Induction heating cooking apparatus

Abstract

Disclosed is an induction heating cooking apparatus having a top plate, a substrate, and a cooling device. The substrate has a heating coil and is disposed below the top plate with a first gap. The cooling device cools the substrate. The cooling device comprises: a first flow path formed by the first gap between the substrate and the top plate; a blowing fan disposed below the substrate; and an air guide duct having a first air guide path for guiding air discharged from the blowing fan to the first flow path.

Description

Induction heating cooker

[0001] The present disclosure relates to an induction heating cooker.

[0002] In an induction heating cooker, a substrate (printed circuit board) with a heating coil mounted thereon can be arranged below the top plate so that approximately the entire surface of the top plate becomes the heating area. In this type of induction heating cooker, because the heat resistance of the substrate is low, heat from a cooking appliance, such as a pot, is transferred to the substrate through the top plate, and the substrate may be damaged.

[0003] According to U.S. Patent Publication No. 2020 / 0154598, a blower fan is placed parallel to the substrate on the same plane as the substrate, and the substrate is cooled by supplying air from the blower fan into the gap formed between the substrate and the top plate.

[0004] An induction heating cooker according to one aspect of the present disclosure may comprise a top plate, a substrate, and a cooling mechanism. The substrate is provided with a heating coil and is disposed below the top plate with a first gap. The cooling mechanism cools the substrate. The cooling mechanism includes a first air passage formed by the first gap between the substrate and the top plate, a blower fan disposed below the substrate, and a first air passage duct having a first air passage that guides air discharged from the blower fan into the first air passage.

[0005] FIG. 1 is a schematic exploded perspective view of an induction heating cooker according to one embodiment of the present disclosure.

[0006] FIG. 2 is a schematic perspective view of one embodiment of the induction heating cooker shown in FIG. 1.

[0007] FIG. 3 is a schematic rear view of one embodiment of the induction heating cooker shown in FIG. 1.

[0008] Figure 4 is a schematic plan view of the induction heating cooker shown in Figure 1.

[0009] Figure 5 is a cross-sectional view of AA of Figure 1.

[0010] Figure 6 is a cross-sectional view of BB in Figure 1.

[0011] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0012] In relation to the description of the drawings, similar reference numerals may be used for similar or related components.

[0013] The singular form of the noun corresponding to the item may include one or multiple items, unless the relevant context clearly indicates otherwise.

[0014] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0015] For example, the phrase “at least one of A, B, and C” may include one of A, B, C, A and B, A and C, B and C, and A and B and C.

[0016] The term "and / or" includes a combination of multiple related described components or any of the multiple related described components.

[0017] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in other aspects (e.g., importance or order).

[0018] Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0019] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this document, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0020] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.

[0021] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.

[0022] In an induction heating cooker, when a blower fan is placed parallel to the substrate to cool the substrate, installation space is required next to the substrate to install the blower fan. Consequently, the heating area may be reduced by the amount of installation space for the blower fan. The present disclosure aims to provide an induction heating cooker capable of cooling a substrate without reducing the heating area as much as possible. However, the technical problems to be solved by the present disclosure are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0023] Hereinafter, embodiments of an induction heating cooker according to the present disclosure will be described with reference to the attached drawings.

[0024] FIG. 1 is a schematic exploded perspective view of an induction heating cooker (100) according to one embodiment of the present disclosure. FIG. 2 is a schematic plan perspective view of the induction heating cooker (100) shown in FIG. 1. FIG. 3 is a schematic rear perspective view of the induction heating cooker (100) shown in FIG. 1. FIG. 4 is a schematic plan view of the induction heating cooker (100) shown in FIG. 1. In FIG. 4, the top plate (20) is omitted.

[0025] Referring to FIGS. 1 to 3, an induction heating cooker (100) may comprise a case (10) with an open top surface, a top plate (20) that blocks the opening of the case (10), one or more substrates (30) disposed below the top plate (20), one or more magnetic flux blocking plates (40) disposed below the substrate (30), and a circuit component (50) disposed below the magnetic flux blocking plate (40). The substrate (30), the magnetic flux blocking plate (40), and the circuit component (50) are accommodated within the case (10).

