Electronic device including elastic material for integrated circuit chip

Abstract

An electronic device may comprise: a first printed circuit board (PCB) including a first surface and a second surface opposite to the first surface; a second PCB; a connector disposed on the first surface of the first PCB and configured to electrically connect the first PCB to the second PCB; a shield can disposed on the second surface of the first PCB and having a top opening; an integrated circuit (IC) chip disposed on the second surface of the first PCB and positioned in the shield can; a shielding layer attached to the shield can to cover the top opening of the shield can; a bracket in contact with the shielding layer; and an elastic material disposed between the IC chip and the shielding layer and configured to support the IC chip pressed by a force transmitted through the connector.

Description

Electronic device including an elastic material for an integrated circuit chip

[0001] The present disclosure relates to an electronic device comprising an elastic material for an IC chip.

[0002] An electronic device, such as a smartphone, may include a housing. The housing may form the exterior of the electronic device and provide a space for various components of the electronic device to be placed. For example, a printed circuit board (PCB) on which various components of the electronic device are mounted may be placed inside the housing. For example, an integrated circuit chip (IC chip) may be mounted on the PCB.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art in relation to the present disclosure.

[0004] An electronic device is provided. The electronic device may include: a first printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface; a second PCB; a connector disposed on the first surface of the first PCB and configured to electrically connect the first PCB to the second PCB; a shield can disposed on the second surface of the first PCB and having a top opening; an integrated circuit chip disposed on the second surface of the first PCB and located within the shield can; a shielding layer attached to the shield can to cover the top opening of the shield can; a bracket in contact with the shielding layer; and an elastic material disposed between the IC chip and the shielding layer and configured to support the IC chip, which is pressed by a force transmitted through the connector.

[0005] An electronic device is provided. The electronic device may include: a printed circuit board (PCB) comprising a first surface and a second surface opposite to the first surface; a connector disposed on the first surface of the PCB; an integrated circuit chip (IC) disposed on a portion of the second surface of the PCB to overlap with the connector; a structure inside the electronic device; and an elastic material disposed between the IC chip and the structure to support the IC chip.

[0006] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0007] FIG. 2a is a drawing showing an exemplary electronic device according to one embodiment.

[0008] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment.

[0009] FIG. 3a shows a first surface of a PCB according to one embodiment.

[0010] FIG. 3b shows a second surface of a PCB according to one embodiment.

[0011] FIG. 3c shows a shielding layer according to one embodiment.

[0012] FIG. 3d shows a PCB having a shield can with a shielding layer attached thereto, according to one embodiment.

[0013] FIG. 4 shows a cross-section of an electronic device according to one embodiment.

[0014] FIG. 5 is a drawing showing a PCB with a connector arranged thereon according to one embodiment.

[0015] Figure 6a shows the strain of an IC chip without an elastic material according to a comparative example.

[0016] FIG. 6b shows the strain of an IC chip having an elastic material according to one embodiment.

[0017] Figure 7 shows a PCB with a connector placed on it.

[0018] Figure 8 shows the strain of an IC chip to which a first elastic material is applied.

[0019] Figure 9 shows the strain of an IC chip to which a second elastic material is applied.

[0020] Figure 10 shows the strain of an IC chip to which a third elastic material is applied.

[0021] FIG. 11a illustrates an example of an unfolded state of an electronic device according to one embodiment.

[0022] FIG. 11b illustrates an example of a folding state of an electronic device according to one embodiment.

[0023] FIG. 11c is an exploded view of an electronic device according to one embodiment.

[0024] Identical or similar components in the drawings may be assigned the same reference numerals. Descriptions of components having the same reference numeral may be applied identically or in a corresponding manner when referring to different drawings, unless otherwise noted, and redundant descriptions of components having the same reference numeral may not be repeated. In the following descriptions referring to specific drawings, reference numerals from other drawings may be referenced.

[0025] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0026] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0027] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0028] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0029] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0030] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0031] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0032] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0033] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0034] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0035] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0036] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0037] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0038] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0039] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0040] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0041] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0042] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, Wi-Fi (wireless fidelity) direct or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0043] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0044] The antenna module (197) can transmit a signal or power to an external source (e.g., an external electronic device) or receive it from an external source. According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). The signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0045] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0046] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0047] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0048] FIG. 2a is a drawing illustrating an exemplary electronic device according to one embodiment. Referring to FIG. 2a, an electronic device (200) according to one embodiment may include a housing (or housing assembly) (210) that forms at least partially the exterior of the electronic device (200). For example, the housing (210) may include a first surface (or front) (200A), a second surface (or rear) (200B), and a third surface (or side) (200C) that surrounds the space between the first surface (200A) and the second surface (200B). In one embodiment, the housing (210) may refer to a structure that forms at least some of the first surface (200A), the second surface (200B), and / or the third surface (200C).

[0049] An electronic device (200) according to one embodiment may include a substantially transparent front plate (202). In one embodiment, the front plate (202) may form at least a portion of the first surface (200A). In one embodiment, the front plate (202) may include, for example, a glass plate or a polymer plate including various coating layers, but is not limited thereto.

[0050] An electronic device (200) according to one embodiment may include a substantially opaque back plate (211). In one embodiment, the back plate (211) may form at least a portion of a second surface (200B). In one embodiment, the back plate (211) may be formed by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the materials.

[0051] An electronic device (200) according to one embodiment may include a side bezel structure (e.g., a side member) (218). In one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a third surface (200C) of the electronic device (200). For example, the side bezel structure (218) may form the entire third surface (200C) of the electronic device (200), or, for another example, the side bezel structure (218) may form the third surface (200C) of the electronic device (200) together with the front plate (202) and / or the rear plate (211).

[0052] In one embodiment, the side bezel structure (218) may comprise a metal and / or a polymer. In one embodiment, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum), but are not limited thereto. For example, the rear plate (211) and the side bezel structure (218) may be formed as separate components and / or may comprise different materials.

[0053] In one embodiment, the electronic device (200) may include a display (201) (e.g., display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., audio module (170) of FIG. 1), a sensor module (e.g., sensor module (176) of FIG. 1), a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1), a key input device (217) (e.g., input module (150) of FIG. 1), a light-emitting element (not shown), and a connector hole (208). In one embodiment, the electronic device (200) may omit at least one of the components (e.g., key input device (217) or light-emitting element (not shown)) or additionally include other components.

[0054] In one embodiment, the display (201) may be visually exposed through a significant portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the first surface (200A). The display (201) may be positioned on the back surface of the front plate (202).

[0055] In one embodiment, the display (201) (or the first surface (200A) of the electronic device (200)) may include a screen display area (201A). In one embodiment, the display (201) may provide visual information to the user through the screen display area (201A). In the illustrated embodiment, when the first surface (200A) is viewed from the front, the screen display area (201A) is shown to be located on the inner side of the first surface (200A) and spaced apart from the outer edge of the first surface (200A), but is not limited thereto. For example, when the first surface (200A) is viewed from the front, at least a portion of the edge of the screen display area (201A) may substantially coincide with the edge of the first surface (200A) (or the front plate (202)).

