Cooling device for cooling an electronic circuit part equipped with heat-generating electrical components, and thermal management module having such a cooling device

Abstract

The invention relates to a cooling device for cooling an electronic circuit part (8) equipped with heat-generating electrical components (84), in particular for use in a thermal management module (1), comprising a module housing (100), wherein at least one cooling channel (101') for a flowing liquid medium, in particular oil, is formed on the module housing (100), wherein the module housing (100) has a module carrier part (10) having a front side (11) and a rear side (12) facing away from said front side, and, on the rear side (12), a housing receptacle (14) which is covered by a cover part (5) of the module housing (100) and has a base (141), wherein a through-opening (79) is formed on the base (141) of the housing receptacle (14) between the front side (11) and the rear side (12), wherein the through-opening (79) is closed by a heat-conducting insert (7), wherein the heat-conducting insert (7) is manufactured from a material which has a greater thermal conductivity than the material of the module carrier part (10), wherein a first side (7a) of the heat-conducting insert (7) is in heat-conducting contact with the electronic circuit part (8) directly or indirectly via a thermally conductive paste (19) or another thermal coupling element and wherein a second side (7b) of the heat-conducting insert (7) facing away from the first side (7a) forms a wall portion (72) of the cooling channel (101') on the front side (11) of the module carrier part (10).

Description

[0001] R. 415477

[0002] - 1 -

[0003] Description

[0004] title

[0005] Cooling device for cooling an electronic circuit component equipped with heat-generating electrical components and a thermal management module with such a cooling device

[0006] State of the art

[0007] Cooling devices for cooling an electronic circuit component equipped with heat-generating electrical components are known in the prior art, in which the electronic circuit component is mounted on a metal plate as a heat sink. Such a cooling device is known, for example, from EP 1 831 055 B1.

[0008] Furthermore, it is known that the e-axle (electric axle) of an electrically powered vehicle, which comprises an electric motor and a transmission, generates heat during operation, and that the vehicle battery of an electric vehicle (BEV) can generate heat, for example, while charging at an electric charging station, or requires heat to maintain functionality at very low ambient temperatures. On the one hand, there is a need to cool some components; on the other hand, the heat emitted by one component can optionally be used to heat another. A thermal management system can be provided to organize the necessary heat management, the task of which is the efficient dissipation, transfer, and / or utilization of heat generated by at least one of the components.

[0009] The thermal management system can, for example, be wholly or partially integrated into a thermal management module, which, as a compact assembly, is used particularly in or on an electrically powered vehicle, R. 415477

[0010] - 2 - for example, it can be installed on the housing of the electric motor or the transmission. The thermal management module can be designed, for example, to dissipate the heat generated by a vehicle component by exchanging this heat between a flowing liquid medium, which flows at least partially through flow channels of the thermal management module, and another medium. This other medium can be, for example, air, especially ambient air, or another liquid. In this way, the heat absorbed by the flowing liquid medium can be transferred to another medium, which, for example, circulates in a fluid circuit of the vehicle that is thermally coupled to the vehicle battery and / or the vehicle interior, and which comprises a liquid or a gas. The thermal management module can, for example, transfer heat to or absorb heat from this fluid circuit.

[0011] For this purpose, the thermal management module can include at least one heat exchanger and one pump, which are installed on or in a module, wherein the module has flow channels for a liquid medium, which may in particular be oil. A flow of the liquid medium can be conveyed by means of the pump through at least one of the flow channels. This flow can flow within the module and through components outside the module. The flow can, for example, flow wholly or partially, in particular through the electric motor and / or the transmission of an electrically powered vehicle or parts thereof. The heat exchanger installed on the thermal management module is designed to transfer heat between the liquid medium flowing in at least one flow channel of the module housing and another medium, in particular another medium flowing in a fluid circuit.

