Evaporation source

Abstract

As a technical means for achieving the above-described technical task, according to one aspect of the present invention, this evaporation source comprises: a crucible configured to accommodate a deposition material; a cover unit configured to cover top of the crucible and including a plurality of injection holes; and a replaceable inner nozzle inserted into the inner side of the cover unit and having an inner injection hole configured to be connected to at least one injection hole among the injection holes, wherein the inner injection hole of the inner nozzle is configured to allow the at least one injection hole and an inner space of the crucible to be in communication with each other.

Description

Evaporation source

[0001] The present invention relates to an evaporation source, and more specifically, to an evaporation source capable of depositing a thin film of excellent quality.

[0002] Thin film deposition devices are equipment used to deposit thin films, and there are various types, including vacuum deposition devices, electron beam deposition devices, chemical vapor deposition devices, and sputtering devices. Among these, vacuum deposition devices form thin films by placing a deposition material into a crucible and heating it to evaporate it. Since vacuum deposition devices can easily form high-quality thin films without causing deformation to the deposition material, they are widely used in the manufacturing processes of various electronic devices such as semiconductors, flat panel displays, solar panels, and smart windows.

[0003] A vacuum deposition apparatus includes an evaporation source as a main component for evaporating a deposition material, and the evaporation source includes a crucible for receiving the deposition material, a heater for heating the deposition material inside the crucible by applying heat to the crucible, and a nozzle part capable of passing the vaporized deposition material through and spraying it.

[0004] To form a large-area thin film with a uniform thickness, the nozzle section includes a plurality of nozzles (i.e., nozzles). In addition, to precisely control the degree and area of ​​deposition material spraying, it is necessary to partially close the plurality of nozzles or control the diameter or shape of the nozzles. To solve this, an evaporation source designed to allow for the replacement of nozzles has been developed (e.g., Korean Registered Patent No. 10-1350026).

[0005] However, heat transfer may not be smooth at the connection point of the replaceable nozzle, and a phenomenon in which the temperature drops at the top of the nozzle may occur. As deposited material accumulates at the top of the nozzle, a clogging problem may occur, causing the nozzle to become blocked.

[0006] In addition, to control the thin film thickness profile, the diameter of some interchangeable nozzles is changed or some interchangeable nozzles are closed; however, if the shape or diameter of the nozzles is changed, it inevitably entails a change in the emission pattern of the deposited material, making it difficult to precisely control the uniformity of the thin film.

[0007] Accordingly, there is a need for technological development to enable precise control of thin film uniformity while compensating for the disadvantages of replaceable nozzles.

[0008] Meanwhile, the aforementioned background technology is technical information that the inventor possessed for the derivation of the present invention or acquired during the process of deriving the present invention, and it cannot be considered as prior art disclosed to the general public prior to the filing of the present invention.

[0009] The objective of the present invention is to provide an evaporation source capable of controlling the nozzle while suppressing the phenomenon of nozzle clogging.

[0010] As a technical means for achieving the technical problem described above, according to one aspect of the present invention, an evaporation source comprises a crucible configured to receive a deposition material, a cover portion configured to cover the upper part of the crucible and including a plurality of nozzles, and a replaceable inner nozzle having an inner nozzle inserted into the inner side of the cover portion and configured to be connected to at least one of the nozzles, wherein the inner nozzle of the inner nozzle is configured to communicate between the at least one nozzle and the inner space of the crucible.

[0011] According to another aspect of the present invention, the cover portion has an internal nozzle receiving space for receiving the internal nozzle, and the internal nozzle can be connected to the cover portion in the internal nozzle receiving space.

[0012] The internal nozzle of the above internal nozzle includes a first part that contacts the nozzle of the cover part and a second part that is in communication with the first part and is positioned toward the internal space of the crucible, and the cross-sectional size of the first part and the cross-sectional size of the second part may be the same.

