Lower mold with transfer part
By adopting a transfer part design in which the lower end of the lower mold and the lower heating plate are integrally formed in an airtight continuous atmosphere sintering and hot pressing forming device, the problems of slow production speed of three-dimensional glass shells and easy damage of the displacement mechanism are solved, and efficient and continuous high-quality three-dimensional glass shell manufacturing is achieved.
Patent Information
- Application Number
- CN201910319767.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2019-04-19
- Publication Date
- 2025-09-09
- Estimated Expiration
- 2039-04-19
AI Technical Summary
In the prior art, when manufacturing three-dimensional glass shells, the production speed is slow and it is difficult to achieve high-quality continuous manufacturing. In addition, the displacement mechanism is easily deformed or damaged by the high temperature in the furnace.
A lower mold with a transfer part is used. The transfer part is integrally formed with the lower outer edge of the lower mold and the lower heating plate. It is directly heated by the lower heating plate and is used in an airtight continuous atmosphere sintering hot pressing molding device to ensure the consistency and efficiency of heating and cooling speeds.
This achieves efficient and continuous manufacturing of three-dimensional glass shells, improves production efficiency and product quality, and avoids the problem of deformation or damage of the displacement mechanism due to high temperature.
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Figure CN111825312B_ABST
Abstract
Description
Technical Field
[0001] The present invention is applied to an airtight continuous atmosphere sintering hot pressing forming device for hot pressing formed products, in particular to a lower mold with a transfer portion. Background Art
[0002] Today, thermoforming is a method for processing polymer materials. It involves placing a material of a certain thickness in a mold, heating the mold or the environment to soften the material and coat the mold surface. The material is then squeezed by a machine and solidified after a cooling stage to obtain a thermoformed product.
[0003] Taking glass as an example of a material that can be thermoformed, due to its high light transmittance, it is often chosen as the outer shell of the window portion of display devices (such as mobile phones, watches, and other electronic products). As you can see, handheld electronic products often have a glass shell on the surface to protect the display module inside. Currently, most glass shells have a flat surface, resulting in a seam on the top surface of the electronic product. Furthermore, since a certain width of mechanical portion must be retained around the perimeter of the electronic product to hold the flat glass, the top surface of the electronic product cannot be fully utilized. Therefore, three-dimensional or curved glass has gradually been used in the glass shells of electronic products.
[0004] Flat glass housings are relatively easy to manufacture, while glass housings with three-dimensional shapes are more challenging. Currently, there are two common methods for producing three-dimensional glass housings. The first involves fabricating multiple flat glass units and then gluing their edges together to form a three-dimensional glass housing. The second involves manufacturing a rectangular glass block of a certain thickness and then repeatedly grinding it to create a multi-sided three-dimensional shape. However, both methods are time-consuming and labor-intensive, resulting in very slow production rates. Generally, since glass material is flat, the preferred method for producing shaped glass is to place the flat glass material between an upper mold and a lower mold. The upper and lower molds are then heated to soften the glass material. Once the glass material has softened, the upper and lower molds can be closed, allowing the upper mold to work with the lower mold along a closing direction to shape the glass material's shape, thereby producing the corresponding molded glass. Taiwan Patent Publication No. M452174, "Molding Equipment for Manufacturing Molded Glass" (publication date: May 1, 2013), includes a female mold part, a first male mold part, a second male mold part, a support push rod and a pressure rod. The first male mold part is arranged on the female mold part in an openable and closable manner, and the second male mold part is arranged between the female mold part and the first male mold part. The support push rod is passed through the female mold part, and the support push rod is used to push the second male mold part to support the second male mold part and the first male mold part to jointly clamp a molded glass. The pressure rod is arranged on one side of the first male mold part, and the pressure rod is used to press down on the first male mold part so that the first male mold part and the second male mold part move to a mold closing position relative to the female mold part to form the molded glass. However, it still cannot meet the industry's demand for continuous and rapid production of high-quality molded three-dimensional glass, which is a shortcoming.
