Power conversion device

Abstract

A power conversion device (100) comprises semiconductor modules (32), heat exchangers (31c), a smoothing capacitor (4), a terminal block (40), an electronic component (6), and a case (80). The semiconductor modules and the heat exchangers form a laminate (30). The smoothing capacitor is connected to the semiconductor modules via a first bus bar (501) and a second bus bar (502), and the terminal block is connected to the semiconductor modules via third bus bars (503). The electronic component is connected to the terminal block via a fourth bus bar (504), and is connected to the smoothing capacitor via a fifth bus bar (505). The first bus bar (501) and the fourth bus bar (504) form high-potential-side input lines (51, 52), the second bus bar (502) and the fifth bus bar (505) form a low-potential-side input line (60), and the third bus bars (503) form an output line (70). The laminate and the electronic component are disposed, in a direction orthogonal to the Y direction, at a position (G) between the smoothing capacitor and the terminal block.

Description

Power conversion device Cross-reference to related applications

[0001] This application is based on Japanese Patent Application No. 2025-024428 filed in Japan on February 18, 2025, the entire content of the base application being incorporated herein by reference.

[0002] The disclosure in this specification relates to a power conversion device.

[0003] Patent Document 1 discloses a power conversion device including a power module, a capacitor module, an input P bus bar, an input N bus bar, and the like.

[0004] Japanese Patent Application Laid-Open No. 2020-162262

[0005] By the way, a laminate in which a power module and a cooler are laminated is likely to vibrate in a direction orthogonal to the lamination direction due to vibrations transmitted from the vehicle body. From the above viewpoint, or from other viewpoints not mentioned, further improvements are required for the power conversion device.

[0006] One disclosed object is to provide a power conversion device capable of improving vibration resistance.

[0007] To achieve the above object, a power conversion device according to one aspect of the present disclosure includes a plurality of semiconductor modules arranged in a stacked manner and incorporating semiconductor switching elements, a plurality of heat exchangers arranged in a stacked manner between the plurality of semiconductor modules and cooling the semiconductor modules, a smoothing capacitor connected to the plurality of semiconductor modules via a first bus bar and a second bus bar, a terminal block connected to the plurality of semiconductor modules via a third bus bar, an electronic component connected to the terminal block via a fourth bus bar and to the smoothing capacitor via a fifth bus bar, a case housing a laminate formed by the semiconductor module and the heat exchanger, the smoothing capacitor, the terminal block, and the electronic component, the first bus bar and the fourth bus bar form a high-potential side input line, the second bus bar and the fifth bus bar form a low-potential side input line, the third bus bar forms an output line, and the laminate and the electronic component are arranged between the smoothing capacitor and the terminal block in a direction orthogonal to the lamination direction of the laminate.

[0008] According to the disclosed power conversion device, the smoothing capacitor and terminal block, which are connected to the laminate via busbars, are also connected to the electronic components via busbars. Here, the laminate is susceptible to external vibrations. These vibrations of the laminate are transmitted to the smoothing capacitor and terminal block via the busbars. In contrast, according to the structure of this disclosure, the vibrations of the smoothing capacitor and terminal block can be suppressed by the electronic components connected to the busbars necessary for forming the electrical circuit, and consequently, the vibrations of the laminate can also be suppressed.

[0009] The reference numbers in parentheses above are merely examples of correspondences with specific configurations in the embodiments described later, and do not limit the technical scope in any way.

[0010] This is a circuit diagram showing the schematic configuration of the power converter in the first embodiment. This is a plan view showing the schematic configuration of the power converter in the first embodiment. This is a cross-sectional view taken along the line III-III in Figure 2. This is a cross-sectional view taken along the line IV-IV in Figure 2.

[0011] Several embodiments will be described below with reference to the drawings. In each embodiment, the same reference numerals are used for corresponding components, and redundant explanations may be omitted. If only a part of the configuration is described in each embodiment, the configuration of other embodiments described earlier can be applied to the other parts of that configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations from multiple embodiments can be partially combined even if not explicitly stated, as long as there are no particular problems with the combination.

[0012] (First Embodiment) The circuit configuration of the power converter of this embodiment will be described with reference to Figure 1. In this embodiment, as an example, a power converter 100 is used that converts the power of a battery 200 to drive two motors 310 and 320.

[0013] <Circuit Configuration of Power Converter> The power converter 100 is installed in vehicles such as electric vehicles and hybrid vehicles. The power converter 100 converts the DC voltage supplied from the battery 200 installed in the vehicle into three-phase AC and outputs it to three-phase AC motors 310 and 320. The motors 310 and 320 function as the driving power source for the vehicle. The power converter 100 can also convert the power generated by the motors 310 and 320 into DC and charge the battery 200. The power converter 100 is capable of bidirectional power conversion.

[0014] The power converter 100 includes a first converter 1a, a second converter 1b, a first inverter 2a, a second inverter 2b, a smoothing capacitor 4, a discharge resistor 5, a filter capacitor 6, an EMI filter 7, and the like. In this embodiment, the power converter 100 is equipped with a first current sensor 41, a second current sensor 42, a third current sensor 43, and a fourth current sensor 44.

[0015] The power converter 100 is equipped with power lines. The P line, which is the high-potential input line, includes the VL line 51 and the VH line 52. The VL line 51 is connected to the positive terminal of the battery 200. A first converter 1a and a second converter 1b are provided between the VL line 51 and the VH line 52. The potential of the VH line 52 is set to be equal to or greater than the potential of the VL line 51. The N line 60 is a low-potential input line connected to the negative terminal of the battery 200. The N line 60 is sometimes referred to as the ground line. Alternatively, the N line 60 may be at a lower potential than the ground line.

[0016] The power converter 100 includes a P terminal t1 for electrically connecting to the positive terminal of the battery 200 and an N terminal t2 for electrically connecting to the negative terminal of the battery 200. The power converter 100 also includes a first U-phase terminal t11, a first V-phase terminal t12, and a first W-phase terminal t13 for electrically connecting to the three terminals of the first motor 310. Furthermore, the power converter 100 includes a second U-phase terminal t21, a second V-phase terminal t22, and a second W-phase terminal t23 for electrically connecting to the three terminals of the second motor 320.

[0017] The first converter 1a comprises a first reactor 21a and a semiconductor module 32 in which two switching elements 3 are connected in series. The second converter 1b, like the first converter 1a, comprises a second reactor 21b and a semiconductor module 32. The switching elements 3 correspond to semiconductor switching elements.

