Power-module heat dissipation structure and on-board charger using same

Abstract

Provided in the present invention are a power-module heat dissipation structure and an on-board charger using same. The power-module heat dissipation structure comprises: a water channel base, which is connected to a housing of an on-board charger; a first three-dimensional water channel and a second three-dimensional water channel, which are spaced apart on the water channel base; an intermediate water channel, which is connected between the first three-dimensional water channel and the second three-dimensional water channel, wherein the water channel base, the first three-dimensional water channel, the intermediate water channel and the second three-dimensional water channel form a heat dissipation accommodating cavity by means of enclosing; at least one magnetic device, which is mounted in the heat dissipation accommodating cavity; and at least one power module, which is mounted on an outer wall of the first three-dimensional water channel and / or the second three-dimensional water channel. The power-module heat dissipation structure provided in the present invention has compact layout, thereby saving on the space in the housing for mounting the power module, the magnetic device and the water channels. The circuit connection layout between the power module and the magnetic device is simplified, thereby realizing the quick assembly of the charger and facilitating the assembly, disassembly and maintenance of the power module and the magnetic device. The magnetic device in the heat dissipation accommodating cavity and the power module on the outer wall of the water channel are respectively cooled by means of the three-dimensional water channels, thereby ensuring a heat dissipation effect.

Description

Power module heat dissipation structure and vehicle-mounted charger applying same TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicle-mounted chargers, and in particular to a power module heat dissipation structure and a vehicle-mounted charger applying same. BACKGROUND

[0002] A vehicle-mounted charger (OBC for short) is a charger installed on an electric vehicle, and as an important component of the vehicle charging system, it realizes the functions of rectifying alternating current into direct current to charge the power storage battery and converting the direct current output by the battery into alternating current for use by external electrical appliances. With the continuous increase in battery capacity and charging power, higher requirements are placed on the heat dissipation performance of the various unit modules inside the vehicle-mounted charger.

[0003] At present, the integrated heat dissipation scheme for the power devices and other functional modules of the OBC provided by the industry is to directly arrange the discrete power devices and magnetic devices on the surface of a three-dimensional water channel through an aluminum substrate. This heat dissipation structure layout is relatively large in size, resulting in the power devices, magnetic devices and three-dimensional water channel occupying a large amount of accommodation space inside the OBC housing, reducing the space inside the OBC housing for installing other functional modules, and affecting the overall performance of the machine. In addition, the discrete power devices and magnetic devices result in a relatively complex circuit design and connection layout, causing the vehicle-mounted charger assembly process to be complex and the production efficiency to be low. Furthermore, the discrete power devices are inconvenient to disassemble, maintain, upgrade and update. SUMMARY

[0004] The present application provides a power module heat dissipation structure and a vehicle-mounted charger applying same, to solve the technical problem that the power devices and magnetic devices of the existing vehicle-mounted charger are arranged on the surface of a three-dimensional water channel through an aluminum substrate, resulting in a large amount of installation space inside the vehicle.

[0005] To solve the above problems, the technical scheme adopted by the present application is as follows:

[0006] The present application provides a power module heat dissipation structure, comprising:

[0007] A water channel base connected to the housing of the vehicle-mounted charger;

[0008] A first three-dimensional water channel and a second three-dimensional water channel are arranged on the water channel base in a spaced manner;

[0009] An intermediate water channel is connected between the first three-dimensional water channel and the second three-dimensional water channel;

[0010] The water channel base, the first three-dimensional water channel, the intermediate water channel and the second three-dimensional water channel form a heat dissipation cavity therebetween;

[0011] At least one magnetic device is installed in the heat dissipation cavity;

[0012] at least one power module is installed on the outer wall of the first three-dimensional water channel and / or the second three-dimensional water channel.

[0013] Further, the power module heat dissipation structure further comprises:

[0014] a device locking strip, comprising:

[0015] a locking base, which is fastened to the shell in a matching manner with the power module;

[0016] a resilient pressing strip, which is installed on the locking base and abuts the corresponding power module against the outer side wall of the first three-dimensional water channel or the second three-dimensional water channel.

[0017] Preferably, the outer side wall and / or the top wall of the first three-dimensional water channel and the second three-dimensional water channel are provided with at least one mounting hole, and the power module is provided with a connecting hole matched with the mounting hole.

[0018] The power module is connected to the outer side wall and / or the top wall of the first three-dimensional water channel or the second three-dimensional water channel through the connecting piece passing through the corresponding connecting hole and the mounting hole.

[0019] Preferably, the power module is connected to the outer side wall and / or the top wall of the first three-dimensional water channel or the second three-dimensional water channel through a heat conduction structure layer.

[0020] Preferably, the power module and the outer side wall and / or the top wall of the first three-dimensional water channel or the second three-dimensional water channel are connected through a heat interface material layer.

[0021] Preferably, the heat conduction structure layer is a thermosetting adhesive layer or a solder layer.

[0022] Further, the power module heat dissipation structure further comprises:

[0023] a water inlet, which is arranged at one end of the first three-dimensional water channel away from the intermediate water channel and is connected to the internal flow channel of the first three-dimensional water channel;

[0024] a water outlet, which is arranged at one end of the second three-dimensional water channel away from the intermediate water channel and is connected to the internal flow channel of the second three-dimensional water channel.

