Sealing door assembly, transfer chamber, and semiconductor process device

Abstract

The present application discloses a sealing door assembly, a transfer chamber, and a semiconductor process device. The disclosed sealing door assembly comprises a door panel, a guide rail, and a connecting assembly. The connecting assembly comprises a first bushing, a second bushing, and a sliding block. The second bushing is sleeved outside the first bushing, and the inner surface of the second bushing spherically fits with the outer surface of the first bushing. The second bushing is arranged in the sliding block, and the door panel is connected to the sliding block. The first bushing is slidably sleeved on the guide rail. During a process in which the door panel moves along the guide rail by means of the sliding fit between the first bushing and the guide rail, angle compensation is performed on the first bushing by means of the spherical fit between the first bushing and the second bushing. The above solution can solve the problem in the related art in which more impurity particles are present in a transfer chamber due to high friction between a shaft sleeve and a guide rail.

Description

Sealing door assemblies, transfer chambers, and semiconductor process equipment Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a sealing door assembly, a transfer chamber, and semiconductor process equipment. Background Technology

[0002] In semiconductor process equipment, a transfer chamber provides a transition space between different process chambers to maintain the environmental conditions within each chamber and prevent cross-contamination or contamination from external air. The transfer chamber has a transfer channel with wafer transfer ports at both ends. Each end of the transfer channel is equipped with a sealing gate assembly. These sealing gate assemblies are used to seal or open the wafer transfer ports of the transfer channel. The sealing gate assemblies at both ends of the transfer channel cannot be opened simultaneously; doing so would create a connection between the process chambers on either side of the transfer chamber, disrupting the environment of the process chamber.

[0003] In related technologies, the door panel of a sealing door assembly is slidably mounted on a guide rail via a bushing. The door panel can slide along the guide rail via the bushing, allowing it to move to a position covering or avoiding the wafer transfer port. However, during installation, the door panel may experience adjustment errors or deformation after prolonged use. When these errors occur, the angle between the central axis of the bushing and the extension direction of the guide rail becomes excessive, increasing friction between the bushing and the guide rail during door panel movement. This increased friction generates more impurity particles, which can easily fall onto the wafer during transfer, thus affecting wafer quality. Therefore, the transfer chamber in related technologies suffers from the problem of high friction between the bushing and the guide rail, resulting in a large number of impurity particles. Summary of the Invention

[0004] This application discloses a sealing door assembly, a transmission chamber, and a semiconductor process equipment to solve the problem in the related art where the transmission chamber has a large amount of impurity particles due to the high friction between the bushing and the guide rail.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, this application discloses a sealing door assembly, which includes a door panel, a guide rail, and a connecting assembly. The connecting assembly includes a first bushing, a second bushing, and a slider. The second bushing is sleeved outside the first bushing, and the inner surface of the second bushing is spherically engaged with the outer surface of the first bushing. The second bushing is disposed on the slider, and the door panel is connected to the slider. The first bushing is slidably sleeved on the guide rail. During the movement of the door panel along the guide rail through the sliding engagement between the first bushing and the guide rail, the first bushing and the second bushing provide angular compensation for the first bushing through the spherical engagement.

[0007] Secondly, this application also discloses a transmission chamber, which includes a chamber body and the sealing door assembly described in the first aspect. The chamber body has a wafer transmission port, and the guide rail is disposed on the chamber body. The door panel can be moved to a position opposite or misaligned with the wafer transmission port through a sliding fit between the first bushing and the guide rail. During the movement of the door panel relative to the guide rail, the first bushing and the second bushing compensate for the angle of the first bushing through a spherical fit.

[0008] Thirdly, this application also discloses a semiconductor process apparatus, which includes a reaction chamber, a microenvironment chamber, an atmospheric chamber, and the transfer chamber described in the second aspect. The transfer chamber is connected between the atmospheric chamber and the microenvironment chamber, and the reaction chamber is connected to the microenvironment chamber.

[0009] The technical solution adopted in this application can achieve the following technical effects:

[0010] The sealing door assembly disclosed in this application configures the connecting component as a structure including a first bushing, a second bushing, and a slider, such that the second bushing is fitted onto the first bushing, and the inner surface of the second bushing spherically mates with the outer surface of the first bushing, allowing the first bushing to rotate relative to the second bushing in any direction. By placing the second bushing on the slider, connecting the door panel to the slider, and slidably fitting the first bushing onto the guide rail, if, during the movement of the door panel relative to the guide rail, there are adjustment errors during installation or deformation of the door panel after prolonged use, resulting in a large angle between the extension direction of the central axis of the first bushing and the extension direction of the guide rail, the first bushing can rotate relative to the second bushing to compensate for the angle. This reduces the angle between the extension direction of the central axis of the first bushing and the extension direction of the guide rail, thereby reducing the frictional force when the first bushing slides along the guide rail. This, in turn, reduces the impurity particles generated by friction between the first bushing and the guide rail. Reduced impurity particles reduce the number of impurity particles falling onto the wafer during transmission, thus improving wafer quality. Attached Figure Description

[0011] Figure 1 is a schematic diagram of the transmission chamber disclosed in the embodiment of this application from a first-view perspective;

[0012] Figure 2 is a partial schematic diagram of the sealing door assembly disclosed in an embodiment of this application;

[0013] Figure 3 is a partial cross-sectional view of the sealing door assembly disclosed in an embodiment of this application;

[0014] Figure 4 is a partial cross-sectional view of the first bushing cooperating with the guide rail in the sealing door assembly disclosed in the embodiment of this application;

[0015] Figure 5 is a schematic diagram of the transmission chamber disclosed in the embodiment of this application from a second perspective;

[0016] Figure 6 is a partial structural schematic diagram of the transmission chamber disclosed in an embodiment of this application;

[0017] Figure 7 is a partial schematic diagram of the wafer cassette positioning mechanism disclosed in an embodiment of this application, wherein a represents the first direction and b represents the second direction;

[0018] Figure 8 is a schematic diagram of the structure of the base disclosed in an embodiment of this application;

[0019] Figure 9 is a partial schematic diagram of the wafer cassette positioning mechanism disclosed in an embodiment of this application;

[0020] Figure 10 is an overall schematic diagram of the wafer cassette positioning mechanism disclosed in the embodiments of this application;

[0021] Figure 11 is a schematic diagram of the cooperation between the wafer cassette positioning mechanism and the base disclosed in the embodiments of this application;

[0022] Figure 12 is a schematic diagram of the clamping assembly without clamping the base as disclosed in the embodiments of this application;

[0023] Figure 13 is a schematic diagram of the clamping base of the clamping assembly disclosed in the embodiments of this application;

[0024] Figure 14 is a schematic diagram of the cooperation between the exhaust manifold, pressure controller, and check valve disclosed in the embodiments of this application;

[0025] Figure 15 is a schematic diagram of the structure of the semiconductor process equipment disclosed in the embodiments of this application.

