A high-precision high-density line impedance signal processing board pressing device

Abstract

The application relates to the technical field of signal processing plate production, and particularly discloses a high-precision high-density circuit impedance signal processing plate pressing device, the side surface of a main body is fixedly connected with a feeding component, the side, away from the feeding component, of the main body is fixedly connected with a discharging component, and the top of the feeding component and the discharging component is fixedly connected with clamping components. The high-precision high-density circuit impedance signal processing plate pressing device is provided with a striking assembly, in the pressing process, the circuit board may be slightly adhered at the inner cavity of the placing seat, the adhesion can be effectively broken through striking vibration, the circuit board can be smoothly separated from the inner cavity of the placing seat, the discharging efficiency is improved, and the problem of poor discharging or material jamming caused by adhesion is avoided; if the circuit board is jammed in the placing seat due to adhesion in production, manual intervention is needed, and the continuity of production is reduced, and the vibration design can effectively avoid such a situation.

Description

Technical Field

[0001] This invention relates to the field of signal processing board manufacturing technology, specifically to a pressing device for a high-precision, high-density line impedance signal processing board. Background Technology

[0002] Modern electronic devices such as smartphones, tablets, and wearable devices require integrating more functions within a limited space, necessitating a more compact layout of circuit board lines and components. Simultaneously, high-performance computing devices and communication base stations require processing high-speed, high-frequency signals, demanding extremely high precision and speed in signal processing. To meet these needs, high-precision, high-density line impedance signal processing boards have emerged, enabling the implementation of numerous complex functions within a small size while ensuring high-quality signal transmission and processing. These circuit boards require the integration of a large number of electronic components at extremely high density within a limited space, while simultaneously ensuring high precision and stability of signal transmission, placing extremely stringent requirements on line impedance control.

[0003] In some existing technologies, after the circuit board is laminated, it gets stuck in the placement seat due to adhesion during the unloading process. This adhesion-induced unloading or jamming problem not only requires manual intervention but also reduces the continuity of production. Summary of the Invention

[0004] To achieve the above objectives, the present invention provides the following technical solution: a pressing device for a high-precision, high-density line impedance signal processing board, comprising:

[0005] The main body has a feeding component fixedly connected to its side, a discharging component fixedly connected to the side of the main body away from the feeding component, and a clamping component fixedly connected to the top of both the feeding component and the discharging component.

[0006] A pressing component is used to press the circuit board, and the bottom of the pressing component is fixedly connected to the top of the main body;

[0007] The pressing component includes a base plate, the bottom of which is fixedly connected to the top of the main body. A guide rod is fixedly connected to the top of the base plate, a top plate is fixedly connected to the top of the guide rod, an output mechanism is fixedly connected to the top of the top plate, a movable plate is slidably connected to the side of the guide rod, an upper pressure plate is fixedly connected to the bottom of the movable plate, a placement mechanism is fixedly connected to the top of the base plate, and the output end of the conveying mechanism is fixedly connected to the top of the movable plate.

[0008] The circuit board is placed in the placement mechanism by the clamping component on the feeding component. By opening the output mechanism, the output end of the output mechanism drives the moving plate to move downward, so that the moving plate drives the upper pressure plate to move towards the placement mechanism. The upper pressure plate continues to descend, applying a certain pre-pressure, so that the circuit board and the inner cavity of the placement mechanism are initially attached. At the same time, the air between the circuit board and the pressing material is squeezed out. This process helps to improve the pressing quality and reduce the generation of defects such as bubbles.

[0009] The placement mechanism includes a placement plate and a placement seat. The bottom of the placement plate is fixedly connected to the top of the base plate. Slide rods are fixedly connected to both sides of the bottom of the placement seat. The bottom of the slide rods is slidably connected to the inner side of the placement plate. Connecting shafts are slidably connected to both sides of the top of the placement plate. A first spring is sleeved on the connecting shaft. The top of the first spring is fixedly connected to the bottom of the placement seat. The bottom of the first spring is fixedly connected to the top of the placement plate. An extrusion groove is formed on the inner side of the placement plate. An impact component is fixedly connected to the inner side of the extrusion groove.

