Electronic device, liquid-cooled server cabinet, control system, and method

Abstract

The present application relates to the technical field of heat dissipation. Disclosed are an electronic device, a liquid-cooled server cabinet, a control system, and a method. The liquid-cooled server cabinet comprises a cabinet body, and a heat exchange unit which is provided in the cabinet body. The heat exchange unit comprises a heat exchanger, a first connecting pipe, and a second connecting pipe. The first connecting pipe is configured to be communicated with a first liquid cooling pipe inside each electronic device among at least one electronic device inside the cabinet body, so as to supply a liquid cooling medium to the first liquid cooling pipe, the liquid cooling medium being used for absorbing heat of components inside the electronic device. The second connecting pipe is configured to be communicated with a second liquid cooling pipe outside the cabinet body. The heat exchanger is used for performing heat exchange between the first connecting pipe and the second connecting pipe, so as to cool the liquid cooling medium in the first connecting pipe. The heat exchange unit is provided, so that an internal circulation system that works independently can be formed inside the cabinet body. Therefore, the liquid-cooled server cabinet does not need to rely on the second liquid-cooled pipe outside the cabinet body to supply the liquid cooling medium, thereby improving the disaster tolerance capability of the liquid-cooled server cabinet.

Description

Electronic equipment, liquid-cooled cabinets, control systems and methods

[0001] This application claims priority to Chinese Patent Application No. 202411551872.7, filed on October 31, 2024, entitled "Electronic Equipment, Liquid-cooled Cabinet, Control System and Method", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heat dissipation technology, and in particular to an electronic device, a liquid-cooled cabinet, a control system, and a method. Background Technology

[0003] With the rapid development of the digital economy, the transmission rate of data centers is constantly increasing, and the power consumption of corresponding electronic devices such as servers and switches is constantly increasing, resulting in higher and higher heat dissipation of electronic devices.

[0004] Currently, liquid cooling technology is used to dissipate heat from electronic devices such as servers and switches. Taking servers as an example, multiple servers can be housed inside a liquid-cooled cabinet. The outside of the cabinet is equipped with a cooling distribution unit (CDU), which is a liquid cooling control unit that regulates the temperature and flow rate of the liquid cooling medium within the cabinet. The CDU is connected to the liquid-cooled cabinet via liquid cooling piping. Thus, the liquid cooling medium flows from the CDU into the cabinet, through the servers, and then back out to the CDU for cooling. This dissipates the heat generated by the servers during operation, lowering their temperature and meeting their heat dissipation requirements.

[0005] However, the liquid-cooled cabinets in the above scheme rely on external liquid-cooling distribution units to supply liquid cooling media to regulate the server temperature. Due to limitations in the performance of the liquid-cooling distribution units, the disaster recovery capabilities of the liquid-cooled cabinets and the servers inside them are currently limited. Summary of the Invention

[0006] To address the aforementioned technical problems, this application provides an electronic device, a liquid-cooled cabinet, a control system, and a method. The following describes this application from multiple aspects, and the implementation methods and beneficial effects of these aspects can be referenced interchangeably.

[0007] The first aspect of this application provides a liquid-cooled cabinet. The liquid-cooled cabinet includes a cabinet body and a heat exchange unit disposed within the cabinet body. By incorporating the heat exchange unit, an independently operating internal circulation system can be formed within the cabinet body. Therefore, the liquid-cooled cabinet does not rely on external liquid-cooling piping for the supply of liquid cooling medium, effectively improving the disaster recovery capability of the liquid-cooled cabinet.

[0008] Specifically, the heat exchange unit includes a heat exchanger, a first connecting pipe, and a second connecting pipe. The first connecting pipe connects to a first liquid cooling pipe inside at least one electronic device within the cabinet, supplying liquid cooling medium to the first liquid cooling pipe. The liquid cooling medium absorbs heat from the components inside the electronic device. The second connecting pipe connects to a second liquid cooling pipe outside the cabinet. The heat exchanger facilitates heat exchange between the first and second connecting pipes, cooling the liquid cooling medium within the first connecting pipe, ultimately dissipating heat from the electronic device.

[0009] According to the embodiments of this application, the first connecting pipe and the first liquid cooling pipe can together constitute an internal circulation system. Since the liquid-cooled cabinet has an independent internal circulation system inside its cabinet, the liquid-cooled cabinet does not need to rely on the second liquid cooling pipe outside the cabinet to supply the liquid cooling medium, thereby reducing the impact of the second liquid cooling pipe outside the cabinet on the liquid-cooled cabinet and improving the disaster recovery capability of the liquid-cooled cabinet.

[0010] For example, when the liquid supply to the second liquid cooling pipeline outside the cabinet is abnormal, the internal circulation system of the liquid-cooled cabinet can work for a short time to prevent the electronic equipment inside the cabinet from overheating and losing power. This allows for a certain amount of backup time for the electronic equipment to perform self-protection or data backup, thus avoiding losses.

[0011] For example, the internal circulation system of the liquid-cooled cabinet can supply liquid cooling medium to the first liquid cooling pipeline of the electronic equipment, thereby achieving the isolation of the liquid cooling medium. Therefore, when the cleanliness of the liquid cooling medium in the second liquid cooling pipeline outside the cabinet is not up to standard, it will not cause contamination to the electronic equipment, effectively avoiding the problem of liquid cooling medium contamination.

[0012] It is understandable that electronic devices, such as servers or switches, can dissipate heat through liquid cooling.

[0013] In one possible implementation of the first aspect described above, there are multiple electronic devices, and the flow rate of the liquid cooling medium supplied by the first connecting pipe to the first liquid cooling pipe of each electronic device is different.

[0014] In this way, precise temperature control of individual electronic devices can be achieved to meet the working requirements of electronic devices with different power consumption, effectively reducing the risk of condensation in electronic devices and improving the disaster recovery capability of electronic devices.

[0015] In one possible implementation of the first aspect described above, the second connecting pipe is provided with at least one of a filter assembly, a first temperature sensing assembly, or a proportional valve.

[0016] According to the embodiments of this application, a filter assembly may be provided on the second connecting pipe. The filter assembly is used to filter impurities in the liquid cooling medium in the second connecting pipe, which can further reduce the dependence of the liquid cooling cabinet on the external second liquid cooling pipe, expand the application scenarios of the liquid cooling cabinet, and improve the disaster recovery capability of the liquid cooling cabinet.

[0017] According to an embodiment of this application, a first temperature sensing component may be provided on the second connecting pipe. This first temperature sensing component is used to detect the temperature of the liquid cooling medium within the second connecting pipe. In this way, the temperature of the liquid cooling medium within the second connecting pipe can be monitored in real time, allowing for flexible adjustment of the state parameters of the liquid cooling medium within the second connecting pipe, such as temperature and flow rate, according to actual needs, ensuring effective heat dissipation and optimizing energy efficiency. Furthermore, it can also promptly detect temperature anomalies in the liquid cooling medium within the second connecting pipe, reducing losses and helping to maintain the long-term stable operation of the second connecting pipe.

[0018] According to the embodiments of this application, a proportional valve may be provided on the second connecting pipe. By adjusting the opening degree of the proportional valve, the flow rate of the liquid cooling medium in the second connecting pipe can be adjusted to meet the actual heat dissipation requirements.

[0019] In one possible implementation of the first aspect described above, a filter assembly is provided on the second connecting pipeline. The second connecting pipeline includes a first branch and a second branch connected in parallel, and the filter assembly includes a first filter screen and a second filter screen. The first filter screen and the second filter screen are respectively disposed on the first branch and the second branch, and a valve is provided on one of the first branch and the second branch.

[0020] By setting up a first filter and a second filter, the operational flexibility of the filtration assembly can be effectively improved to meet different usage needs. For example, the first filter can be used as the primary filter, and the second filter as a backup. When the first filter fails, the second filter can be activated, ensuring that the filtration assembly can continue to operate normally without needing to be replaced. Alternatively, both the first and second filters can be used as primary filters to meet high-flow-rate filtration requirements.

[0021] In one possible implementation of the first aspect described above, a first temperature sensing component is provided on the second connecting pipe. The first temperature sensing component includes a plurality of first temperature sensors (e.g., two, three, four, or five, etc.), which are arranged sequentially along the extension direction of the second connecting pipe.

[0022] By using multiple first temperature sensors, the operational reliability of the first temperature sensing component can be improved, thereby helping to ensure its normal operation throughout its entire life cycle (e.g., a five-year life cycle) and achieving maintenance-free operation. For example, if one first temperature sensor fails, the others can immediately take over, ensuring the first temperature sensing component can continue to operate normally without disassembling the liquid cooling cabinet for maintenance.

[0023] In one possible implementation of the first aspect described above, the front wall of the cabinet is provided with an opening for exposing the heat exchange unit to the outside.

[0024] In this way, online operation and maintenance of the heat exchange unit can be achieved through the opening, that is, the maintenance method of the heat exchange unit is front maintenance. The front maintenance method makes it convenient for operators to maintain and repair the heat exchange unit, the operation is simple, and it does not restrict the installation of the liquid cooling cabinet. For example, the rear wall of the liquid cooling cabinet can be mounted against the wall or embedded in the wall, which saves more space.

[0025] In one possible implementation of the first aspect described above, a filter assembly is provided on the second connecting pipe. The distance between the filter assembly and the rear wall of the cabinet is greater than the distance between the filter assembly and the front wall of the cabinet. This allows for easier access to the filter assembly through the opening, facilitating maintenance and repair.

[0026] In one possible implementation of the first aspect described above, a proportional valve is provided on the second connecting pipe. The heat exchange unit includes a first control board, which is used to monitor the state parameters of the liquid cooling medium in the first and second connecting pipes of the heat exchange unit, and control the proportional valve according to the state parameters.

[0027] In one possible implementation of the first aspect described above, the state parameters include the temperature of the liquid cooling medium within the first connecting pipe. The first control board controls the proportional valve based on the state parameters, including: the first control board comparing the temperature of the liquid cooling medium within the first connecting pipe with the dew point temperature of the environment where the liquid-cooled cabinet is located; and the first control board adjusting the opening of the proportional valve based on the fact that the temperature of the liquid cooling medium within the first connecting pipe is lower than the dew point temperature, so that the temperature of the liquid cooling medium within the first connecting pipe is higher than the dew point temperature. This prevents condensation from forming on the electronic equipment inside the liquid-cooled cabinet due to over-cooling.

[0028] In this way, the liquid-cooled cabinet itself can avoid the risk of condensation without relying on other equipment (such as data center humidity control units, air conditioners, and liquid-cooled distribution units) to achieve condensation warning, thereby effectively improving the disaster recovery capability of the liquid-cooled cabinet.

[0029] In one possible implementation of the first aspect described above, the liquid cooling cabinet includes a controller disposed in the cabinet, and the heat exchange unit further includes a first control board. The first control board is used to monitor the state parameters of the liquid cooling medium in the first connecting pipe and the second connecting pipe of the heat exchange unit, and to send a state signal to the controller to indicate the state of the liquid cooling medium according to the state parameters.

[0030] In one possible implementation of the first aspect above, the heat exchange unit further includes a replenishment tank and a first pump, the replenishment tank being connected to a first connecting pipeline, the first pump being located between the replenishment tank and the first connecting pipeline, and the first pump being used to drive the liquid cooling medium in the replenishment tank to flow to the first connecting pipeline; or, the heat exchange unit includes an expansion tank, the expansion tank being connected to the first connecting pipeline.

[0031] According to an embodiment of this application, the heat exchange unit includes a liquid replenishment tank and a first pump. The first pump is used to drive the liquid cooling medium in the liquid replenishment tank to flow to the first connecting pipe, so that the liquid replenishment tank can supply liquid cooling medium to the first connecting pipe, thereby allowing the liquid cooling medium to flow in the first connecting pipe and ultimately achieving the heat dissipation function.

[0032] According to an embodiment of this application, the heat exchange unit includes an expansion tank connected to a first connecting pipe. The expansion tank is used to stabilize pressure fluctuations of the liquid cooling medium in the first connecting pipe. For example, when the volume of the liquid cooling medium in the first connecting pipe increases due to temperature rise, the expansion tank can absorb the excess liquid cooling medium, preventing the pressure of the liquid cooling medium in the first connecting pipe from rising too quickly; when the volume of the liquid cooling medium in the first connecting pipe decreases due to temperature drop, the expansion tank can release the liquid cooling medium into the first connecting pipe, thereby replenishing the liquid cooling medium in the first connecting pipe and preventing the pressure of the liquid cooling medium in the first connecting pipe from dropping too quickly.

[0033] In one possible implementation of the first aspect described above, at least one of a second temperature sensing component and a pressure sensing component is provided on the first connecting pipe.

[0034] According to an embodiment of this application, a second temperature sensing component is provided on the first connecting pipe. The second temperature sensing component is used to detect the temperature of the liquid cooling medium in the first connecting pipe. This allows for real-time monitoring of the temperature of the liquid cooling medium in the first connecting pipe, enabling flexible adjustment of its state parameters, such as temperature and flow rate, according to actual needs. This ensures effective heat dissipation and optimizes energy efficiency. Furthermore, it allows for timely detection of temperature anomalies in the liquid cooling medium within the first connecting pipe, reducing losses and contributing to the long-term stable operation of the first connecting pipe.

[0035] According to an embodiment of this application, a pressure sensing component is provided on the first connecting pipe, which is used to detect the pressure of the liquid cooling medium in the first connecting pipe. This allows for real-time monitoring of the pressure of the liquid cooling medium in the first connecting pipe, preventing safety hazards caused by excessively high or low pressure, and helping to maintain the long-term stable operation of the first connecting pipe.

[0036] In one possible implementation of the first aspect described above, a second temperature sensing component is provided on the first connecting pipe. The second temperature sensing component includes a plurality of second temperature sensors (e.g., two, three, four, or five, etc.), which are arranged sequentially along the extension direction of the first connecting pipe.

[0037] By incorporating multiple secondary temperature sensors, the operational reliability of the secondary temperature sensing component can be improved, thereby helping to ensure its normal operation throughout its entire lifespan (e.g., a five-year lifespan) and achieving maintenance-free operation. For example, if one secondary temperature sensor fails, the others can immediately take over, ensuring the secondary temperature sensing component can continue to operate normally without disassembling the liquid cooling cabinet for maintenance.

[0038] In one possible implementation of the first aspect described above, a pressure sensing component is provided on the first connecting pipe. The pressure sensing component includes multiple pressure sensors arranged sequentially along the extension direction of the first connecting pipe.

[0039] By incorporating multiple pressure sensors, the operational reliability of the pressure sensing assembly can be improved, thereby helping to ensure its normal operation throughout its entire lifespan (e.g., a five-year lifespan) and achieving maintenance-free operation. For example, if one pressure sensor fails, the others can immediately take over, ensuring the pressure sensing assembly continues to function normally without requiring disassembly of the liquid-cooled cabinet for maintenance.

[0040] A second aspect of this application provides an electronic device. Specifically, the electronic device includes a flow control element and a first liquid cooling pipeline. The flow control element is disposed on the first liquid cooling pipeline and is used to control the flow rate of the liquid cooling medium in the first liquid cooling pipeline. The first liquid cooling pipeline is used to connect to a first connecting pipeline outside the electronic device.

[0041] In this way, the flow rate of the liquid cooling medium in the first liquid cooling pipeline can be controlled by the flow control element, thereby achieving precise temperature control to ensure that the electronic equipment can operate at a suitable temperature, thus effectively preventing condensation from the electronic equipment due to overcooling and improving disaster recovery capability.

[0042] It is understandable that electronic devices, such as servers or switches, can dissipate heat through liquid cooling.

[0043] In one possible implementation of the second aspect described above, the flow control element includes a second pump or a proportional valve.

[0044] According to embodiments of this application, the flow control element may include a second pump, and the flow rate of the liquid cooling medium in the first liquid cooling pipeline can be controlled by adjusting the rotation speed of the second pump. Furthermore, the second pump can also drive the flow of the liquid cooling medium in the first liquid cooling pipeline, allowing the liquid cooling medium in the first liquid cooling pipeline to continuously absorb and remove heat from the electronic device, thereby ensuring that the electronic device can be cooled independently and helping to reduce the liquid supply failure range. For example, even if a second pump fails, it will only affect the flow state of the liquid cooling medium inside that electronic device, without affecting the flow state of the liquid cooling medium in the first liquid cooling pipelines of other electronic devices, thus preventing abnormal liquid cooling medium supply to other electronic devices. As another example, when a first liquid cooling pipeline in an electronic device fails (e.g., leaks), the second pump in that electronic device can be turned off for replacement and repair without affecting other electronic devices.

