Electronic device including antenna module

Abstract

According to various embodiments disclosed herein, an electronic device is provided, the electronic device comprising a housing, an antenna module, a bracket, and a heat transfer material. The housing includes a side member and a conductive support plate. The antenna module includes a PCB. The PCB is disposed inside the housing so as to face the side member. The antenna module includes at least one antenna element disposed on the PCB. The antenna module includes at least one electronic component disposed on the PCB. The bracket surrounds at least a portion of the antenna module so as to accommodate the antenna module. The bracket is configured to be fixed to the conductive support plate of the housing. The bracket includes at least one opening. The heat transfer material is filled via the at least one opening in the bracket and transfers heat generated by the at least one electronic component to the conductive support plate of the housing.

Description

Electronic device including an antenna module

[0001] The present disclosure relates to an electronic device comprising an antenna module.

[0002] The electronic device may include an antenna module. The antenna module may be configured to transmit and / or receive wireless signals in a high-frequency band (e.g., mmWave band), for example.

[0003] Heat generated by the antenna module can degrade the performance of the antenna module (e.g., communication speed).

[0004] Embodiments of the present disclosure provide an electronic device comprising an antenna module configured to diffuse and / or disperse heat generated in the antenna module.

[0005] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other unmentioned technical problems will be understood by those skilled in the art from the description below.

[0006] According to various embodiments of the present disclosure, an electronic device is provided, the electronic device comprising a housing, an antenna module, a bracket, and a heat transfer material. The housing comprises a side member and a conductive support plate. The antenna module comprises a PCB. The PCB is positioned within the housing so as to face the side member. The antenna module comprises at least one antenna element disposed on the PCB. The antenna module comprises at least one electronic component disposed on the PCB. The bracket surrounds at least a portion of the antenna module to accommodate the antenna module. The bracket is configured to be secured to the conductive support plate of the housing. The bracket comprises at least one opening. A heat transfer material is filled through the at least one opening of the bracket and transfers heat generated from at least one electronic component to the conductive support plate of the housing.

[0007] According to various embodiments of the present disclosure, an electronic device is provided, the electronic device comprising a housing, an antenna module, a bracket, a heat transfer material, at least one processor, and memory. The antenna module is located within the housing. The antenna module comprises a PCB. The PCB comprises a first surface and a second surface facing in a direction opposite to the first surface. The antenna module comprises at least one antenna element located on the first surface, or inside the PCB closer to the first surface than the second surface. The antenna module comprises at least one electronic component disposed on the second surface. The antenna module comprises an electromagnetic shielding member disposed on the second surface to cover at least one electronic component. A bracket is configured to connect the antenna module and the housing. The bracket comprises at least one opening located between the housing and the bracket. A heat transfer material is filled into at least one opening of the bracket and configured to thermally connect the electromagnetic shielding member and the housing. The memory stores instructions configured to cause the electronic device to determine the timing of an LTE fallback based on the temperature of the antenna module when executed by at least one processor.

[0008] An electronic device including an antenna module according to various embodiments of the present disclosure is configured to more rapidly diffuse and / or disperse heat generated in the antenna module, thereby reducing or preventing performance degradation of the antenna module.

[0009] In addition, other effects that can be obtained or predicted by the various embodiments of this document may be disclosed directly or implicitly in the detailed description of the embodiments of this document.

[0010] The above and other aspects, features, and advantages of specific embodiments of the present disclosure will become more apparent from the following detailed description taken together with the accompanying drawings.

[0011] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0012] FIG. 2 is a block diagram showing an electronic device in a network environment including a plurality of cellular networks according to various embodiments.

[0013] FIG. 3 is a drawing showing the appearance of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure.

[0014] FIG. 4 is a drawing showing the appearance of a folded electronic device according to various embodiments of the present disclosure.

[0015] FIG. 5 is a cross-sectional view of a foldable electronic device in an unfolded state, cut along line D-D' of FIG. 3 according to various embodiments of the present disclosure.

[0016] FIG. 6 is a drawing showing an antenna module according to various embodiments of the present disclosure.

[0017] FIG. 7 is a drawing showing a part of a foldable electronic device according to various embodiments of the present disclosure.

[0018] FIG. 8 is an exploded perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0019] FIG. 9 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0020] FIG. 10 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0021] FIG. 11 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0022] FIG. 12 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0023] FIG. 13 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0024] FIG. 14 is a cross-sectional perspective view of a foldable electronic device cut along line E-E' of FIG. 7 according to various embodiments of the present disclosure.

[0025] FIG. 15 shows the arrangement of a first heat transfer material and a second heat transfer material according to various embodiments of the present disclosure.

[0026] FIG. 16 shows a heat map for a foldable electronic device of the present disclosure according to various embodiments of the present disclosure, and a heat map for a foldable electronic device of a comparative example.

[0027] FIG. 17 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0028] FIG. 18 shows the arrangement of a heat transfer material according to various embodiments of the present disclosure.

[0029] FIG. 19 is a drawing showing a part of a foldable electronic device according to various embodiments of the present disclosure.

[0030] FIG. 20 shows an arrangement of a heat transfer material according to various embodiments of the present disclosure.

[0031] FIG. 21 is a drawing showing a part of a foldable electronic device according to various embodiments of the present disclosure.

[0032] FIG. 22 is a perspective view of a part of a foldable electronic device according to various embodiments of the present disclosure.

[0033] FIG. 23 is a flowchart of the operation of a foldable electronic device according to various embodiments of the present disclosure.

[0034] FIG. 24 is a circuit diagram of a temperature sensing circuit included in an antenna module according to various embodiments of the present disclosure.

[0035] Various embodiments of the present disclosure are described in more detail below. The following description is provided to facilitate a comprehensive understanding of the various embodiments of the present disclosure as defined by the claims and their equivalents, with reference to the accompanying drawings. While various specific details are included to aid understanding, they should be considered merely illustrative. Accordingly, those skilled in the art will recognize that various changes and modifications to the various embodiments described herein may be made without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of known functions and configurations may be omitted for clarity and brevity.

[0036] The terms and words used in the following description and claims are not limited to their bibliographic meanings and are used merely to enable the inventor to understand the present disclosure clearly and consistently. Accordingly, it should be apparent to those skilled in the art that the following description of various embodiments of the present disclosure is provided for illustrative purposes only and is not intended to limit the present disclosure as defined by the appended claims and their equivalents.

[0037] In this disclosure, the expression “comprising” means that a specific effect or result can be obtained within a specific tolerance, and that a person skilled in the art knows how to obtain such tolerance. It should be understood that terms such as “comprising” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this disclosure, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0038] In the present disclosure, where the term “substantially” is used to define a structural part (structure or structural element), an expression including the term “substantially” is understood or interpreted as a technical feature produced within the technical tolerance of the method used to manufacture it.

[0039] In the present disclosure, "placed on XX" may be understood as being placed adjacent to or in substantial contact with XX, coupled to XX, or included in XX.

[0040] In the present disclosure, "located on XX" may be understood as being located adjacent to or in substantial contact with XX, coupled to XX, or included in XX.

[0041] In the present disclosure, where a first component (or region, layer, part, etc.) is described as being "on," "connected," or "joined" to a second component, it may be understood that it may be directly placed, connected, or joined to the second component, or that a third component may be placed between them.

[0042] In the present disclosure, “ZZ between XX and YY” may be understood as ZZ being positioned in substantial contact with XX or YY or ZZ being directly coupled to XX or YY. “ZZ between XX and YY” may be understood as ZZ being positioned between XX and YY with at least one other component between XX and ZZ and / or at least one component between YY and ZZ in between. “ZZ between XX and YY” may be understood as at least one other component between XX and ZZ connecting XX and ZZ and / or at least one other component between YY and ZZ connecting YY and ZZ.

[0043] In this disclosure, unless otherwise noted, "conductivity" may be understood as "electrical conductivity" and "nonconductivity" may be understood as "electrical insulation." In context, or where thermal properties are mentioned, "conductivity" may be understood as "thermal conductivity."

[0044] In this disclosure, terms such as "above," "upper," "upper," "lower," "lower," or "lower" may be used to describe the relationships between components illustrated in the drawings. These terms are relative concepts and may be described based on the directions indicated in the drawings.

[0045] In the present disclosure, the term “and / or” may be understood to include all of one or more combinations that the associated components may define.

[0046] In the drawings of the present disclosure, the thickness, proportion, and / or dimensions of the components are for the purpose of effectively illustrating the technical content and are not limited to the thickness, proportion, and / or dimensions depicted.

[0047] In the drawings of the present disclosure, at least one structural component may be depicted transparently or translucently to aid in understanding the structural relationships between the components.

[0048] The "comparative examples" mentioned in this disclosure are provided merely for comparison with the embodiments of this disclosure and do not constitute prior art to the various embodiments of this disclosure.

[0049] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments of the present disclosure.

[0050] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an external electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an external electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). The electronic device (101) may communicate with an external electronic device (104) through a server (108). The electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), and / or antenna module (197). In various embodiments of the present disclosure, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In various embodiments of the present disclosure, some of these components may be implemented as a single integrated circuitry. For example, a sensor module (176), a camera module (180), or an antenna module (197) can be implemented by being embedded in a single component (e.g., a display module (160)).

[0051] The processor (120) may include various processing circuits and / or multiple processors. For example, the term “processor” as used in the present disclosure, including in the claims, may include at least one processor and various processing circuits, wherein one or more of the at least one processor may be configured to perform the various functions described in the present disclosure individually and / or collectively in a distributed manner. When the terms “processor,” “at least one processor,” and “one or more processors” as used in the present disclosure are described as being configured to perform numerous functions, these terms encompass, for example, without limitation, situations where one processor performs some of the mentioned functions and other processor(s) perform others of the mentioned functions, and situations where a single processor can perform all the mentioned functions. Additionally, at least one processor may include a combination of processors performing various mentioned / disclosed functions, for example, in a distributed manner. At least one processor may execute program instructions to achieve or perform various functions.

[0052] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. As at least part of the data processing or operations, the processor (120) can load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). The processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)). Additionally or alternatively, the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0053] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. The auxiliary processor (123) (e.g., image signal processor (ISP) or communication processor (CP)) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to various embodiments of the present disclosure, the auxiliary processor (123) (e.g., neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), a deep Q-network, or any combination of two or more of the above, but is not limited to the examples described above. In addition to hardware structures, the artificial intelligence model may additionally or substantially include software structures.

[0054] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The various data may include, for example, software (e.g., program (140)) and input or output data for related commands. The memory (130) may include volatile memory (132) and / or non-volatile memory (134).

[0055] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), and / or an application (146).

[0056] The input module (150) can receive commands or data to be used for other components of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).

[0057] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used for incoming calls. The receiver may be implemented separately from the speaker or as part thereof.

[0058] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. The display module (160) may include a touch circuit (e.g., a touch sensor) configured to detect a touch, or a sensor circuit (e.g., a pressure sensor) configured to measure the intensity of the force generated by said touch.

[0059] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. The audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., external electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0060] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. The sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0061] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., external electronic device (102)). The interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0062] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., external electronic device (102)). The connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0063] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. The haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0064] The camera module (180) can capture still images and video. The camera module (180) may include one or more lenses, image sensors, image signal processors (ISPs), or flashes.

[0065] The power management module (188) can manage power supplied to or consumed by the electronic device (101). The power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0066] The battery (189) can supply power to at least one component of the electronic device (101). The battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell.

[0067] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., external electronic device (102), external electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors (CP) that operate independently of the processor (120) (e.g., application processor (AP)) and support direct (e.g., wired) communication or wireless communication. The communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules is a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (199) (e.g., a legacy cellular network, 5G (5 thIt can communicate with an external electronic device (104) through a network (generation), a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network, such as a first network (198) or a second network (199), using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in a subscriber identification module (SIM) (196).

[0068] The wireless communication module (192) is 4G (4 thIt can support 5G networks and next-generation communication technologies following the generation network, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (i.e., eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave (millimeter wave) band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., external electronic device (104)), or network system (e.g., second network (199)). According to various embodiments of the present disclosure, the wireless communication module (192) has a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, a loss coverage (e.g., 164 dB or less) for realizing mMTC, or a U-plane (user plane) latency (e.g., downlink (DL) and uplink (UL) each of 0) for realizing URLLC.It can support 5ms or less, or round trip 1ms or less.

[0069] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). The antenna module (197) may include an antenna comprising a radiator that includes a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). The antenna module (197) may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0070] According to various embodiments of the present disclosure, the antenna module (197) may form a mmWave antenna module. According to various embodiments of the present disclosure, the mmWave antenna module may include a PCB, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the PCB and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the PCB and capable of transmitting or receiving a signal of the specified high frequency band.

[0071] At least some of the above components are connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., commands or data) with each other.

[0072] Commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). All or part of the operations performed on the electronic device (101) may be performed on one or more external electronic devices, such as the external electronic devices (102 or 104) or the server (108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the request may perform at least part of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide an ultra-low delay service using, for example, distributed computing or mobile edge computing (MEC). In various embodiments of the present disclosure, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks.According to various embodiments of the present disclosure, an external electronic device (104) or a server (108) may be included within a second network (199). The electronic device (101) may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0073] The electronic device according to the various embodiments of the present disclosure may be a device of various forms. The electronic device may include a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. However, the electronic device is not limited to the devices described above.

[0074] The various embodiments of the present disclosure and the terms used therein are not limited to the specific embodiments of the technical features described in the present disclosure. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In the present disclosure, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as “first,” “second,” or “first” or “second” may be used simply to distinguish a corresponding component from other corresponding components and do not limit the corresponding components in any other aspect (e.g., importance or order). Where one element (e.g., a first component) is referred to as "coupled" or "connected" to another element (e.g., a second component), with or without the terms "functionally" or "communicationly," the element may be connected to the other element directly (e.g., by wire), wirelessly, or through a third component.

[0075] The term "module" may include a unit implemented in hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to various embodiments of the present disclosure, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0076] Various embodiments of the present disclosure may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0077] Methods according to various embodiments of the present disclosure may be provided by being included in a computer program product. A computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., CD-ROM (compact disc read only memory)) or an application store (e.g., PLAYSTORE) TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0078] Each of the components described above (e.g., modules or programs) may include a singular or multiple entities. One or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as they were performed by the corresponding components among the multiple components prior to the integration. Operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically; one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0079] FIG. 2 is a block diagram (200) showing an electronic device (101) in a network environment including a plurality of cellular networks according to various embodiments.

[0080] Referring to FIG. 2, the electronic device (101) may include a first communication processor (212), a second communication processor (214), a first RFIC (radio frequency integrated circuit) (222), a second RFIC (224), a third RFIC (226), a fourth RFIC (228), a first radio frequency front end (RFFE) (232), a second RFFE (234), a first antenna module (242), a second antenna module (244), and / or an antenna (248). The electronic device (101) may include a processor (120) and a memory (130). The second network (199) may include a first cellular network (292) and a second cellular network (294). According to various embodiments, the electronic device (101) may further include at least one of the components described in FIG. 1, and the second network (199) may further include at least one other network. According to various embodiments, the first communication processor (212), the second communication processor (214), the first RFIC (222), the second RFIC (224), the fourth RFIC (228), the first RFFE (232), and the second RFFE (234) may form at least a part of the wireless communication module (192). According to various embodiments, the fourth RFIC (228) may be omitted or included as part of the third RFIC (226).

[0081] The first communication processor (212) can establish a communication channel in a band to be used for wireless communication with the first cellular network (292), and support legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), third generation (3G), fourth generation (4G), or LTE (long term evolution) network. The second communication processor (214) can establish a communication channel corresponding to a designated band (e.g., about 6 GHz to about 60 GHz) among the bands to be used for wireless communication with the second cellular network (294), and support 5G network communication through the established communication channel. According to various embodiments, the second cellular network (294) may be a fifth generation (5G) network as defined by 3GPP. Additionally, according to various embodiments, the first communication processor (212) or the second communication processor (214) may support the establishment of a communication channel corresponding to another designated band (e.g., about 6 GHz or less) among the bands to be used for wireless communication with the second cellular network (294), and 5G network communication through the established communication channel. According to various embodiments, the first communication processor (212) and the second communication processor (214) may be implemented within a single chip or a single package. According to various embodiments, the first communication processor (212) or the second communication processor (214) may be formed within a single chip or a single package with the processor (120), the auxiliary processor (123), or the communication module (190).

[0082] The first RFIC (222) can convert a baseband signal generated by the first communication processor (212) during transmission into a radio frequency (RF) signal of about 700 MHz (megahertz) to about 3 GHz used in the first cellular network (292) (e.g., legacy network). During reception, the RF signal is acquired from the first cellular network (292) (e.g., legacy network) through an antenna (e.g., first antenna module (242)) and can be preprocessed through an RFFE (e.g., first RFFE (232)). The first RFIC (222) can convert the preprocessed RF signal into a baseband signal so that it can be processed by the first communication processor (212).

