Environmentally friendly polishing pad and manufacturing method thereof

Abstract

Embodiments relate to a polishing pad comprising a top pad layer and a sub-pad layer, and a manufacturing method thereof, and relate to a polishing pad which is environmentally friendly as a result of comprising biomass components, and a manufacturing method thereof.

Description

Eco-friendly polishing pad and method of manufacturing the same

[0001] An embodiment relates to a polishing pad used in a chemical mechanical polishing (CMP) process for semiconductor devices, and specifically, to a polishing pad having eco-friendliness by including biomass components and a method for manufacturing the same.

[0002]

[0003] The Chemical Mechanical Polishing (CMP) process in semiconductor manufacturing is a process that flattens the uneven parts of the semiconductor substrate surface by attaching a semiconductor substrate, such as a wafer, to a head and moving the platen and the head relative to each other while the substrate is in contact with the surface of a polishing pad fixed on a platen.

[0004] In such a CMP process, the polishing pad is required to possess stable physical properties because it significantly affects the surface processing quality of the semiconductor substrate. In particular, since the polishing rate of the CMP process can vary sensitively depending on the components and physical properties contained in the polishing pad, it is necessary to optimize the components and physical properties of the polishing pad.

[0005] Meanwhile, with the recent emergence of environmental issues such as climate change, public opinion is forming that companies must assume social responsibility to build a sustainable society through ESG management, such as carbon neutrality. Accordingly, various companies are attempting to manufacture a variety of products by applying biomass raw materials derived from plants and other sources instead of petroleum-based raw materials.

[0006] In line with this trend, there is a need to attempt to enhance eco-friendliness by applying biomass raw materials to polishing pads that were previously manufactured using petroleum-based raw materials. Furthermore, there is a need to provide polishing pads with physical properties capable of achieving the polishing rate required in the CMP process, even when the aforementioned biomass raw materials are applied.

[0007] [Prior Art Literature]

[0008] [Patent Literature]

[0009] (Patent Document 1) Korean Published Patent Application No. 2018-0044771

[0010]

[0011] The embodiment aims to provide a polishing pad having properties that enable excellent eco-friendliness and achieve a polishing rate at a level required in the CMP process.

[0012] In addition, the embodiment aims to provide a method for manufacturing a polishing pad that can efficiently manufacture the polishing pad.

[0013]

[0014] According to an embodiment for solving the above problem, a grinding pad is provided comprising a biomass-containing top pad layer and a biomass-containing sub pad layer, wherein the biomass content of the sub pad layer is 10% to 30% by weight based on the total weight of the sub pad layer, the hardness of the top pad layer is 46 Shore D to 55 Shore D, and the total biomass content measured by ASTM D6866 is 50% to 70% by weight.

[0015] According to another embodiment, a method for manufacturing a polishing pad is provided, comprising the steps of: manufacturing a biomass-containing urethane prepolymer from a urethane prepolymer composition comprising an isocyanate raw material and a polyol raw material comprising a bio-based polyol; preparing a biomass-containing composition comprising the biomass-containing urethane prepolymer, a curing agent, and a foaming agent; curing the biomass-containing composition to manufacture a top pad layer having a polished surface; and attaching a sub-pad layer to the top pad layer, wherein the sub-pad layer has a biomass content of 10% to 30% by weight, the hardness of the top pad layer is 46 Shore D to 55 Shore D, and the polishing pad has a total biomass content of 50% to 70% by weight as measured by ASTM D6866.

[0016]

[0017] The polishing pad according to the above embodiment is manufactured using a composition containing biomass raw materials, and the biomass content contained in the polishing pad is controlled within a specific range by adjusting the components and content of the biomass raw materials, thereby exhibiting excellent eco-friendliness and characteristics such as hardness and modulus required in the CMP process.

[0018] Therefore, when performing a CMP process using a polishing pad according to the embodiment, it is possible to provide a semiconductor substrate, such as a wafer, that exhibits a high polishing rate and excellent surface processing quality.

[0019]

[0020] FIG. 1 is a cross-sectional view showing a polishing pad according to one embodiment.

[0021]

[0022] The invention is described below through embodiments. The embodiments disclosed below are not limited to the contents disclosed below and may be modified in various forms as long as the essence of the invention is not altered.

[0023] In this specification, the description that one component is formed above or below another component, or is connected or coupled to one another, includes both direct formation, connection, or coupling between these components and indirect formation, connection, or coupling through the interposition of another component. Furthermore, it should be understood that the criteria for the "above" and "below" of each component may vary depending on the direction in which the object is observed.

[0024] In this specification, the use of the word “comprising” is intended to specify certain characteristics, regions, steps, processes, elements, and / or components, and unless specifically stated otherwise, it does not exclude the presence or addition of other characteristics, regions, steps, processes, elements, and / or components.

[0025] All numbers and expressions indicating the amounts of components, reaction conditions, etc. described in this specification shall be understood to be modified by the term "about" in all cases unless otherwise specified.

[0026]

[0027] Polishing pad

[0028] An embodiment provides a polishing pad comprising a top pad layer and a sub-pad layer, and optionally further comprising an adhesive layer. The polishing pad according to this embodiment is manufactured using a composition containing biomass raw materials, and is characterized in that the biomass content contained in the polishing pad is controlled within a specific range by optimizing the components and content of the biomass raw materials. This is described in detail below with reference to FIG. 1.

[0029] The above biomass refers to an energy source obtained from living organisms, specifically animal and plant resources such as trees, flowers, corn, sugarcane, grass, whale oil, algae, etc.; or an energy source obtained from organic waste resources such as livestock manure, food waste, sawdust, etc., which may include biocarbon (radiocarbon (C14)).

[0030] Meanwhile, the biomass (biocarbon) content described below may refer to values ​​measured in accordance with ASTM D 6866. The ASTM D 6866 standard is a standard analytical method for measuring the biomass (biocarbon) content of solid, liquid, or gaseous samples using radiometric dating or accelerator mass spectrometry (AMS) methods.

[0031] The above radiocarbon dating method may include the following process. Specifically, a sample (specimen) that has undergone pretreatment (e.g., removal of foreign substances) is placed in a special vacuum device and burned to produce carbon dioxide. Next, molten lithium is mixed to produce lithium carbide, which is then cooled and reacted with water to produce acetylene gas. Next, the acetylene gas is purified and converted into benzene using a silica-alumina catalyst. Next, benzene, which is 92% carbon, is mixed with a scintillation chemical, and its radioactivity is measured for about two days using a liquid scintillation counter.

[0032] The above accelerated mass spectrometry method may include the following process. Specifically, a sample (specimen) that has undergone pretreatment (e.g., removal of foreign substances) is burned to produce purified carbon dioxide, and then reacted with hydrogen in a vacuum chamber made of special glass to produce graphite. Then, the graphite, which is 100% carbon, is placed in an accelerated mass spectrometer and radioactivity is measured for about 30 minutes.