[0012] From DE 102020 216288 A1, for example, a thermal management module for an electric motor, designated as an oil module, is known, in which a pump and a heat exchanger are mounted on a plate-shaped base body provided with flow channels, wherein the pump is configured to pump an oil flow through at least one of the flow channels, and wherein the heat exchanger is configured to transfer heat between the oil flow and an external medium. R. 415477

[0013] - 3 -

[0014] Disclosure of the invention

[0015] The invention relates to a cooling device for cooling an electronic circuit component equipped with heat-generating electrical components, in particular for use in a thermal management module, comprising a module housing, wherein at least one cooling channel for a flowing liquid medium, in particular oil, is formed on the module housing, wherein the module housing has a module carrier part with a front and a rear opposite it, and on the rear a housing receptacle covered by a lid part of the module housing with a base, wherein a through-opening is formed on the base of the housing receptacle between the front and the rear, wherein the through-opening is closed by a heat-conducting insert, wherein the heat-conducting insert is made of a material that has a higher thermal conductivity than the material of the module carrier part.wherein the electronic circuit component is arranged in the housing receptacle above the through-hole and the thermal interface insert, wherein the thermal interface insert is in direct or indirect thermal contact with the electronic circuit component via a thermal paste or other thermal coupling element on one side, and wherein the thermal interface insert forms a wall section of the cooling channel on the front of the module carrier part on a second side facing away from the first side. If the module carrier part is made of plastic, the thermal interface insert can be made of, for example, aluminum or copper. The thermal interface insert can, for example, be inserted into the housing receptacle from the rear of the module carrier part and secured to the bottom of the housing receptacle above a through-hole by means of suitable fasteners.

[0016] Without being limited thereto, the invention is particularly useful for cooling an electronic circuit component that is installed in a thermal management module. The invention therefore also relates to a thermal management module with such a cooling device. The thermal management module has a module housing on which a heat exchanger and a pump are arranged. On the module housing of R. 415477

[0017] - 4 -

[0018] Thermal management modules are designed with flow channels for a liquid medium, in particular oil, a dielectric fluid, or a coolant, wherein the pump conveys a flow of the liquid medium through at least one of the flow channels. The heat exchanger can be configured to transfer heat between the medium flow and another medium. If, for example, one or more electrohydraulic control valves are arranged within the module housing for controlling the medium flow, it can be advantageous to arrange an electronic circuit component within the module housing that is electrically connected to the electrohydraulic control valves and the pump and equipped with a control circuit. In this case, the cooling device according to the invention can advantageously dissipate the heat generated during operation by the electronic components of the circuit component to a flow channel of the module housing designed as a cooling channel.

[0019] A fluid connection between two components is understood to be a connection which allows a liquid medium to pass from a channel or interior of one of the components into a channel or interior of the other component.

[0020] In the context of this application, a flow channel for a liquid medium is understood to be a flow space which, in at least one cross-section perpendicular to the flow direction of the medium, is enclosed on all sides, at least partially, by a wall. The cross-section of a flow channel is, for example, circular or rectangular. A flow channel can be long and extend over a larger section of the module housing, or it can be relatively short and, for example, form a simple opening between two adjacent flow channels. A flow channel can be straight or curved. Further flow channels can branch off from a flow channel.A flow channel can have two ends, to which further flow channels with different cross-sectional geometries are connected and / or which are fluidically connected to inlet and outlet openings for the liquid medium from the module housing or to the inlets of a control valve. R. 415477.

[0021] - 5 -

[0022] In the context of this application, a channel trench is understood to be a flow space open on one side, which, in at least one cross-section viewed perpendicular to the flow direction of the medium, is open on one side and bounded on the other three sides of the cross-section by a wall. The cross-section of a channel trench is, for example, C-shaped or U-shaped with a bottom and two side walls. By placing a further component, such as a flat mounting surface of a heat exchanger or an end face of a channel block, the channel trench can be sealed, thus forming a flow channel.Furthermore, two channel trenches with complementary course and mirror symmetry to each other can be placed on top of each other with their open sides facing each other and, if necessary, with a seal in between, in such a way that a flow channel is created whose cross-section is closed on all sides when viewed perpendicular to the flow direction of the medium.

[0023] Advantageous embodiments and further developments of the invention enable the features contained in the dependent claims.

[0024] The cooling channel can be formed, for example, by a channel trench on the front of the module carrier part and a component mounted on the front and attached to the module carrier part, which covers the channel trench. The cooling channel on the front of the module carrier part allows heat to be quickly dissipated from the electronic circuitry.

[0025] The component can be, in particular, a heat exchanger. In that case, fluid cooled by the heat exchanger can enter the cooling channel and there absorb the heat dissipated by the circuit component with exceptional efficiency.