[0026] In the following, the side of the case (10) facing the user (e.g., cook) is called the front side (S1), the side facing the opposite side is called the back side (S2), and the side facing downward is called the bottom side (S3).

[0027] The induction heating cooker (100) may further be provided with first and second support trays (T1) (T2). The first and second support trays (T1) (T2) are installed within the case (10). The first support tray (T1) accommodates a substrate (30) and a magnetic flux blocking plate (40) and supports them within the case (10). The second support tray (T2) accommodates a circuit component (50) and supports it within the case (10).

[0028] The top plate (20) forms the uppermost surface of the induction heating cooker (100). For example, the top plate (20) may be rectangular in shape, but is not limited thereto. For example, the top plate (20) may be circular. In this embodiment, a portion of the top plate (20) is set as an operating area, and an operating device (C) is positioned below the operating area. The operating device (C) may include, for example, a touch panel display.

[0029] The substrate (30) may be a so-called PCB (printed circuit board). One or more substrates (30) are placed under the top plate (20). One or more substrates (30) are placed under the top plate (20) in an area excluding the operation area. The area where one or more substrates (30) are placed becomes a heating area. The substrates (30) are placed with a gap (Fig. 5: G1) between them and the top plate (20).

[0030] In this embodiment, a plurality of, for example, three substrates (30) are arranged. However, this is not limited thereto, and the three substrates (30) may be a single integrated substrate. The three substrates (30) may be accommodated in different first support trays (T1). For example, in this embodiment, three substrates (30) are accommodated in three first support trays (T1).

[0031] A heating coil not shown is mounted on the substrate (30). For example, a plurality of heating coils are aligned and embedded in the substrate (30). The heating coil may include a plurality of thin-plate coils stacked with a gap. The plurality of heating coils may be aligned so as not to overlap each other, or the plurality of heating coils may be aligned so as to partially overlap each other.

[0032] The magnetic flux blocking plate (40) blocks the magnetic flux of the heating coil. The magnetic flux blocking plate (40) may include, for example, a ferrite core. The magnetic flux blocking plate (40) is positioned opposite the substrate (30). In this embodiment, the magnetic flux blocking plate (40) is positioned on the bottom of the first support tray (T1), and the substrate (30) is installed thereon with a gap (Fig. 5: G2).

[0033] A circuit component (Fig. 6: 50) is a component assembled into a circuit necessary to operate an induction heating cooker (100). The circuit component (50) may include, for example, at least one of an inverter circuit component and a resonant circuit component. Since the inverter circuit component and the resonant circuit component generate heat during operation, they are equipped with a heat sink. In this embodiment, the circuit component (50) is mounted on a substrate (not shown) placed on the bottom of a second support tray (T2).

[0034] FIG. 5 is a cross-sectional view AA of FIG. 4. FIG. 6 is a cross-sectional view BB of FIG. 4. Referring to FIG. 5 and FIG. 6, the induction heating cooker (100) of the present embodiment further comprises a cooling mechanism (60) for cooling a substrate (30). The cooling mechanism (60) may comprise a first flow path (L1), which is a first gap (G1) between the top plate (20) and the substrate (30), a second flow path (L2), which is a gap between the substrate (30) and the magnetic flux blocking plate (40), a blower fan (70) placed below the magnetic flux blocking plate (40), and a blower duct (80) that guides air discharged from the blower fan (70) into the first flow path (L1) and the second flow path (L2). In the present embodiment, a cooling mechanism (60) is installed for each substrate (30). In other words, three cooling mechanisms (60) corresponding to each of the three substrates (30) are provided.

[0035] When comparing the first gap (G1) constituting the first flow path (L1) with the second gap (G2) constituting the second flow path (L2), the first gap (G1) is wider than the second gap (G2). That is, the area of ​​the cross-section cut in a direction perpendicular to the flow direction of the first flow path (L1) is larger than that of the second flow path (L2). Therefore, the air flow rate passing through the first flow path (L1) is greater than the air flow rate passing through the second flow path (L2).

