Electronic component mounting device

Abstract

The present invention provides an electronic component mounting device that can simplify the position alignment of the ACF slit relative to the end of the COF, which is required each time the size of the COF changes, and can omit the moving mechanism of the pressure head. The electronic component mounting device of the present invention includes: a supply device that supplies a film-shaped electronic component (F); a laminating device (50) that laminates an anisotropic conductive component to the film-shaped electronic component (F) at a specific laminating position (R2); a mounting device (60) that mounts the film-shaped electronic component (F) laminat-ed with the anisotropic conductive component on a display panel (D); and a transfer device (40) that sets a reference position (R1) for aligning the laminating position (R2), aligns the end of the film-shaped electronic component (F) with the reference position (R1), receives the film-shaped electronic component (F) from the supply device, and transfers the film-shaped electronic component (F) to the mounting device (60) after laminating the anisotropic conductive component.

Description

Technical Field

[0001] The invention relates to an electronic component mounting device. Background Art

[0002] Liquid crystal displays (LCDs) and organic electroluminescent (EL) displays are becoming popular as displays for televisions and personal computers. The manufacturing process for such displays includes a panel assembly process in which electronic components for driving the display panel are mounted on the display panel. Two known methods exist for this assembly process: a method in which a driver integrated circuit (IC) is directly mounted, and a method in which a film-like electronic component is mounted on a film-like circuit substrate, known as a chip-on-film (COF) method.

[0003] The former is called Chip on Glass (COG) mounting, in which chip-shaped electronic components such as driver ICs are mounted on the glass substrate that constitutes the display panel. The latter is called Film on Glass (FOG) mounting, in which film-shaped electronic components are mounted on the glass substrate. COG mounting uses an electronic component mounting device called a COG mounting device, while FOG mounting uses an electronic component mounting device called an Outer Lead Bonding (OLB) device or a FOG mounting device.

[0004] In the past, the display panel size was roughly 10 inches. For example, FOG mounting was used for large display panels larger than 10 inches, while COG mounting was used for small display panels smaller than 10 inches. Therefore, in the mounting equipment used to mount electronic components on display panels, FOG mounting equipment was used for large display panels, while COG mounting equipment was used for small display panels.

[0005] Furthermore, in the display panel manufacturing process, there is a growing demand for electronic component mounting equipment capable of selectively performing both COG and FOG mounting. COFs are supplied by stamping from a strip-shaped member. Driver ICs are supplied from trays. Therefore, this electronic component mounting equipment requires both a stamping and tray-based supply system.

[0006] In this electronic component mounting device, a driver IC or COF is temporarily crimped to a display panel via an anisotropic conductive member called anisotropic conductive film (ACF), and then mounted to the display panel by heat and pressure bonding (hereinafter also referred to as formal pressure bonding). Specifically, before the temporary pressure bonding, the ACF is attached to the display panel, and the driver IC or COF is temporarily and formally pressed to the display panel. This ACF is a sheet-like member made of a large number of small conductive particles embedded in a thermosetting resin serving as a base material, and is supplied in the form of a strip-like member (hereinafter referred to as ACF tape) attached to a release tape.

[0007] On the other hand, there is a need for an electronic component mounting device that can bond an ACF to a COF instead of a display panel, and then mount the COF bonded with the ACF on the display panel. As a bonding device for bonding an ACF to a COF, for example, the bonding device disclosed in Patent Document 1 is known. In Patent Document 1, an ACF tape formed by bonding the ACF is supplied, and the ACF is bonded to the COF. A slit is pre-formed in the ACF according to the size of the COF, and after bonding to the COF, when the release tape is pulled away from the COF, the ACF bonded to the COF is separated from the ACF tape by the slit.

[0008] [Prior art literature]

[0009] [Patent Document]

[0010] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-016594 Summary of the Invention

[0011] [Problems to be solved by the invention]

[0012] Furthermore, conventionally, when electronic components such as COF are held in electronic component mounting devices, the center of the holding portion is aligned with the center of the electronic component to hold the electronic component. Therefore, when attaching ACF to COFs of various sizes, it is necessary to align the position of the ACF slit with respect to the end of the COF each time the size of the COF changes. Figure 16 (A)~ Figure 16As shown in (C), the ACF (the shaded portion in the figure) bonded to the COF is separated into the size of the COF by the slit placed on the ACF and bonded to the COF. At this time, on the ACF tape on the downstream side of the ACF bonded to the COF, no ACF remains because the ACF has already been bonded to the COF, but on the upstream side (supply side of the ACF tape) of the slit, the next ACF bonded to the COF is bonded to the ACF tape. The characteristics of the ACF change due to heating, so it is desirable to avoid applying heat to the ACF before bonding to the COF. Therefore, the slit of the ACF is aligned with the end face of the COF, and in order to prevent the heated pressing head from contacting the ACF on the upstream side of the slit, the end of the pressing head is aligned with the slit of the ACF and press-bonded. Therefore, in order to cope with COFs of various sizes, it is necessary to add a mechanism for adjusting the alignment of the ACF slit with the COF end face each time the COF size changes, a moving mechanism for aligning the end of the pressure head with the ACF slit, and its control.

[0013] An object of the present invention is to provide an electronic component mounting apparatus that can simplify the positional alignment of an ACF slit relative to an end of a COF required each time the size of the COF changes, and can omit a moving mechanism for a pressure head.

[0014] [Technical means to solve the problem]

[0015] In order to achieve the above-mentioned purpose, the electronic component mounting device of the present invention includes: a supply device for supplying film-like electronic components; a bonding device for bonding an anisotropic conductive component to the film-like electronic components at a specific bonding position; an installation device for installing the film-like electronic components bonded with the anisotropic conductive components on a display panel; and a transfer device for setting a reference position for aligning the bonding position, and aligning the end of the film-like electronic component with the reference position to receive the film-like electronic components from the supply device, and after bonding the anisotropic conductive components, transferring them to the installation device.

[0016] [Effects of the Invention]

[0017] The present invention can simplify the position alignment of the ACF slit relative to the end of the COF, which is required every time the size of the COF changes, and can omit the moving mechanism of the pressure head. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 (A) and Figure 1 (B) is a perspective view showing a film-shaped electronic component (A) and a chip-shaped electronic component (B) according to an embodiment.

[0019] Figure 2 It is a plan view showing the overall structure of the electronic component mounting apparatus according to the embodiment.

[0020] Figure 3 (A) and Figure 3 (B) is an explanatory diagram (A) showing a process of mounting a film-shaped electronic component of the electronic component mounting apparatus according to the embodiment, and an explanatory diagram (B) showing a process of mounting a chip-shaped electronic component.

[0021] Figure 4 (A) and Figure 4 (B) is an explanatory diagram showing the press supply device before press (A) and after press (B) according to the embodiment.

[0022] Figure 5 (A)~ Figure 5 (F) is an explanatory diagram showing a tray receiving process of the tray supply device according to the embodiment.

[0023] Figure 6 It is a perspective view showing a first holding head and a second holding head according to the embodiment.

[0024] Figure 7 (A) and Figure 7 (B) is an explanatory diagram showing the operation of the moving mechanism according to the embodiment.

[0025] Figure 8 It is a plan view showing a reference position in the embodiment.

[0026] Figure 9 It is an explanatory diagram showing a bonding apparatus according to an embodiment.

[0027] Figure 10 This is a functional block diagram showing a control device according to an embodiment.

[0028] Figure 11 This is a flowchart showing the procedure for mounting a film-shaped electronic component according to the embodiment.

[0029] Figure 12 This is a flowchart showing the procedure for mounting a film-shaped electronic component according to the embodiment.