[0013] The internal nozzle of the above internal nozzle includes a first part that contacts the nozzle of the cover part and a second part that is in communication with the first part and is positioned toward the internal space of the crucible, and the cross-sectional size of the first part and the cross-sectional size of the second part may be different from each other.

[0014] The cross-sectional shape of the first part of the internal nozzle and the cross-sectional shape of the second part may be identical to each other.

[0015] The cross-sectional shape of the first part of the internal nozzle and the cross-sectional shape of the second part may be different from each other.

[0016] The length from the second part of the inner nozzle to the first part may be 70% or less of the length from the second part of the inner nozzle to the upper part of the nozzle of the cover part.

[0017] The above crucible is linear and extends in one direction, and the plurality of nozzles of the above cover can be arranged along the above one direction.

[0018] The above internal nozzle may be configured in multiple numbers to correspond to each of the plurality of nozzles.

[0019] At least one of the plurality of internal nozzles above may be configured to close the corresponding nozzle.

[0020] The internal nozzle of at least one of the plurality of internal nozzles may have a different size or shape from the internal nozzle of another internal nozzle.

[0021] According to any one of the means for solving the problem of the present invention described above, the evaporation source of the present invention includes an internal nozzle configured to be connected to at least one of a plurality of nozzles provided in a cover portion, and includes a replaceable internal nozzle. Therefore, in the event of a defect or damage to some of the nozzles among the plurality of nozzles, it is possible to respond by replacing the internal nozzle, and since there is no need to completely replace the evaporation source, the efficiency of the thin film deposition process can be improved.

[0022] According to any one of the means for solving the problem of the present invention described above, the evaporation source of the present invention includes a cover portion in which a plurality of nozzles are integrally formed, so that heat transfer between the nozzles and the cover portion can be smooth, thereby minimizing the temperature drop at the top of the nozzles and effectively resolving the problem of nozzle clogging caused by the temperature drop at the top of the nozzles.

[0023] According to any one of the means for solving the problem of the present invention described above, the evaporation source of the present invention includes an internal nozzle having an internal nozzle designed with various sizes or shapes. Since different internal nozzles are installed for each of the multiple nozzles, individual control of the deposition material emitted through the nozzles is possible, and the precision of thin film deposition can be improved. In particular, since the diameter or shape of the internal nozzle can be varied while maintaining the shape and diameter of the nozzle, the amount of deposition material ejected can be precisely controlled while minimizing deformation of the ejection pattern of the ejected deposition material. Consequently, precise control of the thin film thickness profile is possible, and a thin film of excellent quality can be provided.

[0024] The effects obtainable from the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description below.

[0025] FIG. 1 is an exploded perspective view of an evaporation source according to one embodiment of the present invention.

[0026] Figure 2 is a partial perspective view of Figure 1 seen from direction II.

[0027] Figure 3 is a cross-sectional view of III-III' of Figure 1.

[0028] FIG. 4 is a cross-sectional view of an evaporation source according to another embodiment of the present invention.

[0029] Figure 5 is a plan view of Figure 4 seen from the V direction.

[0030] Figure 6 is a plan view taken from the VI direction of Figure 4.

[0031] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement the invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the present invention in the drawings, parts unrelated to the explanation have been omitted, and similar parts throughout the specification are denoted by similar reference numerals.

[0032] Throughout the specification, when a part is described as being "connected" to another part, this includes not only cases where they are "directly connected," but also cases where they are "indirectly connected" with other members or elements interposed between them. Furthermore, when a part is described as "including" a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.

[0033] The present invention will be described in detail below with reference to the attached drawings.

[0034] FIG. 1 is an exploded perspective view of an evaporation source according to one embodiment of the present invention. FIG. 2 is a partial perspective view taken in the direction II of FIG. 1. FIG. 3 is a cross-sectional view taken along III-III' of FIG. 1.

[0035] Referring to FIG. 1, the evaporation source (100) of the present invention is a configuration applied to a deposition apparatus for forming a thin film, and may be an apparatus for vaporizing a deposition material to form a thin film composed of the deposition material on a substrate. Here, the deposition material may be an organic material or an inorganic material.

