Heating and ventilation system

Abstract

Provided in the embodiments of the present disclosure is a heating and ventilation system, comprising: a heating and ventilation device; a main control board, which comprises a first communication circuit; at least one repeater board, wherein the repeater board comprises a second communication circuit, the repeater board is connected to at least two electrical components, and the electrical components are arranged on the heating and ventilation device; and a first communication cable, which is connected to both the first communication circuit and the second communication circuit. The repeater board is used for sending, by means of the first communication cable, a detection signal from a corresponding electrical component to the main control board; and / or the main control board is used for sending a control signal to the repeater board by means of the first communication cable, such that the repeater board controls, on the basis of the control signal, the corresponding electrical component. By means of the technical solution of the present disclosure, the length of wiring for connecting electrical components is reduced, such that the cost is reduced, and wiring management and bundling are facilitated, which is conducive to improving the production efficiency.

Description

HVAC system

[0001] This application claims priority to Chinese Patent Application No. 202411455441.0, filed on October 17, 2024, entitled "Heating, Ventilation and Air Conditioning System," the entire contents of which are incorporated herein by reference. This application also claims priority to Chinese Patent Application No. 202422519419.X, filed on October 17, 2024, entitled "Heating, Ventilation and Air Conditioning System," the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of heating, ventilation, and air conditioning (HVAC) technology, and more particularly to an HVAC system. Background Technology

[0003] HVAC systems (also known as air conditioning equipment), especially multi-split systems and modular units, typically have multiple sensors and multiple loads. Sensors can include temperature sensors (e.g., ambient temperature sensors, pipe temperature sensors, compressor exhaust temperature sensors, etc.), pressure sensors (e.g., high-pressure sensors, low-pressure sensors, etc.), humidity sensors, gas sensors, pressure switches, temperature switches, etc. Loads can include solenoid valves (usually two-way valves), electronic expansion valves, electric heaters, etc. The total number of sensors and loads generally ranges from a few to dozens. These electrical components are typically connected individually to the control board via multi-core wires, as shown in Figure 1. Figure 1 is a schematic diagram of the connection between the control board and multiple electrical components in the prior art.

[0004] As shown in Figure 1, various sensors and loads need to be connected to the control board from different points in the HVAC system piping. Therefore, the peripheral wiring of the control board is numerous and complex. During production, personnel need to organize and bundle the wires within this complex piping, separating high-voltage and low-voltage wiring, and addressing issues such as interference, crosstalk, and avoiding high-temperature piping, resulting in low production efficiency. Furthermore, the outdoor units of air conditioning equipment have different cabinet dimensions for different horsepower ratings, and the locations of the sensors also vary. To ensure compatibility with outdoor units of different capacities, the wiring is usually set according to the maximum length, resulting in most wires being too long, leading to waste. Moreover, the need to organize and bundle these longer wires during production and installation further reduces production and installation efficiency. Summary of the Invention

[0005] This disclosure provides a heating, ventilation, and air conditioning system to solve or alleviate one or more technical problems in the prior art.

[0006] As a first aspect of the present disclosure, the present disclosure provides a heating, ventilation, and air conditioning system, including:

[0007] A heating, ventilation and air conditioning system includes a compressor module and at least one first heat exchange module, the compressor module and the at least one first heat exchange module are connected by a pipeline, and the compressor module is used to drive the heat exchange medium to circulate between the compressor module and the at least one first heat exchange module.

[0008] The control motherboard includes the first communication circuit.

[0009] At least one relay board, the relay board including a second communication circuit, the relay board being connected to at least two electrical components disposed in a heating, ventilation and air conditioning unit;

[0010] The first communication cable is connected to the first communication circuit and the second communication circuit respectively;

[0011] The relay board is used to send detection signals from the corresponding electrical components to the control main board via the first communication cable; and / or, the control main board is used to send control signals to the relay board via the first communication cable, so that the relay board controls the corresponding electrical components according to the control signals.

[0012] In some embodiments, the control board further includes a first power supply circuit, the relay board further includes a second power supply circuit, and the HVAC system further includes a first power cable. The first power supply circuit and the second power supply circuit are connected through the first power cable.

[0013] In some embodiments, the control motherboard further includes a first power supply circuit, the relay board further includes a second power supply circuit, the first communication cable is connected to the first communication circuit and the first power supply circuit, and is also connected to the second communication circuit and the second power supply circuit. The control motherboard and the relay board connected through the first communication cable are also used to transmit power signals through the first communication cable.

[0014] In some embodiments, there are multiple relay boards, including a first relay board closest to the control motherboard. The first relay board is connected to the control motherboard via a first communication cable. The HVAC system also includes a second communication cable, and the multiple relay boards are connected sequentially via the second communication cable.

[0015] In some embodiments, the plurality of relay boards include node relay boards and downstream relay boards. The downstream relay board is a relay board located after the node relay board in the communication line. The number of downstream relay boards is at least two. The relay board closest to the node relay board among the at least two downstream relay boards is connected to the node relay board via a second communication cable.

[0016] In some embodiments, the relay board further includes a second power supply circuit, one end of the second communication cable is connected to the second communication circuit and the second power supply circuit of the corresponding relay board, and the other end of the second communication cable is connected to the second communication circuit and the second power supply circuit of the corresponding relay board. The two relay boards connected by the second communication cable also transmit power signals through the second communication cable.

[0017] In some embodiments, a second power cable is also included, and the relay board further includes a second power circuit. The second power circuits of multiple relay boards are connected sequentially through the second power cable, and one second power cable is connected to the second power circuits of two relay boards respectively.

[0018] The second power supply circuit of the first relay board is connected to the control main board, or the second power supply circuit of the first relay board is connected to the power module.

[0019] In some embodiments, the plurality of relay boards include node relay boards and downstream relay boards, wherein the downstream relay board is a relay board located after the node relay board in the power line, and the number of downstream relay boards is at least two, wherein the relay board closest to the node relay board among the at least two downstream relay boards is connected to the node relay board via a second power cable.

[0020] In some embodiments, a second power cable is also included, and the relay board further includes a second power circuit. The second power circuits of multiple relay boards are connected sequentially via the second power cable, and the second power circuit of at least one of the multiple relay boards is connected to the power module.

[0021] In some embodiments, the relay board closest to the power module among a plurality of relay boards is connected to the power module.

[0022] In some embodiments, electrical components include sensors and / or loads.

[0023] In some embodiments, the sensor includes at least one of a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, a pressure switch, and a temperature switch;

[0024] The load includes at least one of the following: a two-way valve, a four-way valve, an electronic expansion valve, an electric heater, a compressor, and a fan with a heat exchange module.

[0025] In some embodiments, the relay board is connected to at least one sensor and at least one load. The relay board is used to receive detection signals from the sensor, send the detection signals to the control motherboard through a first communication cable, receive control signals from the control motherboard through the first communication cable, and control the load according to the control signals.

[0026] In some embodiments, the system further includes an electrical control box, in which the control motherboard and at least one relay board are located. The electrical control box is provided with a maintenance port, through which the control motherboard and the relay board are exposed when the maintenance port is open.

[0027] In some embodiments, the HVAC system includes an HVAC circuit, the HVAC circuit includes a four-way valve, the four-way valve is used to switch the HVAC system to a cooling mode or a heating mode, and at least one relay plate is disposed on the four-way valve.