[0083] The second RFIC (224) can convert a baseband signal generated by the first communication processor (212) or the second communication processor (214) into an RF signal of the Sub6 band (e.g., about 6 GHz or less) used in the second cellular network (294) (e.g., 5G network) (hereinafter, 5G Sub6 RF signal). When receiving, the 5G Sub6 RF signal is acquired from the second cellular network (294) (e.g., 5G network) through an antenna (e.g., the second antenna module (244)) and can be preprocessed through an RFFE (e.g., the second RFFE (234)). The second RFIC (224) can convert the preprocessed 5G Sub6 RF signal into a baseband signal so that it can be processed by the corresponding communication processor among the first communication processor (212) or the second communication processor (214).

[0084] The third RFIC (226) can convert a baseband signal generated by the second communication processor (214) into an RF signal of the 5G Above6 band (e.g., approximately 6 GHz to approximately 60 GHz) (hereinafter, 5G Above6 RF signal) to be used in the second cellular network (294) (e.g., 5G network). Upon reception, the 5G Above6 RF signal may be acquired from the second cellular network (294) (e.g., 5G network) through an antenna (e.g., antenna (248)) and preprocessed through the third RFFE (236). The third RFIC (226) can convert the preprocessed 5G Above6 RF signal into a baseband signal so that it can be processed by the second communication processor (214). According to various embodiments, the third RFFE (236) may be formed as part of the third RFIC (226).

[0085] According to various embodiments, the electronic device (101) may include a fourth RFIC (228) separately from or at least as part of the third RFIC (226). In this case, the fourth RFIC (228) may convert a baseband signal generated by the second communication processor (214) into an RF signal (hereinafter referred to as an IF signal) in an intermediate frequency band (e.g., about 9 GHz to about 11 GHz) and then transmit the IF signal to the third RFIC (226). The third RFIC (226) may convert the IF signal into a 5G Above6 RF signal. Upon reception, the 5G Above6 RF signal may be received from the second cellular network (294) (e.g., a 5G network) through an antenna (e.g., antenna (248)) and converted into an IF signal by the third RFIC (226). The fourth RFIC (228) can convert the IF signal into a baseband signal so that the second communication processor (214) can process it.

[0086] According to various embodiments, the first RFIC (222) and the second RFIC (224) may be implemented as at least part of a single chip or a single package. According to various embodiments, the first RFFE (232) and the second RFFE (234) may be implemented as at least part of a single chip or a single package. According to various embodiments, at least one of the first antenna module (242) or the second antenna module (244) may be omitted or combined with another antenna module to process RF signals of a plurality of corresponding bands.

[0087] According to various embodiments, the third RFIC (226) and the antenna (248) may be placed on the same substrate to form a third antenna module (246). For example, a wireless communication module (192) or a processor (120) may be placed on a first substrate (e.g., a main PCB). In this case, the third RFIC (226) may be placed on a portion of a second substrate (e.g., a sub PCB) separate from the first substrate (e.g., a bottom surface), and the antenna (248) may be placed on another portion of a second substrate (e.g., a sub PCB) to form a third antenna module (246). By placing the third RFIC (226) and the antenna (248) on the same substrate, it is possible to reduce the length of the transmission line between them. This can reduce the loss (e.g., attenuation) of signals in the high-frequency band (e.g., about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. As a result, the electronic device (101) can improve the quality or speed of communication with the second cellular network (294) (e.g., 5G network).

[0088] According to various embodiments, the antenna (248) may be formed as an antenna array comprising a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC (226) may include a plurality of phase shifters (238) corresponding to the plurality of antenna elements, for example, as part of the third RFFE (236). During transmission, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device (101) (e.g., a base station of a 5G network) through the corresponding antenna element. During reception, each of the plurality of phase shifters (238) can change the phase of a 5G Above6 RF signal received from the outside through the corresponding antenna element to the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device (101) and the outside.

[0089] The second cellular network (294) (e.g., 5G network) may be operated independently of the first cellular network (292) (e.g., legacy network) (e.g., Stand-Alone (SA)) or connected (e.g., Non-Stand Alone (NSA)). For example, the 5G network may only have an access network (e.g., 5G radio access network (RAN) or next generation RAN (NG RAN)) and no core network (e.g., next generation core (NGC)). In this case, the electronic device (101) can access the access network of the 5G network and then access an external network (e.g., the Internet) under the control of the core network of the legacy network (e.g., evolved packed core (EPC)). Protocol information for communication with a legacy network (e.g., LTE protocol information) or protocol information for communication with a 5G network (e.g., New Radio (NR) protocol information) is stored in memory (230) and can be accessed by other parts (e.g., processor (120), first communication processor (212), or second communication processor (214)).

[0090] FIG. 3 is a drawing showing the appearance of a foldable electronic device (3) in an unfolded state (also called an unfolding state or a flat state) according to various embodiments of the present disclosure.

[0091] FIG. 4 is a drawing showing the appearance of a foldable electronic device (3) in a folded state (also called a folding state) according to various embodiments of the present disclosure.

[0092] FIG. 5 is a cross-sectional view of a foldable electronic device (3) in an unfolded state, cut along line D-D' of FIG. 3 according to various embodiments of the present disclosure.

[0093] FIG. 6 is a drawing showing an antenna module (6) according to various embodiments of the present disclosure.

[0094] It is understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 3, 4, 5, and 6 is conceived and included. Any combination of features described below in connection with FIGS. 3, 4, 5, and 6 may be considered to be included in this disclosure as specific examples.

[0095] Referring to FIGS. 3, 4, and 5, the foldable electronic device (3) may include a foldable housing (30) and a first display module (35).

[0096] According to various embodiments, the unfolded state and the folded state of the foldable electronic device (3) may be provided (or formed) by the foldable housing (30). The "unfolded state of the foldable electronic device (3)" and the "unfolded state of the foldable housing (30)" may be understood as the same. The "folded state of the foldable electronic device (3)" and the "folded state of the foldable housing (30)" may be understood as the same.

[0097] According to various embodiments, the foldable housing (30) may include a first housing (also referred to as a first housing part or a first housing structure) (31) and a second housing (also referred to as a second housing part or a second housing structure) (32). The foldable housing (30) may include a hinge cover (also referred to as a hinge housing) (33). The foldable housing (30) may include a hinge module (also referred to as a hinge part, a hinge structure, or a hinge assembly) (34). The first housing (31) and the second housing (32) may be rotatably connected through the hinge module (34). The hinge module (34) may be placed on the hinge cover (33).

[0098] According to various embodiments, a first display module (also called a first display) (35) may be placed in a foldable housing (30). The first display module (35) may include, for example, a flexible display module (also called a flexible display) or a foldable display module (also called a foldable display) that can be deformed in response to a transition between an unfolded state and a folded state of a foldable electronic device (3).

[0099] According to various embodiments, the first display module (35) may include a display area (350). The display area (350) may include an active area or a screen area capable of displaying an image based on an electrical signal. The display area (350) may include a first display area (351) disposed in the first housing (31), a second display area (352) disposed in the second housing (32), and a third display area (353) disposed in the hinge module (34). The third display area (353) may extend the first display area (351) and the second display area (352). The shape of the first display area (351) may be maintained by the support of the first housing (31). The first display area (351) may be provided (or formed) substantially flat by being supported, for example, by the first housing (31). The shape of the second display area (352) may be maintained by being supported by the second housing (32). The second display area (352) may be provided (or formed) substantially flat by being supported, for example, by the second housing (32). The third display area (353) may be positioned corresponding to the hinge module (34). When the foldable electronic device (3) is switched between an unfolded state and a folded state, the third display area (353) may be deformed corresponding to the relative position between the first display area (351) and the second display area (352). In the unfolded state of the foldable electronic device (3), the third display area (353) may be positioned substantially flat. In the folded state of the foldable electronic device (3), the third display area (353) may be positioned in a bent shape. The unfolded state of the foldable electronic device (3) may be understood as a state in which the third display area (353) is positioned flat.The folded state of the foldable electronic device (3) can be understood as a state in which the third display area (353) is arranged in a bent form.

[0100] According to various embodiments, in the unfolded state of the foldable electronic device (3), the first display area (351) and the second display area (352) may form an angle of approximately 180 degrees, and the display area (350) of the first display module (35) may be provided (or arranged) in a substantially flat form. In the unfolded state of the foldable electronic device (3), due to the relative position between the first display area (351) arranged in the first housing (31) and the second display area (352) arranged in the second housing (32), the third display area (353) may be arranged substantially flat. In the unfolded state of the foldable electronic device (3), the third display area (353) can be pulled from both sides by the first display area (351) and the second display area (352), and the pulling force can be provided to reduce damage to the third display area (353) while laying the third display area (353) flat. The third display area (353) can be provided (or formed) with an extended width that can be laid flat while reducing stress by being pulled by the first display area (351) and the second display area (352) in the unfolded state of the foldable electronic device (3).

[0101] According to various embodiments, in the unfolded state of the foldable electronic device (3), the hinge module (34) may be configured to support the third display area (353) of the first display module (35) substantially flat. The hinge module (34) may support the third display area (353) so that, for example, in the unfolded state of the foldable electronic device (3), the third display area (353) can be positioned flat without sagging or with reduced sagging, thereby reducing crease.

[0102] According to various embodiments, when an external force (e.g., external pressure such as touch input using a user's finger or touch input using an electronic pen) is applied to the third display area (353) in the unfolded state of the foldable electronic device (3), the hinge module (34) may be configured to support the third display area (353) so that the third display area (353) can be kept flat by reducing the sagging phenomenon of the third display area (353).

[0103] According to various embodiments, when an external impact is applied due to reasons such as a fall while the foldable electronic device (3) is in an unfolded state, the hinge module (34) may be configured to reduce or absorb the external impact so as to reduce the impact of the external impact on the third display area (353).

[0104] According to various embodiments, the display area (350) of the first display module (35) may substantially provide (or form) the front of the exterior of the foldable electronic device (3). The front of the foldable electronic device (3) may include a first front area provided (or formed) by the first display area (351), a second front area provided (or formed) by the second display area (352), and a third front area provided (or formed) by the third display area (353). The illustrated coordinate axes of the foldable electronic device (3) are illustrated, for example, with respect to the first housing (31), and the direction parallel to the positive direction of the z-coordinate axis may be understood as the direction in which the substantially flat first front area faces. For example, the first front area provided (or formed) by the first display area (351) may be substantially parallel to the xy plane. In the unfolded state of the foldable electronic device (3), the front surface of the foldable electronic device (3) can be provided (or formed) as substantially flat.

[0105] According to various embodiments, the foldable electronic device (3) may be implemented in an infolding manner in which the display area (350) of the first display module (35) (or the front of the foldable electronic device (3) where the display area (350) is visually visible) can be folded inward. FIG. 4 shows a fully folded state of the foldable electronic device (3) arranged so that the first housing (31) and the second housing (32) are no longer close to each other. In the fully folded state of the foldable electronic device (3), the first display area (351) and the second display area (352) (or, the first front area and the second front area) may face each other. For example, in a fully folded state of the foldable electronic device (3), the angle between the first housing (31) and the second housing (32) (or, the angle between the first display area (351) and the second display area (352), or the angle between the first front area and the second front area) may be approximately 0 degrees to approximately 10 degrees. In a fully folded state of the foldable electronic device (3), the display area (350) of the first display module (35) may be substantially invisible. Although not separately illustrated, the foldable electronic device (3) may be positioned in an intermediate state between the unfolded state and the fully folded state. For example, in an intermediate state of the foldable electronic device (3) where the angle between the first housing (31) and the second housing (32) is greater than a certain angle, the foldable electronic device (3) may be configured to provide a user environment in which a user can utilize the display area (350). The "folded state of the foldable electronic device (3)" mentioned in the present disclosure can be understood as a fully folded state.

[0106] According to various embodiments, when viewing the unfolded state of the foldable electronic device (3), the display area (350) of the first display module (35) may be provided (or formed) in a symmetrical shape with respect to the center line (A) of the foldable electronic device (3). The center line (A) of the foldable electronic device (3) may correspond to the middle of the width extending from the first boundary between the first display area (351) and the third display area (353) to the second boundary between the second display area (351) and the third display area (353) when viewing the unfolded state of the foldable electronic device (3). The positive and negative directions of the x-axis may be substantially parallel to the center line (A), for example, and the positive and negative directions of the y-axis may be substantially perpendicular to the center line (A). In various embodiments, the center line (A) of the foldable electronic device (3) may be understood as the "folding axis" of the foldable housing (30) or the foldable electronic device (3). The folding axis may be substantially provided (or formed) by the hinge module (34). A third display area (353) arranged in a bent form in the folded state of the foldable electronic device (3) may be provided (or formed) in a substantially symmetrical form with respect to the center line (A) of the foldable electronic device (3).

[0107] According to various embodiments, the first housing (31) may include a first frame (also referred to as a first frame structure or first framework) (311), and a first back cover (also referred to as a first rear cover, first rear plate, or first back plate) (312) disposed on (or combined with) the first frame (311). The combination of the first frame (311) and the first back cover (312) may provide (or form) a first rear area (also referred to as a first rear appearance) and a first side area (also referred to as a first side appearance) of the appearance of the foldable electronic device (3). The first frame (311) may provide (or form) at least a portion of the first side area of ​​the foldable electronic device (3). The first back cover (312) may provide (or form) at least a portion of the first rear area of ​​the foldable electronic device (3). The first rear area may face in the opposite direction to the first front area of ​​the foldable electronic device (3) provided (or formed) by the first display area (351) of the first display module (35).

[0108] According to various embodiments, the first frame (311) may include a first side member (also referred to as a first border member, a first side member, a first side structure, or a first side bezel structure) (3112). The first side member (3112) may surround at least part of the space between the first display area (351) and the first back cover (312) and may provide (or form) at least part of the first side area of ​​the exterior of the foldable electronic device (3).

[0109] According to various embodiments, the first frame (311) may include a first support plate (also referred to as a first support member, first support structure, first support portion, or first bracket) (3111) that extends from or is connected to the first side member (3112). The first support plate (3111) may be a structural element located inside the foldable electronic device (3) corresponding to the first housing (31). The first support plate (3111) may include at least some metallic material and may include, for example, a first conductive support plate or a first metal support plate.

[0110] According to various embodiments, the first frame (311) may be provided (or formed) as an integrated or single structure (e.g., a single continuous structure or a complete structure) comprising a first support plate (3111) and a first side member (3112).

[0111] According to various embodiments, the first frame (311) may be provided as a combination of a conductor (or metal body) (not separately shown) comprising one or more conductive parts and a nonconductor (or non-metal body) (not separately shown) comprising one or more nonconductive parts.

[0112] According to various embodiments, the first support plate (3111) may be positioned at least partially between the first display area (351) and the first back cover (312). The first display area (351) may be placed on the first support plate (3111), and the first support plate (3111) may be configured to support the first display area (351).

[0113] According to various embodiments, a plurality of electrical components, such as a first printed circuit board (first PCB (710) in FIG. 7) and a first battery (e.g., first battery (720) in FIG. 7), may be partially disposed or coupled to a first support plate (3111) of the first frame (311) between the first frame (311) and the first back cover (312).

[0114] According to various embodiments, electrical components (or electronic components), or various members associated with electrical components, may be placed or coupled to the first frame (311) or the first support plate (3111), or supported by the first frame (311) or the first support plate (3111). The first support plate (3111) may include, for example, a first support surface (3111A) and a third support surface (3111B). The first support surface (3111A) may substantially face the first display area (351) of the first display module (35). The third support surface (3111B) may be located on the opposite side from the first support surface (3111A). The third support surface (3111B) may substantially face the first back cover (312). Electrical components (or electronic parts), or various members associated with electrical components, may be placed or coupled to the first support surface (3111A) and / or the third support surface (3111B), or supported by the first support surface (3111A) and / or the third support surface (3111B). The first support surface (3111A) may include a first front mounting portion for stably placing or supporting one or more components, such as the first display area (351) of the first display module (35). The first front mounting portion may be formed, for example, by a combination of surface areas of different heights. The third support surface (3111B) may include a first rear mounting portion for stably placing or supporting one or more components, such as the first PCB and / or the first battery. The first rear mounting portion may be formed, for example, by a combination of surface areas of different heights.