[0036] The evaporation source (100) includes a crucible (110), a cover (120), and an internal nozzle (130).

[0037] The crucible (110) is configured to accommodate a deposition material and includes an internal space (111). The crucible (110) may be made of a material with excellent chemical resistance and heat resistance. For example, the crucible (110) may be made of various materials such as graphite, alumina, tungsten (W), rhodium (Rh), platinum (Pt), iridium (Ir), and titanium (Ti).

[0038] The shape of the crucible (110) is not particularly limited. For example, the crucible (110) may be cylindrical. In this case, the evaporation source (100) may be a point evaporation source that discharges the deposition material from a specific point. Also, as shown in FIG. 1, the crucible (110) may be a cuboid shape that extends in one direction. In this case, the evaporation source (100) may be a linear evaporation source in which the deposition material is discharged in a linear form. Below, the description will focus on the case where the evaporation source (100) is a linear evaporation source, as shown in FIG. 1.

[0039] In some embodiments, the evaporation source (100) may further include a heater that generates heat in the crucible (110). The heater may be positioned to surround the outer surface of the crucible (110). The heater may be configured in various forms capable of generating heat in the crucible (110). For example, the heater may be configured as a coil capable of generating heat in the crucible (110) by inducing an induced electromotive force in the crucible (110).

[0040] The cover portion (120) is configured to cover the upper part of the crucible (110). The internal space (111) of the crucible (110) is sealed by the cover portion (120), and heat leakage from the internal space (111) is blocked by the cover portion (120).

[0041] The cover portion (120) may be made of a material with excellent chemical resistance and heat resistance, for example, it may be made of the same material as the crucible (110). However, it is not limited thereto, and the cover portion (120) may be made of a material different from the material of the crucible (110).

[0042] The cover portion (120) includes a plurality of nozzles (121). The plurality of nozzles (121) are formed integrally with the cover portion (120) and are made of the same material.

[0043] As shown in FIG. 1, when the shape of the crucible (110) is linear, a plurality of nozzles (121) provided in the cover portion (120) may be arranged in the same direction as the extension direction of the crucible (110). For example, as shown in FIG. 1, the nozzles (121) may be arranged in a single row. However, this is not limited thereto, and the nozzles (121) may be arranged in two or more rows.

[0044] Vaporized deposition material can be discharged through a plurality of nozzles (121). The plurality of nozzles (121) may be positioned toward an area where a deposition target (e.g., a substrate) is placed. For example, the plurality of nozzles (121) may be positioned to face upward. However, the direction in which the plurality of nozzles (121) face can be varied depending on the area, thickness profile, etc. of the thin film to be deposited, and is not particularly limited.

[0045] Figure 2 is a partial perspective view of Figure 1 seen from direction II.

[0046] Referring to FIG. 2, the cover portion (120) includes an internal nozzle receiving space (123). The internal nozzle receiving space (123) is a space for inserting an internal nozzle (130) and is positioned at a location corresponding to a plurality of nozzles (121) provided in the cover portion (120). The internal nozzle receiving space (123) may have a shape corresponding to the shape of the internal nozzle (130). However, it is not limited thereto, and may have a shape different from the shape of the internal nozzle (130) as long as it is a shape capable of receiving the internal nozzle (130).

[0047] The internal nozzle receiving space (123) is in communication with a plurality of nozzles (121). Specifically, when the internal nozzle (130) is inserted through the internal nozzle receiving space (123), the internal nozzle (131) of the internal nozzle (130) is configured to be in communication with a plurality of nozzles (121) of the cover portion (120).

[0048] In some embodiments, a fastening portion for fastening the inner nozzle (130) may be disposed in the inner nozzle receiving space (123). The fastening portion is configured to allow the inner nozzle (130) to be fastened to the cover portion (120) in the inner nozzle receiving space (123) and may be composed of various elements such as screw threads or protrusions.