[0036] The blower fan (70) may be, for example, a Sirocco fan. The blower fan (70) may be equipped with a rotation axis extending in a direction perpendicular to the substrate (30) and a blade (71) that rotates around the rotation axis. The blower fan (70) draws in air from an intake port (11) formed on the back surface (S2) of the case (10) and sends it to the air duct (80).

[0037] The air duct (80) extends from below the substrate (30) through between the edge of the substrate (30) and the inner surface of the case (10) to above the substrate (30). For example, referring to FIGS. 1, 5, and 6, the air duct (80) may have a tubular first air passage (81) extending along the edge of the substrate (30) (e.g., adjacent to the back surface (S2) of the case (10). In this embodiment, the first air passage (81) is arranged parallel to the substrate (30) in a transverse direction. More specifically, the first air passage (81) is interposed between the substrate (30) and the back surface (S2) of the case (10). On the wall facing the top plate (20) of the first air passage (81), one or more outlets (81a) are provided, formed intermittently or continuously along the extension direction of the first air passage (81). In other words, "the outlet (81a) is formed intermittently" means that a plurality of outlets (81a) are spaced apart along the extension direction of the first air passage (81). "The outlet (81a) is formed continuously" means that a single outlet (81a) is formed long along the extension direction of the first air passage (81). The first air passage (81) is equipped with an inlet (81b) into which air discharged from the blower fan (70) is introduced. The air introduced through the inlet (81b) is discharged into the first flow path (L1) and the second flow path (L2) through the outlet (81a). That is, the air passage duct (80) guides the air discharged from the blower fan (70) to be supplied from below the substrate (30), through the side of the substrate (30), and to the top of the substrate (30).

[0038] As shown in FIGS. 1 and 4, the first air passage (81) has a shape in which the cross-sectional area of ​​the opening portion (flow path cross-sectional area) when cut in a direction perpendicular to its extension direction gradually decreases as it moves away from the inlet port (81b). Accordingly, the pressure of the air flowing along the first air passage (81) can be approximately uniform along the extension direction of the first air passage (81). Therefore, the flow rate of air discharged from the outlet port (81a) can be approximately uniform along the extension direction of the first air passage (81).

[0039] Additionally, the cooling mechanism (60) may have a structure capable of cooling the circuit component (50). Referring to FIG. 6, the cooling mechanism (60) may further have a third flow path (L3) formed along at least a portion of the circuit component (50). The air duct (80) may be formed to further guide air discharged from the blower fan (70) into the third flow path (L3).

[0040] In one embodiment, the third flow path (L3) may be formed by a tunnel duct (90) that covers the heat sink of the inverter circuit component. In this embodiment, the tunnel duct (90) is installed on the bottom of the second support tray (T2). Air passing through the third flow path (L3) may pass between two adjacent fins of the heat sink.

[0041] The air duct (80) is provided with a second air duct (82) that guides air discharged from the blower fan (70) to a third air path (L3), separately from the first air duct (81). Accordingly, the air discharged from the blower fan (70) is classified into the first air duct (81) and the second air duct (82). In order to ensure that more air is preferentially introduced into the first air duct (81) than into the second air duct (82), the cross-sectional area of ​​the inlet (81b) of the first air duct (81) facing the blower fan (70) is larger than the cross-sectional area of ​​the inlet of the second air duct (82) facing the blower fan (70).

