Cover device comprising light-emitting element

Abstract

A cover device according to one embodiment may comprise: a housing; a printed circuit board arranged in the housing; a coil member which is arranged on the printed circuit board and which receives power wirelessly provided from an electronic device adjacent to the cover device; a plurality of light-emitting elements which operates on the basis of the power received through the coil member and which is arranged along a pattern area of the printed circuit board; a wall member which includes an opening formed along the pattern area and which is arranged on the printed circuit board; a photocatalytic mixture arranged to be filled in the opening; and a transmissive member which is arranged on the wall member and which includes a transmissive area that overlaps the opening. Various other embodiments identified from the specification are also possible.

Description

Cover device including a light-emitting element

[0001] The present disclosure relates to a cover device comprising a light-emitting element.

[0002] A protective cover for protecting an electronic device can wrap around the part of the electronic device excluding the display area. The protective cover can protect the electronic device from external impacts.

[0003] Mobile electronic devices, such as smartphones, can provide various functions including making calls, playing videos, and browsing the internet based on various types of applications. When attaching a protective cover to a mobile electronic device like a smartphone, users can utilize the cover not only to simply protect the device from external impacts but also as a means to express their individuality and style by using a cover with a graphic design applied to a part of it.

[0004] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0005] A cover device according to one embodiment may include a housing, a printed circuit board disposed within the housing, a coil member disposed on the printed circuit board and receiving power wirelessly provided from an electronic device adjacent to the cover device, a plurality of light-emitting elements disposed along a pattern area of ​​the printed circuit board and operating based on the power received through the coil member, a wall member disposed on the printed circuit board and including an opening formed along the pattern area, a photocatalytic mixture disposed by filling within the opening, and a transparent member disposed on the wall member and including a transparent area that overlaps with the opening.

[0006] FIG. 1 is a drawing showing an electronic device and a cover device mounted on the electronic device according to one embodiment.

[0007] FIG. 2 is a drawing for explaining that a transparent member according to one embodiment is placed on a wall member.

[0008] FIG. 3 is a diagram showing a pattern area of ​​a printed circuit board according to one embodiment.

[0009] FIG. 4 is a drawing illustrating the placement of a wall member and a photocatalyst mixture on a printed circuit board according to one embodiment.

[0010] FIG. 5 is an enlarged view of a portion of a wall member according to one embodiment.

[0011] FIG. 6 is a cross-sectional view showing the interior of the opening of a wall member according to one embodiment.

[0012] FIG. 7 is a drawing showing a state in which a cover device according to one embodiment is mounted on an electronic device.

[0013] FIG. 8 is a flowchart of a method for manufacturing a cover device according to one embodiment.

[0014] FIG. 9 is a drawing for illustrating an example in which a cover device including an opening is applied to various parts of an electronic device housing according to various embodiments.

[0015] FIG. 10 is a block diagram of an electronic device in a network environment according to various embodiments.

[0016] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0017] Embodiments of the present disclosure are described below in detail with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present disclosure in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0018] The terms used in this disclosure are described in their current, general form considering the functions mentioned herein; however, they may refer to various other terms depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Accordingly, the terms used in this disclosure should not be interpreted solely by their names, but should be interpreted based on the meaning of the terms and the overall content of this disclosure.

[0019] Additionally, terms such as "first," "second," etc., may be used to describe various components, but the components should not be limited by these terms. These terms are used for the purpose of distinguishing one component from another.

[0020] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "electrically connected" with other components interposed between them. Furthermore, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0021] One embodiment of the present disclosure may be represented by functional block configurations and various processing steps. Some or all of these functional blocks may be implemented by various numbers of hardware and / or software configurations that execute specific functions. For example, the functional blocks of the present disclosure may be implemented by one or more microprocessors or by circuit configurations for a specific function. Additionally, for example, the functional blocks of the present disclosure may be implemented in various programming or scripting languages. The functional blocks may be implemented as algorithms executed on one or more processors. Furthermore, the present disclosure may employ prior art for electronic configuration, signal processing, and / or data processing, etc. Terms such as “mechanism,” “element,” “means,” and “configuration” may be used broadly and are not limited to mechanical and physical configurations.

[0022] Furthermore, the connecting lines or connecting members between the components depicted in the drawings are merely illustrative of functional connections and / or physical or circuit connections. In the actual device, connections between components may be represented by various alternative or added functional connections, physical connections, or circuit connections.

[0023] The present disclosure will be described in detail below with reference to the attached drawings.

[0024] FIG. 1 is a drawing showing an electronic device (1001) and a cover device (10) mounted on the electronic device (1001) according to one embodiment. FIG. 2 is a drawing for explaining that a transparent member (600) according to one embodiment is placed on a wall member (400).

[0025] Referring to FIGS. 1 and 2, a cover device (10) according to one embodiment may be mounted on one side of an electronic device (1001) to cause a plurality of light-emitting elements (205) within the cover device (10) to emit light. A cover device (10) according to one embodiment may include a housing (100), a printed circuit board (200), a coil member (300), a plurality of light-emitting elements (205), a wall member (400), a photocatalytic mixture (500), a transparent member (600), a magnetic material (700), a communication module (800), and a control module (900). For example, the housing (100) of the cover device (10) may be mounted on the housing (1003) of the electronic device (1001). For example, the cover device (10) may be composed of a protective cover mounted on the rear side of the electronic device (1001). For example, a printed circuit board (200) is placed within the housing (100) of the cover device (10). For example, a printed circuit board (200) may be inserted into a portion of the housing (100) that is cut according to the shape of the printed circuit board (200). For example, a control module (900) of the cover device (10) may receive power wirelessly provided from the electronic device (1001) through a coil member (300) and control the light emission of a plurality of light-emitting elements (205) based on the received power. For example, the control module (900) may include a processor, but is not limited thereto. For example, the cover device (10) may be configured to be thin and adjacent to the rear of the electronic device (1001). For example, the thickness of the printed circuit board (200) on which the wall member (400) is placed may be configured to be equal to or thinner than the thickness of the housing (100) of the cover device (10).