[0056] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire the user's biometric information. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" can be understood as at least a portion of the sensing area (201B) being overlapped with the screen display area (201A). For example, the sensing area (201B) may refer to an area that can display visual information by the display (201) just like other areas of the screen display area (201A), and additionally acquire the user's biometric information (e.g., fingerprint). Although the sensing area (201B) is depicted as being formed within the screen display area (201A), it is not limited thereto. For example, the sensing area (201B) may be formed in the key input device (217).

[0057] In one embodiment, the display (201) may include an area where a first camera module (205) is located. For example, an opening may be formed in the area of ​​the display (201), and the first camera module (205) (e.g., a punch-hole camera) may be placed at least partially within the opening so as to face the first surface (200A). In this case, the screen display area (201A) may surround at least a portion of the edge of the opening. In one embodiment, the first camera module (205) (e.g., an under-display camera (UDC)) may be placed below the display (201) so as to overlap with the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera module (205) may acquire an image corresponding to the direction toward the first surface (200A) through the area of ​​the display (201).

[0058] In one embodiment, the display (201) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer that detects a magnetic field type stylus pen.

[0059] In one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0060] In one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a part area of ​​the third surface (200C) and a second microphone hole (204) formed in a part area of ​​the second surface (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include a plurality of microphones to detect the direction of the sound, but is not limited thereto.

[0061] In one embodiment, a second microphone hole (204) formed in a portion of the second surface (200B) may be positioned adjacent to the camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, it is not limited thereto.

[0062] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed in a part of the third surface (200C) of the electronic device (200). In one embodiment, the external speaker hole (207) is integrated into the microphone hole (203), and the speaker hole (207) and the microphone hole (203) may be implemented as a single hole. Although not shown, the call receiver hole (not shown) may be formed in another part of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the illustration in FIG. 2a, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (200), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (200). However, this is not limited thereto, and in other embodiments, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by the spaced-apart space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0063] In one embodiment, the electronic device (200) may include at least one speaker (not shown) (e.g., the acoustic output module (155) of FIG. 1) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a receiver hole for calls (not shown).

[0064] In one embodiment, a sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] In one embodiment, the camera module (205, 212, 213) may include a first camera module (205) positioned to face a first surface (200A) of the electronic device (200), a second camera module (212) positioned to face a second surface (200B), and a flash (213).

[0066] In one embodiment, the second camera module (212) may include a plurality of cameras (e.g., a dual camera, a triple camera, or a quad camera). However, the second camera module (212) is not necessarily limited to including a plurality of cameras and may include a single camera.

[0067] In one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, an image sensor, and / or an image signal processor.

[0068] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the electronic device (200).

[0069] In one embodiment, the key input device (217) may be placed on a third side (200C) of the electronic device (200). In one embodiment, the electronic device (200) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).

[0070] In one embodiment, a connector hole (208) may be formed on a third surface (200C) of the electronic device (200) so as to accommodate a connector of an external device. A connection terminal (e.g., connection terminal (178) of FIG. 1) that is electrically connected to the connector of the external device may be disposed within the connector hole (208). The electronic device (200) according to one embodiment may include an interface module (e.g., interface (177) of FIG. 1) for processing electrical signals transmitted and received through the connection terminal.

[0071] In one embodiment, the electronic device (200) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be placed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide state information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0072] FIG. 2b is an exploded perspective view of an exemplary electronic device according to one embodiment. Referring to FIG. 2b, an electronic device (200) according to one embodiment may include a frame structure (240) (e.g., side bezel structure (218) of FIG. 2a), a first printed circuit board (PCB) (250), a second PCB (252), a flexible PCB (FPCB) (254), a cover plate (256), and a battery (270) (e.g., battery (189) of FIG. 1).

[0073] In one embodiment, the frame structure (240) may be positioned between the display (201) and the rear plate (211). In one embodiment, the frame structure (240) may support or accommodate components included in the electronic device (200). For example, the display (201) may be placed on one side of the frame structure (240) facing in one direction (e.g., +Z direction). For example, the frame structure (240) may support the front plate (202) to which the display (201) is attached. On the other side of the frame structure (240) facing in the opposite direction (e.g., -Z direction) to the one direction, the first PCB (250), the second PCB (252), the battery (270), and the second camera module (212) may be placed. The first PCB (250), the second PCB (252), the battery (270), and the second camera module (212) can be placed within a recess formed in the frame structure (240).

[0074] In one embodiment, the frame structure (240) may include a first part (241) and a second part (243). The periphery of the second part (243) may be surrounded by the first part (241). The first part (241) may surround the space between the rear plate (211) and the front plate (202) (and / or the display (201)). The first part (241) surrounding the space may at least partially form a side of the electronic device (200) (e.g., the third side (200C) in FIG. 2a), and the second part (243) located within the space may extend inward from the first part (241). The second part (243) may be located below the display (201) (e.g., in the -Z direction). In one embodiment, the first part (241) and / or the second part (243) may be formed of a metal and / or a polymer.

[0075] In one embodiment, a first part (241) of a frame structure (240) forming the side of the electronic device (200) may be referred to as a side member or a lateral structure, and a second part (243) of a frame structure (240) supporting various parts of the electronic device (200) may be referred to as a support member, a support structure, or a bracket.

[0076] In one embodiment, the first PCB (250), the second PCB (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first PCB (250) and the second PCB (252) may be fixedly positioned to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly positioned to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, it is not limited to the examples described above.

[0077] In one embodiment, the display (201) may be positioned between the frame structure (240) and the front plate (202). For example, the front plate (202) may be positioned on one side (e.g., +Z direction) of the display (201), and the frame structure (240) may be positioned on the other side (e.g., -Z direction).

[0078] In one embodiment, the front plate (202) may be combined with the display (201). For example, the display (201) may be attached to the back surface of the front plate (202) via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)).

[0079] In one embodiment, the front plate (202) may be combined with a frame structure (240). For example, the front plate (202) may include an outer portion extending outward from the display (201) when viewed in the z-axis direction. The outer portion of the front plate (202) may be attached to the frame structure (240) (e.g., the first part (241)).

[0080] In one embodiment, a processor (e.g., processor (120) of FIG. 1), memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first PCB (250) and / or the second PCB (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0081] In one embodiment, the FPCB (254) can connect the first PCB (250) and the second PCB (252). For example, the first end of the FPCB (254) can be coupled to the first PCB (250), and the second end of the FPCB (254) can be coupled to the second PCB (252). The first end of the FPCB (254) may include a mating connector (e.g., connector (454) of FIG. 4) that is coupled to a connector (e.g., connector (316) of FIG. 4) disposed on the first PCB (250).

[0082] In one embodiment, the cover plate (256) may be formed of metal and / or plastic. The cover plate (256) may cover various components placed on the first PCB (250). For example, the cover plate (256) may be placed on the first PCB (250) to cover the mating connector of the FPCB (254) coupled to the first PCB (250). Accordingly, the detachment of the FPCB (254) from the first PCB (250) may be prevented or reduced.

[0083] In one embodiment, the battery (270) can supply power to at least one component of the electronic device (200). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell.

[0084] In one embodiment, the first camera module (205) (e.g., front camera) may be placed in at least a part (e.g., second part (243)) of the frame structure (240) so that the lens can receive external light through a part area (e.g., camera area (237)) of the front plate (202) (e.g., front (200A) of FIG. 2a).

[0085] In one embodiment, a second camera module (212) (e.g., rear camera) may be positioned between the frame structure (240) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first PCB (250) through a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be positioned so that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (200).