[0042] The cooling mechanism (60) may be equipped with a first exhaust duct (91) that exhausts air heated to a high temperature by passing through the first flow path (L1) and the second flow path (L2) to the outside of the case (10), and a second exhaust duct (92) that exhausts air heated to a high temperature by passing through the third flow path (L3) to the outside of the case (10). In one embodiment, the first and second exhaust ducts (91, 92) may be connected to one or more, for example, a plurality of exhaust ports (12) formed on the bottom surface (S3) of the case (10). Accordingly, air passing through the first, second, and third flow paths (L1, L2, L3) is exhausted below the case (10). In this embodiment, all of the plurality of exhaust ports (12) are formed on the bottom surface (S3) of the case (10), but are not limited thereto. Some or all of the plurality of exhaust ports (12) may be formed on the front surface (S1) of the case (10). The intake port (11) and the exhaust port (12) may be formed on different surfaces (surfaces facing different directions) among the surfaces of the case (10). For example, the intake port (11) may be provided on the first surface of the case (10), and the exhaust port (12) may be provided on the second surface facing a direction different from the first surface. In this embodiment, the intake port (11) is formed on the back surface (S2) of the case (10), and the exhaust port (12) is formed on the bottom surface (S3) of the case (10). With such a configuration, it is possible to prevent the air exhausted from the exhaust port (12) from being drawn in and circulated through the intake port (11) as is.

[0043] One end of the first exhaust duct (91) is connected to the first support tray (T1) and the other end is connected to the exhaust port (12). For example, an opening is formed at the bottom of the first support tray (T1) to discharge air flowing through the first flow path (L1) and the second flow path (L2), and one end of the first exhaust duct (91) is connected to this opening.

[0044] An operating device (C) may be installed on the front side of the central substrate (30) among the three substrates (30). A first exhaust duct (91) connected to the opening of the first support tray (T1) supporting the central substrate (30) passes below the operating device (C) and is connected to the exhaust port (12).

[0045] By means of such a cooling mechanism (60), a portion of the air discharged from the blower fan (70) is sent from below the substrate (30) toward the rear, then sent upward along the edge of the substrate (30), and flows through the first flow path (L1) and the second flow path (L2) from the rear toward the front, finally being exhausted to the outside from below the front.

[0046] Next, we will explain the operation of the cooling mechanism (60).

[0047] The air discharged from the blower fan (70) is classified into a first air passage (81) and a second air passage (82). The air introduced into the first air passage (81) is set to have a larger flow rate than the air introduced into the second air passage (82) so that the air flows preferentially into the first air passage (L1) and the second air passage (L2) rather than the third air passage (L3). Additionally, the air introduced into the second air passage (82) passes through the third air passage (L3) to cool the circuit component (50), and then is exhausted to the outside along the second exhaust duct (92).

[0048] Air introduced into the first air passage (81) proceeds in the extension direction of the first air passage (81) and is discharged from the outlet (81a). The air discharged from the multiple outlets (81a) passes through the first flow path (L1) and the second flow path (L2), respectively, to cool the substrate (30), and then is exhausted to the outside along the first exhaust duct (91). Here, the flow rate of air passing through the first flow path (L1) is set to be greater than the flow rate of air passing through the second flow path (L2).

[0049] According to the present embodiment, a blower fan (70) is installed below the substrate (30), and air discharged from the blower fan (70) is guided to the first airway (L1) by the air guide duct (80), so the air guide duct (90) is placed next to the substrate (30). The lateral installation space occupied by the air guide duct (80) is smaller than the installation space occupied by the blower fan (70) when the blower fan (70) is placed next to the substrate (30). As a result, the substrate (30) can be cooled without significantly reducing the heating area of ​​the top plate (20). In addition, an intake port (11) and an exhaust port (12) are formed on surfaces facing different directions of the case (10), specifically the bottom and back surfaces, so that air discharged from the cooling mechanism (60) is suppressed from being sucked back into the cooling mechanism (60). In addition, since the circuit component (50) is cooled by the cooling mechanism (60), that is to say, since the heat sink constituting part of the circuit component (50) is cooled by the cooling mechanism (60), the circuit component (50), such as a chip connected to the heat sink, can be efficiently cooled.

[0050] The induction heating cooker (100) of the present disclosure is not limited to the above-described embodiment. In the above-described embodiment, the air duct guides the air discharged from the blower fan into the first path, the second path, and the third path, but is not limited thereto. For example, the air duct may guide the air discharged from the blower fan only into the first path. Also, the air duct may guide the air discharged from the blower fan only into the first path and the second path. Also, the air duct may guide the air discharged from the blower fan only into the first path and the third path.