[0005] See also Figure 1 As shown, Figure 1 This is a side view of an existing top-and-bottom heating molding device, which mainly includes an upper heating plate A, a bottom heating plate B, and a displacement mechanism C. A mold D is placed on the bottom heating plate B, and the displacement mechanism C is used to move the mold D. Although the mold D and the bottom heating plate B are heated by contact, the displacement mechanism C is located inside the furnace and is easily deformed or damaged by the high temperature inside the furnace, which is why it is missing.
[0006] The applicant's previously applied patent for "Airtight Molded Stereo Glass Continuous Forming Device" mainly includes: a furnace body, which is airtight, with exchange systems at both ends of the furnace body, and an airtight cavity inside the furnace body; an exchange system, which is arranged at both ends of the furnace body, and an external conveying channel is arranged between the exchange systems at both ends of the furnace body, each exchange system includes an inner airtight door arranged on the side of the furnace body and an outer airtight door arranged on the side of the external conveying channel, an airtight space is formed between the inner airtight door and the outer airtight door, and a displacement device is provided to push the carrier into or out of the furnace body. When the carrier Before being sent into the furnace body, the inner airtight door and the outer airtight door at the head end of the furnace body are closed. After the airtight space is evacuated and the protective gas is introduced to the same environment as the airtight cavity, the inner airtight door on the side of the furnace body is opened to push the carrier into the airtight cavity. Before the carrier is sent out of the airtight cavity, the inner airtight door and the outer airtight door at the tail end of the furnace body are closed, and the airtight space has been evacuated and the protective gas is introduced to the same environment as the airtight cavity. The inner airtight door on the side of the furnace body is opened to push the carrier into the airtight space to prevent the air outside the furnace from mixing into the airtight cavity. The airtight cavity is arranged inside the furnace body, including an airtight cavity, an inner conveying channel in the airtight cavity, the inner conveying channel connects the airtight doors in the exchange system at both ends of the furnace body, and is provided with a slide rail to serve as a track for the movement of the carrier plate. The airtight cavity is airtight and introduces protective gas. It is divided into a heating zone, a high-temperature forming zone and a cooling zone according to the process. The heating zone and the high-temperature forming zone are provided with at least one thermal insulation layer, and a thermal field is formed in the center of the thermal insulation layer. The hot field is provided with a heating element of a temperature required by the process procedure. The cooling zone has a cooling device. The high-temperature forming area is equipped with a pressurizing system; an external conveyor connects the exchange system at both ends of the furnace body; the pressurizing system is mainly composed of a pressure cylinder, a pressurizing shaft, and a pressurizing column. In the present invention thus constructed, the flat glass to be formed is placed on the forming surface of the mold, and the mold is placed on a carrier. The carrier enters the airtight cavity through the exchange system. After being preheated in the heating zone and subjected to the high temperature of the high-temperature forming zone, the glass in the mold is softened and formed by the pressurizing system. After being cooled in the cooling zone, the glass is conveyed out of the furnace body through the exchange system and then demolded. The mold of this patent is placed on the carrier. The carrier enters the airtight cavity through the exchange system. After being preheated in the heating zone and subjected to the high temperature of the high-temperature forming zone, the glass in the mold is softened and formed by the pressurizing system. After being cooled in the cooling zone, the glass is conveyed out of the furnace body through the exchange system and then demolded. Because the exchange system is located outside the furnace body and is displaced by the carrier inside the furnace, the defect of the displacement mechanism that is easily deformed or damaged by the high temperature inside the furnace, which is common in the prior art, is avoided. However, because there is a gap of the thickness of the carrier plate itself between the carrier plate and the lower heating plate below, and because the mold and the lower heating plate are separated by the thickness of the carrier plate, there is room for improvement in the heating and cooling speeds of indirect contact heating. It is necessary to propose a better design to make the continuous hot pressing molding device more perfect. Summary of the Invention
[0007] The main purpose of the present invention is to provide a lower mold with an efficient transfer portion.