[0010] The circuit board is placed in the inner cavity of the placement seat. The moving plate is driven by the output end of the output mechanism, which causes the moving plate to move the upper pressure plate downward. When the moving plate is pressed against the top of the placement seat, the placement seat is subjected to the pressure, which causes the placement seat to move the slide bar towards the placement plate, thereby pressing the first spring. At the same time, the placement seat moves downward in the inner side of the placement plate through the connecting shaft, so that the impact component moves downward with the placement plate.

[0011] Preferably, the impact assembly includes a connecting plate, the side of which is fixedly connected to the inner side of the extrusion groove, an impact rod is slidably connected to the inner side of the connecting plate, the top of the impact rod is fixedly connected to the bottom of the placement seat, and an impact block is fixedly connected to the bottom of the impact rod.

[0012] After the pressing work is completed, the moving plate is driven to move upward through the output end of the output mechanism, so that the upper pressure plate is released from the squeezing force on the placement seat. The placement seat is stretched and reset by the first spring and moves upward. At the same time, the placement seat drives the slide rod to move upward, so that the side of the impact block impacts the bottom of the connecting plate. This causes the pressed circuit board in the cavity of the placement seat to impact and vibrate after the circuit board is pressed, so as to avoid interfering with the circuit board unloading work.

[0013] During the pressing process, the circuit board may slightly stick together in the inner cavity of the placement seat. By impacting and vibrating, this sticking can be effectively broken, allowing the circuit board to be smoothly detached from the inner cavity of the placement seat. This avoids material feeding problems or jamming caused by sticking, and improves material feeding efficiency. If the circuit board is stuck in the placement seat due to sticking during production, not only will manual intervention be required, but the continuity of production will also be reduced. Vibration design can effectively avoid such situations.

[0014] Preferably, the clamping component includes a bracket, the bottom of which is fixedly connected to the top of the unloading component, a connecting mechanism is fixedly connected to the side of the bracket near the main body, and a gripping mechanism is fixedly connected to the output end of the connecting mechanism.

[0015] After the circuit board is pressed, the output end of the connecting mechanism starts according to the preset program instructions, driving the gripping mechanism to move along the bracket track to the top of the placement seat. During this process, the high-precision positioning system ensures that the gripping mechanism is accurately aligned with the circuit board on the placement seat. When the gripping mechanism is accurately positioned, its internal clamping components start to move. The grippers are pneumatically controlled to open, adjust to the appropriate size, and then close to stably grip the circuit board.

[0016] After grabbing the circuit board, the output end of the connecting mechanism moves again, driving the grabbing mechanism to move along a predetermined trajectory and move the circuit board above the unloading component. Driven by the connecting mechanism, the grabbing mechanism returns to the initial position and waits for the next grabbing task, while the unloading component transports the circuit board to the subsequent process to complete the entire unloading process.

[0017] Preferably, the unloading component includes a conveying mechanism, the side of the conveying mechanism is fixedly connected to both sides of the main body, a conveyor belt is sleeved on the side of the conveying mechanism, and a contact mechanism is fixedly connected to the bottom of the conveying mechanism;

[0018] By activating the transmission mechanism, the motor, as the power source of the transmission mechanism, generates rotational power after being powered on. The motor's shaft is connected to the transmission mechanism, which transmits the power to the transmission mechanism. The transmission mechanism generally includes gears and belt assemblies, which transmit the motor's power to the rollers. The rollers are in close contact with the conveyor belt. When the rollers rotate under the drive of the transmission device, the friction between the rollers and the conveyor belt drives the conveyor belt to move. The gripping mechanism places the pressed circuit board on the transmission mechanism for unloading. At the same time, the contact mechanism cleans the conveyor belt during operation.

[0019] Preferably, the contact mechanism includes a contact frame, the top of which is fixedly connected to the bottom of the conveying mechanism. Sliding rods are slidably connected to both sides of the top of the contact frame. A second spring is sleeved on each sliding rod. The top of the second spring is fixedly connected to the bottom of a contact plate, and the bottom of the second spring is fixedly connected to the top of the contact frame. A contact plate is fixedly connected to the top of the sliding rod. Circular holes are evenly distributed on the top of the contact plate. A rubber plate is fixedly connected to one side of the top of the contact plate. The side of the rubber plate away from the contact plate contacts the side of the conveyor belt. A scraper is fixedly connected to the other side of the top of the contact plate. A fixing frame is fixedly connected to the middle of the top of the contact plate, and a contact roller is rotatably connected to the top of the fixing frame.