[0030] Figure 13 It is an explanatory diagram showing the relationship among the reference position, the half-cut line, and the bonding position in the embodiment.

[0031] Figure 14 This is a flowchart showing the procedure for mounting chip-shaped electronic components according to the embodiment.

[0032] Figure 15 (A)~ Figure 15 (C) is an explanatory diagram showing position alignment according to the embodiment.

[0033] Figure 16 (A)~ Figure 16 (C) is an explanatory diagram showing the positional alignment of the ACF and the pressing head corresponding to COFs of various sizes in the conventional art.

[0034] [Explanation of Symbols]

[0035] 10, 10a, 10b: Punching supply device

[0036] 20, 20a, 20b: Tray supply device

[0037] 40: Handover device

[0038] 50: Laminating device

[0039] 51, 110: Supply Department

[0040] 52: Cutting part

[0041] 53: Lamination

[0042] 54: Peeling section

[0043] 55: Transport Department

[0044] 56: Recycling Department

[0045] 60: Installation

[0046] 80: Control device

[0047] 81: Organization Control Department

[0048] 82: Storage

[0049] 83: Input and output control unit

[0050] 91: Input device

[0051] 92: Output device

[0052] 120, 610: Platform

[0053] 120a: Opening

[0054] 130: Mold

[0055] 131: Die head

[0056] 131a: Punching

[0057] 132: Punch

[0058] 140: Lifting mechanism

[0059] 141: Support

[0060] 141a: Pillar

[0061] 141b: Support plate

[0062] 142: Drive unit

[0063] 142a: Axis

[0064] 210: Framework

[0065] 220: Grip

[0066] 410: Installation Department

[0067] 411: Loading section

[0068] 412: Stopper

[0069] 420: Mobile mechanism

[0070] 430: Transfer device

[0071] 431: First Arm

[0072] 431a, 432b: Adsorption nozzles

[0073] 432: Second Arm

[0074] 432a: Rotating head

[0075] 510: Supply reel

[0076] 511: Tension mechanism

[0077] 511a: Fixed roller

[0078] 511b: Movable roller

[0079] 512, 561: Path roller

[0080] 520: Cutting machine

[0081] 521, 531: Supporting members

[0082] 521a: Flat surface

[0083] 530: Pressure head

[0084] 530a: Buffer member

[0085] 531a: Support roller

[0086] 540, 541: Peeling rod

[0087] 550: conveyor roller

[0088] 560: Recycling Reel

[0089] 620: crimping part

[0090] 621: Pressurized components

[0091] 622: Support

[0092] B: Cleaning device

[0093] B1: Brush

[0094] C: Chip-shaped electronic parts

[0095] D: Display panel

[0096] F: Film-shaped electronic parts

[0097] G: Measuring device

[0098] G1: Push-out surface

[0099] H1: First holding head

[0100] H2: Second holding head

[0101] H11, H21: Holding part

[0102] H12, H22: connection part

[0103] H13, H23: pillar

[0104] HC: Half Tangent

[0105] R1, R1a, R1b: Reference position

[0106] R2: Fitting position

[0107] ST: Thin plate components

[0108] T: Pallet

[0109] T1: tape

[0110] T2: Release tape

[0111] TP: Strip components DETAILED DESCRIPTION

[0112] An embodiment of the present invention (hereinafter referred to as the present embodiment) will be described in detail with reference to the accompanying drawings. The drawings schematically illustrate each member and each component, and do not accurately represent their dimensions or intervals.

[0113] [structure]

[0114] [Electronic components and mounting objects]

[0115] The electronic components in this embodiment are as follows Figure 1 The film-shaped electronic component F shown in (A) and Figure 1The chip-shaped electronic component C shown in (B) is a component in which electronic components are mounted on a flexible resin film and electrodes are formed at the end of one side. The film-shaped electronic component F is prepared in the form of a component that is individually stamped and mounted by forming a plurality of film-shaped electronic components F integrally on a sheet-like or strip-like thin plate-like member. In addition, the film-shaped electronic component F in this embodiment exists in various sizes. The chip-shaped electronic component C is a driver IC. The chip-shaped electronic component C is mounted on a tray T (refer to Figure 3 (A) and Figure 3 (B)) and prepare.

[0116] The object to which the film-like electronic component F and the chip-like electronic component C are mounted is a component that is electrically connected to the electrodes of the film-like electronic component F or the chip-like electronic component C. In this embodiment, the object to be mounted is a display panel D constituting a display device, that is, a component having a display function and electrodes.

[0117] [Electronic component mounting equipment]

[0118] (Overall structure)

[0119] Reference Figure 2 as well as Figure 3 (A) and Figure 3 (B) The overall structure of the electronic component mounting device of this embodiment is described. Figure 2 As shown, the electronic component mounting apparatus includes a punch supply device 10 , a tray supply device 20 , a transfer device 40 , a laminating device 50 , a mounting device 60 , and a control device 80 .

[0120] The punch supply device 10 punches out film-shaped electronic components F from a thin plate-shaped member ST and supplies the film-shaped electronic components F. The tray supply device 20 supplies a tray T containing chip-shaped electronic components C.

[0121] The delivery device 40 is a device that receives a film-shaped electronic component F from the punch supply device 10 and transfers the film-shaped electronic component F to the mounting device 60 via the laminating device 50. In addition, the delivery device 40 is also a device that receives a chip-shaped electronic component C from the tray supply device 20 and transfers it to the mounting device 60. The first holding head H1 is used to deliver the film-shaped electronic component F from the punch supply device 10 to the delivery device 40. The second holding head H2 is used to deliver the chip-shaped electronic component C from the tray supply device 20 to the delivery device 40. The first holding head H1 and the second holding head H2 are arranged on the delivery device 40 in a detachable manner.

[0122] The laminating device 50 bonds an anisotropic conductive member called an ACF (Anisotropic Conductive Film) to the electrodes of a film-like electronic component F. ACF is a sheet-like member made of a resin base containing numerous small conductive particles. The mounting device 60 press-bonds the film-like electronic component F or chip-like electronic component C to the display panel D to which it is mounted.

[0123] The control device 80 controls the punching and feeding device 10, the tray feeding device 20, the transfer device 40, the laminating device 50, and the mounting device 60. The control device 80 may comprise, for example, a dedicated electronic circuit or a computer running a specific program. The control details of each component are programmed in the control device 80, and the program is executed by a processing device such as a programmable logic controller (PLC) or a central processing unit (CPU).

[0124] Furthermore, in a plane parallel to the surface on which the electronic component mounting apparatus is installed, the straight line from the press-feeding device 10 toward the mounting apparatus 60 is defined as the Y direction, the direction perpendicular thereto is defined as the X direction, the axis along the Y direction is defined as the Y axis, and the axis along the X direction is defined as the X axis. The XY plane formed by the Y-axis and the X-axis is parallel to the film-shaped electronic component F, the chip-shaped electronic component C, the display panel D, and the respective planes supporting them. In the following description, the XY plane may be referred to as a horizontal plane.

[0125] In addition, the direction perpendicular to the XY plane and directed upward from the setting surface is set as the Z direction, and the axis along the Z direction is set as the Z axis. When the setting surface is horizontal, the Z axis is the vertical direction. The Z axis is perpendicular to the film-shaped electronic component F, the chip-shaped electronic component C, the display panel D, and the planes supporting them. In the following description, the Z direction is set as the top, and the direction opposite thereto is set as the bottom. Furthermore, the rotation direction parallel to the XY plane with the Z axis as the center is set as the θ direction, and the rotation direction perpendicular to the XY plane with the Y axis as the center is set as the α direction. These directions are expressions used to illustrate the positional relationship of the various structures of the electronic component mounting device, and do not limit the positional relationship or direction when set on the setting surface.

