A method for manufacturing a display substrate, a display substrate and a display device

Abstract

The present invention provides a method for manufacturing a display substrate, a display substrate and a display device. The method for manufacturing a display substrate includes: forming a first flexible substrate, a metal layer, a second flexible substrate, a first film layer and a second film layer on a hard substrate in sequence; opening a first via hole penetrating the second film layer to expose a portion of the surface of the first film layer away from the hard substrate; opening a second via hole penetrating the first film layer and the second flexible substrate to expose a portion of the surface of the metal layer away from the hard substrate, wherein the orthographic projection of the second via hole on the hard substrate is located within the orthographic projection of the first via hole on the hard substrate; opening a third via hole penetrating the first film layer to expose a portion of the surface of the second flexible substrate away from the hard substrate. The embodiment of the present invention avoids undercutting when opening via holes on the second flexible substrate by opening the first via hole, the second via hole and the third via hole in sequence, which helps to improve the reliability of wiring connection.

Description

Technical Field

[0001] The present invention relates to the field of display, and in particular to a method for manufacturing a display substrate, a display substrate and a display device. Background Art

[0002] With the development of display technology, more and more functions are integrated into electronic devices. For example, display devices usually need to integrate various devices such as touch modules, antennas, sensors, etc. on the display panel to meet the required functions. When integrating these devices on the display panel, corresponding wiring needs to be set to provide electrical signals. As the number of wiring increases, the wiring becomes more difficult and the possibility of abnormal connections between wiring is higher. Summary of the invention

[0003] Embodiments of the present invention provide a method for manufacturing a display substrate, a display substrate, and a display device to solve the problem that there is a high possibility of abnormal connection between wirings.

[0004] In a first aspect, an embodiment of the present invention provides a method for manufacturing a display substrate, comprising the following steps:

[0005] forming a first flexible substrate, a metal layer, a second flexible substrate, a first film layer and a second film layer in sequence on a hard substrate;

[0006] Opening a first via hole penetrating through the second film layer so as to expose a portion of a surface of the first film layer away from the hard substrate;

[0007] A second via hole is formed through the first film layer and the second flexible substrate to expose a portion of the surface of the metal layer away from the hard substrate, wherein the orthographic projection of the second via hole on the hard substrate is within the orthographic projection of the first via hole on the hard substrate;

[0008] A third via hole is opened through the first film layer to expose a portion of the surface of the second flexible substrate away from the hard substrate, wherein the orthographic projection of the third via hole on the hard substrate is located within the orthographic projection of the first via hole on the substrate, and the orthographic projection of the third via hole on the hard substrate covers the orthographic projection of the second via hole on the hard substrate.

[0009] In some embodiments, before the first via hole penetrating the second film layer is opened, the method further includes:

[0010] A semiconductor layer is manufactured, wherein the semiconductor layer comprises a polycrystalline silicon material obtained by converting amorphous silicon through excimer laser annealing.

[0011] In some embodiments, the first film layer includes one or more of a buffer layer and a second barrier layer; and / or

[0012] The second film layer includes one or more of a gate insulating layer and a dielectric layer.

[0013] In some embodiments, the second via includes a first sub-via and a second sub-via;

[0014] The step of opening the second via hole comprises:

[0015] Opening a first sub-via hole penetrating the first film layer to expose a portion of a surface of the second flexible substrate away from the hard base;

[0016] Using the first film layer as a mask, a second sub-via hole penetrating the second flexible substrate is opened to expose a surface portion of the metal layer away from the hard base.

[0017] In some embodiments, the apertures of the first via hole, the third via hole, and the second via hole decrease in sequence.

[0018] In some embodiments, after the third via hole penetrating the first film layer is opened, the method further includes:

[0019] A conductive connection line is made on a side of the second film layer away from the hard substrate, and the conductive connection line is electrically connected to the metal layer through the first via hole and the second via hole.

[0020] In a second aspect, an embodiment of the present invention provides a display substrate, which is manufactured by the method for manufacturing a display substrate according to any one of the first aspects.

[0021] In some embodiments, the display substrate includes a touch electrode pattern, the touch electrode pattern includes a first electrode sub-pattern, and the metal layer includes the first electrode sub-pattern.

