A test system for simulating single event effects of pulsed laser and a heat dissipation method

Abstract

The embodiment of the present application discloses a kind of test system and heat dissipation method of pulse laser analog single particle effect, and it is used to improve the heat dissipation efficiency of the chip to be tested for heat dissipation.The heat dissipation system includes pulse laser and heat conduction component.The heat conduction component is located between the pulse laser and the chip to be tested.The heat conduction component includes light-transmitting region and heat-conducting region.The light-transmitting region is physically connected with the heat-conducting region.The pulse laser emitted by the pulse laser is transmitted to the chip to be tested through the light-transmitting region.The pulse laser is used to carry out pulse laser analog single particle effect test on the chip to be tested.The light-transmitting region is physically connected with the chip to be tested.The heat of the chip to be tested is dissipated through the light-transmitting region and the heat-conducting region.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation of electronic components, and particularly relates to a test system for simulating single event effect by pulsed laser and a heat dissipation method. BACKGROUND

[0002] When a space device operates in a space orbit, the space device will be impacted by a large number of high-energy particles in its life cycle. Single event effect (SEE) refers to a series of irradiation effects caused by a single high-energy particle passing through a chip of the space device, which causes abnormal changes of the chip. SEE can cause abnormal flip or even burn of the chip. Therefore, the anti-SEE capability of the chip is one of the necessary indexes for checking whether the chip is suitable for the space device.

[0003] Pulsed laser can simulate the SEE test, so as to test the anti-SEE capability of the chip. In order to improve the realizability and accuracy of the SEE test, the chip needs to be cooled in time during the SEE test process. The specific heat dissipation process is to remove the outer cover of the chip to expose the unit die of the chip. The unit die during the SEE test process is cooled by a fan.

[0004] However, the heat dissipation area of the unit die is relatively small, and the heat dissipation capacity of the fan is limited, which cannot meet the heat dissipation requirement of the high-power chip. In addition, the wind speed of the fan can cause mechanical vibration of the unit die. The mechanical vibration can reduce the accuracy of the SEE test. SUMMARY

[0005] Embodiments of the present application provide a test system for simulating single event effect by pulsed laser and a heat dissipation method. The test system is used to simulate the single event effect by pulsed laser. Moreover, the heat dissipation efficiency of the chip to be tested is improved during the test process.

[0006] In a first aspect, an embodiment of the present application provides a test system for simulating single event effects by pulsed laser. The test system is used to implement a test for simulating single event effects by pulsed laser. The test system comprises a pulsed laser and a heat conduction assembly. The heat conduction assembly is located between the pulsed laser and a chip to be tested. The heat conduction assembly comprises a light-transmitting region and a heat-conducting region. The light-transmitting region is physically connected to the heat-conducting region. Pulsed laser emitted by the pulsed laser is transmitted to the chip to be tested through the light-transmitting region. The pulsed laser is used to perform a test for simulating single event effects by pulsed laser on the chip to be tested. The light-transmitting region is physically connected to the chip to be tested. Heat of the chip to be tested is dissipated through the light-transmitting region and the heat-conducting region. According to the aspect, the light-transmitting region and the heat-conducting region included in the heat conduction assembly can dissipate heat of the chip to be tested, thereby effectively improving the heat dissipation efficiency. Moreover, the process of dissipating heat of the chip to be tested does not cause mechanical vibration of the chip to be tested. The accuracy of the test for simulating single event effects by pulsed laser is improved.

[0007] Based on the first aspect, in an optional implementation, the light-transmitting region is made of a first material. The heat-conducting region is made of a second material. The light-transmitting region has a light transmission rate greater than or equal to a first preset value. The light-transmitting region has a heat conduction coefficient greater than or equal to a second preset value. The heat-conduction coefficient of the second material is greater than or equal to the heat-conduction coefficient of the first material. In the implementation, the light-transmitting region made of the first material can ensure that the pulsed laser is successfully transmitted to the chip to be tested. The light-transmitting region and the heat-conducting region can dissipate heat of the chip to be tested, thereby improving the heat dissipation efficiency.

[0008] Based on the first aspect, in an optional implementation, the test system further comprises a liquid cooling pipe and a refrigeration device connected to the liquid cooling pipe. The heat-conducting region has a heat-conducting groove. The liquid cooling pipe is connected to the heat-conducting groove. The refrigeration device is used to transmit first liquid cooling liquid to the heat-conducting groove through the liquid cooling pipe. The first liquid cooling liquid flowing through the heat-conducting groove is used to dissipate heat of the chip to be tested. In the implementation, the liquid cooling liquid flowing through the heat-conducting groove can effectively improve the heat dissipation efficiency. The test system shown in the implementation can be applied to heat dissipation of the chip to be tested with high power consumption.

[0009] Based on the first aspect, in an optional implementation, the test system comprises a test board. The test board is used to carry the chip to be tested. A normal projection of the heat-conducting groove on the test board has a spacing from a normal projection of the light-transmitting region on the test board. In the implementation, the first liquid cooling liquid flowing through the heat-conducting groove does not interfere with a transmission path of the pulsed laser passing through the light-transmitting region. The implementation effectively ensures that the pulsed laser can be successfully transmitted to the chip to be tested. The implementation effectively ensures the realizability and accuracy of the test for simulating single event effects by pulsed laser.

[0010] In an optional implementation of the first aspect, the test system further includes a liquid cooling pipe and a refrigeration device connected with the liquid cooling pipe. The heat conduction region is used to fix the liquid cooling pipe. The refrigeration device is used to transmit first liquid cooling liquid to the liquid cooling pipe. The first liquid cooling liquid flowing through the liquid cooling pipe is used to dissipate heat for the chip under test. In this way, the position of the liquid cooling pipe can be flexibly adjusted according to the chip under test. It can be known that, in this way, no matter the size of the chip under test or the size of the chip power consumption, the liquid cooling pipe can be fully cooled to the chip under test by adjusting the position of the liquid cooling pipe.