[0026] Explanation of reference numerals in the attached drawings: A-Transmission chamber, 100-Cavity body, 110-Transmission channel, 210-Door panel, 211-First limiting recess, 212-Transparent window, 220-Guide rail, 230-Connector, 240-Door frame, 250-Reset elastic element, 260-First driving element, 280-Second driving element, 300-Connecting assembly, 310-First bushing, 311-Recess, 320-Second bushing, 321-Protrusion, 330-Slider, 331-Mounting hole, 332-Limiting overlap, 340-Limiting baffle, 341-Arc-shaped clearance recess, 400-Wafer cell positioning mechanism, 410-Stage, 421-First support element, 421a-Second limiting recess. 431-Second support member, 431a-First boss, 431b-Second boss, 441-Clamping body, 442-Elastic buffer member, 443-Back plate, 451-Third drive member, 452-Rotating shaft, 453-Mounting base, 454-Transmission assembly, 454a-First rod member, 454b-Second rod member, 510-Base, 511-Crossbeam, 511a-Slot, 512-Side beam, 610-Exhaust branch pipe, 620-Exhaust main pipe, 630-Pressure controller, 640-One-way valve, 641-Valve body, 641a-Valve body inlet, 641b-Valve body outlet, 642-Baffle, 650-Inlet pipe, 710-Reaction chamber, 720-Microenvironment chamber, 721-Second manipulator, 730-Atmospheric chamber, 731-First manipulator. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0028] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0029] Please refer to Figures 1 to 15. This application discloses a sealing door assembly applied to a transmission chamber A for sealing the wafer transmission port of the chamber body 100 of the transmission chamber A.

[0030] As shown in Figure 1, the disclosed sealing door assembly includes a door panel 210, a guide rail 220, and a connecting assembly 300. The sealing door assembly seals the wafer transfer port of the chamber body 100 through the door panel 210. Specifically, the side of the door panel 210 facing the chamber body 100 may have a sealing strip. When the door panel 210 is close to the wafer transfer port, the sealing strip can be sealingly connected between the door panel 210 and the chamber body 100, thereby sealing the wafer transfer port of the chamber body 100.

[0031] The guide rail 220 can be a cylindrical structure, a prism structure, or other structures. This application embodiment does not impose specific limitations on the structure of the guide rail 220.

[0032] As shown in Figures 2 and 3, the connecting assembly 300 includes a first bushing 310, a second bushing 320, and a slider 330. The second bushing 320 is sleeved outside the first bushing 310, and the inner surface of the second bushing 320 spherically mates with the outer surface of the first bushing 310. Both the inner surface of the second bushing 320 and the outer surface of the first bushing 310 are part of a sphere, and the center of the sphere on the inner surface of the second bushing 320 coincides with the center of the sphere on the outer surface of the first bushing 310. The second bushing 320 and the first bushing 310 can rotate relative to each other at any angle around the center of the sphere.

[0033] The second bushing 320 is disposed on the slider 330. The second bushing 320 can be connected to the slider 330 by means of bonding, welding or other methods. The embodiments of this application do not limit the connection method between the second bushing 320 and the slider 330.

[0034] The door panel 210 is connected to the slider 330. For example, the door panel 210 and the slider 330 can be connected by bolts, welding, or other methods. This embodiment does not limit the connection method between the door panel 210 and the slider 330. The first bushing 310 is slidably fitted onto the guide rail 220. The first bushing 310 can slide along the guide rail 220, allowing the door panel 210 to move along the guide rail 220 through the sliding engagement between the first bushing 310 and the guide rail 220. The movement of the door panel 210 along the guide rail 220 can be driven by the second driving member 280. The second driving member 280 can be a motor, cylinder, etc. This embodiment does not specifically limit the type of the second driving member 280.

[0035] During the movement of the door panel 210 along the guide rail 220 through the sliding fit between the first bushing 310 and the guide rail 220, the first bushing 310 and the second bushing 320 compensate for the angle of the first bushing 310 through the spherical fit, so as to reduce the angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220.

[0036] The sealing door assembly disclosed in this application configures the connecting assembly 300 as including a first bushing 310, a second bushing 320, and a slider 330, such that the second bushing 320 is fitted onto the first bushing 310, and the inner surface of the second bushing 320 spherically mates with the outer surface of the first bushing 310, thereby allowing the first bushing 310 to rotate relative to the second bushing 320 in any direction; by placing the second bushing 320 on the slider 330, the door panel 210 is connected to the slider 330, and the first bushing 310 is slidably fitted onto the guide rail 220, so that during the movement of the door panel 210 relative to the guide rail 220, if there are adjustment errors during the installation of the door panel 210 or after long-term use, the door... If the plate 210 is deformed, resulting in a large angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220, the first bushing 310 can rotate relative to the second bushing 320 to compensate for the angle of the first bushing 310. This reduces the angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220, thereby reducing the friction when the first bushing 310 slides along the guide rail 220. This, in turn, reduces the impurity particles generated by friction between the first bushing 310 and the guide rail 220. After the impurity particles are reduced, the number of impurity particles falling onto the wafer during the transmission process is reduced, which helps to improve the quality of the wafer.

[0037] Specifically, the first bushing 310 and the second bushing 320 compensate for the angle of the first bushing 310 by means of a spherical fit, which reduces the angle between the extension direction of the central axis of the first bushing 310 and the extension direction of the guide rail 220 to a preset angle or less. For example, by means of a spherical fit, the extension direction of the central axis of the first bushing 310 is made parallel to the extension direction of the guide rail 220, thereby minimizing the friction between the first bushing 310 and the guide rail 220, and further reducing the impurity particles generated by friction.

[0038] Due to the assembly relationship of the various components of the sealing door assembly, if the rotation angle between the second bushing 320 and the first bushing 310 is too large, the tilt angle between the slider 330 and the guide rail 220 will increase, which will cause interference between the slider 330 and the guide rail 220. If the rotation angle between the second bushing 320 and the first bushing 310 is too large, it may also cause interference between the door panel 210 and the guide rail 220 or other components of the transmission chamber A.

