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1results about "Frictional elements" patented technology

Multi-layer sub pad for CMP processes

An apparatus includes a top pad having a first plurality of protrusions and a first plurality of grooves between the first plurality of protrusions, a first adhesive film underlying the top pad, and an anti-deformation layer underlying and attached to the top pad through the first adhesive film. The anti-deformation layer has a first Young's modulus and a first Poisson's ratio. The apparatus further includes a second adhesive film underlying the anti-deformation layer, and a main support layer underlying and attached to the anti-deformation layer through the second adhesive film. The main support layer has a second Young's modulus lower than the first Young's modulus.
Owner:TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD