Apparatus and method for transferring electronic components from a first to a second carrier

Abstract

The invention relates to an apparatus and a method for transferring electronic components from a first carrier to a second carrier, the first carrier carrying a plurality of individual components, and the second carrier carrying a plurality of electronic sub-assemblies, to each of which one of the components is to be transferred from the first carrier. According to the invention, the apparatus and method provide the following functionality: receiving the first carrier in or on a first receptacle; receiving the second carrier in or on a second receptacle; conveying the second carrier in a conveying direction along its longitudinal extension in or on a second receptacle, wherein the first carrier is received on the first receptacle such that the components carried thereby are oriented towards the second receptacle; separating one of the components from the first carrier in a contacting or contactless manner in order to transfer the component at a depositing point onto the second carrier; conveying the second carrier in its orientation relative to the depositing point such that an electronic sub-assembly on the second carrier reaches the depositing point; detecting the depositing point of the component on the electronic sub-assembly on the second carrier upstream of the depositing point by means of a first image capturing device and signalling the image capture to the controller in order to determine the position and / or orientation of the electronic sub-assembly on the second carrier; applying a portion of a connecting material to the electronic sub-assembly on the second carrier by means of a connecting material dispenser, downstream of the first image capturing device; detecting the position and / or orientation of the portion of a connecting material on the electronic sub-assembly by means of a second image capturing device downstream of the connecting material dispenser and signalling the image capture to the controller in order to determine the position and / or orien

Description

[0001] 30A-168 959

[0002] Device and method for transferring electronic components from a first to a second carrier

[0003] Description

[0004] background

[0005] This document discloses a device and a method for transferring electronic components from a first carrier to a second carrier. A device and a method for applying bonding material to the second carrier are also described. Furthermore, a device and a method for curing the bonding material between a component and a subassembly on the second carrier are disclosed. In particular, a device and a method are described for separating an electronic component from the first carrier and transferring it directly to the second carrier. The second carrier can, for example, support one or more rows of electronic subassemblies, each of which is to be transferred with an electronic component.

[0006] When transferring electronic components, especially chips (or "dies"), and particularly when transferring individual electronic components, the general problem is that they can be easily damaged and therefore must be handled with great care. Furthermore, electronic components are subject to continuous miniaturization, so the requirements regarding accuracy during their transfer are constantly increasing.

[0007] WO2017 / 076989 Al relates to a processing system and method for processing a flexible substrate, for example, a web, using a tensioner with a vacuum plate movable along a transport direction of the flexible substrate and an indexer that intermittently moves the flexible substrate for processing. The vacuum plate is configured to move along the transport direction. A controller regulates the tensioner and the indexer such that a relative velocity between the indexer and the tensioner's vacuum plate is maintained above a predetermined threshold under all operating conditions, even when the flexible substrate is stopped. The web that can be used in the processing system has a number of electrical structures separated by a distance. These electrical structures can be any type of flexible electronics.

[0008] DE 10 2011 104 225 B4 relates to a device for positioning electronic components to be transferred relative to an ejection device, the ejection device comprising a slide for at least one electronic component and a housing surrounding the slide, the housing having a first translucent area. A first carrier provides the electronic components to be transferred. The first carrier has a first side facing the ejection device and a second side facing away from the ejection device. A plurality of electronic components are provided on the second side. An image data acquisition device is configured to acquire image data through the first translucent area of ​​the housing of a region in which the slide is configured to interact with the at least one electronic component.A control system is configured to determine position data of the electronic component to be transferred from the acquired image data and to generate control commands based on this position data. At least one actuator is configured to move the first carrier and the ejection device relative to each other based on the control commands in order to change an offset between a longitudinal axis of the slider and a central axis of the electronic component to be transferred, the ejection device comprising a first mirror arranged inside the housing.

[0009] German patent DE 103 49 847 B3 describes a positioning device and a positioning method for transferring electronic components. A semiconductor wafer mounted on a carrier film is positioned above and parallel to a ribbon-like substrate. The wafer can be moved within the wafer plane by means of a wafer holder and can also be rotated about an axis of rotation perpendicular to the wafer plane. An ejection device includes a cutting needle that, by means of a downward movement, acts on the back of a chip to be detached and detaches it from the carrier film. The chip detached from the carrier film is thereby placed onto a bonding position on the ribbon-like substrate.

[0010] JP 2003-109979 A relates to a device with at least two slides for separating components from a first carrier. The components are each picked up by a suction pipette of a transfer element. In a final step, the transfer element, along with the suction pipettes and components, is positioned over a second carrier, which has already been prepared with an adhesive, and the components are placed onto the second carrier. The components are not transferred directly from the first carrier to the second carrier, but rather, after separation from the first carrier, are picked up by a transfer element and, in a subsequent step, precisely oriented and fixed onto the second carrier by the transfer element.

[0011] Further devices and methods for transferring electronic components, the technological background to the device described here and to the 30A-168 959 described here.

[0012] Verfahren bilden, offenbaren CN 103620756 B, JP 5267451 A, EP 0 565 781 Bl, DE 198 22 512 Al, DE 10 2020 001 439 Al, US 4,667,402 Bl, US 2008 / 0086874 Al, EP 2 764 826 Al, US 2002 / 0019074 Al, US 2009 / 242124 Al, EP 0 140 126 Al, US 4,990,051 Bl, US 2006 / 237142 Al, US 2007 / 293022 Al, US 6,201,306 Bl, JP 2009-238881 A, JP 2010-161155 A, JP 60-097634 A, JP 01-109737 A, JP 55-070041 A, JP 2002-050670 A, JP 09-162204 A, JP 53-100765 A, JP 2008-004936 A, WO 2007 / 137888 Al, WO 2000 / 014789 Al, EP 949 662 A2, US 2006 / 013680 Al, US 2016 / 308269 Al, DE 10 2011 017218 Al, EP 2 491 583 Bl, DE 10 2020 001 439 B3, DE 10 2005 006 978 B3.

[0013] Problem

[0014] Based on this, a space-saving arrangement and a reliable procedure with high throughput and high component placement accuracy are desired when transferring components from a first to a second carrier. Non-transparent second carriers should also be usable without any loss of placement accuracy. Furthermore, the components should be handled gently.

[0015] Suggested solution

[0016] To solve this problem, a device for transferring electronic components from a first carrier to a second carrier is proposed. This device is designed for transferring electronic components from a first carrier, for example, a wafer film, to a second carrier, for example, a quasi-endless carrier tape material that carries a multitude of electronic subassemblies along its transverse and / or longitudinal extent. In one embodiment, the first carrier carries a multitude of individual components, for example, RFID chips that can be detached from the first carrier. One of the components from the first carrier is then transferred to the second carrier, which, for example, forms the antenna carrier tape material and carries RFID antennas as electronic subassemblies.

[0017] The components can be provided in the form of semiconductor chips. Furthermore, the components can be flat and have electrical contacts on one side, which is to be positioned on the subassembly. The electrical contacts can be provided, for example, as contact points, particularly in the form of bumps, which serve to be electrically connected to contacts or conductor patches arranged on the subassembly. The contacts located on the subassembly can be metallic.

[0018] Furthermore, the subassembly can consist of one or more materials from the group consisting of paper, polyvinyl chloride (PVC), polyethylene (PE), polyethylene terephthalate (PET) or glycol-modified polyethylene terephthalate (PETG), polyethylene naphthalate (PEN), acrylonitrile- 30A-168959

[0019] butadiene styrene copolymer (ABS), polyvinyl butyral (PVB), polymethyl methacrylate (PMMA), polyimide (PI), polyvinyl alcohol (PVA), polystyrene (PS), polyvinylphenol (PVP), polypropylene (PP), polycarbonate (PC) or their derivatives as a sheet material on which, for example, an antenna structure made of metal is applied.

[0020] In one variant, the device comprises: a first receiving unit, designed and configured to receive the first carrier; a second receiving unit, designed and configured to convey the second carrier along its longitudinal extent in a conveying direction; the first receiving unit is designed and configured to receive the first carrier such that the components it carries are oriented towards the second receiving unit; a separating device, designed and configured to separate one of the components from the first carrier, either by contact or without contact, in response to information signaled by a control system, in order to transfer the component to the second carrier at a storage location;a first conveying device, designed and equipped to convey the second carrier in response to information signaled by the control system, in its orientation relative to the depositing point, such that an electronic subassembly on the second carrier reaches the depositing point; a first image acquisition device, designed and equipped to detect an electronic subassembly on the second carrier upstream of the component's depositing point and to signal this to the control system for determining the position and / or orientation of the electronic subassembly on the second carrier; a bonding material dispenser, designed and equipped to apply a portion of bonding material to the electronic subassembly on the second carrier downstream of the first image acquisition device;and a second image acquisition device, designed and equipped to detect the portion of connecting material on the electronic subassembly on the downstream side of the connecting material dispenser and to signal the position and / or orientation of the portion of connecting material on the electronic subassembly to the control system.

[0021] In particular, the device serves to transfer electronic components from a first carrier to a second carrier. In one variant, the first carrier holds a multitude of individual components that can be detachably removed from it. In another variant, the second carrier is designed to be quasi-endless and carries along its longitudinal extent a multitude of electronic subassemblies, to each of which one of the components is to be transferred from the first carrier. The device comprises a first receptacle, which is designed and configured to receive the first carrier 30A-168959. The device comprises a second receptacle, which is designed and configured to guide the second carrier, for example, along its longitudinal extent in a conveying direction of the second carrier. The first receptacle is designed and configured to receive the first carrier such that the components it carries are oriented towards the second receptacle.

[0022] Appropriate conveying devices are provided and set up to move the first intake longitudinally and / or transversely as well as in rotation relative to the conveying direction of the second intake in response to information signaled by the control system.

[0023] In one variant, this solution comprises: a single second intake, for example in the form of a rotating vacuum cylinder, which conveys the second carrier, for example tape material, along its cylindrical surface; a bonding material dispenser, which dispenses bonding material onto the second carrier in a controlled and portioned manner, and a separating device are arranged around the circumference of the vacuum cylinder; the bonding material dispenser dispenses bonding material onto the second carrier in a controlled and portioned manner; the separating device separates a component from the first carrier in a controlled manner and transfers the component to the second carrier at the point where the adhesive has been previously applied;For the precise adjustment of the positions and orientations of the first and second carriers relative to each other, as well as the connecting material dispenser and the separating device, the control system receives image feeds from different locations – for example, before and after the connecting material dispenser, after the separating device – along the second carrier; based on these image feeds, the control system sends corresponding signals to adjustment devices.

[0024] This solution increases the throughput of transferred parts (UPH) of the fixture. It requires less space than conventional setups where bonding and part transfer are performed in separate fixtures. This solution reduces the fixture's power requirements and lowers costs. To increase throughput in a conventional setup, process parameters were typically optimized or more precise and faster components (e.g., cameras, servo drives, etc.) were used, which, however, increased the setup's cost. The separate bonding and part transfer systems in a conventional setup (30A-168 959) require two separate cylinders with vacuum systems, drives, controls, etc.

[0025] Here, the term "connecting material" is used to refer to a material used to mechanically and / or electrically connect the component to the electronic subassembly. This connecting material can then be further treated with heat and / or pressure and / or (UV) light. If electrically conductive connecting material is used, a separately created electrical connection is unnecessary. If the connecting material is not electrically conductive, an additional electrical connection between the component and the electronic subassembly is created, for example, by soldering or welding. In one variant, solder paste is applied as the connecting material. In another variant, if the component and / or the electronic subassembly already has pre-tinned contact points, flux is applied as the connecting material.

[0026] The solder paste mechanically and electrically bonds the component to the electronic subassembly after the application of heat and, if necessary, pressure. The solder paste may already contain the flux, or the flux may be applied using a separate dispenser. In this variant, the second image acquisition device can be designed and configured to detect the portion of the bonding material on the electronic subassembly and signal this to the control system for determining the position and / or orientation of the bonding material portion on the electronic subassembly. In this description, the terms "adhesive," "solder paste," and "flux" are collectively referred to as "bonding material."

[0027] In one variant, the bonding material is a thermally curable, in particular liquid, adhesive. Furthermore, in another variant, the adhesive is electrically conductive and designed to mechanically and electrically connect the components and / or their contact points and the subassembly.

[0028] In one variant, the bonding material is an anisotropically conductive, heat-curing adhesive based on a modified epoxy resin. This single-component, heat-curing, solvent-free adhesive is filled with electrically conductive particles (metal powder (especially Cu, Al, Ag, Au), carbon powder, nanocarbon powder, or similar). In one variant, the adhesive is cured at a temperature of approximately +50 °C to approximately +600 °C, e.g., at 540 °C, using a (high-temperature) thermosetting device. Higher temperatures shorten the curing time, and lower temperatures lengthen it. One variant of this adhesive is DELO MONOPOX AC6545. Rapid curing is essential for high production speeds. When using a 230 °C (high-temperature) thermosetting device, DELO MONOPOX AC6545 allows curing within one second.With the higher temperature ranges mentioned above, even shorter curing times of 0.3 to 0.03 seconds are achievable. In one variant, the bonding material is a conductive adhesive that cures through heat and additionally through UV light. In this case, a UV light source is associated with the (high-temperature) thermomode device.

[0029] The solution revealed here requires only a second device, for example a cylinder with a vacuum system, a drive, and a control system.

[0030] In one variant of the device, the second receptacle has a cylindrical shape. In this variant, in response to information signaled by the control system, the second receptacle is rotated by the first conveying device to move the second carrier in its orientation relative to the storage location so that an electronic subassembly on the second carrier reaches the storage location. In another variant of the device, the second receptacle has openings in a surface facing the second carrier, which are connected to a vacuum source, in order to bring the second carrier into close contact with the surface of the second receptacle.In one variant of the device, a heater is provided on the outer surface of the second receptacle, designed and equipped to temper the second carrier from its side opposite the first receptacle before, at, and / or after the storage point, in response to information signaled by the control system.

[0031] In one variant of the device, the (high-temperature) thermomode devices and the second carrier can be moved towards and away from each other. In another variant, the (high-temperature) thermomode device and the second carrier can also be moved together in the conveying direction of the second carrier. This allows the joining process to take place over a longer period during the transport of the second carrier, while the (high-temperature) thermomode device acts on the component and the bonding material hardens.

[0032] In one variant, the device has an additional drive unit to move the (high-temperature) thermomode device and / or the second carrier relative to each other in a direction transverse to the conveying direction of the second carrier. This is particularly the case for arrangements designed and intended for processing second carriers in the form of quasi-endless carrier belt material. This 30A-168959

[0033] The carrier tape material carries a multitude of electronic subassemblies in its transverse and / or longitudinal extent.

[0034] In another variant of the device, the (high-temperature) thermosetting device(s) and / or the second receptacle for the second carrier (or at least their respective components that come into contact with the second carrier or the component) are designed to be movable in the conveying direction of the second carrier by means of appropriate drives. This mobility of the (high-temperature) thermosetting devices in the conveying direction includes the fact that the (high-temperature) thermosetting devices are moved along a circular path relative to the second carrier in order to cure several electronic components on the second carrier in a row. In one variant, the heat source for the adhesive curing is the (high-temperature) thermosetting device.In another variant, the second receptacle for the second carrier (or at least the component that comes into contact with the second carrier or the component) is also equipped with a heat source to preheat the adhesive. The adhesive curing then takes place using the heat source of the (high-temperature) thermosetting device.

[0035] The (high-temperature) thermocouple device is designed as a heat source to introduce heat to the component / adhesive / second support via thermal conduction, i.e., through contact. For this purpose, the (high-temperature) thermocouple device can be designed as a heating resistor, e.g., a heating wire, etc. The heating resistor heats a contact surface of the (high-temperature) thermocouple device, which, if necessary under pressure, then transfers the heat to the component / second support.

[0036] In one variant, the device includes a third image acquisition unit to detect the component on the electronic subassembly on the downstream side of the storage location and to signal this information to the control system for determining the position and / or orientation of the component on the respective electronic subassembly. In another variant, the first, second, and / or third image acquisition units are aligned on the second carrier such that the electronic subassembly, the portion of connecting material, and / or the stored component are detected. In yet another variant, the first, second, and / or third image acquisition units each have a first, second, and / or third adjustment device to adjust the first, second, and / or third image acquisition unit in one or more longitudinal or rotational directions.In one variant, the first, second, and / or third image feed mechanism each has its own first, second, and / or third lighting device for illuminating the respective image feed mechanism. 30A-168959.

[0037] In one variant of the device, the first image acquisition device is arranged upstream of the connecting material dispenser, the second image acquisition device is arranged upstream of the separating device; and / or the third image acquisition device is arranged downstream of the separating device.

[0038] In one variant of the device, the heating system is designed and configured to establish an electrical and mechanical connection when the component is placed on the second carrier, in response to information signaled by the control system. This is achieved by heating the electronic sub-assembly on the second carrier to a temperature at which the applied portion of the connecting material and / or solder of the electronic sub-assemblies is heated, at least in the area of ​​exposed ends of the electronic sub-assemblies, and by bringing areas or contacts of the component into contact with it when the component is placed on the second carrier.

[0039] In one variant of the device, a first adjustment device is provided and configured to set a distance between the first and second receptacles in response to information signaled by the control system. In another variant of the device, a second adjustment device is provided and configured to set the position and / or orientation of the connecting material dispenser relative to the electronic subassembly on the second carrier in response to information signaled by the control system. In another variant of the device, a third adjustment device is provided and configured to set the orientation and positioning of the first receptacle relative to the separating device and / or the storage location in response to information signaled by the control system.In one variant, the connecting material dispenser, the first mounting, and the (high-temperature) thermomode device(s) can be adjusted relative to each other. This adjustability allows second carriers to be equipped with components, each carrying electronic subassemblies of varying sizes.

[0040] In one variant of the device, the separating device is provided and configured to emit a laser beam or actuate a needle in the direction of one of the electronic components on the first carrier in order to separate one of the components from the first carrier in response to information signaled by the control system.

[0041] In one variant of the device, at least one hold-down device is provided and arranged on the upstream and / or downstream side of the storage location to subject the second support to a negative pressure in the storage location, which pulls the second support towards the outer surface of the second receptacle. 30A-168959

[0042] A method is used to transfer electronic components from a first carrier to a second carrier, wherein the first carrier carries a plurality of individual components, and the second carrier carries a plurality of electronic subassemblies, onto each of which one of the components from the first carrier is to be transferred. The method comprises:

[0043] Recording the first carrier in or on a first recording;

[0044] Receiving the second carrier in or on a second recording;

[0045] Conveying the second beam along its longitudinal extent in a conveying direction into or at a second receiving point, wherein the first beam is received at the first receiving point in such a way that the components it carries are oriented towards the second receiving point;

[0046] Detaching one of the components from the first support, either by touching or without contact, in order to transfer the component to the second support at a storage location;

[0047] Promoting the second carrier in its orientation relative to the storage location so that an electronic subassembly on the second carrier reaches the storage location;

[0048] Detecting the placement location of the component on the electronic subassembly on the second carrier upstream of the placement location by means of a first image acquisition device and signaling the image acquisition to the control system to determine the position and / or orientation of the electronic subassembly on the second carrier;

[0049] Applying a portion of a bonding material to the electronic subassembly on the second carrier by means of a bonding material dispenser, downstream of the first image acquisition device;

[0050] Detecting the position and / or orientation of the portion of a connecting material on the electronic subassembly by means of a second image acquisition device downstream of the connecting material dispenser and signaling the image acquisition to the control system to determine the position and / or orientation of the portion of a connecting material.

[0051] In one variant of the method, the second carrier is conveyed to be loaded with the portion of bonding material and to transfer the component into or onto a single second fixture. The bonding material dispenser and the separating device are arranged distributed along the second fixture. The bonding material dispenser dispenses bonding material onto the second carrier in a controlled and portioned manner, and the separating device separates a component from the first carrier and transfers the component to the second carrier at the location where the bonding material had previously been applied. In another variant of the method, image infeeds before and after the bonding material dispenser and after the separating device along the second fixture are used to adjust the positions and orientations of the first and second carriers relative to each other, as well as of the bonding material dispenser and the separating device. 30A-168959

[0052] The image is transmitted, and the control system feeds, based on these image intakes, the corresponding setting devices of the first and / or the second intake and / or the separating device, and / or the connecting material dispenser and / or the devices for the image intakes.

[0053] In one variant, a heater acts on the second carrier in the area of ​​the second recording in order to temper it from the side opposite the first recording before, at, and / or after the deposit point.

[0054] In one variant, a conveying device is designed and configured to move the second carrier relative to the storage location in response to information signaled by a control system, such that an electronic sub-assembly on the second carrier reaches the storage location on the second receptacle that guides the second carrier. In this variant, the second receptacle has a contact surface curved in the conveying direction of the second carrier, for example, a cylindrical drum surface. In this variant, the conveying device is designed and configured to move the second carrier along the conveying direction (without slippage or stretching) in response to information signaled by the control system, such that at least one of the multiple electronic sub-assemblies on the second carrier reaches the storage location according to the signaled information.

[0055] In another variant, the second holder is designed as a circular cylindrical drum and can be heated as a whole. In one variant, this heated drum is rotatable by a conveyor mechanism that includes a drive unit and transports the second carrier towards / away from the component's storage location.

[0056] Instead of a circular cylindrical drum, the second receiving area can also be designed as a convexly curved or bent surface towards the first receiving area, which is fixed in place and to which the further, third conveying device for the second carrier is spatially and / or functionally assigned.

[0057] For the placement of subassemblies or connection frames using direct die attach (DDA), single-row or multi-row tape material is typically used as a second carrier. The components from the first carrier are placed onto the subassemblies located on the second carrier. Conventional DDA systems for single-row or multi-row web material use a camera to detect the placement position on the web material before component placement. This camera is mounted directly in the placement area on the back / underside of the web material of the second carrier. Due to this arrangement (30A-168959), conventional DDA systems can only process fully transparent materials, such as PET, without compromising placement accuracy; opaque materials as a second carrier are generally not possible.The presented solution eliminates the need for the previous inspection of the second support at the placement point, as the inspection and determination of the position on the second support are performed beforehand. This allows even second supports with low or no transparency to be used without compromising component placement accuracy, ensuring precise alignment of the component with the subassembly.

[0058] The proposed solution detects the storage location on the web material (spatially / temporally) before the actual component placement. The second image acquisition device directly captures the respective component storage location on the second carrier itself, rather than through the second carrier. The second carrier is then conveyed to the storage location in such a controlled manner that the component storage location aligns as precisely as possible with the position of the component to be placed on the first carrier when the separating device separates this component from the first carrier and transfers it to the second carrier.

[0059] Compared to pick-and-place or flip-chip systems, the proposed solution achieves a significantly higher component throughput due to its structurally lower complexity. Components can be separated directly from the (sawed) wafer and placed into their respective subassemblies (or mounting frames, etc.) on the second carrier; an intermediate carrier, as used in conventional placement machines, is not required. The transparency of the second carrier material no longer affects the component placement accuracy.

[0060] The device presented here allows, for example, the production of RFID inlays or RFID modules in which the electrical contact between the RFID chip and the antenna is established by soldering. In one variant, the antenna comprises an electrically conductive material that melts under the influence of a specific temperature. In this molten state, the RFID chip, with its contacts (bumps), is placed into the molten, exposed ends of the antenna. This creates a permanent and sufficiently strong electrical and mechanical connection between the contacts of the RFID chip and the contact points of the antenna.

[0061] The electrical and mechanical connection must be established as soon as the component is placed onto the carrier material (tape), more precisely, onto the antennas that are applied to the carrier material (tape). For this purpose, for example, the carrier material (tape) 30A-168959 is heated to a temperature sufficient for placing the component, at which the solder / material of the antenna, at least in the area of ​​the exposed ends of the antenna, reaches its melting point, and the contacts of the RFID chip are brought into contact with it.

[0062] If the tempering of the second carrier does not take place up to the softening temperature of solder in order to create the solder connection described above between the exposed ends of the antenna and the contacts of the RFID chip, conductive adhesive can be used, for example, as a bonding material between the exposed ends of the antenna and the contacts of the RFID chip for the production of RFID inlays.

[0063] Electrically conductive adhesives are classified as either isotropic conductive (ICA) or anisotropic conductive (ACA). Isotropic conductive adhesives conduct electricity in all directions. These adhesives are used, for example, for chip contacting or for electrically conductive SMD (surface mounted device) bonding. Anisotropic adhesives are filled with special conductive particles in the millimeter range, whose conductivity is only present in one direction when contacted. These adhesives are used, for example, for contacting delicate connection structures on printed circuit boards, such as flexible PCBs, or for contacting antenna structures for RFID.

[0064] Anisotropic conductive adhesive bonding (ACA) requires a lower process temperature compared to conventional soldering, for example. Furthermore, this bonding method allows contact on surfaces that are not solderable or difficult to solder.

[0065] In anisotropic conductive bonding, the electrical connection between the chip and the substrate is achieved through conductive particles (metal, metal-clad polymer) within the bonding material. These particles are randomly distributed within the adhesive matrix and are trapped between the electrodes during the bonding process. The advantages of ACA adhesive materials lie in the relatively simple application of ACA paste or ACA films and their rapid curing at relatively low temperatures.

[0066] Alternatively, non-conductive adhesive bonding (NCA) is used to achieve very low and long-term stable contact resistances, comparable to those of soldered joints or thermocompression bonding. 30A-168 959

[0067] If a non-electrically conductive bonding material is used to connect the RFID chip to the antenna, it only needs to ensure the mechanical connection. Inexpensive, non-conductive (epoxy) adhesives or hot-melt adhesives are sufficient for this purpose. When the substrate (tape) is heated, the solder / antenna material and the non-conductive bonding material are brought to their melting point.

[0068] In addition to or as an alternative to curing using a (high-temperature) thermode device, one variant provides for the use of epoxy adhesives containing photoinitiators in order to be cured (also) by means of UV LED light (Ultraviolet Light Emitting Diode) within a very short time.

[0069] UV LED light has high energy efficiency, UV LEDs have lower operating costs due to their longer service life (> 20,000 hours), generate less heat during curing and have a lower temperature load for sensitive secondary substrates, and require no standby time and no warm-up and cool-down phases.