[0045] According to an embodiment of this application, the flow control element may include a proportional valve, which can control the flow rate of the liquid cooling medium in the first liquid cooling pipeline by adjusting the opening degree of the proportional valve.

[0046] In one possible implementation of the second aspect described above, the electronic device further includes a second control board, which is communicatively connected to the flow control element to control the flow control element.

[0047] A third aspect of this application provides a control system. Specifically, the control system includes a liquid-cooled cabinet and at least one electronic device. The liquid-cooled cabinet includes a cabinet body and a heat exchange unit disposed within the cabinet body, and at least one electronic device is disposed within the cabinet body. The electronic device includes a flow control element and a first liquid-cooled pipeline. The flow control element is disposed on the first liquid-cooled pipeline and is used to control the flow rate of the liquid cooling medium within the first liquid-cooled pipeline. The heat exchange unit includes a heat exchanger, a first connecting pipe, and a second connecting pipe. The first connecting pipe connects to the first liquid-cooled pipeline inside each of the at least one electronic device within the cabinet body to supply liquid cooling medium to the first liquid-cooled pipeline. The liquid cooling medium is used to absorb heat from the components inside the electronic device. The second connecting pipe connects to a second liquid-cooled pipeline outside the cabinet body. The heat exchanger is used for heat exchange between the first connecting pipe and the second connecting pipe to cool the liquid cooling medium within the first connecting pipe.

[0048] In the aforementioned control system, on the one hand, the electronic device can control the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the electronic device through the flow control element, thereby achieving precise temperature control to ensure that the electronic device can operate at a suitable temperature, thereby effectively avoiding condensation caused by over-cooling of the electronic device and improving the disaster recovery capability of the electronic device.

[0049] It is understandable that electronic devices, such as servers or switches, can dissipate heat through liquid cooling.

[0050] On the other hand, the first connecting pipe and the first liquid cooling pipe can together form an internal circulation system. Therefore, the liquid-cooled cabinet does not need to rely on a second external liquid cooling pipe for supplying the liquid cooling medium, effectively improving the disaster recovery capability of the liquid-cooled cabinet.

[0051] For example, when the liquid supply to the second liquid cooling pipeline outside the cabinet is abnormal, the internal circulation system of the liquid-cooled cabinet can work for a short time to prevent the electronic equipment inside the cabinet from overheating and losing power. This allows for a certain amount of backup time for the electronic equipment to perform self-protection or data backup, thus avoiding losses.

[0052] For example, the internal circulation system of the liquid-cooled cabinet can supply liquid cooling medium to the first liquid cooling pipeline of the electronic equipment, thereby achieving the isolation of the liquid cooling medium. Therefore, when the cleanliness of the liquid cooling medium in the second liquid cooling pipeline outside the cabinet is not up to standard, it will not cause contamination to the electronic equipment, effectively avoiding the problem of liquid cooling medium contamination.

[0053] In one possible implementation of the third aspect described above, the liquid-cooled cabinet includes a controller disposed within the cabinet, and the heat exchange unit further includes a first control board. The first control board is used to monitor the state parameters of the liquid cooling medium in the first and second connecting pipes of the heat exchange unit, and to send a state signal indicating the state of the liquid cooling medium to the controller based on the state parameters.

[0054] In one possible implementation of the third aspect described above, the electronic device further includes a second control board for monitoring the temperature of the electronic device and sending a temperature signal to the controller to indicate the temperature of the electronic device based on the temperature of the electronic device.

[0055] In one possible implementation of the third aspect described above, the controller is configured to send a control signal to the second control board based on at least one of a status signal and a temperature signal, so that the second control board controls the flow control element according to the control signal.

[0056] In the aforementioned control system, the first control board and the second control board are independent sub-control modules, while the controller is the centrally managed overall control module. Thus, the first control board, the second control board, and the controller together constitute a distributed-distributed control architecture. The first control board reports status signals to the controller, and the second control board reports temperature signals to the controller. The controller collects the status and temperature signals and, based on at least one of them, sends a control signal to the second control board to control the flow control elements of the electronic equipment. This distributed-distributed control architecture effectively ensures the reliability of the overall system control and can implement different control strategies, such as condensation warning control strategies, disaster recovery control strategies, or flow regulation control strategies.

[0057] In one possible implementation of the third aspect described above, the state parameters include the temperature of the liquid cooling medium in the first connecting pipe. The first control board sends a state signal to the controller based on the state parameters, and the controller sends a control signal to the second control board based on the state signal, causing the second control board to control the flow control element according to the control signal. This includes: the first control board comparing the temperature of the liquid cooling medium in the first connecting pipe with the dew point temperature of the environment where the liquid cooling cabinet is located; the first control board sending a first state signal to the controller based on the fact that the temperature of the liquid cooling medium in the first connecting pipe is lower than the dew point temperature; the controller sending a first control signal to the second control board based on the first state signal; and the second control board controlling the flow control element according to the first control signal to make the temperature of the liquid cooling medium in the first connecting pipe higher than the dew point temperature.

[0058] The aforementioned condensation control strategy flexibly controls the flow control element based on the temperature and dew point temperature of the liquid cooling medium in the first liquid cooling pipeline, thereby adjusting the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the electronic equipment. This effectively avoids the risk of condensation and improves the disaster recovery capability of the control system.

[0059] In one possible implementation of the third aspect described above, the status parameters include the temperatures of the liquid cooling media in the first and second connecting pipes. The first control board sends a status signal to the controller based on the status parameters. The controller then sends a control signal to the second control board based on the status signal, causing the second control board to control the flow control element according to the control signal. This includes: the first control board determining an abnormal supply status of the liquid cooling media in the second connecting pipe based on the temperatures of the liquid cooling media in the first and second connecting pipes; the first control board sending a second status signal to the controller based on the abnormal supply status of the liquid cooling media in the second connecting pipe; the controller sending a second control signal to the second control board based on the second status signal; and the second control board controlling the flow control element according to the second control signal, causing the flow control element to adjust the flow rate of the liquid cooling media in the first liquid cooling pipe.

[0060] The aforementioned disaster recovery control strategy can promptly detect abnormalities in the supply status of the liquid cooling medium in the second connecting pipe based on the temperature of the liquid cooling medium in the first and second connecting pipes. This allows for the adjustment of the flow rate of the liquid cooling medium in the first liquid cooling pipe of the electronic equipment through flow control elements, thereby achieving disaster recovery, avoiding losses, and ultimately improving the disaster recovery capability of the control system.

[0061] In one possible implementation of the third aspect described above, the state parameters include the temperature of the liquid cooling medium in the first connecting pipe. A first control board sends a state signal to a controller based on the state parameters, and a second control board sends a temperature signal to the controller based on the temperature of the electronic device. The controller sends a control signal to the second control board based on the state signal and the temperature signal, causing the second control board to control the flow control element according to the control signal. This includes: the first control board sending a third state signal to the controller based on the temperature of the liquid cooling medium in the first connecting pipe, the third state signal indicating the temperature of the liquid cooling medium in the first connecting pipe; the second control board sending a temperature signal to the controller based on the temperature of the electronic device; the controller sending a third control signal to the second control board based on the third state signal and the temperature signal; and the second control board controlling the flow control element according to the third control signal, causing the flow control element to adjust the flow rate of the liquid cooling medium in the first liquid cooling pipe.

[0062] The above-mentioned flow regulation and control strategy adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipe of the electronic device in real time according to the temperature of the liquid cooling medium in the first connecting pipe and the temperature of the electronic device, so as to adapt to the working requirements of the electronic device, avoid excessive flow of liquid cooling medium in the first liquid cooling pipe leading to over-cooling of the electronic device, and help reduce the amount of liquid cooling medium used and reduce costs.

[0063] A fourth aspect of this application provides a control method for a control system in the third aspect and any possible implementation thereof, comprising: a first control board monitoring state parameters of a liquid cooling medium in a first connecting pipe and a second connecting pipe of a heat exchange unit, and sending a state signal indicating the state of the liquid cooling medium to a controller based on the state parameters; and a second control board monitoring the temperature of an electronic device, and sending a temperature signal indicating the temperature of the electronic device to the controller based on the temperature of the electronic device; the controller sending a control signal to the second control board based on at least one of the state signal and the temperature signal, such that the second control board controls a flow control element according to the control signal.

[0064] In one possible implementation of the fourth aspect described above, the state parameters include the temperature of the liquid cooling medium in the first connecting pipe. The first control board sends a state signal to the controller based on the state parameters, and the controller sends a control signal to the second control board based on the state signal, causing the second control board to control the flow control element according to the control signal. This includes: the first control board comparing the temperature of the liquid cooling medium in the first connecting pipe with the dew point temperature of the environment where the liquid cooling cabinet is located; the first control board sending a first state signal to the controller based on the fact that the temperature of the liquid cooling medium in the first connecting pipe is lower than the dew point temperature; the controller sending a first control signal to the second control board based on the first state signal; and the second control board controlling the flow control element according to the first control signal to make the temperature of the liquid cooling medium in the first connecting pipe higher than the dew point temperature.

[0065] In one possible implementation of the fourth aspect described above, the status parameters include the temperatures of the liquid cooling media in the first and second connecting pipes. The first control board sends a status signal to the controller based on the status parameters. The controller then sends a control signal to the second control board based on the status signal, causing the second control board to control the flow control element according to the control signal. This includes: the first control board determining an abnormal supply status of the liquid cooling media in the second connecting pipe based on the temperatures of the liquid cooling media in the first and second connecting pipes; the first control board sending a second status signal to the controller based on the abnormal supply status of the liquid cooling media in the second connecting pipe; the controller sending a second control signal to the second control board based on the second status signal; and the second control board controlling the flow control element according to the second control signal, causing the flow control element to adjust the flow rate of the liquid cooling media in the first liquid cooling pipe.

[0066] In one possible implementation of the fourth aspect described above, the state parameters include the temperature of the liquid cooling medium in the first connecting pipe. A first control board sends a state signal to a controller based on the state parameters, and a second control board sends a temperature signal to the controller based on the temperature of the electronic device. The controller sends a control signal to the second control board based on the state signal and the temperature signal, causing the second control board to control the flow control element according to the control signal. This includes: the first control board sending a third state signal to the controller based on the temperature of the liquid cooling medium in the first connecting pipe, the third state signal indicating the temperature of the liquid cooling medium in the first connecting pipe; the second control board sending a temperature signal to the controller based on the temperature of the electronic device; the controller sending a third control signal to the second control board based on the third state signal and the temperature signal; and the second control board controlling the flow control element according to the third control signal, causing the flow control element to adjust the flow rate of the liquid cooling medium in the first liquid cooling pipe.

[0067] The fifth aspect of this application provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the control method described in the fourth aspect and one possible implementation thereof.

[0068] It should be understood that the technical effects of the fourth aspect, any possible implementation of the fourth aspect, and the fifth aspect can be referenced to the technical effects of the aforementioned third aspect and different possible implementations of the third aspect, which will not be elaborated here. Attached Figure Description

[0069] Figure 1 illustrates a liquid cooling scenario for a server in some embodiments of this application;

[0070] Figure 2 illustrates an exemplary structure of the server in an embodiment of this application;

[0071] Figure 3A shows the architecture diagram of the liquid-cooled cabinet in an embodiment of this application;

[0072] Figure 3B shows a schematic diagram of the structure of the liquid-cooled cabinet in an embodiment of this application;

[0073] Figure 4 shows a partial structure of the heat exchange unit in an embodiment of this application;

[0074] Figure 5 shows a schematic diagram of the maintenance replenishment pump in the heat exchange unit in an embodiment of this application;

[0075] Figure 6 shows a schematic diagram of the heat exchange unit control board in the heat exchange unit in an embodiment of this application;

[0076] Figure 7 shows a perspective view of the heat exchange unit in an embodiment of this application;

[0077] Figure 8A shows the architecture diagram of the control system in an embodiment of this application;

[0078] Figure 8B shows a structural diagram of the control system in an embodiment of this application;

[0079] Figure 9 shows a flowchart of a control method applied in a control system according to an embodiment of this application;

[0080] Figure 10A shows an exemplary flowchart of the condensation early warning control strategy in an embodiment of this application;

[0081] Figure 10B shows an exemplary flowchart of the disaster recovery control strategy in an embodiment of this application;

[0082] Figure 10C shows an exemplary flowchart of the flow regulation control strategy in an embodiment of this application. Detailed Implementation

[0083] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0084] This application provides an electronic device that can be housed inside a liquid-cooled cabinet, enabling the cabinet to utilize liquid cooling technology for heat dissipation. The electronic device can be, for example, a server or a switch, which uses liquid cooling for heat dissipation. For ease of description, a server is used as an example of the electronic device below.

[0085] Figure 1 illustrates a liquid cooling scenario for a server in some embodiments of this application. Referring to Figure 1, the interior of the server room 01 is equipped with a server 1, a liquid-cooled cabinet 2, and a liquid-cooled distribution unit 3, while the exterior of the server room 01 is equipped with a cooling tower 4 and a pump 5.

[0086] In this application, server 1 is housed within a liquid-cooled cabinet 2. The number of liquid-cooled cabinets 2 can be one or more (e.g., two, three, four, or five, etc.), and this application does not impose a specific limitation on this. Each liquid-cooled cabinet 2 can house one or more servers 1 (e.g., two, three, four, or five, etc.), and this application does not impose a specific limitation on this.

[0087] The liquid-cooled cabinet 2 and the liquid-cooled distribution unit 3 are connected by liquid-cooled piping. The liquid cooling medium (e.g., water) in the liquid-cooled piping can circulate between the liquid-cooled cabinet 2 and the liquid-cooled distribution unit 3. In Figure 1, the arrows marked between the liquid-cooled cabinet 2 and the liquid-cooled distribution unit 3 indicate the flow direction of the liquid cooling medium in the liquid-cooled piping between the liquid-cooled cabinet 2 and the liquid-cooled distribution unit 3.

[0088] The liquid-cooled distribution unit 3 and the cooling tower 4 are also connected by liquid-cooled piping. The liquid cooling medium (e.g., water) in the liquid-cooled piping can circulate between the liquid-cooled distribution unit 3 and the cooling tower 4. In Figure 1, the arrows marked between the liquid-cooled distribution unit 3 and the cooling tower 4 indicate the flow direction of the liquid cooling medium in the liquid-cooled piping between the liquid-cooled distribution unit 3 and the cooling tower 4.

[0089] A pump 5 may also be installed in the liquid cooling pipeline between the liquid cooling distribution unit 3 and the cooling tower 4. The pump 5 is used to drive the liquid cooling medium to flow in the liquid cooling pipeline between the liquid cooling distribution unit 3 and the cooling tower 4.

[0090] In this way, the heat generated by server 1 during operation can be transferred to liquid-cooled cabinet 2, and then transferred to liquid-cooled distribution unit 3 through the liquid-cooling medium in the liquid-cooling pipes between liquid-cooled cabinet 2 and liquid-cooled distribution unit 3. Then, liquid-cooled distribution unit 3 transfers the heat to cooling tower 4 through the liquid-cooling medium in the liquid-cooling pipes between liquid-cooled distribution unit 3 and cooling tower 4, and the cooling tower 4 dissipates the heat into the atmosphere outside the computer room 01. This ultimately achieves heat dissipation for server 1.

[0091] As mentioned earlier, liquid-cooled server racks rely on external liquid-cooling distribution units to supply liquid cooling media to regulate server temperature. Due to limitations in the performance of the liquid-cooling distribution units, the disaster recovery capabilities of liquid-cooled server racks and the servers within them are limited.

[0092] For example, in some technical solutions, the liquid cooling distribution unit located outside the liquid-cooled rack can only provide uniform temperature control for all servers within the rack. However, the power consumption of different servers within the same rack varies at the same time, and the liquid cooling distribution unit cannot achieve precise temperature control for each server. This leads to a higher risk of condensation on the servers and poor disaster recovery capabilities. Condensation refers to the phenomenon where water vapor in the air condenses into water droplets when it encounters a cool surface. Condensation can damage servers, such as causing short circuits, electrical leaks, or corrosion of server components.

[0093] For example, during the same time period, the power consumption of an artificial intelligence (AI) server is higher than that of a general-purpose server. When the liquid cooling distribution unit increases the flow rate of the liquid cooling medium to control the temperature of the entire liquid-cooled cabinet at the operating temperature required by the AI ​​server, the temperature of the general-purpose server will be lower than the dew point temperature of the environment in which the server is located (e.g., the data center where the server is located). As a result, the general-purpose server will generate condensation due to overcooling, which will eventually lead to the damage of the general-purpose server.

