Metal card having color pattern, and manufacturing method therefor
The integration of a UV-curable color ink with a UV-curable resin forms a single color pattern layer on metal cards, addressing separation issues and reducing manufacturing complexity and costs while improving durability.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BIOSMART CORPORATION
- Filing Date
- 2024-11-21
- Publication Date
- 2026-05-15
AI Technical Summary
Conventional metal credit cards face issues with separation between pattern and color layers due to complex manufacturing processes, leading to durability problems and increased costs.
A metal card with a color pattern layer formed using UV-curable color ink, mixed with a UV-curable resin, which is pre-cured on a master mold and then transferred and fully cured on the metal sheet, integrating the pattern and color layers into a single layer.
Simplifies the manufacturing process, reduces costs, and prevents separation of layers, enhancing durability and aesthetic appeal.
Smart Images

Figure KR2024096631_15052026_PF_FP_ABST
Abstract
Description
Metal card having a color pattern and method of manufacturing the same
[0001] The present invention relates to a metal card, and more specifically, to a metal card and a method for manufacturing the same, characterized by forming a color pattern layer on the surface of a metal sheet using a UV-curable color ink made by mixing a color pigment with a UV-curable resin.
[0002] Credit cards are used for purposes such as identity verification, payment, and credit extension. Recently, the shapes and designs of credit cards have become increasingly elaborate to imbue them with artistic value and function as accessories. Furthermore, along with services, discounts, and point rewards, the appearance and design of credit cards serve as important factors in card selection. Accordingly, card manufacturers are striving to meet the diverse needs of customers by devising cards that differ significantly not only in appearance and design but also in functionality.
[0003] Generally, credit cards have primarily used plastic materials for a long time. Plastic cards have the advantages of being lightweight, inexpensive to produce, and easy to apply various designs to. However, plastic cards lack durability, and over time, problems such as easy wear and bending can occur.
[0004] To address these issues and enhance the appearance and design of credit cards, the use of metal credit cards has been steadily increasing recently. In particular, metal cards offer a sense of sophistication superior to plastic cards due to the distinctive metallic luster. Furthermore, metal cards provide a more pleasant user experience compared to lightweight plastic cards by offering a luxurious surface texture and a substantial weight. Additionally, metal cards offer significantly greater durability than plastic cards and are gaining popularity for providing users with a premium experience due to their luxurious appearance and substantial weight. Consequently, metal cards are widely used for VIP cards and high-end membership cards, and tend to be regarded among consumers as a symbol of status or position. Driven by this growing demand, metal cards are evolving further by applying various metal materials and surface designs to provide a differentiated appearance.
[0005] Meanwhile, conventional technology has utilized a method of forming a pattern layer and a color layer, respectively, on the surface of a metal card to impart unique visual effects. For example, by engraving an intricate pattern onto a metal substrate and forming a color layer thereon, the appearance of the metal card is made more luxurious. However, this method of forming three-dimensional patterns carries the risk of separation between the metal substrate, the pattern layer, and the color layer. Furthermore, over time, external impacts or wear can weaken the adhesion between the layers, potentially causing issues with the card's durability and appearance. Additionally, since the pattern and color layers are formed separately on the surface of the metal card, the manufacturing process becomes more complex.
[0006] To solve the aforementioned problems, the present invention aims to provide a metal card having a color pattern that not only simplifies the manufacturing process but also fundamentally solves the problem of separation between the color layer and the pattern layer by producing a UV-curable color ink by coloring a UV-curable resin and forming a colored pattern layer on the surface of a metal sheet using the same.
[0007] To achieve the aforementioned technical objectives, a metal card having a color pattern according to the first aspect of the present invention relates to a metal card having a metal sheet made of a plate material having a predetermined card size on its front surface, wherein a predetermined pattern is formed on one surface and a color pattern layer mounted on the upper surface of the metal sheet is provided; wherein the color pattern layer is formed by curing a UV-curable color ink colored by mixing a color pigment with a transparent UV-curable resin material, and wherein a predetermined pattern is formed on one surface.
[0008] The metal card having a color pattern according to the aforementioned features is a sheet configured to absorb or reflect electromagnetic waves, and further comprises: an EMI absorbing sheet disposed on the back surface of the metal sheet; an antenna inlay sheet disposed on the back surface of the EMI absorbing sheet, the antenna coil being mounted on the surface of the main body and the main body being made of a synthetic resin material; a back printing sheet disposed on the back surface of the antenna inlay sheet, the main body being made of a synthetic resin material and having a printing layer formed on one surface; and a back overlay sheet disposed on the back surface of the back printing sheet, the main body being made of a transparent synthetic resin material. An adhesive layer having electrical insulation properties may be formed between the metal sheet and the EMI absorbing sheet and between the EMI absorbing sheet and the antenna inlay sheet.
