Device for cooling an electronic component

Abstract

The invention relates to a cooling system comprising a housing configured to receive one or more electronic components to be thermally regulated and a cooling fluid in which the electronic component(s) are at least partially submerged, the system also comprising a cooling fluid circuit, a means for circulating the fluid, such as at least one pump, connected to the cooling fluid circuit, a heat exchanger configured for the cooling fluid to pass therethrough, and at least one fan configured to cool the heat exchanger, the means for circulating the fluid, heat exchanger and fan being external to the housing, and being connected so as to form a rigid assembly that is stationary relative to the housing and attached to the housing.

Description

[0001] DESCRIPTION

[0002] Title: Cooling system for an electronic component

[0003] [1] The present invention relates in particular to a cooling system configured to receive one or more electronic components to be cooled and a cooling fluid in which the electronic component(s) are at least partially immersed.

[0004] [2] In the field of data centers, it is common practice to house computer servers in a cabinet (also called a rack). For this purpose, the server is placed in an enclosure (or casing) closed by a lid, and the server is cooled by being immersed in a dielectric fluid. It is necessary to make the enclosure impermeable to this dielectric fluid.

[0005] [3] There are several critical problems inherent in server cooling systems intended to be deployed in diverse and often challenging environmental conditions.

[0006] [4] First, server cooling systems deployed outdoors can face extreme variations in ambient temperature and exposure to harsh weather conditions, which can significantly impact operational reliability and efficiency. The present invention aims to ensure consistent performance regardless of geographical location or climatic challenges.

[0007] [5] Secondly, the cooling system must be designed to operate autonomously and require minimal, or even no, on-site intervention. It must be capable of being managed remotely if necessary, which increases its versatility and reduces the need for direct human monitoring.

[0008] [6] Furthermore, maintaining a stable and controlled temperature for the server hardware is essential. The system must ensure that the servers remain below a specific maximum temperature threshold, as exceeding this limit could lead to performance degradation or damage to sensitive electronic components.

[0009] [7] It is known as immersion cooling, using a dielectric fluid. This approach is chosen for its efficiency in directly dissipating heat, ensuring safe and effective thermal management without risk to the server's electronic components.

[0010] [8] Generally, the servers are each housed in a case, and the cases are stacked in the rack and connected by a cooling fluid circuit. The cooling fluid itself is cooled by a liquid / liquid heat exchanger located at a distance from the rack, along with the fluid circulation system, depending on the space required for the entire system.

[0011] [9] This results in a need for significant space, a complex system and maintenance.

[0012]

[0010] The invention aims in particular to address these drawbacks.

[0013]

[0011] The invention thus relates to a cooling system comprising a housing configured to receive one or more electronic components to be thermally regulated and a cooling fluid in which the electronic component(s) are at least partially immersed, the system also comprising

[0014] a cooling fluid circuit,

[0015] a means of circulating the fluid, such as at least one pump, connected to the cooling fluid circuit,

[0016] a heat exchanger configured to allow the cooling fluid to pass through it, and at least one fan configured to cool the heat exchanger,

[0017] said means of circulating the fluid, heat exchanger and fan being external to the case, and being connected so as to form a rigid fixed assembly relative to the case and fixed to said case

[0012] Each element is external to the server and easily accessible, so that it is possible to carry out maintenance by a person with little or no qualifications.

[0013] According to one aspect of the invention, the system comprises a protective structure including the heat exchanger, and at least one fan configured to circulate air in contact with the heat exchanger, in particular through the exchanger, in order to exchange heat with the cooling fluid, the protective structure being configured to surround the heat exchanger so as to protect it from the external environment, the protective structure comprising a wall on which at least one fan is disposed, and in particular an open wall opposite the wall comprising the at least one fan comprising openings configured to allow a ventilated airflow to pass through, the open wall comprising in particular stiffening ribs passing through the openings in order to stiffen the protective structure and to protect the heat exchanger disposed between said walls.