[0094] In view of this, embodiments of this application provide a server including a flow control element and a first liquid cooling pipeline. The flow control element is disposed on the first liquid cooling pipeline and is used to control the flow rate of the liquid cooling medium within the first liquid cooling pipeline. In this way, the flow rate of the liquid cooling medium in the first liquid cooling pipeline of each server can be adjusted specifically according to the power consumption of different servers, thereby achieving precise temperature control of individual servers, effectively reducing the risk of condensation on the servers, and improving the disaster recovery capability of the servers.

[0095] The embodiments of this application are described in detail below with reference to the accompanying drawings.

[0096] Figure 2 illustrates an exemplary structure of server 1 in an embodiment of this application. Referring to Figure 2, server 1 includes a flow control element 10 and a first liquid cooling pipe M1. The flow control element 10 is disposed on the first liquid cooling pipe M1 and is used to control the flow rate of the liquid cooling medium within the first liquid cooling pipe M1. The first liquid cooling pipe M1 is connected to a first connecting pipe L1 outside server 1 to obtain liquid cooling medium through the first connecting pipe L1. This liquid cooling medium is used to absorb heat from internal components (hereinafter referred to as "heat sources") of server 1. In Figure 2, the arrows marked on the first liquid cooling pipe M1 indicate the flow direction of the liquid cooling medium within the first liquid cooling pipe M1, and the arrows marked on the first connecting pipe L1 can also indicate the flow direction of the liquid cooling medium within the first connecting pipe L1.

[0097] In this way, the flow rate of the liquid cooling medium in the first liquid cooling pipe M1 can be controlled by the flow control element 10, thereby achieving precise temperature control to ensure that the server 1 can work at a suitable temperature, thus effectively preventing condensation from the server 1 due to overcooling and improving disaster recovery capability.

[0098] For ease of understanding, the following will continue to use the architecture of server 1 in the embodiment shown in Figure 2 as an example to describe the traffic adjustment process in server 1 in detail.

[0099] Referring again to Figure 2, in some embodiments of this application, server 1 may further include a heat source 11 and a cold plate 12 in contact with the heat source 11. The heat source 11 refers to components inside server 1 that require heat dissipation, such as a central processing unit (CPU), graphics processing unit (GPU), power management IC (PMIC), memory (or internal storage), or optical module. The cold plate 12 includes channels (not shown) for the flow of liquid cooling medium.

[0100] The first liquid cooling pipeline M1 includes an inlet pipe section M11 and an outlet pipe section M12. The first connecting pipeline L1 includes an inlet pipe section L11 and an outlet pipe section L12. One end of the inlet pipe section M11 of the first liquid cooling pipeline M1 serves as the liquid inlet I1 of the server 1, which connects to the inlet pipe section L11 of the first connecting pipeline L1 to obtain the liquid cooling medium. The other end of the inlet pipe section M11 connects to the liquid inlet of the flow channel of the cold plate 12. The outlet of the flow channel of the cold plate 12 connects to one end of the outlet pipe section M12 of the first liquid cooling pipeline M1. The other end of the outlet pipe section M12 serves as the liquid outlet O1 of the server 1, which connects to the outlet pipe section L12 of the first connecting pipeline L1 to allow the liquid cooling medium to flow from the inside of the server 1 to the outside of the server 1. The flow control element 10 can be installed in the liquid inlet section M11 of the first liquid cooling pipeline M1.

[0101] Based on this, the heat generated by the heat source 11 during operation can be transferred to the cold plate 12. The liquid cooling medium in the inlet section M11 of the first liquid cooling pipe M1 flows into the flow channel of the cold plate 12 to absorb the heat from the cold plate 12. Then, the liquid cooling medium that has absorbed the heat from the cold plate 12 flows from the cold plate 12 to the outlet section M12 of the first liquid cooling pipe M1, and then flows from the inside of the server 1 to the outside of the server 1 through the outlet section M12 to carry away the heat from the cold plate 12, ultimately achieving heat dissipation for the heat source 11.

[0102] If server 1 is operating in a low-power scenario, for example, if server 1 is a general-purpose server and the heat generated by heat source 11 is low, the flow rate of the liquid cooling medium in the first liquid cooling pipe M1 can be reduced by the flow control element 10 to avoid the temperature of server 1 being lower than the dew point temperature of the environment where server 1 is located (e.g., the computer room where server 1 is located), thereby avoiding condensation on server 1 due to overcooling.

[0103] If server 1 operates in a high-power scenario, for example, if server 1 is an artificial intelligence server and the heat source 11 generates a high amount of heat, the flow rate of the liquid cooling medium in the first liquid cooling pipe M1 can be increased by the flow control element 10 to ensure effective heat dissipation of the heat source 11.

[0104] When multiple servers 1 with different functions are placed in the same liquid-cooled cabinet, the flow rate of the liquid cooling medium in the first liquid cooling pipe M1 of each server 1 can be adjusted by the flow control element 10 of each server 1, thereby achieving precise temperature control of a single server, ensuring that servers 1 with different power consumption can work at appropriate temperatures, effectively reducing the risk of condensation on the server 1 and improving the disaster recovery capability of the server 1.

[0105] Referring again to Figure 2, in some embodiments of this application, the flow control element 10 may include a circulating pump (as an example of a second pump) or a proportional valve. This application does not impose specific limitations on this, as long as it can control the flow rate of the liquid cooling medium in the first liquid cooling pipeline M1.

[0106] In some implementations, the flow control element 10 includes a circulation pump, whose speed can be adjusted to control the flow rate of the cooling medium in the first liquid cooling pipe M1. Furthermore, the circulation pump can drive the flow of the cooling medium in the first liquid cooling pipe M1, ensuring that the cooling medium continuously absorbs and removes heat from the heat source 11. This ensures that the server 1 can be cooled independently, helping to minimize the liquid cooling failure range of the liquid-cooled cabinet. For example, even if a circulation pump fails, it will only affect the flow of the cooling medium within that server 1, not the entire liquid-cooled cabinet, thus preventing abnormal supply of cooling medium to all servers in the cabinet. Similarly, if a server fails (e.g., leaks), the circulation pump in that server can be shut off for replacement and repair without affecting other servers in the liquid-cooled cabinet.

[0107] In some other implementations, the flow control element 10 includes a proportional valve, which can control the flow rate of the liquid cooling medium in the first liquid cooling line M1 by adjusting the opening of the proportional valve.

[0108] Referring again to Figure 2, in some feasible embodiments, server 1 may also include server control board 13 (as an example of a second control board), which is communicatively connected to flow control element 10 to control flow control element 10, as exemplarily described below.

[0109] In some embodiments of this application, the server control board 13 can monitor the temperature of the server 1 and control the flow control element 10 based on the temperature of the server 1. For example, if the server control board 13 controls the flow control element 10 based on the server 1's temperature being higher than a preset temperature, the flow rate of the liquid cooling medium in the first liquid cooling pipe M1 will increase until the server 1's temperature equals the preset temperature, thereby ensuring that the server 1 can effectively dissipate heat. Alternatively, if the server control board 13 controls the flow control element 10 based on the server 1's temperature being lower than a preset temperature, the flow rate of the liquid cooling medium in the first liquid cooling pipe M1 will decrease until the server 1's temperature is higher than the preset temperature, thereby preventing condensation from forming on the server 1 due to overcooling.

[0110] In some implementations, server 1 may include a temperature sensing component that is communicatively connected to server control board 13. The temperature sensing component can detect the temperature of server 1 and send the detected temperature to server control board 13, so that server control board 13 can monitor the temperature of server 1.

[0111] It should be noted that, depending on the specific structural form of the flow control element 10, the specific implementation method of the server control board 13 controlling the flow control element 10 will also differ. For example, in some implementations, the flow control element 10 may include a circulating pump, and the server control board 13 may control the rotational speed of the circulating pump so that the flow control element 10 controls the flow rate of the liquid cooling medium in the first liquid cooling pipeline M1. In other implementations, the flow control element 10 may also include a proportional valve, and the server control board 13 may control the opening degree of the proportional valve so that the flow control element 10 controls the flow rate of the liquid cooling medium in the first liquid cooling pipeline M1.

[0112] It should also be noted that the temperature of server 1 can be, for example, the temperature of the air inside server 1 or the temperature of the internal components of server 1 (e.g., heat source 11), which will not be elaborated further below.

[0113] It is understood that the above embodiments are merely schematic illustrations of some control schemes of the server control board 13 over the flow control element 10, and do not constitute a limitation of this application. In other embodiments, the server control board 13 may have other control schemes.

[0114] For example, the server control board 13 can also control the flow control element 10 based on other signals (e.g., a temperature signal indicating the temperature of the liquid cooling medium in the first liquid cooling pipe M1).

[0115] For example, the server control board 13 can also send a temperature signal to other controllers (e.g., the controller of the liquid-cooled cabinet where the server 1 is located) to indicate the temperature of the server 1. Then, the other controllers send a control signal to the server control board 13 based on at least one of the temperature signal and other signals (e.g., a status signal indicating the state of the liquid cooling medium in the external connection pipes of the server 1), so that the server control board 13 can control the flow control element 10 according to the control signal.

[0116] It is understood that the structure of server 1 in the embodiment shown in Figure 2 is merely illustrative. In reality, the actual positions and structures of the components in server 1 in this application embodiment are not limited by Figure 2. Furthermore, server 1 may include more or fewer components to achieve other functions. For example, server 1 may also include a leakage sensing component that is communicatively connected to server control board 13, so that server control board 13 can monitor the leakage of liquid cooling medium in the first liquid cooling pipe M1. Alternatively, server 1 may not include cold plate 12; this application does not impose specific limitations on this.

[0117] As mentioned earlier, liquid-cooled server racks rely on external liquid-cooling distribution units to supply liquid cooling media to regulate server temperature. Due to limitations in the performance of the liquid-cooling distribution units, the disaster recovery capabilities of liquid-cooled server racks and the servers within them are limited.

[0118] For example, in some technical solutions, liquid-cooled cabinets rely on external liquid-cooling distribution units to supply the cooling medium. Therefore, liquid-cooled cabinets are significantly affected by these external units, resulting in poor disaster recovery capabilities against external faults. For instance, in some cases, when the external liquid-cooling distribution unit experiences a supply malfunction, the servers inside the cabinet will rapidly overheat and lose power, causing damage. For example, a server can only operate normally at 105°C for 2.3 seconds, and at 115°C, the time from a supply malfunction to power loss is only 5.3 seconds. Furthermore, in other cases, if the cleanliness of the cooling medium supplied by the external liquid-cooling distribution unit is substandard, it can contaminate the servers inside the cabinet.

[0119] In view of this, this application also provides a liquid-cooled cabinet, which has an internal heat exchange unit comprising a first connecting pipe, a second connecting pipe, and a heat exchanger. The first connecting pipe connects to the first liquid cooling pipes inside electronic equipment (e.g., servers or switches) within the cabinet, forming an internal circulation system. The second connecting pipe connects to a second liquid cooling pipe outside the cabinet, forming an external circulation system. The heat exchanger facilitates heat exchange between the first and second connecting pipes to cool the liquid cooling medium within the first connecting pipe, ultimately dissipating heat from the electronic equipment. Because the liquid-cooled cabinet has an independent internal circulation system, it does not rely on external liquid cooling pipes (e.g., liquid cooling pipes connecting to external liquid cooling distribution units) for liquid cooling medium supply, thus reducing the impact of external liquid cooling pipes on the cabinet and improving its resilience to external faults.

[0120] The following describes the implementation of this application in detail, taking a server as an example of an electronic device, with reference to the accompanying drawings.

[0121] Figure 3A shows an architectural diagram of the liquid-cooled cabinet 2 in an embodiment of this application. Figure 3B shows a structural schematic diagram of the liquid-cooled cabinet 2 in an embodiment of this application. Referring to Figure 3A and in conjunction with Figure 3B, the liquid-cooled cabinet 2 includes a cabinet body 20 and a heat exchange unit 21. The heat exchange unit 21 is located inside the cabinet body 20, and as shown in Figure 3B, the heat exchange unit 21 can be located near the bottom of the cabinet body 20. The cabinet body 20 can also be used to accommodate one or more servers (e.g., two, three, four, or five, etc.), and as shown in Figure 3B, servers 1a and 1b can be stacked in the cabinet body 20. The heat exchange unit 21 includes a heat exchanger 210, a first connecting pipe L1, and a second connecting pipe L2 to dissipate heat from the servers inside the cabinet body 20. For ease of description, server 1a is used as an example below.

[0122] Specifically, the first connecting pipe L1 connects to the first liquid cooling pipe (not shown) of server 1a inside the cabinet 20 to supply liquid cooling medium to the first liquid cooling pipe, which is used to absorb heat from the internal components of server 1a. The first connecting pipe L1 and the first liquid cooling pipe together constitute an internal circulation system. In Figure 3A, the arrows marked on the first connecting pipe L1 and the arrows marked next to server 1a indicate the flow direction of the liquid cooling medium in the internal circulation system.

[0123] It should be noted that the specific structure and working principle of the first liquid cooling pipe of server 1a are essentially the same as the specific structure and working principle of the first liquid cooling pipe M1 of server 1 in the embodiment shown in Figure 2 above; the internal components of server 1a are essentially the same as the heat source 11 of server 1 in the embodiment shown in Figure 2 above; the specific process of absorbing the heat of the internal components of server 1a through the liquid cooling medium is essentially the same as the specific process of absorbing the heat of the internal heat source 11 of server 1 through the liquid cooling medium in the embodiment shown in Figure 2 above. Therefore, the relevant descriptions in the embodiment shown in Figure 2 above can be referred to, and will not be repeated here.

[0124] The second connecting pipe L2 connects to the second liquid cooling pipe M2 outside the cabinet 20. The second connecting pipe L2 and the second liquid cooling pipe M2 can together form an external circulation system. In Figure 3A, the arrows marked on the second connecting pipe L2 indicate the flow direction of the liquid cooling medium within the external circulation system. In some implementations, the second liquid cooling pipe M2 can, for example, connect to a liquid cooling distribution unit or cooling tower outside the cabinet 20; this application does not impose specific limitations on this. In some implementations, the second liquid cooling pipe M2 can, for example, partially extend to the bottom of the floor 02 that supports the liquid cooling cabinet 2.

[0125] The first connecting pipe L1 and the second connecting pipe L2 exchange heat through the heat exchanger 210, thereby cooling the liquid cooling medium in the first connecting pipe L1 and ultimately dissipating heat from the server 1a.

[0126] The aforementioned liquid-cooled cabinet 2, by incorporating a heat exchange unit 21, can form an independently operating internal circulation system within the cabinet 20. Therefore, the liquid-cooled cabinet 2 does not need to rely on a second external liquid-cooling pipeline M2 to supply the liquid cooling medium, effectively improving its disaster recovery capability.

[0127] For example, when the liquid supply to the second liquid cooling pipe M2 outside the cabinet 20 is abnormal, the internal circulation system of the liquid-cooled cabinet 2 can operate briefly to prevent the server 1a from rapidly overheating and losing power. This allows for a certain amount of disaster recovery time for the server 1a to perform self-protection or data backup, thus avoiding losses. For instance, the time for the server 1a to operate normally at 105°C can be increased from 2.3s to 1200s, and the time for the server 1a to lose power from a liquid supply abnormality at 115°C can be increased from 5.3s to 1800s.

[0128] For example, the internal circulation system of the liquid-cooled cabinet 2 can supply liquid cooling medium to the first liquid cooling pipe of the server 1a, thereby achieving isolation of the liquid cooling medium. Therefore, when the cleanliness of the liquid cooling medium in the second liquid cooling pipe M2 outside the cabinet 20 is not up to standard, it will not cause contamination to the server 1a, effectively avoiding the problem of liquid cooling medium contamination.

[0129] Secondly, in the aforementioned liquid cooling scheme that relies on an external liquid cooling distribution unit to supply the cooling medium, the internal and external piping of the cabinet must meet material compatibility requirements, and the construction process is a liquid cooling process, which is costly. In this application, however, the cooling medium of the internal circulation system outside the cabinet 20 is isolated from the cooling medium outside the cabinet 20. Therefore, the piping material of the internal circulation system does not need to be compatible with the piping material outside the cabinet 20 (e.g., the second liquid cooling pipe M2), which can effectively reduce the process requirements of the piping. For example, the process can be changed from liquid cooling to HVAC technology, effectively reducing costs.

