Water cooling plate device and vehicle
By bent both ends of the main board of the water-cooled plate device and setting openings, using a plug to seal the opening, and connecting the water pipe to the plug, the problem of low sealing performance of the existing water-cooled plate device is solved, and higher sealing performance and higher efficiency are achieved The heat dissipation effect.
Patent Information
- Application Number
- CN202210112344.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-01-29
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2042-01-29
AI Technical Summary
The existing water-cooled plate devices have low sealing performance, increasing the risk of water leakage.
By bending both ends of the motherboard toward the same side and setting openings on the bent part, using a plug to seal the opening, the water pipe corresponds to the plug one by one, and communicates with the chamber through the plug, reducing the number of interfaces on the motherboard, and improving the Sealing performance.
Improve the sealing performance of the water-cooled plate device, reduce the risk of water leakage, reduce the amount of welding, and avoid blockage problems caused by welding. At the same time, the extrusion process is integrated, and the processing technology is simplified, achieving lightweight and high-quality product patching. Combined, improves heat dissipation efficiency.
Smart Images

Figure CN114423250B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of cooling technology, and more particularly to a water cooling plate device and a vehicle. Background Art
[0002] Existing water-cooled plate devices generally include a main board with a chamber, a sealing structure for sealing the chamber, and an inlet and outlet water pipe connected to the chamber; the sealing structure and the inlet and outlet water pipes are usually detachably connected to the main board or welded together, which reduces the sealing performance of the water-cooled plate device and increases the risk of water leakage. Summary of the invention
[0003] An object of the present invention is to solve the above-mentioned problems and to provide advantages which will be described later.
[0004] Another object of the present invention is to provide a water cooling plate device and a vehicle to improve the sealing performance of the water cooling plate device.
[0005] The present invention is achieved through the following technical solutions:
[0006] A first aspect of the present invention provides a water cooling plate device, comprising:
[0007] A main board having a cavity inside, with openings communicating with the cavity being provided at both ends of the main board; two plugs for sealing the openings; and
[0008] two water pipes for communicating with the chamber;
[0009] Wherein, the main board is bent from two ends of the main body portion toward the same side of the main board to form a bent portion, and the opening is arranged on the bent portion.
[0010] In some technical solutions, the mainboard is integrally formed through an extrusion process.
[0011] In some technical solutions, the water pipe is connected to the main board.
[0012] In some technical solutions, the two water pipes correspond to the two plugs one by one, and the water pipes are connected to the corresponding plugs and communicate with the chamber through the plugs.
[0013] In some technical solutions, the two water pipes correspond to the two plugs one by one, and the water pipes are integrally connected to the corresponding plugs and are connected to the chamber through the plugs.
[0014] In some technical solutions, a groove is provided at the end of the water pipe for connecting with the plug, and the water pipe is clamped on the plug through the groove.
[0015] In some technical solutions, the curved portion includes an arc-shaped transition portion and a bending portion, the main portion, the arc-shaped transition portion and the bending portion are connected in sequence, and the angle between the bending portion and the main portion of the main board is 90 degrees.
[0016] In some technical solutions, the radius of the arc-shaped transition portion is less than or equal to 12 mm.
[0017] In some technical solutions, the chamber is divided into a plurality of channels along the length direction of the main board.
[0018] A second aspect of the present invention further provides a vehicle, comprising: the water cooling plate device described in the first aspect.
[0019] The technical effects provided by the embodiments of the present invention include:
[0020] 1. Since the water-cooling plate device bends the two ends of the mainboard toward the same side of the mainboard, the sealing performance of the water-cooling plate device can be improved and the risk of water leakage can be reduced.
[0021] 2. Compared with the way of connecting the water pipe to the motherboard, the water pipe is connected to the plug and then communicated with the chamber, which can reduce the number of interfaces opened on the motherboard and improve the sealing performance. It can also reduce the amount of welding on the motherboard and avoid the cavity inside the motherboard from being blocked.
[0022] 3. In some embodiments, the water pipe and the plug are integrally connected, which further improves the sealing performance. In addition, the amount of welding can be reduced to avoid blocking the waterway between the water pipe and the plug due to welding.
[0023] 4. The mainboard is formed in one piece by extrusion process, which simplifies the processing technology and makes the product lightweight, thus reducing the product cost. In addition, the flatness can be improved, and the high-quality fit between the product and the heat dissipation pad can be achieved, thereby improving the heat dissipation efficiency.
[0024] 5. Improve product deformation without increasing the weight of the water cooling plate device.