[0039] In order to avoid the above-mentioned problems caused by excessive rotation angle between the second bushing 320 and the first bushing 310, in some embodiments, the second bushing 320 and the first bushing 310 may have a boss 321 and a recess 311 at the spherical mating part.

[0040] For example, in the embodiments shown in Figures 3 and 4, the first bushing 310 has a recess 311 at the spherical mating area, and the second bushing 320 has a boss 321 at the spherical mating area.

[0041] For example, the boss portion 321 can be a cylindrical boss, and the opening profile of the recess portion 311 can be circular. Of course, the structure of the boss portion 321 and the recess portion 311 can also be other structures. For example, the boss portion 321 can be a prism-shaped boss, and the opening profile of the recess portion 311 can be elliptical. The embodiments of this application do not limit the structure of the boss portion 321 and the recess portion 311. Specifically, it can be designed according to the matching relationship of each component of the sealing door assembly and the installation position of the sealing door assembly.

[0042] The top surface of the boss portion 321 can mate with the bottom spherical surface of the recess portion 311. The side of the boss portion 321 can be used to limit the engagement with the side of the recess portion 311 so that the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 is less than or equal to a preset angle.

[0043] It should be noted that the top surface of the boss portion 321 or the bottom surface of the recessed portion 311 in the second bushing 320 is concave, while the bottom surface of the recessed portion 311 or the top surface of the boss portion 321 in the first bushing 310 is convex. The side of the boss portion 321 is an annular side that connects to the top surface of the boss portion 321, and the side of the recessed portion 311 is an annular side that connects to the bottom surface of the recessed portion 311.

[0044] The sealing door assembly disclosed in this application has a boss 321 on one of the second bushing 320 and the first bushing 310 and a recess 311 on the other at the spherical joint of the second bushing 320 and the first bushing 310. The top surface of the boss 321 and the bottom surface of the recess 311 are spherically joined, and the side of the boss 321 and the side of the recess 311 are mutually limitingly joined. This ensures that the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 is less than or equal to a preset angle. This avoids excessive rotation angle between the second bushing 320 and the first bushing 310, thereby preventing interference between the slider 330 and the guide rail 220 due to excessive tilt angle, and also preventing interference between the door panel 210 and the guide rail 220 or other components of the transmission chamber A. Furthermore, the spherical fit between the top surface of the boss portion 321 and the bottom surface of the recess portion 311 helps to reduce the contact area between the second bushing 320 and the first bushing 310 at the spherical fit, thereby reducing the friction between the second bushing 320 and the first bushing 310.

[0045] In order to stably limit the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 to less than or equal to a preset angle, in some embodiments, the second bushing 320 and the first bushing 310 may have a first spherical mating area and a second spherical mating area. The second bushing 320 and the first bushing 310 may each have a boss 321 or a recess 311 at the first spherical mating area and the second spherical mating area. The first spherical mating area and the second spherical mating area are symmetrically distributed on both sides of the central axis of the first bushing 310.

[0046] The sealing door assembly disclosed in this application provides a boss 321 or a recess 311 at both the first and second spherical mating points. This, combined with the limiting fit between the sides of the two sets of bosses 321 and the sides of the recesses 311, ensures that the angle between the central axis of the first bushing 310 and the central axis of the second bushing 320 is stably limited to less than or equal to a preset angle. To further stabilize the connection between the second bushing 320 and the slider 330, in some embodiments, as shown in FIG2, the slider 330 may have a mounting hole 331, and the second bushing 320 may be disposed within the mounting hole 331. The mounting hole 331 can be a through hole. The connecting assembly 300 may also include a limiting baffle 340, which may have an arc-shaped relief recess 341. The limiting baffle 340 may be disposed on the slider 330. The limiting baffle 340 may be connected to the slider 330 by means of bonding, welding, bolting, etc. The embodiments of this application do not limit the connection method between the limiting baffle 340 and the slider 330. The edge of the arc-shaped relief recess 341 is located at the opening of the mounting hole 331. The edge of the arc-shaped relief recess 341 may cover the area of ​​the mounting hole 331 opposite to the second bushing 320. The edge of the arc-shaped relief recess 341 may limit the second bushing 320 in the direction of the opening of the mounting hole 331, thereby preventing the second bushing 320 from moving out of the opening of the mounting hole 331, thus making the installation of the second bushing 320 more stable. The arc-shaped relief recess 341 avoids the guide rail 220. It should be noted that the second bushing 320 can be installed in the mounting hole 331 by interference fit, thereby fixing the second bushing 320 in the mounting hole 331. Of course, the second bushing 320 can also be rotatably disposed in the mounting hole 331. The mounting hole 331 can be a stepped hole, and the side of the second bushing 320 facing away from the limiting baffle 340 can contact the stepped surface of the stepped hole.

[0047] In related technologies, the door panel and the slider are only connected by a bolt. Therefore, the door panel and the slider are prone to rotation, and frequent rotation can lead to poor connection stability between the door panel and the slider. In order to improve the connection stability between the door panel 210 and the slider 330, in some embodiments of this application, as shown in FIG2, the door panel 210 may have a first limiting recess 211, and the slider 330 may have a limiting overlap portion 332. The limiting overlap portion 332 may overlap the first limiting recess 211, and the shape of the limiting overlap portion 332 is adapted to the shape of the first limiting recess 211.

[0048] The sealing door assembly disclosed in this application provides a first limiting recess 211 on the door panel 210 and a limiting overlap portion 332 on the slider 330. The shape of the limiting overlap portion 332 is adapted to the shape of the first limiting recess 211, so that the door panel 210 is connected to the slider 330 through the connector 230. The limiting overlap portion 332 overlaps with the first limiting recess 211, and the outer edge of the limiting overlap portion 332 is limited and engaged with the inner edge of the first limiting recess 211 to restrict the rotation of the door panel 210 and the slider 330, thereby improving the connection stability between the door panel 210 and the slider 330.

[0049] Furthermore, as shown in Figure 2, the sealing door assembly may also include a connector 230, through which the door panel 210 can be connected to the slider 330, thereby making the connection between the door panel 210 and the slider 330 more stable. The connector 230 may be a connecting bolt, a connecting pin, etc.