[0026] In one embodiment, the heat-conducting insert can have a plate-shaped base body and a deflecting wall projecting from the plate-shaped base body. The deflecting wall projects through the opening into the cooling channel on the side of the base body facing away from the electronic circuit section. The deflecting wall redirects the flow path of the liquid medium in the cooling channel, causing the liquid medium to flow back and forth over the base body and thus circulate the heat from the R. 415477

[0027] - 6 -

[0028] The heat emitted by the base body can be absorbed particularly efficiently.

[0029] In this context, it is advantageous if the deflecting wall has a curved wall section and a subsequent straight wall section, wherein the deflecting wall divides the cooling channel into a first flow section and a second flow section, wherein the cooling channel is designed such that, during operation, the liquid medium enters the first flow section of the cooling channel through an inlet opening near the curved wall section and flows through it, wherein at the end of the first flow section the liquid medium is deflected into the second flow section and flows back along the straight wall section until it flows again along the curved wall section and reaches a flow channel designed as a breakthrough in the module support part.This design ensures that almost the entire surface of the base body covering the opening is covered by the cooling liquid medium.

[0030] The heat-conducting insert can have a groove running around the wall section, in which a seal is arranged and pressed against the base of the housing recess, thus advantageously sealing the opening. The liquid medium flowing over the heat-conducting insert therefore cannot enter the housing recess, so that the electronic circuitry is protected within the housing recess.

[0031] To improve the centering and positioning of the heat-conducting insert on the module carrier part, the heat-conducting insert can have a rim surrounding the wall section that engages in a recess on the bottom of the housing receptacle.

[0032] The heat-conducting insert can advantageously have one or more mounting openings that engage with fastening elements formed on the module carrier part. The module carrier part can, for example, have clamping elements that are pressed or injected into the mounting openings.

[0033] Furthermore, the mounting holes can be used to accommodate a variety of other fasteners, such as screws or rivets. R. 415477

[0034] - 7 -

[0035] Brief description of the drawings

[0036] Possible embodiments of the invention are explained below with reference to the accompanying figures. The drawing shows:

[0037] Figure 1 shows a perspective top view of the front of a thermal management module.

[0038] Figure 2 shows a perspective rear view of the thermal management module from Figure 1.

[0039] Figure 3 shows a top view of the front of a module carrier part of the thermal management module with the cooling device according to the invention with the heat exchanger removed.

[0040] Figure 4 shows a top view of the rear of the module carrier part of the thermal management module with the cover part and reservoir cover removed, without the filter element and without the pump.

[0041] Figure 5 shows an enlarged view of the cooling channel on the front of the module carrier part with the heat exchanger removed.

[0042] Figure 6 shows a perspective view of a heat-conducting insert.

[0043] Figure 7 shows a cross-section through the thermal management module from Figure 1 with the cooling device according to the invention,

[0044] Figure 8 is an enlarged detail view from Figure 7.

[0045] Embodiments of the invention R. 415477

[0046] - 8 -

[0047] Figure 1 shows a perspective view of the front of an embodiment of a thermal management module 1. Figure 2 shows a perspective view of the rear mounting side of the same embodiment, opposite the front. For example, the thermal management module 1 has a module housing 100, which has several through-holes 13 for screw-in fasteners, with which the thermal management module 1 can be arranged on a vehicle component such as a transmission or an electric motor. The module housing 100 can be arranged, in particular, on an outer surface of the vehicle component or in a receiving opening therein, wherein the mounting side of the thermal management module 1 shown in Figure 2 faces the vehicle component, while the front surface shown in Figure 1 faces the outside of the vehicle component.

[0048] The thermal management module 1 shown here includes, among other things, a pump 3, a filter 4, and a heat exchanger 2, which are mounted on the front of the module housing 100. On the mounting side facing away from the front, the module housing 100 has a cover 5 and a reservoir cover 6. Inside the module housing 100 are an electronic circuit 8 and at least one electrohydraulic control valve 9. In the embodiment shown here, there are three electrohydraulic control valves 9. The module housing 100 also has several flow channels 101, 102, 103, 104, 105, 113, 114 for a liquid medium pumped by the pump 3, which is preferably oil. However, it is also possible to use, for example, a dielectric fluid, a liquid refrigerant used in air conditioning systems, or electrolyzed water.The thermal management module 1 has a single electrical connection 16 on its front side facing the outside, for electrical contact with an external connector. At least some electrical components of the thermal management module can be contacted via the electrical connection 16.