[0020] When the conveyor belt is in operation, a rubber plate and a scraper are installed at the bottom of the conveyor belt. The rubber plate has a greater bending angle than the scraper. As the conveyor belt rotates, the scraper can remove debris, dust, and other impurities adhering to the surface of the conveyor belt, preventing these impurities from accumulating on the conveyor belt. The rubber plate can further wipe the conveyor belt, cleaning up any small particles that the scraper could not completely remove, thus playing a secondary cleaning role. This keeps the conveyor belt clean and prevents impurities from contaminating the circuit board or affecting the normal operation of the conveyor belt.

[0021] Meanwhile, when the contact pressure between the scraper and the impurities attached to the conveyor belt is greater than the tensile force of the second spring on the contact plate, the second spring contracts, causing the contact plate to move downwards via the sliding rod, thus preventing excessive pressure between the scraper and the side of the conveyor belt, which could cause scratch damage to the side of the conveyor belt.

[0022] This invention provides a lamination device for a high-precision, high-density line impedance signal processing board. It has the following advantages:

[0023] 1. The pressing device of this high-precision, high-density line impedance signal processing board is equipped with an impact component. During the pressing process, the circuit board may slightly stick together in the inner cavity of the placement seat. Through impact vibration, this sticking can be effectively broken, allowing the circuit board to smoothly detach from the inner cavity of the placement seat. This avoids material feeding problems or jamming caused by sticking, and improves material feeding efficiency. If the circuit board is stuck in the placement seat due to sticking during production, not only is manual intervention required, but the continuity of production is also reduced. The vibration design can effectively avoid such situations.

[0024] 2. The pressing device of this high-precision, high-density line impedance signal processing board is equipped with a rubber plate. The rubber plate has a certain degree of elasticity and softness, which can act as a buffer between the scraper and the conveyor belt, reducing direct wear on the conveyor belt and extending its service life. At the same time, the rubber plate has a large bending angle, allowing it to better conform to the surface of the conveyor belt. As the conveyor belt rotates, it can change shape with the belt, further protecting it and preventing scratches or damage from contact with hard objects.

[0025] 3. The pressing device of this high-precision, high-density line impedance signal processing board is equipped with a contact roller. By placing the contact roller in the middle of the top of the contact plate, the surface of the conveyor belt can be smoothed after the scraper cleans the conveyor belt. This makes the surface of the conveyor belt smoother after the scraper cleans it, which is conducive to the stable conveying of items on the conveyor belt and reduces the shaking or displacement of items caused by uneven conveyor belt surfaces.

[0026] 4. The pressing device of this high-precision, high-density line impedance signal processing board is equipped with a contact mechanism. The combined use of the rubber plate and scraper can effectively clean the material residue on the conveyor belt, preventing material from accumulating at the bottom of the conveyor belt. This helps maintain the stability of the conveyor belt operation, prevents the conveyor belt from running off-track or malfunctioning due to material residue, and thus ensures that materials such as circuit boards can be smoothly and accurately transported to the designated position. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the pressing device for the high-precision, high-density line impedance signal processing board of the present invention.

[0028] Figure 2 This is an axonometric view of the present invention;

[0029] Figure 3 This is a schematic diagram of the pressing component of the present invention;

[0030] Figure 4 This is a schematic diagram of the placement mechanism of the present invention;

[0031] Figure 5 This is a cross-sectional view of the placement mechanism of the present invention;

[0032] Figure 6 This is a schematic diagram of the impact component of the present invention;

[0033] Figure 7 This is a schematic diagram of the structure of the clamping component of the present invention;

[0034] Figure 8 This is a schematic diagram of the material feeding component of the present invention;

[0035] Figure 9This is a schematic diagram of the contact mechanism of the present invention.