[0130] Finally, in the aforementioned liquid cooling schemes that rely on external liquid cooling distribution units to supply the liquid cooling medium, it is difficult to analyze the causes of failures, and the responsibility interface is unclear. For example, when the liquid-cooled cabinet malfunctions, it is difficult to distinguish whether the malfunction is caused by damage to the components within the cabinet itself, or by contamination of the liquid cooling medium supplied by the external liquid cooling pipes, leading to component damage and subsequent malfunction. In this application, however, the liquid cooling medium in the internal circulation system outside the cabinet 20 is isolated from the liquid cooling medium outside the cabinet 20. Therefore, it is possible to distinguish between malfunctions caused by the liquid-cooled cabinet itself and malfunctions caused by the external liquid cooling pipes (e.g., the second liquid cooling pipe M2), thus clarifying the responsibility interface.

[0131] In some embodiments of this application, the liquid cooling medium in the internal circulation system and the liquid cooling medium in the external circulation system may be different. For example, the liquid cooling medium in the internal circulation system may be a working fluid (e.g., an alcohol-based solution, an ester-based coolant, mineral oil, or silicone oil), while the liquid cooling medium in the external circulation system may be water. However, this application is not limited to this. In other embodiments of this application, the liquid cooling medium in the internal circulation system and the liquid cooling medium in the external circulation system may be the same. For example, both the liquid cooling medium in the internal circulation system and the liquid cooling medium in the external circulation system may be water.

[0132] In some embodiments of this application, the cabinet 20 of the liquid-cooled cabinet 2 is used to accommodate multiple servers. The flow rate of the liquid cooling medium supplied by the first connecting pipe L1 to the first liquid cooling pipe of each server is different, thereby enabling precise temperature control of a single server, meeting the working requirements of servers with different power consumption, effectively reducing the risk of condensation on the server, and improving the disaster recovery capability of the server.

[0133] Taking servers 1a and 1b in the embodiments shown in Figures 3A and 3B as examples, server 1a can be an artificial intelligence server, and server 1b can be a general-purpose server. The power consumption of server 1a is higher than that of server 1b. Therefore, the flow rate of the liquid cooling medium supplied by the first connecting pipe L1 to the first liquid cooling pipe of server 1a can be greater than the flow rate of the liquid cooling medium supplied by the first connecting pipe L1 to the first liquid cooling pipe of server 1b. On the one hand, this ensures effective heat dissipation for server 1a; on the other hand, it prevents condensation from forming on server 1b due to overcooling.

[0134] In some embodiments of this application, servers 1a and 1b may each include flow control elements 10a and 10b to independently control the flow rate of the liquid cooling medium in the first liquid cooling pipelines of servers 1a and 1b, thereby causing the flow rates of the liquid cooling medium supplied by the first connecting pipeline L1 to the first liquid cooling pipelines of servers 1a and 1b to be different, achieving precise temperature control for a single server. The specific structure and working principle of the flow control elements 10a and 10b of servers 1a are substantially the same as those of the flow control element 10 of server 1 in the embodiment shown in Figure 2. That is, the flow control elements 10a and 10b of servers 1a and 1b may include a circulating pump or a proportional valve; this application does not impose specific limitations on this, as long as it can control the flow rate of the liquid cooling medium in the first liquid cooling pipeline.

[0135] Taking the flow control element 10a of server 1a as an example, in some implementations, the flow control element 10a includes a circulation pump, which can control the flow rate of the liquid cooling medium in the first liquid cooling pipeline by adjusting the speed of the circulation pump. Furthermore, the circulation pump can also drive the flow of the liquid cooling medium in the first liquid cooling pipeline, so that the liquid cooling medium in the first liquid cooling pipeline can continuously absorb and remove heat from the internal components of server 1a, thereby ensuring that server 1a can be cooled independently, which helps to reduce the liquid cooling failure range of the liquid cooling cabinet. For example, even if a circulation pump fails, it will only affect the flow state of the liquid cooling medium inside server 1a, and will not affect the flow state of the liquid cooling medium in the entire liquid cooling cabinet 2, thus avoiding abnormal liquid cooling medium supply to the servers (e.g., server 1b) in the entire liquid cooling cabinet 2. As another example, when server 1a fails (e.g., leakage), the circulation pump in server 1a can be turned off for replacement and repair without affecting other servers (e.g., server 1b) in the liquid cooling cabinet.

[0136] In some other implementations, the flow control element 10a includes a proportional valve, the flow rate of the liquid cooling medium in the first liquid cooling line M1 can be controlled by adjusting the opening of the proportional valve.

[0137] Based on the embodiment of the flow control element 10a including a proportional valve, an additional circulation pump is required in the internal circulation system to drive the liquid cooling medium to circulate within the internal circulation system. For example, a circulation pump can be installed on the first connecting pipe L1, or it can be installed on the first liquid cooling pipe of the server 1a. This application does not impose any specific limitations on this.

[0138] For ease of description, the following will continue to use server 1a as an example to introduce the specific structure of each device in heat exchange unit 21 and its connection relationship with server 1a.

[0139] Figure 4 shows a partial structure of the heat exchange unit 21 in an embodiment of this application. Referring to Figures 3A to 4, in some embodiments of this application, the first connecting pipe L1 of the heat exchange unit 21 includes an inlet pipe section L11 and an outlet pipe section L12. The inlet pipe section L11 is connected to the liquid inlet of the server 1a to supply liquid cooling medium to the first liquid cooling pipe of the server 1a; the outlet pipe section L12 is connected to the liquid outlet of the server 1a so that the liquid cooling medium in the first liquid cooling pipe of the server 1a can flow back to the first connecting pipe L1 for cooling. The liquid inlet and outlet of the server 1a are substantially the same as the liquid inlet I1 and outlet O1 of the server 1 in the embodiment shown in Figure 2 above, therefore, the relevant description in the embodiment shown in Figure 2 above can be referred to, and will not be repeated here.

[0140] In some implementations, a manifold L3 can be used to connect the inlet section L11 of the first connecting pipe L1 to the inlet of server 1a, and the outlet section L12 of the first connecting pipe L1 to the outlet of server 1a. Specifically, one end of the inlet section L11 of the first connecting pipe L1 forms an inlet I2 of the heat exchange unit 21, which is connected to the inlet of server 1a via the inlet section (not shown) of the manifold L3. One end of the outlet section L12 of the first connecting pipe L1 forms an outlet O2 of the heat exchange unit 21, which is connected to the outlet of server 1a via the outlet section (not shown) of the manifold L3. For example, the manifold L3, inlet I2, and outlet O2 can be connected via sanitary flanges, enabling rapid sanitary flange installation in a factory environment, thereby effectively improving installation efficiency and connection reliability.

[0141] In some implementations, the inlet I2 and outlet O2 can each be constructed from a single 50mm diameter pipe (i.e., a DN50 pipe) to ensure sufficient liquid cooling medium can be transported. Alternatively, in other alternative implementations, the inlet I2 and outlet O2 can each be constructed from two 25mm diameter pipes (i.e., DN25 pipes). This application does not impose specific limitations on this, as long as the actual operational requirements are met.

[0142] In some embodiments of this application, the flow resistance of the liquid cooling medium in the first connecting pipe L1 of the heat exchange unit 21 can be less than 100 kPa, for example, 90 kPa, 80 kPa, 70 kPa, or 60 kPa. This helps to increase the flow rate of the liquid cooling medium in the first connecting pipe L1 and reduce the pressure loss of the liquid cooling medium during flow, thereby reducing the energy required to pump the liquid cooling medium in the first connecting pipe L1 and thus reducing energy consumption.

[0143] Referring again to Figures 3A to 4, in some embodiments of this application, the second connecting pipe L2 of the heat exchange unit 21 includes an inlet pipe section L21 and an outlet pipe section L22. The second liquid cooling pipe M2 outside the cabinet 20 includes an inlet pipe section M21 and an outlet pipe section M22.

[0144] In this system, one end of the liquid inlet section L21 of the second connecting pipe L2 serves as another liquid inlet I3 of the heat exchange unit 21. Liquid inlet I3 connects to the liquid inlet section M21 of the second liquid cooling pipe M2 to obtain the liquid cooling medium. The other end of the liquid inlet section L21 of the second connecting pipe L2 is connected to the liquid inlet of the heat exchanger 210. The liquid outlet of the heat exchanger 210 is connected to one end of the liquid outlet section L22 of the second connecting pipe L2. The other end of the liquid outlet section L22 of the second connecting pipe L2 serves as another liquid outlet O3 of the heat exchange unit 21. Liquid outlet O3 connects to the liquid outlet section M22 of the second liquid cooling pipe M2, allowing the liquid cooling medium in the second connecting pipe L2 to flow back to the second liquid cooling pipe M2 for cooling.

[0145] It is understood that the structure of inlet I3 is essentially the same as that of inlet I2, and the structure of outlet O3 is essentially the same as that of outlet O2. Therefore, you can refer to the description of inlet I2 and outlet O2, which will not be repeated here.

[0146] In some implementations, the inlet I3 and outlet O3 can be installed, for example, via a duckbill connector 220, to ensure that the inlet I3 and outlet O3 can reliably transmit the liquid cooling medium.

[0147] In some embodiments of this application, the heat exchanger 210 of the heat exchange unit 21 may be, for example, a plate heat exchanger, a tubular heat exchanger, or a spiral plate heat exchanger. This application does not impose specific limitations on this, as long as heat exchange between the first connecting pipe L1 and the second connecting pipe L2 can be achieved.

[0148] In some embodiments of this application, the heat exchanger 210 can achieve an approximation of 1°C, resulting in excellent heat exchange performance. For example, under a heat load of 140kW and a flow rate of 210lpm, the temperature of the liquid cooling medium in the outlet section L12 of the first connecting pipe L1 can be 36°C, and the temperature of the liquid cooling medium in the inlet section L21 of the second connecting pipe L2 can be 35°C; under a heat load of 80kW and a flow rate of 120lpm, the temperature of the liquid cooling medium in the outlet section L12 of the first connecting pipe L1 can also be 36°C, and the temperature of the liquid cooling medium in the inlet section L21 of the second connecting pipe L2 can also be 35°C.

[0149] Based on the excellent heat exchange performance of the heat exchanger 210, the heat dissipation effect on the server 1a can be effectively improved. For example, in the liquid cooling scheme that relies on the external liquid cooling distribution unit to supply the liquid cooling medium, the temperature of the liquid cooling medium supplied to the server is 40°C, while in the liquid cooling cabinet 2 provided in this application, the temperature of the liquid cooling medium supplied to the server 1a can be reduced from 40°C to 36°C.

[0150] Various devices can be installed in the heat exchange unit 21 to control and monitor the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. The following is an exemplary description with reference to the accompanying drawings.

[0151] To make the description clear, the components related to the first connecting pipe L1 will be introduced first.

[0152] Referring again to Figures 3A and 4, in some embodiments of this application, the heat exchange unit 21 may include a liquid replenishment tank 211. The liquid replenishment tank 211 is connected to the first connecting pipe L1 and stores liquid cooling medium, thereby supplying liquid cooling medium to the first connecting pipe L1. This allows the liquid cooling medium to circulate within the internal circulation system formed by the first connecting pipe L1 and the first liquid cooling pipe of server 1a, ultimately achieving the heat dissipation function of the internal circulation system. Furthermore, during the heat dissipation process of the internal circulation system on server 1a, the amount of liquid cooling medium may decrease due to evaporation. At this time, the liquid replenishment tank 211 can also replenish liquid cooling medium to the first connecting pipe L1, thereby ensuring sufficient liquid cooling medium in the internal circulation system and maintaining the heat dissipation effect and safety of the internal circulation system.

[0153] In some implementations, the volume of the replenishment tank 211 can be greater than 3L, for example, 4L, 5L, or 6L, to meet the amount of liquid cooling medium used in the internal circulation system. For example, the amount of liquid cooling medium used in the internal circulation system can be greater than 12L, for example, 13L, 14L, 15L, or 16L, to ensure that heat dissipation requirements are met.

[0154] In this embodiment, the replenishment tank 211 is connected to the inlet section L11 of the first connecting pipe L1. In other embodiments, the replenishment tank 211 may also be connected to the outlet section L12 of the first connecting pipe L1. This application does not impose specific restrictions on this, as long as the replenishment tank 211 can perform the above-mentioned replenishment function.

[0155] In some embodiments of this application, a liquid level sensing component 2111 may be provided in the replenishment tank 211. The liquid level sensing component 2111 can monitor the liquid level of the liquid cooling medium in the replenishment tank 211, so that the liquid cooling medium can be automatically replenished by the liquid replenishment actuator when the liquid level is too low, or the operator can manually replenish the liquid cooling medium in the replenishment tank 211 to ensure that the liquid cooling medium in the replenishment tank 211 is sufficient.

[0156] In some implementations, the level sensing assembly 2111 may include multiple (e.g., two, three, four, or five) level sensors. This improves the operational reliability of the level sensing assembly 2111, helping to ensure its normal operation throughout its entire lifespan (e.g., a five-year lifespan) and achieving maintenance-free operation. For example, if one level sensor fails, the others can immediately take over, ensuring the continued normal operation of the level sensing assembly 2111 without disassembling the liquid-cooled cabinet 2 for maintenance.

[0157] Referring again to Figures 3A and 4, in some embodiments of this application, the heat exchange unit 21 may further include a replenishment pump 212 (as an example of a first pump). The replenishment pump 212 is located between the replenishment tank 211 and the first connecting pipe L1. The replenishment pump 212 is used to drive the liquid cooling medium in the replenishment tank 211 to flow to the first connecting pipe L1, thereby enabling the replenishment tank 211 to supply liquid cooling medium to the first connecting pipe L1. This allows the liquid cooling medium to circulate within the internal circulation system formed by the first connecting pipe L1 and the first liquid cooling pipe inside the server 1a, ultimately achieving the heat dissipation function of the internal circulation system.

[0158] In some embodiments of this application, the heat exchange unit 21 may include an expansion tank 213. The expansion tank 213 is connected to the first connecting pipe L1 and is used to stabilize pressure fluctuations in the internal circulation system. For example, when the volume of the liquid cooling medium in the internal circulation system increases due to temperature rise, the expansion tank 213 can absorb the excess liquid cooling medium through the first connecting pipe L1 to prevent the pressure of the liquid cooling medium in the internal circulation system from rising too quickly; when the volume of the liquid cooling medium in the internal circulation system decreases due to temperature drop, the expansion tank 213 can release the liquid cooling medium into the first connecting pipe L1, thereby replenishing the liquid cooling medium in the internal circulation system and preventing the pressure of the liquid cooling medium in the internal circulation system from dropping too quickly.

[0159] In some embodiments of this application, the heat exchange unit 21 may include a temperature sensing component and / or a pressure sensing component, which are disposed on the first connecting pipe L1 to detect the state parameters of the liquid cooling medium in the first connecting pipe L1.

[0160] For example, in some implementations, the heat exchange unit 21 may include a temperature sensing component 214a (as an example of a second temperature sensing component), which is disposed on the liquid inlet section L11 of the first connecting pipe L1. The temperature sensing component 214a is used to detect the temperature of the liquid cooling medium in the liquid inlet section L11. In this way, the temperature of the liquid cooling medium in the liquid inlet section L11 can be monitored in real time, so as to flexibly adjust the state parameters of the liquid cooling medium in the liquid inlet section L11 according to actual needs, such as temperature and flow rate, to ensure effective heat dissipation of the server 1a and optimize energy efficiency; and it can also detect abnormal temperature of the liquid cooling medium in the liquid inlet section L11 in a timely manner, reduce losses, and help maintain the long-term stable operation of the internal circulation system.

[0161] For example, in some implementations, the heat exchange unit 21 may include a temperature sensing component 214b (as another example of a second temperature sensing component). The temperature sensing component 214b is disposed on the liquid outlet section L12 of the first connecting pipe L1. The temperature sensing component 214b is used to detect the temperature of the liquid cooling medium in the liquid outlet section L12. In this way, the temperature of the liquid cooling medium in the liquid outlet section L12 can be monitored in real time, so as to flexibly adjust the state parameters of the liquid cooling medium in the liquid outlet section L12 according to actual needs, such as temperature and flow rate, to ensure effective heat dissipation of server 1a and optimize energy efficiency; and it can also detect abnormal temperature of the liquid cooling medium in the liquid outlet section L12 in a timely manner, reduce losses, and help maintain the long-term stable operation of the internal circulation system.

