Thin chamber-type heat dissipation device and method for producing same

Abstract

A thin chamber-type heat dissipation device according to one aspect of the present invention comprises: a lower plate having a chamber therein; a porous body disposed in the chamber; and an upper plate coupled to the lower plate to seal same, wherein the porous body comprises a lower layer and an upper layer thereon, and the size of the lower layer pores may be greater than the size of the upper layer pores.

Description

Thin-plate chamber type heat dissipation device and method of manufacturing the same

[0001] The present invention relates to a thin-plate chamber type heat dissipation device and a method for manufacturing the same, and more specifically, to a thin-plate chamber type heat dissipation device with improved boiling performance and a method for manufacturing the same.

[0002] Generally, portable electronic devices are equipped with circuit components, batteries, etc., to display information on a screen, output sound, and maintain set operations, providing convenience and assistance to the user's daily life.

[0003] Recent portable electronic devices generate significant heat due to the high workload caused by fast CPU / GPU processing speeds and the ability to perform various tasks; however, it is difficult to install effective cooling systems due to the slim structure of these devices.

[0004] Therefore, portable electronic devices can generate significant heat, and excessive heat can cause discomfort and anxiety for the user. Furthermore, since the heat generated can damage semiconductors within the device or cause operational errors, it is desirable to cool the device by dissipating the heat as quickly as possible.

[0005] Generally, a vapor chamber is installed inside a portable electronic device, and the working fluid contained within the vapor chamber can rapidly absorb heat generated inside the portable electronic device and boil (dissipate heat / cool).

[0006] In order to improve such boiling performance, conventional methods involved scratching or sanding the base material of a copper vapor chamber to increase roughness, but the expected boiling performance was not achieved.

[0007] In addition, although a groove pattern was formed on the base material, the processing cost was high and the expected boiling performance was not achieved.

[0008] The present invention provides a thin-wall chamber type heat dissipation device with improved boiling performance and a method for manufacturing the same.

[0009] A thin-plate chamber type heat dissipation device according to one aspect of the present invention comprises a lower plate having a chamber inside, a porous body disposed in the chamber, and an upper plate coupled to the lower plate to seal the lower plate, wherein the porous body comprises a lower layer and an upper layer located on the lower layer, and the pore size of the lower layer may be larger than the pore size of the upper layer.

[0010] As described above, according to one aspect of the present invention, a thin-wall chamber type heat dissipation device may include a porous body to improve the boiling performance of the working fluid.

[0011] In addition, by using the electrospinning method, porous bodies can be formed at a high speed, which can increase the production rate of thin-wall chamber type heat dissipation devices.

[0012] In addition, the lower layer of the porous body is formed with fibers that are relatively thicker than the upper layer, so that the lower layer continuously absorbs the working fluid and the upper layer allows the working fluid to form bubbles and undergo a phase change to be easily discharged from the porous body, thereby ensuring excellent boiling performance of the thin-plate chamber type heat dissipation device.

[0013] FIG. 1 is a schematic perspective view illustrating an example of a thin-plate chamber type heat dissipation device according to one embodiment of the present invention.

[0014] FIG. 2 is an exploded perspective view schematically illustrating the thin-plate chamber type heat dissipation device of FIG. 1.

[0015] FIG. 3 is a schematic cross-sectional view illustrating an example of the AA cross-section of FIG. 1.

[0016] FIG. 4 is a cross-sectional view schematically illustrating an example of part A of FIG. 3.

[0017] FIG. 5 is a cross-sectional view schematically illustrating another example of part A of FIG. 3.

[0018] Figure 6 is a schematic plan view illustrating an example of the BB cross-section of Figure 5.

[0019] Figure 7 is a plan view schematically illustrating another example of the BB cross-section of Figure 5.

[0020] FIG. 8 is a flowchart illustrating a method for manufacturing a thin-plate chamber type heat dissipation device according to one embodiment of the present invention.

[0021] FIGS. 9 to 12 are plan views illustrating the lower plate of FIG. 2, respectively.

[0022] A thin-plate chamber type heat dissipation device according to one aspect of the present invention comprises a lower plate having a chamber inside, a porous body disposed in the chamber, and an upper plate coupled to the lower plate to seal the lower plate, wherein the porous body comprises a lower layer and an upper layer located on the lower layer, and the pore size of the lower layer may be larger than the pore size of the upper layer.

[0023] In the present embodiment, the lower plate may further include a plurality of internal supports protruding from the upper surface of the lower plate.

[0024] In this embodiment, the thickness of the lower layer may be thicker than the thickness of the upper layer.