[0028] In some embodiments, the HVAC system includes a HVAC circuit, an enthalpy-increasing circuit, and an auxiliary return gas circuit. The enthalpy-increasing circuit includes an auxiliary circuit of a subcooler and a first solenoid valve. The auxiliary return gas circuit includes an auxiliary circuit of a subcooler and a second solenoid valve. The auxiliary circuit of the subcooler includes a third port and a fourth port of the subcooler. The first and second ports of the subcooler are located in the HVAC circuit. The second port is also connected to the third port of the subcooler. The fourth port of the subcooler is connected to both the first and second solenoid valves. The other end of the second solenoid valve is connected to the inlet of a gas-liquid separator in the HVAC circuit. The other end of the first solenoid valve is connected to the enthalpy-increasing port of a compressor in the HVAC circuit. The first and second solenoid valves are connected to the same relay board. The relay board is also used to selectively control one of the first and second solenoid valves to be turned on according to a control signal received from the control main board.

[0029] In some embodiments, there are multiple relay boards, and the distance between the multiple electrical components connected to the same relay board and the relay board is less than or equal to a first preset value.

[0030] In some embodiments, there are multiple relay boards, with at least two relay boards located in different positions.

[0031] In some embodiments, the first microcontroller unit in the control motherboard is used to generate a corresponding control signal based on the detection signal received from at least one relay board, and is also used to perform fault analysis and prediction based on the detection signal and stored data.

[0032] In some embodiments, there are multiple relay boards, each relay board is assigned a unique address code, detection signals are configured with address codes, and control signals are configured with address codes.

[0033] In some embodiments, the first communication cable is a communication bus, and the second communication circuit of the relay board is connected to the first communication cable through a communication adapter cable.

[0034] In the technical solution of this disclosure embodiment, at least two electrical components installed in the HVAC system are no longer directly connected to the control main board, but are instead connected to a relay board. The relay board and the control main board are connected by a first communication cable, which greatly reduces the number of wires on the control main board, reduces interference around the control main board, and improves product performance. Furthermore, the position of the relay board can be set according to the position of the electrical components. For example, the relay board can be set at a location where multiple electrical components are concentrated, which can reduce the length of the wires between the electrical components and the relay board, reduce costs, and facilitate the organization and bundling of wires, thereby improving production and installation efficiency.

[0035] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this disclosure will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0036] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments according to this disclosure and should not be construed as limiting the scope of this disclosure.

[0037] Figure 1 is a schematic diagram of the connection between the control motherboard and multiple electrical components in the prior art;

[0038] Figure 2 is a connection diagram of the control section in an embodiment of the HVAC system of this disclosure;

[0039] Figure 3 is a connection diagram of the control section in a heating, ventilation and air conditioning system according to another embodiment of this disclosure;

[0040] Figure 4 is a connection diagram of the control section in a heating, ventilation and air conditioning system according to another embodiment of this disclosure;

[0041] Figure 5 is a connection diagram of the control section in a heating, ventilation and air conditioning system according to another embodiment of this disclosure;

[0042] Figure 6 is a schematic diagram of the piping connection of the heating and ventilation device in a heating and ventilation system according to an embodiment of the present disclosure;

[0043] Figure 7 is a schematic diagram of a relay plate installed on a four-way valve in one embodiment. Detailed Implementation

[0044] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this disclosure, and different embodiments can be combined arbitrarily without conflict. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0045] Figure 2 is a connection diagram of the control part in an HVAC system according to one embodiment of the present disclosure, and Figure 3 is a connection diagram of the control part in an HVAC system according to another embodiment of the present disclosure. As shown in Figures 2 and 3, the HVAC system includes an HVAC device, a control main board 10, at least one relay board 20, and a first communication cable C Cable1.

[0046] The HVAC system may include a compressor module and at least one first heat exchange module. The compressor module may include a compressor. The first heat exchange module may include a first heat exchanger. The compressor module and the at least one first heat exchange module are connected by piping. The compressor module is used to drive the flow of heat exchange medium between the compressor module and at least one first heat exchange module.

[0047] Exemplarily, the HVAC system may further include at least one second heat exchange module, and the compressor module is also connected to the at least one second heat exchange module via piping. One of the first and second heat exchange modules may be located indoors, and the other may be located outdoors. For example, the first heat exchange module may be located outdoors, and the second heat exchange module may be located indoors. The compressor module is used to drive the heat exchange medium to circulate between the at least one first heat exchange module and the at least one second heat exchange module. The first heat exchanger module is used to realize heat exchange between the heat exchange medium and the outdoor environment, and the second heat exchanger module is used to regulate the temperature of the target controlled space using the heat exchange medium.

[0048] The number of first heat exchange modules can be one or more. When there are multiple first heat exchange modules, they can be connected in parallel through pipelines. The number of second heat exchange modules can also be one or more. When there are multiple second heat exchange modules, they can be connected in parallel through pipelines. Solenoid valves can be installed in the pipelines of each first and second heat exchange module. By controlling the on / off state of the solenoid valves, the flow of heat exchange medium in each first and second heat exchange module can be controlled.

[0049] The control motherboard 10 is the core control module of the HVAC system. Exemplarily, the control motherboard 10 includes a first communication circuit and a first microcontroller unit (MCU1), the first communication circuit being connected to the first microcontroller unit. The control motherboard 10 may also include a first printed circuit board (PCB), the first microcontroller unit and the first communication circuit being disposed on the first PCB and connected via wires on the first PCB. In another embodiment, the first communication circuit may be integrated into the first microcontroller unit; that is, the first communication circuit is part of the first microcontroller unit.

[0050] The relay board 20 includes a second communication circuit and a second microprocessor unit (MCU2), the second communication circuit being connected to the second microcontroller unit. The relay board 20 is connected to at least two electrical components. These electrical components are located within a heating, ventilation, and air conditioning (HVAC) system. For example, the relay board 20 may include at least two peripheral interfaces, each with pins connected to the second microprocessor unit. The connection of at least two electrical components to the peripheral interfaces of the relay board 20 enables the connection between the electrical components and the second microprocessor unit, allowing the second microprocessor unit to receive signals from or send signals to the electrical components.

[0051] The relay board 20 may further include a second printed circuit board, on which the second microprocessor unit and the second communication circuit are disposed and connected via wires on the second printed circuit board. In another embodiment, the second communication circuit may be integrated into the second microcontroller unit, that is, the second communication circuit is part of the second microcontroller unit. The peripheral interface may be an electrical connector for connecting to electrical components, disposed on the second printed circuit board and connected to the second microprocessor unit via wires on the second printed circuit board. For example, the peripheral interface may be a socket, with wires from the electrical components connected to a plug, the plug being inserted into the corresponding socket to achieve the connection between the relay board 20 and the electrical components.

[0052] Electrical components are installed within the HVAC system. For example, electrical components may be installed within the piping of the HVAC system, or they may be installed close to other components or piping within the HVAC system. Electrical components include sensors and / or loads. Sensors may be installed within the piping of the HVAC system, on the outer wall of the piping, or in the environment surrounding the HVAC system. The placement of sensors can be determined based on their performance. Loads are actuators that require power to operate. For example, loads may be valves such as solenoid valves, four-way valves, and electronic expansion valves installed within piping; loads may also be actuators such as compressors, fans, and electric heaters.