[0115] According to various embodiments, the second housing (32) may include a second frame (also referred to as a second frame structure or second framework) (321), and / or a second back cover (also referred to as a second rear cover, second rear plate, or second back plate) (322) disposed on the second frame (321). The combination of the second frame (321) and the second back cover (322) may provide (or form) a second rear area (also referred to as a second rear appearance) and a second side area (also referred to as a second side appearance) among the appearances of the foldable electronic device (3). The second frame (321) may provide (or form) at least a portion of the second side area of ​​the foldable electronic device (3). The second back cover (322) may provide (or form) at least a portion of the second rear area of ​​the foldable electronic device (3). The second rear region may face in the opposite direction to the second front region of the foldable electronic device (3) provided (or formed) by the second display region (352).

[0116] According to various embodiments, the second frame (321) may include a second side member (also referred to as a second border member, second side member, second side structure, or second side bezel structure) (3212). The second side member (3212) may surround at least part of the space between the second display area (352) and the second back cover (322) and may provide (or form) at least part of the second side area of ​​the exterior of the foldable electronic device (3).

[0117] According to various embodiments, the second frame (321) may include a second support plate (also referred to as a second support member, second support structure, second support member, or second bracket) (3211) that extends from or is connected to the second side member (3212). The second support plate (3211) may be a structural element located inside the foldable electronic device (3) corresponding to the second housing (32). The second support plate (3211) may include at least some metallic material and may include, for example, a second conductive support plate or a second metal support plate.

[0118] According to various embodiments, the second frame (321) may be provided as an integral or single structure (e.g., a single continuous structure or a complete structure) comprising a second support plate (3211) and a second side member (3212).

[0119] According to various embodiments, the second frame (321) may be provided as a combination of a conductor (or metal body) (not separately shown) comprising one or more conductive parts and a nonconductor (or non-metal body) (not separately shown) comprising one or more nonconductive parts.

[0120] According to various embodiments, the second support plate (3211) may be positioned at least partially between the second display area (352) and the second back cover (322). The second display area (352) may be placed on the second support plate (3211), and the second support plate (3211) may be configured to support the second display area (352).

[0121] According to various embodiments, a plurality of electrical components, such as a second PCB and a second battery, may be partially disposed or coupled to the second support plate (3211) of the second frame (321) between the second frame (321) and the second back cover (322).

[0122] According to various embodiments, electrical components (or electronic components), or various members associated with electrical components, may be placed or coupled to the second frame (321) or the second support plate (3211), or supported by the second frame (321) or the second support plate (3211). The second support plate (3211) may include, for example, a second support surface (3211A) and a fourth support surface (3211B). The second support surface (3211A) may substantially face the second display area (352) of the first display module (35). The fourth support surface (3211B) may be located on the opposite side from the second support surface (3211A). The fourth support surface (3211B) may substantially face the second back cover (322). Electrical components (or electronic parts), or various members associated with electrical components, may be placed or coupled to the second support surface (3211A) and / or the fourth support surface (3211B), or supported by the second support surface (3211A) and / or the fourth support surface (3211B). The second support surface (3211A) may include a second front mounting portion for stably placing or supporting one or more components, such as the second display area (352) of the first display module (35). The second front mounting portion may be formed, for example, by a combination of surface areas of different heights. The fourth support surface (3211B) may include a second rear mounting portion for stably placing or supporting one or more components, such as the second PCB and / or the second battery. The second rear mounting portion may be formed, for example, by a combination of surface areas of different heights.

[0123] According to various embodiments, the first side member (3112) of the first frame (311) may include a first side portion (also called a first edge) (B1), a third side portion (also called a third edge) (B3), a fifth side portion (also called a fifth edge) (B5), and / or a seventh side portion (also called a seventh edge) (B7). The first side portion (B1) may extend in a direction perpendicular to the center line (A) of the foldable electronic device (3) (e.g., a direction parallel to the y-axis). The third side portion (B3) may be spaced apart from the first side portion (B1) in a direction parallel to the center line (A) of the foldable electronic device (3) (e.g., a direction parallel to the x-axis) and may be substantially parallel to the first side portion (B1). The fifth side portion (B5) may extend or connect one end of the first side portion (B1) and one end of the third side portion (B3). The seventh side portion (B7) may extend or connect the other end of the first side portion (B1) and the other end of the third side portion (B3). The fifth side portion (B5) and the seventh side portion (B7) extend in a direction parallel to the center line (A) of the foldable electronic device (3) and may be substantially parallel to each other. The seventh side portion (B7) may be located closer to the center line (A) of the foldable electronic device (3) than the fifth side portion (B5). The first corner where the first side portion (B1) and the fifth side portion (B5) are extended or connected, and / or the second corner where the third side portion (B3) and the fifth side portion (B5) are extended or connected may be provided (or formed) as a smooth curve.

[0124] According to various embodiments, when viewed from above the first back cover (312), the first side portion (B1), the third side portion (B3), the fifth side portion (B5), and the seventh side portion (B7) may surround the first back cover (312). "When viewed from above the first back cover (112)" may be understood as "when viewed in a direction orthogonal to the first back cover (312)." "When viewed from above the first back cover (312)" may refer, for example, to a view in the positive direction of the z-axis.

[0125] According to various embodiments, the second side member (3212) of the second frame (321) may include a second side portion (also called a second edge) (B2), a fourth side portion (also called a fourth edge) (B4), a sixth side portion (also called a sixth edge) (B6), and / or an eighth side portion (also called an eighth edge) (B8). The second side portion (B2) may extend in a direction perpendicular to the center line (A) of the foldable electronic device (3). The fourth side portion (B4) may be spaced apart from the second side portion (B2) in a direction parallel to the center line (A) of the foldable electronic device (3) and may be substantially parallel to the second side portion (B2). The sixth side portion (B6) may extend or connect one end of the second side portion (B2) and one end of the fourth side portion (B4). The eighth side portion (B8) may extend or connect the other end of the second side portion (B2) and the other end of the fourth side portion (B4). The sixth side portion (B6) and the eighth side portion (B8) extend in a direction parallel to the center line (A) of the foldable electronic device (3) and may be substantially parallel to each other. The eighth side portion (B8) may be located closer to the center line (A) of the foldable electronic device (3) than the sixth side portion (B6). The third corner where the second side portion (B2) and the sixth side portion (B6) are extended or connected, and / or the fourth corner where the fourth side portion (B4) and the sixth side portion (B6) are extended or connected may be provided (or formed) as a smooth curve.

[0126] According to various embodiments, when viewed from above the second back cover (322), the second side portion (B2), the fourth side portion (B4), the sixth side portion (B6), and the eighth side portion (B8) may surround the second back cover (322). "When viewed from above the second back cover (322)" may be understood as "when viewed in a direction orthogonal to the second back cover (322)." "When viewed from above the second back cover (322)" may refer, for example, when viewed in the positive direction of the z-axis in the unfolded state of the foldable electronic device (3).

[0127] According to various embodiments, in the folded state of the foldable electronic device (3), the first side member (3112) of the first frame (311) and the second side member (3212) of the second frame (321) may be aligned and overlapped with each other. In the folded state of the foldable electronic device (3), the first side portion (B1) and the second side portion (B2) may be aligned and overlapped with each other. In the folded state of the foldable electronic device (3), the third side portion (B3) and the fourth side portion (B4) may be aligned and overlapped with each other. In the folded state of the foldable electronic device (3), the fifth side portion (B5) and the sixth side portion (B6) may be aligned and overlapped with each other.

[0128] According to various embodiments, the first side portion (B1), the third side portion (B3), and the fifth side portion (B5) may be a one-sided bezel (or first screen bezel) surrounding one side area of ​​the first display module (35) based on the center line (A) of the foldable electronic device (3). The second side portion (B2), the fourth side portion (B4), and the sixth side portion (B6) may be a other-sided bezel (or second screen bezel) surrounding the other side area of ​​the first display module (35) based on the center line (A) of the foldable electronic device (3). The seventh side portion (B7) and the eighth side portion (B8) may be located on the opposite side of the third display area (353). When viewed from above on the front of the foldable electronic device (3) in the unfolded state (e.g., when viewed in the negative direction of the z-axis), the 7th side portion (B7) and the 8th side portion (B8) may not be visible.

[0129] According to various embodiments, the hinge cover (33) may be connected to the hinge module (34). The hinge cover (33) may cover the hinge module (34) so ​​that the hinge module (34) is not visible from the outside of the foldable electronic device (3). The hinge cover (33) may include a first side wall (also referred to as a first end) (331) and a second side wall (also referred to as a second end) (332). The hinge cover (33) may extend from the first side wall (331) to the second side wall (332) in a direction parallel to the center line (A) of the foldable electronic device (3). The first side wall (331) and the second side wall (332) of the hinge cover (33) may be substantially perpendicular to a direction parallel to the center line (A) of the foldable electronic device (3) and may be spaced apart from each other in a direction parallel to the center line (A) of the foldable electronic device (3). The hinge cover (33) may include a side wall extension (333) between the first side wall (331) and the second side wall (332). The side wall extension (333) may extend or connect the first side wall (331) and the second side wall (332). The first side wall (331) of the hinge housing (33) may be positioned corresponding to the first side portion (B1) of the first frame (311) and the second side portion (B2) of the second frame (321). In the unfolded state of the foldable electronic device (3), the first side wall (331) may be covered by the first side portion (B1) of the first frame (311) and the second side portion (B2) of the second frame (321). In the folded state of the foldable electronic device (3), the first side wall (331) may be visually exposed to the outside through the gap between the first side portion (B1) of the first frame (311) and the second side portion (B2) of the second frame (321). The second side wall (332) of the hinge cover (33) may be positioned corresponding to the third side portion (B3) of the first frame (311) and the fourth side portion (B4) of the second frame (321).In the unfolded state of the foldable electronic device (3), the second side wall (332) may be covered by the third side portion (B3) of the first frame (311) and the fourth side portion (B4) of the second frame (321). In the folded state of the foldable electronic device (3), the first side wall (332) may be visually exposed to the outside through the gap between the third side portion (B3) of the first frame (311) and the fourth side portion (B4) of the second frame (321). The side wall extension (333) of the hinge cover (33) may be positioned corresponding to the seventh side portion (B7) of the first frame (311) and the eighth side portion (B8) of the second frame (321). The side wall extension (333) can be visually exposed to the outside through an open gap between the seventh side portion (B7) of the first frame (311) and the eighth side portion (B8) of the second frame (321) in the folded state of the foldable electronic device (3). In the unfolded state of the foldable electronic device (3), the gap between the seventh side portion (B7) of the first frame (311) and the eighth side portion (B8) of the second frame (321) is closed, and the side wall extension (333) may not be visually exposed to the outside.

[0130] According to various embodiments, the side wall extension (333) of the hinge cover (33) may include a seating portion configured to stably position and support the hinge module (34). The seating portion may be provided as a combination of surface areas of different heights. The seating portion may include, for example, a recess where the hinge module (34) is positioned.

[0131] According to various embodiments, when the foldable electronic device (3) transitions from an unfolded state to a folded state, a gap between the first frame (311) and the second frame (321) may open on the opposite side of the third display area (353) due to a change in the relative position between the first frame (311) and the second frame (321) connected through the hinge module (34), and a change in the state of the hinge module (34) combined with the hinge cover (33). The hinge cover (33) may be visually exposed to the outside through the open gap. In the folded state of the foldable electronic device (3), the hinge cover (33) may become part of the exterior covering the interior of the foldable electronic device (3). In the folded state of the foldable electronic device (3), the side of the foldable electronic device (3) may include a first side area provided by the first side member (3112) of the first frame (311), a second side area provided by the second side member (3212) of the second frame (321), and a third side area provided by the hinge cover (33).

[0132] According to various embodiments, the foldable electronic device (3) may include a second display module (36) (also referred to as a second display). The second display module (36) may be positioned between the first back cover (312) and the first support plate (3111) of the first frame (311). The second display module (36) may be placed on or coupled to the first back cover (312) and / or the first support plate (3111). The display area (360) of the second display module (36) may be visually visible through the first back cover (312). In various embodiments, the first back cover (312) may include a transparent area (also referred to as a light-transmitting area) corresponding to the display area (360) of the second display module (36), and an opaque area surrounding the transparent area. The display area (360) of the second display module (36) can be visually seen through the transparent area of ​​the first back cover (312). The foldable electronic device (3) can be configured to display an image through the second display module (36) instead of the first display module (35) in the folded state.

[0133] According to various embodiments, the foldable electronic device (3) may include a first camera module (401), a second camera module (402), and / or a third camera module (403). The first camera module (401), the second camera module (402), or the third camera module (403) may include a camera comprising one or more lenses, image sensor(s), and / or an image signal processor (ISP).

[0134] According to various embodiments, a first camera module (401) and a second camera module (402) may be accommodated in a first housing (31) corresponding to a first back cover (312) (or a first rear area of ​​the foldable electronic device (3)). For example, the first back cover (312) may include a first camera hole (or a first light-transmitting area) corresponding to the first camera module (401) and / or a second camera hole (or a second light-transmitting area) corresponding to the second camera module (402). The location or number of camera modules accommodated in the first housing (31) corresponding to the first back cover (312) is not limited to the illustrated examples.

[0135] According to various embodiments, the first camera module (401) and / or the second camera module (402) may include, but are not limited to, a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR camera (e.g., a TOF (time of flight) camera, a structured light camera).

[0136] According to various embodiments, the first camera module (401) and the second camera module (402) may have different attributes (e.g., angle of view) or functions.

[0137] According to various embodiments, the first camera module (401) or the second camera module (402) may provide different angles of view (or lenses with different angles of view). The foldable electronic device (3) may be configured to selectively use the angle of view of the first camera module (401) or the second camera module (402) based on the user's selection regarding the angle of view.

[0138] According to various embodiments, the third camera module (402) may be accommodated in the first housing (31) corresponding to the first front area of ​​the foldable electronic device (3).

[0139] According to various embodiments, the third camera module (403) may be positioned in alignment with an opening provided in the first display module (35) or at least partially inserted into the opening. External light may pass through the opening provided in the first display module (35) and reach the third camera module (403). The opening of the first display module (35) aligned with or overlapping the third camera module (403) may be a through hole. In various embodiments, the opening of the first display module (35) aligned with or overlapping the third camera module (403) may be provided as a notch (not separately shown).

[0140] According to various embodiments, the third camera module (403) may overlap the first display area (351) of the first display module (35) when viewed from above the first front area of ​​the foldable electronic device (3) (e.g., when viewed in the negative direction of the z-axis). The third camera module (403) may be located on the back of the first display area (351) or below the first display area (351). When viewed from outside the foldable electronic device (3), the third camera module (403), or the location of the third camera module (403), may not be substantially visually distinguishable (or exposed). The third camera module (403) may include, for example, a hidden display back camera (e.g., an under display camera (UDC)). External light may pass through the first display module (35) and reach the third camera module (403).

[0141] According to various embodiments, the first camera module (401), the second camera module (402), and / or the third camera module (403) may be configured to operate as at least part of the sensor module. For example, the IR camera module may operate as at least part of the sensor module.

[0142] According to various embodiments, the foldable electronic device (3) may include a light-emitting module (404). The light-emitting module (404) may be received in a first housing (31) corresponding to a first back cover (312) (or a first rear area of ​​the foldable electronic device (3)). The first back cover (312) may include a flash hole (or a third light-transmitting area) corresponding to the light-emitting module (404). The light-emitting module (404) may include, for example, a light-emitting diode (LED) or a xenon lamp. The light-emitting module (404) may include a light source for a first camera module (401) and / or a second camera module (402).

[0143] According to various embodiments, the foldable electronic device (3) may include a sensor module (405). The sensor module (405) may be accommodated in a foldable housing (30) corresponding to the front of the foldable electronic device (3), for example. The sensor module (405) may include an optical sensor module. The optical sensor module may include, for example, a proximity sensor module or an ambient light sensor module.

[0144] According to various embodiments, the sensor module (405) may overlap with the first display area (351) of the first display module (35) when viewed from above the first front area of ​​the foldable electronic device (3). The sensor module (405) may be located on the back of the first display area (351) or below the first display area (351). When viewed from the outside of the foldable electronic device (3), the sensor module (405), or the location of the sensor module (405), may not be substantially visually distinguishable (or exposed). External light may pass through the first display module (35) and reach the sensor module (407).

[0145] According to various embodiments, the foldable electronic device (3) may further include various other sensor modules (e.g., biosensor modules) (not separately shown).

[0146] According to various embodiments, the foldable electronic device (3) may include an acoustic input module (not otherwise shown). The acoustic input module may include a microphone (also called a microphone) (not otherwise shown). The microphone may be received in the second housing (12), for example, in correspondence with a microphone hole (MH) included in the sixth side portion (B6) of the second side member (3212). The location or number of the microphone and the microphone hole corresponding to the microphone are not limited to the illustrated examples.