[0026] A cover device (10) according to one embodiment may include a pattern area (210) in which a plurality of light-emitting elements (205) are arranged. For example, a plurality of light-emitting elements (205) according to a cover design exposed to the outside may be arranged in the pattern area (210). For example, the plurality of light-emitting elements (205) may be composed of a plurality of LED chips. For example, the pattern area (210) may be formed in an area where a coil member (300), a magnetic body (700), a communication module (800), and a control module (900) are not arranged. For example, a wall member (400) may be arranged or attached to a printed circuit board (200). For example, the wall member (400) may include an opening (410) formed along the pattern area (210) of the printed circuit board (200). For example, when the wall member (400) is placed or attached to the printed circuit board (200), the opening (410) of the wall member (400) may overlap with the pattern area (210). For example, the portion of the wall member (400) excluding the opening (410) may be made of a translucent or opaque material.

[0027] In a cover device (10) according to one embodiment, a photocatalytic mixture (500) may be filled and disposed within the opening (410) of a wall member (400). For example, when the wall member (400) is disposed or attached to a printed circuit board (200), the internal space of the opening (410) may be filled or coated with the photocatalytic mixture (500). For example, when light emitted from a plurality of light-emitting elements (205) is viewed from outside the cover device (10), a hot spot phenomenon (e.g., dot marks) may occur due to the thin thickness of the housing (100), but the photocatalytic mixture (500) can prevent the hot spot phenomenon by increasing the refractive index of the light emitted from the plurality of light-emitting elements (205). For example, the photocatalytic mixture (500) may be composed of a material similar to the internal material of the plurality of light-emitting elements (205). For example, the photocatalytic mixture (500) may include silicon-based photocatalytic powder. For example, the photocatalytic mixture (500) may include silicon dioxide (SiO2), titanium dioxide (TiO2), and a fluorescent material.

[0028] In a cover device (10) according to one embodiment, a transparent member (600) may be placed or attached on a wall member (400). For example, the transparent member (600) may include a transparent area (610) that overlaps with an opening (410) of the wall member (400). For example, the transparent area (610) may overlap with a pattern area (210) of a printed circuit board (200). For example, light emitted from a plurality of light-emitting elements (205) may pass through the transparent member (600) and be emitted outside the cover device (10). For example, when the transparent member (600) is placed or attached on the wall member (400), the transparent area (610) may overlap with an opening (410) of the wall member (400) and a pattern area (210) of the printed circuit board (200). For example, the opening (410) of the wall member (400) may be positioned between the pattern area (210) and the transparent area (610). For example, the transparent area (610) may be configured as a cover design that is exposed to the outside of the cover device (10).

[0029] FIG. 3 is a drawing showing a pattern area (210) of a printed circuit board (200) according to one embodiment.

[0030] Referring to FIG. 3, in a cover device (10) according to one embodiment, a plurality of light-emitting elements (205) may be spaced apart at a predetermined interval on a pattern area (210) of a printed circuit board. For example, the shape of the pattern area (210) and the placement positions of the plurality of light-emitting elements (205) within the pattern area (210) may be determined according to the pattern design of the light emitted through the cover device (10). Additionally, for example, the opening (410) of the wall member (400) may be composed of a plurality of spaced-out openings (410) according to the shape of the pattern area (210) and the placement positions of the plurality of light-emitting elements (204) placed within the pattern area (210).

[0031] FIG. 4 is a drawing for explaining that a wall member (400) and a photocatalytic mixture (500) are placed on a printed circuit board (200) according to one embodiment.

[0032] Referring to FIG. 4, in one embodiment, a printed circuit board (200) may have a wall member (400) disposed on or attached to the printed circuit board (200), and a photocatalytic mixture (500) may be filled or applied to the opening (410) of the wall member (400). For example, after a plurality of light-emitting elements (205) are disposed in a pattern area (210) of the printed circuit board (200), a wall member (400) including an opening (410) may be attached to the printed circuit board (200). A detailed description regarding the opening (410) and the photocatalytic mixture (500) filled or applied to the opening (410) will be described later in FIG. 5 and FIG. 6.

[0033] The left drawing of FIG. 4 is a drawing showing a state in which a plurality of light-emitting elements (205) are arranged along a pattern area (210) of a printed circuit board (200). The middle drawing of FIG. 4 is a drawing showing a state in which a wall member (400) is arranged in the left drawing of FIG. 4. For example, the opening (410) of the wall member (400) attached to the printed circuit board (200) overlaps with the pattern area (210) of the printed circuit board (200), so that a plurality of light-emitting elements (205) arranged in the pattern area (210) can be exposed to the outside. For example, a plurality of light-emitting elements (205) arranged on the printed circuit board (200) are arranged within the opening (410) of the wall member (400) and can emit light through the opening (410). The right drawing of FIG. 4 is a drawing showing a state in which a photocatalytic mixture (500) is filled or applied to the middle drawing of FIG. 4. For example, the photocatalytic mixture (500) may be filled or applied along the opening (410) of the wall member (400). For example, a plurality of light-emitting elements (205) placed within the opening (410) may be surrounded by the photocatalytic mixture (500). For example, the plurality of light-emitting elements (205) surrounded by the photocatalytic mixture (500) may not be exposed to the outside by the photocatalytic mixture (500). For example, after the photocatalytic mixture (500) is filled or applied within the opening (410) of the wall member (400), a transparent member (600) may be attached to the wall member (400). For example, when a transparent member (600) is attached to a wall member (400), the transparent area (610) of the transparent member (600) may overlap with the pattern area (210) of the printed circuit board (200) and the opening (410) of the wall member (400). For example, light emitted from a plurality of light-emitting elements (205) may be emitted to the outside through the transparent area (610) of the transparent member (600).