[0018] In this embodiment, an RC-IGBT comprising an IGBT and a diode is used as the switching element 3. This diode functions similarly to a freewheeling diode inserted in antiparallel to the IGBT. However, this disclosure is not limited to this, and a MOSFET or an IGBT different from the RC-IGBT can be used as the switching element 3. When an IGBT is used as the switching element 3, the semiconductor module 32 may include a freewheeling diode connected in antiparallel to the IGBT.

[0019] The first converter 1a includes a high-potential switching element 3 and a low-potential switching element 3. The high-potential switching element 3 can be called an upper arm element, while the low-potential switching element 3 can be called a lower arm element.

[0020] In the first converter 1a, the collector of the high-potential switching element 3 is electrically connected to the VH line 52, and its emitter is electrically connected to the collector of the low-potential switching element 3. In the first converter 1a, the emitter of the low-potential switching element 3 is electrically connected to the N line 60. Furthermore, the gate of the switching element 3 in the first converter 1a is electrically connected to the control board 33. In the first reactor 21a, one terminal is connected to the emitter of the high-potential switching element 3 and the collector of the low-potential switching element, and the other terminal is electrically connected to the P terminal t1. The second converter 1b is configured similarly to the first converter 1a.

[0021] In the first converter 1a, the emitter of the high-potential switching element 3 and the collector of the low-potential switching element 3 are electrically connected to the third current sensor 43 via the VL line 51. Similarly, in the second converter 1b, the emitter of the high-potential switching element 3 and the collector of the low-potential switching element 3 are electrically connected to the fourth current sensor 44 via the VL line 51. The third current sensor 43 detects, for example, the current flowing through the first converter 1a. The fourth current sensor 44 detects, for example, the current flowing through the second converter 1b.

[0022] An EMI filter 7 and a filter capacitor 6 are provided between the first converter 1a and the battery 200, and between the second converter 1b and the battery 200. The EMI filter 7 and filter capacitor 6 are provided between the VL line 51 and the N line 60. The EMI filter 7 suppresses electromagnetic interference. The EMI filter 7 is sometimes referred to as a filter circuit. EMI is an abbreviation for Electromagnetic Interference. The EMI filter 7 is connected between the VL line 51 and the N line. The EMI filter 7 has coils and capacitors, etc. The example EMI filter 7 has a choke coil 71 and a Y capacitor 72. The choke coil 71 is sometimes referred to as a common mode coil, filter core, EMI core, etc. The choke coil 71 and the Y capacitor 72 reduce common mode noise. The EMI filter 7 may also have an X capacitor and a normal mode coil to reduce normal mode noise.

[0023] The positive terminal of the filter capacitor 6 is connected to the VL line 51 between the battery 200 and the converter 1. The negative terminal of the filter capacitor 6 is connected to the N line 60 between the battery 200 and the converter 1. The filter capacitor 6 is connected in parallel with the battery 200. The filter capacitor 6 suppresses pulsations in the DC current input from, for example, the battery 200. Because the filter capacitor 6 is located on the lower voltage side than the smoothing capacitor 4, it is sometimes referred to as a low-voltage side capacitor. In other words, the capacitance of the filter capacitor 6 is smaller than the capacitance of the smoothing capacitor 4. One terminal of the filter capacitor 6 is electrically connected to the P terminal t1, and the other terminal is electrically connected to the N terminal t2.

[0024] The first inverter 2a is equipped with three semiconductor modules 32 corresponding to each phase of the first motor 310. In each semiconductor module 32 of the first inverter 2a, the collector of the high-potential switching element 3 is electrically connected to the VH line 52, and the emitter is electrically connected to the collector of the low-potential switching element 3. In addition, the emitter of the low-potential switching element 3 of the semiconductor module 32 is electrically connected to the N line. Furthermore, the gate of the switching element 3 of each semiconductor module 32 is electrically connected to the control board 33.

[0025] In the first inverter 2a, the emitter of the high-potential switching element 3 and the collector of the low-potential switching element 3 are connected to the output line, O-line 70. Each semiconductor module 32 of the first inverter 2a is electrically connected to the first current sensor 41 and the first U-phase terminal t11, the first V-phase terminal t12, and the first W-phase terminal t13, respectively, via the O-line 70. The first current sensor 41 detects the current flowing through each phase of the first motor 310.

[0026] Similarly, in the second inverter 2b, the emitter of the high-potential switching element 3 and the collector of the low-potential switching element 3 are connected to the output line, O-line 70. Each semiconductor module 32 of the second inverter 2b is electrically connected to the second current sensor 42 and the second U-phase terminal t21, second V-phase terminal t22, and second W-phase terminal t23, respectively, via O-line 70. The second current sensor 42 detects the current flowing through each phase of the second motor 320.

[0027] The smoothing capacitor 4 is connected between the VH line 52 and the N line 60. The positive terminal of the smoothing capacitor 4 is connected to the VH line 52 between the converter 1 and the inverter 2. The negative terminal of the smoothing capacitor 4 is connected to the N line 60 between the converter 1 and the inverter 2. Note that converter 1 refers to the first converter 1a and the second converter 1b. Inverter 2 refers to the first inverter 2a and the second inverter 2b. The smoothing capacitor 4 is connected in parallel with the inverter 2. The smoothing capacitor 4 smooths the DC voltage boosted by, for example, the converter 1. The voltage across the smoothing capacitor 4 is set to be greater than or equal to the voltage across the filter capacitor 6. Since the smoothing capacitor 4 is located on the higher voltage side than the filter capacitor 6, it is sometimes called a high-voltage side capacitor. In other words, the capacitance of the smoothing capacitor 4 is greater than the capacitance of the filter capacitor 6.

[0028] The discharge resistor 5 discharges the charge stored in the smoothing capacitor 4, for example, to reduce the terminal voltage of the smoothing capacitor 4 to a predetermined voltage. One terminal of the discharge resistor 5 is electrically connected to the VH line 52, and the other terminal is electrically connected to the N line 60. The discharge resistor 5 is connected in parallel with the smoothing capacitor 4. When the power supply from the battery 200 is interrupted, for example, the discharge resistor 5 forces (rapidly) the charge stored in the smoothing capacitor 4 to discharge. The discharge resistor 5 dissipates the discharged charge as heat.

[0029] Next, the structure of the power converter 100 will be described based on Figures 2 to 4. In the following description, the three mutually orthogonal directions will be referred to as the X direction, Y direction, and Z direction. The X direction corresponds to the arrangement direction of the smoothing capacitor, laminate, and terminal block. The Y direction corresponds to the stacking direction of the laminate. The Z direction is orthogonal to the X and Y directions. In other words, the Z direction is an orthogonal direction that is orthogonal to both the arrangement direction and the stacking direction.

