Control systems and methods for processing equipment, electronic devices and storage media

Abstract

This invention provides a control system and method, electronic device, and storage medium for a processing apparatus. The system includes: a data receiving module for receiving distance information of a workpiece in real time, the distance information representing the distance between the processing head of the processing apparatus and the workpiece in a first direction; a data storage module for storing the distance information; an analysis module for determining whether two adjacent data points in the distance information meet preset requirements based on the variation amplitude of the data points in the distance information; if two adjacent data points meet the preset requirements, identifying the two adjacent data points as a set of abnormal data points; and determining whether the area on the workpiece corresponding to the two sets of adjacent abnormal data points is an abnormal area based on preset characteristic parameters of the abnormal data points; and a data updating module for replacing the data points corresponding to the abnormal areas stored in the data storage module with normal data points based on the analysis results. This can eliminate abnormal abrupt changes.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and more specifically to a control system for a processing apparatus, a control method for a processing apparatus, an electronic device, and a storage medium. Background Technology

[0002] In many fields, processing equipment incorporates automatic following systems. The following explanation uses laser processing as an example. A laser processing device includes a stage assembly, a laser rangefinder, a processing head, a piezoelectric ceramic motor, and an automatic following system. In a laser processing device, the automatic following system is a non-contact measurement and real-time focusing system. During laser cutting, the automatic following system enables automatic focusing, with the focus automatically adjusting in real time to follow changes in product thickness, ensuring consistent depth of the laser-focused modified layer during stealth cutting and guaranteeing cutting quality. However, due to interference from abnormal points, the laser rangefinder may collect abrupt voltage signals, causing the piezoelectric ceramic motor to vibrate during the following voltage output, thus affecting the following performance. These abnormal interference points mainly include: raised dust on the wafer surface, depressions, and abnormal non-reflective contamination. Summary of the Invention

[0003] The present invention was proposed in view of the above-mentioned problems. The present invention provides a control system for a processing apparatus, a control method for a processing apparatus, an electronic device, and a storage medium.

[0004] According to one aspect of the present invention, a control system for a processing apparatus is provided, comprising: a data receiving module for receiving distance information of a workpiece to be processed in real time, the distance information representing the distance between the processing head of the processing apparatus and the workpiece to be processed in a first direction, the distance information containing multiple data points, each data point representing a distance value; a data storage module connected to the data receiving module for storing the distance information; an analysis module connected to the data receiving module for determining whether two adjacent data points in the distance information meet preset requirements based on the variation amplitude of the data points in the distance information; if two adjacent data points meet the preset requirements, determining the two adjacent data points as a set of abnormal data points; and determining whether the area on the workpiece to be processed corresponding to the two sets of adjacent abnormal data points is an abnormal area based on the pre-set characteristic parameters of the abnormal data points, thereby obtaining an analysis result, wherein the preset requirements are: the difference between the first data point and the normal data point in the two adjacent data points is less than a first preset threshold, and the difference between the second data point and the normal data point or the first data point is greater than a second preset threshold; and a data updating module connected to the analysis module and the data storage module for replacing the data points corresponding to the abnormal areas stored in the data storage module with normal data points according to the analysis result.

[0005] For example, the analysis module is specifically used to determine that two adjacent data points belong to the first type of abnormal data points when two adjacent data points meet the preset requirements and normal data points, the first data point among the two adjacent data points, and the second data point among the two data points are received in sequence. The two sets of adjacent abnormal data points belong to two different types of abnormal data points.

[0006] For example, the analysis module is specifically used to determine that two adjacent data points belong to the second type of abnormal data points when two adjacent data points meet the preset requirements, and the second data point, the first data point, and the normal data point are received in sequence. The two sets of adjacent abnormal data points belong to two different types of abnormal data points.

[0007] For example, the characteristic parameter of the pre-set abnormal data points is the preset pulse width. The analysis module is specifically used to determine that the area on the workpiece corresponding to the two sets of adjacent abnormal data points is an abnormal area when the time interval between two sets of adjacent abnormal data points is less than the preset pulse width.

[0008] For example, the data update module is specifically used to: for any abnormal region, replace the data points corresponding to the abnormal region stored in the data storage module with the nearest first normal data point before the data point corresponding to the abnormal region, or the nearest second normal data point after the data point corresponding to the abnormal region, or the average of the first normal data point and the second normal data point.

[0009] For example, the data receiving module includes: a first data receiving submodule for receiving distance information in real time; a first downsampling submodule connected to the first data receiving submodule and the data storage module for performing a first downsampling on the distance information; and a second downsampling submodule connected to the first downsampling submodule and the analysis module for performing a second downsampling on the distance information after the first downsampling; wherein, the data storage module is used to store the distance information after the first downsampling, and the analysis module is used to determine whether two adjacent data points in the distance information meet preset requirements based on the change range of data points in the distance information after the second downsampling.

[0010] For example, the data storage module has a first interface and a second interface. The data storage module receives distance information transmitted by the data receiving module through the first interface and receives normal data points for replacement transmitted by the data update module through the second interface.

[0011] For example, the data receiving module is also used to receive the position information of the workpiece to be processed in real time. The position information is used to indicate the position of the workpiece to be processed in the second direction when it moves relative to the processing head of the processing device in the second direction. The system also includes: a reading control module connected to the data storage module and the data receiving module, used to read the corresponding distance information from the data storage module starting from the processing start point of the effective processing area when it is determined at least based on the position information that the workpiece to be processed is in the effective processing area, so as to control the processing head to move in the first direction to a focal position that matches the distance information based on the read distance information.

[0012] For example, the reading control module is also used to determine whether the workpiece to be processed has reached the target position point on the effective processing area based on the position information and distance information. The target position point is the processing start point or the processing end point.

[0013] For example, the reading control module determines whether the workpiece has reached the target position point on the effective processing area based on the position information and distance information in the following way: based on the change range of the distance information, it determines whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; if the determination result is yes, it determines the target position information corresponding to the workpiece when it is at the target position point based on the position information corresponding to the currently received distance information; when the position information received by the data receiving module is the target position information, it determines that the workpiece is at the target position point.

[0014] For example, the processing device includes a ranging mechanism for measuring distance information. The position information includes position information corresponding to each different position point of the workpiece to be processed, and the distance information includes distance information corresponding to each different position point of the workpiece to be processed. The reading control module reads the corresponding distance information from the data storage module in the following manner: determining the second position information X2 based on the first position information X1 corresponding to at least one position point in the effective processing area; when the position information received by the data receiving module is the second position information X2, reading the distance information corresponding to the first position information X1 from the data storage module; wherein the second position information X2 satisfies the following formula: X2=X1+δx1, where δx1 represents the distance between the ranging mechanism and the processing head in the second direction.

[0015] For example, the processing device further includes a ranging mechanism and a focusing mechanism. The ranging mechanism is used to measure distance information, and the focusing mechanism is used to drive the processing head to move in a first direction. The position information includes position information corresponding to each different position point of the workpiece to be processed, and the distance information includes distance information corresponding to each different position point of the workpiece to be processed. The reading control module reads the corresponding distance information from the data storage module in the following manner: determining the second position information X2 based on the first position information X1 corresponding to at least one position point in the effective processing area; when the position information received by the data receiving module is the second position information X2, reading the distance information corresponding to the first position information X1 from the data storage module; wherein the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, where δx1 represents the distance between the ranging mechanism and the processing head in the second direction, and δx2 represents the movement distance of the workpiece to be processed relative to the processing head in the second direction during the response time of the focusing mechanism.

[0016] For example, the processing apparatus further includes a focusing mechanism for driving the processing head to move in a first direction. The system further includes: a first data processing module connected to the reading control module for performing numerical simulation based on the distance information received from the reading control module to obtain a fitted signal; and an output module connected to the first data processing module for generating a corresponding real-time control signal based on the fitted signal and outputting the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to a focal position matching the distance information in the first direction.

[0017] For example, the system further includes: a first interaction module connected to the output module, used to obtain first indication information from the host computer, and the output module is further used to generate a fixed control signal based on the first indication information before the processing head is at the processing start point in the effective processing area, and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to stay in a fixed position in the first direction.

[0018] For example, the reading control module is also used to control the data storage module to store distance information during the process of the workpiece being processed being at the start point and end point of the effective collection area. The effective collection area includes the effective processing area. The system also includes: a judgment module, connected to the data receiving module and the reading control module, used to determine whether the workpiece has reached the start point or end point of the collection based on the position information; and a second interaction module, connected to the judgment module, used to obtain second indication information from the host computer. The judgment module determines the position information corresponding to the start point and end point of the collection based on the second indication information.

[0019] According to another aspect of the present invention, a control method for a processing apparatus is provided, comprising: receiving distance information of a workpiece to be processed in real time, the distance information representing the distance between the processing head of the processing apparatus and the workpiece to be processed in a first direction, the distance information containing multiple data points, each data point representing a distance value; storing the distance information; determining whether two adjacent data points in the distance information meet preset requirements based on the variation amplitude of the data points in the distance information; if the two adjacent data points meet the preset requirements, determining the two adjacent data points as a set of abnormal data points, and determining whether the area on the workpiece corresponding to the two sets of adjacent abnormal data points is an abnormal area based on the characteristic parameters of the abnormal data points set in advance, so as to obtain an analysis result, wherein the preset requirements are: the difference between the first data point and the normal data point in the two adjacent data points is less than a first preset threshold, and the difference between the second data point and the normal data point or the first data point is greater than a second preset threshold; and replacing the stored data points corresponding to the abnormal area with normal data points according to the analysis result.

[0020] For example, when two adjacent data points meet the preset requirements, determining that two adjacent data points are a group of abnormal data points includes: when two adjacent data points meet the preset requirements, and normal data points, the first data point among the two adjacent data points, and the second data point among the two data points are received in sequence, determining that the two adjacent data points belong to the first type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

[0021] For example, when two adjacent data points meet the preset requirements, determining that two adjacent data points are a group of abnormal data points includes: when two adjacent data points meet the preset requirements, and the second data point, the first data point, and the normal data point are received in sequence, determining that the two adjacent data points belong to the second type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

[0022] For example, the feature parameter of the pre-set abnormal data point is the preset pulse width. Based on the feature parameter of the pre-set abnormal data point, it is determined whether the area on the workpiece corresponding to two sets of adjacent abnormal data points is an abnormal area, including: when the time interval between two adjacent transition edges is less than the set pulse width, it is determined that the area between the two adjacent transition edges is an abnormal area.