[0162] For example, in some implementations, the heat exchange unit 21 may include a pressure sensing component 215a, which is disposed on the liquid inlet section L11 of the first connecting pipe L1. The pressure sensing component 215a is used to detect the pressure of the liquid cooling medium in the liquid inlet section L11. In this way, the pressure of the liquid cooling medium in the liquid inlet section L11 can be monitored in real time, preventing safety hazards caused by excessively high or low pressure, and helping to maintain the long-term stable operation of the internal circulation system.

[0163] For example, in some implementations, the heat exchange unit 21 may include a pressure sensing component 215b. The pressure sensing component 215b is located on the liquid outlet section L12 of the first connecting pipe L1. The pressure sensing component 215b is used to detect the pressure of the liquid cooling medium within the liquid outlet section L12. In this way, the pressure of the liquid cooling medium within the liquid outlet section L12 can be monitored in real time, preventing safety hazards caused by excessively high or low pressure, and helping to maintain the long-term stable operation of the internal circulation system.

[0164] In some embodiments of this application, the temperature sensing component in the heat exchange unit 21 may include multiple temperature sensors arranged sequentially along the extension direction of the first connecting pipe L1. By providing multiple temperature sensors, the operational reliability of the temperature sensing component can be improved, thereby helping to ensure that the temperature sensing component operates normally throughout its entire life cycle (e.g., a five-year life cycle), achieving maintenance-free operation. For example, if one temperature sensor fails, the other temperature sensors can immediately take over, ensuring that the temperature sensing component can continue to operate normally without disassembling the liquid cooling cabinet 2 for maintenance.

[0165] For example, in the embodiment shown in Figure 3A, temperature sensing components 214a and 214b may each include three temperature sensors (as an example of a second temperature sensor), and the three temperature sensors are arranged sequentially along the extension direction of the first connecting pipe L1. In other embodiments, temperature sensing components 214a and 214b may also include more or fewer temperature sensors (e.g., two, four, or five, etc.). This application does not impose specific limitations on this, as long as it meets the actual usage requirements.

[0166] In some embodiments of this application, the pressure sensing component in the heat exchange unit 21 may include multiple pressure sensors arranged sequentially along the extension direction of the first connecting pipe L1. By providing multiple pressure sensors, the operational reliability of the pressure sensing component can be improved, thereby helping to ensure that the pressure sensing component operates normally throughout its entire life cycle (e.g., a five-year life cycle), achieving maintenance-free operation of the pressure sensors. For example, if one pressure sensor fails, the other pressure sensors can immediately take over, ensuring that the pressure sensing component can continue to operate normally without disassembling the liquid cooling cabinet 2 for maintenance of the pressure sensing component.

[0167] For example, in the embodiment shown in Figure 3A, pressure sensing components 215a and 215b may each include three pressure sensors. In other embodiments, pressure sensing components 215a and 215b may also include more or fewer (e.g., two, four, or five) pressure sensors. This application does not impose specific limitations on this, as long as it meets the actual usage requirements.

[0168] After introducing the components related to the first connecting pipe L1 in the heat exchange unit 21, the components related to the second connecting pipe L2 will be introduced below with reference to the accompanying drawings.

[0169] Referring again to Figures 3A and 4, in some embodiments of this application, the heat exchange unit 21 may include a filter assembly 216. The filter assembly 216 is disposed on the liquid inlet section L21 of the second connecting pipe L2. The filter assembly 216 is used to filter impurities in the liquid cooling medium within the liquid inlet section L21, further reducing the reliance of the liquid cooling cabinet 2 on external pipes (e.g., the second liquid cooling pipe M2), expanding the application scenarios of the liquid cooling cabinet 2, and improving the disaster recovery capability of the liquid cooling cabinet 2. For example, when the cleanliness of the liquid cooling medium supplied from the liquid inlet section M21 of the second liquid cooling pipe M2 to the liquid inlet section L21 of the second connecting pipe L2 is substandard, the filter assembly 216 can filter the liquid cooling medium to improve the cleanliness of the liquid cooling medium flowing to the heat exchanger 210, thereby reducing the risk of contamination of the heat exchanger 210.

[0170] In some implementations, the inlet section L21 of the second connecting pipe L2 includes a first branch L211 and a second branch L212 connected in parallel. The filter assembly 216 may include a first filter screen 2161 and a second filter screen 2162. The first filter screen 2161 is disposed on the first branch L211, and the second filter screen 2162 is disposed on the second branch L212. A valve (not shown) is provided on one of the first branch L211 and the second branch L212.

[0171] By setting up a first filter screen 2161 and a second filter screen 2162, the operational flexibility of the filter assembly 216 can be effectively improved to meet different usage needs. For example, the first filter screen 2161 can be used as the primary filter screen, and the second filter screen 2162 as a backup filter screen. Specifically, a valve is installed on the second branch L212. Normally, the valve is closed to activate the first filter screen 2161 and deactivate the second filter screen 2162. When the first filter screen 2161 malfunctions, the valve can be opened to activate the second filter screen 2162, thus ensuring that the filter assembly 216 can continue to operate normally without needing to replace it. Alternatively, both the first filter screen 2161 and the second filter screen 2162 can be used as primary filters. Specifically, a valve is installed on the second branch L212. Normally, the valve is opened to simultaneously activate both the first filter screen 2161 and the second filter screen 2162, thereby meeting the filtration requirements for high flow rates.

[0172] It is understood that Figure 3A above is merely a schematic illustration of the structure of a filter assembly 216 and does not constitute a limitation of this application. In other embodiments, the filter assembly 216 may also include more or fewer filters, such as one, three, four, or five.

[0173] It is also understood that Figure 3A above is merely a schematic illustration of one arrangement of the filter assembly 216 on the second connecting pipe L2 and does not constitute a limitation of this application. In some other embodiments, the filter assembly 216 may also be disposed in other pipe sections of the second connecting pipe L2 (e.g., the liquid outlet pipe section L22). In other embodiments, there may be multiple filter assemblies 216, which are respectively disposed in different pipe sections of the second connecting pipe L2. For example, there may be two filter assemblies 216, which may be respectively disposed in the liquid inlet pipe section L21 and the liquid outlet pipe section L22 of the second connecting pipe L2.

[0174] In some embodiments of this application, the heat exchange unit 21 may further include a proportional valve 217. The proportional valve 217 is disposed on the liquid inlet section L21 of the second connecting pipe L2. By adjusting the opening degree of the proportional valve 217, the flow rate of the liquid cooling medium in the liquid inlet section L21 can be adjusted to meet the actual heat dissipation requirements.

[0175] It is understood that Figure 3A above is merely a schematic illustration of one arrangement of the proportional valve 217 on the second connecting pipe L2 and does not constitute a limitation of this application. In some other embodiments, the proportional valve 217 may also be located in other pipe sections of the second connecting pipe L2 (e.g., the liquid outlet pipe section L22). In other embodiments, there may be multiple proportional valves 217, which are respectively located in different pipe sections of the second connecting pipe L2. For example, there may be two proportional valves 217, which may be located in the liquid inlet pipe section L21 and the liquid outlet pipe section L22 of the second connecting pipe L2, respectively.

[0176] In some embodiments of this application, the heat exchange unit 21 may also include a temperature sensing component and / or a pressure sensing component, which are disposed on the second connecting pipe L2 to detect the state parameters of the liquid cooling medium in the second connecting pipe L2.

[0177] For example, in some implementations, the heat exchange unit 21 may include a temperature sensing component 214c (as an example of a first temperature sensing component). The temperature sensing component 214c is disposed on the liquid inlet section L21 of the second connecting pipe L2. The temperature sensing component 214c is used to detect the temperature of the liquid cooling medium in the liquid inlet section L21. In this way, the temperature of the liquid cooling medium in the liquid inlet section L21 can be monitored in real time, so as to flexibly adjust the state parameters of the liquid cooling medium in the liquid inlet section L21 according to actual needs, such as temperature and flow rate, to ensure effective heat dissipation of server 1a and optimize energy efficiency; and it can also detect abnormal temperature of the liquid cooling medium in the liquid inlet section L21 in a timely manner, reduce losses, and help maintain the long-term stable operation of the internal circulation system.

[0178] Exemplarily, the temperature sensing component 214c may include multiple temperature sensors (as an example of a first temperature sensor), such as two, three, four, or five temperature sensors. The multiple temperature sensors are arranged sequentially along the extension direction of the second connecting conduit L2. It is understood that the specific structure and working principle of the temperature sensing component 214c are substantially the same as those of the temperature sensing components (e.g., temperature sensing components 214a and 214b) disposed on the first connecting conduit L1 in the above embodiments. The beneficial effects corresponding to the temperature sensing component 214c are also substantially the same as those corresponding to the temperature sensing components disposed on the first connecting conduit L1 in the above embodiments. Therefore, the description of the temperature sensing components disposed on the first connecting conduit L1 in the above embodiments can be referred to, and will not be repeated here.

[0179] It is understood that Figure 3A above is merely a schematic illustration of the layout of a temperature sensing component 214c on the second connecting pipe L2 and does not constitute a limitation of this application. In some other embodiments, the temperature sensing component 214c may also be disposed in other pipe sections of the second connecting pipe L2 (e.g., the liquid outlet pipe section L22). In other embodiments, there may be multiple temperature sensing components 214c, which are respectively disposed in different pipe sections of the second connecting pipe L2. For example, there may be two temperature sensing components 214c, which may be disposed in the liquid inlet pipe section L21 and the liquid outlet pipe section L22 of the second connecting pipe L2, respectively.

[0180] For example, in some implementations, the heat exchange unit 21 may include pressure sensing components 215c and 215d. Pressure sensing components 215c and 215d are located upstream and downstream of the filter assembly 216, respectively. The liquid cooling medium in the second connecting pipe L2 flows from upstream to downstream of the filter assembly 216 via the filter assembly 216.

[0181] The pressure sensing component 215c is used to detect the pressure of the liquid cooling medium upstream of the filter component 216; the pressure sensing component 215d is used to detect the pressure of the liquid cooling medium downstream of the filter component 216. This allows for real-time monitoring of the pressure difference between the upstream and downstream liquid cooling media of the filter component 216, enabling timely detection of malfunctions and minimizing losses. For example, when the filter component 216 becomes increasingly clogged with impurities, the pressure of the upstream liquid cooling medium gradually increases, while the pressure of the downstream liquid cooling medium relatively decreases. This results in an increased pressure difference between the upstream and downstream liquid cooling media. Based on this pressure difference change, the degree of clogging in the filter component 216 can be determined, allowing for timely maintenance of the filter component 216.

[0182] For example, pressure sensing components 215c and 215d may include multiple pressure sensors (e.g., two, three, four, or five), which are arranged sequentially along the extension direction of the second connecting pipe L2. It is understood that the specific structure and working principle of pressure sensing components 215c and 215d are substantially the same as those of the pressure sensing components (e.g., pressure sensing components 215a and 215b) disposed on the first connecting pipe L1 in the above embodiments. The beneficial effects of pressure sensing components 215c and 215d are also substantially the same as those of the pressure sensing components disposed on the first connecting pipe L1 in the above embodiments. Therefore, the description of the pressure sensing components disposed on the first connecting pipe L1 in the above embodiments can be referred to, and will not be repeated here.

[0183] Referring again to Figures 3A and 4, in some feasible embodiments, the heat exchange unit 21 may include a heat exchange unit control board 218 (as an example of a first control board). The heat exchange unit control board 218 is used to monitor the state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2, and to control the proportional valve 217 according to the state parameters, as exemplarily described below.

[0184] In some embodiments of this application, the state parameters may include the temperature of the liquid cooling medium in the first connecting pipe L1. The heat exchange unit control board 218 can compare the temperature of the liquid cooling medium in the first connecting pipe L1 with the dew point temperature of the environment where the liquid cooling cabinet 2 is located (e.g., the computer room where the liquid cooling cabinet 2 is located), and adjust the opening of the proportional valve 217 based on the fact that the temperature of the liquid cooling medium in the first connecting pipe L1 is lower than the dew point temperature, so as to change the flow rate of the liquid cooling medium in the second connecting pipe L2, thereby changing the heat exchange efficiency between the first connecting pipe L1 and the second connecting pipe L2, and thus making the temperature of the liquid cooling medium in the first connecting pipe L1 higher than the dew point temperature (e.g., at least 3°C ​​higher than the dew point temperature), ultimately preventing the server 1 from condensing due to overcooling.

[0185] In this way, the liquid-cooled cabinet 2 can avoid the risk of condensation on its own without relying on other equipment (such as computer room humidity control, air conditioning and liquid cooling distribution unit, etc.) to achieve condensation warning, thereby effectively improving the disaster recovery capability of the liquid-cooled cabinet 2.

[0186] In some implementations, a proportional-integral-derivative (PID) control mode can be used to adjust the opening of the proportional valve 217, thereby controlling the temperature of the liquid cooling medium in the first connecting pipe L1 to be higher than the dew point temperature of the environment where the liquid cooling cabinet 2 is located. The PID control mode can adjust the control quantity according to the real-time difference between the set value and the actual output value, resulting in high control accuracy.

[0187] In some implementations, the temperature of the liquid cooling medium in the first connecting pipe L1 can be, for example, the temperature of the liquid cooling medium in the liquid inlet section L11 of the first connecting pipe L1.

[0188] In some implementations, the dew point temperature can be calculated by the heat exchange unit control board 218 based on the humidity of the environment where the liquid-cooled cabinet 2 is located. Alternatively, in other implementations, the dew point temperature can be a preset temperature, such as a temperature value preset based on historical data or experience; this application does not limit this.

[0189] It is understood that the above embodiments are merely schematic illustrations of a portion of the control scheme of the heat exchange unit control board 218 relative to the proportional valve 217, and do not constitute a limitation of this application. In other embodiments, the heat exchange unit control board 218 may have other control schemes.

[0190] For example, the heat exchange unit control board 218 can also control the proportional valve 217 based on other state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2 (e.g., the pressure of the liquid cooling medium in the first connecting pipe L1, the temperature and pressure of the liquid cooling medium in the second connecting pipe L2, etc.).

[0191] For example, the heat exchange unit control board 218 can also send a status signal to other controllers (e.g., the controller of the liquid cooling cabinet 2) to indicate the status of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2 according to the status parameters of the liquid cooling medium. Then, the other controllers send a control signal to the heat exchange unit control board 218 according to at least one of the status signal and other signals (e.g., the temperature signal indicating the temperature of the server 1a), so that the server control board 13 can control the flow control element 10 according to the control signal.

[0192] In some embodiments of this application, the heat exchange unit control board 218 can be communicatively connected to the sensing components provided on the first connecting pipe L1 and the second connecting pipe L2 to obtain the data detected by each sensing component, thereby monitoring the state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2.

[0193] For example, in some implementations, the heat exchange unit control board 218 is communicatively connected to temperature sensing components 214a-214c and pressure sensing components 215a-215d. In this way, the heat exchange unit control board 218 can monitor the temperature of the liquid cooling medium in the inlet section L11 of the first connecting pipe L1 through the temperature sensing component 214a, the temperature of the liquid cooling medium in the outlet section L12 of the first connecting pipe L1 through the temperature sensing component 214b, the temperature of the liquid cooling medium in the inlet section L21 of the second connecting pipe L2 through the temperature sensing component 214c, the pressure of the liquid cooling medium in the inlet section L11 of the first connecting pipe L1 through the pressure sensing component 215a, the pressure of the liquid cooling medium in the outlet section L12 of the first connecting pipe L1 through the pressure sensing component 215b, the pressure of the liquid cooling medium upstream of the filter component 216 through the pressure sensing component 215c, and the pressure of the liquid cooling medium downstream of the filter component 216 through the pressure sensing component 215d.

[0194] In some embodiments of this application, the heat exchange unit control board 218 can also be used to monitor other status parameters to achieve other functions.

[0195] For example, in some implementations, the heat exchange unit control board 218 can communicate with a humidity sensing component 03 located in the environment where the liquid-cooled cabinet 2 is located (e.g., the computer room where the liquid-cooled cabinet 2 is located) to obtain humidity data detected by the humidity sensing component 03, thereby monitoring the humidity of the environment where the liquid-cooled cabinet 2 is located. In this way, the heat exchange unit control board 218 can calculate the dew point temperature of the environment where the liquid-cooled cabinet 2 is located based on the humidity, so as to take anti-condensation measures.

