Acoustic device and control structure and control method therefor

Abstract

An acoustic device, comprising a housing and an optical sensor. The optical sensor comprises an optical transceiving unit and a reflection portion that are spaced apart. The optical transceiving unit is configured to emit light waves towards the reflection portion and receive light waves reflected by the reflection portion, so as to generate an electrical signal. The optical sensor is connected to the inner surface of a side wall of the housing. When the outer surface of the side wall is pressed by a user, the electrical signal changes. The housing, combined with the optical sensor, can serve as a control structure for the acoustic device to control the acoustic device.

Description

An acoustic device and its control structure and control method Technical Field

[0001] This specification relates to the field of acoustic equipment technology, and in particular to an acoustic device and its control structure and control method. Background Technology

[0002] Acoustic devices are electronic devices that can emit sound. Examples include headphones, microphones, watches, and electronic bracelets. Acoustic devices typically have one or more buttons, which, when operated, enable different functions. Commonly used buttons include dome switches. A dome switch is a thin, curved, arc-shaped structure often used as a switch on circuit boards such as PCBs or FPCs. Users press the dome switch, causing it to deform and make contact with the circuitry on the PCB or FPC, thus connecting the circuit. Dome switches are difficult to integrate into the housing of acoustic devices using a single molding process, thus requiring additional waterproofing. Different dome switches may have inconsistent tactile feedback when pressed. A dome switch produces a clicking sound when pressed, and varying degrees of pressure result in different levels of contact between the dome switch and the circuitry, leading to unstable electrical signals.

[0003] Therefore, it is necessary to provide a control structure for acoustic devices that integrates the buttons with the housing to simplify waterproof design.

[0004] Summary of the Invention

[0005] This specification provides one or more embodiments of an acoustic device, the acoustic device including a housing; an optical sensor including a spaced-apart optical transceiver unit and a reflector, the optical transceiver unit being configured to emit light waves toward the reflector and receive light waves reflected by the reflector, thereby generating an electrical signal, wherein the optical sensor is connected to the inner surface of a side wall of the housing, and the electrical signal changes when the outer surface of the side wall is pressed by a user.

[0006] In some embodiments, the thickness of the connection area on the sidewall connected to the optical sensor is less than the thickness of the unconnected area.

[0007] In some embodiments, a stepped structure is formed on the sidewall between the connected area of ​​the light sensor and the surrounding unconnected area.

[0008] In some embodiments, the material of the connection area on the sidewall connected to the light sensor is different from the material of the unconnected area.

[0009] In some embodiments, the Mohs hardness of the material in the connection area on the sidewall connected to the light sensor is less than the Mohs hardness of the material in the unconnected area.

[0010] In some embodiments, the reflective portion is located between the inner surface of the sidewall and the optical transceiver unit, and the optical transceiver unit is located on the side of the reflective portion away from the connection area.

[0011] In some embodiments, the optical sensor includes a cantilever structure disposed opposite to the reflector, and the optical transceiver unit is fixed to the cantilever structure and spaced apart from the fixed end of the cantilever structure by a distance.

[0012] In some embodiments, the area of ​​the reflective portion facing the optical transceiver unit forms a groove structure relative to the surrounding area, and the bottom of the groove structure is closer to the optical transceiver unit.

[0013] In some embodiments, the connection area and the unconnected area on the sidewall that are connected to the reflective portion are a non-integral splicing structure.

[0014] In some embodiments, the optical transceiver unit is located between the inner surface of the sidewall and the reflective portion.

[0015] In some embodiments, the optical sensor includes a cantilever structure disposed opposite to the optical transceiver unit, and the reflective portion is fixed to the cantilever structure and spaced apart from the fixed end of the cantilever structure by a distance.

[0016] In some embodiments, the cantilever structure is connected to other areas on the sidewall, and the other areas and the connection area on the sidewall connected to the optical transceiver unit are non-integrated splicing structures.

[0017] In some embodiments, when the outer surface of the sidewall is not pressed by the user, the distance between the optical transceiver unit and the reflector is in the range of 0-200 μm.

[0018] In some embodiments, the intensity of the reflected light wave received by the optical transceiver unit increases as the distance between the optical transceiver unit and the reflector increases.

[0019] In some embodiments, the housing includes at least one second sidewall connected to the sidewall. When the outer surface of the at least one second sidewall is pressed by the user, the deformation of the second sidewall causes a second change in the electrical signal. The trend of the second change is opposite to the trend of the change in the electrical signal caused by the user pressing the sidewall.

[0020] This specification provides one or more embodiments of an acoustic device, the acoustic device including a housing including a first sidewall and at least one second sidewall; a loudspeaker housed in the housing; a light sensor connected to the inner surface of the first sidewall, including a spaced-apart optical transceiver unit and a reflector, the optical transceiver unit emitting light waves toward the reflector and receiving light waves reflected by the reflector, thereby generating an electrical signal; and a processing circuit electrically connected to the light sensor, configured to: when a user presses the first sidewall, read the first electrical signal generated by the light sensor and control the loudspeaker to perform a first operation according to the first electrical signal; and when a user presses the at least one second sidewall, read the second electrical signal generated by the light sensor and control the loudspeaker to perform a second operation according to the second electrical signal. Attached Figure Description

[0021] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0022] Figure 1A is a schematic diagram of an application scenario of an acoustic device according to some embodiments of this specification;

[0023] Figure 1B is a schematic diagram of the structure of an earphone according to some embodiments of this specification;

[0024] Figure 2A is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0025] Figures 2B-2D are schematic diagrams illustrating light wave reflection when the optical transceiver unit and the reflector are at different distances according to some embodiments of this specification;

[0026] Figure 2E is a graph showing the change of current generated by the optical transceiver unit as a function of the distance between the optical transceiver unit and the reflector, according to some embodiments of this specification.

[0027] Figure 2F is a graph showing the voltage generated by the optical transceiver unit according to some embodiments of this specification as a function of the distance between the optical transceiver unit and the reflector;

[0028] Figure 3A is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0029] Figure 3B is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0030] Figure 4 is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0031] Figure 5 is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0032] Figure 6A is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0033] Figure 6B is a schematic diagram of the structure of the sidewall of an acoustic device according to some embodiments of this specification;

[0034] Figures 6C-6E are schematic diagrams showing different reinforcing structures on the sidewalls according to some embodiments of this specification;

[0035] Figure 7 is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0036] Figure 8 is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0037] Figure 9 is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0038] Figure 10 is a structural schematic diagram of the housing of an acoustic device according to some embodiments of this specification;

[0039] Figure 11 is a partial structural schematic diagram of an acoustic device according to some embodiments of this specification;

[0040] Figure 12 is a graph showing the voltage variation with the amount of pressure applied by the user, according to some embodiments of this specification. Detailed Implementation

[0041] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0042] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0043] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0044] Flowcharts are used in this specification to illustrate the operations performed by the system according to embodiments of this specification. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0045] Current acoustic devices typically use dome switches. The dome switch's curved structure is prone to fatigue stress due to repeated pressing, resulting in a short lifespan and irreparable replacement after failure. Installation often requires partial soldering to other structures, such as the casing, PCB board, or FPC board, making installation and replacement difficult. The precision of the soldering also affects the switch's performance. Since the dome switch needs to establish an electrical connection with the PCB or FPC board, dust and other impurities can prevent this connection, leading to failure. Furthermore, dome switches are difficult to integrate seamlessly into the acoustic device's casing, necessitating additional waterproofing. This increases production costs and complexity.

[0046] Therefore, this specification provides an improved acoustic device in which a light sensor is integrated into the control circuit of the acoustic device. The light sensor converts light waves into electrical signals. When a user presses a portion of the acoustic device, it causes a change in the light waves, which in turn causes a change in the electrical signal. This change in the electrical signal is then used to control the acoustic device. This design eliminates the need for a traditional metal dome switch, effectively avoiding the drawbacks associated with metal dome switches.

[0047] Figure 1A is a schematic diagram of an application scenario of an acoustic device according to some embodiments of this specification. The application scenario may include acoustic device 10, storage device 20, network 30, and processing device 40.

[0048] Acoustic device 10 refers to one or more electronic devices that can emit sound and are wearable by a user. Acoustic device 10 can be one or any combination of acoustic devices such as headphones, watches 103, glasses 104, wristbands, helmets, and VR headsets. Headphones can be in-ear headphones 101 or over-ear headphones 102. Headphones can be bone conduction headphones or air conduction headphones.

[0049] Users can control the acoustic device 10 in various ways. For example, users can control the acoustic device 10 by pressing. Pressing operations in this specification include long presses, short presses, touches, single clicks, double clicks, and sliding, among other methods that apply pressure to the housing of the acoustic device 10. In some embodiments, the acoustic device 10 is equipped with a light sensor, which works in conjunction with the housing of the acoustic device 10 to function as a control structure for controlling the acoustic device 10. For example, a physical button or touch button may be provided in the portion of the housing of the acoustic device 10 corresponding to the light sensor. When the user presses the button, the light sensor can detect a signal or a signal change, which can be used to determine the control command input by the user, thereby controlling the acoustic device 10. More details about the light sensor can be found in Figures 2A-12.

[0050] In some embodiments, the processing device 40 can identify user operations through the acoustic device 10, and after processing by the processing device 40, can control the acoustic device 10 to execute corresponding instructions. During processing, the processing device 40 can acquire data from the acoustic device 10 and / or the storage device 20 or save data to the storage device 20, and can also read data from other sources and output data to other target objects through the network 30.

[0051] In some embodiments, the processing device 40 may be integrated into the acoustic device 10. For example, the processing device 40 may also include processing circuitry, which is part of the acoustic device 10 and electrically connected to the light sensor. The processing circuitry is configured to read and analyze the signals acquired by the light sensor to determine control commands input by the user, thereby controlling the acoustic device 10 to perform corresponding operations.

