Handler for testing electronic components

Abstract

The present invention relates to a handler for testing electronic components. The handler for testing electronic components according to the present invention is provided with: a sealed chamber inside which a rearrangement section, a connection section, and a movement section that are not an unloading section are accommodated; and an opening / closing device that can automatically open and close an opening hole in the sealed chamber only when necessary. According to the present invention, the air quality in a test space can be strictly managed, and thus damage to semiconductor devices or test errors caused by foreign substances can be prevented.

Description

electronic component test handler

[0001] The present invention relates to a handler that supports testing of an electronic component by electrically connecting the electronic component and a tester.

[0002] An electronic component test handler is equipment that handles electronic components to electrically connect them to a tester.

[0003] As the integration density of electronic components, such as semiconductor devices, continues to increase, the line width of circuits is becoming increasingly narrow. Consequently, greater precision is required when connecting electronic components to testers.

[0004] Previously, it was possible to make a proper electrical connection between electronic components and testers with an error range of 20㎛, but now, an error range of 10㎛ or less, or even a few㎛, is required.

[0005] Meanwhile, among electronic components, there are dies that are separated into individual units from the wafer state.

[0006] The die can be completed as a final product by undergoing a packaging process or by stacking it for HBM (High Bandwidth Memory) production and then undergoing a packaging process.

[0007] To perform post-die operations, testing of the die is required.

[0008] Electronic components in die form can be tested by electrically connecting contact pads to a tester.

[0009] Until now, automated testing capable of adequately supporting the testing of electronic components in the dyna HBM state has not been proposed. This is because the dies have fine gaps between contact pads, making precise contact difficult, and are very thin, so they can easily break or shatter.

[0010] Accordingly, the applicant has proposed Korean published patent No. 10-2021-0088373 (hereinafter referred to as the 'prior art').

[0011] The prior art proposes a technique for aligning the positions of electronic components by repositioning them before connecting them to a tester.

[0012] The prior art scans an electronic component on a test table (named a 'chuck' in the prior art) with a camera to determine its current position and readjusts the position of the electronic component to reduce the error range.

[0013] According to the prior art, the precise positioning of electronic components enables automated testing of electronic components at the die level.

[0014] Meanwhile, when a semiconductor device contaminated by foreign substances is tested, it may generate an electrical shock that causes damage or errors in the test results.

[0015] The foreign substance may be in particulate or liquid form.

[0016] Particulate foreign matter may enter from the outside air or be generated by grinding caused by mechanical interference during the operation of the handler.

[0017] Liquid foreign matter may be condensation occurring during low-temperature testing.

[0018] In particular, semiconductor devices with fine line widths may be more vulnerable to damage or test errors caused by contamination from foreign substances.

[0019] [Prior Art Literature]

[0020] [Patent Literature]

[0021] Republic of Korea Published Patent No. 10-2021-0088373

[0022] Technology is required to seal off the test environment as much as possible, where electronic components may be contaminated by foreign substances.

[0023] A handler for testing electronic components according to the present invention comprises: a loading section for supplying electronic components to be tested or retrieving electronic components for which testing has been completed; a relocation section for relocating the positions of electronic components to be tested supplied from the loading section; a connection section for electrically connecting the electronic components whose positions have been relocated from the relocation section to a tester; a movement section for moving electronic components to be tested from the loading section (LU) toward the relocation section and electronic components for which testing has been completed from the relocation section toward the loading section; a sealed chamber that accommodates the relocation section, the connection section, and the movement section internally and protrudes toward the loading section so as to overlap with the loading section on a plane; a switch for opening and closing an opening formed on the upper surface of the sealed chamber; and a controller for controlling the switch. The unloading portion includes a picker hand capable of moving electronic components to be tested into the interior of the sealed chamber through the opening or withdrawing electronic components that have been tested from the interior of the sealed chamber through the opening; and the opening / closing device includes an opening / closing door for opening and closing the opening; and an opening / closing mechanism for opening or closing the opening / closing door by moving the opening / closing door.

[0024] The above moving part includes a transport shuttle having a movable transport table for carrying electronic components; and a position sensor for detecting the position of the transport table; and the controller controls the opening / closing mechanism to open the opening / closing door when the transport table is detected by the position sensor when the transport table moves toward the opening hole.

[0025] The above moving part includes a transport shuttle having a movable transport table for carrying electronic components; and the controller controls the opening and closing mechanism according to the position of the transport table to open and close the opening and closing door.

[0026] The above controller controls the opening and closing mechanism according to the position of the picker hand to open and close the opening and closing door.

[0027] The above opening and closing mechanism manually opens and closes the opening and closing door in conjunction with the movement of the above transport table.

[0028] The above opening and closing mechanism includes: a push rod provided on the transport table to push and open the opening and closing door when the transport table moves toward the opening hole; and an elastic member that applies elastic force to the opening and closing door to close the opening and closing door when the transport table moves toward the opposite side of the opening hole.