[0053] The first communication cable C Cable1 is connected to the first communication circuit of the control motherboard and the second communication circuit of the relay board, respectively, so that the control motherboard 10 and the relay board 20 can communicate through the first communication cable C Cable1.

[0054] The relay board 20 is used or can transmit detection signals from corresponding electrical components to the control main board 10 via the first communication cable C Cable1. The control main board 10 is used or can transmit control signals to the relay board 20 via the first communication cable C Cable1, so that the relay board 20 controls the corresponding electrical components according to the control signals. Thus, the first communication cable C Cable1 can transmit the detection signals from the relay board 20 to the control main board 10; the first communication cable C Cable1 can also transmit the control signals generated by the control main board 10 to the relay board 20, so that the relay board 20 controls the corresponding electrical components.

[0055] For example, the relay board 20 can be connected to a sensor, and the relay board 20 sends the detection signal from the sensor to the control main board 10 through the first communication cable C Cable1. The relay board 20 can be connected to a load, and after the control main board 10 generates a control signal, it sends the control signal to the relay board 20 through the first communication cable C Cable1, so that the relay board 20 can control the load according to the control signal.

[0056] It should be noted that the detection signal in this article is the signal transmitted from the relay board 20 to the control motherboard 10. The detection signal comes from the sensor. It can be understood that the relay board 20 can directly collect the detection signal from the sensor, or it can also be understood that the relay board 20 processes the signal collected from the sensor and then uses the signal as the detection signal.

[0057] Upon receiving a detection signal, the control board 10 can generate a corresponding control signal. The control board 10 can also monitor the status of the HVAC system using the detection signal, and generate monitoring information or alarm information when necessary.

[0058] In related technologies, air conditioning equipment, especially high-capacity outdoor units such as multi-split and modular units, typically has multiple sensors and loads, totaling approximately dozens. As shown in Figure 1, the numerous sensors and loads are connected to the control board 10 from various points in the piping via multi-core wires, resulting in a large number of wires around the control board 10. Most of these wires are excessively long, leading to wire waste. Furthermore, during production and installation, the excessively long wires need to be organized and bundled, reducing production and installation efficiency.

[0059] It should be noted that Figure 1 schematically shows the number of core wires in the connecting wires between each sensor or load and the control motherboard 10. It is understood that the number of core wires used when connecting each electrical component to the control motherboard 10 is determined according to the characteristics of the electrical component and is not limited to the number of core wires shown in Figure 1.

[0060] In the technical solution disclosed herein, a control main board 10 and at least one relay board 20 are provided in the HVAC system. The second communication circuit of the relay board 20 is connected to the first communication line of the control main board 10 through a first communication cable C Cable 1. At least two electrical components installed in the HVAC device are connected to the relay board 20. The relay board 20 and the control main board 10 transmit signals through the first communication cable C Cable 1. That is, the relay board 20 can send detection signals from the corresponding electrical components to the control main board 10 through the first communication cable C Cable 1; and / or, the control main board 10 can send control signals to the relay board 20 through the first communication cable C Cable 1, so that the relay board 20 controls the corresponding electrical components according to the control signals. Therefore, in the HVAC system disclosed herein, at least two electrical components installed in the HVAC unit are no longer directly connected to the control main board 10, but are connected to the relay board 20. The relay board 20 and the control main board 10 are connected by a first communication cable C Cable1, which greatly reduces the number of wires on the control main board 10, reduces interference around the control main board 10, and improves product performance. Furthermore, the position of the relay board 20 can be set according to the position of the electrical components. For example, the relay board 20 can be set at a location where multiple electrical components are concentrated, which can reduce the length of wires between the electrical components and the relay board 20, reduce costs, and facilitate the organization and bundling of wires, thereby improving production and installation efficiency.

[0061] In actual implementation, there is at least one relay board 20. The specific number of relay boards 20 can be set as needed. For example, for multi-split units and modular units, multiple relay boards 20 can be set; for single-split units, one or more relay boards 20 can be used. The number of relay boards 20 can also be set according to the area where electrical components are concentrated. For example, in a HVAC system, there are multiple areas where electrical components are concentrated. One relay board 20 can be set in each area. All electrical components in the area are connected to the relay board 20. The relay board 20 is connected to the control main board 10 through the first communication cable C Cable1.

[0062] For example, there are multiple relay boards 20, and the distance between multiple electrical components connected to the same relay board 20 and the relay board 20 is less than or equal to a first preset value. Therefore, the length of the connecting wires between the electrical components and the relay board 20 is less than or equal to the first preset value. Typically, this connecting wire is part of the electrical component; therefore, the length of the connecting wires on each electrical component can be set to the first preset value. By setting the length of the connecting wires on each electrical component to the first preset value, when installing the electrical component, it is no longer necessary to consider whether the installation position of the electrical component is suitable; the electrical component can be installed arbitrarily, and the connection requirements with the relay board 20 can be met. This can further improve production and installation efficiency and facilitate the standardization of electrical component wire lengths.

[0063] For example, when there are multiple relay boards 20, at least two relay boards 20 are set in different positions, so that the connection of electrical components can be distributed, which helps to reduce the number of wires around the relay board 20, facilitates the organization and bundling of wires, and helps to improve production and installation efficiency.

[0064] Furthermore, in related technologies, sensors and loads are directly connected to the control motherboard 10, resulting in a large number of peripheral interfaces on the control motherboard 10 used for connecting to electrical components, thus making the control motherboard 10 larger and more complex in structure. In this disclosure, electrical components are connected to the relay board 20 instead of directly to the control motherboard 10, which greatly reduces the number of peripheral interfaces on the control motherboard 10, reduces the structural complexity of the control motherboard 10, reduces the size of the control motherboard 10, and helps to reduce costs.

[0065] For example, the first communication cable C Cable1 can adopt one of the communication protocols such as CAN, RS-232, RS-422, and RS-485. The number of core wires of the first communication cable C Cable1 can be determined according to the communication protocol.

[0066] In one embodiment, as shown in Figures 2 and 3, the control motherboard 10 further includes a first power supply circuit, which can be connected to an external power source. The first power supply circuit can convert the external power source into the power required by the control motherboard 10 to supply power to it. The first power supply circuit can also be connected to a first microcontroller unit to provide operating voltage to the first microcontroller unit.

[0067] The relay board 20 may also include a second power supply circuit. The HVAC system may also include a first power cable P Cable 1, and the first and second power supply circuits are connected via the first power cable P Cable 1. Thus, the first power supply circuit can supply power to the second power supply circuit, and the second power supply circuit supplies power to the relay board 20. The voltage provided by the first power supply circuit to the second power supply circuit can be the same as the voltage required by the relay board 20, so the voltage received by the second power supply circuit can be directly used by the relay board 20. For example, the second power supply circuit can be a voltage conversion circuit, which can convert the first voltage received from the first power supply circuit into the second voltage required by the relay board 20, and supply power to the relay board 20. In this way, it is no longer necessary to set up a separate external power supply for the relay board 20; instead, the control motherboard 10 supplies power to the relay board 20 via the first power cable P Cable 1, and only one first power cable P Cable 1 is needed to achieve this.

[0068] The second power supply circuit can be connected to the second microcontroller unit to provide operating voltage to the second microcontroller unit.

[0069] In another embodiment, the second power supply circuit of the relay board 20 can be connected to an external power source and is no longer powered by the control motherboard 10.

