Metallic flake integrated waveguide structure

Abstract

The application discloses a metal sheet integrated waveguide structure which is a full-metal structure and is formed by stacking at least three metal substrates arranged from bottom to top, wherein air cavities filled with air are formed on at least one internal metal substrate by cutting off parts, and the metal substrates are connected to form a self-encapsulated structure. The metal sheet integrated waveguide structure technology can generate a multi-layer self-encapsulated structure, and independent circuit design can be performed on each layer to realize high-performance radio frequency, microwave and terahertz electricity; the full-metal integrated platform can fully utilize the low-loss and high-Q characteristics of the metal structure, and can create a circuit structure with good electromagnetic shielding and excellent heat dissipation performance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of radio frequency microwave circuits, and in particular to a metal sheet waveguide (MSW) structure. BACKGROUND

[0002] In modern communication systems, substrate integrated waveguide (SIW) is a kind of transmission line with great significance. SIW has the advantages of miniaturization, high integration, relatively low loss, etc., and can be widely used in the fields of microwave and millimeter wave. However, SIW also has some disadvantages, such as limited operating frequency, manufacturing process requirements, and low quality factor value. Especially at high frequencies, SIW is difficult to design circuit structures in the terahertz frequency band due to the limitations of processing technology.

[0003] Microwave devices based on metal waveguides are also a type of transmission line that transmits microwave energy, with the following advantages: 1. High power bearing capacity. Microwave devices based on metal waveguides can bear higher power due to the use of metal conductors, so they can be used in high-power microwave systems. 2. Low loss. The metal conductor inside the microwave device based on metal waveguide has good electrical conductivity and is not prone to energy dissipation, so it has low loss.

[0004] Microwave devices based on metal waveguides can be flexibly adjusted in size and geometry during design, thereby achieving wide operating frequency bandwidth transmission characteristics. However, microwave devices based on metal waveguides also have some disadvantages: 1. High manufacturing cost. The manufacturing cost of microwave devices based on metal waveguides is relatively high, requiring the use of precise machining equipment and technology, so the manufacturing difficulty is greater. 2. Poor dynamic tuning ability. The operating frequency of microwave devices based on metal waveguides is usually fixed, making it difficult to achieve efficient dynamic tuning ability. Moreover, metal waveguides have large size and volume. 3. Not conducive to miniaturization and integration. Metal waveguides are usually based on turning machining, which may result in knife marks, scales, and vibration marks during the machining process, thereby affecting the performance of the device. SUMMARY

[0005] The purpose of the present application is to solve the problems in the prior art and provide a metal sheet waveguide structure that can achieve high Q and easy processing integration. Based on the multi-layer metal integrated waveguide structure, a multi-layer circuit is designed using a multi-layer metal structure, which can achieve a metal transmission line and a metal resonator with high Q value based on the proposed metal sheet waveguide structure MSW, and realize the characteristics of high Q and easy integration.

[0006] The application is implemented by a metal sheet integrated waveguide structure, which is a full metal structure and is stacked by at least three layers of metal substrates arranged from bottom to top, and an air cavity filled with air is formed on at least one internal metal substrate by cutting off part of the metal substrate, and the multiple metal substrates are connected to form a self-enclosed structure.

[0007] The metal substrate is processed by metal etching or other processes.

[0008] The metal substrate is processed by metal etching or other processes.

[0009] The metal substrate is processed by metal etching or other processes.

[0010] The metal substrate is processed by metal etching or other processes.

[0011] The metal substrate is processed by metal etching or other processes.

[0012] The metal substrate is processed by metal etching or other processes.

[0013] The metal substrate is processed by metal etching or other processes.

[0014] The application utilizes the multi-layer metal sheet integrated waveguide circuit technology to generate a multi-layer self-enclosed structure and perform independent circuit design on each layer to realize high-performance radio frequency, microwave and terahertz circuits. The biggest advantage of the design scheme is to use a full metal integrated platform to fully utilize the low loss and high Q value characteristics of the metal structure, and to create a circuit structure with good electromagnetic shielding and excellent heat dissipation performance.

[0015] The application utilizes the multi-layer metal sheet integrated waveguide circuit technology to generate a multi-layer self-enclosed structure and perform independent circuit design on each layer to realize high-performance radio frequency, microwave and terahertz circuits. The biggest advantage of the design scheme is to use a full metal integrated platform to fully utilize the low loss and high Q value characteristics of the metal structure, and to create a circuit structure with good electromagnetic shielding and excellent heat dissipation performance. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 The application is implemented by a metal sheet integrated waveguide structure, which is a full metal structure and is stacked by at least three layers of metal substrates arranged from bottom to top, and an air cavity filled with air is formed on at least one internal metal substrate by cutting off part of the metal substrate, and the multiple metal substrates are connected to form a self-enclosed structure.

[0017] Figure 2 The application is implemented by a metal sheet integrated waveguide structure, which is a full metal structure and is stacked by at least three layers of metal substrates arranged from bottom to top, and an air cavity filled with air is formed on at least one internal metal substrate by cutting off part of the metal substrate, and the multiple metal substrates are connected to form a self-enclosed structure.

[0018] Figure 3 This is the simulation response of the dual-frequency filter designed based on the metal-integrated MSW structure transmission line of this invention.