[0049] The module housing 100 of the thermal management module 1 comprises a module carrier part 10, which is preferably made of plastic, for example as an injection-molded part. However, it is also possible to manufacture the module carrier part 10 from metal. The module carrier part 10 is shown in Figures 3 and 4. R. 415477

[0050] - 9 - and has a front side 11, which also forms the front of the thermal management module 1, and a rear side 12 facing away from it. Figure 3 shows a view of the front side 11 of the module carrier part 10 with the heat exchanger 2 removed, while Figure 4 shows a perpendicular view of the rear side 12 of the module carrier part 10. In Figure 4, all other components have been removed for clarity. The front side 11 and the rear side 12 of the module carrier part 10 can each be completely or partially covered by other components of the thermal management module 1, such as the heat exchanger 2, a cover part 5, or a reservoir cover 6. The module carrier part 10 is largely covered on the rear side 12 by the cover part 5 and the reservoir cover 6, so that from the mounting side of the module housing 100 shown in Figure 2, only a few areas of the rear side 12 of the module carrier part 10 are visible.

[0051] As can best be seen in Figure 3, the module support part 10 has a first area 110 with first channels 111 on its front face 11. The first area 110 occupies only a portion of the front face 11. As can be seen by comparing Figure 1 and Figure 3, all first channels 111 in the first area 110 are covered by a heat exchanger 2, which is mounted with its mounting side facing the module support part 10 directly above the first channels 111 on the front face 11 of the module support part 10. As can be seen in Figure 1, the heat exchanger 2 has an enlarged flange area 22 extending beyond a box-shaped base body, which can be screwed onto the first area 110, optionally with the insertion of a suitable gasket.On its underside, which is not visible in Figure 1, the heat exchanger 2 has two openings for the liquid medium that flows in the flow channels of the module housing 10. The liquid medium enters the heat exchanger 2, for example, via the inlet opening 106 visible in Figure 3, and exits the heat exchanger 2 via an outlet opening of the heat exchanger 2, which is not visible. This outlet opening also serves as the inlet opening to a cooling channel 10T and is located approximately at the position of reference numeral 108 in Figure 3, above the cooling channel 10T. Furthermore, the heat exchanger 2 has two outwardly projecting connections 23, 24, visible in Figure 1, for a second liquid medium that flows through the heat exchanger 2. The heat exchanger 2 exchanges the liquid medium flowing through the flow channels of the thermal management module 1 and the R. 415477.

[0052] - 10 -

[0053] Heat exchanger 2 transfers heat from the flowing liquid medium on the one hand and from the second liquid medium flowing through the heat exchanger via connections 23, 24, whereby the two media are completely separated from each other. Preferably, the heat exchanger transfers heat to the second liquid medium.

[0054] By mounting the heat exchanger 2 above the first area 110, the first channel trenches 111 are covered, forming flow channels 103 extending in a first plane. A channel trench 11T is also covered by the heat exchanger 2, with the resulting flow channel forming a cooling channel 10T. The first plane with flow channels 103 is particularly well visible in the cross-sectional view of Figure 7, although the heat exchanger 2 is not shown in Figure 7.

[0055] As can be seen in Figures 3, 5, 7, and 8, the module carrier part 10 has a heat-conducting insert 7 inserted therein. The heat-conducting insert 7 is made of a material that has a significantly higher thermal conductivity than the material of the module carrier part 10. In the illustrated embodiment, the heat-conducting insert 7 is, for example, made of aluminum or copper. The heat-conducting insert 7 can be manufactured as a separate component, as shown in Figure 6. In the embodiment shown here, the heat-conducting insert 7 has a plate-shaped base body 73 and a deflecting wall projecting from the plate-shaped base body 73.

[0056] 71. The deflecting wall 71 has a curved wall section 71a and an adjoining straight wall section 71b. A surface section of the base body 73 surrounding the deflecting wall 71 forms a wall section 72 at the bottom of the cooling channel 101', as can best be seen in Figure 5. Furthermore, the heat-conducting insert 7 has this wall section

[0057] 72 circumferential groove 76 for receiving a seal 77, which is only visible in Figure 8. The heat-conducting insert 7 in Figure 6 has a circumferential rim 78. Between the groove 78 and the rim 78, one or more mounting openings 78a can be provided on the heat-conducting insert 7.

