Antenna module operating with dual polarization

Abstract

An antenna module operating with dual polarization, according to the present specification, comprises: a first dielectric layer having a ground layer formed on the back surface thereof; a first signal line and a second signal line; a second dielectric layer; a first signal via vertically connecting one end portion of the first signal line to a first metal pad of the second dielectric layer; a second signal via vertically connecting one end portion of the second signal line to a second metal pad of the second dielectric layer; a third dielectric layer; a first patch element disposed on the front surface of the third dielectric layer; a fourth dielectric layer; a second patch element disposed on the front surface of the fourth dielectric layer; a parasitic patch element formed to encompass the second patch element; and ground vias formed to vertically connect the parasitic patch element to the ground layer.

Description

Antenna module operating with dual polarization

[0001] This specification relates to an antenna module operating in dual polarization. A specific implementation relates to an antenna module operating in dual polarization for improved isolation.

[0002] A dual-polarization antenna is an antenna that utilizes two or more feed lines sharing a single radiator. Signal interference, reduced antenna efficiency, and distortion of the radiation pattern caused by current leakage between physically close feed lines have been identified as problems. In this regard, a structure that improves isolation between adjacent signal lines through modification of the feed lines can be considered. However, because the signal lines become complex, unwanted radiation components may be generated by the signal lines.

[0003] On the other hand, extending the length of transmission lines has the disadvantage of limiting operation within a wide frequency bandwidth and increasing beam-squint phenomena when expanding array antennas. In this regard, while isolation can be improved through the application of hybrid couplers, the size of the hybrid couplers leads to an increase in the overall antenna module size. Furthermore, structures utilizing hybrid couplers have the disadvantage of limiting expansion into array antennas.

[0004] This specification proposes a method to improve isolation between feed lines using a simple ring-parasitic element and ground via formation without deformation or additional structure of the feed line.

[0005] The purpose of this specification is to provide an antenna module operating in dual polarization for improved isolation.

[0006] The present specification aims to provide an antenna module that operates with dual polarization to improve isolation without increasing the antenna size.

[0007] This specification proposes a method to improve isolation between feed lines using a simple ring-parasitic element and ground via formation without modification or additional structure of the feed line.

[0008] The present specification aims to provide an antenna module operating in dual polarization for improved isolation that can be extended to an array antenna.

[0009] To achieve the above or other purposes, an antenna module operating in dual polarization according to the present specification comprises: a first dielectric layer having a ground layer formed on its back surface; a first signal line and a second signal line; a second dielectric layer; a first signal via vertically connecting one end of the first signal line and a first metal pad of the second dielectric layer; a second signal via vertically connecting one end of the second signal line and a second metal pad of the second dielectric layer; a third dielectric layer; a first patch element disposed on the front surface of the third dielectric layer; a fourth dielectric layer; a second patch element disposed on the front surface of the fourth dielectric layer; a parasitic patch element formed to surround the second patch element; and ground vias formed to vertically connect the parasitic patch element and the ground layer.

[0010] The antenna module comprises: a first dielectric layer having a ground layer formed on its back surface; a first signal line disposed in a uniaxial direction in a first region on the front surface of the first dielectric layer; a second signal line disposed in the uniaxial direction in a second region on the front surface of the first dielectric layer; a second dielectric layer stacked and disposed on the first dielectric layer having the first signal line and the second signal line formed thereon; a first signal via vertically connecting one end of the first signal line and a first metal pad of the second dielectric layer; a second signal via vertically connecting one end of the second signal line and a second metal pad of the second dielectric layer; a third dielectric layer stacked and disposed on the second dielectric layer having the first metal pad and the second metal pad formed thereon; a first patch element disposed on the front surface of the third dielectric layer; a fourth dielectric layer stacked and disposed on the third dielectric layer having the first patch element formed thereon; a second patch element disposed on the front surface of the fourth dielectric layer; and a parasitic patch element formed to surround the second patch element. and ground vias formed to vertically connect the parasitic patch element and the ground layer. One end of the second signal line may be formed spaced apart from one end of the first signal line. The ground vias may be connected to the parasitic patch element at two or more points among the first point, the second point in the first axis direction, and the third and fourth points in the other axis direction orthogonal to the first axis direction.

[0011] According to an embodiment, the first patch element may include a first sub-pattern formed with a first length in a first direction and a second sub-pattern formed with the first length in a second direction orthogonal to the first direction. The second patch element may include a third sub-pattern formed with a second length in the first direction and a fourth sub-pattern formed with the second length in the second direction. The second length may be formed to be shorter than the first length.

[0012] According to an embodiment, the first signal line and the second signal line may be formed in the Y-axis direction. The shape of one end of the first signal line may be formed in a circular shape corresponding to the shape of the first metal pad. The shape of one end of the second signal line may be formed in a circular shape corresponding to the shape of the second metal pad.

[0013] According to an embodiment, the first sub-pattern may be arranged in the first direction at a 45-degree angle with respect to the X-axis, and the second sub-pattern may be arranged in the second direction at a -45-degree angle with respect to the X-axis. The third sub-pattern may be arranged in the first direction at a 45-degree angle with respect to the X-axis, and the fourth sub-pattern may be arranged in the second direction at a -45-degree angle with respect to the X-axis.

[0014] According to an embodiment, the first sub-pattern and the third sub-pattern may be formed with a first width in the second direction. The second sub-pattern and the fourth sub-pattern may be formed with a second width in the first direction. The first width and the second width may be formed identically.

[0015] According to an embodiment, the parasitic patch element may include a slot region formed to accommodate the second patch element within it. The slot region may be formed with a third length longer than the first length in the first direction and the second direction. The slot region may include a first sub-region formed with the third length in the first direction and a third width in the second direction; and a second sub-region formed with the third length in the second direction and the third width in the first direction. The first sub-region and the second sub-region may be formed to overlap each other at a central portion.

[0016] According to an embodiment, the ends of the first sub-pattern and the ends of the third sub-pattern may be formed of semicircles having a diameter equal to the first width. The ends of the second sub-pattern and the ends of the fourth sub-pattern may be formed of semicircles having a diameter equal to the second width. The ends of the first sub-region of the slot region may be formed of semicircles having a diameter equal to the third width. The ends of the second sub-region of the slot region may be formed of semicircles having a diameter equal to the third width.

[0017] According to an embodiment, the parasitic patch element may be formed in a polygonal or circular shape having a slot region formed therein. The ground vias may include a first ground via that vertically connects a first point in the direction of the axis of the parasitic patch element and a first point of the ground layer; and a second ground via that vertically connects a second point in the direction of the axis of the parasitic patch element and a second point of the ground layer.

[0018] According to an embodiment, the first ground via and the second ground via may be positioned at the same distance along the axial direction with respect to the center point of the slot area. The first ground via may be positioned at a distance from the first signal via, and the second ground via may be positioned at a distance from the second signal via.

[0019] According to an embodiment, the ground vias may further include a third ground via that vertically connects a third point of the parasitic patch element on one side of the slot region and a third point of the ground layer in the other axis direction. The third ground via may be positioned at a distance from the first signal via by the distance from the first signal via and at a distance from the second signal via by the distance from the first signal via.

[0020] According to an embodiment, the ground vias may further include a fourth ground via that vertically connects a fourth point of the parasitic patch element on the other side of the slot region and a fourth point of the ground layer in the other axis direction. The third ground via and the fourth ground via may be positioned at the same distance in the other axis direction with respect to the center point of the slot region.

[0021] According to an embodiment, the antenna module may be configured to radiate a first polarized signal and a second polarized signal orthogonal to the first polarized signal within a predetermined frequency range centered at 160 GHz. The spacing between the third sub-pattern and the boundary of the slot area and the spacing between the fourth sub-pattern and the boundary of the slot area may be formed to have a range between 0.02 wavelengths and 0.05 wavelengths.

[0022] According to an embodiment, the antenna module may be configured to radiate a first polarized signal and a second polarized signal orthogonal to the first polarized signal within a predetermined frequency range centered at 160 GHz. The lengths on the X-axis and Y-axis of the parasitic patch element may be formed to have a range between 0.512 wavelengths and 0.85 wavelengths.

[0023] The technical effects of the dual-polarization antenna module according to the present specification are described as follows.

[0024] According to the present specification, an antenna module operating with dual polarization for improved isolation is provided.

[0025] According to the present specification, an antenna module having a multilayer substrate structure that operates with dual polarization for improved isolation without increasing the antenna size is provided.

[0026] According to the present specification, a method for improving isolation between feed lines is proposed using a simple ring-parasitic element and two or more ground vias adjacent to signal vias without deformation or additional structure of the feed line.

[0027] According to the present specification, a method for improving isolation between feed lines is proposed using a simple ring-parasitic element and three or more ground vias adjacent to signal vias without deformation or additional structure of the feed line.

[0028] According to the present specification, an isolation enhancement technique between feed lines using four ground vias adjacent to a ring-parasitic element and signal vias, and an antenna radiation pattern of a symmetric structure can be implemented.

[0029] According to the present specification, an antenna module operating with dual polarization for improved isolation, which enables expansion into an array antenna, is provided by limiting the size of a single antenna to a size less than or equal to a certain size relative to the wavelength.

[0030] Further scope of the applicability of this specification will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of this specification are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of this specification, should be understood as being given merely as examples.

[0031] FIG. 1 shows the configuration of wireless devices that perform wireless communication in the millimeter wave band or terahertz band according to the present specification.

[0032] FIG. 2 shows an antenna module composed of a signal transmission device including a plurality of Rotman lenses and an array antenna according to the present specification.

[0033] FIG. 3 is an enlarged view of the first Rotman lens and the first output line of the signal transmission device of FIG. 2.

[0034] FIG. 4 shows a cross-sectional view of an antenna module operating as a dual-polarized antenna in the 6G frequency band according to the present specification.