[0052] In some embodiments, the processing device 40 may include one or more sub-processing devices (e.g., a single-core processing device or a multi-core multi-chip processing device). By way of example only, the processing device 40 may include a central processing unit (CPU), an application-specific integrated circuit (ASIC), an application-specific instruction processor (ASIP), a graphics processing unit (GPU), a physical processor (PPU), a digital signal processor (DSP), a field-programmable gate array (FPGA), a programmable logic device (PLD), a controller, a microcontroller unit, a reduced instruction set computer (RISC), a microprocessor, or any combination thereof.

[0053] Storage device 20 can be used to store data and / or instructions. Data refers to the digital representation of information and can include various types, such as binary data, text data, image data, video data, etc. Instructions refer to programs that control devices or components to perform specific functions. Storage device 20 can include one or more storage components, each of which can be a separate device or part of another device. In some embodiments, storage device 20 can include random access memory (RAM), read-only memory (ROM), mass storage, removable memory, volatile read-write memory, etc., or any combination thereof. For example, mass storage can include disks, optical disks, solid-state drives, etc. In some embodiments, storage device 20 can be implemented on a cloud platform.

[0054] Figure 1B is a structural schematic diagram of an ear-hook headphone according to some embodiments of this specification.

[0055] As shown in Figure 1B, the ear-hook headphones include an ear hook 105 and a sound-emitting part 106. The ear hook 105 can be suspended on the user's ear. The sound-emitting part 106 refers to the structure that can emit sound. When the ear hook 105 is suspended on the user's ear, the sound-emitting part 106 can be close to but not block the ear canal.

[0056] In some embodiments, the sound-emitting unit 106 includes a housing, a processing circuit, and a speaker. The housing houses the processing circuit, speaker, and other components. The processing circuit is communicatively connected to the speaker and can control the speaker to emit sound. In some embodiments, the processing circuit is communicatively connected to an external device via a network 30. The external device can send control commands to the processing circuit, and the processing circuit can perform related operations in response to the control commands.

[0057] Referring again to Figure 1B, a control button 107 is disposed on the side of the housing of the sound-emitting part 106 away from the ear canal, for the user to input control commands. The control button 107 can be a physical button or a touch button. The user can input control commands by pressing it. In some embodiments, a light sensor is disposed inside the housing of the sound-emitting part 106, which is electrically connected to the processing circuit. When the user presses the control button 107, the light sensor can detect a signal or a change in signal. The processing circuit can identify the control command input by the user based on the signal or signal change detected by the light sensor and control the speaker to perform the corresponding operation.

[0058] It should be understood that the ear-hook headphones shown in Figure 1B are merely an exemplary acoustic device. The control structures and methods disclosed in this specification can be used with any type of acoustic device.

[0059] Figure 2A is a partial structural schematic diagram of the acoustic device 10A according to some embodiments of this specification.

[0060] As shown in Figure 2A, the acoustic device 10A may include a housing 100 and a light sensor 200. The light sensor 200 may be disposed within the housing 100. For illustrative purposes, only a portion of the housing 100 is shown in Figure 2A.

[0061] Housing 100 refers to a structure with an internal cavity. The cavity is used to accommodate other structures. The inner surface of housing 100 can serve as a mounting base for mounting other structures that house the space. These other structures may include switches, circuit boards, sensors, etc. In some embodiments, the outer surface of housing 100 may be a plane, an arc surface, an irregular surface, etc. In some embodiments, the inner surface of housing 100 may be a plane, an arc surface, an irregular surface, etc. In some embodiments, the thickness of different parts of housing 100 may be equal or unequal. The thickness of housing 100 can be represented by the distance between the outer surface and the corresponding inner surface. In some embodiments, the corners of the outer surface and / or inner surface of housing 100 may be rounded.

[0062] In some embodiments, housing 100 can be the housing of various acoustic devices, such as headphones, watches, wristbands, microphones, etc. As an example only, housing 100 can be the housing of the sound-emitting part 106 shown in FIG. 1B. In some embodiments, housing 100 can be a one-piece molded structure. In some embodiments, housing 100 can be an assembled structure. In some embodiments, housing 100 can include at least two housing units. At least two housing units can be interconnected in various ways to form housing 100, such as bonding, snap-fitting, heat fusion, threaded connection, etc. In some embodiments, housing 100 can be made of various materials, such as metal, plastic, silicone, etc.

[0063] The optical sensor 200 refers to a structure capable of converting light waves into electrical signals and vice versa. In some embodiments, the electrical signal may include current, voltage, etc. In some embodiments, the optical sensor 200 can be connected to the inside of the housing 100 of the acoustic device 10A in various ways, such as by bonding, snap-fitting, welding, etc.

[0064] In some embodiments, the optical sensor 200 may include an optical transceiver unit 210 and a reflector 220 placed at intervals. The optical transceiver unit 210 may be configured to emit light waves to the reflector 220 and receive light waves reflected by the reflector 220, thereby generating an electrical signal.

[0065] The reflective portion 220 refers to a structure capable of reflecting light waves. Reflection can include specular reflection, diffuse reflection, etc. In some embodiments, the reflective portion 220 may include a reflective structure, such as a reflective layer or reflective film disposed on at least one surface of the reflective portion 220. As an example only, a reflective layer may be disposed on the surface of the reflective portion 220 facing the optical transceiver unit 210. The reflective layer can be used to reflect light. In some embodiments, the reflective layer can be made of various reflective materials, such as reflective paint, reflective coatings, reflective pigments, metallic powders, etc. In some embodiments, the reflective layer can be disposed on the reflective portion 220 in various ways, such as by pasting, coating, or hot-melting. In some embodiments, the reflective portion 220 can be directly made of reflective material. In some embodiments, the reflective portion 220 can have various shapes, such as flat or curved.

[0066] The optical transceiver unit 210 is capable of generating and receiving light waves. In some embodiments, the optical transceiver unit 210 includes a light-emitting part 211 and a receiving part 212.

[0067] The light-emitting unit 211 is used to convert electrical signals into light waves. In some embodiments, the light-emitting unit 211 includes a light-emitting diode, a laser emitter, etc. As an example only, the light-emitting unit 211 is connected to a light-emitting control circuit. The light-emitting control circuit can generate a light-emitting control electrical signal to control the light-emitting unit 211 to emit light waves. In some embodiments, the light-emitting control circuit can control the duration, time interval, and light wave intensity of the light waves emitted by the light-emitting unit 211 based on the light-emitting control electrical signal. For example, when the light-emitting control circuit is turned on, it continuously generates a light-emitting control electrical signal, controlling the light-emitting unit 211 to continuously emit light waves with an intensity of 10 mcd. Another example is that when the light-emitting control circuit is turned on, it generates a light-emitting control electrical signal every 5 seconds, controlling the light-emitting unit 211 to emit light waves every 5 seconds, with each emitted light wave lasting 2 seconds and an intensity of 10 mcd.

[0068] The receiving unit 212 is used to receive light waves and convert them into electrical signals. In some embodiments, the light-emitting unit 211 includes a photosensitive sensor, etc. The photosensitive sensor may include a phototube, a photomultiplier tube, a photoresistor, a phototransistor, an infrared sensor, etc.

[0069] In some embodiments, the light sensor 200 further includes a mounting bracket 230. The mounting bracket 230 serves as a mounting base for mounting the light-emitting part 211 and the receiving part 212. In some embodiments, the interior of the mounting bracket 230 includes a first mounting space 231 and / or a second mounting space 232. For example, the mounting bracket 230 is assembled from multiple plate-like structures, which enclose the first mounting space 231 and / or the second mounting space 232.

[0070] The first mounting space 231 is used to accommodate the light-emitting part 211. In some embodiments, the mounting bracket 230 is provided with a first opening 2311, through which light waves emitted by the light-emitting part 211 can pass and be emitted outward. The light-emitting part 211 is connected to at least one inner surface of the first mounting space 231 in various ways, such as bonding, snap-fitting, welding, etc. In some embodiments, the inner surface of the first mounting space 231 where the light-emitting part 211 is connected can be a plane, thereby facilitating the connection between the light-emitting part 211 and the mounting bracket 230.

[0071] The second mounting space 232 is used to accommodate the receiving part 212. In some embodiments, the mounting bracket 230 is provided with a second opening 2321, through which light waves outside the second mounting space 232 can pass into the second mounting space 232 and be received by the receiving part 212. For example, light waves emitted by the light-emitting part 211 can be reflected by the reflector 220 and then enter the second mounting space 232. In some embodiments, the receiving part 212 can be connected to at least one inner surface of the second mounting space 232 in various ways, such as by bonding, snap-fitting, or welding. In some embodiments, the inner surface of the second mounting space 232 where the receiving part 212 is connected can be a plane to facilitate the connection between the receiving part 212 and the mounting bracket 230.

[0072] In some embodiments, the first opening 2311 and the second opening 2321 are located on the same side of the mounting bracket 230 facing the reflector 220. In some embodiments, the side of the mounting bracket 230 with the first opening 2311 and / or the second opening 2321 is planar. In some embodiments, the side of the mounting bracket 230 with the first opening 2311 and / or the second opening 2321 is parallel to the reflector 220. In some embodiments, there is a specific angle between the side of the mounting bracket 230 with the first opening 2311 and / or the second opening 2321 and the reflector 220.

[0073] In some embodiments, when the acoustic device 10A is in operation, the light-emitting unit 211 continuously emits light waves, some of which are reflected by the reflective unit 220 and then received by the receiving unit 212. The intensity of the light waves received by the receiving unit 212 is related to the distance between the optical transceiver unit 210 and the reflective unit 220. When the optical transceiver unit 210 is disposed within the mounting bracket 230, the distance between the optical transceiver unit 210 and the reflective unit 220 can be equal to or approximately equal to the distance between the mounting bracket 230 and the reflective unit 220.