[0058] As can best be seen in Figures 7 and 8, the module carrier part 10 has a housing receptacle 14 with a base 141 on its rear side 12, which is covered by a cover part 5 of the module housing 100. A through-opening 79 is provided in the base 141 of the housing receptacle 14 between the R. 415477

[0059] - 11 -

[0060] The heat-conducting insert 7 is formed on the front 11 and the back 12. It is inserted into the housing receptacle 14 in such a way that the base body 73 completely covers or closes the opening 79. The seal 77, arranged in the groove 76, is pressed against the base 141 of the housing receptacle 14, thus sealing the opening 79. The edge 78 of the heat-conducting insert 7 engages in a recess 142 on the base 141 of the housing receptacle 14, allowing the heat-conducting insert 7 to be easily centered relative to the opening 79 during insertion. The heat-conducting insert 7 can be fastened to the base 141 of the housing receptacle 14 by means of the fastening openings 78a formed on the heat-conducting insert 7, which can engage with fastening means (not shown) formed on the module carrier part 10.As shown in Figure 8, an electronic circuit carrier 8 is mounted within the housing receptacle 14 above the thermal interface insert 7. The thermal interface insert 7, with its first side 7a facing the housing receptacle 14, is in thermal contact with the electronic circuit carrier 8 either directly or indirectly via a thermal paste 19 or another thermal coupling element. When the thermal interface insert 7 is fully mounted, the deflecting wall 71 on the second side 7b of the thermal interface insert 7, facing away from the electronic circuit carrier 8, projects through the opening 79 into the cooling channel 10T on the front side 11 of the module carrier part 10, as shown in Figures 5 and 8. The thermal interface insert 7, with its second side 7b facing away from the first side 7a, forms a wall section 72 of the cooling channel 101' on the front side 11 of the module carrier part 10.

[0061] Figure 5 shows that the deflecting wall 71 divides the cooling channel 101' into a first flow section 74 and a second flow section 75. During operation, the cooled liquid medium, which has been pumped by the pump 3 through the heat exchanger 2, enters the first flow section 74 of the cooling channel 101' through an outlet opening of the heat exchanger 2, which also represents the inlet opening 108 (shown with dashed lines) near the curved wall section 71a, and flows through it until a deflection point at the end of the first flow section 74. There, the liquid medium is deflected behind the end of the deflecting wall 71 into the second flow section 75. In the second flow section, the liquid medium flows along the straight wall section 71b until it reaches R. 415477

[0062] - 12 - flows again along the curved wall section 71a and reaches a flow channel 105 formed as an opening in the module support part 10. The liquid medium passes through the opening onto the rear side 12 of the module support part 10. This allows, for example, heat produced by the electronic circuit section 8 during operation to be dissipated. On the rear side 12, the liquid medium can, for example, flow back into a reservoir 15 under the reservoir lid 6.

[0063] As can be further seen in Figure 1, a cable connection 17 can be provided on the front 11 of the module carrier part 10, which connects the pump 3 to a connection contact 18 of the thermal management module 1. The connection contact 18 can, for example, be electrically connected to the terminal 16 and / or the electronic circuit part 8 via metal conductors injected into the module carrier part 10.

[0064] Figure 4 shows a top view of the rear side 12 of the module carrier part 10 of the thermal management module 1 with the cover part 5 and reservoir cover 6 removed, but without the filter element 4 and without the pump 3. It can be seen that, for example, a flow channel 105, designed as a through-hole, on the rear side 12 is fluidly connected to a second channel 112. As can be seen in Figure 4, the module carrier part 10 has a housing receptacle 14 on its rear side 12. At the base of the housing receptacle 14, a second area 120 with several second channel 112s is formed. These second channel 112s are covered by a channel block 52 formed on the cover part 5 to create flow channels 104 extending in a second plane. The second plane of flow channels 104, which are formed by the covering with the channel block 52 of the cover part 5, is best seen in Figure 7.Figures 4 and 7 also show that the module support part 10 has further first flow channels 101 designed as openings, which are led from the front 11 to the rear 12 and not all of them end in second channel trenches 112, but are also fluidly connected to such second flow channels 102 which are formed in the channel block 52.