[0029] It may further include a condensation prevention mechanism capable of injecting dry air into the interior of the sealed chamber.

[0030] It may further include a foreign matter removal mechanism that removes foreign matter by blowing air made of purified air into the above unloading section.

[0031] According to the present invention, by allowing the opening of the sealed chamber to be automatically opened and closed only when necessary, the sealing performance of the sealed chamber can be maintained to the maximum extent, thereby suppressing contamination of the semiconductor device.

[0032] FIG. 1 is a conceptual plan view of a handler for testing electronic components according to the present invention.

[0033] FIGS. 2 to 12 are reference diagrams for explaining the electronic component test handler of FIG. 1.

[0034] FIGS. 13 to 15 are schematic reference diagrams for explaining the sealed chamber and switch applied to the electronic component test handler of FIG. 1.

[0035] Preferred embodiments according to the present invention are described by example with reference to the attached drawings, provided that for the sake of brevity, descriptions of well-known or redundant components are omitted or compressed as much as possible.

[0036] <Description of Handlers for Electronic Component Testing>

[0037] FIG. 1 is a conceptual plan view of an electronic component test handler (TH, hereinafter abbreviated as 'handler') according to the present invention.

[0038] The handler (TH) according to the present invention may be divided into a loading section (LU), a relocation section (RP), a connection section (CP), and a moving section (MP), and includes a transport shuttle (100), a first picker hand (210), a foreign matter removal mechanism (270), a second picker hand (310), a test table (300), a vacuum device (400), a relocation mechanism (500), a moving mechanism (600), a condensation prevention mechanism (700), and a controller (800).

[0039] The unloading unit (LU) supplies electronic components to be tested or retrieves electronic components for which testing is complete.

[0040] In the relocation section (RP), the positions of the electronic components to be tested supplied from the unloading section (LU) are precisely relocated.

[0041] In the connection section (CP), electronic components whose positions have been precisely repositioned in the relocation section (RP) are electrically connected to the tester.

[0042] In the moving section (MP), electronic components can be moved to exchange electronic components between the unloading section (LU) and the relocation section (RP).

[0043] The moving section (MF) moves electronic components to be tested from the unloading section (LU) to the relocation section (RP), and moves electronic components that have completed testing from the relocation section (RP) to the unloading section (LU).

[0044] A transport shuttle (100) for carrying electronic components is installed in the moving part (MP).

[0045] When viewed in a planar view, the transport shuttle (100) of the moving part (MP) has a portion of one side (the right side in the drawing) overlapping with the unloading part (LU).

[0046] A transport shuttle (100) is provided to transport electronic components between the unloading section (LU) and the relocation section (RP).

[0047] The transport shuttle (100) has a movable transport table (110).

[0048] The transport shuttle (100) may have at least one transport table (110).

[0049] The transport table (110) can move back and forth in one direction.

[0050] The transport table (110) can move back and forth in the X-axis direction.

[0051] In the case where there are multiple transport tables (100), the multiple transport tables (110) may be provided in parallel in the Y-axis direction. In this case, the multiple transport tables (110) need to be implemented to move back and forth in the X-axis direction independently of each other.

[0052] The transport table (110) can move between the first area (A1) on the side overlapping with the unloading section (LU) and the second area (A2) on the side of the relocation section (RP).

[0053] Electronic components can be loaded on the transport table (110).

[0054] The transport table (110) has a vacuum structure that fixes electronic components placed on a flat surface by vacuum pressure.

[0055] As shown in the schematic plan view of FIG. 2, the transport table (110) has vacuum holes (VH) and vacuum grooves (VG) formed therein for vacuum-adsorbing electronic components.

[0056] One vacuum hole (VH) and one vacuum groove (VG) form a pair.

[0057] When viewed in a planar view, the vacuum hole (VH) is positioned near the center of the area occupied by the vacuum groove (VG).

[0058] The vacuum pressure coming through the vacuum hole (VH) acts on the electronic component as it is evenly distributed through the vacuum groove (VG).

[0059] Since the electronic component can be fixed to the transport table (110) by vacuum pressure, no movement of the electronic component occurs during the process of moving in the X-axis direction while being carried on the transport table (110).

[0060] The vacuum holes (VH) and vacuum grooves (VG) can be arranged in a 2x8 matrix form.

[0061] Since the loading capacity of the transport table (110) can be increased or decreased, the number of vacuum holes (VH) and vacuum grooves (VG) can also be increased or decreased.

[0062] In the unloading section (LU), electronic components are supplied to the handler (TH) or recovered from the handler (TH).

[0063] Electronic components to be tested are supplied to the handler (TH) through the unloading section (LU), and electronic components that have completed testing are recovered from the handler (TH) through the unloading section (LU).

[0064] Electronic components can be loaded onto a Jetec Tray, Ring Frame, Ring Tray, or other types of customer trays and supplied to or retrieved from the handler (TH).

[0065] The structure of the loading / unloading section (LU) may vary depending on the type of customer tray.