[0070] Epoxy adhesives offer good resistance to environmental and chemical influences. They can be used at higher temperatures and have high glass transition temperatures. Epoxy adhesives exhibit high ionic purity and low alkali and halide content. Epoxy adhesives can be formulated to be flexible and soft with high elongation at break, or hard and scratch-resistant with extremely high bond strength. Very high light intensities can be achieved with UV LED light, significantly reducing cycle times for epoxy adhesives. Epoxy-based adhesives can be cured considerably faster than previously possible.

[0071] Furthermore, in some variants, a final bonding module that is otherwise standard in the process chain can be omitted. This significantly reduces the complexity, size, and cost of the machine.

[0072] A final bonding module is a separate machine module containing a large number of conventional thermodes, typically 128 to 256. These thermodes simultaneously heat the electronic components to cure the bonding material during approximately 8 seconds of contact between the thermodes and the components. The final bonding modules have bonding material-repellent strips, such as those made of silicone, between the thermode heads and the electronic components. These strips prevent the bonding material from adhering to the thermode heads. Without these strips, bonding material would adhere to the thermode heads, reducing the heating efficiency of the thermodes. (30A-168959)

[0073] High-temperature thermode devices, on the other hand, immediately burn away any bonding material that is stuck to the thermode heads.

[0074] With the devices and methods presented here, the carrier material (tape), on which, for example, antennas are mounted, is heated by at least one heating element on its way to, at, and / or away from the placement point. This heating element(s) acts on the side of the carrier material (tape) furthest from the subassembly (e.g., antenna), so that at least the solder / material of the exposed ends of the antenna is brought to its melting point. Upon release of the component from the first carrier, the contacts of the RFID chip are brought into contact with the exposed ends of the antenna. After the solder / material of the exposed ends of the antenna has cooled (in a controlled manner) below its melting point, the component (the RFID chip) is electrically and mechanically connected to the subassembly (antenna).

[0075] In one version of the device, the second receiving unit and / or the conveying system has openings connected to a vacuum source. These openings are designed and configured to bring the second carrier, particularly at the placement point, into a tight fit against the curved mounting surface. During transport, the vacuum-operated openings secure the second carrier without slippage. This enables controlled transport of the second carrier and precise placement of the component from the first carrier relative to the sub-assembly on the second carrier.

[0076] In another variant, a buffer storage unit is assigned to the devices on the upstream and / or downstream side of the depositing point or the curved mounting surface. This buffer storage unit is designed and configured to hold a supply of the second carrier. In one variant, this buffer storage unit is designed as a box open towards the depositing point, which may hold the second carrier under negative pressure or guide it with a delay.

[0077] In another variant, a first image acquisition device is provided and configured to capture an image of at least one component located on the first carrier in the area of ​​the storage location and to signal this to the control system. In a further variant, a second and / or a third image acquisition device is arranged and configured to capture images of at least one electronic subassembly on the second carrier, with or without the component, in the area on the upstream and / or downstream side of the storage location and to signal this to the control system. 30A-168959

[0078] In another variant, the distance between the first and second shots can be adjusted using a setting device.

[0079] In another variant, at least one hold-down device is provided and installed on the upstream and / or downstream side of the storage location to force the second carrier onto the second receptacle.

[0080] This temperature control – achieved through appropriate control of the heating element by the controller – is performed uniformly or in sections / zones within the area of ​​the second substrate, depending on the material properties / melting point of contact points of the component to be transferred and / or the material properties / melting point of contact points of the components / electronic subassembly on the second substrate. This ensures a mechanically and electrically secure connection between the component to be transferred and the component / electronic subassembly on the second substrate in a simple and quick manner.

[0081] The image acquisition system determines the position of the second carrier and the subassembly on it before, at, and / or after the placement point for the component to be placed on it. The control system then uses the result of this image acquisition, in combination with position data from the other conveyor system, to determine the exact position of the subassembly on the second carrier at the placement point and to position the first carrier with the component to be placed accordingly. One of the image acquisition systems inspects the top surface of the second carrier. This ensures that the quality of the image acquisition is independent of the transparency of the carrier material.

[0082] Alternatively or cumulatively to the mainly contact-based tempering heating with the heating strip, contactless heating of the second carrier and the sub-assembly(ies) located on it is possible by laser, infrared or induction.

[0083] In one variant, the first tray with the first carrier is located directly above the second carrier on the second tray. The first tray and the separating device have a movement range perpendicular to the conveying direction of the second carrier that is at least approximately equal to the width of the second carrier. This significantly increases the work / component placement area across the width of the second carrier. Consequently, several adjacent rows of electronic subassemblies, for example, RFID antennas, can be accessed on a wide second carrier with the first carrier and loaded at the placement point by actuating the separating device. 30A-168959

[0084] In one variant, the first carrier has a first side facing the separating device and a second side facing away from it. This second side faces the second carrier on / at the second mounting. An image acquisition device is arranged on either the first or second side of the first carrier. On the second side of the first carrier, i.e., facing away from the separating device, the multitude of components are detachably mounted to the first carrier. The separating device is configured to interact with at least one of the components, either by contact (e.g., with a needle) or non-contact (e.g., with a laser beam), in order to separate it from the first carrier. This image acquisition device provides images or data to the control unit for positioning and aligning the separating device relative to the first carrier.The control system generates positioning commands for the separating device from the captured images or data, as well as control commands for the separating device and the respective conveying devices based on the captured images or data.

[0085] In one variant, the second image acquisition device – with respect to the conveying direction of the second carrier – is arranged upstream of the storage point on the second carrier and is designed and configured to detect one or more of the multiple electronic subassemblies on the second carrier in their position relative to the second recording point in the conveying direction of the second carrier and / or transversely to the conveying direction of the second carrier, and to signal information representing the detected position to the control system.

[0086] In one variant, the control system is designed and configured to control the second conveying device based on the information from the second image acquisition device regarding the position of at least one electronic sub-assembly and the information regarding the conveying direction and conveying path of the second carrier, as well as based on the information from the first image acquisition device regarding the position of at least one of the components relative to the depositing point, in order to move the separating device transversely to the conveying direction of the second carrier to the depositing point, and to activate the separating device in the sense of separating the component from the first carrier.

[0087] In one variant, the devices comprise a conveying device for the first intake, which is designed and configured to move the first intake longitudinally or transversely to the conveying direction of the second carrier relative to the second intake in response to information signaled by the control; and / or to rotate the first intake by an angle relative to the second intake in response to information signaled by the control 30A-168959.

[0088] In one variant of the devices, the separating device, if it is configured to separate the components from the first carrier by contact, comprises a probing needle which is configured and dimensioned to puncture the first carrier in response to information signaled by the control system in order to detach one of the components from the first carrier and transfer it to the second carrier; or if it is configured to separate the components from the first carrier without contact, the separating device comprises a controllable energy source which is configured and dimensioned to supply the first carrier with energy in response to information signaled by the control system in order to detach one of the components from the first carrier and transfer it to the second carrier.

[0089] In another variant of the devices, the second receptacle comprises a (circular-cylindrical drum or a convexly curved surface) over which the second carrier reaches the storage point on the second receptacle, wherein in one variant the second receptacle has outlets on its outer surface / surface which guides the second carrier, which are designed to hold the second carrier on the second receptacle (without slippage and without stretching) by means of negative pressure.

[0090] In another variant, the devices include a third image acquisition device which - with respect to the conveying direction of the second carrier - is arranged downstream of the storage point and is designed and equipped to detect at least one of the multitude of electronic subassemblies on the second carrier and the component transferred to it in their position relative to each other and to signal information representing the detected position to the control system.

[0091] In another variant, the devices comprise a conveying device designed and configured to convey the second image acquisition device relative to the second receiver and the deposit point in order to detect at least one component deposit point on the second carrier by the second image acquisition device and / or to detect the position of at least one of the plurality of electronic subassemblies on the second carrier and to signal information representing the detected position to the control system; and / or a conveying device designed and configured to convey the third image acquisition device relative to the second receiver and the deposit point in order to detect the position of at least one of the plurality of electronic subassemblies on the second carrier. 30A-168959

[0092] to detect the position of the carrier and the component transferred to it relative to each other and to signal information representing the detected position to the control system.

[0093] Alternatively, the second and / or third image acquisition device is pivotably mounted on the second mount and its alignment with the component storage location or the electronic subassemblies on the second carrier and the component transferred to them is electronically controlled or manually adjustable.

[0094] In one variant, the devices include a bonding material dispenser designed and configured to dispense bonding material from a supply onto the second carrier. The second carrier is quasi-endless and carries a multitude of electronic subassemblies along its longitudinal and / or transverse extent. The bonding material is dispensed in a controlled and measured manner onto each of these electronic subassemblies at a bonding point on the second carrier at a bonding material dispensing position, in order to then transfer a component to one of the subassemblies.

[0095] The connecting material dispenser also allows for multi-row tape material as a second carrier. In one variant, the dispenser is moved perpendicular to the conveying direction of the second carrier to the respective row of electronic subassemblies. In another variant, a number of dispensers corresponding to the number of rows of electronic subassemblies are arranged perpendicular to the conveying direction of the second carrier, aligned with the rows of electronic subassemblies.

[0096] The proposed solutions detect the adhesive point on the web material (spatially / temporally) before the actual application of the bonding agent. The image capture device detects the adhesive point directly on the second carrier itself, rather than through it, in conjunction with the respective electronic subassembly. The second carrier is then fed in a controlled manner to the bonding agent application position so that the adhesive point aligns as precisely as possible with the position of the bonding agent dispenser's outlet when the dispenser applies a measured portion of bonding agent to the adhesive point.

[0097] The device for image intake – with respect to the conveying direction of the second carrier – is arranged upstream of the connecting material dispensing position on the second carrier and is designed to place one or more of the multiple electronic subassemblies on the second carrier in their 30A-168959 configuration, perpendicular to the conveying direction of the second carrier.

[0098] To determine the position relative to the second recording and / or the second carrier and to signal information representing the recorded position to the control system.

[0099] In various versions of the image acquisition devices, their lighting equipment includes a white light, a red light, and / or an (ultra-)blue light source.

[0100] In one variant of the lighting device, the red light and / or the (ultra-)blue light source is designed as a ring light source that at least partially surrounds a detection area of ​​the image capture device.

[0101] In one variant of the image acquisition device, the white light source is arranged on a side of a beam deflection that is at least partially transparent and located away from the detection area of ​​the image acquisition device.

[0102] Another variant of the device serves to transfer electronic components from a first carrier to a second carrier, wherein the first carrier can detachably carry a plurality of individual components, and the second carrier is designed as a quasi-endless conveyor belt and carries a plurality of electronic subassemblies in one or more rows along its length, to each of which one of the components is to be transferred from the first carrier. This variant of the device comprises a first receptacle, designed and configured to receive the first carrier. A second receptacle is designed and configured to convey the second carrier along its length in a conveying direction, wherein the first receptacle is designed and configured to receive the first carrier such that the components it carries are oriented towards the second receptacle.A bonding material dispenser is designed and configured to apply a portion of bonding material to the electronic subassembly located on the second carrier, in response to information signaled by a control unit, while the second carrier is positioned on the second receptacle. A separating device is designed and configured, downstream of the bonding material dispenser, to separate one of the components from the first carrier, either by contact or without contact, in response to information signaled by a control unit, in order to transfer the component to a corresponding electronic subassembly located on the second carrier at a designated storage location.A first high-temperature thermomode device comprising a stamp to be tempered is designed and configured to move the stamp to be tempered and the second carrier relative to each other on the downstream side of the separating device in response to information signaled by a control system, and thereby subject the component located on the electronic subassembly to pressure and / or temperature.

[0103] This arrangement allows the bonding material, for example an adhesive, to be cured using the first high-temperature thermomode device, and the position of the component on the subassembly to be inspected before and after the adhesive has cured. This arrangement is very well suited for a single-row subassembly guided by the conveyor system; however, it is also particularly well suited for several parallel rows of subassemblies on the second carrier.

[0104] In one variant, along the axial extension of the second conveying unit, i.e., transverse to the conveying direction of the second carrier, several high-temperature thermomode devices are positioned side by side and can be moved synchronously, depending on the number of subassemblies arranged side by side. In another variant, the high-temperature thermomode devices can be moved relative to each other when the antenna size is changed.

[0105] High-temperature thermode devices heat up to 400° to 600°C, while conventional thermodes heat up to 250°C. High-temperature thermode devices can cure the adhesive in 0.03 to 0.3 seconds or less, whereas conventional thermodes require approximately 8 seconds. High-temperature thermode devices operate from the top of the component and subassembly, whereas conventional thermodes are typically positioned in pairs facing each other. Overall, these arrangements and their variations allow for a significantly improved throughput of component transfers.

[0106] As described above, in some variants the second conveying unit must be heated. Alternatively, a thermode with an operating temperature between approximately 80 °C and 35 °C can be provided opposite the high-temperature thermode device. This reduces the required dwell time of the high-temperature thermode device on the component, as it minimizes heat dissipation from the plunger of the high-temperature thermode device when in contact with the component and the subassemblies on the second conveying unit. Another advantage of the high-temperature thermode device is that any residue of the bonding material on the plunger of the high-temperature thermode device is burned off by the high operating temperatures. Conventional thermodes have a silicone strip attached to prevent direct contact of excess adhesive with the thermode.If excess adhesive comes into direct contact with the thermode, it will adhere to the thermode's plunger, thus reducing its heating performance. 30A-168959.