[0035] Figure 5 shows a front view of the antenna module of Figure 4.

[0036] Figure 6 is an enlarged view of the slot area of ​​the parasitic patch element of Figure 4.

[0037] FIG. 7 shows a front view of an antenna module including first and second patch elements and antenna performance.

[0038] FIG. 8 shows a front view of an antenna module including first and second patch elements of a rectangular shape and antenna performance.

[0039] FIG. 9 shows a front view of an antenna module including first and second patch elements and a parasitic patch element of a polygonal or circular shape, and antenna performance.

[0040] FIG. 10 shows a front view of an antenna module including first and second patch elements, parasitic patch elements, and ground vias, and antenna performance.

[0041] Figures 11 to 15 show the current distribution and antenna characteristics according to the number of vias.

[0042] Figure 16 shows the change in antenna characteristics according to the spacing between the first and second patch elements and the parasitic patch element in the antenna module of Figure 5.

[0043] Figure 17 shows the change in antenna characteristics according to the length of the parasitic patch element in the antenna module of Figure 5.

[0044] FIG. 18 shows an array antenna in which a plurality of antenna elements are arranged in one axial direction according to the present specification.

[0045] Figure 19 is an enlarged view of a portion of the array antenna of Figure 18.

[0046] Figure 20 compares the reflection coefficient, isolation characteristics, and antenna gain characteristics of the antenna element of Figure 5 and the array antenna of Figure 18.

[0047] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components regardless of drawing symbols will be assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, in describing the embodiments disclosed in this specification, if it is determined that a detailed description of related prior art could obscure the essence of the embodiments disclosed in this specification, such detailed description will be omitted. Additionally, the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification; the technical concept disclosed in this specification is not limited by the attached drawings, and it should be understood that they include all modifications, equivalents, and substitutions that fall within the concept and technical scope of this specification.

[0048] Terms including ordinal numbers, such as first, second, etc., may be used to describe various components, but said components are not limited by said terms. These terms are used solely for the purpose of distinguishing one component from another.

[0049] When it is stated that one component is "connected" or "connected" to another component, it should be understood that while it may be directly connected or connected to that other component, there may also be other components in between. On the other hand, when it is stated that one component is "directly connected" or "directly connected" to another component, it should be understood that there are no other components in between.

[0050] A singular expression includes a plural expression unless the context clearly indicates otherwise.

[0051] In this application, terms such as “comprising” or “having” are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0052] 6G System General

[0053] The 6G (wireless communication) system aims for (i) very high data rates per device, (ii) a very large number of connected devices, (iii) global connectivity, (iv) very low latency, (v) reduced energy consumption of battery-free IoT devices, (vi) ultra-reliable connectivity, and (vii) connected intelligence with machine learning capabilities. The vision of the 6G system can be seen in four aspects: intelligent connectivity, deep connectivity, holographic connectivity, and ubiquitous connectivity.

[0054] 6G systems are expected to have 50 times higher simultaneous wireless connectivity than 5G wireless communication systems. URLLC, a key feature of 5G, will become an even more dominant technology in 6G communication by providing end-to-end latency of less than 1ms. Unlike the frequently used area spectrum efficiency, 6G systems will have much better volume spectrum efficiency.

[0055] THz (Terahertz) communication

[0056] Data transmission rates can be increased by expanding bandwidth. This can be achieved by using sub-THz communication with wide bandwidth and applying advanced large-scale MIMO technology. THz waves, also known as sub-millimeter radiation, generally refer to a frequency band between 0.1 THz and 10 THz with corresponding wavelengths ranging from 0.03 mm to 3 mm. The 100 GHz–300 GHz band range (Sub-THz band) is considered the primary portion of the THz band for cellular communication. Adding the Sub-THz band to the mmWave band increases 6G cellular communication capacity. Among the defined THz bands, the 300 GHz–3 THz band is located in the far-infrared (IR) frequency band. Although the 300 GHz–3 THz band is part of the broadband, it lies at the boundary of the broadband and immediately following the RF band. Therefore, the 300 GHz–3 THz band exhibits similarities to RF.

[0057] FIG. 1 illustrates the configuration of wireless devices that perform wireless communication in a millimeter wave band or a terahertz band according to the present specification. Referring to FIG. 1, a first wireless device (100) and a second wireless device (200) can transmit and receive wireless signals through various wireless access technologies (e.g., LTE, NR).

[0058] The first wireless device (100) includes one or more processors (102) and one or more memories (104), and may additionally include one or more transceivers (106) and / or one or more antennas (108). The processor (102) controls the memory (104) and / or transceivers (106) and may be configured to implement the functions, procedures and / or methods described or proposed above. For example, the processor (102) may process information within the memory (104) to generate a first information / signal and then transmit a wireless signal containing the first information / signal through the transceiver (106). Additionally, the processor (102) may receive a wireless signal containing a second information / signal through the transceiver (106) and then store information obtained from the signal processing of the second information / signal in the memory (104). The memory (104) may be connected to the processor (102) and may store various information related to the operation of the processor (102). For example, the memory (104) may store software code containing instructions for performing some or all of the processes controlled by the processor (102) or for performing the procedures and / or methods described or proposed above. Here, the processor (102) and the memory (104) may be part of a communication modem / circuit / chip designed to implement wireless communication technology (e.g., LTE, NR). The transceiver (106) may be connected to the processor (102) and may transmit and / or receive wireless signals through one or more antennas (108). The transceiver (106) may include a transmitter and / or receiver. The transceiver (106) may be interchangeably used with an RF (Radio Frequency) unit. In this specification, the wireless device may refer to a communication modem / circuit / chip.

[0059] The second wireless device (200) includes one or more processors (202) and one or more memories (204), and may additionally include one or more transceivers (206) and / or one or more antennas (208). The processor (202) controls the memory (204) and / or transceivers (206) and may be configured to implement the functions, procedures and / or methods described or proposed above. For example, the processor (202) may process information within the memory (204) to generate a third information / signal and then transmit a wireless signal containing the third information / signal through the transceiver (206). Additionally, the processor (202) may receive a wireless signal containing a fourth information / signal through the transceiver (206) and then store information obtained from the signal processing of the fourth information / signal in the memory (204). The memory (204) may be connected to the processor (202) and may store various information related to the operation of the processor (202). For example, the memory (204) may store software code containing instructions for performing some or all of the processes controlled by the processor (202) or for performing the procedures and / or methods described / suggested above. Here, the processor (202) and the memory (204) may be part of a communication modem / circuit / chip designed to implement wireless communication technology (e.g., LTE, NR). The transceiver (206) may be connected to the processor (202) and may transmit and / or receive wireless signals through one or more antennas (208). The transceiver (206) may include a transmitter and / or receiver. The transceiver (206) may be interchangeable with an RF unit. In this specification, a wireless device may refer to a communication modem / circuit / chip.

[0060] Hereinafter, hardware elements of the wireless device (100, 200) will be described in more detail. Although not limited thereto, one or more protocol layers may be implemented by one or more processors (102, 202). For example, one or more processors (102, 202) may implement one or more layers (e.g., functional layers such as PHY, MAC, RLC, PDCP, RRC, SDAP). One or more processors (102, 202) may generate one or more Protocol Data Units (PDUs) and / or one or more Service Data Units (SDUs) according to the functions, procedures, proposals and / or methods disclosed in this document. One or more processors (102, 202) may generate messages, control information, data, or information according to the functions, procedures, proposals and / or methods disclosed in this disclosure. One or more processors (102, 202) may generate a signal (e.g., baseband signal) containing a PDU, SDU, message, control information, data, or information according to the functions, procedures, proposals, and / or methods disclosed in this document and provide it to one or more transceivers (106, 206). One or more processors (102, 202) may receive a signal (e.g., baseband signal) from one or more transceivers (106, 206) and may obtain a PDU, SDU, message, control information, data, or information according to the functions, procedures, proposals, and / or methods disclosed in this document.

[0061] One or more processors (102, 202) may be referred to as a controller, microcontroller, microprocessor, or microcomputer. One or more processors (102, 202) may be implemented by hardware, firmware, software, or a combination thereof. For example, one or more Application Specific Integrated Circuits (ASICs), one or more Digital Signal Processors (DSPs), one or more Digital Signal Processing Devices (DSPDs), one or more Programmable Logic Devices (PLDs), or one or more Field Programmable Gate Arrays (FPGAs) may be included in one or more processors (102, 202). The functions, procedures, proposals, and / or methods disclosed in this document may be implemented using firmware or software, and the firmware or software may be implemented to include modules, procedures, functions, etc. Firmware or software configured to perform the functions, procedures, proposals, and / or methods disclosed in this document may be included in one or more processors (102, 202) or stored in one or more memories (104, 204) and driven by one or more processors (102, 202). The functions, procedures, proposals, and / or methods disclosed in this document may be implemented using firmware or software in the form of code, instructions, and / or sets of instructions.

[0062] One or more memories (104, 204) may be connected to one or more processors (102, 202) and may store various forms of data, signals, messages, information, programs, codes, instructions, and / or commands. One or more memories (104, 204) may be composed of ROM, RAM, EPROM, flash memory, hard drive, registers, cache memory, computer read storage media, and / or combinations thereof. One or more memories (104, 204) may be located inside and / or outside of one or more processors (102, 202). Additionally, one or more memories (104, 204) may be connected to one or more processors (102, 202) through various technologies such as wired or wireless connections.