[0196] For example, in some implementations, the heat exchange unit control board 218 can communicate with the liquid level sensor component 2111 located on the replenishment tank 211 to obtain the liquid level data detected by the liquid level sensor component 2111, thereby monitoring the liquid level of the liquid cooling medium in the replenishment tank 211. Thus, when the liquid level is too low, the heat exchange unit control board 218 can control the replenishment tank 211 to automatically replenish the liquid cooling medium via the replenishment actuator, or remind the operator to manually replenish the liquid cooling medium in the replenishment tank 211 to ensure that the liquid cooling medium in the replenishment tank 211 is sufficient.

[0197] For example, in some implementations, the heat exchange unit 21 includes a leakage sensing component, and the heat exchange unit control board 218 can be communicatively connected to the leakage sensing component so that the heat exchange unit control board 218 can monitor the leakage of the liquid cooling medium in the heat exchange unit 21.

[0198] Referring again to Figure 4, in some embodiments of this application, the heat exchange unit 21 may further include a communication port 219. The communication port 219 is used to connect the heat exchange unit 21 with other devices so that the heat exchange unit 21 can transmit data with other devices.

[0199] After introducing the specific structure of the heat exchange unit 21, the following section will continue to describe, with reference to the accompanying drawings, an exemplary layout of the heat exchange unit 21 and its internal components in the cabinet 20 of the liquid cooling cabinet 2.

[0200] Referring again to Figures 3B and 4, in some embodiments of this application, the cabinet 20 of the liquid-cooled cabinet 2 includes a front wall 201 and a rear wall 202. The front wall 201 may be, for example, a wall facing the operator installing the server 1a when the liquid-cooled cabinet 2 is operating normally, while the rear wall 202 is the wall opposite to the front wall 201. An opening 2011 is provided on the front wall 201 for exposing the heat exchange unit 21 to the outside.

[0201] In this way, online operation and maintenance of heat exchange unit 21 can be achieved through opening 2011, that is, the maintenance method of heat exchange unit 21 is front maintenance. The front maintenance method makes it convenient for operators to maintain and repair heat exchange unit 21, the operation is simple, and it does not restrict the installation of liquid cooling cabinet 2. For example, the rear wall 202 of cabinet 20 of liquid cooling cabinet 2 can be installed against the wall or embedded in the wall, which saves more space.

[0202] In some implementations, a cabinet door can also be provided on the opening 2011, which can switch between an open and closed state. When the cabinet door is open, the heat exchange unit 21 can be exposed to the outside through the opening 2011, so that the operator can maintain and repair the heat exchange unit 21; when the cabinet door is closed, the heat exchange unit 21 can be covered, so that the appearance of the liquid cooling cabinet 2 is more aesthetically pleasing.

[0203] Based on the opening 2011 in the embodiments shown in Figures 3B and 4, the components in the heat exchange unit 21 that require maintenance can be positioned close to the front wall 201. That is, the distance between the component and the rear wall 202 is greater than the distance between the component and the front wall 201. In this way, the component can be more easily accessed through the opening 2011, facilitating maintenance and repair.

[0204] For example, as shown in Figure 4, the distance between the replenishment pump 212 and the rear wall 202 is greater than the distance between the replenishment pump 212 and the front wall 201; the distance between the filter assembly 216 and the rear wall 202 is greater than the distance between the filter assembly 216 and the front wall 201; the distance between the heat exchange unit control board 218 and the rear wall 202 is greater than the distance between the heat exchange unit control board 218 and the front wall 201, and the heat exchange unit control board 218 is located between the replenishment pump 212 and the front wall 201. That is, the replenishment pump 212, the filter assembly 216, and the heat exchange unit control board 218 are closer to the front wall 201 than other devices (e.g., the replenishment tank 211, the expansion tank 213, and the proportional valve 217). In this way, online operation and maintenance of the replenishment pump 212, the filter assembly 216, and the heat exchange unit control board 218 can be achieved.

[0205] For example, Figure 5 shows a schematic diagram of the maintenance replenishment pump 212 in the heat exchange unit 21 of this application embodiment. Referring to Figure 5 and in conjunction with Figure 4, since the replenishment pump 212 is located close to the front wall 201 of the cabinet 20, and a heat exchange unit control board 218 is provided between the replenishment pump 212 and the front wall 201, the heat exchange unit control board 218 can be removed first through the opening 2011, thereby exposing the replenishment pump 212 to the outside. Then, the replenishment pump 212 can be removed from the cabinet 20 in the direction indicated by the arrow for replacement.

[0206] In some implementations, the replenishment pump 212 can be installed in the housing via a blind-fit quick-connect coupling, facilitating online replacement of the replenishment pump 212 with simple and convenient operation.

[0207] Figure 6 shows a schematic diagram of the maintenance of the heat exchange unit control board 218 in the heat exchange unit 21 according to an embodiment of this application. Referring to Figure 6 and in conjunction with Figure 4, the heat exchange unit control board 218 can be exposed to the outside through the opening 2011. Then, the heat exchange unit control board 218 can be removed from the cabinet 20 in the direction indicated by the arrow for replacement.

[0208] It is understood that the maintenance method of the filter component 216 is essentially the same as the maintenance method of the replenishment pump 212 shown in FIG5 and the maintenance method of the heat exchange unit control board 218 shown in FIG6. Therefore, the relevant descriptions of the embodiments shown in FIG5 and FIG6 can be referred to, and will not be repeated here.

[0209] It should be noted that Figures 4 to 6 above are only schematic illustrations of the layout and maintenance methods of some components and do not constitute a limitation on this application. In other embodiments, more or fewer components may be arranged close to the front wall 201. This application does not impose specific limitations on this, as long as the actual maintenance needs are met.

[0210] In some embodiments of this application, the size of the heat exchange unit 21 can meet the installation requirements of a 4U height, thereby saving layout space inside the cabinet 20 of the liquid cooling cabinet 2. Here, 1U is 4.445 cm (1.75 inches), and 4U is 17.78 cm (7 inches).

[0211] For example, FIG7 shows a perspective view of the heat exchange unit 21 in an embodiment of this application. Referring to FIG7, the heat exchange unit 21 can be a cuboid structure. It is understood that the cuboid structure can include structures with a cuboid shape and structures that are approximately cuboid (for example, the outer surface of a structure with a cuboid shape can be partially concave or partially convex). The length D of the cuboid heat exchange unit 21 can be less than or equal to 1100 mm, such as 1100 mm, 1000 mm, 900 mm, 800 mm or 700 mm, etc.; the width W can be less than or equal to 448 mm, such as 448 mm, 440 mm, 430 mm, 420 mm or 410 mm, etc.; the height H can be less than 177 mm, such as 177 mm, 176 mm, 175 mm or 174 mm, etc.

[0212] It should be noted that the structure of the heat exchange unit 21 in this application is not limited to a cuboid structure. For example, in other alternative implementations, the heat exchange unit 21 can also be a cylindrical structure or other irregular structure, and this application does not impose any restrictions on this.

[0213] Referring again to Figure 3B and in conjunction with Figure 3A, in some embodiments of this application, the liquid-cooled cabinet 2 may further include a controller 22. The controller 22 is located inside the cabinet body 20 of the liquid-cooled cabinet 2, for example, as shown in Figure 3B, the controller 22 may be positioned near the top of the cabinet body 20. The controller 22 is communicatively connected to the heat exchange unit control board 218 of the heat exchange unit 21. The heat exchange unit control board 218 can send status signals to the controller 22 based on the status parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. The status signals are used to indicate the status of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2.

[0214] Thus, controller 22 can send a control signal to the server control board (not shown) of server 1a based on at least one of the status signal and other signals (e.g., a temperature signal indicating the temperature of server 1a), so that the server control board can control the flow control element 10a of server 1a according to the control signal. The specific structure and working principle of the server control board of server 1a are substantially the same as those of the server control board 13 of server 1 in the embodiment shown in FIG. 2 above, and therefore can be referred to the relevant description in the embodiment shown in FIG. 2 above, which will not be repeated here.

[0215] Alternatively, in some other alternative implementations, the controller 22 may also send a control signal to the heat exchange unit control board 218 of the heat exchange unit 21 based on at least one of the status signal and other signals, so that the heat exchange unit control board 218 can control the internal components (e.g., proportional valve 217) of the heat exchange unit 21 based on the control signal.

[0216] Alternatively, in some other alternative implementations, the controller 22 may send control signals to the server control board of the server 1a and the heat exchange unit control board 218 of the heat exchange unit 21 according to at least one of the status signal and other signals, so as to control the flow control element 10a of the server 1a and the internal components (e.g., proportional valve 217) of the heat exchange unit 21 respectively.

[0217] It should be noted that, in this embodiment, the controller 22 and the heat exchange unit control board 218 in the liquid-cooled cabinet 2 are two physically independent devices to facilitate individual maintenance and replacement, thereby improving the overall reliability of the control architecture. However, this application is not limited to this. In other embodiments, the controller 22 and the heat exchange unit control board 218 can also be integrated into the same control module.

[0218] Based on the server 1 in the embodiment shown in Figure 2 and the liquid-cooled cabinet 2 in the embodiments shown in Figures 3A and 3B, this application also provides a control system. The control system includes a liquid-cooled cabinet and at least one electronic device (e.g., a server or a switch). The liquid-cooled cabinet includes a cabinet body and a heat exchange unit disposed within the cabinet body. At least one electronic device is disposed within the cabinet body of the liquid-cooled cabinet, so that the liquid-cooled cabinet can dissipate heat from the electronic device using liquid cooling technology. The control system provided by this application has good disaster recovery capabilities.

[0219] The following describes the implementation of this application in detail, taking a server as an example of an electronic device, with reference to the accompanying drawings.

[0220] Figure 8A shows an architecture diagram of the control system 001 in an embodiment of this application. Figure 8B shows a structural diagram of the control system 001 in an embodiment of this application. Referring to Figures 8A and 8B, the control system 001 includes servers (e.g., servers 1a and 1b) and a liquid-cooled cabinet 2. The liquid-cooled structure 2 includes a cabinet 20 and a heat exchange unit 21 disposed within the cabinet 20. For example, as shown in Figure 8B, the heat exchange unit 21 is located at the bottom of the cabinet 20. The servers are disposed within the cabinet 20; for example, as shown in Figure 8B, servers 1a and 1b are stacked within the cabinet 20. For ease of description, server 1a is used as an example in the following description.

[0221] Specifically, server 1a includes a flow control element 10a and a first liquid cooling pipeline (not shown). It can be understood that the specific structure and working principle of the flow control element 10a of server 1a are substantially the same as those of the flow control element 10 of server 1 in the embodiment shown in Figure 2 above; the specific structure and working principle of the first liquid cooling pipeline of server 1a are substantially the same as those of the first liquid cooling pipeline M1 of server 1 in the embodiment shown in Figure 2 above. Therefore, the relevant descriptions in the embodiment shown in Figure 2 above can be referred to, and will not be repeated here.

[0222] The heat exchange unit 21 includes a heat exchanger 210, a first connecting pipe L1, and a second connecting pipe L2. It is understood that the specific structure and working principle of the heat exchanger 210, the first connecting pipe L1, and the second connecting pipe L2 are substantially the same as those in the embodiment shown in Figure 3A above. Since the relevant descriptions in the embodiment shown in Figure 3A can be referenced, they will not be repeated here.

[0223] In the aforementioned control system 001, on the one hand, the server (e.g., server 1a, 1b) can control the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the server through flow control elements (e.g., flow control elements 10a, 10b), thereby achieving precise temperature control to ensure that the server can operate at a suitable temperature, thereby effectively preventing the server from generating condensation due to overcooling and improving the server's disaster recovery capability.

[0224] On the other hand, by setting up a heat exchange unit 21 in the liquid-cooled cabinet 2, an independent internal circulation system can be formed inside the cabinet 20 of the liquid-cooled cabinet 2. As a result, the liquid-cooled cabinet 2 does not need to rely on the second liquid cooling pipeline M2 outside the cabinet 20 to supply the liquid cooling medium, effectively improving the disaster recovery capability of the liquid-cooled cabinet 2.

[0225] For example, when the liquid supply to the second liquid cooling pipe M2 outside the cabinet 20 is abnormal, the internal circulation system of the liquid-cooled cabinet 2 can operate briefly to prevent the server 1a from rapidly overheating and losing power. This allows for a certain amount of disaster recovery time for the server 1a to perform self-protection or data backup, thus avoiding losses. For instance, the time for the server 1a to operate normally at 105°C can be increased from 2.3s to 1200s, and the time for the server 1a to lose power from a liquid supply abnormality at 115°C can be increased from 5.3s to 1800s.

[0226] For example, the internal circulation system of the liquid-cooled cabinet 2 can supply liquid cooling medium to the first liquid cooling pipe of the server 1a, thereby achieving isolation of the liquid cooling medium. Therefore, when the cleanliness of the liquid cooling medium in the second liquid cooling pipe M2 outside the cabinet 20 is not up to standard, it will not cause contamination to the server 1a, effectively avoiding the problem of liquid cooling medium contamination.

[0227] Secondly, compared to the liquid cooling solution that relies on the external liquid cooling distribution unit to supply the liquid cooling medium, the pipe material of the internal circulation system in the control system 001 provided in this application does not need to be compatible with the pipe material of the external cabinet 20 (e.g., the second liquid cooling pipe M2). This application can effectively reduce the process requirements of the pipes. For example, the original liquid cooling process can be changed to the HVAC process, which effectively reduces costs.

[0228] Finally, compared with the above-mentioned liquid cooling scheme that relies on the external liquid cooling distribution unit to supply the liquid cooling medium, the control system 001 provided in this application can effectively distinguish between abnormalities caused by the liquid cooling cabinet 2 itself and abnormalities caused by the external liquid cooling pipeline (e.g., the second liquid cooling pipeline M2) of the liquid cooling cabinet 2, thereby clarifying the responsibility interface.

[0229] The following section will continue to use server 1a as an example to introduce the specific structure of the server and liquid-cooled cabinet 2 in control system 001 and the related control process.

[0230] Referring again to Figures 8A and 8B, in some embodiments of this application, the liquid-cooled cabinet 2 may further include a controller 22, the heat exchange unit 21 may further include a heat exchange unit control board 218, and the server 1a may further include a server control board 13a. The controller 22 is communicatively connected to the heat exchange unit control board 218 and the server control board 13a.

[0231] The heat exchange unit control board 218 monitors the state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2, and sends a state signal to the controller 22 based on these state parameters. The state signal indicates the state of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. It is understood that the specific implementation of the heat exchange unit control board 218 monitoring the state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2 is substantially the same as the specific implementation of the heat exchange unit control board 218 monitoring the state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2 in the embodiments shown in Figures 3A to 4. Therefore, the relevant descriptions in the embodiments shown in Figures 3A to 4 can be referred to, and will not be repeated here.

[0232] Server control board 13a is used to monitor the temperature of server 1a and send a temperature signal to controller 22 based on the temperature of server 1a. The temperature signal is used to indicate the temperature of server 1a. It can be understood that the specific implementation of server control board 13a monitoring the temperature of server 1a is essentially the same as the specific implementation of server control board 13 monitoring the temperature of server 1 in the embodiment shown in Figure 2 above. Therefore, the relevant description in the embodiment shown in Figure 2 above can be referred to, and will not be repeated here.

[0233] The controller 22 can send a control signal to the server control board 13a based on at least one of the status signal sent by the heat exchange unit control board 218 and the temperature signal sent by the server control board 13a, so that the server control board 13a can control the flow control element 10a according to the control signal.

[0234] In the aforementioned control system 001, the heat exchange unit control board 218 and the server control board 13a are independent sub-control modules, while the controller 22 is the centrally managed control module. Thus, the heat exchange unit control board 218, the server control board 13a, and the controller 22 together constitute a distributed-distributed control architecture. The heat exchange unit control board 218 reports status signals to the controller 22, and the server control board 13a reports temperature signals to the controller 22. The controller 22 collects the status and temperature signals and, based on at least one of them, sends a control signal to the server control board 13a to control the server 1a. This distributed-distributed control architecture effectively ensures the reliability of the overall system control and can implement different control strategies, such as condensation warning control strategies, disaster recovery control strategies, or flow regulation control strategies, which are described below as examples.

[0235] In some embodiments of this application, to achieve condensation warning, the status parameter may include the temperature of the liquid cooling medium in the first connecting pipe L1. The heat exchange unit control board 218 can compare the temperature of the liquid cooling medium in the first connecting pipe L1 with the dew point temperature of the environment where the liquid cooling cabinet 2 is located (e.g., the computer room where the liquid cooling cabinet 2 is located), and send a first status signal to the controller 22 based on the fact that the temperature of the liquid cooling medium in the first connecting pipe L1 is lower than the dew point temperature.