[0009] The metal card having a color pattern according to the aforementioned features further comprises: an EMI absorbing sheet disposed on the back surface of the metal sheet, wherein the metal card is configured to absorb or reflect electromagnetic waves; an antenna inlay sheet disposed on the back surface of the EMI absorbing sheet, wherein the antenna coil is mounted on the surface of the main body and the antenna inlay sheet is made of a synthetic resin material; and a rear metal printing sheet disposed on the back surface of the antenna inlay sheet, wherein the rear metal printing sheet is made of a metal material, has a printing layer formed on one surface, and is disposed on the back surface of the antenna inlay sheet; and adhesive layers having electrical insulation properties are formed between the metal sheet and the antenna inlay sheet, and between the antenna inlay sheet and the rear metal printing sheet.
[0010] The metal sheet has a first chip insertion hole in which a chip module for a card is mounted, and the rear metal printed sheet may have a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a slit connecting the second chip insertion hole and the edge of the rear metal printed sheet.
[0011] The metal card having a color pattern according to the aforementioned features comprises: a body made of synthetic resin material, an antenna coil mounted on the surface of the body, and an antenna inlay sheet disposed on the back surface of the metal sheet; a back printing sheet made of synthetic resin material, having a printing layer formed on one surface, disposed on the back surface of the antenna inlay sheet; and a back overlay sheet made of transparent synthetic resin material and disposed on the back surface of the back printing sheet; wherein the metal sheet may have a chip insertion hole in which a chip module for the card is mounted, and a slit connecting the chip insertion hole and the edge of the metal sheet.
[0012] The metal card having a color pattern according to the aforementioned features comprises: a body made of synthetic resin material, an antenna coil mounted on the surface of the body, and an antenna inlay sheet disposed on the back surface of the metal sheet; and a back metal printing sheet made of metal material, having a printing layer formed on one surface, and disposed on the back surface of the antenna inlay sheet; wherein the metal sheet has a first chip insertion hole in which a chip module for the card is mounted and a first slit connecting the first chip insertion hole and the edge of the metal sheet, and the back metal printing sheet may have a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a second slit connecting the second chip insertion hole and the edge of the back metal printing sheet.
[0013] In the metal card having a color pattern according to the aforementioned features, it is preferable that the color pattern layer is completed by applying the UV-curable color ink to the surface of a master mold having a predetermined pattern formed on one side and pre-curing it, transferring the pre-cured UV-curable color ink to the upper surface of the metal sheet, and completely curing the UV-curable color ink transferred to the metal sheet.
[0014] The metal card having a color pattern according to the aforementioned features preferably further comprises a bending prevention sheet disposed between the antenna inlay sheet and the back printing sheet, which is made of an epoxy material sheet having a predetermined thickness.
[0015] A method for manufacturing a metal card having a color pattern according to a second aspect of the present invention comprises: (a) a step of manufacturing a master mold having a predetermined pattern formed on one surface; (b) a step of manufacturing a UV-curable color ink by mixing a color pigment with a UV-curable resin material; (c) a step of applying the UV-curable color ink to one surface of the master mold, applying pressure, and pre-curing; (d) a step of transferring the pre-cured UV-curable color ink onto the surface of a metal sheet; (e) a step of fully-curing the UV-curable color ink transferred onto the surface of the metal sheet to form a color pattern layer on the surface of the metal sheet; and (f) a step of sequentially laminating sheets constituting a metal card onto the back surface of the metal sheet on which the color pattern layer is formed, and then laminating them.
[0016] In the method for manufacturing a metal card having a color pattern according to the aforementioned features, step (f) may laminate a first adhesive layer, an EMI absorption sheet, a second adhesive layer, an antenna inlay sheet, a back printing sheet, and a back overlay sheet on the back surface of a metal sheet having the color pattern layer formed thereon, and then laminate them.
[0017] In the method for manufacturing a metal card having a color pattern according to the aforementioned features, the step (f) is characterized by laminating a first adhesive layer, an EMI absorption sheet, a second adhesive layer, an antenna inlay sheet, and a back metal printing sheet on the back surface of a metal sheet having the color pattern layer formed thereon, and then laminating them. The metal sheet has a first chip insertion hole in which a chip module for the card is mounted, and the back metal printing sheet may have a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a slit connecting the second chip insertion hole and the edge of the back metal printing sheet.
[0018] In the method for manufacturing a metal card having a color pattern according to the aforementioned features, the step (f) is characterized by laminating an antenna inlay sheet, an adhesive layer, a back printing sheet, and a back overlay sheet onto the back surface of a metal sheet having the color pattern layer formed thereon, and then laminating them. The metal sheet may have a chip insertion hole for mounting a chip module for a card, and a slit connecting the chip insertion hole and the edge of the metal sheet.
[0019] In the method for manufacturing a metal card having a color pattern according to the aforementioned features, the step (f) is characterized by laminating an antenna inlay sheet, an adhesive layer, and a back metal printing sheet on the back surface of a metal sheet having the color pattern layer formed thereon, and then laminating them. The metal sheet may have a first chip insertion hole in which a chip module for the card is mounted, and a first slit connecting the first chip insertion hole and the edge of the metal sheet, and the back metal printing sheet may have a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a second slit connecting the second chip insertion hole and the edge of the back metal printing sheet.
