Liquid cooling unit, apparatus and method

Abstract

The present application relates to the field of liquid cooling for electronic devices, and more specifically to a liquid cooling unit, apparatus and method. Specifically, the liquid cooling unit comprises a liquid-cooled device node, a cooling liquid circulation system, and a refrigeration system, and further comprises a chassis; the liquid-cooled device node is mounted inside the chassis; the cooling liquid circulation system comprises a main liquid inlet pipe, branch liquid inlet pipes, a liquid return pipe, a liquid driving device, and a liquid storage container; one end of each branch liquid inlet pipe is connected to one end of the main liquid inlet pipe; one end of the liquid return pipe is connected to a liquid return port in the lower end of the chassis, the other end of the liquid return pipe is connected to the liquid storage container, and the liquid storage container is further connected to the main liquid inlet pipe; the liquid driving device is arranged on the main liquid inlet pipe or the liquid return pipe; the liquid storage container is connected to the refrigeration system; upon completion of heat exchange, cooling liquid flows out through a node liquid return port and accumulates at the bottom of the chassis, and the bottom of the chassis is an extended structure capable of storing liquid. The present application provides cooling for liquid-cooled devices, and mitigates the problems of an excessively slow cooling liquid return flow rate and excessively high pipeline maintenance costs.

Description

Liquid cooling unit, device and method TECHNICAL FIELD

[0001] The present application relates to the field of liquid cooling of electronic equipment, and more particularly to a liquid cooling unit, device and method. BACKGROUND

[0002] Electronic equipment includes some high-power components that generate a large amount of heat during operation. If the heat is not effectively dissipated in time, the equipment will overheat, affecting performance and even damaging hardware. Therefore, liquid cooling technology is needed to cool electronic equipment. The current mainstream liquid cooling technology routes include cold plate type, immersion type, and spraying type, and one or more of the liquid cooling technology is used in a liquid cooling cabinet to achieve cooling of electronic equipment. The current mainstream liquid cooling cabinet uses a liquid inlet pipe and a liquid return pipe to jointly transport and drain the cooling liquid. However, there are the following disadvantages: first, the cabinet installs multiple liquid cooling equipment nodes to cool multiple electronic equipment, and the connection of the liquid inlet and return pipes is complex, occupying a large space; second, the use of cooling liquid by a plurality of liquid distribution pipes converging into a main liquid pipe causes a large pressure in the main liquid pipe, increasing the maintenance cost of the main liquid pipe, and the flow rate of the main liquid pipe is also reduced. Therefore, the cooling liquid drainage scheme needs to be adjusted. TECHNICAL PROBLEM

[0003] The present application aims to overcome at least one of the above-mentioned defects of the prior art, and provides a liquid cooling unit, device and method for improving the slow return flow rate of the cooling liquid and the high cost of the liquid cooling unit, device and method. TECHNICAL SOLUTION

[0004] In a first aspect, a liquid cooling unit is provided, which includes at least one liquid cooling equipment node, a cooling liquid circulation system, and a refrigeration system, characterized in that the liquid cooling unit further includes a plug-in frame, and the liquid cooling equipment node is installed inside the plug-in frame; the liquid cooling equipment node is provided with one or more node liquid inlet ports and node liquid return ports, and the plug-in frame is provided with a plug-in frame liquid inlet port and a plug-in frame lower end liquid return port.

[0005] The cooling liquid circulation system includes a main liquid inlet pipe, a sub-liquid inlet pipe, a liquid return pipe, a liquid driving device, and a liquid storage container, wherein one liquid cooling equipment node corresponds to one or more sub-liquid inlet pipes, the liquid driving device and the liquid storage container are arranged outside the plug-in frame; the node liquid inlet port is connected to one end of the corresponding sub-liquid inlet pipe, and the other end of each sub-liquid inlet pipe is connected to one end of the main liquid inlet pipe through the plug-in frame liquid inlet port;

[0006] The liquid return pipe is connected with the liquid return port at the lower end of the plug-in frame, and the other end of the liquid return pipe is connected with the liquid storage container, and the liquid storage container is also connected with the main liquid inlet pipe; the liquid driving device is arranged on the main liquid inlet pipe or the liquid return pipe; the liquid storage container is connected with the refrigeration system.

[0007] After the cooling liquid completes temperature exchange at the liquid cooling device node, the cooling liquid flows out through the node liquid return port of the liquid cooling device node and is collected at the bottom of the plug-in frame, wherein the bottom of the plug-in frame is an extended structure capable of storing liquid.

[0008] Specifically, the liquid cooling unit is used for liquid cooling of the liquid cooling device, and by improving the pipeline design of the cooling liquid circulation system, the cooling liquid directly flows out of the liquid cooling device node through the node liquid return port and is collected at the bottom of the plug-in frame under the action of gravity, so that multiple liquid cooling device nodes can simultaneously return liquid without pipeline pressure, the use and maintenance of the liquid return pipe are reduced, and the purposes of improving the slow cooling liquid return flow rate and relieving the high maintenance pipeline cost are achieved.

[0009] Optionally, the liquid cooling device node comprises a node shell and one or more liquid cooling devices arranged in the node shell, and the one or more liquid cooling devices realize one or more liquid cooling modes of spray liquid cooling, immersion liquid cooling, and cold plate liquid cooling.

[0010] Specifically, the liquid cooling device node can realize a liquid cooling mode combining one or more technologies of spray, immersion, and cold plate of mainstream liquid cooling technology, so as to efficiently and accurately cool the electronic device.

[0011] Optionally, when the one or more liquid cooling devices realize the spray liquid cooling mode, the node liquid return port is arranged at the lower end of the node shell.

[0012] Specifically, when the spray liquid cooling mode is realized, the node liquid return port is arranged at the lower end of the node shell, so that the cooling liquid can be collected at the bottom of the liquid cooling device node after being sprayed on the liquid cooling device, and finally flows out through the node liquid return port arranged at the lower end of the node shell, thereby realizing the return of the cooling liquid.

[0013] Optionally, when the one or more liquid cooling devices realize the immersion liquid cooling mode, the node liquid return port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device.

[0014] Specifically, when the immersion liquid cooling mode is realized, the node liquid return port should be arranged at the middle position of the node shell which is higher than the upper surface of the liquid cooling device, so as to form a liquid level higher than the liquid cooling device, immerse the liquid cooling device in the cooling liquid, and realize immersion heat dissipation.

[0015] Optionally, when one or more of the liquid cooling devices implement cold plate liquid cooling mode, the sub-liquid inlet pipe enters the liquid cooling device node through the node liquid inlet, and is closely attached to the liquid cooling device.

[0016] Optionally, when one or more of the liquid cooling devices implement cold plate liquid cooling mode, the liquid cooling device node further comprises a cold plate attached to the liquid cooling device, the cold plate is connected with the sub-liquid inlet pipe, and is closely attached to the liquid cooling device.

[0017] Specifically, when the cold plate liquid cooling mode is implemented, two schemes are included: one is to perform liquid cooling on the liquid cooling device through the sub-liquid inlet pipe, and the sub-liquid inlet pipe is connected with the node liquid return port of the liquid cooling device node to realize the return flow of the cooling liquid; the other is that the cooling liquid enters the cold plate through the sub-liquid inlet pipe, and the cooling liquid is closely attached to the upper surface of the liquid cooling device through the lower surface of the cold plate, so as to realize the liquid cooling on the liquid cooling device. The above two schemes can realize cold plate liquid cooling, and the scheme can be selected and installed as needed in actual liquid cooling work.

[0018] Optionally, when one or more of the liquid cooling devices implement spray liquid cooling and immersion liquid cooling mode, the node liquid return port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device.

[0019] Optionally, when one or more of the liquid cooling devices implement spray liquid cooling and cold plate liquid cooling mode, and the node liquid return port is arranged at the lower end of the node shell; the sub-liquid inlet pipe enters the liquid cooling device node through the node liquid inlet, and is closely attached to the liquid cooling device; or,

[0020] When one or more of the liquid cooling devices implement spray liquid cooling and cold plate liquid cooling mode, the node liquid return port is arranged at the lower end of the node shell; the liquid cooling device node further comprises a cold plate attached to the liquid cooling device, the cold plate is connected with the sub-liquid inlet pipe, and is closely attached to the liquid cooling device.

[0021] Optionally, when one or more of the liquid cooling devices implement immersion liquid cooling and cold plate liquid cooling mode, the node liquid return port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the sub-liquid inlet pipe enters the liquid cooling device node through the node liquid inlet, and is closely attached to the liquid cooling device; or, when one or more of the liquid cooling devices implement immersion liquid cooling and cold plate liquid cooling mode, the node liquid return port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the liquid cooling device node further comprises a cold plate attached to the liquid cooling device, the cold plate is connected with the sub-liquid inlet pipe, and is closely attached to the liquid cooling device.

[0022] Optionally, when one or more of the liquid cooling devices implement spray liquid cooling, immersion liquid cooling, and cold plate liquid cooling, the node return port is located in the middle of the node housing, and the middle position is higher than the upper surface of the liquid cooling device; the branch inlet pipe enters the liquid cooling device node through the node inlet and is closely attached to the liquid cooling device; or, when one or more of the liquid cooling devices implement spray liquid cooling, immersion liquid cooling, and cold plate liquid cooling, the node return port is located in the middle of the node housing, and the middle position is higher than the upper surface of the liquid cooling device; the liquid cooling device node also includes a cold plate that is attached to the liquid cooling device, the cold plate is connected to the branch inlet pipe, and is closely attached to the liquid cooling device.