[0011] In an optional implementation of the first aspect, the test system includes a test board. The test board is used to carry the chip under test. The liquid cooling pipe has a spacing between the orthographic projection of the liquid cooling pipe on the test board and the orthographic projection of the light transmission region on the test board. In this implementation, the first liquid cooling liquid flowing through the liquid cooling pipe does not interfere with the transmission path of the pulsed laser passing through the light transmission region. The pulsed laser can be successfully transmitted to the chip under test.

[0012] In an optional implementation of the first aspect, the test system further includes a control device connected with the refrigeration device. The control device is connected with a temperature sensor. The control device is used to acquire the temperature of the chip under test through the temperature sensor. The control device is used to send control signaling to the refrigeration device according to the temperature. The control signaling is used to control at least one of the temperature or the flow rate of the second liquid cooling liquid output by the refrigeration device, so that the temperature of the chip under test is within a preset temperature range. In this implementation, the chip under test within the preset temperature range can ensure the realizability and accuracy of the pulsed laser simulation single event effect test.

[0013] In an optional implementation of the first aspect, the chip under test is sequentially cooled through the light transmission region and the heat conduction region. In this implementation, after the light transmission region absorbs the heat of the chip under test, the light transmission region can also dissipate heat through the heat conduction region. The heat dissipation efficiency is effectively improved.

[0014] In an optional implementation of the first aspect, the heat conduction region and the peripheral wall of the light transmission region are spliced. In this implementation, the manufacturing difficulty of the heat conduction assembly can be effectively reduced, and the manufacturing efficiency of the heat conduction assembly is improved.

[0015] In a second aspect, an embodiment of the present application provides a heat dissipation method for simulating single event effects by pulsed laser. The heat dissipation method is applied to a test system for simulating single event effects by pulsed laser. The heat dissipation method is used for dissipating heat of the test system during the test of simulating single event effects by pulsed laser. The method comprises: pulsed laser emitted by a pulsed laser device is transmitted to a chip to be tested through a light transmission area of a heat conduction assembly. The pulsed laser is used for testing the chip to be tested by simulating single event effects by pulsed laser. The heat conduction assembly is located between the pulsed laser device and the chip to be tested. The heat conduction assembly comprises the light transmission area and a heat conduction area which are physically connected. The light transmission area is physically connected with the chip to be tested. Heat of the chip to be tested is dissipated through the light transmission area and the heat conduction area. The test system to which the heat dissipation method shown in the present aspect is applied and the beneficial effects of the test system are described in the first aspect, and thus are not described herein.

[0016] Based on the second aspect, in an optional implementation, the method further comprises: the refrigeration device transmits first liquid cooling liquid to a heat conduction groove of the heat conduction area through a liquid cooling pipe. The liquid cooling pipe is connected with the refrigeration device and the heat conduction groove respectively. The first liquid cooling liquid flowing through the heat conduction groove dissipates heat of the chip to be tested.

[0017] Based on the second aspect, in an optional implementation, the method further comprises: the refrigeration device transmits first liquid cooling liquid to a liquid cooling pipe fixed by the heat conduction area. The liquid cooling pipe is connected with the refrigeration device. The first liquid cooling liquid flowing through the liquid cooling pipe dissipates heat of the chip to be tested.

[0018] Based on the second aspect, in an optional implementation, the method further comprises: a control device acquires temperature of the chip to be tested through a temperature sensor. The control device sends control signaling to the refrigeration device according to the temperature. The refrigeration device controls at least one of temperature or flow rate of second liquid cooling liquid output by the refrigeration device according to the control signaling, so that the temperature of the chip to be tested is within a preset temperature range.

[0019] In a third aspect, an embodiment of the present application provides a heat dissipation method. The heat dissipation method is applied to a test system for simulating single event effects by pulsed laser. The heat dissipation method is used for dissipating heat for the test system in the process of simulating single event effects by pulsed laser. The method comprises: the heat dissipation method is used for implementing the test of simulating single event effects by pulsed laser. The pulsed laser emitted by a pulsed laser is transmitted to a chip to be tested through a light transmission region of a heat conduction assembly. The pulsed laser is used for performing the test of simulating single event effects by pulsed laser on the chip to be tested. A first liquid cooling liquid flowing through a heat conduction region included in the heat conduction assembly is used for dissipating heat for the chip to be tested. A control device acquires a temperature of the chip to be tested through a temperature sensor. The control device sends control signaling to a refrigeration device according to the temperature. The refrigeration device controls at least one of a temperature or a flow rate of a second liquid cooling liquid output by the refrigeration device according to the control signaling, so that the temperature of the chip to be tested is located in a preset temperature range.

[0020] In a fourth aspect, an embodiment of the present application provides a heat conduction assembly. The heat conduction assembly is used for dissipating heat for a chip to be tested in the process of simulating single event effects by pulsed laser. The heat conduction assembly is located between a pulsed laser and the chip to be tested. The heat conduction assembly comprises a light transmission region and a heat conduction region. The light transmission region is physically connected with the heat conduction region. Pulsed laser emitted by the pulsed laser is transmitted to the chip to be tested through the light transmission region. The pulsed laser is used for performing the test of simulating single event effects by pulsed laser on the chip to be tested. The light transmission region is physically connected with the chip to be tested. Heat of the chip to be tested is dissipated via the light transmission region and the heat conduction region. For the structure of the heat conduction assembly and the description of beneficial effects shown in the present aspect, please refer to the first aspect, and details are not described herein.