[0018]

[0014] According to one aspect of the invention, the casing extends in an extension plane mainly along a first vertical axis, the protection structure including the heat exchanger having dimensions configured to be equal to or less than the dimensions of the casing along a second axis transverse to the first vertical axis.

[0019]

[0015] In other words, the protective structure including the heat exchanger has a height equal to or less than the height of the housing including the electronic components.

[0020]

[0016] According to one aspect of the invention, the protective structure including the heat exchanger is part of the extension of the largest surfaces of the plane formed by the casing.

[0021]

[0017] According to one aspect of the invention, the housing being fixed to the protective structure, the structure being fixed to a plate forming the base of the system, the system being configured to be arranged vertically during its operation, with said plate supporting the system.

[0022]

[0018] According to one aspect of the invention, the cooling fluid is a dielectric fluid.

[0023]

[0019] According to one aspect of the invention, at least one fan is configured to be detachable from the protective structure during system operation, in particular the electrical connections of each fan are configured to be detachable from the protective structure during system operation.

[0024]

[0020] According to one aspect of the invention, the means for circulating the fluid comprises a pump, preferably two pumps connected in parallel.

[0025]

[0021] According to one aspect of the invention, the pumps are configured to be independent of each other and to be able to be disconnected from the fluid circuit without stopping the fluid circulation.

[0026]

[0022] In other words, the pumps are replaceable "hot", which allows them to be maintained or replaced without having to stop the cooling system, thus ensuring uninterrupted operation.

[0027]

[0023] According to one aspect of the invention, the means of circulation is in the form of a pump module comprising at least one pump support, a pump comprising an inlet and an outlet and a first connector suitable for connecting the pump inlet to the fluid circuit of the cooling system.

[0028]

[0024] According to one aspect of the invention, the first connector includes at least one locking ring, and the pump module further includes a device for moving the locking ring of the first connector.

[0029]

[0025] Thus, the use of a connector equipped with a locking ring and cooperating with a translation device allows the connector itself to fix the pump module and to simplify the mounting of the pump module to the electronic cooling system.

[0030]

[0026] Particular embodiments of the pump module according to the invention, taken alone or in combination, propose that:

[0031]

[0027] The pump support comprises at least two lateral wings that are substantially parallel to each other and to a base, said device for moving the locking ring of the first connector being attached to one of the lateral wings of the pump support,

[0032]

[0028] The pump support has a first opening adapted to allow access to at least one electrical connector of the pump for the fluid

[0033] refrigerant,

[0029] The device for moving the locking ring of the first connector includes a button, a slide adapted to slide relative to the pump support, and a connecting tab adapted to cooperate with the locking ring of the first connector,

[0034]

[0030] The slide has at least one opening forming a translational guide and cooperating with a guide pin disposed on one face of the pump support,

[0031] The first connector is suitable for connecting the pump inlet for the refrigerant to a refrigerant collection module of the electronic cooling system, and has a female part equipped with the locking ring and a male part intended to be inserted into the female part of the first connector,

[0035]

[0032] The female part of the first connector, equipped with the locking ring, is suitable for cooperating on the one hand with the pump inlet for the refrigerant and on the other hand for receiving the male part of the first connector.

[0036]

[0033] The male part of the first connector is intended, on the one hand, to be inserted into the female part equipped with the locking ring of the first connector and, on the other hand, to cooperate with the refrigerant fluid collection module of the electronic cooling system,

[0037]

[0034] Sealing means are provided between the pump inlet for the refrigerant and / or the female part equipped with the locking ring of the first connector and / or the male part of the first connector,

[0038]

[0035] The pump module further includes a second connector suitable for connecting the pump outlet for the refrigerant to the refrigerant outlet of the electronic cooling system,

[0039]

[0036] A non-return valve is interposed between the second connector and the refrigerant outlet of the electronic cooling system,

[0040]

[0037] The pump support has a U-shaped form,

[0041]

[0038] The pump support comprises at least one base and two lateral wings,

[0039] The first lateral wing and the second lateral wing of the pump support are substantially parallel to each other,

[0042]

[0040] The two lateral wings are connected to each other at the base,

[0041] The base extends here along a plane substantially perpendicular to the plane of extension of the two lateral wings,