[0126] (Pressing supply device)

[0127] like Figure 2 as well as Figure 4 (A) and Figure 4 As shown in FIG. 1 (B), the press supply device 10 includes a supply unit 110 , a platform 120 , a die 130 , and a lifting mechanism 140 .

[0128] The supply unit 110 includes a reel on which a thin plate-shaped member ST forming an electronic component is wound, and is a mechanism for sequentially feeding out the punched portions of the electronic component (see Figure 2 ) Therefore, the supply unit 110 is provided with a shaft to which the rotation center of the reel is attached and which serves as the rotation axis of the reel, and a conveying roller for feeding out the thin plate-shaped member ST.

[0129] The platform 120 is a table that supports the die 130 . The die 130 includes a die head 131 and a punch 132 .

[0130] The die head 131 is a flat plate-shaped member having a flat surface on which the thin plate-shaped member ST fed from the supply unit 110 is placed. The punched hole 131a is a through-hole that roughly matches the outer shape of the film-shaped electronic component F. The die head 131 is fixed to the upper surface of the platform 120. An opening 120a, which is a through-hole larger than the punched hole 131a, is provided on the platform 120 at a position corresponding to the punched hole 131a.

[0131] Punch 132 is a roughly rectangular cutting die with an outer edge that roughly matches the inner edge of punch hole 131a. With its bottom facing the thin plate-like member ST placed on die head 131, punch 132 moves along the Z-axis until it is inserted into punch hole 131a, thereby punching out a film-like electronic component F from the thin plate-like member ST. Although not shown, suction holes connected to a pneumatic circuit are formed on the bottom surface of punch 132, which uses negative pressure to hold the punched film-like electronic component F.

[0132] The lifting mechanism 140 is a mechanism for pressing the film-shaped electronic component F by moving the punch 132 along the Z axis. The lifting mechanism 140 includes a support portion 141 and a drive portion 142 .

[0133] The support portion 141 is a structure that supports the punch 132 in a manner that allows it to be raised and lowered. The support portion 141 comprises pillars 141a and support plates 141b. The pillars 141a are four rod-shaped members that stand upright on the die head 131. The support plates 141b are plate-like members attached to the upper ends of the pillars 141a, parallel to the upper surface of the die head 131.

[0134] The driving unit 142 is a device that is connected to the punch 132 and drives the punch 132 in the direction of contact and separation with the die 131. As a driving source for the driving unit 142, a cylinder or the like can be used. The driving unit 142 has a shaft 142a. The shaft 142a is connected to the driving source and passes through the support plate 141b and is connected to the punch 132. The driving source is used to raise and lower the shaft 142a, whereby the punch 132 punches out a film-like electronic component F. In addition, the lower movable end of the punch 132 becomes the receiving position of the first holding head H1. That is, the punch 132 adsorbs and holds the film-like electronic component F that is punched out by descending, and stops at a position where it can receive the first holding head H1.

[0135] like Figure 2 As shown, the above-mentioned stamping supply device 10 is provided as a pair along the X-axis in a plan view. One stamping supply device 10a and the other stamping supply device 10b are arranged at a position separated by a transfer device 430 described below in a plan view. Hereinafter, when the stamping supply device 10a and the stamping supply device 10b are not distinguished, it is referred to as the stamping supply device 10.

[0136] [Tray supply device]

[0137] like Figure 5 (A)~ Figure 5 As shown in (F), the tray supply device 20 includes a frame 210 and a gripping portion 220. The frame 210 is a pair of parallel, elongated members. The distance between the pair of frames 210 is approximately the width of the tray T, allowing the tray T to pass up and down. The gripping portion 220 is provided on opposing sides of the frame 210 and is configured to be able to move forward and backward in a direction of contact and separation with the side of the tray T via a drive mechanism (not shown).

[0138] In the tray supply device 20, a tray T is gripped by the gripping portion 220, and a plurality of trays T are stacked on the tray T. Figure 5 The lower surface of the tray T on the bottom layer is the surface opposite to the surface for accommodating the chip-shaped electronic components C, and becomes the receiving position of the second holding head H2 ( Figure 5 (B)).

[0139] like Figure 2 As shown above, a pair of tray supply devices 20 are provided along the X-axis in a plan view. One tray supply device 20a and the other tray supply device 20b are located in a plan view, separated by a transfer device 430, described below. Hereinafter, when no distinction is made between tray supply device 20a and tray supply device 20b, they are referred to as tray supply device 20.

[0140] (Transfer device)

[0141] like Figure 2 as well as Figure 3 (A) and Figure 3 As shown in (B), the handover device 40 is a device that receives the film-shaped electronic component F from the punch supply device 10 and transfers it to the mounting device 60 via the laminating device 50. In addition, the handover device 40 is also a device that receives the chip-shaped electronic component C from the tray supply device 20 and transfers it to the mounting device 60. Figure 3 (A) and Figure 3 (B) Figures 6 to 8 As shown, the delivery device 40 includes a mounting portion 410 , a moving mechanism 420 , and a transfer device 430 .

[0142] (Installation Department)

[0143] The first holding head H1 or the second holding head H2 is attached or detached relative to the mounting portion 410. The mounting portion 410 includes a loading portion 411 and a locking portion 412. The loading portion 411 is a cylindrical member on which the first holding head H1 or the second holding head H2 is mounted. The locking portion 412 is a plurality of pins erected from the upper surface of the loading portion 411. Figure 6 The first holding head H1 and the second holding head H2 that are attached to and detached from the mounting portion 410 will be described.

[0144] The first holding head H1 holds the film-shaped electronic component F supplied from the press supply device 10 (see Figure 3 (A) and Figure 3 (B) The first holding head H1 includes a holding portion H11, a connecting portion H12, and a supporting portion H13.

[0145] The holding portion H11 is a roughly rectangular parallelepiped member whose length corresponds to the side of the film-like electronic component F where the electrodes are arranged. Although not shown, suction holes connected to the pneumatic circuit are formed on the top surface of the holding portion H11. This suction hole holds the stamped film-like electronic component F by negative pressure.

[0146] The connecting portion H12 is a generally rectangular parallelepiped member placed on the mounting portion 410. Although not shown, a hole is provided on the bottom surface of the connecting portion H12 for inserting the locking portion 412. The supporting column H13 is a generally rectangular parallelepiped member that rises from the top surface of the connecting portion H12 and supports the bottom of the holding portion H11.

[0147] The second holding head H2 holds the tray T supplied from the tray supply device 20 (see Figure 3 (A) and Figure 3 (B) The second holding head H2 includes a holding portion H21, a connecting portion H22, and a supporting portion H23.

[0148] The holding portion H21 is a roughly rectangular parallelepiped shape with the outer edge of the upper surface being larger than the outer edge of the tray T. Although not shown, adsorption holes connected to the pneumatic circuit are formed on the upper surface of the holding portion H21, and the tray T is held by negative pressure adsorption. In addition, from the perspective of preventing static electricity, there are cases where a concave and convex shape is provided on the bottom surface of the tray T. In such a case, since there is a possibility that sufficient adsorption force cannot be obtained in the concave and convex parts, it is preferable to avoid the concave and convex parts and form the adsorption holes at a position corresponding to the flat surface. For example, adsorption holes are provided at a position corresponding to the edge of the bottom surface of the tray T to ensure stable adsorption.

[0149] The connecting portion H22 is a roughly rectangular parallelepiped member placed on the mounting portion 410. Although not shown, a hole is provided on the bottom surface of the connecting portion H22 for inserting the locking portion 412. In other words, the connecting portion H12 and the connecting portion H22 of the first holding head H1 and the second holding head H2 share a common structure, allowing for attachment and detachment to the common mounting portion 410. The supporting column H23 is a roughly rectangular parallelepiped member that rises from the top surface of the connecting portion H22 and supports the bottom of the holding portion H21.