[0050] In some embodiments, as shown in FIG6, the sealing door assembly may further include a door frame 240, a reset elastic member 250, and a first drive member 260. A guide rail 220 may be disposed on the door frame 240, and a door panel 210 may be disposed on the door frame 240 via a connecting assembly 300 and the guide rail 220. The first end of the door frame 240 may be used to connect to the chamber body 100 of the transmission chamber A via the reset elastic member 250. The first drive member 260 may be used to connect between the second end of the door frame 240 and the chamber body 100. The first end and the second end of the door frame 240 may be distributed opposite to each other. The first drive member 260 may be used to drive the second end of the door frame 240 to move closer to or further away from the chamber body 100, so that the door panel 210 is in sealed contact with or separated from the wafer transmission port when facing the wafer transmission port of the chamber body 100.

[0051] Specifically, when the first driving member 260 drives the second end of the door frame 240 to approach the chamber body 100, the door frame 240 drives the door plate 210 to move towards the wafer transfer port, so that the door plate 210 makes sealed contact with the wafer transfer port. When the first driving member 260 drives the second end of the door frame 240 away from the chamber body 100, the door frame 240 drives the door plate 210 to move away from the wafer transfer port, so that the door plate 210 separates from the wafer transfer port.

[0052] The sealing door assembly disclosed in this application comprises a door frame 240, a reset elastic element 250, and a first driving element 260. The first end of the door frame 240 is connected to the chamber body 100 of the transmission chamber A via the reset elastic element 250. The first driving element 260 is connected between the second end of the door frame 240 and the chamber body 100. A guide rail 220 can be disposed on the door frame 240. Thus, when the door panel 210 is opposite to the wafer transmission port of the chamber body 100, the first driving element 260 drives the second end of the door frame 240 to move closer to the chamber body 100, so that the door frame 240 drives the door panel 210 to make a sealed contact with the wafer transmission port. Alternatively, the first driving element 260 drives the second end of the door frame 240 away from the chamber body 100, so that the door frame 240 drives the door panel 210 to separate from the wafer transmission port. This enables the sealing contact and separation of the door panel 210 from the wafer transmission port. Furthermore, the first end of the door frame 240 is connected to the chamber body 100 of the transmission chamber A via the reset elastic member 250, thereby avoiding friction compared to the door frame 240 and the chamber body 100 being connected by a pin, and thus reducing the generation of impurity particles.

[0053] For example, the reset elastic element 250 may be a reset spring, but this is not limiting. In some other embodiments not shown in the figures, the reset elastic element 250 may also be other components for elastic reset, which are not limited in the embodiments of this application.

[0054] This application also discloses a transmission chamber A, which includes a chamber body 100 and a sealing door assembly disclosed in the above embodiments. The chamber body 100 has a wafer transmission port, and a guide rail 220 is disposed on the chamber body 100. The door panel 210 can be moved to a position opposite to or offset from the wafer transmission port through the sliding engagement of the first bushing 310 and the guide rail 220. In other words, the door panel 210 can be moved to a position covering the wafer transmission port or to a position avoiding the wafer transmission port through the sliding engagement of the first bushing 310 and the guide rail 220. During the movement of the door panel 210 relative to the guide rail 220, the first bushing 310 and the second bushing 320 compensate for the angle of the first bushing 310 through a spherical engagement.

[0055] The transmission chamber A disclosed in this application can reduce impurity particles generated by friction between the first bushing 310 and the guide rail 220 by setting the sealing door assembly disclosed in the above embodiment. After the impurity particles are reduced, the impurity particles falling onto the wafer during the transmission process can be reduced, thereby improving the quality of the wafer.

[0056] As shown in Figure 15, in the specific application process, the first robotic arm 731 needs to transfer the wafer cassette carrying the wafer from the atmospheric chamber 730 to the transfer channel 110 of the transfer chamber A. Then, the wafer transfer port of the transfer channel 110 connected to the atmospheric chamber 730 is closed by the sealing door assembly. Then, the sealing door assembly on the side of the wafer transfer port of the transfer channel 110 connected to the microenvironment chamber 720 is opened. The second robotic arm 721 in the microenvironment chamber 720 picks up the wafer from the wafer cassette and transports it to the reaction chamber 710. After the wafers are processed in the reaction chamber 710, they are transported to the wafer cassette by the second robot arm 721. Once all the wafers on the wafer cassette have been processed in the reaction chamber 710, the sealing door assembly on the wafer transfer port side of the transfer channel 110, which connects to the microenvironment chamber 720, is closed, and the sealing door assembly on the wafer transfer port side of the transfer channel 110, which connects to the atmospheric chamber 730, is opened, thereby allowing the first robot arm 731 to remove the wafer cassette from the transfer channel 110.

[0057] As shown in Figure 15, when the wafer cassette is transferred into the transfer channel 110, it needs to be placed on the wafer cassette positioning mechanism 400. To improve the stability of the wafer cassette placed on the wafer cassette positioning mechanism 400, in some embodiments, the transfer chamber A may also include the wafer cassette positioning mechanism 400, as shown in Figures 7 and 10. The wafer cassette positioning mechanism 400 may include a stage 410, a first support assembly, and a second support assembly. The first support assembly and the second support assembly may be spaced apart along a first direction. The first support assembly may include two first support members 421, and the second support assembly may include two second support members 431. The two first support members 421 may be spaced apart along a second direction on the stage 410, and the two second support members 431 may be spaced apart along a second direction on the stage 410. The first direction is perpendicular to the second direction.

[0058] The first support member 421 may have a first limiting part, and the second support member 431 may have a second limiting part. When the two first support members 421 and the two second support members 431 jointly support the wafer cell, both the first limiting part and the second limiting part can limit the wafer cell in the second direction.

[0059] Specifically, both the first limiting part and the second limiting part can be limiting posts or limiting grooves. The wafer cassette can be provided with corresponding limiting grooves or limiting posts. The first support member 421 and the second support member 431 can limit the wafer cassette through the insertion and engagement of the limiting posts and limiting grooves, thereby restricting the wafer cassette from moving relative to the first support member 421 and the second support member 431 in the second direction. Of course, the first limiting part and the second limiting part can also have other structures, which will be described later and will not be elaborated here.