[0043]

[0042] The pump for the refrigerant is secured to the pump support at the level of the first side wing,

[0044]

[0043] The pump module further comprises a power supply and a control module,

[0045]

[0044] The control module is also secured to the pump support at the level of the first lateral wing,

[0046]

[0045] The first side wing of the pump support carries the pump for the refrigerant and its control module,

[0047]

[0046] According to one aspect of the invention, the system housing extends in an extension plane mainly along a first vertical axis, the circulation means, such as a pump, has dimensions configured to be equal to or less than the dimensions of the housing along a second axis transverse to the first vertical axis.

[0048]

[0047] In other words, the means of putting into circulation has a height equal to or less than the height of the housing comprising the electronic components.

[0049]

[0048] According to one aspect of the invention, the means of putting into circulation is in the extension of the largest surfaces of the plane formed by the casing.

[0050]

[0049] According to one aspect of the invention, the means for putting into circulation is disposed at mid-height of the casing, in the main direction of extension of the casing, which advantageously optimizes the circulation of the fluid and accessibility.

[0051]

[0050] According to one aspect of the invention, the system includes a temperature sensor configured to measure the temperature of the fluid circulating in the fluid circuit, in particular the temperature sensor is located between the two pumps so as to measure the temperature of the fluid circulating in the circuit at a point between the two pumps.

[0052]

[0051] This advantageously allows for the detection of any alert to increase the flow rate and heat rejection, or to reduce the flow rate or the fans to save energy.

[0052] According to one aspect of the invention, the system includes at least one temperature sensor disposed in the housing.

[0053]

[0053] Advantageously, the sensors in the housing allow the temperature of the fluid to be detected at the point closest to the central unit.

[0054]

[0054] According to one aspect of the invention, the heat exchanger has a height equal to or less than the height of the housing comprising the electronic components.

[0055]

[0055] This advantageously allows for system maintenance to be carried out without having to stop its operation. In particular, the number of fans can be oversized relative to the thermal constraints so that a fan, for example a defective one, can be removed without having to stop the operation of the cooling system.

[0056]

[0056] The system may thus include a means for detecting a malfunction of a fan. This means may, for example, be chosen from among torque, current or temperature detectors.

[0057]

[0057] According to one aspect of the invention, the housing comprising the electronic components may include a wall that is at least partially transparent.

[0058]

[0058] This advantageously allows for a visual assessment of the condition of the system, the fluid and / or the electronic components.

[0059]

[0059] According to one aspect of the invention, all the elements of the system are present in a plane which extends along a main longitudinal direction, the plane having a dimension transverse to the main longitudinal direction, this transverse dimension having in particular a value between 45 and 60 mm when the electronic components are a 1U size server, i.e. a standard height of 44.5mm, or a value between 90 and 100 mm when the electronic components are a 2U size server, i.e. a standard height of 89 mm.

[0060]

[0060] This advantageously allows for a system with a relatively small footprint.

[0061]

[0061] The determining elements of the arrangement of the cooling system are as follows:

[0062] The vertical orientation ensures the best fluid filling and emptying procedure, natural fluid flow from bottom to top, and fewer leakage problems.

[0062]

[0063] The server can be inserted and removed from the top like a cassette with minimal maintenance.

[0063]

[0064] The overall size of the system has been reduced to a minimum to facilitate its final placement and transport.

[0064]

[0065] Access to the pumps and fans is guaranteed to allow for hot swapping.

[0065]

[0066] According to one aspect of the invention, the heat exchanger is a liquid-air heat exchanger, comprising a plurality of tubes configured to be traversed by the coolant of the circulation circuit, the tubes being connected to each other by fins so as to increase the exchanges with the air.

[0066]

[0067] According to one aspect of the invention, the heat exchanger includes fins inside the tubes, preferably these fins are louvered fins.

[0067]

[0068] According to one aspect of the invention, the fans are oriented with respect to the heat exchanger tubes so that the direction of the guided airflow is transverse with respect to a main extension direction of the heat exchanger tubes.