[0023] Specifically, the above scheme introduces liquid cooling methods that combine spraying, immersion, and cold plates in pairs or all three, all of which can achieve the best effect of liquid cooling by combining multiple technologies.

[0024] Optionally, the spray liquid cooling method is implemented by a first spray device and / or a second spray device installed inside the node of the liquid cooling equipment;

[0025] The spray liquid cooling method is implemented as follows:

[0026] The first spray device is used to spray all the liquid cooling equipment in the liquid cooling equipment node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling equipment node; or,

[0027] The second spray device is used to spray each of the liquid cooling devices in the liquid cooling equipment node on a one-to-one basis; or...

[0028] Simultaneously, the first spray device and the second spray device are used to spray the liquid cooling equipment. The first spray device is used to spray all the liquid cooling equipment in the liquid cooling equipment node in a one-to-many manner. The first spray device is located at the top inside the liquid cooling equipment node. The second spray device is used to spray one or more of the liquid cooling equipment in the liquid cooling equipment node in a one-to-one manner.

[0029] Preferably, the cross-section of the second spray device is a U-shaped structure, and the second spray device is provided with a liquid chamber one and a liquid chamber two. The liquid chamber one and the liquid chamber two are isolated by a card plate with a jet hole. The bottom of the second spray device is in contact with the surface of the liquid cooling equipment. The lower end of the second spray device is provided with a liquid return port of the liquid chamber two that communicates with the inside of the node of the liquid cooling equipment.

[0030] Specifically, the liquid cooling device node further comprises a first spraying device and a second spraying device, spraying is performed using the first spraying device and / or the second spraying device, the first spraying device can realize large-scale spraying in a one-to-many manner on all liquid cooling devices of the liquid cooling device node; the second spraying device can realize spraying in a one-to-one manner on each liquid cooling device, so that the cooling liquid is more directly in contact with the liquid cooling device, the efficiency of liquid cooling is improved, and after the cooling liquid completes the liquid cooling work, the cooling liquid directly enters the inside of the shell through the second liquid return port of the cold plate liquid cavity and is then discharged, thereby saving a part of the pipeline usage and reducing the liquid cooling cost.

[0031] Optionally, the vertical distance between the outlet of the jet hole and the surface of the liquid cooling device is 0.5-5 mm.

[0032] Specifically, controlling the vertical distance between the jet hole in the second spraying device and the surface of the liquid cooling device can keep the cooling liquid sprayed to the liquid cooling device at a sufficient liquid pressure, thereby achieving the effect of rapid and efficient liquid cooling.

[0033] Optionally, a jet pipe is installed on the jet hole, one end of the jet pipe is installed on the jet hole, and the other end of the jet pipe has an outlet at a certain distance from the surface of the liquid cooling device.

[0034] Specifically, by arranging the jet pipe, the cooling liquid entering the liquid cavity one can enter the jet pipe through the jet hole and then exit the jet pipe to cool the surface of the liquid cooling device. By controlling the length of the jet pipe, the distance between the outlet of the jet pipe and the surface of the liquid cooling device can be controlled, so that the exit pressure of the cooling liquid exiting the jet pipe can be well controlled, thereby achieving the optimal cooling effect.

[0035] Optionally, the vertical distance between the outlet of the other end of the jet pipe and the surface of the liquid cooling device is 0.5-5 mm.

[0036] Specifically, controlling the vertical distance between the outlet of the other end of the jet pipe and the surface of the liquid cooling device can keep the cooling liquid sprayed to the liquid cooling device at a sufficient liquid pressure after exiting the jet pipe, thereby achieving the effect of rapid and efficient liquid cooling.

[0037] In a second aspect, a liquid cooling device is provided, wherein the liquid cooling device comprises a plurality of liquid cooling units and a cabinet body on which the liquid cooling units are installed, and the cabinet body is provided with a cabinet body through hole through which the main liquid inlet pipe and the liquid return pipe pass.

[0038] Specifically, the liquid cooling unit can be used alone or integrated in a liquid cooling device, maximizing the integration of liquid cooling units, saving installation space, and utilizing the design inside the liquid cooling unit to achieve the effect of simultaneously liquid cooling multiple liquid cooling devices in multiple ways.

[0039] Optionally, the liquid cooling unit is provided with a top liquid return port of the insertion frame; the installation mode of the plurality of liquid cooling units in the cabinet is from top to bottom connection, and the cooling liquid returns in series.

[0040] The main liquid inlet pipe enters the cabinet through the cabinet through hole, and then enters the insertion frame of each liquid cooling unit through the liquid inlet port of each liquid cooling unit.

[0041] The top liquid return port of the liquid cooling unit located at the top of the cabinet is in a closed state, and the lower end liquid return port of the insertion frame of the liquid cooling unit located at the bottom of the cabinet is connected to the liquid storage container through the liquid return pipe; in addition to the top liquid return port of the liquid cooling unit located at the top of the cabinet and the lower end liquid return port of the insertion frame of the liquid cooling unit located at the bottom of the cabinet, the lower end liquid return port of the insertion frame of the other liquid cooling units in the cabinet is connected to the top liquid return port of the liquid cooling unit located below and adjacent to the other liquid cooling units through the liquid return pipe.

[0042] Optionally, the installation mode of the plurality of liquid cooling units in the cabinet is from top to bottom or from left to right connection, and the cooling liquid returns in parallel.

[0043] The main liquid inlet pipe enters the cabinet through the cabinet through hole, and then enters the insertion frame of each liquid cooling unit through the liquid inlet port of each liquid cooling unit.

[0044] The lower end liquid return port of the insertion frame of each liquid cooling unit is connected to the liquid storage container through the liquid return pipe.

[0045] Specifically, two liquid cooling units are connected by a liquid return pipe, and the cooling liquid enters the liquid cooling unit from the main liquid inlet pipe and then enters the liquid cooling device node from the branch liquid inlet pipe for liquid cooling; the cooling liquid returns in series, reducing the use of liquid return pipes and reducing installation costs; the liquid cooling unit can also be connected from top to bottom or from left to right, and the cooling liquid returns in parallel, realizing the diversification of the installation mode of the liquid cooling unit.

[0046] In a third aspect, a liquid cooling method is provided for liquid cooling the liquid cooling unit of the first aspect, the method comprising:

[0047] Obtaining the attribute information of the liquid cooling unit that needs to be liquid cooled and the target temperature required by the liquid cooling device in the liquid cooling unit after liquid cooling.

[0048] select the liquid cooling mode according to the attribute information and the target temperature, and use the corresponding liquid cooling mode to liquid cool the liquid cooling device nodes in the liquid cooling unit;

[0049] monitor the liquid cooling state of the liquid cooling unit in real time to adjust the liquid cooling work of the liquid cooling device nodes according to the monitoring result;

[0050] The attribute information of the liquid cooling unit includes the size of the frame, the number of the liquid cooling device nodes and the liquid cooling attribute of the nodes, the size of the node liquid inlet, the node liquid return port, the frame liquid inlet and the lower end liquid return port of the frame, and the size of the branch liquid inlet pipe, the main liquid inlet pipe and the liquid return pipe.

[0051] The liquid cooling mode includes spray liquid cooling, immersion liquid cooling, cold plate liquid cooling, and two or three combined liquid cooling of spray, immersion and cold plate.

[0052] Specifically, the method provides a strategy for using different liquid cooling modes for liquid cooling of the liquid cooling unit, and realizes individualized liquid cooling of the liquid cooling unit. Advantages

[0053] The liquid cooling unit, device and method of the present application improve the cooling liquid circulation system, abandon the traditional cooling liquid use multiple liquid return pipes to collect the scheme, so that the cooling liquid of the liquid cooling device node can be directly discharged through the liquid return port, and then collected at the bottom of the frame, and then discharged through the lower end liquid return port of the frame and returned to the liquid storage container. The liquid cooling unit, device and method of the present application are applied to liquid cooling of electronic devices and the like, and improve the problems of slow cooling liquid return flow rate and high maintenance pipeline cost, and realize efficient liquid cooling; at the same time, different liquid cooling modes can be selected according to the needs and attributes of different types of liquid cooling units, and individualized liquid cooling of various liquid cooling units can be realized. BRIEF DESCRIPTION OF DRAWINGS

[0054] Fig. 1 is a side view of the liquid cooling unit provided in the present embodiment.

[0055] Fig. 2 is a schematic diagram of a liquid cooling device node for realizing spray liquid cooling.

[0056] Fig. 3 is a schematic diagram of a liquid cooling device node for realizing immersion liquid cooling.

[0057] Fig. 4 is a schematic diagram of a liquid cooling device node for realizing spray and immersion liquid cooling.

[0058] Fig. 5 is a schematic diagram of a liquid cooling device node for realizing spray and cold plate liquid cooling.

[0059] Fig. 6 is a schematic diagram of a liquid cooling device node for realizing immersion and cold plate liquid cooling according to the embodiment.

[0060] Fig. 7 is a schematic diagram of a liquid cooling device node for realizing spray, immersion and cold plate liquid cooling according to the embodiment.

[0061] Fig. 8 is a schematic diagram of installation of multiple liquid cooling units in a liquid cooling device according to the embodiment.

[0062] Fig. 9 is a schematic diagram of mixed installation of multiple liquid cooling units and liquid cooling device nodes in a liquid cooling device according to the embodiment.

[0063] Fig. 10 is a structural diagram of a second spray device according to the embodiment.