[0023] For example, based on the analysis results, replacing the data points corresponding to the abnormal regions stored in the data storage module with normal data points includes: for any abnormal region, replacing the data points corresponding to the abnormal region stored in the data storage module with the nearest first normal data point before the data point corresponding to the abnormal region, or the nearest second normal data point after the data point corresponding to the abnormal region, or the average of the first normal data point and the second normal data point.

[0024] According to another aspect of the present invention, an electronic device is also provided, including a processor and a memory, wherein the memory stores computer program instructions, which are executed by the processor to perform the control method for the processing apparatus described above.

[0025] According to another aspect of the present invention, a storage medium is also provided, on which program instructions are stored, wherein the program instructions are used to execute the above-described control method for the processing apparatus when running.

[0026] According to embodiments of the present invention, the control system and method, electronic device and storage medium for a processing apparatus can determine abnormal data points based on the change range of distance information, thereby identifying abnormal areas on the workpiece to be processed, and modifying the data points in the distance information corresponding to the abnormal areas to normal data points, eliminating abnormal abrupt changes, which helps to ensure the stability of the following signal, thereby ensuring the cutting quality of the processing apparatus. Attached Figure Description

[0027] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0028] Figure 1 A schematic diagram of a processing apparatus according to an embodiment of the present invention is shown;

[0029] Figure 2 A schematic block diagram of a control system for a processing apparatus according to an embodiment of the present invention is shown.

[0030] Figure 3 A schematic diagram showing the waveform of the signal output by a laser rangefinder according to an embodiment of the present invention is provided.

[0031] Figure 4 An exemplary block diagram of a control system according to an embodiment of the present invention is shown;

[0032] Figure 5 A schematic diagram of a wafer-containing wafer according to an embodiment of the present invention is shown;

[0033] Figure 6 A schematic diagram of an exemplary structure of a control system according to an embodiment of the present invention is shown;

[0034] Figure 7 A schematic flowchart illustrating a control method for a processing apparatus according to an embodiment of the present invention; and

[0035] Figure 8 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0037] To facilitate understanding, an exemplary structure of the processing device will be introduced below. Figure 1 A schematic diagram of a processing apparatus 100 according to an embodiment of the present invention is shown. Figure 1 As shown, the processing apparatus 100 may include a stage assembly 110, a ranging mechanism 120, a processing head 130, and a focusing mechanism 140. Furthermore, Figure 1 The workpiece 150 to be processed is also shown. The workpiece can be any item, such as ceramics or a wafer. For ease of description and understanding, the workpiece will be primarily described as a wafer. Exemplarily, and not limitingly, the ranging mechanism 120 can be a laser rangefinder, and the focusing mechanism 140 can be a piezoelectric ceramic motor. The workpiece 150 and the processing head 130 can move relative to each other along a second direction, which can be such as... Figure 1 The X-axis direction shown is in the X-axis direction. Figure 1 The image shows a horizontal direction. Note that... Figure 1 The position of the X-axis shown is only an example; its actual position can be relative to... Figure 1 The indicated position moves vertically. The focusing mechanism 140 is connected to the processing head 130, and the focusing mechanism 140 can drive the processing head 130 to move together in a first direction. The first direction can be... Figure 1The vertical direction is perpendicular to the X-axis. The ranging mechanism 120 and the processing head 130 / focusing mechanism 140 are spaced a certain distance apart in the X-axis direction.

[0038] When the workpiece 150 and the processing head 130 move relative to each other in the second direction, the position of the workpiece 150 in the second direction can be measured by a position measuring mechanism. In one embodiment, the relative movement between the workpiece 150 and the processing head 130 can be such that the position of the processing head 130 remains fixed while the workpiece 150 moves in the second direction. In this case, exemplarily, a position measuring mechanism (e.g., a linear encoder) can be used to measure the distance the workpiece 150 has moved in the second direction to indicate the position of the workpiece 150 in the second direction. In another embodiment, the relative movement between the workpiece 150 and the processing head 130 can be such that the position of the workpiece 150 remains fixed while the processing head 130 moves in the second direction. In this case, exemplarily, a position measuring mechanism (e.g., a linear encoder) can be used to measure the distance the processing head 130 has moved in the second direction to indicate the position of the workpiece 150 in the second direction. In yet another embodiment, the relative movement between the workpiece 150 and the processing head 130 can be such that the workpiece 150 and the processing head 130 move together in the second direction. In this case, for example, a position measuring mechanism (e.g., a grating ruler) can be used to measure the distance between the processing head 130 and the workpiece 150 in the second direction, which is used to indicate the position of the workpiece 150 in the second direction. This article mainly uses the scheme in which the position of the processing head 130 is kept fixed while the workpiece 150 moves along the second direction as an example for illustration.

[0039] Figure 1 The stage assembly 110 shown may include a machining platform for carrying the workpiece 150, a drive assembly for moving the machining platform (i.e., the workpiece 150) along the X-axis, and a position measuring mechanism for measuring the distance traveled by the machining platform (i.e., the workpiece 150) along the X-axis. The drive assembly may be a linear motor, such as... Figure 1The X-axis linear motor is shown. The position measuring mechanism can be a grating ruler. For example, the zero point of the grating ruler can be preset. The grating ruler is used to measure the distance of the processing platform from the origin, that is, the distance of the workpiece 150 from the origin. During processing, the drive assembly can move the processing platform along the X-axis direction. During this process, the processing head 130 processes each processing point in the X-axis direction. The position of each processing point on the X-axis can be determined by the grating ruler. When the workpiece is a wafer, the processing point can be any processing point on a dicing track parallel to the X-axis direction of the wafer. The height of each processing point can be determined by the distance information collected by the ranging mechanism 120. The distance information collected by the ranging mechanism 120 can be transmitted to the control system (which may be called an automatic following system) for the processing apparatus described herein. The control system for the processing apparatus can determine the corresponding control signal based on the distance information and output the control signal to the focusing mechanism 140, thereby controlling the focusing mechanism 140 to move up and down, so as to move the processing head 130 up and down to the focal position matching the distance information, that is, the processing position matching the height of each processing point.

[0040] It is understandable that, although in the example using a laser rangefinder as the ranging mechanism, the laser rangefinder measures the distance between the workpiece and the laser rangefinder in the first direction, this distance can be used to represent the distance between the workpiece and the processing head in the first direction. For example, the laser emitter and receiver of the laser rangefinder can be set at the same height as the end of the processing head facing the workpiece, so that the distance between the laser emitter and receiver of the laser rangefinder and the workpiece in the first direction (first distance) and the distance between the processing head and the workpiece in the first direction (second distance) are consistent. Of course, even if the first distance and the second distance are not consistent, there is still a fixed difference between them. In this case, the distance information collected by the laser rangefinder can still be used to represent the distance between the processing head and the workpiece in the first direction. It's just that when controlling the processing head to move to the focal position matching the distance information in the first direction based on the read distance information, the focal position can be appropriately adjusted up or down according to the preset difference between the first distance and the second distance. Of course, the ranging mechanism can also be designed to directly measure the distance between the workpiece and the processing head in the first direction, for example, by implementing a principle similar to a grating ruler.

[0041] As described above, the position information measured by the position measuring mechanism can include position information corresponding one-to-one with each different position point of the workpiece, and the distance information can include distance information corresponding one-to-one with each different position point of the workpiece. Here, a position point can be understood as the physical location of the workpiece. For example, when the workpiece is within the effective processing area, each position point can be the aforementioned processing point.

[0042] In one embodiment, the processing apparatus 100 may further include the control system for the processing apparatus described herein. Figure 1 (Not shown in the image). In another embodiment, the control system for the processing apparatus can be independent of the processing apparatus 100, for example, communicatively connected to the ranging mechanism 120 and the position measuring mechanism in the processing apparatus 100, receiving distance information collected by the ranging mechanism 120 and position information collected by the position measuring mechanism, and then performing follow control based on the distance information and position information.

[0043] As mentioned above, in processing fields such as wafer fabrication, during follow-up control, interference from abnormal points can cause the laser rangefinder to acquire abrupt voltage signals. This can lead to vibration of the piezoelectric ceramic motor during the follow-up voltage output, thus affecting the follow-up performance. These abnormal interference points mainly include: raised dust on the wafer surface, dents, and abnormally non-reflective contamination. For example, when raised dust is present on the wafer surface, the laser rangefinder may detect an abnormally decreasing interference signal. This abnormal decrease appears on the distance signal waveform as a signal segment that first decreases and then rises; that is, this signal segment has a falling edge and a rising edge. The falling edge and rising edge can be determined by detecting the amplitude of changes in data points in the distance information. This solution is described below.

[0044] To at least partially solve the above problems, embodiments of the present invention provide a control system for a processing apparatus. Figure 2 A schematic block diagram of a control system 200 for a processing apparatus according to an embodiment of the present invention is shown. By way of example, and not limitation, the control system 200 may be implemented using a field-programmable gate array (FPGA). FPGAs have high-speed signal processing capabilities, which helps to accurately determine the position of the effective processing area, thereby helping to improve the tracking performance of the control system 200. Figure 2 As shown, the control system 200 may include a data receiving module 210, a data storage module 220, and a reading control module.

[0045] The data receiving module 210 is used to receive distance information of the workpiece in real time. This distance information represents the distance between the processing head of the processing device and the workpiece in a first direction. The distance information contains multiple data points, each representing a distance value. In this description, any operation on a data point is equivalent to an operation on the distance value corresponding to that data point. For example, "determining whether two adjacent data points in the distance information meet preset requirements based on the change range of the data points in the distance information" can be understood as "determining whether the distance values ​​corresponding to two adjacent data points in the distance information meet preset requirements based on the change range of the distance values ​​corresponding to the data points in the distance information."

