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A high-precision high-density line impedance signal processing board pressing device

ActiveCN120417236BSmooth disengagementEffectively breaks adhesionsMechanical engineeringSignal processing
The application relates to the technical field of signal processing plate production, and particularly discloses a high-precision high-density circuit impedance signal processing plate pressing device, the side surface of a main body is fixedly connected with a feeding component, the side, away from the feeding component, of the main body is fixedly connected with a discharging component, and the top of the feeding component and the discharging component is fixedly connected with clamping components. The high-precision high-density circuit impedance signal processing plate pressing device is provided with a striking assembly, in the pressing process, the circuit board may be slightly adhered at the inner cavity of the placing seat, the adhesion can be effectively broken through striking vibration, the circuit board can be smoothly separated from the inner cavity of the placing seat, the discharging efficiency is improved, and the problem of poor discharging or material jamming caused by adhesion is avoided; if the circuit board is jammed in the placing seat due to adhesion in production, manual intervention is needed, and the continuity of production is reduced, and the vibration design can effectively avoid such a situation.
Owner:江苏金一辰电子科技有限公司