[0060] The transmission chamber A disclosed in this application embodiment is provided with a wafer cassette positioning mechanism 400, which is configured to include a stage 410, a first support component, and a second support component. The first support component and the second support component are spaced apart along a first direction. The two first support members 421 of the first support component are spaced apart on the stage 410 along a second direction, and the two second support members 431 of the second support component are spaced apart on the stage 410 along a second direction. The first support member 421 has a first limiting part, and the second support member 431 has a second limiting part. When the two first support members 421 and the two second support members 431 jointly support the wafer cassette, the first limiting part and the second limiting part both limit the wafer cassette in the second direction, thereby improving the stability of the wafer cassette placed on the wafer cassette positioning mechanism 400.

[0061] In some embodiments, as shown in FIG7, the first limiting portion may include a second limiting recess 421a formed on the first support member 421 facing the inner side of the two first support members 421, and the second limiting portion may include a first boss 431a, which may extend along a first direction. As shown in FIG8, the base 510 of the wafer cassette may include a crossbeam 511 and two side beams 512 connected to both ends of the crossbeam 511. The crossbeam 511 has a slot 511a.

[0062] When the wafer cassette is supported by the two first support members 421 and the two second support members 431, the side beam 512 can be supported on the bottom surface of the second limiting recess 421a, the cross beam 511 can be supported on the first boss 431a by the bottom wall of the slot 511a, the side wall of the second limiting recess 421a located on the two first support members 421 can be engaged with the side beam 512 in the second direction, and the first boss 431a located on the two second support members 431 can be engaged with the side wall of the slot 511a in the second direction.

[0063] It should be noted that the side wall of the second limiting recess 421a is a side wall connected to the bottom surface of the second limiting recess 421a, and the side wall of the slot 511a is a side wall connected to the bottom wall of the slot 511a.

[0064] The transmission chamber A disclosed in this application embodiment is configured such that the first limiting part includes a second limiting recess 421a opened on the first support member 421 facing the inner side of the two first support members 421, and the second limiting part includes a first protrusion 431a. This allows the side beam 512 to be supported on the bottom surface of the second limiting recess 421a when the two first support members 421 and the two second support members 431 jointly support the wafer cassette. The cross beam 511 is supported on the first protrusion 431a through the bottom wall of the slot 511a. The side wall of the second limiting recess 421a located on the two first support members 421 is in upper limit engagement with the side beam 512 in the second direction. The first protrusion 431a located on the two second support members 431 is in upper limit engagement with the side wall of the slot 511a in the second direction. This improves the stability of the wafer cassette placed on the wafer cassette positioning mechanism 400.

[0065] To further improve the stability of the wafer cassette placed on the wafer cassette positioning mechanism 400, in some embodiments, as shown in Figures 7 and 10, the second support member 431 may further include a second boss 431b, which may extend along a second direction. The wafer cassette positioning mechanism 400 may also include a clamping assembly and a clamping drive mechanism. The clamping drive mechanism may be disposed on the stage 410, and the clamping assembly may be connected to the clamping drive mechanism. When the wafer cassette is supported by two first support members 421 and two second support members 431, the clamping drive mechanism may drive the clamping assembly to clamp the crossbeam 511 between the second boss 431b and the clamping assembly, thereby limiting the wafer cassette in the first direction.

[0066] The transmission chamber A disclosed in this application embodiment is configured with a clamping assembly and a clamping drive mechanism. The second support member 431 is configured to include a second boss 431b. When the wafer cassette is supported by the two first support members 421 and the two second support members 431, the clamping drive mechanism drives the clamping assembly to clamp the crossbeam 511 between the second boss 431b and the clamping assembly, thereby limiting the wafer cassette in the first direction. This limits the wafer cassette in both the first and second directions, thereby further improving the stability of the wafer cassette placed on the wafer cassette positioning mechanism 400.

[0067] Since wafer cassettes are typically made of quartz, they are relatively brittle. To prevent damage to the wafer cassette due to the large rigid contact force when the clamping assembly contacts the crossbeam 511, in some embodiments, as shown in Figures 9 and 11, the clamping assembly may include a clamping body 441 and an elastic buffer 442. As shown in Figures 12 and 13, a clamping drive mechanism may be connected to the clamping body 441, and the elastic buffer 442 may be disposed on the clamping body 441. The clamping drive mechanism can drive the elastic buffer 442 through the clamping body 441 to clamp the crossbeam 511 between the second boss 431b and the elastic buffer 442.

[0068] The transmission chamber A disclosed in this application embodiment is configured with a clamping assembly including a clamping body 441 and an elastic buffer 442. This allows the clamping drive mechanism to drive the elastic buffer 442 through the clamping body 441 to clamp the crossbeam 511 between the second boss 431b and the elastic buffer 442. This avoids rigid contact of the wafer cassette under the buffering effect of the elastic buffer 442, thereby preventing damage to the wafer cassette.

[0069] Specifically, the elastic buffer 442 can be elastic rubber, spring, etc. The embodiments of this application do not impose specific restrictions on the type of elastic buffer 442.

[0070] In cases where the wafer cassette positioning mechanism 400 includes at least two clamping assemblies, to enable synchronous movement of the at least two clamping assemblies, in some embodiments, the clamping drive mechanism may include a third drive member 451, a rotating shaft 452, and a mounting base 453. Both the third drive member 451 and the mounting base 453 may be disposed on the stage 410, the rotating shaft 452 may be rotatably disposed on the mounting base 453, and the third drive member 451 may be connected to the rotating shaft 452. The wafer cassette positioning mechanism 400 may include at least two clamping assemblies, which may be spaced apart along a second direction and both are connected to the rotating shaft 452. The third drive member 451 may be used to drive the rotating shaft 452 to rotate, thereby causing the rotating shaft 452 to switch the clamping assemblies between a first position and a second position.

[0071] When the clamping assembly is in the first position, it clamps the crossbeam 511 between the second boss 431b and the clamping assembly. When the clamping assembly is in the second position, it separates from the crossbeam 511.

[0072] The transmission chamber A disclosed in this application embodiment is configured with a clamping drive mechanism including a third drive member 451, a rotating shaft 452 and a mounting base 453, so that the third drive member 451 can drive the rotating shaft 452 to rotate, so that the rotating shaft 452 drives at least two clamping components to switch between a first position and a second position, thereby enabling at least two clamping components to move synchronously.

[0073] Specifically, when the clamping assembly includes a clamping body 441 and an elastic buffer 442, the clamping assembly may also include a back plate 443, through which the clamping body 441 can be connected to the rotating shaft 452. The rotating shaft 452 and the mounting base 453 can be rotatably connected by a bearing. The bearing can be an oil-free bushing, and the bearing can be made of a smooth resin material, which can reduce friction during the rotation of the mechanism and reduce the generation of impurities.