[0147] According to various embodiments, although not otherwise illustrated, the foldable electronic device (3) may include a first acoustic output module and / or a second acoustic output module and / or a third acoustic output module. The first acoustic output module (e.g., the first acoustic output module (730) of FIG. 7) may include a first speaker. The first speaker may be received in a first housing (31), for example, corresponding to a first speaker hole (SH1) included in the fifth side portion (B5) of the first side member (3112). The second acoustic output module may include a second speaker. The second speaker may be received in a second housing (32), for example, corresponding to a second speaker hole (SH2) included in the sixth side portion (B6) of the second side member (3212). The first speaker or the second speaker may be a speaker for multimedia playback or recording playback. The location or number of speakers for multimedia playback or recording playback and speaker holes corresponding to the speakers are not limited to the illustrated examples. The third sound output module may include a third speaker. The third speaker may be accommodated in the first housing (31) corresponding to a third speaker hole (SH3) formed in a non-display area of ​​the first display module (35), for example. The non-display area may surround the display area (350). The third speaker hole (SH3) may be located in a portion of the non-display area adjacent to the fifth side portion (B5). The third speaker may include a call receiver. The location or number of the call receiver and speaker holes corresponding to the call receiver (also referred to as receiver holes) are not limited to the illustrated examples.

[0148] According to various embodiments, the foldable electronic device (3) may include a first key input module and / or a second key input module. The first key input module may include a first key (also called a first side key) (406) and a first key signal generator (not separately illustrated). The first key (406) may be located in a first key hole included in a third side portion (B3) of the first side member (3112). The first key signal generator may be configured to generate a key signal in response to a press or touch on the first key (406). The second key input module may include a second key (also called a second side key) (407) and a second key signal generator (not separately illustrated). The second key (407) may be located in a second key hole included in the third side portion (B3) of the first side member (3112). The second key signal generator may be configured to generate a key signal in response to a press or touch of the second key (407). The location or number of key input modules is not limited to the illustrated example.

[0149] According to various embodiments, the foldable electronic device (3) may include a first connection terminal (also referred to as a first connector or first interface terminal) (408). The first connection terminal (408) may be received in the second housing (32), for example, corresponding to a first connection terminal hole (e.g., a first connector hole) included in the sixth side portion (B6) of the second side member (3212). The foldable electronic device (3) may transmit and / or receive power and / or data with an external electronic device electrically connected to the first connection terminal (407). The first connection terminal (407) may include, for example, a USB connector or an HDMI connector. The location of the first connection terminal (407) and the first connection terminal hole corresponding to the first connection terminal (407) is not limited to the illustrated example.

[0150] According to various embodiments, the foldable electronic device (3) may include a second connection terminal (also referred to as a second connector or second interface terminal) (not separately illustrated). The second connection terminal may be received in the first housing (31) in correspondence with a connection terminal cover (409) located in a second connection terminal hole (e.g., a second connector hole) included in the first side portion (B1) of the first side member (3112), for example. An external storage medium, such as an SD (secure digital memory) card, a SIM card, or a USIM (universal SIM) card, may be connected to the second connection terminal. The location of the second connection terminal and the second connection terminal hole corresponding to the second connection terminal is not limited to the illustrated examples.

[0151] According to various embodiments, the foldable electronic device (3) may include an antenna module (6). The antenna module (6) may be located inside the first housing (31) corresponding to the first side member (3112). The antenna module (6) may be located, for example, closer to the first side member (B1) than to the third side member (B3). Electromagnetic waves (or electromagnetic waves) transmitted (or radiated) from the antenna module (6) may pass (or penetrate) the first side member (B1) of the first side member (3112) and propagate to the outside of the foldable electronic device (3). Electromagnetic waves transmitted from the outside of the foldable electronic device (3) may pass (or penetrate) the first side member (B1) and be received (or detected) by the antenna module (6).

[0152] According to various embodiments, the antenna module (6) may include the third antenna module (246) of FIG. 2.

[0153] According to various embodiments, the antenna module (6) may include an antenna structure (61), a wireless communication circuit (64), a power management circuit (65), an electromagnetic shielding member (66), and / or a first connector (C1).

[0154] According to various embodiments, the antenna structure (61) may include a third PCB (610). The third PCB (610) may include a first surface (611) and a second surface (612) facing in a direction opposite to the first surface (611). The first surface (611) and the second surface (612) may be substantially parallel, for example. The first surface (611) of the third PCB (610) may face the first side portion (B1). The first direction (601) (see FIG. 3) to which the first surface (611) of the PCB (610) faces may be substantially parallel to the direction from the third side portion (B3) to the first side portion (B1) (e.g., the negative direction of the x-axis) when viewed from above the first front area of ​​the foldable electronic device (3).

[0155] According to various embodiments, the third PCB (610) of the antenna module (6) may include a first side (613), a second side (614), a third side (615), and a fourth side (616). The first side (613) and the second side (614) may face in opposite directions. The first side (613) may face in the negative direction of the y-axis. The second side (614) may face in the positive direction of the y-axis. The third side (615) and the fourth side (616) may face in opposite directions. The third side (615) and the fourth side (616) may be perpendicular to the first side (613) and the second side (614). The third side (615) may face in the positive direction of the z-axis. The fourth side (615) can be oriented in the negative direction of the z-axis.

[0156] According to various embodiments, the third PCB (610) of the antenna module (6) may include a plurality of pattern layers (not separately shown) containing conductive patterns, and a plurality of non-conductive layers (e.g., insulating layers) (not separately shown) stacked alternately with the plurality of pattern layers. The third PCB (610) may include a plurality of conductive vias (not separately shown). A conductive via may be a conductive hole provided to allow a connecting wire to be placed for electrically connecting the conductive patterns of different pattern layers. A conductive via may include, for example, a PTH (plated through hole), LVH (laser via hole), BVH (buried via hole), or a stacked via. At least one conductive via may electrically connect signal line patterns included in different pattern layers as part of a signal line (e.g., patterns of conductive lines used as electrical paths). At least one conductive via can electrically connect ground planes (or ground regions or ground patterns) contained in different pattern layers, for example.

[0157] According to various embodiments, the third PCB (610) may include an antenna array (62). The antenna array (62) may be implemented, for example, as some conductive patterns among a plurality of pattern layers included in the third PCB (610). The antenna array (62) may be placed on a first surface (611) of the third PCB (610) or placed inside the third PCB (610) closer to the first surface (611) than to the second surface (612) of the third PCB (610). The antenna array (62) may include a plurality of antenna elements (621, 622, 623, 624, 625). The plurality of antenna elements (621, 622, 623, 624, 625) may include, for example, the antenna (248) of FIG. 2.

[0158] According to various embodiments, a plurality of antenna elements (621, 622, 623, 624, 625) may be substantially identical in shape and may be arranged at regular intervals. The plurality of antenna elements (621, 622, 623, 624, 625) may be arranged in a second direction (602) (e.g., positive direction of the y-axis) when viewed from above the first surface (611) of the third PCB (610) (e.g., when viewed in the positive direction of the x-axis). When viewed from above the first front area of ​​the foldable electronic device (3), the second direction (602) may be perpendicular to the first direction (601).

[0159] According to various embodiments, when viewed from above on the first surface (611) of the third PCB (610), the plurality of antenna elements (621, 622, 623, 624, 625) may be substantially the same rectangle, but are not limited thereto. Although not otherwise illustrated, the plurality of antenna elements (621, 622, 623, 624, 625) may be provided (or formed) in, for example, squares or triangles and various other polygons. Although not otherwise illustrated, the plurality of antenna elements (621, 622, 623, 624, 625) may be provided (or formed) in, for example, circular or elliptical shapes.

[0160] According to various embodiments, the number or location of antenna elements included in the antenna array (62) is not limited to the illustrated embodiments.

[0161] According to various embodiments, the third PCB (610) may include a ground plane (63). The ground plane (63) may be located closer to the second surface (612) of the third PCB (610) than the antenna array (62). When viewed from above the first surface (611) of the third PCB (610), the antenna array (62) may overlap at least partially with the ground plane (63). For example, the antenna array (62) may be included in a first pattern layer (not otherwise shown) of the third PCB (610), and the ground plane (63) may be included in a second pattern layer (not otherwise shown) closer to the second surface (612) of the third PCB (610) than the first pattern layer. The ground plane (63) can ensure antenna radiation performance (or radio wave transmission / reception performance or communication performance) and / or coverage with respect to a plurality of antenna elements (621, 622, 623, 624, 625). The ground plane (63) may be configured as an antenna ground. The ground plane (63) can enhance the radiation of an electromagnetic field (also called a radiation field) formed by the plurality of antenna elements (621, 622, 623, 624, 625) in a first direction (601). The ground plane (63) can reduce electromagnetic interference (EMI) (or signal loss) with respect to the plurality of antenna elements (621, 622, 623, 624, 625).

[0162] According to various embodiments, the antenna structure (61) may be configured to operate as a patch antenna. When a wireless communication circuit (64) provides (or feeds) an electromagnetic signal (or, wireless signal, RF signal, or radiated current) to a plurality of antenna elements (621, 622, 623, 624, 625), the antenna structure (61) may operate as a resonator (e.g., a patch antenna) because the plurality of antenna elements (621, 622, 623, 624, 625) act as radiating elements while resonating with the ground plane (63). The antenna structure (61) comprises, for example, a first resonator (e.g., a first patch antenna, a first patch resonator, a first patch resonator, or a first radiator) comprising a first antenna element (621), a second resonator (e.g., a second patch antenna, a second patch resonator, a second patch resonator, or a second radiator) comprising a second antenna element (622), a third resonator (e.g., a third patch antenna, a third patch resonator, a third patch resonator, or a third radiator) comprising a third antenna element (623), a fourth resonator (e.g., a fourth patch antenna, a fourth patch resonator, a fourth patch resonator, or a fourth radiator) comprising a fourth antenna element (624), and / or a fifth resonator (e.g., a fifth patch resonator) comprising a fifth antenna element (625). It may include an antenna, a fifth patch resonator, a fifth patch resonator, or a fifth radiator. A plurality of antenna elements (621, 622, 623, 624, 625) may be understood as a plurality of patches.

[0163] According to various embodiments, as a single-layer patch structure, a plurality of antenna elements (621, 622, 623, 624, 625) may be included in a single pattern layer (not separately shown) among a plurality of pattern layers included in the third PCB (610). For example, the plurality of antenna elements (621, 622, 623, 624, 625) may be directly fed from a wireless communication circuit (64).

[0164] According to various embodiments, as a stacked patch structure, the third PCB (610) may further include a plurality of dummy antenna elements (e.g., dummy patches) (not separately shown). The plurality of dummy antenna elements may be positioned in a one-to-one overlap with the plurality of antenna elements (621, 622, 623, 624, 625) when viewed from above the first surface (611) of the third PCB (610) and may be in an electrically floating state. One pattern layer containing the plurality of dummy antenna elements may be positioned closer to the first surface (611) of the third PCB (610) than another pattern layer containing the plurality of antenna elements (621, 622, 623, 624, 625). The wireless communication circuit (64) provides (or feeds) an electromagnetic signal (or, wireless signal, RF signal, or radiated current) to a plurality of antenna elements (621, 622, 623, 624, 625), and dummy antenna elements may be indirectly fed from the plurality of antenna elements (621, 622, 623, 624, 625). The plurality of antenna elements (621, 622, 623, 624, 625) may be understood as a plurality of fed antenna elements. The plurality of dummy antenna elements may be electromagnetically coupled to the plurality of antenna elements (621, 622, 623, 624, 625) to operate as part of a radiator and may adjust radiation characteristics. The plurality of dummy antenna elements may, for example, shift the resonant frequency of the antenna module (6) to a specified frequency or shift it by a specified amount. Multiple dummy antenna elements can extend the bandwidth for transmitting or receiving electromagnetic waves through, for example, an antenna module (6) or form different frequency bands (e.g., multiple bands).Multiple dummy antenna elements can, for example, improve antenna performance by reducing electromagnetic noise.

[0165] According to various embodiments, as a stacked patch structure, the third PCB (610) may further include a plurality of feed antenna elements (not separately shown) that are at least partially overlapping with a plurality of antenna elements (621, 622, 623, 624, 625) and physically separated from the plurality of antenna elements (621, 622, 623, 624, 625) when viewed from above the first surface (611). One pattern layer containing a plurality of antenna elements (621, 632, 623, 624, 625) may be located closer to the first surface (611) of the third PCB (610) than another pattern layer containing a plurality of feed antenna elements. A wireless communication circuit (64) provides (or feeds) an electromagnetic signal (or, wireless signal, RF signal, or radiated current) to a plurality of feed antenna elements, and the plurality of antenna elements (621, 622, 623, 624, 625) may be indirectly fed from the plurality of feed antenna elements. The plurality of antenna elements (621, 622, 623, 624, 625) may be understood as a plurality of dummy antenna elements.

[0166] According to various embodiments, the wireless communication circuit (64) may be placed on the second side (612) of the third PCB (610) through a conductive adhesive material (or conductive adhesive material) such as solder (not separately shown). The wireless communication circuit (64) may be electrically connected to a plurality of antenna elements (621, 622, 623, 624, 625) through wiring (or electrical paths) (not separately shown) included in the third PCB (610).

[0167] According to various embodiments, the wireless communication circuit (64) may include a radio frequency integrate circuit (RFIC). The wireless communication circuit (64) may include, for example, the third RFIC (226) of FIG. 2.

[0168] According to various embodiments, although not separately illustrated, the wireless communication circuit (64) may be placed on a PCB different from the third PCB (610). For example, the wireless communication circuit (64) may be omitted from the antenna module (6). The other PCB may include a first PCB (e.g., the first PCB (710) of FIG. 7) on which components (or electrical elements), such as the processor (120), memory (130), or communication module (190) of FIG. 1, are placed.

[0169] According to various embodiments, the wireless communication circuit (64) can up-convert or down-convert the frequency of a signal being transmitted or received. For example, the wireless communication circuit (64) can receive an intermediate frequency (IF) signal from a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on another PCB (e.g., the first PCB (710) of FIG. 7) and up-convert the received IF signal into a radio frequency (RF) signal (e.g., millimeter wave). According to various embodiments, the wireless communication circuit (64) down-converts the RF signal received through the antenna array (62) into an IF signal, and the IF signal can be provided to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) placed on another PCB (e.g., the first PCB (710) of FIG. 7).

[0170] According to various embodiments, the wireless communication circuit (64) may be configured to transmit and / or receive signals of substantially the same frequency band (or frequency) through a plurality of antenna elements (621, 622, 623, 624, 625).

[0171] According to various embodiments, the wireless communication circuit (64) may be configured to transmit and / or receive signals in at least some frequency bands of about 3 GHz to about 100 GHz through a plurality of antenna elements (621, 622, 623, 624, 625), but is not limited thereto.

[0172] According to various embodiments, although not separately illustrated, the third PCB (610) may include a first electrical path (or, first transmission line or first feed line) corresponding to the first antenna element (621), a second electrical path (or, second transmission line or second feed line) corresponding to the second antenna element (622), a third electrical path (or, third transmission line or third feed line) corresponding to the third antenna element (623), a fourth electrical path (or, fourth transmission line or fourth feed line) corresponding to the fourth antenna element (624), and / or a fifth electrical path (or, fifth transmission line or fifth feed line) corresponding to the fifth antenna element (625). The wireless communication circuit (64) can provide (or feed) an electromagnetic signal (or, wireless signal, RF signal, or radiated current) to the first antenna element (621) through a first electrical path. The wireless communication circuit (64) can provide (or feed) an electromagnetic signal to the second antenna element (622) through a second electrical path. The wireless communication circuit (64) can provide (or feed) an electromagnetic signal to the third antenna element (623) through a third electrical path. The wireless communication circuit (64) can provide (or feed) an electromagnetic signal to the fourth antenna element (624) through a fourth electrical path. The wireless communication circuit (64) can provide (or feed) an electromagnetic signal to the fifth antenna element (625) through a fifth electrical path. The first electrical path, the second electrical path, the third electrical path, the fourth electrical path, and / or the fifth electrical path may include, for example, a combination of at least one conductive via that electrically connects signal line patterns included in different pattern layers and signal line patterns.

[0173] According to various embodiments, the shape of a plurality of antenna elements (621, 622, 623, 624, 625) and the feed points of the plurality of antenna elements (621, 622, 623, 624, 625) (e.g., points or parts where an electromagnetic signal is transmitted) may be configured to radiate at least one linear polarization corresponding to at least one selected or designated frequency band. For example, the plurality of antenna elements (621, 622, 623, 624, 625) may be configured to radiate a first linear polarization and a second linear polarization, each having polarization directions perpendicular to each other (e.g., the direction in which the electric field oscillates, or a direction parallel to the vector of the electric field) upon feeding.

[0174] According to various embodiments, the shapes of the plurality of antenna elements (621, 622, 623, 624, 625) and the feed points of the plurality of antenna elements (621, 622, 623, 624, 625) may be configured to radiate circular polarization corresponding to at least one selected or designated frequency band.

