Resin composition, adhesive, cured objects, semiconductor device, and electronic component

Abstract

Provided are a resin composition which cures at low temperatures to give cured objects having low electrical resistance, an adhesive including the resin composition, cured objects, and a semiconductor device and an electronic component which include these cured objects. The present invention relates to: a resin composition comprising (A) a heat-curable resin, (B) a hardener or a free-radical polymerization initiator, (C) electroconductive particles, and (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides; an adhesive including the resin composition; cured objects; and a semiconductor device and an electronic component which include these cured objects.

Description

Resin compositions, adhesives, cured products, semiconductor devices and electronic components

[0001] The present invention relates to resin compositions, adhesives containing resin compositions, cured products, semiconductor devices, and electronic components containing these cured products.

[0002] With the widespread adoption of high-performance communication devices such as smartphones and tablets, there is a growing demand for lighter, smaller, and thinner products. Furthermore, the IoT (Internet of Things) market, where various devices are connected to the internet, is rapidly growing. While various devices, including smartphones, are being developed as IoT applications, there are challenges in manufacturing them at high temperatures due to the materials used. For example, soldering components can involve temperatures exceeding 180°C, which can damage the components depending on the material.

[0003] For example, Patent Document 1 discloses a conductive paste that can be heat-treated at 200°C and can produce a conductive film with low electrical resistivity, comprising silver powder surface-treated with a liquid fatty acid, a thermosetting resin and / or a thermoplastic resin, and a diluent.

[0004] Japanese Patent Publication No. 2016-106356

[0005] In order to manufacture semiconductor devices and electronic components, there is a need for compositions that can form conductive films at temperatures even lower than 200°C, for example, 100°C or below, depending on the material of the components, in order to reduce environmental impact and to form conductive films with low electrical resistivity.

[0006] Therefore, the present invention aims to provide a resin composition, an adhesive, and their cured products, as well as a semiconductor device or electronic component containing these cured products, that can form a conductive cured product at a low temperature, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower, and that can form a cured product having low electrical resistivity.

[0007] The means for solving the aforementioned problems are as follows, and the present invention encompasses the following embodiments.

[0008] [1] A resin composition comprising (A) a thermosetting resin, (B) a curing agent or radical polymerization initiator, (C) conductive particles, and (D) a surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides. [2] The resin composition according to [1], wherein the (A) thermosetting resin comprises at least one selected from the group consisting of (A1) a compound having an epoxy group, (A2) a compound having a (meth)acryloyl group, and (A3) a bismaleimide compound. [3] The insulating composition according to [1] or [2], wherein the (B) curing agent or radical polymerization initiator is an amine-based latent curing agent or an organic peroxide. [4] The resin composition according to any one of [1] to [3], wherein the (C) conductive particles include silver particles. [5] The resin composition according to any one of [1] to [4], wherein the (D) surface treatment agent includes a saturated fatty acid amide having 10 or more carbon atoms. [6] The resin composition according to any one of [1] to [5], wherein the (D) surface treatment agent comprises stearic acid amide. [7] The resin composition according to any one of [1] to [4], wherein the (D) surface treatment agent comprises a saturated fatty acid ester having 10 or more carbon atoms. [8] The resin composition according to any one of [1] to [4] or [7], wherein the (D) surface treatment agent comprises a sorbitan fatty acid ester. [9] The resin composition according to any one of [1] to [4], [7] or [8], wherein the (D) surface treatment agent comprises sorbitan monostearate.

[10] The resin composition according to any one of [1] to [9], wherein when the total mass of the resin composition is 100% by mass, the sum of the (C) conductive particles and the (D) surface treatment agent is in the range of 60% by mass or more and 95% by mass or less.

[11] The resin composition according to any one of [1] to

[10] , wherein the (C) conductive particles include (C1) first conductive particles treated with the (D) surface treatment agent, and may also include (C2) second conductive particles treated with a (D') surface treatment agent other than the (D) surface treatment agent.

[12] The resin composition according to

[11] , wherein when the (C) conductive particles are (C1) first conductive particles treated with the (D) surface treatment agent, the amount of the (D) surface treatment agent is in the range of 0.01 parts by mass or more and 1.0 parts by mass or less, when the conductive particles to be treated are 100 parts by mass.

[13] The resin composition according to any one of [1] to

[10] , wherein when the total mass of the resin composition is 100% by mass, the (D) surface treatment agent is in the range of 0.005% by mass or more and 0.95% by mass or less.

[14] An adhesive comprising the resin composition according to any one of [1] to

[13] .

[15] A cured product obtained by curing the resin composition according to any one of [1] to

[13] or the adhesive according to

[14] .

[16] A semiconductor device or electronic component comprising the cured product according to

[15] .

[0009] The present invention provides a resin composition, an adhesive, and their cured products, as well as a semiconductor device or electronic component containing these cured products, which can form a conductive cured product at a low temperature, for example, 100°C or lower, preferably 80°C or lower, and which can form a cured product having low electrical resistivity.

[0010] This is a schematic diagram showing a zigzag pattern for measuring the volume resistivity of cured resin compositions of the examples and comparative examples.

[0011] The following description is based on the resin compositions described herein. The embodiments shown below are illustrative examples for embodying the technical concept of the present invention, and the present invention is not limited to the resin compositions described below. In this specification, "~" means to include the upper and lower limits of the numerical values ​​or symbols containing numerical values ​​described before and after it, and thus represents the following. In this invention, "resin composition" refers to a composition that appropriately includes (A) a thermosetting resin, (B) a curing agent or radical polymerization initiator, (C) conductive particles, and at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, and other optional components such as coupling agents as needed.

[0012] The resin composition comprises (A) a thermosetting resin, (B) a curing agent or radical polymerization initiator, (C) conductive particles, and (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides.

[0013] Resin compositions containing conductive particles are used as raw materials for forming electrodes and circuit patterns of electronic components. For example, a paste-like resin composition containing conductive particles is applied to a substrate by screen printing or the like. The conductive paste described in Patent Document 1 above is cured at a temperature of about 200°C, and the conductive particles are brought into contact to form conductive paths and electrodes or circuit patterns. The conductive particles used are surface-treated with a surface treatment agent to improve wettability with the resin. In Patent Document 1 above, the surface of silver powder, which is a conductive particle, is surface-treated with a liquid fatty acid, and since the liquid fatty acid dissolves easily in a diluent and evaporates together with the diluent, a cured product is obtained at a relatively low temperature of about 200°C.

[0014] Given the widespread use of high-performance communication terminals, there is a need for resin compositions that can produce cured products at temperatures even lower than 200°C, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower, and that also produce cured products with low electrical resistivity.

[0015] The resin composition comprises (A) a thermosetting resin, (B) a curing agent or radical polymerization initiator, (C) conductive particles, and (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides. This allows for curing at low temperatures, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower, and yields a cured product with low electrical resistivity.

[0016] The resin composition contains at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, which improves the wettability between (A) the thermosetting resin and (C) the conductive particles, and improves the dispersibility of (C) the conductive particles in the resin composition. Furthermore, the resin composition contains at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, which is easily decomposed or peeled off at low temperatures, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower, which increases the contact area between (C) conductive particles, forms conductive paths in the cured product, and allows for the production of a cured product with low electrical resistance.

[0017] In this specification, the at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides may be at least one selected from the group consisting of fatty acid esters and fatty acid amides that is not used in the name of (D) surface treatment agent, as long as it improves the wettability between (A) thermosetting resin and (C) conductive particles and improves the dispersibility of (C) conductive particles in the resin composition. For example, the at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides may also be used in the name of rust inhibitor, waterproofing agent or surfactant. Even if it is used in the name of rust inhibitor, waterproofing agent or surfactant, in a resin composition that contains at least one compound selected from the group consisting of fatty acid esters and fatty acid amides, the at least one compound selected from the group consisting of fatty acid esters and fatty acid amides corresponds to the at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides in the resin composition of this specification. Furthermore, the at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides may also function as a curing accelerator when curing (A) thermosetting resin. Even when at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides cures (A) a thermosetting resin, it is preferable that the curing agent (B) for curing (A) the thermosetting resin or a radical polymerization initiator is included in order to obtain a cured product.

[0018] The thermosetting resin (A) contained in the resin composition may be any resin that undergoes a polymerization reaction upon heating, forming a three-dimensional network structure and hardening. Such a thermosetting resin (A) preferably contains at least one selected from the group consisting of (A1) compounds having epoxy groups, (A2) compounds having (meth)acryloyl groups, and (A3) bismaleimide compounds. The thermosetting resin (A) contains at least one selected from the group consisting of (A1) compounds having epoxy groups, (A2) compounds having (meth)acryloyl groups, and (A3) bismaleimide compounds, and one of these may be used alone, or two or more may be used in combination. For example, the thermosetting resin (A) may use a compound having epoxy groups (A1), or it may be a combination of two compounds: a compound having (meth)acryloyl groups and a bismaleimide compound (A2). The thermosetting resin (A) may also use a combination of two or more compounds having epoxy groups (A1). (A) The thermosetting resin may be a combination of two or more (A2) compounds having (meth)acryloyl groups and two or more (A3) bismaleimide compounds.