[0034] FIG. 5 is an enlarged view of a portion of a wall member (400) according to one embodiment. FIG. 6 is a cross-sectional view showing the interior of an opening (410) of a wall member (400) according to one embodiment.

[0035] Referring to FIGS. 5 and 6, a photocatalytic mixture (500) according to one embodiment may be filled within an opening (410) up to a height (h2) equal to or lower than the height (h1) of the opening (410) of the wall member (400). For example, the internal space of the opening (410) of the wall member (400) may be filled or coated with the photocatalytic mixture (500). For example, the photocatalytic mixture (500) may be filled or coated up to a height (h2) equal to or lower than the height (h1) of the inner wall of the opening (410).

[0036] In a cover device (10) according to one embodiment, a plurality of light-emitting elements (205) may be surrounded by at least a portion or all of a photocatalytic mixture (500). For example, when a wall member (400) is attached to a printed circuit board (200), a plurality of light-emitting elements (205) may be located within an opening (410). For example, a plurality of light-emitting elements (205) may be located in the portion between the inner walls (405) on both sides of the opening (410). For example, the height (h1) of the inner wall (405) of the opening (410) of the wall member (400) may have a height corresponding to the height (h3) of the plurality of light-emitting elements (205). For example, the height (h3) of the plurality of light-emitting elements (205) may be configured to be lower than the height (h1) of the inner wall (405) of the opening (410) of the wall member (400). For example, the height (h2) of the photocatalytic mixture (500) in the opening (410) can be filled or applied so that it is higher than the height (h3) of the plurality of light-emitting elements (205).

[0037] In a cover device (10) according to one embodiment, light emitted from a plurality of light-emitting elements (205) may be reflected by the inner wall (405) of the opening (410) of the wall member (400). For example, light emitted laterally from the plurality of light-emitting elements (205) may be reflected by the inner wall (405) of the opening (410) and directed to the outside of the opening (410). For example, light emitted laterally from the plurality of light-emitting elements (205) may be reflected by the inner wall (405) of the opening (410) and directed to the transmission area (610). For example, the inner wall (405) of the opening (410) of the wall member (400) may be positioned substantially perpendicular to the printed circuit board (200). For example, the inner wall (405) of the opening (410) of the wall member (400) may be formed to have an angle of inclination such that it has an acute or obtuse angle with respect to the printed circuit board (200). For example, light emitted laterally from a plurality of light-emitting elements (205) may be reflected by the inner wall (405) of the inclination opening (410) and directed toward the transmission area (610).

[0038] In a cover device (10) according to one embodiment, light emitted from a plurality of light-emitting elements (205) is reflected by the inner wall (405) of the opening (410) of the wall member (400), thereby preventing the light emitted from the plurality of light-emitting elements (205) from spreading toward the surroundings of the plurality of light-emitting elements (205), and accordingly, the light leakage phenomenon occurring between the wall member (400) and the transparent member (600) can be blocked. For example, the height of the inner wall (405) of the opening (410) can be configured to have a height corresponding to the height of the plurality of light-emitting elements (205) or a higher height, and the light emitted from the plurality of light-emitting elements (205) can be prevented from leaking out to an area outside the opening (410) of the wall member (400). Thus, the spreading of light emitted from the plurality of light-emitting elements (205) can be prevented, and light can be concentrated at the opening (410) of the wall member (400). By efficiently concentrating light, the light directed outward from the opening (410) can be emitted with high brightness.

[0039] FIG. 7 is a drawing showing a state in which a cover device (10) according to one embodiment is mounted on an electronic device (1001).

[0040] Referring to FIG. 7, in a cover device (10) according to one embodiment, a transmission area (610) of a transmission member (600) may be formed in the housing (100) of the cover device (10) based on a cover design that is exposed to the outside of the cover device (10). The left drawing of FIG. 7 is a drawing showing a state in which a plurality of light-emitting materials (205) do not emit light. The right drawing of FIG. 7 is a drawing showing a state in which a plurality of light-emitting materials (205) emit light. For example, when a plurality of light-emitting materials (205) emit light as in FIG. 7, the light emitted from the plurality of light-emitting materials (205) is evenly spread across the entire transmission area (610) by the opening (410) of the wall member (400) and the photocatalytic mixture (500), thereby preventing a hot spot phenomenon. For example, the transparent area (610) may overlap with the pattern area (210) in which a plurality of light-emitting elements (205) are arranged and the opening (410) of the wall member (400). For example, the transparent area (610) of the transparent member (600) may be formed in the same shape as the pattern area (210). For example, the transparent area (610) of the transparent member (600) may be formed of a material through which light can pass. For example, the area other than the transparent area (610) of the transparent member (600) may be formed of a material through which light cannot pass. Accordingly, light emitted from the plurality of light-emitting elements (205) may be emitted to the outside of the cover device (10) through the opening (410) and the transparent area (610).

[0041] In a cover device (10) according to one embodiment, the luminance of the transmission area (610) of the transmission member (600) can be increased by the opening (410) of the wall member (400) or by the photocatalytic mixture (500) filled in the opening (410). For reference, luminance is a physical property representing the amount of light emitted by a light source or object, and is generally measured by the amount of light transmitted per specific area, with the unit being candela per square meter (cd / m²). Luminance can be influenced by various factors such as light intensity, the visual conditions of the observer, and the reflective characteristics of the object. Luminance is related to color perception, so even the same color may appear visually different if the luminance is different.

