Method for manufacturing a power module and multi-phase counter-coupled inductor

Abstract

The present disclosure relates to the technical field of electronic power, and particularly discloses a power supply module, a power supply system and a multi-phase anti-coupling inductor. The power supply module comprises an anti-coupling inductor and a plurality of half-bridge modules arranged on the anti-coupling inductor. The anti-coupling inductor comprises a plurality of windings and a magnetic core. The plurality of windings are linear windings between a first plane and a second plane. A first magnetic core and a second magnetic core are respectively located at two ends of the windings. A magnetic core column connects the first magnetic core and the second magnetic core. The magnetic core column is a plurality of magnetic core columns, and forms a plurality of magnetic core units with the first magnetic core and the second magnetic core. The magnetic core units are arranged in correspondence with the windings. The plurality of magnetic core units all extend from the first plane to the second plane in the same direction around the corresponding windings. A closed region is arranged in one-to-one correspondence with the windings. Each half-bridge module is connected in one-to-one correspondence with the windings, and a midpoint of a bridge arm of each half-bridge module is electrically coupled with a first end of the corresponding winding.

Description

[0001] This case is a divisional application of application number 202010387760.8, filed on May 9, 2020, entitled "Power Module, Power Supply System and Multiple Opposite Coupled Inductors". Technical Field

[0002] This disclosure relates to the field of electronic power technology, and in particular to a method for manufacturing a power module and multiple oppositely coupled inductors. Background Technology

[0003] Currently, the market size of cloud (data centers) and edge devices (mobile phones, iPads, etc.) is growing rapidly. However, this growth also brings several challenges. For example, as smart ICs become more functional and consume more power, the number of components on motherboards increases, requiring power modules to have higher power density or greater current output capacity per module. Stacking active and passive components can significantly reduce the footprint or size of power modules. Furthermore, with the increasing computing power of smart ICs, the demands on the dynamic performance of power supply systems are also rising. Multiphase parallel power supply is an effective solution for achieving high-current power supply. When both high efficiency and high dynamics are required, using two or more phases with opposite coupling in parallel is often a good solution to improve the dynamic performance of the power supply system. Existing power modules either cannot achieve multiphase opposite coupling parallel power supply, or those that can often achieve it have complex structures, large sizes, tortuous winding lines, and long output paths, affecting efficiency. Moreover, they often suffer from poor heat dissipation in the vertical direction, or the pin layout is inconvenient for customer applications, further limiting the performance of the power module. Summary of the Invention

[0004] A primary objective of this disclosure is to overcome at least one of the deficiencies of the prior art described above, and to provide a power module, a power supply system, and multiple oppositely coupled inductors.

[0005] According to a first aspect of the present invention, a power supply module is provided, comprising an anti-coupling inductor and a plurality of half-bridge modules disposed on the anti-coupling inductor, the anti-coupling inductor comprising:

[0006] Multiple windings, all of which are straight windings between the first plane and the second plane, and are perpendicular to the first plane or the second plane. Each winding is a single turn, and the current flows in the same direction in each winding. The first plane and the second plane are parallel.

[0007] The magnetic core includes a first magnetic core, a second magnetic core, and magnetic core posts. The first and second magnetic cores are located at the two ends of the winding, respectively. The magnetic core posts connect the first and second magnetic cores. There are multiple magnetic core posts, which together with the first and second magnetic cores form multiple magnetic core units. The magnetic core units are arranged corresponding to the windings. The multiple magnetic core units extend from the first plane around the corresponding windings to the second plane in the same direction. The projections of the multiple magnetic core units on the first plane perpendicular to the windings form multiple closed areas. The closed areas are arranged one-to-one with the windings.

[0008] The half-bridge modules are connected to the windings one-to-one, and the midpoint of the bridge arm of each half-bridge module is electrically coupled to the first end of the corresponding winding.

[0009] In one embodiment of the invention, the midpoint of the bridge arm in the half-bridge module at least partially overlaps with the vertical projection of the corresponding winding on the first plane.

[0010] In one embodiment of the present invention, the power module further includes:

[0011] The wiring layer is located between the anti-coupled inductor and the half-bridge module.

[0012] In one embodiment of the present invention, the wiring layer includes a first conductive layer and a second conductive layer, the first conductive layer being connected to the positive input pin and the second conductive layer being connected to the negative input pin.

[0013] In one embodiment of the present invention, a plurality of conductive portions are provided on the wiring layer, one end of the conductive portion is electrically connected to the midpoint of the bridge arm in the corresponding half-bridge module, and the other end of the conductive portion is connected to the first end of the corresponding winding.

[0014] In one embodiment of the present invention, a plurality of vias are provided on both the first conductive layer and the second conductive layer, and a plurality of conductive portions pass through the vias one by one.

[0015] In one embodiment of the present invention, the anti-coupling inductor is a three-winding anti-coupling inductor, with the three windings arranged in an array. The array arrangement of the three windings is either an equilateral triangle arrangement or a right triangle arrangement, and a reserved space is formed in the power module. The power module further includes a controller and peripheral electronic devices, which are disposed in the reserved space.

[0016] The peripheral electronic components are located on one side of the wiring layer, and the controller is located on the other side of the wiring layer.

[0017] In one embodiment of the invention, all components on at least one side of the wiring layer are injection molded.

[0018] In one embodiment of the present invention, the power module further includes:

[0019] Multiple vertical conductive lines enable the power module to connect to external circuits for input and signal connections.

[0020] In one embodiment of the present invention, the vertical conductive line is disposed in the reserved space or on the outer periphery of the anti-coupled inductor.

[0021] In one embodiment of the present invention, the vertical conductive line includes: an input positive conductive line and an input negative conductive line, wherein the input positive conductive line and the input negative conductive line are concentrically nested and insulated from each other.

[0022] In one embodiment of the present invention, the positive input conductive line and the negative input conductive line are respectively formed into a positive input pin and a negative input pin through a solder pad.

[0023] In one embodiment of the present invention, vertical conductive lines are disposed on the outside of the encapsulated magnetic core unit.

[0024] In one embodiment of the present invention, the vertical conductive line includes: an input positive conductive line and an input negative conductive line, wherein the input positive conductive line and the input negative conductive line are alternately arranged.

[0025] In one embodiment of the present invention, the positive input conductive line and the negative input conductive line are respectively formed into a positive input pin and a negative input pin through a stamp hole pad.

[0026] In one embodiment of the present invention, the power module further includes:

[0027] The capacitor layer is located on the side of the anti-coupled inductor away from the half-bridge module.

[0028] In one embodiment of the present invention, the power module further includes:

[0029] A conductive circuit module is arranged adjacent to an anti-coupling inductor. The conductive circuit module includes multiple vertical conductive circuits, and adjacent vertical conductive circuits are insulated from each other.

[0030] In one embodiment of the present invention, the power module further includes:

[0031] A copper block is placed adjacent to an anti-coupling inductor, and the copper block is soldered to the wiring layer.

[0032] In one embodiment of the present invention, the power module further includes:

[0033] Irregularly shaped circuit board, connected to the wiring layer;

[0034] The irregularly shaped circuit board has a groove, and the magnetic core is placed in the groove.

[0035] In one embodiment of the present invention, a plurality of vertical conductive lines are provided in the irregularly shaped circuit board, and at least two of the plurality of vertical conductive lines pass through their respective corresponding magnetic core units to form windings.

[0036] In one embodiment of the present invention, the second ends of the windings are connected together via solder pads to form an output positive pin; or

[0037] The second end of the winding forms multiple positive output pins through multiple solder pads.

[0038] In one embodiment of the present invention, both the first magnetic core and the second magnetic core are E-type magnetic core structures.

[0039] In one embodiment of the present invention, the half-bridge modules are respectively disposed in their respective chips, or multiple half-bridge modules are integrated into one chip.

[0040] In one embodiment of the present invention, multiple half-bridge modules are provided with anti-coupled inductors on the upper or lower side.

[0041] According to a second aspect of the present invention, a power supply system is provided, comprising:

[0042] The aforementioned power module; system circuit board;

[0043] The load is located on the first side of the system circuit board.

[0044] The power module is disposed on the first side of the system circuit board and is located around the load; and / or, the power module is disposed on the second side of the system circuit board and its projection on the plane at least partially overlaps with the load.

[0045] According to a third aspect of the present invention, a method for manufacturing a power module is provided, comprising:

[0046] Multiple half-bridge modules are available;

[0047] Multiple windings are provided, all of which are straight windings between the first plane and the second plane and are perpendicular to the first plane or the second plane. All windings are single-turn, and the first plane and the second plane are parallel.

[0048] A magnetic core is provided, comprising a first magnetic core, a second magnetic core, and magnetic core posts. The first and second magnetic cores are located at the two ends of the winding, respectively. The magnetic core posts connect the first and second magnetic cores. There are multiple magnetic core posts, which together with the first and second magnetic cores form multiple magnetic core units. The magnetic core units are arranged correspondingly to the windings. The multiple magnetic core units extend from a first plane around the corresponding windings to a second plane in the same direction. The projections of the multiple magnetic core units on the first plane perpendicular to the windings form multiple closed regions, and the closed regions are arranged one-to-one with the windings. Among them, the half-bridge modules are connected one-to-one with the windings, and the midpoint of the bridge arm in each half-bridge module is electrically coupled to the first end of the corresponding winding.