[0063] One or more transceivers (106, 206) may transmit user data, control information, wireless signals / channels, etc., as mentioned in the methods and / or operation flowcharts, etc., of this document to one or more other devices. One or more transceivers (106, 206) may receive user data, control information, wireless signals / channels, etc., as mentioned in the functions, procedures, proposals, methods and / or operation flowcharts, etc., disclosed in this document from one or more other devices. For example, one or more transceivers (106, 206) may be connected to one or more processors (102, 202) and may transmit and receive wireless signals. For example, one or more processors (102, 202) may control one or more transceivers (106, 206) to transmit user data, control information, or wireless signals to one or more other devices. Additionally, one or more processors (102, 202) may control one or more transceivers (106, 206) to receive user data, control information, or wireless signals from one or more other devices. Additionally, one or more transceivers (106, 206) may be connected to one or more antennas (108, 208), and one or more transceivers (106, 206) may be configured to transmit and receive user data, control information, wireless signals / channels, etc., as mentioned in the functions, procedures, proposals, methods, and / or operation flowcharts disclosed in this document through one or more antennas (108, 208). In this document, one or more antennas may be multiple physical antennas or multiple logical antennas (e.g., antenna ports). One or more transceivers (106, 206) can convert the received wireless signal / channel, etc. from an RF band signal to a baseband signal in order to process the received user data, control information, wireless signal / channel, etc. using one or more processors (102, 202).One or more transceivers (106, 206) can convert user data, control information, wireless signals / channels, etc. processed using one or more processors (102, 202) from baseband signals to RF band signals. To this end, one or more transceivers (106, 206) may include (analog) oscillators and / or filters.

[0064] In this regard, 6G wireless communication services are not limited to electronic devices such as mobile terminals or video display devices. 6G wireless communication services can be applied to fully autonomous vehicles, artificial intelligence (AI) robots, and electronic devices supporting augmented / virtual reality (AR / VR)-based metaverses.

[0065] Meanwhile, an antenna module including an array antenna in the millimeter wave band or terahertz band according to the present specification is described. In this regard, FIG. 2 shows an antenna module composed of a signal transmission device including a plurality of Rotman lenses and an array antenna according to the present specification. FIG. 3 is an enlarged view of the first Rotman lens and the first output line of the signal transmission device of FIG. 2.

[0066] Referring to FIGS. 2 and 3, the signal transmission device (1000) may be configured to include a first input line (1210), a first output line (1220), and a first Rotman lens (1230). The first input line (1210) may include a first port (P1) to a fifth port (P5) connected to one side of the Rotman lens (1230). The first output line (1220) may include first to eighth ports (Po1 to Po8) connected to the other side of the Rotman lens (1230). The first to eighth ports (Po1 to Po8) of the first output line (1220) may be connected to each antenna element (PA1 to PA8) of the array antenna (1000a).

[0067] Beamforming of an array antenna connected to the first to eighth ports (Po1 to Po8) of the first output line (1220) can be performed by applying a signal to one of the first port (P1) to the fifth port (P5) of the first input line (1210). When a signal is applied to the first port (P1), the beam of the array antenna can be steered by 2α. When a signal is applied to the second port (P2), the beam of the array antenna can be steered by α. When a signal is applied to the third port (P3), the beam of the array antenna can be steered by 0 degrees. When a signal is applied to the fourth port (P4), the beam of the array antenna can be steered by -α. When a signal is applied to the fifth port (P5), the beam of the array antenna can be steered by -2α. For example, when signals are applied in the order of the first port (P1) to the fifth port (P5), the beam of the array antenna can be steered by 25 degrees, 12.5 degrees, 0 degrees, -12.5 degrees, and 25 degrees.

[0068] A first input line (1210) comprising a first port (P1) through a fifth port (P5) forms beam ports for selecting beams of an array antenna. A first Rotman lens (1230) disposed between the first input line (1210) and the first output line (1220) is connected to the first input line (1210) and the first output line (1220). The first Rotman lens (1230) may be implemented as a conductive plate on a substrate.

[0069] The signal transmission device (1000) may be configured to include a plurality of dummy ports that eliminate diffuse reflection between signals transmitted through the first Rotman lens (1230). The upper and lower regions of the first Rotman lens (1230) may be implemented with dummy ports.

[0070] A first output line (1220) comprising a first port (Po1) to an eighth port (Po8) of a first output line (1220) forms array ports. Signals having different phases between the first port (Po1) to the eighth port (Po8) of the first output line (1220) can be connected to each antenna element of an array antenna. The signals applied to the first port (Po1) to the eighth port (Po8) are A0ej φ0 to A7ej φ7 It can be expressed as such. A0 to A7, which are the magnitudes of the signals applied to the first port (Po1) to the eighth port (Po8), can be configured to have the same value. Depending on which of the first port (P1) to the fifth port (P5) of the first input line (1210) a signal is applied to, the phases of the signals applied to the first port (Po1) to the eighth port (Po8), φ0 to φ7, can be determined.

[0071] When a signal is applied to the first port (P1), there is a phase difference of 2△φ between adjacent ports of the first output line (1220). When a signal is applied to the second port (P2), there is a phase difference of △φ between adjacent ports of the first output line (1220). When a signal is applied to the third port (P3), there is the same phase value with a phase difference of 0 degrees between adjacent ports of the first output line (1220). When a signal is applied to the fourth port (P4), there is a phase difference of -△φ between adjacent ports of the first output line (1220). When a signal is applied to the fifth port (P5), there is a phase difference of -2△φ between adjacent ports of the first output line (1220).

[0072] The beam steering angle (θ) of the array antenna (1000a) can be determined according to the phase difference (△φ) between adjacent ports of the first output line (1220) as in Equation 1. The beam steering angle (θ) can be determined according to the wavelength (λ) corresponding to the operating frequency, the spacing (d) between adjacent antenna elements of the array antenna (1000a), and the phase difference (△φ).

[0073]

[0074] Hereinafter, an antenna module operating as a dual-polarized antenna in the 6G frequency band according to the present specification will be described. In this regard, FIG. 4 shows a cross-sectional view of an antenna module operating as a dual-polarized antenna in the 6G frequency band according to the present specification. FIG. 5 shows a front view of the antenna module of FIG. 4. FIG. 6 is an enlarged view of the slot area of ​​the parasitic patch element of FIG. 4.

[0075] Referring to FIGS. 4 to 6, an antenna module operating as a dual-polarization antenna in a 6G frequency band according to the present specification is described. The antenna module (1000) may be configured to include a plurality of dielectric layers, a first patch element (1110), a second patch element (1120), a parasitic patch element (1130), a first signal line (SL1), and a second signal line (SL2). The first patch element (1110), the second patch element (1120), and the parasitic patch element (1130) constitute an antenna element (1100) of a dual-polarization antenna. The antenna element (1100) or radiator may be configured to include the first patch element (1110), the second patch element (1120), and the parasitic patch element (1130). A plurality of dielectric layers may be configured to include a first dielectric layer (1010), a second dielectric layer (1020), a third dielectric layer (1030), and a fourth dielectric layer (1040).

[0076] The antenna module (1000) may be configured to further include a first signal via (V1), a second signal via (V2), and ground vias (GV). The ground vias (GV) may be connected to a parasitic patch element (1130) at two or more points among a first point (P1), a second point (P2) in one axis direction, and a third point (P3) and a fourth point (P4) in another axis direction. The one axis direction may be the Y-axis direction, and the other axis direction may be the X-axis direction orthogonal to the Y-axis direction, which is the one axis direction.

[0077] The ground vias (GV) may be configured to include a first ground via (GV1) and a second ground via (GV2) in one axis direction. The ground vias (GV) may be configured to further include a third ground via (GV3) in the other axis direction. The ground vias (GV) may be configured to further include a fourth ground via (GV4).

[0078] A ground layer (GL) may be formed on the rear surface, which is the second surface of the first dielectric layer (1010). A first signal line (SL1) and a second signal line (SL2) may be disposed on the front surface, which is the first surface of the first dielectric layer (1010). The first signal line (SL1) may be disposed in a uniaxial direction in the first region of the front surface of the first dielectric layer (1010). The second signal line (SL2) may be disposed in a uniaxial direction in the second region of the front surface of the first dielectric layer (1010). The first region and the second region of the front surface of the first dielectric layer (1010) correspond to an upper region and a lower region, respectively, with respect to the center of the uniaxial direction. The first signal line (SL1) and the second signal line (SL2) may be disposed in the first region (upper region) and the second region (lower region), respectively, with respect to the center of the antenna element (1100). One end (EP2) of the second signal line (SL2) can be formed spaced apart from one end (EP1) of the first signal line (SL1).

[0079] A second dielectric layer (1020) may be laminated and disposed on a first dielectric layer (1010) in which a first signal line (SL1) and a second signal line (SL2) are formed. A first signal via (V1) may be formed to vertically connect one end (EP1) of the first signal line (SL1) and a first metal pad (MP1) of the second dielectric layer (1020). A second signal via (V2) may be formed to vertically connect one end (EP2) of the second signal line (SL2) and a second metal pad (MP2) of the second dielectric layer (1020).

[0080] A third dielectric layer (1030) may be laminated and disposed on a second dielectric layer (1020) in which a first metal pad (MP1) and a second metal pad (MP2) are formed. A first patch element (1110) may be disposed on the front surface of the third dielectric layer (1030). A second patch element (1120) may be disposed on the front surface of the fourth dielectric layer (1040). A parasitic patch element (1130) may be formed to surround the second patch element (1120). A parasitic patch element (1130) may be formed on the front surface of the fourth dielectric layer (1040) to surround the second patch element (1120). The second patch element (1120) may be laminated in the upper region in the Z-axis direction of the first patch element (1110). The parasitic patch element (1130) can be stacked in the upper region in the Z-axis direction of the first patch element (1110). The second patch element (1120) and the parasitic patch element (1130) can be placed on the same plane. The second patch element (1120) and the parasitic patch element (1130) can be placed on the front surface of the fourth dielectric layer (1040).

[0081] Ground vias (GV) may be formed to vertically connect the parasitic patch element (1130) and the ground layer (GL). The ground vias (GV) may be configured to include a first ground via (GV1) and a second ground via (GV2) in one axial direction. The ground vias (GV) may be configured to further include a third ground via (GV3) in the other axial direction. The ground vias (GV) may be configured to further include a fourth ground via (GV4).