[0042] In a cover device (10) according to one embodiment, the opening (410) of the wall member (400) can increase the brightness of the transmission area (610) by allowing light emitted from a plurality of light-emitting elements (205) to be reflected by the side wall and directed toward the transmission area (610). Additionally, the photocatalytic mixture (500) filled in the opening (410) can increase the refractive index of the light emitted from a plurality of light-emitting materials, thereby causing the light to spread throughout the entire transmission area (610) rather than concentrating at a single point in the transmission area (610). For example, a transmission area (610) having various brightness levels can be realized by applying different mixing ratios of the photocatalytic mixture (500) based on a cover design exposed to the outside of the cover device (10).

[0043] Meanwhile, referring to FIG. 1, in a cover device (10) according to one embodiment, a magnetic body (700) disposed on a printed circuit board is further included, and mounting of the cover device (10) can be detected by an electronic device (1001) based on the magnetic force of the magnetic body (700). In a cover device (10) according to one embodiment, a communication module (800) disposed on a printed circuit board is further included, and the communication module (800) can transmit information of the cover device (10) to the electronic device (1001) via near-field wireless communication (NFC). In a cover device (10) according to one embodiment, a coil member (300) can receive power from the electronic device (1001) via near-field wireless communication (NFC).

[0044] For example, when a cover device (10) according to one embodiment is mounted on a housing (1003) of an electronic device (1001), the electronic device (1001) recognizes the mounting of the cover through a magnetic body (700) of the cover device (10), receives information of the cover device (10) through a communication module (800) of the cover device (10), and can supply power to the cover device (10) through short-range wireless communication.

[0045] FIG. 8 is a flowchart of a method for manufacturing a cover device according to one embodiment.

[0046] Referring to identification number 80 in FIG. 8, according to one embodiment, a molded structure for accommodating a printed circuit board (200) may be provided. The molded structure may include a plurality of plate members, including an upper plate member (91) and a lower plate member (92). According to one embodiment, a recess (93) for accommodating the printed circuit board (200) may be formed in the lower plate member (92). For example, the recess (93) formed on the surface of the lower plate member (92) may have a shape corresponding to the shape of the printed circuit board (200). For example, the recess (93) may be formed to have a height corresponding to the thickness of the printed circuit board (200).

[0047] Referring to identification number 81 in FIG. 8, a printed circuit board (200) can be accommodated in a recess (93) of a lower plate member (92) according to one embodiment. As the printed circuit board (200) is placed in the recess (93) of the lower plate member (92), the printed circuit board (200) can be stably seated within the recess (93).

[0048] According to one embodiment, a wall member (400) to be attached to a printed circuit board (200) may be disposed on the surface of the top plate member (91). For example, the wall member (400) may be disposed on the surface of the top plate member (91) facing the bottom plate member (92). According to one embodiment, a receiving groove for receiving the wall member (400) may be formed on the surface of the top plate member (91), and the wall member (400) may be disposed within the receiving groove. According to one embodiment, the wall member (400) may be formed to have an opening (410) having a shape corresponding to a pattern of a plurality of light-emitting elements on the printed circuit board (200).

[0049] Referring to identification number 83 in FIG. 8, an upper plate member (91) and a lower plate member (92) according to one embodiment may be pressed together. According to one embodiment, the surface of the lower plate member (92) on which the printed circuit board (200) is placed and the surface of the upper plate member (91) on which the wall member (400) is placed may be pressed together. Additionally, a heating process and a cooling process may be applied to the upper plate member (91) and the lower plate member (92) that are pressed together.

[0050] Referring to identification number 84 in FIG. 8, according to one embodiment, a wall member (400) may be attached to a printed circuit board (200) placed on a lower plate member (92). According to one embodiment, as the upper plate member (91) and the lower plate member (92) in a compressed state are heated and cooled, the wall member (400) placed on the upper plate member (92) may be attached to the printed circuit board (200) placed on the lower plate member (92).

[0051] Referring to identification number 85 in FIG. 8, a photocatalytic mixture (500) may be filled and disposed within the opening (410) of a wall member (400) attached to a printed circuit board (200) according to one embodiment. For example, the photocatalytic mixture (500) may include silicon-based photocatalytic powder. For example, the photocatalytic mixture (500) may include silicon dioxide (SiO2), titanium dioxide (TiO2), and a fluorescent material.

[0052] Referring to identification number 86 in FIG. 8, a flattening operation may be performed on a photocatalytic mixture (500) filled in an opening (410) of a wall member (400) on a printed circuit board (200) according to one embodiment. For example, a flattening operation may be performed to make the height of the photocatalytic mixture (500) filled in the opening (410) of the wall member (400) uniform.

[0053] FIG. 9 is a drawing for illustrating an example in which a cover device including an opening is applied to various parts of an electronic device housing according to various embodiments.

[0054] Referring to FIG. 1, an electronic device (1001) according to one embodiment comprises a housing (1003), a printed circuit board (200) disposed within the housing (1003), a coil member (300) disposed on the printed circuit board (200) and receiving power wirelessly provided from an electronic component disposed within the housing (1003), a plurality of light-emitting elements (205) that operate based on the power received through the coil member (300), are disposed along a pattern area (210) of the printed circuit board (200), and emit light toward the outside of the electronic device (1001), a wall member (400) disposed on the printed circuit board (200) and including an opening (410) formed along the pattern area (210), a photocatalytic mixture (500) filled and disposed within the opening (410), and a transparent element disposed on the wall member (400), overlapping with the opening (410), and exposed to the outside of the housing (1003). It may include a transparent member (600) including a region (610).

[0055] Referring to FIG. 9, a cover device (10) according to one embodiment may be implemented to be included in various electronic devices (2001), such as tablets and laptops, in addition to smartphones. For example, a printed circuit board (200) may be placed within the housing (2003) of various electronic devices (2001), such as tablets and laptops, in addition to smartphones. For example, a printed circuit board (200), a wall member (400), a photocatalytic mixture (500), and a transparent member (600) may be placed within the housing (2003) of various electronic devices (2001). For example, the transparent member (600) may be placed at various locations based on a design applied to the outside of the housing (2003) of various electronic devices (2001).

