount A. For particularly effective heat conduction, a sufficient size of the contact areas 28 between adjacent inserts 20, 20a, 20b is essential.In the illustrated embodiment, the passages 26 have a maximum height of, for example, approximately 2-3 mm and a maximum width of approximately 5-6 mm. Furthermore, the recesses in the base plate 14 are connected to each other over a width of approximately 7 mm. The inserts 20, 20a, 20b completely fill the recesses 18, 18a, 18b and the depressions, so that they contact each other via appropriately sized contact surfaces 28.

[0062] In the illustrated embodiment, a passage direction R, as shown in Figs. 4 and 5, can be defined by connecting the longitudinal center axes of adjacent and directly connected recesses 18, 18a, 18b. A possible measure of the passage size is a comparison of its cross-section (in a plane orthogonal to the passage direction R) with the maximum cross-sectional area of ​​the first recess 18a (also oriented orthogonally to the passage direction R). In the example shown, the cross-sectional area of ​​the passage can, for instance, correspond to approximately 15% of the maximum cross-sectional area. Furthermore, the contact surface 28 between the inserts 20a and 20b extends into the passage between the connected recesses in the base plate 12, so that the inserts 20a and 20b are in contact with each other over an area sufficiently large for effective heat conduction.

[0063] On the plate surface 16, the recesses 18 and the inserts 20 arranged therein are arranged as shown, for example, in Fig. 1, such that each recess 18 is directly adjacent to two other recesses 18. The relative arrangement of the recesses 18 to one another is essentially as shown and explained above for recesses 18a and 18b, i.e., such that all inserts 20 are in direct contact with two other inserts 20 arranged next to them. The inserts 20 of the atomizing target 10 are thus all interconnected and are in contact either directly (i.e., with immediately adjacent inserts 20) or indirectly (i.e., with the other inserts 20 by means of the interconnection via inserts 20 arranged between them).

[0064] As previously explained, in the illustrated embodiment, the inserts 20, 20a, 20b are made of aluminum, while the target plate 14 is made of titanium. The thermal conductivity of aluminum is significantly higher than that of titanium. The contact of adjacent inserts 20, 20a, 20b via sufficiently large contact surfaces 28 enables good heat conduction between the aluminum inserts 20, thus allowing for a certain degree of temperature equalization. Due to the described interconnection of the inserts 20, this equalization is not limited to immediately adjacent inserts, but rather temperature differences can be equalized between all inserts 20.

[0065] The invention is not limited to the specific shapes and dimensions of the recesses 18, 18a, 18b of the illustrated embodiment, but the desired temperature equalization can also be advantageously achieved for different shapes, sizes and arrangements of recesses and inserts.

[0066] Figures 10 and 11 show an exemplary second embodiment with recesses 118 and inserts 120 having a different, namely strip-shaped, cross-sectional form. In the example shown, the inserts 120 have a substantially rectangular, elongated cross-section with rounded ends. The inserts 120, as well as the recesses 118 in which they are arranged, are conical in shape, i.e., they widen in the longitudinal and transverse directions (see Figure 11).

[0067] As can be seen in Fig. 10, the strip-shaped recesses 118 and the inserts 120 arranged therein are positioned side by side and parallel to each other in the target plate 14. Like the recesses 18 in the first embodiment, the recesses 118 in the second embodiment also have closed edges on the plate surface 16 and are spaced apart from one another. Due to their conical shape, however, adjacent recesses 118 are connected to each other at a distance from the plate surface 16, and the inserts 120 are in contact with each other at this distance. The inserts 120 in the second embodiment are also linked together, so that they are in direct or indirect contact with other inserts 120. However, unlike in the first embodiment, not all inserts 120 are linked together; instead, two linked groups are formed.While the embodiments described above are preferred, the invention is not limited thereto. In particular, other atomizing materials can be used. While in the described embodiments a target plate 14 consists of titanium (which may optionally contain small amounts of other material, e.g., tantalum and / or zirconium), in alternative embodiments the target plate 14 can also consist of chromium (optionally with small amounts of other material). While the inserts 20, 20a, 20b, 120 are above made of aluminum, in alternative embodiments inserts made of aluminum with silicon (Al-Si) can also be used, wherein the Si content is less than 10%. A target plate 14 made of titanium can be provided with inserts 20, 20a, 20b, 120 made of aluminum or of Al-Si. Likewise, a target plate 14 made of chromium can be provided with inserts 20, 20a, 20b, 120 made of aluminum or of Al-Si.