[0022] In some embodiments, the touch electrode pattern further includes a second electrode sub-pattern, and the second electrode sub-pattern is located on a side of the second flexible substrate away from the first flexible substrate;

[0023] The display substrate includes an edge region and a central region, wherein the first electrode sub-pattern is used for touch recognition in the edge region, and the second electrode sub-pattern is used for touch recognition in the central region.

[0024] In some embodiments, the metal layer includes a near field communication coil.

[0025] In some embodiments, the metal layer includes at least one of a data line pattern or a power signal line pattern.

[0026] In a third aspect, an embodiment of the present invention provides a display device, comprising the display substrate described in any one of the second aspects.

[0027] The manufacturing method of the display substrate provided by the embodiment of the present invention comprises the following steps: forming a first flexible substrate, a metal layer, a second flexible substrate, a first film layer and a second film layer on a hard substrate in sequence; opening a first via hole penetrating the second film layer to expose a surface portion of the first film layer away from the hard substrate; opening a second via hole penetrating the first film layer and the second flexible substrate to expose a surface portion of the metal layer away from the hard substrate, wherein the orthographic projection of the second via hole on the hard substrate is located within the orthographic projection of the first via hole on the hard substrate; opening a third via hole penetrating the first film layer to expose a surface portion of the second flexible substrate away from the hard substrate, wherein the orthographic projection of the third via hole on the hard substrate is located within the orthographic projection of the first via hole on the substrate, and the orthographic projection of the third via hole on the hard substrate covers the orthographic projection of the second via hole on the hard substrate. Since the thickness of the flexible substrate is usually thicker than that of other film layers, undercutting may occur when opening vias on the flexible substrate. In the embodiment of the present invention, the first via, the second via, and the third via are opened in sequence to avoid undercutting when opening vias on the second flexible substrate, thereby helping to improve the reliability of wiring connection. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative labor.

[0029] Figure 1 It is a local electron microscope scanning image of a display substrate;

[0030] Figure 2 is a flow chart of a method for manufacturing a display substrate provided by an embodiment of the invention;

[0031] Figure 3 is a schematic diagram of an intermediate process of a display substrate provided by an embodiment of the invention;

[0032] Figure 4 is a schematic diagram of an intermediate process of a display substrate provided by an embodiment of the invention;

[0033] Figure 5 is a schematic diagram of an intermediate process of a display substrate provided by an embodiment of the invention;

[0034] Figure 6 is a schematic diagram of an intermediate process of a display substrate provided by an embodiment of the invention;

[0035] Figure 7 is a schematic diagram of an intermediate process of a display substrate provided by an embodiment of the invention;

[0036] Figure 8 is a schematic diagram of an intermediate process of a display substrate provided by an embodiment of the invention;

[0037] Fig. 9 is a schematic structural diagram of another display substrate in an embodiment of the present invention;

[0038] Fig.10 is a schematic structural diagram of another display substrate in an embodiment of the present invention;

[0039] Fig.11 It is a schematic structural diagram of another display substrate in an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. The following embodiments and features in the embodiments can be combined with each other if there is no conflict. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] With the development of display technology and electronic technology, users have more and more requirements for the functions integrated into electronic devices. For example, for display devices, it may be necessary to integrate near field communication (NFC) functions, touch functions, ambient light detection functions, etc. At the same time, there may be different requirements for display panels, such as resolution requirements. At the same time, users also have certain requirements for the size and shape of display devices, such as narrow borders, high screen-to-body ratio, low weight, etc. In order to achieve these requirements, it will make the routing of display devices more difficult. For example, if the NFC function needs to be realized, an NFC induction coil needs to be set up, and the NFC induction coil will take up a certain amount of space. For example, if high resolution needs to be achieved, the pixel routing needs to be arranged more closely.

[0042] The inventor of the present application found in the process of realizing the technical solution of the present application that the routing difficulty can be reduced by metal routing between double-layer substrates. The metal routing between double-layer substrates refers to setting a double-layer flexible substrate and setting a part of the metal routing between the two layers of flexible substrates, thereby reducing the routing density of other parts. The metal routing between the double-layer flexible substrates needs to be electrically connected to other structures through vias penetrating one of the layers of the flexible substrate, but this routing method has poor reliability.