[0107] One variant of the device comprises a first image acquisition unit, designed and configured to detect the respective electronic subassembly on the second carrier on the upstream side of the component's placement location and to signal the position and / or orientation of the electronic subassembly on the second carrier to the control system. The image acquisition unit (e.g., a camera) either signals an image containing the position and / or orientation, from which the control system determines the position and / or orientation of the electronic subassembly on the second carrier. Alternatively, the evaluation of the image acquisition with regard to the position and / or orientation of the electronic subassembly on the second carrier takes place directly within the image acquisition unit, and data (coordinates) concerning the position and / or orientation are directly signaled to the control system.

[0108] Alternatively or additionally, a second image acquisition device is designed and configured to detect the portion of the connecting material on the electronic subassembly downstream of the connecting material dispenser and to signal the position and / or orientation of the connecting material portion on the electronic subassembly to the controller. Here, too, the image acquisition device (e.g., camera) either signals an image containing the position and / or orientation, from which the controller determines the position and / or orientation of the connecting material portion on the second carrier. Alternatively, the evaluation of the image acquisition with regard to the position and / or orientation of the connecting material portion on the second carrier takes place directly in the image acquisition device, and data (coordinates) regarding the position and / or orientation are directly signaled to the controller.In particular, the position and / or orientation of the portion of the connecting material on one or more (for example, two) contact surfaces of the electronic subassembly located on the second carrier are determined.

[0109] Alternatively or additionally, a third image acquisition device is designed and configured to detect the component on the electronic subassembly on the downstream side of the storage location and to signal the position and / or orientation of the component on the respective electronic subassembly to the controller. Here too, the image acquisition device (e.g., camera) either signals an image containing the position and / or orientation, from which the controller determines the position and / or orientation of the component on the respective electronic subassembly. Alternatively, the evaluation of the image acquisition with regard to the position and / or orientation of the component on the respective electronic subassembly takes place directly in the 30A-168959.

[0110] The image acquisition device and the control system directly receive data (coordinates) regarding position and / or orientation.

[0111] Alternatively or additionally, a fourth image acquisition device is designed and configured to detect the component on the electronic subassembly on the downstream side of the first high-temperature thermode device and to signal the position and / or orientation of the component on the respective electronic subassembly to the control system. In particular, any slippage or rotation of the component relative to contact surfaces of the electronic subassembly located on the second carrier is detected. Here, too, the image acquisition device (e.g., camera) either signals an image containing the position and / or orientation, from which the control system determines the position and / or orientation of the component on the respective electronic subassembly.Alternatively, the evaluation of the image acquisition with regard to position and / or orientation of the component on the respective electronic sub-assembly takes place directly in the image acquisition device, and data (coordinates) regarding position and / or orientation are directly signaled to the control system.

[0112] The first, second, third, and / or fourth image capture devices are aligned with the second carrier such that the electronic subassembly, the portion of connecting material, and / or the deposited component are captured. Alternatively or additionally, the first, second, third, and / or fourth image capture devices each have a first, second, and / or third adjustment device to adjust the respective image capture device in one or more longitudinal or rotational directions. Alternatively or additionally, the first, second, third, and / or fourth image capture devices each have a lighting device to illuminate the respective image capture device.

[0113] These measures lead to increased precision and reliability in the positioning of the component on the sub-assembly, even with higher throughput.

[0114] One variant of the device has a second high-temperature thermomode device comprising a piston to be tempered. This device is designed and configured to move the piston to be tempered and the second carrier relative to each other downstream of the separating device in response to information signaled by a control unit, thereby subjecting the component located on the electronic subassembly to pressure and / or temperature.

[0115] One variant of the device has a fifth image acquisition unit. This is designed and configured to connect to the downstream side of the second high-temperature 30A-168959

[0116] The thermode device detects the component on the electronic subassembly and signals the control system to determine the position and / or orientation of the component on the respective electronic subassembly.

[0117] This second high-temperature thermomode device allows for an increase in the throughput of the device.

[0118] In one variant, the image acquisition after the application of the bonding material and the image acquisition after the component is placed are performed by the same image acquisition device. This reduces the tooling complexity and allows for a more compact device design.

[0119] The assemblies comprising the connecting material dispenser, separating device, and high-temperature thermode fixtures, along with their respective image acquisition devices, are adjustable relative to each other along the second conveyor in one variant to accommodate different sizes of the subassembly. In some variants, the high-temperature thermode fixtures are arranged multiple times along the axial extension of the second conveyor, i.e., transversely to the conveying direction of the second carrier; in this case, they are also adjustable relative to each other in this direction.

[0120] In one variant of the device, the control system is designed and configured to feed the components located on the second carrier to the first and second high-temperature thermode devices, offset along the carrier, and then simultaneously subject them to pressure and / or temperature.

[0121] In one variant of the device, the control system is designed and configured to simultaneously actuate the first and / or the second high-temperature thermomode device and the second carrier in the conveying direction of the second carrier. This allows the joining process to take place over a longer period during the transport of the second carrier, while the (high-temperature) thermomode device acts on the component and the bonding material hardens.

[0122] In one variant of the device, a third adjustment device is provided and configured for use with a multi-row carrier material. This device adjusts the orientation and positioning of the first holder according to information signaled by the control system, perpendicular to the conveying direction of the second carrier, in order to move the first carrier so that a component is placed on an electronic sub-assembly of one of the multiple rows on the second carrier. 30A-168959

[0123] In one variant of the device, a first and / or a second high-temperature thermode device is provided for each of the several rows of electronic subassemblies on the second carrier. The control system is designed and configured to actuate the first and / or second high-temperature thermode device of each row and the second carrier simultaneously in the conveying direction of the second carrier, in order to subject the components to pressure and / or temperature at the same time. In this way, the high-temperature thermode devices and the second carrier move synchronously in the conveying direction of the second carrier while the components are subjected to pressure and / or temperature.

[0124] In one variant of the device, a high-temperature thermode unit is provided for several rows of electronic subassemblies on the second carrier. The control system is designed and configured to move the high-temperature thermode unit transversely to the conveyor for the sequential processing of several strips.

[0125] In one variant of the device, the second receptacle has a cylindrical shape. In response to information signaled by the control system, this second receptacle is rotated by the first conveying unit to align the second carrier with the storage location, ensuring that an electronic subassembly on the second carrier is delivered to the storage location. In this variant, the second receptacle has openings in a surface facing the second carrier, which are connected to a vacuum source. This vacuum source with the openings is designed and configured to bring the second carrier into close contact with the surface of the second receptacle.In one variant of the device, this second receptacle has a heater on its outer surface, which is designed and configured to temper the second carrier from its side opposite the first receptacle, in response to information signaled by the control system, before, at, and / or after the storage location.

[0126] In one variant of the device, the heating element is designed and configured to establish an electrical and mechanical connection when the component is placed on the second carrier, in response to information signaled by the control system, by heating the electronic subassemblies on the second carrier to a temperature at which the applied portion of the connecting material of the electronic subassemblies is heated, at least in the area of ​​exposed ends of the electronic subassemblies 30A-168959, and when the component is placed, areas or contacts of the component are brought into contact with it.

[0127] In one variant of the device, a first adjustment device is provided and configured to manually adjust the distance between the first and second receptacles, either manually or in response to information signaled by the control system. In another variant of the device, a second adjustment device is provided and configured to manually adjust the position and / or orientation of the connecting material dispenser relative to the electronic subassembly on the second carrier, either manually or in response to information signaled by the control system. In another variant of the device, a third adjustment device is provided and configured to manually adjust the orientation and positioning of the first receptacle relative to the separating device and / or the storage location, either manually or in response to information signaled by the control system.In one variant, the connecting material dispenser, the first inlet, and the high-temperature thermomode devices are each assigned an adjustment mechanism to allow them to be adjusted relative to one another. Alternatively, a single adjustment mechanism can be provided to move the connecting material dispenser, the first inlet, and the high-temperature thermomode devices along a path on which the subassemblies are conveyed.

[0128] In one variant of the device, the separation device is provided and configured to emit a laser beam or actuate a needle in the direction of one of the electronic components on the first carrier in order to separate one of the components from the first carrier in response to information signaled by the control system. In another variant of the device, at least one hold-down device is provided and configured on the upstream and / or downstream side of the depositing point to subject the second carrier to a vacuum in the depositing point area.

[0129] A method for transferring electronic components from a first carrier to a second carrier, wherein the first carrier detachedly carries a plurality of individual components, and the second carrier is designed as a quasi-endless carrier strip and carries a plurality of electronic components in a row or in several rows along its longitudinal extent, to each of which one of the components is to be transferred from the first carrier, comprises the following steps:

[0130] Recording the first carrier by means of an initial recording;

[0131] Conveying the second beam along its longitudinal extent in a conveying direction through a second receiving device, wherein the first receiving device receives the first beam in such a way that the components it carries are oriented towards the second receiving device; - l-

[0132] 30A-168 959

[0133] Applying a portion of a bonding material to the electronic subassembly located on the second carrier using a bonding material dispenser in response to information signaled by a controller, while the second carrier is on the second mount;

[0134] Separation of one of the components from the first support, either by contact or without contact, downstream towards the connecting material dispenser, using a separation device, in response to information signaled by the control system; and

[0135] Transferring the component at a storage location to a corresponding electronic sub-assembly located on the second carrier;

[0136] Moving a piston to be tempered of a first high-temperature thermode device relative to the second carrier, downstream of the separating device, in response to information signaled by the control; and applying pressure and / or temperature to the component located on the electronic subassembly.

[0137] One variant of the procedure includes the following steps:

[0138] Capturing a respective electronic subassembly on the second carrier by means of a first image acquisition device upstream of the component's storage location, and signaling the position and / or orientation of the electronic subassembly on the second carrier to the control system; and / or

[0139] Detecting the portion of the connecting material on the electronic subassembly by means of a second image acquisition device downstream of the connecting material dispenser, and signaling the position and / or orientation of the portion of connecting material on the electronic subassembly to the controller; and / or detecting the component on the electronic subassembly by means of a third image acquisition device downstream of the storage location, and signaling the position and / or orientation of the component on the respective electronic subassembly to the controller; and / or

[0140] Capturing the component on the electronic subassembly by means of a fourth image acquisition device downstream of the first high-temperature thermode device, and signaling the position and / or orientation of the component on the respective electronic subassembly to the controller; and / or

[0141] Aligning the first, second, third and / or fourth image capture device onto the second carrier such that the electronic subassembly, the portion of connecting material and / or the deposited component are captured; and / or

[0142] Adjusting the first, second, third and / or fourth image intake device by means of a respective first, second and / or third adjustment device to achieve the respective 30A-168959

[0143] Device for adjusting the image feed in one or more longitudinal or rotational directions; and / or

[0144] Illuminating the respective image intake of the first, second, third and / or fourth image intake device by means of a respective lighting device.

[0145] In one variant of the method, the following steps are provided: moving a piston to be tempered of a second high-temperature thermode device relative to the second carrier, downstream of the separating device, in response to information signaled by the control system; and applying pressure and / or temperature to the component located on the electronic subassembly; and / or

[0146] Capturing the component on the electronic subassembly by means of the fourth or a fifth image acquisition device downstream of the second high-temperature thermode device, and signaling the image acquisition to the control system to determine the position and / or orientation of the component on the respective electronic subassembly.

[0147] In one variant of the process, the following steps are provided: staggered feeding of the first and second high-temperature thermode devices to different components located in the same row on the carrier, and then simultaneous application of pressure and / or temperature to these components by the first and second high-temperature thermode devices; and / or simultaneous actuation of the first and / or the second high-temperature thermode device and the second carrier in the conveying direction of the second carrier. This allows the joining process to take place over a longer period during the transport of the second carrier, while the high-temperature thermode device acts on the component and the bonding material cures.

[0148] In one variant of the process, the following steps are provided: in the case of a multi-row carrier material, adjusting the orientation and positioning of the first holder according to information signaled by the control system by means of a third adjustment device transverse to the conveying direction of the second carrier, in order to move the first carrier so that one component at a time is placed on an electronic sub-assembly of one of the several rows on the second carrier; and / or

[0149] Providing a first and / or a second high-temperature thermode device for each of the multiple rows of electronic subassemblies on the second carrier; or providing a high-temperature thermode device movable transversely to the conveying direction for multiple rows of electronic subassemblies on the second carrier; and 30A-168 959 jointly actuating the first and / or the second high-temperature thermode device of each row and of the second carrier in the conveying direction of the second carrier in order to subject the components to pressure and / or temperature simultaneously.

[0150] One variant of the procedure includes the following steps:

[0151] Setting a distance between the first and second shots using a first adjustment device, manually and / or in response to information signaled by the control system; and / or

[0152] Setting the position and / or orientation of the connecting material dispenser relative to the electronic sub-assembly on the second carrier by means of a second adjustment device, manually and / or in response to information signaled by the control system; and / or

[0153] Setting the alignment and positioning of the first recording relative to the separating device and / or the storage location by means of a third adjustment device manually and / or in response to information signaled by the control system.