[0030] <Structure of the Power Converter> In addition to the above-described configuration, the power converter 100 includes a cooler 31, a terminal block 40, a first busbar 501, a second busbar 502, a third busbar 503, a fourth busbar 504, a fifth busbar 505, a sixth busbar 506, and a case 80. In the following description, the first busbar 501, the second busbar 502, the third busbar 503, the fourth busbar 504, the fifth busbar 505, and the sixth busbar 506 may be referred to as the first busbar 501 to the sixth busbar 506.

[0031] The case 80 houses the semiconductor module 32, the cooler 31, the terminal block 40, the smoothing capacitor 4, the first busbar, the second busbar 502, the third busbar 503, the fourth busbar 504, the fifth busbar 505, and the sixth busbar 506. The case 80 is made of metal, for example. The case 80 has a bottom wall 81 on which the smoothing capacitor 4, the terminal block 40, the filter capacitor 6, and the EMI filter 7 are mounted. The bottom wall 81 is parallel to the XY plane, for example.

[0032] The first busbars 501 to the sixth busbars 506 form the power lines of the power converter 100. The first busbar 501 and the fourth busbar 504 form the P line, which is the input line on the high potential side. The fourth busbar 504 forms the VL line 51 of the P line. The first busbar 501 forms the VH line 52 of the P line. The P line may also have busbars other than the first busbar 501 and the fourth busbar 504. The second busbar 502 and the fifth busbar 505 form the N line 60, which is the input line on the low potential side. The second busbar 502 and the fifth busbar 505 may be a single unit. Alternatively, the second busbar 502 and the fifth busbar 505 may be separate units connected by bolting or welding.

[0033] The third busbar 503 forms the O line 70, which is the output line to which the power converted to three-phase AC by the inverter 2 is output. The sixth busbar 506 electrically connects the switching element 3 and the reactor 21 that constitute the converter 1. One end of the reactor 21 is electrically connected to the switching element 3 via the sixth busbar 506. The other end of the reactor 21 is electrically connected to the filter capacitor 6 via the fourth busbar 504. Note that the reactor 21 refers to the first reactor 21a and the second reactor 21b. The first to sixth busbars 501 to 506 may each be formed by a single busbar, or by multiple busbars connected together. For example, the fourth busbar 504 may be formed by two busbars bolted together as shown in Figure 2, or by a single busbar. The fifth busbar 505 may be formed by two busbars bolted together, or by a single busbar.

[0034] As shown in Figure 2, the first busbar 501 connects the semiconductor module 32 and the smoothing capacitor 4. The second busbar 502 connects the semiconductor module 32 and the smoothing capacitor 4. The third busbar 503 connects the semiconductor module 32 and the terminal block 40. The fourth busbar 504 connects the terminal block 40 and the filter capacitor 6. The fourth busbar 504 further connects the filter capacitor 6 and the EMI filter 7. The fifth busbar 505 connects the smoothing capacitor 4 and the filter capacitor 6. The fifth busbar 505 further connects the filter capacitor 6 and the EMI filter 7. The sixth busbar 506 connects the semiconductor module 32 and the terminal block 40.

[0035] As shown in Figure 2, multiple semiconductor modules 32 are stacked in the Y direction. The semiconductor modules 32 are arranged in multiple stages in the Y direction. The semiconductor modules 32 are stacked alternately with the heat exchangers 31c, which will be described later, along the Y direction. In other words, the stacked arrangement of multiple semiconductor modules 32 and multiple heat exchangers 31c forms a laminate 30. The semiconductor modules 32 and heat exchangers 31c are arranged side by side in the Y direction. Each semiconductor module 32 is cooled by the heat exchanger 31c in the Y direction. The semiconductor modules 32 have a switching element 3 built in. In Figure 2, some reference numerals for the semiconductor modules 32 and heat exchangers 31c have been omitted. In this embodiment, one semiconductor module 32 constitutes one upper and lower arm circuit. The semiconductor modules 32 are arranged in different stages for each upper and lower arm circuit unit. Note that one upper and lower arm circuit may be composed of two semiconductor modules 32.

[0036] The cooler 31 comprises an inlet pipe 31a, an outlet pipe 31b, and a plurality of heat exchangers 31c, forming part of a circulation path for circulating the refrigerant. The cooler 31 is formed using a metal material with excellent thermal conductivity. For example, the heat exchangers 31c are formed by pressing at least one of a pair of plates (thin metal sheets) into a shape that bulges in the Y direction. Then the outer edges of the pair of plates are fixed together by crimping or the like, and joined together all around by brazing or the like. This creates a flow path between the pair of plates through which the refrigerant can flow, making it possible to use it as a heat exchanger 31c.

[0037] Each of the inlet pipe 31a and outlet pipe 31b may be composed of a single component, or multiple components may be connected to form an integrated structure. The inlet pipe 31a and outlet pipe 31b are arranged side by side in the X direction. Multiple heat exchangers 31c are stacked in the Y direction and connected to the inlet pipe 31a and outlet pipe 31b extending in the Y direction. By supplying refrigerant to the inlet pipe 31a by a pump (not shown), refrigerant flows through the flow path in each of the heat exchangers 31c. As a result, each of the semiconductor modules 32 is cooled from both sides in the Y direction. The refrigerant that has flowed through each of the heat exchangers 31c is discharged through the outlet pipe 31b. The refrigerant may be a phase-changing refrigerant such as water or ammonia, or a non-phase-changing refrigerant such as ethylene glycol. The refrigerant used as an example is LLC. LLC is an abbreviation for Long Life Coolant.

[0038] The semiconductor module 32 and the heat exchanger 31c may be in contact via an insulator with good thermal conductivity. For example, thermal grease can be used as the insulator with good thermal conductivity. A pressurizing member is provided at one end of the laminate 30 in the Y direction, and a retaining part is provided at the other end in the Y direction. The pressurizing member is made of, for example, a leaf spring. The retaining part is integrated with the case 80. Alternatively, the retaining part may be separate from the case 80 and fixed to the case 80. The pressurizing member presses the laminate 30 toward the retaining part in the Y direction. The retaining part supports the laminate 30 pressed by the pressurizing member. That is, the laminate 30 is compressed in the Y direction by the pressurizing member and the retaining part. As a result, vibration in the Y direction of the laminate 30 is suppressed.