[0065] Figure 7 shows that the electronic circuit part 8 is located in the housing recess 14 next to the second area 120 with second channel trenches R. 415477

[0066] - 13 -

[0067] 112 is used. The electronic circuit part 8 is designed, for example, as a printed circuit board and has a side 81 populated with electrical components 84 and a contact side 82 facing away from it and towards the cover part 5, which is provided with contact pads (not shown). Some of the electrical components 84, such as IC components or transistors, generate heat during operation. The electronic circuit part 8 includes an electronic control circuit 83 comprising the electrical components 84 for controlling electrohydraulic control valves 9 and the pump 3, as well as optionally other electrical components of the thermal management module 1. Contact pins of the electrical connection 16 can, for example, be directly contacted with the electronic circuit part 8 in a through-hole configuration.The side 81 of the electronic circuit part 8, which is equipped with the electrical components 84, is thermally connected to the thermal conducting part 7 via a thermal paste 19, for example.

[0068] Figure 7 shows that the side 53 of the channel block 52 facing the module support part 10 can be provided with at least one sealing element 130. The sealing element 130 is arranged between the channel block 52 and the rear side 12 of the module support part 10 such that at least one transition area between at least one of the first flow channels 101 and at least one of the second flow channels 102 is sealed. Furthermore, the flow channels 104 arranged in the second plane are each surrounded by a sealing area of ​​the sealing element 130. Preferably, all fluid transition areas between the cover part 5 and the module support part 10 are sealed from each other and from the housing receptacle 14 by the sealing element 130.

[0069] In the embodiment shown in Figure 3, the first channel trenches 111 on the front face 11 of the module support part 10, including channel trench 11T, are both part of the first flow channels 101 and part of the flow channels 103 arranged in the first plane. However, in addition to the flow channels 103 arranged in the first plane, there are further first flow channels 101 of the module support part 10, which, for example, connect the front face 11 with the rear face 12 as openings, such as flow channel 105 in Figure 3. The second channel trenches 112 on the rear face 12 and / or the end face of the channel block 52 are part of the flow channels 103 arranged in the second plane.

[0070] - 14 - flow channels 104, which run within the module housing 100 and are bounded by both the module support part 10 and the cover part 5, or are formed between these two components. Further channel trenches on the rear side 12 outside the second area 112 are covered by the reservoir cover 6, forming, for example, an inlet channel 113 and an outlet channel 114 of the filter 4. Both the inlet channel 113 and the outlet channel 114 are flow channels formed within the module housing 100.

[0071] Figure 7 shows that one or more electrohydraulic control valves 9 can be attached to the channel block 52. Each of the electrohydraulic control valves 9 can have a valve part 92 and a solenoid part 91.

[0072] Each solenoid part 91 has a solenoid coil and, when energized, can actuate, for example, a spool valve formed in the valve part 92. The operating principle of such control valves, which can be designed as switching valves or pressure regulating valves, is known. The valve part 92 of the control valves 9 can each be inserted into a receiving opening 54 of the channel block 52, which runs parallel to the contacting side 82 of the electronic circuit part 8, with the respective solenoid part 91 projecting laterally from the channel block 52, as can be seen in Figure 7. The second flow channels 102 formed in the channel block 52 can, for example, each represent an inlet port, outlet port, and / or working port of an electrohydraulic control valve 9.The flow of liquid medium in one or more of the flow channels (101, 102, 103, 104, 105, 113, 114) can be controlled by the electro-hydraulic control valves 9.

[0073] After the cover part 5 is placed on the module carrier part 10, the magnetic parts 91 project into the housing receptacle 14 between the electronic circuit part 8 and the cover 51, as can best be seen in Figure 9. Spring-elastic electrical contact elements 93 of the respective electrohydraulic control valve 9, projecting from the magnetic part 91, can be electrically contacted with contact surfaces on the contacting side 82 of the electronic circuit part 8, for example by press contact. The cover part 5 and the module carrier part 10 can be welded together. However, it is also possible to screw the cover part 5 to the module carrier part 10. Between the edge of the housing receptacle R. 415477

[0074] - 15 -

[0075] 14 and the cover part 5, another sealing element can be arranged which seals the housing receptacle 14 to the outside.

[0076] As can be seen further in Figure 4, the module support part 10 can have a reservoir 15 for the liquid medium on its rear side 12, which is in fluid communication with the pump 3. The liquid medium can enter the reservoir 15, for example, via an opening 61 on the mounting side of the module housing 100. During operation, the pump 3 pumps the liquid medium into an inlet channel 113, which is part of the flow channels of the module support part 10. The inlet channel 113 is designed as a channel trench on the rear side 12 of the module support part 10 and is covered together with the reservoir 15 by a reservoir cover 6, which is arranged on the mounting side of the module housing 100 next to the cover part 5, as shown in Figure 2.