[0066] Electronic components to be tested in the unloading section (LU) are loaded onto a transport table (110) in the first area (A1), and electronic components that have completed testing and are loaded onto the transport table (110) in the first area (A1) are unloaded from the transport table (110). To this end, a first picker hand (210) is provided in the unloading section (LU).

[0067] The first picker hand (210) is provided to load electronic components onto the transport table (110) or to unload them from the transport table (110).

[0068] For unloading operations by the first picker hand (210), the transport table (110) must be moved toward the unloading section (LU) and be in the first area (A1).

[0069] The first picker hand (210) loads electronic components to be tested onto a transport table (110) in the first area (A1) or unloads electronic components that have been tested from the transport table (110) in the first area (A1).

[0070] The first picker hand (210) may have one or more pickers capable of gripping or releasing electronic components. The pickers may grip electronic components by vacuum pressure.

[0071] Preferably, four pickers can be installed in pairs on the first picker hand (210) to improve processing capacity.

[0072] For example, as shown in the conceptual diagram of FIG. 3, the first picker hand (210) may have four pickers (P) arranged in a 2x2 matrix form.

[0073] Depending on the embodiment, the number of pickers (P) provided in the first picker hand (210) may be increased or decreased.

[0074] The unloading section (LU) further includes a foreign matter removal mechanism (270).

[0075] The foreign substance removal device (270) can be configured to remove foreign substances scattered in the unloading section (LU) by blowing air consisting of purified air free of foreign substances.

[0076] As shown in the conceptual diagram of FIG. 4, the foreign matter removal mechanism (270) may be provided with a structure that blows purified air from the upper side to the lower side of the unloading section (LU).

[0077] Air blown from the upper side to the lower side may escape downward, but it may also be designed with a structure that allows it to escape sideways before reaching the lower side.

[0078] The lateral side is preferably in the Y-axis direction and may be the front side where the supply stacker or recovery stacker is located. In this case, foreign substances that may enter from the supply stacker or recovery stacker can be blocked in advance.

[0079] The air blown by the foreign matter removal mechanism (270) is discharged to the outside along with foreign matter through various holes in the unloading section (LU) due to the difference in density.

[0080] The foreign matter removal mechanism (270) may be provided as a pair of blower fans and intake fans, or it is sufficient to be provided as a coupling means that can be combined with a supply line installed in a factory to supply purified air. A filter for filtering out foreign matter may be installed on either the blower fan or the intake fan.

[0081] Further details regarding the unloading section (LU) will be described later.

[0082] In the relocation section (RP), electronic components (ED) to be tested are unloaded from the transport table (110) and loaded onto the test table (300), and the electronic components loaded onto the test table (300) are relocated.

[0083] In the relocation section (RP), a relocation space (RS) is formed for the relocation of electronic components.

[0084] According to the present embodiment, the relocation portion (RP) is positioned on one side of the connection portion (CP) in the X-axis direction.

[0085] The repositioning part (RP) is equipped with a second picker hand (310).

[0086] The second picker hand (310) unloads electronic components (ED) to be tested from the transport table (110) or loads electronic components (ED) that have been tested onto the transport table (110).

[0087] For unloading operations by the second picker hand (310), the transport table (110) must be moved toward the relocation section (RP) and be in the second area (A2).

[0088] The second picker hand (310) unloads electronic components to be tested from the transport table (110) in the second area (A2) or loads electronic components that have been tested from the transport table (110) in the second area (A2).

[0089] The second picker hand (310) can be configured in the same way as the first picker hand (210).

[0090] The number of pickers (P) provided in the second picker hand (310) may be different from the number of pickers (P) provided in the first picker hand (210).

[0091] The second picker hand (310) loads the electronic components to be tested from the transport table (110) in the second area (A2) onto the test table (300) that has been moved to the relocation area (RP).

[0092] The second picker hand (310) loads the electronic components that have been tested and are loaded on the test table (300) onto the transport table (110) in the second area (A2).

[0093] In order for electronic components to be tested by the second picker hand (310) to be loaded onto the test table (300), the test table (300) must be located in the relocation space (RP).

[0094] The test table (300) is provided to load electronic components (ED) that are unloaded from the transport table (110) by the second picker hand (310).

[0095] As shown in the schematic excerpt of FIG. 5, the test table (300) is in the shape of a disc and has a flat top surface.

[0096] The test table (300) may be in the shape of a square plate when viewed from a flat plane, and in this case, the top surface is also flat.

[0097] The electronic components are loaded onto the test table (300) in a manner such that they are placed on the flat upper surface of the test table (300).

[0098] The test table (300) can be moved in the X-axis, Y-axis, and Z-axis directions.

[0099] The test table (300) can be rotated in the Θ-axis direction with the vertical line (V) passing through the center of the test table (300) in the Z-axis direction as the axis of rotation.

[0100] Generally, when an electronic component (ED) is moved to a test table (300), shock or inertia accompanying the movement occurs.