[0154] Although some of the aspects described above relate to the operating modes of the devices, these aspects may also relate to the structure of the devices. Likewise, the aspects described above relating to the devices may apply analogously to the operating modes. While the individual aspects of the devices and the operating modes are described together to explain their interaction, they are also disclosed independently of each other, to the other devices, and to other operating modes.

[0155] Brief description of the drawings

[0156] Further objectives, features, advantages, and applications will become apparent from the following description of non-restrictive variants with reference to the accompanying drawings. All described and / or illustrated features, individually or in any combination, demonstrate the subject matter disclosed herein, regardless of their grouping in the claims or their cross-references. The dimensions and proportions of the components shown in the figures are not necessarily to scale; they may differ from those illustrated here in implemented variants.

[0157] Fig. 1 shows a schematic side view of a device for transferring electronic components from a first carrier to a second carrier. 30A-168959

[0158] Fig. 2 shows a schematic top view of a table adjustable in X / Y / Theta coordinates, which serves as the first mounting for the first support.

[0159] Fig. 3 shows a schematic top view of a section of the second carrier with several electronic subassemblies.

[0160] Fig. 4 shows a schematic side view of another device for transferring electronic components from a first to a second carrier.

[0161] The process and device variants described here, as well as their functional and operational aspects, serve only to facilitate a better understanding of their structure, operation, and properties; they do not limit the disclosure to the exemplary embodiments shown. Some of the figures are schematic, with essential properties and effects sometimes significantly enlarged to illustrate the functions, operating principles, technical designs, and features. Each operating principle, each technical design, and each feature disclosed in the figures or in the text can be freely and arbitrarily combined with all claims, each feature in the text and in the other figures, other operating principles, principles, technical designs, and features contained in or arising from this disclosure, so that all conceivable combinations can be attributed to the described devices.This includes combinations of all individual descriptions in the text, that is, in every section of the description, in the claims, and also combinations of different variants in the text, in the claims, and in the figures, and these can be the subject of further claims. The claims also do not limit the disclosure or the possible combinations of all the identified features. All disclosed features are explicitly disclosed here, both individually and in combination with all other features.

[0162] Detailed description

[0163] The figures depict corresponding or functionally similar components in a similar manner and provide them with matching reference numerals. The method and the device will now be described using exemplary embodiments.

[0164] Fig. 1 shows a device 100 for transferring electronic components B from a first carrier W to a second carrier T. In this variant, the first carrier W has the shape of an approximately circular semiconductor component wafer and carries a plurality of individual components B, which can be detached from it in the manner described below. The second carrier T is designed as a quasi-endless tape and carries a plurality of electronic subassemblies ANT along its longitudinal and / or transverse extent. In the variant shown here, the subassemblies ANT are printed or wire-laid antenna sections of an RFID module (see also Fig. 3). One of the components B is to be transferred from the first carrier W to each of the plurality of electronic subassemblies ANT, in particular to the storage location 140. The device has a first receptacle 110, which is configured to receive the first carrier W.The first recording 110 is adapted in its shape to the first carrier W.

[0165] In the illustrated variant, a second receiving 120 has the shape of a circular cylindrical drum. The second support 120 is guided along its longitudinal extent in a conveying direction by means of the cylindrical outer wall. Details of this are explained below. The first receiving 110 receives the first support W such that the components B it carries are oriented towards the second receiving 120 (downwards in Fig. 1). A separating device TE is provided on the side of the first receiving 110 furthest from the second receiving 120. The first support W has a first side facing the separating device 130 and a second side facing away from the separating device 130, which faces the second support T on / at the second receiving 120. The plurality of components B are detachably mounted on the second side of the first support W.The separating device 130 serves, controlled by the electronic control unit ECU, to separate the components B from the first carrier W by touching or without contact, in order to transfer them precisely positioned at a storage location 140 onto the second carrier T, more precisely onto one of the subassemblies ANT.

[0166] Fig. 1 shows a section of the second support T onto which several components B from the first support W have already been transferred by means of the separating device 130.

[0167] The first fixture 110 is part of a table adjustable in X / Y / rot coordinates, the individual X / Y axes of which and the rot position are each adjustable by a conveyor 112a, 112b, 112c controlled by an electronic control unit (ECU). In particular, a conveyor 112a in the form of a linear servo drive serves to move the first fixture 110 transversely to the conveying direction (in the Y direction) of the second support T relative to the second fixture 120. (See also Fig. 2).

[0168] A conveying device 112b in the form of a linear servo drive serves to move the first receptacle 110 along the conveying direction (in the X-direction) of the second carrier T relative to the second receptacle 120. (See also Fig. 2). A conveying device 112c in the form of a servo drive serves to rotate the first receptacle 110 by an angle rot clockwise or counterclockwise around the Z-axis. (See also Fig. 2). 30A-168 959

[0169] In one embodiment, a conveying device 250 in the form of a linear servo drive serves to move the separating device 130 transversely to the conveying direction of the second carrier T (in the Y direction) relative to the second receiving 120.

[0170] An image acquisition device 260 in the form of a camera is assigned to the separating device 130 and serves to capture, in a top view, at least one of the components B in its position relative to a storage location 140 on the second recording 120, which guides the second support T. For aligning the image acquisition device 260 in the X, Y, and Z directions, the device has an adjustment device 262 and a ring light 264 directed at the first support W.

[0171] In one variant, the connecting material dispenser 170 and / or the solder paste dispenser 170' are also adjustable along the outer surface or circumference of the second carrier 120 in the longitudinal direction of the web material. This allows the respective positions of the connecting material dispenser 170 or the solder paste dispenser 170' to be adjusted due to different lengths of the electronic subassembly ANT in the longitudinal direction of the web material of the second carrier T.

[0172] A further image acquisition device 180 is arranged upstream of the storage location 140 and is assigned to the second recording position 120. This image acquisition device 180 is movable transversely to the conveying direction of the second carrier T and / or, in some variants, can be adjusted manually or by motor by a pre-defined angular amount along the surface of the second recording position 120. In variants for second carriers T with single-row sub-assemblies ANT, the image acquisition device 180 can be rigidly mounted and its field of view is adjusted once. This image acquisition device 180 serves to detect the position of at least one of the multiple electronic sub-assemblies ANT on the second carrier T relative to the second recording position 120 and to signal information representing the detected position to a control unit (ECU).

[0173] In this embodiment, a conveying device 196 for the second carrier T is formed by two controlled-driven transport rollers, which are arranged on the upstream and downstream sides of the second receptacle 120, which in this embodiment is drum-shaped, and around which the second carrier T is guided. In response to information signaled by the control unit (ECU), the second carrier T is conveyed by the two controlled-driven transport rollers to the storage location 140. Thus, at least one of the multiple electronic subassemblies ANT on the second carrier T reaches the storage location 140 on the second receptacle 120 that guides the second carrier T. 30A-168 959

[0174] Alternatively or cumulatively, a conveyor 150 rotates the drum-shaped second receptacle 120 for the second carrier T in response to information signaled by the control unit (ECU). In this way, the second carrier T is conveyed to the storage location 140 such that an electronic sub-assembly ANT on the second carrier T reaches the storage location 140 on the second receptacle 120 that guides the second carrier T.

[0175] This alternative / cumulative design of the further conveying device 150 for the second carrier T is, if the second receiving 120 is designed as a circular cylindrical drum, a motorized rotary drive of the drum (see Fig. 1).

[0176] It is understood that the storage location 140 can change both longitudinally and transversely along the second support T in order to precisely place a component B at the intended location of the sub-assembly ANT, while a corresponding area of ​​the second support T is located on the second receptacle 120 and must be aligned with component B on the first support W. Accordingly, the first support W is also controlled by the ECU to move both longitudinally and transversely along the second support T.

[0177] A multi-row strip material as a second support T is a strip material that, in its transverse extent, carries, for example, two, three, or more rows of subassemblies ANT that repeat almost endlessly in the longitudinal direction (conveyor direction) of the strip material. A slightly or completely opaque support material can be used as the second support T without any loss of accuracy in component placement.

[0178] The second intake 120, in the embodiment shown in Fig. 1, is a rigid drum along the cylinder axis, approximately circular in shape, which is to be rotated by a drive or by corresponding drives / conveying devices.

[0179] Upstream of the separating device 130 and the image acquisition device 180, a bonding material dispenser 170 is arranged, configured, and set up on the second receptacle 120 to apply a portion of a bonding material E, for example, an anisotropically electrically conductive epoxy adhesive, to the electronic subassembly ANT on the second carrier T. To precisely control this application in time and space, an image acquisition device 160 is arranged upstream of the bonding material dispenser 170. This image acquisition device 160 is configured and set up upstream of the bonding material dispenser 170 to the position and 30A-168 959

[0180] To detect the orientation of the electronic sub-assembly ANT on the second carrier T and signal it to the control ECU.

[0181] If the connecting material E is not electrically conductive, in one variant a solder paste dispenser 170' is arranged, designed, and configured upstream of the separating device 130 and the image acquisition device 180 at the second mount 120 to apply a portion of solder paste S to the electronic subassembly ANT on the second carrier T. This can occur spatially and temporally before or after the application of the connecting material E by the connecting material dispenser 170. To precisely control this application of the solder paste S in terms of time and space, the image acquisition device 160 is located upstream of the solder paste dispenser 170'. This image acquisition device 160 is designed and configured upstream of the connecting material dispenser 170 and the solder paste dispenser 170' to detect the position and orientation of the electronic subassembly ANT on the second carrier T and signal this information to the control unit (ECU).This allows the ECU control unit to align the connecting material dispenser 170 and the solder paste dispenser 170' relative to the respective electronic subassembly ANT by means of the respective adjustment devices 172, 172'. If component B is soldered to the electronic subassembly ANT, the application of the connecting material E can be replaced by the application of the solder paste.

[0182] In one variant, the connecting material dispenser 170 and / or the solder paste dispenser 170' are also adjustable along the outer surface or circumference of the second carrier 120 in the longitudinal direction of the web material. This allows the respective positions of the connecting material dispenser 170 or the solder paste dispenser 170' to be adjusted due to different lengths of the electronic subassembly ANT in the longitudinal direction of the web material of the second carrier T.

[0183] A heater 220 is provided and set up on the inside of the outer surface of the second receptacle 120, in response to information signaled by the control ECU, to temper the second carrier T before, at, and / or after the storage location 140 from its side away from the first receptacle W.

[0184] Downstream of the storage location 140, an image capture device 190 is arranged at the second inlet 120 to detect component B after it has been placed on the electronic subassembly ANT and to signal this to the control unit (ECU) for determining the position and / or orientation of component B on the respective electronic subassembly ANT. 30A-168 959

[0185] In the depicted variant, three image acquisition devices 160, 180, 190 are aligned on the second carrier T such that the electronic subassembly ANT (without connecting material and without component), the portion of connecting material E on the electronic subassembly ANT, and the component B placed on the electronic subassembly ANT and the connecting material E are to be captured. The three image acquisition devices 160, 180, 190 each have first, second, and / or third adjustment devices 162, 182, 192 to adjust the three image acquisition devices 160, 180, 190 in one or more longitudinal or rotational directions X, Y, Z, red. Finally, the three image acquisition devices 160, 180, 190 each have a first, second, and / or third illumination device 164, 184, 194 to illuminate the respective image acquisition area.

[0186] The first image acquisition device 160, for detecting the position and orientation of the electronic subassembly ANT, is arranged upstream of the connecting material dispenser 170. The second image acquisition device 180, for detecting the position and orientation of the portion of connecting material on the electronic subassembly ANT, is arranged upstream of the disconnecting device 130. The third image acquisition device 190, for checking the transfer of the component to the electronic subassembly ANT, is arranged downstream of the disconnecting device 130.

[0187] In one variant, the image acquisition devices 160, 180, 190, 260 and their respective illumination devices 164, 184, 194, 264 are also adjustably mounted along the outer surface or circumference of the second carrier 120 in the longitudinal direction of the web material. This allows the positions of the image acquisition devices 160, 180, 190, 260 and their respective third illumination devices 164, 184, 194, 264 to be adjusted due to different lengths of the electronic subassembly ANT in the longitudinal direction of the web material of the second carrier T.

[0188] In the illustrated variant, the heater 220 is designed and configured to establish an electrical and mechanical connection when component B is placed on the second carrier T, in response to information signaled by the control unit (ECU). For this purpose, the electronic subassemblies ANT on the second carrier T are heated to a temperature at which the applied portion of the connecting material E and / or solder of the electronic subassemblies ANT is heated, at least in the area of ​​the exposed ends K (see Fig. 3) of the electronic subassemblies ANT. When component B is placed on the carrier, the contacts of component B are brought into contact with the exposed ends K of the electronic subassemblies ANT. 30A-168 959

[0189] In the variant illustrated here, a heater 220 is arranged in the cylindrical wall of the drum, which is designed to emit heat, particularly in the upstream and / or downstream area and / or along the transverse extent of the storage location 140, in response to information signaled by the control ECU.

[0190] The circular cylindrical wall of the drum of the second recording 120 has a curved contact surface with openings (not illustrated) to be connected to a vacuum source p. If the second support T is guided around the curved contact surface and the vacuum source p is connected to the openings, the vacuum forces the second support T into close contact with the curved contact surface.