[0019] (A1) The compound having epoxy groups is preferably a compound having at least two epoxy groups. (A1) The compound having epoxy groups is preferably an epoxy resin containing a compound having at least two epoxy groups. An epoxy resin is a thermosetting resin in which epoxy groups present in the molecule of the compound crosslink to form a network, and a cured product can be obtained. The epoxy resin includes the prepolymer compound before curing. If heat resistance is required for the cured product, the epoxy resin is more preferably having 2 to 6 epoxy groups, and even more preferably having 2 epoxy groups. The epoxy resin may be liquid at 25°C or solid at 25°C. The epoxy resin is preferably liquid at 25°C.

[0020] Epoxy resins are broadly classified into aromatic epoxy resins and epoxy resins that do not contain aromatic rings. Aromatic epoxy resins are epoxy resins that have a structure containing aromatic rings such as benzene rings. Examples of aromatic epoxy resins include: - Bisphenol A type epoxy resins; - Branched polyfunctional bisphenol A type epoxy resins such as p-glycidyloxyphenyldimethyltrisbisphenol A diglycidyl ether; - Bisphenol F type epoxy resins; - Novolac type epoxy resins; - Tetrabromobisphenol A type epoxy resins; - Fluorene type epoxy resins; - Biphenyl aralkyl type epoxy resins; - Diepoxy compounds such as 1,4-phenyldimethanol diglycidyl ether; - Biphenyl type epoxy resins such as 3,3',5,5'-tetramethyl-4,4'-diglycidyloxybiphenyl; - Glycidylamine type epoxy resins such as diglycidylaniline, diglycidyltoluidine, triglycidyl-p-aminophenol, and tetraglycidyl-m-xylylenediamine; and - Naphthalene ring-containing epoxy resins; - Mixtures of bisphenol A type epoxy resins and bisphenol F type epoxy resins. - Examples include copolymers of bisphenol F and 1,6-hexanediol diglycidyl ether. The epoxy resins described above may be used individually or in combination of two or more types.

[0021] Preferred aromatic epoxy resins include bisphenol F type epoxy resin, bisphenol A type epoxy resin, a mixture of bisphenol A type epoxy resin and bisphenol F type epoxy resin, a copolymer of bisphenol F and 1,6-hexanediol diglycidyl ether, and glycidylamine type epoxy resin, with those having an epoxy equivalent of 90 to 500 g / eq being more preferred, and those having an epoxy equivalent of 90 to 400 g / eq being even more preferred. The aromatic epoxy resin may be modified by oxyalkylene modification such as EO (ethylene oxide) modification or PO (propylene oxide) modification. Furthermore, the aromatic epoxy resin is preferably liquid at 25°C. Furthermore, the viscosity at 25°C is preferably 0.1 to 100 Pa·s, more preferably 0.5 to 100 Pa·s, and particularly preferably 1 to 100 Pa·s. The viscosity of the epoxy resin is a value measured according to the Japanese Industrial Standard JIS K6833. Specifically, it can be determined by measuring with an E-type viscometer at a rotation speed of 10 rpm. There are no particular restrictions on the equipment, rotor, or measurement range used.

[0022] Epoxy resins that do not have aromatic rings include, for example, aliphatic epoxy resins and epoxy resins that have heterocyclic rings. Examples of aliphatic epoxy resins include diepoxy compounds such as (poly)ethylene glycol diglycidyl ether, (poly)propylene glycol diglycidyl ether, butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, polytetramethylene glycol diglycidyl ether, glycerin diglycidyl ether, neopentyl glycol diglycidyl ether, cyclohexane-type diglycidyl ether, and dicyclopentadiene-type diglycidyl ether; triepoxy compounds such as trimethylolpropane triglycidyl ether and glycerin triglycidyl ether; and alicyclic epoxy resins such as vinyl (3,4-cyclohexene) dioxide and 2-(3,4-epoxycyclohexyl)-5,1-spiro-(3,4-epoxycyclohexyl)-m-dioxane. Examples include hydrogenated bisphenol A type diepoxy resins such as hydrogenated bisphenol A diglycidyl ether; glycidylamine type epoxy resins such as tetraglycidylbis(aminomethyl)cyclohexane; hydantoin type epoxy resins such as 1,3-diglycidyl-5-methyl-5-ethylhydantoin; and epoxy resins having a silicone skeleton such as 1,3-bis(3-glycidoxypropyl)-1,1,3,3-tetramethyldisiloxane. Aliphatic epoxy resins are preferably those with an epoxy equivalent of 90 to 450 g / eq. They are also preferably liquid at 25°C. Furthermore, they are preferably those with a viscosity of 10 to 10,000 mPa·s at 25°C, and more preferably 10 to 5,000 mPa·s.

[0023] Examples of epoxy resins having heterocyclic rings include isocyanuric acid type epoxy resins and glycoluryl type epoxy resins. Preferably, the epoxy resin having heterocyclic rings has an epoxy equivalent weight of 80 to 450 g / eq. From the viewpoint of workability, it is preferable that it is liquid at 25°C. Furthermore, it is preferable that its viscosity at 25°C be 100 to 50,000 mPa·s, and more preferably 100 to 5,000 mPa·s. On the other hand, from the viewpoint of adhesion, it is preferable that it is solid at 25°C.

[0024] The amount of the (A1) epoxy group-containing compound in the resin composition is preferably 3 to 50% by mass, more preferably 5 to 30% by mass, and even more preferably 7 to 20% by mass, when the total mass of the resin composition is 100% by mass.

[0025] (A2) Compounds having a (meth)acryloyl group may be any (meth)acrylate compound having at least one (meth)acryloyl group in the molecule, and examples include (A2-1) monofunctional (meth)acrylate compounds having one (meth)acryloyl group and (A2-2) polyfunctional (meth)acrylate compounds having two or more (meth)acryloyl groups. Any one (meth)acrylate compound may be used alone, or two or more may be used in combination.

[0026] (A2) Among (meth)acrylate compounds, (A2-1) Examples of monofunctional (meth)acrylate compounds include alkyl (meth)acrylates having a branched alkyl group structure, such as isobutyl (meth)acrylate and t-butyl (meth)acrylate; esters of (meth)acrylic acid with alicyclic alcohols, such as cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, and dicyclopentanyl (meth)acrylate; esters of (meth)acrylic acid with cyclic alcohols, such as cyclic trimethylolpropaneformal (meth)acrylate; esters of (meth)acrylic acid with aromatic alcohols, such as phenoxyethyl (meth)acrylate; acid-modified mono(meth)acrylates, such as phosphoric acid-modified (meth)acrylate; and (methacrylamide) compounds, such as hydroxyethyl (meth)acrylamide.

[0027] Among (meth)acrylate compounds, examples of (A2-2) polyfunctional (meth)acrylate compounds include alkyl (meth)acrylates such as 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, and neopentyl glycol di(meth)acrylate; polyalkylene glycol di(meth)acrylates such as tripropylene glycol di(meth)acrylate; and difunctional (meth)acrylates such as polyester (meth)acrylate and neopentyl glycol-modified trimethylolpropane di(meth)acrylate. Examples include trifunctional (meth)acrylates such as trimethylolpropane tri(meth)acrylate; tetrafunctional (meth)acrylates such as pentaerythritol tetra(meth)acrylate and ditrimethylolpropane tetra(meth)acrylate; pentafunctional (meth)acrylates such as dipentaerythritol penta(meth)acrylate; (meth)acrylates containing a cyclic structure such as dimethylol-tricyclodecane di(meth)acrylate; acid-modified poly(meth)acrylates such as phosphate-modified poly(meth)acrylate; and urethane (meth)acrylates having a urethane bond and a (meth)acryloyl group. In some embodiments, flexibility may be required for the cured product of the resin composition. When flexibility is required for the cured product of the resin composition, it is preferable that the polyfunctional (meth)acrylate compound has a linear alkylene skeleton with 4 or more carbon atoms or a linear oxyalkylene skeleton with 4 or more carbon atoms between adjacent (meth)acryloyl groups. When flexibility is required in the cured product of the resin composition, the polyfunctional (meth)acrylate compound is preferably a bifunctional (meth)acrylate compound.

[0028] In one embodiment, from the viewpoint of the workability of the resin composition, the (meth)acrylate compound preferably contains (A2-1) a monofunctional (meth)acrylate compound. In one embodiment, from the viewpoint of improving reactivity, the (A2) (meth)acrylate compound preferably contains (A2-2) a polyfunctional (meth)acrylate compound. In one embodiment, the (meth)acrylate compound preferably contains a monofunctional (meth)acrylate compound and a polyfunctional (meth)acrylate compound. In one embodiment, the (meth)acrylate compound preferably contains a monofunctional (meth)acrylate compound and a difunctional (meth)acrylate compound.