[0074] In some embodiments, the clamping drive mechanism may further include a transmission assembly 454, which may include a first rod 454a and a second rod 454b. The first end of the first rod 454a may be hinged to the third drive member 451, and the second end of the first rod 454a may be hinged to the first end of the second rod 454b. The second end of the second rod 454b may be fixedly connected to the rotating shaft 452. The third drive member 451 may drive the rotating shaft 452 to rotate through the first rod 454a and the second rod 454b.

[0075] The transmission chamber A disclosed in this application embodiment is configured with a transmission assembly 454 comprising a first rod 454a and a second rod 454b, such that the first end of the first rod 454a is hinged to the third driving member 451, the second end of the first rod 454a is hinged to the first end of the second rod 454b, and the second end of the second rod 454b is fixedly connected to the rotating shaft 452. By configuring the first rod 454a and the second rod 454b, the third driving member 451 drives the rotating shaft 452 to rotate via the first rod 454a and the second rod 454b, thereby facilitating the arrangement of components such as the third driving member 451 and the rotating shaft 452.

[0076] To improve transmission efficiency, as shown in Figure 1, the chamber body 100 typically has multiple transmission channels 110, and the openings on both sides of the transmission channels 110 can be wafer transfer ports. When the chamber body 100 has multiple transmission channels 110, as shown in Figure 5, the multiple transmission channels 110 share a single exhaust manifold 620. To prevent gas in the transmission channels 110 under atmospheric conditions from flowing back into the transmission channels 110 under vacuum conditions through the exhaust manifold 620, in some embodiments, the transmission chamber A may further include an exhaust branch pipe 610, an exhaust manifold 620, and a pressure controller 630. Each transmission channel 110 may be connected to an exhaust branch pipe 610, and the exhaust branch pipe 610 may connect the transmission channel 110 to the exhaust manifold 620.

[0077] The exhaust branch pipe 610 may be equipped with a pressure controller 630, which can be used to control the gas pressure in the exhaust branch pipe 610 so that the internal pressure of the part of the exhaust branch pipe 610 located between the chamber body 100 and the pressure controller 630 is greater than the internal pressure of the part of the exhaust branch pipe 610 located between the pressure controller 630 and the exhaust main pipe 620.

[0078] The transmission chamber A disclosed in this application embodiment has a pressure controller 630 installed on the exhaust branch pipe 610. The pressure controller 630 can control the gas pressure in the exhaust branch pipe 610 so that the internal pressure of the part of the exhaust branch pipe 610 located between the chamber body 100 and the pressure controller 630 is greater than the internal pressure of the part of the exhaust branch pipe 610 located between the pressure controller 630 and the exhaust main pipe 620. This can prevent the gas in the transmission channel 110 under atmospheric conditions from flowing back into the transmission channel 110 under vacuum conditions through the exhaust main pipe 620, thereby protecting the environmental conditions in each transmission channel 110.

[0079] It should be noted that the transmission chamber A may also include an air inlet pipe 650. The transmission chamber A can adjust the environmental characteristics of the transmission channel 110 (e.g., switching between vacuum environment and atmospheric environment) by cooperating with the air inlet pipe 650 and the exhaust branch pipe 610.

[0080] To further protect the environmental conditions within each transmission channel 110, in some embodiments, transmission chamber A may further include a one-way valve 640. The one-way valve 640 may be located in the exhaust branch pipe 610, between the transmission channel 110 and the pressure controller 630. When the gas pressure in the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is greater than the gas pressure between the one-way valve 640 and the pressure controller 630, the one-way valve 640 may be in an open state. When the gas pressure in the exhaust branch pipe 610 between the transmission channel 110 and the one-way valve 640 is less than the gas pressure between the one-way valve 640 and the pressure controller 630, the one-way valve 640 may be in a closed state.

[0081] The transmission chamber A disclosed in this application embodiment is equipped with a one-way valve 640 in the exhaust branch pipe 610. The one-way valve 640 is located between the transmission channel 110 and the pressure controller 630. When the gas pressure in the part of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 is less than the gas pressure in the part located between the one-way valve 640 and the pressure controller 630, the one-way valve 640 is in a closed state. This can further prevent the gas in the transmission channel 110 under atmospheric conditions from flowing back into the transmission channel 110 under vacuum conditions through the exhaust main pipe 620, thereby better protecting the environmental conditions in each transmission channel 110.

[0082] Specifically, the one-way valve 640 can be an electronic valve. The one-way valve 640 can automatically control the opening and closing of the one-way valve 640 by detecting the pressure on both sides of the exhaust manifold 610.

[0083] In another embodiment, as shown in FIG14, the one-way valve 640 may include a valve body 641 and a baffle 642. The valve body 641 may have a valve body inlet 641a and a valve body outlet 641b. The portion of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 may communicate with the valve body inlet 641a, and the portion of the exhaust branch pipe 610 located between the one-way valve 640 and the pressure controller 630 may communicate with the valve body outlet 641b. The baffle 642 is rotatably disposed within the valve body 641. When the gas pressure at the portion of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 is greater than the gas pressure at the portion located between the one-way valve 640 and the pressure controller 630, the baffle 642 may open the valve body inlet 641a under the action of the pressure difference, thereby realizing the exhaust of the transmission channel 110. When the gas pressure in the exhaust manifold 610 located between the transmission channel 110 and the check valve 640 is less than the gas pressure in the location between the check valve 640 and the pressure controller 630, the baffle 642 can block the valve body inlet under the action of gravity.

[0084] The transmission chamber A disclosed in this application embodiment has a structure for the one-way valve 640, which includes a valve body 641 and a baffle 642. When the gas pressure in the part of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 is greater than the gas pressure in the part between the one-way valve 640 and the pressure controller 630, the baffle 642 can open the valve body inlet under the action of the pressure difference. When the gas pressure in the part of the exhaust branch pipe 610 located between the transmission channel 110 and the one-way valve 640 is less than the gas pressure in the part between the one-way valve 640 and the pressure controller 630, the baffle 642 can block the valve body inlet under the action of gravity. Thus, the one-way valve 640 can open and close according to its own structural characteristics, and the structure of this one-way valve 640 is relatively simple.

[0085] To facilitate operators' observation of the situation inside the transmission channel 110, in some embodiments, the door panel 210 may have a transparent window 212, through which operators can observe the situation inside the transmission channel 110.