[0049] Referring to FIG. 3, the internal nozzle receiving space (123) is connected to a plurality of nozzles (121). That is, each nozzle (121) is connected from the internal nozzle receiving space (123) toward the upper part of the cover portion (120). Accordingly, the lower part (121b) of the nozzles (121) is positioned within the internal nozzle receiving space (123), and the upper part (121t) of the nozzles (121) is positioned toward the upper part of the cover portion (120).

[0050] The inner nozzle (130) is inserted into the inner side of the cover portion (120). Specifically, as shown in FIG. 2, it is inserted into the inner nozzle receiving space (123) provided in the cover portion (120). As shown in FIG. 3, the shape of the inner nozzle (130) may correspond to the shape of the inner nozzle receiving space (123). However, it is not limited thereto, and if the inner nozzle (130) can be inserted into the inner nozzle receiving space (123), the shape of the inner nozzle (130) may not correspond to the shape of the inner nozzle receiving space (123).

[0051] As described above, the inner nozzle (130) is connected to the cover portion (120) within the inner nozzle receiving space (123). For example, if the inner nozzle receiving space (123) is provided with a concave portion, the inner nozzle (130) may be provided with a convex portion corresponding to the concave portion, and the inner nozzle (130) may be connected to the inner nozzle receiving space (123) by an uneven coupling method. Additionally, if the inner nozzle receiving space (123) is provided with screw threads, the inner nozzle (130) may be configured to be screw-coupled to the screw threads of the inner nozzle receiving space (123).

[0052] As illustrated in FIGS. 1 and 2, the inner nozzles (130) may be configured in multiple numbers to correspond to the nozzles (121) of the cover portion (120). For example, the multiple inner nozzles (130) may be arranged to correspond one-to-one with each of the nozzles (121) of the cover portion (120).

[0053] The inner nozzle (130) is provided with an inner nozzle (131), and as shown in FIG. 3, the inner nozzle (131) of the inner nozzle (130) is configured to be connected to the nozzle (121) of the cover portion (120). Specifically, when the inner nozzle (130) is inserted into the inner nozzle receiving space (123), the first part (131t) of the inner nozzle (131) of the inner nozzle (130) comes into contact with the lower part (121b) of the corresponding nozzle (121). Additionally, the second part (131b) of the inner nozzle (131) of the inner nozzle (130) is positioned toward the lower part of the cover portion (120), and when the cover portion (120) and the crucible (110) are connected, the second part (131b) is positioned toward the inner space (111) of the crucible (110). Accordingly, the internal space (111) of the crucible (110) is connected to the outside of the cover (120) through the second part (131b) of the internal nozzle (131), the first part (131t) of the internal nozzle (131), the lower part (121b) of the nozzle (121), and the upper part (121t) of the nozzle (121).

[0054] As described above, the internal nozzle (131) of the internal nozzle (130) is in the shape of a tube connected from the second part (131b) toward the first part (131t), and the cross-sectional diameter of the first part (131t) may be substantially the same as the cross-sectional diameter of the second part (131b). However, it is not limited thereto, and the cross-sectional sizes of the first part (131t) and the second part (131b) of the internal nozzle (131) may be different from each other.

[0055] Additionally, the cross-sectional shape of the first part (131t) and the cross-sectional shape of the second part (131b) may be substantially the same. For example, the internal nozzle (131) may be configured as a cylindrical shape with the same upper and lower surfaces. However, it is not limited thereto, and the internal nozzle (131) may be configured as a rectangular prism, a triangular prism, etc., or the cross-sectional shape of the first part (131t) and the cross-sectional shape of the second part (131b) may be different from each other.

[0056] Meanwhile, the length of the internal nozzle (130)'s internal nozzle (131) may be 70% or less of the total length of the nozzle (121) to which the internal nozzle (130) is mounted. That is, the length from the second part (131b) of the internal nozzle (131) to the first part (131t) may be 70% or less of the total length of the nozzle (121), which is defined as the length from the second part (131b) of the internal nozzle (131) to the upper part (121t) of the nozzle (121). If the length of the internal nozzle (130) exceeds 70% of the total length of the nozzle (121), the length of the internal nozzle (130) becomes excessively large, which may cause a deformation in the spraying shape of the deposition material by the internal nozzle (130) and may make it difficult to control the spraying through the internal nozzle (130).