[0064] Fig. 11 is a schematic diagram of a liquid cooling device node for realizing air cooling and cold plate liquid cooling according to the embodiment.

[0065] Fig. 12 is a flow chart of a liquid cooling method according to the embodiment.

[0066] Fig. 13 is a schematic diagram of a liquid cooling device node according to the embodiment. Embodiments of the present application

[0067] The drawings in the present application are only used for illustrative purposes and should not be understood as limiting the present application. In order to better illustrate the following embodiments, some components in the drawings may be omitted, enlarged or reduced, and do not represent the actual product size. It is understandable for those skilled in the art that some well-known structures and their descriptions in the drawings may be omitted.

[0068] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor should be within the scope of protection of the present application.

[0069] It is to be understood that the terms "first", "second", and the like, used in the description and the claims of the present application as well as the above description of the drawings merely refer to different categories and do not necessarily imply a sequence or order of importance, unless otherwise indicated by the context. It is to be understood that the use of the terms first, second, etc., in the description and the claims of the present application as well as the above description of the drawings is merely to distinguish between similar objects and cannot be construed as implying a sequence or order of importance. Furthermore, the terms "comprise" and "have" and any variations thereof are intended to cover a non-exclusive inclusion, for example, a process, method, system, product, or apparatus that comprises a list of steps or units is not necessarily limited to those steps or units that are clearly listed, but can include other steps or units that are not clearly listed or inherent to such processes, methods, products, or apparatuses.

[0070] Exemplarily, the embodiment provides a liquid cooling unit. As shown in FIG. 1, a side view of a liquid cooling unit is provided, which comprises a plug-in frame 4, a liquid cooling device node 11 and a cooling liquid circulation system. The liquid cooling device node 11 is installed inside the plug-in frame 4. The liquid cooling device node 11 is installed through the mounting structure provided inside the plug-in frame 4. Preferably, the mounting structure can be a clamping groove. It can be understood that the clamping groove of the plug-in frame 4 can be adapted to the specifications of the liquid cooling device node 11, including length, height and width, etc., so as to be installed smoothly. The installation mode can be push-pull clamping groove installation, direct bearing clamping groove installation, etc., and the installation mode is not specially required.

[0071] Specifically, the plug-in frame is provided with a plug-in frame front door 12 and a plug-in frame rear door 13, which provide a passage for the installation work of the liquid cooling device node 11 and facilitate the maintenance of the liquid cooling device node 11. It should be understood that the plug-in frame front door 12 and the plug-in frame rear door 13 should be in a closed state when the liquid cooling unit is working. It can be understood that when the plug-in frame front door 12 and the plug-in frame rear door 13 are in a closed state, the gap between the door frames should be sealed to prevent liquid leakage;

[0072] The plug-in frame 4 is also provided with a plug-in frame liquid inlet 3 and a plug-in frame lower end liquid return port 2. The plug-in frame liquid inlet 3 is a passage for the main liquid inlet pipe 7 to enter the plug-in frame 4, and the position of the plug-in frame liquid inlet 3 is not specially required. Preferably, the plug-in frame liquid inlet 3 can be designed near one side of the plug-in frame front door 12 or the plug-in frame rear door 13, which is convenient for connecting with the main liquid return pipe. The plug-in frame lower end liquid return port 2 needs to be arranged at the bottom of the plug-in frame 4, so that the cooling liquid collected at the bottom of the plug-in frame can smoothly flow out of the plug-in frame into the liquid return pipe 15. Preferably, the plug-in frame lower end liquid return port 2 can also be designed near one side of the plug-in frame front door 12 or the plug-in frame rear door 13, which is convenient for connecting with the liquid return pipe;

[0073] Specifically, the cooling liquid circulating system comprises a main liquid inlet pipe 7, a sub liquid inlet pipe 8, a liquid return pipe 15, a liquid driving device 6 and a liquid storage container 5, wherein one liquid cooling device node 11 corresponds to one or more sub liquid inlet pipes 8. The node liquid inlet 9 is connected to one end of the corresponding sub liquid inlet pipe 8, and the other end of each sub liquid inlet pipe 8 is connected to one end of the main liquid inlet pipe 7 through the plug-in frame liquid inlet 3.

[0074] Specifically, the liquid cooling device node 11 is provided with one or more node liquid inlets 9 and node liquid outlets 10. It can be understood that the liquid cooling device node 11 can be cooled in different ways, and the number and position of the node liquid inlets 9 and node liquid outlets 10 required by different cooling methods will change accordingly, so one liquid cooling device node 11 needs to correspond to one or more node liquid inlets 9 and node liquid outlets 10 according to different cooling methods; it can be understood that because one liquid cooling device node 11 corresponds to one or more node liquid inlets 9, the multi-way input of cooling liquid is realized, so the number of sub liquid inlet pipes 8 needs to correspond to the number of node liquid inlets 9, and the corresponding sub liquid inlet pipes 8 and node liquid inlets 9 are connected one by one.

[0075] It can be understood that the other end of each sub liquid inlet pipe 8 is connected to one end of the main liquid inlet pipe 7 through the plug-in frame liquid inlet 3, so that the cooling liquid is distributed to each sub liquid inlet pipe 8 through the main liquid inlet pipe 7, and then enters each liquid cooling device node 11.

[0076] Specifically, the cooling liquid driving device 6 and the liquid storage container 5 are arranged outside the plug-in frame 4; it can be understood that the inside of the liquid storage container 5 is provided with a liquid return chamber and a new liquid chamber, the liquid return chamber and the new liquid chamber are isolated by a temperature isolation plate and do not communicate with each other, and both the liquid return chamber and the new liquid chamber are provided with liquid outlets (not shown in the figure); one end of the liquid return pipe 15 is connected to the plug-in frame lower end liquid return port 2, the other end of the liquid return pipe 2 is connected to the liquid return chamber of the liquid storage container 5, and the new liquid chamber of the liquid storage container 5 is also connected to the main liquid inlet pipe 7.

[0077] Specifically, the liquid return chamber and the liquid inlet chamber of the liquid storage container 5 are respectively connected to the refrigeration system; it can be understood that the cooling liquid in the liquid return chamber of the liquid storage container 5 is recovered after completing the liquid cooling work, and the temperature of the cooling liquid is higher than the initial state of the cooling liquid because it has experienced the process of absorbing the heat of the liquid cooling device. Therefore, the cooling liquid in the liquid return chamber is transported to the refrigeration system for cooling, and the cooling liquid cooled to the initial state is returned to the new liquid chamber of the liquid storage container 5 for the next round of liquid cooling work. It can be understood that the initial state of the cooling liquid refers to the temperature at which the cooling liquid can be used to dissipate heat from the liquid cooling device with the highest efficiency, and the temperature value of the initial state needs to be balanced according to the liquid cooling demand of the liquid cooling device and the energy consumption of the liquid cooling unit. According to the above connection, the cooling liquid forms a circulating closed loop outside the plug-in frame 4.

[0078] It can be understood that the liquid driving device 6 is arranged on the main liquid inlet pipe 7 or the liquid return pipe 15, so as to provide power for the cooling liquid and complete the circulation of the cooling liquid in the liquid cooling unit.

[0079] It can be understood that the pipeline of the liquid cooling unit includes the main liquid inlet pipe 7 and the liquid return pipe 15, and the liquid port of the liquid cooling unit includes the plug-in frame liquid inlet port 3, the plug-in frame top liquid return port 1 and the plug-in frame lower end liquid return port 2; preferably, the pipeline and the liquid port of the liquid cooling unit can be arranged on one side of the plug-in frame front door 12 or the plug-in frame rear door 13; correspondingly, the liquid port of the liquid cooling device node includes the node liquid inlet port 9 and the node liquid return port 10, and the liquid port of the liquid cooling device node should also be designed on the side close to the plug-in frame front door or the plug-in frame rear door, so that each plug-in frame liquid port, each liquid cooling device node liquid port and each plug-in frame pipeline are conveniently connected, so that the layout is clear and maintenance is convenient.

[0080] Specifically, the cooling liquid flows from the liquid storage container 5 into the main liquid inlet pipe 7, is branched from the main liquid inlet pipe 7 into each branch liquid inlet pipe 8, and enters the corresponding liquid cooling device node 11 through each branch liquid inlet pipe 8 to perform liquid cooling; the cooling liquid completing the liquid cooling work flows out of the node liquid return port 10 of the liquid cooling device node 11 and is collected at the bottom of the plug-in frame 4, and finally enters the liquid return pipe 15 through the plug-in frame lower end liquid return port 2 and flows into the liquid storage container 5 through the liquid return pipe 15.

[0081] Compared with the pipeline scheme of the traditional cooling liquid circulation, the application reduces the use amount of the liquid return pipe 15, can save the cost of pipeline materials, and prevents the complex pipeline layout; moreover, the cooling liquid directly flows out of the node liquid return port 10 of the liquid cooling device node 11 and is collected at the bottom of the plug-in frame 4, so that the cooling liquid is recovered, the pressure of the liquid return pipeline is reduced, the liquid cooling unit failure caused by excessive pipe pressure of the liquid return pipe 15 is prevented, and the efficiency of the liquid cooling work is improved.

[0082] Optionally, the liquid cooling device node 11 includes a node shell 51 and one or more liquid cooling devices arranged in the node shell 51, and the one or more liquid cooling devices realize one or more liquid cooling modes of spray liquid cooling, immersion liquid cooling and cold plate liquid cooling based on the cooling liquid input by the branch liquid inlet pipe 8.