[0074] Specifically, the relationship between distance and light intensity differs when the distance falls within different ranges of the first, second, and third distance ranges. Specifically, the first distance range is smaller than the second distance range, and the second distance range is smaller than the third distance range. In some embodiments, the first, second, and third distance ranges are related to the intensity of the light emitted by the optical transceiver unit 210, the wavelength of the light wave, and the reflectivity of the reflective portion, etc.

[0075] For illustrative purposes, Figures 2B-2D illustrate light wave reflection when the optical transceiver unit and the reflector are at different distances. Referring to Figure 2B, when the distance between the optical transceiver unit 210 and the reflector 220 is within a first distance range, the distance between the optical transceiver unit 210 and the reflector 220 is small, and the light-receiving surface on the reflector 220 is small. At this time, only light waves at specific angles can be received by the optical transceiver unit 210 after reflection by the reflector 220, and the intensity of the light waves received by the optical transceiver unit 210 is low. Within the first distance range, as the distance between the optical transceiver unit 210 and the reflector 220 increases, light scattered by the reflector 220 at larger angles can enter the optical transceiver unit 210. That is, within the first distance range, the intensity of the light waves received by the optical transceiver unit 210 increases with the increase of the distance between the optical transceiver unit 210 and the reflector 220.

[0076] Referring to Figure 2C, when the distance between the optical transceiver unit 210 and the reflector 220 is within the second distance range, as the distance between the optical transceiver unit 210 and the reflector 220 increases, on the one hand, the light-receiving surface on the reflector 220 increases, and reflected light at a larger angle enters the optical transceiver unit 210; on the other hand, as the distance increases, more light waves are lost due to diffuse reflection. At this time, the intensity of the light waves received by the optical transceiver unit 210 changes little or not at all.

[0077] Referring to Figure 2D, when the distance between the optical transceiver unit 210 and the reflector 220 is within the third distance range, the distance between them is relatively large. At this time, the light waves emitted from the optical transceiver unit 210 are dispersed, and the light waves reflected by the reflector 220 are further scattered. Diffuse reflection plays a dominant role in the loss of light waves, resulting in a decrease in the intensity of the light waves received by the optical transceiver unit 210. Within the third distance range, the intensity of the light waves received by the optical transceiver unit 210 further decreases as the distance between the optical transceiver unit 210 and the reflector 220 increases.

[0078] Figure 2E is a graph showing the change of current generated by the optical transceiver unit according to some embodiments of this specification as a function of the distance between the optical transceiver unit and the reflector. Figure 2F is a graph showing the change of voltage generated by the optical transceiver unit according to some embodiments of this specification as a function of the distance between the optical transceiver unit and the reflector. The curves in Figures 2E and 2F were obtained through actual measurements. In the actual measurements, the optical transceiver unit 210 used a QRE1 infrared reflectivity sensor. The QRE1113 infrared reflectivity sensor used an LED lamp that emits infrared light as the light-emitting part 211, and a phototransistor that receives infrared light as the receiving part 212. The light-emitting part 211 emits light waves in an environment with a voltage of 5V, a current of 10mA, and an ambient temperature of 25°C. The reflector 220 is made of black material.

[0079] In Figure 2E, the horizontal axis represents the distance d between the mounting bracket 230 and the reflector 220, and the vertical axis represents the normalized current generated by the receiver 212. In Figure 2F, the horizontal axis represents the distance d between the mounting bracket 230 and the reflector 220, and the vertical axis represents the voltage generated by the receiver 212.

[0080] As shown in Figures 2E and 2F, when the distance d between the mounting bracket 230 and the reflector 220 gradually increases from 0 to 0.6 mm, the light-receiving surface of the reflector 220 illuminated by the light-emitting part 211 gradually increases, and the intensity of the light waves that can be received by the receiver 212 after reflection by the reflector 220 gradually increases. The resulting change in the electrical signal can include a gradual increase in the current generated by the receiver 212 from 0 to 1 mA, and a corresponding decrease in the voltage from 2.9 V to approximately 0.

[0081] When the distance between the mounting bracket 230 and the reflector 220 is between 0.6 and 0.8 mm, the intensity of the light wave that can be received by the receiver 212 reaches its maximum value, the current generated by the receiver 212 remains at 1 mA, and the corresponding voltage remains approximately 0.

[0082] As the distance between the mounting bracket 230 and the reflector 220 continues to increase from 0.8mm, the light-receiving surface of the reflector 220 gradually increases, resulting in an increase in the light waves lost through diffuse reflection. After reflection, the light waves that can be received by the receiver 212 gradually decrease, the intensity of the light waves received by the receiver 212 gradually decreases, the current generated by the receiver 212 gradually decreases to about 0, and the voltage gradually increases to about 2.9V.

[0083] To ensure the sensitivity of the optical sensor 200, the distance between the optical transceiver unit 210 and the reflector 220 needs to be controlled so that changes in the light wave more easily trigger changes in the electrical signal. Referring again to Figures 2E and 2F, when the distance is less than 0.6 mm (i.e., within the first distance range), the slope of the light wave intensity change curve is larger, indicating that changes in distance more easily trigger changes in the electrical signal, and the sensitivity of the optical sensor 200 is stronger. Therefore, in some embodiments, the distance between the optical transceiver unit 210 and the reflector 220 can be controlled within the first distance range. In this case, the intensity of the reflected light wave received by the receiving unit 212 can increase as the distance between the optical transceiver unit 210 and the reflector 220 increases.

[0084] In some embodiments, when the outer surface of the sidewall 110 is not pressed by the user, the distance between the optical transceiver unit 210 and the reflector 220 can be in the range of 0-600 μm. To reduce device size, preferably, the distance can be in the range of 0-500 μm; more preferably, the distance can be in the range of 0-400 μm; even more preferably, the distance can be in the range of 0-300 μm; even more preferably, the distance can be in the range of 0-200 μm. In some embodiments, when the outer surface of the sidewall 110 is not pressed by the user, the distance between the optical transceiver unit 210 and the reflector 220 can be in the range of 0-200 μm.

[0085] In this specification, the distance between the optical transceiver unit 210 and the reflector 220 when the outer surface of the sidewall is not pressed by the user can also be referred to as the initial distance. In some embodiments, the initial distance can be related to various factors. For example, it may be positively correlated with the intensity of the light wave emitted by the light-emitting unit 211, positively correlated with the reflectivity of the reflector 220, etc. As an example only, the initial distance can be determined based on the curve in FIG2E. Three-quarters of the distance corresponding to the maximum current can be determined as the initial distance. For example, when the distance between the optical transceiver unit 210 and the reflector 220 is 80 μm, the current generated by the receiver 212 is at its maximum value, and the initial distance can be 60 μm. As another example, half of the distance corresponding to the maximum current can be determined as the initial distance. For example, the initial distance can be 40 μm. In some embodiments, the initial distance can also be other values. For example, 0, 30 μm, 50 μm, 120 μm, 200 μm, or other values ​​exceeding 200 μm. The specific value can be preset according to actual needs.

[0086] In some embodiments, the light sensor 200 is connected to the inner surface of a sidewall 110 of the housing 100. The sidewall 110 refers to a structure on one side of the housing 100. By way of example only, when the housing 100 is the outer shell of an earphone, the sidewall 110 includes at least one of a structure on the side of the housing 100 that contacts the user's skin, a structure on the side away from the user's skin, etc. The inner surface refers to the surface of the sidewall 110 facing the interior of the housing 100. The light sensor 200 and the sidewall 110 can be connected in various ways, such as by bonding, snap-fitting, welding, etc.

[0087] In some embodiments, one surface of the light sensor 200 (hereinafter referred to as the connecting surface) may be connected to the inner surface of one side wall 110 of the housing 100. The connecting surface of the light sensor 200 may be the outer side of the mounting bracket 230 or the outer side of the reflector 220. The outer side of the mounting bracket 230 may be the outer side of the mounting bracket 230 without the first opening 2311 or the second opening 2321. The outer side of the reflector 220 may be the outer side without a reflective layer.

[0088] In some embodiments, the mounting bracket 230 and the reflector 220 can be connected to the side wall 110 of the housing 100, respectively. When one of the mounting bracket 230 and the reflector 220 is connected to the side wall 110 of the housing 100, the other of the mounting bracket 230 and the reflector 220 can be connected to the side wall 110 of the housing 100 via a support structure. The angle and / or spacing between the mounting bracket 230 and the reflector 220 can be controlled using the support structure. In some embodiments, the support structure can include various types, such as a support rod, a support column, a step provided on the side wall 110, etc. The support structure can be connected to the mounting bracket 230, the reflector 220, or the side wall 110 of the housing 100 in various ways, such as bonding, snap-fitting, welding, integral molding, etc.

[0089] Since the optical sensor 220 is connected to one of the side walls 110 of the housing 100, when the outer surface of the side wall 110 is pressed by the user, the deformation of the side wall 110 can change the distance between the optical transceiver unit 210 and the reflector 220, thereby causing a change in the electrical signal. The outer surface refers to the surface of the side wall 110 facing the outside of the housing.

[0090] As an example only, as shown in Figure 2A, the first opening 2311 and the second opening 2321 are located on the same side of the mounting bracket 230. The outer surface of the mounting bracket 230 opposite to the first opening 2311 is connected to the inner surface of the side wall 110 of the housing 100. The reflector 220 is located on the side of the mounting bracket 230 where the first opening 2311 and the second opening 2321 are located. When the user presses the position on the outer side of the side wall 110 corresponding to the mounting bracket 230, the side wall 110 deforms and can drive the mounting bracket 230 and the optical transceiver unit 210 to move synchronously along the direction in which the side wall 110 is pressed (e.g., the Z direction in Figure 2A), thereby changing the distance between the optical transceiver unit 210 and the reflector 220. When the distance between the optical transceiver unit 210 and the reflector 220 changes, the light wave emitted from the light-emitting part 211 changes its path after being reflected by the reflector 220, causing a change in the light wave that can be received by the receiving part 212, thereby causing a change in the electrical signal.