[0021] In a fifth aspect, an embodiment of the present application provides a heat dissipation system. The heat dissipation system comprises a heat conduction assembly, a liquid cooling pipe and a refrigeration device. For the specific description of related components and optional implementation manners of the heat dissipation system, please refer to the first aspect, and details are not described herein. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A structure example diagram of a first test system provided by an embodiment of the present application;

[0023] Figure 2 An embodiment of a heat conduction assembly included in the test system shown in the present aspect; Figure 1 An embodiment example diagram of a heat conduction assembly and a unit die included in the test system shown in the present aspect in orthographic projection on a test board;

[0024] Figure 3 An embodiment example diagram of a heat conduction assembly and a unit die included in the test system shown in the present aspect in orthographic projection on a test board; Figure 1 An embodiment example diagram of a heat conduction assembly and a unit die included in the test system shown in the present aspect in orthographic projection on a test board;

[0025] Figure 4 A structure example diagram of a second test system provided by an embodiment of the present application is shown in FIG. 2.

[0026] Figure 5a A first embodiment of the heat conduction assembly included in the test system shown in FIG. 1 is shown in FIG. 3. Figure 4

[0027] Figure 5b A first embodiment of the heat conduction assembly included in the test system shown in FIG. 1 is shown in FIG. 3. Figure 4

[0028] Figure 5c A first embodiment of the heat conduction assembly included in the test system shown in FIG. 1 is shown in FIG. 3. Figure 4

[0029] Figure 6 A first embodiment of the heat conduction assembly included in the test system shown in FIG. 1 is shown in FIG. 3. Figure 4

[0030] Figure 7 A first embodiment of the heat conduction assembly included in the test system shown in FIG. 1 is shown in FIG. 3. Figure 4

[0031] Figure 8 A step flow chart of an embodiment of the heat dissipation method provided by the present application is shown in FIG. 8. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without any creative work fall within the scope of protection of the present application.

[0033] The test system provided by the present application can realize the pulse laser simulation single particle effect test. Figure 1 A structure example diagram of a first test system provided by an embodiment of the present application is shown in FIG. 1. Figure 1 As shown in FIG. 1, the test system provided by the present application includes a pulse laser 101, a control device 102, a test board 103 and a heat conduction assembly 110.

[0034] ​​​​​The test system shown in the embodiment includes a support frame 120 for fixing the laser 101. The pulsed laser emitted by the laser lens 121 of the fixed laser 101 can be directly transmitted to the chip to be tested on the test board 103. The pulsed laser is used to simulate the SEE test on the chip to be tested. The description of the fixing method of the laser 101 in the embodiment is an optional example and is not limited. For example, the laser 101 can also be fixed in a hanging manner. For another example, the pulsed laser emitted by the pulsed laser 101 can also simulate the SEE test on the pre-processed chip to be tested. Among them, the efficiency and accuracy of the SEE test can be effectively improved by simulating the SEE test on the pre-processed chip to be tested. The chip to be tested includes a printed circuit board (PCB). A cover is arranged on the PCB. A unit die 104 is packaged between the cover and the PCB. The pre-processing refers to removing the cover of the chip to be tested to expose the unit die 104. It can be known that the pre-processing can expose the unit die 104 of the chip to be tested to avoid the interference of the cover on the SEE test. The packaging method of the chip to be tested in the embodiment is not limited as long as the pre-processing can expose the unit die 104. For example, the packaging method of the chip to be tested can be flip chip plastic grid array (FCPGA) or flip-chip CSP (FCCSP).

[0035] Continuing to refer to Figure 1 The heat conduction assembly 110 is located between the pulsed laser 101 and the unit die 104. The heat conduction assembly 110 shown in the embodiment can be an integrally formed structure. The integrally formed structure can effectively ensure the stability of the structure of the heat conduction assembly 110. The service life of the heat conduction assembly 110 is improved. The heat conduction assembly 110 is made of a material with light transmission and heat conduction properties. For example, the heat conduction assembly 110 can be made of silicon dioxide (SiO2) or diamond. The heat conduction assembly 110 shown in the embodiment can be arranged on the surface of the test board 103 facing the pulsed laser 101. A test space is formed between the heat conduction assembly 110 and the test board 103. The unit die 104 is located inside the test space. The specific method of fixing the heat conduction assembly 110 on the test board 103 is not limited in the embodiment. For example, the heat conduction assembly 110 can be fixed on the test board 103 by adhesive. For another example, the surface of the test board 103 facing the pulsed laser 101 is provided with a slide. The heat conduction assembly 110 is provided with a convex rail at a position opposite to the slide. When the convex rail is inserted into the slide, the purpose of arranging the heat conduction assembly 110 on the surface of the test board 103 is achieved.

[0036] The heat-conducting component 110 includes a light-transmitting region 201 and a heat-conducting region 202. The light-transmitting region 201 and the heat-conducting region 202 are different regions included in the heat-conducting component 110. The light-transmitting region 201 is located between the pulsed laser 101 and the unit die 104, and is located in the transmission direction of the pulsed laser emitted from the pulsed laser 101. Because the heat-conducting component 110 is made of a light-transmitting material, the pulsed laser emitted from the pulsed laser 101 can pass through the light-transmitting region 201 to be transmitted to the unit die 104. This pulsed laser is used to perform a pulsed laser simulated SEE test on the unit die 104. Specifically, the pulsed laser is transmitted to the unit die 104. The pulsed laser excites the photoelectric effect of the unit die 104 to generate electron-hole pairs. This pulsed laser can simulate high-energy particles entering the unit die 104 to excite the unit die 104 to produce a SEE response. For example, the response to the SEE could be a change in the data stored in the die 104, a change in current, a voltage fluctuation, or a change in the function implemented. The control device 102 connected to the die 104 can detect the SEE response generated by the die 104. The control device 102 can be any computing device with computing capabilities. For example, the control device 102 can be a computer, a server, or a smart terminal.