[0068] io, no atomization target

[0069] 12 Base plate

[0070] 14 Target plate

[0071] 16 plate surface

[0072] 18, 18a, 18b, 118 recesses

[0073] 20, 20a, 20b, 120 deployments

[0074] 22 screw holes

[0075] 24. Bridge of the target plate between two recesses

[0076] 26th round

[0077] 28 Contact area

[0078] 30 coating systems

[0079] 32 Vacuum chamber

[0080] 34 Pump system

[0081] 36 Gas supply

[0082] 38 Substrate table

[0083] 40 Magnetron cathode

[0084] 42 electrical power supply system

[0085] 44 Anode

[0086] Dl, D2 Upper and lower diameter of an insert

[0087] L Length of an operation

[0088] A distance of a passage from the surface

[0089] T Thickness of the target plate a Taper angle d Width of the bridge between two recesses

[0090] R Direction of passage

Claims

(20091-9) Claims 1. Atomization target (10, 110), comprising - a target plate (14) made of a first atomizing material with a plate surface (16) and at least one first and one second recess (18, 18a, 18b, 118) formed therein, wherein the first and the second recess (18a, 18b) are each enclosed on the plate surface (16) by the first atomizing material, - at least one first and one second insert (20, 20a, 20b, 120) made of a second atomizing material, wherein the first insert (20a) is arranged in the first recess (18a) and the second insert (20b) is arranged in the second recess (18b), - wherein the first and second recesses (18a, 18b) have a connection (26) at at least one passage spaced away from the plate surface (16), - and where the first and second deployments (20a, 20b) are in contact in the area of ​​the transit point.

2. Atomizing target according to claim 1, wherein - the first and / or the second insert (20a, 20b) are shaped such that the cross-sectional area, measured parallel to the plate surface (16), increases with increasing distance from the plate surface (16).

3. Atomizing target according to claim 2, wherein - the first and second insertions (18a, 18b) have round cross-sectional shapes and a taper angle of 3 0 exhibit up to 20°.

4. Atomizing target according to any of the preceding claims, wherein - the second atomizing material has a higher sputtering rate than the first atomizing material. 5- Atomization target according to one of the preceding claims, wherein - the second atomizing material has a higher thermal conductivity than the first atomizing material.

6. Atomizing target according to any of the preceding claims, wherein - the surface area of ​​the second atomizing material on the plate surface (16) is 15 - 35%.

7. Atomizing target according to any of the preceding claims, wherein - the target plate (14) has at least one third recess (18), - and a third insert (20) made of the second atomizing material is arranged in the third recess (18), - wherein the third recess (18) has a connection (26) to the second recess (18b) at at least one further passage point spaced away from the plate surface (16), - and where the third deployment (20) and the second deployment (20b) touch in the area of ​​the further transit point.

8. Atomizing target according to any of the preceding claims, wherein - a base plate (12) is arranged below the target plate (14), - and depressions are formed in the base plate (12), - and the deployments (20, 20a, 20b) extend into the depressions.

9. Atomizing target according to any of the preceding claims, wherein - the passage point from the plate surface has a distance (A) that is at least 20% of the thickness (T) of the target plate (14).

10. Atomizing target according to any of the preceding claims, wherein - on the plate surface (16) the distance (d) between the first insert (20a) and the second insert (20b) is 3 to 15% of the largest cross-sectional area (Di) of the first insert (20a) parallel to the plate surface (16).

11. Atomizing target according to any of the preceding claims, wherein - the cross-sectional area of ​​the passage point, measured orthogonally to the direction of passage (R), is at least 5% of the maximum cross-sectional area of ​​the first recess (18a), measured orthogonally to the direction of passage (R).

12. Atomizing target according to any of the preceding claims, wherein - the target plate (14) is made of titanium and the inserts (20, 20a, 20b) are made of aluminum, - or the target plate (14) is made of titanium and the inserts (20, 20a, 20b) are made of aluminum and silicon, - or the target plate (14) is made of chrome and the inserts (20, 20a, 20b) are made of aluminium, - or the target plate (14) is made of chromium and the inserts (20, 20a, 20b) are made of aluminium and silicon.

13. Coating plant (30), with - a coating chamber (32), means (34) for producing a vacuum in the coating chamber (32), means (38) for arranging a substrate to be coated in the coating chamber (32) and at least one cathode (40) arranged in the coating chamber (32), - wherein a sputtering target (10, 110) according to one of the preceding claims is attached to the cathode (40).

14. Coating process in which - in a vacuum, an atomizing target (10, 110) according to one of claims 1 to 12 is atomized by means of cathode atomization and a coating of atomized components of the atomizing target (10, 110) is applied to a substrate.

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