[0086] In one embodiment, the camera area (284) may be formed on the surface of the rear plate (211) (e.g., the rear (200B) of FIG. 2A). In one embodiment, the camera area (284) may be formed at least partially transparent so that external light can be incident on the lens of the second camera module (212). In one embodiment, at least a portion of the camera area (284) may protrude a certain height from the surface of the rear plate (211). However, it is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially identical to the surface of the rear plate (211).

[0087] In one embodiment, the housing (210) of the electronic device (200) may mean a configuration or structure that forms at least a part of the exterior of the electronic device (200). In other words, the housing (210) may include at least a part of a front plate (202), a frame structure (240), and / or a rear plate (211) that form the exterior of the electronic device (200).

[0088] FIG. 3a shows a first surface of a PCB according to one embodiment. FIG. 3b shows a second surface of a PCB according to one embodiment. FIG. 3c shows a shielding layer according to one embodiment. FIG. 3d shows a PCB having a shield can attached with a shielding layer according to one embodiment.

[0089] Referring to FIGS. 3a and 3b, according to one embodiment, an electronic device (e.g., the electronic device (200) of FIG. 2b, hereinafter the electronic device (200)) may include a PCB (310) (e.g., the first PCB (250) of FIG. 2b). The PCB (310) may include a first surface (310A) and a second surface (310B) opposite to the first surface (310A).

[0090] Referring to FIG. 3a, according to one embodiment, an electronic device (200) may include a connector (316) disposed (or mounted) on a first surface (310A) of a PCB (310). The connector (316) may be configured to electrically connect the PCB (310) to another PCB. For example, the PCB (310) may be electrically connected to another PCB (e.g., the second PCB (252) in FIG. 2b) through the connector (316). For example, a connector of an FPCB (e.g., the FPCB (254) in FIG. 2b) may be coupled to the connector (316), and the PCB (310) may be electrically connected to the other PCB through the FPCB coupled to the connector (316).

[0091] Referring to FIG. 3b, according to one embodiment, an electronic device (200) may include a shield can (360) and an IC chip (integrated circuit chip) (320). The electronic device (200) may further include another shield can (366) and another IC chip (326).

[0092] The shield can (360) may be placed (or mounted) on the second side (310B) of the PCB (310). The shield can (360) may be formed of an electrically conductive material to provide electromagnetic shielding. The shield can (360) may include an upper opening (365).

[0093] The IC chip (320) may be placed (or mounted) on the second side (310B) of the PCB (310) so as to be located inside the shield can (360). The IC chip (320) may be aligned with the top opening (365) of the shield can (360). For example, but not limited to, the IC chip (320) may include a radio frequency transceiver (e.g., the wireless communication module (194) of FIG. 1).

[0094] Another shield can (366) may be placed (or mounted) on the second side (310B) of the PCB (310). The other shield can (366) may be adjacent to the shield can (360). The other shield can (366) may be formed of an electrically conductive material to provide electromagnetic shielding. The other shield can (366) may include a top opening (369).

[0095] Another IC chip (326) may be placed (or mounted) on the second side (310B) of the PCB (310) so as to be located inside another shield can (366). The other IC chip (326) may be aligned with the top opening (369) of the other shield can (366). For example, but not limited to, the other IC chip (326) may include an application processor of the electronic device (200) (e.g., the processor (120) of FIG. 1).

[0096] Referring to FIG. 3c, an electronic device (200) according to one embodiment may include a shielding layer (340), an elastic material (330) disposed on the shielding layer (340), and a thermal interface material (TIM) (336) disposed on the shielding layer (340).

[0097] Referring to FIGS. 3c and 3d, the shielding layer (340) may include a first surface (340A) and a second surface (340B) opposite to the first surface (340A). An elastic material (330) and a TIM (336) may each be disposed on the first surface (340A) of the shielding layer (340). For example, the elastic material (330) and the TIM (336) may each be attached to the first surface (340A) of the shielding layer (340).

[0098] Referring to FIG. 3d, a shielding layer (340) may be placed on the upper surface of a shield can (360) and on the upper surface of another shield can (366). The upper opening (365) of the shield can (360) and the upper opening (369) of the other shield can (366) may be closed by the shielding layer (340). For example, the shielding layer (340) may be attached to the shield can (360) and the other shield can (366) to cover the upper opening (365) of the shield can (360) and the upper opening (369) of the other shield can (366) (e.g., through an adhesive layer included in the shielding layer (340) or a separate adhesive material). Unlike in a city, the shielding layer (340) may be attached only to the shield can (360) so as to cover only the top opening (365) of the shield can (360). The shielding layer (340) may be referred to as a shielding sheet or shielding tape.

[0099] The shielding layer (340) can provide electromagnetic shielding together with the shield can (360). To provide electromagnetic shielding, at least a portion of the shielding layer (340) may be formed of a material with relatively high electrical conductivity and / or may include a layer formed therefrom. Accordingly, noise that may enter from outside the shield can (360) into the IC chip (320) located inside the shield can (360) and / or noise that may enter from the IC chip (320) into the electronic component located outside the shield can (360) can be reduced. Additionally, the shielding layer (340) can provide electromagnetic shielding together with another shield can (366). Accordingly, noise that may be introduced from outside another shield can (366) to another IC chip (326) located inside another shield can (366) and / or noise that may be introduced from another IC chip (326) to an electronic component located outside another shield can (366) can be reduced.

[0100] Referring to FIGS. 3c and 3d, the first surface (340A) of the shielding layer (340) can be attached to a shield can (360) and another shield can (366). Accordingly, the elastic material (330) and the TIM (336) disposed on the first surface (340A) of the shielding layer (340) can be located within the top opening (365) of the shield can (360) and the top opening (369) of the other shield can (366), respectively.

[0101] An elastic material (330) located within the top opening (365) of a shield can (360) may face an IC chip (320) located within the shield can (360). A TIM (336) located within the top opening (369) of another shield can (366) may face another IC chip (326). For example, the TIM (336) may come into contact with another IC chip (326).

[0102] The TIM (336) can be formed from a material having a relatively high thermal conductivity, for example. For example, not limited to, the TIM (336) can be formed from a conformal type thermally conductive material. For example, not limited to, the TIM (336) can be formed from a gel type thermally conductive material. For example, not limited to, the TIM (336) can be a rigid body in which the shape is substantially maintained. For example, not limited to, the TIM (336) can be a fluid having fluidity. The TIM (336) can transfer heat generated from another IC chip (326) to the shielding layer (340).

[0103] The shielding layer (340) can release (and / or disperse) heat transferred from the TIM (336) to the outside of the shielding layer (340), to another shield can (366), and to the shield can (360). For the release (and / or dispersion) of heat, at least a portion of the shielding layer (340) may be formed of a material with relatively high thermal conductivity (e.g., nano-TIM) or may include a layer formed therefrom. The performance degradation of another IC chip (326) and / or other electronic components caused by heat generation of another IC chip (326) may be reduced. In terms of the shielding layer (340) functioning for electromagnetic shielding and heat dissipation, the shielding layer (340) may be referred to as a heat dissipation layer, a heat dissipation sheet, a heat dissipation tape, a shielding heat dissipation layer, a shielding heat dissipation sheet, or a shielding heat dissipation tape.