[0033]

[0034] Top pad layer

[0035] The top pad layer (10) included in the polishing pad (100) according to the embodiment serves to polish a semiconductor substrate (e.g., a wafer) that is to be polished. This top pad layer (10) includes a biomass-containing urethane prepolymer. Specifically, the top pad layer (10) is manufactured (formed) using a composition (A) containing a biomass raw material, wherein the biomass raw material may be a biomass-containing urethane prepolymer (A1).

[0036] The above urethane prepolymer (A1) may be a prepolymer obtained through the reaction of an isocyanate raw material and a polyol raw material including a bio-based polyol. Specifically, the above urethane prepolymer (A1) may include an isocyanate raw material (A12) and a polyol raw material (A11) including a bio-based polyol.

[0037] The polyol raw material (A11) containing the above bio-based polyol may not be particularly limited as long as it is a polyol raw material that is derived from biomass and contains biocarbon, and contains a bio-based polyol having two or more hydroxyl groups (OH). Specifically, the above polyol raw material (A11) may include a bio-based polyol comprising one or more selected from the group consisting of a bio-based polymer polyol (A111) and a bio-based monomer polyol (A112). For example, the above bio-based polyol may consist of the above bio-based polymer polyol (A111) alone or the above bio-based monomer polyol (A112) alone, or may consist of a mixture of the above bio-based polymer polyol (A111) and the above bio-based monomer polyol (A112).

[0038] The above bio-based polymer polyol (A111) may not be particularly limited as long as it is a multimolecular bio-based polyol derived from biomass and containing biocarbon, having two or more hydroxyl groups (OH). Specifically, the bio-based polymer polyol (A111) may include one or more selected from the group consisting of bio-based polyether polyol, bio-based polyester polyol, bio-based polycarbonate polyol, and bio-based polycaprolactam polyol. As the above bio-based polymer polyol (A111) includes the above multimolecular bio-based polyol, it is possible to provide a polishing pad (100) with excellent flexibility, elastic recovery, permanent deformation, weather resistance, and hydrolysis resistance while ensuring processability by lowering the viscosity of the urethane prepolymer composition. For example, the above bio-based polymer polyol (A111) may include SK Chemical’s ECOTRION H2000 or ECOTRION H1000; SK Pucore’s BI-550 or B-1184; BASF’s Sovermol 1102, Sovermol 1005, Sovermol 805 or Sovermol 815; NOROO’s BP-04 or BP-05; Croda’s Priplast 2033 or Priplast 1838; ALLESSA’s Velvetol H500, Velvetol H1000, Velvetol H2000 or Velvetol H2700; or a combination thereof may be used.

[0039] The above bio-based polymer polyol (A111) may have a weight-average molecular weight of 400 to 3000 g / mol, specifically 450 to 2700 g / mol, 500 to 2300 g / mol, 600 to 1800 g / mol, 700 to 1500 g / mol, or 800 to 1200 g / mol. Additionally, the above bio-based polymer polyol (A111) may have a hydroxyl value (OH-value) of 35 to 250 mgKOH / g, specifically 45 to 230 mgKOH / g, 60 to 200 mgKOH / g, 70 to 180 mgKOH / g, 80 to 150 mgKOH / g, or 90 to 130 mgKOH / g. As the weight-average molecular weight and hydroxyl value (OH-value) of the above bio-based polymer polyol (A111) are each within the above ranges, a polishing pad (100) with excellent flexibility, elastic recovery, permanent deformation, weather resistance, and hydrolysis resistance can be provided.

[0040] The bio-based polymer polyol (A111) may have a biomass content (biocarbon content contained in the bio-based polymer polyol (A111)) based on the total weight of the bio-based polymer polyol (A111) of 20 to 100 weight%, specifically 25 to 100 weight%, 40 to 100 weight%, 50 to 100 weight%, 60 to 100 weight%, 70 to 100 weight%, or 80 to 100 weight%. As the biomass content of the bio-based polymer polyol (A111) is within the above range, a polishing pad (100) with excellent eco-friendliness and physical properties required in the CMP process can be provided.

[0041] The above bio-based monomer polyol (A112) is derived from biomass and contains biocarbon, but is not particularly limited as long as it is a monomeric bio-based polyol having two or more hydroxyl groups (OH). Specifically, the bio-based monomer polyol (A112) is bio-based ethylene glycol, bio-based diethylene glycol, bio-based 1,2-propylene glycol, bio-based 1,3-propanediol, bio-based 2-methyl-1,3-propanediol, bio-based 1,3-butanediol, bio-based 1,4-butanediol, bio-based 2,3-butanediol, bio-based n-butanol, bio-based isobutanol, bio-based It may include one or more selected from the group consisting of 1,5-pentanediol (bio-based 1,5-pentanediol), bio-based 2-octanol (bio-based 2-octanol), bio-based 1,9-nonanediol (bio-based 1,9-nonanediol), bio-based 1,10-decanediol (bio-based 1,10-decanediol), bio-based diethylene glycol, and bio-based isosorbide. Since the bio-based monomer polyol (A112) includes the monomolecular bio-based polyol, the crosslinking density of the urethane prepolymer composition is increased, thereby providing a polishing pad (100) with excellent hardness, durability, etc.

[0042] The above bio-based monomer polyol (A112) may have a weight-average molecular weight of 50 to 200 g / mol, specifically 55 to 180 g / mol, 60 to 150 g / mol, 65 to 130 g / mol, 70 to 100 g / mol, or 75 to 90 g / mol. As the weight-average molecular weight of the above bio-based monomer polyol (A112) is within the above range, a polishing pad (100) with excellent hardness, durability, etc. can be provided.

[0043] This bio-based monomer polyol (A112) may have a biomass content (biocarbon content contained in the bio-based monomer polyol (A112)) based on the total weight of the bio-based monomer polyol (A112) of 100 weight%. As the biomass content of the bio-based monomer polyol (A112) is within the above range, a polishing pad (100) with excellent eco-friendliness and physical properties required in the CMP process can be provided.

[0044] Meanwhile, the above isocyanate raw material (A12) may include a bio-based isocyanate (A121). The above bio-based isocyanate (A121) may be derived from biomass and contain biocarbon, and may not be particularly limited as long as it is a bio-based isocyanate having two or more isocyanate groups (NCO).

[0045] Specifically, the bio-based isocyanate (A121) may include bio-based 1,5-pentamethylene diisocyanate (Bio-based PDI) and bio-based toluene diisocyanate (Bio-based TDI).