[0051] In the above-described embodiments, the heating coil is embedded in the substrate, but is not limited thereto. For example, the heating coil may be installed or laminated on the surface of the substrate.

[0052] In the above-described embodiment, the cooling mechanism is configured such that air passing through the first, second, and third passages passes from the rear side to the front side of the induction heating cooker, but is not limited thereto. For example, the cooling mechanism may be configured such that air passing through the first, second, and third passages passes from one side side to another side side of the induction heating cooker. Additionally, the cooling mechanism may be configured such that air passing through the first, second, and third passages passes from the front side to the rear side of the induction heating cooker.

[0053] In the aforementioned embodiment, the cross-sectional area of ​​the flow path of the first airflow path decreases as it moves away from the inlet, but is not limited thereto. For example, the cross-sectional area of ​​the flow path of the first airflow path may remain the same even as it moves away from the inlet.

[0054] In the above-described embodiment, the first air guide is positioned to be interposed between the substrate and the back surface of the case, but is not limited thereto. For example, the first air guide may be positioned to be interposed between the substrate and the side surface of the case.

[0055] In the above-described embodiment, the intake port and the exhaust port are formed on surfaces of the case facing different directions, but are not limited thereto. For example, the intake port and the exhaust port may be formed on surfaces of the case facing the same direction. In this case, a certain means (for example, forming a shield structure on the side of the intake port facing the exhaust port) may be provided so that the air exhausted from the exhaust port is not drawn in through the intake port.

[0056] In the above-described embodiment, the cross-sectional area of ​​the flow path of the first air guide is made to decrease as it moves away from the inlet so that the air discharged from the blower fan is evenly distributed over the entire substrate, but is not limited thereto. For example, the opening area of ​​a plurality of outlets of the first air guide may be made to decrease as it moves away from the inlet. Here, the opening area refers to the opening area per unit length in the extension direction of the first air guide.

[0057] In the above-described embodiments, the air duct extends upward from the outside of the rear edge of the substrate, but is not limited thereto. For example, the air duct may extend upward from the outside of the side or front edge of the substrate. An induction heating cooker according to one aspect of the present disclosure comprises: a top plate; a substrate having a heating coil disposed below the top plate with a first gap; and a cooling mechanism for cooling the substrate. The cooling mechanism comprises: a first air passage formed by the first gap between the substrate and the top plate; a blower fan disposed below the substrate; and an air duct having a first air passage that guides air discharged from the blower fan into the first air passage.

[0058] According to this, a blower fan is installed below the substrate, and air discharged from the blower fan is guided to a first airflow path by a guide duct, so that the guide duct is positioned parallel to the substrate. The installation space of the guide duct is smaller than the installation space occupied by the blower fan when the blower fan is positioned parallel to the substrate. Therefore, the substrate can be cooled without significantly reducing the heating area of ​​the top plate.

[0059] In one embodiment, the induction heating cooker may include a magnetic flux blocking plate disposed below the substrate with a second gap. The cooling mechanism may further include a second flow path formed by the first gap between the substrate and the magnetic flux blocking plate. The first air guide path may guide air discharged from the blower fan into the second flow path.

[0060] Most circuit components of an induction heating cooker are positioned beneath the circuit board. These circuit components can generate heat during operation. The circuit board can also be damaged by the heat from these components. Additionally, the heating coil mounted on the circuit board generates magnetic flux during operation. A magnetic flux blocking plate is positioned between the circuit board and the circuit components to suppress damage to the board caused by the heat from the components and to block the magnetic flux generated by the heating coil from adversely affecting the circuit components. By utilizing the magnetic flux blocking plate to form a second flow path between the circuit board and the plate, cooling performance can be improved without increasing the number of components.

[0061] In one embodiment, the first gap may be larger than the second gap.

[0062] The heat transferred from the cooking appliance on the top plate to the substrate is greater than the heat transferred from the circuit components to the substrate. Therefore, the first gap is made larger than the second gap so that more air flows through the first path than through the second path, thereby effectively cooling the substrate.