[0070] In the embodiments shown in Figures 2 and 3, a first communication cable CCable1 and a first power cable P Cable1 are connected between the relay board 20 and the control motherboard 10.

[0071] Figure 4 is a connection diagram of the control section in a HVAC system according to another embodiment of this disclosure. In one embodiment, as shown in Figure 4, the control main board 10 further includes a first power supply circuit, and the relay board 20 further includes a second power supply circuit. A first communication cable C Cable1 is connected to the first communication circuit and the first power supply circuit, and also to the second communication circuit and the second power supply circuit. For example, one end of the first communication cable C Cable1 is connected to the first communication circuit and the first power supply circuit, and the other end is connected to the second communication circuit and the second power supply circuit. The control main board 10 and the relay board 20, connected via the first communication cable, are also used to transmit power signals via the first communication cable C Cable1. Exemplarily, the control main board 10 may transmit power signals to the relay board 20 via the first communication cable C Cable1, or the relay board 20 may transmit power signals to the control main board 10 via the first communication cable C Cable1.

[0072] For example, the first communication cable C Cable1 can use carrier technology or LIN bus technology, so that the first communication cable C Cable1 can not only transmit communication between the control motherboard 10 and the relay board 20, but also transmit power signals between the control motherboard 10 and the relay board 20. Thus, only one cable is needed between the control motherboard 10 and the relay board 20 to realize communication and power transmission, further reducing the number of cables between the two and reducing costs.

[0073] Figure 5 is a connection diagram of the control section in a HVAC system according to another embodiment of this disclosure. When the number of relay boards 20 is small, electrical components that are far from the relay boards 20 may need to be connected to them, resulting in longer wiring and wasted wiring. For example, as shown in Figure 5, the number of relay boards 20 can be multiple. The positions of the multiple relay boards 20 can be set as needed. The multiple relay boards 20 include a first relay board 20 closest to the control main board 10; that is, the relay board 20 closest to the control main board 10 among the multiple relay boards 20 is called the first relay board 20. The first relay board 20 is connected to the control main board 10 via a first communication cable C Cable1. The HVAC system also includes a second communication cable C Cable2, and the multiple relay boards 20 are connected sequentially via the second communication cable C Cable2.

[0074] Multiple repeater boards 20 are connected sequentially via second communication cables C Cable 2. This should be understood as two repeater boards 20 being connected sequentially via second communication cables C Cable 2. For example, if the number of repeater boards n is 4, and repeater board 1# is the first repeater board, then the control motherboard is connected to repeater board 1# via the first communication cable; repeater board 1# is connected to repeater board 2# via the second communication cable; repeater board 2# is connected to repeater board 3# via the second communication cable; and repeater board 3# is connected to repeater board 4# via the second communication cable. The connection order of the four repeater boards can be set as needed, as long as the four repeater boards are connected sequentially via second communication cables C Cable 2. For example, in the above embodiment, repeater board 1# is connected to repeater board 3# via second communication cables C Cable 2; repeater board 3# is connected to repeater board 4# via second communication cables C Cable 2; and repeater board 4# is connected to repeater board 2# via second communication cables C Cable 2. It should be noted that n in Figure 5 is not limited to 4; n can be a positive integer greater than or equal to 2.

[0075] In this approach, the relay board closest to the control motherboard is defined as the first relay board. The first relay board is connected to the control motherboard via the first communication cable (C Cable1). Therefore, all other relay boards use the first relay board as a switching point to communicate with the control motherboard. Defining the relay board closest to the control motherboard as the first relay board reduces the length of the first communication cable, minimizes external interference to the first communication cable, and improves signal transmission accuracy and efficiency, thereby enhancing communication performance.

[0076] In one embodiment, the multiple relay boards include node relay boards and downstream relay boards. A downstream relay board is a relay board located after the node relay board in the communication line. There are at least two downstream relay boards, and the relay board closest to the node relay board among the at least two downstream relay boards is connected to the node relay board via a second communication cable C, Cable2. As shown in Figure 5, n is 4, and the node relay board can be relay board 1# and relay board 2#.

[0077] When the node relay board is relay board 1#, the corresponding downstream relay boards are relay board 2#, relay board 3#, and relay board 4#. The relay board closest to relay board 1# among relay board 2#, 3#, and 4# is connected to relay board 1# via the second communication cable C, Cable 2. For example, if relay board 2# is the closest relay board to relay board 1#, then relay board 2#, being closest to relay board 1#, is connected to relay board 1# via the second communication cable C, Cable 2.

[0078] When the node relay board is relay board 2#, the corresponding downstream relay boards are relay board 3# and relay board 4#. The relay board closest to relay board 2# between relay board 3# and relay board 4# is connected to relay board 2# via the second communication cable C, Cable 2. For example, if relay board 3# is the relay board closest to relay board 2#, then relay board 3#, which is closest to relay board 2#, is connected to relay board 2# via the second communication cable C, Cable 2.

[0079] For relay board 3#, the only subsequent relay board is relay board 4#. Therefore, relay board 4# is connected to relay board 3# via the second communication cable.

[0080] This connection method allows for the optimal length of each second communication cable, avoiding excessively long signal transmission distances between multiple repeater boards. This further improves the communication transmission performance between multiple repeater boards and reduces cable costs.

[0081] Typically, a communication socket can be installed on the repeater board, which is connected to the second communication circuit.

[0082] When a repeater board is located at an intermediate node of a communication line, and the repeater board (e.g., repeater board 1#, repeater board 2#, and repeater board 3# in Figure 5) needs to be connected to two second communication cables C Cable2 or simultaneously to the first communication cable C Cable1 and the second communication cable C Cable2, two communication sockets can be provided on the repeater board 20. Both communication sockets are connected to the second communication circuit; one communication socket is connected to one communication cable, and the other is connected to the other communication cable. Alternatively, if the two communication cables connected to the repeater board 20 use the same communication protocol, the repeater board 20 can be provided with one communication socket, and both communication cables with the same protocol can be connected to this communication socket. For example, in Figure 5, the first communication cable C Cable1 and the second communication cable C Cable2 use the same communication protocol, each repeater board 20 is provided with one communication socket, and both communication cables connected to the repeater board 20 are connected to this communication socket.

[0083] For example, one end of the second communication cable C Cable2 is connected to the second communication circuit and the second power supply circuit of the corresponding repeater board 20, and the other end of the second communication cable C Cable2 is also connected to the second communication circuit and the second power supply circuit of the corresponding repeater board 20. The two repeater boards 20 connected by the second communication cable C Cable2 also transmit power signals through the second communication cable C Cable2. In this way, the second communication cable C Cable2 can use carrier technology or LIN bus technology, etc., so that the second communication cable C Cable2 can not only transmit communication between the two repeater boards 20, but also transmit power signals between the two repeater boards 20. Therefore, only one cable is needed between the two repeater boards 20 to realize communication and power transmission, further reducing the number of cables between them and reducing costs.

[0084] For example, the second communication cable C Cable2 can also use one of the communication protocols such as CAN, RS-232, RS-422, and RS-485. The number of core wires in the second communication cable C Cable2 can be determined according to the communication protocol.