[0082] A first ground via (GV1) may be formed to vertically connect a first point (P1) and a first point of the ground layer (GL) in one axial direction of the parasitic patch element (1130). A second ground via (GV2) may be formed to vertically connect a second point (P2) and a second point of the ground layer (GL) in one axial direction of the parasitic patch element (1130). The first ground via (GV1) and the second ground via (GV2) may be positioned at equal distances in one axial direction with respect to the center point of the slot region (SR) inside the parasitic patch element (1130).

[0083] The first ground via (GV1) may be positioned at a distance from the first signal via (SV1). The second ground via (GV2) may be positioned at the same distance from the second signal via (SV2). Accordingly, the first ground via (GV1) and the second ground via (GV2) may be positioned at the first point (P1) and the second point (P2), respectively, to prevent interference between the first signal via (SV1) and the second signal via (SV2) by the first signal and the second signal via (SV2). To maintain the level of interference between the first signal and the second signal below a first threshold, the ground vias (GV) may be configured to include the first ground via (GV1) and the second ground via (GV2).

[0084] Meanwhile, a third ground via (GV3) may be placed in the area between the first signal via (SV1) and the second signal via (SV2) to prevent interference caused by the first signal and the second signal of the first signal via (SV1) and the second signal via (SV2). As the third ground via (GV3) is placed, the level of interference caused by the first signal and the second signal of the first signal via (SV1) and the second signal via (SV2) may be further reduced.

[0085] The third ground via (GV3) may be formed to vertically connect the third point (P3) and the third point of the ground layer (GL) in the other axis direction of the parasitic patch element (1130). One axis direction may be the Y-axis direction, and the other axis direction may be the X-axis direction orthogonal to the Y-axis direction, which is the one axis direction. The third ground via (GV3) may be positioned at a distance from the first signal via (SV1). The third ground via (GV3) may be positioned at the same distance from the second signal via (SV2). The third ground via (GV3) may be positioned at the third point (P3) in the other axis direction, at the same distance from the first signal via (SV1) and the second signal via (SV2). To maintain the interference level between the first signal and the second signal below a second threshold, the ground vias (GV) may be configured to include a first ground via (GV1), a second ground via (GV2), and a third ground via (GV3). The second threshold for the interference level between the first signal and the second signal may be set lower than the first threshold.

[0086] Meanwhile, for the symmetry of the radiation pattern of the antenna module, the ground vias (GV) need to be formed in a symmetrical structure in one axis direction and the other axis direction. For the symmetry of the radiation pattern, the ground vias (GV) may be configured to include a first ground via (GV1), a second ground via (GV2), a third ground via (GV3), and a fourth ground via (GV4). The fourth ground via (GV4) may be formed to vertically connect a fourth point (P4) and a fourth point of the ground layer (GL) in the other axis direction of the parasitic patch element (1130). The third ground via (GV3) and the fourth ground via (GV4) may be placed at the same distance in the other axis direction with respect to the center point of the slot region (SR) inside the parasitic patch element (1130).

[0087] Ground vias (GV) can be connected to a parasitic patch element (1130) at two or more points among a first point (P1), a second point (P2) in one axis direction, a third point (P3), and a fourth point (P4) in another axis direction. The one axis direction is the Y-axis direction, and the other axis direction may be the X-axis direction orthogonal to the Y-axis direction, which is the one axis direction.

[0088] The first patch element (1110) and the second patch element (1120) may be formed in the same direction. The first patch element (1110) may be configured to include a first sub-pattern (1111) and a second sub-pattern (1112). The second patch element (1120) may be configured to include a third sub-pattern (1131) and a fourth sub-pattern (1122).

[0089] The first sub-pattern (1111) may be formed with a first length (L1) in a first direction. The second sub-pattern (1112) may be formed with a first length (L1) in a second direction orthogonal to the first direction. The third sub-pattern (1121) may be formed with a second length (L2) in a first direction. The fourth sub-pattern (1122) may be formed with a second length (L2) in a second direction orthogonal to the first direction. The second length (L2) of the third and fourth sub-patterns (1121, 1122) constituting the second patch element (1120) may be formed shorter than the first length (L1) of the first and second sub-patterns (1111, 1112) constituting the first patch element (1110).

[0090] The first signal line (SL1) and the second signal line (SL2) may be formed in the Y-axis direction. The shape of one end (EP1) of the first signal line (SL1) may be formed in a circular shape corresponding to the shape of the first metal pad (MP1). The shape of one end (EP2) of the second signal line (SL2) may be formed in a circular shape corresponding to the shape of the second metal pad (MP2).

[0091] The first sub-pattern (1111) can be arranged in a first direction at 45 degrees relative to the X-axis. The second sub-pattern (1112) can be arranged in a second direction at -45 degrees relative to the X-axis. The third sub-pattern (1121) can be arranged in a first direction at 45 degrees relative to the X-axis. The fourth sub-pattern (1122) can be arranged in a second direction at -45 degrees relative to the X-axis.

[0092] The first sub-pattern (1111) and the third sub-pattern (1121) may be formed in the same direction. The first sub-pattern (1111) and the third sub-pattern (1121) may be formed in a second direction with a first width (W1). The second sub-pattern (1112) and the fourth sub-pattern (1122) may be formed in the same direction. The second sub-pattern (1112) and the fourth sub-pattern (1122) may be formed in a first direction orthogonal to the second direction with a second width (W2). The first width (W1) of the first sub-pattern (1111) and the third sub-pattern (1121) and the second width (W2) of the second sub-pattern (1112) and the fourth sub-pattern (1122) may be formed with the same width.

[0093] The antenna performance can be optimized by adding each component of the antenna module operating as a dual-polarized antenna according to the present specification. In this regard, FIG. 7 shows a front view and antenna performance of an antenna module including first and second patch elements. FIG. 8 shows a front view and antenna performance of an antenna module including first and second patch elements of a rectangular shape. FIG. 9 shows a front view and antenna performance of an antenna module including first and second patch elements and a parasitic patch element of a polygonal or circular shape. FIG. 10 shows a front view and antenna performance of an antenna module including first and second patch elements, a parasitic patch element, and ground vias.

[0094] FIG. 7(a) shows a front view of an antenna module including first and second patch elements. FIG. 7(b) shows the reflection coefficient and isolation characteristics of the antenna module including first and second patch elements. FIG. 7(c) shows the directivity and gain characteristics of the antenna module including first and second patch elements.

[0095] Referring to FIG. 7(a), the first signal via (SV1) and the second signal via (SV2) can be connected to the first sub-pattern (1111) and the second sub-pattern (1112) of the first patch element (1110), respectively. The current induced in the first sub-pattern (1111) and the second sub-pattern (1112) of the first patch element (1110) can be coupled and transmitted to the third sub-pattern (11121) and the fourth sub-pattern (1122) of the second patch element (1120), respectively. The polarization direction can be maintained in the diagonal direction of the first sub-pattern (1111) and the second sub-pattern (1112) and in the diagonal direction of the third sub-pattern (1121) and the fourth sub-pattern (1122).

[0096] Referring to FIG. 7(b), the reflection coefficients (S11, S22) of the antennas in the first and second signal lines (SL1, SL2) have a value of -10 dB or less from 145 GHz to 170 GHz. However, the isolation (S21) between the dual-polarized antennas in the first and second signal lines (SL1, SL2) has a value of -10 dB or more from 145 GHz to 170 GHz, so interference between the dual-polarized antennas may occur. Referring to FIG. 7(c), the directivity (Dir_a) of the antenna module has a value of 6.8 dBi or more from 150 GHz to 175 GHz. The gain (Ga_a) of the antenna module has a value of 5.6 dBi or more from 150 GHz to 175 GHz.

[0097] Meanwhile, the shapes of the first and second patch elements in FIG. 7(a) can be varied depending on the application. In this regard, FIG. 8(a) shows a front view of an antenna module having first and second patch elements of a rectangular shape. FIG. 8(b) shows the reflection coefficient and isolation characteristics of an antenna module having first and second patch elements of a rectangular shape. FIG. 8(c) shows the directivity and gain characteristics of an antenna module having first and second patch elements of a rectangular shape.

[0098] Referring to FIG. 8(a), a first signal via (SV1) and a second signal via (SV2) can be connected to a first metal pad (MP1) and a second metal pad (MP2), respectively. Current induced in the first metal pad (MP1) and the second metal pad (MP2) can be coupled and transmitted to the first and second square-shaped patch elements (1110a, 1120a). In this regard, the basic design parameters and resonance lengths of the first and second square-shaped patch elements (1110a, 1120a) can be selected to optimize the overall antenna performance. The length (L1b) of the larger patch element among the first and second patch elements (1110a, 1120a) can be formed within a predetermined range based on a half wavelength (λg / 2) which is half the wavelength corresponding to the center frequency. The reflection coefficient, isolation, and radiation characteristics of the antenna module having first and second patch elements (1110a, 1120a) of a rectangular shape are similar to the characteristics of the antenna module having first and second patch elements (1110, 1120) of FIG. 7.

[0099] Referring to FIG. 8(b), the reflection coefficients (S11, S22) of the antennas in the first and second signal lines (SL1, SL2) have a value of -10dB or less from 147GHz to 175GHz. However, the isolation (S21) between the dual-polarized antennas in the first and second signal lines (SL1, SL2) has a value of -10dB or more from 145GHz to 172GHz, so interference between the dual-polarized antennas may occur. Referring to FIG. 8(c), the directivity (Dir_b) of the antenna module has a value of 6.7dBi or more from 150GHz to 175GHz. The gain (Ga_b) of the antenna module has a value of 5.0dBi or more from 150GHz to 152GHz, so the antenna gain has a somewhat low value.