[0101] Impact or inertia, etc., can disrupt the position of electronic components loaded on the test table (300). To prevent this, vacuum holes (h) are formed in the area where electronic components are loaded on the test table (300).

[0102] The vacuum structure of the test table (300) for fixing electronic components may be the same as the vacuum structure of the transport table (110).

[0103] When an electronic component is placed on the test table (300) by the second picker hand (310), the electronic component can be placed in the same position due to vacuum pressure. In that state, when the second picker hand (310) releases the grip on the electronic component, the electronic component is fixed in the placed position without shifting.

[0104] The vacuum device (400) provides vacuum pressure to the vacuum holes (h) in the test table (300) through a vacuum circuit (not shown).

[0105] The vacuum device (400) can be configured with only a structure that is installed in a factory and distributes vacuum pressure supplied from outside the handler (TH) to each electronic component through a vacuum circuit.

[0106] The vacuum pressure provided by the vacuum device (400) is transmitted to the electronic components (ED) through the vacuum hole (h), and the electronic components loaded on the test table (300) are fixed in position by the vacuum pressure.

[0107] The vacuum holes (h) are implemented to be selectively opened or closed depending on the control of the vacuum circuit. The electronic components (ED) can be selectively fixed to the test table (300) or removed from the test table (300).

[0108] The electronic components are electrically connected to the tester while loaded on the test table (300).

[0109] The electrical connection between the electronic components loaded on the test table (300) and the tester is made via a test board (TB).

[0110] The test board (TB) has test pins that make electrical contact with electronic components.

[0111] The test board (TB) is fixedly coupled to the handler (TH) at the connection part (CP).

[0112] The electronic components loaded on the test table (300) that has been moved to the connection part (CP) are electrically connected to the test pins of the test board (TB).

[0113] The test board (TB) may have any structure as long as it has a configuration that can be electrically connected to electronic components.

[0114] The test board (TB) may be a widely known probe card. In this case, it is preferable that the test table (300) be provided in the form of a disc.

[0115] The test board (TB) may be a structure having socket modules. Test pins are provided in the socket modules, and the socket modules are installed in the socket body. In this case, it is preferable that the test table (300) be provided in the shape of a square plate.

[0116] As shown in the bottom view of FIG. 6, test zones (TZ) corresponding to one electronic component are arranged on the test board (TB).

[0117] The test zones (TZ) correspond one-to-one with the electronic components loaded on the test table (300).

[0118] One test zone (TZ) is equipped with test pins (t) for electrically connecting to one electronic component.

[0119] The test pins (t) in one test zone (TZ) form a set of clusters that form the test zone (TZ) and are electrically connected to the electronic component (ED).

[0120] When the test board (TB) is a probe card, a set of test pins (t) is densely arranged in the test area (TZ). Here, the set of test pins (t) corresponds to terminals on a single electronic component. The test pins (t) on the probe card are also commonly referred to as probe pins.

[0121] When the test board (TB) is a structure having a socket module, a set of test pins (t) are installed in one socket module, and one socket module forms one test zone (TZ). Therefore, when one socket module (22) is replaced, one test zone (TZ) is replaced.

[0122] The test area (TZ) and the electronic component (ED) must be aligned. If the coordinates of the electronic component (ED) on the test table (300) on the XY plane do not match the coordinates of the test area (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester.

[0123] As shown in the conceptual example of FIG. 7, if an electronic component (ED) on the test table (300) is in an angular position having a rotation angle (Θ1) twisted in the Θ-axis direction with respect to the test zone (TZ), a failure occurs in the electrical connection between the electronic component (ED) and the tester. To prevent this, all test zones (TZ) of the test board (TB) and all electronic components (ED) on the test table (300) must be aligned.

[0124] A relocation mechanism (500) is provided to realize alignment between the test zone (TZ) and the electronic component (ED).

[0125] According to the present embodiment, the electronic component (ED) is moved from the transport table (110) to the test table (300) by the second picker hand (310). During this process, an error in the position of the electronic component (ED) may occur due to an operating error or operating shock of the second picker hand (310).

[0126] The positions of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) on the XY plane or each position may be different, and the electronic components (ED) loaded onto the test table (300) and the test zones (TZ) of the test board (TB) may not coincide with each other.

[0127] It does not matter if the error tolerance between the electronic component (ED) and the test zone (TZ) is wide. However, the reality is that the packaged semiconductor device requires a precision of within 30㎛, and in the case of the die or HBM, a precision of within 5㎛ is required.

[0128] In the present invention, when the second picker hand (310) moves electronic components (ED) from the transport table (110) to the test table (300), the electronic components (ED) are loaded into temporary zones and then relocated from the temporary zones to the fixed zones.

[0129] The temporary area may not be a set location, but any location where the electronic component (ED) is placed on the test table (300) by the second picker hand (310).

[0130] The temporary area is a location that is not set or fixed by the controller (800) and is arbitrarily determined by the operation of the second picker hand (310).