[0046] The above bio-based isocyanate may have a molecular weight of 300 g / mol or less. For example, the above bio-based isocyanate may have a molecular weight of 250 g / mol or less, 200 g / mol or less, 150 g / mol or less, 100 g / mol or less, 90 g / mol or less, or 80 g / mol or less, and may have a molecular weight of 1 g / mol or more, 10 g / mol or more, 20 g / mol or more, 30 g / mol or more, 40 g / mol or more, 50 g / mol or more, 60 g / mol or more, or 70 g / mol or more. Specifically, the above bio-based isocyanate may have a molecular weight of 1 g / mol to 300 g / mol or 70 g / mol to 80 g / mol.

[0047] For example, as the above bio-based isocyanate (A121), bio-based 1,5-pentamethylene diisocyanate (Bio-based PDI) can be used, and specifically, Mitsui Chemicals' STABiO PDI (molecular weight 76 g / mol) can be used.

[0048] The above bio-based isocyanate (A121) may have an isocyanate terminal group content (NCO%) of 20 to 30 weight%, specifically 21 to 28 weight%, 22 to 26 weight%, or 23 to 25 weight%. As the NCO% of the above bio-based isocyanate (A121) is within the above range, a polishing pad (100) with excellent hardness, durability, etc. can be provided.

[0049] The bio-based isocyanate (A121) may have a biomass content (biocarbon content contained in the bio-based isocyanate (A121)) based on the total weight of the bio-based isocyanate (A121) of 50 to 100 weight%, specifically 55 to 95 weight%, 60 to 90 weight%, 63 to 80 weight%, or 65 to 75 weight%. As the biomass content of the bio-based isocyanate (A121) is within the above range, a polishing pad (100) with excellent eco-friendliness and physical properties required in the CMP process can be provided.

[0050] Meanwhile, the above isocyanate raw material (A12) may further include a petroleum-based isocyanate (A122). Specifically, the above isocyanate raw material (A12) may include one or more selected from the group consisting of petroleum-based aromatic diisocyanates, petroleum-based aliphatic diisocyanates, and petroleum-based alicyclic diisocyanates. More specifically, the above petroleum-based isocyanate (A122) may be one or more selected from the group consisting of petroleum-based aromatic diisocyanates and petroleum-based alicyclic diisocyanates.

[0051] For example, the above petroleum-based isocyanate (A122) may be one or more selected from the group consisting of toluene diisocyanate, naphthalene-1,5-diisocyanate, p-phenylene diisocyanate, toluidine diisocyanate, 4,4'-diphenylmethane diisocyanate, hexamethylene diisocyanate, 4,4'-methylenedicyclohexyl diisocyanate, and isophorone diisocyanate.

[0052] Preferably, the petroleum-based isocyanate (A122) may be one or more selected from the group consisting of toluene diisocyanate (TDI) and 4,4'-methylene dicyclohexyl diisocyanate (H12MDI).

[0053]

[0054] Meanwhile, when reacting the polyol raw material (A11)(z) and the isocyanate raw material (A12)(w), the reaction ratio (z:w) is not particularly limited, but considering the overall physical properties of the top pad layer (10), specifically, it may be a weight ratio of 1:1 to 1:2, a weight ratio of 1:1.4 to 1:2, a weight ratio of 1:1.6 to 1:1.9, or a weight ratio of 1:1.7 to 1:1.9.

[0055] In addition, the ratio (M) of the moles of the bio-containing raw material to the total moles of the polyol raw material (A11) and the isocyanate raw material (A12) may be 0.1 to 1.00, 0.2 to 1.00, 0.3 to 1.00, 0.4 to 1.00, 0.5 to 1.00, 0.6 to 1.00, 0.7 to 1.00, 0.8 to 1.00, 0.85 to 1.00, 0.86 to 1.00, or 0.87 to 1.00. Specifically, the ratio (M) may be a value calculated according to the following formula 1. As the ratio (M) is within the above range, a polishing pad (100) with excellent eco-friendliness and physical properties required in the CMP process can be provided.

[0056] [Equation 1]

[0057] M = (M BP1 + M BI1 ) / (M BP1 + M P2 + M BI1 + M I2 )

[0058] In the above Equation 1,

[0059] M BP1 is the number of moles (total number of moles) of bio-based polyol included in the urethane prepolymer composition, and

[0060] M P2 is the number of moles (total number of moles) of petroleum-based polyol included in the urethane prepolymer composition, and

[0061] M BI1 is the moles (total moles) of bio-based isocyanate included in the urethane prepolymer composition, and

[0062] M I2 is the moles (total moles) of petroleum-based isocyanate included in the urethane prepolymer composition.

[0063] The biomass-containing urethane prepolymer (A1) obtained through the reaction of the polyol raw material (A11) and the isocyanate raw material (A12) may have a biomass (biocarbon) content of 80% to 100% by weight. Specifically, the biomass content of the biomass-containing urethane prepolymer (A1), based on the total weight of the biomass-containing urethane prepolymer (A1), may be 81% to 100% by weight, 82% to 100% by weight, 83% to 100% by weight, 84% to 100% by weight, 85% to 100% by weight, 86% to 100% by weight, 87% to 100% by weight, 88% to 100% by weight, 89% to 100% by weight, or 90% to 100% by weight. As the biomass content of the above biomass-containing urethane prepolymer (A1) is within the above range, a polishing pad (100) with excellent eco-friendliness and physical properties required in the CMP process can be provided.

[0064] Meanwhile, the composition (A) containing the biomass-containing urethane prepolymer (A1) for forming the top pad layer (10) may further include a curing agent (A2) and a foaming agent (A3).

[0065] The curing agent (A2) may include a compound that undergoes a curing reaction with the biomass-containing urethane prepolymer (A1). Specifically, the curing agent (A2) may include one or more selected from the group consisting of aromatic amines, aliphatic amines, aromatic alcohols, and aliphatic alcohols. More specifically, the curing agent (A2) is 4,4'-methylenebis(2-chloroaniline), diethyltoluenediamine, diaminodiphenylmethane, dimethylthio-toluene diamine, propanediolbis p-aminobenzoate, diaminodiphenylsulfone, m-xylylenediamine, isophoronediamine, ethylenediamine, diethylenetriamine, triethylenetetramine, polypropylenediamine, polypropylenetriamine, and It may include one or more selected from the group consisting of bis(4-amino-3-chlorophenyl)methane.

[0066] The content of the curing agent (A2) may be 15 to 55 parts by weight per 100 parts by weight of the biomass-containing urethane prepolymer (A1), and specifically, may be 20 to 50 parts by weight, 25 to 45 parts by weight, or 30 to 40 parts by weight. Since the content of the curing agent (A2) is within the above range, it may be more advantageous to realize a polishing pad (100) with excellent physical properties.