[0083] Optionally, when the one or more liquid cooling devices realize the spray liquid cooling mode based on the cooling liquid input by the branch liquid inlet pipe 8, the node liquid return port 10 is arranged at the lower end of the node shell 51. As shown in FIG. 2, a schematic diagram of the liquid cooling device node realizing the spray liquid cooling in the embodiment is provided.

[0084] Exemplarily, the liquid cooling device includes a secondary liquid cooling device 57 and a primary liquid cooling device 58. The PCB board 54 is a basic component for supporting and connecting the liquid cooling device, which provides a mechanical basis for the liquid cooling device and realizes the electrical connection between the devices through a series of conductive paths (usually copper foil).

[0085] Specifically, the secondary liquid cooling device 57 and the primary liquid cooling device 58 in FIG. 2 exchange heat through the cooling liquid sprayed by the first spraying device 53 located at the top of the node shell 51. The cooling liquid enters the first spraying device 53 in the liquid cooling device node 11 through the node inlet 9 of the liquid inlet pipe 8. It can be understood that the first spraying device 53 is provided with a spraying cavity, and the lower surface of the spraying cavity is provided with a plurality of spraying holes, which can realize the downward spraying of the cooling liquid.

[0086] It can be understood that the liquid inlet diameter of the first spraying device 53 is much larger than the hole diameter of the spraying hole, so that the flow rate of the cooling liquid flowing into the first spraying device is much larger than the spraying speed of the cooling liquid. Therefore, the cooling liquid can quickly fill the spraying cavity, apply pressure to the downwardly sprayed cooling liquid, and provide power. The downwardly sprayed cooling liquid exchanges heat after contacting the secondary liquid cooling device 57 and the primary liquid cooling device 58, and then flows out at the node return liquid outlet 10.

[0087] The node return liquid outlet 10 is arranged at the lower end of the node shell 51, so that the cooling liquid collected at the bottom of the liquid cooling device node 11 can smoothly flow out from the node return liquid outlet 10.

[0088] Alternatively, when one or more of the liquid cooling devices realize immersion liquid cooling based on the cooling liquid input by the liquid inlet pipe 8, the node return liquid outlet 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device. As shown in FIG. 3, a schematic diagram of the liquid cooling device node of the present embodiment realizing immersion liquid cooling is provided.

[0089] Exemplarily, the secondary liquid cooling device 57 and the primary liquid cooling device 58 in FIG. 3 exchange heat by immersion in the cooling liquid. The cooling liquid enters the liquid cooling device node through the node inlet 9 of the liquid inlet pipe 8; the node return liquid outlet 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the secondary liquid cooling device 57 and the primary liquid cooling device 58, so that the cooling liquid can be collected at the bottom of the liquid cooling device node before flowing out of the node return liquid outlet 10, and the liquid level of the secondary liquid cooling device 57 and the primary liquid cooling device 58 is accumulated to immerse the secondary liquid cooling device 57 and the primary liquid cooling device 58.

[0090] Alternatively, when one or more of the liquid cooling devices realize cold plate liquid cooling based on the cooling liquid input by the liquid inlet pipe 8, the cooling liquid realizes liquid cooling on the liquid cooling device through the liquid inlet pipe 8. This includes the following two schemes:

[0091] One is that the distribution liquid inlet pipe 8 is arranged in a disc return mode on the upper surface of the liquid cooling device, and the wall of the disc return distribution liquid inlet pipe 8 is closely attached to the liquid cooling device, so as to increase the contact area of the distribution liquid inlet pipe 8 and the liquid cooling device, thereby fully exchanging heat with the liquid cooling device; the other end of the distribution liquid inlet pipe 8 is connected with the node liquid return port 10, and the cooling liquid after completing the liquid cooling flows out of the node shell 51 from the node liquid return port 10 through the distribution liquid inlet pipe 8;

[0092] Two is that the cooling liquid enters the cold plate through the distribution liquid inlet pipe 8, the inside of the cold plate is a cold plate cavity, and the cold plate cavity comprises a cold plate liquid inlet port and a cold plate liquid return port; the cooling liquid enters the cold plate cavity through the cold plate liquid inlet port, and is discharged through the cold plate liquid return port after completing the heat exchange.

[0093] The cooling liquid is discharged in two ways: one is that the cold plate liquid return port is externally connected with a liquid return pipe, and the cooling liquid flows out of the node shell 51 through the liquid return pipe; the other is that the cold plate liquid return port is not connected with the liquid return pipe, and the cooling liquid directly flows into the inside of the node shell 51 and flows out of the node shell 51 through the liquid return port of the liquid cooling device node.

[0094] Optionally, when one or more of the liquid cooling devices realize the spray liquid cooling and immersion liquid cooling mode based on the cooling liquid input by the distribution liquid inlet pipe, the node liquid return port 10 is arranged at a middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device. As shown in FIG. 4, a schematic diagram of a liquid cooling device node of the embodiment realizing the spray and immersion liquid cooling is provided.

[0095] Specifically, the secondary liquid cooling device 57 and the main liquid cooling device 58 in FIG. 4 can exchange heat not only through the cooling liquid sprayed by the first spray device 53 located at the top of the node shell 51, but also through immersion in the cooling liquid. The first spray device 53 enters the first spray device 53 through the distribution liquid inlet pipe 8; it can be understood that the first spray device 53 is provided with a spray cavity, and a plurality of spray holes are arranged on the lower surface of the spray cavity corresponding to the secondary liquid cooling device 57 and the main liquid cooling device 58, so as to realize downward spraying of the cooling liquid; the flow rate design between the first spray device 53 is the same as the above description of realizing the spray liquid cooling, and will not be described here. The downward sprayed cooling liquid is collected at the bottom position of the liquid cooling device node 11 after exchanging heat with the liquid cooling device;

[0096] The node liquid return port 10 is arranged at a middle position of the node shell 51, and the middle position is higher than the upper surface of the secondary liquid cooling device 57 and the main liquid cooling device 58, so that the cooling liquid can accumulate to a liquid level higher than the secondary liquid cooling device 57 and the main liquid cooling device 58 at the bottom of the liquid cooling device node before flowing out of the node liquid return port 10, thereby realizing immersion liquid cooling for the secondary liquid cooling device 57 and the main liquid cooling device 58.

[0097] Optionally, when one or more of the liquid cooling devices achieve the spray liquid cooling and cold plate liquid cooling mode based on the cooling liquid input by the sub-liquid pipe, the node liquid return port 10 is arranged at the lower end of the node shell 51; the cooling liquid cools the liquid cooling device through the sub-liquid pipe 8, and the other end of the sub-liquid pipe 8 is connected with the node liquid return port 10; the cooling liquid that has completed the liquid cooling work flows out of the node shell 51 through the sub-liquid pipe 8 from the node liquid return port 10; or it includes a cold plate that is attached to the liquid cooling device, the cooling liquid enters the cold plate through the sub-liquid pipe 8 to cool the liquid cooling device, and the cooling liquid that has completed the liquid cooling work flows out of the cold plate and enters the node shell 51; as shown in FIG. 5, a liquid cooling device node schematic diagram for realizing the spray and cold plate liquid cooling of the embodiment is provided.

[0098] Specifically, the secondary liquid cooling device 57 in FIG. 5 exchanges heat with the cooling liquid sprayed by the first spray device 53 located at the top of the node shell 51, and the primary liquid cooling device 58 exchanges heat in the cold plate liquid cooling mode. It can be understood that the cold plate liquid cooling of the primary liquid cooling device 58 is the same as the introduction of the above two schemes for realizing the cold plate liquid cooling, and will not be repeated here. In terms of spraying, the cooling liquid enters the first spray device 53 through the sub-liquid pipe 8; it can be understood that the first spray device is provided with a spray cavity, and a plurality of spray holes are arranged on the lower surface of the spray cavity corresponding to the secondary liquid cooling device 57, which can realize downward spraying of the cooling liquid; the flow rate design between the first spray device 53 is the same as the introduction of the above-mentioned spray liquid cooling mode, and will not be repeated here. The cooling liquid sprayed downward exchanges heat after contacting the secondary liquid cooling device 57, and finally flows out of the node liquid return port 10 of the liquid cooling device node 11. The node liquid return port 10 is arranged at the lower end of the node shell 51, so that the cooling liquid collected at the bottom of the liquid cooling device node 11 can flow out of the node liquid return port 10 smoothly. In the specific implementation process, the secondary liquid cooling device 57 can also be cooled by the cold plate liquid cooling mode, and the primary liquid cooling device 58 can also be cooled by the spray liquid cooling mode, and the specific implementation mode will not be repeated here.

[0099] Optionally, when one or more of the liquid cooling devices achieve immersion liquid cooling and cold plate liquid cooling based on the cooling liquid input by the liquid distribution pipe 8, the node liquid return port 10 is arranged at a middle position of the node housing 51, and the middle position is higher than the upper surface of the liquid cooling device; the cooling liquid is used to liquid cool the liquid cooling device through the liquid distribution pipe 8, and the other end of the liquid distribution pipe 8 is connected with the node liquid return port 10; the cooling liquid after completing the liquid cooling flows out of the node housing 51 through the liquid distribution pipe 8 from the node liquid return port 10; or it includes a cold plate attached to the liquid cooling device, the cooling liquid enters the cold plate through the liquid distribution pipe 8 to liquid cool the liquid cooling device, and the cooling liquid after completing the liquid cooling flows out of the cold plate into the node housing 51. It can be understood that the cold plate liquid cooling adopted by the liquid cooling device is the same as the introduction of the above two schemes for achieving cold plate liquid cooling, and will not be repeated here. As shown in FIG. 6, a liquid cooling device node schematic diagram for achieving immersion and cold plate liquid cooling is provided.