[0049] In one embodiment of the present invention, multiple windings and a magnetic core form an anti-coupled inductor, and the manufacturing method further includes:

[0050] Multiple anti-coupled inductors are configured as a continuous inductor plate;

[0051] A wiring layer is formed on the inductor cascade;

[0052] Place the half-bridge module on the wiring layer;

[0053] It is encapsulated using insulating encapsulating material.

[0054] In one embodiment of the present invention, it further includes:

[0055] Forming a wiring layer on the wafer;

[0056] A first magnetic material layer is formed on the wiring layer;

[0057] A first isolation layer is disposed on the first magnetic material layer, and a through hole is formed on the first isolation layer to expose a portion of the first magnetic material layer;

[0058] A second magnetic material layer is disposed on the first isolation layer, and the second magnetic material layer fills the through-hole, so that the magnetic circuits of the first magnetic material layer and the second magnetic material layer are connected.

[0059] Conductive vias are provided, which penetrate the second magnetic material layer, the first isolation layer, and are electrically connected to the wiring layer of the first magnetic material layer; wherein, the conductive vias form a winding, the first magnetic material layer and the second magnetic material layer form a magnetic core, and the half-bridge module is integrated in the wafer;

[0060] The power supply is cut into multiple discrete power modules.

[0061] In one embodiment of the present invention, it further includes:

[0062] Before forming a conductive via,

[0063] A second isolation layer is also provided on the second magnetic material layer to fill the gaps in the second magnetic material layer;

[0064] The conductive vias penetrate the second isolation layer, the second magnetic material layer, the first isolation layer, and are electrically connected to the wiring layer.

[0065] In one embodiment of the present invention, it further includes:

[0066] Before forming multiple discrete power modules, a capacitor layer is formed on the second isolation layer.

[0067] In one embodiment of the present invention, the first magnetic material layer and the second magnetic material layer are prefabricated magnetic core plates or films, or the first magnetic material layer and the second magnetic material layer are formed by printing or sputtering.

[0068] According to a fourth aspect of the present invention, a multi-opposite-coupled inductor is provided, comprising:

[0069] Two windings, both of which are straight windings between the first plane and the second plane, with the first plane and the second plane being parallel;

[0070] The magnetic core includes a first magnetic core, a second magnetic core, and magnetic core posts. The first and second magnetic cores are located at the two ends of the winding, respectively. The magnetic core posts connect the first and second magnetic cores. There are multiple magnetic core posts, which together with the first and second magnetic cores form two magnetic core units. The magnetic core units are arranged in a one-to-one correspondence with the windings. Both magnetic core units extend from the first plane around the corresponding windings to the second plane in the same direction. The projections of the two magnetic core units on the first plane perpendicular to the windings enclose multiple closed areas, which are respectively arranged in a corresponding manner to the windings.

[0071] Both the first and second magnetic cores are S-shaped magnetic core structures.

[0072] In one embodiment of the present invention, there is at least one core connection plane between the first magnetic core, the core column and the second magnetic core, and the connection plane is perpendicular to the axis of the winding.

[0073] In one embodiment of the present invention, the first magnetic core and the second magnetic core are components with the same shape.

[0074] In one embodiment of the present invention, the magnetic core column is integrally formed with at least one of the first magnetic core and the second magnetic core; or, a portion of the magnetic core column is integrally formed with the first magnetic core, and another portion of the magnetic core column is integrally formed with the second magnetic core.

[0075] According to a fifth aspect of the present invention, a multi-opposed coupled inductor is provided, comprising:

[0076] Multiple windings, all of which are straight windings between the first plane and the second plane, with the first plane and the second plane being parallel;

[0077] The magnetic core includes a first magnetic core, a second magnetic core, and magnetic core posts. The first and second magnetic cores are located at the two ends of the winding, respectively. The magnetic core posts connect the first and second magnetic cores. There are multiple magnetic core posts, which together with the first and second magnetic cores form multiple magnetic core units. The magnetic core units are arranged one-to-one with the windings. The multiple magnetic core units extend from the first plane around the corresponding windings to the second plane in the same direction. The projections of the multiple magnetic core units on the first plane perpendicular to the windings form multiple closed regions, and the closed regions are respectively arranged corresponding to the windings.

[0078] The winding has at least three windings. The first magnetic core includes a first common magnetic post, and multiple first transverse magnetic posts are vertically led out from the first common magnetic post. The second magnetic core includes a second common magnetic post, and multiple second transverse magnetic posts are vertically led out from the second common magnetic post. The magnetic core posts are respectively arranged corresponding to the first transverse magnetic posts and the second transverse magnetic posts, and are respectively connected to form a magnetic circuit.

[0079] In one embodiment of the present invention, there is at least one core connection plane between the first magnetic core, the core column and the second magnetic core, and the connection plane is perpendicular to the axis of the winding.

[0080] In one embodiment of the present invention, the first magnetic core and the second magnetic core are components with the same shape.

[0081] In one embodiment of the present invention, the magnetic core column is integrally formed with at least one of the first magnetic core and the second magnetic core; or, a portion of the magnetic core column is integrally formed with the first magnetic core, and another portion of the magnetic core column is integrally formed with the second magnetic core.

[0082] The power module of the present invention can achieve multiple anti-coupled parallel power supply through anti-coupled inductors and multiple half-bridge modules. The anti-coupled inductor structure composed of magnetic core and winding is relatively simple, and the linear winding is not only simple in structure, but also has a short output path, thereby improving the efficiency of the power module. Attached Figure Description

[0083] The various objectives, features, and advantages of this disclosure will become more apparent from the following detailed description of preferred embodiments of the disclosure taken in conjunction with the accompanying drawings. The drawings are merely illustrative illustrations of the present disclosure and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts. Wherein:

[0084] Figure 1 This is a schematic diagram of the structure of a power module according to the first exemplary embodiment;

[0085] Figure 2 This is an exploded structural diagram of a power module according to a second exemplary embodiment;

[0086] Figure 3This is a schematic diagram of the structure of a power module according to a second exemplary embodiment;

[0087] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure at the middle GG point;

[0088] Figure 5 This is a schematic diagram of the structure of a power module according to a third exemplary embodiment;

[0089] Figure 6 yes Figure 5 Schematic diagram of the cross-sectional structure at point BB;

[0090] Figure 7 This is a schematic diagram of the structure of a power module according to a fourth exemplary embodiment;

[0091] Figure 8 This is a schematic diagram of the structure of a power module according to the fifth exemplary embodiment;

[0092] Figure 9 yes Figure 8 Schematic diagram of the cross-sectional structure at point DD;

[0093] Figure 10 This is a schematic diagram of the structure of a power module according to the sixth exemplary embodiment;

[0094] Figure 11 yes Figure 10 Schematic diagram of the cross-sectional structure at the middle EE;

[0095] Figure 12 This is a schematic diagram of the structure of a power module according to the seventh exemplary embodiment;

[0096] Figure 13 yes Figure 12 Schematic diagram of the cross-sectional structure at the middle FF point;

[0097] Figure 14 This is a schematic diagram of the structure of a power module according to the eighth exemplary embodiment;

[0098] Figure 15 This is a schematic diagram of the structure of a first wiring layer or a second wiring layer of a power module according to an exemplary embodiment;

[0099] Figure 16 This is a schematic diagram of the structure of a power module according to the ninth exemplary embodiment;

[0100] Figure 17 This is a schematic diagram of the structure of a power module according to the tenth exemplary embodiment;

[0101] Figure 18 This is a schematic diagram of the structure of a power module according to the eleventh exemplary embodiment;

[0102] Figure 19 This is a schematic diagram of the structure of a power module according to the twelfth exemplary embodiment;

[0103] Figure 20 This is a schematic diagram of the structure of a power module according to the thirteenth exemplary embodiment;

[0104] Figure 21 This is a first structural schematic diagram of a circuit board for a power module according to an exemplary embodiment;

[0105] Figure 22 This is a second structural schematic diagram of a circuit board for a power module according to an exemplary embodiment;

[0106] Figure 23 This is an exploded view of a power module according to the fourteenth exemplary embodiment;

[0107] Figure 24 This is a partially exploded structural diagram of a power module according to the fourteenth exemplary embodiment;

[0108] Figure 25 This is a schematic diagram of the structure of a power module according to the fourteenth exemplary embodiment;

[0109] Figure 26 This is a schematic diagram of the structure of a power module according to the fifteenth exemplary embodiment;

[0110] Figure 27 This is a bottom view of a power module according to the sixteenth exemplary embodiment;

[0111] Figure 28 This is a schematic diagram of the structure of a power module according to the sixteenth exemplary embodiment;

[0112] Figure 29 This is a top view of a power module according to the seventeenth exemplary embodiment;

[0113] Figure 30 This is a bottom view of a power module according to the seventeenth exemplary embodiment;

[0114] Figure 31 This is a schematic diagram of the structure of a power module according to the eighteenth exemplary embodiment;

[0115] Figure 32 This is a schematic diagram of the structure of a power module according to the nineteenth exemplary embodiment;

[0116] Figure 33 This is a flowchart illustrating a method for manufacturing a power module according to a first exemplary embodiment;