[0025] In this embodiment, the porous body may be formed by applying a preset voltage to a polymer material and extruding fibers onto the lower plate.

[0026] In this embodiment, the polymer material may contain thermally conductive nanowires or nanoparticles.

[0027] In this embodiment, the fibers of the lower layer may be formed thicker than the fibers of the upper layer.

[0028] In the present embodiment, the lower layer may include a first lower layer formed on the upper surface of the lower plate and a second lower layer formed on the upper surface of the first lower layer and disposed between the first lower layer and the upper layer.

[0029] A method for manufacturing a thin-plate chamber-type heat dissipation device according to another aspect of the present invention may include a porous body forming step of forming a porous body in a lower plate having a chamber inside by an electrospinning process, a sealing step of sealing the lower plate by joining an upper plate to the lower plate, and a working fluid injection step of injecting a working fluid into the chamber.

[0030] In this embodiment, the porous body forming step may form a radiation hole corresponding to the radiation area in the masking guide after specifying the radiation area on the upper surface of the lower plate.

[0031] In this embodiment, the porous body forming step may cover the upper surface of the lower plate with the masking guide so that the radiation area and the radiation holes correspond.

[0032] In this embodiment, the porous body formation step may form the porous body by applying a preset voltage to a polymer material and spinning the fibers generated onto the lower plate.

[0033] In this embodiment, the porous body forming step may form an upper layer on the upper surface of the lower layer after forming a lower layer on the upper surface of the lower plate.

[0034] In this embodiment, the voltage applied to the polymer material during the formation of the lower layer in the porous body formation step may be smaller than the voltage applied to the polymer material during the formation of the upper layer.

[0035] In this embodiment, the transfer speed applied to the polymer material during the formation of the upper layer in the porous body formation step may be faster than the transfer speed applied to the polymer material during the formation of the lower layer.

[0036] In the present embodiment, the porous body forming step may form a first lower layer on the upper surface of the lower plate and form a second lower layer on the upper surface of the first lower layer.

[0037] The present invention is capable of various modifications and may have various embodiments, and specific embodiments are to be illustrated and described in detail. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that it includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention.

[0038] The terms used in this invention are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this invention, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0039] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Note that in the accompanying drawings, identical components are indicated by the same reference numerals whenever possible. Furthermore, detailed descriptions of known functions and configurations that may obscure the essence of the present invention will be omitted. For the same reason, some components in the accompanying drawings may be exaggerated, omitted, or schematically depicted.

[0040] Hereinafter, a thin-plate chamber type heat dissipation device according to one embodiment of the present invention will be described.

[0041] FIG. 1 is a schematic perspective view illustrating an example of a thin-plate chamber type heat dissipation device according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view schematically illustrating the thin-plate chamber type heat dissipation device of FIG. 1.

[0042] Referring to FIGS. 1 and 2, a thin-wall chamber type heat dissipation device (100) according to one embodiment of the present invention may include a lower plate (110), a porous body (120), an upper plate (130), and an internal support (140).

[0043] The lower plate (110) may be made of a square plate or a circular plate, and a chamber (111) formed in the shape of a groove may be formed in the lower plate (110). The lower plate (110) may be placed on top of a hot spot such as a CPU / GPU.

[0044] The internal support (140) is formed as a structure that extends in one direction, and a plurality of internal supports (140) can be evenly distributed on the lower plate (110).

[0045] Here, the shape of the internal support (140) is not limited to this and can be made in various shapes such as a cylinder, an elliptical cylinder, a rectangular cylinder, etc.

[0046] A porous body (120) may be disposed within the chamber (111) of the lower plate (110). The porous body (120) accelerates the boiling of the working fluid and may be formed in the shape of a square plate or a disc. The porous body (120) may be formed, for example, by an electrospinning process.

[0047] An injection port (113) for injecting a working fluid and a welding groove (112) for welding to an upper plate (130) may be formed in the lower plate (110). The welding groove (112) supports the upper plate (130) when the lower plate (110) and the upper plate (130) are joined, and may be formed along the edge of the lower plate (110). Thus, the chamber (111) is located inside the welding groove (112). Additionally, the injection port (113) may be formed by removing a portion of the welding groove (112).

[0048] The upper plate (130) may be made of a rectangular or circular flat plate, but is not limited thereto. For example, the upper plate (130) may have a smaller size than the lower plate (120) and may be joined to the lower plate (120) with its edges supported by a welding groove (112). After the lower plate (110) and the upper plate (130) are joined, the upper plate (130) and the lower plate (110) may be joined by welding along the welding groove (112).