[0057] Hereinafter, various embodiments regarding the shape and size of the internal nozzle (130)'s internal injection port (131) will be described in detail with reference to FIGS. 4 to 6.

[0058] FIG. 4 is a cross-sectional view of an evaporation source according to another embodiment of the present invention. FIG. 5 is a plan view taken from the V direction of FIG. 4. FIG. 6 is a plan view taken from the VI direction of FIG. 4.

[0059] Referring to FIG. 4, the internal nozzle (430, 630) may have various shapes of internal nozzles. For example, the first internal nozzle (430) may include internal nozzles with different diameters, although the cross-sectional shapes of the first part (431t) and the second part (431b) are the same.

[0060] Referring to FIG. 5, the internal nozzle of the first internal nozzle (430) may have a cross-sectional shape of both the first part (431t) and the second part (431b) that is circular. However, the diameter of the first part (431t) may be larger than the diameter of the second part (431b). In this case, as shown in FIG. 4, the size of the opening on the internal space side of the crucible (i.e., the size of the second part (431b)) is small, but the size of the opening on the external side of the crucible (i.e., the size of the first part (431t)) is large, and the deposition material can be ejected from the small opening to the large opening.

[0061] Referring again to FIG. 4, the second internal nozzle (630) may include an internal nozzle in which the cross-sectional shape and size of the first part (631t) and the second part (631b) are both different. Referring to FIG. 6, the size of the first part (631t) may be larger than the size of the second part (631b), and the shape of the first part (631t) may be circular, while the shape of the second part (631b) may be rhombus-shaped. In this case, the deposition material may be ejected from the small rhombus-shaped opening to the large circular opening.

[0062] As illustrated in FIG. 4, when the size or shape of the first part (431t, 631t) and the second part (431b, 631b) of the internal nozzle (430, 630) are different, the size or shape of the first part (431t, 631t) and the second part (431b, 631b) may change continuously or discontinuously. In this case, factors related to the emission of the deposition material (e.g., emission rate, emission amount, etc.) may change continuously or discontinuously.

[0063] Additionally, as illustrated in FIG. 4, different internal nozzles (430, 630) may be inserted into each of the plurality of nozzles (121) provided in the cover portion (120). In this case, the elements related to the discharge of the deposition material discharged through each nozzle (121) may be different from each other, and the discharge of the deposition material through each nozzle (121) may be individually controlled according to the type of internal nozzle (430, 630).

[0064] In some embodiments, although not illustrated in FIG. 4, at least one of the internal nozzles (430, 630) may be configured to close the corresponding nozzle (121). In this case, some of the nozzles (121) provided in the cover portion (120) may be closed, and the discharge area of ​​the deposited material may be partially reduced.

[0065] As described with reference to FIGS. 1 to 6, the evaporation source (100) of the present invention includes a replaceable internal nozzle (130, 430, 630), so that fine control of the area, thickness profile, etc. of the thin film to be deposited can be easily achieved. Specifically, by varying the size or shape of the internal nozzle (131) of the internal nozzle (130, 430, 630), the deposition material can be emitted in various forms without changing the nozzle (121) of the cover part (120). That is, by mounting an internal nozzle (130, 430, 630) comprising an internal nozzle (131) composed of a first part (131t, 431t, 631t) and a second part (131b, 431b, 631b) having diversified sizes or shapes on a desired nozzle (121), elements related to the emission of deposition material emitted through the evaporation source (100) can be precisely controlled, and some nozzles (121) can be closed. This allows for fine control of thin film deposition.