[0091] For example, the reflector 220 can be connected to the inner surface of one side wall 110 of the housing 100. The mounting bracket 230 can be connected to the inner surface of one side wall 110 of the housing 100 via a support structure. The first opening 2311 and the second opening 2321 are located on the side of the mounting bracket 230 facing the reflector 220. When the user presses the outer side of the housing 100 at the position corresponding to the reflector 220, the housing 100 deforms, which can cause the reflector 220 to move synchronously along the direction of the side wall 110 being pressed (e.g., the Z direction in FIG. 2A), thereby changing the distance between the optical transceiver unit 210 and the reflector 220.

[0092] In some embodiments, the reflective portion 220 can be arc-shaped. Deformation of the housing 100 can cause the reflective portion 220 to change its curvature, for example, changing the size of the curvature, or changing it from an arc shape to a near-planar shape. In this way, the user's press can also change the path of the reflected light waves, causing a change in the light waves that can be received by the receiving portion 212, thereby causing a change in the electrical signal.

[0093] In some embodiments, the mounting bracket 230 may also employ other structures. By way of example only, the mounting bracket 230 includes a first bracket and a second bracket. The first bracket and the second bracket are spaced apart and disposed on the same inner side surface of the housing 100. The first bracket forms a first mounting space 231, and the second bracket forms a second mounting space 232. The first bracket has a first opening 2311, and the second bracket has a second opening 2321. The first opening 2311 is located on the side of the first bracket facing the reflective portion 220, and the second opening 2321 is located on the side of the second bracket facing the reflective portion 220.

[0094] In some embodiments, the first bracket and the second bracket are disposed on two opposite inner sides of the housing 100. In this case, the first opening 2311 is located on the side of the first bracket facing the second bracket, and the second opening 2321 is located on the side of the second bracket facing the first bracket. The light waves emitted by the light-emitting part 211 are emitted directly to the receiving part 212 without reflection, meaning the reflector 220 can be omitted. Pressing one of the outer sides of the housing 100, or squeezing the two opposite outer sides of the housing 100, can change the distance between the two first brackets and the second bracket, thereby changing the distance between the light-emitting part 211 and the receiving part 212, and consequently changing the light waves received by the receiving part 212, thus causing a change in the electrical signal.

[0095] Referring again to Figure 2A, in some embodiments, the thickness of the connection region 111 on the sidewall 110 connected to the optical sensor 200 is less than the thickness of the unconnected region 112.

[0096] The connection area 111 refers to a certain area on the sidewall 110 that is connected to the light sensor 200. In some embodiments, the coverage area of ​​the connection area 111 is greater than or equal to the projection area of ​​the light sensor 200 on the sidewall 110. In some embodiments, the connection area 111 is a plane to facilitate the positioning and connection of the light sensor 200. In some embodiments, the connection area 111 is the part of the sidewall 110 that is pressed when used by the user. The unconnected area 112 refers to the area on the sidewall 110 that is not connected to the light sensor 200. In some embodiments, the unconnected area 112 surrounds the connection area 111 circumferentially.

[0097] The thickness of the connected region 111 may be equal or unequal at different locations. The thickness of the unconnected region 112 may be equal or unequal at different locations. When the thickness of the connected region 111 and / or the unconnected region 112 varies at different locations, the thicknesses of the two can be compared based on thickness parameters such as average thickness, minimum thickness, and maximum thickness. For example, the thickness of the connected region 111 being less than the thickness of the unconnected region 112 can mean that the average thickness of the connected region 111 is less than the average thickness of the unconnected region 112. For more information on the thickness of the connected region 111 being less than the thickness of the unconnected region 112, please refer to the relevant descriptions in Figures 3A-5.

[0098] In some embodiments, the thickness of the connected region 111 is greater than the thickness of the unconnected region 112. For example, the thickness of the connected region 111 being greater than the thickness of the unconnected region 112 may mean that the average thickness of the connected region 111 is greater than the average thickness of the unconnected region 112. For more information regarding the thickness of the connected region 111 being greater than the thickness of the unconnected region 112, please refer to the relevant descriptions in Figures 6A-6E.

[0099] In some embodiments, the production personnel use various methods to make the thickness of the connecting region 111 less than the thickness of the unconnected region 112. For example, machining (cutting, grinding, etc.) the inner and / or outer surfaces of the side of the housing 100 makes the thickness of the connecting region 111 less than the thickness of the unconnected region 112. Another example is using mold casting to make the thickness of the connecting region 111 less than the thickness of the unconnected region 112.

[0100] In some embodiments, the outer surface of the connecting region 111 is formed with a concave arc surface, thereby reducing the thickness of the connecting region 111 so that the thickness of the connecting region 111 is less than the thickness of the unconnected region 112. Furthermore, the concave arc surface allows the user to quickly locate the suitable connecting region 111 on the housing 100 for pressing, facilitating the user's input of operation commands.

[0101] In some embodiments, a positioning structure is provided on the outer surface of the connection area 111. When the positioning structure comes into contact with the user's finger, it can provide the user with different tactile feedback. For example, the positioning structure includes multiple raised dots, anti-slip patterns, rough surfaces, frosted surfaces, etc.

[0102] By setting the thickness of the connecting area to be less than that of the unconnected area, the connecting area is more easily deformed when pressed by the user, thereby changing the distance between the optical transceiver unit and the reflector, and thus causing a change in the electrical signal. This design can improve the sensitivity of the optical sensor, thereby improving the user's control precision over the acoustic device. On the other hand, setting the thickness of the unconnected area to be greater than that of the connecting area can ensure the overall strength of the housing.

[0103] In some embodiments, a stepped structure is formed between the connection region 111 on the sidewall 110 connected to the photosensor 200 and the surrounding unconnected region 112. A stepped structure refers to a structure formed by at least two surfaces with a height difference. For example, there is a height difference between a first height of the inner surface of the connection region 111 relative to the outer surface of the housing 100 and a second height of the unconnected region 112 relative to the outer surface of the housing 100. The first height can be understood as the thickness of the connection region 111, and the second height can be understood as the thickness of the unconnected region 112. The first height is smaller than the second height, thereby making the thickness of the connection region 111 smaller than the thickness of the unconnected region 112.

[0104] In some embodiments, the corners of the stepped structure can be rounded to avoid stress concentration. In some embodiments, at least a portion of the stepped structure can be adapted to the outer surface of the light sensor 200, allowing at least a portion of the stepped structure to engage with the light sensor 200. For example, the surface of the stepped structure in the height difference direction (e.g., the Z direction in FIG. 2A) can be adapted to the outer surface of the light sensor 200, allowing at least a portion of the outer surface of the light sensor 200 to engage with the surface of the stepped structure in the height difference direction, thereby improving the positioning accuracy of the light sensor 200. In some embodiments, the surface of the stepped structure in the height difference direction can be perpendicular to the inner surface of the unconnected region 112.

[0105] By employing a stepped structure, the thickness of the connecting area can be made smaller than the thickness of the unconnected area, and the connecting area can be formed to be concave relative to the inner surface of the housing. When connecting the light sensor to the housing, the connecting area can be used to position the light sensor, thereby improving the positioning accuracy of the light sensor.

[0106] In some embodiments, the material of the connecting region 111 is different from the material of the unconnected region 112. By way of example only, the unconnected region 112 is made of at least one material such as metal or plastic. The connecting region 111 is made of at least one material such as plastic, rubber, or silicone. In some embodiments, the hardness of the material of the connecting region 111 is less than the hardness of the material of the unconnected region 112.

[0107] In some embodiments, the elasticity of the material in the connected region 111 is greater than that of the material in the unconnected region 112. In some embodiments, the Mohs hardness of the material in the connected region 111 may be less than that of the material in the unconnected region 112. Mohs hardness is a physical quantity used to describe the ability of a solid material and / or structure to resist deformation. The lower the Mohs hardness, the easier it is for the solid material and / or structure to deform under external force.

[0108] Using different materials for the connected and unconnected areas makes the connected area more sensitive to pressure compared to the unconnected area. When the connected area is pressed, it deforms more easily, causing a change in the electrical signal. This design avoids erroneous changes in the electrical signal caused by pressing the unconnected area, thus preventing accidental contact.

[0109] As described above, when a user presses the housing 100 (e.g., the connecting area 111), the electrical signal detected by the light sensor 200 changes. Furthermore, when the user presses the housing with different force, frequency, and duration, the distance between the optical transceiver unit 210 and the reflector 220 changes differently, leading to different changes in the electrical signal generated by the light sensor 220. Based on this characteristic, the housing 100 and the light sensor 200 can be used together as a control structure for an acoustic device. For example, the changes in the electrical signal generated by the light sensor 220 can be analyzed to identify the user's operation type on the housing 100 (e.g., single click, double click, long press, swipe, etc.), thereby determining the corresponding control command to control the acoustic device. Further description of using the housing 100 and the light sensor 200 to control the acoustic device can be found in Figures 10-11.

[0110] In some embodiments of the acoustic device provided in this specification, control of the acoustic device is achieved by setting a light sensor on the inner surface of the housing. Compared to dome switches, light sensors do not generate fatigue stress and have a longer service life. By controlling the structure and materials of the housing (e.g., reducing the thickness of the connecting area, making the Mohs hardness of the connecting area lower than that of the unconnected area, etc.), the sensitivity of the light sensor can be improved, the pressing force required to cause changes in the electrical signal can be reduced, and the user experience can be enhanced.