[0037] The bottom surface of the light-transmitting region 201 is physically connected to the unit die 104. "Physically connected" means that the bottom surface of the light-transmitting region 201 is in direct contact with the unit die 104. Therefore, there is no gap between the bottom surface of the light-transmitting region 201 and the unit die 104. The bottom surface of the light-transmitting region 201 refers to the surface of the light-transmitting region 201 facing the unit die 104 and away from the pulsed laser 101.

[0038] Figure 2 for Figure 1 The diagram shows a top view of one embodiment of the thermally conductive components included in the experimental system. Figure 2 This is a top-down view of the thermal conductive assembly from a perspective perpendicular to the test plate 103. The thermal conductive assembly shown in this embodiment includes thermally conductive regions 202 located on both sides of the light-transmitting region 201. Both sides of the light-transmitting region 201 are physically connected to the thermally conductive regions 202. Figure 3 for Figure 1An embodiment example of the heat conducting component and the orthographic projection of the unit die on the test board of the illustrated test system is shown. The light transmissive region 201 has a first orthographic projection 311 on the test board 103. The heat conducting regions 202 located on both sides of the light transmissive region 201 have a second orthographic projection 312 on the test board 103. The light transmissive region 201 is projected with a projection line perpendicular to the test board 103 to obtain the first orthographic projection 311. It can be seen that, because the light transmissive region 201 is physically connected with the heat conducting regions 202 on both sides, the edges of the first orthographic projection 311 on both sides coincide with the edges of the second orthographic projection 312. Alternatively, the light transmissive region 201 can also be located within the heat conducting regions 202, so that the light transmissive region 201 is physically connected with the heat conducting regions 202 on all sides. For the description of the physical connection between the light transmissive region 201 and the heat conducting regions 202, please refer to the way of the physical connection between the light transmissive region 201 and the unit die 104, which will not be described in detail.

[0039] The light transmissive region 201 is cross-sectioned with a plane parallel to the surface of the unit die 104 to obtain a cross-section. The cross-section of the light transmissive region 201 is rectangular. The heat conducting regions 202 are cross-sectioned with a plane parallel to the surface of the unit die 104 to obtain a cross-section. The cross-section of the heat conducting regions 202 is also rectangular. In other examples, the cross-sections of the light transmissive region 201 and the heat conducting regions 202 can be of any shape. For example, if the light transmissive region 201 is located within the heat conducting regions 202, the cross-section of the heat conducting regions 202 is circular ring-shaped. The cross-section of the light transmissive region 201 is circular. It can be seen that the outer peripheral wall of the light transmissive region 201 in this example is physically connected with the peripheral wall of the inner ring of the heat conducting regions 202.

[0040] Both the light transmissive region 201 and the heat conducting regions 202 have heat conducting properties. Both the light transmissive region 201 and the heat conducting regions 202 can dissipate the heat generated by the unit die 104 during the pulsed laser SEE simulation test. As shown, Figure 3 The unit die 104 has a third orthographic projection 320 on the test board 103. The third orthographic projection 320 is only within the coverage of the first orthographic projection 311, indicating that the unit die 104 is only physically connected with the light transmissive region 201. The light transmissive region 201 can absorb the heat of the unit die 104. The light transmissive region 201 can dissipate the absorbed heat. The heat conducting regions 202 located on both sides of the light transmissive region 201 can also dissipate the heat of the light transmissive region 201. It can be seen that the heat generated by the unit die 104 has two heat dissipation paths. Heat dissipation path 1: the heat generated by the unit die 104 is sequentially dissipated through the light transmissive region 201 and the heat conducting regions 202. Heat dissipation path 2: the heat generated by the unit die 104 is directly dissipated through the light transmissive region 201.

[0041] For example, the third orthographic projection is located within the coverage of the first orthographic projection and the second orthographic projection. For the description of the first orthographic projection, the second orthographic projection and the third orthographic projection, please refer to the description of the first orthographic projection, the second orthographic projection and the third orthographic projection in the first embodiment. Figure 3 As shown in the figure, the specific description is omitted. This example shows that the unit die 104 is physically connected with the light-transmitting region 201 and the heat-conducting region 202 at the same time. The heat generated by the unit die 104 has three heat dissipation paths. For the description of the heat dissipation path 1 and the heat dissipation path 2, please refer to the description of the heat dissipation path 1 and the heat dissipation path 2 in the first embodiment. Figure 3 For the corresponding description, the specific description is omitted. The heat dissipation path 3, the heat generated by the unit die 104 is directly dissipated via the heat-conducting region 202.

[0042] As shown in the figure, the area of the heat-conducting assembly in this embodiment is greater than the area of the unit die along the plane parallel to the test board. It can be seen that the heat-conducting assembly effectively improves the heat dissipation area of the unit die by dissipating the heat of the unit die. Since the light-transmitting region and the heat-conducting region included in the heat-conducting assembly can dissipate the heat of the unit die, the heat dissipation efficiency is effectively improved. Moreover, the process of dissipating the heat of the unit die will not cause mechanical vibration of the unit die, thereby improving the accuracy of the pulsed laser SEE simulation test.

