4results about How to "Avoid oxygen inhibition" patented technology

The invention provides a UV fixing adhesive for fixing a photovoltaic module, a preparation method and application, the UV fixing adhesive is characterized by comprising, by mass, 50-70% of polyurethane acrylic resin, 30-50% of a reactive diluent, 1-4% of a photoinitiator and 0-2% of fumed silica; the reactive diluent comprises an acrylic diluent and a thiol diluent in a mass ratio of (0.5: 1)-(6: 1); according to the selected polyurethane acrylic resin, the refractive index range of an acrylic acid diluent is 1.460 to 1.500, and the refractive index range of a mercaptan diluent is 1.500 to 1.525. According to the invention, the oxygen inhibition problem is solved by increasing the dosage of the photoinitiator and selecting the mercaptan diluent and the high-activity resin or monomer, meanwhile, the bright line problem is solved by selecting the resin or monomer within a certain refractive index range, and the trace problem is solved by selecting the yellowing-resistant and shrinkage-resistant resin or monomer, so that the glue has excellent curing and aging-resistant properties, and the service life of the glue is prolonged. And the light utilization rate of the photovoltaic module is improved.

An electron beam curing method, materials, and equipment for complex ceramic components are disclosed. This method employs a focused electron beam with a variable beam diameter to selectively cure and form ceramic materials containing photosensitive resin, layer by layer, to create complex components. These components are then sintered to obtain the final complex ceramic component. Due to the high penetration of the electron beam and the real-time control of the beam diameter, this method can not only form complex, irregularly shaped, high-density components such as ultrafine carbides, nitrides, and ultra-high temperature ceramics, but also reduce the difficulty of sintering. Simultaneously, the real-time adjustment of the beam diameter allows for efficient filling of large areas within complex components and precise shaping of fine contours. Furthermore, the high vacuum requirement during electron beam curing significantly reduces defects such as pores within the material. Since electron beam curing can reduce or eliminate the need for initiators, the storage stability of the prepared ceramic materials is also greatly improved. This represents a novel additive manufacturing process for high-performance complex ceramic components.

The invention discloses a high-molecular photosensitive material and a preparation method thereof, and relates to the field of photosensitive materials. Nano zinc boride modified organic silicon resin modified epoxy resin is used as modified resin, hydroxyl groups on the surface of the epoxy resin and borate groups form hydrogen bonds or are subjected to a condensation reaction, cohesion of the material is enhanced, crosslinking points of the epoxy resin are increased due to introduction of the organic silicon resin, a complex crosslinking net structure is formed, and the performance of the material is improved; boron is introduced to form a strong B-O bond, the stability of the resin is improved, zinc ions can promote formation of a carbon layer in the combustion process, the structure of an expanded carbon layer is improved, and the flame retardance of the material is improved. According to the invention, the alkenyl phosphite modified epoxy acrylic resin is used as a film-forming main material and has strong compatibility with the modified epoxy resin, and the synthesized material has stable performance; the introduction of the alkenyl phosphite group can reduce the viscosity of the resin, prevent UV yellowing and improve the photocuring rate. The light-sensitive material prepared by the invention is rapid in light curing and stable in chemical performance.

The invention provides an anti-oxygen and anti-light condensation curing device and method.The anti-oxygen and anti-light condensation curing device comprises a light generator and a curing cavity assembly, the curing cavity assembly comprises an upper cover, a curing cavity body and an inflation assembly, the upper cover has an open state and a closed state relative to the curing cavity body, and the inflation assembly is arranged in the curing cavity body; when the upper cover is in a closed state, the curing chamber body and the upper cover form a sealing structure, and the gas charging assembly is used for charging inert gas into the sealing structure; a to-be-cured substrate containing space is formed in the curing chamber body, and the light generator is used for emitting curing light and conducting light curing on the to-be-cured substrate through the upper cover. According to the UV curing device, the upper cover is controlled to have the opening state and the closing state relative to the curing chamber body, the sealed curing chamber is built, inert gas is inflated into the sealing structure in combination with the inflation assembly, and UV curing in a sealed oxygen-free environment is achieved.