[0043] After further research, the inventor of the present application found that the reason for the poor reliability of the routing is that in order to realize the electrical connection between the metal routing and other structures between the double-layer flexible substrate, one layer of the flexible substrate needs to be etched. The thickness of the flexible substrate is much greater than that of other film layers, and the flexible substrate needs to be made of organic materials such as polyimide (PI). Therefore, when opening a via on the flexible substrate, it is not possible to directly use photoresist to block etching, but to use the inorganic layer on the flexible substrate to block etching. Figure 1 As shown in the boxed area in the figure, this process will cause the flexible substrate material at the edge of the via to be over-etched and undercut. In this way, when the conductive connection line is subsequently made through the via to overlap with the metal trace, the overlap is more difficult and the open circuit phenomenon is likely to occur, resulting in reduced reliability of the display substrate.

[0044] An embodiment of the present invention provides a method for manufacturing a display substrate.

[0045] like Figure 2 As shown, in one embodiment, the method for manufacturing the display substrate includes the following steps:

[0046] Step S101: forming a first flexible substrate, a metal layer, a second flexible substrate, a first film layer and a second film layer in sequence on a hard substrate.

[0047] In this embodiment, glass or other materials can be used as the hard substrate 10. Figure 3 As shown, a first flexible substrate 101 , a metal layer 103 , a second flexible substrate 104 , a first film layer 105 and a second film layer 106 are sequentially formed on a hard substrate 10 .

[0048] The first flexible substrate 101 can be made of organic materials such as PI, and the thickness of the first flexible substrate 101 can be controlled to be 5 to 20 micrometers. On the first flexible substrate 101, a first barrier layer 102 can be made as needed.

[0049] A metal material is deposited on the first flexible substrate 101 . The metal material may be selected as required, including but not limited to molybdenum Mo, titanium Ti, aluminum Al, silver Ag, niobium aluminum alloy AlNb, and the like. The metal material is then patterned as required to form a metal layer 103 .

[0050] A second flexible substrate 104 is manufactured on the metal layer 103 . The second flexible substrate 104 may be made of organic materials such as PI. The thickness of the second flexible substrate 104 may be smaller than that of the first flexible substrate 101 , for example, may be controlled within 1 to 10 microns.

[0051] A first film layer 105 is manufactured on the second flexible substrate 104 . The first film layer 105 includes an inorganic layer. In some embodiments, the inorganic layer specifically included in the first film layer 105 refers to one or more of a second barrier layer 1051 and a buffer layer 1052 .

[0052] The second film layer 106 is fabricated on the first film layer 105 . In some embodiments, the second film layer 106 includes one or more of a gate insulating layer and a dielectric layer 1063 .

[0053] It should be understood that when manufacturing the second film layer 106, other film layers may be manufactured as needed, such as the semiconductor layer 107 of the thin film transistor (TFT), the gate metal layer, etc. However, these film layers and the vias to be opened are located in different regions, and the existence of these film layers and structures will not affect the opening of the vias, so no further limitation and description are made here. The film layers to be manufactured and their process materials, etc. can all refer to the relevant technologies to a certain extent, and will not be described here.

[0054] See also Figure 3 In this embodiment, the TFT has a dual-gate structure, and accordingly, the film layers to be manufactured include a semiconductor layer 107, a first gate metal layer 108, and a second gate metal layer 109. Accordingly, the second film layer 106 specifically includes a first gate insulating layer 1061, a second gate insulating layer 1062, and a dielectric layer 1063. Obviously, the structure to be manufactured can be adaptively adjusted as needed, and no further limitation is made here.

[0055] Step S102: opening a first via hole penetrating the second film layer to expose a portion of a surface of the first film layer away from the hard substrate.

[0056] like Figure 4 As shown, a first via hole 201 is provided, and the first via hole 201 penetrates the second film layer 106. Thus, after the first via hole 201 is provided, a portion of the surface of the first film layer 105 away from the hard substrate 10 is exposed. In this embodiment, a portion of the surface of the buffer layer 1052 away from the hard substrate 10 is exposed. The size of the first via hole 201 can be set as required and is not further limited here.

