Light-emitting device and method for manufacturing same

Abstract

The present invention improves reliability when soldering a light-emitting element onto a conductive member. This light-emitting device 100 comprises: a conductive member 20 that includes a first conductive member 21 and a second conductive member 22; a light-emitting element 10 comprising a semiconductor laminate 11 and an electrode 12 that includes a first electrode 12a and a second electrode 12b that are disposed on a lower surface of the semiconductor laminate 11; and a bonding member 30 that includes a first bonding member 31 that is disposed between the first conductive member 21 and the first electrode 12a and includes a plurality of first solders 33 that are spaced away from each other, and a second bonding member 32 that is disposed between the second conductive member 22 and the second electrode 12b and includes a plurality of second solders 34 that are spaced away from each other.

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