[0066] In particular, the shape or size of the nozzle (121) remains constant despite deformation, replacement, or closure of the internal nozzle (130, 430, 630). In this case, the discharge pattern of the deposition material through the nozzle (121) can remain constant regardless of the type of internal nozzle (130, 430, 630), and only the discharge amount or intensity of the deposition material may change. In the case of a conventional replaceable nozzle, since the shape or size of the nozzle (121) is directly changed, the discharge pattern of the deposition material is inevitably deformed along with the change in the discharge amount or intensity of the deposition material. In this case, since the discharge pattern according to the discharge amount or intensity of the deposition material must also be considered, it may be difficult to precisely control the uniformity of the thin film through the replaceable nozzle. In contrast, when the internal nozzle (130, 430, 630) is modified, replaced, or closed, the shape or size of the nozzle (121) is not changed, so only the amount or intensity of the discharge of the deposition material can be precisely controlled, making it relatively easy to precisely control the uniformity of the thin film.

[0067] In addition, if a specific internal nozzle (130, 430, 630) is defective or damaged, or if some of the multiple nozzles (121) provided in the cover portion (120) are defective or damaged, it may be possible to address the defective or damaged nozzles (121) by replacing only the defective or damaged internal nozzle (130, 430, 630) or by installing the internal nozzle (130, 430, 630) to close the defective or damaged nozzle (121), thereby minimizing the problem of having to replace the entire evaporation source (100), and thus increasing the efficiency of the thin film deposition process.

[0068] Meanwhile, in the evaporation source (100) of the present invention, the nozzle (121) of the cover portion (120) is formed integrally with the cover portion (120), so problems such as the contact area between the nozzle (121) and the cover portion (120) widening may not occur. Specifically, in the case of a conventional evaporation source in which the nozzle (i.e., nozzle) is configured to be replaceable, various problems may arise as the connection part between the nozzle and the cover portion (120) widens. For example, thermal deformation may occur in the cover portion (120) due to prolonged use of the evaporation source (100), and since the degree of thermal deformation of the nozzle and the degree of thermal deformation of the cover portion (120) differ from each other, a problem may arise where the connection part between the cover portion (120) and the nozzle widens. In this case, problems such as leakage of the deposition material through the widened connection part may occur. However, since the evaporation source (100) of the present invention has a cover part (120) and a nozzle (121) formed as a single unit, the above-mentioned problem may not occur.

[0069] In particular, the evaporation source (100) of the present invention includes an internal nozzle (130, 430, 630) inserted into the inner side of the cover portion (120), so there is an advantage in that the clogging phenomenon caused by the upper temperature drop of the nozzle (121) can be minimized. Specifically, when the nozzle is configured to be replaceable as in a conventional evaporation source, the nozzle is separated from the cover portion (120), and heat leakage may occur at the connection point between the nozzle and the cover portion (120). That is, as the thermal contact between the nozzle and the cover portion (120) is reduced due to thermal deformation of the nozzle and the cover portion (120), the heat of the cover portion (120) may not be sufficiently transferred to the nozzle. In this case, the temperature at the upper part of the nozzle may be locally lowered, and a problem may occur where the nozzle becomes clogged as the deposition material condenses and accumulates at the upper part of the nozzle. Due to such clogging issues, the nozzle must be continuously replaced, which may reduce the efficiency of the thin film deposition process. In contrast, in the present invention, since the nozzle (121) is formed integrally with the cover (120), the temperature of the cover (120) is fully transferred to the nozzle (121), and the possibility of heat leakage can be minimized. Accordingly, the upper and lower temperature gradient of the nozzle (121) can be minimized. In addition, since the inner nozzle (130, 430, 630) is inserted into the inner nozzle receiving space (123) inside the cover (120), the inner nozzle (130, 430, 630) is surrounded by the cover (120), and due to the thermal insulation effect of the cover (120), the upper and lower temperature gradient of the inner nozzle (130, 430, 630) can be minimized. Accordingly, the clogging of the internal nozzles (130, 430, 630) can be significantly reduced.In addition, as previously mentioned, by diversifying the shape of the internal nozzle (131) of the internal nozzle (130, 430, 630) and configuring the internal nozzle (130, 430, 630) as a replaceable type, the deposition material emitted through the nozzle (121) can be precisely controlled. Therefore, even though the nozzle (121) and the cover (120) are formed as a single unit, the same advantages as a conventional evaporation source with a replaceable nozzle (121) can be provided. In particular, in this case, since the discharge of the deposition material is controlled by changing the shape or size of the internal nozzle (130, 430, 630) while maintaining the same shape or size of the nozzle (121), the discharge shape of the deposition material emitted through the nozzle (121) is maintained constant, and only the amount or intensity of the deposition material through the internal nozzle (130, 430, 630) can be controlled. Accordingly, the control of the thin film thickness profile can be made easier.