[0057] Step S103 : opening a second via hole 202 penetrating the first film layer 105 and the second flexible substrate 104 , so as to expose a portion of the surface of the metal layer 103 away from the hard substrate 10 .

[0058] like Figure 5 and Figure 6As shown, a second via hole 202 is provided, and the orthographic projection of the second via hole 202 on the rigid substrate 10 is located within the orthographic projection of the first via hole 201 on the rigid substrate 10. It can be understood that the second via hole 202 is provided in the area where the first film layer 105 is partially exposed, and the second via hole 202 penetrates the first film layer 105 and the second flexible substrate 104, so that a part of the metal layer 103 is exposed.

[0059] In some embodiments, the second via 202 includes a first sub-via 2021 and a second sub-via 2022, and the step S103 specifically includes:

[0060] A first sub-via hole 2021 is formed through the first film layer 105 to expose a portion of a surface of the second flexible substrate 104 away from the hard base 10 ;

[0061] Using the first film layer as a mask, a second sub-via hole penetrating the second flexible substrate is opened to expose a surface portion of the metal layer away from the hard base.

[0062] like Figure 5 As shown, firstly, a first sub-via hole 2021 is opened. The first sub-via hole 2021 is a portion that penetrates the first film layer 105. Figure 6 As shown, the second sub-via 2022 is opened next. The second sub-via 2022 is a portion that passes through the second flexible substrate 104. That is, the first sub-via 2021 and the second sub-via 2022 included in the second via 202 are opened separately.

[0063] Please also see Figure 1 and Figure 6 When the second sub-via hole 2022 is formed, the etched portion of the second flexible substrate 104 will be undercut.

[0064] Step S104: opening a third via hole penetrating the first film layer to expose a portion of a surface of the second flexible substrate away from the hard base.

[0065] like Figure 7 As shown, next, a third via hole 203 is opened, and the orthographic projection of the third via hole 203 on the hard substrate 10 is located within the orthographic projection of the first via hole 201 on the substrate, and the orthographic projection of the third via hole 203 on the hard substrate 10 covers the orthographic projection of the second via hole 202 on the hard substrate 10.

[0066] It can be understood that the third via hole 203 is opened in the area exposed by the first film layer 105, and the range of the opened second via hole 202 is larger than that of the second via hole 202. Since the thickness of the second flexible substrate 104 is relatively large and the corrosion resistance is higher than that of the first film layer 105, by controlling the process parameters, the opened third via hole 203 can only penetrate the first film layer 105 and cannot penetrate the second flexible substrate 104. In this process, the metal layer 103 acts as an etching barrier to prevent further etching.

[0067] Please compare Figure 6 and Figure 7 After the third via hole 203 is opened, the surface of the second flexible substrate 104 which is away from the hard base 10 can be partially exposed, thus eliminating the undercut phenomenon.

[0068] The embodiment of the present invention sequentially opens the first via hole, the second via hole and the third via hole to avoid undercutting when opening the via holes on the second flexible substrate, which helps to improve the reliability of the wiring connection.

[0069] In some embodiments, after step S104, the method further includes:

[0070] A conductive connection line is made on a side of the second film layer away from the hard substrate, and the conductive connection line is electrically connected to the metal layer through the first via hole and the second via hole.

[0071] In some embodiments, the apertures of the first via 201, the third via 203, and the second via 202 are successively reduced. It should be noted that, in theory, the apertures of the first sub-via 2021 and the second sub-via 2022 included in the second via 202 are equal, but there is actually a certain difference between the apertures of the first sub-via 2021 and the second sub-via 2022. The actual difference is caused by the undercut phenomenon caused by process factors. Therefore, the aperture of the second via 202 in this embodiment actually refers to the aperture of the second sub-via 2022.

[0072] Thus, after the manufacturing is completed, the size of the formed via hole gradually decreases in the direction away from the hard substrate 10, which helps to improve the reliability of the electrical connection between the subsequent conductive connection line and the metal layer 103. Here, the via hole specifically refers to the entire via hole formed by the first via hole 201 and the third via hole 203.

[0073] After the via holes are formed, conductive connecting lines may be manufactured. The conductive connecting lines and the source-drain metal layer 103 may be manufactured through a single patterning process.