[0175] According to various embodiments, the foldable electronic device (3) may include a beamforming system (or beamforming circuit) for the antenna module (6). The beamforming system may allow receiving a signal with greater intensity in a desired direction or transmitting a signal in a desired direction, or prevent receiving a signal coming from an unwanted direction. In various embodiments, the wireless communication circuit (64) may include a beamforming system. The beamforming system may be configured to adjust the beam pattern (e.g., shape and direction of the beam) by controlling the phase or amplitude of the electromagnetic signal (or, wireless signal, RF signal, or radiated current).

[0176] According to various embodiments, a processor (e.g., processor (120) of FIG. 1) may be configured to determine the phase of an electromagnetic signal (or, wireless signal, RF signal, or radiated current) provided (or fed) to a plurality of antenna elements (621, 622, 623, 624, 625) according to a frequency (or frequency band) used by an application (or program), based on codebook information regarding beamforming stored in a memory (e.g., memory (130) of FIG. 1). The wireless communication circuit (64) of the antenna module (6) may be configured to adjust the phase of the electromagnetic signal provided (or fed) to a plurality of antenna elements (621, 622, 623, 624, 625) under the control of the processor. The wireless communication circuit (64) of the antenna module (6) can be configured to efficiently control (e.g., allocate or place) multiple beams through a plurality of resonators (or radiating parts) (e.g., a first resonator, a second resonator, a third resonator, a fourth resonator, and a fifth resonator) included in the antenna module (6) under the control of a processor.

[0177] According to various embodiments, a radiation field from a first resonator including a first antenna element (621), a radiation field from a second resonator including a second antenna element (622), a radiation field from a third resonator including a third antenna element (623), a radiation field from a fourth resonator including a fourth antenna element (624), or a radiation field from a fifth resonator including a fifth antenna element (625) may be configured to provide (or form) a beam pattern capable of radiating or concentrating a relatively large amount of electromagnetic wave energy (or wave energy) in a first direction (601) toward which the first surface (611) of the third PCB (610) is substantially facing.

[0178] According to various embodiments, interference (e.g., constructive interference and / or detailing interference) between a radiation field (or beam pattern) from a first resonator including a first antenna element (621), a radiation field (or beam pattern) from a second resonator including a second antenna element (622), a radiation field (or beam pattern) from a third resonator including a third antenna element (623), a radiation field (or beam pattern) from a fourth resonator including a fourth antenna element (624), and a radiation field (or beam pattern) from a fifth resonator including a fifth antenna element (625) can be configured to substantially radiate or concentrate electromagnetic wave energy (or wave energy) in a first direction (601) toward which the first surface (611) of the third PCB (610) faces.

[0179] According to various embodiments, the antenna module (6) may include a frequency adjustment circuit (or matching circuit) (not separately shown) disposed on a third PCB (610) (e.g., a second side (612) of the third PCB (610)). The frequency adjustment circuit may include, for example, a tuner or a passive element. The frequency adjustment circuit may impedance match, shift the resonant frequency to a specified frequency, or shift it by a specified amount.

[0180] According to various embodiments, the power management circuit (65) may be placed on the second side (612) of the third PCB (610) via a conductive adhesive material (or conductive adhesive material) such as solder (not separately shown). The power management circuit (65) may be electrically connected to a wireless communication circuit (64) or various other components (e.g., passive components) placed on the third PCB (610) via wiring (or electrical paths) (not separately shown) included in the third PCB (610).

[0181] According to various embodiments, the power management circuit (65) may include a power management integrated circuit (PMIC).

[0182] According to various embodiments, the power management circuit (65) may be placed on a PCB different from the third PCB (610) (e.g., the first PCB (710) of FIG. 7). For example, the power management circuit (65) may be omitted from the antenna module (6).

[0183] According to various embodiments, an electromagnetic shielding member (also referred to as an electromagnetic shield, a noise shielding member, or a noise shield) (66) may be placed on the second side (612) of the third PCB (610) to enclose a wireless communication circuit (64), a power management circuit (65), or various other electrical elements placed on the second side (612) of the third PCB (610). The electromagnetic shielding member (66) may be electrically connected to a ground plane (63). The combination of the electromagnetic shielding member (66) and the ground plane (63) may be understood as a ground structure of the antenna module (6). The ground structure of the antenna module (6) may be configured to reduce or prevent electromagnetic interference (e.g., electromagnetic noise) regarding a plurality of electrical elements such as a wireless communication circuit (64) and / or a power management circuit (65). The electromagnetic shielding member (66) may include a conductive member, for example, such as a shield can. The electromagnetic shielding member (66) may include a protective member, for example, such as urethane resin, and a conductive paint, such as EMI paint, applied to the outer surface of the protective member. The electromagnetic shielding member (66) may be provided (or formed) as various shielding sheets, for example.

[0184] According to various embodiments, the electromagnetic shielding member (66) may be composed of part of a heat spreader that diffuses and / or disperses heat generated from at least one electronic component (also called an electrical element) (e.g., a wireless communication circuit (64) and / or a power management circuit (65)) included in the antenna module (6). The electromagnetic shielding member (66) may prevent heat emitted from at least one electronic component included in the antenna module (6) from remaining in at least one electronic component through heat conduction, heat convection, and / or heat radiation. The electromagnetic shielding member (66) may reduce or prevent overheating of at least one electronic component included in the antenna module (6), thereby reducing or preventing performance degradation or damage to at least one electronic component.

[0185] According to various embodiments, the first connector (C1) may be placed on the second side (612) of the third PCB (610) via a conductive adhesive material (or conductive adhesive material) such as solder (not otherwise shown). The antenna module (6) may be electrically connected to another PCB (e.g., the first PCB (710) of FIG. 7) via an electrical connection member such as a flexible printed circuit board (FPCB) (e.g., the seventh FPCB (9) of FIG. 7, 8, 9, and 10). One end of the electrical connection member may be electrically connected to the first connector (e.g., FPCB connector) (C1) placed on the second side (612) of the third PCB (610), and the other end of the electrical connection member may be electrically connected to a connector placed on another PCB (e.g., the first PCB (710) of FIG. 7).

[0186] According to various embodiments, the foldable electronic device (3) may include an RF window area (radio frequency window area) corresponding to the antenna module (6) (also referred to as an electromagnetic wave passing area or an electromagnetic wave transmission area). Electromagnetic waves transmitted (or radiated) from the antenna module (6) may pass through (or transmit) the RF window area and propagate to the outside of the foldable electronic device (3). Electromagnetic waves transmitted from the outside of the foldable electronic device (3) may pass through (or transmit) the RF window area and be received (or detected) by the antenna module (6). The RF window area may be located at least partially corresponding to the coverage (or beam coverage) (e.g., communication range) of the antenna module (6).

[0187] According to various embodiments, the RF window area may overlap at least partially with the first surface (611) when viewed from above the first surface (611) of the third PCB (610). The RF window area may overlap at least partially with the antenna array (62) when viewed from above the first surface (611) of the third PCB (610). The RF window area may include, for example, a portion of the first side portion (B1) that overlaps at least partially with the first surface (611) of the third PCB (610) when viewed from above the first surface (611) of the third PCB (610).

[0188] According to various embodiments, the RF window region may include a dielectric of a non-conductive material or an air gap, or a combination thereof. The air gap may be understood as a dielectric having the permittivity of air.

[0189] According to various embodiments, the RF window region may be configured to reduce the impact on the antenna radiation performance (or radio wave transmission / reception performance) and / or coverage (or beam coverage) of the antenna module (6). The RF window region may have a dielectric constant that can reduce the electromagnetic impact on the antenna module (6). The RF window region may have a dielectric constant that reduces the degradation of the antenna radiation performance of the antenna module (6), or a dielectric constant that does not reduce the antenna radiation performance below a critical level. The RF window region may have a dielectric constant that has an impact such that the coverage of the antenna module (6) does not exceed the range to be secured, or a dielectric constant that does not substantially affect the coverage of the antenna module (6). In various embodiments, the dielectric constant of the RF window region may be a value that reduces the difference from the dielectric constant of air (e.g., low dielectric constant).

[0190] According to various embodiments, the RF window area may include a dielectric lens (or, electromagnetic lens) or be configured to operate as a dielectric lens. The dielectric lens can focus and / or diverge electromagnetic waves, just as an optical lens refracts light waves. The dielectric lens can secure or improve the antenna radiation performance and / or coverage of the antenna module (6).

[0191] According to various embodiments, the metal part included in the first side member (3112) may include a radiation hole (or opening) (44) (see FIG. 3 and 4) provided corresponding to the antenna module (6). Electromagnetic waves transmitted (or radiated) from the antenna module (6) may pass through (or pass through) the radiation hole (44) and propagate to the outside of the foldable electronic device (3). Electromagnetic waves transmitted from the outside of the foldable electronic device (3) may pass through (or pass through) the radiation hole (44) and be received (or detected) by the antenna module (6). The radiation hole (44) in the metal part included in the first side member (3112) may reduce or prevent deformation (e.g., distortion) of the beam pattern by reducing the effect of the metal part on the electromagnetic waves radiated from the antenna module (6) compared to a comparative example in which the radiation hole (44) is omitted.

[0192] According to various embodiments, the first side member (3112) may include a non-conductive portion (45) of a non-conductive material (e.g., polymer) disposed (e.g., filled) in the radiation hole (44) of the metal part (see FIG. 3, 4, and 14). The non-conductive portion (45) may provide (or form) a portion of the first side area of ​​the foldable electronic device (3). When viewed from above the first side (611) of the third PCB (610), the non-conductive portion (45) may overlap at least partially with the first side (611) of the antenna module (6). When viewed from above the first side (611) of the third PCB (610), the non-conductive portion (45) may overlap at least partially with the antenna array (62) of the antenna module (6). The non-conductive portion (45) may be understood as a portion of the RF window area corresponding to the antenna module (6). Electromagnetic waves transmitted (or radiated) from the antenna module (6) can pass (or penetrate) the non-conductive part (45) and propagate to the outside of the foldable electronic device (3). Electromagnetic waves (or electromagnetic signals, wireless signals, or RF signals) transmitted from the outside of the foldable electronic device (3) can pass (or penetrate) the non-conductive part (45) and be received (or detected) by the antenna module (6).

[0193] According to various embodiments, the radiation hole (44) of the metal part included in the first side member (3112) corresponding to the antenna module (6) may be a through hole. The through hole may be understood as an opening that is entirely surrounded by the metal part. The shape of the radiation hole (44) may vary and is not limited to the illustrated example. For example, the radiation hole (44) may be implemented as a notch-shaped opening (not separately illustrated).

[0194] According to various embodiments, the non-conductive portion (45) may have a dielectric constant that can reduce the electromagnetic effect on the antenna radiation performance (or radio wave transmission / reception performance) and / or coverage (or beam coverage) of the antenna module (6).

[0195] According to various embodiments, the dielectric constant of the non-conductive portion (45) may be a value that can reduce the difference from the dielectric constant of air (e.g., low dielectric constant).

[0196] According to various embodiments, the first side member (3112) may further include a coating layer (not separately shown) of various colors or textures that substantially provides the first side area. The coating layer may be configured to reduce or prevent the metal part including the non-conductive portion (45) and the radiation hole (44) from appearing visually distinct. In various embodiments, to reduce or prevent the metal part including the non-conductive portion (45) and the radiation hole (44) from appearing distinct, the metal part including the non-conductive portion (45) and the radiation hole (44) may have substantially the same color.

[0197] According to various embodiments, although not separately illustrated, the number and / or location of antenna modules (6) are not limited to the illustrated examples. An antenna module (6) may be positioned, for example, corresponding to the third side portion (B3) or the fifth side portion (B5) of the first frame (311). An antenna module (6) may be positioned, for example, corresponding to the second side portion (B2), the fourth side portion (B4), or the sixth side portion (B6) of the second frame (321).

[0198] According to various embodiments, although not otherwise illustrated, the antenna module (6) may be configured to transmit and / or receive electromagnetic waves through a first front area of ​​the first housing (31). For example, a first surface (611) of a third PCB (610) included in the antenna module (6) may face the first front area of ​​the first housing (31). In various embodiments, the third PCB (610) of the antenna module (6) may be positioned in alignment with an opening provided in the first display module (35) or at least partially inserted into the opening. The third PCB (610) of the antenna module (6) may be configured to transmit and / or receive electromagnetic waves through an opening provided in the first display module (35). In various embodiments, the third PCB (610) of the antenna module (6) may overlap with the first display area (351) of the first display module (35) when viewed from above the first front area of ​​the foldable electronic device (3). The third PCB (610) of the antenna module (6) may be located on the back of the first display area (351) or below the first display area (351). The third PCB (610) of the antenna module (6) may be configured to transmit and / or receive electromagnetic waves through the first display area (351) of the first display module (35).

[0199] According to various embodiments, although not separately illustrated, the antenna module (6) may be configured to transmit and / or receive electromagnetic waves through a first rear area of ​​the first housing (31). A first surface (611) of a third PCB (610) included in the antenna module (6) may face the first rear area of ​​the first housing (31).

[0200] According to various embodiments, although not separately illustrated, the antenna module (6) may be positioned in the first housing (31) such that it forms an acute or obtuse angle with the direction in which the first front area of ​​the foldable electronic device (3) faces or the direction in which the first rear area of ​​the foldable electronic device (3) faces.

[0201] FIG. 7 is a drawing showing a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0202] FIG. 8 is an exploded perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0203] FIG. 9 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0204] FIG. 10 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0205] FIG. 11 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0206] FIG. 12 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0207] FIG. 13 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0208] FIG. 14 is a cross-sectional perspective view of a foldable electronic device (3) cut along line E-E' of FIG. 7 according to various embodiments of the present disclosure.

[0209] It is understood in the present disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 7, 8, 9, 10, 11, 12, 13, and 14 is conceived and included. Any combination of features described below in connection with FIGS. 7, 8, 9, 10, 11, 12, 13, and 14 may be considered to be included in the present disclosure as specific examples.

[0210] Referring to FIGS. 7, 8, 9, 10, 11, 12, 13, and 14, the foldable electronic device (3) may include a first frame (311), a first PCB (710), a first battery (720), a first camera module (401), a second camera module (402), a light-emitting module (404), and / or a first acoustic output module (730). The first frame (311) may include a first support plate (3111) and a first side member (3112). The first PCB (710), the first battery (720), the first camera module (401), the second camera module (402), the light-emitting module (404), and the first sound output module (730) may be placed or coupled to the third support surface (3111B) of the first support plate (3111) of the first frame (311). The first camera module (401) and the second camera module (402) may be placed or coupled to the camera bracket (740), and the camera bracket (740) may be coupled to the third support surface (3111B) of the first support plate (3111) of the first frame (311). The first PCB (710) can be electrically connected to a second PCB (not separately shown) located inside the second housing (32) (see FIG. 1) through a first FPCB (750) that penetrates a hole (760) formed in the first frame (3111). When viewed from above the first back cover (312) (see FIG. 1), the first FPCB (750) can cross the first battery (720). The first FPCB (750) can cross the hinge module (34) (see FIG. 1 and 2). The first battery (720) can be electrically connected to the first PCB (710) through the second FPCB (not separately shown). The first camera module (401) can be electrically connected to the first PCB (710) through a third FPCB (not separately shown). The second camera module (402) can be electrically connected to the first PCB (710) through a fourth FPCB (not separately shown).The light-emitting module (404) can be electrically connected to the first PCB (710) through the fifth FPCB (770). The first acoustic output module (730) can be electrically connected to the first PCB (710) through the sixth FPCB (not separately shown).

[0211] According to various embodiments, when viewed from above the first back cover (312) (see FIG. 1), a portion of the first PCB (710) may be located between the first battery (720) and the camera bracket (740). When viewed from above the first back cover (31) (see FIG. 1), the camera bracket (740) may be located closer to the fifth side (B5) than the first PCB (710), and the first battery (720) may be located closer to the seventh side (B7) than the first PCB (710).

[0212] According to various embodiments, when viewed from above the first back cover (312) (see FIG. 1), a portion of the first PCB (710) may be located between the first battery (720) and the first acoustic output module (730). When viewed from above the first back cover (31) (see FIG. 1), the first acoustic output module (730) may be located closer to the fifth side (B5) than the first PCB (710), and the first battery (720) may be located closer to the seventh side (B7) than the first PCB (710). When viewed from above the first back cover (31) (see FIG. 1), the first sound output module (730) is positioned closer to the first side portion (B1) than the camera bracket (740), and the camera bracket (740) may be positioned closer to the third side portion (B3) than the first sound output module (730).