[0117] Figure 34 This is a flowchart illustrating a method for manufacturing a power module according to a second exemplary embodiment;

[0118] Figure 35 This is a schematic diagram of the structure of a power module obtained according to a method for manufacturing a power module according to a second exemplary embodiment;

[0119] Figure 36 This is a schematic diagram of the exploded structure of a multi-opposite-coupled inductor according to the first exemplary embodiment;

[0120] Figure 37 This is a schematic diagram of the structure of a multi-opposite-coupled inductor according to the first exemplary embodiment;

[0121] Figure 38 This is an exploded structural diagram of a multi-opposite-coupled inductor according to a second exemplary embodiment;

[0122] Figure 39 This is a schematic diagram of the exploded structure of a multi-opposite-coupled inductor according to a third exemplary embodiment;

[0123] Figure 40 This is a schematic diagram of the exploded structure of a multi-opposite-coupled inductor according to the fourth exemplary embodiment;

[0124] Figure 41 This is an exploded structural diagram of a multi-opposite-coupled inductor according to the fifth exemplary embodiment;

[0125] Figure 42 This is an exploded structural diagram of a multi-opposite-coupled inductor according to the sixth exemplary embodiment;

[0126] Figure 43 This is a schematic diagram of the exploded structure of a multi-opposite-coupled inductor according to the seventh exemplary embodiment;

[0127] Figure 44 This is a schematic diagram of the structure of a multi-opposite-coupled inductor according to the seventh exemplary embodiment;

[0128] Figure 45 This is a schematic diagram of the structure of a multi-opposite-coupled inductor according to the eighth exemplary embodiment;

[0129] Figure 46 This is an exploded structural diagram of a multi-opposite-coupled inductor according to the eighth exemplary embodiment;

[0130] Figure 47 This is a schematic diagram of the exploded structure of a multi-opposite-coupled inductor according to the ninth exemplary embodiment;

[0131] Figure 48 This is an exploded structural diagram of a multi-opposite-coupled inductor according to the tenth exemplary embodiment;

[0132] Figure 49 This is a schematic diagram of a structure of multiple oppositely coupled inductors according to the tenth exemplary embodiment;

[0133] Figure 50 This is a schematic diagram of a structure of multiple oppositely coupled inductors from a second perspective, according to the eleventh exemplary embodiment;

[0134] Figure 51 This is a schematic diagram of the structure of a multi-opposite-coupled inductor according to the twelfth exemplary embodiment;

[0135] Figure 52 This is a schematic diagram of the structure of a multi-opposite-coupled inductor from a second perspective, according to the thirteenth exemplary embodiment;

[0136] Figure 53 This is a schematic diagram of the structure of a multi-opposite-coupled inductor according to the fourteenth exemplary embodiment;

[0137] Figure 54 This is a schematic diagram of the structure of a multi-opposite-coupled inductor according to the fifteenth exemplary embodiment;

[0138] Figure 55 This is a schematic diagram of a structure of multiple oppositely coupled inductors according to the sixteenth exemplary embodiment;

[0139] Figure 56 yes Figure 55 A schematic diagram of the cross-sectional structure at point AA;

[0140] Figure 57 This is a schematic diagram of a multiphase Buck circuit;

[0141] Figure 58 This is a schematic diagram of a multiphase Boost circuit.

[0142] Figure 59 A schematic diagram of a multiphase parallel four-switch Buck / Boost circuit;

[0143] Figure 60 This is a schematic diagram of a multiphase parallel Buck / Boost circuit;

[0144] Figure 61 This is a schematic diagram of a power supply system according to an exemplary embodiment.

[0145] The annotations in the attached figures are explained as follows:

[0146] 10. Winding; 20. Magnetic core; 21. First magnetic core; 212. First common magnetic post; 213. First transverse magnetic post; 214. Third transverse magnetic post; 22. Second magnetic core; 222. Second common magnetic post; 223. Second transverse magnetic post; 224. Fourth transverse magnetic post; 23. Magnetic core pillar; 24. Enclosed area; 25. Conductive plate; 42. Conductive via;

[0147] 1. Anti-coupled inductor; 2. Half-bridge module; 2'. Chip; 3. Half-bridge circuit area; 4. Control area; 50. Wiring layer; 51. Controller; 52. Capacitor; 53. Resistor; 54. Package layer; 55. Conductive via; 56. Vertical conductive line; 561. Input positive conductive line; 562. Input negative conductive line; 57. Input positive pin; 571. First conductive layer; 572. Via; 58. Input negative pin; 581. Second conductive layer; 59. Signal conductive line; 60. Capacitor layer; 61. Solder joint; 62. Conductive circuit module; 64. Insulating material layer; 65. Copper block; 66. Circuit board; 661. Groove; 67. Conductor; 68. Isolator plate; 71. Connection pin; 72. Output positive pin; 73. Solder pad; 74. Wafer; 75. First magnetic material layer; 76. First isolation layer; 77. Through hole; 78. Second magnetic material layer; 79. Second isolation layer; 80. Conductive via; 81. Insulating encapsulant; 82. Cutting line; 100. Power module; 110. System circuit board; 120. Load. Detailed Implementation

[0148] Typical embodiments embodying the features and advantages of this disclosure will be described in detail in the following description. It should be understood that this disclosure can have various variations in different embodiments without departing from the scope of this disclosure, and the descriptions and drawings therein are illustrative in nature and not intended to limit this disclosure.

[0149] In the following description of various exemplary embodiments of this disclosure, reference is made to the accompanying drawings, which form part of this disclosure, and which illustrate by way of example different exemplary structures, systems, and steps that may implement various aspects of this disclosure. It should be understood that other specific embodiments of the components, structures, exemplary devices, systems, and steps may be used, and structural and functional modifications may be made without departing from the scope of this disclosure. Furthermore, while the terms “above,” “between,” “within,” etc., may be used in this specification to describe different exemplary features and elements of this disclosure, these terms are used herein only for convenience, such as according to the orientation of the examples in the accompanying drawings. Nothing in this specification should be construed as requiring a specific three-dimensional orientation of the structure to fall within the scope of this disclosure.

[0150] One embodiment of the present invention provides a power module, please refer to... Figures 1 to 32 The power module includes an anti-coupling inductor 1 and multiple half-bridge modules 2 disposed on the anti-coupling inductor 1. The anti-coupling inductor 1 includes multiple windings 10, each winding 10 being a straight winding between a first plane and a second plane, and perpendicular to either the first or second plane, wherein the first and second planes are parallel; and each winding 10 is a single-turn winding, with the current flowing in the same direction in each winding 10; that is, the current in each winding 10 flows from the first plane to the second plane, or from the second plane to the first plane. Further, as... Figure 2 As shown, the anti-coupled inductor 1 further includes: a magnetic core 20, which includes a first magnetic core 21, a second magnetic core 22, and magnetic core posts 23. The first magnetic core 21 and the second magnetic core 22 are located at the two ends of the winding 10, respectively. The magnetic core posts 23 connect the first magnetic core 21 and the second magnetic core 22. There are multiple magnetic core posts 23, which together with the first magnetic core 21 and the second magnetic core 22 form multiple magnetic core units. The magnetic core units are correspondingly arranged with the winding 10. The multiple magnetic core units extend from the first plane around the corresponding winding 10 to the second plane in the same direction. The projections of the multiple magnetic core units on the first plane perpendicular to the winding 10 form multiple closed regions 24. The closed regions 24 are arranged one-to-one with the winding 10. Among them, the half-bridge modules 2 are connected one-to-one with the winding 10, and the midpoint of each half-bridge module 2 arm (e.g., Figure 57 The SW point in the circuit is electrically coupled to the first end of the corresponding winding 10. The half-bridge module 2 is generally formed by two switches to form a half-bridge circuit. The connection point of the two switches (i.e., the midpoint) is the SW terminal, which can be electrically connected to one end of the winding 10 of the anti-coupled inductor 1.

[0151] In one embodiment, winding 10 can transmit current through multiple vias, or winding 10 can be composed of multiple windings connected in parallel, but it is still equivalent to a single winding 10. This invention is not limited to this. Furthermore, multiple half-bridge modules 2 are provided on the upper or lower side of the anti-coupling inductor 1.

[0152] Furthermore, in one embodiment, the midpoint of the bridge arm in the half-bridge module 2 at least partially overlaps with the vertical projection of the corresponding winding 10 on the first plane, thereby ensuring that the midpoint of the bridge arm in each half-bridge module 2 is electrically coupled to the first end of the corresponding winding 10, so that the output path of the midpoint of the bridge arm in the half-bridge module 2 is minimized, further reducing losses.

[0153] In one embodiment of the present invention, the power module enables multi-phase anti-coupled parallel power supply through an anti-coupled inductor 1 and multiple half-bridge modules 2. The anti-coupled inductor 1, composed of a magnetic core 20 and windings 10, has a relatively simple structure. The windings 10 of the anti-coupled inductor 1 in the power module are vertical and short, resulting in a short output path, low loss, small size, good vertical heat dissipation, a simple and compact structure, high power density, and good manufacturability. The anti-coupled inductor 1 can separate dynamic and static inductance. The same inductor can achieve a smaller inductance during dynamic operation, improving response speed, while increasing the inductance during static operation, achieving a smaller ripple current, thus balancing dynamic response capability and low static ripple. Furthermore, the volume can be reduced or efficiency improved through magnetic integration and the cancellation of reverse magnetic flux. Moreover, multiple anti-coupled inductors with more than two phases can further improve system efficiency, reduce size, and enhance dynamic performance, and can further reduce the number of output capacitors required by the power supply module.