[0025] Other advantages, objectives and features of the present invention will be embodied in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 A schematic structural diagram of a water cooling plate device according to an embodiment of the present invention;
[0027] Figure 2 for Figure 1 Schematic diagram of the local enlarged structure of the middle M area;
[0028] Figure 3 is a schematic diagram of a curved portion in an embodiment of the present invention;
[0029] Figure 4 It is another structural schematic diagram of the water cooling plate device according to an embodiment of the present invention;
[0030] Figure 5 A schematic diagram of a connection between a water pipe and a plug in an embodiment of the present invention;
[0031] Figure 6 is a schematic diagram of a water pipe in an embodiment of the present invention;
[0032] Figure 7 It is another structural schematic diagram of the water cooling plate device according to an embodiment of the present invention;
[0033] Figure numerals: 10, main board; 20, plug; 30, water pipe; 110, main body; 120, curved portion; 121, arc-shaped transition portion; 122, bending portion; 123, opening; 310, slot. DETAILED DESCRIPTION
[0034] The present invention is further described in detail below in conjunction with the accompanying drawings so that those skilled in the art can implement the invention with reference to the description.
[0035] The terms "upper", "lower", "top", "bottom", "inside", "outside" and the like in the embodiments of the present application indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or device referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation of the present invention. Furthermore, the terms "including", "provided with", "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units inherent to these processes, methods, products or devices.
[0036] In the description of the present application, “plurality” means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0037] In addition to the above, it is still necessary to emphasize that the reference to "embodiment" in this article means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0038] like Figure 1 As shown, in the first aspect, the water-cooling plate device provided in the embodiment of the present application can be used to cool a battery. Specifically, the water-cooling plate device comprises: a main board 10 having a chamber inside, two plugs 20 arranged at both ends of the main board 10, and two water pipes 30 for communicating with the chamber; wherein both ends of the main board 10 are bent toward the same side of the main board 10.
[0039] Further, continue to combine Figure 2 As shown, the main board 10 is bent toward the upper side of the main board from the left and right ends of the main body 110 to form two bent parts 120 ( Figure 2 Only one curved portion 120 at the left end is shown in the figure, and the curved portion 120 at the right end is not shown). An opening 123 is provided on each curved portion 120. Each opening 123 is communicated with the chamber.
[0040] The two plugs 20 correspond to the two openings 123 respectively, wherein the plugs 20 are used to seal the corresponding openings 123 so that the chamber is sealed; more specifically, each of the two ends of the main board 10 is connected to a corresponding plug 20, so that the corresponding opening 123 is sealed.
[0041] Two water pipes 30 are respectively connected to the chambers, wherein one water pipe 30 is used for water outlet and the other water pipe 30 is used for water intake. More specifically, the water pipe 30 is hollow inside to form an inner cavity, and the inner cavity is connected to the chamber.
[0042] The two ends of the mainboard 10 are bent toward the same side of the mainboard 10, for example, bent upward as shown in the figure. In this way, when in use, the mainboard 10 can be placed in the upward direction of the opening 123, so as to prevent water or other liquids contained in the mainboard 10 from flowing out, thereby improving the sealing performance of the water cooling plate device and reducing the risk of water leakage.
[0043] In summary, compared with the prior art, the water-cooled plate device can improve the sealing performance of the water-cooled plate device and reduce the risk of water leakage because the two ends of the mainboard 10 are bent toward the same side of the mainboard 10. In some embodiments, the bending angle is 90 degrees.
[0044] In some embodiments, the radius of the bend is less than 12 mm.
[0045] In some embodiments, continued binding Figure 3 As shown, the curved portion 120 includes an arc-shaped transition portion 121 and a bending portion 122, wherein the main portion 110, the arc-shaped transition portion 121 and the bending portion 122 are connected in sequence. Further, the angle between the bending portion 122 and the main portion 110 of the main board is 90 degrees; the main portion 110 here can be understood as the unbent portion of the main board. Further, the radius of the arc-shaped transition portion 121 is less than or equal to 12 millimeters (mm).
[0046] In some embodiments, the mainboard 10 is integrally formed by an extrusion process, which simplifies the processing technology and makes the product lightweight, thereby reducing the product cost. In addition, the flatness can be improved, and a high-quality fit between the product and the heat dissipation pad can be achieved, thereby improving the heat dissipation efficiency.