[0131] For example, when the second picker hand (310) places an electronic component (ED) on the test table (300), the area where the electronic component (ED) is placed becomes a temporary area.

[0132] Exaggerated Figure 8 shows an example of a temporary zone (BZ) on a test table (300).

[0133] All temporary zones (BZ) can have their own positions on the X-axis, Y-axis, and Θ-axis.

[0134] The positioning zone refers to the location where the electronic component and the test zone (TZ) coincide. The exaggerated figure 9 shows the relationship between the temporary zone (BZ) and the positioning zone (RZ) on the test table (300).

[0135] The position zone (RZ) may be pre-set, but it may also be set to match the position and arrangement of the test zones (TZ) on the test board (TB) after the electronic components (ED) to be tested are loaded onto the test table (300).

[0136] The positioning zone (RZ) can be obtained from an image precisely scanned by a separate high-magnification camera attached to the test table (300) before the test operation of the handler (TH).

[0137] In Fig. 9, the temporary zone (BZ) has errors in the X-axis, Y-axis, and Θ-axis directions with respect to the fixed zone (RZ).

[0138] A relocation mechanism (500) is provided to precisely relocate the position of an electronic component (ED) loaded on a test table (300) in a relocation space (RS).

[0139] The relocation mechanism (500) is provided to relocate the position of an electronic component (ED) loaded on a test table (300) by the second picker hand (310) from a temporary zone (BZ) to a fixed zone (RZ).

[0140] According to the present embodiment, the second picker hand (310) loads the electronic components (ED) to be tested, which are unloaded from the transport table (110), into a temporary zone (BZ). Then, a relocation mechanism (500) is utilized to move the electronic components (ED) in the temporary zone (BZ) to the designated zone (RZ).

[0141] As shown in the schematic diagram of FIG. 10, the relocation mechanism (500) includes a relocation picker (510), a relocation camera (520), and a picker elevator (530).

[0142] The relocation mechanism (500) can be fixedly mounted on the frame forming the skeleton of the handler (TH).

[0143] The repositioning picker (510) can grasp or release the electronic component (ED). The repositioning picker (510) can grasp the electronic component (ED) by vacuum pressure.

[0144] The repositioning picker (510) is fixed in a horizontal position in the X-axis and Y-axis directions.

[0145] The relocation camera (520) is positioned apart from the relocation picker (510).

[0146] The repositioning camera (520) is fixed in position in the horizontal direction, which is the X-axis and Y-axis direction.

[0147] A repositioning camera (520) is provided to photograph electronic components (ED).

[0148] The picker elevator (530) raises the relocation picker (510).

[0149] It is preferable that the picker elevator (530) be equipped with a lifting motor so as to precisely control the lifting speed or lifting distance of the repositioning picker (510).

[0150] As in the example of FIG. 11, the repositioning camera (520) photographs identification marks (M: M1, M2) on the electronic component (ED). The identification marks (M) may be arranged diagonally opposite each other.

[0151] However, the object photographed by the relocation camera (520) to relocate the electronic component (ED) does not need to be limited to the identification mark (M). The object photographed by the relocation camera (520) may be replaced with the corner of the electronic component (ED), the identification pad or identification pattern of the electronic component (ED), or other identifiable objects.

[0152] The relocation picker (510) and the relocation camera (520) are bundled into a single module and fixed. The mutual placement positions of the relocation picker (510) and the relocation camera (520) are fixed.

[0153] The moving mechanism (600) can move the test table (300) in the horizontal direction, which is the X-axis and Y-axis direction.

[0154] The moving mechanism (600) can rotate the test table (300) in the Θ-axis direction.

[0155] The moving mechanism (600) can move the test table (300) up and down in the Z-axis direction.

[0156] As shown in the schematic excerpt of FIG. 12, the moving mechanism (600) includes a rotating mechanism (610), an elevator (620), a first moving mechanism (640), and a second moving mechanism (660).

[0157] The rotator (610) rotates the test table (300) in the Θ-axis direction.

[0158] The test table (300) can be rotated by the rotating mechanism (610) so that the angular position of the electronic component (ED) in the Θ-axis direction can be adjusted.

[0159] The elevator (620) raises the test table (300).

[0160] The test table (300) is connected to the elevator (620) via a rotating mechanism (610).

[0161] When the test table (300) is raised by the elevator (620), the electronic components (ED) of the test table (300) come into contact with the test pins (t), thereby electrically connecting the electronic components (ED) to the tester. When the test table (300) is lowered by the elevator (620), the contact between the electronic components (ED) and the test pins (t) is released, and the test table (300) becomes capable of moving in a horizontal direction.

[0162] The first moving device (640) moves the test table (300) in the X-axis direction.

[0163] By moving the test table (300) in the X-axis direction by the first moving device (640), the test table (300) can be selectively positioned in the relocation space (RS) and the test space (TS). Here, the test space (TS) is a space formed in the connection part (CP), and when the test table (300) is in the test space (TS), an electrical connection between the electronic component (ED) and the tester is made by the raising of the test table (300).