[0100] Referring to FIGS. 7 and 8, first and second signal lines (SL1, SL2) capable of inducing surface current vectors orthogonal in the diagonal direction are applied so that current can be induced in the first and second sub-patterns (1111, 1121). Additionally, a dual-polarized antenna may be implemented having a second patch element (1120) stacked on a first patch element (1110) to expand bandwidth. Meanwhile, since antennas operating in a very high frequency band of 100 GHz or higher are physically very small and the distance between the feed lines of the first and second signal lines is also close, a design is required to improve isolation between ports.

[0101] Meanwhile, referring to FIG. 9(a), the parasitic patch element (1130) may be formed in a polygonal or circular shape. The parasitic patch element (1130) may be formed in a polygonal or circular shape of at least an octagon, but is not limited thereto. The parasitic patch element (1130) may also be formed in a polygonal or circular shape of at least a hexagon. FIG. 9(a) shows a front view of an antenna module including first and second patch elements and a parasitic patch element with an outer boundary of a polygonal or circular shape. FIG. 9(b) shows the reflection coefficient and isolation characteristics of an antenna module including first and second patch elements and a parasitic patch element with an outer boundary of a polygonal or circular shape. FIG. 9(c) shows the directivity and gain characteristics of an antenna module including first and second patch elements and a parasitic patch element with an outer boundary of a polygonal or circular shape.

[0102] Referring to FIG. 9(a), the first signal via (SV1) and the second signal via (SV2) can be connected to the first sub-pattern (1111) and the second sub-pattern (1112) of the first patch element (1110), respectively. The current induced in the first sub-pattern (1111) and the second sub-pattern (1112) of the first patch element (1110) can be coupled and transmitted to the third sub-pattern (11121) and the fourth sub-pattern (1122) of the second patch element (1120) and to the parasitic patch element (1130), the outer boundary of which is polygonal or circular in shape.

[0103] Referring to FIG. 9(b), the reflection coefficients (S11, S22) of the antennas in the first and second signal lines (SL1, SL2) have a value of -10dB or less from 147GHz to 167GHz. Meanwhile, the resonance characteristics of the reflection coefficients (S11, S22) of the antennas are improved to -25dB or less at 153GHz. However, the isolation (S21) between the dual-polarized antennas in the first and second signal lines (SL1, SL2) has a value of -10dB or more from 145GHz to 167GHz, so interference between the dual-polarized antennas may occur. Referring to FIG. 9(c), the directivity (Dir_c) of the antenna module has a value of 6.4dBi or more from 150GHz to 175GHz. Meanwhile, the directivity characteristics of the antenna module are improved to a maximum of 8.4dBi at 168GHz. However, the gain (Ga_c) of the antenna module has a value of 5.2 dBi or higher at 150 GHz to 175 GHz, so the antenna gain has a somewhat low value.

[0104] Referring to FIG. 9, when the first and second patch elements (1110, 1120) are combined with the ring-shaped parasitic patch element (1130), a strong induced current is generated. However, a current path is formed along the inner and outer boundaries of the ring-shaped parasitic patch element (1130). Therefore, since the ring-shaped parasitic patch element (1130) has a resonance length of about 1λg, it has a peak current value near the feed line of the first and second signal lines (SL1, SL2). Accordingly, the radiation efficiency of the antenna is reduced, and the isolation between ports may be reduced.

[0105] Meanwhile, referring to FIG. 10(a), first to fourth ground vias (GV1 to GV4) may be added to the antenna module. FIG. 10(a) shows a front view of an antenna module including first and second patch elements, parasitic patch elements, and first to fourth ground vias (GV1 to GV4). FIG. 10(b) shows the reflection coefficient and isolation characteristics of an antenna module including first and second patch elements, parasitic patch elements, and first to fourth ground vias. FIG. 10(c) shows the directivity and gain characteristics of an antenna module including first and second patch elements, parasitic patch elements, and first to fourth ground vias.

[0106] Referring to FIG. 10(a), a first signal via (SV1) and a second signal via (SV2) can be connected to a first sub-pattern (1111) and a second sub-pattern (1112) of a first patch element (1110), respectively. Current induced in the first sub-pattern (1111) and the second sub-pattern (1112) of the first patch element (1110) can be coupled to a third sub-pattern (11121) and a fourth sub-pattern (1122) of the second patch element (1120). Current induced in the third sub-pattern (11121) and the fourth sub-pattern (1122) of the second patch element (1120) can be coupled and transmitted to a parasitic patch element (1130) having an outer boundary that is polygonal or circular in shape, respectively.

[0107] In this regard, ground vias may be positioned close to the peak distribution points of the current induced in the ring-shaped parasitic patch element (1130). To this end, first to fourth ground vias (GV1 to GV4) may be positioned so that the current formed in the parasitic patch element (1130) can leak into the ground layer. In this regard, since the peak value of the induced current is formed at two points, two or more ground vias must be positioned. However, four first to fourth ground vias (GV1 to GV4) may be positioned at equal angles, taking into account physical interference with the feed lines of the first and second signal lines (SL1, SL2) and the symmetry of the radiation pattern.

[0108] Referring to FIG. 10(b), the reflection coefficients (S11, S22) of the antennas in the first and second signal lines (SL1, SL2) have a value of -10dB or less from 152GHz up to 168GHz. Meanwhile, the reflection coefficients (S11, S22) of the antennas have resonance characteristics improved to approximately -30dB at 150GHz. The isolation (S21) between the dual-polarized antennas in the first and second signal lines (SL1, SL2) has a value of -10dB or less at frequencies above 147GHz, so the isolation characteristics can be maintained above a certain level. Referring to FIG. 10(c), the directivity (Dir_d) of the antenna module is improved to 7.6dBi or more from 150GHz to 175GHz. The gain (Ga_d) of the antenna module is improved to a value of 7.2dBi or more at frequencies above 150GHz.

[0109] Meanwhile, the parasitic patch element (1130) may include a slot region (SR) formed to accommodate a first patch element (1110) and a second patch element (1120) inside. The parasitic patch element (1130) may be formed in a polygonal or circular shape greater than a hexagon in which the slot region (SR) is formed inside. The slot region (SR) may be formed with a third length (L3) that is longer than a first length (L1) in the first direction and the second direction.

[0110] The slot area (SR) may be configured to include a first sub-area (SR1) and a second sub-area (SR2). The first sub-area (SR1) may be formed with a third length (L3) in the first direction and a third width (W3) in the second direction. The second sub-area (SR2) may be formed with a third length (L3) in the first direction and a third width (W3) in the second direction. The first sub-area (SR1) and the second sub-area (SR2) may be formed to overlap each other at the center.

[0111] Meanwhile, the ends of the first sub-pattern (1111) and the ends of the third sub-pattern (1121) may be formed into semicircles having a diameter equal to the first width (W1). The ends of the second sub-pattern (1112) and the ends of the fourth sub-pattern (1122) may be formed into semicircles having a diameter equal to the second width (W2).

[0112] The shape of the first sub-region (SR1) of the slot area (SR) can be formed to correspond to the shape of the first sub-pattern (1111) and the shape of the third sub-pattern (1121). The shape of the second sub-region (SR2) of the slot area (SR) can be formed to correspond to the shape of the third sub-pattern (1121) and the shape of the fourth sub-pattern (1122).

[0113] The ends of the first sub-region (SR1) of the slot region (SR) may be formed of semicircles having a diameter equal to the third width (W3). The ends of the second sub-region (SR2) of the slot region (SR) may be formed of semicircles having a diameter equal to the third width (W3). The shape of the first sub-region (SR1) of the slot region (SR) may be formed as a first oval shape in which a circle having a diameter of the third width (W3) is moved by a third length (L3) in the first direction. The shape of the second sub-region (SR2) of the slot region (SR) may be formed as a second oval shape in which a circle having a diameter of the third width (W3) is moved by a third length (L3) in the first direction.

[0114] Meanwhile, in the antenna module according to the present specification, antenna performance may be changed depending on the number of ground vias (GV). In this regard, FIGS. 11 to 15 show the current distribution and antenna characteristics according to the number of vias.

[0115] FIG. 11(a) shows the current distribution of an antenna module with first and second ground vias (GV1, GV2) arranged in the Y-axis direction. FIG. 11(b) shows the reflection coefficient (S11) at the first signal line (SL1), the reflection coefficient (S22) at the second signal line (SL2), and the isolation (S21) in the antenna module of FIG. 11(a). FIG. 11(c) shows the directivity (Dir1) and gain (Ga1) characteristics of the antenna module of FIG. 11(a).

[0116] FIG. 12(a) shows the current distribution of an antenna module with third and fourth ground vias (GV3, GV4) arranged in the X-axis direction. FIG. 12(b) shows the reflection coefficient (S11) at the first signal line (SL1), the reflection coefficient (S22) at the second signal line (SL2), and the isolation (S21) in the antenna module of FIG. 12(a). FIG. 12(c) shows the directivity (Dir2) and gain (Ga2) characteristics of the antenna module of FIG. 12(a).

[0117] FIG. 13(a) shows the current distribution of an antenna module in which first and second ground vias (GV1, GV2) are arranged in the Y-axis direction and a third ground via (GV3) is arranged in the X-axis direction. FIG. 13(b) shows the reflection coefficient (S11) at the first signal line (SL1), the reflection coefficient (S22) at the second signal line (SL2), and the isolation (S21) in the antenna module of FIG. 13(a). FIG. 13(c) shows the directivity (Dir3) and gain (Ga3) characteristics of the antenna module of FIG. 13(a).

[0118] FIG. 14(a) shows the current distribution of an antenna module in which first and second ground vias (GV1, GV2) are arranged in the Y-axis direction and third and fourth ground vias (GV3, GV4) are arranged in the X-axis direction. FIG. 14(b) shows the reflection coefficient (S11) at the first signal line (SL1), the reflection coefficient (S22) at the second signal line (SL2), and the isolation (S21) in the antenna module of FIG. 14(a). FIG. 14(c) shows the directivity (Dir4) and gain (Ga4) characteristics of the antenna module of FIG. 14(a).