[0047] In some embodiments, in combination Figure 4 As shown, the connection between the water pipe 30 and the chamber can be achieved in the following manner, that is, the water pipe 30 is directly connected to the main body 110 of the main board 10. In this connection method, a through hole (not shown in the figure) corresponding to the water pipe 30 is provided on the main body 110, and the through hole is connected to the chamber. The end of the water pipe 30 for connecting with the main body 110 covers the through hole, and the inner cavity of the water pipe 30 is connected to the through hole.
[0048] Compared with the above method, Figure 5-7 As shown, the communication between the water pipe 30 and the chamber can also be achieved in the following manner: the water pipe 30 is connected to the plug 20, and is communicated with the chamber through the plug 20. It should be understood that each water pipe 30 is connected to a corresponding plug 20. It should be noted that in this embodiment, a flow channel (not shown in the figure) is provided inside the plug 20 for communicating with the chamber. Correspondingly, the flow channel is communicated with the water pipe 30.
[0049] It should be noted that, compared with the method of connecting the water pipe to the mainboard, the water pipe is connected to the plug and then communicated with the chamber, which can reduce the number of interfaces opened on the mainboard and improve the sealing performance. It can also reduce the amount of welding on the mainboard and avoid clogging of the chamber inside the mainboard.
[0050] In some embodiments, Figure 6As shown, a clamping groove 310 is provided at the end of the water pipe 30 for connecting with the plug 20 , and the water pipe 30 is clamped on the plug 20 through the clamping groove 310 .
[0051] In some embodiments, the end of the plug 20 used for connecting to the water pipe 30 is provided with an outlet (not shown in the figure), and the outlet is connected to the flow channel provided in the plug 20. When the plug 20 is connected to the corresponding water pipe 30, the outlet of the plug 20 is covered by the water pipe 30 and is connected to the inner cavity of the water pipe 30, which can further improve the sealing performance.
[0052] In order to further improve the sealing performance, the water pipe 30 is integrally connected with the corresponding plug 20. In addition, the welding amount can be reduced to avoid blocking the waterway between the water pipe and the plug due to welding.
[0053] In some embodiments, the chamber is divided into a plurality of channels along the length direction of the main board 10. In some embodiments, the two ends of the channel are respectively connected to the two openings 123. That is, the left end of the channel is connected to the opening 123 at the left end of the main board 10, and similarly, the right end of the channel is connected to the opening 123 at the right end of the main board 10.
[0054] In a second aspect, the present application further provides a vehicle, comprising the water cooling plate device described in each embodiment of the first aspect.
[0055] Although the embodiments of the present invention have been disclosed as above, they are not limited to the applications listed in the specification and the implementation modes, and they can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and the illustrations shown and described herein.
Claims
1. A water cooling plate device, characterized in that: include: A main board with a cavity inside, the main board is integrally formed by an extrusion process, both ends of the main board are provided with openings communicating with the cavity, the main board is bent from both ends of the main body toward the upper side of the main board to form two curved parts, wherein the curved part includes an arc-shaped transition part and a bending part, the main body, the arc-shaped transition part and the bending part are connected in sequence, the opening is provided at the end of the corresponding bending part, and the other end of the bending part opposite to the end is connected to the corresponding arc-shaped transition part; Two plugs for sealing the opening, each plug having a flow channel disposed therein; and Two water pipes for communicating with the chamber, the two water pipes corresponding to the two plugs one by one, the water pipes connected to the corresponding plugs, and communicating with the chamber through the plugs; The water pipe is integrally connected with the corresponding plug and communicates with the chamber through the plug; an outlet is provided at the end of the plug for connecting with the water pipe, and the outlet is communicated with the flow channel provided in the plug. When the plug is connected with the corresponding water pipe, the outlet of the plug is covered by the water pipe and communicates with the inner cavity of the water pipe; The end of the water pipe used for connecting with the plug is provided with a clamping groove, and the water pipe is clamped on the plug through the clamping groove.
2. The water cooling plate device according to claim 1, characterized in that: The angle between the bent portion and the main body of the main board is 90 degrees.
3. The water cooling plate device according to claim 1, characterized in that: The radius of the arc-shaped transition portion is less than or equal to 12 mm.
4. The water cooling plate device according to claim 1, characterized in that: The chamber is divided into a plurality of channels along the length direction of the main board.
5. A vehicle, characterized in that It comprises the water cooling plate device described in any one of claims 1 to 4.
Citation Information
Patent Citations
Liquid cooling plate for interior split flow
CN107732355A
Liquid cooling plate and manufacturing method thereof
CN113346161A
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CN216673706U