Computer main unit case with high cooling efficiency

A computer and main box technology, applied in the computer field, can solve the problems of inconvenient installation, computer burning, damage to computer parts, etc.

Active Publication Date: 2018-02-23
合肥迈斯软件科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The computer case is an important protection device for the computer. Because the computer will generate a lot of heat when it is working, if the heat cannot be dissipated well, it will affect the working efficiency of the computer, and there will be certain harm to the internal computer components, and even cause computer burned
The general heat dissipation box can dissipate heat from the main computer case, but the effect is not ideal.

Method used

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  • Computer main unit case with high cooling efficiency
  • Computer main unit case with high cooling efficiency
  • Computer main unit case with high cooling efficiency

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Embodiment Construction

[0016] like Figures 1 to 4 as shown, figure 1 It is a structural schematic diagram of a high-efficiency heat-dissipating computer mainframe box proposed by the present invention, figure 2 It is another structural schematic diagram of a high-efficiency heat dissipation computer main chassis proposed by the present invention, image 3 It is a schematic diagram of the installation structure of a heat dissipation box of a high-efficiency heat dissipation computer main chassis proposed by the present invention, Figure 4 It is a structural schematic diagram of a heat dissipation box accommodation compartment of a high-efficiency heat dissipation computer mainframe case proposed by the present invention.

[0017] refer to Figures 1 to 4 , the present invention proposes a high-efficiency heat dissipation computer mainframe box, comprising: a chassis main body 1, a drive motor 7, and a heat dissipation box 3;

[0018] The drive motor 7 is arranged on the inner wall of the chass...

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Abstract

The invention discloses a computer main unit case with high cooling efficiency; a drive motor is disposed on the inner wall of a case body, a spindle of the drive motor is perpendicular to the inner wall and is provided with a guide bar extended in radial direction, the inner wall of the case body is provided with a circular slide rail that is arranged around the drive motor, a cooling box is slidably mounted on the circular slide rail and is provided with a guide sleeve, the guide bar and the guide sleeve are coaxial, one end of the guide bar far away from the spindle of the drive motor is extended into the guide sleeve, and the drive motor drives the guide bar to rotate so as to drive the cooling box to move along the circular slide rail. The computer main unit case with high cooling efficiency which is optimized is optimal and reasonable in structural design; the circular slide rail allows the cooling box to circularly move in a rail device; the problem that a common cooling box provides non-uniform cooling for a main unit case and affected cooling effect is solved; cooling of a computer main unit is benefited; the service life of the computer main unit case is extended.

Description

technical field [0001] The invention relates to the technical field of computers, in particular to a high-efficiency heat dissipation computer main chassis. Background technique [0002] The computer case is an important protection device for the computer. Because the computer will generate a lot of heat when it is working, if the heat cannot be dissipated well, it will affect the working efficiency of the computer, and there will be certain harm to the internal computer components, and even cause The computer burned. The general heat dissipation box can dissipate heat to the computer main box, but the effect is not ideal, and it is impossible to carry out circulating heat dissipation to the main chassis to ensure the effect of heat dissipation, and it is inconvenient to install. Contents of the invention [0003] In order to solve the technical problems existing in the background technology, the present invention proposes a high-efficiency heat dissipation computer mainf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F1/18
CPCG06F1/183G06F1/20
Inventor 刘运保
Owner 合肥迈斯软件科技有限公司
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