[0036] In the diagram: 1. Main body; 2. Pressing component; 21. Base plate; 22. Guide rod; 23. Top plate; 24. Output mechanism; 25. Moving plate; 27. Upper pressure plate; 28. Placement mechanism; 281. Placement plate; 282. Placement seat; 283. Slide rod; 284. First spring; 285. Extrusion groove; 286. Impact assembly; 2861. Connecting plate; 2862. Impact rod; 2863. Impact block; 287. Connecting shaft; 3. Feeding component; 4. Unloading component; 41. Transmission mechanism; 42. Conveyor belt; 43. Contact mechanism; 431. Contact frame; 432. Slide rod; 433. Contact plate; 434. Second spring; 435. Circular hole; 436. Rubber plate; 437. Scraper; 438. Fixing frame; 439. Contact roller; 5. Clamping component; 51. Support; 52. Connecting mechanism; 53. Gripping mechanism. Detailed Implementation

[0037] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] Please see Figures 1-3 This invention provides a technical solution: a pressing device for a high-precision, high-density line impedance signal processing board, comprising:

[0039] The main body 1 has a feeding component 3 fixedly connected to its side, and a discharging component 4 fixedly connected to the side of the main body 1 away from the feeding component 3. Both the feeding component 3 and the discharging component 4 have clamping components 5 fixedly connected to their tops.

[0040] Pressing component 2 is used to press the circuit board, and the bottom of the pressing component 2 is fixedly connected to the top of the main body 1.

[0041] The pressing component 2 includes a base plate 21, the bottom of which is fixedly connected to the top of the main body 1. A guide rod 22 is fixedly connected to the top of the base plate 21. A top plate 23 is fixedly connected to the top of the guide rod 22. An output mechanism 24 is fixedly connected to the top of the top plate 23. A movable plate 25 is slidably connected to the side of the guide rod 22. An upper pressure plate 27 is fixedly connected to the bottom of the movable plate 25. A placement mechanism 28 is fixedly connected to the top of the base plate 21. The output end of the output mechanism 24 is fixedly connected to the top of the movable plate 25.

[0042] The circuit board is placed in the placement mechanism 28 by the clamping component 5 on the feeding component 3. By opening the output mechanism 24, the output end of the output mechanism 24 drives the moving plate 25 to move downward, so that the moving plate 25 drives the upper pressure plate 27 to move towards the placement mechanism 28. The upper pressure plate 27 continues to descend, applying a certain pre-pressure, so that the circuit board and the inner cavity of the placement mechanism 28 are initially attached, and at the same time the air between the circuit board and the pressing material is squeezed out. This process helps to improve the pressing quality and reduce the generation of defects such as bubbles.

[0043] Please see Figures 1-5 The placement mechanism 28 includes a placement plate 281 and a placement seat 282. The bottom of the placement plate 281 is fixedly connected to the top of the base plate 21. Slide rods 283 are fixedly connected to both sides of the bottom of the placement seat 282. The bottom of the slide rods 283 is slidably connected to the inner side of the placement plate 281. Connecting shafts 287 are slidably connected to both sides of the top of the placement plate 281. A first spring 284 is sleeved on the connecting shaft 287. The top of the first spring 284 is fixedly connected to the bottom of the placement seat 282. The bottom of the first spring 284 is fixedly connected to the top of the placement plate 281. An extrusion groove 285 is opened on the inner side of the placement plate 281. An impact component 286 is fixedly connected to the inner side of the extrusion groove 285.

[0044] The circuit board is placed in the inner cavity of the placement seat 282. The moving plate 25 is driven by the output end of the output mechanism 24, so that the moving plate 25 drives the upper pressure plate 27 to move downward. When the moving plate 25 is pressed against the top of the placement seat 282, the placement seat 282 is subjected to the compressive force, so that the placement seat 282 drives the slide bar 283 to move towards the placement plate 281, thereby compressing the first spring 284. At the same time, the placement seat 282 moves downward in the inner side of the placement plate 281 through the connecting shaft 287, so that the impact component 286 moves downward with the placement plate 281.

[0045] Please see Figures 1-6 The impact assembly 286 includes a connecting plate 2861, the side of the connecting plate 2861 is fixedly connected to the inner side of the extrusion groove 285, an impact rod 2862 is slidably connected to the inner side of the connecting plate 2861, the top of the impact rod 2862 is fixedly connected to the bottom of the placement seat 282, and an impact block 2863 is fixedly connected to the bottom of the impact rod 2862.