[0068]

[0069] According to one aspect of the invention, the fluid inlet conduit in the housing opens onto a distribution chamber comprising a plurality of distribution ports so as to distribute the cooling fluid.

[0069]

[0070] Advantageously, the internal shape of the fluid distribution chamber is specially profiled to direct the cooling fluid to the areas of highest heat concentration within the server. This targeted approach improves cooling efficiency by more directly addressing critical heat zones.

[0070]

[0071] According to one aspect of the invention, the cooling system includes a filter, in particular a metallic one, configured to filter impurities from the cooling fluid.

[0072] This has the advantage of preventing damage to the pumps during system operation.

[0071]

[0073] According to one aspect of the invention, the cooling fluid circuit comprises a fluid collector disposed outside the casing, the means for circulating the fluid being fixed and connected to said collector, the collector further comprising in particular a fluid filter, the filter preferably being metallic.

[0072]

[0074] According to one aspect of the invention, the filter is arranged in a collector connected to the discharge duct of the housing.

[0073]

[0075] According to one aspect of the invention, the manifold includes a temperature sensor configured to measure the temperature of the fluid circulating in the fluid circuit, in particular the means for circulating the fluid includes two pumps, the temperature sensor being located between the two pumps so as to measure the temperature of the fluid circulating in the circuit at a point between the two pumps.

[0074]

[0076] According to one aspect of the invention, the connector is linked to the means of circulation, in particular the pumps, and furthermore in particular to the fluid temperature sensor.

[0075]

[0077] According to one aspect of the invention, the collector, the means for circulating the fluid, the structure and the fluid circuit are all in line with the largest surfaces of the plane formed by the housing.

[0076]

[0078] The invention also relates to an assembly comprising a system as described above, and one or more electronic components to be cooled placed in the housing, the electronic component(s) being at least partially immersed in a cooling fluid, this cooling fluid being in particular a dielectric fluid.

[0077]

[0079] The invention also relates to an electronic assembly comprising a system as described above, and at least one server, the system housing including said server, the server being immersed in a dielectric cooling fluid circulating in the cooling fluid circuit.

[0080] The enclosure is advantageously designed to protect the components from adverse weather conditions. This outdoor enclosure ensures the system's durability and functionality in outdoor environments by protecting it from rain, dust, and other environmental factors. The weatherproof design of this enclosure aims to maintain the system's performance and longevity, regardless of the external climate.

[0078]

[0081] To power the electronic boards of servers, it is known to use electrically conductive bars (also called "busbars" in English).

[0079]

[0082] Installing busbars requires proper management of the housing's sealing.

[0080]

[0083] According to one aspect of the invention, the system extends mainly along a vertical plane, the casing being disposed above the heat exchanger relative to the ground, the circulation means such as at least one pump being disposed laterally relative to the vertical direction of extension of the casing, and being disposed above the heat exchanger, the heat exchanger forming the base on which the casing and the circulation means rest.

[0081]

[0084] This advantageously minimizes pumping requirements.

[0082] The arrangement effectively reduces the load on the pumps, allowing the use of smaller and more efficient pumps, which reduces energy consumption and improves the reliability of the system.

[0083]

[0085] According to one aspect of the invention, the system includes a cover comprising sealed connections for connecting a power supply to the busbars.

[0084]

[0086] According to one aspect of the invention, the system includes a means for detecting the level of coolant present in the housing, the means being an optical, electrical, mechanical, or any other probe enabling the measurement of the level of a liquid.

[0085]

[0087] According to one aspect of the invention, the system includes a controller so as to automatically control the operation of the system.

[0086]

[0088] This allows for a system capable of independently regulating its cooling operations without requiring external intervention or monitoring. While remote monitoring and control are available as an option, the system is designed to autonomously maintain optimal server temperatures, reducing the need for constant monitoring and enabling reliable operation in remote or hard-to-reach locations.