[0043] The above-mentioned light-transmitting region 201 and the heat-conducting region 202 are integrally formed by the same material (for example, SiO2). In other examples, the light-transmitting region 201 and the heat-conducting region 202 can be made of different materials. Specifically, the light-transmitting region 201 is made of a first material. The heat-conducting region 202 is made of a second material. The light-transmitting rate of the first material is greater than or equal to a first preset value, and the heat-conducting coefficient of the first material is greater than or equal to a second preset value. The specific values of the first preset value and the second preset value are not limited in this embodiment, as long as the first material has the heat-conducting property and the light-transmitting property. For example, the first preset value is 90%, and the second preset value is 7.6 W / (m·K). The pulsed laser does not need to pass through the heat-conducting region 202, so the heat-conducting region 202 does not need to have the light-transmitting property. The heat-conducting coefficient of the second material is greater than or equal to the heat-conducting coefficient of the first material. For example, if the light-transmitting region 201 and the heat-conducting region 202 are both made of SiO2, the heat-conducting coefficient of the light-transmitting region 201 is the same as the heat-conducting coefficient of the heat-conducting region 202. For example, if the light-transmitting region 201 is made of SiO2 and the heat-conducting region 202 is made of a metal material, the heat-conducting coefficient of the heat-conducting region 202 is greater than the heat-conducting coefficient of the light-transmitting region 201. The light-transmitting region 201 itself has the heat-conducting property. In the case that the heat-conducting coefficient of the heat-conducting region 202 is greater than the heat-conducting system of the light-transmitting region 201, the heat-conducting region 202 can effectively accelerate the heat exchange efficiency between the light-transmitting region 201 and the outside. It can be seen that the heat-conducting coefficient of the heat-conducting region 202 being greater than the heat-conducting coefficient of the light-transmitting region 201 can effectively improve the heat dissipation efficiency of the unit die.

[0044] In the case that the light-transmitting region 201 and the heat-conducting region 202 are made of different materials, the heat-conducting region 202 is spliced with the peripheral wall of the light-transmitting region 201. For example, the heat-conducting region 202 can be adhered to the peripheral wall of the light-transmitting region 201 by means of adhesion. For another example, the heat-conducting region 202 can be welded to the peripheral wall of the light-transmitting region 201 by means of welding. The heat-conducting region 202 and the light-transmitting region 201 are spliced, which can effectively reduce the manufacturing difficulty of the heat-conducting assembly and improve the manufacturing efficiency of the heat-conducting assembly.

[0045] The application also provides a test system as shown in Figure 4 The test system as shown in Figure 4 The test system as shown in Figure 4 The test system as shown in Figure 4 The test system as shown in Figure 1 The test system as shown in Figure 2 The test system as shown in The test system as shown in

[0046] The test system as shown in Figure 5a The test system as shown in Figure 5b The test system as shown in Figure 5c The test system as shown in Figure 5a The test system as shown in Figure 4 The test system as shown in Figure 5b The test system as shown in Figure 4 The test system as shown in Figure 5c The test system as shown in Figure 4 The test system as shown in Figure 5c The test system as shown in The test system as shown in

[0047] The refrigeration device 401 shown in this embodiment transmits liquid cooling liquid to the heat conduction assembly 402 through a liquid cooling pipe. Specifically, the refrigeration device 401 is connected to an inlet liquid cooling pipe 501 and an outlet liquid cooling pipe 502. The outlet liquid cooling pipe 502 is used to transmit the liquid cooling liquid output by the refrigeration device 401. The outlet liquid cooling pipe 502 transmits the liquid cooling liquid to the heat conduction area 412. The liquid cooling liquid can absorb the heat of the heat conduction area 412. The liquid cooling liquid is then transmitted to the refrigeration device 401 through the inlet liquid cooling pipe 501. The refrigeration device 401 is used to dissipate the heat of the liquid cooling liquid received from the inlet liquid cooling pipe 501. The liquid cooling liquid can be water or hydrofluorocarbon liquid, etc., and the specific implementation is not limited. As long as the liquid cooling liquid can absorb the heat of the heat conduction area 412, it is acceptable. The internal structure of the refrigeration device 401 is not limited in this embodiment. The refrigeration device can dissipate the heat of the liquid cooling liquid received through the inlet liquid cooling pipe 501. For example, the refrigeration device can include a liquid cooling control unit (CDU) connected to the inlet liquid cooling pipe 501 and the outlet liquid cooling pipe 502. The CDU is used to dissipate the heat of the liquid cooling liquid from the inlet liquid cooling pipe 501 and output. The CDU is used to adjust at least one of the temperature or flow rate of the liquid cooling liquid input to the outlet liquid cooling pipe 502.

[0048] The liquid cooling liquid output by the outlet liquid cooling pipe 502 flows through the heat conduction area 412 to absorb the heat of the heat conduction area 412. To this end, the heat conduction area 412 has a heat conduction groove 511 for accommodating the liquid cooling liquid from the outlet liquid cooling pipe 502. In this embodiment, each of the heat conduction areas 412 located on both sides of the light transmission area 411 includes one heat conduction groove 511. Each heat conduction groove 511 has a cross section parallel to the surface of the unit die 104 to obtain a cross section. The cross section of the heat conduction groove 511 is rectangular. The number, position and cross section shape of the heat conduction groove are exemplary and not limited in this embodiment. For example, the cross section of the heat conduction groove can be annular. The light transmission area 411 is located at the center of the annular. Specifically, the heat conduction groove 511 has a first slot 512 and a second slot 513. The heat conduction groove 511 also includes an accommodation channel 514 connecting the first slot 512 and the second slot 513. The first slot 512 is in communication with the outlet liquid cooling pipe 502. The second slot 513 is in communication with the inlet liquid cooling pipe 501. It can be seen that the outlet liquid cooling pipe 502 transmits the liquid cooling liquid to the accommodation channel 514 through the first slot 512. The liquid cooling liquid is guided along the accommodation channel 514 to the second slot 513. The liquid cooling liquid flowing out of the second slot 513 is transmitted to the refrigeration device 401 through the inlet liquid cooling pipe 501.