[0164] The second mover (660) moves the test table (300) in the Y-axis direction.

[0165] The above-mentioned moving mechanism (600) has four functions.

[0166] The first function is to move the test table (300) between the relocation space (RS) and the test space (TS).

[0167] The second function is to electrically connect or disconnect electronic components (ED) to the tester.

[0168] The third function is to raise and lower the test table (300) as it moves between the connection part (CP) and the relocation part (RP). This is because the test table (300) may be at different heights in the test space (TS) and the relocation space (RS) due to surrounding interference during the movement of the test table (300). However, it is more desirable for the test table (300) to be at the same height in the test space (TS) and the relocation space (RS).

[0169] The third function is for the relocation of electronic components (ED) in the relocation space (RS).

[0170] Since the repositioning picker (510) is fixed, the test table (300) moves in the horizontal X-axis and Y-axis directions or rotates in the Θ-axis direction to adjust the position of the electronic component (ED) on the horizontal plane.

[0171] Depending on the implementation, the test table (300) is raised during the relocation process of the electronic component (ED), thereby enabling the relocation picker (510) to grasp or release the electronic component (ED). However, it is more desirable to use a picker lifter (530) to raise the relocation picker (510) instead of raising the test table (300) during the relocation process, and to raise the test table (300) when electrically connecting the electronic component (ED) and the tester at the connection part (CP) to improve the contact precision between the electronic component and the tester.

[0172] Here, the operation during the relocation of electronic components (ED) is explained.

[0173] As shown in Fig. 9, the temporary zone (BZ) of the electronic component (ED) may differ from the fixed zone (RZ) in the X-axis, Y-axis, and Θ-axis directions.

[0174] The relocation camera (520) photographs the electronic component (ED) on the test table (300) and identifies the temporary zone (BZ) through the location of the identification mark (M).

[0175] When the temporary zone (BZ) is identified, the first mover (640) and the second mover (660) operate to position the center of the temporary zone (BZ) below the relocation picker (510), and the picker elevator (530) operates to lower the relocation picker (510).

[0176] When the repositioning picker (510) adsorbs and grasps the electronic component (ED) of the raised test table (300) by vacuum pressure, the picker elevator (530) operates to raise the repositioning picker (510). Afterward, the first moving device (640) and the second moving device (660) operate to align the center of the positioning zone (RZ) with the center of the electronic component (ED) grasped by the repositioning picker (510), and the rotating device (610) operates to align the electronic component (ED) with the positioning zone (RZ). In this state, the picker elevator (530) operates to lower the repositioning picker (510), thereby allowing the electronic component (ED) grasped by the repositioning picker (510) to settle in the positioning zone (RZ).

[0177] When the electronic component (ED) is fixed to the test table (300) by vacuum pressure applied through the vacuum hole (h) while the electronic component (ED) is seated in the positioning zone (RZ), the repositioning picker (510) releases the grip of the electronic component (ED). Then, the repositioning picker (510) rises and begins repositioning the next electronic component (ED).

[0178] The controller (800) controls the components necessary for the proper operation of the handler (TH), such as the transport shuttle (100), the first picker hand (210), the foreign matter removal mechanism (270), the second picker hand (310), the vacuum device (400), the relocation mechanism (500), the moving mechanism (600), and the condensation prevention mechanism (700).

[0179] Next, the method of operation of the handler (TH) according to the present invention is explained from the perspective of the logistics of electronic components (ED).

[0180] In the unloading section (LU), the first picker hand (210) loads electronic components (ED) to be tested onto a transport table (110) in the first area (A1).

[0181] When all the electronic components (ED) are loaded onto the transport table (110), the transport shuttle (100) operates and moves the transport table (110) to the second area (A2).

[0182] The second picker hand (310) unloads electronic components (ED) from the transport table (110) in the second area (A2) and moves them to the test table (300) in the relocation area (RS). At this time, the locations of the electronic components (ED) loaded onto the test table (300) by the second picker hand (310) are temporary zones (BZ).

[0183] When all the electronic components (ED) to be tested are loaded onto the test table (300), the controller (800) operates the relocation mechanism (500) and the moving mechanism (600) to relocate the electronic components (ED) from the temporary zones (BZ) to the fixed zones (RZ).

[0184] When the rearrangement of electronic components (ED) on the test table (300) is completed, the moving mechanism (600) operates to move the test table (300) to the test space (TS) formed in the connection part (CP). Afterwards, the connector (700) operates to raise the test table (300) toward the test board (TB) so that the electronic components (ED) are electrically connected to the tester.

[0185] When the testing of the electronic components (ED) is finished, the test table (300) is moved to the relocation section (RP) by the moving mechanism (600). Then, the second picker hand (310) moves the electronic components (ED) that have completed testing to the transport tray (110) in the second area (A2), and the transport tray (110) filled with the electronic components (ED) that have completed testing moves to the first area (A1). Subsequently, the first picker hand (210) unloads the electronic components (ED) that have completed testing from the transport table (110) and loads them onto an empty customer tray.