[0150] (Mobile mechanism)

[0151] like Figure 7 As shown in (A) of FIG. 1 , the moving mechanism 420 moves the mounting portion 410 on which the first holding head H1 is mounted between the press supply device 10 and the transfer device 430 described below. Figure 7 As shown in (B), the moving mechanism 420 moves the mounting portion 410 to which the second holding head H2 is mounted between the tray supply device 20 and the transfer device 430. The moving mechanism 420 is configured below the transfer device 430 by combining, for example, a drive source (not shown) with a ball screw, a slider, etc., and is provided so as to be movable in the X, Y, and Z directions.

[0152] (Transfer device)

[0153] like Figure 2 As shown, the transfer device 430 receives the film-shaped electronic components F held by the first holding head H1 and transfers them to the mounting device 60 via the laminating device 50. Furthermore, the transfer device 430 also receives the chip-shaped electronic components C from the tray T held by the second holding head H2 and transfers them to the mounting device 60.

[0154] like Figure 2 as well as Figure 3 (A) and Figure 3 As shown in FIG. 8 (B), the transfer device 430 includes a first arm 431 , a cleaning device B, a measuring device G, and a second arm 432 .

[0155] The first arm 431 is a member configured to rotate in a plane parallel to the XY plane via a drive source (not shown), such as a motor. The first arm 431 is a cross-shaped arm formed by four roughly rectangular parallelepiped arms extending in a cross direction from the center, with the center fixed to the rotation axis of the drive source (not shown). A suction nozzle 431a connected to a pneumatic circuit is provided at the front end of the four arms. The suction nozzle 431a utilizes the negative pressure of the vacuum source of the pneumatic circuit to suction and hold the back surface of the electrode portion of the film-like electronic component F held by the first holding head H1 from above, across the entire width of the direction in which the electrodes of the film-like electronic component F are arranged.

[0156] The first arm 431 intermittently rotates every 90 degrees. More specifically, when viewed from the rotation axis of the first arm 431, the Y-direction side where the punch supply device 10 is located is set to the 12 o'clock position on the clockwise direction, and the first arm 431 intermittently rotates in the counterclockwise direction or the clockwise direction, stopping at the 12 o'clock position, the 9 o'clock position, the 6 o'clock position, and the 3 o'clock position. The first arm 431 intermittently rotates counterclockwise in the following order: receiving the film-shaped electronic component F from the first holding head H1 at the 12 o'clock position, laminating the film-shaped electronic component F through the laminating device 50 at the 9 o'clock position, transferring the film-shaped electronic component F with the ACF laminated to the second arm 432 at the 6 o'clock position, and passing through the 3 o'clock position.

[0157] like Figure 8 As shown, a reference position R1 is set at the front end of the four arms of the first arm 431 to determine the position for receiving the film-like electronic component F. The reference position R1 is, for example, a reference line parallel to the direction in which each arm extends, and is set to the right of the front end of each arm when viewed from the center of the first arm 431. The reference position R1 is the reference position for laminating the film-like electronic component F to the ACF in the laminating device 50 described below, when the film-like electronic component F held by the first arm 431 is positioned at 9 o'clock due to the rotation of the first arm 431. Here, it is the end of the strip-like member TP on the supply side of the pressing head 530 of the laminating device 50. The film-like electronic component F is delivered to the first arm 431 with its end, that is, the short side on the right side when viewed from the center of the first arm 431, aligned with the reference position R1. As a result, the film-like electronic component F is delivered to the first arm 431 with one side aligned with the reference position R1, regardless of its size. In other words, the film-like electronic component F is aligned at the 12 o'clock position with reference to the reference position R1 along the X direction. Thus, when the first arm 431 rotates to face the laminating device 50 described later, the film-like electronic component F is aligned along the Y direction with the laminating device 50.

[0158] Cleaning device B is positioned below first arm 431 at the aforementioned 12 o'clock position. Cleaning device B removes dirt and other debris adhering to the electrode portion of the punched film-like electronic component F. Cleaning device B includes a brush B1. Brush B1 is rotatable about an axis in the X-axis direction by a drive source such as a motor (not shown). Cleaning device B is moved in a direction of contact with and separation from the electrode portion of the film-like electronic component F held by first arm 431 by a drive mechanism (not shown).

[0159] The measuring device G is arranged below the first arm 431 at the above-mentioned 12 o'clock position. The measuring device G has a push-out surface G1 parallel to the XZ plane. The push-out surface G1 can be moved along the Y direction by a driving mechanism not shown in the figure. Thus, the push-out surface G1 of the measuring device G is extruded to the side of the stamping supply device 10 in a state where the film-like electronic component F is adsorbed by the adsorption nozzle 431a, so that the relative position of the film-like electronic component F relative to the adsorption nozzle 431a is offset. That is, the measuring device G aligns the position of the film-like electronic component F adsorbed by the adsorption nozzle 431a along the Y direction. Thus, when the film-like electronic component F faces the bonding device 50 due to the rotation of the first arm 431, it is aligned with the position of the bonding device 50 along the X direction. In other words, the measuring device G aligns the position of the film-like electronic component F along the Y direction at the 12 o'clock position and aligns the position of the film-like electronic component F along the X direction at the 9 o'clock position. By the above-described alignment, the electrodes of the film-like electronic component F are positioned at the positions of the ACF supplied from the laminating device 50 , and the ACF is laminated with high precision by the laminating device 50 .

[0160] The second arm 432 is arranged between the first arm 431 and the mounting device 60. The second arm 432 is a long member that can be rotated on a plane parallel to the XY plane by a driving source such as a motor. One end of the second arm 432 is fixed to the rotating shaft of the driving source (not shown). A rotating head 432a is provided at the front end of the second arm 432. The rotating head 432a is arranged so as to be able to rotate along the α direction with the longitudinal direction of the second arm 432 as the axis. The second arm 432 performs intermittent rotation every 180°. More specifically, it performs intermittent rotation in the counterclockwise direction or the clockwise direction in a manner that stops at the 12 o'clock position and the 6 o'clock position.

[0161] The rotating head 432a is equipped with a suction nozzle 432b extending along the radius of the rotating circle. Although not shown, the suction nozzle 432b is connected to a pneumatic circuit and uses the negative pressure of a vacuum source to suction and hold the film-shaped electronic component F or the chip-shaped electronic component C. The direction of the tip of the suction nozzle 432b is changed 180 degrees by the rotating head 432a. In other words, the second arm 432 is configured as a reverse transfer device capable of reversing the received components.

[0162] Therefore, when the suction nozzle 432b receives the film-shaped electronic component F held by the suction nozzle 431a of the first arm 431, it suction-holds the electrode side of the film-shaped electronic component F from below. When picking up chip-shaped electronic components C from the tray T held by the second holding head H2, it suction-holds each chip-shaped electronic component C from above. Specifically, the punching supply device 10 punches out the film-shaped electronic component F with its electrode portion facing downward, and the first holding head H1 holds the film-shaped electronic component F punched out by the punching supply device 10 from below with its electrode portion facing downward, and transfers it to the first arm 431. The suction nozzle 431a of the first arm 431 suction-holds the film-shaped electronic component F held from below by the first holding head H1 from above. Therefore, when the suction nozzle 432b receives the film-shaped electronic component F from the suction nozzle 431a, the film-shaped electronic component F is held from above by the suction nozzle 431a with its electrode portion facing downward, and the suction nozzle 432b suction-holds the electrode side from below. Furthermore, since the chip-shaped electronic components C are stored in the tray T held by the second holding head H2 with their electrode portions facing upward, the suction nozzles 432b suction-hold the chip-shaped electronic components C from above.