[0191] An adjustment device 240 serves to set a distance D between the first recording 110 and the second recording 120 in response to information signaled by the control ECU.

[0192] An adjustment device 260 serves to set a position and / or orientation of the connecting material dispenser 170 relative to the electronic sub-assembly ANT on the second carrier T in response to information signaled by the control ECU.

[0193] The adjustment device 112a, 112b, 112c serves to adjust the alignment and positioning of the first receiving device 110 relative to the separating device 130 and / or to the storage location 140 in response to information signaled by the control ECU.

[0194] In the variant illustrated in Fig. 1, the separating device 130 has a needle 132 which, in response to information signaled to the separating device 130 by the control ECU, extends towards one of the electronic components B on the first carrier W in order to separate the respective component B from the first carrier W.

[0195] A method, which can be carried out, for example, with the device disclosed above, serves to transfer electronic components from a first carrier to a second carrier. The first carrier carries a plurality of individual components. The second carrier carries a plurality of electronic subassemblies, onto each of which one of the components from the first carrier is to be transferred. The method comprises the following steps:

[0196] Picking up the first carrier in or at a first receptacle; picking up the second carrier in or at a second receptacle; conveying the second carrier along its longitudinal extent in a conveying direction in or at a second receptacle. The first carrier (30A-168959) is picked up at or in the first receptacle such that the components it carries are oriented towards the second receptacle; separating one of the components from the first carrier, either by contact or without contact, to transfer the component to the second carrier at a storage location; conveying the second carrier in its orientation relative to the storage location such that an electronic subassembly on the second carrier reaches the storage location.Detecting the component's placement location on the electronic subassembly on the second carrier, upstream of the placement location, by means of a first image acquisition device and signaling the image acquisition to the control system to determine the position and / or orientation of the electronic subassembly on the second carrier; applying a portion of a bonding material to the electronic subassembly on the second carrier by means of a bonding material dispenser, downstream of the first image acquisition device; detecting the position and / or orientation of the bonding material portion on the electronic subassembly by means of a second image acquisition device, downstream of the bonding material dispenser, and signaling the image acquisition to the control system to determine the position and / or orientation of the bonding material portion.

[0197] The second carrier is fed with the portion of bonding material and the component is transferred to or onto a single second fixture. The bonding material dispenser and the separating device are arranged along the second fixture. The bonding material dispenser dispenses bonding material onto the second carrier in a controlled and measured portion, and the separating device separates a component from the first carrier and transfers it to the second carrier at the point where the bonding material had previously been applied. To adjust the positions and orientations of the first and second carriers relative to each other, as well as of the bonding material dispenser and the separating device, image feeds are transmitted to a controller before and after the bonding material dispenser and after the separating device along the second carrier.Based on these image intakes, the control system feeds corresponding adjustment devices for the first and second exposure, the separation device, the connecting material dispenser, and the devices for the image intakes.

[0198] Fig. 4 illustrates another device 100 for transferring electronic components B from a first carrier W to a second carrier T. Here too, the first carrier W carries a plurality of individual components B, which are detachable from the first carrier W. The second carrier T is designed as a quasi-endless carrier strip and carries a plurality of electronic subassemblies ANT in a single row or in several parallel rows along its length. The device serves to transfer one of the components B at a time from the first carrier W to one of the electronic subassemblies ANT.

[0199] The device 100 has a first receptacle 110 for receiving the first carrier W. This first carrier W is, for example, a wafer substrate on which the components B are located. Details are also shown in Fig. 2 and explained above. The device 100 has a second receptacle 120 for receiving the second carrier T along its longitudinal extent in a conveying direction. to promote. The first intake 110 is designed and set up to accommodate the first support W in such a way that the components B it supports are oriented towards the second intake 120.

[0200] The second intake 120 has a circular cylindrical shape. In response to information signaled by the control unit ECU, the second intake 120 is rotated by the first conveyor 150 in order to convey the second carrier T in its orientation relative to the storage location 150 without slippage, so that an electronic sub-assembly ANT on the second carrier T reaches the storage location 140.

[0201] In one variant, the second receptacle 120 has openings in a surface facing the second carrier T, which are connected to a vacuum source p. This allows the second carrier T to be brought into close contact with the surface of the second receptacle 120. In another variant, the second receptacle 120 has a heater 220 on its surface to temper the second carrier T before, at, and / or after the storage location 140 from its side furthest from the first receptacle W, in response to information signaled by the control ECU.

[0202] The device 100 has a bonding material dispenser 170, designed and configured to apply a portion of a bonding material E, S to the electronic subassembly ANT located on the second carrier T in response to information signaled by a control ECU, while the second carrier T is located on the second receptacle 120. As mentioned, the bonding material can be adhesive, solder paste, or flux.

[0203] An adjustment device 172 is provided for the connecting material dispenser 170 and is configured to manually and / or in response to information signaled by the control unit (ECU) adjust the position and / or orientation of the connecting material dispenser 170 relative to the electronic sub-assembly ANT on the second carrier T. 30A-168 959

[0204] In one variant, a conveying device 196 for the second carrier T is formed by two controlled-driven transport rollers, which are arranged on the upstream and downstream sides of the second receptacle 120, which in the present embodiment is drum-shaped, and around which the second carrier T is guided. In response to information signaled by the control unit (ECU), the second carrier T is conveyed around the second receptacle 120 by the two controlled-driven transport rollers.

[0205] On the downstream side of the connecting material dispenser 170, a separating device 130 is arranged on the circumference of the second receptacle 120 to separate one of the components B from the first carrier W, either by contact or without contact, in response to information signaled by a control ECU. In this process, component B is transferred at a storage location 140 to a corresponding electronic subassembly ANT located on the second carrier T.

[0206] The separating device 130 is designed and configured to emit a laser beam or actuate a needle 132 in the direction of one of the electronic components B on the first carrier W in order to separate one of the components B from the first carrier W in response to information signaled by the control ECU.

[0207] On the downstream side of the separating device 130, a first high-temperature thermomode device 310 is provided, comprising a temperature-controlled plunger 312, in order to move the temperature-controlled plunger 312 in response to information signaled by a control ECU in the direction of the second carrier T. The temperature-controlled plunger 312 applies pressure and / or temperature to the component B located on the electronic subassembly ANT in order to establish a stable electrical and / or mechanical connection between the electronic subassembly ANT and the component B located on it.

[0208] The processes of applying the portion of the connecting material E, S to the electronic subassembly ANT, placing component B onto the electronic subassembly ANT, and placing the placed component B onto the electronic subassembly ANT are precisely controlled and monitored in the device disclosed herein. For this purpose, a first, a second, and a third image acquisition device 160, 180, 190 are provided along the circumference of the second carrier 120.

[0209] The first device for image intake 160 serves to supply the upstream side to the

[0210] The connecting material dispenser 170 detects the respective electronic sub-assembly ANT on the second carrier T and signals the position and / or orientation of the 30A-168 959 electronic sub-assembly ANT on the second carrier T to the control unit. The control unit ECU is programmed to use an actuator 172 to position the connecting material dispenser 170 precisely upon arrival of the respective electronic sub-assembly ANT, ensuring the connecting material is dispensed onto the electronic sub-assembly ANT.

[0211] The second device for image acquisition 180 serves to detect the dispensed portion of the connecting material E, S on the electronic subassembly ANT on the downstream side of the connecting material dispenser 170 and to signal the position and / or orientation of the portion of a connecting material E, S on the electronic subassembly ANT to the control ECU.

[0212] The third device for image acquisition 190 serves to detect component B on the electronic sub-assembly ANT on the downstream side to the storage location 140 and to signal the position and / or orientation of component B on the respective electronic sub-assembly ANT to the control ECU.

[0213] A fourth device for image acquisition 350 serves to detect component B on the electronic subassembly ANT downstream of the first high-temperature thermode device 310 and to signal to the control ECU the position and / or orientation of component B fixed on the electronic subassembly ANT by means of the high-temperature thermode device 310.

[0214] For this purpose, the first, second, third and fourth image acquisition devices 160, 180, 190, 350 are aligned on the second carrier T in such a way that the electronic subassembly ANT, the portion of the connecting material E, S and the deposited component B can be captured in the respective situations.

[0215] The first, second, third, and fourth image feed units 160, 180, 190, and 350 each have a first, second, third, and fourth adjustment device 162, 182, 192, and 352, respectively. This allows the respective image feed unit 160, 180, 190, and 350 to be adjusted in one or more longitudinal or rotational directions X, Y, Z, and red. The first, second, third, and fourth image feed units 160, 180, 190, and 350 also each have a lighting device 164, 184, 194, and 354 for illuminating the respective image feed unit.

[0216] As illustrated in Fig. 4, one variant of the device 100 has a second high-temperature thermostatic device 320 comprising a stamp 322 to be tempered. This second high-temperature thermostatic device 320 is located downstream of the 30A-168 959

[0217] A separating device 130 and a downstream device 310 are arranged on the circumference of the second carrier 120. In response to information signaled by a control unit (ECU), the piston 322 to be tempered in this second high-temperature thermode device 320 can be moved towards the second carrier T to apply pressure and / or temperature to a component B placed on an electronic subassembly ANT. A fifth image acquisition device 380 is arranged downstream of the second high-temperature thermode device 320 on the circumference of the second carrier 120. This fifth image acquisition device 380 serves to detect component B on the electronic subassembly ANT and to signal the position and / or orientation of component B on the respective electronic subassembly ANT to the control unit (ECU). This fifth image acquisition device 380 has a fifth adjustment device 354.This allows the fifth image feed mechanism 350 to be adjusted in one or more longitudinal or rotational directions X, Y, Z, red. The fifth image feed mechanism 380 also has a fifth lighting device 384 for illuminating the respective image feed.

[0218] The control unit (ECU) is designed and configured to feed the components B located on the carrier T to the first and second high-temperature thermode devices 310 and 320 in a staggered manner, in order to then simultaneously subject them to pressure and / or temperature. For this purpose, the first and second high-temperature thermode devices 310 and 320 are arranged offset along the circumference of the second carrier 120 by the length of an electronic subassembly ANT in the conveying direction.

[0219] In one variant of the device 100, the control unit (ECU) is designed and configured to move the first and / or the second high-temperature thermode device 310, 320 and the second carrier T together in the conveying direction of the second carrier T. This allows the joining process of component B with the electronic sub-assembly ANT to take place over a longer period of time during the transport of the carrier material T via the second carrier 120, while the high-temperature thermode device 310, 320 acts on component B and the bonding material hardens.

[0220] The first intake is equipped with an adjustment device 112a, 112b, 112c, designed to manually and / or in response to information signaled by the control unit (ECU) adjust the alignment and positioning of the first intake 110 relative to the separating device 130 and / or the storage location 140. 30A-168 959

[0221] In the event that the device 100 is to feed a multi-row carrier material T with components B, the adjusting device 112a, 112b, 112c (see also Fig. 2) is provided and set up to adjust the first receiving 110 in its orientation and positioning according to information signaled by the control ECU in the conveying direction and transverse to the conveying direction -> of the second carrier T, and in the rotational orientation of the first receiving 110, in order to move the first carrier W so that one component B is to be placed on an electronic sub-assembly ANT of one of the several rows on the second carrier T.

[0222] For each of the multiple rows of electronic subassemblies ANT on the second carrier T, a first and / or a second high-temperature thermomode device 310, 320 is provided. Furthermore, the control ECU is designed and configured to actuate the first and / or the second high-temperature thermomode device 310, 320 of each row and the second carrier T in the conveying direction -> of the second carrier T simultaneously, in order to subject the components B to pressure and / or temperature at the same time.

[0223] The heater 220 is designed and configured to assist in establishing an electrical and / or mechanical connection when component B is placed on the second carrier T, in response to information signaled by the control unit (ECU). To this end, the heater 220 heats the electronic subassemblies ANT on the second carrier T to a temperature at which the applied portion of the connecting material E, S of the electronic subassemblies ANT is heated, at least in the area of ​​exposed ends of the electronic subassemblies ANT, and when component B is placed on the carrier, areas or contacts of component B are brought into contact with this material.

[0224] As illustrated in Fig. 4, an adjustment device 240 is provided on the first receptacle 110 and is configured to adjust a distance D between the first receptacle 110 and the second receptacle 120 manually and / or in response to information signaled by the control ECU.

[0225] On the downstream side of the fifth image acquisition device 380, an ionization device 412, 414 is provided, directed towards the top and bottom of the second carrier T, respectively. These two ionization devices 412, 414 are particularly necessary if the second carrier T is made of plastic.