[0029] In one embodiment, when flexibility is required in the cured product of the resin composition, it is preferable that the (meth)acrylate compound includes a (meth)acrylate compound having a glass transition temperature (Tg) of 15°C or less. In one embodiment, from the viewpoint of suppressing oxygen-induced curing inhibition on the surface of the cured product and the resulting tackiness, it is preferable that the (meth)acrylate compound includes a (meth)acrylate compound having a glass transition temperature (Tg) of more than 15°C. In one embodiment, it is preferable that the (meth)acrylate compound includes a (meth)acrylate compound having a glass transition temperature (Tg) of 15°C or less and a (meth)acrylate compound having a glass transition temperature (Tg) of more than 15°C. In this specification, the glass transition temperature (Tg) of the (meth)acrylate compound can be measured by a dynamic viscoelasticity analyzer (DMA) as the glass transition temperature (Tg) when it is a homopolymer. When measuring the glass transition temperature (Tg) of a (meth)acrylate compound using a dynamic viscoelasticity analyzer (DMA), the measurement conditions are as follows: tensile mode, frequency: 10 Hz, heating rate: 3°C / min, and the peak of the resulting tanδ chart is taken as the glass transition temperature.

[0030] (A) When the thermosetting resin contains (A2) a compound having a (meth)acryloyl group, and the compound having a (meth)acryloyl group contains a (meth)acrylate compound, from the viewpoint of the workability of the resin composition and the adhesion and tack-free properties of the cured product, when the total mass of (A) the thermosetting resin is 100% by mass, it is preferable that the (meth)acrylate compound is 10 to 100% by mass, more preferably 30 to 95% by mass, and even more preferably 50 to 90% by mass.

[0031] (A2) Compounds having a (meth)acryloyl group may include (A2-2) urethane (meth)acrylate compounds. (A2-2) Urethane (meth)acrylate compounds are oligomers having a urethane bond and a (meth)acryloyl group, and are obtained by the reaction of the hydroxyl groups and isocyanate groups of three main raw materials: hydroxy (meth)acrylate, diisocyanate, and polyol. By combining the main raw materials, various properties can be imparted to the resulting urethane (meth)acrylate compound. For example, if the main raw material polyol is an ether-based compound, it exhibits excellent hydrolysis resistance and flexibility. For example, if the main raw material polyol is an ester-based compound, it exhibits excellent heat resistance, flexibility, and toughness. For example, if the main raw material polyol is a carbonate-based compound, it exhibits excellent heat resistance, weather resistance, and toughness.

[0032] (A2-2) The weight average molecular weight of the urethane (meth)acrylate compound is preferably 1,600 to 20,000, more preferably 2,000 to 18,000, and even more preferably 3,000 to 15,000. However, from the viewpoints of the workability and reactivity of the resin composition, it is preferable that the urethane (meth)acrylate compound does not substantially contain a urethane (meth)acrylate compound having a weight average molecular weight exceeding 20,000. Also, it is preferable that the urethane (meth)acrylate compound does not substantially contain a urethane (meth)acrylate compound having a weight average molecular weight less than 1,600. Note that "does not substantially contain" means that the component is not intentionally included, and specifically, that the component is present in an amount less than 0.1% by mass in the curable resin composition. In the present specification, the weight average molecular weight refers to a value obtained by gel permeation chromatography (GPC) using a calibration curve with standard polystyrene. The urethane (meth)acrylate compound may be used singly or in combination of two or more.

[0033] When the (A) thermosetting resin contains a compound having a (meth)acryloyl group (A2) and the compound having a (meth)acryloyl group (A2) contains a urethane (meth)acrylate compound (A2-2), when the total mass of the (A) thermosetting resin is 100% by mass, the urethane (meth)acrylate compound (A2-2) is preferably 1 to 50% by mass, more preferably 3 to 40% by mass, and even more preferably 5 to 30% by mass.

[0034] The compound having a (meth)acryloyl group (A2) in the resin composition is preferably 1 to 50% by mass, more preferably 3 to 40% by mass, and even more preferably 5 to 30% by mass when the total mass of the resin composition is 100% by mass.

[0035] (A3) The bismaleimide compound can be any compound having a chemical structure sandwiched between two maleimide groups. When (A) the thermosetting resin contains (A3) the bismaleimide compound, it becomes easier to impart reliability (heat resistance, moisture resistance) and adhesion strength to the cured product obtained by curing the resin composition. The reason why the cured product has reliable heat resistance and moisture resistance is thought to be that the bismaleimide compound has a rigid imide ring, which allows it to exhibit high heat resistance, and the main chain of the imide bond is hydrophobic, designed to absorb less moisture. When the resin composition contains (A3) the bismaleimide compound in addition to (A) the thermosetting resin, the cured product of the resin composition has improved heat resistance and moisture resistance, and high reliability can be obtained. Furthermore, the maleimide group of (A3) the bismaleimide compound has double bonds on both sides, giving it very high reactivity, and because it has a large number of functional groups, it is thought that it can improve adhesion strength when curing at low temperatures and in a short time. (A3) Any one bismaleimide compound may be used, or two or more may be used in combination.

[0036] (A3) Examples of bismaleimide compounds include N,N'-(4,4'-diphenylmethane)bismaleimide, bisphenol A diphenyl ether bismaleimide, 3,3'-dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, 4-methyl-1,3-phenylene bismaleimide, 1,6'-bismaleimide-(2,2,4-trimethyl)hexane, bis-(3-ethyl-5-methyl-4-maleimidophenyl)methane, m- Examples include phenylenebismaleimide (N,N'-1,3-phenylenebismaleimide), 1,6-bismaleimidehexane, 1,2-bismaleimideethane (N,N'-ethylenedimaleimide), N,N'-(1,2-phenylene)bismaleimide, N,N'-1,4-phenylenedimaleimide, N,N'-(sulfonyldi-p-phenylene)dimaleimide, and N,N'-[3,3'-(1,3-phenylenedioxy)diphenyl]bismaleimide.

[0037] When a cured product of a resin composition is required to have a low room temperature elastic modulus, the (A3) bismaleimide compound preferably includes a bismaleimide compound having a hydrocarbon group derived from dimer acid. Such bismaleimide compounds are described, for example, in JP-A-2015-193725. Since the hydrocarbon group derived from dimer acid does not have a crosslinkable reactive group in the molecular chain, it is considered that the room temperature elastic modulus can be lowered. Commercially available products of bismaleimide compounds having a hydrocarbon group derived from dimer acid include, for example, those which are liquid at 25°C, such as product name "BMI-689", product name "BMI-1400", product name "BMI-1500", product name "BMI-1700", or those which are solid at 25°C, such as product name "BMI-3000" (all manufactured by Designer Molecules Inc.).

[0038] The (A3) bismaleimide compound may be either liquid or solid at 25°C, but is preferably liquid at 25°C. The weight average molecular weight of the (A3) bismaleimide compound is preferably from 400 to 7000, more preferably from 500 to 5500, and even more preferably from 600 to 3000.

[0039] When the (A) thermosetting resin contains the (A3) bismaleimide compound, when the total mass of the (A) thermosetting resin is 100% by mass, the (A3) bismaleimide compound is preferably 5 to 60% by mass, more preferably 5 to 40% by mass, and even more preferably 15 to 35% by mass.

[0040] The (A3) bismaleimide compound in the resin composition is preferably 0.5 to 30% by mass, more preferably 1 to 20% by mass, and even more preferably 1.5 to 15% by mass when the total mass of the resin composition is 100% by mass.

[0041] The (B) curing agent or radical polymerization initiator contained in the resin composition may be any compound that contributes to the curing reaction of the (A) thermosetting resin. The (B) curing agent or radical polymerization initiator serves as the (B1) curing agent and the (B2) radical polymerization initiator.

[0042] (B) Among the curing agents or radical polymerization initiators, (B1) the curing agent can be any known agent without limitation, such as imidazole-based curing agents, amine-based curing agents, phenol-based curing agents and acid anhydride-based curing agents. (A) If the thermosetting resin contains (A1) a compound having an epoxy group, it is preferable to include (B) the curing agent or radical polymerization initiator (B1).

[0043] The imidazole-based curing agent may be in the form of a latent curing agent that is activated by heating, or in the form of a microencapsulated curing agent. Examples of imidazole-based curing agents include imidazole, 2-methylimidazole, 2-ethylimidazole, 1-isobutyl-2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, and other 2-substituted imidazole compounds, 1-cyanoethyl-2-undecylimidazolium trimellitate, and 1-cyanoethyl-2-phenylimidazole. Examples include trimellites such as nilimidazolium trimellitate, triazine ring-containing compounds such as 2,4-diamino-6-[(2-methyl-1-imidazolyl)ethyl]s-triazine, 2,4-diamino-6-[(2-undecyl-1-imidazolyl)ethyl]s-triazine, and 2,4-diamino-6-[(2-ethyl-4-methyl-1-imidazolyl)ethyl]s-triazine, isocyanuric acid adducts of 2,4-diamino-6-[(2-methyl-1-imidazolyl)ethyl]s-triazine, isocyanuric acid adducts of 2-phenylimidazole, isocyanuric acid adducts of 2-methylimidazole, isocyanuric acid adducts of 2-phenyl-4,5-dihydroxymethylimidazole, and isocyanuric acid adducts of 2-phenyl-4-methyl-5-hydroxymethylimidazole.