[0186] Based on the basic operation method described above, the electronic component (ED) is supplied to the tester for testing, and is retrieved after the test is completed.

[0187] <Explanation of the Closed Chamber>

[0188] The sealed chamber maintains the test temperature environment while increasing the efficiency of the condensation prevention mechanism (700).

[0189] It is desirable for the sealed chamber to be structured in such a way that the test space (TS) is isolated as much as possible from the outside air and the unloading area (LU).

[0190] According to the present embodiment, the sealed chamber accommodates a relocation portion (RP), a connection portion (CP), and a moving portion (MP) inside.

[0191] The condensation prevention device (700) injects dry air into the interior of the sealed chamber.

[0192] FIG. 13 is a schematic perspective view of a sealed chamber (900).

[0193] As shown in FIGS. 1 and FIGS. 13, the sealed chamber (900) has a protrusion (910) that protrudes toward the unloading portion (LU) so as to overlap with the unloading portion (LU) in a planar view.

[0194] An open hole (911) is formed on the upper surface of the protrusion (910) that corresponds to the first region (A1) in a planar view.

[0195] The transport table (110) in the first area (A1) can be exposed upward through the opening (911).

[0196] The electronic components (ED) to be tested can be introduced into the interior of the sealed chamber (900) from the unloading section (LU) through the opening (911).

[0197] The first picker hand (210) can move the electronic components (ED) to be tested into the interior of the sealed chamber (900) through the opening (911) and place them on the transport table (110) in the first area (A1).

[0198] The electronic components (ED) that have completed testing can exit from inside the sealed chamber (900) through the opening (911) and be moved to the unloading section (LU).

[0199] The first picker hand (210) can retrieve the tested electronic components (ED) from inside the sealed chamber (900) through the opening (911).

[0200] In order to maintain the temperature inside the sealed chamber (900), maintain the dry state inside the sealed chamber (900), and suppress the entry of foreign substances into the sealed chamber (900), the opening hole (911) needs to be opened only when necessary.

[0201] As in the example of FIG. 14, the handler (TH) has a switch (920) for opening and closing the opening hole (911).

[0202] The switch (920) automatically opens and closes the opening hole (911) while being controlled by the controller (800).

[0203] The opening / closing device (920) includes an opening / closing door (921) and an opening / closing mechanism (922).

[0204] The opening and closing door (921) is configured to move back and forth in the X-axis direction of the horizontal direction.

[0205] Depending on the moved position of the opening / closing door (921), the opening hole (911) is opened or closed.

[0206] The opening / closing mechanism (922) moves the opening / closing door (921) in the X-axis direction.

[0207] The opening / closing mechanism (922) moves the opening / closing door (921) to open or close the opening / closing door (921).

[0208] The interior of the sealed chamber (900) can be blocked as much as possible from the outside air and the unloading section (LU) by the opening / closing device (920), and the opening hole (911) can be opened only when necessary.

[0209] The controller (800) controls the opener (920) so that the opening hole (911) is opened only when the electronic component to be tested enters the interior of the sealed chamber (900) or when the electronic component that has been tested exits the interior of the sealed chamber (900).

[0210] Therefore, the quality of the air inside the sealed chamber (900) can be managed more strictly.

[0211] Let’s look at a few desirable examples regarding the control of the switch (920).

[0212] 1. First Example

[0213] The handler (TH) may have a position sensor (S) for detecting the position of the transport table (110).

[0214] The controller (800) controls the opening / closing mechanism (922) to open the opening / closing door (921) when the transport table (110) is detected by the position sensor (S) as the transport table (110) moves toward the opening hole (911).

[0215] When the necessary work (electronic component movement work) is completed with the opening hole (911) open, the controller (800) controls the opening / closing mechanism (922) to close the opening / closing door (921).

[0216] 2. Second Example

[0217] The controller (800) can be implemented to control the opening and closing mechanism (922) software-wise according to the position of the transport table (110).

[0218] The controller (800) may have software that tracks the position of the transport table (110) by arithmetic calculation.

[0219] When the transport table (110) moves toward the opening hole (911), the controller (800) controls the opening / closing mechanism (922) so that the opening / closing door (921) is opened just before or at the same time as the transport table (110) arrives at the opening hole (911).

[0220] In the second example, the controller (800) controls the opening and closing mechanism (922) according to the position of the transport table (110).

[0221] 3. Third Example.

[0222] It is sufficient for the opening hole (911) to be opened only when electronic components (ED) to be tested by the first picker hand (210) enter the interior of the sealed chamber (910) or when electronic components (ED) that have been tested by the first picker hand (210) exit from the interior of the sealed chamber (910).

[0223] Accordingly, the controller (800) can be implemented to control the opening / closing mechanism (922) according to the position of the first picker hand (210) to open / close the opening / closing door (921).

[0224] According to the third example, the controller (800) is implemented to control the opening and closing mechanism (922) software-wise according to the position of the first picker hand (210).