[0213] According to various embodiments, the foldable electronic device (3) may include an antenna module (6), an antenna module bracket (also referred to as a third bracket) (8), and a seventh FPCB (9). The antenna module (6) may be placed or coupled to the antenna module bracket (8) and may be placed or coupled to the first frame (311) through the antenna module bracket (8). The antenna module (6) may be stably and rigidly connected to the first frame (311) through the antenna module bracket (8). The antenna module (6) may be electrically connected to the first PCB (710) through the seventh FPCB (9).

[0214] According to various embodiments, the antenna module (6) may be placed or joined to the antenna module bracket (8) through an adhesive material (or adhesive material) (not separately shown).

[0215] According to various embodiments, the antenna module (6) may be placed or joined to the antenna module bracket (8) through mechanical fastening, such as screw fastening or snap-fit ​​fastening. Snap-fit ​​fastening can be understood as an assembly method that elastically pushes and joins interlocking elements (e.g., hooks and hook fasteners (also called hooks)).

[0216] According to various embodiments, a third support surface (311B) (e.g., a first rear mounting portion) included in the first support plate (3111) of the first frame (311) may include a mounting portion corresponding to a combination of an antenna module (6) and an antenna module bracket (8). The mounting portion may include a recess (780) in which the combination of the antenna module (6) and the antenna module bracket (8) can be stably fitted. When the combination of the antenna module (6) and the antenna module bracket (8) is inserted into the recess (780) of the first frame (311), the first surface (611) (see FIG. 6) of the antenna module (6) may face the first side portion (B1).

[0217] According to various embodiments, when viewed from above the first back cover (312) (see FIG. 1), at least a portion of the recess (780) of the first frame (311) may be located between the first battery (720) and the first side portion (B1). When viewed from above the first back cover (312) (see FIG. 1), the antenna module (6) may not overlap with the first PCB (710) and the first battery (720). When viewed from above the first back cover (312) (see FIG. 1), the antenna module bracket (8) may not overlap with the first PCB (710) and the first battery (720).

[0218] According to various embodiments, the antenna module bracket (8) may be provided (or formed) as an integrated or single metal body (or metal structure) (e.g., a single continuous metal structure) including one or more bent portions.

[0219] According to various embodiments, the antenna module bracket (8) may have a resilient structure that can be elastically inserted into the recess (780) of the first frame (311). The antenna module bracket (8) may be coupled to the recess (780) of the first frame (311), for example, through a snap-fit ​​connection. As a snap-fit ​​connection, the antenna module bracket (8) may include at least one hook (801) (see FIG. 8, 11, and 12), and the recess (780) of the first frame (311) may include a hook connection portion (also called a catch portion) (not separately illustrated).

[0220] According to various embodiments, the antenna module bracket (8) may include a first part (81) configured to support the antenna module (6), and a second part (82) extending from the first part (81). The first part (81) may be located in a recess (780) of the first frame (311). When viewed from above the first back cover (312) (see FIG. 1), the second part (82) may extend from the first part (81) between the first PCB (710) and the first battery (720). The second part (82) may be coupled to the first support plate (3111) of the first frame (311) via a screw (790). The second part (82) includes a screw hole (821) (see FIG. 8) corresponding to the screw (790), and the first support plate (3111) of the first frame (311) may include a screw fastening part corresponding to the screw (790). The screw fastening part may be a boss including a female thread corresponding to the male thread of the screw (790).

[0221] According to various embodiments, the antenna module bracket (8) may be composed of an electromagnetic shielding member (also called a noise shielding member) for the antenna module (6). In various embodiments, the antenna module bracket (8) may be electrically connected to the ground area of ​​the first PCB (710) through a screw (790).

[0222] According to various embodiments, the first part (81) of the antenna module bracket (8) may include a first part area (811), a second part area (812), a third part area (813), a fourth part area (814), and / or a fifth part area (815). The first part area (811) may face the second surface (612) (see FIG. 6) of the third PCB (610) of the antenna module (6) and may be implemented to have at least a partially flat plate shape, but is not limited thereto. The second part area (812) may face the first side (613) (see FIG. 6) of the third PCB (610) of the antenna module (6) and may be implemented to have at least a partially flat plate shape, but is not limited thereto. The third portion area (813) may face the second side (614) (see FIG. 6) of the third PCB (610) of the antenna module (6) and may be implemented to have at least a partially flat plate shape, but is not limited thereto. The fourth portion area (814) may face the third side (615) (see FIG. 6) of the third PCB (610) of the antenna module (6) and may be implemented to have at least a partially flat plate shape, but is not limited thereto. The fifth portion area (815) may face the fourth side (616) (see FIG. 6) of the third PCB (610) of the antenna module (6) and may be implemented to have at least a partially flat plate shape, but is not limited thereto. In various embodiments, the first portion (81) of the antenna module bracket (8) may extend from the first portion area (811). In various embodiments, although not separately illustrated, the first part (81) may further include a sixth part region that partially faces the first surface (611) of the third PCB (610) of the antenna module (6) without degrading the antenna radiation performance of the antenna array (62) (see FIG. 6).

[0223] According to various embodiments, the electromagnetic shielding member (66) of the antenna module (6) may be placed between the first portion area (811) included in the first portion (81) of the antenna module bracket (8) and the third PCB (610) of the antenna module (6).

[0224] According to various embodiments, the seventh FPCB (9) may include one or more rigid portions (or rigid regions or rigid sections) and one or more flexible portions (or flexible regions or flexible sections). The rigid portions may be understood as being less flexible or more rigid than the flexible portions. The flexible portions may be understood as being more flexible or less rigid than the rigid portions. The rigid portions may have, for example, a thicker thickness or a larger number of layers than the flexible portions, and thus the rigid portions may be rigid. The rigid portions may include a material different from the flexible portions so as to be rigid than the flexible portions, for example.

[0225] According to various embodiments, the 7th FPCB (9) can be implemented as an RFPCB (rigid FPCB).

[0226] According to various embodiments, the 7th FPCB (9) may be an FRC (FPCB type RF cable).

[0227] According to various embodiments, the second connector (C2) may be placed at one end of the seventh FPCB (9) (e.g., surface mounted), and the third connector (C3) may be placed at the other end of the seventh FPCB (9) (e.g., surface mounted). The second connector (C2) may be electrically connected to the first connector (C1) (see FIG. 6) placed on the second side (612) (see FIG. 6) of the antenna module (6). The third connector (C3) may be electrically connected to the third connector (not separately shown) placed on the first PCB (710). For example, the second connector (C2) may be the first BTB (board to board) connector, and the third connector (C) may be the second BTB connector.

[0228] According to various embodiments, the first connector (C1) of the antenna module (6) and the second connector (C2) of the seventh FPCB (9) may be positioned between the third PCB (610) of the antenna module (6) and a first portion area (811) included in the first portion (81) of the antenna module bracket (8). The first portion area (811) included in the first portion (81) of the antenna module bracket (8) may support (e.g., apply pressure) the second connector (C2) toward the first connector (C1) to reduce or prevent separation of the first connector (C1) of the antenna module (6) and the second connector (C2) of the seventh FPCB (9).

[0229] According to various embodiments, the antenna module bracket (8) may be configured as part of a heat spreader that diffuses and / or disperses heat generated from at least one electronic component (also called an electrical element) (e.g., a wireless communication circuit (64) and a power management circuit (65)) included in the antenna module (6). A portion of the first part (81) of the antenna module bracket (8) may be in physical contact with the third PCB (610) of the antenna module (6), and heat generated from at least one electronic component included in the antenna module (6) may be transferred to the antenna module bracket (8). An electromagnetic shielding member (66) may be in physical contact with a first portion area (811) included in the first part (81) of the antenna module bracket (8), and heat generated from at least one electronic component included in the antenna module (6) may be transferred from the electromagnetic shielding member (66) to the antenna module bracket (8). The antenna module bracket (8) can prevent heat emitted from at least one electronic component included in the antenna module (6) from remaining in at least one electronic component through heat conduction, heat convection, and / or heat radiation. The antenna module bracket (8) can reduce or prevent overheating of at least one electronic component included in the antenna module (6), thereby reducing or preventing performance degradation or damage to at least one electronic component.

[0230] According to various embodiments, the foldable electronic device (3) may be configured such that heat generated from at least one electronic component included in the antenna module (6) is transferred to the first frame (311) through the antenna module bracket (8). The first frame (311) may be configured as part of a heat spreader that diffuses and / or disperses the heat generated from at least one electronic component included in the antenna module (6). In the present disclosure, a heat dissipation structure (e.g., a heat spreader) for the antenna module (6) may include, but is not limited to, an electromagnetic shielding member (66), an antenna module bracket (8), and a first frame (311), and other heat-conducting members may be further added.

[0231] According to various embodiments, the first frame (311) may be provided as a combination of a metal body (not otherwise shown) comprising one or more conductive parts and a non-metal body (not otherwise shown) comprising one or more non-conductive parts. A recess (780) of the first frame (311) may be provided (or formed) at least partially by the metal body of the first frame (311), and the metal body of the first frame (311) may be in physical contact with at least a part of the first part (81) of the antenna module bracket (8). Heat generated from at least one electronic component included in the antenna module (6) may be transferred to the metal body of the first frame (311) through the first part (81) of the antenna module bracket (8).

[0232] In the present disclosure, thermally conductive members included in a heat dissipation structure (e.g., a heat spreader) for an antenna module (6) (e.g., an electromagnetic shielding member (66) of the antenna module (6), an antenna module bracket (8), and a metal body of the first frame (311)) may be understood as good conductors for heat. Bad conductors for heat (e.g., a gas or a non-metallic material such as a polymer) may be understood as not substantially included in the heat dissipation structure for the antenna module (6).

[0233] In the present disclosure, heat conduction between a first component and a second component may include 'direct heat conduction' or 'indirect or mediate heat conduction'. Direct heat conduction between a first component and a second component may be understood as heat being transferred between the first component and the second component through direct (or physical) contact between the first component and the second component. Indirect heat conduction between a first component and a second component may be understood as heat being transferred between the first component and the second component through (or via) a third component (e.g., a medium or intermediate material) between the first component and the second component. Indirect heat conduction between the first component and the second component may include direct heat conduction between the first component and the third component, and direct heat conduction between the second component and the third component. In the scheme of indirect heat conduction, the third component may be understood to include a positive conductor of heat capable of smoothly transferring heat between the first component and the first component. In the scheme of indirect heat conduction, the third component may be understood to substantially not include a poor conductor of heat.

[0234] In the present disclosure, indirect heat conduction between the first component and the second component may be understood as heat being transferred between the first component and the second component by 'indirect or mediate contact' between the first component and the second component through the third component. To improve heat transfer performance (e.g., thermal conductivity performance), the foldable electronic device (3) may include a heat transfer material (e.g., thermal interface material (TIM)) disposed between, for example, the third PCB (610) of the antenna module (6) and the electromagnetic shielding member (66). To improve heat transfer performance (e.g., thermal conductivity performance), the foldable electronic device (3) may include a heat transfer material disposed between, for example, the third PCB (610) of the antenna module (6) and the antenna module bracket (8). To improve heat transfer performance (e.g., heat conduction performance), the foldable electronic device (3) may include a heat transfer material disposed between, for example, an antenna module bracket (8) and an electromagnetic shielding member (66) of the antenna module (6). To improve heat transfer performance (e.g., heat conduction performance), the foldable electronic device (3) may include a heat transfer material disposed between, for example, an antenna module bracket (8) and a first frame (311).

[0235] According to various embodiments, a heat dissipation structure (e.g., a heat spreader) for an antenna module (6) can provide (or form) convective heat transfer, which is a method of transferring thermal energy between a solid surface (e.g., the surface of one or more heat conductors) and a gas between one or more heat conductors (e.g., the electromagnetic shielding member (66) of the antenna module (6), the antenna module bracket (8), and the metal body of the first frame (311)) and the surrounding air.

[0236] According to various embodiments, the foldable electronic device (3) may include a ground structure (also called a ground) (not otherwise shown). The ground structure may reduce or prevent electromagnetic interference (EMI) to electrical elements included in the foldable electronic device (3). The ground structure may include one or more ground regions included in one or more PCBs included in the foldable electronic device (3), for example, a first PCB (710) located in the first housing (31), a second PCB located in the second housing (32) (see FIG. 1), and a third PCB (610) of the antenna module (6). The ground structure may include, for example, a first conductor (also called a first conductive structure or a first metal part) (not otherwise shown) included in the first housing (31) (see FIG. 1). The ground structure may include, for example, a second conductor (also referred to as a second conductive structure or a second metal part) (not separately illustrated) included in the second housing (32) (see FIG. 1). The ground structure may include, for example, a third conductor (also referred to as a third conductive structure or a third metal part) (not separately illustrated) included in the hinge cover (33) (see FIG. 2). The ground structure may include, for example, a fourth conductor (also referred to as a fourth conductive structure or a fourth metal part) (not separately illustrated) included in the hinge part (34) (see FIG. 1 and 2). The ground structure may include, for example, a fifth conductor (also referred to as a fifth conductive structure or a fifth metal part) (not separately illustrated) included in the first display module (35) (see FIG. 1). The ground structure may include, for example, a sixth conductor (also called a sixth conductive structure or a sixth metal part) (not shown separately) included in the second display module (36) (see FIG. 1 and 2).The ground structure may include, for example, an electromagnetic shielding member (66) of the antenna module (6). The ground structure may include, for example, an antenna module bracket (8). One or more ground regions, a first conductor, a second conductor, a third conductor, a fourth conductor, a fifth conductor, a sixth conductor, an electromagnetic shielding member (66), and the antenna module bracket (8) may be electrically connected. The ground structure may further include at least one other conductor (not separately shown). The ground structure may be provided (or formed) by various other combinations. In various embodiments, a heat dissipation structure (e.g., a heat spreader) for the antenna module (6) may be composed of part of the ground structure of the foldable electronic device (3).

[0237] According to various embodiments, a first portion area (811) included in a first portion (81) of an antenna module bracket (8) may include a first opening (1001). The foldable electronic device (3) may include a first heat transfer material (e.g., TIM) (1101) located (e.g., filled) in the first opening (1001). The first heat transfer material (1101) may include a liquid or paste-like TIM (e.g., gel TIM). The foldable electronic device (3) may include a first conductive tape (1201) placed or bonded (e.g., attached) to the first portion area (811) of the antenna module bracket (8). The first heat transfer material (1101) may be in physical contact with an electromagnetic shielding member (66). The first heat transfer material (1101) may be in physical contact with the first conductive tape (1201). The first conductive tape (1201) may be in physical contact with the first frame (311). The first conductive tape (1201) may block the first opening (1001) of the antenna module bracket (8) and may reduce or prevent leakage of the first heat transfer material (1101). The first conductive tape (1201) may be electrically conductive and may reduce or prevent degradation or deformation of the electromagnetic shielding properties of the antenna module bracket (8) due to the formation of the first opening (1001) compared to a comparative example in which the first opening (1001) of the antenna module bracket (8) is omitted. In various embodiments, the first conductive tape (1201) may be electrically connected to the antenna module bracket (8). The first conductive tape (1201) may have thermal conductivity. The first heat transfer material (1101) and the first conductive tape (1201) may be a first heat transfer path (1401) (see FIG. 14) through which heat is transferred from the first frame (311) to the electromagnetic shielding member (66).The first heat transfer path (1401) can be configured to thermally connect the electromagnetic shielding member (66) and the first frame (311).

[0238] According to various embodiments, a fifth portion area (815) included in a first portion (81) of an antenna module bracket (8) may include a second opening (1002). The foldable electronic device (3) may include a second heat transfer material (e.g., TIM) (1102) located (e.g., filled) in the second opening (1002). The second heat transfer material (1102) may include a liquid or paste-like TIM (e.g., gel TIM). The foldable electronic device (3) may include a second conductive tape (1202) placed or bonded (e.g., attached) to the fifth portion area (815) of the antenna module bracket (8). The second heat transfer material (1102) may be in physical contact with an electromagnetic shielding member (66). The second heat transfer material (1102) may be in physical contact with the second conductive tape (1202). The second conductive tape (1202) may be in physical contact with the first frame (311). The second conductive tape (1202) may block the second opening (1002) of the antenna module bracket (8) and may reduce or prevent leakage of the second heat transfer material (1102). The second conductive tape (1202) may be electrically conductive and may reduce or prevent the degradation or deformation of the electromagnetic shielding properties of the antenna module bracket (8) due to the formation of the first opening (1002) compared to a comparative example in which the second opening (1002) of the antenna module bracket (8) is omitted. The second conductive tape (1202) may be thermally conductive. The second heat transfer material (1102) and the second conductive tape (1202) may serve as a second heat transfer path (1402) (see FIG. 14) through which heat is transferred from the first frame (311) to the electromagnetic shielding member (66). The second heat transfer path (1402) may be configured to thermally connect the electromagnetic shielding member (66) and the first frame (311).