[0049] A weld (WL, see FIG. 1) is formed by welding the upper plate (130) and the lower plate (110), and the weld (WL) is formed along the side edge of the upper plate (130), and the upper end of the weld groove (112) and the upper plate (130) can be joined by the weld (WL).

[0050] FIG. 3 is a schematic cross-sectional view illustrating an example of the AA section of FIG. 1, and FIG. 4 is a schematic cross-sectional view illustrating an example of the A section of FIG. 3.

[0051] Referring to FIGS. 3 and 4, the porous body (120) may include a lower layer (121) and an upper layer (122) having different pore sizes, which are located in the center of the chamber (111). For example, the pore size of the lower layer (121) may be larger than the pore size of the upper layer (122), and the upper layer (122) may be located on the lower layer (121).

[0052] Such a porous body (120) can be formed by applying a preset voltage to a polymer material and spinning fibers onto a lower plate (110).

[0053] The electrospinning device can be spun into a fiber form by having a syringe pump push a polymer material contained inside toward the needle, and a power supply applying voltage to the polymer material discharged from the needle.

[0054] Here, a thermally conductive nanowire or nanoparticle is mixed into the polymer material to increase the boiling performance of the porous body (120), and the thickness of the fiber can be controlled by adjusting the magnitude of the voltage and the transport speed of the polymer material.

[0055] That is, the greater the voltage applied to the polymer material, the greater the tensile force acting on the polymer material, allowing for the spinning of relatively thin fibers, and this electrospinning method can form a porous body (120) at a high speed, thereby increasing the production rate of the thin-wall chamber type heat dissipation device.

[0056] Meanwhile, the lower layer (121) can be formed by radiating fibers onto the upper surface of the lower plate (110), and the upper layer (122) can be formed by radiating fibers onto the upper surface of the lower layer (121).

[0057] At this time, the voltage applied to the polymer material when forming the lower layer (121) is set to be smaller than the voltage applied to the polymer material when forming the upper layer (122), so that the fibers of the lower layer (121) can be formed thicker than the fibers of the upper layer (122).

[0058] That is, the lower layer (121) may be formed of fibers that are relatively thicker than the upper layer (122), so that the lower layer (121) has a loose hydrophilic structure and the upper layer (122) has a relatively dense hydrophobic structure compared to the lower layer (121).

[0059] Accordingly, the pore size of the lower layer (121) is formed to be larger than the pore size of the upper layer (122), and the working fluid is continuously absorbed by the capillary effect of the lower layer (121), and the working fluid can be easily discharged from the porous body (120) by changing phases into bubbles in the upper layer (122), thereby ensuring excellent boiling performance of the thin-plate chamber type heat dissipation device (100).

[0060] Meanwhile, the thickness (T1) of the lower layer (121) may be greater than the thickness (T2) of the upper layer (122). If the thickness (T1) of the lower layer (121) is greater than the thickness (T2) of the upper layer (122), the amount of fluid absorbed by the lower layer (121) is greater than the amount of fluid evaporated by the upper layer (122), so fluid can be continuously supplied to the porous body (120), and the flow of fluid can be smoothly circulated inside the thin-plate chamber type heat dissipation device (100), thereby improving the cooling efficiency of the thin-plate chamber type heat dissipation device (100).

[0061] FIG. 5 is a schematic cross-sectional view illustrating another example of part A of FIG. 3, FIG. 6 is a schematic plan view illustrating one example of the BB cross section of FIG. 5, and FIG. 7 is a schematic plan view illustrating another example of the BB cross section of FIG. 5.

[0062] First, referring to FIG. 5, the porous body (120') is located in the center of the chamber (111) and may include a lower layer (121') and an upper layer (122') having different pore sizes. For example, the pore size of the lower layer (121') is larger than the pore size of the upper layer (122'), and the upper layer (122') may be located on the lower layer (121').

[0063] Meanwhile, the lower layer (121') may include a first lower layer (121'b) and a second lower layer (121'a) that are sequentially stacked.

[0064] A first lower layer (121'b) is formed by radiating fibers onto the upper surface of a lower plate (110), a second lower layer (121'a) is formed by radiating fibers onto the upper surface of the first lower layer (121'b), and an upper layer (122) can be formed by radiating fibers onto the upper surface of the second lower layer (121'a).

[0065] Here, the voltage applied to the polymer material during the formation of the first lower layer (121'b) and the second lower layer (121'a) can be set to be the same.

[0066] A flow path (121'c) is formed in the second lower layer (121'a), and the working fluid can be absorbed more smoothly into the lower layer (121') through the flow path (121'c), thereby increasing the boiling performance.