[0154] In one embodiment, the half-bridge modules 2 are respectively disposed in their respective chips, or multiple half-bridge modules 2 are integrated into one chip. For example, in some embodiments, the power supply module includes an anti-coupled inductor 1 and a chip disposed on the upper surface of the anti-coupled inductor 1, the chip forming at least a two-phase half-bridge circuit (or the chip having two half-bridge modules 2), the midpoint of the half-bridge circuit being respectively connected to the first end of the corresponding winding 10 of the anti-coupled inductor 1. Figure 2 Taking the anti-coupled inductor shown as an example, each winding 10 can be considered to be surrounded by a core unit extending from the lower surface of the anti-coupled inductor 1 to the upper surface of the anti-coupled inductor 1 in the same direction. For example Figure 2 The double-dotted line in the diagram illustrates the leftmost magnetic core unit. For example, with three magnetic core units, the first ends of all core units are connected together on the lower surface of the anti-coupled inductor 1, and the second ends of all core units are connected together on the upper surface of the anti-coupled inductor 1. The vertical projections of the first and second ends of each core unit in the horizontal plane overlap, and the first and second ends of each core unit are spaced apart from each other. Furthermore, three half-bridge modules 2 can be disposed on the upper surface of the anti-coupled inductor, and the midpoints of the half-bridge arms in the half-bridge modules 2 are electrically connected to the first ends of the corresponding windings 10 of the anti-coupled inductor 1.

[0155] In one embodiment, such as Figure 1As shown, the power module also includes a wiring layer 50, which is disposed between the anti-coupled inductor 1 and the half-bridge module 2. The wiring layer 50 is used to connect the terminals of the half-bridge module 2 to the external connection pins of the entire power module, such as input, output pins, control signal pins, and various parameter sampling signal pins. Further, the wiring layer 50 is used to connect the midpoint SW of the bridge arm in the half-bridge module 2 to the first end of the corresponding winding 10 of the anti-coupled inductor 1. For example, the wiring layer 50 is provided with multiple conductive portions 67, one end of which is electrically connected to the midpoint of the corresponding bridge arm in the half-bridge module 2, and the other end of which is connected to the first end of the corresponding winding 10. The conductive portions 67 can be formed by vias, etc., and this application does not limit the comparison. The wiring layer 50 can be implemented in various ways, such as a metallization layer or redistribution layer (RDL) formed on the half-bridge module 2, a metallization layer formed on the upper surface of the anti-coupled inductor 1, or a printed circuit board (PCB). Alternatively, vertical conductive lines 56 can be provided on the side surface of the power module to connect the external connection pins of the power module to the corresponding conductive lines in the wiring layer 50, thereby reducing the volume occupied by the circuit connection.

[0156] In one embodiment, such as Figure 3 and Figure 4 As shown, Figure 3 The anti-coupling inductor 1 of the power supply module is a structure in which multiple windings 10 (e.g., 3) are arranged in a straight line, and 3 chips 2' (or half-bridge module 2) are arranged in a straight line and stacked with the corresponding windings 10 respectively. Figure 4 for Figure 3 Along the cross-sectional view of GG, this structure can be used in Figure 3 The left side is provided with a vertical conductive line 56, for example, an input positive conductive line 561 and an input negative conductive line 562 can be provided. The input positive conductive line 561 and the input negative conductive line 562 form an input positive pin 57 and an input negative pin 58 on the lower surface of the power module; and this structure can facilitate the placement of the electrical load 120 on the right side of the power module.

[0157] like Figure 5 The diagram shows a top view of a power module according to an embodiment of this application. The power module includes two oppositely coupled inductors, and two half-bridge modules 2 are disposed on the upper surfaces of the oppositely coupled inductors. The half-bridge modules 2 are respectively disposed corresponding to the windings 10 of the two oppositely coupled inductors 1. Furthermore, the half-bridge modules 2 and the windings 10 overlap in projection; this arrangement results in a short output path at the midpoint of each half-bridge circuit and a compact structure. Figure 6 yes Figure 5A cross-sectional view along the middle BB. In this half-bridge module 2, the midpoint SW of the bridge arm is connected to the winding 10 via a conductor 67 in the wiring layer 50. In this embodiment, the midpoint SW of the bridge arm in the half-bridge module 2 is directly and linearly connected to the winding, minimizing the output path at the midpoint of each half-bridge circuit and resulting in the most compact structure.

[0158] In some embodiments, the power module may also be provided with multiple anti-coupling circuits. Figure 7 It can also be shown that two oppositely coupled circuits can be set in the same power module. Furthermore, the power module also includes two chips 2', each chip 2' has four switches to form two half-bridge circuits, each chip 2' and the anti-coupled inductor 1 form two oppositely coupled circuits, and both chips 2' can be set on the upper surface of the same wiring layer 50, and both anti-coupled inductors 1 are set on the lower surface of the wiring layer 50, forming a power module with multiple anti-coupled circuits.

[0159] In one embodiment, the anti-coupling inductor 1 is a three-winding anti-coupling inductor with three windings 10 arranged in an array. The array arrangement of the three windings 10 is either an equilateral triangle or a right triangle, and a reserved space is formed within the power module (i.e., the anti-coupling inductor does not occupy space within the footprint of the rectangular power module). The power module also includes a controller 51 and peripheral electronic components, housed within the reserved space. The peripheral electronic components can be located on one side of the wiring layer 50, and the controller 51 can be located on the other side of the wiring layer 50. The power module, in addition to integrating the anti-coupling inductor and the half-bridge module 2, can also integrate the controller 51 and other peripheral electronic components, and the spatial arrangement between the various components is relatively reasonable.

[0160] like Figure 8 and Figure 9 As shown, Figure 9 yes Figure 8 The cross-sectional structural diagram at point DD shows a three-way anti-coupled power module. The three anti-coupled inductors are arranged in an equilateral triangle shape and include passive components such as anti-coupled inductor 1 and wiring layer 50. Anti-coupled inductor 1 includes a magnetic core 20 and winding 10. Chip 2' includes six switches, forming three half-bridge circuits. The midpoint of each half-bridge circuit is electrically connected to the corresponding winding 10. Ideally, the midpoint of each half-bridge circuit overlaps with the projection of the corresponding winding 10 on the upper surface of the power module. The array distribution of the three windings 10 in an equilateral triangle arrangement ensures balanced coupling among the three anti-coupled inductors 1, improving the output performance, dynamic performance, and efficiency of the multi-way anti-coupled power module and facilitating increased power density.

[0161] In one embodiment, such as Figures 10 to 13As shown, the power module is a 3-way anti-coupled power module, with the magnetic cores 20 arranged in an L-shaped array. Figure 10 The upper left corner can be left empty (i.e., reserved space), for example, to set up controller 51 and other devices, such as capacitor 52 or resistor 53, etc. Figure 11 As shown, the controller 51 can be located on the lower side of the wiring layer 50, that is, the controller 51 and the anti-coupling inductor are located on one side. Peripheral components of the controller, such as capacitor 52 and resistor 53, can be located in the area above the controller 51 on the wiring layer 50. Alternatively, peripheral components of each chip 2', such as capacitors or resistors, can also be located. Figure 10 and 11 In the illustrated implementation, the controller 51 can also be positioned on the upper side of the wiring layer 50, such as... Figure 12 As shown, the specific layout can be adjusted according to the application. In general, this layout can improve the power density of multi-phase power modules (such as 3-phase) and can well integrate controllers or other circuits, such as current sampling circuits or communication circuits.

[0162] In some embodiments, a vertical conductive line 56 may also be provided in the reserved space, such as... Figure 10 and Figure 11 As shown, the vertical conductive line 56 in this area can be used as the output line of chip 2', thus making the input loops of each chip 2' shorter and more consistent. In some embodiments, the vertical conductive line 56 may include an input positive conductive line 561 and an input negative conductive line 562 (Vin conductive line and GND conductive line) as well as a signal conductive line 59.

[0163] Furthermore, in some embodiments, Figure 13 The chip 2' shown can also integrate a half-bridge circuit and a drive circuit. For example, a half-bridge circuit region and a drive region can be provided in the chip 2'. The half-bridge circuit region can correspond to the magnetic core 20, and the drive region can correspond to the reserved space. The drive region is provided with the drive circuit or signal processing circuit of the half-bridge circuit, etc. The midpoint of the half-bridge circuit in the half-bridge circuit region is electrically connected to the corresponding winding 10, thus forming a more compact structure. Other devices, such as capacitors 52 or resistors 53, can be placed on the lower side of the wiring layer 50 corresponding to the drive region.

[0164] Furthermore, in some embodiments, the lower surface of the wiring layer 50 can be encapsulated with an insulating encapsulant to form an encapsulation layer 54, improving the overall structural stability and strength, and facilitating the protection of the anti-coupling inductor 1, capacitor 52, and resistor 53, etc. Additionally, conductive vias 55 can be fabricated in the insulating encapsulant. These vias directly form the winding 10 of the anti-coupling inductor 1. The upper end of the conductive via 55 is electrically connected to the midpoint of the half-bridge circuit in the half-bridge circuit region through the wiring layer. The other end (lower end) of the conductive via 55 is led out on the lower surface of the power module and can serve as an output pin of the power module. This approach simplifies the anti-coupling inductor structure and improves the power density of the power module.