[0049] The heat dissipation mode of the heat conduction assembly is described in combination with Figure 6 Figure 6 Figure 4 ​​An embodiment of the test system is shown in FIG. 6. The test system includes a heat conduction component and a unit die. The heat conduction component includes a light-transmissive region 411 and a heat conduction region 412. The unit die 104 is physically connected to the light-transmissive region 411 and the heat conduction region 412. The light-transmissive region 411 has a first orthographic projection 611 on the test board 103. The heat conduction region 412 has a second orthographic projection 612 on the test board 103. The unit die 104 has a third orthographic projection 601 on the test board 103. For more details, please refer to Figure 3 The heat conduction groove 511 has a fourth orthographic projection 613 on the test board 103. If the third orthographic projection 601 is only within the coverage of the first orthographic projection 611, it means that the unit die is only physically connected to the light-transmissive region 411. The light-transmissive region 411 can absorb the heat generated by the unit die. The light-transmissive region 411 can dissipate the absorbed heat. The liquid cooling liquid flowing through the heat conduction groove of the heat conduction region 412 can dissipate the heat of the light-transmissive region 411. Therefore, the heat generated by the unit die 104 has two dissipation paths. Dissipation path 1: the heat generated by the unit die 104 is sequentially dissipated by the light-transmissive region 411, the heat conduction region 412, and the liquid cooling liquid flowing through the heat conduction groove. Dissipation path 2: the heat generated by the unit die 104 is directly dissipated by the light-transmissive region 411.

[0050] For another example, the third orthographic projection 601 is within the coverage of the first orthographic projection and the second orthographic projection. For more details of the first orthographic projection, the second orthographic projection, and the third orthographic projection, please refer to Figure 6 As shown in FIG. 7, for more details, please refer to FIG. 6. This example shows that the unit die is physically connected to the light-transmissive region 411 and the heat conduction region 412. The heat generated by the unit die has three dissipation paths. For more details of dissipation path 1 and dissipation path 2, please refer to FIG. 6. Figure 6 For more details, please refer to FIG. 6. Dissipation path 3: the heat generated by the unit die 104 is sequentially dissipated by the heat conduction region 202 and the liquid cooling liquid flowing through the heat conduction groove. Therefore, the liquid cooling liquid flowing through the heat conduction groove of the embodiment shown can effectively improve the heat dissipation efficiency of the heat generated by the unit die during the pulsed laser SEE simulation test. The test system shown in this embodiment can be applied to the heat dissipation of high-power chips to be tested.

[0051] The liquid cooling liquid flowing through the heat conduction groove 511 does not interfere with the transmission of the pulsed laser. Specifically, the fourth orthogonal projection 613 of the heat conduction groove 511 on the test board 103 has a spacing between the first orthogonal projection 611 of the light transmission area 411 on the test board. It can be known that the heat conduction groove 511 and the light transmission area 411 do not overlap in position. Then, the liquid cooling liquid flowing through the heat conduction groove 511 does not interfere with the transmission path of the pulsed laser passing through the light transmission area 411. That is, the liquid cooling liquid flowing through the heat conduction groove 511 does not block the transmission of the pulsed laser. In the case where the heat conduction groove 511 and the light transmission area 411 do not overlap in position, it is effectively ensured that the pulsed laser can be successfully transmitted to the unit die. It effectively ensures the realizability and accuracy of the pulsed laser simulation SEE test.

[0052] The structure of the heat conduction assembly shown in the embodiment can also be seen from Figure 7 The heat conduction assembly included in the test system shown in Figure 7 The heat conduction assembly included in the test system shown in Figure 4 The second embodiment of the heat conduction assembly included in the test system shown in the embodiment is a side view structure example diagram. The heat conduction assembly 700 shown in the embodiment includes a light transmission area 701 and a heat conduction area 702. For the positional relationship of the light transmission area 701 and the heat conduction area 702, please refer to Figure 2 The heat conduction assembly included in the test system shown in the embodiment is a side view structure example diagram. The heat conduction assembly 700 shown in the embodiment includes a light transmission area 701 and a heat conduction area 702. For the positional relationship of the light transmission area 701 and the heat conduction area 702, please refer to Figure 7As shown, the height of the light-transmitting region 701 is greater than the height of the heat-conducting region 702. Alternatively, the height of the light-transmitting region 701 is less than or equal to the height of the heat-conducting region 702. The upper surface of the heat-conducting region 702 is fixed with the liquid cooling pipe 703. The upper surface of the heat-conducting region 702 is the surface of the heat-conducting region 702 facing the pulsed laser. The liquid cooling pipe 703 fixed on the upper surface of the heat-conducting region 702 is connected with the incoming liquid cooling pipe 501 and the outgoing liquid cooling pipe 502, respectively. As can be seen, the liquid cooling liquid output by the outgoing liquid cooling pipe 502 flows through the liquid cooling pipe 703 on the upper surface of the heat-conducting region 702. The liquid cooling pipe 703 on the upper surface of the heat-conducting region 702 absorbs the heat of the heat-conducting region 702 and then transmits the heat to the outgoing liquid cooling pipe 502. The specific way of fixing the liquid cooling pipe 703 on the upper surface of the heat-conducting region 702 is not limited in the embodiment. For example, the liquid cooling pipe 703 can be fixed on the upper surface of the heat-conducting region 702 by means of adhesion. The position of the liquid cooling pipe 703 is an optional example and is not limited in the embodiment. For example, the liquid cooling pipe 703 can also be fixed on the lower surface of the heat-conducting region 702. The lower surface of the heat-conducting region 702 is the surface of the heat-conducting region 702 facing the unit die. Alternatively, the liquid cooling pipe 703 is fixed on the side surface of the heat-conducting region 702. The side surface of the heat-conducting region 702 refers to the surface connected with the upper surface of the heat-conducting region 702 and the lower surface of the heat-conducting region 702. By fixing the liquid cooling pipe 703 on the surface of the heat-conducting region 703, the heat dissipation of the unit die is improved, and the flexibility of adjusting the position of the liquid cooling pipe 703 is improved. For example, when the power consumption of the unit die is relatively large, the liquid cooling pipe 703 can be additionally arranged on the surface of the heat-conducting region 703. In the embodiment, the liquid cooling pipe 703 is fixed on the surface of the heat-conducting region 703. In other examples, the liquid cooling pipe 703 can also pass through the heat-conducting region 703.