[0020] In the method for manufacturing the metal card having a color pattern according to the aforementioned features, the step (f) is preferably made of an epoxy material sheet having a predetermined thickness, and a bending prevention sheet is placed between the antenna inlay sheet and the back printing sheet and then laminated.
[0021] A metal card having a color pattern according to the present invention having the above-described configuration can form a color pattern layer using a UV-curable color ink colored by mixing a color pigment with a UV-curable resin. In addition, the metal card according to the present invention can form a pattern layer on the surface of a metal sheet using a UV-curable resin by curing the UV-curable resin in two stages of pre-curing and full curing using a master mold engraved with a pattern design.
[0022] As such, the metal card according to the present invention utilizes UV-curable color ink to implement the existing color layer and pattern layer into a single color pattern layer, thereby eliminating the risk of the color layer and pattern layer separating even if they are damaged by external impact or prolonged use.
[0023] In addition, the metal card according to the present invention simplifies the card manufacturing process by implementing the color layer and the pattern layer as a single color pattern layer, thereby enabling a reduction in manufacturing costs.
[0024] FIG. 1 is a cross-sectional view illustrating a metal card according to a first embodiment of the present invention.
[0025] FIG. 2 is a flowchart sequentially illustrating a method for manufacturing a metal card according to a first embodiment of the present invention.
[0026] FIG. 3 is a cross-sectional view illustrating a pre-cured state of UV-curable color ink applied to a master mold in a method for manufacturing a metal card according to the first embodiment of the present invention.
[0027] FIG. 4 is a cross-sectional view illustrating a metal card according to a second embodiment of the present invention.
[0028] FIG. 5 is a cross-sectional view illustrating a metal card according to a third embodiment of the present invention.
[0029] FIG. 6 is a cross-sectional view illustrating a metal card according to a fourth embodiment of the present invention.
[0030] Hereinafter, a metal card and a method for manufacturing the same according to preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In order to facilitate an overall understanding in describing the present invention, the same reference numerals are used for identical components in the drawings, and redundant descriptions of identical components are omitted.
[0031]
[0032] < 1st Example >
[0033] FIG. 1 is a cross-sectional view illustrating a metal card according to a first embodiment of the present invention. Referring to FIG. 1, the metal card (1) according to the present invention comprises a metal sheet (10) made of a plate material of metal having a preset card size, a color pattern layer (11), an EMI absorption sheet (12), an antenna inlay sheet (13), a back printing sheet (14), and a back overlay sheet (15). The color pattern layer (11) is mounted on the upper surface of the metal sheet (10). The EMI absorption sheet (12), the antenna inlay sheet (13), the back printing sheet (14), and the back overlay sheet (15) are sequentially laminated on the back surface of the metal sheet (10). Electrically insulating adhesive layers (17) are respectively disposed between the metal sheet and the EMI absorption sheet, and between the EMI absorption sheet (12) and the antenna inlay sheet (13). The above-described components will be explained in more detail below.
[0034] The metal sheet (10) may have a main body made of a metal sheet and may have a chip insertion hole formed in a predetermined area of the main body to mount a chip module for a card. The metal sheet (10) is a plate material that will become the body sheet of a metal card, and the thickness and material of the metal plate material may be determined according to the shape and type of the metal card to be completed. A chip module for a combi card that enables the metal card to communicate in both contact and non-contact ways may be mounted in the chip insertion hole of the metal sheet, or a chip module for a contact card that enables contact communication may be mounted. The metal sheet (10) may be made of one of the following metal materials: steel including SUS, gold, silver, copper, titanium, duralumin, aluminum, aluminum alloy, carbon, etc.
[0035] The color pattern layer (11) is a layer formed by UV curing a UV-curable color ink, which is colored by mixing a color pigment with a UV-curable resin, and a pattern of a predetermined three-dimensional shape is provided on one surface. The color pattern layer (11) is mounted on the upper surface of a metal sheet. The color pattern layer of the metal card according to the present invention is characterized by being completed through two stages of curing: pre-curing and full-curing of the UV-curable color ink. The pre-curing is performed while the UV-curable color ink constituting the color pattern layer (11) is applied to the surface of a master mold. The full-curing is performed while the pre-cured UV-curable color ink is transferred to the upper surface of a metal sheet. The degree of pre-curing may vary depending on the material and process, and it is preferable that it proceed to about 10% to 50% of the total curing.
[0036] Patterns provided on the color pattern layer (11) include spin, lenticular, hologram, hairline, Fresnel, stripe, etc. The metal card according to the present invention can realize the pattern layer and the color layer as one layer by using a UV-curable resin mixed with color pigment to realize the color pattern layer.