[0165] In some embodiments, a vertical conductive line 56 may also be provided in the insulating encapsulation material. Specifically, an input positive conductive line 561 and an input negative conductive line 562 (Vin conductive line and GND conductive line) may also be provided in the insulating encapsulation material. The input positive conductive line 561 and the input negative conductive line 562 are concentrically nested and are insulated from each other, for example, by providing an insulating material between them or by directly insulating them through the insulating encapsulation material. The input positive conductive line 561 can be used for the connection of the input circuit, and the input negative conductive line 562 can be connected to the negative terminal of the circuit. This structure makes the input positive conductive line 561 less susceptible to interference from the nearby anti-coupling inductor 1, thereby improving the stability and reliability of the power module. Of course, the vertical conductive line 56 can also be used as a signal conductive line, which is not limited in this application. Overall, the chip 2' of the power module of the present invention can be flexibly configured according to actual applications. Of course, the upper surface of the wiring layer 50 can also be encapsulated.

[0166] In one embodiment, such as Figures 14 to 16 This diagram illustrates a power module arranged in a 3x3 array. Figure 14 This is a cross-sectional view of the power module. The wiring layer 50 includes a first conductive layer 571 and a second conductive layer 581, which can be used as an input circuit Vin layer or GND layer, for example. The first conductive layer 571 is connected to the input positive pin 57 through the input positive conductive line 561, and the second conductive layer 581 is connected to the input negative pin 58 through the input negative conductive line 562. Figure 15 The diagram illustrates either a first conductive layer 571 or a second conductive layer 581. Either the first conductive layer 571 or the second conductive layer 581 can be a whole layer of conductive circuitry. A via 572 is provided between the whole layer of the first conductive layer 571 and the second conductive layer 581 to avoid the conductive part 67 that connects the midpoint of each phase half-bridge circuit to the corresponding winding 10. Figure 16The above is a bottom view of the power module. For example, the second end of the winding 10 can be directly led out to the output positive pin 72 (e.g., Vo1-Vo9 in the figure) on the lower surface of the power module through multiple solder pads. Of course, Vo1 to Vo9 can also be electrically connected together to form a large output positive pin through a solder pad (e.g., directly forming a large Vo).

[0167] Furthermore, such as Figure 16 As shown, the positive input pin 57 and the negative input pin 58 (positive input conductive line 561, negative input conductive line 562) and the signal conductive line 59 can be disposed on the periphery of the power module and electrically connected to the corresponding conductive lines in the wiring layer 50. In one embodiment, for example, these pins or conductive vias can be connected using a perforated hole method, or vertical conductive vias can be used, i.e., not exposed on the side of the power module. Furthermore, the positive input pin 57 and the negative input pin 58 (positive input conductive line 561, negative input conductive line 562) can also be arranged in an alternating manner. Using a large-area copper-plated structure can increase the conductive area of ​​the Vin or GND conductive lines, thereby reducing impedance and losses; and by arranging the Vin and GND conductive lines in an alternating manner, the parasitic inductance of the input circuit can be further reduced, which is beneficial to improving the high-frequency performance of the power module. Moreover, this structure is simple and compact, with high power density.

[0168] In one embodiment, the power module further includes a capacitor layer 60, which is disposed on the side of the anti-coupled inductor 1 away from the chip 2'. Figure 17 As shown, a capacitor layer 60 is disposed below the anti-coupling inductor 1. The capacitor layer 60 includes multiple capacitors 52. For example, capacitor 52 serves as the output capacitor Co of the power module, and capacitor 52 is connected to the output positive pin 72 formed by winding 10. Of course, in other embodiments, capacitor 52 can also serve as the input capacitor Cin of the input circuit. Figure 18 The capacitor layer 60 can also be a single-layer structure with multiple terminals that connect to the input or output pins of the power module. Using such a capacitor layer allows for a more compact structure or a larger capacitance value. Additionally... Figure 18 The diagram also shows that insulating encapsulant can be used on the upper side of wiring layer 50 to encapsulate chip 2' and capacitor 52, etc., to form encapsulation layer 54, which improves the reliability of the module and facilitates the installation of heat sink on the upper surface, thus promoting heat dissipation. Figure 18 It is also shown that a vertical conductive line 56 is set on the side of the power module to realize the electrical connection between the capacitor layer 60 and the corresponding conductive line in the wiring layer 50. Of course, the vertical conductive line 56 can also be used to connect the external pins of the power module.

[0169] In one embodiment, such as Figure 19The schematic diagram shows that the wiring layer 50 can be a printed circuit board (PCB), and a half-bridge module 2 or peripheral devices such as capacitors can be placed on its upper surface. An anti-coupling inductor 1 is placed on the lower surface of the wiring layer 50. For example, the upper ends of each winding 10 of the anti-coupling inductor 1 are soldered to the corresponding pads on the lower surface of the wiring layer 50 via solder points 61. A conductive line module 62 can also be placed next to the anti-coupling inductor 1. The conductive line module 62 includes vertical conductive lines 56, and multiple vertical conductive lines 56 can be formed within one conductive line module 62. Multiple vertical conductive lines 56 are separated by an insulating material layer 64. For example, these vertical conductive lines 56 can serve as Vin conductive lines, GND conductive lines, or signal lines, etc. The conductive line module 62 can also be soldered to the wiring layer 50 via solder points 61. In one embodiment, a copper block 65 can also be placed, which can also be connected to the wiring layer 50 via solder points 61. Of course, other devices, such as capacitors 52, can also be placed in the gaps next to the anti-coupling inductor 1. This structure is simple and easy to manufacture, mainly using conventional SMT and reflow soldering processes, which helps to reduce costs.

[0170] In one embodiment, such as Figure 20 As shown, the half-bridge module 2 or chip 2' can also be embedded within the wiring layer 50, facilitating interconnection between multiple chips 2' and improving structural compactness. Capacitors 52 can also be placed between chips 2', for example as input capacitor Cin. Multiple half-bridge circuits can share this capacitor 52, reducing ripple in the input loops between multiple half-bridge circuits. Furthermore, Figure 20 It also illustrates the use of an irregularly shaped circuit board 66, such as Figure 21 A cross-sectional view of an irregularly shaped circuit board structure is shown. Figure 22 The middle indicates Figure 21 A three-dimensional schematic diagram shows a recess 661 and a raised structure on a shaped circuit board 66. A magnetic core 20 is placed within the recess 661 of the shaped circuit board 66, and the raised structure passes through the magnetic core unit formed by the magnetic core 20. A conductive via 42 is provided in the raised structure, and the conductive via 42 directly forms the winding 10 of the anti-coupled inductor 1. The shaped circuit board 66 and the wiring layer 50 are connected as a whole by solder joints 61, as shown below. Figure 20 As shown, the wiring layer 50 and the winding 10 are electrically connected. In one embodiment, a vertical conductive line 56 can be provided in the conductive via 42, which can be used for electrical connection of input circuits or signals. This structure is compact and simple, and the power module can directly lead out pins from the lower surface of the irregularly shaped circuit board 66. The coplanarity of the pins is easy to achieve, and the manufacturing cost is low.

[0171] In one embodiment, such as Figures 23 to 28 This diagram illustrates a four-way anti-coupled power supply module structure. Figure 23 This is an exploded view of a four-way anti-coupled power supply module. Figure 24This is an assembly diagram of a four-way anti-coupled power supply module. Figures 25-26 This is a 3D schematic diagram of the power module from different angles. Figure 27 The diagram shows the bottom view of the power module. (Example) Figure 23 As shown, four half-bridge modules 2 are arranged on the wiring layer 50. The anti-coupling inductor 1 includes a first magnetic core 21, a second magnetic core 22, four windings 10, and an isolation plate 68. The anti-coupling inductor 1 is arranged in a 2x2 array, with a symmetrical structure and a short and symmetrical magnetic circuit, which is beneficial to improving the efficiency and dynamic performance of the power module. The isolation plate 68 is equipped with the first magnetic core 21, the second magnetic core 22, and the windings 10, forming a configuration as shown in the diagram. Figure 24 The anti-coupling inductor 1 is shown. The isolation plate 68 uses a similar design. Figure 21 The irregularly shaped circuit board 66 and the isolation plate 68 have raised structures on their upper and lower surfaces to match the magnetic core. Additionally, the anti-coupled inductor can be encapsulated using insulating encapsulant 81, such as... Figure 26 and Figure 27 As shown. Furthermore, vertical conductive lines 56 can be provided within the isolation plate 68 or the insulating encapsulation material 81. The vertical conductive lines 56 form pads on the lower surface of the isolation plate 68 or the insulating encapsulation material 81, serving as external connection pins 71 for the power module. Adjacent connection pins 71 can be concentrically nested, meaning the vertical conductive lines 56 can be concentrically nested, which helps improve the anti-interference performance of the electrical connection line of the connection pin 71 located in the middle. Furthermore, the second end of the winding 10 of the anti-coupling inductor 1 can directly form an output positive pin 72 (output pin Vo) on the lower surface via a pad. Since the outer side of the anti-coupling inductor 1 is also arc-shaped, devices or vertical conductive lines 56 can be placed in the four corner areas of the power module, for example... Figure 27 The connection pin 71 is configured in the configuration. This improves space utilization of each part of the power module and increases power density.