[0100] Exemplarily, the main liquid cooling device 58 in FIG. 6 is in full contact with the lower surface of the cold plate 59 to exchange heat, and the cooling liquid after completing the liquid cooling work in the cold plate 59 flows out of the inside of the liquid cooling device node 11 through the cold plate liquid return port 63 and gathers at the bottom thereof. When the cooling liquid gathered at the bottom position of the liquid cooling device node 11 is sufficient, the liquid level of the cooling liquid is higher than the height of the liquid cooling device, immersion liquid cooling is achieved for the secondary liquid cooling device 57 and the main liquid cooling device 58, and finally flows out through the node liquid return port 10. It can be understood that the node liquid return port 10 is arranged at a middle position of the node housing 51, and the middle position is higher than the upper surface of the liquid cooling device, so as to ensure that the liquid level of the gathered cooling liquid is higher than the height of the liquid cooling device, and the immersion effect is achieved. In the specific implementation process, the secondary liquid cooling device 57 can also be liquid cooled through the cold plate liquid cooling mode at the same time, and the specific implementation manner will not be repeated here.

[0101] Optionally, when one or more of the liquid cooling devices achieve the spray liquid cooling, immersion liquid cooling and cold plate liquid cooling mode based on the cooling liquid input by the sub-liquid pipe, the node liquid return port 10 is arranged at a middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device; the cooling liquid is used to liquid cool the liquid cooling device through the sub-liquid pipe 8, and the other end of the sub-liquid pipe 8 is connected with the node liquid return port 10; the cooling liquid after completing the liquid cooling flows out of the node shell 51 through the sub-liquid pipe 8 from the node liquid return port 10; or it includes a cold plate attached to the liquid cooling device, the cooling liquid enters the cold plate through the sub-liquid pipe 8 to liquid cool the liquid cooling device, and the cooling liquid after completing the liquid cooling work flows out of the cold plate and enters the node shell 51. It can be understood that the implementation of the cold plate liquid cooling scheme and the above two schemes for implementing the cold plate liquid cooling are the same, and will not be repeated here. As shown in FIG. 7, a liquid cooling device node schematic diagram for realizing the spray liquid cooling, immersion liquid cooling and cold plate liquid cooling of the embodiment is provided.

[0102] Specifically, the secondary liquid cooling device 57 in FIG. 7 can exchange heat through the cooling liquid sprayed by the first spray device 53 located at the top of the shell, and can also exchange heat by being immersed in the cooling liquid; the main liquid cooling device 58 can exchange heat by being in full contact with the upper surface of the cold plate 55, and can also exchange heat by being immersed in the cooling liquid. In the specific implementation process, the secondary liquid cooling device 57 can also simultaneously perform liquid cooling through the cold plate liquid cooling mode, and the main liquid cooling device 58 can also simultaneously perform liquid cooling through the spray liquid cooling mode, and the specific implementation mode will not be repeated here.

[0103] The spray liquid cooling therein has the same implementation mode as described above, and will not be repeated here;

[0104] The immersion liquid cooling therein has the same implementation mode as described above, and will not be repeated here;

[0105] The cold plate liquid cooling therein has the same implementation mode as described above, and will not be repeated here.

[0106] Specifically, the spray liquid cooling mode is achieved through the first spray device and / or the second spray device arranged inside the liquid cooling device node;

[0107] The implementation mode of the spray liquid cooling mode is:

[0108] The first spray device is used to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling device node; or,

[0109] The second spray device is used to spray each of the liquid cooling devices in the liquid cooling equipment node on a one-to-one basis; or...

[0110] Simultaneously, the first spray device and the second spray device are used to spray the liquid cooling equipment. The first spray device is used to spray all the liquid cooling equipment in the liquid cooling equipment node in a one-to-many manner. The first spray device is located at the top inside the liquid cooling equipment node. The second spray device is used to spray one or more of the liquid cooling equipment in the liquid cooling equipment node in a one-to-one manner.

[0111] Preferably, the cross-section of the second spray device is a U-shaped structure, and the second spray device is provided with a liquid chamber one and a liquid chamber two. The liquid chamber one and the liquid chamber two are isolated by a card plate with a jet hole. The bottom of the second spray device is in contact with the surface of the liquid cooling equipment. The lower end of the second spray device is provided with a liquid return port of the liquid chamber two that communicates with the inside of the node of the liquid cooling equipment.

[0112] Figure 10 shows a structural diagram of a second spray device. The second spray device includes a first liquid chamber 64 and a second liquid chamber 65, which are separated by a retaining plate with a jet hole 61. The first liquid chamber 64 has a first liquid inlet 62, which is connected to the branch inlet pipe 8. The second liquid chamber 65 has a second liquid return port 63. Since the second spray device has a U-shaped structure, the second liquid chamber is an open structure without a bottom, allowing the sprayed coolant to directly contact the liquid cooling equipment. After entering the first liquid chamber 64, the coolant enters the second liquid chamber 65 through the jet hole 61 and then flows out through the second liquid return port 63. Understandably, the diameter of the inlet 62 of the first liquid chamber 64 is much larger than the diameter of the jet orifice 61, allowing the coolant to quickly fill the first liquid chamber 64, applying pressure and providing power for the downward-jetting coolant. Understandably, the pressure of the coolant can be controlled by the coolant inlet speed. The downward-jetting coolant is directly sprayed onto the liquid cooling device 58 through the second liquid chamber 65, fully exchanging heat with the liquid cooling device 58.

[0113] Specifically, in order to achieve better spraying effect, the vertical distance between the card plate and the liquid cooling device 58 is set to a preset height, which is 0.5-5mm.

[0114] It is understood that there are no special requirements on the number of the liquid return ports 63 of the second liquid chamber, and the positions of the liquid return ports 63 of the second liquid chamber can be set on the left and right lower ends of the second liquid chamber 65.

[0115] It can be understood that the second spraying device can use the pressure of the cooling liquid to spray and cool the liquid cooling equipment at a close distance, and the structure of the second liquid cavity can enable the cooling liquid to concentrate on cooling one liquid cooling equipment, thereby achieving the effect of precise liquid cooling of one liquid cooling equipment.

[0116] It can be understood that the first spraying device and the second spraying device can be used in combination to achieve the liquid cooling effect of the liquid cooling equipment.

[0117] As shown in FIG. 8, based on the liquid cooling unit implemented in the present application, the present application further provides a liquid cooling device, which comprises two or more liquid cooling units and a cabinet body for mounting the liquid cooling units, wherein the cabinet body is provided with cabinet body through holes for the main liquid inlet pipe and the liquid return pipe.

[0118] The liquid cooling unit is provided with a top liquid return port 1 of the insertion frame, and the two or more liquid cooling units are connected from top to bottom in the cabinet body, and the cooling liquid returns in a series mode.

[0119] The main liquid inlet pipe 7 enters the cabinet body through the cabinet body through hole, and then enters the insertion frame 4 of each liquid cooling unit through the liquid inlet port 3 of each liquid cooling unit; the cooling liquid flows into the sub-liquid inlet pipe 8 of each liquid cooling unit through the main liquid inlet pipe 7, and then enters the inside of the liquid cooling equipment node 11 for liquid cooling.

[0120] The top liquid return port 1 of the liquid cooling unit located at the top of the cabinet body is in a closed state, and the insertion frame lower end liquid return port 2 of the liquid cooling unit located at the bottom of the cabinet body is connected to the liquid storage container 5 through the liquid return pipe 15; in addition to the top liquid return port 1 of the liquid cooling unit located at the top of the cabinet body and the insertion frame lower end liquid return port 2 of the liquid cooling unit located at the bottom of the cabinet body, the insertion frame lower end liquid return port 2 of other liquid cooling units in the cabinet body is connected to the top liquid return port 1 of the liquid cooling unit located below and adjacent to the other liquid cooling unit through the liquid return pipe 15.

[0121] As shown in FIG. 8, the liquid cooling device cabinet body is provided with a mounting structure for mounting the liquid cooling unit, which can be realized by a clamping groove. The clamping groove of the cabinet body needs to correspond to the relevant attribute specifications of the liquid cooling unit in design, so that the liquid cooling unit can be fitted and mounted in the cabinet body. Multiple liquid cooling units can be installed in the cabinet body, which can realize the use of multiple liquid cooling units in one liquid cooling device, and improve the liquid cooling efficiency and the flexibility of the liquid cooling scheme.

[0122] Specifically, the cabinet body is provided with front and rear cabinet doors for facilitating installation of the liquid cooling units; the top of the cabinet body is provided with cable holes which are passages for cables of the liquid cooling units, and the top and bottom of the cabinet body are provided with through holes which are pipeline passages for inlet and outlet liquid pipes; the cabinet body can be provided with an accessory installation area in the middle region between the two liquid cooling units, for installing other equipment required for operation of the liquid cooling units, such as a control switch, a PBU power supply system and a wire arrangement rack, so as to ensure normal operation of the liquid cooling units. Other specifications of the cabinet body are not specially required.