[0086] To avoid wafer fragmentation during wafer handling by the second robot 721 due to excessive wafer protrusion caused by unstable transmission from the first robot 731, in some embodiments, the transmission chamber A may further include a wafer cassette positioning mechanism 400 and a sensor assembly. When the wafer cassette positioning mechanism 400 carries a wafer cassette, the sensor assembly can detect whether the length of the wafer protruding from the wafer cassette exceeds a preset length. If the length of the wafer protruding from the wafer cassette exceeds the preset length, the second robot 721 can skip the wafer exceeding the preset length and pick up the next wafer, and so on, thereby avoiding wafer fragmentation during wafer handling by the second robot 721.

[0087] Specifically, the sensor assembly may include a laser sensor and a reflector, which may be positioned relative to each other and spaced apart. The detection light emitted by the laser sensor reaches the reflector, which reflects the detection light and then receives it from the laser sensor. By setting the positions of the laser sensor and the reflector, the presence of bumps on the wafer can be determined based on whether the detection light emitted by the laser sensor is obstructed.

[0088] Laser sensors and reflectors can also be used to inspect different types of wafers. For example, when the wafer is made of transparent material, the detection light emitted by the laser sensor can pass through the wafer and reach the reflector. The reflector then reflects the detection light emitted by the laser sensor, which is then received by the laser sensor. If the detection light emitted by the laser sensor cannot pass through the wafer, it can be determined that the wafer is made of non-transparent material.

[0089] The sensor assembly can be movably disposed within the chamber body 100. By adjusting the position of the sensor assembly, it can be used to detect the presence of bumps on wafers of different sizes (e.g., six-inch wafers, eight-inch wafers). The sensor assembly can also be used to detect notched wafers and flat-edge wafers, depending on the specific placement of the sensor assembly, which will not be elaborated further.

[0090] This application also discloses a semiconductor process apparatus, which includes a reaction chamber 710, a microenvironment chamber 720, an atmospheric chamber 730, and a transmission chamber A disclosed in the above embodiments. The transmission chamber A is connected between the atmospheric chamber 730 and the microenvironment chamber 720, and the reaction chamber 710 is connected to the microenvironment chamber 720.

[0091] Specifically, a first robotic arm 731 can be installed in the atmospheric chamber 730, and a second robotic arm 721 can be installed in the microenvironment chamber 720. When it is necessary to transfer a wafer located in the atmospheric chamber 730 to the reaction chamber 710, the wafer transfer port of the transfer channel 110 of the transfer chamber A, which connects to the microenvironment chamber 720, is first closed via a sealing door assembly. Then, the sealing door assembly on the side of the transfer channel 110 connecting to the atmospheric chamber 730 is opened. The first robotic arm 731 can then transfer the wafer cassette carrying the wafer from the atmospheric chamber 730 to the transfer channel 110 and place the wafer cassette on the wafer cassette positioning mechanism 400. Next, the sealing door assembly on the side of the transfer channel 110 connecting to the atmospheric chamber 730 is closed, and the sealing door assembly on the side of the transfer channel 110 connecting to the microenvironment chamber 720 is opened. The second robotic arm 721 then picks up the wafer from the wafer cassette and transfers it to the reaction chamber 710.

[0092] After the wafers are processed in the reaction chamber 710, they are transported to the wafer cassette by the second robot arm 721. After all the wafers on the wafer cassette have been processed in the reaction chamber 710, the sealing door assembly on the wafer transfer port side of the transfer channel 110 that communicates with the microenvironment chamber 720 is closed, and the sealing door assembly on the wafer transfer port side of the transfer channel 110 that communicates with the atmospheric chamber 730 is opened. The wafer cassette is then transported from the transfer channel 110 to the atmospheric chamber 730 by the first robot arm 731.

[0093] The semiconductor process chamber disclosed in this application can reduce impurity particles generated by friction between the first bushing 310 and the guide rail 220 by setting the transmission chamber A disclosed in the above embodiment. After the impurity particles are reduced, the impurity particles falling onto the wafer during the transmission process can be reduced, thereby improving the quality of the wafer.

[0094] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0095] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A sealed door assembly, characterized by The device includes a door panel, a guide rail, and a connecting assembly. The connecting assembly includes a first bushing, a second bushing, and a slider. The second bushing is sleeved outside the first bushing, and the inner surface of the second bushing spherically engages with the outer surface of the first bushing. The second bushing is disposed on the slider, and the door panel is connected to the slider. The first bushing is slidably sleeved on the guide rail. During the movement of the door panel along the guide rail through the sliding engagement between the first bushing and the guide rail, the first bushing and the second bushing provide angle compensation for the first bushing through the spherical engagement.

2. The sealed door assembly of claim 1, wherein, At the spherical mating point, the second bushing and the first bushing each have a boss and a recess, respectively. The top surface of the boss and the bottom surface of the recess are spherically mated. The side of the boss is used to limit the fit with the side of the recess, so that the angle between the central axis of the first bushing and the central axis of the second bushing is less than or equal to a preset angle.

3. The sealed door assembly of claim 2, wherein, The second bushing and the first bushing have a first spherical mating area and a second spherical mating area. Both the second bushing and the first bushing have the boss or the recess at the first spherical mating area and the second spherical mating area. The first spherical mating area and the second spherical mating area are symmetrically distributed on both sides of the central axis of the first bushing.

4. The sealed door assembly of claim 1, wherein, The slider has a mounting hole, the second bushing is disposed in the mounting hole, and the connecting assembly further includes a limiting baffle. The limiting baffle has an arc-shaped relief recess. The limiting baffle is disposed on the slider, and the edge of the arc-shaped relief recess is located at the opening of the mounting hole to limit the movement of the second bushing in the direction of the opening of the mounting hole. The arc-shaped relief recess avoids the guide rail.

5. The sealed door assembly of claim 1, wherein, The door panel has a first limiting recess, and the slider has a limiting overlap portion. The limiting overlap portion overlaps with the first limiting recess, and the shape of the limiting overlap portion is adapted to the shape of the first limiting recess.

6. The sealed door assembly of claim 1, wherein, The sealing door assembly further includes a door frame, a reset elastic element, and a first driving element. The guide rail is disposed on the door frame. The first end of the door frame is connected to the chamber body of the transmission chamber through the reset elastic element. The first driving element is connected between the second end of the door frame and the chamber body, and is used to drive the second end of the door frame to move closer to or away from the chamber body.

