Micro-device integrating mechanical energy collection and vibration detection functions and preparation method thereof

Abstract

The present invention discloses a micro-device integrating mechanical energy collection and vibration detection functions, comprising: a base layer, on which a crack structure is opened, the crack structure penetrates the base layer along the thickness direction of the base layer, and the crack structure has a closed tip; a vibration detection structure, which is arranged on the base layer and partially covers the crack structure, and the vibration detection structure is used to detect vibration signals; an electromechanical conversion structure, which is embedded in the base layer on one side of the tip of the crack structure, and the electromechanical conversion structure can collect mechanical energy and convert it into electrical energy. The present invention also discloses a method for the above-mentioned micro-device integrating mechanical energy collection and vibration detection functions. The advantages of the present invention include that by opening a crack structure, both efficient collection of mechanical energy and high-precision detection of weak vibration signals can be achieved.

Description

Technical Field

[0001] The present invention belongs to the field of micro-intelligent electronic technology, and specifically relates to a micro-device integrating mechanical energy collection and vibration detection functions and a preparation method thereof. Background Art

[0002] Microdevices that integrate high-precision detection of vibration signals and efficient capture of mechanical energy are the key to improving the overall perception and endurance capabilities of micro-intelligent electronic equipment, which is difficult to achieve using existing design principles and preparation methods.

[0003] Therefore, in order to solve the above technical problems, it is necessary to provide a micro-device integrating mechanical energy collection and vibration detection functions and a preparation method thereof. Summary of the invention

[0004] The purpose of the present invention is to provide a micro-device integrating mechanical energy collection and vibration detection functions and a preparation method thereof, aiming to solve the problem that existing intelligent electronic equipment cannot achieve high-precision detection of vibration signals and efficient collection of mechanical energy while taking into account the micro-scale.

[0005] In order to achieve the above purpose, the technical solution provided by an embodiment of the present invention is as follows:

[0006] In one embodiment, a micro-device integrating mechanical energy collection and vibration detection functions is provided, comprising:

[0007] A base layer, on which a crack structure is formed, wherein the crack structure penetrates the base layer along the thickness direction of the base layer, and the crack structure has a closed tip portion;

[0008] a vibration detection structure, disposed on the base layer and partially covering the crack structure, the vibration detection structure being used to detect a vibration signal;

[0009] The electromechanical conversion structure is embedded in the base layer on one side of the tip of the crack structure, and the electromechanical conversion structure can collect mechanical energy and convert it into electrical energy.

[0010] As a further improvement of the present invention, the vibration detection structure includes a flexible film base layer adhered to the base layer, a conductive layer arranged on the flexible film base layer, and a signal derivation electrode arranged on the conductive layer.

[0011] As a further improvement of the present invention, the electromechanical conversion structure includes a first conductive film, a transducer material layer and a second conductive film in sequence from near to far from the tip, wherein the first conductive film and the second conductive film are respectively provided with electric energy extraction electrodes.

[0012] In the above technical solution, the electromechanical conversion structure is arranged on the base layer on one side of the tip of the crack structure, so that the electromechanical conversion structure is located in the stress field of the tip of the crack structure. When an external stimulus containing mechanical energy acts on the micro-device, the energy concentration effect at the tip of the crack structure will cause the mechanical energy to be efficiently gathered in the stress field of the tip and converted into electrical energy through the electromechanical conversion structure and transmitted to the subsequent circuit or storage device; the vibration detection structure is arranged on the base layer and partially covers the crack structure. When the vibration signal acts on the base layer, the flexible film base layer will bend and deform as the width of the crack structure changes, thereby triggering the conductive layer to detect the signal.

[0013] As a further improvement of the present invention, the crack width of the crack structure is 5 to 50 μm.

[0014] As a further improvement of the present invention, the crack structure is formed by being recessed inward from one side of the base layer, and has an open portion arranged opposite to the tip portion.

[0015] As a further improvement of the present invention, the vibration detection structure covers the open portion.

[0016] As a further improvement of the present invention, a nano-scale crack microstructure is provided on the conductive layer of the flexible film substrate layer.