[0044] Examples of amine-based curing agents include aliphatic amines such as diethylenetriamine, triethylenetetraamine, tetraethylenepentamine, trimethylhexamethylenediamine, m-xylenediamine, and 2-methylpentamethylenediamine; alicyclic polyamines such as isophoronediamine, 1,3-bisaminomethylcyclohexane, bis(4-aminocyclohexyl)methane, norbornenediamine, and 1,2-diaminocyclohexane; piperazine-type polyamines such as N-aminoethylpiperazine and 1,4-bis(2-amino-2-methylpropyl)piperazine; and aromatic amines such as diaminodiphenylmethane, m-phenylenediamine, diaminodiphenylsulfone, diethyltoluenediamine, trimethylenebis(4-aminobenzoate), polytetramethyleneoxide-di-p-aminobenzoate, and 4,4'-diamino-3,3'-diethyldiphenylmethane. In addition, modified amine compounds that are solid at room temperature can be used as amine-based latent curing agents. Examples of commercially available amine-based latent curing agents, which are modified amine compounds that are solid at room temperature, include "Fujicure-FXR-1020", "Fujicure-FXR-1030", "Fujicure-FXR-1061", "Fujicure-FXR-1081", and "Fujicure-FXR-1121" (all manufactured by T&K TOKA Corporation), as well as "Amicure PN-23" and "Amicure PN-23J" (both manufactured by Ajinomoto Fine Techno Co., Ltd.).

[0045] As a phenolic curing agent, phenolic resins, particularly novolac resins obtained by condensing phenols or naphthols (e.g., phenol, cresol, naphthol, alkylphenol, bisphenol, terpenephenol, etc.) with formaldehyde, are preferably used. Examples of novolac resins include phenol novolac resin, o-cresol novolac resin, p-cresol novolac resin, α-naphthol novolac resin, β-naphthol novolac resin, t-butylphenol novolac resin, bisphenol A type novolac resin, xylylene-modified novolac resin, decalin-modified novolac resin, etc. Examples of other phenolic resins include dicyclopentadiene cresol resin, poly-p-vinylphenol, poly(di-o-hydroxyphenyl)methane, poly(di-m-hydroxyphenyl)methane, and poly(di-p-hydroxyphenyl)methane.

[0046] Examples of acid anhydride-based curing agents include phthalic anhydride, alkylhexahydrophthalic anhydride such as hexahydrophthalic anhydride and methylhexahydrophthalic anhydride, alkyltetrahydrophthalic anhydride such as tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride and 3-methyltetrahydrophthalic anhydride, Hymic anhydride, succinic anhydride, trimellitic anhydride, pyromellitic anhydride, and the like.

[0047] Among the curing agents listed above, imidazole-based curing agents or modified amine compounds that are solid at room temperature are preferred from the viewpoint of reactivity at high temperatures and storage stability. Of the curing agents (B) or radical polymerization initiators used in the resin composition, the curing agent (B1) may be one type of curing agent or a combination of two or more curing agents. Of the curing agents (B) or radical polymerization initiators in the resin composition, the curing agent (B1) is preferably in the amount of 10 to 100 parts by mass, more preferably 15 to 80 parts by mass, and particularly preferably 20 to 70 parts by mass, per 100 parts by mass of the thermosetting resin (A).

[0048] (B) Among the curing agent or radical polymerization initiator, (B2) the radical polymerization initiator can be any agent that initiates and cures the radical polymerization of a radically polymerizable curable compound. (B2) The radical polymerization initiator is preferably a thermal radical polymerization initiator that generates active species radicals by cleavage at a predetermined temperature, and examples of thermal radical polymerization initiators include organic peroxides, inorganic peroxides, and azo compounds. (B2) The radical polymerization initiator is preferably an organic peroxide because of its good reactivity with the radically polymerizable (A) thermosetting resin. Any one radical polymerization initiator may be used, or two or more may be used in combination. (A) When the thermosetting resin contains (A2) a compound having a (meth)acryloyl group or (A3) a bismaleimide compound, it is preferable to include (B2) the radical polymerization initiator among the curing agent or radical polymerization initiator.

[0049] (B2) The 10-hour half-life temperature (T10) of the radical polymerization initiator is preferably 70°C or lower, more preferably 30 to 70°C, and even more preferably 40 to 70°C. The 10-hour half-life temperature (T10) refers to the temperature at which it takes 10 hours for the (B2) radical polymerization initiator to decompose and its amount to be reduced to half. The 10-hour half-life temperature (T10) of the (B2) radical polymerization initiator at 70°C or lower is an indicator of the radical generation ability of the (B2) radical polymerization initiator at low temperatures of 50 to 100°C and its stability at room temperature. By having the 10-hour half-life temperature (T10) of the radical polymerization initiator within the above range, the resin composition can be cured at a relatively low temperature and a long pot life can be obtained.

[0050] The (B2) radical polymerization initiator contained in the resin composition is preferably an organic peroxide having a dicarbonate structure represented by the following formula (1). In the above formula (1), R １ and R ２ Each of these is an alkyl group independently. The alkyl group may be linear, branched, or cyclic, or any combination thereof. １ and R ２They may be the same or different. １ and R ２ The number of carbon atoms in the alkyl group represented by formula (1) is preferably 1 to 30, more preferably 2 to 20, and even more preferably 3 to 20. In one embodiment, the alkyl group is preferably linear. Furthermore, the organic peroxide represented by formula (1) is preferably solid at 25°C. The average particle size of the organic peroxide represented by formula (1) is preferably 1 μm to 400 μm. Here, the average particle size refers to the value of the 50% volume cumulative particle size (D50), which is a value obtained from the volume-based particle size distribution measured using a laser diffraction particle size distribution analyzer and a dynamic light scattering analyzer. Because the organic peroxide represented by formula (1) has a dicarbonate structure, radicals are efficiently generated at low temperatures, for example, 50 to 100°C, preferably 70 to 80°C, and termination reactions that deactivate the radicals are unlikely to occur, thereby allowing the initiation and growth reactions of the radical polymerization reaction of the resin composition to proceed efficiently. An example of an organic peroxide having a dicarbonate structure represented by formula (1) is bis(4-t-butylcyclohexyl)peroxycarbonate. An example of a commercially available organic peroxide having a dicarbonate structure represented by formula (1) is the product name "Perkadox® 16 (manufactured by Kayaku Nurion Co., Ltd.)".

[0051] Of the curing agent or radical polymerization initiator in the resin composition, the radical polymerization initiator (B2) is preferably 0.1 to 30 parts by mass, more preferably 1 to 25 parts by mass, and even more preferably 3 to 20 parts by mass, per 100 parts by mass of the thermosetting resin (A).

[0052] Of the curing agents or radical polymerization initiators (B) contained in the resin composition, the curing agent (B1) is preferably an amine-based latent curing agent. The curing agent (B1) is more preferably an amine-based latent curing agent from the viewpoint of reactivity at high temperatures and storage stability. Of the curing agents or radical polymerization initiators (B), the radical polymerization initiator (B2) is preferably an organic peroxide. The radical polymerization initiator (B2) is more preferably an organic peroxide from the viewpoint of efficient commencement and growth reactions of the radical polymerization reaction.

[0053] The conductive particles (C) contained in the resin composition may be any material that imparts thermal conductivity and / or electrical conductivity to the cured product after the resin composition has hardened. Examples of materials for the conductive particles (C) include gold, silver, nickel, copper, palladium, platinum, bismuth, tin, and their alloys (especially bismuth-tin alloys, solder, etc.), aluminum, indium tin oxide, silver-coated copper, silver-coated aluminum, metal-coated glass spheres, silver-coated fibers, silver-coated resins, antimond-doped tin, tin oxide, carbon fibers, graphite, carbon black, and mixtures thereof. The conductive material constituting the conductive particles (C) is preferably at least one metal selected from the group consisting of silver, nickel, copper, tin, aluminum, silver alloys, nickel alloys, copper alloys, and aluminum alloys, more preferably at least one metal selected from the group consisting of silver, copper, and nickel, even more preferably silver or copper, and particularly preferably containing silver. The conductive particles (C) contained in the resin composition are preferably silver particles. The conductive particles (C) contained in the resin composition are preferably copper particles. The silver particles or copper particles include silver powder or copper powder, and a coating powder in which at least a portion of the surface of the core particles is coated with silver or copper.