[0226] A method for transferring electronic components B from a first carrier W to a second carrier T, for example with the device also described in connection with Fig. 4, wherein the first carrier W carries a plurality of individual components B from the first 30A-168 959

[0227] The following steps are involved in the process where the carrier W is detachably supported, and the second carrier T is designed as a quasi-endless carrier strip and carries a multitude of electronic subassemblies ANT in one or more rows along its longitudinal extension, to each of which one of the components is to be transferred from the first carrier W:

[0228] Capture of the first carrier W by a first capture 110;

[0229] Conveying the second beam T along its longitudinal extent in a conveying direction through a second receiving 120, wherein the first receiving 110 receives the first beam W in such a way that the components B carried by it are oriented towards the second receiving 120;

[0230] Applying a portion of a bonding material E, S to the electronic subassembly ANT located on the second carrier T by means of a bonding material dispenser 170 in response to information signaled by a control ECU, while the second carrier T is located on the second receptacle 120;

[0231] Separation of one of the components B from the first carrier W, either by contact or without contact, downstream of the connecting material dispenser 170, by means of a separation device 130, in response to information signaled by the control ECU; and transfer of the component B at a storage location 140 to a corresponding electronic subassembly ANT located on the second carrier T;

[0232] Moving a piston 312 to be tempered of a first high-temperature thermode device 310 relative to the second carrier T, downstream of the separating device 130, in response to information signaled by the control ECU, and applying pressure and / or temperature to the component B located on the electronic sub-assembly ANT.

[0233] In this process, a respective electronic subassembly ANT on the second carrier T can be detected by means of a first image acquisition device 160 upstream of the storage location 140 of component B, and the position and / or orientation of the electronic subassembly ANT on the second carrier T can be signaled to the control ECU.

[0234] In this process, the portion of the connecting material E, S on the electronic sub-assembly ANT can be detected by means of a second device for image acquisition 180 downstream of the connecting material dispenser 170, and the position and / or orientation of the portion of a connecting material E, S on the electronic sub-assembly ANT can be signaled to the control ECU.

[0235] In this case, component B on the electronic subassembly ANT can be detected by means of a third device for image acquisition 190 downstream of the storage location 140, and 30A-168 959

[0236] Signaling of the position and / or orientation of component B on the respective electronic sub-assembly ANT to the control unit ECU.

[0237] In this process, component B on the electronic sub-assembly ANT can be detected by means of a fourth image acquisition device 350 downstream of the first high-temperature thermode device 310, and the position and / or orientation of component B on the respective electronic sub-assembly ANT can be signaled to the control ECU.

[0238] In this process, the first, second, third and / or fourth image acquisition device 160, 180, 190, 350 can be aligned onto the second carrier T in such a way that the electronic subassembly ANT, the portion of the connecting material E, S and / or the deposited component B are captured.

[0239] In this case, the first, second, third and / or fourth image feed device 160, 180, 190, 350 can be adjusted by means of a respective first, second and / or third adjustment device 162, 182, 192, 352 in order to adjust the respective image feed device 160, 180, 190, 350 in one or more longitudinal or rotational directions X, Y, Z.

[0240] In this case, the respective image intake of the first, second, third and / or fourth device for image intake 160, 180, 190, 350 can be illuminated by means of a respective lighting device 164, 184, 194, 354.

[0241] In this process, a piston 322 of a second high-temperature thermode device 320 can be moved relative to the second carrier T, downstream of the separating device 130, in response to information signaled by the control ECU, and the component B located on the electronic sub-assembly ANT can be subjected to pressure and / or temperature.

[0242] In this process, component B on the electronic subassembly ANT can be detected by means of a fifth image acquisition device 380 downstream of the second high-temperature thermode device 320, and the image acquisition signal can be sent to the control ECU to determine the position and / or orientation of component B on the respective electronic subassembly ANT.

[0243] In this case, the first and second high-temperature thermode devices 310, 320 can be supplied staggered to the respective components located on the carrier T 30A-168 959

[0244] B, and then simultaneous application of pressure and / or temperature to these components B by the first and second high-temperature thermostatic devices 310, 320. In this process, the first and / or the second high-temperature thermostatic device 310, 320 and the second carrier T can be actuated together in the conveying direction -> of the second carrier T.

[0245] In the case of a multi-row carrier material T, the first receiving 110 can be adjusted in its orientation and positioning according to information signaled by the control ECU by means of an adjustment device 112a, 112b, 112c transverse to the conveying direction -> of the second carrier T, in order to move the first carrier W so that a component B is placed on an electronic sub-assembly ANT of one of the several rows on the second carrier T.

[0246] This involves providing a first and / or a second high-temperature thermode device 310, 320 for each of the several rows of the electronic subassemblies ANT on the second carrier T; and jointly actuating the first and / or the second high-temperature thermode device 310, 320 of each row and the second carrier T in the conveying direction -> of the second carrier T in order to subject the components B to pressure and / or temperature simultaneously.

[0247] In this process, several rows of components located on the carrier T can be treated by the first and / or second high-temperature thermode devices 310, 320, by positioning the high-temperature thermode devices 310, 320 transversely to the conveying direction. are movable to the respective rows.

[0248] Here, a distance D between the first recording 110 and the second recording 120 can be set manually and / or in response to information signaled by the control ECU using a first adjustment device 240.

[0249] In this process, the position and / or orientation of the connecting material dispenser 170 relative to the electronic sub-assembly ANT on the second carrier T can be adjusted manually and / or in response to information signaled by the control ECU using a second adjustment device 260.

[0250] Here, the alignment and positioning of the first recording device 110 relative to the separating device 130 and / or to the storage location 140 can be adjusted manually and / or in response to information signaled by the control ECU using a third adjustment device 112a, 112b, 112c.

Claims

30A-168 959 Patent claims 1. A device (100) for transferring electronic components (B) from a first carrier (W) to a second carrier (T), wherein the first carrier (W) detachably carries a plurality of individual components (B) from the first carrier (W), and the second carrier (T) is designed as a quasi-endless carrier belt and carries a plurality of electronic subassemblies (ANT) along its longitudinal extent, to each of which one of the components is to be transferred from the first carrier (W), and wherein the device (100) comprises: - a first intake (110), designed and equipped to receive the first carrier (W); - a second receiving (120), designed and equipped to convey the second beam (T) along its longitudinal extent in a conveying direction (), wherein the first receiving (110) is designed and equipped to receive the first beam in such a way that the components (B) it carries are oriented towards the second receiving (120); - a separating device (130) designed and configured to separate one of the components (B) from the first carrier (W) by contact or without contact in response to information signaled by a control unit (ECU) in order to transfer the component (B) to the second carrier (T) in a storage location (140); - a first conveying device (150), designed and equipped to convey the second carrier (T) in its orientation relative to the storage location (140) in response to information signaled by the control unit (ECU) in such a way that an electronic subassembly (ANT) on the second carrier (T) reaches the storage location (140); - a first image acquisition device (160), designed and configured to detect a respective electronic subassembly (ANT) on the second carrier (T) on the upstream side to the storage location (140) of the component (B) and to signal to the control (ECU) to determine the position and / or orientation of the electronic subassembly (ANT) on the second carrier (T); - a connecting material dispenser (170), designed and configured to apply a portion of a connecting material (E, S) to the electronic subassembly (ANT) on the second carrier (T) on the downstream side of the first image acquisition device (160); and - a second image acquisition device (180), designed and equipped to detect the portion of a connecting material (E, S) on the electronic subassembly (ANT) on the downstream side of the connecting material dispenser (170) and to signal to the control unit (ECU) to determine the position and / or orientation of the portion of a connecting material (E, S) on the electronic subassembly (ANT). 30A-168 959 2. The device (100) according to claim 1, wherein the second receptacle (120) - has a cylindrical shape; and / or - in response to information signaled by the control unit (ECU), the first conveying device (150) rotates the second carrier (T) in its orientation relative to the depositing point (140) so that an electronic subassembly (ANT) on the second carrier (T) reaches the depositing point (140); and / or - has openings in a surface of the second receptacle (120) facing the second support (T) that are to be connected to a vacuum source (p--), and is designed and equipped to bring the second support (T) into close contact with the surface of the second receptacle (120); and / or - a heater (220) is provided on the outer surface of the second receptacle (120), designed and equipped to temper the second carrier (T) before, at, and / or after the storage location (140) from its side away from the first receptacle (110) in response to information signaled by the control unit (ECU).

3. The device (100) according to claim 1 or 2, comprising - a third image acquisition device (190), designed and configured to detect the component (B) on the electronic subassembly (ANT) on the downstream side of the storage location (140) and to signal to the control unit (ECU) to determine the position and / or orientation of the component (B) on the respective electronic subassembly (ANT); wherein - the first, second and / or third image acquisition device (160, 180, 190) are aligned on the second carrier (T) such that the electronic subassembly (ANT), the portion of the connecting material (E, S), and / or the deposited component (B) are captured; and / or - the first, second and / or third image feed device (160, 180, 190) each have a first, second and / or third adjustment device (162, 182, 192) to adjust the first, second and / or third image feed device (160, 180, 190) in one or more longitudinal or rotational directions (X, Y, Z, rot); and / or - the first, second and / or third image intake device (160, 180, 190) shall each have a first, second and / or third lighting device (164, 184, 194) for illuminating the respective image intake.

4. The device (100) according to claim 1 or 2, wherein - the first device for image intake (160) is arranged upstream of the connecting material dispenser (170); - the second image intake device (180) is arranged upstream of the separating device (130); and / or 30A-168 959 - the third device for image intake (190) is arranged downstream of the separating device (130).

5. The device (100) according to claim 2, 3 or 4, wherein - the heater (220) is designed and equipped to establish an electrical and mechanical connection when the component (B) is placed on the second carrier (T) in response to information signaled by the control unit (ECU), by heating the electronic subassemblies (ANT) on the second carrier (T) to a temperature at which the applied portion of the connecting material (E, S) and / or the solder of the electronic subassemblies (ANT) is heated at least in the area of ​​exposed ends of the electronic subassemblies (ANT), and when the component (B) is placed, areas or contacts of the component (B) are brought into contact with it.

6. The device (100) according to any one of claims 1 to 5, wherein - a first adjustment device (240) is provided and configured to set a distance (D) between the first receiver (110) and the second receiver (120) in response to information signaled by the control unit (ECU); and / or - a second adjustment device (260) is provided and configured to adjust the position and / or orientation of the connecting material dispenser (170) relative to the electronic subassembly (ANT) on the second carrier (T) in response to information signaled by the control unit (ECU); and / or - a third adjustment device (112a, 112b, 112c) is provided and set up to adjust the alignment and positioning of the first receiving device (110) relative to the separating device (130) and / or the storage location (140) in response to information signaled by the control unit (ECU).

7. The device (100) according to any one of claims 1 to 6, wherein - the separation device (130) is provided and configured to emit a laser beam or actuate a needle (132) in the direction of one of the electronic components (B) on the first carrier (W) in order to separate one of the components (B) from the first carrier (W) in response to information signaled by the control unit (ECU).

8. The device according to any one of claims 1 to 7, wherein - in the area on the upstream and / or downstream side of the storage point (140) at least one hold-down device is provided and installed to subject the second support in the area of ​​the storage point (140) to a negative pressure (p-). 30A-168 959 9. A method for transferring electronic components from a first carrier (W) to a second carrier (T), wherein the first carrier (W) carries a plurality of individual components (B), and the second carrier (T) carries a plurality of electronic subassemblies (ANT), onto each of which one of the components (B) is to be transferred from the first carrier (W); and wherein the method comprises: Receiving the first carrier (W) in or on a first recording; Receiving the second carrier (T) in or on a second recording; Conveying the second beam (T) along its longitudinal extent in a conveying direction () into or at a second receiving, wherein the first beam (T) is received at the first receiving such that the components (B) it carries are oriented towards the second receiving; Detaching one of the components (B) from the first support (W) by touching or without touching, in order to transfer the component (B) to a storage location on the second support (T); Promoting the second carrier (T) in its orientation relative to the drop-off point such that an electronic subassembly (ANT) on the second carrier (T) reaches the drop-off point; Capturing the electronic subassembly (ANT) on the second carrier upstream of the storage location by means of a first image acquisition device and signaling the image acquisition to the control unit (ECU) to determine the position and / or orientation of the electronic subassembly (ANT) on the second carrier (T); Applying a portion of a bonding material (E, S) to the electronic subassembly (ANT) on the second carrier (T) by means of a bonding material dispenser, downstream of the first image acquisition device; Detecting the position and / or orientation of the portion of a connecting material (E, S) on the electronic subassembly (ANT) by means of a second image acquisition device downstream of the connecting material dispenser and signaling the image acquisition to the control unit (ECU) to determine the position and / or orientation of the portion of a connecting material (E, S).

10. The method according to claim 9, wherein the second carrier (T) is conveyed to or onto a single second receiving for loading with the portion of the bonding material (E, S) and for transferring the component (B); and / or the bonding material dispenser and the separating device are arranged distributed along the second receiving and the bonding material dispenser dispenses bonding material (E, S) onto the second carrier in a controlled and portioned manner; and / or the separating device separates a component (B) from the first carrier (W) in a controlled manner. 30A-168959 component is transferred to the second carrier at the location with the previously applied bonding material (E, S); and / or for adjusting the positions and orientations of the first (W) and the second carrier (T) relative to each other, as well as the bonding material dispenser and the separating device, image acquisitions are transmitted to a control unit (ECU) before and after the bonding material dispenser, and after the separating device along the second carrier, and the control unit (ECU) feeds corresponding adjustment devices of the first and / or the second camera and / or the separating device, and / or the bonding material dispenser and / or the devices for the image acquisitions based on these image acquisitions.