[0067] Meanwhile, the reaction ratio (curing reaction ratio) of the biomass-containing urethane prepolymer (A1) and the curing agent (A2) is not particularly limited, but specifically, it may be an equivalent ratio of 1:0.5 to 1:1.3, an equivalent ratio of 1:0.6 to 1:1.2, an equivalent ratio of 1:0.7 to 1:1.1, or an equivalent ratio of 1:0.8 to 1:1. As the curing reaction is carried out at the above reaction ratio, the curing reaction is optimized, thereby providing a polishing pad (100) having physical properties (hardness, modulus, etc.) required in the CMP process.

[0068] The blowing agent (A3) is intended to form a porous structure within the top pad layer (10) and may include one or more selected from the group consisting of a solid blowing agent, a liquid blowing agent, and a gaseous blowing agent (e.g., gases such as nitrogen, argon, helium, and carbon dioxide). Specifically, the blowing agent (A3) may preferably be a solid blowing agent containing expandable particles.

[0069] The above-mentioned expandable particles are particles having the characteristic of being expandable by heat or pressure, and their size within the final top pad layer can be determined by the heat or pressure applied during the process of manufacturing the top pad layer (10). Specifically, the above-mentioned expandable particles may include thermally expanded particles, unexpanded particles, or a combination thereof. The thermally expanded particles are particles that have been pre-expanded by heat, and may refer to particles whose final size is determined by expansion caused by the heat or pressure applied during the process of manufacturing the top pad layer (10). Such expandable particles may include an outer shell made of resin material and an expansion-inducing component present inside that is enclosed by the outer shell.

[0070] The outer shell made of the above resin material may include a thermoplastic resin. Specifically, the thermoplastic resin may be one or more selected from the group consisting of vinylidene chloride copolymers, acrylonitrile copolymers, methacrylonitrile copolymers, and acrylic copolymers.

[0071] The above-mentioned swelling-inducing component may include one or more selected from the group consisting of hydrocarbon compounds, chlorofluoro compounds, and tetraalkylsilane compounds.

[0072] Specifically, the hydrocarbon compound may include one or more selected from the group consisting of ethane, ethylene, propane, propene, n-butane, isobutene, n-butene, isobutene, n-pentane, isopentane, neopentane, n-hexane, heptane, and petroleum ether.

[0073] The above chlorofluoro compound may include one or more selected from the group consisting of trichlorofluoromethane (CCl3F), dichlorodifluoromethane (CCl2F2), chlorotrifluoromethane (CClF3), and dichlorotetrafluoroethylene (CClF2-CClF2).

[0074] The above tetraalkylsilane compound may include one or more selected from the group consisting of tetramethylsilane, trimethylethylsilane, trimethylisopropylsilane, and trimethyl-n-propylsilane.

[0075] Such solid foaming agents may have an average particle size of 5 to 200 μm, specifically 10 to 100 μm, 15 to 70 μm, or 20 to 45 μm. Here, if the solid foaming agent contains the thermally expanded particles as the expandable particles, the average particle size may refer to the average particle size of the thermally expanded particles themselves. Additionally, if the solid foaming agent contains the unexpanded particles as the expandable particles, the average particle size may refer to the average particle size of the particles after expansion by heat or pressure.

[0076] The content of the solid foaming agent may be 0.5 to 10 parts by weight per 100 parts by weight of the biomass-containing urethane prepolymer (A1), and specifically, 0.7 to 8 parts by weight, 0.9 to 6 parts by weight, or 1 to 5 parts by weight. Since the content of the solid foaming agent is within the above range, it may be more advantageous to realize a polishing pad with excellent physical properties.

[0077] In addition, the composition (A) containing the biomass-containing urethane prepolymer (A1) for forming the top pad layer (10) may further include additives such as surfactants, reaction rate regulators, etc.

[0078] The above surfactant is not particularly limited, but specifically may be a silicone-based surfactant.

[0079] The above reaction rate regulator is not particularly limited, but specifically includes triethylenediamine, dimethylethanolamine, tetramethylbutanediamine, 2-methyl-triethylenediamine, dimethylcyclohexylamine, triethylamine, triisopropanolamine, 1,4-diazabicyclo(2,2,2)octane, bis(2-methylaminoethyl)ether, trimethylaminoethylethanolamine, N,N,N,N,N''-pentamethyldiethyldimethylaminoethylamine, dimethylaminopropylamine, benzyldimethylamine, N-ethylmorpholine, N,N-dimethylaminoethylmorpholine, N,N-dimethylcyclohexylamine, 2-methyl-2-azanobornenein, dibutyltin dilaurate, stannus octoate, dityltin diacetate, dioctyltin diacetate, dibutyltin maleate, dibutyltin di-2-ethylhexanoate, and It may include one or more selected from the group consisting of dibutin dimer captides.

[0080] A top pad layer (10) manufactured from a composition (A) containing such a biomass-containing urethane prepolymer (A1) may have a biomass (biocarbon) content of 70 to 90 weight%. Specifically, the biomass content of the top pad layer (10) based on the total weight of the top pad layer (10) may be 71 to 89 weight%, 71 to 88 weight%, 71 to 86 weight%, 71 to 85 weight%, 71 to 84 weight%, 71 to 83 weight%, 71 to 82 weight%, 71 to 81 weight%, or 72 to 80 weight%. As the biomass content of the top pad layer (10) is within the above range, a polishing pad (100) with excellent eco-friendliness and physical properties required in a CMP process can be provided.

[0081] The thickness of the top pad layer (10) is not specifically limited, but specifically may be 0.5 mm to 5 mm, 0.8 mm to 4 mm, 1 mm to 3 mm, or 1.5 mm to 3 mm. In addition, the hardness (Shore D) of the top pad layer (10) is not specifically limited, but specifically may be 46 Shore D to 55 Shore D, 47 Shore D to 54 Shore D, 47 Shore D to 53 Shore D, 47 Shore D to 52 Shore D, or 48 Shore D to 51 Shore D. In addition, the average pore size formed in the top pad layer (10) is not specifically limited, but specifically may be 10 to 40 μm. As the thickness, hardness, and average pore size of the top pad layer (10) are each within the above ranges, the CMP process can be performed stably and the polishing pad (100) can be made lighter.

[0082] The above top pad layer has a tensile strength of 15 N / mm 2 Up to 25 N / mm 2 It may be. For example, the top pad layer has a tensile strength of 15 N / mm 2 Above, 16 N / mm 2 Above, 17 N / mm 2 Above, 18 N / mm 2 Above, 19 N / mm 2 Above, 20 N / mm 2 Above, 20.1 N / mm 2 Above, 20.2 N / mm 2 Greater than or equal to 20.3 N / mm 2 It may be greater than 25 N / mm 2 Below, 24 N / mm 2 Below, 23 N / mm 2 Below, 22 N / mm 2 Below, 21.9 N / mm 2 Less than or equal to 21.8 N / mm 2 It may be less than or equal to. Specifically, the top pad layer has a tensile strength of 20 N / mm2 Up to 22 N / mm 2 or 20.3 N / mm 2 Up to 21.8 N / mm 2 It could be.