[0017] As a further improvement of the present invention, the nano-scale crack microstructure can be prepared and formed by mechanical bending, organic solvent-induced expansion or light-induced expansion.

[0018] As a further improvement of the present invention, the electromechanical conversion structure is arranged in an arc shape, and its inner arc surface is arranged opposite to the tip portion.

[0019] As a further improvement of the present invention, the conductive layer in the vibration detection structure is disposed on the flexible film base layer by deposition, evaporation, sputtering or brushing.

[0020] As a further improvement of the present invention, the first conductive film and the second conductive film in the electromechanical conversion structure are provided on the energy conversion material layer by deposition, evaporation, sputtering or brushing.

[0021] As a further improvement of the present invention, the conductive material in the conductive layer, the first conductive film and the second conductive film may be one of gold, silver, copper, platinum and graphite.

[0022] As a further improvement of the present invention, the energy conversion material of the energy conversion material layer may be one of piezoelectric ceramics, piezoelectric films, and composite piezoelectric materials;

[0023] As a further improvement of the present invention, the flexible film base layer may be one of polyimide, polyethylene, and vinyl chloride.

[0024] An embodiment of the present application further provides a method for preparing the above-mentioned micro-device with integrated mechanical energy collection and vibration detection functions, comprising the following steps:

[0025] A metal strip with a curved end is placed in the liquid solidifying material;

[0026] After the solidified material reaches a semi-solidified state, the electromechanical conversion structure is placed in the solidified material at the arc-shaped end of the metal strip and at a certain distance from the arc-shaped end of the metal strip;

[0027] The metal strip is removed through a corrosive liquid to form a crack structure;

[0028] The vibration detection structure is laid at one end of the crack structure away from the arc end, and the solidified material is further solidified.

[0029] As a further improvement of the present invention, the base layer is formed by curing a curing material selected from epoxy resin, silicone, polyurethane, polydimethylsiloxane and photoresist.

[0030] As a further improvement of the present invention, the solution used for corrosion removal of the metal strips may be one of ferric chloride solution, hydrochloric acid solution and sulfuric acid solution.

[0031] Compared with the prior art, the advantages of the present invention are:

[0032] Since the electromechanical conversion structure is located in the stress field at the tip of the crack structure, it is able to efficiently collect the dispersed mechanical energy and convert it into electrical energy based on the energy concentration effect at the crack tip, thereby improving the efficiency of mechanical energy collection. Since the flexible film substrate is attached to the tail of the crack, the deformation phenomenon of the crack tail can be used to bend the flexible film substrate, thereby changing the resistance of the conductive layer on the flexible film substrate, and achieving high-precision detection of weak vibration signals. In summary, by opening a crack structure on the substrate and setting an electromechanical conversion structure and an electromechanical conversion structure, both efficient collection of mechanical energy and high-precision detection of weak vibration signals can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1This is a top view of a micro-device with integrated mechanical energy collection and vibration detection functions in one embodiment of the present application;

[0035] Figure 2 This is a partial front view of a micro-device integrating mechanical energy collection and vibration detection functions in one embodiment of the present application;

[0036] Figure 3 is a schematic diagram of the details of the vibration detection structure in one implementation;

[0037] Figure 4 is a schematic diagram of the details of the electromechanical conversion structure in one embodiment;

[0038] Figure 5 It is a schematic diagram of data description of a metal strip, a crack structure and a substrate layer in one embodiment. DETAILED DESCRIPTION

[0039] The present invention will be described in detail below in conjunction with the various embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0040] refer to Figure 1 and Figure 2 As shown, an embodiment of the present application provides a micro-device integrating mechanical energy collection and vibration detection functions, including a substrate layer 1, a crack structure 2, a vibration detection structure 3 and an electromechanical conversion structure 4; wherein, the crack structure 2 is opened on the substrate layer 1 and is arranged to penetrate the substrate layer 1 along the thickness direction, the crack structure 2 has a closed tip portion 21, the vibration detection structure 3 covers the crack structure 2 and is arranged away from the tip portion 21, and the electromechanical conversion structure 4 is embedded in the substrate layer 1 and is set at a certain distance from the tip portion 21 of the crack structure 2.