[0085] In one embodiment, the first communication cable C Cable1 can be a communication bus. One end of the first communication cable C Cable1 can be connected to the first communication circuit. The second communication circuit of the relay board 20 is connected to the first communication cable C Cable1 via a communication adapter cable. For example, the second communication circuit of each relay board 20 is connected to the first communication cable C Cable1 via a communication adapter cable. The first communication cable C Cable1 can adopt bus technology, thus, the first communication cable C Cable1 can serve as a communication bus, each relay board 20 is a node of the communication bus, the communication bus can extend along the arrangement position of the relay board 20, the relay board 20 is connected to the first communication cable C Cable1 via a communication adapter cable, and communicates with the control motherboard 10 through the first communication cable C Cable1.

[0086] As shown in Figure 5, the HVAC system may also include a second power cable P Cable2. The relay board 20 also includes a second power circuit, and the second power circuits of multiple relay boards 20 are connected sequentially via the second power cable P Cable2. One second power cable P Cable2 connects to the second power circuits of two relay boards 20 respectively. For example, in Figure 5, the number of relay boards 20, n, is 4. The second power circuit of relay board 1# is connected to the second power circuit of relay board 2# via the second power cable P Cable2; the second power circuit of relay board 2# is connected to the second power circuit of relay board 3# via the second power cable P Cable2; and the second power circuit of relay board 3# is connected to the second power circuit of relay board 4# via the second power cable P Cable2. The connection order of the four relay boards 20 can be set as needed, as long as the four relay boards 20 are connected sequentially via the second communication cable C Cable2. Therefore, by providing power to only one relay board 20, power can be provided to all n relay boards 20.

[0087] In one embodiment, the power supply for the relay board 20 can be provided by a power module, thereby allowing the second power circuit of at least one of the relay boards 20 to be connected to the power module. Exemplarily, the relay board 20 closest to the power module among the multiple relay boards 20 can be selected for connection to the power module; that is, the second power circuit of the relay board 20 closest to the power module among the multiple relay boards 20 is connected to the power module.

[0088] For example, the second power supply circuit of the first relay board 20 is connected to the control motherboard 10, or the second power supply circuit of the first relay board 20 is connected to a power module. The power supply for the relay board 20 can be provided by the control motherboard 10 or by a power module.

[0089] When the power supply of the relay board 20 is provided by the control motherboard 10, the first relay board 20 is the relay board 20 closest to the control motherboard 10 among the multiple relay boards 20. Setting the second power circuit of the first relay board 20 to be connected to the first power circuit of the control motherboard 10 can reduce the length of the first power cable P Cable1, further reduce the cost of the cable, and facilitate wiring.

[0090] When the power supply for the first relay board 20 is provided by the power module, the power module can be placed close to the first relay board 20, thereby reducing the length of the power cable between the first relay board 20 and the power module.

[0091] In one embodiment, the plurality of repeater boards 20 include node repeater boards 20 and downstream repeater boards 20. A downstream repeater board 20 is a repeater board 20 located after the node repeater board 20 in the power line, and the number of downstream repeater boards 20 is at least two. A downstream repeater board 20 can also be understood as a repeater board 20 located after the node repeater board 20 in the power transmission path. The repeater board 20 closest to the node repeater board 20 among the at least two downstream repeater boards 20 is connected to the node repeater board 20 via a second power cable P Cable2. As shown in Figure 5, n is 4, and the node repeater board 20 can be repeater board 1# and repeater board 2#.

[0092] When node relay board 20 is relay board 1#, the corresponding downstream relay boards 20 are relay board 2#, relay board 3#, and relay board 4#. The relay board 20 closest to relay board 1# among relay board 2#, relay board 3#, and relay board 4# is connected to relay board 1# via the second power cable P Cable 2. For example, if relay board 2# is the relay board closest to relay board 1#, then relay board 2# is connected to relay board 1# via the second power cable P Cable 2.

[0093] When the node relay board is relay board 2#, the corresponding downstream relay boards are relay board 3# and relay board 4#. The relay board closest to relay board 2# between relay board 3# and relay board 4# is connected to relay board 2# via a second power cable. For example, if relay board 3# is the relay board closest to relay board 2#, then relay board 3# is connected to relay board 2# via the second power cable.

[0094] For relay board 3#, the only subsequent relay board is relay board 4#. Therefore, relay board 4# is connected to relay board 3# via the second power cable.

[0095] This connection method allows for the optimal length of each second power cable P Cable2, avoiding excessively long power cables between multiple repeater boards 20, further reducing cable costs, and helping to reduce power consumption between the two repeater boards 20, thus reducing the overall power consumption of the product.

[0096] Typically, a power socket can be installed on the relay board 20, which is connected to the second power circuit.

[0097] When a repeater board is located at an intermediate node in a power supply line, and the repeater board (e.g., repeater board 1#, repeater board 2#, and repeater board 3# in Figure 5) needs to be connected to two second power cables or simultaneously to the first and second power cables, two power sockets can be installed on the repeater board. Both power sockets are connected to the second power circuit; one power socket is connected to one power cable, and the other is connected to the other power cable. Alternatively, repeater board 20 can be equipped with one power socket, and both power cables connected to repeater board 20 can be connected to this power socket. When the first power cable P Cable1 and the second power cable P Cable2 transmit the same power signal, the first repeater board 20 can also be equipped with one power socket.

[0098] For example, in Figure 5, the first power cable P Cable1 and the second power cable P Cable2 transmit the same power signal. A power socket is provided on the repeater board 20, and both power cables connected to the repeater board 20 are connected to the power socket. The power socket is connected to the second power circuit.

[0099] The power signal transmitted by the first power cable P Cable1 can be either an AC signal or a DC signal. If the load requires DC power, the relay board 20 can be directly connected to the control board 10 via the first power cable P Cable1, and the control board 10 can provide the operating voltage required by the load. For example, a power module can be installed in the electrical control box of the HVAC system. The power module can include a filter power board and a compressor fan drive board. The first power cable P Cable1 can also be connected to the filter power board or the compressor fan drive board, which will supply power to the relay board 20. The second power circuit on the relay board 20 can have functions such as voltage conversion, voltage regulation, and filtering, converting the input voltage on the relay board 20 into the operating voltage required by the load. If the relay board 20 is connected to an AC load, the input terminal of the second power circuit on the relay board 20 can be connected to an AC power source, and the second power circuit can have an AC-DC conversion function to supply power to the AC load, and can also convert AC power to DC power to supply power to the DC load. In other embodiments, multiple power cables can be provided as needed. These power cables can provide AC and DC power to the relay board 20 respectively, eliminating the need for the AC-DC conversion function of the second power supply circuit and reducing the cost of the relay board 20.

[0100] For example, the power module may also include a switching power supply, which is a module capable of converting AC power into different voltages, and a suitable switching power supply can be selected as needed.

[0101] It should be noted that in Figure 5, the control motherboard 10 and the first relay board are connected via a first communication cable CCable1 and a first power cable P Cable1, and the two relay boards are connected via a second communication cable C Cable2 and a second power cable P Cable2. It is understood that, according to the description in this disclosure, the control motherboard 10 and the first relay board can be connected via the first communication cable C Cable1, which is used to transmit communication signals and power signals; or, the two relay boards can be connected via the second communication cable C Cable2, which is also used to transmit communication signals and power signals.