[0046] The data storage module 220 is connected to the data receiving module 210 and is used to store distance information.

[0047] The analysis module 230 is connected to the data receiving module 210 and is used to determine whether two adjacent data points in the distance information meet preset requirements based on the change range of the data points in the distance information. If the two adjacent data points meet the preset requirements, the two adjacent data points are determined to be a group of abnormal data points. Based on the pre-set characteristic parameters of the abnormal data points, the analysis module determines whether the area on the workpiece corresponding to the two groups of adjacent abnormal data points is an abnormal area, so as to obtain the analysis results. The preset requirements are: the difference between the first data point and the normal data point in the two adjacent data points is less than the first preset threshold, and the difference between the second data point and the normal data point or the first data point is greater than the second preset threshold.

[0048] The data update module 240 is connected to the analysis module 230 and the data storage module 220, and is used to replace the data points corresponding to the abnormal areas stored in the data storage module 220 with normal data points according to the analysis results.

[0049] Exemplarily, and not limitingly, the data receiving module 210 may include a first data receiving submodule and a second data receiving submodule. The first data receiving submodule may be communicatively connected to the ranging mechanism 120 for receiving distance information from the ranging mechanism 120. The second data receiving submodule may be communicatively connected to a position measuring mechanism for receiving position information from the position measuring mechanism. Exemplarily, the first data receiving submodule may be an analog-to-digital converter (ADC) module. In the case where the ranging mechanism 120 is a laser rangefinder, the distance information it acquires is an analog signal. The ADC module can convert the distance information from an analog signal to a digital signal. The sampling frequency of the ADC module can be set as needed, for example, 20 megabits per second (Mbps). In the case where the position measuring mechanism is a grating ruler, the position information output by the grating ruler is a digital pulse signal. The output frequency of the grating ruler may be, for example, 500 kilohertz (kHz). Exemplarily, and not limitingly, the data receiving module 210 may also include at least one downsampling submodule to downsample the distance information (e.g., digitized distance information) output by the first data receiving submodule at least once. Downsampling can be, for example, extracting data from the received data at preset intervals of a number of data points (each data point can be understood as distance information corresponding to a location point). Since the first data receiving submodule collects a large amount of data, it is unnecessary to process all of it; downsampling can reduce the workload of subsequent modules. In one example, the data receiving module 210 may also include a first downsampling submodule connected to the aforementioned first data receiving submodule, used to downsample the distance information output by the first data receiving submodule, for example, downsampling 20 Mbps distance information to 500 Kbps. Exemplarily, and not limitingly, the first downsampling submodule may also filter the distance information, such as through sliding filtering. Filtering removes interference, making the output distance signal (i.e., distance information) smoother. Filtering can be performed before or after downsampling.

[0050] For example, if the workpiece to be processed is a wafer, the data receiving module 210 can receive the distance information of the wafer in real time, and can optionally receive the position information corresponding to this distance information. The distance information of the wafer can be obtained from the measurement value of the laser rangefinder at the current moment. The position information corresponding to this distance information can be obtained from the measurement value of the grating ruler at the same moment. Figure 1 As shown, the ranging mechanism measures the distance between itself and the wafer surface, for example, denoted by h.

[0051] The data storage module 220 can be used to store the acquired distance information. The data storage module 220 can be implemented using any memory, such as Random Access Memory (RAM), Read Only Memory (ROM), or Flash Memory. Optionally, the data storage module 220 can also further store the acquired location information. When storing location and distance information, the data storage module 220 can use a one-to-one correspondence method, for example, associating the location and distance information corresponding to each location point. In one example, the data storage module 220 can store all distance information output by the data receiving module 210 during the entire working period of the ranging mechanism; specifically, it can store all distance information output by the first data receiving submodule or at least one downsampling submodule connected to the first data receiving submodule. In another example, the data storage module 220 can store only the distance information output by the data receiving module 210 during a portion of the working period of the ranging mechanism; specifically, it can store the distance information output by the first data receiving submodule or at least one downsampling submodule connected to the first data receiving submodule. For example, the data storage module 220 can store only the distance information output by the data receiving module 210 when the workpiece is within the effective acquisition area. The effective acquisition area can be pre-defined. For example, the user can input the position information corresponding to the start and end points of the effective acquisition area in the control system 200. When the position information acquired by the grating ruler, i.e., the position information received by the data receiving module 210, is the position information corresponding to the start point, the data storage module 220 can be controlled to start storing the current distance information, or start storing both the current distance information and the position information. Furthermore, when the position information acquired by the grating ruler, i.e., the position information received by the data receiving module 210, is the position information corresponding to the end point, the data storage module 220 can be controlled to stop storing the distance information, or stop storing both the distance information and the position information. Exemplarily and not limitingly, the above-described operation of controlling the data storage module 220 to store distance information can be performed by the read control module described below.

[0052] Optionally, similar to the data storage module 220, the data receiving module 210 may also receive distance information measured by the ranging mechanism (e.g., performing ADC sampling on the distance information) during the entire working period of the ranging mechanism or during a portion of the working period of the ranging mechanism. The operation of the data receiving module 210 can be understood by referring to the above description of the data storage module 220, and will not be repeated here.

[0053] The analysis module 230 can determine whether two adjacent data points in the distance information meet preset requirements based on the variation range of the data points in the distance information, and then determine whether the data points are abnormal data points. The preset requirements can be set based on the variation patterns of data points on rising and falling edges. Assuming three data points are on rising or falling edges, theoretically two of them will be quite similar, while the third data point will differ significantly from these two. One of these three data points is considered a normal data point, and the other two can be considered abnormal data points (i.e., a set of abnormal data points). Therefore, the preset requirements can be set as follows: the difference between the first data point and the normal data point is less than a first preset threshold, and the difference between the second data point and either the normal data point or the first data point is greater than a second preset threshold.

[0054] Using the above methods, each set of abnormal data points can be identified in real time. For two adjacent sets of abnormal data points, the region on the workpiece corresponding to the two sets of adjacent abnormal data points can be further determined as an abnormal region based on pre-set characteristic parameters of the abnormal data points. For example, each set of abnormal data points belongs to the rising or falling edge of the distance information. Compared with the rising and falling edges corresponding to normal signal transitions in the distance information (e.g., signal transitions caused by wafer edges), the rising and falling edges corresponding to signal transitions caused by abnormal point interference have corresponding characteristics, such as shorter pulse width and / or larger amplitude. Based on the pre-set characteristic parameters, it is possible to identify whether the region corresponding to the two sets of abnormal data points is an abnormal region.

[0055] The data update module 240 can replace the data points corresponding to the abnormal areas stored in the data storage module 220 with normal data points based on the analysis results of the analysis module 230.

[0056] In this paper, any data point that is not an outlier can be considered a normal data point.

[0057] In one example, the time interval (corresponding to the sampling frequency) between adjacent data points stored in the data storage module 220 is consistent with the time interval (corresponding to the sampling frequency) between adjacent data points used for analysis by the analysis module 230. For example, the data storage module 220 stores data point h. a / h b / h c / h d / h e / h f / h g / h h / h i ...Analysis module 230 detected h b and h cIt is a set of outlier data points, h f and h g If it is another set of abnormal data points, the analysis module can determine h. b / h c / h d / h e / h f / h g These are all data points corresponding to the abnormal regions. Furthermore, h a h h and h i These are normal data points; h can be used. a h h and h i Replace h with any data point in the table. b / h c / h d / h e / h f / h g It can also be used for h a h h and h i Multiple data points are combined, such as by averaging, and h is replaced based on the combined data points. b / h c / h d / h e / h f / h g Of course, other suitable methods can be used to replace the data points corresponding to the abnormal areas.

[0058] In another example, the time interval (corresponding to the sampling frequency) between adjacent data points stored in the data storage module 220 is smaller than the time interval (corresponding to the sampling frequency) between adjacent data points used for analysis by the analysis module 230. For example, the distance information received by the first data receiving submodule can be downsampled twice. The data after the first downsampling is stored in the data storage module 220, and the data after the second downsampling is used for anomaly analysis. For example, the data storage module 220 stores data point h. a / h b / h c / h d / h e / h f / h g / h h / h i ..., the analysis module 230 receives h a / h d / h g / h j / h m / h p...Assuming analysis module 230 detects h d and h g It is a set of outlier data points, h m and h p If it is another set of abnormal data points, the analysis module can determine h. d / h e / h f / h g / h h / h i / h j / h k / h l / h m / h n / h o / h p These are all data points corresponding to the abnormal regions. The method for replacing data points is similar to the previous example, and will not be repeated here.

[0059] In one example, the data update module 240 can latch the storage addresses of the normal data points before and after the abnormal data points (abnormal data points) based on the data points corresponding to the abnormal regions output by the analysis module 230. Then, based on the start and end addresses of the normal data points and their values, it rewrites the abnormal data points in the data storage module 220. For example, if data point h... a and h h If the data points are normal and the intermediate data points are all abnormal data points, then data point h can be latched. a The storage address and the data point h a The value of h, and latch the data point h. h The storage address can then be used to access the data storage module 220 located at h. a storage address and h h The data points between the storage addresses are rewritten, and these data points are replaced with h. a (It could also be other normal data points or the average of normal data points, etc.)

[0060] By way of example, and not limitation, the first preset threshold, the second preset threshold, and the characteristic parameters described above can be configured by the user via a host computer (PC) and can optionally be transmitted to the second data storage module in the control system 200 via an interactive module. The second data storage module can be data storage module 220 (which can be the first data storage module), or a storage module independent of the first data storage module. By way of example, the second data storage module can be a register included in the analysis module 230.

[0061] According to the control system for the processing device of the present invention, abnormal data points can be determined based on the change range of distance information, thereby identifying abnormal areas on the workpiece to be processed, and modifying the data points in the distance information corresponding to the abnormal areas to normal data points, eliminating abnormal abrupt changes, which helps to ensure the stability of the following signal, thereby ensuring the cutting quality of the processing device.

[0062] According to an embodiment of the present invention, the analysis module is specifically used to determine that two adjacent data points belong to a first type of abnormal data points when two adjacent data points meet preset requirements and normal data points, the first data point among the two adjacent data points, and the second data point among the two data points are received in sequence. The two sets of adjacent abnormal data points belong to two different types of abnormal data points.