[0054] (C) The shape of the conductive particles is not particularly limited and may be spherical, irregular, flake-like, filament-like, dendritic, or any other shape. Here, "irregular" means particles other than perfectly spherical powder and flake-like powder with an aspect ratio of 100 or more. Flake-like refers to a shape with an aspect ratio of 2 or more, expressed as "major axis / minor axis," and includes flat shapes such as plate-like and flake-like. In this specification, (C) the major axis and minor axis of the conductive particles refer to the average values ​​of the major axis and minor axis of any 20 particles based on images obtained from a scanning electron microscope (SEM). "Major axis" refers to the longest distance of the line segments passing through the approximate center of gravity of the particle in the particle image obtained by SEM, and "minor axis" refers to the shortest distance of the line segments passing through the approximate center of gravity of the particle in the particle image obtained by SEM. The conductive particles may include particles of different shapes. (C) The average particle size of the conductive particles is preferably 0.05 to 50 μm, more preferably 0.1 to 20 μm, and even more preferably 0.1 to 15 μm. Here, the average particle size refers to the value of the 50% volume cumulative particle size (D50), which is a value obtained from the volume-based particle size distribution measured using a laser diffraction particle size distribution analyzer and a dynamic light scattering analyzer.

[0055] (C) The conductive particles may be (C1) first conductive particles treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, (C2) second conductive particles treated with a (D') surface treatment agent other than at least one selected from the group consisting of fatty acid esters and fatty acid amides, or (C3) third conductive particles that are not surface treated with a surface treatment agent. The (C3) third conductive particles that are not surface treated with a surface treatment agent may be conductive particles in which a metal particle that serves as a core particle is coated on the surface with a metal different from the core particle.

[0056] The resin composition contains (C1) first conductive particles that are surface-treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, and may also contain (C2) second conductive particles that are treated with a (D') surface treatment agent other than fatty acid esters and fatty acid amides. When the resin composition contains (C1) first conductive particles as (C) conductive particles, a cured product with lower electrical resistance can be obtained even when cured at a low temperature, for example, 100°C or lower, preferably 80°C or lower. Furthermore, when the (C) conductive particles further contain (C2) second conductive particles in addition to (C1) first conductive particles, a cured product with lower electrical resistance can be obtained even when cured at a low temperature, for example, 100°C or lower, preferably 80°C or lower.

[0057] The content of (C) conductive particles in the resin composition is preferably 20 to 95% by mass, more preferably 25 to 90% by mass, and even more preferably 30 to 90% by mass, when the total mass of the resin composition is 100% by mass. In one embodiment of the resin composition, for example, if (A) the thermosetting resin contains (A1) a compound having an epoxy group, the content of (C) conductive particles in the resin composition is preferably 30 to 85% by mass, more preferably 35 to 82% by mass, and even more preferably 40 to 80% by mass, when the total mass of the resin composition is 100% by mass. Also, in one embodiment of the resin composition, for example, if (A) the thermosetting resin contains (A2) a compound having a (meth)acryloyl group, the content of (C) conductive particles in the resin composition is preferably 20 to 85% by mass, more preferably 30 to 80% by mass, and even more preferably 40 to 75% by mass, when the total mass of the resin composition is 100% by mass.

[0058] At least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides contained in the resin composition may be used to treat the surface of the (C) conductive particles before mixing the (A) thermosetting resin and (B) curing agent or radical polymerization initiator with the (C) conductive particles, or when mixing the (A) thermosetting resin and (B) curing agent or radical polymerization initiator with the (C) conductive particles, the (D) surface treatment agent may be mixed into the mixture containing the (A) thermosetting resin, (B) curing agent or radical polymerization initiator and the (C) conductive particles.

[0059] The resin composition contains at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, which allows the resin composition to be cured at a lower temperature, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower, compared to the case where conductive particles surface-treated with fatty acids or amines such as isostearic acid or isobutylamine, and a cured product with low electrical resistance can be obtained. The resin composition contains at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, which acts on the (C) conductive particles to improve the wettability between the (C) conductive particles and the (A) thermosetting resin in the resin composition and improve dispersibility. Furthermore, if the resin composition contains at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, when the resin composition is cured at a low temperature, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower, it is presumed that at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides is more easily decomposed or peeled off from (C) conductive particles than fatty acids such as isostearic acid or amines such as isobutylamine that have been used conventionally, thereby increasing the contact area between (C) conductive particles and forming conductive paths in the cured product, making it possible to obtain a cured product with low electrical resistance.

[0060] Among the (D) surface treatment agents selected from the group consisting of fatty acid esters and fatty acid amides, a (D1) fatty acid ester is a sorbitan fatty acid ester. Examples of sorbitan fatty acid esters include sorbitan monostearate, sorbitan monooleate, and sorbitan monolaurate. Since it is difficult to control the number of fatty acids bound to one sorbitan molecule, it may be used as a mixture of molecules with multiple different compositions.

[0061] To obtain a cured product with low electrical resistance, for example, when the resin composition contains a surface treatment agent (D) (D1) fatty acid ester, it is preferable that the (D1) fatty acid ester contains a saturated fatty acid ester with 10 or more carbon atoms. The number of carbon atoms in the fatty acid contained in the saturated fatty acid ester may be 22 or less. It is preferable that the number of carbon atoms in the fatty acid contained in the saturated fatty acid ester is 10 to 22. To obtain a cured product with low electrical resistance, for example, when the resin composition contains a surface treatment agent (D) (D1) fatty acid ester, it is preferable that the (D1) fatty acid ester contains a sorbitan fatty acid ester, and more preferably contains sorbitan monostearate.

[0062] (D) A surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, (D2) fatty acid amides include oleic acid amide, stearic acid amide, palmitic acid amide, etc.

[0063] The resin composition, by including at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, specifically (D2) fatty acid amide, can obtain a cured product with low electrical resistance even when cured at a relatively low temperature, such as 100°C or below. In addition to the aforementioned effect, it can also reduce viscosity and thixotropy index (TI) when the resin composition is pasteurized. It is preferable that the (D2) fatty acid amide includes a saturated fatty acid amide with 10 or more carbon atoms. The number of carbon atoms in the fatty acid contained in the saturated fatty acid amide may be 22 or less. It is preferable that the number of carbon atoms in the fatty acid contained in the saturated fatty acid amide is 10 to 22. The resin composition can be cured at a low temperature, such as 100°C or below, preferably 80°C or below, and more preferably 70°C or below. To obtain a cured product with low electrical resistance, the (D) surface treatment agent includes (D2) fatty acid amide, and it is preferable that the (D2) fatty acid amide includes stearic acid amide. The resin composition, by including the (D2) fatty acid amide as the (D) surface treatment agent, and among the (D2) fatty acid amides, can obtain a cured product with excellent mechanical strength.

[0064] The total content of (C) conductive particles and (D) surface treatment agent in the resin composition is preferably 20 to 96% by mass, may be 25% or more by mass, may be 30% or more by mass, may be 50% or more by mass, preferably 60 to 95% by mass, and may be 90% or less by mass, when the total mass of the resin composition is 100% by mass.

[0065] When the resin composition contains (C1) first conductive particles, which are (C) conductive particles treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, it is preferable that the amount of (D) surface treatment agent is in the range of 0.01 parts by mass or more and 1.0 parts by mass or less, when the amount of (C) conductive particles before surface treatment is 100 parts by mass. When the resin composition contains (C1) first conductive particles, which are (C) conductive particles treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, when the amount of (D) surface treatment agent is in the range of 0.01 parts by mass or more and 1.0 parts by mass or less, when the amount of (C) conductive particles before surface treatment is 100 parts by mass, the dispersibility of (C) conductive particles in the resin composition is improved, and curing can be performed at a low temperature, for example, 100°C or less, preferably 80°C or less, more preferably 70°C or less, and a cured product with low electrical resistance can be obtained. When (C) conductive particles are (C1) first conductive particles that have been treated with (D) a surface treatment agent, it may be difficult to measure the content of (C) conductive particles and the content of (D) surface treatment agent separately in the resin composition. When (C) conductive particles are (C1) first conductive particles that have been treated with (D) a surface treatment agent, the total amount of (C) conductive particles and (D) surface treatment agent can be measured in the resin composition.

[0066] The content of at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides in the resin composition is preferably in the range of 0.005% by mass or more and 0.95% by mass or less when the total mass of the resin composition is 100% by mass. If the content of the (D) surface treatment agent in the resin composition is in the range of 0.005% by mass or more and 0.95% by mass or less when the total mass of the resin composition is 100% by mass, then when curing at a low temperature, for example, 100°C or less, preferably 80°C or less, the (D) surface treatment agent will decompose easily or peel off easily from the (C) conductive particles, increasing the contact area between the (C) conductive particles, forming conductive paths in the cured product, and a cured product with low electrical resistance can be obtained. When the total mass of the resin composition is 100% by mass, the (D) surface treatment agent may be included in the range of 0.01% by mass or more and 0.90% by mass or in the range of 0.05% by mass or more and 0.85% by mass or less. The content of at least one (D) surface treatment agent selected from the group consisting of (D1) fatty acid esters and (D2) fatty acid amides in the resin composition can be determined by, for example, if the resin composition contains (C1) first conductive particles treated with the (D) surface treatment agent, by determining the ignition loss (Ig. loss) of the (C1) first conductive particles in accordance with JIS K 0067 Test Methods for Loss of Weight and Residue of Chemical Products, and by calculating the content of the (D) surface treatment agent in the resin composition from the product of this ignition loss (Ig. loss) and the blending ratio of the (C1) first conductive particles in the resin composition. If there is a catalog value that lists the ignition loss (Ig. loss) for the (C1) first conductive particles treated with the (D) surface treatment agent, the content of the (D) surface treatment agent in the resin composition can be calculated by referring to the catalog value.