[0025] Preferably, the first three-dimensional water channel and the second three-dimensional water channel are both in the shape of a cuboid, the water inlet is arranged at the top surface, the side surface, the end surface or the bottom surface of one end of the first three-dimensional water channel away from the intermediate water channel, and the water outlet is arranged at the top surface, the side surface, the end surface or the bottom surface of one end of the second three-dimensional water channel away from the intermediate water channel.

[0026] Preferably, the first three-dimensional water channel comprises:

[0027] a first water channel body, which is arranged on the water channel base;

[0028] The first water channel cover plate is installed on the outer side or bottom of the first water channel body away from the second three-dimensional water channel.

[0029] The second three-dimensional water channel comprises:

[0030] The second water channel body is arranged on the water channel base in parallel with the first water channel body.

[0031] The second water channel cover plate is installed on the outer side or bottom of the second water channel body away from the first three-dimensional water channel.

[0032] Preferably, the outer side of the first water channel body away from the second three-dimensional water channel is provided with a first flow channel groove, one end of the first flow channel groove is communicated with the water inlet, and the opposite end of the first flow channel groove is communicated with the internal flow channel of the intermediate water channel.

[0033] The first water channel cover plate is installed on the outer side of the first water channel body and closes the first flow channel groove, and the side of the first water channel cover plate facing the first flow channel groove is provided with a plurality of heat dissipation fins.

[0034] The outer side of the second water channel body is provided with a second flow channel groove, one end of the second flow channel groove is communicated with the water outlet, and the opposite end of the second flow channel groove is communicated with the internal flow channel of the intermediate water channel.

[0035] The second water channel cover plate is installed on the outer side of the second water channel body and closes the second flow channel groove, and the side of the second water channel cover plate facing the second flow channel groove is provided with a plurality of heat dissipation fins.

[0036] Preferably, the heat dissipation fins are tooth-shaped fins, rectangular fins or circular fins.

[0037] Preferably, two groups of power modules are respectively arranged on the outer walls of the first three-dimensional water channel and the second three-dimensional water channel, and the power modules are single-PIN devices and / or double-PIN devices.

[0038] The application also provides a vehicle-mounted charger comprising a shell and the power module heat dissipation structure.

[0039] Compared with the prior art, the application has the following beneficial effects:

[0040] The power module heat dissipation structure provided by the application can be directly installed in the shell of the vehicle-mounted charger, a heat dissipation cavity for accommodating magnetic devices is designed in the middle region of the three-dimensional water channel on the two sides of the water channel base, the power module is quickly and detachably installed on the surface of the outer wall of the three-dimensional water channel on the two sides in multiple ways, and then the pin magnetic devices and the corresponding pins of the power module are welded with the circuit board installed in the shell of the charger and located above the power module heat dissipation structure. The power module heat dissipation structure has compact layout and small volume, saves the space in the OBC machine shell for installing the power module, the magnetic devices and the three-dimensional water channel, and increases the space for installing other functional modules to improve the performance of the whole machine. In addition, the power module heat dissipation structure simplifies the circuit design and connection layout of the power module and the magnetic devices, realizes quick assembly of the vehicle-mounted charger, improves production efficiency, and facilitates disassembly, maintenance, upgrading and updating of the power module and the magnetic devices. At the same time, the magnetic devices in the heat dissipation cavities and the power module on the outer wall of the three-dimensional water channel are cooled through the three-dimensional water channels connected with each other, so as to ensure the heat dissipation effect and enable the vehicle-mounted charger to work stably. BRIEF DESCRIPTION OF DRAWINGS

[0041] In order to more clearly illustrate the technical solutions provided by the application, the application will be described in detail below with reference to the embodiments and drawings. It should be understood that the embodiments described below and in the drawings of the specification are only some embodiments of the application, and those skilled in the art can make changes to the drawings under the concept of the application.

[0042] Fig. 1 is a schematic diagram of the overall assembly structure of the power module heat dissipation structure according to Embodiment One of the application;

[0043] Fig. 2 is an exploded structural schematic diagram of the power module heat dissipation structure in Fig. 1;

[0044] Fig. 3 is a schematic diagram of the overall assembly structure of the power module heat dissipation structure according to Embodiment Two of the application;

[0045] Fig. 4 is a schematic diagram of the overall assembly structure of the power module heat dissipation structure according to Embodiment Three of the application;

[0046] Fig. 5 is an overall exploded structural schematic diagram of the power module heat dissipation structure in Fig. 4;

[0047] Fig. 6 is an exploded structural schematic diagram of the power module heat dissipation structure according to Embodiment Four of the application;

[0048] Fig. 7 is an exploded structural schematic diagram of the power module heat dissipation structure according to Embodiment Five of the application;

[0049] Fig. 8 is a schematic diagram of the overall assembly structure of the power module heat dissipation structure according to Embodiment Six of the application;

[0050] Fig. 9 is an exploded structural schematic diagram of the sixth embodiment of the power module heat dissipation structure provided by the present application;

[0051] Fig. 10 is a whole assembly structural schematic diagram of the seventh embodiment of the power module heat dissipation structure provided by the present application;