[0119] Referring to FIG. 11, an antenna module equipped with first and second ground vias (GV1, GV2) in the Y-axis direction has a reflection coefficient (S11, S22) characteristic of -10dB or less from 150GHz up to 162GHz. Meanwhile, at frequencies below 152GHz, the isolation (S21) has a value of -10dB or more, and the isolation characteristic is degraded. As the third and fourth ground vias (GV3, GV4) are arranged only in the Y-axis direction, the isolation (S21) may be degraded by current components in the X-axis direction. The gain (Ga1) of the antenna module has a value of 5.9dBi or more at frequencies above 150GHz, and the maximum value of the gain (Ga1) has a value of 6.8dBi.

[0120] Referring to FIG. 12, an antenna module equipped with third and fourth ground vias (GV3, GV4) in the X-axis direction has a reflection coefficient (S11, S22) characteristic of -10dB or less from 150GHz to 168GHz. Meanwhile, at frequencies below 165GHz, the isolation (S21) has a value of -10dB or more, so the isolation characteristic is somewhat degraded. As the first and second ground vias (GV1, GV2) are arranged only in the X-axis direction, the isolation (S21) may be somewhat degraded by current components in the Y-axis direction. However, since the isolation (S21) of -9dB to -10dB is maintained in the frequency band from 145GHz to 165GHz, the interference between dual polarizations is maintained below a certain level, so it can operate as a dual polarization antenna. The gain (Ga2) of the antenna module has a value of 6.4 dBi or higher at a frequency of 150 GHz or higher, and the maximum value of the gain (Ga2) is 7.6 dBi.

[0121] Referring to FIG. 13, an antenna module equipped with first and second ground vias (GV1, GV2) in the Y-axis direction and a third ground via (GV3) in the X-axis direction has reflection coefficient (S11, S22) characteristics of -10dB or less from 152GHz up to 168GHz. Meanwhile, at frequencies above 147GHz, the isolation (S21) has a value of -10dB or less, allowing the isolation characteristics to be maintained above a certain level. By providing third and fourth ground vias (GV3, GV4) in the Y-axis direction and a second ground via (GV2) in the X-axis direction, the degradation of the isolation (S21) caused by current components in orthogonal directions can be prevented. The gain (Ga3) of the antenna module has a value of 6.0dBi or more at frequencies above 150GHz, and the maximum value of the gain (Ga3) has a value of 8.0dBi.

[0122] Referring to FIG. 14, an antenna module equipped with first and second ground vias (GV1, GV2) in the Y-axis direction and third and fourth ground vias (GV3, GV4) in the X-axis direction has a reflection coefficient (S11, S22) characteristic of -10dB or less from 150GHz up to 172GHz. Meanwhile, at frequencies above 145GHz, the isolation (S21) has a value of -12dB or less, so the isolation characteristic can be maintained above a certain level. By providing first and second ground vias (GV1, GV2) in the X-axis direction and third and fourth ground vias (GV3, GV4) in the X-axis direction, a decrease in isolation (S21) caused by current components in orthogonal directions can be prevented. The gain (Ga4) of the antenna module has a value of 6.8dBi or more at frequencies above 150GHz, and the maximum value of the gain (Ga4) has a value of 8.3dBi.

[0123] Therefore, an antenna module with two or more ground vias arranged in a single axis direction can maintain an isolation value of approximately -10 dB, thereby suppressing interference between dual polarizations. Meanwhile, as the number of ground vias increases, the gain value of the antenna module increases. However, if the number of ground vias increases beyond four, the antenna gain may decrease slightly.

[0124] Referring to FIG. 15, the antenna module may include first and second ground vias (GV1, GV2) in the Y-axis direction, third and fourth ground vias (GV3, GV4) in the X-axis direction, and fifth and sixth ground vias (GV5, GV6) in the first and second directions. The fifth ground via (GV5) may be placed between the first ground via (GV1) and the fourth ground via (GV4). The sixth ground via (GV6) may be placed between the second ground via (GV2) and the fourth ground via (GV4).

[0125] An antenna module equipped with first to sixth ground vias (GV1 to GV6) has a reflection coefficient (S11, S22) characteristic of -10dB or less from 150GHz up to 171GHz. Meanwhile, at frequencies above 145GHz, the isolation (S21) has a value of -14dB or less, so the isolation characteristic can be maintained above a certain level. By providing first and second ground vias (GV1, GV2) in the Y-axis direction, third and fourth ground vias (GV3, GV4) in the X-axis direction, and fifth and sixth ground vias (GV5, GV6) in the first and second directions, the degradation of the isolation (S21) caused by current components in almost all directions can be prevented. The gain (Ga5) of the antenna module has a value of 6.6dBi or more at frequencies above 150GHz, and the maximum value of the gain (Ga5) has a value of 7.7dBi. However, due to electrical loss in the ground vias, the gain (Ga5) of the second structure with 6 ground vias is slightly reduced compared to the gain (Ga4) of the first structure with 4 ground vias.

[0126] Referring to FIGS. 4 through 12, one end of the first ground via (GV1) and one end of the second ground via (GV2) may be formed at a first point (P1) and a second point (P2) in the axial direction of the parasitic patch element (1130). The first point (P1) and the second point (P2) of the parasitic patch element may be formed at a first distance in the axial direction from the center of the slot region (SR). One end of the first ground via (GV1) and one end of the second ground via (GV2) may be positioned on either the X-axis or the Y-axis.

[0127] Referring to FIGS. 4 through 14, one end of the third ground via (GV3) may be formed at a third point (P3) in the other axis direction orthogonal to one axis direction of the parasitic patch element (1130). One end of the fourth ground via (GV4) may be formed at a fourth point (P4) in the other axis direction orthogonal to one axis direction of the parasitic patch element (1130). The third point (P3) of the parasitic patch element may be formed at a distance of a second distance in the other axis direction from the center of the slot region (SR). The fourth point (P4) of the parasitic patch element may be formed at a distance of a second distance in the other axis direction from the center of the slot region (SR).

[0128] A second distance in the direction of the other axis from the center of the slot region (SR) can be formed to be equal to the first distance in the direction of the first axis from the center of the slot region (SR). One end of the third ground via (GV3) and one end of the fourth ground via (GV4) can be placed on the other axis among the X-axis and the Y-axis.

[0129] In this regard, ground vias are placed near the peak value of the surface current of the ring-shaped parasitic patch element (1130) to leak the induced current to the ground layer (GL), which is effective for improving the isolation (S21) between the first and second signal lines (SL1, SL2). Meanwhile, as the number of ground vias increases, the isolation (S21) improves, and an increase in antenna gain occurs accordingly. However, if six or more ground vias are placed, the antenna radiation gain tends to decrease somewhat. If six or more ground vias are placed, it can also affect the surface current induced in the first and second patch elements (1110, 1120) and the parasitic patch element (1130) by the ground vias. Therefore, it is necessary to select an appropriate number of ground vias by considering the shape and size of the first and second patch elements (1110, 1120) and the parasitic patch element (1130). Meanwhile, ground vias need to be placed near the surface current peak value of the parasitic patch element (1130).

[0130] Meanwhile, ground vias are spaced apart from the first and second signal vias (SV1, SV2) by a predetermined distance to improve isolation and antenna gain. In this regard, a third ground via (GV3) may be placed between the first signal via (SV1) and the second signal via (SV2). Thus, in a structure in which three ground vias are placed, the three ground vias may be spaced apart adjacently from the first and second signal vias (SV1, SV2).

[0131] The third ground via (GV3) and the first signal via (SV1) may be spaced apart by a third distance. The third ground via (GV3) and the second signal via (SV2) may be spaced apart by a third distance.

[0132] The first ground via (GV1) and the first signal via (SV1) may be spaced apart by a third distance. The second ground via (GV2) and the second signal via (SV2) may be spaced apart by a third distance. The fourth ground via (GV4) and the first signal via (SV1) may be spaced apart by a third distance (D3). The fourth ground via (GV4) and the second signal via (SV2) may be spaced apart by a third distance (D3). The third distance from any one of the second to fourth ground vias (GV2, GV3, GV4) to the first signal via (SV1) or the second signal via (SV2) may be formed to be shorter than the first and second distances from the center of the slot area (SR) to the ground vias.

[0133] Meanwhile, each of the first signal line (SL1) and the second signal line (SL2) may be composed of multiple components for impedance matching and feeding to the first patch element (1110). The first signal line (SL1) may be configured to include a first sub-signal line (SSL1), a second sub-signal line (SSL2), and a first end (EP1). The first sub-signal line (SSL1) may be formed with a first line width (Lw1). The second sub-signal line (SSL2) may be connected to the first sub-signal line (SSL1). The second sub-signal line (SSL2) may be formed with a second line width (Lw2). The second sub-signal line (SSL2) may operate as an impedance converter that matches the impedance of the first sub-signal line (SSL1) with the input impedance of the antenna element connected to the first end (EP1). The second sub-signal line (SSL2) can be formed with a length of 1 / 4 of the wavelength of the center frequency. One end (EP1) can be formed in a circular shape at the end of the second sub-signal line (SSL2) rotated 45 degrees.

[0134] The second signal line (SL2) may be configured to include a third sub-signal line (SSL3), a fourth sub-signal line (SSL4), and a first end (EP2). The third sub-signal line (SSL3) may be formed with a first line width (Lw1). The fourth sub-signal line (SSL4) may be connected to the third sub-signal line (SSL3). The fourth sub-signal line (SSL4) may be formed with a second line width (Lw2). The fourth sub-signal line (SSL4) may operate as an impedance converter that matches the impedance of the third sub-signal line (SSL) with the input impedance of an antenna element connected to the first end (EP2). The fourth sub-signal line (SSL4) may be formed with a length of 1 / 4 of the wavelength of the center frequency. The first end (EP2) may be formed in a circular shape at the end of the fourth sub-signal line (SSL4) rotated in the -45 degree direction.