[0163] When the suction nozzle 432b is sucking and holding a film-shaped electronic component F, the rotary head 432a reaches the mounting apparatus 60 with the electrode side facing downward. That is, in this case, the rotary head 432a is not reversed. When the suction nozzle 432b is sucking and holding a chip-shaped electronic component C, the rotary head 432a is positioned with the electrode side of the chip-shaped electronic component C facing downward before reaching the mounting apparatus 60. That is, in this case, the rotary head 432a is reversed.

[0164] [Laminating device]

[0165] The bonding device 50 bonds the ACF to the electrode portion of the film-shaped electronic component F held by the adsorption nozzle 431a of the first arm 431. Figure 9 As shown, the laminating device 50 includes a supply unit 51 , a cutting unit 52 , a laminating unit 53 , a peeling unit 54 , a conveying unit 55 , and a collecting unit 56 .

[0166] (Supply Department)

[0167] The supply unit 51 supplies a strip-shaped member TP to the laminating unit 53. Strip-shaped member TP is formed, for example, by laminating an adhesive tape T1 containing an ACF to a release tape T2. Release tape T2 is a tape that can be peeled from adhesive tape T1 and is formed, for example, from a resin film such as polyimide. In this embodiment, the width of strip-shaped member TP is approximately 0.5 mm to 3.5 mm.

[0168] The supply unit 51 includes a supply reel 510, a tension mechanism 511, and a path roller 512. The supply reel 510 is a reel that rolls up the strip-like component TP and delivers the strip-like component TP by rotating. The tension mechanism 511 applies tension to the strip-like component TP. The tension mechanism 511 is a pair of rollers arranged at a distance from each other in a manner that guides the movement of the strip-like component TP pulled out from the supply reel 510. One of the rollers is a fixed roller 511a that does not move up and down, and the other roller is a movable roller 511b that can move up and down. The movable roller 511b moves up and down by a lifting mechanism (not shown). In other words, it moves in the direction of the black arrow in the figure. The path roller 512 is a roller that changes the direction of movement of the strip-like component TP from the tension mechanism 511 and delivers it toward the cutting unit 52.

[0169] (cutting part)

[0170] The cutting unit 52 cuts the tape T1 in the strip-shaped member TP. Hereinafter, cutting only the tape T1 as described above is referred to as half-cutting, and the cuts formed in the tape T1 by the cutting unit 52 are referred to as half-cut lines HC. The half-cut lines HC are formed at intervals corresponding to the size of the film-like electronic component F. The intervals between the half-cut lines HC are approximately the same as the length of the side connecting the film-like electronic component F to the display panel. In other words, the intervals between the half-cut lines HC are determined based on the size of the side connecting the mounted film-like electronic component F to the display panel.

[0171] The cutting section 52 is provided on the upstream side of the laminating section 53 and comprises a cutter 520 and a supporting member 521. The cutter 520 is a member for cutting the adhesive tape T1 along the width direction. That is, the knife at the front end of the cutter 520 extends along the width direction of the strip-shaped member TP. In addition, the knife at the front end of the cutter 520 contacts and separates from the adhesive tape T1 through a moving mechanism not shown in the figure. As described above, the cutter 520 forms a half-cut line HC on the strip-shaped member TP supplied by the supply section 51 according to the size of the film-shaped electronic component F. The supporting member 521 is a block having a roughly rectangular parallelepiped shape. The supporting member 521 clamps the strip-shaped member TP between itself and the cutter 520 and has a flat surface 521a in contact with the release tape T2.

[0172] (Lamination section)

[0173] The laminating section 53 laminates the tape T1 in the strip-shaped member TP to the electrode portion of the film-like electronic component F. The laminating section 53 includes a pressing head 530 and a supporting member 531. The pressing head 530 is moved up and down by a lifting device (not shown), thereby pushing up the strip-shaped member TP and heating and pressurizing the tape T1 to the electrode portion of the film-like electronic component F. Therefore, a heater (not shown) is provided in the pressing head 530 to heat the contact surface with the strip-shaped member TP to a specific temperature. Furthermore, a buffer member 530a is provided on the contact surface of the pressing head 530 with the strip-shaped member TP. The buffer member 530a is, for example, a sheet made of an elastomer, and prevents the tape T1, which has softened due to heating, from adhering to the pressing head 530. The supporting member 531 supports the first arm 431 from above while the pressing head 530 heats and press-bonds the tape T1 to the electrode portion of the film-like electronic component F. The supporting member 531 has a pair of support rollers 531a at a position facing the pressure head 530. On the outer peripheral surface of the support rollers 531a, the film-shaped electronic component F is held by the adsorption nozzle 431a, supporting the upper surface of the first arm 431 that rotates and aligns with the position of the bonding device 50.

[0174] A laminating position R2 is set in the laminating section 53. The laminating position R2 is a reference position for aligning the position of the half-cut line HC of the adhesive tape T1 in the strip-shaped member TP by the conveying section 55 described below. Here, the laminating position R2 is the position of the end of the pressing head 530 on the supply section 51 side in the traveling direction of the strip-shaped member TP.

[0175] (Peeling section)

[0176] The peeling section 54 peels the release tape T2 from the adhesive tape T1 attached to the film-like electronic component F. The peeling section 54 includes a peeling rod 540 and a peeling rod 541. The peeling rod 540 and the peeling rod 541 are, for example, round rods and are members that are in contact with the release tape T2. The peeling rod 540 is in contact with the surface of the release tape T2, that is, the surface on the side of the adhesive tape T1, and the peeling rod 541 is in contact with the back of the release tape T2. The peeling rod 540 and the peeling rod 541 are moved by a moving mechanism (not shown) as shown in FIG. Figure 9 As shown, the release tape T2 is peeled off from the tape T1 pressed against the film-like electronic component F by horizontally moving along the upstream side (in the direction of the dotted arrow) of the strip-shaped member TP while sandwiching the release tape T2.

[0177] (Transportation Department)

[0178] The conveying section 55 delivers the strip-shaped member TP from the supply section 51 to the laminating section 53 to the recovery section 56. In particular, the conveying section 55 delivers the strip-shaped member TP to the laminating section 53 in such a manner that the half-tangent line HC is aligned with the laminating position R2. The conveying section 55 includes a conveying roller 550 and a conveying motor (not shown). The conveying roller 550 clamps the release tape T2 by a pair of rollers, and the belt-shaped member TP is moved from the supply section 51 side to the recovery section 56 side by the rotation of the rollers. The conveying motor is a driving source for rotating the conveying roller 550. The rotating shaft of the conveying motor is connected to the conveying roller 550, and the rotating shaft is rotated around the shaft by the drive of the motor, thereby rotating the conveying roller 550 around the rotating shaft.

[0179] (Recycling Department)

[0180] The recovery unit 56 recovers the release tape T2 that has been peeled off from the adhesive tape T1 that has been applied to the electrode portion of the film-like electronic component F in the laminating unit 53. The recovery unit 56 includes a recovery reel 560 and a path roller 561. The recovery reel 560 is a reel that winds and recovers the release tape T2. The path roller 561 is a roller that changes the direction of movement of the release tape T2 from the laminating unit 53 and feeds it toward the recovery reel 560.

[0181] [Installation device]

[0182] like Figure 2 as well as Figure 3 (A) and Figure 3 As shown in FIG. 1 (B), the mounting device 60 is a device that heat-compresses the electrodes of the film-shaped electronic component F or the chip-shaped electronic component C to the electrodes of the display panel D via the ACF.