[0067] Figures 6 and 7 each show an example of the Euro shown in Figure 5.

[0068] Referring to FIGS. 6 and 7, the flow path (121'c) may be formed in a straight line (121'ca) or grid (121'cb) shape and may be connected to the chamber (111, see FIG. 5). However, the shape of the flow path (121'c) is not limited to this and can be modified into various shapes such as radial or zigzag.

[0069] FIG. 8 is a flowchart illustrating a method for manufacturing a thin-plate chamber type heat dissipation device according to one embodiment of the present invention, and FIGS. 9 to 12 are plan views illustrating the lower plate of FIG. 2, respectively.

[0070] Specifically, FIG. 9 is a plan view of the lower plate illustrated in FIG. 2, showing the state before the porous body is formed, FIG. 10 shows the state in which a masking guide is covered on the lower plate illustrated in FIG. 9, FIG. 11 shows the state in which a spacer is placed to form a first embodiment of the flow path in FIG. 10, and FIG. 12 shows the state in which a spacer is placed to form a second embodiment of the flow path in FIG. 10.

[0071] Referring to FIGS. 8 to 12, a method for manufacturing a thin-wall chamber type heat dissipation device (S100) according to one embodiment of the present invention may include a porous body forming step (S110), a sealing step (S120), and an operating fluid injection step (S130).

[0072] The porous body formation step (S110) involves forming a porous body (120) on a lower plate (110) by an electrospinning process and placing it in a chamber (111) (see FIG. 4).

[0073] More specifically, after specifying a radiation area (114) on the upper surface of the lower plate (110), a radiation hole (151) corresponding to the radiation area (114) is formed in the masking guide (150) (see FIG. 9 and FIG. 10).

[0074] Here, the radiation area (114) can be defined as the location where the porous body (120) is formed on the lower plate (110).

[0075] Afterwards, a masking guide (150) is placed on the upper surface of the lower plate (110) so that the radiation area (114) and the radiation hole (151) correspond, and a fiber generated by applying a preset voltage to a polymer material is radiated onto the lower plate (110) to form a porous body (120).

[0076] A first embodiment of the porous body (120) may include a lower layer (121) and an upper layer (122) (see FIG. 4).

[0077] That is, fibers are radiated onto the upper surface of the lower plate (110) through the radiating hole (151, see FIG. 9) to form a lower layer (121), and then fibers are radiated onto the upper surface of the lower layer (121) to form an upper layer (122).

[0078] Here, the voltage applied to the polymer material during the formation of the lower layer (121) is set to be smaller than the voltage applied to the polymer material during the formation of the upper layer (122), so that the fibers of the lower layer (121) can be formed thicker than the fibers of the upper layer (122).

[0079] Alternatively, the transfer speed applied to the polymer material by the syringe pump during the formation of the upper layer (122) is set faster than the transfer speed applied to the polymer material during the formation of the lower layer (121), so that the fibers of the lower layer (121) can be formed thicker than the fibers of the upper layer (122).

[0080] Accordingly, the pore size of the lower layer (121) is formed to be larger than the pore size of the upper layer (122), and the working fluid is continuously absorbed by the capillary effect of the lower layer (121), and the working fluid can be easily discharged from the porous body (120) by changing phases into bubbles in the upper layer (122).

[0081] Meanwhile, as shown in FIG. 5, the lower layer (121') of the porous body (120') may include a first lower layer (121'b) and a second lower layer (121'a).

[0082] That is, a fiber is radiated through a radiating hole (151, see FIG. 111) to form a first lower layer (121'b) on the upper surface of a lower plate (110), then a fiber is radiated on the upper surface of the first lower layer (121'b) to form a second lower layer (121'a), and a fiber is radiated on the upper surface of the second lower layer (121'a) to form an upper layer (122).

[0083] Here, the voltage applied to the polymer material during the formation of the first lower layer (121'b) and the second lower layer (121'a) can be set to be the same.

[0084] A flow path (121'c) is formed inside the second lower layer (121'a), and a spacer (160) can be placed on the upper surface of the first lower layer (121'b) to form the flow path (121'c) by specifying the location of the flow path (121'c).

[0085] The spacer (160) is an object of a size corresponding to the flow path (121'c) and can be made of paper that can dissolve in a specific solution including water, and can be removed from the porous body (120') after the formation of the porous body (120') is completed so that the flow path (121'c) can be formed in the place where the spacer (160) was removed.