[0063] In one embodiment, the first air passage may have an inlet through which air is introduced from the blower fan and an outlet that is open toward the first air passage and the second air passage, and may extend along the edge of the substrate.

[0064] In one embodiment, the cross-sectional area of ​​the flow path of the first air passage may decrease as it moves away from the inlet along the extension direction.

[0065] In one embodiment, the opening area of ​​the outlet may become smaller as it moves further away from the inlet.

[0066] According to this configuration, the pressure of the air flowing in the extended direction along the first air passage may not decrease even as it moves away from the inlet. Therefore, air discharged from the blower fan can be supplied to the entire substrate at approximately the same flow rate. As a result, the entire substrate can be cooled approximately evenly.

[0067] In one embodiment, the induction heating cooker may further include a circuit component disposed below the substrate. The cooling mechanism may further include a third flow path formed along at least a portion of the circuit component. The air duct may include a second air path that guides air discharged from the blower fan into the third flow path.

[0068] According to this, since circuit components can be directly cooled by air supplied from a blower fan, the heat transferred from circuit components to the circuit board can be reduced, and thermal damage to the circuit components themselves can also be suppressed.

[0069] In one embodiment, the cross-sectional area of ​​the inlet port of the first air passage may be larger than the cross-sectional area of ​​the inlet port facing the blower fan of the second air passage. Since the heat transferred from the cooking appliance on the top plate to the substrate through the top plate is relatively large compared to the heat generated by the circuit components, more air can be allowed to flow through the first air passage than through the second air passage.

[0070] In one embodiment, the circuit component may include at least one of an inverter circuit component and a resonant circuit component.

[0071] In one embodiment, the blower fan may be a Sirocco fan having a rotation axis extending in a direction orthogonal to the substrate. By doing so, the thickness of the induction heating cooker can be reduced.

[0072] In one embodiment, the air duct may extend from below the substrate, through the outside of the edge of the substrate, and upward to the substrate. Accordingly, since the air duct is positioned at the edge portion of the top plate, a non-heating area is not formed in the center of the top plate, thereby improving the convenience of using the induction heating cooker.

[0073] In one embodiment, the air duct may be formed to pass through the outside of an edge other than the front side. If the air duct is formed to pass through the outside of the front side edge of the substrate, the area of ​​the top plate close to the user (cook) becomes a non-heated area, which may reduce user convenience. If the air duct is formed to pass through the outside of the back side or side side edge of the substrate, user convenience may be improved.

[0074] In one embodiment, the induction heating cooker may further include a case that is open toward the top plate and accommodates the substrate and the cooling mechanism. The air duct may extend from below the substrate, passing between the edge of the substrate and the inner circumference of the case, and upward from the substrate. Accordingly, since the air duct is installed at the edge portion of the top plate, a non-heated area is not formed near the center of the top plate, thereby improving ease of use.

[0075] In one embodiment, the induction heating cooker may include an operating device disposed below the top plate. The substrate may be disposed so as not to overlap with the operating area. The cooling mechanism may include a first exhaust duct for exhausting air passing through the first flow path to the outside. One end of the first exhaust duct may be connected to the first flow path, pass below the operating device, and the other end may be connected to an exhaust port provided in the case.

[0076] An operating device is positioned below the operating area of ​​the top plate, and if high-temperature air passing through the first flow path comes into contact with the operating device, the operating device may be damaged. Taking this into account, the heat effect on the operating device can be reduced by exhausting the air passing through the first flow path to the outside through a first exhaust duct passing below the operating device.

[0077] In one embodiment, an intake port may be provided on a first surface of the case, and an exhaust port may be provided on a second surface of the case facing in a direction different from the first surface. The blower fan draws in air through the intake port, and the air passing through the air duct may be discharged through the exhaust port. Accordingly, it is possible to prevent the air exhausted through the exhaust port from being immediately drawn into the cooling mechanism through the intake port.