[0225] The controller (800) may have software that tracks the position of the first picker hand (210) by arithmetic calculation.

[0226] When the first picker hand (210) moves toward the opening hole (911), the controller (800) controls the opening / closing mechanism (922) so that the opening / closing door (921) is opened just before or at the same time as the second picker hand (210) arrives at the opening hole (911).

[0227] According to the third example, since the opening hole (911) is frequently opened and closed even during the process of moving the electronic component (ED), the internal environment of the sealed chamber (900) can be preserved to that extent.

[0228] 4. Fourth Example.

[0229] The opening / closing mechanism (922) can be implemented to manually open / close the opening / closing door (921) in conjunction with the movement of the transport table (110).

[0230] The opening and closing mechanism (922) includes a push rod (922a) and a spring (922b).

[0231] The push rod (922a) is provided on the transport table (110).

[0232] The pusher (922a) moves together with the transport table (110).

[0233] When the transport table (110) moves toward the opening hole (911), the pusher (922a) pushes the push plate (921a) on the opening / closing door (921) to open the opening / closing door (921).

[0234] The spring (922b) is provided as an elastic member that applies elastic force to the opening / closing door (921) in the direction in which the opening / closing door (921) closes.

[0235] The elastic force of the spring (922b) always acts in the direction that the opening / closing door (921) closes. Therefore, when the transport table (110) moves to the opposite side of the opening hole (911) and the push rod (922a) no longer pushes the push plate (921a), the opening / closing door (921) closes due to the action of the spring (922b).

[0236] <In the case of multiple transport tables>

[0237] Multiple transport tables may be provided in parallel in the Y-axis direction. In this case, the opening (911) may be formed as one large opening, but as shown in FIG. 16, two openings (911) may be formed in the Y-axis direction.

[0238] When two open holes (911) are formed, both open holes (911) can be implemented to be opened and closed by one opener (920).

[0239] However, for the sealing of the sealed chamber (900), it is preferable to form two opening holes (911) and to provide two opening / closing devices (920) that independently open and close the two opening holes (911).

[0240] The embodiments described above are merely preferred examples of the present invention and may have various applications. Therefore, the present invention should not be understood as being limited only to the contents described above. Instead, the scope of the present invention should be understood as the separately described claims and their equivalents.

Claims

1. An unloading section for supplying electronic components to be tested or retrieving electronic components for which testing is completed; A relocation section for relocating the positions of electronic components to be tested supplied from the above unloading section; A connection part that electrically connects the electronic components whose positions have been relocated in the above-mentioned relocation part to a tester; A moving section that moves electronic components to be tested from the above unloading section (LU) toward the above relocation section, and moves electronic components that have completed testing from the above relocation section toward the above unloading section; A sealed chamber that accommodates the above-mentioned relocation portion, the above-mentioned connecting portion, and the above-mentioned moving portion internally, and protrudes toward the above-mentioned unloading portion so as to overlap with the above-mentioned unloading portion in a planar view; A shut-off device for opening and closing an opening formed on the upper surface of the above-mentioned sealed chamber; and A controller that controls the above switch; including, The above unloading section is having a picker hand capable of moving electronic components to be tested into the interior of the sealed chamber through the opening or withdrawing electronic components that have been tested from the interior of the sealed chamber through the opening; The above switch An opening / closing door for opening and closing the above-mentioned opening; and An opening / closing mechanism for opening or closing the door by moving the door; Handler for testing electronic components.

2. In Paragraph 1, The above moving part is A transport shuttle having a movable transport table for transporting electronic components; and A position sensor that detects the position of the above transport table; comprising, The controller controls the opening / closing mechanism to open the opening / closing door when the transport table is detected by the position sensor as the transport table moves toward the opening hole. Handler for testing electronic components.

3. In Paragraph 1, The above moving part is A transport shuttle having a movable transport table for transporting electronic components; comprising, The above controller controls the opening and closing mechanism according to the position of the transport table to open and close the opening and closing door. Handler for testing electronic components.

4. In Paragraph 1, The above controller controls the opening and closing mechanism according to the position of the picker hand to open and close the opening and closing door. Handler for testing electronic components.

5. In Paragraph 1, The above opening / closing mechanism manually opens and closes the opening / closing door in conjunction with the movement of the above transport table. Handler for testing electronic components.

6. In Paragraph 5, The above opening and closing mechanism is A push rod provided on the above transport table for pushing and opening the opening / closing door when the above transport table moves toward the opening hole; and An elastic member that applies elastic force to the opening / closing door to close the opening / closing door when the transport table moves to the opposite side of the opening hole; Handler for testing electronic components.

7. In Paragraph 1, A condensation prevention mechanism capable of injecting dry air into the interior of the sealed chamber; further comprising Handler for testing electronic components.

8. In Paragraph 1, A foreign matter removal mechanism that removes foreign matter by blowing wind consisting of purified air into the above-mentioned unloading section; further comprising Handler for testing electronic components.

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