[0052] Fig. 11 is an exploded structural schematic diagram of the seventh embodiment of the power module heat dissipation structure provided by the present application;

[0053] Fig. 12 is a whole assembly structural schematic diagram of the eighth embodiment of the power module heat dissipation structure provided by the present application;

[0054] Fig. 13 is a whole assembly structural schematic diagram of another embodiment of the power module heat dissipation structure of the eighth embodiment;

[0055] Fig. 14 is a whole assembly structural schematic diagram of the ninth embodiment of the power module heat dissipation structure provided by the present application;

[0056] Fig. 15 is a whole assembly structural schematic diagram of the tenth embodiment of the power module heat dissipation structure provided by the present application;

[0057] Fig. 16 is a whole assembly structural schematic diagram of the eleventh embodiment of the power module heat dissipation structure provided by the present application;

[0058] Fig. 17 is an exploded structural schematic diagram one of the twelfth embodiment of the power module heat dissipation structure provided by the present application;

[0059] Fig. 18 is an exploded structural schematic diagram two of the twelfth embodiment of the power module heat dissipation structure provided by the present application;

[0060] Fig. 19 is an enlarged structural schematic diagram of one embodiment of the second water channel cover plate in Fig. 18;

[0061] Fig. 20 is an enlarged structural schematic diagram of another embodiment of the second water channel cover plate in Fig. 18;

[0062] Fig. 21 is an enlarged structural schematic diagram of still another embodiment of the second water channel cover plate in Fig. 18.

[0063] In the drawings, the main reference signs are as follows:

[0064] 1, water channel base; 10, screw; 11, partition wall; 2, first three-dimensional water channel; 21, water inlet; 22, first water channel body; 23, first water channel cover plate; 3, second three-dimensional water channel; 31, water outlet; 32, second water channel body; 321, second flow channel groove; 33, second water channel cover plate; 4, intermediate water channel; 5, heat dissipation cavity; 6, magnetic device; 7, power module; 71, single-PIN power module; 72, double-PIN power module; 73, device locking strip; 731, locking base; 732, elastic pressing strip; 74, connecting hole; 75, heat-conducting structural layer; 76, thermal interface material layer; 77, pressing strip; 771, soldering foot; 8, third water channel cover plate; 9, heat dissipation fin; 91, tooth-shaped fin; 92, rectangular fin; 93, circular fin.

[0065] In the figure, other marks are as follows:

[0066] A, outer side wall; B, top wall; C, mounting hole; X, first horizontal direction; Y, second horizontal direction. DETAILED DESCRIPTION

[0067] In order to make the technical problems, technical solutions and beneficial effects of the present application clearer, the present application is further described in detail below in combination with the accompanying drawings 1-21 and examples.

[0068] Please refer to FIGS. 1 and 2, the power module heat dissipation structure provided by the present application comprises:

[0069] The water channel base 1 is connected to the shell (not shown in the figure) of the vehicle-mounted charger; the first three-dimensional water channel 2 and the second three-dimensional water channel 3 are arranged at intervals on the water channel base 1; the intermediate water channel 4 is connected between the first three-dimensional water channel 2 and the second three-dimensional water channel 3; the water channel base 1, the first three-dimensional water channel 2, the intermediate water channel 4 and the second three-dimensional water channel 3 form a heat dissipation cavity 5; at least one magnetic device 6 is installed in the heat dissipation cavity 5; and at least one power module 7 is installed on the outer wall of the first three-dimensional water channel 2 and / or the second three-dimensional water channel 3.

[0070] The first three-dimensional water channel 2, the intermediate water channel 4 and the second three-dimensional water channel 3 are provided with internal flow channels (not shown in the figure) that are in communication with each other, for introducing external cooling water or cooling liquid (not shown in the figure) into the power module heat dissipation structure, so that when the cooling water or cooling liquid flows through the internal flow channels, the magnetic devices 6 and the power modules 7 connected to the water channel walls of the first three-dimensional water channel 2, the intermediate water channel 4 and the second three-dimensional water channel 3 are subjected to heat exchange, and then the cooling water or cooling liquid that has completed the heat exchange flows out of the power module heat dissipation structure, is subjected to heat exchange again in the outside world, and then flows into the power module heat dissipation structure again, thereby realizing the heat dissipation function of the water channel to the power module heat dissipation structure through the circulation.

[0071] In the embodiment, the power module heat dissipation structure can be manufactured as a separate module and detachably connected and installed inside the shell of the on-board charger, or can be integrally arranged with the shell of the on-board charger, for example, when the shell of the on-board charger is directly embedded into the shell to be integrally formed and manufactured.