[0008] The lower mold with a transfer part of the present invention is used for an airtight continuous atmosphere sintering hot pressing molding device, wherein: the outer edge of the lower end of the lower mold has a transfer part that is larger than the outer edge of the lower mold and is integrally processed and formed with the lower mold.
[0009] Optionally, the aforementioned transfer part of the present invention is placed on the lower heating plate of the airtight continuous atmosphere sintering hot pressing forming device, and directly conducts heat with the lower heating plate. In addition to having the effect of continuous, high-efficiency and high-quality hot pressing forming products, it also has consistent and better heating and cooling speeds.
[0010] Optionally, the aforementioned transfer part of the present invention is arranged on both sides of the slide rails opposite to the airtight continuous atmosphere sintering hot pressing forming device, and the bottom end is in direct contact with the heat field formed by the heating element, and is directly heated by the heat field. In addition to having the effect of continuous, high-efficiency and high-quality hot pressing forming products, it also has consistent and better heating and cooling speeds.
[0011] Optionally, the aforementioned transfer part of the present invention has at least two sets of integrally formed lower molds at its upper end. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 A side view of a known upper and lower heating type molding device;
[0013] Figure 2 This is a front cross-sectional view of the hot pressing forming device of the present invention;
[0014] Figure 3 This is a cross-sectional view of the upper end of the hot pressing forming device of the present invention;
[0015] Figure 4 This is a cross-sectional view of the heating zone of the hot pressing forming device of the present invention;
[0016] Figure 5 This is a cross-sectional view of the high-temperature forming area of the hot pressing forming device of the present invention;
[0017] Figure 6 Three-side views of the mold according to the embodiment of the present invention;
[0018] Figure 7 sectional views of multiple sets of molds according to an embodiment of the present invention;
[0019] Figure 8 This is a cross-sectional view of the heating zone of a hot pressing forming device according to another embodiment of the present invention.
[0020] In the picture:
[0021] A upper heating plate; B bottom heating plate; C displacement mechanism; D mold; 1 furnace body; 2 exchange system; 20 inner airtight door;
[0022] 21 external airtight door; 22 airtight space; 23 displacement device; 3 airtight cavity; 30 airtight cavity body; 31 internal conveying channel;
[0023] 32 heating zone; 33 high temperature forming zone; 34 cooling zone; 35 thermal insulation layer; 36 thermal field; 37 upper heating element;
[0024] 370 lower heating element; 371 lower heating plate; 372 slide rail; 38 cooling device; 4 external conveying channel; 5 pressurizing system;
[0025] 50 pressure cylinder; 51 pressure shaft; 52 pressure column; 6 airtight cavity; 60 slide rail; 61 heating element; 62 thermal field; 7 mold;
[0026] 70 upper mold; 71 lower mold; 72 transfer unit. DETAILED DESCRIPTION
[0027] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.