[0063] For three consecutive data points, if they meet the first preset requirement, these data points can be considered as corresponding to the falling edge in the distance information. The first data point corresponding to the falling edge can be considered a normal data point, and the latter two data points can be considered as first-type abnormal data points. The first preset requirement is: h n1 ≈h n2 >>h n3 , where |h n1 -h n2 |<SUB_MIN, and|h n2 -h n3 |>SUB_MAX. h n1 h n2 h n3 This indicates that the analysis module 230 receives three data points sequentially, with SUB_MIN being the first preset threshold and SUB_MAX being the second preset threshold. Figure 3 A schematic diagram of the waveform of the signal output by a laser rangefinder according to an embodiment of the present invention is shown. Figure 3 As shown, where h b h c and h d This corresponds to the falling edge in the distance information.

[0064] Two adjacent sets of outlier data points belong to two different types of outlier data points. For example, the first set of outlier data points may correspond to a rising edge, and the second set may correspond to a falling edge, which could be a case of wafer surface depression, for example. Alternatively, the first set of outlier data points may correspond to a falling edge, and the second set may correspond to a rising edge, which could be a case of wafer surface bulge, for example.

[0065] Using the above methods, it is easy and quick to determine whether two adjacent data points belong to the abnormal data points corresponding to the falling edge.

[0066] According to an embodiment of the present invention, the analysis module is specifically used to determine that two adjacent data points belong to a second type of abnormal data points when two adjacent data points meet preset requirements and the second data point, the first data point, and the normal data point are received in sequence. The two sets of adjacent abnormal data points belong to two different types of abnormal data points.

[0067] For three consecutive data points, if they meet the second preset requirement, these data points can be considered as corresponding to the rising edge in the distance information. The third data point corresponding to the rising edge can be considered a normal data point, and the first two data points can be considered as second-type abnormal data points. The second preset requirement is: h n1 < <h n2 ≈h n3 , where |h n1 -h n2 |>SUB_MAX, and |h n2 -h n3 |<SUB_MIN。 h n1 h n2 h n3 This indicates that the analysis module 230 receives three data points sequentially, with SUB_MIN representing the first preset threshold and SUB_MAX representing the second preset threshold. See also... Figure 3 , where h e h f and h g This corresponds to the rising edge in the distance information.

[0068] Using the above methods, it is easy and quick to determine whether two adjacent data points belong to the abnormal data points corresponding to the rising edge.

[0069] According to an embodiment of the present invention, the feature parameter of the pre-set abnormal data point is a preset pulse width. The analysis module is specifically used to determine that the area on the workpiece corresponding to the two sets of adjacent abnormal data points is an abnormal area when the time interval between two sets of adjacent abnormal data points is less than the preset pulse width.

[0070] In one embodiment, when storing data points, the data storage module 220 assigns a storage address to each data point sequentially according to the time order of the received data points. The address difference between the storage addresses of two adjacent data points can represent the time interval between these two data points. For example, a storage address difference of 1 corresponds to a time interval of 2 microseconds (µs) between two adjacent data points. If the storage addresses of any two data points differ by 1000, it means that the time interval between these two data points is 2 milliseconds (ms). In this case, it can be optionally determined whether the time interval between two sets of adjacent abnormal data points is less than a set pulse width. For example, it can be determined whether the following condition is met: |first storage address - second storage address| < the address difference corresponding to the set pulse width. If this condition is met, it can be determined that the time interval between two sets of adjacent abnormal data points is less than the set pulse width, and the area on the workpiece corresponding to the two sets of adjacent abnormal data points is determined to be an abnormal area. The first storage address is the storage address corresponding to any data point in the previous set of abnormal data points, such as the data point at the very beginning. The second storage address is the storage address corresponding to any data point in the next set of abnormal data points, such as the data point at the very end.

[0071] It should be noted that the time interval between the aforementioned adjacent data points can refer to the time interval between the acquisition of these two adjacent data points by the ranging mechanism. Optionally, the pulse width between the two sets of adjacent data points can be calculated directly using the acquisition time difference of any data point in each of the two sets of adjacent data points (e.g., the data point at the very beginning of the first set of abnormal data points and the data point at the very end of the second set of abnormal data points), and compared with a preset pulse width. For example, it can be determined whether the following condition is met: |Acquisition time of the first set of data points - Acquisition time of the second set of data points| < preset pulse width. If this condition is met, it can be determined that the area on the workpiece corresponding to the two sets of adjacent abnormal data points is an abnormal area. Here, the acquisition time of the first set of data points can be represented by the acquisition time of any data point in the first set of abnormal data points (e.g., the data point at the very beginning), and the acquisition time of the second set of data points can be represented by the acquisition time of any data point in the second set of data points (e.g., the data point at the very end).

[0072] As mentioned above, compared to the rising and falling edges corresponding to normal signal transitions in distance information (e.g., signal transitions caused by wafer edges), the rising and falling edges corresponding to signal transitions caused by anomalous interference have corresponding characteristics, such as shorter pulse widths. Using this scheme, the pulse width feature can be used to determine whether the regions corresponding to two sets of anomalous data points are normal transition regions or regions with anomalous interference. This scheme is simple, efficient, and relatively accurate in identifying anomalous interference.

[0073] According to an embodiment of the present invention, the data update module is specifically used to: for any abnormal region, replace each data point corresponding to the abnormal region stored in the data storage module with the nearest first normal data point before the data point corresponding to the abnormal region, or the nearest second normal data point after the data point corresponding to the abnormal region, or the average value of the first normal data point and the second normal data point.

[0074] Since the values ​​of normal data points other than those corresponding to the outlier regions are relatively stable and do not differ significantly, any one or more data points can be used to replace the data points corresponding to any outlier region. For example, continuing the example above, normal data point h can be used. a h h and h i Replace the data point h corresponding to the abnormal region with any data point in the table. b / h c / h d / h e / h f / h g It can also be used for h a h h and h i Multiple data points are combined, such as by averaging, and h is replaced based on the combined data points. b / h c / h d / h e / h f / h g .

[0075] In contrast, replacing the data point corresponding to the abnormal region with the nearest normal data point before and / or after the abnormal region is a better way to ensure the smooth transition between the replaced abnormal region data point and the preceding and following data points, which in turn helps to ensure the smoothness of the tracking.

[0076] According to an embodiment of the present invention, the data receiving module includes: a first data receiving submodule for receiving distance information in real time; a first downsampling submodule connected to the first data receiving submodule and the data storage module for performing a first downsampling on the distance information; and a second downsampling submodule connected to the first downsampling submodule and the analysis module for performing a second downsampling on the distance information after the first downsampling; wherein, the data storage module is used to store the distance information after the first downsampling, and the analysis module is used to determine whether two adjacent data points in the distance information meet preset requirements based on the change amplitude of data points in the distance information after the second downsampling.

[0077] As described above, the data receiving module may include at least one downsampling submodule to downsample the distance information (e.g., digitized distance information) output by the first data receiving submodule at least once. In one embodiment, the data receiving module 210 may include a first downsampling submodule and a second downsampling submodule. The first downsampling submodule may be connected to the first data receiving submodule and the data storage module 220. The first downsampling submodule may perform a first downsampling on the distance information output by the first data receiving submodule, and the data storage module 220 stores the distance information obtained after the first downsampling. The second downsampling submodule may be connected to the first downsampling submodule and the analysis module 230. The second downsampling submodule may perform a second downsampling on the distance information obtained after the first downsampling. The analysis module 230 may determine whether two adjacent data points in the distance information meet preset requirements based on the change amplitude of data points in the distance information obtained after the second downsampling to determine whether they belong to abnormal data points (abnormal data point analysis). The analysis module 230 may analyze each pair of adjacent data points to determine whether they belong to abnormal data points.

[0078] Downsampling can reduce the sampling rate. For example, assuming the data receiving submodule samples a data rate of 20 Mbps, after the first downsampling, the data rate drops to 500 Kbps, consistent with the output rate of the grating ruler. A data rate of 20 Mbps is relatively high for tracking control, which generally doesn't require such a large data volume; therefore, the first downsampling helps reduce storage space. However, when performing outlier analysis, a rate of 500 Kbps is still very high, and not every data point needs to participate in outlier analysis. Therefore, a second downsampling can be performed, for example, downsampling to 200 bps or 2 Kbps.

[0079] According to the above technical solution, after the first downsampling and the second downsampling, the amount of data stored in the data storage module and the amount of data processed by the analysis module can be effectively reduced, thereby effectively saving storage space, reducing the system's computational load, and improving the system's operating efficiency.

[0080] According to an embodiment of the present invention, the data storage module has a first interface and a second interface. The data storage module receives distance information transmitted by the data receiving module through the first interface and receives normal data points for replacement transmitted by the data update module through the second interface.

[0081] Figure 4 An exemplary block diagram of a control system 200 according to an embodiment of the present invention is shown. See also Figure 4 This illustrates the two downsampling submodules mentioned above. Furthermore, Figure 4 It also shows the analysis module, data update module, and data storage module. Figure 4 (Shown as RAM storage module). Figure 4 The data storage module is shown to include a first interface (interface A) and a second interface (interface B). Normal data writing can be performed through interface A, while data rewriting can be performed through interface B. This allows for parallel data writing and rewriting via two different interfaces, effectively improving data processing efficiency and thus enhancing the real-time performance of the tracking control.

[0082] also, Figure 4 A read control module is also shown, which can determine whether the workpiece is in the effective processing area, and can read distance information when the workpiece is in the effective processing area to control the processing head to move in a first direction to a focal position matching the distance information based on the read distance information. This embodiment is described below.

[0083] According to an embodiment of the present invention, the data receiving module is further configured to receive position information of the workpiece to be processed in real time. The position information is used to indicate the position of the workpiece to be processed in the second direction when it moves relative to the processing head of the processing device in the second direction. The system further includes: a reading control module connected to the data storage module and the data receiving module, configured to read corresponding distance information from the data storage module starting from the processing start point of the effective processing area when it is determined, at least based on the position information, that the workpiece to be processed is within the effective processing area, so as to control the processing head to move in the first direction to a focal position matching the distance information based on the read distance information.