[0102] In one embodiment, the first power supply circuit and the second power supply circuit require the same power. The first power cable P Cable1 can be a power bus. One end of the power bus can be connected to a power module. The first power supply circuit of the control motherboard 10 can be connected to the power bus through a first power adapter cable, and the second power supply circuit of the relay board 20 can be connected to the power bus through a second power adapter cable. Thus, both the control motherboard 10 and the relay board 20 are nodes of the power bus. The power bus can extend along the arrangement of multiple nodes, and the power circuits of each node are connected to the power bus through power adapter cables to obtain the required operating voltage from the power bus.

[0103] In this embodiment, the electrical components include sensors and / or loads. Sensors may include temperature sensors, pressure sensors, humidity sensors, gas sensors, pressure switches, temperature switches, and other detection devices used in HVAC systems. Loads may include two-way valves, four-way valves, electronic expansion valves, electric heaters, compressors, fans in heat exchange modules, and other electrically controlled actuators used in HVAC systems. Sensors and loads are not limited to the devices mentioned above; all sensors and loads used in HVAC systems are considered electrical components in this disclosure.

[0104] In one embodiment, as shown in Figures 3 and 4, the relay board 20 is connected to at least one sensor and at least one load. That is, the electrical components connected to the relay board 20 include at least one sensor and at least one load. Thus, the relay board 20 is used to receive detection signals from the sensors and transmit these signals to the control motherboard 10 via the first communication cable C Cable1. The relay board 20 is also used to receive control signals from the control motherboard 10 via the first communication cable CC Cable1 and control the load according to the control signals.

[0105] For example, after receiving the detection signal, the control motherboard 10 can compare the detection signal with the preset signal. When the detection signal does not meet the preset signal, the control motherboard 10 generates a corresponding control signal and sends the control signal to the corresponding relay board 20 through the first communication cable C Cable1, so that the relay board 20 can control the state of the load and thus realize the control of the HVAC system.

[0106] For example, in Figures 3 and 4, the relay board 20 is connected to n sensors and p loads. The relay board 20 can be equipped with n sensor sockets, each connected to the plugs of one of the n sensors. The relay board 20 can also be equipped with p load sockets, each connected to the plugs of one of the p loads. Therefore, the relay board 20 is connected to n+p electrical components. Figures 3 and 4 list some types of sensors and some types of loads. It is understood that in actual implementation, the types of sensors and loads can be set as needed and are not limited to those listed in Figures 3 and 4.

[0107] After receiving the detection signal, the control motherboard 10 can also display the detection signal so that users can understand the status of the HVAC system in a timely manner; when the detection signal reaches the warning signal, the control motherboard 10 can also issue an alarm message.

[0108] The HVAC system may also include an electrical control box, within which a main control board 10 and at least one relay board 20 are located. The electrical control box is provided with a maintenance access port, through which both the main control board 10 and the relay board 20 are exposed when the maintenance access port is open. The electrical control box can protect the main control board 10 and the relay board 20 located within it, and the maintenance access port facilitates the maintenance of the main control board 10 and the relay board 20.

[0109] Figure 6 is a schematic diagram of the piping connection of a heating and ventilation (HVAC) device in an embodiment of this disclosure. The HVAC device shown in Figure 6 includes a compressor, a first heat exchange module, and a second heat exchange module, which are connected by piping. The compressor module drives a heat exchange medium, such as refrigerant, to flow between the first and second heat exchange modules. As shown in Figure 6, the HVAC device includes a heating and ventilation circuit, which may include a circuit composed of the compressor, the first heat exchange module, and the second heat exchange module. The HVAC circuit also includes a four-way valve with four pipe ports: port A1, port A2, port A3, and port A4. The four-way valve is used to switch the HVAC device between cooling and heating modes. Taking the four-way valve configuration in Figure 6 as an example, the HVAC circuit includes: compressor INV1 outlet → oil separator O / S → check valve DXF1 → four-way valve ST1 pipe interface A1 → four-way valve ST1 pipe interface A2 → first heat exchange module HR1 → filter GLQ1 → electronic expansion valve EXVA1 → subcooler GLQ B1 → subcooler GLQ B2 → filter GLQ2 → second heat exchange module HR2 → filter GLQ3 → four-way valve ST1 pipe interface A4 → four-way valve ST1 pipe interface A3 → gas-liquid separator ACC → filter GLQ4 → compressor INV1 inlet. The first heat exchange module HR1 can be located outdoors, and the second heat exchange module HR2 can be located indoors. In cooling mode, the four-way valve ST1 is connected with A1 and A2, and with A4 and A3, as shown in Figure 6; in heating mode, the four-way valve ST1 is connected with A1 and A4, and with A2 and A3.

[0110] As shown in Figure 6, in the HVAC circuit, a high-temperature sensor T7C1 and a low-temperature sensor T71 are respectively installed at the outlet and inlet of compressor INV1; a high-pressure switch HPS1 is installed between oil separator O / S and check valve DXF1; a high-pressure sensor HP is installed between check valve DXF1 and pipe interface A1 of four-way valve ST1; multiple temperature sensors T3, T4, and T8 are installed around the first heat exchange module HR1; a temperature sensor TL is installed between filter GLQ1 and electronic expansion valve EXVA1; a temperature sensor T5 is installed between subcooler B2 and filter GLQ2; and a low-pressure sensor LP is installed between pipe interface A3 of four-way valve ST1 and gas-liquid separator ACC. In addition, the loads in the HVAC circuit also include the compressor, the fan of the first heat exchange module HR1, and the fan of the second heat exchange module HR2. It should be noted that the sensors and loads in the HVAC circuit are not limited to those shown in Figure 6; other sensors and loads can also be installed, which will not be listed here. As can be seen, there are many sensors and loads in the HVAC circuit, and they are scattered in different locations. If all these sensors and loads are directly connected to the control board 10, as shown in Figure 1, it will result in a lot of wires around the control board 10, which is not conducive to the organization and bundling of the wires, and will also cause waste of wires.

[0111] By adopting the technical solution of this disclosure, a relay board 20 can be set in the area where electrical components are concentrated. For example, in Figure 6, a relay board 20A is set near the first heat exchange module HR1. Then, the surrounding sensors and loads can be connected to the relay board 20A, which reduces the wire length of electrical components, facilitates the connection of electrical components, and facilitates the organization and bundling of wires.

[0112] In actual implementation, multiple temperature sensors, pressure sensors, and pressure switches are installed around the four-way valve ST1. To facilitate the connection of electrical components around the four-way valve ST1, at least one relay board 20 is installed on the four-way valve ST1.

[0113] Figure 7 is a schematic diagram of a relay plate provided on a four-way valve in one embodiment. As shown in Figure 7, the relay plate 20 can be set at the intersection of the pipeline of the four-way valve ST1. Thus, the relay plate 20 is relatively close to the sensors and loads around the four-way valve ST1, which facilitates the connection of the four-way valve and the surrounding sensors and loads to the relay plate 20. In addition, the length of the connecting wires between these sensors and loads and the relay plate 20 is relatively short, which reduces the cost of the wires and facilitates the arrangement and bundling of the wires.

[0114] For example, a mounting box 30 can be installed at the intersection of the four-way valve pipeline, and a relay plate 20 can be installed inside the mounting box 30.