[0086] The spacer (160) may be manufactured in a straight or grid shape and fibers may be spun while placed on the upper surface of the first lower layer (121'b) to form the second lower layer (121'a) (see FIG. 11 and FIG. 12).

[0087] Afterwards, the masking guide (150) is removed from the lower plate (110) to complete the formation of the porous body (120, 120').

[0088] The sealing step (S120) seals the lower plate (110) by joining the upper plate (130) to the lower plate (110).

[0089] More specifically, an upper plate (130) is inserted into a welding groove (112) formed in a lower plate (110), and a weld (WL) is formed along the perimeter of the upper plate (130) on the upper surface of the upper plate (130) so that the upper end of the welding groove (112) and the side end of the upper plate (130) can be joined (see FIG. 3).

[0090] The working fluid injection step (S130) injects working fluid into the chamber (111).

[0091] More specifically, the working fluid consists of deionized water or other liquid, and after injecting the working fluid through an inlet (113) formed in the lower plate (110), the inlet (113) is sealed (see FIG. 2).

[0092] Although an embodiment of the present invention has been described above, those skilled in the art may modify and change the present invention in various ways by adding, changing, deleting, or adding components, etc., without departing from the spirit of the present invention as described in the claims, and such modifications and changes are also to be included within the scope of the rights of the present invention.

Claims

1. A lower plate having a chamber inside; A porous body disposed in the above chamber; and It includes an upper plate that is coupled to the lower plate and seals the lower plate; and The above porous body includes a lower layer and an upper layer located on the lower layer, and A thin-plate chamber type heat dissipation device in which the pore size of the lower layer is larger than the pore size of the upper layer.

2. In Paragraph 1, The above lower plate is a thin-plate chamber type heat dissipation device further comprising a plurality of internal supports protruding from the upper surface of the above lower plate.

3. In Paragraph 1, A thin-plate chamber type heat dissipation device in which the thickness of the lower layer is thicker than the thickness of the upper layer.

4. In Paragraph 1, The above porous body is, A thin-wall chamber type heat dissipation device formed by applying a preset voltage to a polymer material and extruding fibers onto the lower plate.

5. In Paragraph 4, A thin-wall chamber type heat dissipation device in which thermally conductive nanowires or nanoparticles are mixed into the above polymer material.

6. In Paragraph 4, A thin-plate chamber-type heat dissipation device in which the fibers of the lower layer are thicker than the fibers of the upper layer.

7. In Paragraph 1, The above lower layer is, A first lower layer formed on the upper surface of the lower plate; and A thin-plate chamber type heat dissipation device comprising: a second lower layer formed on the upper surface of the first lower layer and disposed between the first lower layer and the upper layer.

8. A porous body formation step of forming a porous body on a lower plate having an internal chamber by an electrospinning process; A sealing step of sealing the lower plate by joining an upper plate to the lower plate; and A method for manufacturing a thin-plate chamber type heat dissipation device comprising: a working fluid injection step of injecting a working fluid into the chamber.

9. In Paragraph 8, The above porous body formation step is, A method for manufacturing a thin-plate chamber type heat dissipation device, wherein a radiation area is designated on the upper surface of the lower plate, and then a radiation hole corresponding to the radiation area is formed in a masking guide.

10. In Paragraph 9, The above porous body formation step is, A method for manufacturing a thin-plate chamber type heat dissipation device by covering the upper surface of the lower plate with the masking guide so that the radiation area and the radiation hole correspond to each other.

11. In Paragraph 8, The above porous body formation step is, A method for manufacturing a thin-plate chamber type heat dissipation device by applying a preset voltage to a polymer material to generate fibers, which are then spun onto the lower plate to form the porous body.

12. In Paragraph 11, The above porous body formation step is, A method for manufacturing a thin-plate chamber type heat dissipation device, wherein a lower layer is formed on the upper surface of the lower plate, and then an upper layer is formed on the upper surface of the lower layer.

13. In Paragraph 12, The above porous body formation step is, A method for manufacturing a thin-wall chamber type heat dissipation device in which the voltage applied to the polymer material during the formation of the lower layer is smaller than the voltage applied to the polymer material during the formation of the upper layer.

14. In Paragraph 12, The above porous body formation step is, A method for manufacturing a thin-plate chamber type heat dissipation device in which the transfer speed applied to the polymer material during the formation of the upper layer is faster than the transfer speed applied to the polymer material during the formation of the lower layer.

15. In Paragraph 12, The above porous body formation step is, A first lower layer is formed on the upper surface of the above lower plate, and A method for manufacturing a thin-plate chamber type heat dissipation device characterized by forming a second lower layer on the upper surface of the first lower layer.

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