[0111] Figure 3A is a partial structural schematic diagram of the acoustic device 10B according to some embodiments of this specification. The acoustic device 10B is similar to the acoustic device 10A shown in Figure 2A, except that the mounting positions of the optical transceiver unit 210 and the reflector 220 are different.

[0112] As shown in FIG3A, the reflective portion 220 is located between the inner surface of the sidewall 110 and the optical transceiver unit 210, with the optical transceiver unit 210 located on the side of the reflective portion 220 facing away from the connection region 111. In some embodiments, the side of the reflective portion 220 facing away from the connection region 111 and the side of the reflective portion 220 near the connection region 111 are two opposing sides. In some embodiments, when the reflective portion 220 includes a reflective layer, the reflective layer is disposed on the side of the reflective portion 220 facing away from the connection region 111.

[0113] In some embodiments, when the optical transceiver unit 210 is disposed within the mounting bracket 230, the mounting bracket 230 is located on the side of the reflective portion 220 away from the connection area 111. In some embodiments, the first opening 2311 and the second opening 2321 on the mounting bracket 230 are on the side of the mounting bracket 230 facing the reflective portion 220.

[0114] Since the reflector 220 is connected to the connection area 111, when the outer surface of the housing 100 corresponding to the connection area 111 is pressed, the connection area 111 deforms, causing the reflector 220 to deform, which in turn causes the distance between the reflector 220 and the optical transceiver unit 210 to change, thereby causing the electrical signal to change.

[0115] In some embodiments, at least a portion of the outer surface of the reflective portion 220 is adapted to the connecting region 111. In some embodiments, the reflective portion 220 and the connecting region 111 can be connected in various ways, such as by bonding, snap-fitting, welding, etc. Connecting the reflective portion 220 to the connecting region 111 can improve the sensitivity of the reflective portion 220, making it easier to induce changes in electrical signals when the connecting region 111 is pressed.

[0116] In some embodiments, as shown in FIG3A, the optical sensor 200 includes a cantilever structure 300 disposed opposite to the reflector 220, and an optical transceiver unit 210 is fixed on the cantilever structure 300 and spaced apart from the fixed end 320 of the cantilever structure 300 by a distance.

[0117] The cantilever structure 300 can serve as a support base to support the optical transceiver unit 210 and / or the mounting bracket 230. In some embodiments, the cantilever structure 300 protrudes from the inner surface of the sidewall 110 toward the interior of the housing 100.

[0118] In some embodiments, the cantilever structure 300 includes a support end 310 and a fixed end 320. The support end 310 is connected to the fixed end 320. The support end 310 can be used to connect to the optical transceiver unit 210 and / or the mounting bracket 230, and provide support for the optical transceiver unit 210 and / or the mounting bracket 230. The fixed end 320 is used to connect the housing 100 and the support end 310. In some embodiments, the support end 310 and the fixed end 320 are integrally formed. In some embodiments, the support end 310 and the fixed end 320 are detachably connected by means of snap-fit, threaded connection, etc. In some embodiments, the support end 310 and the fixed end 320 are fixedly connected by means of bonding, snap-fit, welding, etc. In some embodiments, the fixed end 320 is connected to the inner surface of the housing 100 by means of bonding, snap-fit, welding, etc.

[0119] In some embodiments, the fixed end 320 is cylindrical, prismatic, or similar in shape. In some embodiments, the support end 310 is elongated, plate-shaped, or similar in shape. In some embodiments, the surface of the support end 310 that connects to the optical transceiver unit 210 and / or the mounting bracket 230 is a plane to facilitate the installation of the optical transceiver unit 210 and / or the mounting bracket 230. In some embodiments, there is a certain angle between the fixed end 320 and the support end 310. By way of example only, the angle between the fixed end 320 and the support end 310 is 90°.

[0120] In some embodiments, when the housing 100 is not pressed, the cantilever structure 300 is used to control the initial distance between the optical transceiver unit 210 and the reflector 220.

[0121] In some embodiments, the connection between the fixed end 320 and the housing 100 is located within the unconnected area 112. As an example only, when the connection area 111 on the housing 100 is pressed, the connection area 111 deforms, while the unconnected area 112 does not deform. The positions of the cantilever structure 300 and the optical transceiver unit 210 and / or mounting bracket 230 do not change. The deformation of the housing 100 causes the reflector 220 to shift and move closer to the optical transceiver unit 210 and / or mounting bracket 230, thereby causing a change in the electrical signal.

[0122] In some embodiments, the connection between the fixed end 320 and the housing 100 is located within the connection region 111. As an example only, when the connection region 111 is pressed, it deforms, causing displacement of the reflector 220. Simultaneously, the deformation of the connection region 111 causes the cantilever structure 300 to move. For instance, the cantilever structure 300 rotates about the connection between the fixed end 320 and the housing 100 toward the inner surface of the sidewall 110, thereby changing the distance between the reflector 220 and the optical transceiver unit 210 and / or the mounting bracket 230, thus causing a change in the electrical signal. When the housing 100 deforms, the cantilever structure 300 can amplify the effect of the housing 100 deformation on the distance between the reflector 220 and the optical transceiver unit 210 and / or the mounting bracket 230, thereby amplifying the change in the electrical signal and improving the sensitivity of the optical sensor 200.

[0123] In some embodiments, the optical transceiver unit 210 is spaced apart from the fixed end 320 of the cantilever structure 300 by a distance, which can move the optical transceiver unit 210 away from the connection between the fixed end 320 and the housing 100. When the cantilever structure 300 rotates, the positional change of the optical transceiver unit 210 can be amplified, thereby amplifying the change of the electrical signal.

[0124] Figure 3B is a partial structural schematic diagram of the acoustic device 10C according to some embodiments of this specification.

[0125] As shown in Figure 3B, one end of the reflective portion 220 is connected to a first connecting portion 330 and a second connecting portion 400. The first connecting portion 330 is connected to the second connecting portion 400 and provides support for at least a portion of the second connecting portion 400. The second connecting portion 400 is connected between the first connecting portion 330 and the support end 310 and provides support for at least a portion of the support end 310. In some embodiments, the first connecting portion 330 and the fixed end 320 may be located on opposite sides of the reflective portion 220.

[0126] The first connecting portion 330 protrudes from the inner surface of the side wall 110, facing the interior of the housing 100. In some embodiments, the first connecting portion 330 and the reflective portion 220 are integrally formed or separate structures. In some embodiments, the first connecting portion 330 is connected to the reflective portion 220 and / or the housing 100 by various methods such as bonding, snap-fitting, or welding. In some embodiments, the structure of the first connecting portion 330 is similar to that of the fixed end 320. For more information about the first connecting portion 330, please refer to the previous description of the fixed end 320.

[0127] In some embodiments, the second connecting portion 400 has a layered or plate-like structure. In some embodiments, the second connecting portion 400 is made of an elastic or flexible material, such as silicone or rubber. In some embodiments, the second connecting portion 400 is connected to the first connecting portion 330 and the support end 310 by various methods such as bonding or snap-fitting. In some embodiments, the second connecting portion 400 itself is adhesive and is bonded to both the first connecting portion 330 and the support end 310.

[0128] In some embodiments, a gap is left between the first connecting portion 330 and the supporting end 310. The first connecting portion 330, the supporting end 310, the fixed end 320, and the reflective portion 220 are arranged in a ring. The second connecting portion 400 is connected between the first connecting portion 330 and the supporting end 310, and can be used to restrict the degree of freedom of the supporting end 310 to prevent the supporting end 310 from deforming under the action of gravity and affecting the accuracy of the optical sensor 200.

[0129] When the housing 100 is pressed and deformed, the first connecting part 330 moves synchronously with the housing 100, and the gap between the first connecting part 330 and the support end 310 will not interfere with the movement of the first connecting part 330. The second connecting part 400 undergoes elastic deformation when the first connecting part 330 moves, thus avoiding interference between the second connecting part 400 and the movement of the first connecting part 330.

[0130] Figure 4 is a partial structural schematic diagram of the acoustic device 10D according to some embodiments of this specification.

[0131] As shown in Figure 4, the coverage area of ​​the reflective part 220 is larger than the area of ​​the connecting region 111, and the portion of the reflective part 220 that extends beyond the connecting region 111 is connected to the inner surface of the housing 100 by at least one pad 500.

[0132] The pad 500 refers to the layered structure located between the reflective part 220 and the unconnected area 112. The pad 500 can create a gap between the reflective part 220 and the connecting area 111. When the connecting area 111 is pressed and deformed, due to the gap between the reflective part 220 and the connecting area 111, the corresponding parts of the reflective part 220 and the connecting area 111 are more likely to deform, causing changes in the electrical signal.

[0133] In some embodiments, when there is one padding layer 500, the padding layer 500 can be located at any position around the circumference of the connecting region 111. When there are two padding layers 500, the padding layers 500 can be located on opposite sides of the connecting region 111. When there are three or more padding layers 500, the padding layers 500 can be arranged circumferentially around the connecting region 111. In some embodiments, the padding layer 500 is also a ring structure, surrounding the periphery of the connecting region 111.

[0134] In some embodiments, the pad 500 is made of an elastic or flexible material, such as rubber or silicone. In some embodiments, the pad 500 is connected to the reflective part 220 and the housing 100 by various methods such as bonding, snap-fitting, or welding. In some embodiments, the pad 500 is an adhesive structure. For example, the pad 500 is made of an adhesive material, including epoxy resin, phenolic resin, urea-formaldehyde resin, and neoprene rubber.

[0135] Figure 5 is a partial structural schematic diagram of the acoustic device 10E according to some embodiments of this specification.