[0028] The present invention is a novel design of a transfer plate for a hot press forming device for airtight continuous atmosphere sintering of hot press forming products. The hot press forming materials of the present invention include but are not limited to glass, metal, ceramic or metal-ceramic heterogeneous composite materials. Figure 2 、 Figure 3 The figure shows an example of an airtight continuous atmosphere sintering hot pressing molding device. The present invention is applicable to, but not limited to, this type of molding device (this embodiment is a direct heating molding device in which the mold is placed on a lower heating plate, and is also applicable to a space heating molding device in which the mold is placed in a hot field). The airtight continuous atmosphere sintering hot pressing molding device mainly includes:
[0029] The furnace body 1 is a closed type, with exchange systems 2 provided at both ends of the outside of the furnace body 1, and an airtight cavity 3 provided inside the furnace body 1; the exchange system 2 is provided at both ends of the furnace body 1, and an external conveying channel 4 is provided between the exchange systems 2 at both ends of the furnace body 1, and each exchange system 2 includes an inner airtight door 20 provided on one side of the furnace body 1 and an outer airtight door 21 provided on the side of the external conveying channel 4, an airtight space 22 is formed between the inner airtight door 20 and the outer airtight door 21, and a displacement device 23 is provided to push the mold 7 into or out of the furnace body 1; the airtight cavity 3 is provided inside the furnace body 1, including an airtight cavity 30, and an inner conveying channel 31 is provided in the airtight cavity 30, and the inner conveying channel 31 connects the inner airtight doors 20 of the exchange system 2 at both ends of the furnace body 1, and the airtight cavity 3 is airtight and A protective gas is introduced (generally an inert gas, such as nitrogen; the device for providing the protective gas is a known technology and will not be described in detail here). The heating zone 32, the high-temperature forming zone 33 and the cooling zone 34 are divided according to the process. At least one thermal insulation layer 35 is provided in the heating zone 32 and the high-temperature forming zone 33, and a thermal field 36 is formed in the center of the thermal insulation layer 35. The thermal field 36 is provided with an upper heating element 37 and a lower heating element 370 (temperature control devices and the like are known technologies and will not be described in detail here) of a temperature required by the process. The upper heating element 37 radiates heat above the thermal field, and the lower heating element 370 is provided in a lower heating plate 371 to conduct heat to the bottom of the mold 7. The lower heating plate 371 is also provided with a slide rail 372 (see Figure 4 and Figure 5 ), which serves as a track for the movement of the mold 7. The cooling zone 34 has a cooling device 38 (the cooling device 38 is a known technology and will not be described in detail). The high-temperature molding zone 33 is provided with a pressurizing system 5; an external conveying channel 4 connects the exchange system 2 at both ends of the furnace body 1; the pressurizing system 5, please refer to Figure 5 As shown, the pressurizing system 5 is mainly composed of a pressure cylinder 50, a pressurizing shaft 51 and a pressurizing column 52. In the present invention thus constructed, the object to be hot-pressed is placed on the forming surface of the mold 7, and the mold 7 is placed on the lower heating plate track 372. The mold 7 enters the airtight cavity 3 through the exchange system 2, and is preheated in the temperature rising zone 32 (to avoid damage due to too rapid temperature changes) and the high temperature forming zone 33, so that the object to be hot-pressed in the mold is softened, and is formed by the pressurization of the pressurizing system 5. After cooling in the cooling zone 34, it is sent out to the outside of the furnace body 1 through the exchange system 2 and then demolded.
[0030] See also Figure 2As shown, the present invention is provided with an exchange system 2 on both sides of the furnace body 1, and each exchange system 2 includes an inner airtight door 20 provided on one side of the furnace body 1 and an outer airtight door 21 provided on the side of the outer conveying channel 4. An airtight space 22 is formed between the inner airtight door 20 and the outer airtight door 21. Before the mold 7 is fed into the furnace body 1, the inner airtight door 20 and the outer airtight door 21 at the head end of the furnace body 1 are closed. After the airtight space 22 is evacuated and the protective gas is introduced to the same environment as that in the airtight cavity 3 (the vacuuming process will remove the air on the mold 7 (especially The inner airtight door 20 on the furnace body side is opened to push the mold 7 into the airtight cavity 3. Before the mold 7 is sent out of the airtight cavity 3, the inner airtight door 20 and the outer airtight door 21 at the rear end of the furnace body are closed, and the airtight space 22 has been evacuated and the protective gas is introduced to the same environment as that in the airtight cavity 3. The inner airtight door 20 on the furnace body side is opened to push the mold 7 into the airtight space 22. This can prevent the air outside the furnace from mixing into the airtight cavity 3, thereby improving the molding quality of the object to be hot-pressed.