[0172] In one embodiment, such as Figure 29 and Figure 30 This diagram illustrates a four-phase anti-coupled power supply module. The power supply module can utilize a single chip 2', which includes a four-phase half-bridge module 2. The midpoint of each half-bridge module 2's bridge arm is electrically connected to the corresponding winding 10 of the anti-coupled inductor 1. For example... Figure 29 The diagram also illustrates that the half-bridge module 2 has a circuit region 3 and a control region 4, meaning the control loops of the half-bridge circuits are arranged in a distributed manner. This improves the consistency of the response and switching characteristics of each half-bridge circuit, which is beneficial for improving the power, efficiency, and dynamic performance of the power module. Furthermore, each distributed control region 4 can be positioned on the outer side of the chip 2' relative to the half-bridge circuit, allowing signal lines to be more easily connected to the corresponding control loops of the chip 2'. This simplifies design and reduces the degree of interference from anti-coupling inductors in the signal loops. Figure 30The diagram also illustrates that the second end of winding 10 has four positive output pins 72 (Vo1-Vo4) on the lower surface of the power module. These four positive output pins 72 can be shorted into a large pad 73 for easy application and reduced conduction losses. Similarly, vertical conductive lines 56 are arranged around the power module. For example, by arranging Vin and GND conductive lines in an alternating manner, the parasitic inductance of the input circuit can be further reduced, which is beneficial to improving the high-frequency performance of the power module. Moreover, this structure is simple and compact, and has high power density.

[0173] In one embodiment, such as Figure 31 and Figure 32 This diagram illustrates a 3x3 multi-op-coupled power module structure. Figure 31 The schematic chip 2' (shown as a dotted line in the figure) can be embedded within the wiring layer 50. Other components, such as capacitors 52 and resistors 53, can also be disposed on its upper surface. In some other embodiments, the chip 2' can also be disposed above the wiring layer 50, and peripheral components (such as capacitors 52 and / or resistors 53) can be disposed around each chip 2'. These peripheral components can be stacked above the wiring layer 50 with the chip 2', or disposed around the chip 2', or disposed on the wiring layer facing the inductor side. Furthermore, an insulating encapsulant can be used for encapsulation to form an encapsulation layer 54. Similarly, vertical conductive lines 56 can be provided on the side of the power module, for example, in the form of stamp holes, for vertical circuit connections. The conductive lines Vin and GND can be arranged around the perimeter of the power module, staggered, or evenly. This input circuit structure significantly improves the input impedance consistency between the input circuits of the multi-phase array half-bridge circuit. For example, although the middle chip 2' among the nine chips 2' is not close to the side of the power module, making the distance from the side conductive lines Vin or GND to it relatively far, the sum of its distances to the surrounding areas is roughly equivalent to the sum of the distances from the other eight chips 2' closer to the side to the surrounding areas. This ensures that the input circuit impedance of each chip 2' is consistent. This further improves the efficiency and dynamic performance of the multi-phase parallel connection.

[0174] This application does not limit the shape of the magnetic core. In one embodiment, both the first magnetic core 21 and the second magnetic core 22 are E-type magnetic core structures, such as... Figure 2 As shown, or Figures 45 to 49 The magnetic core structure shown.

[0175] An embodiment of the present invention also provides a method for manufacturing a power module, comprising: providing a plurality of half-bridge modules 2; providing a plurality of windings 10, wherein the plurality of windings 10 are all linear windings between a first plane and a second plane, and are perpendicular to the first plane or the second plane, and the plurality of windings 10 are all single-turn, and the first plane and the second plane are parallel; providing a magnetic core 20, wherein the magnetic core 20 includes a first magnetic core 21, a second magnetic core 22, and a magnetic core post 23, wherein the first magnetic core 21 and the second magnetic core 22 are respectively located at both ends of the windings 10, and the magnetic core post 23 connects the first magnetic core 21 and the second magnetic core 22. 2. There are multiple magnetic core columns 23, which together with the first magnetic core 21 and the second magnetic core 22 form multiple magnetic core units. The magnetic core units are arranged correspondingly to the windings 10. The multiple magnetic core units extend from the first plane around the corresponding windings 10 to the second plane in the same direction. The projections of the multiple magnetic core units on the first plane perpendicular to the windings 10 form multiple closed regions 24. The closed regions 24 are arranged one-to-one with the windings 10. Among them, the half-bridge modules 2 are connected one-to-one with the windings 10, and the midpoint of the bridge arm in each half-bridge module 2 is electrically coupled to the first end of the corresponding winding 10.

[0176] In one embodiment, multiple windings 10 and magnetic core 20 form an anti-coupled inductor 1. The manufacturing method further includes: configuring the multiple anti-coupled inductors 1 into an inductor strip; forming a wiring layer 50 on the inductor strip; placing a half-bridge module 2 on the wiring layer 50; and encapsulating it with an insulating encapsulant 81.

[0177] In one embodiment, Figure 33 This illustrates the manufacturing process of a power module. Step 1, as follows: Figure 33 As shown in (a), multiple anti-coupled inductors 1 can be formed into an inductor panel; step 2, as... Figure 33 As shown in (b), a wiring layer 50 is formed on the inductor cascade; in some embodiments, conductive vias can be provided in the insulating encapsulant 81 to form vertical conductive lines; step 3, as... Figure 33 As shown in (c), solder the chip on the wiring layer 50 (or set up the half-bridge module 2); Step 4, as... Figure 33 As shown in (d), this is an optional step; the chip can also be encapsulated using insulating encapsulant 81; Step 5, as... Figure 33 As shown in (e), the panel is cut at position 82 to form a power module, as illustrated in the aforementioned embodiments. This process allows for mass production of panels in continuous strips, resulting in low cost; moreover, the process is simple and yields a high success rate.

[0178] In one embodiment, Figure 34 This illustrates another manufacturing process for a power module, step 1, as follows: Figure 34 As shown in (a), a wiring layer 50 is formed on wafer 74; step 2, as... Figure 34(b) As shown, a first magnetic material layer 75 is formed on the wiring layer 50; Step 3, as... Figure 34 As shown in (c), a first isolation layer 76 is formed on the first magnetic material layer 75; Step 4, as follows Figure 34 As shown in (d), a through hole 77 is provided on the first isolation layer 76 to expose a portion of the first magnetic material layer 75; Step 5, as follows Figure 34 As shown in (e), a second magnetic material layer 78 is disposed on the first isolation layer 76, and magnetic material is also disposed in the through hole 77 between the first magnetic material layer 75 and the second magnetic material layer 78, thereby connecting the first magnetic material layer 75 and the second magnetic material layer 78 magnetically; Step 6, as Figure 34 As shown in (f), this step is optional, and a second isolation layer 79 may also be provided on the second magnetic material layer 78; Step 7, as Figure 34 As shown in (g), a conductive via 80 is provided, penetrating the first magnetic material layer 75 and the second magnetic material layer 78, with its upper end electrically connected to the conductive lines of the wiring layer 50. Part of the conductive via 80 can serve as the winding of an anti-coupling inductor, and part of the conductive via 80 can serve as the conductive line for an input circuit or signal. Additionally, in step 7, a capacitor layer 60 can be further integrated; this step is optional. Figure 34 (h) is shown; Step 8, along as shown in... Figure 34 (s) and Figure 35 The power module 100 can be formed after cutting along the dicing line 82 shown. The first magnetic material layer 75 or the second magnetic material layer 78 can be achieved in various ways, such as by setting a pre-fabricated magnetic core substrate or thin film, by printing on the wiring layer 50, by sputtering, or by other methods. Wafer-based manufacturing simplifies subsequent processes, reduces costs, and improves yield. This process also allows for power modules with smaller inductance and more or denser distributed inductor arrangements, making it more suitable for ultra-high frequency power module applications.