[0083] The above top pad layer may have an elongation of 180% to 260%. For example, the above top pad layer may have an elongation of 180% or more, 181% or more, 182% or more, 183% or more, 184% or more, 185% or more, 186% or more, or 187% or more, and may have an elongation of 260% or less, 250% or less, 240% or less, 230% or less, 220% or less, 210% or less, 205% or less, 204% or less, 203% or less, 202% or less, or 201% or less. Specifically, the above top pad layer may have an elongation of 185% to 250% or 186% to 201%.

[0084] As the tensile strength and elongation of the top pad layer satisfy the above-mentioned range, a polishing pad having physical properties suitable for polishing a semiconductor device to be processed in the present invention can be provided.

[0085]

[0086] adhesive layer

[0087] An adhesive layer (20) further included in the polishing pad (100) according to the embodiment is provided between the top pad layer (10) and the sub pad layer (30) and serves to bond the top pad layer (10) and the sub pad layer (30). Furthermore, the adhesive layer (20) can also serve to prevent polishing slurry supplied to the top pad layer (10) from leaking into the sub pad layer (30). Such an adhesive layer (20) can be manufactured (formed) using a hot melt adhesive composition.

[0088] The above hot melt adhesive composition may include a commonly known hot melt adhesive. Specifically, the hot melt adhesive may include one or more selected from the group consisting of polyurethane resins, polyester resins, ethylene-vinyl acetate resins, polyamide resins, and polyolefin resins.

[0089] The thickness of the adhesive layer (20) is not specifically limited, but specifically may be 5 to 30 μm, 10 to 30 μm, 20 to 27 μm, or 23 to 25 μm. As the thickness of the adhesive layer (20) is within the above range, the bonding force (adhesion force) between the top pad layer (10) and the sub pad layer (30) can be secured to the required level.

[0090]

[0091] Sub-pad layer

[0092] The sub-pad layer (30) included in the polishing pad (100) according to the embodiment is provided below the top pad layer (10) and serves to stably support the top pad layer (10) while absorbing and / or dispersing the impact applied to the top pad layer (10).

[0093] The biomass content of the sub-pad layer (30) may be 10% to 30% by weight based on the total weight of the sub-pad layer (30). Specifically, the biomass content of the sub-pad layer (30) based on the total weight of the sub-pad layer (30) may be 11% to 29% by weight, 12% to 27% by weight, 13% to 26% by weight, 15% to 25% by weight, 16% to 24% by weight, 17% to 23% by weight, 18% to 22% by weight, or 19% to 21% by weight.

[0094] The above sub-pad layer (30) may be manufactured by processing polyurethane foam that satisfies the above range of biomass content. The above sub-pad layer (30) may be manufactured by compressing and cutting the polyurethane foam. As the biomass content of the above sub-pad layer (30) satisfies the above range, the biomass content of the entire polishing pad (100) also increases, thereby further enhancing eco-friendliness.

[0095] Specifically, the polyurethane foam used to manufacture the sub-pad layer (30) may be PORON TR-20, PORON TR-24, PORON TR-32, PORON RX-32, PORON ATR-24, PORON ATR-24PR, PORON ATR-32, PORON ATR-32PR, PORON SA-30 from INOAC. More specifically, the polyurethane foam used to manufacture the sub-pad layer (30) may be PORON TR-32 (biomass content 20%) from INOAC.

[0096] The thickness of the sub-pad layer (30) is not specifically limited, but specifically may be 0.1 to 4 mm, 0.5 to 3 mm, 0.5 to 2 mm, or 0.5 to 1 mm. In addition, the hardness (Asker C) of the sub-pad layer (30) is not specifically limited, but specifically may be 60 Shore D to 90 Shore D. As the thickness and hardness of the sub-pad layer (30) are each within the above ranges, the top pad layer (10) can be stably supported while the polishing pad (100) can be made lighter.

[0097] The polishing pad (100) according to this embodiment may have excellent eco-friendliness as the top pad layer (10) is manufactured from a biomass-containing composition. In addition, the polishing pad (100) according to this embodiment contains a biomass content within a specific range by optimally controlling the composition and content of the polymer raw material and the isocyanate raw material included in the biomass-containing composition used to manufacture the top pad layer (10). As a result, it possesses the physical properties required in the CMP process, and thus the polishing rate, cutting rate, etc., may be excellent.

[0098] Specifically, the polishing pad (100) according to the embodiment may have a biomass (biocarbon) content of 50 to 70 weight% based on the total weight of the polishing pad (100). More specifically, the total biomass content of the polishing pad (100) based on the total weight of the polishing pad (100) may be 50 to 70 weight%, 50 to 69 weight%, 50 to 68 weight%, 50 to 67 weight%, 50 to 66 weight%, 50 to 65 weight%, 50 to 64 weight%, 50 to 63 weight%, 50 to 62 weight%, 50 to 61 weight%, or 50 to 60 weight%. As the biomass content of the above polishing pad (100) is within the above range, it is possible to provide a polishing pad (100) that is highly eco-friendly and has excellent polishing rate, cutting rate, etc. in the CMP process.

[0099] Meanwhile, the polishing pad (100) according to the embodiment may have a compression ratio (%) of 0.3 to 1.8%, 0.4 to 1.6%, 0.5 to 1.5%, 0.6 to 1.4%, or 0.8 to 1.3%.

[0100] In addition, the polishing pad (100) according to the embodiment may have a CMP process polishing rate (Å / min) of 2000 to 4000 Å / min, 2500 to 3500 Å / min, 3000 to 3300 Å / min, 3100 to 3250 Å / min, or 3100 Å / min to 3220 Å / min.

[0101] In addition, the polishing pad (100) according to the embodiment may have a polishing pad cutting rate (㎛ / hr) of 10 to 30 ㎛ / hr, 15 to 25 ㎛ / hr, 17 to 23 ㎛ / hr, 18 to 22 ㎛ / hr, or 19 ㎛ / hr to 21 ㎛ / hr.