[0123] Specifically, the bottom of the main inlet liquid pipe 7 is connected to the liquid storage container 5 and enters the cabinet body through the through hole of the cabinet body; the main inlet liquid pipe 7 enters the plug-in frame 4 of each liquid cooling unit through the plug-in frame inlet liquid port 3 of each liquid cooling unit, and is connected to each branch inlet liquid pipe 8 which is connected to the plug-in frame inlet liquid port 3 of the liquid cooling device node 11 installed in the liquid cooling unit; the cooling liquid flows into each branch inlet liquid pipe 8 of each liquid cooling unit through the main inlet liquid pipe 7, and then enters the inside of the liquid cooling device node 11 for liquid cooling (not shown in the figure);

[0124] Preferably, each liquid cooling unit is provided with two plug-in frame inlet liquid ports, so that the main inlet liquid pipe penetrates through the liquid cooling unit, that is, the main inlet liquid pipe 7 enters the inside of the plug-in frame top liquid cooling unit from the plug-in frame inlet liquid port of the plug-in frame top liquid cooling unit, extends out from the other plug-in frame inlet liquid port of the plug-in frame top liquid cooling unit, continues to enter the inside of the plug-in frame middle liquid cooling unit from the plug-in frame inlet liquid port of the plug-in frame middle liquid cooling unit, extends out from the other plug-in frame inlet liquid port of the plug-in frame middle liquid cooling unit, finally enters the inside of the plug-in frame top liquid cooling unit from the plug-in frame inlet liquid port of the plug-in frame top liquid cooling unit, extends out from the other plug-in frame inlet liquid port of the plug-in frame top liquid cooling unit, and reaches the top of the cabinet body, wherein the top of the main inlet liquid pipe 7 is sealed. The above-mentioned inlet liquid pipe connection scheme can shorten the distance between each branch inlet liquid pipe 8 and the main inlet liquid pipe 7, thereby reducing the length of each branch inlet liquid pipe 8; without the need for multiple main inlet liquid pipes 7 to input cooling liquid into each liquid cooling unit one by one, the use length of the main inlet liquid pipe 7 is also reduced, thereby achieving the purpose of reducing the use of pipelines.

[0125] In terms of return flow, the first liquid cooling unit is located at the top of the cabinet body, the second liquid cooling unit is located at the middle of the cabinet body, and the third liquid cooling unit is located at the bottom of the cabinet body in FIG. 8;

[0126] The top return liquid port 1 of the first liquid cooling unit is in a sealed state; the plug-in frame lower end return liquid port 2 is connected to the top return liquid port 1 of the second liquid cooling unit through the return liquid pipe 15, wherein the second liquid cooling unit is located below and adjacent to the first liquid cooling unit;

[0127] The top liquid return port 1 of the second liquid cooling unit is connected to the first liquid cooling unit through the liquid return pipe 15 of the first liquid cooling unit, and is connected to the lower end liquid return port 2 of the insertion frame of the first liquid cooling unit, and the lower end liquid return port 2 of the insertion frame is connected to the top liquid return port 1 of the third liquid cooling unit through the liquid return pipe 15, wherein the first liquid cooling unit is located above and adjacent to the second liquid cooling unit, and the third liquid cooling unit is located below and adjacent to the second liquid cooling unit.

[0128] The lower end liquid return port 2 of the insertion frame of the third liquid cooling unit is connected to the liquid storage container 5 through the liquid return pipe 15, and the top liquid return port 1 is connected to the second liquid cooling unit through the liquid return pipe 15 of the second liquid cooling unit, and is connected to the lower end liquid return port 2 of the insertion frame of the second liquid cooling unit, wherein the second liquid cooling unit is located above and adjacent to the third liquid cooling unit.

[0129] It can be understood that if the liquid cooling device needs to install more liquid cooling units, each liquid cooling unit can be installed according to the corresponding installation mode according to the position of the cabinet where it is located, including the top, middle and bottom of the cabinet.

[0130] It can be understood that the cooling liquid in the liquid storage container 5 enters each liquid cooling unit through the main liquid distribution pipe 7, and then enters the liquid cooling device node 11 through each liquid distribution pipe 8 to perform liquid cooling on the liquid cooling device. The cooling liquid that has completed liquid cooling in the first liquid cooling unit flows out through the node liquid return port 10, and due to the action of gravity, it is collected at the bottom of the first liquid cooling unit, and then flows into the second liquid cooling unit through the liquid return pipe 15, and due to the action of gravity, it is collected at the bottom of the second liquid cooling unit. Similarly, the cooling liquid that has completed liquid cooling in the second liquid cooling unit flows out through the node liquid return port 10, and due to the action of gravity, it is collected at the bottom of the second liquid cooling unit together with the cooling liquid flowing down from the first liquid cooling unit. In this way, when all the cooling liquid is collected in the liquid cooling unit at the bottom of the insertion frame, it flows back to the liquid storage container 5 through the liquid return pipe 15, completing the recovery of the cooling liquid.

[0131] Exemplarily, another installation mode of the liquid cooling unit in the liquid cooling device is also provided in the embodiment, that is, the installation mode of the two or more liquid cooling units in the cabinet is connected from top to bottom or from left to right, and the cooling liquid flows back in parallel:

[0132] It can be understood that the way in which the cooling liquid enters each liquid cooling device node 11 and the installation mode of the main liquid distribution pipe are the same as described above, and will not be described here.

[0133] The lower end liquid return port 2 of the insertion frame of each liquid cooling unit is connected to the liquid storage container 5 through the liquid return pipe 15, completing the recovery of the cooling liquid.

[0134] As shown in FIG. 9, on the basis of the liquid cooling unit installed in the liquid cooling device, the application also provides a mixed installation mode of the liquid cooling unit and the liquid cooling device node 11 in the liquid cooling device, that is, the cabinet of the liquid cooling device can install the liquid cooling unit and directly install the liquid cooling device node 11. It can be understood that the inside of the cabinet is provided with an installation structure, which can be realized by a clamping groove; it can be understood that the specifications of the clamping grooves for installing the liquid cooling device node 11 and the liquid cooling unit are different, because the liquid cooling unit can install the liquid cooling device node 11, so the volume of the liquid cooling unit is larger than that of the liquid cooling device node 11. In order to flexibly design the installation positions of the liquid cooling device node 11 and the liquid cooling unit in the cabinet, related accessories should be assembled with the clamping grooves of the liquid cooling unit, so as to realize the conversion from installing the liquid cooling unit to installing the liquid cooling device node 11, so that each clamping groove of the cabinet can install the liquid cooling device node 11 or the liquid cooling unit; it can be understood that because the space specification of the cabinet is limited, the number of clamping grooves provided in the cabinet is limited, and the number of installed liquid cooling device nodes or liquid cooling units is also limited.

[0135] Exemplarily, FIG. 9 is a schematic diagram of the mixed connection and installation of multiple liquid cooling units and liquid cooling device nodes in the liquid cooling device provided by the embodiment;

[0136] Specifically, the installation mode of the mixed installation of the multiple liquid cooling units and the multiple liquid cooling device nodes is from top to bottom connection, and the cooling liquid returns in a series mode:

[0137] In terms of liquid inlet, the bottom of the main liquid inlet pipe 7 is connected with the liquid storage container 5, and enters the cabinet through the through hole of the cabinet; the main liquid inlet pipe 7 enters the plug-in frame 4 of each liquid cooling unit through the plug-in liquid inlet 3 of each liquid cooling unit, and is connected with each branch liquid inlet pipe 8, and the branch liquid inlet pipe 8 is connected with the node liquid inlet 9 of the liquid cooling device node installed in the liquid cooling unit; or, is directly connected with the branch liquid inlet pipe 8, and the branch liquid inlet pipe 8 is directly connected with the node liquid inlet 9 of the liquid cooling device node 11 installed in the cabinet;

[0138] The cooling liquid flows into each branch liquid inlet pipe 8 of each liquid cooling unit through the main liquid inlet pipe 7, or flows into the branch liquid inlet pipe 8 of each liquid cooling device node 11 installed in the cabinet (not shown in the figure);

[0139] The preferred scheme of liquid inlet only needs to adjust the installation of each liquid cooling unit, and the adjustment scheme is the same as the connection mode of the main liquid inlet pipe described above, which will not be described here.

[0140] In terms of liquid return, the scheme also includes a branch liquid return pipe 16 connected with the node liquid return port of each liquid cooling device node;

[0141] Specifically, if one or more liquid cooling device nodes 11 are installed at the top position of the cabinet body, a liquid cooling device node cluster is formed. The node liquid inlet 9 of each liquid cooling device node 11 is connected with the branch liquid inlet pipe 8; the node liquid return port 10 of each liquid cooling device node is connected with the branch liquid return pipe 16, and each branch liquid return pipe 16 is connected with the liquid return pipe 15; the cooling liquid completing the liquid cooling work is collected in the liquid return pipe 15 through each branch liquid return pipe 16;

[0142] If the lower adjacent position of the last liquid cooling device node 11 of the liquid cooling device node cluster, the liquid cooling device node 11 is continuously installed, and the installation scheme is a node-node scheme, that is, the branch liquid return pipe 16 of the lower liquid cooling device node 11 is continuously connected with the liquid return pipe 15, and the connection mode is the same as that of the liquid cooling device node cluster installed above, which will not be described here.

[0143] If the lower adjacent position of the last liquid cooling device node of the liquid cooling device node cluster, another liquid cooling device node 11 is not installed, but a liquid cooling unit is installed, and the installation scheme is a node-unit scheme, that is, the liquid return pipe 15 is connected with the top liquid return port 1 of the liquid cooling unit, so that the cooling liquid collected in the liquid return pipe 15 flows into the liquid cooling unit through the top liquid return port 1 of the liquid cooling unit.