[0084] The read control module can be connected to the data receiving module 210 and the data storage module 220. The read control module can determine whether the workpiece is within the effective processing area based at least on the current position information. If the workpiece is within the effective processing area, it reads distance information corresponding to each position point within the effective processing area from the data storage module 220, starting from the processing start point of the effective processing area. Based on the read distance information, it controls the processing head to move in a first direction to a focal position matching the distance information. In other words, the read control module reads the distance information corresponding to each position point within the effective processing area, including the processing start point and the processing end point of the effective processing area. In one example, for any one or more position points, when the position information currently received by the data receiving module 210 is the original position information X1 corresponding to one or more position points, the read control module can directly read the distance information h1 corresponding to the original position information X1 from the data storage module 220 and control the processing head to move to the matching focal position according to the distance information h1. In another example, for any one or more position points, the original position information X1 can be corrected (or error compensated) to determine new position information X2. When the current position information received by the data receiving module 210 is position information X2, the read control module can read the distance information h1 corresponding to the original position information X1 from the data storage module 220, and control the processing head to move to the matching focal position according to the distance information h1. Corrections can be made based on multiple aspects, such as the distance between the processing head and the ranging mechanism and / or the response time of the focusing mechanism, etc., these embodiments will be described below. The operation of controlling the processing head to move to the focal position matching the distance information in the first direction based on the read distance information can be performed entirely by the read control module, or it can be performed by the read control module in conjunction with other subsequent modules connected to the read control module.

[0085] According to the above technical solution, the position and distance information of the workpiece to be processed are received in real time by the data receiving module, and the processing head is controlled to follow the workpiece in real time by the reading control module while the workpiece is within the effective processing area. This solution can determine the working position of the focusing mechanism with high precision, which helps to improve the stability of the following.

[0086] To facilitate understanding in the following text, we will use a wafer as an example to uniformly introduce the "effective acquisition area" and "effective processing area" described in this article.

[0087] Figure 5 A schematic diagram of a wafer comprising a wafer is shown according to an embodiment of the present invention. Generally, on the wafer, the wafer is fixed on a thin film, and a metal frame is fixed to the outer periphery of the thin film. Figure 5As shown, the edges where points B and E are located are the edges of the metal frame on the wafer. The edges where points C and D are located are the wafer edges, and the circular area surrounded by the wafer edges is the wafer area. As the wafer moves along the X-axis, the ranging mechanism aligns with each point on the wafer one by one. For example, when the wafer edge passes the ranging mechanism (or vice versa), the distance information measured by the ranging mechanism will show a jump, and this jump can be used to determine whether the wafer edge position has been detected. However, typically, when points B or E (the metal frame edge) pass the ranging mechanism, the signal output of the ranging mechanism will also show a jump, but this is not the actual wafer edge. If this point is mistakenly identified as the wafer edge, problems can easily occur during processing. Therefore, in this embodiment of the invention, the area between B and E is defined as the "effective acquisition area on the wafer," which does not include the edges where points B and E are located. The effective acquisition area on the wafer can be a region slightly larger than the wafer area. The starting point of the effective acquisition area on the wafer can be a point between points B and C, and the ending point can be a point between points D and E.

[0088] It should be noted that, although Figure 5 This text uses points on a wafer as examples to describe various regions or locations. However, it is understood that these regions and locations can be correlated to regions or locations within the range of movement during the relative movement of the wafer and the processing head. That is, within this range of movement, there is an actual moving area corresponding to the aforementioned "effective acquisition area on the wafer," which is referred to as the "effective acquisition area" in this text. For example, when the wafer reaches the starting point of the effective acquisition area, the ranging mechanism can be aligned with the starting point of the effective acquisition area on the wafer; that is, the distance information acquired by the ranging mechanism is the distance information at the starting point of the effective acquisition area on the wafer. When the wafer reaches the ending point of the effective acquisition area, the ranging mechanism can be aligned with the ending point of the effective acquisition area on the wafer; that is, the distance information acquired by the ranging mechanism is the distance information at the ending point of the effective acquisition area on the wafer.

[0089] The effective acquisition area has corresponding position information at both the start and end points, i.e., corresponding grating ruler readings. The position information measured by the grating ruler can be used to determine whether the wafer has entered the effective acquisition area. Optionally, the data receiving module 210 can only receive (i.e., sample) the distance information corresponding to when the wafer enters the effective acquisition area, and / or the data storage module 220 can only store the distance information corresponding to when the wafer enters the effective acquisition area. Thus, the distance information stored in the data storage module 220 will only cause a signal transition when the ranging mechanism reaches point C or point D (wafer edge). Exemplarily, but not limitingly, the position information corresponding to the effective acquisition area on the X-axis can be preset by the user through the interactive module and can optionally be stored in the third data storage module. The third data storage module can be the second data storage module or data storage module 220, or it can be a storage module independent of the second data storage module and data storage module 220.

[0090] In one example, when the wafer reaches the starting point of the effective acquisition area, the data receiving module 210 can begin sampling the distance information and sequentially store the sampled distance information into the data storage module 220 after at least one downsampling. However, the control system 200 does not begin implementing follow control from the starting point of the effective acquisition area. Follow control is the operation of outputting real-time control signals to the focusing mechanism to control the focusing mechanism (i.e., the processing head) to move up and down following the distance information. The control system 200 can implement follow control from the moment the wafer enters the effective processing area, which can also be called the follow area. (Continue to refer to...) Figure 5In one embodiment, the area enclosed by the edges of points C and D (i.e., the wafer area) can be considered as the effective processing area on the wafer. In another embodiment, the area located inside the wafer area, i.e., smaller than the wafer area, can be considered as the effective processing area on the wafer. Theoretically, following control (i.e., starting processing) can begin when the ranging mechanism aligns with one side of the wafer edge and end when it aligns with the other side of the wafer edge. However, due to signal jumps at the wafer edge, the real-time control signal generated based on distance information will also jump, resulting in inaccurate following. Therefore, after the ranging mechanism aligns with one side of the wafer edge, it can continue to move a certain distance, such as a first correction distance i1, before starting following. The position on the workpiece at this point is the starting point of the effective processing area, which can also be considered the starting position of following. Conversely, if there is still a certain distance before the ranging mechanism aligns with the other side of the wafer edge, such as a second correction distance i2, following ends. The position on the workpiece at this point is the ending point of the effective processing area, which is the ending position of following. In other words, following can start late and end early to avoid signal jump problems caused by the wafer edge.

[0091] Similar to the effective acquisition area on the wafer, within the range of relative movement between the wafer and the processing head, there is an actual movement area corresponding to the aforementioned "effective processing area on the wafer," which is referred to herein as the "effective processing area." For example, when the wafer reaches the processing start point of the effective processing area, the ranging mechanism can be aligned with the start point of the effective processing area on the wafer; that is, the distance information acquired by the ranging mechanism is the distance information at the start point of the effective processing area on the wafer. When the wafer reaches the processing end point of the effective processing area, the ranging mechanism can be aligned with the end point of the effective processing area on the wafer; that is, the distance information acquired by the ranging mechanism is the distance information at the end point of the effective processing area on the wafer.

[0092] According to an embodiment of the present invention, the reading control module can also be used to determine whether the workpiece to be processed has reached the target position point on the effective processing area based on the position information and distance information. The target position point is the processing start point or the processing end point.

[0093] Referring to the above description, the meaning of the effective processing area can be understood, and will not be repeated here. In this embodiment, the control module determines whether the workpiece has reached the processing start point or processing end point on the effective processing area based on the location information and distance information. This scheme can realize automatic and real-time determination of the effective processing area. Of course, this scheme is only an example and not a limitation of the present invention. For example, the user can also input the location information corresponding to the processing start point and processing end point of the effective processing area through an interaction module. In this way, when the location information received by the data receiving module 210 is equal to the location information corresponding to the processing start point or processing end point, it can be directly determined that the workpiece has reached the processing start point or processing end point.

[0094] According to an embodiment of the present invention, the reading control module can determine whether the workpiece has reached the target position point on the effective processing area based on the position information and distance information in the following manner: based on the change range of the distance information, determine whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece; if the determination result is yes, determine the target position information corresponding to the workpiece when it is at the target position point based on the position information corresponding to the currently received distance information; when the position information received by the data receiving module 210 is the target position information, determine that the workpiece is at the target position point.

[0095] In one embodiment, the presence of a signal jump, i.e., abrupt change, can be determined based on the distance information measured by the ranging mechanism, thereby determining whether the position on the wafer corresponding to the currently received distance information is the edge of the wafer. In this embodiment, a significant change in the distance information is considered a signal jump. For example, when the change in distance information exceeds a change amplitude threshold, a signal jump can be determined, indicating that the ranging mechanism has aligned with the wafer edge, or that the ranging mechanism has reached above the wafer edge. The change amplitude threshold can be set to any suitable size as needed. For example, the change amplitude threshold can be any value greater than or equal to the thickness of the product to be processed. In one embodiment, the change amplitude threshold can be preset by the user through an interactive module and can optionally be stored in a fourth data storage module. The fourth data storage module can be the second data storage module, the third data storage module, the data storage module 220, or a storage module included within the read control module, or it can be a storage module independent of the second data storage module, the third data storage module, the data storage module 220, and the read control module.

[0096] The magnitude of change in distance information can be calculated on a per-group basis, meaning the magnitude of change within each group of data points is calculated. Each group of data points can include two or more data points, representing distance information corresponding to two or more location points. Two adjacent groups of data points may or may not share any data points at their boundary. For example, for each group of data points, the difference between the first and last data points within that group can be calculated as the magnitude of change for that group. For instance, if the magnitude of change between the current data point and the previous data point in the distance information exceeds a threshold, the position on the wafer corresponding to the current data point acquired by the ranging mechanism can be determined as the edge of the wafer. Subsequently, based on the position information corresponding to the current data point, the target position information corresponding to the wafer being at the target location can be determined.