[0039] The semiconductor module 32 may further include a encapsulant, terminals, etc. The semiconductor module 32 illustrated in Figure 3 includes a main terminal and signal terminals 322, which are external connection terminals electrically connected to the switching element 3, and a encapsulant 323. Parts of each external connection terminal are exposed from the encapsulant 323. The external connection terminals are terminals for electrically connecting the switching element 3 to external equipment.

[0040] The main terminal has a semiconductor P terminal 321a, a semiconductor N terminal 321b, and a semiconductor O terminal 321c. Each of the main terminals is electrically connected to the main electrode of the switching element 3. The semiconductor P terminal 321a is electrically connected to the first busbar 501. The semiconductor N terminal 321b is electrically connected to the second busbar 502. The semiconductor O terminal 321c is electrically connected to the third busbar 503 or the sixth busbar 506. The semiconductor O terminal 321c of the semiconductor module 32 forming the inverter 2 is electrically connected to the third busbar 503. The semiconductor O terminal 321c of the semiconductor module 32 forming the converter 1 is electrically connected to the sixth busbar 506. The main terminal and each busbar are connected, for example, by welding.

[0041] The signal terminal 322 is electrically connected to the pad of the corresponding switching element 3. Here, the laminate 30 may be in contact with the bottom wall 81 of the case 80, but in this embodiment it is not in contact with the bottom wall 81. As shown in Figure 3, an opening 81a is provided in at least a portion of the bottom wall 81 that faces the laminate 30 in the Z direction. The opening 81a is provided for connecting the semiconductor module 32 to the control board 33. The signal terminal 322 is connected to the control board 33 through the opening 81a.

[0042] The smoothing capacitor 4 is arranged in line with the laminate 30 in the X direction. The smoothing capacitor 4 comprises a smoothing capacitor element, a encapsulant, a smoothing capacitor P terminal, a smoothing capacitor N terminal, and a smoothing capacitor case 4a. The smoothing capacitor element is placed inside the smoothing capacitor case 4a and covered with the encapsulant. The smoothing capacitor element has a pair of electrodes. The smoothing capacitor 4 has, for example, multiple smoothing capacitor elements connected in parallel. The encapsulant is an electrically insulating resin such as epoxy resin.

[0043] The smoothing capacitor 4 is electrically connected to the first busbar 501, the second busbar 502, and the fifth busbar 505. That is, the smoothing capacitor 4 is connected to the semiconductor module 32 via the first busbar 501 and the second busbar 502. The smoothing capacitor P terminal is embedded in the sealing material together with the smoothing capacitor element, with a portion of it exposed from the sealing material and the smoothing capacitor case 4a. One end of the smoothing capacitor P terminal is embedded in the sealing material and connected to the positive electrode side of the smoothing capacitor element. The other end of the smoothing capacitor P terminal is exposed from the sealing material and connected to the first busbar 501. In this embodiment, the other end of the smoothing capacitor P terminal corresponds to the smoothing capacitor P connection portion, which is the part connected to the first busbar 501. The smoothing capacitor P connection portion may be connected to the first busbar 501 with fastening members such as bolts. Alternatively, the smoothing capacitor P connection portion may be welded to the first busbar 501.

[0044] Similarly, the smoothing capacitor N terminal is embedded in the sealing material, and a part thereof is exposed from the sealing material and the smoothing capacitor case 4a. One end of the smoothing capacitor N terminal is embedded in the sealing material and connected to the negative electrode side of the smoothing capacitor element. As shown in FIG. 4, the other end of the smoothing capacitor N terminal is exposed from the sealing material and connected to the fifth bus bar 505. In the present embodiment, the other end of the smoothing capacitor N terminal corresponds to the smoothing capacitor N connection portion 4b which is the portion connected to the fifth bus bar 505. Note that the dashed-dotted line extending in the Z direction in FIG. 4 indicates the direction of bolt fastening. That is, in the present embodiment, the smoothing capacitor N connection portion 4b is bolted to the fifth bus bar 505 in the Z direction. Note that the smoothing capacitor N connection portion 4b may be welded to the fifth bus bar 505.

[0045] The second bus bar 502 and the fifth bus bar 505 may be bolted in the Z direction in a state where they overlap in the Z direction, for example. Alternatively, the second bus bar 502 and the fifth bus bar 505 may be separate bodies, and the smoothing capacitor 4 may further have a terminal connected to the second bus bar 502. Also, in the present embodiment, the smoothing capacitor 4 is separate from the first bus bar 501, the second bus bar 502, and the fifth bus bar 505. However, the smoothing capacitor 4 may be integrated with the first bus bar 501, the second bus bar 502, and the fifth bus bar 505.

[0046] The smoothing capacitor case 4a has a smoothing capacitor fastening part 4c. The smoothing capacitor 4 is fixed to the case 80 by the smoothing capacitor fastening part 4c. As shown in FIG. 4, a boss extending in the Z direction is provided on the bottom wall 81 of the case 80. Then, the smoothing capacitor fastening part 4c is fixed in the Z direction to the boss provided on the case 80 by a fastening member such as a bolt. Other electronic components fixed to the case 80 are also fixed in the same manner. The smoothing capacitor fastening part 4c may be one or plural. In the present embodiment, there are plural smoothing capacitor fastening parts 4c. Note that the number and arrangement of the smoothing capacitor fastening parts 4c are not limited by FIG. 2. As shown in FIG. 4, in the present embodiment, the Z-direction length from the bottom wall 81 to the smoothing capacitor N connection part 4b is longer than the Z-direction length from the bottom wall 81 to the smoothing capacitor fastening part 4c.

[0047] The terminal block 40 is arranged side by side with the laminate 30 in the X direction. The terminal block 40 is arranged on the side opposite to the side where the smoothing capacitor 4 is arranged with respect to the laminate 30. That is, in the X direction, the terminal block 40, the laminate 30, and the smoothing capacitor 4 are arranged in this order. The laminate 30 is arranged in the gap G between the terminal block 40 and the smoothing capacitor 4 in the X direction. For example, as shown in FIG. 2, the entire X-direction range of the laminate 30 is located in the gap G.

[0048] In this case, the Y-direction position of the laminate 30 may not overlap with the Y-direction positions of the terminal block 40 and the smoothing capacitor 4. That is, the entire Y-direction range of the laminate 30 may not overlap with at least a part of the Y-direction range of the terminal block 40 or at least a part of the Y-direction range of the smoothing capacitor 4. However, it is desirable that at least a part of the Y-direction range of the laminate 30 overlaps with at least a part of the Y-direction ranges of the terminal block 40 and the smoothing capacitor 4, respectively. Further, it is desirable that the entire Y-direction range of the laminate 30 overlaps with at least a part of the Y-direction ranges of the terminal block 40 and the smoothing capacitor 4, respectively.