[0077] As can be seen in Figure 4, a receptacle 41 for a filter 4 for filtering the flowing liquid medium is formed on the module housing 10. The inlet channel 113 leads to the filter 4, and at least one outlet channel 114 of the flow channels leads away from the filter 4 and is fluidly connected, for example, via a flow channel 107 designed as a vertical deflection channel, to one of the first channel trenches 111 of the first area 110 on the front face 11. The filter 4 is shown here as a filter can and can comprise a filter element for filtering the liquid medium, in particular an oil filter element.

Claims

R. 415477 - 16 - Claims 1. Cooling device for cooling an electronic circuit part (8) equipped with heat-generating electrical components (84), in particular for use in a thermal management module (1), comprising a module housing (100), wherein at least one cooling channel (10T) for a flowing liquid medium, in particular oil, is formed on the module housing (100), wherein the module housing (100) has a module carrier part (10) with a front (11) and a rear (12) facing away from it, and on the rear (12) a housing receptacle (14) covered by a cover part (5) of the module housing (100) with a base (141), wherein a through-opening (79) is formed on the base (141) of the housing receptacle (14) between the front (11) and the rear (12), wherein the through-opening (79) is closed by a heat-conducting insert (7), wherein the heat-conducting insert (7) is made of a material,which has a higher thermal conductivity than the material of the module carrier part (10), wherein the electronic circuit part (8) is arranged in the housing receptacle (14) above the through-hole (79) and the thermal interface insert (7), wherein the thermal interface insert (7) is in thermal contact with the electronic circuit part (8) with a first side (7a) directly or indirectly via a thermal paste (19) or another thermal coupling element, and wherein the thermal interface insert (7) forms a wall section (72) of the cooling channel (10T) on the front (11) of the module carrier part (10) with a second side (7b) facing away from the first side (7a).

2. Cooling device according to claim 1, characterized in that the cooling channel (10T) is formed by a channel trench (11T) formed on the front (11) of the module support part (10) and a component (200) placed on the front (11) and attached to the module support part (10), which covers the channel trench (11T).

3. Cooling device according to claim 2, characterized in that the component (200) is a heat exchanger (2). R. 415477 - 17 - 4. Cooling device according to one of claims 1 to 3, characterized in that the heat conduction insert (7) has a plate-shaped base body (73) and a deflecting wall (71) projecting from the plate-shaped base body (73), wherein the deflecting wall (71) projects into the cooling channel (101') through the opening (79) on the side of the base body (73) facing away from the electronic circuit part (8).

5. Cooling device according to claim 4, characterized in that the deflecting wall (71) has a curved wall section (71a) and a straight wall section (71b) adjoining it, wherein the deflecting wall (71) divides the cooling channel (101') into a first flow section (74) and a second flow section (75), wherein the cooling channel (101) is designed such that, during operation, the liquid medium enters the first flow section (74) of the cooling channel (101') through an inlet opening (108) near the curved wall section (71a) and flows through it, wherein the liquid medium is deflected at the end of the first flow section (74) into the second flow section (75) and flows back along the straight wall section (71b) until it flows again along the curved wall section (70a) and to a breakthrough in the The module carrier part (10) enters the formed flow channel (105).

6. Cooling device according to one of claims 1 to 5, characterized in that the heat conducting insert (7) has a groove (76) circumferential to the wall section (72) in which a seal (77) is arranged which is pressed against the bottom (141) of the housing receptacle (14) so ​​that the opening (79) is sealed.

7. Cooling device according to one of claims 1 to 6, characterized in that the heat conducting insert (7) has a circumferential edge (78) which engages in a recess (142) on the bottom (141) of the housing receptacle (14).

8. Cooling device according to one of claims 1 to 7, characterized in that the heat conducting insert (7) has one or more fastening openings (78a) which engage in fastening means formed on the module carrier part (10). R. 415477 - 18 - 9. Cooling device according to one of claims 1 to 8, characterized in that the module carrier part (10) is made of plastic and the heat-conducting insert (7) is made of a metal, in particular aluminum or copper.

10. Thermal management module (1) with a cooling device according to one of claims 1 to 8. Claims 1 to 9.

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