[0104] FIG. 4 shows a cross-section of an electronic device according to one embodiment. The cross-section of FIG. 4 may correspond to line 4-4' of FIG. 3d.

[0105] Referring to FIG. 4, according to one embodiment, an electronic device (200) may include a bracket (350), a display (370), a connector (454), a cover plate (480), and a rear plate (490).

[0106] For example, the bracket (350) may be an example of the frame structure (240) of FIG. 2B. For example, the bracket (350) may include a second part (243) of the frame structure (240) of FIG. 2B. For example, the bracket (350) may further include a first part (241) of the frame structure (240) of FIG. 2B. For example, the display (370) may include the display (201) of FIG. 2B. For example, the display (370) may further include a front plate (202) attached to the display (201) of FIG. 2B. For example, the connector (454) may be included in the FPCB (254) of FIG. 2B. For example, the connector (454), coupled to the connector (316) of the PCB (310), may be included in the first end portion of the FPCB (254), coupled to the first PCB (250) of FIG. 2B. For example, the cover plate (480) may be an example of the cover plate (256) of FIG. 2B. For example, the rear plate (490) may be an example of the rear plate (211) of FIG. 2B.

[0107] A connector (454) may be physically and electrically coupled to the connector (316). For example, but not limited to, the connector (316) may be a receptacle connector, and the connector (454) may be a plug connector mated to the receptacle connector. Through the connector (316) and the connector (454), the PCB (310) may be electrically connected to another PCB (e.g., the second PCB (252) in FIG. 2b).

[0108] In one embodiment, a cover plate (480) may be placed on the connector (454). For example, a portion of the cover plate (480) may be placed on the connector (454), and another portion (not shown) of the cover plate (480) may be attached to the PCB (310) (and / or bracket (350)). Accordingly, the portion of the cover plate (480) may be seated on the connector (454). Additionally, the electrical and physical connection of the connectors (316 and 454) can be stably maintained by pressing the connector (454) against the cover plate (480).

[0109] The cover plate (480) may be positioned between the connector (454) and the rear plate (490). For example, a first surface of the cover plate (480) (e.g., a surface facing the -Z direction) may face the rear plate (490), and a second surface of the cover plate (480) (e.g., a surface facing the +Z direction) may be in contact with the connector (454).

[0110] An electronic device (200) according to one embodiment may further include an antenna module (492) disposed (or interposed) between a cover plate (480) and a rear plate (490). The antenna module (492) may include at least one of an antenna for near field communication (NFC), an antenna for magnetic secure transmission (MST), and / or an antenna for wireless charging (e.g., a wireless charging coil). For example, but not limited to, the antenna module (492) may include an FPCB, and the FPCB of the antenna module (492) may include a conductive pattern forming at least one of an NFC antenna, an MST antenna, and / or a wireless charging antenna.

[0111] The antenna module (492) may be attached to, for example, a cover plate (480) (e.g., the first surface of the cover plate (480)), without limitation. The antenna module (492) may, for example, overlap at least partially with the connector (454).

[0112] The connector (316) can be placed on a part of the first surface (310A) of the PCB (310).

[0113] The IC chip (320) may be placed on a portion of the second surface (310B) of the PCB (310) corresponding to the portion of the first surface (310A) of the PCB (310) on which the connector (316) is placed. For example, the connector (316) and the IC chip (320), placed on the first surface (310A) and the second surface (310B) of the PCB (310), respectively, may overlap at least partially with each other. For example, at least a portion of the connector (316) may overlap at least partially with the IC chip (320) with respect to a direction substantially perpendicular to the PCB (310) (e.g., +Z direction). For example, at least a portion of the footprint of the connector (316) placed on the first side (310A) of the PCB (310) may overlap with the footprint of the IC chip (320) placed on the second side (310B) of the PCB (310). Alternatively, the IC chip (320) and the connector (316) may not overlap with each other with respect to a direction substantially perpendicular to the PCB (310). In this case, the connector (316) and other components may be at least partially placed on the portion of the first side (310A) of the PCB (310) opposite the IC chip (320). For example, the components overlapping with the IC chip (320) may include a shield can. For example, the shield can may include a side wall extending from (and / or attached to) the first surface (310A) of the PCB (310), and the side wall may overlap the IC chip (320).

[0114] The elastic material (330) may be positioned between the IC chip (320) and the shielding layer (340). The elastic material (330) may be positioned within the top opening (365) of the shield can (360). The elastic material (330) may face the IC chip (320) located within the shield can (360). The elastic material (330) may come into contact with the IC chip (320). The elastic material (330) may include, for example, rubber.

[0115] The shielding layer (340) may include a first portion attached to the shield can (360) and a second portion extending from the first portion to cover the top opening (365) of the shield can (360). For example, the first portion of the shielding layer (340) may be positioned between the shield can (360) and the bracket (350), and the second portion of the shielding layer (340) may be positioned between the elastic material (330) and the bracket (350). The shielding layer (340) may be in contact with the bracket (350). For example, the second surface (340B) of the shielding layer (340) may be in contact with the bracket (350). The shielding layer (340) and the elastic material (330) may fill the gap between the bracket (350) and the IC chip (320).

[0116] A bracket (350) may be positioned between a shielding layer (340) and a display (370). For example, a first surface of the bracket (350) (e.g., a surface of the bracket (350) facing the -Z direction) may be in contact with the shielding layer (340), and a second surface of the bracket (350) (e.g., a surface of the bracket (350) facing the +Z direction) may be facing the display (370).

[0117] The bracket (350) can support a shield can (360) to which a shielding layer (340) is attached and a PCB (310) on which the shield can (360) is mounted. Various components such as an IC chip (320) and a shield can (360) and the PCB (310) on which they are mounted may be referred to as a printed circuit board assembly (PBA). The PBA may be supported by being placed on the first surface of the bracket (350).

[0118] According to one embodiment, the electronic device (200) may further include a member (372) disposed between the bracket (350) and the display (370). The member (372) may include, for example, a waterproof material (e.g., waterproof tape) attached to the second surface of the bracket (350) and the back surface of the display (370), without limitation. The member (372) may include, for example, a conductive gasket electrically connecting the display (370) to the bracket (350), without limitation.

[0119] Meanwhile, as portable communication devices such as electronic devices (200) become smaller and lighter, the thickness of the electronic device (200) is also becoming thinner, and the internal components of the electronic device (200) are also becoming smaller and / or denser. Therefore, the electronic device (200) may include a structure in which internal components are densely stacked, such as a rear plate (490), an antenna module (492), a cover plate (480), a connector (454), a connector (316), a PCB (310), and an IC chip (320). However, such a stacked structure may be vulnerable to external shock. For example, external shock can be easily transmitted as the rear plate (490), the antenna module (492), the cover plate (480), the connector (454), the connector (316), the PCB (310), and the IC chip (320) are physically connected to each other (e.g., contact). For example, an external shock applied to any one of the rear plate (490), antenna module (492), cover plate (480), connector (454), connector (316), and PCB (310) can be transmitted to the IC chip (320). As a result, bending or cracking may occur in the IC chip (320). The external shock causing such damage to the IC chip (320) may include not only shocks that may be applied during the use of the electronic device (200), but also shocks that may be applied during the manufacturing process of the electronic device (200), such as shocks that may be applied during the assembly of the connector (316) and connector (454), the assembly of the PCB (310) and cover plate (480), and the assembly of the rear plate (490) and bracket (350).