[0115] As shown in Figure 6, the HVAC system also includes a pressure relief circuit, which consists of: outlet of check valve DXF1 → solenoid valve SV7 → inlet of gas-liquid separator ACC. When the high-pressure sensor HP detects that the pressure in the pipeline is greater than the preset value, it controls the solenoid valve SV7 to open, the pressure relief circuit is activated, and the heat exchange medium flows through the solenoid valve SV7 into the gas-liquid separator ACC, thus relieving the pressure in the pipeline between the check valve DXF1 and the pipe interface A1 of the four-way valve ST1.

[0116] The HVAC system also includes an oil drain circuit, which consists of: the oil discharge port of the oil separator O / S → filter GLQ5 → gas-liquid separator ACC, discharging the oil collected by the oil separator O / S.

[0117] The HVAC system may also include a subcooler GLQ, which includes a main circuit and an auxiliary circuit. The main circuit includes a first port B1 and a second port B2, and the auxiliary circuit includes a third port B3 and a fourth port B4. The main circuit of the subcooler GLQ is connected to the HVAC circuit, that is, the first port B1 and the second port B2 of the subcooler GLQ are located in the HVAC circuit.

[0118] The HVAC system also includes an enthalpy-increasing circuit and an auxiliary return gas circuit. The enthalpy-increasing circuit includes an auxiliary circuit for the subcooler GLQ and a first solenoid valve SV8A. The auxiliary return gas circuit includes the subcooler GLQ and a second solenoid valve SV5. The second port B2 of the subcooler GLQ is also connected to the third port B3 of the subcooler GLQ, and the fourth port B4 of the subcooler is connected to both the first solenoid valve SV8A and the second solenoid valve SV5. The other end of the second solenoid valve SV5 is connected to the inlet of the gas-liquid separator ACC in the HVAC circuit, and the other end of the first solenoid valve SV8A is connected to the enthalpy-increasing port of the compressor in the HVAC circuit. The first and second solenoid valves are connected to the same relay board 20, which is also used to selectively control one of the first solenoid valve SV8A and the second solenoid valve SV5 to be turned on according to the control signal received from the control main board 10. That is, the relay board 20 controls the first solenoid valve SV8A to be turned off and the second solenoid valve SV5 to be turned on, or the first solenoid valve SV8A to be turned on and the second solenoid valve SV5 to be turned off.

[0119] As shown in Figure 6, exemplarily, the enthalpy-increasing circuit may include: the second port B2 of the subcooler GLQ → the electronic expansion valve EXVC2 → the third port B3 of the subcooler GLQ → the fourth port B4 of the subcooler GLQ → the first solenoid valve SV8A → the enthalpy-increasing port of the compressor INV1.

[0120] The auxiliary return gas circuit may include: the fourth port B4 of the subcooler GLQ → the second solenoid valve SV5 → the gas-liquid separator ACC.

[0121] For the subcooler GLQ, after the heat exchange medium flows from B1 to B2, the temperature of the heat exchange medium becomes lower; a portion of the low-temperature heat exchange medium flowing out from B2 passes through the auxiliary path of the subcooler GLQ to cool the heat exchange medium in the main path.

[0122] When heating at low temperatures (i.e., heating when the ambient temperature is very low), the relay board 20 controls the second solenoid valve SV5 to close and the first solenoid valve SV8A to open, and the enthalpy increase circuit to open, according to the received control signal. Under other operating conditions, the relay board 20 controls the first solenoid valve SV8A to close and the second solenoid valve SV5 to open, according to the received control signal. The subcooler auxiliary return gas circuit is opened, and the heat exchange medium flowing out of B4 of the subcooler GLQ flows back to the gas-liquid separator ACC through the second solenoid valve SV5.

[0123] The on / off states of the first solenoid valve SV8A and the second solenoid valve SV5 are associated. By setting the first solenoid valve SV8A and the second solenoid valve SV5 to be connected to the same relay board 20, the control accuracy and timeliness of the first solenoid valve SV8A and the second solenoid valve SV5 can be improved, and the simultaneous conduction or closure of the two solenoid valves due to communication lag can be avoided.

[0124] As can be seen from the above description of the various circuits in the HVAC system, the sensors and loads in the HVAC system are not limited to the HVAC circuits. Multiple sensors and / or loads are also installed in the pressure relief circuit, enthalpy increase circuit, and auxiliary return gas circuit. In actual implementation, more relay boards 20 can be installed as needed to connect more sensors and / or loads.

[0125] It should be noted that Figure 6 only schematically shows the piping connection method of the HVAC system. In other embodiments, the piping connection of the HVAC system can be changed or adjusted as needed, and all of these are within the protection scope of the HVAC system disclosed herein.

[0126] In the HVAC system of this disclosure embodiment, when the number of electrical components is large, multiple relay boards 20 can be set as needed. To allow the control motherboard 10 to distinguish between each relay board 20 during communication, each relay board 20 can be assigned a unique address code. The control motherboard 10 can act as a communication master, and each relay board 20 can act as a communication slave with a different address.

[0127] The detection signal can be configured with an address code. When the relay board 20 sends a detection signal to the control motherboard 10, the detection signal is configured with an address code. Thus, the relay board 20 sends both the detection signal and its corresponding address code to the control motherboard 10. When the control motherboard 10 receives the detection signal and the address code, it can identify the source of the detection signal and monitor the pipeline or environmental status at the corresponding location in order to generate the corresponding control signal.

[0128] The control signal can also be configured with an address code. When the control motherboard 10 sends a control signal to the relay board 20, the control signal is configured with the address code corresponding to the relay board 20. Thus, the control signal and the address code are sent to the corresponding destination relay board 20, which facilitates the relay board 20 to accurately control the load.

[0129] By configuring the detection signal with the address code corresponding to the relay board 20 and the control signal with the address code corresponding to the relay board 20, the accuracy of signal transmission of the first communication cable C Cable1 is improved, thereby improving the precision and accuracy of HVAC system control.

[0130] The detection signal is configured with an address code. For example, the detection signal can be set with a flag bit, which is used to set the address code of the relay board 20; or, the relay board 20 can send both the detection signal and the address code to the control motherboard 10 at the same time.

[0131] The control signal is configured with an address code. For example, the control signal can be set with an identifier bit, which is used to set the address code of the relay board 20; or, the control motherboard 10 can send both the control signal and the address code to the relay board 20 at the same time.

[0132] In this disclosed technical solution, the electrical components are no longer connected to the control mainboard 10, but instead to the relay board 20. After receiving the acquisition signals from the electrical components, the relay board 20 processes the signals to generate detection signals, which are then transmitted to the control mainboard 10 via the first communication cable C Cable1. The first microcontroller unit in the control mainboard 10 generates corresponding control signals based on the detection signals received from at least one relay board 20. In this way, the control mainboard 10 no longer needs to process the sensor acquisition signals, saving resources of the first microcontroller unit in the control mainboard 10. Therefore, the first microcontroller unit can also be used for fault analysis and prediction based on the detection signals and stored data, which is beneficial for pre-controlling the HVAC system, ensuring its operation, and improving its operational safety.