[0056] In an electronic device (1001) according to one embodiment, when a wall member (400) is disposed on a printed circuit board (200), an opening (410) may overlap with a pattern area (210) of the printed circuit board (200). In an electronic device (1001) according to one embodiment, when a transparent member (600) is disposed on a wall member (400), a transparent area (610) may overlap with an opening (410) of the wall member (400) and a pattern area (210) of the printed circuit board (200).

[0057] In an electronic device (1001) according to one embodiment, a plurality of light-emitting elements (205) are spaced apart at a predetermined interval on a pattern area (210) of a printed circuit board (200), and a photocatalytic mixture (500) can increase the refractive index of light emitted from the plurality of light-emitting elements (205).

[0058] In an electronic device (1001) according to one embodiment, the photocatalytic mixture (500) is filled to a height equal to or lower than the height of the inner wall of the opening (410) of the wall member (400), and a plurality of light-emitting elements (205) may be surrounded by at least a portion of the photocatalytic mixture (500).

[0059] In an electronic device (1001) according to one embodiment, the photocatalytic mixture (500) may include silicon dioxide (SiO2), titanium dioxide (TiO2), and a fluorescent material.

[0060] FIG. 10 is a block diagram of an electronic device (1001) in a network environment (1000) according to various embodiments.

[0061] Referring to FIG. 10, in a network environment (1000), an electronic device (1001) may communicate with an electronic device (1002) through a first network (1098) (e.g., a short-range wireless communication network) or with at least one of an electronic device (1004) or a server (1008) through a second network (1099) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (1001) may communicate with the electronic device (1004) through a server (1008). According to one embodiment, the electronic device (1001) may include a processor (1020), memory (1030), input module (1050), sound output module (1055), display module (1060), audio module (1070), sensor module (1076), interface (1077), connection terminal (1078), haptic module (1079), camera module (1080), power management module (1088), battery (1089), communication module (1090), subscriber identification module (1096), or antenna module (1097). In some embodiments, at least one of these components (e.g., connection terminal (1078)) may be omitted from the electronic device (1001), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (1076), camera module (1080), or antenna module (1097)) may be integrated into a single component (e.g., display module (1060)).

[0062] The processor (1020) can, for example, execute software (e.g., program (1040)) to control at least one other component (e.g., hardware or software component) of the electronic device (1001) connected to the processor (1020) and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (1020) can store commands or data received from other components (e.g., sensor module (1076) or communication module (1090)) in volatile memory (1032), process the commands or data stored in volatile memory (1032), and store the resulting data in non-volatile memory (1034). According to one embodiment, the processor (1020) may include a main processor (1021) (e.g., a central processing unit or an application processor) or an auxiliary processor (1023) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (1001) includes a main processor (1021) and an auxiliary processor (1023), the auxiliary processor (1023) may be configured to use lower power than the main processor (1021) or to be specialized for a specified function. The auxiliary processor (1023) may be implemented separately from the main processor (1021) or as part thereof.

[0063] The auxiliary processor (1023) may control at least some of the functions or states associated with at least one component of the electronic device (1001) (e.g., display module (1060), sensor module (1076), or communication module (1090)) on behalf of the main processor (1021) while the main processor (1021) is in an inactive (e.g., sleep) state, or together with the main processor (1021) while the main processor (1021) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (1023) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (1080) or communication module (1090)). According to one embodiment, the auxiliary processor (1023) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (1001) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (1008)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0064] The memory (1030) can store various data used by at least one component of the electronic device (1001) (e.g., processor (1020) or sensor module (1076)). The data may include, for example, software (e.g., program (1040)) and input data or output data for related commands. The memory (1030) may include volatile memory (1032) or non-volatile memory (1034).

[0065] The program (1040) may be stored as software in memory (1030) and may include, for example, an operating system (1042), middleware (1044), or an application (1046).

[0066] The input module (1050) can receive commands or data to be used for a component of the electronic device (1001) (e.g., processor (1020)) from outside the electronic device (1001) (e.g., user). The input module (1050) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0067] The sound output module (1055) can output a sound signal to the outside of the electronic device (1001). The sound output module (1055) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0068] The display module (1060) can visually provide information to an external (e.g., user) of the electronic device (1001). The display module (1060) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (1060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0069] The audio module (1070) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (1070) can acquire sound through the input module (1050) or output sound through the sound output module (1055) or an external electronic device (e.g., electronic device (1002)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (1001).

[0070] The sensor module (1076) can detect the operating state of the electronic device (1001) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (1076) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0071] The interface (1077) may support one or more specified protocols that can be used for the electronic device (1001) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (1002)). According to one embodiment, the interface (1077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0072] The connection terminal (1078) may include a connector through which the electronic device (1001) can be physically connected to an external electronic device (e.g., electronic device (1002)). According to one embodiment, the connection terminal (1078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0073] The haptic module (1079) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (1079) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0074] The camera module (1080) can capture still images and video. According to one embodiment, the camera module (1080) may include one or more lenses, image sensors, image signal processors, or flashes.

[0075] The power management module (1088) can manage power supplied to the electronic device (1001). According to one embodiment, the power management module (1088) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0076] The battery (1089) can supply power to at least one component of the electronic device (1001). According to one embodiment, the battery (1089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0077] The communication module (1090) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (1001) and an external electronic device (e.g., electronic device (1002), electronic device (1004), or server (1008)), and the performance of communication through the established communication channel. The communication module (1090) may include one or more communication processors that operate independently of the processor (1020) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1090) may include a wireless communication module (1092) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (1094) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (1004) through a first network (1098) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (1099) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1092) can identify or authenticate the electronic device (1001) within a communication network such as the first network (1098) or the second network (1099) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (1096).