[0183] The mounting device 60 includes a platform 610 and a press-fit portion 620. The platform 610 is a horizontal plate-shaped body on which the display panel D is placed. Although not shown, suction holes connected to a pneumatic circuit are formed on the top surface of the platform 610, which retains the display panel D by suction using negative pressure. The platform 610 is arranged to be movable along the X-axis, Y-axis, and θ-axis by a drive mechanism (not shown).

[0184] like Figure 3 (A) and Figure 3 As shown in (B), the pressing portion 620 includes a pressing member 621 and a support member 622. The pressing member 621 causes the film-like electronic component F or the chip-like electronic component C to overlap with the display panel D supported by the platform 610 and heat and pressurize it through a driving mechanism not shown in the figure. The pressing member 621 holds the film-like electronic component F or the chip-like electronic component C by adsorption through a holding portion not shown in the figure, and heats it through a heating device not shown in the figure. The support member 622 is a member that supports the display panel D when the film-like electronic component F or the chip-like electronic component C is heated and pressed through the ACF by the pressing member 621.

[0185] Although detailed description is omitted in this embodiment, when heat-compression bonding is performed on chip-shaped electronic components C, an ACF is pre-attached to the display panel D. Furthermore, even when heat-compression bonding is performed on film-shaped electronic components F, an ACF may be pre-attached to the display panel D. In such cases, the ACF is not attached using the bonding apparatus 50.

[0186] The crimping section 620 is a device for temporarily crimping before final crimping. After the temporary crimping is performed by the crimping section 620, a final crimping is performed by a final crimping section arranged in a downstream process, although not shown.

[0187] [Control device]

[0188] like Figure 10 As shown, the control device 80 includes a mechanism control unit 81, a storage unit 82, and an input / output control unit 83. The mechanism control unit 81 controls the operation of each of the components of the punch supply device 10, the tray supply device 20, the transfer device 40, the laminating device 50, and the mounting device 60. The storage unit 82 stores information necessary for the control of this embodiment, such as programs and data for implementing each of the components. The input / output control unit 83 is an interface that controls the conversion of signals or the input / output of signals between the components to be controlled.

[0189] Furthermore, an input device 91 and an output device 92 are connected to the control device 80. The input device 91 is an input device such as a switch, touch panel, keyboard, or mouse that allows an operator to operate the electronic component mounting apparatus via the control device 80. The output device 92 is an output device such as a display device that allows the operator to visually recognize information used to confirm the status of the electronic component mounting apparatus.

[0190] [effect]

[0191] The operation of the above-described electronic component mounting apparatus will be described separately for the case of mounting a film-shaped electronic component F and the case of mounting a chip-shaped electronic component C.

[0192] (Installation of film-shaped electronic components)

[0193] First, refer to Figure 3 (A) Figures 11 to 13 The order of mounting the film-shaped electronic component F is described. The first holding head H1 is pre-mounted on the mounting portion 410. The half-cut line HC of the strip-shaped member TP formed with the half-cut line HC is positioned at the bonding position R2 by the conveying portion 55. Figure 11As shown, the moving mechanism 420 moves the first holding head H1 mounted on the mounting portion 410 so that it reaches directly below the punching supply device 10 (step S01). In the punching supply device 10, a film-shaped electronic component F is punched out (step S02). The punched film-shaped electronic component F descends while being adsorbed by the punch head 132, and while being released from adsorption, it is adsorbed by the holding portion H11 of the first holding head H1. Thus, the first holding head H1 receives the film-shaped electronic component F (step S03).

[0194] The moving mechanism 420 moves the first holding head H1, which receives the film-like electronic component F, to the bottom of the suction nozzle 431a at the end of the first arm 431 (step S04). Specifically, the moving mechanism 420 moves the first holding head H1 so that the film-like electronic component F is directly below the suction nozzle 431a of the arm located at the 12 o'clock position among the four arms of the first arm 431. At this point, the moving mechanism 420 positions the film-like electronic component F along the X direction, aligning the end of the film-like electronic component F with the reference position R1 of the first arm 431 (step S05). Then, by releasing suction from the holding portion H11 of the first holding head H1 while continuing to apply suction using the suction nozzle 431a, the first arm 431 receives the film-like electronic component F with the end of the film-like electronic component F aligned with the reference position R1 (step S06).

[0195] Next, at the 12 o'clock position, the cleaning device B rises and contacts the rotating brush B1, thereby cleaning the electrode portion of the film-like electronic component F (step S07). After the cleaning device B is lowered, the pushing surface G1 of the measuring device G moves toward the 12 o'clock position and contacts the film-like electronic component F, thereby aligning the film-like electronic component F, which is being held by the holding nozzle 431a, along the Y direction (step S08).

[0196] Then, refer to Figure 12The lamination of the ACF to the film-like electronic component F and the temporary pressing of the film-like electronic component F to the display panel D are described. After the cleaning by the cleaning device B and the position alignment by the measuring device G are completed, the first arm 431 is rotated, thereby positioning the film-like electronic component F at the 9 o'clock position, that is, the laminating device 50 (step S11). More specifically, the upper surface of the first arm 431 abuts against the support roller 531a and enters between the supporting member 531 and the belt member TP of the laminating device 50, and is positioned in a form of the first arm 431 with the film-like electronic component F adsorbed thereon. At this time, the reference position R1 set on the first arm 431 is set to the position for laminating the ACF when the first arm 431 rotates at the 12 o'clock position and is positioned in the laminating device 50. Therefore, the reference position R1 set on the first arm 431 is consistent with the laminating position R2 set on the pressure head 530. In addition, as described above, the half-cut line HC of the strip-shaped member TP formed with the half-cut line HC is positioned at the bonding position R2. Figure 13 As shown, the reference position R1, the half-cut line HC, and the bonding position R2 are all consistent. Thus, in the bonding apparatus 50, each time the size of the film-like electronic component F changes, there is no need to control the position of the half-cut line HC of the strip member TP or to provide a moving mechanism for moving the end of the pressing head 530, and the ACF can be bonded to film-like electronic components F of varying sizes.

[0197] In this state, the support roller 531a of the support member 531 supports the upper surface of the first arm 431. Subsequently, the pressure head 530 is raised (step S12), pushing the strip member TP from the release tape T2 side, allowing the half-cut tape T1 to be bonded to the electrode portion of the film-like electronic component F (step S13). After bonding the tape T1, the pressure head 530 is lowered, and the peeling bars 540 and 541 are moved horizontally to the upstream side of the strip member TP, thereby peeling the release tape T2 from the tape T1 bonded to the electrode portion of the film-like electronic component F (step S14). In this manner, the tape T1, i.e., the ACF, is bonded to the film-like electronic component F.

[0198] After the film-like electronic component F is attached to the ACF, the first arm 431 is rotated to position the film-like electronic component F at the 6 o'clock position. The film-like electronic component F is then moved to the top of the suction nozzle 432b of the second arm 432, which is waiting at the 12 o'clock position (step S15). Then, the suction by the suction nozzle 431a of the first arm 431 is released, and the suction by the suction nozzle 432b is resumed, thereby transferring the film-like electronic component F to the second arm 432 (step S16).

[0199] The second arm 432 rotates 180° in the XY plane, moving the film-like electronic component F to the crimping section 620 of the mounting device 60 (step S17). The suction applied by the suction nozzle 432b of the second arm 432 is released, and the suction applied by the pressure member 621 is simultaneously resumed, thereby holding the film-like electronic component F. The pressure member 621, holding the film-like electronic component F, then descends, thereby heat-pressing the electrodes of the film-like electronic component F to the electrodes of the display panel D across the ACF (step S18). The suction applied by the pressure member 621 is released, and the display panel D, with the film-like electronic component F temporarily crimped, is transported to the final crimping section for final crimping.