[0049] The position of the laminate 30 in the Z direction overlaps with at least a portion of the terminal block 40 and the smoothing capacitor 4. For example, as shown in Figure 3, a portion of the Z-direction range of the laminate 30 overlaps with at least a portion of the terminal block 40 and the smoothing capacitor 4. However, the entire Z-direction range of the laminate 30 may overlap with at least a portion of the terminal block 40 and the smoothing capacitor 4.

[0050] The terminal block 40 has a first U-phase terminal t11, a first V-phase terminal t12, a first W-phase terminal t13, a second U-phase terminal t21, a second V-phase terminal t22, a second W-phase terminal t23, and a resin molded portion 40a. Furthermore, the terminal block 40 is provided with terminals for electrically connecting the switching element 3 that constitutes the converter 1 to the reactor 21, and terminals for electrically connecting the filter capacitor 6 to the reactor 21. Although not shown in Figure 3, the reactor 21 is housed in the space opposite the terminal block 40 to the bottom wall 81.

[0051] The first U-phase terminal t11, the first V-phase terminal t12, the first W-phase terminal t13, the second U-phase terminal t21, the second V-phase terminal t22, and the second W-phase terminal t23 are connected to the third busbar 503 via a busbar (not shown). The dashed line extending in the Z direction in Figure 3 also indicates the direction of bolt fastening, similar to Figure 4. The terminals that electrically connect the switching element 3 and the reactor 21 constituting the converter 1 are connected to the sixth busbar 506 via a busbar (not shown). That is, the terminal block 40 is connected to the semiconductor module 32 via the third busbar 503 and the sixth busbar 506. The terminals that electrically connect the filter capacitor 6 and the reactor 21 are connected to the fourth busbar 504 via a busbar (not shown). The terminals that electrically connect the filter capacitor 6 and the reactor 21 correspond to terminal block P terminal 40b, which is the part connected to the fourth busbar 504.

[0052] The terminal block 40 may be provided with a first current sensor 41, a second current sensor 42, a third current sensor 43, and a fourth current sensor 44. Furthermore, the resin molded portion 40a of the terminal block 40 is provided with a terminal block fastening portion 40c. The terminal block 40 is fixed to the case 80 by the terminal block fastening portion 40c. The terminal block fastening portion 40c is fixed in the Z direction by a fastening member such as a bolt. There may be one or more terminal block fastening portions 40c. In this embodiment, there are multiple terminal block fastening portions 40c. Note that the number and arrangement of terminal block fastening portions 40c are not limited by Figure 2. As shown in Figure 4, in this embodiment, the Z-direction length from the bottom wall 81 to the terminal block P terminal 40b is longer than the Z-direction length from the bottom wall 81 to the terminal block fastening portion 40c.

[0053] The filter capacitor 6 is positioned alongside the laminate 30 in the Y direction. The filter capacitor 6 is positioned between the terminal block 40 and the smoothing capacitor 4 in the X direction, G. For example, as shown in Figure 2, the entire X-direction range of the filter capacitor 6 lies between G. In this case, the Y-direction position of the filter capacitor 6 does not have to overlap with the Y-direction positions of the terminal block 40 and the smoothing capacitor 4. In other words, the entire Y-direction range of the filter capacitor 6 does not have to overlap with at least a part of the Y-direction range of the terminal block 40 or a part of the Y-direction range of the smoothing capacitor 4.

[0054] However, it is desirable that at least a portion of the Y-direction range of the filter capacitor 6 overlaps with at least a portion of the Y-direction ranges of the terminal block 40 and the smoothing capacitor 4, respectively. Furthermore, it is desirable that the entire Y-direction range of the filter capacitor 6 overlaps with at least a portion of the Y-direction ranges of the terminal block 40 and the smoothing capacitor 4, respectively.

[0055] The position of the filter capacitor 6 in the Z direction overlaps with at least a portion of the terminal block 40 and the smoothing capacitor 4. For example, as shown in Figure 4, the entire Z-direction range of the filter capacitor 6 overlaps with at least a portion of the terminal block 40 and the smoothing capacitor 4. However, a portion of the Z-direction range of the filter capacitor 6 may overlap with at least a portion of the terminal block 40 and the smoothing capacitor 4.

[0056] The filter capacitor 6 comprises a filter capacitor element, a sealing material, a filter capacitor P terminal, a filter capacitor N terminal, and a filter capacitor case 6a. The filter capacitor element is arranged inside the filter capacitor case 6a and covered with the sealing material. The filter capacitor element has a pair of electrodes. The filter capacitor 6 has, for example, multiple filter capacitor elements connected in parallel. The sealing material is an electrically insulating resin such as epoxy resin.

[0057] The filter capacitor 6 is electrically connected to the fourth busbar 504 and the fifth busbar 505. That is, the filter capacitor 6 is connected to the terminal block 40 via the fourth busbar 504 and to the smoothing capacitor 4 via the fifth busbar 505. In this embodiment, the filter capacitor 6 corresponds to an electronic component that is connected to the terminal block 40 via the fourth busbar 504 and to the smoothing capacitor 4 via the fifth busbar 505.

[0058] The filter capacitor P terminal is embedded in the sealing material together with the filter capacitor element, with a portion of it exposed from the sealing material and the smoothing capacitor case 4a. One end of the filter capacitor P terminal is embedded in the sealing material and connected to the positive side of the filter capacitor element. The other end of the filter capacitor P terminal is exposed from the sealing material and connected to the fourth busbar 504. In this embodiment, the other end of the filter capacitor P terminal corresponds to the electronic component P connection portion 6b, which is the part connected to the fourth busbar 504. In the following description, the other end of the filter capacitor P terminal may be referred to as the filter capacitor P connection portion 6b. The filter capacitor P connection portion 6b is connected to the fourth busbar by a fastening member such as a bolt.

[0059] Similarly, the N terminal of the filter capacitor is embedded in the sealing material, with a portion exposed from the sealing material and the filter capacitor case 6a. One end of the N terminal of the filter capacitor is embedded in the sealing material and connected to the negative electrode side of the filter capacitor element. The other end of the N terminal of the filter capacitor is exposed from the sealing material and connected to the fifth busbar 505. In this embodiment, the other end of the N terminal of the filter capacitor corresponds to the electronic component N connection portion 6c, which is the part connected to the fifth busbar 505. In the following description, the other end of the N terminal of the filter capacitor may be referred to as the filter capacitor N connection portion 6c. The N connection portion 6c of the filter capacitor is connected to the fifth busbar 505 by a fastening member such as a bolt.