[0037] The process of forming a color pattern layer (11) on the upper surface of a metal sheet is as follows. First, a UV-curable color ink is prepared by mixing an arbitrary color pigment into a transparent UV-curable resin. Next, the colored UV-curable color ink is applied to the surface of the master mold where the pattern is formed, and then pressure is applied. The pressurized product is pre-cured using a UV dryer. The pre-cured UV-curable color ink is transferred to the upper surface of the metal sheet, and the master mold is separated. Next, the pre-cured UV-curable color ink transferred to the upper surface of the metal sheet is completely cured using a UV dryer. Through the above process, the color pattern layer (11) on the upper surface of the metal sheet (10) is completed.
[0038] In this regard, conventional cards are completed by sequentially laminating different pattern layers and color layers onto the surface of a metal sheet, which leads to problems such as the separation or detachment of each layer due to long-term use. However, the metal card according to the present invention can solve the problems that arise from laminating different pattern layers and color layers in conventional cards by implementing a colored pattern layer using UV-curable color ink. Furthermore, the card according to the present invention can simplify the card manufacturing process and reduce manufacturing costs by implementing the pattern layer and color layer as a single layer.
[0039] The above EMI (Electromagnetic Interference) absorbing sheet (12) is composed of graphite, carbon fiber, ferrite material, etc., and is a sheet that absorbs or reflects electromagnetic waves to block them from penetrating. In particular, it is preferable that the EMI absorbing sheet according to the present invention is an effective EMI absorbing sheet in the range of tens of MHz to hundreds of MHz. The above EMI absorbing sheet may use a ferrite sheet made of a ferrite material having ferromagnetism. In addition, the above EMI absorbing sheet may use an electromagnetic wave absorbing sheet. The electromagnetic wave absorbing sheet is a sheet made to a predetermined thickness by mixing powders of materials having the property of absorbing electromagnetic waves with a binder. In the above electromagnetic wave absorbing sheet, the powder having the property of absorbing electromagnetic waves is composed of silicon (Si), chromium (Cr), iron (Fe), and a binder in amounts of 1 to 10 wt%, 1 to 10 wt%, 70 to 90 wt%, and 5 to 15 wt%, respectively, and the binder may be composed of a urethane-based resin. It is preferable that the thickness of the EMI absorbing sheet be determined according to the communication performance at the communication frequency of the card chip module. Accordingly, since the radio frequency used for the card chip module is 13.56 MHz to 19 MHz, it is preferable to determine the thickness of the EMI absorbing sheet so that RF communication at this communication frequency is possible.
[0040] The antenna inlay sheet (13) is a sheet formed such that its main body is made of a synthetic resin material, and antenna wiring connected to a card chip module is patterned on the surface of the main body or an antenna coil is mounted thereon. The antenna coil is wound several times on the surface of the main body of the antenna inlay sheet to form a single closed loop, and both ends of the COB type card chip module are electrically connected to both ends of the antenna wiring or the antenna coil. The synthetic resin material constituting the main body of the antenna inlay sheet may be made of one of Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET), Polyethylene Terephthalate Glycol (PET-G), or Polycarbonate (PC). It is preferable that the antenna inlay sheet (13) according to the first embodiment be manufactured in the size of a card.
[0041] The above-described rear printing sheet (14) is a sheet made of synthetic resin material and is characterized by having a pattern, design, or pattern printed on its surface. The above-described rear overlay sheet (15) is made of a transparent synthetic resin material and is placed on the exposed surface of the above-described rear printing sheet to protect the surface of the rear printing sheet. A magnetic strip may be attached to the back surface of the above-described rear overlay sheet. The synthetic resin material in this specification may be one of Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET), Polyethylene Terephthalate Glycol (PET-G), and Polycarbonate (PC).
[0042] The adhesive layer (17) may be placed between the metal sheet and the EMI absorption sheet and between the EMI absorption sheet and the antenna inlay sheet. The adhesive layers (17) may be formed by applying an adhesive, or a thermal adhesive film, such as a hot-melt film, which has the property of melting and bonding by heating and pressurizing, may be used. It is preferable that the adhesive layers have electrical insulation properties.
[0043] Meanwhile, the metal card according to the present invention may further include a lower cushioning sheet (not shown) for preventing bending between the antenna inlay sheet (13) and the back printing sheet (14). The lower cushioning sheet for preventing bending is intended to prevent the metal card from bending and may be made of epoxy material.
[0044] Hereinafter, a method for manufacturing a metal card according to a first embodiment of the present invention will be described in detail with reference to FIG. 2. FIG. 2 is a flowchart sequentially illustrating a method for manufacturing a metal card according to a first embodiment of the present invention.
[0045] Referring to FIG. 2, the method for manufacturing a metal card according to the first embodiment of the present invention first produces a master mold having a three-dimensional pattern engraved on one surface (step 200). The process of producing the master mold first produces a graphic master of the pattern. Next, a photoresist ('PR') solution is applied to a PC material plate, and then the graphic master and the PC material plate coated with PR are combined. Then, the combined result is exposed to light and then washed with chemicals to complete the master mold of the PC material having a pattern engraved on its surface. The master mold (30) according to the present invention is completed by having a pattern engraved three-dimensionally on one surface of a PC material plate.