[0120] To reduce these problems, the IC chip (320) and the connector (316) can be positioned so as not to overlap. However, this may reduce the component density of the PCB (310) and, consequently, cause an increase in the volume and weight of the electronic device (200). Due to the increase in the capacity and size of the battery of the electronic device (200) (e.g., the battery (270) in FIG. 2b), a higher density mounting is required on the PCB (310), which may make it more difficult to position the IC chip (320) and the connector (316) to avoid overlap. Additionally, due to the increased performance of the electronic device (200), the IC chip (320) may have a relatively large surface area, which may make it more difficult to position the IC chip (320) and the connector (316) to avoid overlap, and the IC chip (320) having a large surface area may be more susceptible to cracking or bending. To improve the rigidity of the IC chip (320), resin may be filled between the solder balls connecting the IC chip (320) and the PCB (310). However, while the resin between the IC chip (320) and the PCB (310) may be advantageous for preventing cracks in the solder balls, it may be difficult to improve the bending or cracking of the IC chip (320) itself.

[0121] As another method, an empty space such as an air gap can be placed in the power transmission path leading to the chip (320) so that external shocks are not transmitted to the IC chip (320), but this also causes wasted space and may cause an increase in the volume of the electronic device (200).

[0122] As another method, the amount of external impact transmitted to the IC chip (320) can be reduced by supplementing the rigidity of the rear plate (490) and / or the cover plate (480). However, to supplement the rigidity of the rear plate (490) and / or the cover plate (480), a thicker thickness or heavier material may be required, which may increase the thickness and weight of the electronic device (200).

[0123] According to one embodiment, the elastic material (330) of the electronic device (200) can reduce the above-described problems. For example, the elastic material (330) can support an IC chip (320) that is pressed by a force transmitted through a connector (316). By supporting the IC chip (320), the elastic material (330) can disperse external shocks. Accordingly, bending of the PCB (310) and the IC chip (320) can be reduced.

[0124] According to one embodiment, the electronic device (200) may include a structure in which a rear plate (490), an antenna module (492), a cover plate (480), a connector (454), a connector (316), a PCB (310), an IC chip (320), and a bracket (350) are stacked vertically (e.g., in the Z direction). Through this stacked structure, the electronic device (200) may be made smaller and lighter. Furthermore, even though the electronic device (200) includes such a stacked structure that enables miniaturization, the aforementioned problem, namely damage to the IC chip (320) due to external impact, can be reduced.

[0125] According to one embodiment, the electronic device (200) may include an internal structure that supports an elastic material (330) located below an IC chip (320) (e.g., in the +Z direction). For example, the elastic material (330) may be placed between the IC chip (320) and the internal structure. The elastic material (330) may support the IC chip (320) which is pressed by a force transmitted through the connector (316) by being supported by the internal structure. For example, but not limited to, the internal structure may include a shield can that accommodates the IC chip (320) and the elastic material (330) (e.g., a shield can (360) that does not have an upper opening (365)). For example, but not limited to, the internal structure may include a bracket (350). For example, the internal structure may include a bracket (350) and a shielding layer (340) disposed between the bracket (350) and the elastic material (330).

[0126] FIG. 5 is a drawing showing a PCB with a connector placed thereon according to one embodiment. In FIG. 5, an area where an IC chip (320) is placed and an area where an elastic material (330) is placed are shown together with the PCB (310) and the connector (316).

[0127] Referring to FIG. 5, at least a portion of the connector (316) may overlap with the IC chip (320). In the area of ​​the IC chip (320) that overlaps the connector (316), the force transmitted through the connector (316) may be concentrated. To disperse this force (or to support the IC chip (320) being pressed by this force), an elastic material (330) may be placed on at least the area of ​​the IC chip (320) that overlaps the connector (316). For example, at least a portion of the elastic material (330) may overlap with the area where the connector (316) and the IC chip (320) overlap each other.

[0128] FIG. 6a shows the strain of an IC chip without an elastic material according to a comparative example. FIG. 6b shows the strain of an IC chip having an elastic material according to one embodiment.

[0129] FIGS. 6a and 6b can show the strain of an IC chip (320) when a spherical weight with a diameter of 15 mm and a weight of 500 g is dropped from a distance of 10 cm onto the rear plate (490) of FIG. 4.

[0130] In one embodiment, the strain of the IC chip (320) upon external impact can be reduced through the elastic material (330). For example, if the electronic device (200) does not include the elastic material (330), as shown in FIG. 6a, the strain of the first region (601a) of the IC chip (320) may be relatively large (e.g., largest), and the strain of the second region (602a) of the IC chip (320) may be relatively small (e.g., smallest). If the electronic device (200) includes the elastic material (330), as shown in FIG. 6b, the strain of the first region (601b) of the IC chip (320) may be relatively large (e.g., largest), and the strain of the second region (602b) of the IC chip (320) may be relatively small (e.g., smallest). The size of the first region (601b) in Fig. 6b may be smaller than the size of the first region (601a) in Fig. 6a, and the size of the second region (602b) in Fig. 6b may be larger than the size of the second region (602a) in Fig. 6a. That is, by including an elastic material (330) in the electronic device (200), the strain of the IC chip (320) can be reduced upon external impact. For example, when the electronic device (200) includes an elastic material (330), the maximum strain of the IC chip (320) may be approximately 3320 με, which is about 48% lower than the maximum strain of the IC chip (320), which is approximately 6420 με, when the electronic device (200) does not include an elastic material (330).

[0131] FIG. 7 shows a PCB with a connector placed thereon. In FIG. 7, various sizes of elastic materials (330-1, 330-2, and 330-3) are shown together with the connector (316) and IC chip (320) on the PCB (310).

[0132] FIG. 8 shows the strain of an IC chip to which a first elastic material is applied. FIG. 9 shows the strain of an IC chip to which a second elastic material is applied. FIG. 10 shows the strain of an IC chip to which a third elastic material is applied. FIG. 8, FIG. 9, and FIG. 10 can show the strain of an IC chip (320) when a spherical weight with a diameter of 15 mm and a weight of 500 g is dropped from a distance of 10 cm onto the rear plate (490) of FIG. 4.

[0133] Referring to FIG. 7, the size of the area where the first elastic material (330-1) is placed may be larger than the size of the area where the connector (316) is placed. The size of the area where the first elastic material (330-1) is placed may be smaller than the size of the area where the elastic material (330) of FIG. 5 is placed. The size of the area where the second elastic material (330-2) is placed may be smaller than the size of the area where the first elastic material (330-1) is placed and substantially the same as the size of the area where the connector (316) is placed. The size of the area where the third elastic material (330-3) is placed may be smaller than the size of the area where the second elastic material (330-2) is placed and the size of the area where the connector (316) is placed. For example, the size of the area where the third elastic material (330-3) is placed may be about 80% of the size of the area where the connector (316) is placed.

[0134] In one embodiment, as the area of ​​the elastic material (330) increases, the strain of the IC chip (320) upon external impact may be reduced. In one embodiment, the area of ​​the elastic material (330) may be equal to or greater than the area of ​​the connector (316) and less than or equal to the area of ​​the IC chip (320).