[0179] An embodiment of the present invention also provides a multi-opposite-coupled inductor, such as Figures 36 to 44 As shown, it includes two windings 10, each extending vertically; and a magnetic core 20, which includes two core units, each corresponding to one of the two windings 10. Each core unit extends from the first end around the corresponding winding 10 to the second end in the same direction, as shown. Figure 37 The double-dotted line with an arrow in the image indicates the meaning. Figure 36 and Figure 37The schematic diagram of two oppositely coupled inductors includes an "S"-shaped first magnetic core 21 and second magnetic core 22, core posts 23, and windings 10, the cross-sectional shape of which is circular. The axis of winding 10 is perpendicular to the upper surface of the first magnetic core 21 or the lower surface of the second magnetic core 22. The two ends of the first magnetic core 21 and the second magnetic core 22 are connected by two core posts 23. One end of one core post 23 is connected to one end of the first magnetic core 21, and the other end is connected to one end of the second magnetic core 22. The other core post 23 is connected to one end of the first magnetic core 21, and the other end is connected to one end of the second magnetic core 22. The two windings 10 are respectively surrounded by the first magnetic core 21, the second magnetic core 22, and the two core posts 23. An air gap can be provided at the connection between the core post 23 and the first magnetic core 21 or the second magnetic core 22 to adjust the inductance. The coupling system of the two oppositely coupled inductors can also be adjusted by adjusting the spacing between the first magnetic core 21 and the second magnetic core 22. The magnetic core of this inductor has a simple, planar structure with excellent symmetry, which minimizes core deformation during molding and sintering, thus improving manufacturing precision and yield. Furthermore, the first magnetic core 21 and the second magnetic core 22 can have identical shapes and dimensions, requiring only one mold to manufacture both, thereby reducing costs. Figure 38 The illustration also shows that the magnetic core column 23 and the second magnetic core 22 can be integrated to form a single magnetic core component, which can reduce the number of magnetic core parts and simplify the assembly process. Figure 39 It can also be shown that... Figure 37 The magnetic core pillar 23 is divided into two halves and integrated into the two ends of the first magnetic core 21 and the two ends of the second magnetic core 22 respectively. This arrangement makes the first magnetic core 21 and the second magnetic core 22 completely identical parts. Only one mold needs to be made to manufacture the first magnetic core 21 and the second magnetic core 22. That is, only one mold needs to be made for the entire magnetic core of the inductor, which can further reduce costs. Figure 40 The diagram illustrates that the magnetic core structure can be prefabricated. After the first magnetic core 21 and the second magnetic core 22 are pre-assembled, the winding 10 is then inserted into the magnetic core 20 to form two oppositely coupled inductors. This method is more suitable for the production of powder core inductors, but it can also be used for ferrite materials. Figures 41 to 44 The first magnetic core 21 and the second magnetic core 22, which are in the shape of an "S", can be in the form of right-angle bends. In this case, the cross-section of the winding 10 can also be rectangular, which fits tightly with the magnetic core. Such a structure can make the shape of the inductor more square. In addition, an air gap can be set between the first magnetic core 21 and the second magnetic core 22 to adjust the inductance or saturation current and other characteristics. Of course, the coupling coefficient of the two oppositely coupled inductors can also be adjusted by adjusting the spacing between the first magnetic core 21 and the second magnetic core 22.

[0180] In one embodiment, an anti-coupling inductor can be applied to the power module described above.

[0181] An embodiment of the present invention also provides a multi-opposite-coupled inductor, such as Figures 45 to 49 As shown, this illustrates a three-phase opposite-coupled inductor structure. The inductor includes a first magnetic core 21, a second magnetic core 22, core posts 23, and windings 10. The axis of the windings 10 is perpendicular to the upper surface of the first magnetic core 21 or the lower surface of the second magnetic core 22. The first magnetic core 21 and the second magnetic core 22 are identical components, both resembling an "E" shape. One end of each core post 23 is connected to the corresponding horizontal post end face of the first magnetic core 21, and the other end is connected to the corresponding horizontal post end face of the second magnetic core 22. The three windings 10 are arranged in a straight line and surrounded by the first magnetic core 21, the second magnetic core 22, and the core posts 23, respectively. Figure 45 and Figure 46 As shown, the first magnetic core 21 includes a first common magnetic post 212, from which multiple first transverse magnetic posts 213 are vertically led out; the second magnetic core 22 includes a second common magnetic post 222, from which multiple second transverse magnetic posts 223 are vertically led out. The magnetic core posts 23 are respectively arranged corresponding to the first transverse magnetic posts 213 and the second transverse magnetic posts 223, and are respectively connected to form a magnetic circuit. Figures 47 to 49 As shown, the first magnetic core 21 includes a first common magnetic post 212, from which a plurality of first transverse magnetic posts 213 are vertically led out, and from which a plurality of third transverse magnetic posts 214 are vertically led out; the second magnetic core 22 includes a second common magnetic post 222, from which a plurality of second transverse magnetic posts 223 are vertically led out, and from which a plurality of fourth transverse magnetic posts 224 are vertically led out. The magnetic core posts 23 are respectively arranged corresponding to the third transverse magnetic posts 214 and the fourth transverse magnetic posts 224, and are respectively connected to form a magnetic circuit.

[0182] In one embodiment, an anti-coupling inductor can be applied to the power module.

[0183] One embodiment of the present invention also provides a multiphase coupled inductor. For example... Figure 50 and Figure 51As shown, the multiphase coupled inductor includes windings 10 and magnetic cores 20. There are at least three windings 10, all of which are straight windings arranged in an array between a first plane and a second plane, with the first and second planes parallel to each other. The magnetic core 20 includes a first magnetic core 21, a second magnetic core 22, and magnetic core posts 23. The first magnetic core 21 and the second magnetic core 22 are located at opposite ends of the windings 10, respectively. The magnetic core posts 23 connect the first magnetic core 21 and the second magnetic core 22. There are at least three magnetic core posts 23, forming at least three magnetic core units with the first magnetic core 21 and the second magnetic core 22. Each magnetic core unit corresponds to one winding 10, and all at least three magnetic core units extend from the first plane around the corresponding winding 10 to the second plane in the same direction. The projections of the at least three magnetic core units onto the first plane perpendicular to the windings 10 enclose at least three closed regions 24, each of which corresponds to one winding 10.

[0184] The multiphase coupled inductor of this application can be a three-phase coupled inductor or any three-phase or more coupled inductor. For example... Figure 52 As shown, the multiphase coupled inductor is a four-phase coupled inductor. The windings 10 in the multiphase coupled inductor are arranged in an array, meaning they are arranged in multiple rows and columns, rather than all in a straight line. This shortens the magnetic path between inductors, making the coupling strength between each phase inductor and the inductance of each phase more balanced and consistent. All windings 10 are straight windings, each with a single turn and vertically positioned, resulting in a shorter path for the windings. This is suitable for stacked power supply modules and helps improve the efficiency of the power supply module and heat dissipation in the vertical direction. The structure of the windings 10 and the magnetic core 20 is simple and compact, resulting in a smaller footprint.

[0185] In some embodiments, the multiphase coupled inductor may further include a conductive plate 25, and the windings 10 are all connected to the conductive plate 25. For example... Figure 53 As shown, the lower ends of the four windings 10 are all connected to the conductive plate 25. The conductive plate 25 can serve as the common output terminal of the entire multiphase coupled inductor, so as to facilitate the electrical connection of the multiphase coupled inductor with other electronic devices and facilitate various practical applications.

[0186] In one embodiment, such as Figure 54As shown, the multiphase coupled inductor is a six-phase coupled inductor. The magnetic core 20 includes a first magnetic core 21, a second magnetic core 22, and six pairs of magnetic core posts 23. The six windings 10 are arranged in a ring array. Both the first magnetic core 21 and the second magnetic core 22 include a connecting portion in the middle and six branches extending outward from the connecting portion. The six branches of the first magnetic core 21 and the six branches of the second magnetic core 22 are connected together by the magnetic core posts 23 in a one-to-one correspondence. The ends of the six branches of the first magnetic core 21 and the six magnetic core posts 23 at their ends are provided with protruding structures as magnetic core posts 23. The upper part, which is integrally formed with the first magnetic core 21 and the six magnetic core posts 23 at its ends, and the lower part, which is integrally formed with the second magnetic core 22 and the six magnetic core posts 23 at its ends, have the same shape.

[0187] In one embodiment, such as Figure 55 and Figure 56 As shown, the first magnetic core 21 includes a linear cylindrical first connecting portion and six branches extending outward from the first connecting portion, with three branches extending to the left of the first connecting portion and the other three branches extending to the right of the first connecting portion. The second magnetic core 22 includes a linear cylindrical second connecting portion and six branches extending outward from the second connecting portion, with three branches extending to the left of the second connecting portion and the other three branches extending to the right of the second connecting portion. The six branches of the first magnetic core 21 and the six branches of the second magnetic core 22 are connected one-to-one by magnetic core posts 23. The first magnetic core 21, the second magnetic core 22, and the magnetic core posts form six magnetic core units, which are correspondingly arranged around six windings 10. This connection method results in a shorter connecting post length, which is more conducive to reducing magnetic core losses. The current flowing through each winding 10 can be from top to bottom, and the windings 10 are anti-coupled. Figure 55 For ease of display, the first and second connecting parts are drawn offset. In reality... Figure 56 The components overlap vertically, resulting in a compact structure. In one embodiment, a multiphase coupled inductor can be applied to the aforementioned power module.

[0188] Figures 57 to 60 The application of multiphase coupled inductors in some circuits is illustrated, and the multiphase coupled inductors can adopt the structure in the above embodiments. Figure 57 This illustrates a Buck circuit (a step-down converter circuit). Figure 58 This illustrates a Boost circuit (boost converter). Figure 59 This diagram illustrates a multiphase parallel four-switch Buck-Boost circuit (buck-to-boost converter). Figure 60This diagram illustrates the principle of a multiphase parallel Buck-Boost circuit. In the diagram, Ln represents the multiphase coupling inductor, Cin represents the input capacitor, Co represents the output capacitor, Vin represents the positive input terminal of the half-bridge circuit, GND represents the negative input terminal of the half-bridge circuit, Vo represents the positive output terminal of the half-bridge circuit, SW represents the midpoint of the half-bridge circuit, and V1 represents the positive output terminal of the half-bridge circuit with a different output voltage than Vo. It is worth noting that the multiphase coupling inductor in this application is not limited to these circuits but can also be used in other circuit topologies, such as Cuk circuits, flyback circuits, switch capacitor circuits, or LLC circuits.