11. A device (100) for transferring electronic components (B) from a first carrier (W) to a second carrier (T), wherein the first carrier (W) detachably carries a plurality of individual components (B) from the first carrier (W), and the second carrier (T) is designed as a quasi-endless carrier strip and carries in its longitudinal extension in one or more rows a plurality of electronic subassemblies (ANT), to each of which one of the components is to be transferred from the first carrier (W), and wherein the device (100) comprises: - a first intake (110), designed and equipped to receive the first carrier (W); - a second receiving (120), designed and equipped to convey the second beam (T) along its longitudinal extent in a conveying direction (-->), wherein the first receiving (110) is designed and equipped to receive the first beam (W) in such a way that the components (B) it carries are oriented towards the second receiving (120); - a connecting material dispenser (170) designed and configured to apply a portion of a connecting material (E, S) to the electronic subassembly (ANT) located on the second carrier (T) in response to information signaled by a control unit (ECU), while the second carrier (T) is located on the second receptacle (120); - a disconnecting device (130), designed and configured to disconnect one of the components (B) from the first carrier (W) on the downstream side to the connecting material dispenser (170) in response to information signaled by a control unit (ECU), either by touching or without contact, in order to transfer the component (B) at a storage location (140) to a corresponding electronic subassembly (ANT) located on the second carrier (T); - a first high-temperature thermode device (310) comprising a stamp (312) to be tempered, designed and configured to, on the downstream side to the separating device (130), in response to information signaled by a control unit (ECU), to temper the stamp (312) to be tempered and the second carrier (T) relative to each other 30A-168 959 move and thereby subject the component (B) located on the electronic subassembly (ANT) to pressure and / or temperature.

12. The device (100) according to claim 11, comprising - a first image acquisition device (160), designed and configured to detect a respective electronic subassembly (ANT) on the second carrier (T) on the upstream side of the connecting material dispenser (170) and to signal the position and / or orientation of the electronic subassembly (ANT) on the second carrier (T) to the control unit (ECU); and / or - a second image acquisition device (180), designed and configured to detect the portion of the connecting material (E, S) on the electronic subassembly (ANT) on the downstream side of the connecting material dispenser (170) and to signal the position and / or orientation of the portion of a connecting material (E, S) on the electronic subassembly (ANT) to the control unit (ECU); and / or - a third image acquisition device (190), designed and configured to detect the component (B) on the electronic subassembly (ANT) on the downstream side of the storage location (140) and to signal the position and / or orientation of the component (B) on the respective electronic subassembly (ANT) to the control unit (ECU); wherein - a fourth image acquisition device (350), designed and configured to detect the component (B) on the electronic subassembly (ANT) downstream of the first high-temperature thermode device (310) and to signal the position and / or orientation of the component (B) on the respective electronic subassembly (ANT) to the control unit (ECU); wherein - the first, second, third and / or fourth image acquisition devices (160, 180, 190, 350) are aligned on the second carrier (T) such that the electronic subassembly (ANT), the portion of the connecting material (E, S) and / or the deposited component (B) are captured; and / or - the first, second, third and / or fourth image feed device (160, 180, 190, 350) each have a first, second, third and / or fourth adjustment device (162, 182, 192, 352) to adjust the respective image feed device (160, 180, 190, 350) in one or more longitudinal or rotational directions (X, Y, Z, rot); and / or - the first, second, third and / or fourth image intake device (160, 180, 190, 350) shall each have a lighting device (164, 184, 194, 354) for illuminating the respective image intake.

13. The device (100) according to claim 11 or 12, wherein - the control unit (ECU) is designed and set up to connect the components located on the carrier (T) of the first and second high-temperature thermode device (320). 30A-168 959 (B) to supply them staggered each time, and then subject them simultaneously to pressure and / or temperature; and / or - the control unit (ECU) is designed and configured to jointly actuate the first and / or the second high-temperature thermomode device (310, 320) and the second carrier (T) in the conveying direction (->) of the second carrier (T).

14. The device (100) according to any one of claims 11 to 13, wherein - in the case of a multi-row carrier material (T), a third adjustment device (112a, 112b, 112c) is provided and configured to adjust the first fixture (110) in its orientation and positioning according to information signaled by the control unit (ECU) perpendicular to the conveying direction (->) of the second carrier (T), in order to move the first carrier (W) so that a component (B) is placed on an electronic subassembly (ANT) of one of the multiple rows on the second carrier (T); and / or - for each of the several rows of electronic subassemblies (ANT) on the second carrier (T), a first and / or a second high-temperature thermomode device (310, 320) is provided; and / or - the image acquisition devices on the upstream and downstream sides of the high-temperature thermode devices are designed and configured to detect the components (B) on several rows of electronic subassemblies (ANT) on the second carrier (T) and to signal to the control unit (ECU) to determine the position and / or orientation of the component (B) on the respective electronic subassembly (ANT); or - a high-temperature thermomode device (310, 320) is provided to be movable transversely to the conveying direction (->) for several rows of the electronic subassemblies (ANT) on the second carrier (T), and - the control unit (ECU) is designed and configured to actuate the first and / or the second high-temperature thermode device (310, 320) of each row and the second carrier (T) in the conveying direction (-->) of the second carrier (T) together in order to apply pressure and / or temperature to the components (B) simultaneously.

15. The device (100) according to one of claims 11 to 14, wherein the second receptacle (120) - has a cylindrical shape; and / or - in response to information signaled by the control unit (ECU), the first conveying device (150) rotates the second carrier (T) in its orientation relative to the depositing point (150) so that an electronic subassembly (ANT) on the second carrier (T) reaches the depositing point (140); and / or - has openings to be connected to a vacuum source (p--) in a surface of the second receptacle (120) facing the second support (T), provided for this purpose and 30A-168 959 set up to bring the second support (T) into a close fit to the outer surface of the second receptacle (120); and / or - a heater (220) on the outer surface of the second receptacle (120) is provided and set up to temper the second carrier (T) before, at, and / or after the storage location (140) from its side away from the first receptacle (W) in response to information signaled by the control unit (ECU).

16. The device (100) according to claim 15, wherein - the heater (220) is designed and configured to establish an electrical and mechanical connection when the component (B) is placed on the second carrier (T) in response to information signaled by the control unit (ECU), by heating the electronic subassemblies (ANT) on the second carrier (T) to a temperature at which the applied portion of the connecting material (E, S) of the electronic subassemblies (ANT) is heated at least in the area of ​​exposed ends of the electronic subassemblies (ANT), and when the component (B) is placed, areas or contacts of the component (B) are brought into contact with it.

17. The device (100) according to any one of claims 11 to 16, wherein - a first adjustment device (240) is provided and configured to manually and / or in response to information signaled by the control unit (ECU) adjust a distance (D) between the first receiver (110) and the second receiver (120); and / or - a second adjustment device is provided and set up to manually and / or in response to information signaled by the control unit (ECU) adjust the position and / or orientation of the connecting material dispenser (170) relative to the electronic sub-assembly (ANT) on the second carrier (T); and / or - a third adjustment device (112a, 112b, 112c) is provided and configured to manually and / or in response to information signaled by the control unit (ECU) adjust the alignment and positioning of the first receiving device (110) relative to the separating device (130) and / or the storage location (140); and / or - the connecting material dispenser, the first intake and the high-temperature thermode(s) adjustment devices, or are adjustable relative to each other by means of an adjustment device along a track on which the subassemblies (ANT) are conveyed.

18. The device (100) according to any one of claims 11 to 17, wherein - the separation device (130) is provided and configured to emit a laser beam towards one of the electronic components (B) on the first carrier (W) or 30A-168 959 to actuate a needle (132) in order to detach one of the components (B) from the first carrier (W) in response to information signaled by the control unit (ECU); and / or - in the area on the upstream and / or downstream side of the storage point (140) at least one hold-down device is provided and installed to subject the second support in the area of ​​the storage point (140) to a negative pressure (p-).

19. A method for transferring electronic components (B) from a first carrier (W) to a second carrier (T), wherein the first carrier (W) detachably carries a plurality of individual components (B) from the first carrier (W), and the second carrier (T) is designed as a quasi-endless carrier strip and carries in its longitudinal extent in one or more rows a plurality of electronic subassemblies (ANT), to each of which one of the components is to be transferred from the first carrier (W), comprising the steps: - Capture of the first carrier (W) by a first capture (110); - Conveying the second beam (T) along its longitudinal extent in a conveying direction (- ->) through a second receiving (120), wherein the first receiving (110) receives the first beam (W) in such a way that the components (B) it carries are oriented towards the second receiving (120); - Applying a portion of a bonding material (E, S) to the electronic subassembly (ANT) located on the second carrier (T) by means of a bonding material dispenser (170) in response to information signaled by a control unit (ECU) while the second carrier (T) is located on the second receptacle (120); - Separating one of the components (B) from the first carrier (W) by contact or without contact downstream to the connecting material dispenser (170) by means of a separation device (130), in response to information signaled by the control unit (ECU); and transferring the component (B) at a storage location (140) to a corresponding electronic subassembly (ANT) located on the second carrier (T); - Moving a piston (312) to be tempered of a first high-temperature thermode device (310) relative to the second carrier (T), downstream of the separating device (130), in response to information signaled by the control unit (ECU), and applying pressure and / or temperature to the component (B) located on the electronic subassembly (ANT).

20. The method according to claim 19, comprising the steps - Capturing a respective electronic subassembly (ANT) on the second carrier (T) by means of a first image acquisition device (160) upstream of the storage location (140) of the component (B), and signaling the position and / or orientation of the electronic subassembly (ANT) on the second carrier (T) to the control unit (ECU); and / or 30A-168 959 - Detecting the portion of the connecting material (E, S) on the electronic subassembly (ANT) by means of a second image acquisition device (180) downstream of the connecting material dispenser (170), and signaling the position and / or orientation of the portion of connecting material (E, S) on the electronic subassembly (ANT) to the control unit (ECU); and / or - Detection of the component (B) on the electronic subassembly (ANT) by means of a third image acquisition device (190) downstream of the storage location (140), and signaling the position and / or orientation of the component (B) on the respective electronic subassembly (ANT) to the control unit (ECU); and / or - Detection of the component (B) on the electronic subassembly (ANT) by means of a fourth image acquisition device (350) downstream of the first high-temperature thermode device (310), and signaling the position and / or orientation of the component (B) on the respective electronic subassembly (ANT) to the control unit (ECU); and / or - Aligning the first, second, third and / or fourth image acquisition device (160, 180, 190, 350) onto the second carrier (T) such that the electronic subassembly (ANT), the portion of the connecting material (E, S) and / or the deposited component (B) are captured; and / or - Adjusting the first, second, third and / or fourth image feed device (160, 180, 190, 350) by means of a respective first, second and / or third adjustment device (162, 182, 192, 352) in order to adjust the respective image feed device (160, 180, 190, 350) in one or more longitudinal or rotational directions (X, Y, Z, rot); and / or - Illuminating the respective image intake of the first, second, third and / or fourth image intake device (160, 180, 190, 350) by means of a respective lighting device (164, 184, 194, 354).

21. The method according to one of claims 19 to 20, comprising the steps - staggered supply of the first and second high-temperature thermomode devices (310, 320) to the respective components (B) located on the carrier (T), and then simultaneous application of pressure and / or temperature to these components (B) by the first and second high-temperature thermomode devices (310, 320); and / or - joint activation of the first and / or the second high-temperature thermode device (310, 320) and the second carrier (T) in the conveying direction (->) of the second carrier (T).

22. The method according to any one of claims 19 to 21, comprising the steps - in the case of a multi-row carrier material (T), adjusting the first recording (110) in its orientation and positioning according to information signaled by the control unit (ECU). 30A-168 959 by means of a third adjusting device (112a, 112b, 112c) transverse to the conveying direction (->) of the second carrier (T) in order to move the first carrier (W) so that a component (B) is to be placed on an electronic subassembly (ANT) of one of the several rows on the second carrier (T); and / or - Providing a first and / or a second high-temperature thermomode device (310, 320) for each of the multiple rows of electronic subassemblies (ANT) on the second carrier (T); or - Provision of a high-temperature thermomode device (310, 320) movable transversely to the conveying direction (->) for several rows of the electronic subassemblies (ANT) on the second carrier (T), and - jointly actuating the first and / or the second high-temperature thermode device (310, 320) of each row and the second carrier (T) in the conveying direction (->) of the second carrier (T) in order to subject the components (B) to pressure and / or temperature simultaneously.

23. The method according to any one of claims 19 to 22, comprising the steps - Setting a distance (D) between the first recording (110) and the second recording (120) by means of a first adjustment device (240) manually and / or in response to information signaled by the control unit (ECU); and / or - Setting a position and / or orientation of the connecting material dispenser (170) relative to the electronic subassembly (ANT) on the second carrier (T) by means of a second adjustment device (260) manually and / or in response to information signaled by the control unit (ECU); and / or - Adjusting the alignment and positioning of the first intake (110) relative to the separating device (130) and / or the storage location (140) by means of a third adjustment device (112a, 112b, 112c) manually and / or in response to information signaled by the control unit (ECU); and / or - Adjusting the bonding material dispenser, the first intake and the high-temperature thermode(s) relative to each other along a path on which the subassemblies (ANT) are conveyed.

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