[0102]

[0103] Method for manufacturing a polishing pad

[0104] An embodiment provides a method for manufacturing a polishing pad capable of efficiently manufacturing the polishing pad described above. Specifically, the method for manufacturing a polishing pad according to an embodiment comprises the steps of: manufacturing a biomass-containing urethane prepolymer from a urethane prepolymer composition comprising an isocyanate raw material and a polyol raw material comprising a bio-based polyol; preparing a biomass-containing composition comprising the biomass-containing urethane prepolymer, a curing agent, and a foaming agent; curing the biomass-containing composition to manufacture a top pad layer; and attaching a sub-pad layer to the top pad layer, wherein the sub-pad layer has a biomass content of 10% to 30% by weight, the hardness of the top pad layer is 46 Shore D to 55 Shore D, and the polishing pad has a total biomass content of 50% to 70% by weight as measured by ASTM D6866.

[0105] Specifically, the step of manufacturing the biomass-containing urethane prepolymer may consist of introducing a urethane prepolymer composition containing the polyol raw material and the isocyanate raw material into a reactor and reacting it. The reaction conditions are not particularly limited, but the reaction temperature may be 70 to 90 ℃ (specifically 75 to 85 ℃) and the reaction time may be 1 to 4 hours (specifically 2 to 3 hours). Meanwhile, the description of the polyol raw material and the isocyanate raw material, respectively, is omitted as it is identical to the description of the polyol raw material (A11) and the isocyanate raw material (A12) described above.

[0106] The step of preparing the above biomass-containing composition may consist of a process of filling the biomass-containing urethane prepolymer, curing agent, and foaming agent into their respective injection lines and mixing them. Specifically, the mixing may be performed at a speed of 1,000 to 10,000 rpm, 2,500 to 8,500 rpm, or 4,000 to 7,000 rpm. Here, the foaming agent may be mixed through an injection line separate from the biomass-containing urethane prepolymer injection line, or may be mixed with the biomass-containing urethane prepolymer in advance before the biomass-containing urethane prepolymer is filled into its injection line. Meanwhile, the descriptions of the biomass-containing urethane prepolymer, the curing agent, and the foaming agent, respectively, are omitted as they are identical to the descriptions of the biomass-containing urethane prepolymer (A1), the curing agent (A2), and the foaming agent (A3) described above.

[0107] The step of manufacturing the top pad layer described above may consist of a process of introducing the biomass-containing composition into a mold and causing a curing reaction. The curing reaction conditions are not particularly limited, but the curing reaction temperature is 60 to 130 ℃ (specifically 75 to 100 ℃), and the mold pressure is 50 to 260 kg / m² 2(Specifically, 80 to 180 kg / m² 2 It can be.

[0108] The step of manufacturing the above sub-pad layer may be carried out by cutting a polyurethane foam (INOAC, biomass content 10% to 30% by weight).

[0109] The step of attaching a sub-pad layer to a top pad layer can be performed by a process of attaching a sub-pad layer to a top pad layer using a hot melt adhesive composition.

[0110] In addition, the process may further include a process for cutting the surface of the top pad layer, a process for machining a groove on the surface of the top pad layer, a polishing pad inspection process, or a polishing pad packaging process, and conventional methods for manufacturing polishing pads may be applied to these processes.

[0111]

[0112] The present embodiment will be explained in more detail through the following examples. However, the scope of the present embodiment is not limited to these examples.

[0113]

[0114] Examples

[0115] [Example 1]

[0116] Example 1-1: Preparation of Urethane Prepolymer

[0117] 180 g of bio-based PDI (STABiO PDI, MITSUI CHEMICALS (molecular weight 76 g / mol)) as an isocyanate raw material, 300 g of bio-based polymer polyol (ECOTRION H1000, SK Chemical (molecular weight 1000 g / mol, OH-value 102.0~124.7, biomass content 100 wt% based on total weight of bio-based polymer polyol) as a polymer polyol, and 20 g of bio-based 1,3-propanediol (molecular weight 76 g / mol, biomass content 100 wt% based on total weight of bio-based 1,3-propanediol) as a monomer polyol were added to a 4-neck flask and reacted at 80 ℃ for 3 hours to prepare a biomass-containing urethane prepolymer with an NCO% of 9%.

[0118] Example 1-2: Preparation of Top Pad Layer

[0119] In a casting machine equipped with an inert gas injection line, the biomass-containing urethane prepolymer prepared in Example 1-1 was filled into the prepolymer tank, and bis(4-amino-3-chlorophenyl)methane (Ishihara Co.) was filled into the curing agent tank, and nitrogen (N2) was applied as the inert gas. Meanwhile, 1 part by weight of a solid foaming agent (Akzonobel Co.) and 1 part by weight of a silicone-based surfactant (Evonik Co.) were introduced through separate lines to 100 parts by weight of the urethane prepolymer to be mixed with the urethane prepolymer. Each raw material was introduced into a mixing head at a constant speed through each input line and stirred. At this time, the urethane prepolymer and the curing agent were added in an equivalent ratio of 1:1, and nitrogen (N2), an inert gas, was injected at a rate of 0.5 L / min to 1.5 L / min. The stirred raw material was extruded into a mold (1,000 mm x 1,000 mm x 3 mm) preheated to 80 ℃ at an extrusion rate of 10 kg / min, and then cast at 120 ℃ to obtain a molded body. Subsequently, the top and bottom ends of the molded body were each cut to a thickness of 0.5 mm to obtain a top pad (top pad layer) with a thickness of 2 mm (average pore size 23.6 μm).

[0120] Examples 1-3: Preparation of sub-pad layer

[0121] A sub-pad (thickness: 1.0 mm) was manufactured by cutting polyurethane foam (PORON TR-32, INOAC).

[0122] Examples 1-4: Manufacture of polishing pads

[0123] A polishing pad (thickness: 3.32 mm) having a structure of a top pad layer / adhesive layer / sub pad layer was manufactured by combining the top pad manufactured in Example 1-2 and the sub pad manufactured in Example 1-3 using a hot melt adhesive.

[0124]

[0125] [Example 2]

[0126] Example 2-1: Preparation of Urethane Prepolymer

[0127] 120 g of bio-based PDI (STABiO PDI, MITSUI CHEMICALS (molecular weight 76 g / mol)) as an isocyanate raw material, 310 g of bio-based polymer polyol (ECOTRION H1000, SK Chemical (molecular weight 1000 g / mol, OH-value 102.0~124.7, biomass content 100 wt% based on total weight of bio-based polymer polyol) as a polymer polyol, and 10 g of bio-based 1,3-propanediol (molecular weight 76 g / mol, biomass content 100 wt% based on total weight of bio-based 1,3-propanediol) as a monomer polyol were added to a 4-neck flask and reacted at 80 ℃ for 3 hours to prepare a biomass-containing urethane prepolymer with an NCO% of 9%.

[0128] Example 2-2: Preparation of Top Pad Layer

[0129] A top pad (top pad layer) (average pore size 23.6 μm) was prepared through the same process as in Example 1-2, except that the urethane prepolymer prepared in Example 2-1 was applied instead of the urethane prepolymer prepared in Example 1-1.