[0072] Referring to FIGS. 1 and 2, in the first embodiment of the power module heat dissipation structure provided by the application:

[0073] The power module heat dissipation structure further comprises:

[0074] The device locking strip 73 comprises a locking base 731 matched and fastened to the shell of the on-board charger, and an elastic pressing strip 732 installed on the locking base 731 and abutting the corresponding power module 7 against the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

[0075] Referring to FIGS. 1 and 2, as a preferred embodiment of the first embodiment, the locking base 731 is a sheet metal part fastened to the shell of the on-board charger by the screw 10, and the elastic pressing strip 732 is a pair of metal pressing strips spaced apart from and integrally bent and formed with the locking base 731. Under the torque of the locking screw 10, the elastic pressing strip 732 (the pair of metal pressing strips) gradually applies pressure to the power module 7 towards the first three-dimensional water channel 2 or the second three-dimensional water channel 3, so that the power module 7 is tightly pressed against the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

[0076] Referring to FIG. 3, in the second embodiment of the power module heat dissipation structure provided by the application:

[0077] The outer side wall A of the first three-dimensional water channel 2 and the second three-dimensional water channel 3 is provided with at least one mounting hole C, and the power module 7 is provided with a connecting hole 74 matched with the mounting hole C; the power module 7 is connected to the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 by the connecting member passing through the corresponding connecting hole 74 and mounting hole C.

[0078] Referring to FIGS. 4 and 5, in the third embodiment of the power module heat dissipation structure provided by the application:

[0079] The top wall B of the first three-dimensional water channel 2 and the second three-dimensional water channel 3 is provided with at least one mounting hole C, and the power module 7 is provided with a connecting hole 74 or a connecting groove matched with the mounting hole C; the power module 7 is connected to the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 by the connecting member hole or the connecting groove passing through the corresponding connecting hole 74 and mounting hole C.

[0080] Please refer to Figs. 3-5, as the preferred embodiment common to embodiments two and three, the mounting hole C is a threaded hole, the connecting hole 74 is a screw 10 hole matching the threaded hole, and the connecting member is a screw 10 matching the threaded hole and the screw 10 hole.

[0081] In other embodiments of the power module heat dissipation structure provided by the present application, the outer side wall A and the top wall B of the first three-dimensional water channel 2 and the second three-dimensional water channel 3 are each provided with at least one mounting hole C, and the power module 7 is connected to the outer side wall A and the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through the connecting member passing through the corresponding connecting hole 74 and the mounting hole C.

[0082] Please refer to Fig. 6, in the fourth embodiment of the power module heat dissipation structure provided by the present application:

[0083] The power module 7 is connected to the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through the heat conduction structure layer 75, which can simultaneously serve to fix and connect the power module 7 and the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, and to reduce the interfacial thermal resistance between the water channel wall of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 and the power module 7, thereby improving the heat dissipation efficiency of the power module heat dissipation structure.

[0084] In one embodiment of the fourth embodiment, the heat conduction structure layer 75 is a thermosetting adhesive layer coated between the power module 7 and the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

[0085] In one embodiment of the fourth embodiment, the heat conduction structure layer 75 is a solder layer welded between the power module 7 and the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

[0086] Please refer to Fig. 7, in the fifth embodiment of the power module heat dissipation structure provided by the present application:

[0087] The power module 7 is connected to the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 through the heat conduction structure layer 75, which can simultaneously serve to fix and connect the power module 7 and the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, and to reduce the interfacial thermal resistance between the water channel wall of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 and the power module 7, thereby improving the heat dissipation efficiency of the power module heat dissipation structure.

[0088] In one embodiment of the fifth embodiment, the heat conduction structure layer 75 is a thermosetting adhesive layer coated between the power module 7 and the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

[0089] In one embodiment of the fifth embodiment, the heat conduction structure layer 75 is a solder layer welded between the power module 7 and the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3.

[0090] Please refer to FIG. 8, 9, in the sixth embodiment of the power module heat dissipation structure provided by the present application:

[0091] The pressing strip 77 is pressed against the top surface of the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, and the soldering feet 771 of the pressing strip 77 are soldered to the outer surface of the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, so that the power module 7 is pressed against the outer surface of the outer side wall A of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 by the pressing strip 77.

[0092] Please refer to FIG. 10, 11, in the seventh embodiment of the power module heat dissipation structure provided by the present application:

[0093] The pressing strip 77 is pressed against the top surface of the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, and the soldering feet 771 of the pressing strip 77 are soldered to the outer surface of the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3, so that the power module 7 is pressed against the outer surface of the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 by the pressing strip 77.

[0094] Please refer to FIG. 1-11, as a preferred embodiment common to embodiments one to seven, the power module 7 and the outer side wall A and / or the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 are connected by a thermal interface material layer 76, that is, the power module 7 and the outer side wall A and / or the top wall B of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 are coated with a thermal interface material layer 76 (Thermal Interface Material, TIM for short), which is used to reduce the interface thermal resistance between the water channel wall of the first three-dimensional water channel 2 or the second three-dimensional water channel 3 and the power module 7, so as to further improve the heat dissipation efficiency of the power module heat dissipation structure.

[0095] Wherein, when the above-mentioned heat conduction structure layer 75 in embodiments four and five is a solder layer or a thermosetting adhesive layer, the thermal interface material layer 76 does not need to be provided.

[0096] Please refer to FIG. 1, 2, in the present embodiment, the first three-dimensional water channel 2 and the second three-dimensional water channel 3 both extend forward and backward along the first horizontal direction X; the intermediate water channel 4 extends along the second horizontal direction Y perpendicular to the first horizontal direction X and is connected between the first three-dimensional water channel 2 and the second three-dimensional water channel 3.