[0239] According to various embodiments, the first conductive tape (1201) and the second conductive tape (1202) may include a nano tape (e.g., nano TIM tape), but are not limited thereto.

[0240] According to various embodiments, the first heat transfer material (1101) and the second heat transfer material (1102) may have superior thermal conductivity performance (e.g., thermal conductivity) compared to the antenna module bracket (8).

[0241] According to various embodiments, the first conductive tape (1201) and the second conductive tape (1202) may have substantially the same thermal conductivity performance (e.g., thermal conductivity) as the antenna module bracket (8) or may have superior thermal conductivity performance (e.g., thermal conductivity) than the antenna module bracket (8).

[0242] According to various embodiments, the first heat transfer material (1101) and / or the second heat transfer material (1102) may have electrical conductivity.

[0243] According to various embodiments, the number or location of structures including an opening provided (or formed) in the first part (81) of the antenna module bracket (8), a heat transfer material located in the opening, and a conductive tape placed in the first part (81) are not limited to the illustrated examples.

[0244] According to various embodiments, a first heat transfer path (1401) comprising a first heat transfer material (1101) and a first conductive tape (1201) filled in a first opening (1001), and a second heat transfer path (1402) comprising a second heat transfer material (1102) and a second conductive tape (1202) filled in a second opening (1002) may be positioned corresponding to a hot spot (also referred to as a hot spot area) of the antenna module (6). A hot spot of the antenna module (6) can be understood as a part where heat generated from at least one electronic component of the antenna module (6) (e.g., wireless communication circuit (64) and / or power management circuit (65)) is relatively concentrated, and / or a part where cooling is relatively slow compared to other parts. The first heat transfer path (1401) and the second heat transfer path (1402) quickly move (or transfer) the heat of the hot spot of the antenna module (6) to the first frame (311) compared to a comparative example in which the first heat transfer path (1401) and the second heat transfer path (1402) are omitted, thereby reducing or preventing the performance of the antenna module (6) (e.g., antenna radiation performance or data transmission speed) from degrading due to the heat of the hot spot.

[0245] According to various embodiments, to ensure tolerance or assembly, there may be a first air gap between the antenna module bracket (8) and the antenna module (6) (e.g., the electromagnetic shielding member (66) of the antenna module (6)), and / or a second air gap between the antenna module bracket (8) and the first frame (311). The first heat transfer path (1401) and the second heat transfer path (1402) can reduce the performance degradation of heat generated from at least one electronic component included in the antenna module (6) being transferred to the first frame (311) due to the first air gap and / or the second air gap.

[0246] FIG. 15 shows the arrangement of a first heat transfer material (1101) (see FIG. 14) and a second heat transfer material (1102) (see FIG. 14) according to various embodiments of the present disclosure.

[0247] Referring to FIG. 15, a first heat transfer material (1101) (see FIG. 14) and a second heat transfer material (1102) (see FIG. 14) can be injected into a first opening (1001) and a second opening (1002) of an antenna module bracket (8) through an injection device (1500) including a nozzle (1501).

[0248] According to various embodiments, the first opening (1001) of the first partial area (811) of the antenna module bracket (8) may be provided (or formed) as a rectangle having a length of about 2 mm (millimeter) in a direction parallel to the z-axis and a length of about 3 mm in a direction parallel to the y-axis. The first conductive tape (1201) (see FIG. 8) may be provided (or formed) in a size larger than the first opening (1001) so as to cover the first opening (1001). The first conductive tape (1201) (see FIG. 8) may be provided (or formed) as a rectangle having a length of about 4 mm in a direction parallel to the z-axis and a length of about 5 mm in a direction parallel to the y-axis, for example. The size or shape of the first opening (1001) may be implemented so as to secure a first attachment area in which the first conductive tape (1201) (see FIG. 8) can be securely attached to the first partial area (811) of the antenna module bracket (8). The first attachment area of ​​the first conductive tape (1201) (see FIG. 8) surrounding the edge of the first opening (1001) in the first partial area (811) of the antenna module bracket (8) may be provided (or formed) for example, within a range of at least about 0.5 mm from the edge of the first opening (1001). In various embodiments, the size or shape of the first opening (1001) and / or the size or shape of the first conductive tape (1201) (see FIG. 8) are not limited to the illustrated examples.

[0249] According to various embodiments, the second opening (1002) of the fifth portion area (815) of the antenna module bracket (8) may be provided (or formed) as a rectangle having a length of about 1 mm in a direction parallel to the x-axis and a length of about 3 mm in a direction parallel to the y-axis. The second conductive tape (1202) (see FIG. 8) may be provided (or formed) in a size larger than the second opening (1002) so as to cover the second opening (1002). The second conductive tape (1202) (see FIG. 8) may be provided (or formed) as a rectangle having a length of about 2 mm in a direction parallel to the x-axis and a length of about 5 mm in a direction parallel to the y-axis, for example. The size or shape of the second opening (1002) may be implemented so as to secure a second attachment area in which the second conductive tape (1202) (see FIG. 8) can be securely attached to the fifth portion area (815) of the antenna module bracket (8). The second attachment area of ​​the second conductive tape (1202) (see FIG. 8) surrounding the edge of the second opening (1002) in the fifth portion area (815) of the antenna module bracket (8) may be provided (or formed), for example, within a range of at least about 0.5 mm from the edge of the second opening (1002). In various embodiments, the size or shape of the second opening (1002) and / or the size or shape of the second conductive tape (1202) (see FIG. 8) are not limited to the illustrated examples.

[0250] According to various embodiments, in order to reduce or prevent the degradation of antenna radiation performance, the size and / or shape of the first opening (1001) and the size and / or shape of the second opening (1002) may be implemented to reduce or prevent the possibility of the heat transfer material flowing into the antenna array (62) of the antenna module (6) (see FIG. 6) when the heat transfer material is injected through the injection device (1500).

[0251] FIG. 16 shows a heat map for a foldable electronic device (3) of the present disclosure according to various embodiments of the present disclosure, and a heat map for a foldable electronic device (1610) of a comparative example.

[0252] Referring to FIG. 16, the foldable electronic device (3) of the present disclosure may include a first heat transfer path (1401) (see FIG. 14) and a second heat transfer path (1402) (see FIG. 14) for the antenna module (6) compared to the foldable electronic device (1610) of the comparative example. The foldable electronic device (3) according to the present disclosure may reduce the retention of heat generated in the antenna module (6) in the antenna module (6) compared to the foldable electronic device (1610) of the comparative example, thereby allowing for a low temperature distribution in the antenna module (6). For example, the hot spot (1620) of the antenna module (6) in the foldable electronic device (1610) of the comparative example may have a temperature of about 40°C, and the hot spot (1620) of the antenna module (6) in the foldable electronic device (3) of the present disclosure may have a temperature of about 39°C. The foldable electronic device (1610) according to the present disclosure can reduce or prevent overheating of the antenna module (6) compared to the foldable electronic device (1610) of the comparative example, thereby reducing or preventing the deterioration of the performance of the antenna module (6) (e.g., antenna radiation performance or data transmission speed).

[0253] FIG. 17 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0254] FIG. 18 shows the arrangement of a heat transfer material according to various embodiments of the present disclosure.

[0255] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 17 and 18 is conceived and included. Any combination of features described below in connection with FIGS. 17 and 18 may be considered to be included in this disclosure as specific examples.

[0256] Referring to FIGS. 17 and 18, the foldable electronic device (3) may include an antenna module (6), an antenna module bracket (8), and a third FPCB (9). Descriptions of some components identical to those in the preceding embodiment may not be repeated.

[0257] According to various embodiments, the antenna module bracket (8) may include an opening (1700) extending from a first part area (811) of the first part (81) to a fifth part area (815) of the first part (81). The opening (1700) may cross a bent portion (e.g., a corner where the first part area (811) and the fifth part area (815) meet) between the first part area (811) and the fifth part area (815). The opening (1700) may include a first part opening (1701) formed in the first part area (811), a second part opening (1702) formed in the fifth part area (815), and a corner part opening (1703) between the first part opening (1701) and the second part opening (1702). The corner opening (1703) may be positioned corresponding to the bent portion between the first portion area (811) and the fifth portion area (815).

[0258] According to various embodiments, the injection device (1500) may be configured to inject a heat transfer material into the corner opening (1703) of the opening (1700) of the antenna module bracket (8) so that the opening (1700) is filled with the heat transfer material. When injecting the heat transfer material, the first portion area (811) and the fifth portion area (815) of the antenna module bracket (8) may be positioned at an angle with respect to the nozzle (1501) of the injection device (1500) so that the nozzle (1501) of the injection device (1500) can enter directly into the corner opening (1703).

[0259] According to various embodiments, although not separately illustrated, the foldable electronic device (3) may include a conductive tape capable of covering the opening (1700). The conductive tape may be provided (or formed) in a form extending from a first portion area (811) of the antenna module bracket (8) to a fifth portion (815) of the antenna module bracket (8).

[0260] FIG. 19 is a drawing showing a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0261] FIG. 20 shows an arrangement of a heat transfer material according to various embodiments of the present disclosure.

[0262] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 19 and 20 is conceived and included. Any combination of features described below in connection with FIGS. 19 and 20 may be considered to be included in this disclosure as specific examples.

[0263] According to various embodiments, the foldable electronic device (3) may include a first frame (311), an antenna module (6), an antenna module bracket (8), and a third FPCB (9). The first frame (311) may include a first support plate (3111) and a first side member (3112). The first support plate (3111) may include a recess (780). The antenna module bracket (8) may include a first opening (1001). Descriptions of some components identical to those in the preceding embodiment may not be repeated.

[0264] According to various embodiments, the injection of a heat transfer material through the injection device (1500) may be performed after the combination of the antenna module (6), the antenna module bracket (8), and the third FPCB (9) is positioned in the recess (780) of the first frame (311). The recess (780) of the first frame (311) may include an extension (1900) connected to the first opening (1001) so as to allow the heat transfer material to be injected into the first opening (1001) of the antenna module bracket (8). The injection device (1500) may fill the first opening (1001) with the heat transfer material by injecting the heat transfer material through the extension (1900) of the recess (780). In the embodiments of FIGS. 19 and 20, the first conductive tape (1201) (see FIG. 8) is omitted, and the heat transfer material filled in the first opening (1001) can be physically in contact with the electromagnetic shielding member (66) of the first frame (311) and the antenna module (6). The heat transfer material filled in the first opening (1001) can be configured to thermally connect the electromagnetic shielding member (66) of the first frame (311) and the antenna module (6).

[0265] FIG. 21 is a drawing showing a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0266] FIG. 22 is a perspective view of a part of a foldable electronic device (3) according to various embodiments of the present disclosure.

[0267] It may be understood in this disclosure that any combination of features and / or embodiments disclosed in connection with FIGS. 21 and 22 is conceived and included. Any combination of features described below in connection with FIGS. 20 and 21 may be considered to be included in this disclosure as specific examples.

[0268] Referring to FIGS. 21 and 22, the foldable electronic device (3) may include a first frame (311), a first PCB (710), a first battery (720), a first acoustic output module (730), a camera bracket (740), a first camera module (401), a second camera module (402), a light-emitting module (404), a first FPCB (750), and / or a fifth FPCB (770). The foldable electronic device (3) may include an antenna module (6) and a seventh FPCB (9). Descriptions of some components identical to those in the preceding embodiment may not be repeated.

[0269] According to various embodiments, in the embodiments of FIGS. 20 and 21, the antenna module bracket (8) (see FIG. 7) may be omitted. The recess (780) of the first frame (311) may be implemented so that the antenna module (6) can be securely fitted. The electromagnetic shielding member (66) of the antenna module (6) may include at least one opening (2110, 2120). An injection device (1500) may inject a heat transfer material (2200) through the recess (780) to fill the at least one opening (2110, 2120) with the heat transfer material. In the embodiments of FIGS. 21 and 22, the conductive tape (e.g., the first thermal conductive tape (1201) of FIG. 8) may be omitted. A heat transfer material (2200) filled in at least one opening (2110, 2120) may be physically in contact with at least one electronic component (e.g., wireless communication circuit (64) and / or power management circuit (65) of FIG. 6) placed on the third PCB (610) of the antenna module (6). A heat transfer material (2200) filled in at least one opening (2110, 2120) may be physically in contact with the first frame (311) and the electromagnetic shielding member (66) of the antenna module (6). A heat transfer material (2200) filled in at least one opening (2110, 2120) may be configured to thermally connect at least one electronic component placed on the third PCB (610) of the antenna module (6) with the electromagnetic shielding member (66) and the first frame (311).

[0270] According to various embodiments, in mobile communication (e.g., SA (stand-alone) communication or NSA (non-stand-alone) communication), the foldable electronic device (3) may be configured to transmit to the network (e.g., core network) that an LTE fallback is required when the temperature of the foldable electronic device (3) reaches a reference temperature. After receiving the transmission from the foldable electronic device (3) that an LTE fallback is required, the network may transmit to the foldable electronic device (3) that an LTE fallback is initiated. When the LTE fallback is implemented, data communication in the NR band is momentarily cut off, resulting in data loss, which may cause a reduction in communication speed (e.g., data transmission speed), such as buffering experienced by the user. 5G mobile communication may include, for example, a first wireless data communication in the mmWave band and a second wireless data communication using a frequency lower than the mmWave band (e.g., Sub-6GHz wireless communication using a frequency of about 6GHz or less) (e.g., LTE communication). The first wireless data communication may be configured to transmit and / or receive data in the mmWave band through an antenna module (6) (see FIG. 6). The second wireless data communication may be configured to transmit and / or receive data in a band lower than the mmWave band through a conductor (e.g., an antenna radiator) of the foldable electronic device (3) that is not located in the antenna module (6) (see FIG. 6). The conductor configured as the antenna radiator in the second wireless data communication may include a part of a ground structure and may include, for example, a conductor included in the first side member (3112) (see FIG. 1) of the first frame (311) or the second side member (3212) of the second frame (321), but is not limited thereto.The foldable electronic device (3) of the present disclosure (see FIG. 3) may be configured such that the LTE fallback time (e.g., the time of the second wireless data communication) is determined based on the temperature of the antenna module (6) (see FIG. 6) during the first wireless data communication. The antenna module (6) of the present disclosure (see FIG. 6) may include a temperature sensing circuit (e.g., the temperature sensing circuit (2400) of FIG. 24) to detect the temperature of the antenna module (6). According to various embodiments of the present disclosure, at least one heat transfer path for the antenna module (6) (see FIG. 6) (e.g., the first heat transfer path (1401) and the second heat transfer path (1402) of FIG. 14) can delay the temperature of the antenna module (6) reaching a reference temperature compared to a comparative example in which at least one heat transfer path for the antenna module (6) is omitted, thereby delaying the LTE fallback time and reducing or preventing the reduction of the data transmission speed.

[0271] FIG. 23 is an operation flowchart (2300) of a foldable electronic device (3) (see FIG. 3) according to various embodiments of the present disclosure.

[0272] Referring to FIG. 23, the processor of the foldable electronic device (3) (e.g., the processor (120) of FIG. 1) may be configured to check whether the temperature of the antenna module (6) (see FIG. 6) has reached a reference temperature during wireless data communication in the mmWave band in operation 2301.

[0273] According to various embodiments, when it is confirmed that the temperature of the antenna module (6) (see FIG. 6) has reached a reference temperature in operation 2301, the processor may be configured to notify the network that an LTE fallback is required in operation 2303.

[0274] According to various embodiments, the foldable electronic device (3) may include a processor (or at least one processor) (e.g., the processor (120) of FIG. 1) and a memory (e.g., the memory (130) of FIG. 1). The processor (also referred to as a processing circuit or a control circuit) may control hardware components or software components connected to the processor by running an operating system (OS) or an embedded software program. The processor may control a number of hardware components or software components by executing instructions (e.g., the program (140) of FIG. 1) stored in memory, for example. In various embodiments, the processor may correspond to a number of processors that collectively perform a number of operations by dividing them among the processors. In various embodiments, the memory of the foldable electronic device (3) may store instructions configured to cause the foldable electronic device (3) to perform operations 2301 and 2303 of FIG. 23 when executed by at least one processor of the foldable electronic device (3).

[0275] According to various embodiments, the processor of the foldable electronic device (3) (see FIG. 3) may be implemented as one or more integrated circuit (or circuitry) chips and may perform various data processing operations. The processor may include at least one electrical circuit and may process instructions (or programs, data, etc.) stored in memory individually or collectively in a distributed manner. The processor may include a processor assembly comprising one or more processing circuits. The processor may include any processing circuit that is operative to control the performance and operations of one or more components of the foldable electronic device (3) (see FIG. 3). For example, the processor (e.g., application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or a chipset). For example, the processor may be implemented as a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor may include one or more processing circuits. For example, the processor may include one or more processing circuits configured to perform the various functions of the present disclosure individually and / or collectively. As an example without limitation, at least a portion of the processor may be included in a first chip of a foldable electronic device (3) (see FIG. 3), and at least another portion of the processor may be included in a second chip of an electronic device (not separately shown) different from the first chip of the foldable electronic device (3) (see FIG. 3).