[0019] Figure 4 This is a schematic diagram of a third-order filter and waveguide feeding structure based on a metal-integrated MSW structure, as well as the present invention.

[0020] Figure 5 This is the simulation response of the vertically integrated filter designed based on the metal-integrated MSW structure of this invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are some embodiments of the present invention, but not all embodiments.

[0022] The overall structure of the metal thin-film integrated waveguide (MSW) based on all-metal integration of the present invention is composed of multiple stacked metal substrates. Taking a three-layer metal substrate as an example, see [link to relevant documentation]. Figure 1 As shown, it can be derived from Figure 1 The circuit consists of a first metal substrate 1, a second metal substrate 2, and a third metal substrate 3 arranged sequentially from top to bottom. The microwave radio frequency circuit can be designed on any layer and can be designed by etching any shape on the metal substrate. The second metal substrate 2 is partially cut off to form an air-filled hollow cavity.

[0023] In some embodiments, each metal substrate can be fabricated from aluminum, copper, or other alloys through processes such as metal etching.

[0024] In some embodiments, to form a closed cavity structure internally, through-holes are drilled in each metal substrate layer and penetrate all metal substrates. In some embodiments, the multilayer metal substrates are connected by countersunk holes, rivets, or soldering to form a self-encapsulating structure.

[0025] Secondly, active and / or passive devices can be embedded in the metal cavity. Active devices include, but are not limited to, amplifiers, voltage-controlled oscillators, active mixers, active frequency multipliers, and other active devices.

[0026] The thickness of each metal substrate can be freely set according to actual needs. The thickness can be the same or different. Generally speaking, the thickness of the metal substrate forming the metal cavity is greater than the thickness of the metal substrates on both sides. The thickness of the metal substrates on both sides of the metal substrate forming the metal cavity can generally be the same and relatively thin.

[0027] like Figure 2 As shown, Figure 2It is shown that the circuit based on the MSW design can design a transmission line structure of any shape. Taking a three-layer metal substrate as an example, a metal cavity is formed on the second metal substrate 2, and the structure or shape of the metal cavity makes the second metal substrate form a similar square shape, and the internal cross structure is disconnected in three directions. Unlike Figure 1 The square shape or the back shape is shown, and the first coaxial feed line 4 and the second coaxial feed line 5 are arranged at the top end of the first metal substrate 1. Based on this, a high-Q double-frequency cavity filter can be designed. Figure 3 For Figure 2 The simulation response of the structure shown is shown. The simulation insertion loss is 0.29 dB and 0.30 dB, and the two passbands are 100 MHz bandwidth.

[0028] As Figure 4 shown, Figure 4 It is shown that the circuit based on the MSW design can design a resonant type structure, and various patterns can be drawn on a multi-layer metal substrate. Here, methods such as chemical etching or laser cutting can be used for design. There are four metal substrates (including metal substrate one 31, metal substrate two 32, metal substrate three 33, and metal substrate four 34) without cutting to form air cavities in the middle, and three metal substrates (including metal cavity plate one 21, metal cavity plate two 22, and metal cavity plate three 23) with cut parts in the middle to form rectangular air cavities. The upper surface of the top metal substrate one 31 is arranged with a waveguide feed port one 41, and the lower surface of the bottom metal substrate one 31 is arranged with a waveguide feed port two 42. It is a three-order three-zero-point filter, which is designed by vertically integrating three MSW units. The zero point can be placed anywhere. Here, the zero point is placed at the low frequency, and the transmission zero point can be placed at any position by changing the position of the waveguide feed port and the coupling window. Figure 5 The simulation response is shown. The passband center frequency is 20 GHz, the fractional bandwidth is 2%, the zero point is located at 19.22 GHz, 19.47 GHz and 19.56 GHz, and the simulation insertion loss is 0.29 dB.

[0029] From the above analysis, it can be seen that the metal sheet integrated waveguide structure MSW proposed by the present application can be externally connected by rivet process or soldering, and other devices can also be placed in the cavity structure formed by the structure. Since the present application is a full-metal structure, it has good shielding and heat dissipation functions.

[0030] The above only describes the preferred embodiments of the present application, and it should be pointed out that for ordinary skilled persons in the technical field, some improvements and refinements can be made without departing from the principles of the present application, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A metal flake integrated waveguide structure, characterized by, The application relates to a full-metal structure, which is formed by at least three layers of metal substrates arranged from top to bottom, air cavities filled with air are formed on at least one internal metal substrate by cutting off parts, and the metal substrates are connected to form a self-enclosed structure; a preset shape or pattern is formed on any metal substrate by chemical etching or laser cutting to design a microwave radio frequency circuit; passive devices and / or active devices are embedded in the air cavities; the active devices include one or more of an amplifier, a voltage-controlled oscillator, an active mixer and an active frequency multiplier; the metal substrates are connected by means of a counterbore, a rivet or tin soldering to form a self-enclosed structure; and a uniform through hole is formed on each metal substrate along the outer edge direction and penetrates all the metal substrates.

2. The metal-plate integrated waveguide structure according to claim 1, wherein The metal substrate is made of aluminum, copper or alloy and processed by a metal etching process.

3. The metal-plate integrated waveguide structure according to claim 1, wherein The thickness of each metal substrate is freely set according to actual requirements.

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