[0130] Example 2-3: Preparation of Sub-pad Layer

[0131] A sub-pad (thickness: 1.0 mm) was manufactured by cutting polyurethane foam (PORON TR-32, INOAC).

[0132] Examples 2-4: Manufacture of abrasive pads

[0133] A polishing pad (thickness: 3.32 mm) having a structure of a top pad layer / adhesive layer / sub pad layer was manufactured by combining the top pad manufactured in Example 2-2 and the sub pad manufactured in Example 2-3 using a hot melt adhesive.

[0134]

[0135] [Comparative Example 1]

[0136] Comparative Example 1-1: Preparation of Urethane Prepolymer

[0137] 145 g of toluene diisocyanate (TDI) and 30 g of 4,4'-methylene dicyclohexyl diisocyanate (H12MDI) as isocyanate raw materials, 305 g of polytetramethylene glycol (PTMG) as a polymer polyol, and 20 g of diethylene glycol as a monomer polyol were added to a 4-necked flask and reacted at 80°C for 3 hours to prepare a biomass-containing urethane prepolymer with an NCO% of 9%.

[0138] Comparative Example 1-2: Manufacturing of Top Pad Layer

[0139] A top pad (top pad layer) (average pore size 23.6 μm) was prepared through the same process as in Example 1-2, except that the urethane prepolymer prepared in Comparative Example 1-1 was applied instead of the urethane prepolymer prepared in Example 1-1.

[0140] Comparative Examples 1-3: Sub-pad layer fabrication

[0141] A sub-pad (thickness: 1.0 mm) was prepared by impregnating a polyester fiber nonwoven fabric with polyurethane resin.

[0142] Comparative Examples 1-4: Manufacture of polishing pads

[0143] A polishing pad (thickness: 3.32 mm) having a structure of a top pad layer / adhesive layer / sub pad layer was manufactured by combining the top pad manufactured in Comparative Example 1-2 and the sub pad manufactured in Comparative Example 1-3 using a hot melt adhesive.

[0144]

[0145] [Comparative Example 2]

[0146] Comparative Example 2-1: Preparation of Urethane Prepolymer

[0147] 30 g of 4,4'-methylene dicyclohexyl diisocyanate (H12MDI) and 365 g of bio-based isocyanate (STABiO D-376N, MITSUI CHEMICALS (molecular weight 350 g / mol, biomass content 67 wt%) based on total weight of bio-based isocyanate) as isocyanate raw materials; 60 g of bio-based polymer polyol (ECOTRION H1000, SK Chemical Co. (molecular weight 1000 g / mol, OH-value 102.0~124.7, biomass content 100 wt% based on total weight of bio-based polymer polyol) and 45 g of bio-based 1,3-propanediol (molecular weight 76 g / mol, biomass content 100 wt% based on total weight of bio-based 1,3-propanediol) were added to a 4-necked flask as polyol raw materials and reacted at 80 ℃ for 3 hours to prepare a biomass-containing urethane prepolymer with an NCO% of 9%.

[0148] Comparative Example 2-2: Manufacturing of Top Pad Layer

[0149] A top pad (top pad layer) (average pore size 23.6 μm) was prepared through the same process as in Example 1-2, except that the urethane prepolymer prepared in Comparative Example 2-1 was applied instead of the urethane prepolymer prepared in Example 1-1.

[0150] Comparative Example 2-3: Sub-pad layer fabrication

[0151] A sub-pad (thickness: 1.0 mm) was prepared by impregnating a polyester fiber nonwoven fabric with polyurethane resin.

[0152] Comparative Example 2-4: Manufacture of polishing pad

[0153] A polishing pad (thickness: 3.32 mm) having a structure of a top pad layer / adhesive layer / sub pad layer was manufactured by combining the top pad manufactured in Comparative Example 2-2 and the sub pad manufactured in Comparative Example 2-3 using a hot melt adhesive.

[0154]

[0155] Meanwhile, the Bio-based PDI used for the preparation of the top pad layer in Example 1 above is STABiO PDI from MITSUI CHEMICALS, having a molecular weight of 76 g / mol. For comparison, Comparative Example 2 used a Bio-based PDI with a molecular weight exceeding 300 g / mol, and the Bio-based PDI used for the preparation of the top pad layer in Comparative Example 2 is STABiO D-376N from MITSUI CHEMICALS, having a molecular weight of 350 g / mol.

[0156]

[0157] <Test Example>

[0158] Test Example 1. Biomass Content Analysis

[0159] Based on ASTM D 6866 standards (applying radiocarbon dating methods), the content of biomass (biocarbon) contained in the urethane prepolymer, top pad layer, sub-pad layer, and polishing pad of Examples 1 and 2 and Comparative Examples 1 and 2 (sample size: width: 5 cm, length: 5 cm) was analyzed, and the results are shown in Table 1 below.

[0160] Biomass (Biocarbon) Content Example 1 Example 2 Comparative Example 1 Comparative Example 2 Based on total weight of polishing pad: 55 wt% 50 wt% 0 wt% 60 wt% Based on total weight of top pad layer: 80 wt% 72 wt% 0 wt% 77 wt% Based on total weight of sub pad layer: 20 wt% 20 wt% 0 wt% 0 wt% Based on total weight of urethane prepolymer: 100 wt% 90 wt% 0 wt% 98 wt%

[0161] Test Example 2. Evaluation of Physical Properties

[0162] The physical properties of the top pad, sub-pad, and polishing pad prepared in Examples 1 to 2 and Comparative Examples 1 to 2, respectively, were evaluated as follows, and the results are shown in Table 2 below.

[0163]

[0164] 1. Hardness

[0165] The top pad (thickness: 2 mm, width: 5 cm, length: 5 cm) and the sub pad (thickness: 1.1 mm, width: 5 cm, length: 5 cm) were each stored at 25 ℃ for 12 hours, and then Shore D hardness and Asker C hardness were measured using a durometer.

[0166]

[0167] 2. Tensile strength

[0168] The maximum strength value just before fracture was measured at a speed of 50 mm / min using a universal test system (UTM) on a top pad (thickness: 2 mm, width: 4 cm, length: 1 cm).

[0169]

[0170] 3. New Ratio

[0171] The maximum deformation length just before fracture was measured using a universal test system (UTM) on a top pad (thickness: 2 mm, width: 4 cm, length: 1 cm) at a speed of 50 mm / min, and the elongation was measured by calculating the ratio of the maximum deformation length to the initial length (percentage (%)).

[0172]

[0173] 4. Compression ratio

[0174] The compression ratio ((AB) / A*100) was measured by calculating the change in thickness (A) measured after placing an 85 g weight on a grinding pad (thickness: 3.32 mm, width: 25 mm, length: 25 mm) for 30 seconds using a Dial Thickness Gauge (YASUDA, 129-E) and the thickness (B) measured after placing an additional 800 g weight (85 g weight + 800 g weight) for 3 minutes.