[0046] Next, a UV-curable color ink is prepared by mixing an arbitrary color pigment into a transparent UV-curable resin (Step 210). Next, the mixed UV-curable color ink is applied to the surface of the master mold imprinted with a pattern design and then pressurized (Step 220). Next, UV irradiation is applied to the surface of the master mold coated with the UV-curable color ink to pre-cure the UV-curable color ink (Step 230). At this time, the degree of pre-curing may vary depending on the material and process, and it is preferable to proceed to about 10% to 50% of the total curing. In this pre-curing stage, it is preferable that the UV-curable color ink is not completely hardened but is cured to a degree that allows for subsequent processes. In this way, by pre-curing the UV-curable color ink applied to the surface of the master mold, the material is fixed to prevent flow, thereby maintaining the basic shape and enabling the subsequent transfer process to proceed. FIG. 3 is a cross-sectional view illustrating a pre-cured state of UV-curable color ink applied to a master mold in a method for manufacturing a metal card according to a first embodiment of the present invention. Referring to FIG. 3, the color-mixed UV-curable color ink (11) is applied to the surface of the master mold (30) according to the present invention, on which a pattern design is imprinted, and then pre-cured.
[0047] Next, the pre-cured UV-curable color ink is transferred to the upper surface of the metal sheet, and then the master mold is separated (step 240). Next, the pre-cured UV-curable color ink transferred to the upper surface of the metal sheet is fully cured using a UV dryer, thereby completing the color pattern layer on the upper surface of the metal sheet (step 250).
[0048] Next, sheets constituting a metal card are sequentially laminated on the back surface of the metal sheet (step 260). Here, the sheets constituting the metal card according to the first embodiment are an EMI absorption sheet, a first adhesive layer, an antenna inlay sheet, a second adhesive layer, a back printing sheet, and a back overlay sheet. However, the sheets constituting the metal card may be configured in various ways depending on the type of metal card. Next, the laminated result is laminated by applying pressure and heat (step 270). Through this process, the card sheet is completed. Next, the completed card sheet is cut to a preset card size to complete a unit card (step 280), and then a card chip module is attached to the unit card to complete the card (step 290).
[0049] The process of completing a card by attaching a card chip module to a unit card (step 290) is described in more detail below. In order to connect the terminals of the card chip module with the terminals of the antenna wiring of the antenna inlay sheet and to insert the card chip module into the card body, the insertion portion of the card chip module is milled to form a chip insertion hole, and then the terminals of the antenna wiring of the antenna inlay sheet embedded in the card body are pulled out and protruded above the insertion hole. Next, the central area of the insertion hole of the card body is milled a second time to match the size of the back mold of the card chip module to complete the insertion hole. Next, two contact points for the terminals of the card chip module and the terminals of the antenna wiring are welded using a spot welding method to electrically connect the card chip module and the antenna wiring. The card chip module is embedded into the insertion hole of the card body by applying heat and pressure to the front of the card body using an embedding mold. Next, according to a preset card design, a hologram and a signature plate are stamped on the surface of a rear overlay sheet located on the back of the card body to complete the metal card according to the present invention.
[0050] By the above-described configuration, the metal card according to the present invention can realize a color pattern layer using a UV-curable color ink made by coloring a transparent UV-curable resin.
[0051]
[0052] < 2nd Example >
[0053] Hereinafter, a metal card according to a second embodiment of the present invention will be described in detail with reference to the attached drawings. FIG. 4 is a cross-sectional view illustrating a metal card according to a second embodiment of the present invention.
[0054] Referring to FIG. 4, a metal card (2) according to a second embodiment of the present invention comprises a metal sheet (20) made of a metal plate having a preset card size, a color pattern layer (21), an EMI absorption sheet (22), an antenna inlay sheet (23), and a back metal printing sheet (24). The color pattern layer (21) is mounted on the upper surface of the metal sheet (20). The EMI absorption sheet (22), the antenna inlay sheet (23), and the back metal printing sheet (24) are sequentially laminated on the back surface of the metal sheet (20). Electrically insulating adhesive layers (37) are respectively disposed between the metal sheet (20) and the EMI absorption sheet (22), and between the EMI absorption sheet (22) and the antenna inlay sheet (23). The metal card according to the second embodiment is characterized by having a back metal printing sheet (24) in place of the back printing sheet and back overlay sheet of the first embodiment. In this embodiment, the description of the component identical to the corresponding component of the first embodiment described above is omitted.
[0055] The metal sheet (30) of the metal card (2) according to the second embodiment of the present invention has a first chip insertion hole for mounting a chip module for a card in a predetermined area of the main body. The chip module for a card mounted in the first chip insertion hole of the metal sheet of the metal card according to the second embodiment may be composed of a chip module for a combination card or a chip module for a contactless card, similar to the first embodiment.