7. A transfer chamber characterized by, The device includes a chamber body and a sealing door assembly as described in any one of claims 1 to 6. The chamber body has a wafer transfer port, and the guide rail is disposed on the chamber body. The door panel can be moved to a position opposite or misaligned with the wafer transfer port through a sliding fit between the first bushing and the guide rail. During the movement of the door panel relative to the guide rail, the first bushing and the second bushing compensate for the angle of the first bushing through a spherical fit.

8. The transfer chamber of claim 7, wherein, The transmission chamber further includes a wafer cassette positioning mechanism, which includes a stage, a first support assembly, and a second support assembly. The first support assembly and the second support assembly are spaced apart along a first direction. The first support assembly includes two first support members, and the second support assembly includes two second support members. The two first support members are spaced apart on the stage along a second direction, and the two second support members are spaced apart on the stage along the second direction. The first direction is perpendicular to the second direction. The first support member has a first limiting portion, and the second support member has a second limiting portion. When the wafer cassette is supported by the two first support members and the two second support members, both the first limiting portion and the second limiting portion limit the wafer cassette in the second direction.

9. The transfer chamber of claim 8, wherein, The first limiting portion includes a second limiting recess formed on the first support member facing the inner side of the two first support members, and the second limiting portion includes a first protrusion extending along the first direction; The base of the wafer cassette includes a crossbeam and two side beams connected to both ends of the crossbeam. The crossbeam has a slot. When the wafer cassette is supported by the two first support members and the two second support members, the side beams are supported on the bottom surface of the second limiting recess. The crossbeam is supported on the first boss through the bottom wall of the slot. The side wall of the second limiting recess located on the two first support members is in upper limit engagement with the side beam in the second direction. The first boss located on the two second support members is in upper limit engagement with the side wall of the slot in the second direction.

10. The transfer chamber of claim 9, wherein, The second support member further includes a second boss extending along the second direction. The wafer cassette positioning mechanism further includes a clamping assembly and a clamping drive mechanism. The clamping drive mechanism is disposed on the platform. The clamping assembly is connected to the clamping drive mechanism. When the wafer cassette is supported by the two first support members and the two second support members, the clamping drive mechanism drives the clamping assembly to clamp the crossbeam between the second boss and the clamping assembly.

11. The transfer chamber of claim 10, wherein, The clamping assembly includes a clamping body and an elastic buffer. The clamping drive mechanism is connected to the clamping body. The elastic buffer is disposed on the clamping body. The clamping drive mechanism drives the elastic buffer through the clamping body to clamp the crossbeam between the second boss and the elastic buffer.

12. The transfer chamber of claim 10, wherein, The clamping drive mechanism includes a third drive member, a rotating shaft, and a mounting base. The third drive member and the mounting base are both disposed on the platform. The rotating shaft is rotatably disposed on the mounting base. The third drive member is connected to the rotating shaft. The wafer cassette positioning mechanism includes at least two clamping components, which are spaced apart along the second direction and are all connected to the rotating shaft; the third driving member is used to drive the rotating shaft to rotate, so that the rotating shaft drives the clamping components to switch between a first position and a second position. When the clamping assembly is in the first position, the clamping assembly clamps the crossbeam between the second boss and the clamping assembly; When the clamping assembly is in the second position, the clamping assembly is separated from the crossbeam.

13. The transfer chamber of claim 12, wherein, The clamping drive mechanism further includes a transmission assembly, which includes a first rod and a second rod. The first end of the first rod is hinged to the third drive member, and the second end of the first rod is hinged to the first end of the second rod. The second end of the second rod is fixedly connected to the rotating shaft. The third drive member drives the rotating shaft to rotate through the first rod and the second rod.

14. The transfer chamber of claim 7, wherein, The chamber body has multiple transmission channels, and the openings on both sides of the transmission channels are the wafer transmission ports. The transmission chamber also includes an exhaust branch pipe, an exhaust main pipe, and a pressure controller. Each transmission channel is connected to the exhaust branch pipe, and the exhaust branch pipe is connected between the transmission channel and the exhaust main pipe. The exhaust branch pipe is equipped with the pressure controller, which is used to control the gas pressure in the exhaust branch pipe so that the internal pressure of the part of the exhaust branch pipe located between the chamber body and the pressure controller is greater than the internal pressure of the part of the exhaust branch pipe located between the pressure controller and the exhaust main pipe.

15. The transfer chamber of claim 14, wherein, The transmission chamber also includes a one-way valve, which is located in the exhaust branch pipe and between the transmission channel and the pressure controller; When the gas pressure at the location between the transmission channel and the check valve in the exhaust branch pipe is greater than the gas pressure at the location between the check valve and the pressure controller, the check valve is in the open state. When the gas pressure at the location between the transmission channel and the check valve in the exhaust manifold is less than the gas pressure at the location between the check valve and the pressure controller, the check valve is in the closed state.

16. The transfer chamber of claim 15, wherein, The one-way valve includes a valve body and a baffle. The valve body has a valve body inlet and a valve body outlet. The portion of the exhaust branch pipe located between the transmission channel and the one-way valve is connected to the valve body inlet. The portion of the exhaust branch pipe located between the one-way valve and the pressure controller is connected to the valve body outlet. The baffle is rotatably disposed within the valve body. When the gas pressure at the location between the transmission channel and the check valve in the exhaust branch pipe is greater than the gas pressure at the location between the check valve and the pressure controller, the baffle opens the valve body inlet under the action of the pressure difference. When the gas pressure at the location between the transmission channel and the check valve in the exhaust branch pipe is less than the gas pressure at the location between the check valve and the pressure controller, the baffle blocks the valve body inlet under the action of gravity.

17. The transfer chamber of claim 7, wherein, The door panel has a transparent viewing window.

18. The transfer chamber of claim 7, wherein, The transmission chamber also includes a wafer cassette positioning mechanism and a sensor assembly. When the wafer cassette positioning mechanism carries a wafer cassette, the sensor assembly is used to detect whether the length of the wafer extending out of the wafer cassette exceeds a preset length.

19. A semiconductor process apparatus, characterized by, It includes a reaction chamber, a microenvironment chamber, an atmospheric chamber, and a transmission chamber as described in any one of claims 7 to 18, wherein the transmission chamber is connected between the atmospheric chamber and the microenvironment chamber, and the reaction chamber is connected to the microenvironment chamber.

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