[0097] In one embodiment, if the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece, the position information corresponding to the currently received distance information can be directly determined as the target position information. For example, if the change amplitude exceeds the change amplitude threshold for the first time, the position information corresponding to the currently received distance information can be determined as the position information corresponding to the workpiece when it is at the processing start point (referred to as the third position information for ease of explanation). If the change amplitude exceeds the change amplitude threshold for the second time, the position information corresponding to the currently received distance information can be determined as the position information corresponding to the workpiece when it is at the processing end point (referred to as the fourth position information for ease of explanation).

[0098] In another embodiment, if the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece, the third position information X3 corresponding to the start point of the workpiece reaching the effective processing area and / or the position information X4 corresponding to the end point of the workpiece reaching the effective processing area can be determined based on the position information corresponding to the currently received distance information and a correction distance, where X3 = X5 + i1, X5 represents the position information corresponding to the currently received distance information when it corresponds to the start edge of the workpiece, and i1 represents the first correction distance; and / or where X4 = X6 - i2, X6 represents the position information corresponding to the currently received distance information when it corresponds to the end edge of the workpiece, and i2 represents the second correction distance. As mentioned above, since there will be signal jumps at the wafer edge, the real-time control signal generated based on the distance information will also have jumps, resulting in inaccurate tracking. Therefore, after the ranging mechanism is aligned with one side of the wafer edge, it can continue to move a certain distance, for example, the first correction distance i1, before starting to track. Conversely, if there is still a certain distance, such as the second correction distance i2, before the ranging mechanism aligns with the edge of the other wafer, the tracking ends. In other words, tracking can start late and end early to avoid signal jump problems caused by the wafer edge.

[0099] When the location information received by the data receiving module 210 is the target location information (i.e., the third location information or the fourth location information), it can be determined that the wafer is at the target location point.

[0100] According to the above technical solution, based on the change range of distance information, it is determined whether the position on the workpiece corresponding to the currently received distance information is the edge of the workpiece, and thus the position information corresponding to the processing start point or processing end point is determined. This edge-based judgment solution can simply and accurately determine the position information corresponding to the processing start point or processing end point.

[0101] According to an embodiment of the present invention, the processing apparatus includes a ranging mechanism for measuring distance information. The ranging mechanism is used to measure distance information. The position information includes position information corresponding one-to-one with each different position point of the workpiece to be processed, and the distance information includes distance information corresponding one-to-one with each different position point of the workpiece to be processed. The reading control module can read the corresponding distance information from the data storage module 220 in the following manner: determining the second position information X2 based on the first position information X1 corresponding to at least one position point in the effective processing area; when the position information received by the data receiving module 210 is the second position information X2, reading the distance information corresponding to the first position information X1 from the data storage module 220; wherein the second position information X2 satisfies the following formula: X2=X1+δx1, where δx1 represents the distance between the ranging mechanism and the processing head in the second direction.

[0102] See back Figure 1 There is a certain distance, denoted as δx1, between the ranging mechanism and the processing head in the second direction. As described above, the ranging mechanism can reach any position point first, and then the processing head will only reach that position point after the workpiece and / or processing head has moved a certain distance. Therefore, for any position point, if processing is initiated at that position point as soon as the position information received by the data receiving module 210 equals the position information corresponding to the distance measured by the ranging mechanism, there will be a certain error because the processing head has not actually reached that position point yet. Adding the original position information of any position point to δx1 can compensate for this error, making the processing position of the processing head more accurate.

[0103] It should be noted that the aforementioned first position information X1 is position information that corresponds one-to-one with at least one position point. That is, for each of the at least one position points, it has its own first position information X1 (i.e., the original position information without error compensation). Furthermore, for each of the at least one position points, its corresponding first position information X1 can be added to δx1 to obtain the corresponding second position information X2 (i.e., the new position information after error compensation).

[0104] The location points within the effective processing area can include the processing start point and the processing end point. That is, the above error compensation operation based on δx1 can also be performed for these two location points.

[0105] According to the above technical solution, this solution can compensate for the error caused by the installation distance between the ranging mechanism and the processing head, thereby effectively improving the processing accuracy.

[0106] According to an embodiment of the present invention, the processing apparatus further includes a ranging mechanism and a focusing mechanism. The ranging mechanism is used to measure distance information, and the focusing mechanism is used to drive the processing head to move in a first direction. The position information includes position information corresponding one-to-one with each different position point of the workpiece to be processed, and the distance information includes distance information corresponding one-to-one with each different position point of the workpiece to be processed. The reading control module can read the corresponding distance information from the data storage module in the following manner: determine the second position information X2 based on the first position information X1 corresponding to at least one position point in the effective processing area; when the position information received by the data receiving module 210 is the second position information X2, read the distance information corresponding to the first position information X1 from the data storage module 220; wherein the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, where δx1 represents the distance between the ranging mechanism and the processing head in the second direction, and δx2 represents the moving distance of the workpiece to be processed relative to the processing head in the second direction during the response time of the focusing mechanism.

[0107] During follow-up control, a certain response time is required from sending a control signal to the focusing mechanism 140 to the focusing mechanism 140 responding. In laser processing equipment, the following accuracy requirements in the wafer's movement direction (i.e., the X-axis direction) are relatively high, needing to reach the micrometer level. However, the response time of the piezoelectric ceramic motor is in the millisecond range, which directly affects the X-axis following accuracy, and thus the final cutting accuracy. Therefore, it is possible to consider compensating for the error caused by the response time of the focusing mechanism.

[0108] In one embodiment, the response time of the focusing mechanism can be considered fixed, i.e., δx2 is fixed. In this case, the value of δx2 can be preset. For each position point, the second position information X2 is calculated uniformly based on the preset δx2. Exemplarily, δx2 can be set by the user through the interaction module, and the set δx2 can optionally be stored in the fifth data storage module. The fifth data storage module can be the second data storage module, the third data storage module, the fourth data storage module, the data storage module 220, or a storage module included within the read control module, or it can be a storage module independent of the second data storage module, the third data storage module, the fourth data storage module, the data storage module 220, and the read control module.

[0109] In another embodiment, the response time can be determined by the rate of change of distance information corresponding to multiple position points. Based on this response time, δx2 corresponding to the multiple position points is determined, and error compensation is performed on the first position information X1 corresponding to these multiple position points based on the determined δx2 to obtain the second position information X2 corresponding to the multiple position points. In this scheme, position points within the effective processing area can be grouped, with multiple position points forming a position point group. Adjacent position point groups can share position points at the boundary or not share any position points. For any two different position point groups, if their rates of change are different, the corresponding response times will also be different, and therefore the compensation distance δx2 will be different. The reason for implementing this scheme is that the response time of the focusing mechanism 140 is related to the step of the input signal, but is basically independent of the amplitude of the input signal. The following uses a piezoelectric ceramic motor as an example for explanation. When the input signal is a sine wave, the response time of the piezoelectric ceramic motor is approximately 2.7ms; when the input signal is a pulse wave, the response time of the piezoelectric ceramic motor is approximately 5ms. For example, an external signal (e.g., a signal generated by a signal generator) can be used as an input signal to the focusing mechanism 140 for testing. By adjusting the slope of the input signal, a relationship function between the slope k1 of the input signal and the response time y is fitted, for example, y = f(k1). In this way, after determining the rate of change of multiple position points, the corresponding response time can be determined based on the above relationship function.

[0110] The above-mentioned scheme with fixed response time has a simple algorithm, low requirements for hardware and software, and low cost, while the scheme with real-time response time has good tracking performance and high processing accuracy.

[0111] According to the above technical solution, this solution can compensate for the errors caused by response time and the installation distance between the ranging mechanism and the processing head, thereby effectively improving the processing accuracy.

[0112] According to an embodiment of the present invention, the processing apparatus further includes a focusing mechanism for driving the processing head to move in a first direction. The system further includes: a first data processing module connected to the reading control module for performing numerical simulation based on the distance information received from the reading control module to obtain a fitting signal; and an output module connected to the first data processing module for generating a corresponding real-time control signal based on the fitting signal and outputting the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to a focal position matching the distance information in the first direction.

[0113] In one embodiment, the control system 200 may further include a first data processing module and an output module. Figure 6A schematic diagram illustrating an exemplary structure of a control system 200 according to an embodiment of the present invention is shown. It should be noted that... Figure 6 The various modules in the control system 200 shown are merely examples and not intended to limit the invention. Many of these modules can be omitted or replaced with other modules, and the control system 200 may further include... Figure 6 Other modules besides the one shown. Additionally, Figure 6 The connection relationships between the various modules shown can also be adjusted.

[0114] See Figure 6 The diagram illustrates the first data processing module. This first data processing module can be a digital-to-analog (DA) fitting output module, connected to the readout control module. Based on the distance information received from the readout control module, the first data processing module performs DA fitting using the formula y = k²h + b. Here, h represents the distance measured by the ranging mechanism, k² and b can be pre-set, and y represents the fitted signal obtained after fitting. (See also...) Figure 6 The diagram also shows an output module. The output module is connected to the first data processing module, and the fitted signal obtained by the first data processing module can be transmitted to the output module. The output module can generate a corresponding real-time control signal based on the fitted signal and output the real-time control signal to the focusing mechanism. The real-time control signal can control the focusing mechanism to move the processing head in a first direction to a focal position that matches the distance information read by the ranging mechanism.

[0115] For example, see Figure 6 The output module may include an output control submodule and a data output submodule. The output control submodule may be a DA output control submodule, used to control the data output submodule to output real-time control signals. The data output submodule may be a digital-to-analog converter (DAC) submodule, which can perform digital-to-analog conversion and other operations on the real-time control signals to obtain analog real-time control signals and output these signals to the focusing mechanism.

[0116] In addition, see Figure 6 The diagram also shows the first and second data receiving submodules described above. Referring to the above description, the functions of the first and second data receiving submodules can be understood; they will not be repeated here. Furthermore, see... Figure 6 The diagram also shows a second data processing module. This second data processing module can be understood as the aforementioned first downsampling submodule. That is, the second data processing module can downsample the distance information received by the first data receiving submodule and can optionally perform sliding filtering. Furthermore, Figure 6It is also shown that the output signal frequency of the first data receiving submodule is 200 Mbps, the output signal frequency of the second data processing module is 500 Kbps, and the output signal frequency of the second data receiving submodule (which may be the pulse output frequency of a position measuring mechanism such as a grating ruler) is 500 kHz, but these are just examples and these frequencies can be adjusted as needed.