[0136] As shown in Figure 5, a groove structure 221 is formed on the area of ​​the reflective portion 220 facing the optical transceiver unit 210 relative to the surrounding area, with the bottom of the groove structure 221 being closer to the optical transceiver unit 210. The groove structure 221 allows the surface of the reflective portion 220 to form a height difference in the direction in which the housing 100 is pressed (e.g., the Z direction in Figure 4), thereby increasing the elasticity of the reflective portion 220. When the housing 100 is pressed, the groove structure 221 can amplify the deformation of the reflective portion 220, which is beneficial for improving the sensitivity of the optical sensor 200.

[0137] In some embodiments, the groove structure 221 has various shapes, such as trapezoidal or arc-shaped. In some embodiments, the groove structure 221 is formed in various ways, such as stamping a plate structure, bending a plate structure, or integrally forming it using a mold. In some embodiments, the corners of the groove structure 221 are rounded to avoid stress concentration and prevent the reflective part 220 from deforming or breaking due to stress concentration.

[0138] Figure 6A is a partial structural schematic diagram of the acoustic device 10F according to some embodiments of this specification. Figure 6B is a structural schematic diagram of the sidewall of the acoustic device according to some embodiments of this specification.

[0139] As shown in Figure 6A, the thickness of the connecting region 111 on the sidewall 110 can be greater than the thickness of the unconnected region 112. In some embodiments, the unconnected region 112 is arranged circumferentially around the connecting region 111.

[0140] In some embodiments, the projection of the connecting region 111 onto the sidewall 110 can be of any shape. Referring to FIG. 6B, the projection of the connecting region 111 onto the sidewall 110 is circular. The connecting region 111 can be located at any position on the sidewall 110. For example, the connecting region 111 can be located at the center of the sidewall 110. For more information about the connecting region 111 and the unconnected region 112, please refer to the relevant description in FIG. 2A.

[0141] In some embodiments, the production personnel use various methods to make the thickness of the connecting region 111 greater than the thickness of the unconnected region 112. For example, machining (cutting, grinding, etc.) the inner and / or outer surfaces of the side of the housing 100 makes the thickness of the connecting region 111 greater than the thickness of the unconnected region 112. Another example is using mold casting to make the thickness of the connecting region 111 greater than the thickness of the unconnected region 112.

[0142] By setting the thickness of the connecting area to be greater than that of the unconnected area, it is easier for the unconnected area to deform when the user presses on the connecting area. Since the unconnected area surrounds the connecting area circumferentially, deformation of the unconnected area causes displacement of the entire connecting area, thereby changing the distance between the optical transceiver unit and the reflector, and thus inducing a change in the electrical signal. This design improves the sensitivity of the optical sensor, thereby enhancing the user's control precision over the acoustic device. On the other hand, setting the thickness of the unconnected area to be less than that of the connecting area further improves the deformability of the sidewalls, thereby increasing the sensitivity of the optical sensor.

[0143] In some embodiments, referring to Figures 6C-6E, at least one reinforcing structure 113 may be provided on the sidewall 110.

[0144] The reinforcing structure 113 is used to increase the strength of the unconnected area 112, preventing damage to the unconnected area 112 when the connected area 111 or the unconnected area 112 is pressed. In some embodiments, the reinforcing structure 113 protrudes from the inner surface of the unconnected area 112 and is disposed towards the interior of the housing 100. In some embodiments, the reinforcing structure 113 may include at least one of a plate-like structure, a strip-like structure, a rod-like structure, etc.

[0145] In some embodiments, at least a portion of the reinforcing structure 113 is connected to the unconnected area 112 in a variety of ways, such as bonding, snap-fitting, or integral molding. In some embodiments, both ends of the reinforcing structure 113 may be connected to the connecting area 111 and the second sidewall 120 in a variety of ways, such as bonding, snap-fitting, or integral molding.

[0146] In some embodiments, the production personnel integrally form the reinforcing structure 113 onto the unconnected area 112 using various methods. For example, the inner and / or outer surfaces of the sidewall 110 of the housing 100 are machined (cut, grind, etc.) to form the reinforcing structure 113 onto the unconnected area 112. Another example is the use of mold casting to form the reinforcing structure 113 onto the unconnected area 112.

[0147] For illustrative purposes, Figures 6C-6E show different reinforcing structures on the sidewall 110.

[0148] Referring to Figure 6C, the reinforcing structure 113 is an elongated strip structure, which can be connected between one of the second sidewalls 120 of the housing 100 and the connecting region 111. The reinforcing structure 113 can be used to increase the local strength of the unconnected region 112.

[0149] Referring to Figure 6D, the reinforcing structure 113 is an elongated strip structure, and multiple reinforcing structures 113 can be provided, distributed around the circumference of the connecting region 111. In some embodiments, the number of reinforcing structures 113 can be the same as the number of second sidewalls 120. Each reinforcing structure 113 is connected to one second sidewall 120. By using multiple reinforcing structures 113, the coverage area of ​​the reinforcing structures 113 can be increased, thereby reinforcing different parts of the unconnected region 112, which is beneficial to improving the overall strength of the unconnected region 112.

[0150] Referring to Figure 6E, the reinforcing structure 113 is a curved elongated structure. Setting the reinforcing structure 113 as a curved elongated structure increases its coverage area, thereby further improving its reinforcing effect. In some embodiments, multiple curved reinforcing structures 113 can be provided, and these multiple curved reinforcing structures 113 can be distributed in a ring around the circumference of the connecting region 111. This further improves the overall strength of the unconnected region 112.

[0151] Figure 7 is a partial structural schematic diagram of the acoustic device 10G according to some embodiments of this specification.

[0152] As shown in Figure 7, the connecting region 111 and the unconnected region 112 on the side wall 110 of the housing 100, which are connected to the reflector 220, are a non-integrated splicing structure. The splicing structure refers to a structure where the connecting region 111 and the unconnected region 112 are relatively movable. As an example only, the connecting region 111 can slide relative to the unconnected region 112 along the direction in which the housing 100 is pressed (e.g., the Z direction in Figure 4). When the connecting region 111 slides relative to the unconnected region 112, the connecting region 111 causes the reflector 220 to move synchronously, thereby changing the distance between the reflector 220 and the optical transceiver unit 210, thus causing a change in the electrical signal.

[0153] In some embodiments, the outer surface of the connecting region 111 in the circumferential direction (e.g., the circumferential direction surrounding the Z direction in FIG4) is adapted to the inner surface of the unconnected region 112 in the circumferential direction, such that the connecting region 111 and the unconnected region 112 slide relative to each other. In some embodiments, the connecting region 111 and the unconnected region 112 are engaged in various ways, such as clearance fit, transition fit, etc.

[0154] In some embodiments, a button is attached to the outer surface of the connection area 111. The user presses the button to move the connection area 111 synchronously. In some embodiments, the connection area 111 is pressed by the user as a button.

[0155] In some embodiments, the connecting region 111 is connected to a reset structure. After the connecting region 111 is pressed by a user, the reset structure can elastically deform. After the user stops pressing the connecting region 111, the reset structure can recover under the elastic force, moving the connecting region 111 back to its initial position. In some embodiments, the reset structure includes a spring. One end of the spring is connected to the connecting region 111, and the other end of the spring is connected to the unconnected region 111, the cantilever structure 300, etc.

[0156] In some embodiments, the connecting region 111 and the unconnected region 112 can also be connected in other ways. For example, the connecting region 111 is slidably connected to the unconnected region 112 along a direction perpendicular to the direction in which the housing 100 is pressed (e.g., the Z direction in FIG. 4), and the reflector 220 forms a certain angle with the optical transceiver unit 210 and / or the mounting bracket 230 (e.g., the reflector 220 is obliquely mounted on the connecting region 111). For example, the side of the reflector 220 facing the optical transceiver unit 210 forms an acute angle with the side of the optical transceiver unit 210 and / or the mounting bracket 230 facing the reflector 220. When the user slides the connecting region 111, the connecting region 111 drives the reflector 220 to move synchronously. The relative angle between the reflector 220 and the optical transceiver unit 210 and / or the mounting bracket 230 does not change, but the position of the light wave illuminating the reflector 220 changes, causing a change in the light wave path, which can also cause a change in the electrical signal.

[0157] In some embodiments, the connecting region 111 is connected to a limiting structure. The limiting structure restricts at least one relative position between the connecting region 111 and the unconnected region 112. When the user slides the connecting region 111 to a preset position, the limiting structure restricts the relative position between the connecting region 111 and the unconnected region 112. In some embodiments, the limiting structure includes various structures such as a latch or a damping structure.

[0158] Figure 8 is a partial structural schematic diagram of the acoustic device 10H according to some embodiments of this specification.

[0159] In some embodiments, as shown in FIG8, the optical transceiver unit 210 may be located between the inner surface of the sidewall 110 and the reflective portion 220. Specifically, the optical transceiver unit 210 is disposed within the mounting bracket 230, which is located between the inner surface of the sidewall 110 and the reflective portion 220. For more information about the optical transceiver unit 210 and the reflective portion 220, please refer to the relevant descriptions above.

[0160] In some embodiments, the mounting bracket 230 and / or the optical transceiver unit 210 may be connected to the connection area 111. When the outer surface of the housing 100 corresponding to the connection area 111 is pressed, the deformation of the connection area 111 can cause the mounting bracket 230 and / or the optical transceiver unit 210 to move, causing a change in the distance between the reflector 220 and the optical transceiver unit 210, thereby causing a change in the electrical signal.

[0161] Referring again to Figure 8, the optical sensor 200 includes a cantilever structure 300 disposed opposite to the optical transceiver unit 210. A reflector 220 is fixed to the cantilever structure 300 and spaced apart from the fixed end of the cantilever structure 300. The cantilever structure 300 serves as a supporting base for the reflector 220. For more information on the cantilever structure 300, please refer to the relevant description in Figure 3A.