[0070] The foregoing description of the present invention is for illustrative purposes only, and those skilled in the art will understand that other specific forms can be easily modified without altering the technical spirit or essential features of the present invention. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive. For example, each component described as a single unit may be implemented in a distributed manner, and components described as distributed may likewise be implemented in a combined form.

[0071] The scope of the present invention is defined by the claims set forth below rather than by the detailed description above, and all modifications or variations derived from the meaning and scope of the claims and equivalent concepts thereof should be interpreted as being included within the scope of the present invention.

[0072] The present invention can be applied to various industrial fields requiring a deposition process. For example, the present invention can be used as a device for stably vaporizing a deposition material in a vacuum deposition apparatus to form a desired thin film on a substrate, and the aforementioned device can be applied to various fields such as semiconductors, liquid crystal displays (LCDs), organic light-emitting diodes (OLEDs), solar cells, and functional coatings.

Claims

1. A crucible configured to accommodate a deposition material; A cover portion configured to cover the upper part of the above-mentioned crucible and including a plurality of nozzles; and It includes a replaceable inner nozzle having an inner nozzle inserted into the inner side of the above-mentioned cover portion and configured to be connected to at least one of the nozzles, and An evaporation source, wherein the internal nozzle of the internal nozzle is configured to communicate between the at least one nozzle and the internal space of the crucible.

2. In Paragraph 1, The above cover portion has an internal nozzle receiving space for receiving the internal nozzle, and The above-mentioned inner nozzle is an evaporation source connected to the cover portion in the above-mentioned inner nozzle receiving space.

3. In Paragraph 1, The internal nozzle of the internal nozzle comprises a first portion in contact with the nozzle of the cover portion and a second portion communicating with the first portion and positioned toward the internal space of the crucible. An evaporation source in which the cross-sectional size of the first part and the cross-sectional size of the second part are the same.

4. In Paragraph 1, The internal nozzle of the internal nozzle comprises a first portion in contact with the nozzle of the cover portion and a second portion communicating with the first portion and positioned toward the internal space of the crucible. An evaporation source in which the cross-sectional size of the first part and the cross-sectional size of the second part are different from each other.

5. In Paragraph 4, An evaporation source in which the cross-sectional shape of the first part of the internal nozzle and the cross-sectional shape of the second part are identical to each other.

6. In Paragraph 4, An evaporation source in which the cross-sectional shape of the first part of the internal nozzle and the cross-sectional shape of the second part are different from each other.

7. In Paragraph 4, An evaporation source in which the length from the second part of the inner nozzle to the first part is 70% or less of the length from the second part of the inner nozzle to the upper part of the nozzle of the cover part.

8. In Paragraph 1, The above crucible is linear and extends in one direction, and The plurality of nozzles of the above-mentioned cover portion are evaporation sources arranged along the above-mentioned one direction.

9. In Paragraph 7, The above internal nozzle is an evaporation source composed of a plurality of internal nozzles corresponding to each of the plurality of nozzles.

10. In Paragraph 8, An evaporation source, wherein at least one of the plurality of internal nozzles is configured to close a corresponding nozzle.

11. In Paragraph 8, An evaporation source in which the internal nozzle of at least one of the plurality of internal nozzles has a different size or different shape from the internal nozzle of another internal nozzle.

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