[0135] For example, as illustrated in FIG. 8, the strain of the first region (801) of the IC chip (320) to which the first elastic material (330-1) is applied may be relatively large (e.g., the largest), and the strain of the second region (802) of the IC chip (320) to which the first elastic material (330-1) is applied may be relatively small (e.g., the smallest).

[0136] For example, as illustrated in FIG. 9, the strain of the first region (901) of the IC chip (320) to which the second elastic material (330-2) is applied may be relatively large (e.g., the largest), and the strain of the second region (902) of the IC chip (320) to which the second elastic material (330-2) is applied may be relatively small (e.g., the smallest).

[0137] For example, as illustrated in FIG. 10, the strain of the first region (1001) of the IC chip (320) to which the third elastic material (330-3) is applied may be relatively large (e.g., the largest), and the strain of the second region (1002) of the IC chip (320) to which the third elastic material (330-3) is applied may be relatively small (e.g., the smallest).

[0138] Referring to FIGS. 8 and 9, the size of the first region (801) of the IC chip (320) to which the first elastic material (330-1) having a relatively larger area is applied may be smaller than the size of the first region (901) of the IC chip (320) to which the second elastic material (330-2) having a relatively smaller area is applied. Additionally, the size of the second region (802) of the IC chip (320) to which the first elastic material (330-1) having a relatively larger area is applied may be larger than the size of the second region (902) of the IC chip (320) to which the second elastic material (330-2) having a relatively smaller area is applied. Referring to FIGS. 9 and 10, the size of the first region (901) of the IC chip (320) to which the second elastic material (330-2) having a relatively larger area is applied may be smaller than the size of the first region (1001) of the IC chip (320) to which the third elastic material (330-3) having a relatively smaller area is applied. Additionally, the size of the second region (902) of the IC chip (320) to which the second elastic material (330-2) having a relatively larger area is applied may be larger than the size of the second region (1002) of the IC chip (320) to which the third elastic material (330-3) having a relatively smaller area is applied. That is, as the area of ​​the elastic material (330) is increased, the strain of the IC chip (320) upon external impact may be reduced. For example, when the electronic device (200) includes a first elastic material (330-1), the maximum strain of the IC chip (320) may be about 3380 με, which is smaller than the maximum strain of the IC chip (320) of about 3460 με when the electronic device (200) includes a second elastic material (330-2).For example, when the electronic device (200) includes a second elastic material (330-2), the maximum strain of the IC chip (320) may be about 3460 με, which is smaller than the maximum strain of the IC chip (320) of about 3580 με when the electronic device (200) includes a third elastic material (330-3).

[0139] Unlike the test conditions of FIGS. 8, 9, and 10, a limit test may be performed by dropping a spherical weight with a diameter of 8 mm and a weight of 200 g from a distance of 20 cm. In the limit test, the electronic device (200) to which the first elastic material (330-1) is applied and the electronic device (200) to which the second elastic material (330-2) is applied may not have a crack in the IC chip (320). In contrast, in the limit test, the electronic device (200) to which the third elastic material (330-3) is applied may have a crack in the IC chip (320). That is, the area of ​​the elastic material (330) may be greater than or equal to the area of ​​the connector (316), as with the first elastic material (330-1) and the second elastic material (330-2).

[0140] FIG. 11a illustrates an example of an unfolded state of an electronic device according to one embodiment, FIG. 11b illustrates an example of a folded state of an electronic device according to one embodiment, and FIG. 11c is an exploded view of an electronic device according to one embodiment.

[0141] Referring to FIGS. 11a, 11b, and 11c, an electronic device (1101) (e.g., electronic device (101)) may include a first housing part (1110), a second housing part (1120), and a foldable display (1130). The electronic device (1101) may be referred to as a foldable electronic device in that it is configured to be folded along a folding axis (1137).

[0142] In one embodiment, the electronic device (1101) may include a first housing part (1110), a second housing part (1120), a hinge structure (1160), a foldable display (1130), a printed circuit board (1150), a display (1135), and / or a back plate (1190). According to one embodiment, the electronic device (1101) may omit at least one of the components or additionally include other components.

[0143] In one embodiment, the first housing part (1110) may define a portion of the outer surface of the electronic device (1101). For example, the first housing part (1110) may define a first surface (1111), a second surface (1112) spaced apart from and opposite to the first surface (1111), and a first side of a first side wall (1113) that encloses at least a portion of the first surface (1111) and the second surface (1112). In one embodiment, the first housing part (1110) may provide the space defined by the first surface (1111), the second surface (1112), and the first side as a space for placing components of the electronic device (1101).

[0144] In one embodiment, the second side wall (1123) may be pivotally or rotatably connected to the first side wall (1113) through a hinge structure (1160) disposed on the hinge cover (1165). The hinge structure (1160) may include a hinge module and hinge plates (1166, 1167). The hinge plates may include a first hinge plate (1166) and a second hinge plate (1167), the first hinge plate (1166) may be connected to the first housing part (1110), and the second hinge plate (1167) may be connected to the second housing part (1120).

[0145] In one embodiment, the second housing part (1120) may include a third surface (1121), a fourth surface (1122) separated from and facing the third surface (1121), and a second side wall (1123) that encloses at least a portion of the third surface (1121) and the fourth surface (1122). The second housing part (1120) may provide a space defined by the third surface (1121), the fourth surface (1122), and the second side of the second side wall (1123) as a space for placing components of the electronic device (1101).

[0146] In one embodiment, the foldable display (1130) (e.g., the display module (160) of FIG. 1) may include a window exposed to the outside. The window protects the surface of the foldable display (1130) and is formed of a transparent material to transmit visual information provided from the foldable display (1130) to the outside. The window may include a glass material such as ultra-thin glass (UTG) or a polymer material such as polyimide (PI). The foldable display (1130) may be an example of the display (370) of FIG. 4.

[0147] In one embodiment, the foldable display (1130) may form at least a portion of the first surface (1111) of the first housing part (1110) (e.g., the front of the first housing part (1110)) and the third surface (1121) of the second housing part (1120) (e.g., the front of the second housing part (1120)). The foldable display (1130) may be disposed on the first surface (1111) of the first housing part (1110) and the third surface (1121) of the second housing part (1120) across the hinge structure (1160) within the hinge cover (1165). The foldable display (1130) may be configured to be bent within the folded state of the electronic device (1101) by the hinge structure (1160). The foldable display (1130) may include a first display area (1131), a second display area (1132), and a third display area (1133). For example, the foldable display (1130) may include a first display area (1131) disposed on a first surface (1111) of a first housing, a second display area (1132) disposed on a third surface (1121) of a second housing, and a third display area (1133) between the first display area (1131) and the second display area (1132). The foldable display (1130) may be supported by a first bracket (1170) of a first housing part (1110) and a second bracket (1180) of a second housing part (1120). The first bracket (1170) may be an example of the bracket (350) of FIG. 4.