[0056] The color pattern layer (21) of the metal card (2) according to the second embodiment of the present invention is formed on the upper surface of the metal sheet (20) by undergoing two stages of pre-curing and full curing of UV-curable color ink. The process of forming the color pattern layer is the same as that of the first embodiment, and a redundant description is omitted.
[0057] The rear metal printing sheet (24) is made of a metal material, has a printed layer formed on one surface, and is placed on the back surface of the antenna inlay sheet. The rear metal printing sheet (24) has a second chip insertion hole formed at a position corresponding to the first chip insertion hole, and a slit formed by cutting between the side of the second chip insertion hole and the corner of the main body of the rear metal printing sheet. In this way, by providing a slit in the rear metal printing sheet (24), the chip modules for the card can communicate wirelessly with an external card reader normally.
[0058] The process of forming a color pattern layer on the upper surface of a metal sheet in the method for manufacturing a metal card according to the second embodiment of the present invention is the same as the method for manufacturing a metal card according to the first embodiment described above. The method for manufacturing a metal card according to the second embodiment sequentially laminates a first adhesive layer, an EMI absorption sheet, a second adhesive layer, an antenna inlay sheet, and a back metal printing sheet onto the back surface of the metal sheet on which the color pattern layer is formed, and then laminates them. The manufacturing process after lamination in the method for manufacturing a metal card according to the second embodiment of the present invention is the same as the method for manufacturing a metal card according to the first embodiment described above.
[0059]
[0060] < 3rd Example >
[0061] Hereinafter, a metal card according to a third embodiment of the present invention will be described in detail with reference to the attached drawings. FIG. 5 is a cross-sectional view illustrating a metal card according to a third embodiment of the present invention.
[0062] Referring to FIG. 5, a metal card (3) according to a third embodiment of the present invention comprises a metal sheet (30), a color pattern layer (31), an antenna inlay sheet (33), a back printing sheet (34), and a back overlay sheet (35), wherein an adhesive layer having electrical insulation properties is disposed between the metal sheet and the antenna inlay sheet. The color pattern layer (31) is mounted on the upper surface of the metal sheet (30). The antenna inlay sheet (33), the back printing sheet (34), and the back overlay sheet (35) are sequentially laminated on the back surface of the metal sheet (30). Unlike the first embodiment, the metal card according to the third embodiment does not have an EMI absorption sheet. Furthermore, the remaining components of the metal card according to the third embodiment, excluding the metal sheet, are identical to the corresponding components of the metal card of the first embodiment, except that the shape of the metal sheet and the antenna inlay sheet is different from the corresponding components of the first embodiment. Therefore, in this embodiment, the description of components identical to the corresponding components of the first embodiment is omitted.
[0063] The metal sheet (30) of the metal card (3) according to the third embodiment of the present invention is characterized by having a chip insertion hole for mounting a chip module for a card in a predetermined area of the main body, and having a slit formed by cutting between the corner of the main body of the metal sheet and the side of the insertion hole. The chip module for a card mounted in the chip insertion hole of the metal sheet of the metal card according to the second embodiment may be composed of a chip module for a combi card or a chip module for a contactless card, similar to the first embodiment.
[0064] The antenna inlay sheet (33) is made smaller than the size of the card, and it is preferable to insulate the surface of the antenna inlay sheet by coating it with a material having electrical insulation properties.
[0065] The color pattern layer (31) of the metal card (3) according to the third embodiment of the present invention is formed on the upper surface of the metal sheet (30) by undergoing two stages of pre-curing and full curing of UV-curable color ink. The process of forming the color pattern layer is the same as that of the first embodiment, and a redundant description is omitted.
[0066] The process of forming a color pattern layer on the upper surface of a metal sheet in the method for manufacturing a metal card according to the third embodiment of the present invention is the same as the method for manufacturing a metal card according to the first embodiment described above. The method for manufacturing a metal card according to the third embodiment involves laminating an antenna inlay sheet, an adhesive layer, a back printing sheet, and a back overlay sheet onto the back surface of the metal sheet on which the color pattern layer is formed, and then laminating them. The manufacturing process after lamination in the method for manufacturing a metal card according to the third embodiment of the present invention is the same as the method for manufacturing a metal card according to the first embodiment described above.
[0067]
[0068] < 4th Example >
[0069] Hereinafter, a metal card according to a fourth embodiment of the present invention will be described in detail with reference to the attached drawings. FIG. 6 is a cross-sectional view illustrating a metal card according to a fourth embodiment of the present invention.