[0087]

[0089] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the attached schematic drawings on the other hand, in which:

[0088]

[0090] [Fig. 1] Figure 1 is a perspective representation of a cooling system according to the invention;

[0089]

[0091] [Fig. 2] Figure 2 is a diagram of the operation of the cooling system;

[0090]

[0092] [Fig. 3] Figure 3 is a cross-sectional view of a detail of the system at the level of the pumps and the system manifold.

[0091]

[0093] [Fig. 4] Figure 4 is a cross-sectional view of a detail of the system at the heat exchanger;

[0092]

[0094] [Fig. 5] Figure 5 is a cross-sectional view of a detail of the system at the level of the distribution enclosure of the housing and the heat exchanger;

[0093]

[0095] [Fig. 6] Figure 6 is a cross-sectional view of a detail of the system at the heat exchanger with the fan.

[0094]

[0096] The features, variations, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variations of the invention may include only a selection of features, described hereafter in isolation from the other features described, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from prior art.

[0095]

[0097] Figure 1 shows a cooling system 1 comprising a housing 10 configured to receive components 100 to be cooled. Inside this housing 10, the components 100 are immersed in a cooling fluid, which in this case is a dielectric fluid.

[0096]

[0098] Components 100 are electronic components of a computer server, or in English "CPU" (for "Central Processing Unit").

[0099] The housing 10 includes a receptacle that receives the components 100, and a cover (not shown) configured to seal the receptacle tightly. The housing 10 has a substantially rectangular perimeter that extends longitudinally in a plane parallel to the largest surfaces of the housing.

[0097]

[0100] We can see the fluid evacuation conduit 12 which allows the heated fluid from the housing 10 to the manifold 6 by means of the pumps 2, and the fluid supply conduit 11 which allows the housing 10 to be supplied with fluid cooled by its passage through the heat exchanger 3.

[0098]

[0101] We can see that all the elements are arranged according to this plan in order to standardize and limit the space taken up in a given plan.

[0099]

[0102] The protective structure 5 shields the heat exchanger from the external environment. It also provides a solid base for supporting the entire system, on which the fans 4 are conveniently mounted. Optionally, an additional plate can be attached to the structure to stabilize the base and create a support foot.

[0100]

[0103] As can be seen, the hot-swappable components, namely the 4 fans and 2 pumps, are easily accessible by their placement outside the case, in locations easily accessible to maintenance personnel.

[0101]

[0104] Figure 2 shows the operating principle of the cooling system, with the fluid following a fluid circuit from the housing 10 in which it heats up by contact with the server to the heat exchanger 3 in which it is cooled before completing another full cycle in the circuit, thanks to the action of the pumps 2.

[0102]

[0105] Note that the cooling fluid here is a dielectric fluid, which can be single-phase or two-phase within its operating range. In the case of two-phase operation, the dielectric fluid transitions to at least a partially gaseous state upon contact with the electronic components, then is cooled in the heat exchanger to condense into a liquid. A fan is used to improve the efficiency of the fluid's cooling as it passes through the heat exchanger.

[0106] Figure 3 shows a detail of the manifold 6 and the pumps 2, the manifold including a filter 61 preferably metallic in order to remove impurities from the fluid which could cause a short circuit or damage the pumps 2.

[0103]

[0107] In this embodiment, a temperature sensor 62 is positioned between the two pumps 2 and faces an outlet orifice of a chamber of the manifold 6 so as to optimally measure the temperature of the cooling fluid.

[0104]

[0108] Figure 4 shows the tube heat exchanger 3, and the fluid connections allowing the fluid to flow through said exchanger 3, and in particular the fluid circulation duct 13 which brings the fluid from the manifold 6 to the heat exchanger 3, and the fluid supply duct 11 which supplies the housing 10 with fluid cooled by its passage through the heat exchanger 3.

[0105]

[0109] Figure 5 shows the interior of the housing 10, and in particular the distribution chamber 14, which has distribution ports 15 to improve fluid distribution within the housing 10. It should be noted that the structure of this distribution chamber 14 is adaptable to the arrangement and shape of the electronic components to be cooled and can, of course, take on multiple forms. The distribution ports 15 can form nozzles that create a jet of dielectric fluid.