[0046] After the pressing work is completed, the moving plate 25 moves upward through the output end of the output mechanism 24, thereby causing the upper pressure plate 27 to release the pressure on the placement seat 282. The placement seat 282 moves upward through the tension reset of the first spring 284. At the same time, the placement seat 282 drives the slide rod 283 to move upward, so that the side of the impact block 2863 impacts the bottom of the connecting plate 2861. After the circuit board is pressed, the pressed circuit board in the cavity of the placement seat 282 is impacted and vibrated to avoid interfering with the circuit board unloading work.

[0047] During the pressing process, the circuit board may become slightly stuck in the inner cavity of the placement seat 282. Impact and vibration can effectively break this adhesion, allowing the circuit board to be smoothly detached from the inner cavity of the placement seat 282, avoiding material feeding problems or jamming caused by adhesion, and improving material feeding efficiency. If the circuit board is stuck in the placement seat 282 due to adhesion during production, not only will manual intervention be required, but the continuity of production will also be reduced. The vibration design can effectively avoid such situations.

[0048] Please see Figures 1-7 The clamping component 5 includes a bracket 51, the bottom of which is fixedly connected to the top of the unloading component 4. A connecting mechanism 52 is fixedly connected to the side of the bracket 51 near the main body 1, and a gripping mechanism 53 is fixedly connected to the output end of the connecting mechanism 52.

[0049] After the circuit board is pressed, the output end of the connecting mechanism 52 starts according to the preset program instructions, driving the gripping mechanism 53 to move along the track of the bracket 51 to the top of the placement seat 282. During this process, the high-precision positioning system ensures that the gripping mechanism 53 is accurately aligned with the circuit board on the placement seat 282. When the gripping mechanism 53 is accurately positioned, its internal clamping components start to move. The grippers are pneumatically controlled to open, adjust to the appropriate size, and then close to stably grip the circuit board.

[0050] After the circuit board is picked up, the output end of the connecting mechanism 52 is activated again, driving the picking mechanism 53 to move along a predetermined trajectory and move the circuit board above the unloading component 4. Under the drive of the connecting mechanism 52, the picking mechanism 53 returns to the initial position and waits for the next picking task, while the unloading component 4 transports the circuit board to the subsequent process to complete the entire unloading process.

[0051] This invention provides a technical solution: Please refer to Figures 1-8 The feeding component 4 includes a conveying mechanism 41. The side of the conveying mechanism 41 is fixedly connected to both sides of the main body 1. A conveyor belt 42 is sleeved on the side of the conveying mechanism 41. A contact mechanism 43 is fixedly connected to the bottom of the conveying mechanism 41.

[0052] By activating the transmission mechanism 41, the motor, as the power source of the transmission mechanism 41, generates rotational power after being powered on. The motor shaft is connected to the transmission mechanism, which transmits the power to the transmission mechanism. The transmission mechanism generally includes gear and belt assembly, which transmits the power of the motor to the roller. The roller is in close contact with the conveyor belt 42. When the roller rotates under the drive of the transmission device, it drives the conveyor belt 42 to move by relying on the friction between the roller and the conveyor belt 42. The gripping mechanism 53 is placed on the transmission mechanism 41 to press the circuit board for unloading. At the same time, the contact mechanism 43 cleans the conveyor belt 42 during operation.

[0053] Please see Figures 1-9 The contact mechanism 43 includes a contact frame 431. The top of the contact frame 431 is fixedly connected to the bottom of the transmission mechanism 41. Sliding rods 432 are slidably connected to both sides of the top of the contact frame 431. A second spring 434 is sleeved on the sliding rod 432. The top of the second spring 434 is fixedly connected to the bottom of the contact plate 433. The bottom of the second spring 434 is fixedly connected to the top of the contact frame 431. A contact plate 433 is fixedly connected to the top of the sliding rod 432. Circular holes 435 are evenly opened on the top of the contact plate 433. A rubber plate 436 is fixedly connected to one side of the top of the contact plate 433. The side of the rubber plate 436 away from the contact plate 433 contacts the side of the conveyor belt 42. A scraper 437 is fixedly connected to the other side of the top of the contact plate 433. A fixing frame 438 is fixedly connected to the middle of the top of the contact plate 433. A contact roller 439 is rotatably connected to the top of the fixing frame 438.