[0144] If one or more liquid cooling device nodes 11 are installed at the middle position of the cabinet body, a liquid cooling device node cluster is formed. The connection mode is the same as that of the liquid cooling device node cluster installed above, which will not be described here.

[0145] If the upper adjacent position of the first liquid cooling device node of the liquid cooling device node cluster, or the lower adjacent position of the last liquid cooling device node of the liquid cooling device node cluster, the liquid cooling device node 11 is continuously installed, and the node-node scheme can be used for connection.

[0146] If the upper adjacent position of the first liquid cooling device node 11 of the liquid cooling device node cluster, the liquid cooling unit is installed, and the installation scheme is a unit-node scheme, that is, the liquid return pipe 15 is connected with the lower end liquid return port 2 of the plug-in frame of the liquid cooling unit, so that the cooling liquid collected at the bottom of the liquid cooling unit flows into the liquid return pipe 15 as the middle channel of the return flow to the liquid storage container 5.

[0147] If the lower adjacent position of the last liquid cooling device node 11 of the liquid cooling device node cluster, the liquid cooling unit is installed, and the liquid cooling unit is adjacent to the upper position of the liquid cooling device node cluster, the node-unit scheme can be used for connection.

[0148] If one or more liquid cooling device nodes 11 are installed at the bottom position of the cabinet body, a liquid cooling device node cluster is formed. The connection mode is the same as the above-mentioned installed liquid cooling device node cluster, which will not be described here; and if no other liquid cooling unit or liquid cooling device node 11 is installed at the lower adjacent position of the last liquid cooling device node 11 of the liquid cooling device cluster, the liquid return pipe 15 is connected with the liquid storage container 5 to complete the recovery of the cooling liquid;

[0149] If a liquid cooling unit is installed at the upper adjacent position of the first liquid cooling device node 11 of the liquid cooling device node cluster, the unit-node scheme connection can be used;

[0150] If a liquid cooling device node is installed at the upper adjacent position of the first liquid cooling device node 11 of the liquid cooling device node cluster, the node-node scheme connection can be used.

[0151] Exemplarily, in this embodiment, the present application also provides another mixed installation mode of liquid cooling unit and liquid cooling device node in the liquid cooling device, that is, a plurality of liquid cooling units and a plurality of liquid cooling device nodes 11 are connected from top to bottom or from left to right, and the cooling liquid returns in parallel:

[0152] It can be understood that the way in which the cooling liquid enters each liquid cooling device node 11 or liquid cooling unit and the installation mode of the main liquid inlet pipe are the same as described above, which will not be described here;

[0153] Specifically, the liquid return port 2 at the lower end of the insertion frame of each liquid cooling unit is connected with the liquid storage container 5 through the liquid return pipe 15, and the node liquid return port 10 of each liquid cooling device node 11 is connected with the liquid storage container 5 through the liquid return pipe 15, to complete the recovery of the cooling liquid.

[0154] Exemplarily, the present application also provides a liquid cooling device node for realizing air cooling and cold plate liquid cooling, as shown in FIG. 11, which is a schematic diagram of the liquid cooling device node for realizing air cooling and cold plate liquid cooling in this embodiment.

[0155] Specifically, the liquid cooling device node adopting this liquid cooling mode can only be directly installed in the cabinet body. It can be understood that the front door of the cabinet body, the rear door of the cabinet body, and the front door of the cabinet body corresponding to the liquid cooling device node and the rear door of the cabinet body corresponding to the liquid cooling device node should be provided with ventilation holes, and the ventilation holes can be adaptively opened and closed to meet the installation scene of the air cooling and temperature exchange mode; when air cooling and temperature exchange is realized, the ventilation holes of the cabinet body are opened to form ventilation.

[0156] The secondary liquid cooling device 57 in FIG. 11 exchanges heat with air in the wind, and the primary liquid cooling device 58 exchanges heat with the cold plate in close contact and exchanges heat with air in the wind; it can be understood that the scheme of realizing liquid cooling of the cold plate is the same as the above introduction of liquid cooling of the cold plate, and will not be repeated here. When realizing the air cooling temperature exchange mode, one side of the cabinet body is set as the air inlet area, and the other side of the cabinet body is set as the air outlet area; for example, the front door of the cabinet body in FIG. 11 is set as the air inlet area, and the other side of the rear door of the cabinet body is set as the air outlet area; air is blown at the front door of the cabinet body, so that air enters the liquid cooling device node, and is discharged from the rear door of the cabinet body after exchanging heat with the secondary liquid cooling device 57 and the primary liquid cooling device 58.

[0157] In the embodiment, a liquid cooling method is also provided for liquid cooling of the liquid cooling unit described above. FIG. 12 is a flowchart of a liquid cooling method provided in the embodiment. The method comprises:

[0158] S101, obtaining attribute information of a liquid cooling unit requiring liquid cooling and a target temperature required by liquid cooling devices in the liquid cooling unit after liquid cooling;

[0159] S102, selecting the liquid cooling mode according to the attribute information and the target temperature, and using the selected liquid cooling mode to liquid cool the liquid cooling device node in the liquid cooling unit;

[0160] S103, monitoring the liquid cooling state of the liquid cooling unit in real time to adjust the liquid cooling work of the liquid cooling device node according to the monitoring result;

[0161] The attribute information of the liquid cooling unit includes the size of the plug-in frame in the liquid cooling unit, the number of the liquid cooling device nodes in the liquid cooling unit and the liquid cooling attributes thereof, the size of the node liquid inlet, the node liquid return port, the plug-in frame liquid inlet and the plug-in frame lower end liquid return port, and the size of the branch liquid inlet pipe, the primary liquid inlet pipe and the liquid return pipe.

[0162] The liquid cooling mode includes spray liquid cooling, immersion liquid cooling, cold plate liquid cooling, and two or three combined liquid cooling of spray, immersion, and cold plate. Understandably, the size of the frame inserted in the liquid cooling unit is determined according to the size of the liquid cooling equipment node that needs to be liquid cooled, so that the liquid cooling equipment node can be installed inside the frame; the number of liquid cooling equipment nodes in the liquid cooling unit and their liquid cooling properties are obtained, the liquid cooling properties include the sensitivity of the liquid cooling equipment node to the cooling liquid, the usual liquid cooling mode of the liquid cooling equipment node, and the like, combined with the size of the node inlet, the node return liquid port, the frame inlet, and the frame lower end return liquid port, and the size of the sub-liquid inlet pipe, the main liquid inlet pipe, and the return liquid pipe, the liquid cooling equipment node of the corresponding liquid cooling mode is installed in the frame. Because the liquid cooling mode adopted is different, the required node liquid inlet port and node return liquid port position are different, and the required number of sub-liquid inlet pipes is also different, and the corresponding liquid cooling mode needs to be selected according to the properties of each liquid cooling unit.

[0163] Understandably, the liquid cooling equipment node can be used for liquid cooling and heat dissipation of various liquid cooling equipment, which can include electronic chips, electronic components, servers, etc. Understandably, the properties such as material and specification of each type of liquid cooling equipment are different, so the attribute information of the liquid cooling equipment node can also be used as reference information for selecting the liquid cooling mode.

[0164] Specifically, the target temperature after liquid cooling required by the liquid cooling unit is the defined temperature at which the liquid cooling equipment inside the liquid cooling unit can normally operate or normally use;

[0165] Understandably, because the properties such as material and specification of each type of liquid cooling equipment are different, the liquid cooling mode that can be adopted will also be different. For example, some servers are very sensitive to cooling liquid and cannot directly contact the cooling liquid, so liquid cooling modes containing spray and immersion are not suitable. For example, some electronic components have different shapes and specifications, and do not have a flat heat-conducting surface, so liquid cooling modes containing cold plates are not suitable. Preferably, the usual liquid cooling mode of each type of liquid cooling equipment can also be used as reference information. For example, some servers use air cooling combined cooling scheme for heat dissipation due to their structure, so a liquid cooling scheme combined with air cooling can be selected. For example, some electronic devices are better cooled by immersion, so a liquid cooling scheme combined with immersion can be selected.

[0166] Understandably, because the performance and tolerance of different liquid cooling equipment in the liquid cooling unit are different, the target temperature after liquid cooling required is different. In addition, different liquid cooling schemes have different heat absorption capacities of the liquid cooling equipment in a single liquid cooling process, so the time spent by different liquid cooling schemes to achieve the target temperature of heat dissipation is different.

[0167] Therefore, considering the material, specification and other attributes of the liquid cooling device, and the target temperature to be reached after heat dissipation of the liquid cooling device, and combining the characteristics of each liquid cooling scheme, a personalized liquid cooling scheme is selected for the liquid cooling unit in the direction of minimum energy consumption and minimum use time of the liquid cooling unit, so as to achieve efficient heat dissipation.

[0168] Specifically, the liquid cooling state of the liquid cooling unit is monitored in real time, so that the state at each moment during liquid cooling can be controlled in real time. It can be understood that the monitoring can use a monitoring tool, which can be a temperature sensor. The temperature sensor is close to the surface or inside the liquid cooling device, so as to ensure the accuracy of the measured temperature data.

[0169] It can be understood that after the liquid cooling device is placed inside the liquid cooling device node, the temperature t0 of the initial state can be obtained by the temperature sensor. The target temperature t2 required by the liquid cooling device after liquid cooling is input as the condition for completing the liquid cooling work, and the temperature t1 of the liquid cooling device at a certain time point during the liquid cooling process is monitored in real time. It can be understood that when:

[0170] t1=t2

[0171] The liquid cooling device reaches the target temperature, and the liquid cooling work is completed.