[0200] Furthermore, the film-like electronic components F are first supplied by one of the punching and feeding devices 10a. Then, when the thin plate-like member ST in the supply section 110 of the punching and feeding device 10a is exhausted, the supply of the film-like electronic components F is switched to the other punching and feeding device 10b, which continues. During this time, the reel of the thin plate-like member ST in the punching and feeding device 10a is replaced, and when the thin plate-like member ST in the other punching and feeding device 10b is exhausted, the supply of the film-like electronic components F is switched back to the punching and feeding device 10a. This allows continuous installation without stopping the electronic component mounting apparatus.

[0201] (Installation of chip-shaped electronic components)

[0202] Then, refer to Figure 3 (B) Figure 5 (A)~ Figure 5 (F), Figure 14 The installation procedure of the chip-shaped electronic component C is described below. The second holding head H2 is pre-installed in the installation portion 410. Figure 5 As shown in (A), the moving mechanism 420 moves the second holding head H2 mounted on the mounting portion 410 so as to reach the bottom of the tray supply device 20 (step S21). Figure 5 As shown in FIG. 1B , the holding portion H21 of the second holding head H2 contacts the bottom surface of the lowermost tray T and holds it by suction (step S22 ). Then, the holding portion H21 of the second holding head H2 receives the tray T (step S23 ) through the following sequence.

[0203] like Figure 5 As shown in (C), the tray supply device 20 releases the grip of the gripping portion 220. Then, as shown in Figure 5 As shown in (D), the second holding head H2 is lowered by the amount of one tray T. The holding portion 220 is as shown in FIG. Figure 5 As shown in (E), the holding portion 220 holds the tray T one level higher than the bottom level. Figure 5As shown in FIG. 1 (F), the second holding head H2 descends and transfers the tray T to the holding portion H21.

[0204] The moving mechanism 420 moves the second holding head H2, which has received the tray T, to the bottom of the suction nozzle 432b of the second arm 432 (step S24). Specifically, the moving mechanism 420 moves the second holding head H2 so that the tray T is positioned below the suction nozzle 432b of the second arm 432, which is positioned at the 12 o'clock position. The suction nozzle 432b of the second arm 432 rotates as the rotary head 432a rotates, so that it faces the tray T held by the second holding head H2.

[0205] The moving mechanism 420 sequentially positions each chip-shaped electronic component C on the tray T at a position facing the adsorption nozzle 432b of the second arm 432. In addition, the positioning can be performed by scanning the tray T with a scanning unit (not shown). More specifically, a storage section partitioned into a grid shape is provided on the tray T, and the chip-shaped electronic components C are stored in these storage sections. Therefore, each storage section is sequentially positioned at a position where the adsorption nozzle 432b of the second arm 432 receives the chip-shaped electronic component C, that is, a position directly below the adsorption nozzle 432b when the second arm 432 stops at the 12 o'clock position. Then, after positioning one storage section on the tray T, adsorption by the adsorption nozzle 432b is started, thereby transferring the chip-shaped electronic component C to the second arm 432 (step S25).

[0206] The second arm 432 rotates 180° in the XY plane, so that the chip-shaped electronic component C moves to the crimping section 620 of the mounting device 60 (step S26). During the movement, the rotating head 432a rotates in the α direction and the electrode of the chip-shaped electronic component C is reversed in a manner facing downward. The adsorption of the adsorption nozzle 432b by the second arm 432 is released, and at the same time, the adsorption of the pressing member 621 by the crimping section 620 is performed, so that the chip-shaped electronic component C is held by the pressing member 621. Then, the electrode portion of the chip-shaped electronic component C is heated and crimped to the electrode of the display panel D through the ACF (step S27). The adsorption by the pressing member 621 is released, and the display panel D temporarily crimped with the chip-shaped electronic component C is transported to the formal crimping section for formal crimping.

[0207] Furthermore, after the chip-shaped electronic components C are taken out from one tray T, the moving mechanism 420 transports the second holding head H2 holding the empty tray T to the storage section for the empty tray T prepared in the tray supply device 20, and transfers the tray T to the storage section. Then, as described above, the moving mechanism 420 receives the tray T containing the chip-shaped electronic components C through the second holding head H2 and installs the chip-shaped electronic components C. Furthermore, the storage section for the empty tray T can be provided at an adjacent position of the tray supply device 20, for example, with the same structure as the tray supply device 20. By configuring in this manner, the order can be reversed to that of the tray supply device 20, that is, in the order Figure 5 (F) Figure 5 (E) Figure 5 (D) Figure 5 (C) Figure 5 (B) Figure 5 Empty trays T are stacked and stored in the order of (A).

[0208] The trays T are initially supplied by one of the tray supply devices 20a. Once the trays T containing chip-shaped electronic components C are used up, the tray supply device 20a switches to the other tray supply device 20b, which continues to supply the trays T. During this time, the trays T in the tray supply device 20a are replaced. Once the trays T in the other tray supply device 20b are used up, the supply switches again to the tray supply device 20a. This allows continuous mounting without stopping the electronic component mounting equipment.

[0209] [Effect]

[0210] (1) The electronic component mounting device of this embodiment includes: a punching supply device 10 for supplying a film-like electronic component F; a bonding device 50 for bonding an anisotropic conductive component to the film-like electronic component F at a specific bonding position R2; a mounting device 60 for mounting the film-like electronic component F bonded with the anisotropic conductive component on the display panel D; and a transfer device 40 for setting a reference position R1 aligned with the bonding position R2, and aligning the end of the film-like electronic component F with the reference position R1 to receive the film-like electronic component F from the punching supply device 10, and transferring the film-like electronic component F to the mounting device 60 after bonding the anisotropic conductive component.

[0211] Therefore, if Figure 15 (A)~ Figure 15As shown in (C), even for film-like electronic components F of varying sizes, their ends are aligned with the reference position R1. Therefore, even if the size of the supplied film-like electronic component F varies, the ACF can be accurately bonded to the film-like electronic component F without providing a moving mechanism for moving the pressing head 530 of the bonding apparatus 50. This simplifies the time required for aligning the pressing head 530 of the bonding apparatus 50, thereby improving productivity, and omits the moving mechanism for moving the pressing head 530, thereby reducing costs.

[0212] (2) The laminating apparatus 50 of this embodiment includes a cutting unit 52 for forming slits in the anisotropic conductive member at intervals corresponding to the size of the film-like electronic component F; and a conveying unit 55 for conveying the anisotropic conductive member so that the slits are aligned with the laminating position R2. Thus, when the film-like electronic component F is positioned in the laminating apparatus 50, not only is the reference position R1 aligned with the laminating position R2, but the laminating position R2 is also aligned with the slits of the anisotropic conductive member. This reduces the time required to align the slits of the anisotropic conductive member with the laminating position, which was previously required.

[0213] (3) The transfer device 40 of this embodiment includes: a first arm 431 for receiving the film-like electronic component F from the press-feeding device 10; and a measuring device G for adjusting the position of the first arm 431 receiving the film-like electronic component F while aligning the end of the film-like electronic component F with the reference position R1. This allows the anisotropic conductive member and the film-like electronic component F to be aligned in the width direction of the anisotropic conductive member.

[0214] (4) The electronic component mounting apparatus of this embodiment further includes: a tray supply device 20 for supplying a tray T containing chip-shaped electronic components C; a transfer device 40 for receiving the chip-shaped electronic components C from the tray supply device 20 and transferring the tray T to a mounting apparatus 60; and a mounting apparatus 60 for mounting the chip-shaped electronic components C on a display panel D to which an anisotropic conductive member has been previously bonded. Thus, it is possible to selectively mount the film-shaped electronic components F bonded with the anisotropic conductive member on the display panel D, or to mount the chip-shaped electronic components C on the display panel D to which the anisotropic conductive member has been bonded.