[0117] According to the above technical solution, based on the first data processing module and the output module, a fitted signal can be obtained, and a corresponding real-time control signal can be generated based on the fitted signal. This allows for automatic control of the focusing mechanism to move the processing head in the first direction. This solution has a high degree of automation.

[0118] For example, the system further includes: a first interaction module connected to the output module, used to obtain first indication information from the host computer, and the output module is further used to generate a fixed control signal based on the first indication information before the processing head is at the processing start point in the effective processing area, and output the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the processing head to stay in a fixed position in the first direction.

[0119] In one embodiment, the control system 200 may further include a first interaction module. See also Figure 6 The diagram illustrates an interaction module, which may include a first interaction module. The first interaction module may include any wired and / or wireless communication interface to communicate with a host computer and receive first instruction information from the host computer. For example, the first interaction module may include one or more of an RS232 interface, a Bluetooth interface, a WiFi interface, and a Universal Serial Bus (USB) interface. Furthermore, the first interaction module may also include an instruction configuration submodule, used to transmit instruction information to the corresponding module based on the type of instruction information received from the host computer. For example, upon receiving first instruction information, the instruction configuration submodule may transmit the first instruction information to an output module for corresponding output control. As another example, upon receiving the following second instruction information, the instruction configuration submodule may transmit the second instruction information to a judgment module for corresponding judgment.

[0120] Users can input first position information into the host computer using input devices such as a mouse, keyboard, or touchscreen. The host computer can then transmit this first instruction information to the first interaction module. (See also...) Figure 6The first interaction module can be connected to the output module. The first indication information can indicate any voltage value, based on which the focusing mechanism can be activated, but the focusing mechanism does not move in the first direction, but remains in a fixed position. Before the workpiece enters the effective processing area, the output module can generate a fixed control signal based on the first indication information. Then, the fixed control signal is output to the focusing mechanism to control the focusing mechanism to keep the processing head fixed in the vertical direction.

[0121] For example, the first interaction module can be connected to the aforementioned output control submodule and transmit the first indication information to the output control submodule. Upon receiving the first indication information, the output control submodule controls the data output submodule to output a fixed control signal. Conversely, upon receiving the aforementioned fitting signal, the output control submodule can control the data output submodule to output a real-time control signal.

[0122] The first indication information may include a "register" value used to indicate the magnitude of a fixed control signal. There is a preset correspondence between the register value and the voltage value. For example, if the register value transmitted from the host computer to the first interactive module is 0 (before and after implementing follow control), the output module can output a fixed voltage (e.g., according to a pre-configured correspondence between register values ​​and voltage values ​​in the FPGA). Alternatively, the host computer can also output third indication information to the first interactive module. Assuming the third indication information includes a register value of 1, the magnitude of the voltage output by the output module can be calculated in real-time based on distance information (i.e., in the case of real-time follow control).

[0123] Optionally, for situations following real-time follow control, to avoid piezoelectric ceramic motor jitter caused by edge signal jumps, the voltage corresponding to register value 0 can be omitted after implementing follow control. Instead, the voltage corresponding to the last position point during follow control (i.e., the magnitude of the real-time control signal corresponding to the last position point) can be maintained. In this case, the host computer does not need to send register value 0 to the interaction module after implementing follow control.

[0124] According to the above technical solution, based on the first interactive module, it can receive the first instruction information and generate a fixed control signal based on the first instruction information. This makes it convenient to keep the focusing mechanism and the processing head in a suitable position according to the user's needs before implementing follow control.

[0125] For example, the reading control module is also used to control the data storage module to store distance information during the process of the workpiece being processed being at the start point and end point of the effective collection area. The effective collection area includes the effective processing area. The system also includes: a judgment module, connected to the data receiving module and the reading control module, used to determine whether the workpiece has reached the start point or end point of the collection based on the position information; and a second interaction module, connected to the judgment module, used to obtain second indication information from the host computer. The judgment module determines the position information corresponding to the start point and end point of the collection based on the second indication information.

[0126] The second interaction module and the first interaction module can be the same interaction module (e.g., ...). Figure 6 The interactive module shown can be either one or two separate interactive modules. Similar to the first interactive module, the second interactive module can include any wired and / or wireless communication interface to communicate with the host computer and receive second instruction information from the host computer. For example, the second interactive module can include one or more of the following: RS232 interface, Bluetooth interface, WiFi interface, Universal Serial Bus (USB) interface, etc. If the first and second interactive modules are implemented using the same interactive module, this interactive module can include the aforementioned instruction configuration submodule. If the first and second interactive modules are two separate interactive modules, the instruction configuration submodule can optionally be omitted from both the first and second interactive modules.

[0127] In one embodiment, the read control module can also be used to control the data storage module 220 to store the distance information collected by the ranging mechanism during the movement of the wafer from the starting point to the ending point of the effective acquisition area. For example... Figure 6 As shown, the control system 200 may further include a judgment module. The judgment module can be connected to the second data receiving submodule and the second interaction module. The user can input second position information into the host computer via input devices such as a mouse, keyboard, or touchscreen. The host computer can then transmit the second indication information to the second interaction module. The second indication information may include the position information corresponding to the acquisition start point and acquisition end point. For example, the user can use the keyboard to input the measurement values ​​on the grating ruler corresponding to the acquisition start point and acquisition end point in the information input boxes of the user interface displayed on the host computer. The judgment module can determine in real time whether the workpiece to be processed has reached the acquisition start point or acquisition end point based on the position information received by the data receiving module 210. The reading control module can control the data storage module 220 to store distance information during the process of the workpiece being within the effective acquisition area at the acquisition start point and acquisition end point, based on the judgment result of the judgment module.

[0128] According to the above technical solution, it is possible to automatically determine whether the workpiece to be processed is within the collection start point and collection end point of the collection area, and to control the data storage module to store distance information while the workpiece is within the effective collection area's collection start point and collection end point. This solution can effectively save storage space and also help reduce the workload of the control system 200.

[0129] According to another aspect of the present invention, a control method for a processing apparatus is also provided. Figure 7 A schematic flowchart illustrating a control method 700 for a processing apparatus according to an embodiment of the present invention is shown. See also Figure 7 The control method 700 for the processing device includes steps S710, S720 and S730.

[0130] In step S710, distance information of the workpiece to be processed is received in real time. The distance information is used to represent the distance between the processing head of the processing device and the workpiece to be processed in the first direction. The distance information contains multiple data points, and each data point represents a distance value.

[0131] In step S720, the distance information is stored.

[0132] In step S730, based on the change range of the data points in the distance information, it is determined whether two adjacent data points in the distance information meet the preset requirements. If the two adjacent data points meet the preset requirements, the two adjacent data points are determined to be a group of abnormal data points. Based on the pre-set characteristic parameters of the abnormal data points, it is determined whether the area on the workpiece corresponding to the two groups of adjacent abnormal data points is an abnormal area, so as to obtain the analysis results. The preset requirements are: the difference between the first data point and the normal data point in the two adjacent data points is less than the first preset threshold, and the difference between the second data point and the normal data point or the first data point is greater than the second preset threshold.

[0133] In step S740, based on the analysis results, the stored data points corresponding to the abnormal areas are replaced with normal data points.

[0134] According to an embodiment of the present invention, when two adjacent data points meet preset requirements, determining two adjacent data points as a group of abnormal data points includes: when two adjacent data points meet preset requirements, and normal data points, the first data point among the two adjacent data points, and the second data point among the two data points are received in sequence, determining that the two adjacent data points belong to a first type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

[0135] According to an embodiment of the present invention, when two adjacent data points meet preset requirements, determining two adjacent data points as a group of abnormal data points includes: when two adjacent data points meet preset requirements, and the second data point, the first data point, and the normal data point are received in sequence, determining that the two adjacent data points belong to a second type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

[0136] According to an embodiment of the present invention, the feature parameter of the pre-set abnormal data point is a preset pulse width. Based on the feature parameter of the pre-set abnormal data point, it is determined whether the area on the workpiece corresponding to two sets of adjacent abnormal data points is an abnormal area, including: when the time interval between two adjacent transition edges is less than the preset pulse width, it is determined that the area between the two adjacent transition edges is an abnormal area.

[0137] According to an embodiment of the present invention, based on the analysis results, replacing each data point stored in the data storage module corresponding to the abnormal region with normal data points includes: for any abnormal region, replacing each data point stored in the data storage module corresponding to the abnormal region with the nearest first normal data point before the data point corresponding to the abnormal region, or the nearest second normal data point after the data point corresponding to the abnormal region, or the average value of the first normal data point and the second normal data point.

[0138] According to another aspect of the present invention, an electronic device is also provided. Figure 8 A schematic block diagram of an electronic device 800 according to an embodiment of the present invention is shown, such as... Figure 8 As shown, the electronic device 800 may include a processor 810 and a memory 820. The memory 820 stores a computer program, and the processor 810 executes the computer program to implement the aforementioned control method for the processing apparatus.

[0139] According to another aspect of the present invention, a storage medium is also provided. Program instructions are stored on the storage medium, which, when executed, are used to perform the control method for a processing apparatus as described above. The storage medium may, for example, include a storage component of a tablet computer, a hard disk of a personal computer, a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a portable compact disc read-only memory (CD-ROM), a USB memory, or any combination of the above storage media. The computer-readable storage medium may be any combination of one or more computer-readable storage media.

[0140] Those skilled in the art can understand the specific implementation schemes of the control method, electronic equipment and storage medium for the processing apparatus by reading the above description of the control system 200 for the processing apparatus, and will not be repeated here for the sake of brevity.