[0074] In some embodiments, the formed via holes may be filled while the planarization layer 109 is being manufactured.

[0075] In some embodiments, the display substrate also needs to be bound to other structures, for example, it may need to be bound to a circuit board. Accordingly, when filling the via hole, the binding area may be filled as needed.

[0076] In some embodiments, other subsequent structures can be manufactured as needed. For example, when the display substrate is an OLED (organic light emitting diode) display substrate, an anode layer 110, a pixel definition layer (PDL) 111, a support structure (PS) 112 and other structures can be further manufactured. The specific structures can be arranged as needed and are not further limited or described here.

[0077] In some embodiments, the display substrate includes an LTPS-TFT (Low Temperature Poly-silicon ThinFilm Transistor). Thus, the process of manufacturing the second film layer 106 also includes the step of manufacturing the semiconductor layer 107, wherein the manufacturing of the semiconductor layer 107 includes the step of converting amorphous silicon (a-Si) into polycrystalline silicon (p-Si) material by excimer laser annealing (ELA).

[0078] It should be understood that if the second flexible substrate 104 is etched before the ELA process, the side wall of the second flexible substrate 104 will be partially exposed at the second sub-via 2022. At this time, there is no inorganic layer that can protect the area. Here, the inorganic layer refers to one or more of the second barrier layer 1051 and the buffer layer 1052 in the first film layer 105, and the curing temperature of PI is generally about 450 degrees Celsius. In this way, the exposed portion of the second flexible substrate 104 may be burned in the ELA process.

[0079] The technical solution of this embodiment arranges the step of etching the second flexible substrate 104 after the ELA process, which completely avoids the possibility of the ELA process burning the etched second flexible substrate 104, and helps to improve the reliability of the display substrate.

[0080] An embodiment of the present invention provides a display substrate, which is manufactured by any of the above methods for manufacturing a display substrate.

[0081] Since the display substrate of this embodiment is manufactured by the above method embodiment, it can at least achieve all the above technical effects, which will not be described in detail here.

[0082] like Fig. 9 As shown, in some embodiments, the display substrate includes a touch electrode pattern, the touch electrode pattern includes a first electrode sub-pattern 901 , and the metal layer includes the first electrode sub-pattern 901 .

[0083] In this embodiment, the touch electrode pattern can be made between two layers of flexible substrates, thereby reducing space occupation, providing more wiring space for the second flexible substrate away from the first flexible substrate, and reducing wiring difficulty.

[0084] In some embodiments, the touch electrode pattern further includes a second electrode sub-pattern, the second electrode sub-pattern is located on a side of the second flexible substrate away from the first flexible substrate, the display substrate includes an edge region and a central region, wherein the first electrode sub-pattern 901 is used for touch recognition in the edge region, and the second electrode sub-pattern is used for touch recognition in the central region. The first electrode sub-pattern 901 is connected to the conductive connection line through the via 902 to achieve transmission of the touch signal.

[0085] In this embodiment, it can be understood that the first electrode sub-pattern 901 corresponding to the edge area of ​​the display substrate is moved between the double-layer flexible substrate below the display area, which helps to achieve a narrow frame, increase the screen-to-body ratio, and help improve the display effect.

[0086] like Fig.10 As shown, in some embodiments, the metal layer includes a near field communication (NFC) coil 1001. The technical solution of this embodiment can make the NFC coil 1001 through the metal layer between the double-layer flexible substrate, and then realize the electrical connection between the NFC coil 1001 and the conductive connection line 1003 through the via 1002, so as to realize the integration of the display substrate and the NFC coil 1001, which helps to reduce space occupation.

[0087] like Fig.11 As shown, in some embodiments, the metal layer includes at least one of a data line pattern 1101 or a power signal line pattern.

[0088] In this embodiment, a portion of the data line pattern 1101 or the power signal line is fabricated between the two-layer flexible substrates, and the data line pattern 1101 or the power signal line is electrically connected to the driving circuit layer located on the side of the second flexible substrate away from the first flexible substrate through the via hole 1102 to achieve signal transmission. The data line pattern 1101 or the power signal line can be connected to the conductive connection line 1104 connected to the signal source through the via hole 1103 in the fan-out area of ​​the display substrate to obtain the data signal or the power signal.