[0215] [Modification]

[0216] (1) In the above embodiment, only the structure of alternately switching between one punch supply device 10a and the other punch supply device 10b is described. However, it is also possible to mount a thin plate-like member ST having film-like electronic components F of different sizes formed thereon using one punch supply device 10a and the other punch supply device 10b. According to this embodiment, it is not necessary to align the position of the ACF slit with respect to the end of the COF each time the size of the COF changes. Therefore, a plurality of film-like electronic components F of different sizes can be easily mounted on the display panel D without stopping the electronic component mounting device.

[0217] (2) In the above embodiment, the punching supply device 10 for punching out the film-like electronic components F from the thin plate-like member ST is used as the structure for supplying the film-like electronic components F. However, the present invention is not limited to this. For example, a supply device for supplying the film-like electronic components F previously punched out from the thin plate-like member ST may also be used.

[0218] (3) The laminating device 50 of the above embodiment includes a supply unit 51, a cutting unit 52, a laminating unit 53, a peeling unit 54, a conveying unit 55, and a collecting unit 56, but is not limited thereto. The laminating device 50 only needs to include the laminating unit 53, and the other components, namely, the supply unit 51, the cutting unit 52, the peeling unit 54, the conveying unit 55, and the collecting unit 56, may be configured differently from the laminating device 50.

[0219] (4) In the above embodiment, the tape T1 is formed with a half-cut line HC serving as a slit by the cutting portion 52, but the present invention is not limited thereto. Alternatively, the tape T1 may be one that has slits formed therein in advance according to the size of the film-like electronic component F. Furthermore, the tape T1 need not necessarily be slit-formed. For example, the tape T1 may be formed with numerous fine holes throughout its entire surface, and the stripping portion 54 may be used to tear the tape along the edge of the film-like electronic component F.

[0220] (5) The electronic component mounting device may include only the mounting portion 410 for the first holding head H1 and the second holding head H2, and is not limited to a structure in which both can be replaced. For example, a device may include multiple mounting portions 410, one of which is fixed with the first holding head H1 and the other with the second holding head H2. In this way, it is possible to switch between mounting the film-shaped electronic component F and mounting the chip-shaped electronic component C without replacing the first holding head H1 and the second holding head H2.

[0221] (6) A pair of moving mechanisms 420 may be provided along the X-axis direction, sandwiching the transfer device 430 therebetween. That is, one moving mechanism 420 may be provided corresponding to one of the punching supply device 10a and the tray supply device 20a, and the other moving mechanism 420 may be provided corresponding to the other punching supply device 10b and the tray supply device 20b. Furthermore, a pair of the first holding head H1 and the second holding head H2 may be provided corresponding to each pair of moving mechanisms 420.

[0222] (7) The moving paths of the film-like electronic component F and the chip-like electronic component C are common in the second arm 432. Therefore, by setting cameras for photographing the film-like electronic component F and the chip-like electronic component C at the two stop positions of the second arm 432 (the 12 o'clock position and the 6 o'clock position), positioning can be performed using a common camera. For example, at the 12 o'clock position, a pre-alignment camera is arranged above the adsorption nozzle 432b. When the film-like electronic component F is held by the adsorption nozzle 432b, the camera is used to photograph the alignment marks at both ends of the electrode portion of the film-like electronic component F, and the position of the film-like electronic component F is identified based on the alignment marks. The identification can be performed by the control device 80 using a well-known image recognition technology. Based on the identified position, when the film-like electronic component F is transferred to the pressurizing member 621, the relative position of the adsorption nozzle 432b and the pressurizing member 621 is adjusted. In this way, the position accuracy of the film-like electronic component F when it is handed over to the pressurizing member 621 can be ensured.

[0223] Furthermore, when removing the chip-like electronic component C from the tray T, the alignment marks provided on the electrode surface of the chip-like electronic component C are imaged, and the position of the chip-like electronic component C is identified based on the alignment marks. Based on the identified position, the relative position of the suction nozzle 432b and the chip-like electronic component C is adjusted when removing the chip-like electronic component C. This ensures the positional accuracy of the film-like electronic component F when it is transferred to the pressing member 621.

[0224] Meanwhile, a pair of simultaneous recognition cameras for temporary crimping are positioned at the 6 o'clock position. These cameras simultaneously capture within their field of view the alignment marks located at one end of the electrodes of the film-like electronic component F and the chip-like electronic component C, along with the corresponding alignment marks on the display panel D. A pair of simultaneous recognition cameras is positioned corresponding to the alignment marks at both ends of the film-like electronic component F and the chip-like electronic component C. This ensures consistent accuracy during both temporary crimping of the film-like electronic component F and the chip-like electronic component C.

[0225] [Other embodiments]

[0226] While the embodiments and variations of the various parts of the present invention have been described above, these embodiments and variations of the various parts are provided as examples and do not limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, substitutions, and modifications can be made without departing from the gist of the invention. These embodiments and their variations are included in the scope and gist of the invention and are included in the invention described in the claims.

Claims

1. An electronic component mounting device comprising: a supply device for supplying film-shaped electronic components; a laminating device for laminating the anisotropic conductive member to the film-shaped electronic component by applying pressure at a specific laminating position via a pressing head; a mounting device for mounting the film-shaped electronic component to which the anisotropic conductive member is attached on a display panel; as well as The transfer device sets a reference position for aligning the bonding position, includes an arm for receiving the film-like electronic component from the supply device, and receives the film-like electronic component from the supply device with the end of the film-like electronic component aligned with the reference position, transfers the film-like electronic component to the mounting device after bonding the anisotropic conductive member, Wherein, the fitting position is set on the pressure head, The reference position is set at the following position: when the arm is rotated to position the film-shaped electronic component on the bonding device, the reference position and the bonding position can be neatly arranged even without moving the pressure head to align the bonding position relative to the reference position.

2. The electronic component mounting device according to claim 1, wherein The laminating device comprises: a cutting portion for forming slits in the anisotropic conductive member at intervals corresponding to the size of the film-shaped electronic component; as well as The conveying unit delivers the anisotropic conductive member so that the slit is aligned with the bonding position.

3. The electronic component mounting device according to claim 1, wherein The handover device comprises: The measuring device adjusts the position at which the arm receives the film-shaped electronic component in a state in which the end portion of the film-shaped electronic component is aligned with the reference position.

4. The electronic component mounting device according to claim 2, wherein The handover device comprises: The measuring device adjusts the position at which the arm receives the film-shaped electronic component in a state in which the end portion of the film-shaped electronic component is aligned with the reference position.

5. The electronic component mounting device according to claim 3, wherein The laminating device further comprises: a supporting member that supports the arm receiving the film-shaped electronic component, and The supporting member includes a pair of support rollers, and the arm is supported by outer peripheral surfaces of the support rollers.

6. The electronic component mounting device according to claim 4, wherein The laminating device further comprises: a supporting member that supports the arm receiving the film-shaped electronic component, and The supporting member includes a pair of support rollers, and the arm is supported by outer peripheral surfaces of the support rollers.

7. The electronic component mounting device according to any one of claims 1 to 6, further comprising: The tray supply device supplies a tray containing chip-shaped electronic components, and The handover device receives the chip-shaped electronic components from the tray supply device and transfers the chip-shaped electronic components to the mounting device. The mounting device mounts the chip-shaped electronic component on a display panel to which an anisotropic conductive member is previously attached.

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