[0141] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of the invention. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

[0142] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0143] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0144] The above description is merely a specific embodiment of the present invention or an explanation of that embodiment. The scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A control system for a processing device, comprising: a data receiving module configured to receive distance information of a workpiece in real time, the distance information being indicative of a distance between a processing head of the processing device and the workpiece in a first direction, the distance information comprising a plurality of data points, each data point representing a distance value; a data storage module connected to the data receiving module and configured to store the distance information; an analysis module connected to the data receiving module and configured to determine, according to a variation amplitude of the data points in the distance information, whether two adjacent data points in the distance information meet a preset requirement, determine, in a case where the two adjacent data points meet the preset requirement, that the two adjacent data points are a group of abnormal data points, and determine, according to a characteristic parameter of the abnormal data points set in advance, whether a region on the workpiece corresponding to the two groups of adjacent abnormal data points is an abnormal region, to obtain an analysis result, wherein the preset requirement is that a difference between a first data point in the two adjacent data points and a normal data point is less than a first preset threshold, and a difference between a second data point and the normal data point or the first data point is greater than a second preset threshold; a data updating module connected to the analysis module and the data storage module and configured to replace, according to the analysis result, each data point corresponding to the abnormal region stored in the data storage module with the normal data point.

2. The system of claim 1, wherein, The analysis module is specifically configured to determine, when the two adjacent data points meet the preset requirement and the normal data point, a first data point in the two adjacent data points, and a second data point in the two adjacent data points are received in sequence, that the two adjacent data points belong to a first type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

3. The system of claim 1, wherein, The analysis module is specifically configured to determine, when the two adjacent data points meet the preset requirement and the second data point in the two adjacent data points, the first data point in the two adjacent data points, and the normal data point are received in sequence, that the two adjacent data points belong to a second type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

4. The system of claim 1, wherein, The characteristic parameter of the abnormal data points set in advance is a preset pulse width, and the analysis module is specifically configured to determine, when a time interval between the two groups of adjacent abnormal data points is less than the preset pulse width, that the region on the workpiece corresponding to the two groups of adjacent abnormal data points is an abnormal region.

5. The system of claim 1, wherein, The data updating module is specifically configured to: for any abnormal region, replace each data point corresponding to the abnormal region stored in the data storage module with a nearest first normal data point located before the data point corresponding to the abnormal region, or a nearest second normal data point located after the data point corresponding to the abnormal region, or an average value of the first normal data point and the second normal data point.

6. The system according to any one of claims 1-5, characterized in that, The data receiving module comprises: a first data receiving submodule configured to receive the distance information in real time; The first downsampling module is connected with the first data receiving submodule and the data storage module, and is configured to perform first downsampling on the distance information. The second downsampling module is connected with the first downsampling module and the analysis module, and is configured to perform second downsampling on the distance information after the first downsampling. The data storage module is configured to store the distance information after the first downsampling, and the analysis module is configured to determine whether two adjacent data points in the distance information meet the preset requirement based on a variation amplitude of the data points in the distance information after the second downsampling.

7. The system according to any of claims 1-5, characterized in that, The data storage module has a first interface and a second interface, the data storage module receives the distance information transmitted by the data receiving module through the first interface, and receives the normal data points for replacement transmitted by the data updating module through the second interface.

8. The system according to any of claims 1-5, characterized in that, The data receiving module is further configured to receive position information of the workpiece to be processed in real time, the position information is used to represent a position of the workpiece to be processed in a second direction when the workpiece to be processed moves relative to a machining head of the machining device in the second direction, and the system further comprises: The reading control module is connected with the data storage module and the data receiving module, and is configured to read corresponding distance information from a machining starting point of the effective machining area in the data storage module based on at least the position information when it is determined that the workpiece to be processed is in the effective machining area, so as to control the machining head to move to a focal point position matched with the distance information in the first direction based on the read distance information.

9. The system of claim 8, wherein, The reading control module is further configured to determine whether the workpiece to be processed reaches a target position point on the effective machining area according to the position information and the distance information, the target position point being a machining starting point or a machining ending point.

10. The system of claim 9, wherein, The reading control module determines whether the workpiece to be processed reaches the target position point on the effective machining area according to the position information and the distance information in the following manner: According to the variation amplitude of the distance information, it is determined whether a position on the workpiece to be processed corresponding to the currently received distance information is an edge of the workpiece to be processed; In a case where the determination result is yes, target position information corresponding to a case where the workpiece to be processed is at the target position point is determined based on position information corresponding to the currently received distance information; When the position information received by the data receiving module is the target position information, it is determined that the workpiece to be processed is at the target position point.

11. The system of claim 8, wherein, The machining device comprises a distance measuring mechanism, the distance measuring mechanism is configured to measure the distance information, the position information comprises position information corresponding to each different position point of the workpiece to be processed, and the distance information comprises distance information corresponding to each different position point of the workpiece to be processed. The reading control module reads corresponding distance information from the data storage module in the following manner: According to first position information X1 corresponding to at least one position point in the effective machining area, second position information X2 is determined. When the position information received by the data receiving module is the second position information X2, the distance information corresponding to the first position information X1 is read from the data storage module; Wherein, the second position information X2 satisfies the following formula: X2=X1+δx1, δx1 represents the distance between the ranging mechanism and the machining head in the second direction.

12. The system of claim 8, wherein, The machining device further comprises a ranging mechanism and a focusing mechanism, the ranging mechanism is used for measuring the distance information, the focusing mechanism is used for driving the machining head to move in the first direction, the position information comprises position information corresponding to each different position point of the workpiece to be processed, and the distance information comprises distance information corresponding to each different position point of the workpiece to be processed, wherein, The reading control module reads the corresponding distance information from the data storage module in the following way: According to the first position information X1 corresponding to at least one position point in the effective machining area, the second position information X2 is determined; When the position information received by the data receiving module is the second position information X2, the distance information corresponding to the first position information X1 is read from the data storage module; Wherein, the second position information X2 satisfies the following formula: X2=X1+δx1-δx2, δx1 represents the distance between the ranging mechanism and the machining head in the second direction, and δx2 represents the moving distance of the workpiece to be processed relative to the machining head in the second direction within the response time of the focusing mechanism.

13. The system of claim 8, wherein, The machining device further comprises a focusing mechanism, the focusing mechanism is used for driving the machining head to move in the first direction, and the system further comprises: A first data processing module connected with the reading control module, used for digital-analog fitting according to the read distance information received from the reading control module, to obtain a fitting signal; An output module connected with the first data processing module, used for generating a corresponding real-time control signal according to the fitting signal, and outputting the real-time control signal to the focusing mechanism to control the focusing mechanism to drive the machining head to move to a focus position matching the distance information in the first direction.

14. The system of claim 13, wherein, The system further comprises: A first interaction module connected with the output module, used for obtaining first indication information from a host computer, and the output module is further used for generating a fixed control signal based on the first indication information before the machining head is at a machining starting point in the effective machining area, and outputting the fixed control signal to the focusing mechanism to control the focusing mechanism to drive the machining head to remain at a fixed position in the first direction.

15. The system of claim 13, wherein, The reading control module is further used for controlling the data storage module to store the distance information in the process that the workpiece to be processed is at a collection starting point and a collection ending point of an effective collection area, and the effective collection area comprises the effective machining area, The system further comprises: A judging module, connected with the data receiving module and the reading control module, is configured to determine whether the workpiece reaches the collection start point or the collection end point according to the position information. A second interaction module, connected with the judging module, is configured to obtain second indication information from the upper computer, and the judging module determines the position information corresponding to the collection start point and the collection end point based on the second indication information.

16. A control method for a processing device, comprising: receiving distance information of a workpiece in real time, the distance information being used to represent a distance between a processing head of the processing device and the workpiece in a first direction, the distance information including a plurality of data points, each data point representing a distance value; storing the distance information; determining whether two adjacent data points in the distance information meet a preset requirement according to a variation amplitude of the data points, determining the two adjacent data points as a group of abnormal data points in a case where the two adjacent data points meet the preset requirement, and determining whether a region on the workpiece corresponding to two groups of adjacent abnormal data points is an abnormal region according to a characteristic parameter of the abnormal data points pre-set, to obtain an analysis result, wherein the preset requirement is that a difference between a first data point in the two adjacent data points and a normal data point is less than a first preset threshold, and a difference between a second data point and the normal data point or the first data point is greater than a second preset threshold; replacing each data point corresponding to the abnormal region in the stored distance information with the normal data point according to the analysis result.

17. The method of claim 16, wherein, The determining the two adjacent data points as a group of abnormal data points in the case where the two adjacent data points meet the preset requirement includes: when the two adjacent data points meet the preset requirement and the normal data point, a first data point in the two adjacent data points, and a second data point in the two adjacent data points are received in sequence, determining that the two adjacent data points belong to a first type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

18. The method of claim 16, wherein, The determining the two adjacent data points as a group of abnormal data points in the case where the two adjacent data points meet the preset requirement includes: when the two adjacent data points meet the preset requirement and the second data point in the two adjacent data points, the first data point in the two adjacent data points, and the normal data point are received in sequence, determining that the two adjacent data points belong to a second type of abnormal data points, wherein the two groups of adjacent abnormal data points belong to two different types of abnormal data points.

19. The method of claim 16, wherein, The characteristic parameter of the abnormal data points pre-set is a preset pulse width, and the determining whether the region on the workpiece corresponding to the two groups of adjacent abnormal data points is the abnormal region according to the characteristic parameter of the abnormal data points pre-set includes: when a time interval between the two groups of adjacent abnormal data points is less than the preset pulse width, determining that the region on the workpiece corresponding to the two groups of adjacent abnormal data points is the abnormal region.

20. The method of claim 16, wherein, The replacing the stored data points corresponding to the abnormal region by the normal data points according to the analysis result comprises: For any abnormal region, the stored data points corresponding to the abnormal region are replaced by the nearest first normal data point before the data point corresponding to the abnormal region, or the nearest second normal data point after the data point corresponding to the abnormal region, or the average of the first normal data point and the second normal data point.

21. An electronic device comprising a processor and a memory, wherein, The memory stores computer program instructions, which, when executed by the processor, implement the control method for the processing device according to any one of claims 16-20.

22. A storage medium having stored thereon program instructions which, when executed by a processor, cause the processor to perform the method of any of claims 1 to 21. The program instructions, when executed, implement the control method for the processing device according to any one of claims 16-20.

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