[0097] The power module heat dissipation structure further comprises:

[0098] The water inlet 21 is arranged at one end of the first three-dimensional water channel 2 away from the intermediate water channel 4 in the first horizontal direction X and communicates the internal flow passage of the first three-dimensional water channel 2; and the water outlet 31 is arranged at one end of the second three-dimensional water channel 3 away from the intermediate water channel 4 in the first horizontal direction X and communicates the internal flow passage of the second three-dimensional water channel 3.

[0099] Referring to FIGS. 12 and 13, in the eighth embodiment of the power module heat dissipation structure provided by the application:

[0100] The power module 7 is provided in two groups, each group of power modules 7 includes a plurality of power modules 7, and the two groups of power modules 7 are respectively and spacedly arranged on the outer wall (the outer side wall A or the top wall B) of the first three-dimensional water channel 2 and the second three-dimensional water channel 3, and the power module 7 is a single-PIN device (i.e., a power module 7 with a single row of PIN pins arranged on one side) and / or a double-PIN device (i.e., a power module 7 with two rows of PIN pins arranged on two sides, respectively).

[0101] Referring to FIG. 12, as one implementation of the eighth embodiment, the power module 7 is provided in two groups, both groups of power modules 7 are double-PIN devices (as shown in FIG. 8), or both groups of power modules 7 are single-PIN power modules, and the two groups of power modules 7 are respectively and spacedly arranged on the outer wall (the outer side wall A or the top wall B) of the first three-dimensional water channel 2 and the second three-dimensional water channel 3.

[0102] Referring to FIG. 13, as one implementation of the eighth embodiment, the power module 7 is provided in two groups, one group of power modules 7 is double-PIN devices and is spacedly arranged on the outer wall (the outer side wall A or the top wall B) of the first three-dimensional water channel 2 located on the right side (i.e., one end of the water channel base 1 in the second horizontal direction Y), and the other group of power modules 7 is single-PIN devices and is spacedly arranged on the outer wall (the outer side wall A or the top wall B) of the second three-dimensional water channel 3 located on the left side (i.e., the opposite end of the water channel base 1 in the second horizontal direction Y).

[0103] As another implementation of the eighth embodiment (not shown in the figure), one group of power modules 7 arranged on the first three-dimensional water channel 2 located on the right side can also be single-PIN devices, and the other group of power modules 7 arranged on the second three-dimensional water channel 3 located on the left side is double-PIN devices.

[0104] In this implementation, the power module 7 can be made of internal chips made of silicon, silicon carbide, gallium nitride, etc. according to actual application scenarios.

[0105] Referring to FIG. 14, in the ninth embodiment of the power module heat dissipation structure provided by the application:

[0106] The power modules 7 are arranged in two groups. One group of power modules 7 is arranged on the top wall B of the second cuboid water channel 3 on the right side in any of the manners described in Embodiments 3 or 5 above. The other group of power modules 7 is arranged on the outer side wall A of the first cuboid water channel 2 on the left side in any of the manners described in Embodiments 1, 2 or 4 above, so as to achieve a mixed layout of the power modules on the top and side of the power module heat dissipation structure.

[0107] As another implementation of Embodiment 9 (not shown in the figure), one group of power modules 7 is arranged on the top wall B of the first cuboid water channel 2 on the left side in any of the manners described in Embodiments 3 or 5 above. The other group of power modules 7 is arranged on the outer side wall A of the second cuboid water channel 3 on the right side in any of the manners described in Embodiments 1, 2 or 4 above.

[0108] In other embodiments of the power module heat dissipation structure provided by the application (not shown in the figure), the power modules 7 can also be arranged on the outer wall surface of the first cuboid water channel 2 or the second cuboid water channel 3 in manners other than those described in Embodiments 1 to 5 above.

[0109] Referring to Figure 15, in Embodiment 10 of the power module heat dissipation structure provided by the application:

[0110] The first cuboid water channel 2 and the second cuboid water channel 3 are both cuboid-shaped. The internal flow channels of the first cuboid water channel 2 and the second cuboid water channel 3 both extend along the first horizontal direction X. The water inlet 21 is arranged on the top surface of the end of the first cuboid water channel 2 away from the intermediate water channel 4. The water outlet 31 is arranged on the top surface of the end of the second cuboid water channel 3 away from the intermediate water channel 4. The intermediate water channel 4 is cuboid-shaped and is perpendicular to the connection between the end of the first cuboid water channel 2 away from the water inlet 21 and the end of the second cuboid water channel 3 away from the water outlet 31. The internal flow channel of the intermediate water channel 4 is connected between the corresponding internal flow channels of the first cuboid water channel 2 and the second cuboid water channel 3 along the second horizontal direction Y perpendicular to the first horizontal direction X.

[0111] Referring to Figure 15, in one implementation of Embodiment 10, the first cuboid water channel 2 and the second cuboid water channel 3 are arranged on the right side and the left side of the water channel base 1 respectively, i.e. the first cuboid water channel 2 and the second cuboid water channel 3 are arranged as the right-side cuboid water channel and the left-side cuboid water channel of the power module heat dissipation structure respectively, and the intermediate water channel 4 is arranged as a horizontal cuboid water channel connecting between the first cuboid water channel 2 and the second cuboid water channel 3.