[0148] According to one embodiment, the foldable display (1130) may include an opening formed in a part of the screen display area, or the bracket supporting the foldable display (1130) may include a recess or an opening. The electronic device (1101) may include at least one camera aligned with the recess or the opening. For example, the first display area (1131) may further include at least one camera (1136) capable of acquiring an image from the outside through a part of the first display area (1131). According to one embodiment, at least one camera (1136) may be included on the rear of the foldable display (1130) corresponding to the first display area (1131) or the second display area (1132) of the foldable display (1130). For example, at least one camera (1136) may be positioned below the foldable display (1130) and may be wrapped by the foldable display (1130). At least one camera (1136) may be an under-display camera (UDC) that is wrapped by the foldable display (1130) and is not exposed to the outside. However, not limited thereto, the foldable display (1130) may include an opening that exposes at least one camera (1136) to the outside. In one embodiment, the camera (1136) may acquire an image of an external environment and / or an external object through the opening.

[0149] In one embodiment, the fourth surface (1122) of the second housing part (1120) may further include at least one camera (1134) and a display (1135) exposed through a portion of the fourth surface (1122).

[0150] In one embodiment, the hinge structure (1160) may be configured to pivotally connect a first bracket (1170) forming a first housing part (1110) and a second bracket (1180) forming a second housing part (1120).

[0151] In one embodiment, the electronic device (1101) may be in a folded state, an unfolded state, or an intermediate state. The folded state may be a state in which the first surface (1111) of the first housing part (1110) and the third surface (1121) of the second housing part (1120) face each other. In the folded state, the direction in which the first surface (1111) faces and the direction in which the third surface (1121) faces may be opposite to each other. The unfolded state may be a state in which the first surface (1111) of the first housing part (1110) and the third surface (1121) of the second housing part (1120) are substantially continuous planes. In the unfolded state, the direction in which the first surface (1111) faces and the direction in which the third surface (1121) faces may be the same. The intermediate state may be a state between the unfolded state and the folded state. In the intermediate state, the direction in which the first surface (1111) faces and the direction in which the third surface (1121) faces may be different.

[0152] In one embodiment, while the electronic device (1101) is in a folded state, the hinge cover (1165) covering the hinge structure (1160) may be exposed at least partially through the space between the first housing part (1110) and the second housing part (1120). In another embodiment, while the electronic device (1101) is in an unfolded state, the hinge cover (1165) may be covered by the first housing part (1110) and the second housing part (1120).

[0153] In one embodiment, the electronic device (1101) can be folded along a folding axis (1137) passing through a hinge cover (1165) or a hinge structure (1160). For example, a hinge structure (1160) within the hinge cover (1165) may be positioned between a first housing part (1110) and a second housing part (1120) of the electronic device (1101) to allow the electronic device (1101) to be bent, curved, or folded. For example, the first housing part (1110) may be connected to the second housing part (1120) through a hinge structure (1160) positioned within the hinge cover (1165) and may be rotated along a folding axis (1137).

[0154] In one embodiment, the electronic device (1101) can be folded so that the first housing part (1110) and the second housing part (1120) face each other by rotating about the folding axis (1137). In one embodiment, the electronic device (1101) can be folded so that the first housing part (1110) and the second housing part (1120) overlap or are stacked on top of each other.

[0155] The hinge structure (1160) may include a hinge module and hinge plates (1166, 1167). The hinge module may include a hinge gear (1162, 1163) that makes the first housing part (1110) and the second housing part (1120) pivotable.

[0156] The first housing part (1110) may include a first bracket (1170), and the second housing part (1120) may include a second bracket (1180). The first bracket (1170) may be partially covered by the first side wall (1113), and the second bracket (1180) may be partially covered by the second side wall (1123). The first bracket (1170) may be formed integrally with the first side wall (1113), and the second bracket (1180) may be formed integrally with the second side wall (1123). According to one embodiment, the first bracket (1170) may be formed separately from the first side wall (1113), and the second bracket (1180) may be formed separately from the second side wall (1123). The first sidewall (1113) and the second sidewall (1123) may be formed of a metallic material, a non-metallic material, or a combination thereof. For example, the first sidewall (1113) may include a conductive portion (1118) and a non-conductive portion (1119). The conductive portion (1118) may be used as a radiator of the antenna.

[0157] One side of the first bracket (1170) is coupled to the rear plate (1190), and the other side of the first bracket (1170) can be coupled to the foldable display (1130). One side of the second bracket (1180) is coupled to the display (1135), and the other side of the second bracket (1180) can be coupled to the foldable display (1130).

[0158] A printed circuit board (1150) and a battery may be disposed in the space between the surface formed by the first bracket (1170) and the second bracket (1180) and the surface formed by the display (1135) and the rear plate (1190). The printed circuit board (1150) may be separated so as to be disposed on the first bracket (1170) of the first housing part (1110) and the second bracket (1180) of the second housing part (1120), respectively. Components for implementing various functions of the electronic device (1101) may be disposed on the printed circuit board (1150).

[0159] According to one embodiment, the first printed circuit board (1151) may have components for implementing the overall function of the electronic device (1101) placed thereon, and the second printed circuit board (1152) may have electronic components for implementing some function of the first printed circuit board (1151) placed thereon, or components for driving a display panel placed on the fourth side (1122) placed thereon. The first printed circuit board (1151) and the second printed circuit board (1152) may be electrically connected by a flexible printed circuit board (1140). The first printed circuit board (1151) may be an example of the PCB (310) of FIG. 4.

[0160] The battery (1155) may be a device for supplying power to at least one component of the electronic device (1101), for example, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (1155) may be disposed substantially coplanar with the printed circuit board (1150). The surface formed substantially coplanar with the printed circuit board (1150) and the battery (1155) may be disposed on one side of the first bracket (1170) and the second bracket (1180) (e.g., the side facing the second side (1112) and the fourth side (1122), or the side facing the display panel and the back plate (1190). For example, a flexible display (1130) may be placed on a first surface (1111) and a third surface (1121), and a printed circuit board (1150) and a battery (1155) may be placed on a second surface (1112) and a fourth surface (1122) facing the surface where the flexible display (1130) is placed.

[0161] In one embodiment, the antenna (1185) may be positioned between the rear plate (1190) and the battery (1155). The antenna (1185) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (1185) may, for example, communicate near-field with an external device or wirelessly transmit and receive power required for charging. The rear plate (1190) may be an example of the rear plate (490) of FIG. 4. The antenna (1185) may be an example of the antenna module (492) of FIG. 4. Although not illustrated, the electronic device (1101) may include a cover plate (e.g., the cover plate (480) of FIG. 4) positioned between the rear plate (1190) (or antenna (1185)) and the first printed circuit board (1151).

[0162] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0163] According to one embodiment, an electronic device (101; 200; 1101) comprises: a first PCB (printed circuit board) (250; 310; 1151) having a first surface (310A) and a second surface (310B) opposite to the first surface (310A); a second PCB (252; 1152); a connector (316) disposed on the first surface (310A) of the first PCB (250; 310; 1151) and configured to electrically connect the first PCB (250; 310; 1151) to the second PCB (252; 1152); and a shield can (360) disposed on the second surface (310B) of the first PCB (250; 310; 1151) and having a top opening (365). It may include an IC chip (integrated circuit chip) (320) disposed on the second surface (310B) of the first PCB (250; 310; 1151) and located within the shield can (360); a shielding layer (340) attached to the shield can (360) to cover the upper opening (365) of the shield can (360); a bracket (240; 350; 1170) in contact with the shielding layer (340); and an elastic material (330) disposed between the IC chip (320) and the shielding layer (340) and configured to support the IC chip (320) which is pressed by a force transmitted through the connector (316).