[0189] An embodiment of the present invention also provides a power supply system, including: the power module described above; a system circuit board 110; a load 120 disposed on a first surface of the system circuit board 110; wherein the power module is disposed on the first surface of the system circuit board 110 and is located around the load 120; and / or, the power module is disposed on a second surface of the system circuit board 110 and its projection on the plane at least partially overlaps with the load 120.

[0190] In one embodiment, such as Figure 61 As shown, power modules 100 are respectively arranged on the upper and lower sides of the system circuit board 110. One power module 100 and the load 120 are on the same side of the system circuit board 110. The output Vo of the power module 100 is transmitted to the load 120 through the system circuit board 110, and the distance from each phase to the load 120 can be made consistent, which is beneficial to improving the efficiency and dynamics of multi-phase parallel power supply. The load 120 can be a CPU, GPU, or other intelligent chip. The other power module 100 is arranged on a different side of the system circuit board 110 from the load 120, and its projection on the plane at least partially overlaps with the load 120, making the power supply path vertical and short, which is beneficial to improving the efficiency and dynamics of multi-phase parallel power supply.

[0191] In the case of anti-coupling and vertical single-turn winding of the power module of the present invention, the chip can be set on the same side of the anti-coupling inductor, for example, both can be set on the upper surface of the anti-coupling inductor, and higher power density and higher efficiency can be achieved; moreover, a power module with better anti-coupling consistency can be achieved. In addition, since the single-turn winding of the anti-coupling inductor is vertical and the path is short, it is beneficial to the heat dissipation of the power module in the vertical direction.

[0192] Other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and exemplary embodiments are to be considered illustrative only, and the true scope and spirit of the invention are indicated by the following claims.

[0193] It should be understood that the present invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method of manufacturing a power module, characterized by, The application relates to a manufacturing method of a power supply module. The application provides a plurality of half-bridge modules (2); A plurality of windings (10) are provided, the plurality of windings (10) are linear windings between a first plane and a second plane, and the plurality of windings (10) are perpendicular to the first plane or the second plane, the plurality of windings (10) are single turns, the first plane is parallel to the second plane; A magnetic core (20) is provided, the magnetic core (20) comprises a first magnetic core (21), a second magnetic core (22) and a plurality of magnetic core columns (23), the first magnetic core (21) and the second magnetic core (22) are respectively located at two ends of the winding (10), the magnetic core column (23) connects the first magnetic core (21) and the second magnetic core (22), the magnetic core column (23) is a plurality of magnetic core columns, and the magnetic core column (23) forms a plurality of magnetic core units with the first magnetic core (21) and the second magnetic core (22), the magnetic core unit is arranged correspondingly to the winding (10), the plurality of magnetic core units are extended to the second plane from the first plane along the corresponding winding (10) in the same direction, and projections of the plurality of magnetic core units on the first plane perpendicular to the winding (10) enclose a plurality of closed areas (24), the closed areas (24) are arranged in one-to-one correspondence with the windings (10); wherein the half-bridge module (2) is connected with the winding (10) in one-to-one correspondence, and a midpoint of a bridge arm in each half-bridge module (2) is electrically connected with a first end of the corresponding winding (10).

2. The production method according to claim 1, characterized by, The plurality of windings (10) and the magnetic core (20) form an anti-coupling inductor (1), and the manufacturing method further comprises the following steps: The plurality of anti-coupling inductors (1) are arranged to be inductance continuous sheets; A wiring layer (50) is formed on the inductance continuous sheets; The half-bridge module (2) is arranged on the wiring layer (50); And the half-bridge module (2) is encapsulated by using an insulating encapsulating material (81).

3. The method of making of claim 1, wherein, The application further comprises the following steps: A wiring layer (50) is formed on a wafer (74); A first magnetic material layer (75) is formed on the wiring layer (50); A first isolation layer (76) is arranged on the first magnetic material layer (75), and a through hole (77) is formed on the first isolation layer (76) to expose part of the first magnetic material layer (75); A second magnetic material layer (78) is arranged on the first isolation layer (76), and the second magnetic material layer (78) fills the through hole (77), so that the first magnetic material layer (75) and the second magnetic material layer (78) are magnetically connected; A conductive via (80) is arranged, the conductive via (80) penetrates through the second magnetic material layer (78), the first isolation layer (76) and the first magnetic material layer (75) and is electrically connected with the wiring layer (50); wherein the conductive via (80) forms the winding (10), the first magnetic material layer (75) and the second magnetic material layer (78) form the magnetic core (20), and the half-bridge module (2) is integrated in the wafer (74); A plurality of discrete power supply modules are formed by cutting.

4. The method of manufacturing according to claim 3, wherein, Before the conductive via (80) is formed, ​ A second isolation layer (79) is further arranged on the second magnetic material layer (78) to fill the voids of the second magnetic material layer (78). The conductive via (80) penetrates the second isolation layer (79), the second magnetic material layer (78), the first isolation layer (76), and the first magnetic material layer (75) to be electrically connected with the wiring layer (50).

5. The method of manufacturing according to claim 4, wherein, Further comprising: A capacitor layer (60) is formed on the second isolation layer (79) before forming the plurality of discrete power supply modules.

6. The method of manufacturing according to claim 3, wherein, The first magnetic material layer (75) and the second magnetic material layer (78) are pre-prepared magnetic core plates or films, or the first magnetic material layer (75) and the second magnetic material layer (78) are formed by printing or sputtering.

7. A multi-opposite-coupled inductor, characterized in that, Further comprising: A plurality of windings (10), the plurality of windings (10) are linear windings between a first plane and a second plane, the first plane and the second plane are parallel; A magnetic core (20) comprising a first magnetic core (21), a second magnetic core (22), and a plurality of magnetic core columns (23), the first magnetic core (21) and the second magnetic core (22) are respectively located at two ends of the winding (10), the magnetic core column (23) connects the first magnetic core (21) and the second magnetic core (22), the magnetic core column (23) is a plurality of, and forms a plurality of magnetic core units with the first magnetic core (21) and the second magnetic core (22), the magnetic core unit is arranged one-to-one corresponding to the winding (10), a plurality of the magnetic core units are extended to the second plane from the first plane along the same direction around the corresponding winding (10), and the projections of a plurality of the magnetic core units on the first plane perpendicular to the winding (10) enclose a plurality of closed areas (24), the closed area (24) is arranged corresponding to the winding (10) respectively; The winding (10) is at least three, the first magnetic core (21) comprises a first common magnetic column (212), a plurality of first transverse magnetic columns (213) are vertically led out on the first common magnetic column (212); the second magnetic core (22) comprises a second common magnetic column (222), a plurality of second transverse magnetic columns (223) are vertically led out on the second common magnetic column (222), and the magnetic core column (23) is arranged corresponding to the first transverse magnetic column (213) and the second transverse magnetic column (223) respectively, and is connected to form a magnetic circuit.

8. The multiphase flyback transformer of claim 7, wherein, There is at least one magnetic core connection plane between the first magnetic core (21), the magnetic core column (23), and the second magnetic core (22), and the connection plane is perpendicular to the axis of the winding (10).

9. The multiphase flyback transformer of claim 7, wherein, The first magnetic core (21) and the second magnetic core (22) are components with the same shape.

10. The multiphase flyback transformer of claim 7, wherein, The magnetic core column (23) is integrally formed with at least one of the first magnetic core (21) and the second magnetic core (22); or, a part of the magnetic core column (23) is integrally formed with the first magnetic core (21), and another part of the magnetic core column (23) is integrally formed with the second magnetic core (22).

11. A multi-opposite-coupled inductor, characterized in that, Further comprising: Two windings (10), the windings (10) are linear windings between a first plane and a second plane, the first plane and the second plane are parallel; A magnetic core (20) comprises a first magnetic core (21), a second magnetic core (22) and a magnetic core column (23), the first magnetic core (21) and the second magnetic core (22) are respectively located at two ends of the winding (10), the magnetic core column (23) connects the first magnetic core (21) and the second magnetic core (22), the magnetic core column (23) is multiple, and forms two magnetic core units with the first magnetic core (21) and the second magnetic core (22), the magnetic core units are arranged one by one corresponding to the winding (10), two magnetic core units extend from the first plane to the second plane along the same direction from the corresponding winding (10), the projections of two magnetic core units on the first plane perpendicular to the winding (10) enclose a plurality of closed areas (24), and the closed areas (24) are respectively arranged corresponding to the winding (10); Wherein, the first magnetic core (21) and the second magnetic core (22) are S-shaped magnetic core structure, there is at least one magnetic core connecting plane between the first magnetic core (21), the magnetic core column (23) and the second magnetic core (22), the connecting plane is perpendicular to the axis of the winding (10).

12. The multiphase flyback transformer of claim 11, wherein, The first magnetic core (21) and the second magnetic core (22) are the same parts.

13. The multiphase flyback transformer of claim 11, wherein: The magnetic core column (23) is integrally formed with at least one of the first magnetic core (21) and the second magnetic core (22); or, a part of the magnetic core column (23) is integrally formed with the first magnetic core (21), and another part of the magnetic core column (23) is integrally formed with the second magnetic core (22).

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