[0112] The cooling water or cooling liquid enters the first cuboid water channel 2 on the right side from the water inlet 21, exchanges heat with the power modules on the top or side of the first cuboid water channel 2 on the right side of the power module heat dissipation structure and the magnetic devices 6 in the heat dissipation cavities 5 when flowing through the internal flow channel of the first cuboid water channel 2, then enters the second cuboid water channel 3 on the left side through the internal flow channel of the intermediate water channel 4, exchanges heat with the power modules on the top or side of the second cuboid water channel 3 on the left side of the power module heat dissipation structure and the magnetic devices 6 in the heat dissipation cavities 5 when flowing through the internal flow channel of the second cuboid water channel 3, and finally flows out from the water outlet 31.

[0113] In another implementation of the embodiment ten (not shown in the figure), the first cuboid water channel 2 and the second cuboid water channel 3 are respectively arranged on the left side and the right side of the water channel base 1, i.e. the first cuboid water channel 2 and the second cuboid water channel 3 are respectively used as the left side cuboid water channel and the right side cuboid water channel of the power module heat dissipation structure, and the intermediate water channel 4 is used as the transverse cuboid water channel connected between the first cuboid water channel 2 and the second cuboid water channel 3.

[0114] At this time, the flow direction of the cooling water or cooling liquid is changed to flow from the right side to the left side of the power module heat dissipation structure.

[0115] Please refer to FIG. 16, in the embodiment eleven of the power module heat dissipation structure provided by the present application:

[0116] The first cuboid water channel 2 and the second cuboid water channel 3 are both in the shape of a cuboid, the water inlet 21 is arranged on the bottom surface of the first cuboid water channel 2 away from the intermediate water channel 4, and the water outlet 31 is arranged on the bottom surface of the second cuboid water channel 3 away from the intermediate water channel 4.

[0117] In other embodiments of the power module heat dissipation structure provided by the present application (not shown in the figure), the water inlet 21 can also be arranged on the side surface of the cuboid-shaped first cuboid water channel 2 away from the intermediate water channel 4, and the water outlet 31 can also be arranged on the side surface of the cuboid-shaped second cuboid water channel 3 away from the intermediate water channel 4.

[0118] Please refer to FIG. 17 and 18, in the present implementation, the first cuboid water channel 2 includes:

[0119] The first water channel body 22 is integrally formed on the water channel base 1, and the first water channel cover plate 23 is detachably arranged on the outer side surface or bottom surface of the first water channel body 22 away from the second cuboid water channel 3, and surrounds the first flow cavity (not shown in the figure) which is part of the internal flow channel of the first cuboid water channel 2 together with the first water channel body 22.

[0120] The second cuboid water channel 3 includes:

[0121] The second water channel body 32 is integrally formed on the water channel base 1 in parallel with the first water channel body 22; the second water channel cover plate 33 is detachably installed on the outer side or bottom of the second water channel body 32 away from the first three-dimensional water channel 2, and forms a second flow cavity (not shown in the figure) as part of the internal flow channel of the second three-dimensional water channel 3 together with the second water channel body 32.

[0122] Please refer to Figs. 17-21, in the twelfth embodiment of the power module heat dissipation structure provided by the present application:

[0123] The first water channel body 22 is provided with a first flow groove (not shown in the figure) on the outer side away from the second three-dimensional water channel 3, one end of the first flow groove is communicated with the water inlet 21, and the opposite end of the first flow groove is communicated with the internal flow channel of the intermediate water channel 4; the first water channel cover plate 23 is installed on the outer side of the first water channel body 22 and closes the first flow groove, so that the first water channel cover plate 23 and the first flow groove form the above-mentioned first flow cavity as part of the internal flow channel of the first three-dimensional water channel 2. And the side of the first water channel cover plate 23 facing the first flow groove is provided with a plurality of heat dissipation fins 9, when the first water channel cover plate 23 is installed on the outer side of the first water channel body 22 and closes the first flow groove, the heat dissipation fins 9 are surrounded in the above-mentioned first flow cavity formed inside the first flow groove, for increasing the contact area of the cooling water or cooling liquid flowing through the first flow cavity with the first water channel cover plate 23 on one side, improving the water channel flow resistance, and improving the liquid flow rate flowing through the first flow cavity, thereby improving the heat dissipation efficiency of the first three-dimensional water channel 2.

[0124] The second water channel body 32 is provided with a second flow groove 321 on the outer side away from the first three-dimensional water channel 2, one end of the second flow groove 321 is communicated with the water outlet 31, and the opposite end of the second flow groove 321 is communicated with the internal flow channel of the intermediate water channel 4; the second water channel cover plate 33 is installed on the outer side of the second water channel body 32 and closes the second flow groove 321, so that the second water channel cover plate 33 and the second flow groove 321 form the above-mentioned second flow cavity as part of the internal flow channel of the second three-dimensional water channel 3. And the side of the second water channel cover plate 33 facing the second flow groove 321 is provided with a plurality of heat dissipation fins 9, when the second water channel cover plate 33 is installed on the outer side of the second water channel body 32 and closes the second flow groove 321, the heat dissipation fins 9 are surrounded in the above-mentioned second flow cavity formed inside the second flow groove 321, for increasing the contact area of the cooling water or cooling liquid flowing through the second flow cavity with the second water channel cover plate 33 on one side, improving the water channel flow resistance, and improving the liquid flow rate flowing through the second flow cavity, thereby improving the heat dissipation efficiency of the second three-dimensional water channel 3.