[0060] The filter capacitor case 6a has a filter capacitor fastening portion 6d. The filter capacitor 6 is fixed to the case 80 by the filter capacitor fastening portion 6d. The filter capacitor fastening portion 6d is fixed in the Z direction by a fastening member such as a bolt. There may be one or more filter capacitor fastening portions 6d. In this embodiment, there are multiple filter capacitor fastening portions 6d.

[0061] Here, among the filter capacitor fastening portions 6d, the one closest to the laminate 30 in the Y direction is designated as the first filter capacitor fastening portion 6e. The first filter capacitor fastening portion 6e corresponds to the first electronic component fastening portion that has the shortest length in the stacking direction to the laminate among the multiple electronic component fastening portions. The number of first filter capacitor fastening portions 6e is not limited by Figure 2. In Figure 2, there are two first filter capacitor fastening portions 6e, but there may be, for example, only one.

[0062] In this embodiment, the length from the laminate 30 to the filter capacitor P connection portion 6b in the Y direction is shorter than the length from the laminate 30 to the first filter capacitor fastening portion 6e. Furthermore, the length from the laminate 30 to the filter capacitor N connection portion 6c in the Y direction is shorter than the length from the laminate 30 to the first filter capacitor fastening portion 6e. Note that the Y-direction length from the laminate 30 to the filter capacitor P connection portion 6b may be greater than or equal to the Y-direction length from the laminate 30 to the first filter capacitor fastening portion 6e. Alternatively, the Y-direction length from the laminate 30 to the filter capacitor N connection portion 6c may be greater than or equal to the Y-direction length from the laminate 30 to the first filter capacitor fastening portion 6e. However, it is desirable that at least one of the above lengths is shorter than the Y-direction length from the laminate 30 to the first filter capacitor fastening portion 6e.

[0063] From the configuration described above, it can be said that one side of the laminate 30 in the X direction is connected to the terminal block 40 by the third busbar 503 and the sixth busbar 506. The opposite side of the laminate 30 in the X direction is connected to the smoothing capacitor 4 by the first busbar 501 and the second busbar 502. In other words, the laminate 30 is fixed to the terminal block 40 and the smoothing capacitor 4 from both sides in the X direction via busbars.

[0064] Similarly, one side of the filter capacitor 6 in the X direction is connected to the terminal block 40 by the fourth busbar 504. The other side of the filter capacitor 6 in the X direction is connected to the smoothing capacitor 4 by the fifth busbar 505. In other words, the filter capacitor 6 is fixed to the terminal block 40 and the smoothing capacitor 4 from both sides in the X direction via busbars.

[0065] The EMI filter 7 is arranged in the Y direction alongside the laminate 30 and the filter capacitor 6. That is, in the Y direction, the laminate 30, filter capacitor 6, and EMI filter 7 are arranged in that order. In the X direction, the EMI filter 7 is positioned between the terminal block 40 and the smoothing capacitor 4. The EMI filter 7 comprises a Y capacitor 72, a choke coil 71, a sealing material, and an EMI filter case 7a, etc. The Y capacitor 72 and the choke coil 71 are arranged, for example, inside the EMI filter case 7a and covered with a sealing material. The Y capacitor 72 has terminals connected to ground, the fourth busbar 504, and the fifth busbar 505, respectively. The choke coil 71 has terminals connected to the fourth busbar 504 and the fifth busbar 505, respectively.

[0066] Each terminal is partially exposed from the sealing material. Each terminal may be connected to the fourth busbar 504 or the fifth busbar 505 by fastening members such as bolts, or by welding. The EMI filter 7 is connected to the filter capacitor 6 via the fourth busbar 504 and the fifth busbar 505. In other words, the EMI filter 7 is connected to the terminal block 40 and the smoothing capacitor 4 via the filter capacitor 6.

[0067] The EMI filter case 7a is fixed to the case 80 by fastening members such as bolts. The EMI filter case 7a is fixed, for example, in the Z direction. This fixes the EMI filter 7 to the case 80.

[0068] <Effects of the First Embodiment> In the power conversion device 100 of this embodiment, the laminate 30 and the filter capacitor 6 are arranged between the smoothing capacitor 4 and the terminal block 40 in the X direction. The laminate 30 is connected to the smoothing capacitor 4 and the terminal block 40 via busbars. The filter capacitor 6 is also connected to the smoothing capacitor 4 and the terminal block 40 via busbars. Here, the laminate 30 is susceptible to external vibrations. These vibrations of the laminate 30 are transmitted to the smoothing capacitor 4 and the terminal block 40 via busbars. In contrast, according to the structure of this disclosure, the smoothing capacitor 4 and the terminal block 40, which are connected to the laminate 30 via busbars, are also connected to the filter capacitor 6 via busbars. In other words, the filter capacitor 6, which is connected to the busbars necessary for forming the electrical circuit, can suppress vibrations of the smoothing capacitor 4 and the terminal block 40, and consequently, vibrations of the laminate 30 can also be suppressed.

[0069] Furthermore, the filter capacitor 6 is an electronic component connected between the high-potential input line and the low-potential input line. In other words, without using any additional materials, the vibration of the laminate 30 can be suppressed by utilizing the busbars necessary for forming the electrical circuit, as described above.

[0070] Furthermore, in the power conversion device 100 of this embodiment, at least a portion of the case 80 facing the laminate 30 in the Z direction is provided with an opening 81a for connecting the semiconductor module 32 to the control board 33. As a result, the laminate 30 becomes more susceptible to vibration in the direction opposite to the opening 81a. In other words, the vibration countermeasure effect of the filter capacitor 6 on the laminate 30 is more easily achieved.

[0071] Furthermore, according to the power converter 100 of this embodiment, the filter capacitor 6 comprises a plurality of filter capacitor fastening portions 6d, a filter capacitor P connection portion 6b, and a filter capacitor N connection portion 6c. The filter capacitor fastening portions 6d are portions fixed to the case 80, and the one with the shortest Y-direction length to the laminate 30 is the first filter capacitor fastening portion 6e. The filter capacitor P connection portion 6b is connected to the fourth busbar 504, and the filter capacitor N connection portion 6c is connected to the fifth busbar 505. In this embodiment, in the Y-direction, at least one of the length from the laminate 30 to the filter capacitor P connection portion and the length from the laminate 30 to the filter capacitor N connection portion 6c is shorter than the length from the laminate 30 to the first filter capacitor fastening portion 6e.