[0053] To avoid the interference of the liquid cooling pipe 703 on the transmission of the pulsed laser, the liquid cooling pipe 703 has a spacing between the orthographic projection of the liquid cooling pipe 703 on the test board and the orthographic projection of the light-transmitting region 701 on the test board. For specific description, please refer to Figure 6 For specific description of the spacing between the orthographic projection of the heat-conducting groove and the orthographic projection of the light-transmitting region 701 on the test board in the embodiment, please refer to the description above.

[0054] Figure 4The corresponding test system can also enable the unit die to be in the preset temperature range through negative feedback control during the process of performing the pulsed laser simulation SEE test. The unit die in the preset temperature range can ensure the normal test of the unit die during the process of performing the pulsed laser simulation SEE test. The unit die in the preset temperature range can also ensure the realizability and accuracy of the pulsed laser simulation SEE test. The preset temperature range is not limited in the embodiment. For example, the preset temperature range can be between 25 degrees Celsius and 125 degrees Celsius. To realize the negative feedback control, the control device 102 shown in the embodiment is also connected to a temperature sensor. The temperature sensor is integrated on the unit die. The temperature sensor can detect the temperature of the unit die and send a temperature indication message to the control device 102. The temperature indication message is used to indicate the temperature of the unit die. In other examples, the temperature sensor can also be arranged near the unit die. The position of the temperature sensor in the example is not limited, as long as the temperature sensor can accurately detect the temperature of the unit die.

[0055] The specific process of realizing negative feedback control in the embodiment is that the heat absorbed by the heat conduction area 412 is transmitted to the refrigeration device 401 via the inlet liquid cooling pipe 501. The control device 102 obtains the temperature indication message from the temperature sensor. The control device 102 sends control signaling to the refrigeration device according to the temperature indication message. The control signaling is used to control at least one of the temperature or flow rate of the second liquid cooling liquid output by the refrigeration device. The second liquid cooling liquid is obtained by the refrigeration device 401 after the first liquid cooling liquid is cooled. The second liquid cooling liquid is transmitted to the heat conduction area via the outlet liquid cooling pipe 502. The second liquid cooling liquid can absorb the heat of the heat conduction area. In the case that the heat of the heat conduction area is absorbed by the second liquid cooling liquid, the temperature of the unit die can be located in the preset temperature range. For example, if the control device 102 determines that the temperature of the unit die is greater than the maximum value of the preset temperature range, the control device 102 indicates the refrigeration device 401 to at least one of reduce the temperature of the second liquid cooling liquid or increase the flow rate of the second liquid cooling liquid through the control signaling. For another example, if the control device 102 determines that the temperature of the unit die is less than the minimum value of the preset temperature range, the control device 102 indicates the refrigeration device 401 to at least one of increase the temperature of the second liquid cooling liquid or reduce the flow rate of the second liquid cooling liquid through the control signaling. The control device 401 shown in the embodiment can adjust at least one of the temperature or flow rate of the second liquid cooling liquid output by the refrigeration device 401 multiple times until the temperature of the unit die is determined to be within the preset temperature range by the temperature sensor.

[0056] The application also provides a heat dissipation method. In the process of transmitting the pulsed laser emitted by the pulsed laser to the unit die, the method provided by the application can directly dissipate heat from the unit die through the heat conduction area. For the description of dissipating heat from the unit die through the heat conduction area, please refer to the description of Figure 1-3 , and details are not repeated.

[0057] Figure 8 An embodiment step flow chart of the heat dissipation method provided by the application is shown in the figure. As shown in the figure, the method comprises the following steps. Figure 8

[0058] Step 801: The pulsed laser emitted by the pulsed laser transmits to the chip to be tested through the light-transmitting area of the heat conduction assembly.

[0059] The pulsed laser transmitted to the chip to be tested can make the chip to be tested perform a pulsed laser simulation SEE test. For the specific process, please refer to the corresponding description, and details are not repeated. Figure 1

[0060] Step 802: The refrigeration device transmits the first liquid cooling liquid to the heat conduction area through the liquid cooling pipe.

[0061] The steps 801 and 802 shown in the embodiment are executed synchronously. That is, in the process of emitting the pulsed laser by the pulsed laser, the refrigeration device synchronously transmits the first liquid cooling liquid to the heat conduction area. For the process of transmitting the first liquid cooling liquid to the heat conduction area by the refrigeration device and dissipating heat from the unit die by the first liquid cooling liquid, please refer to the description of Figure 4 , Figure 5a , Figure 5b , Figure 5c , Figure 6 and Figure 7 , and details are not repeated.

[0062] Step 803: The control device acquires the temperature of the chip to be tested through the temperature sensor.

[0063] Step 804: The control device sends the control signaling to the refrigeration device according to the temperature.

[0064] Step 805: The refrigeration device controls at least one of the temperature or the flow rate of the second liquid cooling liquid output by the refrigeration device according to the control signaling.

[0065] Step 806: The refrigeration device transmits the second liquid cooling liquid to the heat conduction area through the liquid cooling pipe.

[0066] The steps 803-806 shown in the embodiment are optional steps. For the description of the specific execution process of the steps 803-806, please refer to the description of the corresponding embodiment, and details are not repeated. Figure 4

[0067] ​​​The embodiment of the present application can also provide a heat conduction assembly. The specific description of the heat conduction assembly can be found in Figure 1 , Figure 2 and Figure 3 the description of the corresponding embodiment, and will not be repeated here.

