Efficient heat dissipation device of computer case

A technology of a heat dissipation device and a main box, which is applied in the field of computers, can solve the problems of heating of the main chassis and poor use effect, etc., and achieves the effects of an efficient heat dissipation device, a simple structure, and strong practicability.

Inactive Publication Date: 2017-12-15
CHENGDU LEYE TECH CO LTD
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AI Technical Summary

Problems solved by technology

[0002] As a part of the computer accessories, the main computer box is mainly used to place and fix various computer accessories, and to play a supporting and protective role. The continuous progress of science and technology promotes the continuous upgrading of the accessories installed in the computer main box. Then came the heating problem of the main box. At present, most of the cooling devices installed in the main computer box on the market are air-cooled or water-cooled. The effect of using it alone is not very good. Therefore, we propose a High-efficiency heat dissipation device for computer main box

Method used

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Embodiment Construction

[0013] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on The embodiments of the present invention and all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0014] see Figure 1-2 , the present invention provides a technical solution:

[0015] A high-efficiency heat dissipation device for a computer mainframe, comprising an outer box 1, an inner box 2 and a condensation box 3, the outer box 1, the inner box 2 and the condensation box 3 are all hollow structures, and the condensation box 3 is placed outside the body In the inner cavity of the box 1, the body inner box 2 is placed in the inner cavity...

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Abstract

The invention discloses a high-efficiency heat dissipation device for a computer main box, which comprises an outer box of a machine body, an inner box of a machine body and a condensation box. The inner box of the machine body is placed in the inner cavity of the condensing box. The high-efficiency heat dissipation device of the main computer box has a simple structure. The condensate in the condensing box is pumped through the water pump passing through the first connecting pipe, and the condensate is input into the connected return pipe. To cool the heat generated by the operation of the main computer case, the condensate that has absorbed the heat enters the cooling plate and the annular tube on the cooling plate. At the same time, the second motor above the cooling plate drives the fan driven by the first motor to rotate back and forth, blowing away the cooling plate and the annular tube. The heat of the condensate in the tube is cooled by heat transfer on the one hand, and the heat on the surface of the cooling plate and the annular tube is blown away by the fan on the other hand, so as to complete the heat dissipation, which has strong practicability.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a high-efficiency heat dissipation device for a computer main box. Background technique [0002] As a part of the computer accessories, the main computer box is mainly used to place and fix various computer accessories, and to play a supporting and protective role. The continuous progress of science and technology promotes the continuous upgrading of the accessories installed in the computer main box. Then came the heating problem of the main box. At present, most of the cooling devices installed in the main computer box on the market are air-cooled or water-cooled. The effect of using it alone is not very good. Therefore, we propose a A high-efficiency cooling device for a computer main box. Contents of the invention [0003] The purpose of the present invention is to provide a high-efficiency heat dissipation device for a computer mainframe to solve the problems raised in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 肖亚玲
Owner CHENGDU LEYE TECH CO LTD
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