[0106]

[0110] Figure 6 shows a detailed cross-sectional view of the heat exchanger and fan assembly 4. The fan is positioned as close as possible to the heat exchanger.

[0107]

[0111] The heat exchanger 3 is a tube heat exchanger of the radiator type. The tubes 30 preferably include louvered fins 31 within them, and between the tubes, where the ventilated air passes to exchange heat by cooling the tubes, other fins 32 are arranged in order to increase the heat exchange.

[0112] Legend

[0108] 1. Cooling system

[0109] 2. Pump

[0110] 3. Heat exchanger

[0111] 4. Fan

[0112] 5. Protective structure

[0113] 6. Collector

[0114] 10. Case

[0115] 11. Fluid supply conduit

[0116] 12. Fluid drain pipe

[0117] 13. Fluid circulation duct

[0118] 14. Distribution chamber

[0119] 15. Distribution orifice

[0120] 30. Heat exchanger tube

[0121] 31. Tube fin

[0122] 32. Fin between two tubes

[0123] 61. Filter

[0124] 62. Temperature sensor

[0125] 100. Electronic component such as a server

Claims

DEMANDS

1. A cooling system comprising a housing configured to receive one or more thermally regulated electronic components and a cooling fluid in which the electronic component(s) are at least partially immersed, the system also a cooling fluid circuit, a means of circulating the fluid, such as at least one pump, connected to the cooling fluid circuit, a heat exchanger configured to allow the cooling fluid to pass through it, and at least one fan configured to cool the heat exchanger, said means of circulating the fluid, heat exchanger and fan being external to the casing, and being connected so as to form a rigid assembly fixed relative to the casing and fixed to said casing.

2. Cooling system according to claim 1, characterized in that it comprises a protective structure including the heat exchanger, and at least one fan configured to circulate air in contact with the heat exchanger, in particular through the exchanger, in order to exchange heat with the cooling fluid, the protective structure being configured to surround the heat exchanger so as to protect it from the external environment, the protective structure comprising a wall on which at least one fan is disposed, and in particular an open wall opposite the wall comprising at least one fan comprising openings configured to allow a ventilated airflow to pass through, the open wall comprising in particular stiffening ribs passing through the openings in order to stiffen the protective structure and to protect the heat exchanger disposed between said walls.

3. Cooling system according to the preceding claim, wherein the housing extends in an extension plane mainly along a first vertical axis, the protective structure including the heat exchanger having configured dimensions to be equal to or less than the dimensions of the case along a second axis transverse to the first vertical axis.

4. Cooling system according to any one of claims 2 or 3, wherein the protective structure including the heat exchanger is in line with the largest surfaces of the plane formed by the housing.

5. Cooling system according to any one of claims 2 to 4, wherein the housing is fixed to the protective structure, the structure is fixed to a plate forming the base of the system, the system being configured to be arranged vertically during its operation, with said plate supporting the system.

6. Cooling system according to any one of claims 2 to 5, wherein at least one fan is configured to be detachable from the protective structure during system operation, in particular the electrical connections of each fan are configured to be detachable from the protective structure during system operation.

7. Cooling system according to any one of the preceding claims, wherein the cooling fluid circuit comprises a fluid manifold disposed outside the housing, the means for circulating the fluid being fixed and connected to said manifold, the manifold further comprising in particular a fluid filter, the filter preferably being metallic.

8. Cooling system according to the preceding claim, wherein the manifold includes a temperature sensor configured to measure the temperature of the fluid circulating in the fluid circuit, in particular the means for circulating the fluid includes two pumps, the temperature sensor being located between the two pumps so as to measure the temperature of the fluid circulating in the circuit at a point between the two pumps.

9. Cooling system according to any one of claims 3 to 8, wherein the manifold, the means of circulation of the fluid, the structure and the fluid circuit are all in line with the largest surfaces of the plane formed by the casing.

10. Electronic assembly comprising the cooling system according to any one of the preceding claims, and at least one server, the system housing comprising said server, the server being immersed in a dielectric cooling fluid circulating in the cooling fluid circuit.

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