[0067] (C) As a method for treating conductive particles with a surface treatment agent, if the surface treatment agent is at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, for example, any of the following methods (i) to (iii) can be used. (C) The method for treating conductive particles with a surface treatment agent may be any method other than the following (i) to (iii). (i) Add (C) conductive particles to a liquid fatty acid ester or liquid fatty acid amide, stir the resulting mixture, and dry the (C) conductive particles to which the fatty acid ester or fatty acid amide has adhered to obtain (C1) first conductive particles treated with the (D) surface treatment agent. (ii) Dissolve a fatty acid ester or fatty acid amide (liquid or solid) in a solvent, add (C) conductive particles to the resulting solution, stir the resulting mixture, and then dry the (C) conductive particles to which the fatty acid ester solution or fatty acid amide solution has adhered to obtain (C1) first conductive particles treated with the (D) surface treatment agent. (iii) A mixture of liquid fatty acid ester and solid fatty acid ester, or a mixture of liquid fatty acid amide and solid fatty acid amide, is mixed with (C) conductive particles, then a solvent is added, the resulting mixture is stirred, and the (C) conductive particles to which the fatty acid ester solution or fatty acid amide solution adheres are dried to obtain (C1) first conductive particles treated with (D) a surface treatment agent. In the above methods (i) to (iii), any solvent can be used. As solvents, for example, inorganic solvents such as water and / or organic solvents such as alcohol (e.g., ethanol) can be used. When stirring, an appropriate stirrer such as a ball mill can be used.

[0068] A (D') surface treatment agent other than the (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides is, for example, a fatty acid. Examples of fatty acids include saturated fatty acids or unsaturated fatty acids having 10 or more carbon atoms. Examples of saturated fatty acids having 10 or more carbon atoms include stearic acid and isostearic acid. An example of an unsaturated fatty acid having 10 or more carbon atoms is oleic acid. The (D') surface treatment agent other than the (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides can be used to treat the (C) conductive particles by replacing the fatty acid with a fatty acid in any of the methods described in (i) to (iii) above, thereby obtaining (C2) second conductive particles treated with the (D') surface treatment agent other than the (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides.

[0069] The resin composition may contain additives to the extent that it does not impair the spirit of this embodiment. In this specification, these may also be referred to as (E) additives. (E) additives are components other than (A) thermosetting resins, (B) curing agents or radical polymerization initiators, (C) conductive particles, at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, and (D') surface treatment agents other than the aforementioned (D) surface treatment agents. Examples of additives include radical polymerization inhibitors, reactive diluents, thixotropes, carbon black, titanium black, coupling agents, ion trapping agents, leveling agents, antioxidants, defoaming agents, viscosity stabilizers, flame retardants, colorants, plasticizers, etc. The type and amount of each additive are in accordance with conventional methods.

[0070] Radical polymerization inhibitors include quinone compounds, such as p-benzoquinone. Reactive diluents include monofunctional epoxy compounds having one epoxy group. A commercially available monofunctional epoxy compound is Cardolite LITE513E (manufactured by Cardolite). Swipasters include colloidal silica, organic bentonite, fatty acid amides, hydrogenated castor oil, etc. A commercially available swipaster is TS720 (hydrophobic silica) (manufactured by Cabot Specialty Chemicals Inc.). Coupling agents are compounds having two or more different functional groups in their molecules. An example of a coupling agent is 3-glycidoxypropyltriethoxysilane (product name: KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd.). A commercially available viscosity stabilizer is L-07N (epoxy-phenol-boric acid ester compound) (manufactured by Shikoku Chemicals Co., Ltd.).

[0071] The amount of each additive should be within a range that does not impair the effect of adding each additive, and is preferably 0.01% to 30% by mass, and more preferably 0.1% to 10% by mass, relative to the total mass of the resin composition.

[0072] A method for producing a resin composition is described below. In the following, (A) a thermosetting resin may be referred to as component (A), (B) a curing agent or radical polymerization initiator may be referred to as component (B), (C) conductive particles may be referred to as component (C), (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides may be referred to as component (D), (D') a surface treatment agent other than (D) may be referred to as component (D'), and (E) additives may be referred to as component (E). A method for producing a resin composition can be obtained, for example, by introducing components (A) to (D), and optionally components (D') and (E) into a suitable mixer simultaneously or separately, and mixing them by stirring while melting them by heating if necessary, to obtain a homogeneous composition. As this mixer, a Leikai mixer, Henschel mixer, three-roll mill, ball mill, planetary mixer, and bead mill, etc., equipped with a stirring device and a heating device can be used. These devices may also be used in appropriate combinations.

[0073] The resin composition obtained in this manner is preferably cured within 5 hours, more preferably within 3 hours, and even more preferably within 1 hour, at a temperature of, for example, 100°C or lower, preferably 80°C or lower, more preferably 70°C or lower. When the resin composition is used in the manufacture of semiconductor modules containing components that degrade under high-temperature conditions, it is preferable to heat-cur the resin composition at a temperature of 50 to 100°C, more preferably 50 to 80°C, and even more preferably 50 to 70°C for 30 to 120 minutes.

[0074] The resin composition of this embodiment can be applied, for example, by supplying it to a desired portion of a substrate or the like using a known printing method, dispensing method, or coating method. Printing methods include, but are not limited to, inkjet printing, screen printing, lithographic printing, cardboard printing, metal printing, offset printing, gravure printing, and flexographic printing. Dispensing methods include, but are not limited to, methods using jet dispensers and air dispensers. Coating methods include dip coating, spray coating, bar coater coating, gravure coating, reverse gravure coating, and spin coater coating. The above application methods can also be used when the resin composition is used as an adhesive or sealant, or as a raw material thereof, as described later.

[0075] The resin composition can be used, for example, as an adhesive or sealant, or as a raw material, for fixing, joining, or protecting components that make up a semiconductor device or electronic component.

[0076] The adhesive comprises the resin composition described above. The resin composition described above may also be used in a encapsulant comprising this resin composition. The adhesive or encapsulant comprises the resin composition described above. The adhesive or encapsulant enables good fixation, bonding, or protection of engineering plastics (e.g., LCP (liquid crystal polymer), polyamide, polycarbonate, etc.), ceramics, organic substrates (e.g., FR4, etc.), metals (e.g., SUS, gold, copper, nickel, etc.), and metal oxides (e.g., silver chloride, copper oxide, nickel oxide, etc.), and can be used to fix, bond, or protect components constituting semiconductor devices or electronic components. Examples of semiconductor devices or electronic components include, but are not limited to, HDDs, semiconductor elements, IoT sensor modules such as medical and healthcare IoT sensor modules for measuring blood pressure, pulse, blood glucose, electroencephalograms, etc., sensor modules such as image sensor modules, camera modules, semiconductor modules, integrated circuits, etc.

[0077] The adhesive or sealant can cure at a low temperature, for example, 100°C or below, preferably 80°C or below, and more preferably 70°C or below, to obtain a cured product with low electrical resistance. This results in high productivity and makes it suitable for use in the manufacturing of semiconductor devices and electronic components where multiple parts made of different materials are joined and assembled. Furthermore, because the adhesive or sealant cures at a low temperature and yields a cured product with low electrical resistance, it is suitable for use in the manufacturing of semiconductor modules equipped with miniaturized electronic components.

[0078] The cured product of the resin composition, adhesive, or sealant is a cured product obtained by curing the aforementioned resin composition, adhesive, or sealant. This cured product has excellent properties, including low electrical resistance.

[0079] Semiconductor devices or electronic components include the cured products described above. Semiconductor devices or electronic components have high reliability because they are assembled by joining multiple parts made of different materials with the aforementioned resin composition or adhesive. Semiconductor devices refer to all devices that can function by utilizing semiconductor properties, and include electronic components, semiconductor circuits, modules incorporating these, electronic equipment, etc. Examples of semiconductor devices or electronic components include, but are not limited to, HDDs, semiconductor elements, IoT sensor modules such as medical and healthcare IoT sensor modules for measuring blood pressure, pulse, blood glucose, electroencephalograms, etc., sensor modules such as image sensor modules, camera modules, semiconductor modules, integrated circuits, etc.

[0080] The present invention will be described in detail below with reference to examples. The present invention is not limited to these examples. In the following examples and comparative examples, the figures indicating the blending ratio of each component contained in the resin composition are in parts by mass unless otherwise specified. Components that are liquid at room temperature are expressed in parts by mass of liquid, and components that are solid at room temperature are expressed in parts by mass of solid.