[0078] The wireless communication module (1092) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (1092) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (1092) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (1092) can support various requirements specified in the electronic device (1001), external electronic device (e.g., electronic device (1004)), or network system (e.g., second network (1099)). According to one embodiment, the wireless communication module (1092) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0079] An antenna module (1097) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (1097) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (1097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (1098) or a second network (1099), may be selected from the plurality of antennas, for example, by a communication module (1090). A signal or power may be transmitted or received between the communication module (1090) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (1097).

[0080] According to various embodiments, the antenna module (1097) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0081] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0082] According to one embodiment, commands or data may be transmitted or received between an electronic device (1001) and an external electronic device (1004) through a server (1008) connected to a second network (1099). Each of the external electronic devices (1002, or 1004) may be the same or a different type of device as the electronic device (1001). According to one embodiment, all or part of the operations performed on the electronic device (1001) may be performed on one or more of the external electronic devices (1002, 1004, or 1008). For example, if the electronic device (1001) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (1001) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (1001). The electronic device (1001) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (1001) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In one embodiment, the external electronic device (1004) may include an Internet of Things (IoT) device. The server (1008) may be an intelligent server using machine learning and / or neural networks.According to one embodiment, an external electronic device (1004) or server (1008) may be included within the second network (1099). The electronic device (1001) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0083] Meanwhile, a cover device (10) according to one embodiment may be implemented as part of an electronic device (1001) or as a separate device mounted on the electronic device (1001). For example, if the cover device (10) is implemented as part of the electronic device (1001), the housing (200) of the cover device (10) may be configured as part of the housing (1003) of the electronic device (1001). For example, if the cover device (10) is implemented as part of the electronic device (1001), the process of detecting the mounting of the cover device (10) by the electronic device (1001) based on the magnetic force of the magnetic material (700) may be omitted. For example, if the cover device (10) is implemented as part of the electronic device (1001), the process of the communication module (800) transmitting information of the cover device (10) to the electronic device (1001) via near-field wireless communication (NFC) may be omitted.

[0084] Additionally, if the cover device (10) is implemented as a separate device from the electronic device (1001), the cover device (10) may be mounted on the housing (1003) of the electronic device (1001) to protect the housing (1003) of the electronic device (1001). For example, the cover device (10) may be mounted on the electronic device (1001) such that the printed circuit board (200) of the cover device (100) corresponds to the rear surface of the housing (1003) of the electronic device (1001). For example, when the cover device (10) is mounted on the electronic device (1001), the coil member (300) may be positioned at a location corresponding to the wireless charging coil of the electronic device (1001).

[0085] A cover device (10) according to one embodiment may include a housing (100), a printed circuit board (200) disposed within the housing (100), a coil member (300) disposed on the printed circuit board (200) and receiving power wirelessly provided from an electronic device (1001) adjacent to the cover device (10), a plurality of light-emitting elements (205) disposed along a pattern area (210) of the printed circuit board (200) and operating based on the power received through the coil member (300), a wall member (400) disposed on the printed circuit board (200) and including an opening (410) formed along the pattern area (210), a photocatalytic mixture (500) filled and disposed within the opening (410), and a transparent member (600) disposed on the wall member (400) and including a transparent area (610) that overlaps with the opening (410).

[0086] In a cover device (10) according to one embodiment, when a wall member (400) is placed on a printed circuit board (200), the opening (410) may overlap with the pattern area (210) of the printed circuit board (200).

[0087] In a cover device (10) according to one embodiment, when a transparent member (600) is placed on a wall member (400), the transparent area (610) may overlap with the opening (410) of the wall member (400) and the pattern area (210) of the printed circuit board (200).

[0088] In a cover device (10) according to one embodiment, a plurality of light-emitting elements (205) are spaced apart at a predetermined interval on a pattern area (210) of a printed circuit board (200), and a photocatalytic mixture (500) can increase the refractive index of light emitted from the plurality of light-emitting elements (205).

[0089] In a cover device (10) according to one embodiment, a photocatalytic mixture (500) is filled within an opening (410) to a height equal to or lower than the height of the inner wall of the opening (410) of a wall member (400), and a plurality of light-emitting elements (205) may be surrounded by at least a portion of the photocatalytic mixture (500).

[0090] In a cover device (10) according to one embodiment, light emitted from a plurality of light-emitting elements (205) can be reflected by the inner wall of the opening (410) of the wall member (400).

[0091] In a cover device (10) according to one embodiment, the brightness of the transmission area (610) of the transmission member (600) can be increased by the opening (410) of the wall member (400) or by the photocatalytic mixture (500) filled in the opening (410).

[0092] In a cover device (10) according to one embodiment, the height of the inner wall of the opening (410) of the wall member (400) may correspond to the height of a plurality of light-emitting elements (205).

[0093] In a cover device (10) according to one embodiment, the inner wall of the opening (410) of the wall member (400) may be formed to be perpendicular to the printed circuit board (200) or to have an angle inclined toward the outside of the plurality of light-emitting elements (205).

[0094] In a cover device (10) according to one embodiment, the photocatalytic mixture (500) may include silicon dioxide (SiO2), titanium dioxide (TiO2), and a fluorescent material.

[0095] In a cover device (10) according to one embodiment, a magnetic body (700) disposed on a printed circuit board (200) is further included, and mounting of the cover device (10) can be detected by an electronic device (1001) based on the magnetic force of the magnetic body (700).

[0096] In a cover device (10) according to one embodiment, a communication module (800) disposed on a printed circuit board (200) is further included, and the communication module (800) can transmit information of the cover device (10) to an electronic device (1001) via near-field wireless communication (NFC).

[0097] In a cover device (10) according to one embodiment, the coil member (300) can receive power from an electronic device (1001) via near-field wireless communication (NFC).