[0072] This allows the length of at least one of the fourth busbar 504 and the fifth busbar 505 to be shortened. Thus, the vibration suppression effect of the smoothing capacitor 4 and the terminal block 40 can be improved, and consequently, the vibration suppression effect of the laminate 30 can be improved.

[0073] Furthermore, in the power conversion device 100 of this embodiment, the length from the bottom wall 81 to the smoothing capacitor N connection part 4b is longer than the length from the bottom wall 81 to the smoothing capacitor fastening part 4c. As a result, vibrations received by the smoothing capacitor 4 can be suppressed at a position further away from the bottom wall 81, which is the mounting surface. Therefore, the vibration countermeasures effect of the smoothing capacitor 4, terminal block 40, and laminate 30 can be improved.

[0074] Furthermore, in the power conversion device 100 of this embodiment, the length from the bottom wall 81 to the terminal block P terminal is longer than the length from the bottom wall 81 to the terminal block fastening portion. As a result, vibrations received by the terminal block 40 can be suppressed at a position further away from the bottom wall 81, which is the mounting surface. Therefore, the vibration countermeasures effect of the smoothing capacitor 4, the terminal block 40, and the laminated body 30 can be improved.

[0075] (Other Embodiments) The disclosures of this specification are not limited to the exemplary embodiments. The disclosures encompass the exemplary embodiments and variations thereof by those skilled in the art. For example, the disclosures are not limited to the combinations of parts and elements shown in the embodiments, but can be implemented in various variations. The disclosures can be implemented in a variety of combinations. The disclosures may have additional parts that can be added to the embodiments. The disclosures encompass embodiments in which parts and elements have been omitted. The disclosures encompass substitutions or combinations of parts and elements between one embodiment and another. The scope of the disclosed technical field is not limited to the descriptions of the embodiments. The scope of the disclosed technical field is indicated by the claims and should be understood to include all modifications within the meaning and scope equivalent to the claims.

[0076] The disclosures in the specification and drawings are not limited by the claims. The disclosures in the specification and drawings encompass the technical ideas described in the claims and extend to a wider and more diverse range of technical ideas than those described in the claims. Therefore, a variety of technical ideas can be extracted from the disclosures in the specification and drawings without being bound by the claims.

[0077] When an element or layer is referred to as “on top of,” “connected to,” “linked to,” or “joined,” it may be directly on top of, connected to, or joined to another element or layer, and there may also be an intervening element or layer. In contrast, when an element is referred to as “directly on top of,” “directly connected to,” “directly linked to,” or “directly joined to” another element or layer, there is no intervening element or layer. Other words used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” vs. “directly between,” “adjacent” vs. “directly adjacent,” etc.). As used in this specification, the term “and / or” includes any combination and all combinations relating to one or more of the enumerated items in question. That is, the statement A and / or B means at least one of A and B.

[0078] Spatially relative terms such as “inside,” “outside,” “back,” “below,” “low,” “above,” and “high” are used here to facilitate descriptions of the relationship between one element or feature and other elements or features, as illustrated. Spatially relative terms may be intended to encompass different orientations of the device in use or operation, in addition to the orientation depicted in the drawings. For example, if the device in the drawing is turned upside down, an element described as “below” or “directly below” another element or feature will be oriented “above” the other element or feature. Thus, the term “below” can encompass both up and down orientations. The device may also be oriented in other directions (it may be rotated 90 degrees or in other directions), and the spatially relative descriptors used in this specification will be interpreted accordingly.

[0079] In the first embodiment described above, the power converter 100 has an EMI filter 7, but it does not have to have an EMI filter 7. Alternatively, the arrangement of the filter capacitor 6 and the EMI filter 7 may be reversed. That is, the terminal block 40 may be connected to the EMI filter 7 via the fourth busbar 504, and the smoothing capacitor 4 may be connected to the EMI filter 7 via the fifth busbar 505. Here, the EMI filter 7 is an electronic component connected between the high-potential input line and the low-potential input line. In other words, even in this case, vibration of the laminate can be suppressed by utilizing the busbars necessary for forming the electrical circuit without using additional members.

[0080] In the above structure, the portion where the EMI filter 7 is connected to the fourth busbar 504 is designated as the EMI filter P connection portion. The portion where the EMI filter 7 is connected to the fifth busbar 505 is designated as the EMI filter N connection portion. Of the portions where the EMI filter 7 is fixed to the case 80, the portion with the shortest Y-direction length to the laminate 30 is designated as the first EMI filter fastening portion. The Y-direction length from the laminate 30 to the EMI filter P connection portion may be shorter than the Y-direction length from the laminate 30 to the first EMI filter fastening portion. The Y-direction length from the laminate 30 to the EMI filter N connection portion may be shorter than the Y-direction length from the laminate 30 to the first EMI filter fastening portion.

[0081] In the first embodiment described above, an opening 81a is provided in at least a portion of the bottom wall 81 that faces the laminate 30 in the Z direction. However, the opening 81a is not required. In this case, the control board 33 is housed in the same housing space as, for example, the semiconductor module 32. Alternatively, in Figure 3, the encapsulant 323 of the semiconductor module 32 penetrates the opening 81a in the Z direction, but it does not have to penetrate. For example, the encapsulant 323 of the semiconductor module 32 is located above the bottom wall 81 in the Z direction, and the signal terminal 322 may penetrate the opening 81a.

[0082] (Disclosure of Technical Ideas) This specification discloses several technical ideas as described in the following paragraphs. Some paragraphs may be written in a multiple dependent form, where subsequent paragraphs optionally refer to preceding paragraphs. Furthermore, some paragraphs may be written in a multiple dependent form, where they refer to other multiple dependent forms. These paragraphs written in multiple dependent forms define several technical ideas.

[0083] (Technical Concept 1) A plurality of semiconductor modules (32) arranged in a stack, each containing a semiconductor switching element; a plurality of heat exchangers (31c) arranged in a stack between the plurality of semiconductor modules to cool the semiconductor modules; a smoothing capacitor (4) connected to the plurality of semiconductor modules via a first busbar (501) and a second busbar (502); a terminal block (40) connected to the plurality of semiconductor modules via a third busbar (503); electronic components (6, 7) connected to the terminal block via a fourth busbar (504) and to the smoothing capacitor via a fifth busbar (505); and a stack (30) formed by the semiconductor modules and the heat exchangers, the smoothing capacitor, the terminal block, and the electronic components, wherein the first busbar and the fourth busbar form high-potential input lines (51, 52), and the second busbar and the fifth busbar form low-potential input lines (60). The third busbar forms an output line (70), and the laminate and the electronic components are arranged between the smoothing capacitor and the terminal block (G) in a direction perpendicular to the lamination direction of the laminate, in a power conversion device.