[0081] (A) Thermosetting resin (A1) Compounds having epoxy groups (A1-1) Epoxy resin: Mixture of bisphenol F type epoxy resin and bisphenol A type epoxy resin (EXA-835LV, epoxy equivalent 160-170 g / eq., weight-average molecular weight 210, manufactured by DIC Corporation) (A1-2) Epoxy resin: Modified bisphenol type epoxy resin (YX7105, epoxy equivalent 440-520 g / eq., weight-average molecular weight 3300, manufactured by Mitsubishi Chemical Corporation)

[0082] (A) Thermosetting resin (A2) Compounds having a (meth)acryloyl group (A2-1-1) Cyclic trimethylolpropane formal acrylate (Viscoat #200, manufactured by Osaka Organic Chemical Industry Co., Ltd.) (A2-1-2) Dicyclopentanyl methacrylate (Funcryl FA-513M, manufactured by Resonac Holdings Co., Ltd.) (A2-2) Urethane poly(meth)acrylate (UN6200, manufactured by Negami Kogyo Co., Ltd., weight-average molecular weight 6500)

[0083] (A) Thermosetting resin (A3) Bismaleimide compound (A3-1) Reaction product of bismaleimide compound ([4,4'-oxydiphthalic acid 1,2:1',2'-dianhydride (dimeramine obtained by reducing and aminating cyclic and acyclic dimer acids (C=36) obtained as dimers of unsaturated fatty acids (C=18) (limited to those in which the carboxyl group has been replaced with an aminomethyl group)] and maleic anhydride (BMI-1500, weight-average molecular weight 1500, manufactured by Designer Molecules Inc.)

[0084] (B) Curing agent or radical polymerization initiator (B1) Curing agent (B1-1) Amine-based latent curing agent thermosetting resin (FujiCure® FXR-1020, manufactured by T&K TOKA Corporation) (B1-2) Amine-based latent curing agent thermosetting resin (FujiCure® FXR-1030, manufactured by T&K TOKA Corporation) (B2) Radical polymerization initiator (B2) Radical polymerization initiator (di(4-tert-butylcyclohexyl)peroxydicarbonate, Percadox® 16, manufactured by Kayaku Nurion Co., Ltd.)

[0085] (C1) First conductive particles and (D) surface treatment agent) (C1-1) First conductive particles: Sorbitan fatty acid ester surface-treated silver powder ((D) Surface treatment agent: (D1) Sorbitan fatty acid ester, 0.1 parts by mass of sorbitan monostearate added to 100 parts by mass of silver powder and mixed, then surface-treated. Average particle size after treatment: 8.6 μm) (C1-2) First conductive particles: Stearic acid amide surface-treated silver powder ((D) Surface treatment agent: (D2) Stearic acid amide, 0.62 parts by mass of stearic acid amide added to 100 parts by mass of silver powder and mixed, then surface-treated. Average particle size after treatment: 7.2 μm)

[0086] (C2) Second conductive particles and (D') surface treatment agent (C2-1) Second conductive particles: Oleic acid surface-treated silver powder-1 ((D') Surface treatment agent: Oleic acid, 0.12 parts by mass of oleic acid added to 100 parts by mass of silver powder and mixed, then surface-treated. Average particle size after treatment: 7.9 μm) (C2-2) Second conductive particles: Isostearic acid surface-treated silver powder ((D') Surface treatment agent: Isostearic acid, 0.19 parts by mass of isostearic acid added to 100 parts by mass of silver powder and mixed, then surface-treated. Average particle size: 7 μm) (C2-3) Second conductive particles: Oleic acid surface-treated silver powder-2 ((D') Surface treatment agent: Oleic acid, 0.69 parts by mass of oleic acid added to 100 parts by mass of silver powder and mixed, then surface-treated. Average particle size after treatment: 1.0 μm) (C2-4) Second conductive particles: Branched fatty acid surface-treated silver powder ((D') Surface treatment agent: Surface-treated with branched fatty acid. Average particle size after treatment: 9.1 μm)

[0087] (C3) Third conductive particles (C3-1) Third conductive particles: Silver (Ag) coated nickel (Ni) powder (average particle size 10 μm) (C3-2) Third conductive particles: Zinc powder (average particle size 4 μm) (C3-3) Third conductive particles: Surface untreated silver powder (average particle size 12 μm)

[0088] (E) Additives (E1) Coupling agent: 3-Glycidoxypropyltriethoxysilane (KBE-403, manufactured by Shin-Etsu Chemical Co., Ltd.) (E2) Radical polymerization inhibitor: p-Benzoquinone (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) (E3) Reactive diluent: Monofunctional epoxy compound (Cardolite LITE513E, manufactured by Cardolite) (E4) Swixing agent: Hydrophobic silica (TS720, manufactured by Cabot Specialty Chemicals Inc.) (E5) Viscosity stabilizer: Epoxy-phenol-boric acid ester compound (L-07N, manufactured by Shikoku Chemicals Co., Ltd.)

[0089] Examples 1 to 6, Comparative Examples 1 to 3: The resin compositions of the Examples and Comparative Examples were prepared by stirring the following mixtures at 1200 rpm for 60 seconds using a hybrid mixer (manufactured by Thinky Co., Ltd., product name "Awatori Rentaro ARE-310") in the proportions shown in Tables 1 and 2: (A) thermosetting resin, (B) curing agent or radical polymerization initiator, (C1) first conductive particles, (D) surface treatment agent ((C) first conductive particles and (D) surface treatment agent), optionally (C2) second conductive particles, optionally (D') surface treatment agent ((C2) second conductive particles and (D') surface treatment agent), and optionally (E) additives. Each resin composition of the Examples and Comparative Examples is in paste form. In Tables 1 and 2, the content of (D) surface treatment agents, namely (D1) fatty acid ester or (D2) fatty acid amide, was determined by calculating the ignition loss (Ig. loss) of (C1) first conductive particles in accordance with JIS K 0067 Test Method for Loss on Weight and Residue of Chemical Products, and then multiplying this ignition loss (Ig. loss) by the blending ratio of (C1) first conductive particles in the resin composition. If a catalog value listing the ignition loss (Ig. loss) for (C1) first conductive particles is available, the content of the (D) surface treatment agent in the resin composition can be calculated by referring to the catalog value. The blending ratios of each component listed in Tables 1 and 2 are in parts by mass.

[0090] In Examples 1 to 6 and Comparative Examples 1 to 3, when (C) conductive particles are treated with (D) surface treatment agent or (D') surface treatment agent, either (C1) first conductive particles already treated with (D) surface treatment agent or (C2) second conductive particles treated with (D') surface treatment agent can be used, or 100 g of (C) conductive particles, 2 g of (D) surface treatment agent or (D') surface treatment agent and 10 g of ethanol as an auxiliary agent can be placed in a pot mill and stirred to surface treat the (C) conductive particles, and then dried to obtain (C1) first conductive particles treated with (D) surface treatment agent or (C2) second conductive particles treated with (D') surface treatment agent, and these (C1) first conductive particles or (C2) second conductive particles can be used.

[0091] Example 7 The resin composition of Example 7 was produced by mixing (A) thermosetting resin, (B) curing agent or radical polymerization initiator, (C3) third conductive particles that have not been surface-treated with a surface treatment agent, (D) surface treatment agent, and optionally (E) additives using a three-roll mill in the proportions shown in Table 3. The resin composition of Example 7 is in paste form. The resin composition of Example 7 was produced by preparing (C3-3) untreated silver powder that has not been surface-treated with a surface treatment agent and (D) surface treatment agent separately, and then surface-treating the surface of (C3-3) untreated silver powder with (D) surface treatment agent when obtaining the resin composition. The proportions of each component listed in Table 3 are in parts by mass.

[0092] Comparative Example 4 A resin composition of Comparative Example 4 was prepared in the same manner as in Example 7, except that (D) a surface treatment agent was not used, with the blending ratios shown in Table 3. The resin composition of Comparative Example 4 is in paste form.

[0093] Each resin composition in the examples and comparative examples was evaluated using one of the following methods. The results are shown in Tables 1 to 3. In Tables 1 to 3, the symbol "-" indicates that the component in question is not present.

[0094] Viscosity and Thixotropy Index (TI) of Resin Composition Using a rotational viscometer (RVT Viscometer, manufactured by Brookfield), with an SC-14C spindle, at 25°C, the spindle was rotated at 10 rpm for 60 seconds, left standing for 5 minutes, then rotated at 1.0 rpm for 60 seconds, 5 rpm for 60 seconds, 10 rpm for 60 seconds, and 50 rpm for 60 seconds in this order to measure the viscosities of the resin compositions of the examples and comparative examples. Tables 1 and 2 list the viscosities of each resin composition when rotated at 10 rpm for 60 seconds using the aforementioned rotational viscometer and SC-14C spindle. The thixotropy index (TI) is the ratio (V １０ｒｐｍ / V １ｒｐｍ [[ID=४]] ) of the viscosity V １ｒｐｍ after rotation at 10 rpm for 60 seconds to the viscosity V １０ｒｐｍ after rotation at 1 rpm for 60 seconds, measured as the thixotropy index (TI).