[0098] In a cover device (10) according to one embodiment, the housing (100) can be mounted on the housing (1003) of an electronic device (1001).

[0099] An electronic device (1001) according to one embodiment comprises a housing (100), a printed circuit board (200) disposed within the housing (100), a coil member (300) disposed on the printed circuit board (200) and receiving power wirelessly provided from an electronic component disposed within the housing (100), a plurality of light-emitting elements (205) that operate based on the power received through the coil member (300), are disposed along a pattern area (210) of the printed circuit board (200), and emit light toward the outside of the electronic device (1001), a wall member (400) disposed on the printed circuit board (200) and including an opening (410) formed along the pattern area (210), a photocatalytic mixture (500) filled and disposed within the opening (410), and a transparent area (610) disposed on the wall member (400), which overlaps with the opening (410) and is exposed to the outside of the housing (100). It may include a component (600).

[0100] In an electronic device (1001) according to one embodiment, when a wall member (400) is placed on a printed circuit board (200), the opening (410) may overlap with the pattern area (210) of the printed circuit board (200).

[0101] In an electronic device (1001) according to one embodiment, when a transparent member (600) is disposed on a wall member (400), the transparent area (610) may overlap with the opening (410) of the wall member (400) and the pattern area (210) of the printed circuit board (200).

[0102] In an electronic device (1001) according to one embodiment, a plurality of light-emitting elements (205) are spaced apart at a predetermined interval on a pattern area (210) of a printed circuit board (200), and a photocatalytic mixture (500) can increase the refractive index of light emitted from the plurality of light-emitting elements (205).

[0103] In an electronic device (1001) according to one embodiment, the photocatalytic mixture (500) is filled to a height equal to or lower than the height of the inner wall of the opening (410) of the wall member (400), and a plurality of light-emitting elements (205) may be surrounded by at least a portion of the photocatalytic mixture (500).

[0104] In an electronic device (1001) according to one embodiment, the photocatalytic mixture (500) may include silicon dioxide (SiO2), titanium dioxide (TiO2), and a fluorescent material.

[0105] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0106] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0107] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0108] Various embodiments of the present document may be implemented as software (e.g., program (1040)) comprising one or more instructions stored in a storage medium (e.g., internal memory (1036) or external memory (1038)) readable by a machine (e.g., electronic device (1001)). For example, a processor (e.g., processor (1020)) of the machine (e.g., electronic device (1001)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0109] According to one embodiment, the method according to the various embodiments disclosed herein may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0110] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0111] Methods according to the embodiments described in the claims or specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0112] When implemented in software, a computer-readable storage medium may be provided for storing one or more programs (software modules). One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure.

[0113] In the present disclosure, the function or operation performed by an electronic device may be performed by one or more processors executing one or more instructions stored in memory. The function or operation of the electronic device mentioned in the present disclosure may be performed by a single processor executing one or more instructions, or by a combination of multiple processors executing one or more instructions. A processor mentioned in the present disclosure is understood to include a circuit for performing operations or controlling other components of the electronic device. For example, the one or more processors may include a central processing unit (CPU), a micro-processor unit (MPU), an application processor (AP), a communication processor (CP), a neural processing unit (NPU), a system on chip (SoC), or an integrated circuit (IC) configured to execute one or more instructions. The one or more processors may be configured to perform the operation of the electronic device described above.

[0114] In the present disclosure, a program (software module, software) may be stored in a random access memory, a non-volatile memory including flash memory, a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a magnetic disc storage device, a compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, or a magnetic cassette. Alternatively, it may be stored in a memory composed of some or all of these. The memory may be composed of a single storage medium or a combination of multiple storage media. The one or more instructions may be stored in a single storage medium or distributed across multiple storage media.

[0115] Additionally, the above program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WLAN (wide LAN), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0116] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0117] Additionally, in the present disclosure, terms such as “part,” “module,” etc. may be a hardware component, such as a processor or circuit, and / or a software component executed by a hardware component, such as a processor.

[0118] "Parts" and "modules" may be implemented by a program that is stored on an addressable storage medium and can be executed by a processor. For example, "parts" and "modules" may be implemented by components such as software components, object-oriented software components, class components, and task components, as well as by processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables.

[0119] The specific embodiments described in this disclosure are merely examples and do not limit the scope of this disclosure in any way. For the sake of brevity, descriptions of prior electronic configurations, control systems, software, and other functional aspects of said systems may be omitted.

[0120] Additionally, in the present disclosure, “comprising at least one of a, b, or c” may mean “comprising only a, comprising only b, comprising only c, or comprising a combination of two or more (comprising a and b, comprising b and c, comprising a and c, or comprising all of a, b, and c).”

[0121] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments, but should be defined by the claims set forth below as well as equivalents thereof.

[0122] In the present disclosure, the term “if” will be understood, depending on the context, to mean “when, upon,” “in response to a decision,” or “in response to a detection.” Similarly, “when decided to,” or “when [mentioned condition or event] is detected” will be understood, optionally, to mean “when decided,” or “in response to a decision,” “when [mentioned condition or event] is detected,” or “in response to a detection.”

[0123] The device described above may be implemented as a hardware component, a software component, and / or a combination of a hardware component and a software component. For example, the device and components described in the embodiments may be implemented using one or more general-purpose or special-purpose computers, such as a processor, a controller, an arithmetic logic unit (ALU), a digital signal processor, a microcomputer, a field programmable gate array (FPGA), a programmable logic unit (PLU), a microprocessor, or any other device capable of executing and responding to instructions. The processing unit (or processing circuit) may execute an operating system (OS) and one or more software applications executed on said operating system. Additionally, the processing unit may access, store, manipulate, process, and generate data in response to the execution of the software. For ease of understanding, the processing unit may be described as being used as a single unit, but those skilled in the art will understand that the processing unit may include multiple processing elements and / or multiple types of processing elements. For example, the processing unit may include multiple processors or one processor and one controller. Additionally, other processing configurations, such as parallel processors, are also possible.