[0054] When the conveyor belt 42 is in operation, a rubber plate 436 and a scraper 437 are provided at the bottom of the conveyor belt 42, and the bending angle of the rubber plate 436 is greater than that of the scraper 437. Thus, when the conveyor belt 42 is in operation, the scraper 437 can scrape off the debris, dust, and debris adhering to the surface of the conveyor belt 42, preventing these impurities from accumulating on the conveyor belt 42. The rubber plate 436 can further wipe the conveyor belt 42, wiping away the fine particles that the scraper 437 could not completely remove, playing a secondary cleaning role, keeping the conveyor belt 42 clean, and preventing impurities from contaminating the circuit board or affecting the normal operation of the conveyor belt 42.

[0055] At the same time, when the contact pressure between the scraper 437 and the impurities attached to the conveyor belt 42 is greater than the tension force of the second spring 434 on the contact plate 433, the second spring 434 retracts, causing the contact plate 433 to move downward through the sliding rod 432, thereby preventing the scraper 437 and the rubber plate 436 from being too pressured against the side of the conveyor belt 42, which would cause scratch damage to the side of the conveyor belt 42.

[0056] Meanwhile, by setting a contact roller 439 in the middle of the top of the contact plate 433, the surface of the conveyor belt 42 can be smoothed after the scraper 437 cleans the conveyor belt 42, making the surface of the conveyor belt 42 more flat after being cleaned by the scraper 437. This is conducive to the stable conveying of items on the conveyor belt 42 and reduces the situation of items shaking or shifting due to uneven surface of the conveyor belt 42.

[0057] Specific workflow:

[0058] Prepare the circuit board, prepreg, cover film, and other materials to be laminated;

[0059] The circuit board to be pressed is placed on the feeding component 3, and is automatically gripped by the clamping component 5 on the feeding component 3 and transported to the pressing component 2 on the main body 1.

[0060] Using positioning fixtures, the circuit board is precisely positioned. Optical positioning systems, mechanical positioning pins, and other methods are used to ensure that the circuit board does not shift during the pressing process, ensuring the alignment accuracy between each layer of circuitry and meeting high precision requirements.

[0061] On the positioned circuit board, a prepreg is laid according to the design requirements. The function of the prepreg is to bond the layers of the circuit board together through heating and pressurization during the pressing process.

[0062] As needed, a cover film can be placed on the prepreg. The cover film protects the circuitry on the circuit board surface from oxidation, scratches, etc., and also helps improve the insulation performance and appearance quality of the circuit board. When placing the cover film, ensure its accurate positioning and alignment with the edge of the circuit board.

[0063] Start the pressing component 2 to apply a certain pre-pressure to the circuit board. The purpose of the pre-pressure is to initially compact the circuit board and the pressing material, squeeze out the air, and make the layers initially adhere to each other, so as to prepare for the subsequent formal pressing.

[0064] After pre-pressing is completed, the circuit board is heated, and the pressure is gradually increased to the set formal pressing pressure. During the heating and pressurization process, it is necessary to ensure that the temperature and pressure are evenly distributed on the entire circuit board to ensure the consistency of the pressing quality.

[0065] Once the temperature and pressure reach the set values, maintain them for a period of time to allow the prepreg to fully cure and firmly bond the layers of the circuit board together. During the pressure-holding curing process, it is essential to strictly control the stability of the temperature and pressure to avoid fluctuations that could affect the curing effect and the performance of the circuit board.

[0066] After the pressure holding and curing are completed, stop heating and begin cooling the circuit board. Natural cooling can be used for this purpose.

[0067] After cooling is complete, the pressing component 2 rises and removes the pressed circuit board;

[0068] The circuit board after pressing is clamped and removed by the clamping component 5 on the unloading component 4 and placed on the loading component 3, thereby completing the unloading of the circuit board.

[0069] Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art and related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.