[0041] The base layer 1 is formed by curing a curing material, and the curing material may be one of epoxy resin, silicone, polyurethane, polydimethylsiloxane, and photoresist. In the present embodiment, epoxy resin is preferred.

[0042] The crack structure 2 can be formed by adding a metal strip into the solidified material and removing the metal strip fixed in the solidified material by corrosion, wherein the solution used for the corrosion removal of the metal strip can be one of a ferric chloride solution, a hydrochloric acid solution, and a sulfuric acid solution. The crack structure 2 is formed by being recessed inward from one side of the base layer 1, and has an open portion ( Figure 1 The vibration detection structure 3 covers the open portion, and the crack width of the crack structure is 5 to 50 μm.

[0043] refer to Figure 3 As shown, the vibration detection structure 3 is composed of a flexible film substrate 33, a conductive layer 32, and a signal extraction electrode 31. The flexible film substrate 33 is arranged on the substrate 1, and the conductive layer 32 is arranged on the flexible film substrate 33 by deposition, evaporation, sputtering or brushing. The signal extraction electrode 31 is arranged on the conductive layer 32. The flexible film substrate 33 can be one of polyimide, polyethylene, and vinyl chloride. The conductive material of the conductive layer 32 can be one of gold, silver, copper, platinum, and graphite. A nano-scale crack microstructure is opened on the conductive layer 32, and the nano-scale crack microstructure can be prepared by mechanical bending, organic solvent induced expansion, or light induced expansion.

[0044] refer to Figure 4 As shown, the electromechanical conversion structure 4 is arranged in an arc shape, and its inner arc surface is arranged opposite to the tip portion 21. The electromechanical conversion structure 4 includes a first conductive film 41, a transducing material layer 42 and a second conductive film 43 from near to far from the tip portion 21, wherein the first conductive film 41 and the second conductive film 43 are respectively provided with electric energy extraction electrodes 44. The first conductive film 41 and the second conductive film 43 are arranged on the transducing material layer 42 by deposition, evaporation, sputtering or brushing. The conductive material in the first conductive film 41 and the second conductive film 43 can be one of gold, silver, copper, platinum and graphite. The transducing material of the transducing material layer 42 can be one of piezoelectric ceramics, piezoelectric films, and composite piezoelectric materials.

[0045] The working principle of the micro-device of the present invention can be summarized as follows: when vibration signal detection is performed, the vibration signal acts on the base layer 1, causing the width of the crack structure 2 to change, and inducing the flexible film base layer 33 in the vibration detection structure 3 to change, causing the resistance in the conductive layer 32 located on the flexible film base layer 33 to change, and further realizing the output of the resistance signal through the signal extraction electrode 31, thereby achieving the function of vibration signal detection; when energy collection is performed, external excitation acts on the base layer 1, and due to the energy concentration effect at the tip of the crack structure 2, the mechanical energy is efficiently gathered at the tip and converted into electrical energy by the transducer material layer 42 in the electromechanical conversion structure 4, and is transported to the subsequent processing module through the first conductive film 41, the second conductive film 43 and the electrical energy extraction electrode 44.

[0046] The present invention also discloses a method for preparing a micro-device integrating mechanical energy collection and vibration detection functions, comprising the following steps:

[0047] Step S1, placing a metal strip with an arc-shaped end in a culture dish containing liquid curing material for moderate curing;

[0048] Step S2, placing the pre-processed arc-shaped electromechanical conversion structure at the end point of the arc-shaped end of the metal strip, with its inner arc surface facing the arc-shaped end of the metal strip, and separating the electromechanical conversion structure from the end point of the arc-shaped end of the metal strip by a semi-solidified substance in the culture dish;

[0049] Step S3, removing the metal strip through a corrosive liquid to form a base layer with a crack structure;

[0050] Step S4, laying the pre-processed flexible vibration detection structure flat on the base layer of the open part of the crack structure, with the side provided with the signal extraction electrode facing outward, and further curing the base layer;

[0051] Step S5: cutting the prepared sample to finally obtain a micro-device integrating mechanical energy collection and vibration detection functions.