[0236] The controller 22 can send a first control signal to the server control board 13a of the server 1a according to the first status signal. The server control board 13a can control the flow control element 10a of the server 1a according to the first control signal, so that the flow control element 10a adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the server 1a, thereby changing the flow rate of the liquid cooling medium in the first connecting pipeline L1 connected to the first liquid cooling pipeline, and thus making the temperature of the liquid cooling medium in the first connecting pipeline L1 higher than the dew point temperature (for example, at least 3°C ​​higher than the dew point temperature), ultimately preventing the server 1a from condensing due to overcooling.

[0237] In some implementations, the dew point temperature can be calculated by the heat exchange unit control board 218 based on the humidity of the environment where the liquid cooling cabinet 2 is located, or the dew point temperature can be a preset temperature, such as a temperature value preset based on historical data or experience. This application does not limit this.

[0238] In some embodiments of this application, to achieve disaster recovery, the status parameters may include the temperature of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. The heat exchange unit control board 218 can determine that the supply status of the liquid cooling medium in the second connecting pipe L2 is abnormal based on the temperature of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2, and send a second status signal to the controller 22 based on the abnormal supply status of the liquid cooling medium in the second connecting pipe L2.

[0239] The controller 22 can send a second control signal to the server control board 13a of the server 1a according to the second status signal. The server control board 13a can control the flow control element 10a of the server 1a according to the second control signal, so that the flow control element 10a adjusts the flow of the liquid cooling medium in the first liquid cooling pipeline of the server 1a to prevent the server 1a from overheating and losing power, thereby reserving a certain amount of disaster recovery time for the server 1a to perform self-protection or data backup and avoid loss.

[0240] In some implementations, the heat exchange unit control board 218 can determine the temperature difference between the liquid cooling medium in the inlet section L11 and the outlet section L12 of the first connecting pipe L1 based on the temperature of the liquid cooling medium in the first connecting pipe L1, and determine the temperature change rate of the liquid cooling medium in the second connecting pipe L2 based on the temperature of the liquid cooling medium in the second connecting pipe L2. If the temperature difference is lower than a preset temperature difference and the temperature change rate is lower than a preset change rate, it can be determined that the supply status of the liquid cooling medium in the second connecting pipe L2 is abnormal.

[0241] In some implementations, the flow control element 10a can increase the flow rate of the liquid cooling medium in the first liquid cooling pipeline to improve the heat dissipation efficiency of the server 1a, thereby preventing the server 1a from overheating and losing power rapidly.

[0242] In some embodiments of this application, to achieve flow regulation, the status parameter may include the temperature of the liquid cooling medium in the first connecting pipe L1. The heat exchange unit control board 218 can send a third status signal to the controller 22 based on the temperature of the liquid cooling medium in the first connecting pipe L1. The third status signal may, for example, include the temperature of the liquid cooling medium in the first connecting pipe L1, or the temperature difference between the liquid cooling medium in the inlet pipe section L11 and the outlet pipe section L12 of the first connecting pipe L1.

[0243] Controller 22 can send a third control signal to server control board 13a based on the third status signal and the temperature signal sent by server control board 13a of server 1a. Server control board 13a can control the flow control element 10a of server 1a based on the third control signal, so that the flow control element 10a adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline of server 1a, thereby adapting to the working requirements of server 1a, avoiding excessive flow of liquid cooling medium in the first liquid cooling pipeline that would cause server 1a to overcool, which helps to reduce the amount of liquid cooling medium used and reduce costs. For example, in the above-mentioned liquid cooling scheme that relies on the liquid cooling distribution unit outside the cabinet to supply the liquid cooling medium, the amount of liquid cooling medium used is 18502L, and the cooling load factor (CLF) is 0.06. In this application, the amount of liquid cooling medium can be reduced from 18502L to 154L; the cooling load factor can be reduced from 0.06 to 0.035. That is, by monitoring and adjusting the flow rate, the overcooling and unnecessary energy consumption can be effectively reduced while ensuring the heat dissipation effect. The cooling load factor refers to the ratio of the power consumption of the data center cooling equipment to the power consumption of the server.

[0244] In some implementations, the third state signal may include, for example, the temperature difference between the liquid cooling medium in the liquid inlet section L11 and the liquid outlet section L12 of the first connecting pipe L1.

[0245] When the temperature difference is less than the preset temperature difference, and the temperature of server 1a is less than the preset temperature, it indicates that the flow rate of the liquid cooling medium in the first connecting pipe L1 and the first liquid cooling pipe of server 1a is too high. This will cause condensation to form on server 1a due to overcooling, and the liquid cooling medium cannot be fully utilized to effectively absorb the heat of the internal components of server 1a, resulting in waste of the liquid cooling medium. Based on this, controller 22 can send a third control signal to server control board 13. The third control signal is used to reduce the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a, so that flow control element 10a can reduce the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a.

[0246] Conversely, when the temperature difference exceeds a preset value, and the temperature of server 1a exceeds a preset temperature, it indicates that the flow rate of the liquid cooling medium in the first connecting pipe L1 and the first liquid cooling pipe of server 1a is too low. In this case, the internal circulation system formed by the first connecting pipe L1 and the first liquid cooling pipe cannot effectively dissipate heat from server 1a, and a large temperature difference can easily lead to excessive pressure within the internal circulation system. Based on this, controller 22 can send a third control signal to server control board 13. This third control signal is used to increase the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a, so that flow control element 10a can increase the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a.

[0247] It is understood that the above embodiments only introduce some control schemes of the distributed-distributed control architecture composed of heat exchange unit control board 218, server control board 13a and controller 22, and do not constitute a limitation on this application.

[0248] For example, in some other embodiments, the controller 22 may also send a control signal to the heat exchange unit control board 218 based on at least one of the status signal and the temperature signal, so that the heat exchange unit control board 218 can control the devices (e.g., proportional valve 217) of the heat exchange unit 21 based on the control signal.

[0249] For example, in other embodiments, the controller 22 may also send control signals to the heat exchange unit control board 218 and the server control board 13a respectively based on at least one of the status signal and the temperature signal, so as to control the internal components of the heat exchange unit 21 (e.g., the proportional valve 217) and the flow control element 10a of the server 1a respectively.

[0250] It should be noted that in this embodiment, the controller 22 and the heat exchange unit control board 218 in the control system 001 are two physically independent devices to facilitate individual maintenance and replacement, thereby improving the overall reliability of the control architecture. However, this application is not limited to this. In other embodiments, the controller 22 and the heat exchange unit control board 218 may also be integrated into the same control module.

[0251] Furthermore, it should be understood that the diversity-distribution control architecture of the control system 001 in the embodiments shown in Figures 8A and 8B is merely illustrative and does not constitute a limitation of this application. In other embodiments, the control system 001 may have other control architectures.

[0252] For example, the control system 001 may not include the server control board 13a of the server 1a. The heat exchange unit control board 218 of the heat exchange unit 21 and the controller 22 together constitute the control architecture. The controller 22 is communicatively connected to the flow control element 10a to realize the control of the internal components of the heat exchange unit 21 (e.g., proportional valve 217) and the flow control element 10a of the server 1a.

[0253] For example, the control system 001 may not include the controller 22. The heat exchange unit control board 218 of the heat exchange unit 21 and the server control board 13a of the server 1a together constitute the control architecture. The heat exchange unit control board 218 and the server control board 13a are communicatively connected to realize the control of the internal components of the heat exchange unit 21 (e.g., proportional valve 217) and the flow control element 10a of the server 1a.

[0254] In addition, the server 1a in the control system 001 may also include other devices, such as heat sources, cold plates, etc. For details, please refer to the relevant description of server 1 in Figure 2 above, which will not be elaborated here.

[0255] The heat exchange unit 21 in the control system 001 may also include other components, such as a replenishment tank 211, a replenishment pump 212, an expansion tank 213, temperature sensing components 214a-214c, pressure sensing components 215a-215c, a filter component 216, a proportional valve 217, etc. For details, please refer to the relevant descriptions of the heat exchange unit 21 in Figures 3A to 4 above, which will not be repeated here.

[0256] Based on the control system 001 in the embodiments shown in Figures 8A and 8B above, this application also provides a control method, which will be described exemplarily below. For ease of description, server 1a will continue to be used as an example for the following description.

[0257] Figure 9 shows a flowchart of the control method applied in the control system 001 in an embodiment of this application. The control method in this embodiment will be described in detail below with reference to Figure 9. As shown in Figure 9, the control method specifically includes:

[0258] S110: The heat exchange unit control board 218 sends a status signal to the controller 22 according to the status parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. The status signal is used to indicate the status of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2.

[0259] Based on the control system 001 in the embodiments shown in Figures 8A and 8B above, in some embodiments of this application, the heat exchange unit control board 218 can be communicatively connected to the sensing components provided on the first connecting pipe L1 and the second connecting pipe L2 to obtain the data detected by each sensing component, thereby monitoring the state parameters of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2, and then sending a state signal to the controller 22 according to the state parameters. For details, please refer to the description of the heat exchange unit control board 218 in the embodiments shown in Figures 3A to 4 above, which will not be repeated here.

[0260] S120: Server control board 13a sends a temperature signal to controller 22 based on the temperature of server 1a. The temperature signal is used to indicate the temperature of server 1a.

[0261] In some embodiments of this application, the server control board 13a may be connected to a temperature sensing component located inside the server 1a. The temperature sensing component can detect the temperature of the server 1a and send the detected temperature to the server control board 13, so that the server control board 13 can monitor the temperature of the server 1a. Then, the server control board 13 can send a control signal to the controller 22 according to the temperature of the server 1a.

[0262] S130: Controller 22 sends a control signal to server control board 13a based on at least one of the status signal and temperature signal.

[0263] For example, controller 22 can send control signals to server control board 13a based on status signals; or controller 22 can send control signals to server control board 13a based on both status signals and temperature signals; or controller 22 can send control signals to server control board 13a based on temperature signals. This application does not impose specific limitations on these, as long as the actual control requirements can be met.

[0264] S140: Server control board 13a controls flow control element 10a according to control signals.

[0265] It is understood that, depending on the specific structural form of the flow control element 10a, the specific implementation method of the server control board 13a controlling the flow control element 10a will also differ. For example, in some embodiments of this application, the flow control element 10a may include a circulating pump, and the server control board 13a may control the rotational speed of the circulating pump. Furthermore, in other embodiments of this application, the flow control element 10a may also include a proportional valve, and the server control board 13a may control the opening degree of the proportional valve.

[0266] It should be noted that this application does not impose specific restrictions on the execution order of S110 and S120. For example, S110 can be executed first, followed by S120; or S120 can be executed first, followed by S110; or S110 and S120 can be executed simultaneously.

[0267] Alternatively, at least one of S110 and S120 can be selectively executed according to actual control requirements. For example, S110 can be executed, in which case the controller 22 sends a control signal to the server control board 13a based on the status signal in S130; or S120 can be executed, in which case the controller 22 sends a control signal to the server control board 13a based on the temperature signal in S130; or S110 and S120 can be executed, in which case the controller 22 sends a control signal to the server control board 13a based on both the status signal and the temperature signal.

[0268] The above control method involves the heat exchange unit control board 218 reporting status signals to the controller 22, and the server control board 13a reporting temperature signals to the controller 22. The controller 22 collects the status and temperature signals and sends a control signal to the server control board 13a based on at least one of the status and temperature signals to control the server 1a. This effectively ensures the reliability of the overall system control and allows for the implementation of different control strategies, such as condensation warning control strategies, disaster recovery control strategies, or flow regulation control strategies, which are described below as examples.

[0269] Figure 10A shows an exemplary flowchart of the condensation early warning control strategy in an embodiment of this application. Referring to Figure 10A, the control flow of the condensation early warning control strategy may specifically include:

[0270] S111a: The status parameters include the temperature of the liquid cooling medium in the first connecting pipe L1. The heat exchange unit control board 218 compares the temperature of the liquid cooling medium in the first connecting pipe L1 with the dew point temperature of the environment where the control system 001 is located.

[0271] Based on the control system 001 in the embodiments shown in Figures 8A and 8B above, in some embodiments of this application, the heat exchange unit control board 218 can be communicatively connected to the temperature sensing component 214a disposed on the liquid inlet pipe section L11 of the first connecting pipe L1 to monitor the temperature of the liquid cooling medium in the liquid inlet pipe section L11 of the first connecting pipe L1.

[0272] In some embodiments of this application, the heat exchange unit control board 218 can be communicatively connected to the humidity sensing component 03 located in the environment where the control system 001 is located (e.g., the computer room where the control system 001 is located) to obtain humidity data detected by the humidity sensing component 03, thereby monitoring the humidity of the environment where the control system 001 is located. In this way, the heat exchange unit control board 218 can calculate the dew point temperature of the environment where the control system 001 is located based on the humidity. In other embodiments, the dew point temperature can also be a preset temperature, such as a temperature value preset based on historical data or experience; this application does not impose any limitations on this.

[0273] S112a: The heat exchange unit control board 218 sends a first status signal to the controller 22 based on the fact that the temperature of the liquid cooling medium in the first connecting pipe L1 is lower than the dew point temperature.

[0274] In some embodiments of this application, the heat exchange unit control board 218 can calculate the difference between the temperature of the liquid cooling medium in the first connecting pipe L1 and the dew point temperature, and determine whether the temperature of the liquid cooling medium in the first connecting pipe L1 is lower than the dew point temperature based on the sign of the difference.

[0275] In other embodiments of this application, the heat exchange unit control board 218 may also calculate the ratio between the temperature of the liquid cooling medium in the first connecting pipe L1 and the dew point temperature, and determine whether the temperature of the liquid cooling medium in the first connecting pipe L1 is lower than the dew point temperature based on the magnitude of the ratio.

[0276] S130a: Controller 22 sends a first control signal to server control board 13a based on the first status signal.

[0277] S140a: The server control board 13a controls the flow control element 10a according to the first control signal so that the temperature of the liquid cooling medium in the first connecting pipe L1 is higher than the dew point temperature.

[0278] The flow control element 10a can adjust the flow rate of the liquid cooling medium in the first liquid cooling pipe of the server 1a, thereby changing the flow rate of the liquid cooling medium in the first connecting pipe L1 connected to the first liquid cooling pipe, and thus making the temperature of the liquid cooling medium in the first connecting pipe L1 higher than the dew point temperature (for example, at least 3°C ​​higher than the dew point temperature), ultimately preventing the server 1a from condensing due to overcooling.

[0279] The aforementioned condensation control strategy flexibly controls the flow control element 10a based on the temperature and dew point temperature of the liquid cooling medium in the first liquid cooling pipeline, thereby adjusting the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the server 1a, effectively avoiding the risk of condensation, and thus improving the disaster recovery capability of the control system 001.

[0280] Figure 10B shows an exemplary flowchart of the disaster recovery control strategy in an embodiment of this application. Referring to Figure 10B, the control flow of the disaster recovery control strategy may specifically include:

[0281] S111b: The status parameters include the temperature of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. The heat exchange unit control board 218 determines that the supply status of the liquid cooling medium in the second connecting pipe L2 is abnormal based on the temperature of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2.

[0282] Based on the control system 001 in the embodiments shown in Figures 8A and 8B above, in some embodiments of this application, the heat exchange unit control board 218 can be connected with temperature sensing components 214a-214c to monitor the temperature of the liquid cooling medium in the liquid inlet section L11 of the first connecting pipe L1, the liquid outlet section L12 of the first connecting pipe L1, and the liquid inlet section L21 of the second connecting pipe L2.

[0283] In some implementations, the heat exchange unit control board 218 can determine the temperature difference between the liquid cooling medium in the inlet section L11 and the outlet section L12 of the first connecting pipe L1 based on the temperature of the liquid cooling medium in the first connecting pipe L1, and determine the temperature change rate of the liquid cooling medium in the second connecting pipe L2 based on the temperature of the liquid cooling medium in the second connecting pipe L2. If the temperature difference is lower than a preset temperature difference and the temperature change rate is lower than a preset change rate, it can be determined that the supply status of the liquid cooling medium in the second connecting pipe L2 is abnormal.

[0284] S112b: The heat exchange unit control board 218 sends a second status signal to the controller 22 based on the abnormal supply status of the liquid cooling medium in the second connecting pipe L2.

[0285] S130b: Controller 22 sends a second control signal to server control board 13a based on the second status signal.

[0286] S140b: The server control board 13a controls the flow control element 10a according to the second control signal, so that the flow control element 10a adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the server 1a.