[0162] In some embodiments, the cantilever structure 300 includes a support end 310 and a fixed end 320. The support end 310 is connected to the fixed end 320. The support end 310 can be used to support the reflective portion 220. In some embodiments, the support end 310 and the reflective portion 220 are integrally formed. In some embodiments, a reflective layer is provided on the surface of the support end 310 facing the mounting bracket 230 and / or the optical transceiver unit 210 to form the reflective portion 220. The fixed end 320 is connected between the housing 100 and the support end 310. For more details about the reflective layer, please refer to the relevant description in FIG2A. For more details about the support end 310 and the fixed end 320, please refer to the relevant description in FIG3A.

[0163] In some embodiments, as shown in FIG8, a first connecting portion 330 and a second connecting portion 400 are provided on the housing 100. The first connecting portion 330 is connected to the second connecting portion 400 and provides support for at least a portion of the second connecting portion 400. The second connecting portion 400 is connected between the first connecting portion 330 and the support end 310 and provides support for at least a portion of the support end 310.

[0164] In some embodiments, the first connecting portion 330 and the fixed end 320 are located on opposite sides of the mounting bracket 230 and / or the optical transceiver unit 210. In some embodiments, the first connecting portion 330 is L-shaped, and at least a portion of the first connecting portion 330 is connected to the connection area 111 of the housing 100. The mounting bracket 230 and / or the optical transceiver unit 210 are disposed on the surface of the first connecting portion 330 facing the reflective portion 220.

[0165] In some embodiments, the second connecting portion 400 is connected between the first connecting portion 330 and the support end 310. The second connecting portion 400 can restrict the degrees of freedom of the support end 310 and provide support to the support end 310, preventing deformation of the support end 310 under gravity and thus affecting the accuracy of the optical sensor 200. For more details regarding the first connecting portion 330 and the second connecting portion 400, please refer to the relevant description in Figure 3B.

[0166] Figure 9 is a partial structural schematic diagram of the acoustic device 10I according to some embodiments of this specification.

[0167] As shown in Figure 9, the cantilever structure 300 is connected to other areas 600 on the sidewall 110. The connection between these other areas 600 and the connection area on the sidewall 110 that connects to the optical transceiver unit 210 is a non-integrated spliced ​​structure. In some embodiments, the cantilever structure 300 and other areas 600 can be connected in various ways. For example, they can be connected by a connecting rod, which is a rod-shaped structure and can be parallel to the fixed end 320 of the cantilever structure 300. Alternatively, the other areas 600 themselves can be columnar structures. The other areas 600 and the cantilever structure 300 can be connected by one of the following methods: bonding, snap-fitting, or integral molding. By providing other areas 600, a button structure can be formed on the housing as needed. For example, the other areas 600 can be used as buttons, or buttons can be provided on the outer surface of the other areas 600 to meet application scenarios requiring buttons.

[0168] Other regions 600 may be movable relative to the connecting region. For example, other regions 600 may move relative to the connecting region along the direction in which the housing 100 is pressed (e.g., the Z direction in FIG9).

[0169] In some embodiments, the other region 600 is connected to the support end 310 of the cantilever structure 300. In some embodiments, the other region 600 and the fixed end 320 are located on opposite sides of the support end 310 of the cantilever structure 300. In some embodiments, the reflective portion 220 is located between the other region 600 and the fixed end 320.

[0170] In some embodiments, at least a portion of the other region 600 protrudes relative to the housing 100. By pressing the other region 600, the user moves the support end 310, thereby changing the distance between the reflector 220 and the optical transceiver unit 210, thus causing a change in the electrical signal. Making at least a portion of the other region 600 protrude relative to the housing 100 creates a step between the other region 600 and the outer surface of the housing 100, facilitating quick identification of the other region 600's position when a finger touches the housing 100. In some embodiments, to facilitate pressing the other region 600, the other region 600 is configured as a button, or a button is provided on the other region 600.

[0171] In some embodiments, the support end 310 is elastic. For example, the support end 310 is made of an elastic material. Elastic materials include rubber, silicone, plastic, etc. In some embodiments, the support end 310 is elastically connected to the fixed end 320. For example, the support end 310 and the fixed end 320 are connected by an elastic structure, an elastic material, etc. The elastic structure includes a spring, an elastic pad, etc. By making the support end 310 elastic or by making the support end 310 and the fixed end 320 elastically connected, the sensitivity of other areas 600 to pressure and the sensitivity of the support end 310 to pressing can be improved. When the user stops pressing other areas 600, the other areas 600 can automatically reset under the elastic action, enhancing the user experience.

[0172] Figure 10 is a structural schematic diagram of the housing of the acoustic device 10J according to some embodiments of this specification.

[0173] As shown in Figure 10, the housing 100 includes a sidewall 110 and at least one second sidewall 120 connected to the sidewall 110. In some embodiments, the second sidewall 120 may form an angle with the sidewall 110. For example, the angle between the second sidewall 120 and the sidewall 110 may be 90° or other values. In some embodiments, the second sidewall 120 and the sidewall 110 may be transitioned by a rounded corner.

[0174] In some embodiments, a user triggers a change in electrical signal in the light sensor 200 by pressing the second sidewall 120. In some embodiments, the direction in which the user presses the second sidewall 120 may be different from the direction in which the user presses the sidewall 110. For example, the direction in which the user presses the second sidewall 120 may be perpendicular to the direction in which the user presses the sidewall 110 (e.g., the Z direction in FIG. 10). In some embodiments, a user may press two opposing second sidewalls 120 simultaneously.

[0175] In some embodiments, the change in distance between the optical transceiver unit 210 and the reflective portion 220 when the user presses the second sidewall 120 may differ from the change in distance between the optical transceiver unit 210 and the reflective portion 220 when the user presses the sidewall 110. In some embodiments, the trend of distance change between the optical transceiver unit 210 and the reflective portion 220 when the user presses the second sidewall 120 is opposite to the trend of distance change between the optical transceiver unit 210 and the reflective portion 220 when the user presses the second sidewall 120.

[0176] In some embodiments, when the outer surface of at least one second sidewall 120 is pressed by a user, the deformation of the second sidewall 120 causes a second change in the electrical signal, the trend of which is opposite to the trend of the electrical signal caused by the user pressing the sidewall 110. In some embodiments, by pressing the second sidewall 120, the user can increase the distance between the optical transceiver unit 210 and the reflector 220, thereby reducing the current generated by the optical transceiver unit 210 after receiving the light wave reflected by the reflector 220. As an example only, as shown in FIG10, the direction in which the second sidewall 120 is pressed (e.g., the Y direction in FIG9) is perpendicular to the direction in which the sidewall 110 is pressed (e.g., the Z direction in FIG9). Under the action of the pressing force, the second sidewall 120 moves toward the interior of the housing 100, and at the same time, the second sidewall 120 transmits the pressure to the sidewall 110. When the second sidewall 120 and the sidewall 110 are rounded, the pressure transmitted from the second sidewall 120 to the sidewall 110 has a certain angle with the sidewall 110. The component of this pressure in the direction in which the sidewall 110 is pressed can drive the sidewall 110 to move toward the outside of the housing 100, thereby increasing the distance between the optical transceiver unit 210 and the reflector 220.

[0177] As an example only, the optical sensor 200 exhibits good sensitivity when the distance between the optical transceiver unit 210 and the reflector 220 is between 20 and 120 μm. At a distance of 120 μm, the current generated by the optical transceiver unit 210 after receiving the light wave reflected by the reflector 220 reaches its maximum value. The initial distance between the optical transceiver unit 210 and the reflector 220 can be set to 70 μm. Pressing the side wall 110 reduces the distance between the optical transceiver unit 210 and the reflector 220 from 70 μm to 20 μm, during which the current generated by the optical transceiver unit 210 after receiving the light wave reflected by the reflector 220 gradually increases. Pressing the second side wall 120 increases the distance between the optical transceiver unit 210 and the reflector 220 from 70 μm to 120 μm, during which the current generated by the optical transceiver unit 210 after receiving the light wave reflected by the reflector 220 gradually decreases.

[0178] By utilizing the changing trends of different electrical signals, different control effects can be achieved, allowing users to press different side walls. Acoustic devices can then perform various functions, enhancing the user experience.

[0179] Figure 11 is a partial structural schematic diagram of the acoustic device 10K according to some embodiments of this specification. Figure 12 is a graph showing the voltage variation with the magnitude of user pressure according to some embodiments of this specification.

[0180] As shown in Figure 11, the acoustic device 10 may include a housing 100, a speaker 700, a light sensor 200, and a processing circuit 800.

[0181] The processing circuit 800 is electrically connected to the light sensor 200. When the user presses the side wall 110, the electrical signal of the light sensor 200 changes. The electrical signal of the light sensor 200 is transmitted to the processing circuit 800, which processes the electrical signal and implements the corresponding control function.

[0182] As an example only, when the acoustic device is headphones, the light sensor 200 is located inside the side wall 110 of the headphones. When the user presses the side wall 110 of the headphones once, the light sensor 200 generates a corresponding electrical signal and transmits it to the processing circuit 800. The processing circuit 800 processes the electrical signal and executes the pause function. When the user presses the side wall 110 of the headphones twice consecutively, the light sensor 200 generates a corresponding electrical signal and transmits it to the processing circuit 800. The processing circuit 800 processes the electrical signal and executes the play function.

[0183] In some embodiments, different pressing operations by the user on the side wall 110 can cause different electrical signal changes in the light sensor 200, thus enabling the light sensor 200 to generate different electrical signals. Based on the different electrical signals, the processing circuit 800 can perform different control functions.