[0031] See also Figure 6 As shown, the mold 7 of the present invention is used in the aforementioned airtight continuous atmosphere sintering molding device. The mold 7 is composed of an upper mold 70 and a lower mold 71. The feature of the present invention is that the outer edge of the lower end of the lower mold 71 has a transfer portion 72 that is larger than the outer edge of the lower mold 71 and is integrally processed and formed with the lower mold 71, and the transfer portion 72 replaces the original transfer plate function.
[0032] See also Figure 4 and Figure 5 As shown, in this embodiment of the present invention (i.e., a direct heating molding apparatus in which the mold 7 is placed on a lower heating plate 371), the transfer member 72 is placed on the lower heating plate 371 of an airtight continuous atmosphere sintering hot press molding apparatus, directly conducting heat to the lower heating plate 371. This not only provides continuous, efficient, and high-quality hot press molding, but also, because the lower mold 71 and transfer member 72 are made of a single material, such as graphite, they achieve uniform heating and cooling rates. Furthermore, thanks to the design of the transfer member 72 integrally formed at the lower end of the lower mold 71, the bottom of the lower mold 71 is in direct contact with the lower heating plate 371. This direct conduction heating from the lower heating plate 371 also provides improved heating and cooling effects. This eliminates the gap between the carrier plate and the lower heating plate, which is the thickness of the carrier plate itself, and which, due to the thickness of the carrier plate, results in poor heating and cooling rates associated with indirect contact heating in conventional methods.
[0033] The transfer portion 72 of the present invention can be used in another airtight continuous atmosphere sintering hot pressing molding device (such as a space heating molding device where the mold 7 is placed in the heat field 62), see Figure 8As shown, the transfer member 72 is positioned on opposite sides of the slide rails 60 on the airtight chamber 6 of the airtight continuous atmosphere sintering hot press forming apparatus. The transfer member 72 and the bottom of the lower mold 71 are in direct contact with the heat field 62 formed by the heating element 61, and are heated by direct conduction from the heat field 62. In addition to achieving continuous, efficient, and high-quality hot press forming, the lower mold 71 and the transfer member 72 are made of a single material, such as graphite, which provides uniform heating and cooling rates. Furthermore, the transfer member 72, integrally formed at the bottom of the lower mold 71, is designed to directly contact the heat field 62 formed by the heating element, achieving superior heating and cooling effects. This eliminates the disadvantage of indirect contact heating, which suffers from the poor heating and cooling rates associated with conventional methods, where the thickness of the carrier plate separates the heat field formed by the mold and the heating element. The bottom of the lower mold 71 does not contact the device components, which can prevent the lower mold 71 from generating dust due to friction.
[0034] See also Figure 7 As shown, the transfer part 72 of the present invention has at least two sets of integrally formed lower molds 71 at the upper end (three sets in the embodiment in the figure), which not only has the effect of continuous, high-efficiency and high-quality hot pressing molding products, but also has the effect of improving production efficiency.
[0035] The above embodiments are merely preferred embodiments for the purpose of fully illustrating the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are within the scope of protection of the present invention. The scope of protection of the present invention shall be subject to the claims.
Claims
1. A lower mold with a transfer portion, used in a space-heated, airtight, continuous atmosphere sintering hot pressing molding device, characterized in that: The lower end outer edge of the lower mold has a transfer portion that is larger than the lower mold outer edge and is integrally formed with the lower mold, and the upper end of the transfer portion has at least two sets of integrally formed lower molds; The space heating type airtight continuous atmosphere sintering hot pressing forming device has slide rails on both sides, and the two sides of the transfer part are respectively arranged on the slide rails. The bottom end of the transfer part is in direct contact with the heat field formed by the heating element, and is directly heated by the heat field.
Citation Information
Patent Citations
And lower die is provided with transfer part
CN210764977U
Transfer plate
TWM560471U