[0125] Please refer to Figs. 1-16, in the thirteenth embodiment of the power module heat dissipation structure provided by the present application:

[0126] The bottom surface of the water channel base 1, which faces away from the first three-dimensional water channel 2 and the second three-dimensional water channel 3, is provided with a third flow channel groove (not shown in the figure), one end of which is connected to the water inlet 21, and the opposite end of which is connected to the water outlet 31; the power module heat dissipation structure further comprises:

[0127] A third water channel cover plate 8 is installed on the bottom surface of the water channel base 1 and covers the third flow channel groove, so that the third water channel cover plate 8 and the third flow channel groove form a third flow channel cavity as a planar water channel provided on the water channel base 1. The third water channel cover plate 8 is provided with a plurality of heat dissipation fins 9 on the side facing the third flow channel groove. When the third water channel cover plate 8 is installed on the bottom surface of the water channel base 1 and covers the third flow channel groove, the heat dissipation fins 9 are surrounded by the third flow channel cavity formed on the inside of the third flow channel groove, which is used to increase the contact area between the cooling water or cooling liquid flowing through the third flow channel cavity and the third water channel cover plate 8 on the bottom side, and to increase the liquid flow rate, thereby improving the heat dissipation efficiency of the planar water channel.

[0128] Please refer to Figures 1-18, as preferred embodiments of Examples 12 and 13, the first water channel cover plate 23, the second water channel cover plate 33 and the third water channel cover plate 8 can be fastened and connected to the corresponding outer walls of the first three-dimensional water channel 2, the second three-dimensional water channel 3 and the water channel base 1 respectively by screws 10, and sealed and connected by sealing rings (not shown in the figure) or sealing glue (not shown in the figure) at their connection points; the first water channel cover plate 23, the second water channel cover plate 33 and the third water channel cover plate 8 can also be respectively welded to the corresponding outer walls of the first three-dimensional water channel 2, the second three-dimensional water channel 3 and the water channel base 1.

[0129] Please refer to Figure 19, as embodiments of Examples 12 and 13, the heat dissipation fins 9 are tooth-shaped fins 91.

[0130] Please refer to Figure 20, as embodiments of Examples 12 and 13, the heat dissipation fins 9 are rectangular fins 92.

[0131] Please refer to Figure 21, as embodiments of Examples 12 and 13, the heat dissipation fins 9 are circular fins 93.

[0132] As preferred embodiments of Examples 12 and 13, the heat dissipation fins 9 are Pin-Fin (pin-fin) fins.

[0133] Please refer to Figs. 1-18, as the common implementation of the first to thirteenth embodiments, the intermediate water channel 4 adopts the intermediate three-dimensional water channel installed on the water channel base 1, that is, the intermediate water channel 4 is the three-dimensional water channel arranged behind the magnetic device 6 at the end of the water channel base 1 far from the water inlet 21 and the water outlet 31, at this time, the overall water channel layout of the power module heat dissipation structure is: water inlet 21-first three-dimensional water channel 2-intermediate water channel 4 (three-dimensional water channel)-second three-dimensional water channel 3-water outlet 31.

[0134] In other embodiments (not shown in the figure), the intermediate water channel 4 can also adopt the intermediate planar water channel installed in the water channel base 1, that is, the intermediate water channel 4 is the planar water channel arranged below the magnetic device 6 at the end of the water channel base 1 far from the water inlet 21 and the water outlet 31, respectively communicating the first three-dimensional water channel 2 and the second three-dimensional water channel 3, at this time, the overall water channel layout of the power module heat dissipation structure is: water inlet 21-first three-dimensional water channel 2-intermediate water channel 4 (planar water channel)-second three-dimensional water channel 3-water outlet 31.

[0135] The present application also provides a vehicle-mounted charger, comprising a shell (not shown in the figure), and further comprising the above-mentioned power module heat dissipation structure.

[0136] Please refer to Figs. 1, 2, in the present embodiment, the above-mentioned heat dissipation cavity 5 is divided into at least two chambers by at least one partition wall 11, respectively for installing at least two magnetic devices 6, the magnetic device 6 is connected to the inner surface of the first three-dimensional water channel 2, the second three-dimensional water channel 3 and / or the intermediate water channel 4 through the heat-conducting glue.

[0137] In the present embodiment, the power module heat dissipation structure further comprises:

[0138] The circuit board (not shown in the figure) is installed in the shell of the vehicle-mounted charger and located above the power module heat dissipation structure, the pins of the magnetic device 6 and the power module 7 are electrically connected to the circuit board.

[0139] As a preferred embodiment, the circuit board is a PCB board, a power board or a chip board.