[0172] It can be understood that after one liquid cooling cycle of the cooling liquid, the liquid cooling device still cannot reach the target temperature, and the next round of liquid cooling of the cooling liquid is needed at this time, so that the cooling liquid cooled by the refrigeration system is used for the next liquid cooling until the target speed of the liquid cooling device is reached.

[0173] It can be understood that because the measurement of temperature and the flow of cooling liquid have a certain hysteresis, the final temperature of the liquid cooling device after completing the liquid cooling work may be less than the target temperature, i.e.

[0174] t1<t2

[0175] It can be understood that the t 1 和 t2 is relatively small, and t1 is within the temperature range of safe operation or normal use of the liquid cooling device, and can be ignored.

[0176] Obviously, the above embodiments of the present application are only examples for clearly illustrating the technical solutions of the present application, and are not intended to limit the specific embodiments of the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the claims of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A liquid-cooled unit comprising at least one liquid-cooled device node, a cooling liquid circulation system and a refrigeration system, characterized in that, The liquid cooling unit further comprises a plug-in frame, and the liquid cooling device node is installed inside the plug-in frame; the liquid cooling device node is provided with one or more node liquid inlet and node liquid return, and the plug-in frame is provided with plug-in frame liquid inlet and plug-in frame lower end liquid return; The cooling liquid circulation system comprises a main liquid inlet pipe, a sub liquid inlet pipe, a liquid return pipe, a liquid driving device and a liquid storage container, one liquid cooling device node corresponds to one or more sub liquid inlet pipes, the liquid driving device and the liquid storage container are arranged outside the plug-in frame; the node liquid inlet is connected with one end of the corresponding sub liquid inlet pipe, and the other end of each sub liquid inlet pipe is connected with one end of the main liquid inlet pipe through the plug-in frame liquid inlet; The other end of the liquid return pipe is connected with the liquid storage container, and the liquid storage container is also connected with the main liquid inlet pipe; the liquid driving device is arranged on the main liquid inlet pipe or the liquid return pipe; the liquid storage container is connected with the refrigeration system; After the cooling liquid completes temperature exchange in the liquid cooling device node, the cooling liquid flows out through the node liquid return of the liquid cooling device node and collects at the bottom of the plug-in frame, wherein the bottom of the plug-in frame is an expansion structure capable of storing liquid.

2. The liquid-cooled unit of claim 1, wherein, The liquid cooling device node comprises a node shell and one or more liquid cooling devices arranged inside the node shell, and one or more liquid cooling devices realize one or more liquid cooling modes such as spray liquid cooling, immersion liquid cooling and cold plate liquid cooling.

3. A liquid cooling unit according to claim 2, wherein, When one or more liquid cooling devices realize spray liquid cooling mode, the node liquid return is arranged at the lower end of the node shell.

4. The liquid-cooled unit of claim 2, wherein, When one or more liquid cooling devices realize immersion liquid cooling mode based on the cooling liquid input by the sub liquid inlet pipe, the node liquid return is arranged at the middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device.

5. The liquid-cooled unit of claim 2, wherein, When one or more liquid cooling devices realize cold plate liquid cooling mode, the sub liquid inlet pipe enters the liquid cooling device node through the node liquid inlet and closely adheres to the liquid cooling device; Or, when one or more liquid cooling devices realize cold plate liquid cooling mode, the liquid cooling device node further comprises a cold plate closely adhered to the liquid cooling device, the cold plate is connected with the sub liquid inlet pipe and closely adheres to the liquid cooling device.

6. The liquid-cooled unit of claim 2, wherein, When one or more liquid cooling devices realize spray liquid cooling and immersion liquid cooling mode, the node liquid return is arranged at the middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device.

7. The liquid-cooled unit of claim 2, wherein, When one or more liquid cooling devices realize spray liquid cooling and cold plate liquid cooling mode, the node liquid return is arranged at the lower end of the node shell; the sub liquid inlet pipe enters the liquid cooling device node through the node liquid inlet and closely adheres to the liquid cooling device; Or, when one or more liquid cooling devices realize spray liquid cooling and cold plate liquid cooling mode, the node liquid return is arranged at the lower end of the node shell; the liquid cooling device node further comprises a cold plate closely adhered to the liquid cooling device, the cold plate is connected with the sub liquid inlet pipe and closely adheres to the liquid cooling device.

8. The liquid-cooled unit of claim 2, wherein, When one or more of the liquid cooling devices implement immersion liquid cooling and cold plate liquid cooling, the node return liquid port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the sub-liquid inlet pipe enters the liquid cooling device node through the node liquid inlet, and is closely attached to the liquid cooling device; Or, When one or more of the liquid cooling devices implement immersion liquid cooling and cold plate liquid cooling, the node return liquid port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the liquid cooling device node further comprises a cold plate attached to the liquid cooling device, the cold plate is connected with the sub-liquid inlet pipe, and is closely attached to the liquid cooling device.

9. The liquid-cooled unit of claim 2, wherein, When one or more of the liquid cooling devices implement spray liquid cooling, immersion liquid cooling and cold plate liquid cooling, the node return liquid port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the sub-liquid inlet pipe enters the liquid cooling device node through the node liquid inlet, and is closely attached to the liquid cooling device; Or, When one or more of the liquid cooling devices implement spray liquid cooling, immersion liquid cooling and cold plate liquid cooling, the node return liquid port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the liquid cooling device node further comprises a cold plate attached to the liquid cooling device, the cold plate is connected with the sub-liquid inlet pipe, and is closely attached to the liquid cooling device.

10. A liquid cooling unit according to any of claims 2-9, characterized in that The spray liquid cooling mode is implemented by the first spray device and / or the second spray device arranged inside the liquid cooling device node; The implementation mode of the spray liquid cooling mode is: The first spray device is used to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling device node; Or, The second spray device is used to spray each of the liquid cooling devices in the liquid cooling device node in a one-to-one manner; or, The first spray device and the second spray device are used to spray the liquid cooling devices at the same time, wherein the first spray device is used to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling device node; the second spray device is used to spray one or more of the liquid cooling devices in the liquid cooling device node in a one-to-one manner.

11. A liquid cooling unit according to claim 10, wherein, The cross section of the second spray device is a shape of a Chinese character, and the second spray device is provided with liquid cavity one and liquid cavity two, the liquid cavity one and the liquid cavity two are isolated by a clamping plate provided with a jet hole, the bottom of the second spray device is connected with the surface of the liquid cooling device, and the lower end of the second spray device is provided with a liquid cavity two return liquid port communicated with the inside of the liquid cooling device node.

12. The liquid-cooled unit of claim 11, wherein, The vertical distance between the outlet of the jet hole and the surface of the liquid cooling device is 0.5mm-5mm.

13. The liquid-cooled unit of claim 11, wherein, A jet pipe is mounted on the jet hole, one end of the jet pipe is mounted on the jet hole, and the other end is connected with the surface of the liquid cooling device.

14. The liquid-cooled unit of claim 13, wherein, The vertical distance between the outlet of the other end of the jet pipe and the surface of the liquid cooling device is 0.5-5 mm.

15. A liquid cooling device, characterized by, The liquid cooling device comprises a plurality of liquid cooling units and a cabinet body for mounting the liquid cooling units, and the cabinet body is provided with cabinet body through holes for the main liquid inlet pipe and the liquid return pipe.

16. The liquid cooling device of claim 15, wherein, The liquid cooling units are connected from top to bottom, and the cooling liquid returns in a series mode. The main liquid inlet pipe enters the cabinet body through the cabinet body through holes and then enters the frame of each liquid cooling unit through the liquid inlet port of the frame. The top liquid return port of the liquid cooling unit at the top of the cabinet body is in a closed state, and the lower end liquid return port of the frame of the liquid cooling unit at the bottom of the cabinet body is connected to the liquid storage container through the liquid return pipe.

17. The liquid cooling device of claim 15, wherein The liquid cooling units are connected from top to bottom or from left to right, and the cooling liquid returns in a parallel mode. The main liquid inlet pipe enters the cabinet body through the cabinet body through holes and then enters the frame of each liquid cooling unit through the liquid inlet port of the frame. The lower end liquid return port of the frame of each liquid cooling unit is connected to the liquid storage container through the liquid return pipe.

18. A method of liquid cooling, characterized by: A method for liquid cooling of the liquid cooling unit of any one of claims 1-14, the method comprising: obtaining attribute information of the liquid cooling unit and a target temperature of the liquid cooling device in the liquid cooling unit after liquid cooling; selecting the liquid cooling mode according to the attribute information and the target temperature, and using the corresponding liquid cooling mode to perform liquid cooling on the liquid cooling device node in the liquid cooling unit; monitoring the liquid cooling state of the liquid cooling unit in real time to adjust the liquid cooling work of the liquid cooling device node according to the monitoring result; wherein the attribute information of the liquid cooling unit comprises the size of the frame, the number of liquid cooling device nodes and their liquid cooling attributes, the size of the node liquid inlet port, the node liquid return port, the frame liquid inlet port and the lower end liquid return port of the frame, the size of the branch liquid inlet pipe, the main liquid inlet pipe and the liquid return pipe; the liquid cooling mode comprises one or more of the combination of spray liquid cooling, immersion liquid cooling and cold plate liquid cooling.

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