[0175]

[0176] 5. Grinding rate

[0177] A polishing pad was fixed on the platen of the CMP equipment, and the silicon oxide film of a silicon wafer (diameter: 300 mm) was placed facing downward to perform the CMP process. Specifically, the polishing load was adjusted to 4.0 psi, and the silicon oxide film was polished by feeding calcined silica slurry onto the polishing pad at a rate of 250 ml / min while rotating the platen at 150 rpm for 60 seconds. After polishing, the silicon wafer was removed from the carrier, mounted on a spin dryer, washed with purified water, and dried with nitrogen for 15 seconds. The difference in thickness before and after polishing was measured using an optical coherence thickness measuring device (Kyence, SI-F80R) on the dried silicon wafer, and the polishing rate was calculated according to Equation 2 below.

[0178] [Equation 2]

[0179] Polishing rate (Å / min) = Polishing thickness of silicon wafer (silicon oxide film) (Å) / Polishing time (min)

[0180]

[0181] 6. Grinding pad cutting rate

[0182] After pre-conditioning the polishing pad with deionized water for the first 10 minutes, the change in thickness of the polishing pad was measured by conditioned again while spraying deionized water for 1 hour. At this time, the AP-300HM equipment from CTS was used for conditioning, the conditioning pressure was 6 l bf, the rotation speed was 100 to 110 rpm, and the disc used for conditioning was the Saesol LPX-DS2.

[0183]

[0184] Classification Example 1 Example 2 Comparative Example 1 Comparative Example 2 Bio Carbon Content (Based on polishing pad, %) 55 500 60 Top Pad Hardness (Shore D) 48.2 49.8 51 45.3 Top Pad Tensile Strength (N / mm²) 20.4 21.7 22.9 16.2 Top Pad Elongation (%) 200.5 18 7.2 210 25 3.0 Polishing Rate (Å / min) 310 832 1132 44 18 66 Polishing Pad Cutting Rate (㎛ / hr) 19.0 20.7 19.3 30.1

[0185] Referring to Table 2 above, it can be seen that the polishing pads of Examples 1 and 2, in which the total biomass content is controlled within the range of the embodiments, exhibit excellent overall physical properties, whereas the polishing pad of Comparative Example 2, which falls outside the range of the embodiments, exhibits significantly inferior physical properties. Furthermore, it can be seen that the polishing pads of Examples 1 and 2, even when manufactured using bio-based polyol raw materials, exhibit physical properties equivalent to or better than those of the polishing pad of Comparative Example 1, which is manufactured using petroleum-based polyol raw materials. On the other hand, the polishing pad of Comparative Example 2 does not meet the conditions for the polishing pad intended to be realized by the present invention because the hardness of the top pad layer is excessively low. As a result, it can be seen that the embodiments make it possible to provide a polishing pad that exhibits excellent physical properties and eco-friendliness.

[0186]

[0187] [Explanation of the symbol]

[0188] 100: Polishing pad

[0189] 10: Top pad layer

[0190] 20: Adhesive layer

[0191] 30: Sub-pad layer

Claims

1. Includes a biomass-containing top pad layer and a biomass-containing sub pad layer, The biomass content of the above sub-pad layer is 10% to 30% by weight based on the total weight of the above sub-pad layer, and The hardness of the top pad layer is 46 Shore D to 55 Shore D, and A grinding pad having a total biomass content of 50% to 70% by weight as measured by ASTM D6866.

2. In Paragraph 1, A polishing pad having a biomass content of 70% to 90% by weight based on the total weight of the top pad layer.

3. In Paragraph 1, The above top pad layer is manufactured from a biomass-containing composition, and The above composition includes a biomass-containing urethane prepolymer, and A polishing pad, wherein the above-mentioned biomass-containing urethane prepolymer is prepared from a urethane prepolymer composition comprising an isocyanate raw material; and a polyol raw material comprising a bio-based polyol.

4. In Paragraph 3, A polishing pad having a biomass content of the above biomass-containing urethane prepolymer of 80% to 100% by weight based on the total weight of the biomass-containing urethane prepolymer.

5. In Paragraph 3, A polishing pad comprising one or more types selected from the group consisting of bio-based polyols and bio-based monomer polyols.

6. In Paragraph 5, A polishing pad comprising one or more types selected from the group consisting of bio-based polymer polyols, bio-based polyether polyols, bio-based polyester polyols, bio-based polycarbonate polyols, and bio-based polycaprolactam polyols.

7. In Paragraph 5, A polishing pad comprising one or more selected from the group consisting of bio-based monomer polyols: bio-based ethylene glycol, bio-based diethylene glycol, bio-based 1,2-propylene glycol, bio-based 1,3-propanediol, bio-based 2-methyl-1,3-propanediol, bio-based 1,3-butanediol, bio-based 1,4-butanediol, bio-based 2,3-butanediol, bio-based n-butanol, bio-based isobutanol, bio-based 1,5-pentanediol, bio-based 2-octanol, bio-based 1,9-nonanediol, bio-based 1,10-decanediol, bio-based diethylene glycol, and bio-based isosorbide.

8. In Paragraph 3, A polishing pad in which the above isocyanate raw material comprises a bio-based isocyanate.

9. In Paragraph 8, A polishing pad, wherein the above bio-based isocyanate is one or more selected from the group consisting of bio-based 1,5-pentamethylene diisocyanate (Bio-based PDI) and bio-based toluene diisocyanate (Bio-based TDI).

10. In Paragraph 8, The above bio-based isocyanate is a polishing pad having a molecular weight of 300 g / mol or less.

11. In Paragraph 1, The above top pad layer has a tensile strength of 15 N / mm 2 Up to 25 N / mm 2 Phosphor, polishing pad.

12. In Paragraph 1, The above top pad layer is a polishing pad having an elongation of 180% to 260%.

13. A step of preparing a biomass-containing urethane prepolymer from a urethane prepolymer composition comprising an isocyanate raw material and a polyol raw material comprising a bio-based polyol; A step of preparing a biomass-containing composition comprising the above-mentioned biomass-containing urethane prepolymer, a curing agent, and a foaming agent; A step of curing the above biomass-containing composition to produce a top pad layer having a polished surface; and A method for manufacturing a polishing pad comprising the step of attaching a sub-pad layer to the top pad layer, The above sub-pad layer has a biomass content of 10% to 30% by weight, and The hardness of the top pad layer is 46 Shore D to 55 Shore D, and The above-mentioned abrasive pad is a method for manufacturing an abrasive pad having a total biomass content of 50% to 70% by weight as measured by ASTM D6866.

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