[0184] As shown in Figure 12, the horizontal axis represents time, and the vertical axis represents the voltage generated by the optical sensor 200. For illustrative purposes only, in the AB interval, the force applied by the user to the side wall 110 gradually increases over time, the distance between the optical transceiver unit 210 and the reflector 220 gradually decreases, and the voltage generated by the optical sensor 200 gradually increases. In the BC interval, the user continuously presses the side wall 110 with the same force, the distance between the optical transceiver unit 210 and the reflector 220 remains constant, and the voltage generated by the optical sensor 200 remains constant. In the DE interval, the user presses the side wall 110 multiple times, the distance between the optical transceiver unit 210 and the reflector 220 changes periodically, and the frequency of the distance change is the same as the frequency of the user's pressing of the side wall 110. The force applied during each press is approximately the same, and the maximum voltage generated by the optical sensor 200 is approximately the same during each press. Within the EF interval, when the user presses the side wall 110 multiple times, the distance between the optical transceiver unit 210 and the reflector 220 changes periodically, with the frequency of this distance change being the same as the frequency at which the user presses the side wall 110. The force applied during each press is approximately the same, and the maximum voltage generated by the optical sensor 200 is also approximately the same during each press. The force applied by the user to the side wall 110 within the EF interval is less than the force applied by the user to the side wall 110 within the DE interval. Similarly, the maximum voltage generated by the optical sensor 200 during each press within the EF interval is less than the maximum voltage generated by the optical sensor 200 during each press within the DE interval.

[0185] Different pressures applied by the user to the side wall 110 cause different electrical signal changes in the light sensor 200, which in turn cause the processing circuit 800 to execute different control functions.

[0186] In some embodiments, referring to FIG11, the housing 100 includes a first sidewall and at least one second sidewall 120. The first sidewall refers to the sidewall 110 on the housing 100 that connects to the photosensor 200. In some embodiments, two second sidewalls 120 may be provided. The two second sidewalls 120 may be located on opposite sides of the first sidewall. In some embodiments, the second sidewall 120 may also include a connected area and an unconnected area. In some embodiments, the connected area of ​​the second sidewall 120 may be connected to at least one photosensor 200. In some embodiments, the second sidewall 120 may not be connected to the photosensor 200. When the second sidewall 120 is pressed, the deformation of the second sidewall 120 can cause deformation of the connected area 111 of the first sidewall, thereby causing a change in the electrical signal of the photosensor 200 on the connected area 111 of the first sidewall.

[0187] The loudspeaker 700 refers to a structure capable of converting electrical signals into sound signals. In some embodiments, the loudspeaker 700 can be connected to the first sidewall and / or the second sidewall 120 in various ways, such as by bonding, snap-fitting, threaded connection, etc.

[0188] The processing circuit 800 refers to a circuit capable of implementing control functions. In some embodiments, the processing circuit 800 may include multiple electronic components connected in series and / or parallel. The processing circuit 800 can implement control functions by changing the switching on and / or off of different electronic components.

[0189] In some embodiments, the processing circuit 800 is disposed on a circuit board. In some embodiments, the circuit board can be connected to the first sidewall and / or the second sidewall 120 in various ways. In some embodiments, the circuit board can be connected to the cantilever structure 300 in various ways, such as bonding, snap-fitting, soldering, etc. In some embodiments, the circuit board can be connected to the side of the cantilever structure 300 away from the pressing area 111. For more information about the cantilever structure 300, please refer to the relevant description in FIG3A.

[0190] In some embodiments, the processing circuit 800 may be electrically connected to the light sensor 200. In some embodiments, the processing circuit 800 may be configured to read a first electrical signal generated by the light sensor 200 when a user presses the first sidewall, and control the speaker 700 to perform a first operation based on the first electrical signal; and to read a second electrical signal generated by the light sensor 200 when a user presses at least one second sidewall 120, and control the speaker 700 to perform a second operation based on the second electrical signal.

[0191] The first electrical signal refers to the electrical signal generated by the light sensor 200 when the user presses the first side wall. Different ways of pressing the first side wall generate different first electrical signals. For example, pressing the first side wall once, twice consecutively, three times consecutively, or continuously for more than 3 seconds will generate different first electrical signals, which can trigger the processing circuit 800 to control the speaker 700 to perform different first operations.

[0192] The second electrical signal refers to the electrical signal generated by the light sensor 200 when the user presses the second side wall 120. Different ways of pressing the second side wall 120 will generate different second electrical signals. For example, pressing the second side wall 120 once, pressing it twice consecutively, pressing it three times consecutively, pressing it continuously for more than 3 seconds, or pressing two opposite second side walls 120 will each generate different second electrical signals. These different second electrical signals can trigger the processing circuit 800 to control the speaker 700 to perform different second operations.

[0193] The first and second operations include various operations related to sound playback. For example, changing the volume of the sound played by the speaker 700, the playback speed, switching songs, pausing, starting, and turning off. In some embodiments, the first operation may differ from the second operation. In some embodiments, the processing circuit 800 can analyze a first variation pattern of the first electrical signal to determine the first operation. For example, the first operation can be determined based on the first variation pattern and the correspondence between different variation patterns of the first electrical signal and the operation. The processing circuit 800 can analyze a second variation pattern of the second electrical signal to determine the second operation. For example, the second operation can be determined based on the second variation pattern and the correspondence between different variation patterns of the second electrical signal and the operation.

[0194] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this specification. Such modifications, improvements, and corrections are suggested in this specification and therefore remain within the spirit and scope of the exemplary embodiments described herein.

[0195] Furthermore, this specification uses specific terms to describe embodiments thereof. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of this specification. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Moreover, certain features, structures, or characteristics in one or more embodiments of this specification can be appropriately combined.

[0196] Similarly, it should be noted that, in order to simplify the description disclosed herein and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of embodiments in this specification may sometimes combine multiple features into a single embodiment, drawing, or description thereof. However, this method of disclosure does not imply that the subject matter of this specification requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of a single embodiment disclosed above.

[0197] Finally, it should be understood that the embodiments described in this specification are merely illustrative of the principles of the embodiments described herein. Other variations may also fall within the scope of this specification. Therefore, alternative configurations of the embodiments described herein are intended to be consistent with the teachings of this specification, rather than as examples or limitations. Accordingly, the embodiments described herein are not limited to those explicitly introduced and described herein.

Claims

1. An acoustic device, characterized by include: case; An optical sensor includes an optical transceiver unit and a reflector placed at intervals. The optical transceiver unit is configured to emit light waves to the reflector and receive light waves reflected by the reflector, thereby generating an electrical signal. The optical sensor is connected to the inner surface of a side wall of the housing. When the outer surface of the side wall is pressed by a user, the electrical signal changes.

2. The acoustic device of claim 1, wherein, The thickness of the connection area on the sidewall that is connected to the optical sensor is less than the thickness of the unconnected area.

3. The acoustic device of claim 2, wherein, A stepped structure is formed on the sidewall between the connection area of ​​the optical sensor and the surrounding unconnected area.

4. The acoustic device of claim 1, wherein, The material of the connection area on the sidewall that is connected to the optical sensor is different from the material of the unconnected area.

5. The acoustic device of claim 4, wherein, The Mohs hardness of the material in the connection area on the sidewall that is connected to the optical sensor is less than the Mohs hardness of the material in the unconnected area.

6. The acoustic device of claim 1, wherein, The reflective part is located between the inner surface of the sidewall and the optical transceiver unit, and the optical transceiver unit is located on the side of the reflective part away from the connection area.

7. The acoustic device of claim 6, wherein, The optical sensor includes a cantilever structure disposed opposite to the reflector, and the optical transceiver unit is fixed on the cantilever structure and spaced apart from the fixed end of the cantilever structure by a distance.

8. The acoustic device of claim 6, wherein, The area on the reflective part facing the optical transceiver unit forms a groove structure relative to the surrounding area, and the bottom of the groove structure is closer to the optical transceiver unit.

9. The acoustic device of claim 6, wherein, The connection area and the unconnected area on the side wall that are connected to the reflective part are not integrally formed spliced ​​structures.

10. The acoustic device of claim 1, wherein, The optical transceiver unit is located between the inner surface of the sidewall and the reflective part.

11. The acoustic device of claim 10, wherein, The optical sensor includes a cantilever structure disposed opposite to the optical transceiver unit, and the reflective part is fixed on the cantilever structure and spaced apart from the fixed end of the cantilever structure by a distance.

12. The acoustic device of claim 11, wherein, The cantilever structure is connected to other areas on the side wall, and the other areas and the connection area on the side wall connected to the optical transceiver unit are non-integrated splicing structures.

13. The acoustic device of claim 1, wherein, When the outer surface of the sidewall is not pressed by the user, the distance between the optical transceiver unit and the reflector is in the range of 0-200μm.

14. The acoustic device of claim 1, wherein, The intensity of the reflected light wave received by the optical transceiver unit increases as the distance between the optical transceiver unit and the reflector increases.

15. The acoustic device of claim 1, wherein, The housing includes at least one second sidewall connected to the sidewall. When the outer surface of the at least one second sidewall is pressed by the user, the deformation of the second sidewall causes a second change in the electrical signal. The trend of the second change is opposite to the trend of the electrical signal caused by the user pressing the sidewall.

16. An acoustic device, characterized by include: The housing includes a first sidewall and at least one second sidewall; The speaker is housed within the housing; An optical sensor, connected to the inner surface of the first sidewall, includes optical transceiver units and a reflector placed at intervals. The optical transceiver units emit light waves to the reflector and receive light waves reflected by the reflector, thereby generating an electrical signal. as well as The processing circuit, which is electrically connected to the optical sensor, is configured as follows: When a user presses the first side wall, a first electric signal generated by the light sensor is read, and the first electric signal is used to control the speaker to perform a first operation; and When a user presses the at least one second side wall, a second electric signal generated by the light sensor is read, and the second electric signal is used to control the speaker to perform a second operation.

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