[0084] (Technical Concept 2) The power conversion device according to Technical Concept 1, wherein the electronic component is a filter capacitor (6) that suppresses pulsation of DC current.

[0085] (Technical Concept 3) The power conversion device according to Technical Concept 1, wherein the electronic component is an EMI filter (7) that suppresses electromagnetic interference.

[0086] (Technical Concept 4) The power conversion device according to any one of Technical Concepts 1 to 3, wherein the smoothing capacitor, the terminal block, and the electronic components are fixed to the case.

[0087] (Technical Idea 5) A power conversion device according to any one of Technical Ideas 1 to 4, wherein the direction perpendicular to both the arrangement direction of the smoothing capacitor, the laminate, and the terminal block and the stacking direction of the laminate is defined as the orthogonal direction, and an opening (81a) for connecting the semiconductor module to a control board (33) is provided in at least a part of the portion of the case that faces the laminate in the orthogonal direction.

[0088] (Technical Idea 6) The power conversion device according to any one of Technical Ideas 1 to 5, wherein the electronic component comprises a plurality of electronic component fastening portions (6d) which are fixed to the case, an electronic component P connection portion (6b) which is connected to the fourth busbar, and an electronic component N connection portion (6c) which is connected to the fifth busbar, wherein the first electronic component fastening portion (6e) is the one with the shortest length in the stacking direction to the laminate, and at least one of the length from the laminate to the electronic component P connection portion and the length from the laminate to the electronic component N connection portion is shorter than the length from the laminate to the first electronic component fastening portion in the stacking direction.

[0089] (Technical Idea 7) The power conversion device according to any one of Technical Ideas 1 to 6, wherein the case has a bottom wall (81) on which the smoothing capacitor, the terminal block, and the electronic components are placed, the smoothing capacitor comprises a smoothing capacitor fastening portion (4c) which is a portion fixed to the case, and a smoothing capacitor N connection portion (4b) which is a portion connected to the fifth busbar, and the length from the bottom wall to the smoothing capacitor N connection portion is longer than the length from the bottom wall to the smoothing capacitor fastening portion in a direction perpendicular to both the direction of arrangement of the smoothing capacitor, the laminate, and the terminal block and the stacking direction of the laminate.

[0090] (Technical Idea 8) The power conversion device according to any one of Technical Ideas 1 to 6, wherein the case has a bottom wall (81) on which the smoothing capacitor, the terminal block, and the electronic components are placed, the terminal block comprises a terminal block fastening portion (40c) which is fixed to the case, and a terminal block P terminal (40b) which is connected to the fourth busbar, and the length from the bottom wall to the terminal block P terminal is longer than the length from the bottom wall to the terminal block fastening portion in a direction perpendicular to both the direction in which the smoothing capacitor, the laminate, and the terminal block are arranged and the stacking direction of the laminate.

Claims

1. The device comprises: a plurality of stacked semiconductor modules (32) each containing a semiconductor switching element; a plurality of heat exchangers (31c) stacked between the plurality of semiconductor modules for cooling the semiconductor modules; a smoothing capacitor (4) connected to the plurality of semiconductor modules via a first busbar (501) and a second busbar (502); a terminal block (40) connected to the plurality of semiconductor modules via a third busbar (503); electronic components (6, 7) connected to the terminal block via a fourth busbar (504) and to the smoothing capacitor via a fifth busbar (505); and a laminate (30) formed by the semiconductor modules and the heat exchangers, the smoothing capacitor, the terminal block, and the electronic components, wherein the first busbar and the fourth busbar form high-potential input lines (51, 52), and the second busbar and the fifth busbar form low-potential input lines (60). The third busbar forms an output line (70), and the laminate and the electronic components are arranged between the smoothing capacitor and the terminal block (G) in a direction perpendicular to the lamination direction of the laminate, in a power conversion device.

2. The power conversion device according to claim 1, wherein the electronic component is a filter capacitor (6) that suppresses pulsation of DC current.

3. The power conversion device according to claim 1, wherein the electronic component is an EMI filter (7) that suppresses electromagnetic interference.

4. The power conversion device according to any one of claims 1 to 3, wherein the smoothing capacitor, the terminal block, and the electronic components are fixed to the case.

5. The power conversion device according to any one of claims 1 to 3, wherein the direction perpendicular to both the arrangement direction of the smoothing capacitor, the laminate, and the terminal block and the stacking direction of the laminate is defined as the orthogonal direction, and at least a portion of the case facing the laminate in the orthogonal direction is provided with an opening (81a) for connecting the semiconductor module to a control board (33).

6. The power conversion device according to any one of claims 1 to 3, wherein the electronic component comprises a plurality of electronic component fastening portions (6d) which are fixed to the case, an electronic component P connection portion (6b) which is connected to the fourth busbar, and an electronic component N connection portion (6c) which is connected to the fifth busbar, wherein the first electronic component fastening portion (6e) is the one with the shortest length in the stacking direction to the laminate, and at least one of the length from the laminate to the electronic component P connection portion and the length from the laminate to the electronic component N connection portion is shorter than the length from the laminate to the first electronic component fastening portion in the stacking direction.

7. The power conversion device according to any one of claims 1 to 3, wherein the case has a bottom wall (81) on which the smoothing capacitor, the terminal block, and the electronic components are mounted, the smoothing capacitor comprises a smoothing capacitor fastening portion (4c) which is a portion fixed to the case, and a smoothing capacitor N connection portion (4b) which is a portion connected to the fifth busbar, and the length from the bottom wall to the smoothing capacitor N connection portion is longer than the length from the bottom wall to the smoothing capacitor fastening portion in a direction perpendicular to both the direction of arrangement of the smoothing capacitor, the laminate, and the terminal block and the stacking direction of the laminate.

8. The power conversion device according to any one of claims 1 to 3, wherein the case has a bottom wall (81) on which the smoothing capacitor, the terminal block, and the electronic components are placed, the terminal block comprises a terminal block fastening portion (40c) which is fixed to the case, and a terminal block P terminal (40b) which is connected to the fourth busbar, and the length from the bottom wall to the terminal block P terminal is longer than the length from the bottom wall to the terminal block fastening portion in a direction perpendicular to both the direction in which the smoothing capacitor, the laminate, and the terminal block are arranged and the stacking direction of the laminate.

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