[0135] Meanwhile, the antenna module (1000) can operate as a dual-polarized antenna in the 6G frequency band. In this regard, when a first signal is applied to a first signal line (SL1), the first sub-pattern (1111) of the first patch element (1110) and the third sub-pattern (1121) of the second patch element (1120) may be formed to radiate a first polarized signal. When a second signal is applied to a second signal line (SL1), the second sub-pattern (1112) of the first patch element (1110) and the fourth sub-pattern (1122) of the second patch element (1120) may be formed to radiate a second polarized signal. In this regard, the second polarized signal radiated when a second signal is applied to a second signal line (SL2) may be orthogonal to the first polarized signal radiated when a first signal is applied to a first signal line (SL1).

[0136] The antenna module (1000) may be configured to radiate a first polarized signal and a second polarized signal orthogonal to the first polarized signal within a predetermined frequency range centered on 160 GHz. Meanwhile, to improve the isolation between the first polarized signal and the second polarized signal, the number of vias may be adjusted, or the spacing between the first and second patch elements (1110, 1120) and the parasitic patch element (1130) may be adjusted. In this regard, FIG. 16 shows a change in antenna characteristics according to the spacing between the first and second patch elements and the parasitic patch element in the antenna module of FIG. 5.

[0137] Referring to FIG. 5 and FIG. 16(a), the spacing (G1, G2) between the second patch element (1120) and the parasitic patch element (1130) can be adjusted. In this regard, the spacing (G1) between the boundary of the third sub-pattern (1121) of the second patch element (1120) and the slot region (SR) can be formed to have a range between 40 µm and 100 µm. The spacing (G2) between the boundary of the fourth sub-pattern (1122) of the second patch element (1120) and the slot region (SR) can be formed to have a range between 40 µm and 100 µm. The spacing (G2) between the boundary of the fourth sub-pattern (1122) of the second patch element (1120) and the slot region (SR) can be formed to have a range between 0.02 wavelength and 0.05 wavelength.

[0138] If the spacing (G1, G2) between the boundaries of the third and fourth sub-patterns (1121, 1122) and the slot region (SR) is in the range of 40 µm to 100 µm, the change in reflection coefficient, isolation, and gain performance is not significant. Therefore, the spacing (G1, G2) between the boundaries can be selected in the range of 40 µm to 100 µm depending on the fabrication process capability.

[0139] Referring to FIG. 4, FIG. 16(a) and FIG. 16(b), if the spacing (G1, G2) to the slot region (SR) has a value between 40 µm and 100 µm, the reflection coefficient (S11) has a value of -10 dB or less at 145 GHz to 167 GHz. If the spacing (G1, G2) to the slot region (SR) has a value between 40 µm and 100 µm, the isolation (S21) has a value of -13 dB or less at frequencies above 145 GHz. Referring to FIG. 5, FIG. 16(a) and FIG. 16(c), if the spacing (G1, G2) to the slot region (SR) has a value between 40 µm and 100 µm, the antenna gain has a value of 7 dBi or more at frequencies above 150 GHz.

[0140] As described above, the antenna module (1000) can operate as a dual-polarized antenna in the 6G frequency band. In this regard, the resonant frequency and gain characteristics of the antenna module (1000) may be changed according to the size of the parasitic patch element (1130) formed to surround the first and second patch elements (1110, 1120). FIG. 17 shows the change in antenna characteristics according to the length of the parasitic patch element in the antenna module of FIG. 5.

[0141] Referring to FIG. 5 and FIG. 17(a), the lengths (Lx, Ly) on one axis and the other axis of the parasitic patch element (1130) can be adjusted. In this regard, the antenna module (1000) may be configured to radiate a first polarized signal and a second polarized signal orthogonal to the first polarized signal in a predetermined frequency range centered on 160 GHz. The lengths on the X-axis and Y-axis of the parasitic patch element (1130) may be formed to have a range between 0.96 mm and 1.6 mm. The lengths on the X-axis and Y-axis of the parasitic patch element (1130) may be formed to have a range between 0.512 wavelengths and 0.85 wavelengths.

[0142] Referring to FIG. 5, FIG. 17(a) and FIG. 17(b), if the length (Lx, Ly) of the parasitic patch element (1130) has a value between 0.96 mm and 1.6 mm, the reflection coefficient (S11) has a value of -10 dB or less at 145 GHz to 155 GHz. Referring to FIG. 5, FIG. 17(a) and FIG. 17(c), if the length (Lx, Ly) of the parasitic patch element (1130) has a value between 0.96 mm and 1.6 mm, the antenna gain has a value of about 6 dBi or more at a frequency of 150 GHz or higher.

[0143] Therefore, the change in antenna reflection coefficient and gain performance according to the change in length (Lx, Ly) of the parasitic patch element (1130) may show a somewhat large difference. If the length (Lx, Ly) of the parasitic patch element (1130) is greater than 1.6 mm, current is distributed to the surface of the ring-shaped parasitic patch element (1130). Consequently, since surface current cannot be leaked to the ground layer through the ground vias, a change in antenna reflection coefficient and gain performance may occur.

[0144] Accordingly, in order to prevent current from being dispersed to the surface of the ring-shaped parasitic patch element (1130), it is necessary to design the distance from the first to fourth ground vias (GV1 to GV4) to the outside of the parasitic patch element (1130) so as not to exceed a threshold value. In this regard, the length (Lx, Ly) of the parasitic patch element (1130) can be set to be 1.6 mm or less. Meanwhile, the length (Lx, Ly) of the parasitic patch element (1130) can be set to be 0.96 mm or more so that the antenna resonance frequency is within the operating frequency band.

[0145] Meanwhile, the antenna elements (1110) of the antenna module according to the present specification may be spaced apart in one axial direction to form an array antenna. In this regard, FIG. 18 shows an array antenna in which a plurality of antenna elements are arranged in one axial direction according to the present specification. FIG. 19 is an enlarged view of a portion of the array antenna of FIG. 18.

[0146] Referring to FIGS. 2 to 6, FIGS. 18 and FIG. 19, an antenna module (1000) operating as a dual-polarized antenna in the 6G frequency band configured with an array antenna according to the present specification will be described.

[0147] An array antenna (1000a) can be configured by arranging antenna elements (1100) including a first patch element (1110), a second patch element (1120), and a parasitic patch element (1130) spaced apart in one axial direction. The array antenna (1000a) may include 16 antenna elements including a first antenna element (PA1) to a 16th antenna element (PA16) and first to fourth dummy elements (DE1 to DE4). The first dummy element (DE1) and the second dummy element (DE2) may be placed on one side of the first antenna element (PA1). The third dummy element (DE3) and the fourth dummy element (DE4) may be placed on the other side of the 16th antenna element (PA16).

[0148] The directivity of the array antenna in a uniaxial direction can be further increased through the additional structure of the first to fourth dummy elements (DE1 to DE4) to the basic structure of the first to sixth antenna elements (PA1 to PA16). Meanwhile, the number of first signal lines (SL1) and second signal lines (SL2) connected to the first to sixth antenna elements (PA1 to PA16) is each implemented as 16, so that the signal coupling structure can be implemented more easily. Specifically, a signal coupling structure in which 16 lines are combined can be implemented more easily than a signal coupling structure in which 20 lines are combined. Therefore, while improving antenna directivity through the first to fourth dummy elements (DE1 to DE4), the implementation of the signal coupling structure is simplified, thereby reducing feed loss.

[0149] Meanwhile, FIG. 20 compares the reflection coefficient, isolation characteristics, and antenna gain characteristics of the antenna element of FIG. 5 and the array antenna of FIG. 18. FIG. 20(a) compares the reflection coefficient (S11, Snn) and isolation characteristics (S21) of the antenna element of FIG. 5 and the array antenna of FIG. 18. FIG. 20(b) compares the gain (Ga4) of the antenna element of FIG. 5 with the directivity (Dir_ar) and gain (Ga_ar) of the array antenna of FIG. 18. Here, in the reflection coefficient (Snn) of the array antenna, n can be set to n=1 to 1, corresponding to the number of antenna elements.

[0150] Referring to FIGS. 5, FIGS. 18 and FIG. 20(a), the reflection coefficient (S11) of the antenna element (1100) and the reflection coefficient (Snn) of the array antenna (1000a) have a value of -10dB or less in the frequency band of 150GHz to 175GHz. Meanwhile, the isolation (S21) of the array antenna (1000a) has a value of -20dB or less in the frequency band of 150GHz to 175GHz.

[0151] Referring to FIG. 5, FIG. 18 and FIG. 20(b), the gain (Ga4) of the antenna element has a value of 6.8 dBi or higher at a frequency of 150 GHz or higher, and the maximum value of the gain (Ga4) has a value of 8.3 dBi. The directivity (Dir_ar) of the array antenna (1000a) has a value of 18.2 dBi or higher in the frequency band from 150 GHz to 175 GHz, and the maximum value of the directivity (Dir_ar) has a value of 19.8 dBi. The gain (Ga_ar) of the array antenna (1000a) has a value of 17 dBi or higher in the frequency band from 150 GHz to 175 GHz, and the maximum value of the gain (Ga_ar) has a value of 18.6 dBi.

[0152] Meanwhile, an antenna module implemented as an array antenna (1000a) according to the present specification may be configured to include an upper ground via region (GVR1) and a lower ground via region (GVR2). The upper ground via region (GVR1) may include a plurality of ground vias connecting a ground layer (GL) to a first metal region formed in the region between the first signal lines of adjacent antenna elements of the array antenna (1000a). The lower ground via region (GVR2) may include a plurality of ground vias connecting a ground layer (GL) to a second metal region formed in the region between the second signal lines of adjacent antenna elements of the array antenna (1000a).