[0124] Software may include computer programs, code, instructions, or a combination of one or more of these, and may configure a processing unit to operate as desired or instruct the processing unit independently or collectively. Software and / or data may be embodied in any type of machine, component, physical device, computer storage medium, or device so as to be interpreted by the processing unit or to provide instructions or data to the processing unit. Software may be distributed over networked computer systems and may be stored or executed in a distributed manner. Software and data may be stored on one or more computer-readable recording media.

[0125] The method according to the embodiment may be implemented in the form of program instructions that can be executed through various computer means and recorded on a computer-readable medium. In this case, the medium may continuously store a program executable by a computer, or temporarily store it for execution or download. Additionally, the medium may be various recording or storage means in the form of a single or several hardware combined, and may not be limited to a medium directly connected to a computer system but may exist distributed over a network. Examples of media may include magnetic media such as hard disks, floppy disks, and magnetic tapes; optical recording media such as CD-ROMs and DVDs; magneto-optical media such as floptical disks; and media configured to store program instructions, including ROM, RAM, and flash memory. Additionally, other examples of media may include recording or storage media managed by an app store that distributes applications or a site or server that supplies or distributes various other software.

[0126] Although the embodiments have been described above with reference to limited examples and drawings, those skilled in the art can make various modifications and variations from the description above. For example, suitable results can be achieved even if the described techniques are performed in a different order than described, and / or the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents.

Claims

1. In the cover device (10), Housing (100); A printed circuit board (200) disposed within the above housing (100); A coil member (300) disposed on the printed circuit board (200) and receiving power wirelessly provided from an electronic device (1001) adjacent to the cover device (10), A plurality of light-emitting elements (205) that operate based on the power received through the coil member (300) and are arranged along the pattern area (210) of the printed circuit board (200); A wall member (400) disposed on the printed circuit board (200) and including an opening (410) formed along the pattern area (210); A photocatalytic mixture (500) filled and disposed within the above-mentioned opening (410); and A cover device (10) comprising: a transparent member (600) disposed on the above wall member (400) and including a transparent area (610) that overlaps with the opening (410).

2. In Claim 1, A cover device (10) in which, when the above wall member (400) is placed on the above printed circuit board (200), the opening (410) overlaps with the pattern area (210) of the above printed circuit board (200).

3. In Claim 1, A cover device (10) in which, when the above-mentioned transparent member (600) is placed on the above-mentioned wall member (400), the above-mentioned transparent area (610) overlaps with the opening (410) of the above-mentioned wall member (400) and the above-mentioned pattern area (210) of the above-mentioned printed circuit board (200).

4. In Claim 1, The plurality of light-emitting elements (205) are spaced apart at a predetermined interval on the pattern area (210) of the printed circuit board, and The above photocatalytic mixture (500) is a cover device (10) that increases the refractive index of light emitted from the plurality of light-emitting elements (205).

5. In Claim 1, The above photocatalytic mixture (500) is filled into the opening (410) up to a height equal to or lower than the height of the inner wall of the opening (410) of the wall member (400), and A cover device (10) in which at least a portion of the plurality of light-emitting elements (205) is surrounded by the photocatalytic mixture (500).

6. In Claim 1, A cover device (10) in which light emitted from the plurality of light-emitting elements (205) is reflected by the inner wall of the opening (410) of the wall member (400).

7. In Claim 1, A cover device (10) in which the brightness of the transmission area (610) of the transmission member (600) is increased by the opening (410) of the wall member (400) or the photocatalytic mixture (500) filled in the opening (410).

8. In Claim 1, A cover device (10) in which the height of the inner wall of the opening (410) of the above wall member (400) corresponds to the height of the plurality of light-emitting elements (205).

9. In Claim 1, A cover device (10) in which the inner wall of the opening (410) of the above-mentioned wall member (400) is formed to be perpendicular to the printed circuit board or to have an angle inclined toward the outside of the plurality of light-emitting elements (205).

10. In Claim 1, The above photocatalytic mixture (500) comprises silicon dioxide (SiO2), titanium dioxide (TiO2), and a fluorescent material, in a cover device (10).

11. In Claim 1, It further includes a magnetic body (700) disposed on the printed circuit board above, and A cover device (10) in which the mounting of the cover device (10) is detected by the electronic device (1001) based on the magnetic force of the magnetic body (700).

12. In Claim 1, It further includes a communication module (800) disposed on the printed circuit board above, and The communication module (800) transmits information of the cover device (10) to the electronic device (1001) via near-field wireless communication (NFC), the cover device (10).

13. In Claim 1, The above coil member (300) is a cover device (10) that receives power from the electronic device (1001) via near-field wireless communication (NFC).

14. In Claim 1, The above housing (100) is a cover device (10) mounted on the housing (1003) of the electronic device (1001).

15. In an electronic device (1001), Housing (1003); A printed circuit board (200) disposed within the above housing (100); A coil member (300) disposed on the printed circuit board (200) and receiving power wirelessly provided from an electronic component disposed within the housing (100), A plurality of light-emitting elements (205) that operate based on the power received through the coil member (300), are arranged along the pattern area (210) of the printed circuit board (200), and emit light toward the outside of the electronic device (1001); A wall member (400) disposed on the printed circuit board (200) and including an opening (410) formed along the pattern area (210); A photocatalytic mixture (500) filled and disposed within the above-mentioned opening (410); and An electronic device (1001) comprising: a transparent member (600) disposed on the above-mentioned wall member (400), overlapping with the above-mentioned opening (410), and including a transparent area (610) exposed to the outside of the housing (100).

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