[0089] In this way, when the display substrate area is constant, more data line graphics 1101 or power signal lines can be set, so as to provide signals for more pixel units, which helps to increase the number of pixels per unit area.

[0090] It should be understood that the more pixel units per unit area, the more routing lines are required. In the related art, the number of routing lines is usually increased by controlling the line width or routing layout to improve the resolution. However, this method is difficult to wire because when the line width is reduced, the signal transmission effect decreases. Therefore, it is necessary to optimize the routing design. At the same time, the difficulty of the manufacturing process increases, which may also lead to an increase in production costs. The technical solution of this embodiment can increase the number of routing lines per unit area without increasing or significantly increasing the difficulty of wiring, which helps to effectively improve the display resolution without significant process difficulty.

[0091] An embodiment of the present invention provides a display device, comprising any one of the above display substrates.

[0092] Since this embodiment includes all the technical solutions of the above-mentioned display substrate embodiment, it can at least achieve all the above-mentioned technical effects, which will not be described in detail here.

[0093] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for manufacturing a display substrate, characterized in that: The following steps are involved: forming a first flexible substrate, a metal layer, a second flexible substrate, a first film layer and a second film layer in sequence on a hard substrate; Opening a first via hole penetrating through the second film layer so as to expose a portion of a surface of the first film layer away from the hard substrate; A second via hole is formed through the first film layer and the second flexible substrate to expose a portion of the surface of the metal layer away from the hard substrate, wherein the orthographic projection of the second via hole on the hard substrate is within the orthographic projection of the first via hole on the hard substrate; A third via hole is formed through the first film layer to expose a portion of a surface of the second flexible substrate away from the hard substrate, wherein an orthographic projection of the third via hole on the hard substrate is within an orthographic projection of the first via hole on the substrate, and an orthographic projection of the third via hole on the hard substrate covers an orthographic projection of the second via hole on the hard substrate; The second via hole includes a first sub-via hole and a second sub-via hole; The step of opening the second via hole comprises: Opening a first sub-via hole penetrating the first film layer to expose a portion of a surface of the second flexible substrate away from the hard base; Using the first film layer as a mask, a second sub-via hole penetrating the second flexible substrate is opened to expose a surface portion of the metal layer away from the hard base.

2. The method for manufacturing a display substrate according to claim 1, characterized in that: Before the first via hole penetrating the second film layer is formed, the method further includes: A semiconductor layer is manufactured, wherein the semiconductor layer comprises a polycrystalline silicon material obtained by converting amorphous silicon through excimer laser annealing.

3. The method for manufacturing a display substrate according to claim 1, characterized in that: The first film layer comprises one or more of a buffer layer and a second barrier layer; and / or The second film layer includes one or more of a gate insulating layer and a dielectric layer.

4. The method for manufacturing a display substrate according to claim 1 or 3, characterized in that: The apertures of the first via hole, the third via hole and the second via hole decrease in sequence.

5. The method for manufacturing a display substrate according to claim 1, characterized in that: After the third via hole penetrating the first film layer is opened, the method further includes: A conductive connection line is made on a side of the second film layer away from the hard substrate, and the conductive connection line is electrically connected to the metal layer through the first via hole and the second via hole.

6. A display substrate, characterized in that: The display substrate is manufactured by the manufacturing method of any one of claims 1 to 5.

7. The display substrate according to claim 6, characterized in that: The display substrate includes a touch electrode pattern, the touch electrode pattern includes a first electrode sub-pattern, and the metal layer includes the first electrode sub-pattern.

8. The display substrate according to claim 7, characterized in that: The touch electrode pattern further includes a second electrode sub-pattern, and the second electrode sub-pattern is located on a side of the second flexible substrate away from the first flexible substrate; The display substrate includes an edge region and a central region, wherein the first electrode sub-pattern is used for touch recognition in the edge region, and the second electrode sub-pattern is used for touch recognition in the central region.

9. The display substrate according to claim 6, characterized in that: The metal layer includes a near field communication coil.

10. The display substrate according to claim 6, characterized in that: The metal layer includes at least one of a data line pattern or a power signal line pattern.

11. A display device, characterized in that: A display substrate comprising the display substrate according to any one of claims 6 to 10.

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