[0287] For example, the flow control element 10a can increase the flow rate of the liquid cooling medium in the first liquid cooling pipeline to improve the heat dissipation efficiency of the server 1a, prevent the server 1a from overheating and losing power rapidly, and thus reserve a certain amount of disaster recovery time for the server 1a to perform self-protection or data backup to avoid losses.

[0288] The aforementioned disaster recovery control strategy can detect abnormalities in the supply status of the liquid cooling medium in the second connecting pipe L2 in a timely manner based on the temperature of the liquid cooling medium in the first connecting pipe L1 and the second connecting pipe L2. This allows the flow rate of the liquid cooling medium in the first liquid cooling pipe of the server 1a to be adjusted by the flow control element 10a, thereby achieving disaster recovery, avoiding losses, and improving the disaster recovery capability of the control system 001.

[0289] Figure 10C shows an exemplary flowchart of the flow regulation control strategy in an embodiment of this application. Referring to Figure 10C, the control flow of the flow regulation control strategy may specifically include:

[0290] S110c: The status parameters include the temperature of the liquid cooling medium in the first connecting pipe L1. The heat exchange unit control board 218 sends a third status signal to the controller 22 according to the temperature of the liquid cooling medium in the first connecting pipe L1.

[0291] Based on the control system 001 in the embodiments shown in Figures 8A and 8B above, in some embodiments of this application, the heat exchange unit control board 218 can be communicatively connected to the temperature sensing components 214a and 214b to monitor the temperature of the liquid cooling medium in the liquid inlet section L11 and the liquid outlet section L12 of the first connecting pipe L1.

[0292] In some implementations, the heat exchange unit control board 218 can also calculate the temperature difference between the liquid cooling medium in the liquid inlet section L11 and the liquid outlet section L12 of the first connecting pipe L1, so as to monitor the temperature difference change between the liquid cooling medium in the liquid inlet section L11 and the liquid outlet section L12 of the first connecting pipe L1.

[0293] Based on this, the third state signal may include, for example, the temperature of the liquid cooling medium in the liquid inlet section L11 of the first connecting pipe L1, the temperature of the liquid cooling medium in the liquid outlet section L12 of the first connecting pipe L1, or the temperature difference between the liquid cooling medium in the liquid inlet section L11 and the liquid outlet section L12 of the first connecting pipe L1.

[0294] S120c: Server control board 13a sends a temperature signal to controller 22 based on the temperature of server 1a. The temperature signal is used to indicate the temperature of server 1a.

[0295] For details regarding S120c, please refer to the description of S120 above, which will not be repeated here.

[0296] S130c: The controller 22 sends a third control signal to the server control board 13 based on the third status signal and the temperature signal.

[0297] According to the embodiment described in S110c above, the third state signal may include, for example, the temperature difference between the liquid cooling medium in the liquid inlet section L11 and the liquid outlet section L12 of the first connecting pipe L1.

[0298] When the temperature difference is less than the preset temperature difference, and the temperature of server 1a is less than the preset temperature, it indicates that the flow rate of the cooling medium in the first connecting pipe L1 and the first liquid cooling pipe of server 1a is too high. This will cause condensation to form on server 1a due to overcooling, and the cooling medium cannot be fully utilized to effectively absorb the heat of the internal components of server 1a, resulting in waste of the cooling medium. Based on this, controller 22 can send a third control signal to server control board 13, which is used to reduce the flow rate of the cooling medium in the first liquid cooling pipe of server 1a.

[0299] Conversely, when the temperature difference exceeds a preset value, and the temperature of server 1a exceeds a preset temperature, it indicates that the flow rate of the liquid cooling medium in the first connecting pipe L1 and the first liquid cooling pipe of server 1a is too low. In this case, the internal circulation system formed by the first connecting pipe L1 and the first liquid cooling pipe cannot effectively dissipate heat from server 1a, and a large temperature difference can easily lead to excessive pressure within the internal circulation system. Based on this, controller 22 can send a third control signal to server control board 13, which is used to increase the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a.

[0300] S140c: The server control board 13a controls the flow control element 10a according to the third control signal, so that the flow control element 10a adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline of the server 1a.

[0301] According to the embodiment described in S130c above, when the third control signal is used to reduce the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a, the flow control element 10a can reduce the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a; when the third control signal is used to increase the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a, the flow control element 10a can increase the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a.

[0302] The aforementioned flow regulation and control strategy adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipe of server 1a in real time based on the temperature of the liquid cooling medium in the first connecting pipe L1 and the temperature of server 1a. This adapts to the working requirements of server 1a, preventing excessive flow of the liquid cooling medium in the first liquid cooling pipe from causing overcooling of server 1a. This helps reduce the amount of liquid cooling medium used and lower costs. For example, in the liquid cooling scheme that relies on the external liquid cooling distribution unit to supply the liquid cooling medium, the amount of liquid cooling medium used is 18502L, and the cooling load factor (CLF) is 0.06. In this application, the amount of liquid cooling medium used can be reduced from 18502L to 154L; the cooling load factor can be reduced from 0.06 to 0.035. That is, through flow monitoring and regulation, while ensuring heat dissipation, overcooling and unnecessary energy consumption can be effectively reduced. Here, the cooling load factor refers to the ratio of the power consumption of the data center cooling equipment to the power consumption of the server.

[0303] This application also provides a computer-readable storage medium storing instructions that, when executed on a computer, cause the computer to perform the control methods described in the embodiments shown in Figures 9 to 10C.

[0304] The specific embodiments described above illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of this application. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0305] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0306] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0307] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

A liquid-cooled cabinet, characterized in that, Includes a cabinet and a heat exchange unit disposed within the cabinet, wherein: The heat exchange unit includes a heat exchanger, a first connecting pipe, and a second connecting pipe. The first connecting pipe is used to connect to a first liquid cooling pipe inside each of at least one electronic device inside the cabinet to supply liquid cooling medium to the first liquid cooling pipe. The liquid cooling medium is used to absorb heat from the components inside the electronic device. The second connecting pipe is used to connect to a second liquid cooling pipe outside the cabinet. The heat exchanger is used to exchange heat between the first connecting pipe and the second connecting pipe to cool the liquid cooling medium in the first connecting pipe. The liquid-cooled cabinet according to claim 1 is characterized in that, The number of electronic devices is multiple, and the flow rate of the liquid cooling medium supplied by the first connecting pipe to the first liquid cooling pipe of each electronic device is different. The liquid-cooled cabinet according to claim 1 is characterized in that, The second connecting pipeline is provided with at least one of a filter assembly, a first temperature sensing assembly, or a proportional valve. The liquid-cooled cabinet according to claim 3 is characterized in that, The filter assembly is provided on the second connecting pipe; The second connecting pipeline includes a first branch and a second branch connected in parallel, and the filter assembly includes a first filter screen and a second filter screen; the first filter screen and the second filter screen are respectively disposed on the first branch and the second branch, and a valve is provided on one of the first branch and the second branch. The liquid-cooled cabinet according to claim 3 is characterized in that, The first temperature sensing component is installed on the second connecting pipe; The first temperature sensing component includes a plurality of first temperature sensors, which are arranged sequentially along the extension direction of the second connecting pipe. The liquid-cooled cabinet according to claim 3 is characterized in that, The front wall of the cabinet has an opening for exposing the heat exchange unit to the outside. The liquid-cooled cabinet according to claim 6 is characterized in that, The filter assembly is provided on the second connecting pipe; The distance between the filter assembly and the rear wall of the cabinet is greater than the distance between the filter assembly and the front wall of the cabinet. The liquid-cooled cabinet according to claim 3 is characterized in that, The proportional valve is provided on the second connecting pipeline; The heat exchange unit includes a first control board, which is used to monitor the state parameters of the liquid cooling medium in the first connecting pipe and the second connecting pipe of the heat exchange unit, and control the proportional valve according to the state parameters. The liquid-cooled cabinet according to claim 8 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe; The first control board controls the proportional valve according to the state parameters, including: The first control board compares the temperature of the liquid cooling medium in the first connecting pipe with the dew point temperature of the environment where the liquid cooling cabinet is located. The first control board adjusts the opening of the proportional valve based on the fact that the temperature of the liquid cooling medium in the first connecting pipe is lower than the dew point temperature, so that the temperature of the liquid cooling medium in the first connecting pipe is higher than the dew point temperature. The liquid-cooled cabinet according to claim 1 is characterized in that, The liquid cooling cabinet includes a controller disposed in the cabinet, and the heat exchange unit further includes a first control board. The first control board is used to monitor the status parameters of the liquid cooling medium in the first connecting pipe and the second connecting pipe of the heat exchange unit, and send a status signal to the controller to indicate the status of the liquid cooling medium according to the status parameters. The liquid-cooled cabinet according to claim 1 is characterized in that, The heat exchange unit further includes a replenishment tank and a first pump. The replenishment tank is connected to the first connecting pipe, and the first pump is located between the replenishment tank and the first connecting pipe. The first pump is used to drive the liquid cooling medium in the replenishment tank to flow to the first connecting pipe; or... The heat exchange unit includes an expansion tank, which is connected to the first connecting pipeline. The liquid-cooled cabinet according to claim 1 is characterized in that, The first connecting pipe is provided with at least one of a second temperature sensing component and a pressure sensing component. The liquid-cooled cabinet according to claim 12 is characterized in that, The first connecting pipe is equipped with the second temperature sensing component; The second temperature sensing component includes a plurality of second temperature sensors, which are arranged sequentially along the extension direction of the first connecting pipe. The liquid-cooled cabinet according to claim 13 is characterized in that, The pressure sensing component is provided on the first connecting pipe; The pressure sensing component includes multiple pressure sensors, which are arranged sequentially along the extension direction of the first connecting pipe. An electronic device, characterized in that, It includes a flow control element and a first liquid cooling pipeline. The flow control element is disposed on the first liquid cooling pipeline and is used to control the flow rate of the liquid cooling medium in the first liquid cooling pipeline. The first liquid cooling pipeline is used to connect to a first connecting pipeline outside the electronic device. The electronic device according to claim 15, characterized in that, The flow control element includes a second pump or a proportional valve. The electronic device according to claim 15, characterized in that, The electronic device further includes a second control board, which is communicatively connected to the flow control element to control the flow control element. A control system, characterized in that, The system includes a liquid-cooled cabinet and at least one electronic device. The liquid-cooled cabinet includes a cabinet body and a heat exchange unit disposed within the cabinet body. The at least one electronic device is disposed within the cabinet body, wherein: The electronic device includes a flow control element and a first liquid cooling pipeline. The flow control element is disposed on the first liquid cooling pipeline and is used to control the flow rate of the liquid cooling medium in the first liquid cooling pipeline. The heat exchange unit includes a heat exchanger, a first connecting pipe, and a second connecting pipe. The first connecting pipe is used to connect to a first liquid cooling pipe inside each of at least one electronic device inside the cabinet to supply liquid cooling medium to the first liquid cooling pipe. The liquid cooling medium is used to absorb heat from the components inside the electronic device. The second connecting pipe is used to connect to a second liquid cooling pipe outside the cabinet. The heat exchanger is used to exchange heat between the first connecting pipe and the second connecting pipe to cool the liquid cooling medium in the first connecting pipe. The control system according to claim 18 is characterized in that, The liquid cooling cabinet includes a controller disposed in the cabinet, and the heat exchange unit further includes a first control board. The first control board is used to monitor the status parameters of the liquid cooling medium in the first connecting pipe and the second connecting pipe of the heat exchange unit, and send a status signal to the controller to indicate the status of the liquid cooling medium according to the status parameters. The control system according to claim 19 is characterized in that, The electronic device also includes a second control board, which monitors the temperature of the electronic device and sends a temperature signal to the controller to indicate the temperature of the electronic device based on the temperature of the electronic device. The control system according to claim 20 is characterized in that, The controller is configured to send a control signal to the second control board based on at least one of the status signal and the temperature signal, so that the second control board controls the flow control element according to the control signal. The control system according to claim 21 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe; The first control board sends a status signal to the controller based on the status parameters, and the controller sends a control signal to the second control board based on the status signal, so that the second control board controls the flow control element according to the control signal, including: The first control board compares the temperature of the liquid cooling medium in the first connecting pipe with the dew point temperature of the environment where the liquid cooling cabinet is located. The first control board sends a first status signal to the controller based on the fact that the temperature of the liquid cooling medium in the first connecting pipe is lower than the dew point temperature. The controller sends a first control signal to the second control board based on the first status signal; The second control board controls the flow control element according to the first control signal so that the temperature of the liquid cooling medium in the first connecting pipe is higher than the dew point temperature. The control system according to claim 21 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe and the second connecting pipe; The first control board sends a status signal to the controller based on the status parameters. The controller then sends a control signal to the second control board based on the status signal, so that the second control board controls the flow control element according to the control signal, including: The first control board determines that the supply status of the liquid cooling medium in the second connecting pipe is abnormal based on the temperature of the liquid cooling medium in the first connecting pipe and the second connecting pipe. The first control board sends a second status signal to the controller based on the abnormal supply status of the liquid cooling medium in the second connection pipeline; The controller sends a second control signal to the second control board according to the second status signal; The second control board controls the flow control element according to the second control signal, so that the flow control element adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline. The control system according to claim 21 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe; The first control board sends a status signal to the controller based on the status parameters, and the second control board sends a temperature signal to the controller based on the temperature of the electronic device. The controller is configured to send a control signal to the second control board based on the status signal and the temperature signal, so that the second control board controls the flow control element according to the control signal, including: The first control board sends a third status signal to the controller based on the temperature of the liquid cooling medium in the first connecting pipe. The third status signal is used to indicate the temperature of the liquid cooling medium in the first connecting pipe. The second control board sends a temperature signal to the controller based on the temperature of the electronic device. The controller sends a third control signal to the second control board based on the third status signal and the temperature signal; The second control board controls the flow control element according to the third control signal, so that the flow control element adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline. A control method for use in the control system as described in any one of claims 21-24, characterized in that, The method includes: The first control board monitors the status parameters of the liquid cooling medium in the first and second connecting pipes of the heat exchange unit, and sends a status signal to the controller to indicate the status of the liquid cooling medium according to the status parameters. The second control board monitors the temperature of the electronic device and sends a temperature signal to the controller to indicate the temperature of the electronic device according to the temperature of the electronic device. The controller sends a control signal to the second control board based on at least one of the status signal and the temperature signal, so that the second control board controls the flow control element according to the control signal. The control method according to claim 25 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe; The first control board sends a status signal to the controller based on the status parameters, and the controller sends a control signal to the second control board based on the status signal, so that the second control board controls the flow control element according to the control signal, including: The first control board compares the temperature of the liquid cooling medium in the first connecting pipe with the dew point temperature of the environment where the liquid cooling cabinet is located. The first control board sends a first status signal to the controller based on the fact that the temperature of the liquid cooling medium in the first connecting pipe is lower than the dew point temperature. The controller sends a first control signal to the second control board based on the first status signal; The second control board controls the flow control element according to the first control signal so that the temperature of the liquid cooling medium in the first connecting pipe is higher than the dew point temperature. The control method according to claim 25 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe and the second connecting pipe; The first control board sends a status signal to the controller based on the status parameters. The controller then sends a control signal to the second control board based on the status signal, so that the second control board controls the flow control element according to the control signal, including: The first control board determines that the supply status of the liquid cooling medium in the second connecting pipe is abnormal based on the temperature of the liquid cooling medium in the first connecting pipe and the second connecting pipe. The first control board sends a second status signal to the controller based on the abnormal supply status of the liquid cooling medium in the second connection pipeline; The controller sends a second control signal to the second control board according to the second status signal; The second control board controls the flow control element according to the second control signal, so that the flow control element adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline. The control method according to claim 25 is characterized in that, The status parameters include the temperature of the liquid cooling medium in the first connecting pipe; The first control board sends a status signal to the controller based on the status parameters, and the second control board sends a temperature signal to the controller based on the temperature of the electronic device. The controller is configured to send a control signal to the second control board based on the status signal and the temperature signal, so that the second control board controls the flow control element according to the control signal, including: The first control board sends a third status signal to the controller based on the temperature of the liquid cooling medium in the first connecting pipe. The third status signal is used to indicate the temperature of the liquid cooling medium in the first connecting pipe. The second control board sends a temperature signal to the controller based on the temperature of the electronic device. The controller sends a third control signal to the second control board based on the third status signal and the temperature signal; The second control board controls the flow control element according to the third control signal, so that the flow control element adjusts the flow rate of the liquid cooling medium in the first liquid cooling pipeline. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores instructions that, when executed on a computer, cause the computer to perform the control method according to any one of claims 25 to 28.

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