1results about How to "Easy conduction" patented technology

This application discloses a heat dissipation system for electronic devices, comprising: a liquid cooling plate; microchannels disposed within the liquid cooling plate for containing a cooling medium; a circulation mechanism disposed on the liquid cooling plate and communicating with the microchannels to circulate the cooling medium within the microchannels; and a fan disposed on the liquid cooling plate. As the cooling medium flows within the microchannels, it conducts heat while simultaneously carrying it away, achieving "flow transport" of heat. Simultaneously, the microchannels and the liquid cooling plate have a larger contact area, making it easier for heat transferred from the electronic device to the liquid cooling plate to be conducted to the cooling medium. The fan, disposed on the liquid cooling plate, forms active air convection. This application combines the active flow heat dissipation of the microchannels with the active air convection heat dissipation of the fan, ensuring continuous active heat transport and dissipation throughout the process, resulting in a fast response and significantly improved heat dissipation efficiency.