[0070] Referring to FIG. 6, a metal card (4) according to a fourth embodiment of the present invention comprises a metal sheet (40), a color pattern layer (41), an antenna inlay sheet (43), an adhesive layer (47), and a back metal printing sheet (44). The color pattern layer (41) is mounted on the upper surface of the metal sheet (40). The antenna inlay sheet (43) and the back metal printing sheet (44) are sequentially laminated on the back surface of the metal sheet (30). Unlike the first embodiment, the metal card according to the fourth embodiment does not have an EMI absorption sheet and is characterized by having a back metal printing sheet (44) instead of the back printing sheet and back overlay sheet of the first embodiment.
[0071] The metal sheet (40) of the metal card (4) according to the fourth embodiment of the present invention has a first chip insertion hole for mounting a chip module for the card in a predetermined area of the main body, and a first slit formed by cutting between the side of the first chip insertion hole and the corner of the main body of the metal sheet.
[0072] The above-mentioned rear metal printing sheet (44) is made of a metal material, has a printed layer formed on one surface, and is placed on the back surface of the antenna inlay sheet. The above-mentioned rear metal printing sheet has a second chip insertion hole formed at a position corresponding to the first chip insertion hole, and a second slit formed by cutting between the side of the second chip insertion hole and the corner of the main body of the above-mentioned rear metal printing sheet. In this way, by providing the first slit and the second slit in the metal sheet (40) and the rear metal printing sheet (44), respectively, the chip modules for the card can communicate wirelessly with an external card reader normally without an EMI absorption sheet.
[0073] The chip module for a card mounted in the insertion hole of the metal sheet of the metal card according to the fourth embodiment may be composed of a chip module for a combination card or a chip module for a contactless card, similar to the first embodiment.
[0074] The antenna inlay sheet (43) is made smaller than the size of the card, and it is preferable to insulate the surface of the antenna inlay sheet by surface coating it with a material having electrical insulation properties.
[0075] The color pattern layer (41) of the metal card (4) according to the fourth embodiment of the present invention is formed on the upper surface of the metal sheet (40) through two stages of pre-curing and full curing of UV-curable color ink. The process of forming the color pattern layer is the same as that of the first embodiment, and a redundant description is omitted.
[0076] The process of forming a color pattern layer on the upper surface of a metal sheet in the method for manufacturing a metal card according to the fourth embodiment of the present invention is the same as the method for manufacturing a metal card according to the first embodiment described above. The method for manufacturing a metal card according to the fourth embodiment involves laminating an antenna inlay sheet, an adhesive layer, and a back metal printing sheet onto the back surface of the metal sheet on which the color pattern layer is formed, and then laminating them. The manufacturing process after lamination in the method for manufacturing a metal card according to the fourth embodiment of the present invention is the same as the method for manufacturing a metal card according to the first embodiment described above.
[0077] Although the present invention has been described above with reference to preferred embodiments, this is merely illustrative and does not limit the invention. Those skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the invention. For example, appropriate results may be achieved even if the described techniques are performed in a different order than described, and / or if the components of the described system, structure, device, circuit, etc. are combined or assembled in a form different from described, or replaced or substituted by other components or equivalents. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the invention as defined in the appended claims. Therefore, other implementations, other embodiments, and equivalents to the claims should also be interpreted as falling within the scope of the claims set forth below.
Claims
1. A metal card having a metal sheet on the front surface made of a metal plate having a preset card size, A color pattern layer mounted on the upper surface of the metal sheet, wherein a predetermined pattern is formed on one surface, and the metal sheet has a color pattern layer mounted thereon. A metal card having a color pattern, characterized in that the color pattern layer is formed by curing a UV-curable color ink colored by mixing a color pigment into a transparent UV-curable resin material, and a predetermined pattern is formed on one surface.
2. In paragraph 1, the metal card is, An EMI absorbing sheet configured to absorb or reflect electromagnetic waves, wherein the sheet is disposed on the back surface of the metal sheet; An antenna inlay sheet is formed on the back surface of the EMI absorption sheet and comprises a main body made of synthetic resin material, an antenna coil is mounted on the surface of the main body; A rear printing sheet made of a synthetic resin material, having a printing layer formed on one surface and disposed on the back surface of the antenna inlay sheet; and A rear overlay sheet made of a transparent synthetic resin material and disposed on the back surface of the rear printing sheet; is provided. A metal card having a color pattern, characterized in that an adhesive layer having electrical insulation is formed between the metal sheet and the EMI absorption sheet and between the EMI absorption sheet and the antenna inlay sheet.
3. In paragraph 1, the metal card is, An EMI absorbing sheet configured to absorb or reflect electromagnetic waves, wherein the sheet is disposed on the back surface of the metal sheet; An antenna inlay sheet comprising a main body made of synthetic resin material, with an antenna coil mounted on the surface of the main body and disposed on the back surface of the EMI absorption sheet; and A rear metal printing sheet made of a metal material, having a printing layer formed on one surface, and disposed on the back surface of the antenna inlay sheet; comprising The invention is characterized by having electrically insulating adhesive layers formed between the metal sheet and the antenna inlay sheet, and between the antenna inlay sheet and the rear metal printing sheet. The above metal sheet has a first chip insertion hole in which a chip module for a card is mounted, and A metal card having a color pattern, characterized in that the rear metal printing sheet comprises a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a slit connecting the second chip insertion hole and the edge of the rear metal printing sheet.