[0153] Interference between adjacent signal lines between adjacent antenna elements can be minimized through the upper ground via region (GVR1) and the lower ground via region (GVR2). Additionally, interference between an antenna module implemented as an array antenna (1000a) and a polarization-adjustable signal transmission device composed of a Rotman lens can be minimized through the upper ground via region (GVR1) and the lower ground via region (GVR2).

[0154] The technical effects of the dual-polarization operating antenna module according to the present specification have been described above. The technical effects of the dual-polarization operating antenna module according to the present specification are described as follows.

[0155] According to the present specification, an antenna module operating with dual polarization for improved isolation is provided.

[0156] According to the present specification, an antenna module having a multilayer substrate structure that operates with dual polarization for improved isolation without increasing the antenna size is provided.

[0157] According to the present specification, a method for improving isolation between feed lines is proposed using a simple ring-parasitic element and two or more ground vias adjacent to signal vias without deformation or additional structure of the feed line.

[0158] According to the present specification, a method for improving isolation between feed lines is proposed using a simple ring-parasitic element and three or more ground vias adjacent to signal vias without deformation or additional structure of the feed line.

[0159] According to the present specification, an isolation enhancement technique between feed lines using four ground vias adjacent to a ring-parasitic element and signal vias, and an antenna radiation pattern of a symmetric structure can be implemented.

[0160] According to the present specification, an antenna module operating with dual polarization for improved isolation, which enables expansion into an array antenna, is provided by limiting the size of a single antenna to a size less than or equal to a certain size relative to the wavelength.

[0161] Further scopes of the applicability of this specification will become apparent from the following detailed description. However, since various changes and modifications within the spirit and scope of this specification are clearly understood by those skilled in the art, specific embodiments, such as the detailed description and preferred embodiments of this specification, should be understood as being given merely as examples. The detailed description should not be interpreted restrictively in any respect and should be considered exemplary. The scope of this specification shall be determined by a reasonable interpretation of the appended claims, and all modifications within the equivalent scope of this specification are included within the scope of this specification.

Claims

1. In an antenna module operating with dual polarization, A first dielectric layer having a ground layer formed on the back surface; A first signal line arranged in an axial direction in a first region on the front surface of the first dielectric layer; A second signal line disposed in the axial direction in a second region on the front surface of the first dielectric layer - one end of the second signal line is formed spaced apart from one end of the first signal line; A second dielectric layer stacked and disposed on the first dielectric layer in which the first signal line and the second signal line are formed; A first signal via vertically connecting one end of the first signal line and the first metal pad of the second dielectric layer; A second signal via vertically connecting one end of the second signal line and the second metal pad of the second dielectric layer; A third dielectric layer stacked and disposed on the second dielectric layer on which the first metal pad and the second metal pad are formed; A first patch element disposed on the front surface of the third dielectric layer; A fourth dielectric layer stacked and disposed on the third dielectric layer on which the first patch element is formed; A second patch element disposed on the front surface of the fourth dielectric layer; A parasitic patch element formed to surround the second patch element; and It includes ground vias formed to vertically connect the parasitic patch element and the ground layer, and An antenna module in which the ground vias are connected to the parasitic patch element at two or more of the first point and second point in the first axis direction, and the third and fourth points in the other axis direction orthogonal to the first axis direction.

2. In Paragraph 1, The first patch element includes a first sub-pattern formed with a first length in a first direction and a second sub-pattern formed with the first length in a second direction orthogonal to the first direction, and The second patch element includes a third sub-pattern formed with a second length in the first direction and a fourth sub-pattern formed with the second length in the second direction, An antenna module in which the second length is formed to be shorter than the first length.

3. In Paragraph 2, The first signal line and the second signal line are formed in the Y-axis direction, and The shape of one end of the first signal line is formed in a circular shape corresponding to the shape of the first metal pad, and An antenna module in which the shape of one end of the second signal line is formed in a circular shape corresponding to the shape of the second metal pad.

4. In Paragraph 3, The first sub-pattern is arranged in the first direction at a 45-degree angle with respect to the X-axis, and the second sub-pattern is arranged in the second direction at a -45-degree angle with respect to the X-axis, and An antenna module in which the third sub-pattern is arranged in the first direction at a 45-degree angle with respect to the X-axis, and the fourth sub-pattern is arranged in the second direction at a -45-degree angle with respect to the X-axis.

5. In Paragraph 4, The first sub-pattern and the third sub-pattern are formed with a first width in the second direction, and The second sub-pattern and the fourth sub-pattern are formed with a second width in the first direction, and An antenna module in which the first width and the second width are formed identically.

6. In Paragraph 5, The parasitic patch element includes a slot region formed to accommodate the second patch element therein, and The slot region is formed with a third length longer than the first length in the first direction and the second direction, and The above slot area is A first sub-region formed with the third length in the first direction and the third width in the second direction; and It includes a second sub-region formed with the third length in the second direction and the third width in the first direction, An antenna module in which the first sub-region and the second sub-region are formed to overlap each other at the center.

7. In Paragraph 6, The ends of the first sub-pattern and the ends of the third sub-pattern are formed of semicircles having a diameter equal to the first width, and The ends of the second sub-pattern and the ends of the fourth sub-pattern are formed of semicircles having a diameter equal to the second width, and The ends of the first sub-region of the slot region are formed of semicircles having a diameter equal to the third width, and An antenna module in which the ends of the second sub-region of the slot region are formed of semicircles having the same diameter as the third width.

8. In Paragraph 7, The parasitic patch element is formed in a polygonal or circular shape having a slot region formed therein, and The above ground vias are, A first ground via perpendicularly connecting a first point and a first point of the ground layer in the axial direction of the parasitic patch element; and It includes a second ground via that vertically connects a second point and a second point of the ground layer in the direction of the one axis of the parasitic patch element, The first ground via and the second ground via are arranged at equal distances in the one-axis direction with respect to the center point of the slot area, and An antenna module in which the first ground via is positioned at a distance from the first signal via, and the second ground via is positioned at a distance from the second signal via.

9. In Paragraph 8, The above ground vias further include a third ground via that vertically connects a third point of the parasitic patch element on one side of the slot region and a third point of the ground layer in the other axis direction, An antenna module in which the third ground via is positioned apart from the first signal via by the aforementioned separation distance and positioned apart from the second signal via by the aforementioned separation distance.

10. In Paragraph 9, The above ground vias further include a fourth ground via that vertically connects a fourth point of the parasitic patch element on the other side of the slot region and a fourth point of the ground layer in the other axis direction, An antenna module in which the third ground via and the fourth ground via are disposed at equal distances in the other axis direction with respect to the center point of the slot area.

11. In Paragraph 10, One end of the first ground via and one end of the second ground via are formed at the first point and the second point of the parasitic patch element, which are spaced apart by a first distance in an axial direction from the center of the slot region, and One end of the third ground via is formed at the third point of the parasitic patch element, which is spaced by a second distance in the other axis direction from the center of the slot region, and One end of the fourth ground via is formed at the fourth point of the parasitic patch element, which is spaced by a second distance in the other axis direction from the center of the slot region, and An antenna module in which the first distance and the second distance are formed identically.

12. In Paragraph 11, The second ground via is positioned between the first signal via and the second signal via, and The second ground via and the first signal via are separated by a third distance, and The second ground via and the second signal via are separated by the third distance, and The third ground via and the first signal via are separated by the third distance, and the third ground via and the second signal via are separated by the third distance, and The fourth ground via and the first signal via are separated by the third distance, and the fourth ground via and the second signal via are separated by the third distance, and An antenna module in which the third distance is formed to be shorter than the first distance and the second distance.

13. In Paragraph 2, The first signal line comprises a first sub-signal line formed with a first line width, a second sub-signal line formed with a second line width, and a circular end formed at the end of the second sub-signal line rotated in a 45-degree direction. The second signal line includes a third sub-signal line formed with a first line width, a fourth sub-signal line formed with a second line width, and a circular end formed at the end of the fourth sub-signal line rotated in a -45 degree direction. The antenna module, wherein the second sub-signal line and the fourth sub-signal line operate as impedance converters.

14. In Paragraph 13, When a first signal is applied to the first signal line, the first sub-pattern and the third sub-pattern radiate a first polarized signal, and An antenna module in which, when a second signal is applied to the second signal line, the second sub-pattern and the fourth sub-pattern radiate a second polarized signal orthogonal to the first polarized signal.

15. In Paragraph 6, The above antenna module is configured to radiate a first polarized signal and a second polarized signal orthogonal to the first polarized signal within a predetermined frequency range centered at 160 GHz, and An antenna module having a range between 0.02 wavelengths and 0.05 wavelengths for the spacing between the third sub-pattern and the boundary of the slot region and the spacing between the fourth sub-pattern and the boundary of the slot region.

16. In Paragraph 1, The above antenna module is configured to radiate a first polarized signal and a second polarized signal orthogonal to the first polarized signal within a predetermined frequency range centered at 160 GHz, and An antenna module having lengths on the X-axis and Y-axis of the parasitic patch element in the range between 0.512 wavelengths and 0.

85.

17. In Paragraph 1, An array antenna is configured such that antenna elements including the first patch element, the second patch element, and the parasitic patch element are spaced apart in one axial direction. The above array antenna comprises 16 antenna elements including a first antenna element to a 16th antenna element, a first dummy element and a second dummy element disposed on one side of the first antenna element, and a third dummy element and a fourth dummy element disposed on the other side of the 16th antenna element, an antenna module.

18. In Paragraph 17, An upper ground via region comprising a plurality of ground vias connecting the ground layer to first metal regions formed in the region between the first signal lines of adjacent antenna elements of the array antenna; and An antenna module further comprising a lower ground via region including a plurality of ground vias connecting the ground layer to second metal regions formed in the region between the second signal lines of adjacent antenna elements of the array antenna.

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