[0140] The above is only the preferred embodiment of the present application, and is not used to limit the present application, and those skilled in the art should understand that any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A power module heat dissipation structure, characterized by, The utility model relates to a kind of power module installation structure, including: Water channel base (1) is connected to the shell of vehicle-mounted charger; First three-dimensional water channel (2) and second three-dimensional water channel (3) are spaced apart on the water channel base (1); Intermediate water channel (4) is connected between the first three-dimensional water channel (2) and the second three-dimensional water channel (3); The water channel base (1), first three-dimensional water channel (2), the intermediate water channel (4) and second three-dimensional water channel (3) form heat dissipation cavity (5) between; At least one magnetic device (6) is installed in the heat dissipation cavity (5); At least one power module (7) is installed on the outer wall of first three-dimensional water channel (2) and / or second three-dimensional water channel (3).

2. The power module heat dissipation structure of claim 1, wherein, Also including: Device locking strip (73), including: Locking base (731) is fastened on the shell and matches the power module (7); Elastic pressing strip (732) is installed on the locking base (731), and corresponding power module (7) is tightly pressed to the outer side wall (A) of first three-dimensional water channel (2) or second three-dimensional water channel (3).

3. The power module heat dissipation structure of claim 1, wherein, The outer side wall (A) and / or top wall (B) of the first three-dimensional water channel (2) and second three-dimensional water channel (3) is provided with at least one mounting hole (C), and the power module (7) is provided with a connecting hole (74) matched with the mounting hole (C); The power module (7) is connected to the outer side wall (A) and / or top wall (B) of first three-dimensional water channel (2) or second three-dimensional water channel (3) by connecting member through corresponding connecting hole (74) and mounting hole (C).

4. The power module heat dissipation structure of claim 1, wherein, The power module (7) is connected to the outer side wall (A) and / or top wall (B) of first three-dimensional water channel (2) or second three-dimensional water channel (3) by heat conduction structure layer (75).

5. The power module heat dissipation structure according to any one of claims 2 to 4, wherein The power module (7) and the outer side wall (A) and / or top wall (B) of first three-dimensional water channel (2) or second three-dimensional water channel (3) are connected by a layer of thermal interface material (76).

6. The power module heat dissipation structure of claim 4, wherein, The heat conduction structure layer (75) is a layer of thermosetting adhesive or solder.

7. The power module heat dissipation structure according to any one of claims 1 to 4, wherein Also including: Water inlet (21) is provided at one end of the first three-dimensional water channel (2) away from the intermediate water channel (4), and is communicated with the internal flow passage of the first three-dimensional water channel (2); Water outlet (31) is provided at one end of the second three-dimensional water channel (3) away from the intermediate water channel (4), and is communicated with the internal flow passage of the second three-dimensional water channel (3).

8. The power module heat dissipation structure of claim 7, wherein, The first three-dimensional water channel (2) and the second three-dimensional water channel (3) are both in the shape of a cuboid, the water inlet (21) is provided at the top surface, side surface, end surface or bottom surface of the first three-dimensional water channel (2) away from the intermediate water channel (4), and the water outlet (31) is provided at the top surface, side surface, end surface or bottom surface of the second three-dimensional water channel (3) away from the intermediate water channel (4).

9. The power module heat dissipation structure of claim 7, wherein, The first three-dimensional water channel (2) includes: First water channel body (22) is provided on the water channel base (1); First water channel cover plate (23) is installed on the outer side surface or bottom surface of the first water channel body (22) away from the second three-dimensional water channel (3); The second three-dimensional water channel (3) includes: Second water channel body (32) is spaced apart on the water channel base (1) in parallel with the first water channel body (22); A second water channel cover plate (33) is installed on the outer side or bottom of the second water channel body (32) away from the first three-dimensional water channel (2).

10. The power module heat dissipation structure of claim 9, wherein, The outer side of the first water channel body (22) away from the second three-dimensional water channel (3) is provided with a first flow channel groove, one end of the first flow channel groove being connected to the water inlet (21), and the other end of the first flow channel groove being connected to the internal flow channel of the intermediate water channel (4). The first water channel cover plate (23) is installed on the outer side of the first water channel body (22) and covers the first flow channel groove, and one side of the first water channel cover plate (23) facing the first flow channel groove is provided with a plurality of heat dissipation fins (9) at intervals. The outer side of the second water channel body (32) is provided with a second flow channel groove (321), one end of the second flow channel groove (321) being connected to the water outlet (31), and the other end of the second flow channel groove (321) being connected to the internal flow channel of the intermediate water channel (4). The second water channel cover plate (33) is installed on the outer side of the second water channel body (32) and covers the second flow channel groove (321), and one side of the second water channel cover plate (33) facing the second flow channel groove (321) is provided with a plurality of heat dissipation fins (9) at intervals.

11. The power module heat dissipation structure of claim 10, wherein, The heat dissipation fins (9) are tooth-shaped fins (91), rectangular fins (92), or circular fins (93).

12. The power module heat dissipation structure of any one of claims 1-4, wherein, Two groups of the power modules (7) are installed at intervals on the outer walls of the first three-dimensional water channel (2) and the second three-dimensional water channel (3), respectively, and the power modules (7) are single-PIN devices and / or double-PIN devices.

13. An on-board charger comprising a housing, characterized in that The power module heat dissipation structure also includes the power module heat dissipation structure according to any one of claims 1-12. The power module heat dissipation structure also includes the power module heat dissipation structure according to any one of claims 1-12.

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