4. In paragraph 1, the metal card is, An antenna inlay sheet is formed on the back surface of the metal sheet and comprises a main body made of synthetic resin material, an antenna coil is mounted on the surface of the main body; A rear printing sheet made of a synthetic resin material, having a printing layer formed on one surface and disposed on the back surface of the antenna inlay sheet; and A rear overlay sheet made of a transparent synthetic resin material and disposed on the back surface of the rear printing sheet; is provided. A metal card having a color pattern, characterized in that the metal sheet comprises a chip insertion hole for mounting a chip module for a card, and a slit connecting the chip insertion hole and the edge of the metal sheet.
5. In paragraph 1, the metal card is, An antenna inlay sheet disposed on the back surface of the metal sheet, the antenna coil mounted on the surface of the main body which is made of a synthetic resin material; and A rear metal printing sheet made of a metal material, having a printing layer formed on one surface, and disposed on the back surface of the antenna inlay sheet; comprising The metal sheet has a first chip insertion hole in which a chip module for a card is mounted and a first slit connecting the first chip insertion hole and the edge of the metal sheet. A metal card having a color pattern, characterized in that the rear metal printing sheet comprises a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a second slit connecting the second chip insertion hole and the edge of the rear metal printing sheet.
6. In claim 1, the color pattern layer A metal card having a color pattern, characterized by applying the UV-curable color ink to the surface of a master mold having a predetermined pattern formed on one side and pre-curing it, transferring the pre-cured UV-curable color ink to the upper surface of the metal sheet, and completely curing the UV-curable color ink transferred to the metal sheet.
7. In either paragraph 2 or paragraph 4, the metal card is, A metal card having a color pattern, further comprising a bending prevention sheet disposed between the antenna inlay sheet and the back printing sheet, the sheet being made of an epoxy material having a predetermined thickness. 8.(a) A step of producing a master mold having a predetermined pattern formed on one surface; (b) a step of producing a UV-curable color ink by mixing a color pigment into a UV-curable resin material; (c) a step of applying the UV-curable color ink to one surface of the master mold, applying pressure, and pre-curing; (d) a step of transferring a pre-cured UV-curable color ink onto the surface of a metal sheet; (e) a step of fully curing the UV-curable color ink transferred to the surface of the metal sheet to form a color pattern layer on the surface of the metal sheet; and (f) A step of sequentially laminating sheets constituting a metal card onto the back surface of a metal sheet having a color pattern layer formed thereon, and then laminating them; A method for manufacturing a metal card having a color pattern characterized by comprising 9. In paragraph 8, the above step (f) is, A method for producing a metal card having a color pattern, characterized by laminating a first adhesive layer, an EMI absorption sheet, a second adhesive layer, an antenna inlay sheet, a back printing sheet, and a back overlay sheet onto the back surface of a metal sheet having the color pattern layer formed thereon, and then laminating them.
10. In paragraph 8, the above step (f) is, The method is characterized by laminating a first adhesive layer, an EMI absorption sheet, a second adhesive layer, an antenna inlay sheet, and a rear metal printing sheet onto the back surface of a metal sheet having the above-mentioned color pattern layer, and then laminating them. The above metal sheet has a first chip insertion hole in which a chip module for a card is mounted, and A method for producing a metal card having a color pattern, characterized in that the rear metal printing sheet comprises a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a slit connecting the second chip insertion hole and the edge of the rear metal printing sheet.
11. In paragraph 8, the above step (f) is, The method is characterized by laminating an antenna inlay sheet, an adhesive layer, a back printing sheet, and a back overlay sheet onto the back surface of a metal sheet having the above-mentioned color pattern layer, and then laminating them. A method for manufacturing a metal card having a color pattern, characterized in that the metal sheet comprises a chip insertion hole for mounting a chip module for a card and a slit connecting the chip insertion hole and the edge of the metal sheet.
12. In paragraph 8, the above step (f) is, The method is characterized by laminating an antenna inlay sheet, an adhesive layer, and a back metal printing sheet onto the back surface of a metal sheet having the above-mentioned color pattern layer, and then laminating them. The metal sheet has a first chip insertion hole in which a chip module for a card is mounted, and a first slit connecting the first chip insertion hole and the edge of the metal sheet. A method for producing a metal card having a color pattern, characterized in that the rear metal printing sheet comprises a second chip insertion hole formed at a position corresponding to the first chip insertion hole and a second slit connecting the second chip insertion hole and the edge of the rear metal printing sheet.
13. In either of paragraphs 9 and 11, the above step (f) is, A method for manufacturing a metal card having a color pattern, characterized by being made of an epoxy sheet having a predetermined thickness, and then laminating a bending prevention sheet placed between the antenna inlay sheet and the back printing sheet.