[0078] The technical effects intended to be achieved in this document are not limited to those mentioned above, and other technical effects not mentioned will be clearly understood by those skilled in the art to which this disclosure belongs from the description in this document.

[0079] As described above, although the induction heating cooker of the present disclosure has been explained by limited embodiments and drawings, the present disclosure is not limited to the above embodiments and various modifications are possible within the scope without departing from the spirit thereof.

Claims

1. Top plate (20); A substrate (30) having a heating coil and positioned below the top plate with a first gap (G1); It includes a cooling mechanism (60) for cooling the above substrate, The above cooling mechanism is, A first flow path (L1) formed by the first gap between the substrate and the top plate; A blower fan (70) positioned below the substrate; An induction heating cooker comprising: a first air-guide duct (90) having a first air-guide path (81) that guides air discharged from the above-mentioned blower fan into the first air path.

2. In Paragraph 1, It includes a magnetic flux blocking plate (40) positioned below the substrate with a second gap (G2); The above cooling mechanism further includes a second flow path (L2) formed by the first gap between the substrate and the magnetic flux blocking plate, and The above first air guide is an induction heating cooker that guides air discharged from the above blower fan into the above second air path.

3. In Paragraph 2, The above first gap is larger than the above second gap in an induction heating cooker.

4. In Paragraph 2 or 3, The first air-flow path is an induction heating cooker that has an inlet (81b) into which air is introduced from the blower fan and an outlet (81a) that is open toward the first flow path and the second flow path, and extends along the edge of the substrate.

5. In Paragraph 4, An induction heating cooker in which the cross-sectional area of ​​the flow path of the first induction furnace decreases as it moves away from the inlet along the extension direction.

6. In Paragraph 4, An induction heating cooker in which the opening area of ​​the above-mentioned outlet becomes smaller as it moves away from the above-mentioned inlet.

7. In any one of paragraphs 1 through 6, It includes a circuit component (50) disposed below the above substrate, The above cooling mechanism further includes a third flow path formed along at least a portion of the circuit component, and The above air duct is an induction heating cooker that includes a second air duct (82) that directs air discharged from the above blower fan into the third air path.

8. In Paragraph 7, An induction heating cooker in which the cross-sectional area of ​​the inlet port of the first air-flow furnace is larger than the cross-sectional area of ​​the inlet port facing the blower fan of the second air-flow furnace.

9. In Paragraph 7 or 8, The above circuit component is an induction heating cooker comprising at least one of an inverter circuit component and a resonance circuit component.

10. In any one of paragraphs 1 through 9, The above-mentioned blower fan is an induction heating cooker that is a Sirocco fan having a rotation axis extending in a direction orthogonal to the substrate.

11. In any one of paragraphs 1 through 10, The above-mentioned air duct is an induction heating cooker that extends from below the substrate, through the outside of the edge of the substrate, and above the substrate.

12. In Paragraph 11, The above-mentioned air duct is an induction heating cooker that passes through the outside of the edge other than the front edge of the substrate.

13. In any one of paragraphs 1 through 12, It further includes a case (10) that is open toward the top plate and accommodates the substrate and the cooling mechanism, and The above-described air duct is an induction heating cooker that extends from below the substrate, passes between the edge of the substrate and the inner surface of the case, and extends upward from the substrate.

14. In Paragraph 13, It includes an operating device (C) positioned below the top plate; and The above substrate is an induction heating cooker positioned so as not to overlap with the above operating area, and The above cooling mechanism includes a first exhaust duct (91) that exhausts air passing through the first flow path to the outside, and The first exhaust duct is an induction heating cooker, one end of which is connected to the first flow path and passes below the operating device, and the other end of which is connected to an exhaust port provided in the case.

15. In Paragraph 13, An intake port (11) is provided on the first surface of the above case, and an exhaust port (12) is provided on the second surface of the above case facing in a direction different from the first surface. The above-mentioned blower fan draws in air through the above-mentioned intake port, and An induction heating cooker in which air passing through the above air duct is discharged through the above exhaust port.

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