[0068] The embodiment of the present application can also provide a heat dissipation system. The heat dissipation system comprises a heat conduction assembly. The specific description of the heat conduction assembly can be found in Figure 1 , Figure 2 and Figure 3 the description of the corresponding embodiment, and will not be repeated here.

[0069] The embodiment of the present application can also provide a heat dissipation system. The heat dissipation system comprises a heat conduction assembly, a liquid cooling pipe and a refrigeration device. The specific description of the heat dissipation system can be found in Figure 4 , Figure 5a , Figure 5b , Figure 5c , Figure 6 and Figure 7 the description of the corresponding embodiment, and will not be repeated here.

[0070] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacements for some technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A test system for simulating single event effects of pulsed laser, characterized in that, The test system is used for implementing the pulse laser simulation single particle effect test, and the test system comprises a pulse laser and a heat conduction assembly; the heat conduction assembly is located between the pulse laser and a chip to be tested, the heat conduction assembly comprises a light transmission region and a heat conduction region, the light transmission region is physically connected with the heat conduction region, pulse laser emitted by the pulse laser is transmitted to the chip to be tested through the light transmission region, and the pulse laser is used for performing the pulse laser simulation single particle effect test on the chip to be tested. The light transmission region is physically connected with the chip to be tested, and heat of the chip to be tested is dissipated through the light transmission region and the heat conduction region.

2. The test system of claim 1, wherein, The light transmission region is made of a first material, the heat conduction region is made of a second material, a light transmission rate of the first material is greater than or equal to a first preset value, a heat conduction coefficient of the first material is greater than or equal to a second preset value, and the heat conduction coefficient of the second material is greater than or equal to the heat conduction coefficient of the first material.

3. The test system of claim 1 or 2, wherein, The test system further comprises a liquid cooling pipe and a refrigeration device connected with the liquid cooling pipe, the heat conduction region has a heat conduction groove, the liquid cooling pipe is connected with the heat conduction groove, and the refrigeration device is used for transmitting first liquid cooling liquid to the heat conduction groove through the liquid cooling pipe, and the first liquid cooling liquid flowing through the heat conduction groove is used for dissipating heat for the chip to be tested.

4. The test system of claim 3, wherein, The test system comprises a test board, the test board is used for carrying the chip to be tested, and a normal projection of the heat conduction groove on the test board has a spacing from a normal projection of the light transmission region on the test board.

5. The test system of claim 1 or 2, wherein, The test system further comprises a liquid cooling pipe and a refrigeration device connected with the liquid cooling pipe, the heat conduction region is used for fixing the liquid cooling pipe, and the refrigeration device is used for transmitting first liquid cooling liquid to the liquid cooling pipe, and the first liquid cooling liquid flowing through the liquid cooling pipe is used for dissipating heat for the chip to be tested.

6. The test system of claim 5, wherein, The test system comprises a test board, the test board is used for carrying the chip to be tested, and a normal projection of the heat conduction groove on the test board has a spacing from a normal projection of the light transmission region on the test board.

7. A test system according to any one of claims 3 to 6, characterised in that, The test system further comprises a control device connected with the refrigeration device, the control device is connected with a temperature sensor, the control device is used for acquiring a temperature of the chip to be tested through the temperature sensor, the control device is used for sending control signaling to the refrigeration device according to the temperature, and the control signaling is used for controlling at least one of a temperature or a flow rate of second liquid cooling liquid output by the refrigeration device, so that the temperature of the chip to be tested is located within a preset temperature range.

8. The test system of any one of claims 1 to 7, wherein, The chip to be tested is sequentially dissipated through the light transmission region and the heat conduction region.

9. The test system of any one of claims 1 to 8, wherein, The heat conduction region is spliced with a peripheral wall of the light transmission region.

10. A heat dissipation method for simulating single event effects of a pulsed laser, characterized in that, The heat dissipation method is applied to a test system of pulse laser simulation single particle effect, the heat dissipation method is used for dissipating heat for the test system in the process of the pulse laser simulation single particle effect test, and the method comprises: The pulsed laser emitted by the pulsed laser passes through the light transmission region of the heat conduction assembly and is transmitted to the to-be-tested chip, and the pulsed laser is used for performing a pulsed laser simulation single particle effect test on the to-be-tested chip. The heat conduction assembly is located between the pulsed laser and the to-be-tested chip. The heat conduction assembly comprises the light transmission region and the heat conduction region which are physically connected. The light transmission region is physically connected with the to-be-tested chip. The heat of the to-be-tested chip is dissipated through the light transmission region and the heat conduction region.

11. The method of claim 10, wherein, The method further comprises: The refrigeration device transmits first liquid cooling liquid to the heat conduction groove of the heat conduction region through a liquid cooling pipe, and the liquid cooling pipe is connected with the refrigeration device and the heat conduction groove respectively. The first liquid cooling liquid flowing through the heat conduction groove dissipates the heat of the to-be-tested chip.

12. The method of claim 10, wherein, The method further comprises: The refrigeration device transmits first liquid cooling liquid to the liquid cooling pipe fixed by the heat conduction region, and the liquid cooling pipe is connected with the refrigeration device. The first liquid cooling liquid flowing through the liquid cooling pipe dissipates the heat of the to-be-tested chip.

13. The method according to claim 11 or 12, characterized in that, The method further comprises: The control device acquires the temperature of the to-be-tested chip through a temperature sensor; The control device sends control signaling to the refrigeration device according to the temperature; The refrigeration device controls at least one of the temperature or the flow rate of the second liquid cooling liquid output by the refrigeration device according to the control signaling, so that the temperature of the to-be-tested chip is within a preset temperature range.

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