[0164] In one embodiment, when viewed in a direction (+Z) perpendicular to the first PCB (250; 310; 1151), at least a portion of the elastic material (330) may overlap the connector (316).

[0165] In one embodiment, when viewed in a direction (+Z) perpendicular to the first PCB (250; 310; 1151), the size of the elastic material (330) may be larger than the size of the overlapping area of ​​the connector (316) and the IC chip (320).

[0166] In one embodiment, when viewed in a direction (+Z) perpendicular to the first PCB (250; 310; 1151), the size of the elastic material (330) may be equal to or larger than the size of the connector (316).

[0167] In one embodiment, the elastic material (330) can be attached to the shielding layer (340).

[0168] In one embodiment, the elastic material (330) may be in contact with the IC chip (320).

[0169] In one embodiment, the electronic device (101; 200; 1101) may include a mating connector (354) coupled to the connector (316).

[0170] In one embodiment, the electronic device (101; 200; 1101) may include a rear cover (490; 1190) that defines part of the exterior of the electronic device (101; 200; 1101). The first PCB (250; 310; 1151) may be located between the bracket (240; 350; 1170) and the rear cover (490; 1190).

[0171] In one embodiment, the electronic device (101; 200; 1101) may include a cover plate (480) disposed on the first surface (310A) of the first PCB (250; 310; 1151) to cover the mating connector (354). The cover plate (480) may include a first surface facing the rear cover (490; 1190); and a second surface opposite to the first surface of the cover plate (480) and in contact with the mating connector (354).

[0172] In one embodiment, the electronic device (101; 200; 1101) may include another FPCB (492; 1185) disposed between the rear cover (490; 1190) and the cover plate (480). The other FPCB (492; 1185) may include a conductive pattern configured to operate as an antenna of the electronic device (101; 200; 1101).

[0173] In one embodiment, the electronic device (101; 200; 1101) may include a display (160; 201; 370; 1130). The bracket (240; 350; 1170) may include a first surface in contact with the shielding layer (340); and a second surface opposite to the first surface of the bracket (240; 350; 1170) on which the display (160; 201; 370; 1130) is positioned.

[0174] In one embodiment, the electronic device (101; 200; 1101) may include a flexible PCB (FPCB) (254; 1140) connecting the first PCB (250; 310; 1151) and the second PCB (252; 1152). The flexible PCB (FPCB) (254; 1140) may include the mating connector (354).

[0175] In one embodiment, the electronic device (101; 200; 1101) may include a first housing part (1110) on which the first PCB (250; 310; 1151) is disposed; a second housing part (1120) on which the second PCB (252; 1152) is disposed; and a hinge structure (1160) that rotatably connects the first housing part (1110) and the second housing part (1120). The FPCB (254; 1140) may extend from the first PCB (250; 310; 1151) in the first housing part (1110) across the hinge structure (1160) to the second PCB (252; 1152) in the second housing part (1120).

[0176] In one embodiment, the elastic material (330) may include rubber.

[0177] In one embodiment, the IC chip (320) may include a radio frequency transceiver.

[0178] According to one embodiment, an electronic device (101; 200; 1101) may include a printed circuit board (PCB) (250; 310; 1151) comprising a first surface (310A) and a second surface (310B) opposite to the first surface (310A); a connector (316) disposed on the first surface (310A) of the PCB (250; 310; 1151); an integrated circuit chip (320) disposed on a portion of the second surface (310B) of the PCB (250; 310; 1151) so as to overlap the connector (316); a structure inside the electronic device (101; 200; 1101); and an elastic material (330) disposed between the IC chip (320) and the structure to support the IC chip (320).

[0179] In one embodiment, the structure may include a shield can (360) disposed on the second surface (310B) of the PCB (250; 310; 1151). The IC chip (320) may be located inside the shield can (360).

[0180] In one embodiment, the structure may include a bracket (240; 350; 1170) on which the PCB (250; 310; 1151) is placed. A portion of the bracket (240; 350; 1170) may support the elastic material (330).

[0181] In one embodiment, a heat dissipation layer (340) may be included between the bracket (240; 350; 1170) and the elastic material (330). The bracket (240; 350; 1170) may support the elastic material (330) through the heat dissipation layer (340).

[0182] In one embodiment, the elastic material (330) may include rubber.

[0183] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0184] The electronic device according to the various embodiments disclosed in this document may be a device of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0185] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in any other aspect (e.g., importance or order). Where any component (e.g., the first) is referred to as "coupled" or "connected" to another component (e.g., the second), with or without the terms "functionally" or "communicationally," it means that said component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0186] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0187] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0188] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0189] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device, A first PCB (printed circuit board) comprising a first surface and a second surface opposite to the first surface; 2nd PCB; A connector disposed on the first surface of the first PCB and configured to electrically connect the first PCB to the second PCB; A shield can disposed on the second surface of the first PCB and having a top opening; An IC chip (integrated circuit chip) disposed on the second surface of the first PCB and located within the shield can; A shielding layer attached to the shield can to cover the upper opening of the shield can; A bracket in contact with the shielding layer above; and A structure comprising an elastic material disposed between the IC chip and the shielding layer, configured to support the IC chip which is pressed by a force transmitted through the connector. Electronic device.

2. In Claim 1, When viewed in a direction perpendicular to the first PCB, at least a portion of the elastic material overlaps the connector. Electronic device.

3. In claim 1 or claim 2, When viewed in a direction perpendicular to the first PCB, the size of the elastic material is larger than the size of the overlapping area between the connector and the IC chip. Electronic device.

4. In Claim 3, When viewed in a direction perpendicular to the first PCB, the size of the elastic material is equal to or greater than the size of the connector. Electronic device.

5. In any one of claims 1 to 4, The above elastic material is attached to the shielding layer, Electronic device.

6. In any one of claims 1 to 5, The above elastic material is in contact with the IC chip, Electronic device.

7. In any one of claims 1 to 6, A mating connector coupled to the above connector, Electronic device.

8. In Claim 7, It includes a rear cover that defines part of the exterior of the electronic device, and The first PCB is located between the bracket and the rear cover, Electronic device.

9. In Claim 8, It includes a cover plate disposed on the first surface of the first PCB to cover the mating connector, and The above cover plate is: A first surface facing the rear cover; and A second surface opposite to the first surface of the cover plate and in contact with the mating connector, Electronic device.

10. In Claim 9, It includes another FPCB disposed between the rear cover and the cover plate, and The other FPCB above includes a conductive pattern configured to operate as an antenna of the electronic device, Electronic device.

11. In claim 9 or claim 10, Includes a display, The above bracket is: A first surface in contact with the shielding layer above; and A second surface opposite to the first surface of the bracket and on which the display is positioned, Electronic device.

12. In any one of claims 1 to 11, A flexible PCB (FPCB) comprising the first PCB and the second PCB, and including the mating connector Electronic device.

13. In Claim 12, A first housing part on which the above-mentioned first PCB is placed; A second housing part on which the second PCB is placed; and It includes a hinge structure that rotatably connects the first housing part and the second housing part, and The above FPCB extends from a first PCB in the first housing part across the hinge structure to a second PCB in the second housing part, Electronic device.

14. In any one of claims 1 to 13, The above elastic material includes rubber, Electronic device.

15. In any one of claims 1 to 14, The above IC chip includes a radio frequency transceiver. Electronic device.

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