[0095] Method for Measuring Connection Resistance Value Using the resin compositions of the examples and comparative examples, a pair of electrodes made of each resin composition were formed on the surface of a nickel (Ni)-coated copper (Cu) substrate (thickness 160 μm), and a passive component was placed between the two electrodes so as to contact each electrode, and a connection resistance measurement sample cured in a convection oven at 70°C for 30 minutes was prepared. For each resin composition, one pattern serving as an electrode for the connection resistance measurement sample had a length of 2 mm, a width of 1 mm, and a thickness of 50 μm, and was screen-printed on the substrate such that the distance between the two patterns serving as a pair of electrodes was 2 mm. A current of 10 mA was passed through the two electrodes of the connection resistance measurement sample, and the connection resistance value was measured by the four-terminal method using a digital multimeter (model number: 2001) (manufactured by TFF Case Ray Instruments). As connection resistance measurement samples, four samples of the same conditions were prepared for each resin composition, and the average value of the four was taken as the connection resistance value (mΩ) of the cured product obtained by curing each resin composition. The connection resistance value is preferably 2.0 mΩ or less, more preferably 1.8 mΩ or less, and may be 0.1 mΩ or more, 0.5 mΩ or more, or 1.0 mΩ or more.

[0096] Volume Resistivity Measurement Method Using each resin composition from the examples and comparative examples, a zigzag test pattern with a line width of 1 mm, a side length of 11 mm before bending, a total length of 71 mm, and a thickness of 100 μm, as shown in Figure 1, was screen printed onto an alumina substrate. The pattern was cured in a convention oven at 80°C for 60 minutes to form a volume resistance measurement sample. Figure 1 is an illustrative diagram of the test pattern. The test pattern for forming the volume resistance measurement sample is not limited to that shown in Figure 1; for example, a straight line bent in a Z-shape about five times may also be used. Measuring terminals were brought into contact with both ends of the test pattern, and the volume resistance was measured using the four-terminal method with an LCR meter (manufactured by Yokogawa Electric Corporation) according to the calculation formula (I) below. Three samples were prepared under the same conditions for each resin composition as volume resistance measurement samples, and the average value of the three samples was taken as the volume resistance (Ω・cm) of the cured product obtained by curing each resin composition. The volume resistivity is preferably 0.01 Ω·cm or less, more preferably 0.005 Ω·cm or less, and may be 0.0005 Ω·cm or more, or 0.001 Ω·cm or more. Volume resistivity (Ω·cm) = Resistivity (Ω) × [Film thickness (0.01 cm) × Pattern line width (0.1 cm)] / Total pattern length (7.1 cm) (I)

[0097] Shear Strength Measurement Method: Using a polyimide film stencil with 2 mm diameter holes, each resin composition from the examples and comparative examples was applied to a gold-plated FR4 (Flame Retarded Type 4) plate. A silicon chip (Si Die) measuring 3 mm in length, 3 mm in width, and 330 μm in thickness was placed on each applied resin composition. The resin composition was cured under light load to prepare test specimens for shear strength measurement. The curing conditions were 70°C for 30 minutes in a convention oven. The silicon chip on the gold-plated FR plate was punctured from the side with a bond tester (Dage Series 4000) at room temperature (23°C), and the stress (N) at which the silicon chip peeled off was measured. The surface area (mm²) of the chip was also measured. ２ The stress (N) against the hardened material is expressed as the shear strength (N / mm²) ２The shear strength was measured as (unit: N / mm²). This measurement was performed on 10 shear strength test specimens, and the average value of the obtained stresses was calculated. This average value was used to determine the shear strength of the hardened material (unit: N / mm²). ２ The values ​​are shown in Table 1. The shear strength is 9.0 N / mm². ２ Preferably, it is 9.5 N / mm ２ It is more preferable that the value be greater than or equal to 10 N / mm ２ It is even more preferable that the load be 11 N / mm ２ It is particularly preferable that the load be 20 N / mm ２ The following is also acceptable: 15 N / mm ２ The following is also acceptable.

[0098]

[0099] As shown in Table 1, the resin compositions of Examples 1 to 4 contain (C) conductive particles and at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, and the cured product obtained by curing at a low temperature of 70°C has a contact resistance of 2.0 mΩ or less, indicating low electrical resistance. Furthermore, the resin compositions of Examples 1 to 4 have a shear strength of 9.0 N / mm² when cured at a low temperature of 70°C. ２ The above results in larger values. The resin compositions according to Examples 1 to 4 include (C1) first conductive particles that have been treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides.

[0100] As shown in Table 1, the resin compositions of Comparative Examples 1 and 2 do not contain (C1) first conductive particles treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides. Therefore, the cured product obtained by curing at a low temperature of 70°C has a contact resistance value exceeding 2.0 mΩ, resulting in high electrical resistance.

[0101]

[0102] As shown in Table 2, the resin compositions according to Examples 5 to 6 contain (C) conductive particles and at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, and the cured product obtained by curing at a low temperature of 80°C has a volume resistivity of 0.005 Ω·cm or less, and the electrical resistance is low. The resin compositions according to Examples 5 to 6 contain (C1) first conductive particles treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides.

[0103] As shown in Table 2, the resin composition according to Comparative Example 3 does not contain (C1) first conductive particles treated with at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides. Therefore, even when it contains only (C2) second conductive particles treated with a (D') surface treatment agent other than at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides, the cured product obtained by curing at a low temperature of 80°C has a volume resistivity exceeding 0.01 Ω·cm, indicating high electrical resistance.

[0104]

[0105] As shown in Table 3, the resin composition according to Example 7 contains (C3) untreated silver powder as a third conductive particle, and also contains at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides. Therefore, the cured product obtained by curing at a low temperature of 80°C has a connection resistance of 1.0 mΩ or less, and thus has low electrical resistance.

[0106] As shown in Table 3, the resin composition according to Comparative Example 4 does not contain at least one (D) surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides. Therefore, the cured product obtained by curing at a low temperature of 80°C has a connection resistance value exceeding 10.0 mΩ, resulting in high electrical resistance.

[0107] The resin compositions or adhesives according to the embodiments of this disclosure can be cured at low temperatures, for example, 100°C or lower, preferably 80°C or lower, and more preferably 70°C or lower. The resulting cured products have low electrical resistance, resulting in high productivity. They are useful as resin compositions or adhesives or cured products suitable for use in the manufacture of semiconductor devices and electronic components, for example, when multiple parts made of different materials are joined and assembled.

Claims

1. A resin composition comprising (A) a thermosetting resin, (B) a curing agent or radical polymerization initiator, (C) conductive particles, and (D) at least one surface treatment agent selected from the group consisting of fatty acid esters and fatty acid amides.

2. The resin composition according to claim 1, wherein the (A) thermosetting resin comprises at least one selected from the group consisting of (A1) a compound having an epoxy group, (A2) a compound having an (meth)acryloyl group, and (A3) a bismaleimide compound.

3. The resin composition according to claim 1 or 2, wherein the curing agent or radical polymerization initiator (B) is an amine-based latent curing agent or an organic peroxide.

4. The resin composition according to any one of claims 1 to 3, wherein the conductive particles (C) include silver particles.

5. The resin composition according to any one of claims 1 to 4, wherein the (D) surface treatment agent comprises a saturated fatty acid amide having 10 or more carbon atoms.

6. The resin composition according to any one of claims 1 to 5, wherein the (D) surface treatment agent comprises stearic acid amide.

7. The resin composition according to any one of claims 1 to 4, wherein the (D) surface treatment agent comprises a saturated fatty acid ester having 10 or more carbon atoms.

8. The resin composition according to any one of claims 1 to 4, 7, wherein the (D) surface treatment agent comprises a sorbitan fatty acid ester.

9. The resin composition according to any one of claims 1 to 4, 7, or 8, wherein the (D) surface treatment agent comprises sorbitan monostearate.

10. The resin composition according to any one of claims 1 to 9, wherein when the total mass of the resin composition is 100% by mass, the sum of (C) conductive particles and (D) surface treatment agent is in the range of 60% by mass or more and 95% by mass or less.

11. The resin composition according to any one of claims 1 to 10, wherein the (C) conductive particles include (C1) first conductive particles treated with the (D) surface treatment agent, and may also include at least one selected from the group consisting of (C2) second conductive particles treated with a (D') surface treatment agent other than the (D) surface treatment agent.

12. The resin composition according to claim 11, wherein when the conductive particles (C) are first conductive particles (C1) that have been treated with the surface treatment agent (D), the amount of the surface treatment agent (D) is in the range of 0.01 parts by mass or more and 1.0 part by mass or less, when the conductive particles to be treated are 100 parts by mass.

13. The resin composition according to any one of claims 1 to 10, wherein when the total mass of the resin composition is 100% by mass, the (D) surface treatment agent is in the range of 0.005% by mass or more and 0.95% by mass or less.

14. An adhesive comprising the resin composition according to any one of claims 1 to 13.

15. A cured product obtained by curing the resin composition according to any one of claims 1 to 13, or the adhesive according to claim 14.

16. A semiconductor device or electronic component comprising the cured product described in claim 15.

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