[0052] In a preferred embodiment of the present invention, the width D of the metal strip should be consistent with the width d of the crack structure, and its length should be consistent with the length of the crack structure. The end of the metal strip should be arc-shaped to facilitate the formation of the tip of the crack structure. The thickness L of the metal strip should be greater than the thickness l of the base layer (the thickness of the crack structure). Figure 5 shown.

[0053] In this embodiment, the length of the crack structure is 1000μm, and the length of the metal strip is 1000μm; the width d of the crack structure is 100μm, and the width D of the metal strip is 100μm; the thickness l of the base layer formed by the solidified material is 100μm, and the thickness L of the metal strip should be set between 100μm and 1000μm, preferably, to 500μm.

[0054] The metal strip may also be made of other common materials, such as aluminum, iron, copper, stainless steel or various alloys, as long as it is easy to be removed by corrosion.

[0055] For the curing material used as the base layer in step S1, common epoxy resin materials can be used, and easily curable materials such as silicone, polyurethane, polydimethylsiloxane, photoresist, etc. can also be used.

[0056] In a preferred embodiment of the present invention, an epoxy resin material is used as an example for explanation. When the epoxy resin material is used, it can be heated at 30°C-50°C for 1-5 hours to make the epoxy resin in a semi-cured state. It should be noted that in order to make the vibration detection structure adhere better to the open part of the crack structure and make the electromechanical conversion structure better to further cure with the epoxy resin, it is not necessary to completely melt the epoxy resin material in this step of the test.

[0057] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0058] In addition, it should be understood that although the present specification is described according to embodiments, not every embodiment contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation methods that those skilled in the art can understand.

Claims

1. A micro-device integrating mechanical energy collection and vibration detection functions, characterized in that: include: A base layer, on which a crack structure is formed, wherein the crack structure penetrates the base layer along the thickness direction of the base layer, and the crack structure has a closed tip portion; A vibration detection structure, disposed on the base layer and covering a portion of the crack structure, the vibration detection structure being used to detect a vibration signal; An electromechanical conversion structure is embedded in the base layer on one side of the tip of the crack structure, and the electromechanical conversion structure can collect mechanical energy and convert it into electrical energy; The crack structure is formed by being recessed inward from one side of the base layer, and has an open portion arranged opposite to the tip portion, and the vibration detection structure covers the open portion; The electromechanical conversion structure is arranged in an arc shape, and its inner arc surface is arranged opposite to the tip portion.

2. The micro-device with integrated mechanical energy collection and vibration detection functions according to claim 1, characterized in that: The vibration detection structure includes a flexible film base layer attached to the base layer, a conductive layer arranged on the flexible film base layer, and a signal derivation electrode arranged on the conductive layer.

3. The micro-device with integrated mechanical energy collection and vibration detection functions according to claim 2, characterized in that: The conductive layer of the flexible film substrate is provided with a nano-scale crack microstructure.

4. The micro-device integrating mechanical energy collection and vibration detection functions according to claim 2, characterized in that: The flexible film base layer is one of polyimide, polyethylene and vinyl chloride.

5. The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1, characterized in that: The electromechanical conversion structure includes, from near to far away from the tip, a first conductive film, a transducer material layer and a second conductive film, wherein the first conductive film and the second conductive film are respectively provided with electric energy extraction electrodes.

6. The micro-device integrating mechanical energy collection and vibration detection functions according to claim 5, characterized in that: The energy conversion material layer is one of piezoelectric ceramics and composite piezoelectric materials.

7. The micro-device integrating mechanical energy collection and vibration detection functions according to claim 1, characterized in that: The base layer is formed by curing a curing material, and the curing material is one of epoxy resin, silica gel, polyurethane, polydimethylsiloxane, and photoresist.

8. A method for preparing a micro-device with integrated mechanical energy collection and vibration detection functions as claimed in any one of claims 1 to 7, characterized in that: The steps include: A metal strip with a curved end is placed in the liquid solidifying material; After the solidified material reaches a semi-solidified state, the electromechanical conversion structure is placed in the solidified material at the arc-shaped end of the metal strip and at a certain distance from the arc-shaped end of the metal strip; The metal strip is removed through a corrosive liquid to form a crack structure; The vibration detection structure is laid at one end of the crack structure away from the arc end, and the solidified material is further solidified.

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