[0276] According to various embodiments, the processor of the foldable electronic device (3) (see FIG. 3) may include a CPU, GPU, NPU, ISP, display controller, memory controller, storage controller, CP, and / or sensor interface. These components of the processor are merely exemplary. For example, the processor may include other components. For example, some components of the processor may be omitted from the processor. For example, some components of the processor may be included as separate components of the foldable electronic device (3) (see FIG. 3) outside the processor. For example, some components of the processor (e.g., memory controller) may be included within other components (e.g., at least a portion of memory, interfaces available for connection to at least one component of the foldable electronic device (3) of FIG. 3).

[0277] According to various embodiments, the processor of the foldable electronic device (3) (see FIG. 3) may cause other components of the foldable electronic device (3) (see FIG. 3) to perform various operations by executing instructions stored in memory. The memory of the foldable electronic device (3) (see FIG. 3) may include one or more storage media (or one or more storage devices). For example, the memory may include a memory assembly comprising one or more storage media. For example, the one or more storage media may include a hard drive, a flash memory, a permanent memory such as ROM (read-only memory) (e.g., non-volatile memory (122)), a semi-permanent memory such as RAM (random access memory) (e.g., volatile memory), any other suitable type of storage (or storage assembly), or any combination thereof. The memory may include a cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the foldable electronic device (3) (see FIG. 3). As an example, but not limited to, the cache memory may be included within a processor.The memory may be fixedly embedded in the foldable electronic device (3) (see FIG. 3) or incorporated into one or more suitable types of components (e.g., a SIM (subscriber identity module) card and / or an SD (secure digital) card) that can be repeatedly inserted into and removed from the foldable electronic device (3) (see FIG. 3).

[0278] According to various embodiments, the memory of a foldable electronic device (3) (see FIG. 3) may store one or more software applications, such as an operating system (or system) software application, a firmware software application, a driver software application, a plugin (e.g., add-in, add-on, and / or applet) software application, and / or any other suitable software application. For example, the one or more software applications may include instructions executable by a processor. For example, the memory may store instructions that can be called by an application programming interface (API). For example, the memory may store instructions within a library.

[0279] FIG. 24 is a circuit diagram of a temperature sensing circuit (2400) included in an antenna module (6) (see FIG. 6) according to various embodiments of the present disclosure.

[0280] Referring to FIG. 24, the temperature sensing circuit (2400) may include a thermistor (2410), a resistor (2420), and a power management circuit (65). The thermistor (2410), the resistor (2420), and the power management circuit (65) may be placed on a second side (612) (see FIG. 6) of a third PCB (610) included in the antenna module (6). The thermistor (2410) may be placed in a first electrical path (2401) that electrically connects the reference voltage (VREF) and the ground (also called the ground area) (G) of the antenna module (6). The resistor (2420) may be placed in the first electrical path (2401) between the thermistor (2410) and the ground (G). The first electrical path (2401) may be located on a third PCB (610) included in the antenna module (6). The power management circuit (65) may include a plurality of terminals (also referred to as a plurality of pins), and one of the plurality of terminals may be electrically connected to a point of the first electrical path (2401) between the thermistor (2410) and the resistor (2420) via a second electrical path (2402). The second electrical path (2402) may be located on a third PCB (610) (see FIG. 6) included in the antenna module (6). The thermistor (2410) may be configured to provide (or form) different resistance values ​​depending on the temperature of the antenna module (6) (see FIG. 6) (e.g., the temperature of a hot spot). The power management circuit (65) detects a voltage value (VOUT) (or electrical signal) through a second electrical path (2402), and the detected voltage value (VOUT) can be transmitted to a processor (e.g., processor (120) of FIG. 1) placed on the first PCB (710) (see FIG. 7) through the seventh FPCB (9) (see FIG. 7). The processor can be configured to determine the temperature (e.g., temperature of a hot spot) of the antenna module (6) (see FIG. 6) based on the voltage value (VOUT) and reference voltage (VREF) received from the power management circuit (65).

[0281] According to various embodiments, the technical features of the present disclosure may be applied to electronic devices of other shapes that are not limited to foldable electronic devices (3) (e.g., bar-type electronic devices, plate-type electronic devices, slideable electronic devices, stretchable electronic devices, or rollable electronic devices). Depending on the form provided, the electronic device may further include various components. Although these components cannot all be listed due to variations in the convergence trends of the electronic device (3), components equivalent to the components mentioned above may be additionally included in the electronic device (3). In various embodiments, depending on the form provided, certain components from the components mentioned above may be excluded or replaced with other components.

[0282] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (3)) comprises a housing (e.g., a foldable housing (30)), an antenna module (e.g., an antenna module (6)), a bracket (e.g., an antenna module bracket (8)), and a heat transfer material (e.g., a first heat transfer material (1101) and a second heat transfer material (1102)). The housing comprises a side member (e.g., a first side member (3111)) and a conductive support plate (e.g., a first support plate (3111)). The antenna module comprises a PCB (e.g., a third PCB (610)). The PCB is positioned within the housing so as to face the side member (e.g., a side member (3112)). The antenna module includes at least one antenna element (e.g., a first antenna element (621), a second antenna element (622), a third antenna element (623), a fourth antenna element (624), and / or a fifth antenna element (625)) disposed on a PCB. The antenna module includes at least one electronic component (e.g., a wireless communication circuit (64) and a power management circuit (65)) disposed on a PCB. A bracket surrounds at least a portion of the antenna module to accommodate the antenna module. The bracket is configured to be fixed to a conductive support plate of the housing. The bracket includes at least one opening (e.g., a first opening (1001) and a second opening (1002)). A heat transfer material is filled through at least one opening of the bracket and transfers heat generated from at least one electronic component to the conductive support plate of the housing.

[0283] According to various embodiments of the present disclosure, the heat transfer material (e.g., first heat transfer material (1101) and second heat transfer material (1102)) may have a greater thermal conductivity than the bracket (e.g., antenna module bracket (8)).

[0284] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (3)) may include at least one tape (e.g., a first conductive tape (1201) and a second conductive tape (1202)) disposed on a bracket to cover at least one opening (e.g., a first opening (1001) and a second opening (1002)) of a bracket between a bracket (e.g., an antenna module bracket (8)) and a housing (e.g., a foldable housing (30)). The at least one tape may be configured to thermally connect a heat transfer material (e.g., a first heat transfer material (1101) and a second heat transfer material (1102)) and a conductive support plate of the housing (e.g., a first support plate (3111)).

[0285] According to various embodiments of the present disclosure, at least one tape (e.g., a first conductive tape (1201) and a second conductive tape (1202)) may have a greater thermal conductivity than a bracket (e.g., an antenna module bracket (8)).

[0286] According to various embodiments of the present disclosure, at least one tape (e.g., a first conductive tape (1201) and a second conductive tape (1202)) may have electrical conductivity.

[0287] According to various embodiments of the present disclosure, a bracket (e.g., antenna module bracket (8)) can be electrically connected to the ground of an electronic device (e.g., foldable electronic device (3)).

[0288] According to various embodiments of the present disclosure, at least one opening (e.g., a first opening (1001) and a second opening (1002)) may be positioned corresponding to a hot spot of the antenna module (6).

[0289] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (3)) may include at least one processor (e.g., a processor (120)) and a memory (e.g., a memory (130)). The memory may store instructions configured to determine the timing of an LTE fallback based on the temperature of the antenna module (6) when executed by at least one processor.

[0290] According to various embodiments of the present disclosure, a power management circuit (e.g., power management circuit (65)) included in an antenna module (e.g., antenna module (6)) may be configured to acquire an electrical signal corresponding to the temperature of the antenna module through a thermistor (e.g., thermistor (2410)) included in the antenna module.

[0291] According to various embodiments of the present disclosure, a PCB (e.g., a third PCB (610)) of an antenna module (e.g., antenna module (6)) may include a first surface (e.g., a first surface (611)) facing a side member (e.g., a first side member (3112)) and a second surface (e.g., a second surface (612)) facing in the opposite direction to the first surface. At least one electronic component (e.g., a wireless communication circuit (64) and a power management circuit (65)) may be placed on the second surface of the PCB. At least one antenna element of the antenna module (e.g., a first antenna element (621), a second antenna element (622), a third antenna element (623), a fourth antenna element (624), and / or a fifth antenna element (625)) may be located on the first surface of the PCB, or inside the PCB closer to the first surface than to the second surface. At least one antenna element of the antenna module may be configured to transmit and / or receive a wireless signal through a side member.

[0292] According to various embodiments of the present disclosure, a bracket (e.g., antenna module bracket (8)) may include a first part (e.g., first part (81)) configured to support an antenna module (e.g., antenna module (6)), and a second part (e.g., second part (82)) extending from the first part and coupled to a housing (e.g., foldable housing (30)) through screw fastening. A conductive support plate of the housing (e.g., first support plate (3111)) may include a PCB of the antenna module (e.g., third PCB (610)) and a recess (e.g., recess (780)) in which the first part of the bracket is located.

[0293] According to various embodiments of the present disclosure, an antenna module (e.g., antenna module (6)) may include an electromagnetic shielding member (e.g., electromagnetic shielding member (66)) disposed on a PCB (e.g., a third PCB (610)) to cover at least one electronic component (e.g., a wireless communication circuit (64) and a power management circuit (65)). A heat transfer material (e.g., a first heat transfer material (1101) and a second heat transfer material (1102)) filled through at least one opening (e.g., a first opening (1001) and a second opening (1002)) of a bracket (e.g., antenna module bracket (8)) may thermally connect the electromagnetic shielding member and a conductive support plate (e.g., a first support plate (3111)) of the housing.

[0294] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (3)) comprises a housing (e.g., a foldable housing (30)), an antenna module (e.g., an antenna module (6)), a bracket (e.g., an antenna module bracket (8)), a heat transfer material (e.g., a first heat transfer material (1101) and a second heat transfer material (1102)), at least one processor (e.g., a processor (120)), and a memory (e.g., a memory (130)). The antenna module is located within the housing. The antenna module (6) comprises a PCB (e.g., a third PCB (610)). The PCB comprises a first surface (e.g., a first surface (611)) and a second surface (e.g., a second surface (612)) facing in a direction opposite to the first surface. The antenna module includes at least one antenna element (e.g., a first antenna element (621), a second antenna element (622), a third antenna element (623), a fourth antenna element (624), and / or a fifth antenna element (625)) located on a first surface or inside the PCB closer to the first surface than the second surface. The antenna module includes at least one electronic component (e.g., a wireless communication circuit (64) and a power management circuit (65)) placed on the second surface. The antenna module includes an electromagnetic shielding member (e.g., an electromagnetic shielding member (66)) placed on the second surface to cover at least one electronic component. A bracket is configured to connect the antenna module and the housing. The bracket includes at least one opening (e.g., a first opening (1001) and a second opening (1002)) located between the housing and the bracket. A heat transfer material is filled into at least one opening of the bracket and configured to thermally connect the electromagnetic shielding member and the housing. The memory stores instructions configured to allow the electronic device to determine the timing of the LTE fallback based on the temperature of the antenna module when executed by at least one processor.

[0295] According to various embodiments of the present disclosure, an electronic device (e.g., a foldable electronic device (3)) may include at least one tape (e.g., a first conductive tape (1201) and a second conductive tape (1202)) disposed on a bracket to cover at least one opening (e.g., a first opening (1001) and a second opening (1002)) of a bracket between a bracket (e.g., an antenna module bracket (8)) and a housing (e.g., a foldable housing (30)). At least one tape may be configured to thermally connect a heat transfer material (e.g., a first heat transfer material (1101) and a second heat transfer material (1102)) and the housing.

[0296] According to various embodiments of the present disclosure, a power management circuit (e.g., power management circuit (65)) included in an antenna module (e.g., antenna module (6)) may be configured to acquire an electrical signal corresponding to the temperature of the antenna module through a thermistor (e.g., thermistor (2410)) included in the antenna module.

[0297] According to various embodiments of the present disclosure, a heat transfer material (e.g., a first heat transfer material (1101) and a second heat transfer material (1102)) and at least one tape (e.g., a first conductive tape (1201) and a second conductive tape (1202)) may have a greater thermal conductivity than a bracket (e.g., an antenna module bracket (8)).

[0298] The embodiments disclosed in this disclosure and the drawings are provided merely as examples to facilitate the explanation of the technical content and to aid in understanding this disclosure, and are not intended to limit the scope of this disclosure. Accordingly, it should be understood that the scope of the various embodiments of this disclosure includes modifications or variations other than those disclosed herein. Additionally, it will be understood that any embodiment(s) described herein may be used in conjunction with any various embodiment(s) described herein. For example, this disclosure is presented in the form of providing multiple embodiments each defining a number of features, but it is emphasized that some of these embodiments are connected only by reference to the same drawings or drawings. This disclosure should be understood to include all combinations of these embodiments, unless there is an obvious contradiction between two (or more) embodiments. For example, where features are presented as optional in this disclosure, all combinations of such optional features are included in this disclosure.

Claims

1. In the electronic device (3), A housing (30) comprising a side member (3112) forming the side of the electronic device (3) and a conductive support plate (3111); An antenna module (6) comprising a PCB (610) disposed within the housing (30) facing the side member (3112) and having at least one antenna element (621, 622, 623, 624, 625) and at least one electronic component (64, 65) disposed thereon; A bracket (8) configured to surround at least a portion of the antenna module (6) to accommodate the antenna module (6) and to be fixed to the conductive support plate (3111), and comprising at least one opening (1001, 1002); and An electronic device comprising a heat transfer material (1101, 1102) that is filled through the at least one opening (1001, 1002) of the bracket (8) and transfers heat generated from the at least one electronic component (64, 65) to the conductive support plate (3111).

2. In Paragraph 1, The above heat transfer material (1101, 1102) is an electronic device having a greater thermal conductivity than the bracket (8).

3. In Paragraph 1, It further includes at least one tape (1201, 1202) disposed on the bracket (8) to cover the at least one opening (1001, 1002) of the bracket (8) between the bracket (8) and the housing (30), The electronic device configured such that at least one tape (1201, 1202) thermally connects the heat transfer material (1101, 1102) and the conductive support plate (3111) of the housing (30).

4. In the above Clause 3, The above at least one tape (1201, 1202) is an electronic device having a thermal conductivity greater than that of the bracket (8).

5. In Paragraph 3, The above at least one tape (1201, 1202) is an electronic device having electrical conductivity.

6. In Paragraph 5, The above bracket (8) is an electronic device electrically connected to the ground of the above electronic device (3).

7. In Paragraph 1, The above at least one opening (1001, 1002) is an electronic device positioned corresponding to a hot spot of the antenna module (6).

8. In Paragraph 1, It further includes at least one processor (120) and memory (130), and The memory (130) is an electronic device configured to store instructions that, when executed by the at least one processor (120), allow the electronic device (3) to determine the timing of an LTE fallback (long term evolution fallback) based on the temperature of the antenna module (6).

9. In Paragraph 8, An electronic device configured such that a power management circuit (65) included in the antenna module (6) obtains an electrical signal corresponding to the temperature through a thermistor (2410) included in the antenna module (6).

10. In Paragraph 1, The PCB (610) of the antenna module (6) includes a first surface (611) facing the side member (3112) and a second surface (612) facing in the opposite direction to the first surface (611). The above at least one electronic component (64, 65) is disposed on the second surface (612) of the PCB (610), and The at least one antenna element (621, 622, 623, 624, 625) of the antenna module (6) is located on the first surface (611) of the PCB (610), or inside the PCB (610) closer to the first surface (611) than to the second surface (612), and is configured to transmit and / or receive a radio signal through the side member (3112).

11. In Paragraph 10, The bracket (8) comprises a first part (81) configured to support the antenna module (6), and a second part (82) extending from the first part (81) and coupled to the housing (30) through screw fastening, and The conductive support plate (3111) of the housing (30) is an electronic device comprising a recess (780) in which the first part (81) of the PCB (610) and the bracket (8) is located.

12. In Paragraph 1, The antenna module (6) further includes an electromagnetic shielding member (66) disposed on the PCB (610) to cover at least one electronic component (64, 65), and The heat transfer material (1101, 1102) filled through the at least one opening (1001, 1002) of the bracket (8) is an electronic device that thermally connects the electromagnetic shielding member (66) of the antenna module (6) and the conductive support plate (3111) of the housing (30).

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