[0133] In this disclosed HVAC system, at least two electrical components located in the HVAC unit are no longer directly connected to the control main board 10, but instead connected to a relay board 20. The relay board 20 and the control main board 10 are connected via a first communication cable C Cable 1. The relay board 20 calculates and processes the sensor's acquired signals to generate detection signals, which are then sent to the control main board 10 via the first communication cable C Cable 1. The control main board 10 generates corresponding control signals based on the detection signals and sends these control signals to the corresponding relay board 20 via the first communication cable C Cable 1. The relay board 20 then controls the corresponding load's operating state. Each electrical component is connected to the relay board 20, resulting in a relatively short distance between the component and the relay board 20. This saves on wiring length, facilitates wiring organization and bundling, significantly improves wiring efficiency, and reduces the cost of electrical components. The larger the HVAC system capacity, the more significant the cost reduction. Each electrical component is located near its corresponding relay board 20, reducing the impact of the enclosure size on the length of the electrical component's wires. This facilitates the standardization of electrical component wire lengths, laying the foundation for automated wiring and the sealed design of the electrical control box.

[0134] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0135] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this disclosure, "multiple" means two or more, unless otherwise explicitly specified.

[0136] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0137] In this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0138] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this disclosure. To simplify this disclosure, the components and arrangements of specific examples are described above. Of course, these are merely examples and are not intended to limit this disclosure. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0139] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this disclosure. Different parts of different embodiments can be combined with each other without conflict, and these should all be covered within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A heating, ventilation, and air conditioning system, comprising: include: A heating, ventilation, and air conditioning (HVAC) system includes a compressor module and at least one first heat exchange module, wherein the compressor module and the at least one first heat exchange module are connected by a pipeline, and the compressor module is used to drive a heat exchange medium to circulate at least between the compressor module and the at least one first heat exchange module; The control motherboard includes the first communication circuit. At least one relay board, the relay board including a second communication circuit, the relay board being connected to at least two electrical components disposed in the HVAC system; A first communication cable is connected to both the first communication circuit and the second communication circuit. The relay board is used to send detection signals from the corresponding electrical components to the control main board via the first communication cable; and / or, the control main board is used to send control signals to the relay board via the first communication cable, so that the relay board controls the corresponding electrical components according to the control signals.

2. The heating system of claim 1, wherein, The control board further includes a first power supply circuit, the relay board further includes a second power supply circuit, and the HVAC system further includes a first power cable. The first power supply circuit and the second power supply circuit are connected through the first power cable.

3. The heating system of claim 1, wherein, The control motherboard further includes a first power supply circuit, and the relay board further includes a second power supply circuit. The first communication cable is connected to the first communication circuit and the first power supply circuit, and is also connected to the second communication circuit and the second power supply circuit. The control motherboard and the relay board connected through the first communication cable are also used to transmit power signals through the first communication cable.

4. The heating system according to any one of claims 1 to 3, wherein The number of relay boards is multiple, including a first relay board closest to the control motherboard. The first relay board is connected to the control motherboard via the first communication cable. The HVAC system also includes a second communication cable, and the multiple relay boards are connected sequentially via the second communication cable.

5. The heating system of claim 4, wherein, The plurality of relay boards include node relay boards and downstream relay boards. The downstream relay board is a relay board located after the node relay board in the communication line. There are at least two downstream relay boards. The relay board closest to the node relay board among the at least two downstream relay boards is connected to the node relay board through the second communication cable.

6. The heating system of claim 4, wherein, The relay board also includes a second power supply circuit. One end of the second communication cable is connected to the second communication circuit and the second power supply circuit of the corresponding relay board, and the other end of the second communication cable is connected to the second communication circuit and the second power supply circuit of the corresponding relay board. The two relay boards connected by the second communication cable also transmit power signals through the second communication cable.

7. The heating system of claim 4, wherein, It also includes a second power cable, and the relay board also includes a second power circuit. The second power circuits of the plurality of relay boards are connected in sequence through the second power cable, and one second power cable is connected to the second power circuits of two relay boards respectively. The second power supply circuit of the first relay board is connected to the control main board, or the second power supply circuit of the first relay board is connected to the power module.

8. The heating system of claim 7, wherein, The plurality of relay boards include node relay boards and downstream relay boards. The downstream relay board is a relay board located after the node relay board in the power line. There are at least two downstream relay boards. The relay board closest to the node relay board among the at least two downstream relay boards is connected to the node relay board through the second power cable.

9. The heating system of claim 4, wherein, It also includes a second power cable, and the relay board also includes a second power circuit. The second power circuits of the plurality of relay boards are connected in sequence through the second power cable, and the second power circuit of at least one of the plurality of relay boards is connected to the power module.

10. The heating system of claim 9, wherein, The relay board closest to the power module among the plurality of relay boards is connected to the power module.

11. The heating system of claim 1, wherein, The electrical components include sensors and / or loads.

12. The heating system of claim 11, wherein, The sensor includes at least one of a temperature sensor, a pressure sensor, a humidity sensor, a gas sensor, a pressure switch, and a temperature switch; The load includes at least one of a two-way valve, a four-way valve, an electronic expansion valve, an electric heater, a compressor, and a fan with a heat exchange module.

13. The heating system of claim 11, wherein, The relay board is connected to at least one sensor and at least one load. The relay board is used to receive detection signals from the sensor and send the detection signals to the control motherboard through the first communication cable. It also receives control signals from the control motherboard through the first communication cable and controls the load according to the control signals.

14. The heating system of claim 1, wherein, It also includes an electrical control box, in which the control motherboard and at least one of the relay boards are located. The electrical control box is provided with a maintenance port, through which the control motherboard and the relay board are exposed when the maintenance port is open.

15. The heating system of claim 1, wherein, The HVAC system includes an HVAC circuit, the HVAC circuit includes a four-way valve, the four-way valve is used to switch the HVAC system to a cooling mode or a heating mode, and at least one relay plate is disposed on the four-way valve.

16. The heating system of claim 1, wherein, The HVAC system includes an HVAC circuit, an enthalpy-increasing circuit, and an auxiliary return gas circuit. The enthalpy-increasing circuit includes an auxiliary circuit for a subcooler and a first solenoid valve. The auxiliary return gas circuit includes an auxiliary circuit for a subcooler and a second solenoid valve. The auxiliary circuit for the subcooler includes a third port and a fourth port of the subcooler. The first and second ports of the subcooler are located in the HVAC circuit. The second port is also connected to the third port of the subcooler. The fourth port of the subcooler is connected to both the first and second solenoid valves. The other end of the second solenoid valve is connected to the inlet of the gas-liquid separator in the HVAC circuit. The other end of the first solenoid valve is connected to the enthalpy-increasing port of the compressor in the HVAC circuit. The first and second solenoid valves are connected to the same relay board. The relay board is also used to selectively control one of the first and second solenoid valves to be turned on according to the control signal received from the control main board.

17. The heating system of claim 1, wherein, The number of relay boards is multiple, and the distance between the multiple electrical components connected to the same relay board and the relay board is less than or equal to a first preset value.

18. The heating system of claim 1, wherein, The number of relay boards is multiple, and at least two of the relay boards are set in different locations.

19. The heating system of claim 1, wherein, The first micro-control unit in the control mainboard is configured to generate corresponding control signals according to detection signals received from at least one of the relay boards, and to perform fault analysis and prediction according to the detection signals and stored data.

20. The heating system of claim 1, wherein, The number of the relay boards is multiple, each of the relay boards is provided with a unique address code, the detection signals are configured with the address code, and the control signals are configured with the address code.

21. The heating system of claim 1, wherein, The first communication cable is a communication bus, and the second communication circuit of the relay board is connected with the first communication cable through a communication adapter.

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