Claims

1. A pressing device for a high-precision, high-density line impedance signal processing board, characterized in that, include: The main body (1) has a feeding component (3) fixedly connected to its side, and a discharging component (4) fixedly connected to the side of the main body (1) away from the feeding component (3). Both the feeding component (3) and the discharging component (4) have clamping components (5) fixedly connected to their tops. A pressing component (2) is used to press the circuit board. The bottom of the pressing component (2) is fixedly connected to the top of the main body (1). The pressing component (2) includes a base plate (21), the bottom of which is fixedly connected to the top of the main body (1), a guide rod (22) is fixedly connected to the top of the base plate (21), a top plate (23) is fixedly connected to the top of the guide rod (22), an output mechanism (24) is fixedly connected to the top of the top plate (23), a moving plate (25) is slidably connected to the side of the guide rod (22), an upper pressure plate (27) is fixedly connected to the bottom of the moving plate (25), a placement mechanism (28) is fixedly connected to the top of the base plate (21), and the output end of the output mechanism (24) is fixedly connected to the top of the moving plate (25). The placement mechanism (28) includes a placement plate (281) and a placement seat (282). Slide rods (283) are fixedly connected to both sides of the bottom of the placement seat (282). The bottom of the slide rods (283) is slidably connected to the inner side of the placement plate (281). Connecting shafts (287) are slidably connected to both sides of the top of the placement plate (281). A first spring (284) is sleeved on the connecting shaft (287). An extrusion groove (285) is opened on the inner side of the placement plate (281). An impact component (286) is fixedly connected to the inner side of the extrusion groove (285). The feeding component (4) includes a conveying mechanism (41), the side of the conveying mechanism (41) is fixedly connected to both sides of the main body (1), a conveyor belt (42) is sleeved on the side of the conveying mechanism (41), and a contact mechanism (43) is fixedly connected to the bottom of the conveying mechanism (41). The contact mechanism (43) includes a contact frame (431), the top of which is fixedly connected to the bottom of the transmission mechanism (41). Sliding rods (432) are slidably connected to both sides of the top of the contact frame (431). A second spring (434) is sleeved on the sliding rod (432). A contact plate (433) is fixedly connected to the top of the sliding rod (432). Circular holes (435) are evenly opened on the top of the contact plate (433). A rubber plate (436) is fixedly connected to one side of the top of the contact plate (433). A scraper (437) is fixedly connected to the other side of the top of the contact plate (433). A fixing frame (438) is fixedly connected to the middle of the top of the contact plate (433). A contact roller (439) is rotatably connected to the top of the fixing frame (438).

2. The pressing device for a high-precision, high-density line impedance signal processing board according to claim 1, characterized in that: The bottom of the placement plate (281) is fixedly connected to the top of the base plate (21), the top of the first spring (284) is fixedly connected to the bottom of the placement seat (282), and the bottom of the first spring (284) is fixedly connected to the top of the placement plate (281).

3. The pressing device for a high-precision, high-density line impedance signal processing board according to claim 2, characterized in that: The impact assembly (286) includes a connecting plate (2861), an impact rod (2862) is slidably connected to the inner side of the connecting plate (2861), and an impact block (2863) is fixedly connected to the bottom of the impact rod (2862).

4. The pressing device for a high-precision, high-density line impedance signal processing board according to claim 3, characterized in that: The side of the connecting plate (2861) is fixedly connected to the inside of the extrusion groove (285), and the top of the impact rod (2862) is fixedly connected to the bottom of the placement seat (282).

5. The pressing device for a high-precision, high-density line impedance signal processing board according to claim 1, characterized in that: The clamping component (5) includes a bracket (51), the bottom of which is fixedly connected to the top of the unloading component (4), and a connecting mechanism (52) is fixedly connected to the side of the bracket (51) near the main body (1). A gripping mechanism (53) is fixedly connected to the output end of the connecting mechanism (52).

6. The pressing device for a high-precision, high-density line impedance signal processing board according to claim 1, characterized in that: The top of the second spring (434) is fixedly connected to the bottom of the contact plate (433), the bottom of the second spring (434) is fixedly connected to the top of the contact frame (431), and the side of the rubber plate (436) away from the contact plate (433) is in contact with the side of the conveyor belt (42).

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