Solder pump with intelligent switchable selective soldering machine

Abstract

The application discloses a selective soldering machine with a solder pump capable of intelligent switching, which comprises a machine cover, a PCB clamping and conveying device and a solder pump intelligent switching device. A PCB feeding port is formed in the middle of the left end face of the machine cover, and a PCB discharging port is formed in the middle of the right end face. The PCB clamping and conveying device is fixedly arranged in the machine cover along the left-right direction, and the left and right ends of the device correspond to the PCB feeding port and the PCB discharging port. The solder pump intelligent switching device is fixedly arranged in the machine cover and located below the PCB clamping and conveying device, and has two solder pumps arranged upwards and capable of switching the welding positions in a rotating mode. The two solder pumps are switched in a rotating mode, so that the occupied space of the whole device can be greatly reduced. The two solder pumps are switched in a rotating mode, so that the operation is simple, and the movement paths of the two solder pumps are relatively short, so that the running speed is high, and the working efficiency of the soldering machine can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of automation equipment, in particular to a selective soldering machine with intelligent switching of solder pumps. BACKGROUND

[0002] The soldering machine is an intelligent automatic mechanical equipment, which generally has a large-size transparent window to facilitate observation of the entire soldering process, and plays a very important role in product research and development and process curve optimization. The temperature control adopts a high-precision intuitive intelligent controller, which can be programmed to perfectly control the curve, accurately control the temperature, and easily set parameters. It can complete the soldering of single and double-sided PCB boards of all packaging forms such as CHIP, SOP, PLCC, QFP, and BGA. The working efficiency is extremely high, and one soldering machine with one silk screen table and two workers can complete nearly 100 large-size PCB boards or thousands of small-size PCB boards per day. The soldering machine changes the method of relying on natural cooling or pulling out the PCB board outside the soldering machine for cooling, making the reflow soldering process curve more perfect, and avoiding damage to surface-mounted devices and soldering displacement problems.

[0003] For the existing soldering machine, due to the different soldering positions of the PCB board, some positions need to be soldered with large soldering points, and some positions need to be soldered with small soldering points. Therefore, the existing soldering machine generally needs to be equipped with two solder pumps with different inner diameters for pumping liquid solder, and the traditional two solder pumps are basically arranged side by side and driven to rise and fall by two separate lifting devices arranged on a linear conveyor, such as lifting device A controlling the lifting of solder pump A and lifting device B controlling the lifting of solder pump B. When solder pump A is needed, it is conveyed to the designated position by the linear conveyor and controlled to rise by a preset stroke by lifting device A to align the soldering point on the PCB board at the corresponding designated position and work. At this time, solder pump B needs to be controlled to fall by a preset stroke by lifting device B to stop working. When solder pump B is needed, it is conveyed to the designated position by the linear conveyor and controlled to rise by a preset stroke by lifting device B to align the soldering point on the PCB board at the corresponding designated position and work. At this time, solder pump A needs to be controlled to fall by a preset stroke by lifting device A to stop working.

[0004] For the soldering machine equipped with two solder pumps with different powers for pumping liquid solder, although it is widely used, the present inventors have found that it still has certain defects and shortcomings in actual use.

[0005] Specifically, in one aspect, when the solder pumps A and B are alternately conveyed to the same designated position using the linear conveyer, the linear conveyer used needs to be long enough, which greatly increases the occupied space of the entire device, and the hood set also needs to be large enough, which greatly increases the volume of the entire device. In another aspect, when the solder pumps A and B are alternately conveyed to the same designated position or to different positions using the linear conveyer, the operation is troublesome, the conveying path is long, the operation speed is slow, and the working efficiency of the entire soldering machine cannot be effectively improved.

[0006] Therefore, the existing problems need to be solved. SUMMARY

[0007] The present application aims to at least solve one of the technical problems in the related art. To this end, the purpose of the present application is to provide a selective soldering machine with intelligent switching of solder pumps.

[0008] To achieve one of the above purposes, the selective soldering machine with intelligent switching of solder pumps according to an embodiment of the present application comprises:

[0009] a hood; a PCB board feeding port is formed in the middle of the left end face of the hood, and a PCB board discharging port is formed in the middle of the right end face of the hood, and the PCB board discharging port is opposite to the PCB board feeding port;

[0010] a PCB board clamping and conveying device; the PCB board clamping and conveying device is fixedly arranged in the hood along the left-right direction, and the left and right ends of the PCB board clamping and conveying device correspond to the PCB board feeding port and the PCB board discharging port;

[0011] a solder pump intelligent switching device; the solder pump intelligent switching device is fixedly arranged in the hood and located below the PCB board clamping and conveying device, and has two solder pumps arranged upwards and capable of switching the welding position in a rotating manner.

[0012] According to one embodiment of the present application, a two-dimensional moving table is further included to control the forward and backward movement and the left and right movement of the solder pump intelligent switching device;

[0013] the two-dimensional moving table is fixedly arranged in the bottom of the hood; and the solder pump intelligent switching device is mounted on the two-dimensional moving table.

[0014] According to one embodiment of the present application, the solder pump intelligent switching device comprises a rotating disc type bracket, a first solder pump, a second solder pump, a first lifting member, a second lifting member, and a fixing ring.

[0015] The first lifting member and the second lifting member are movably installed on the rotary disc carrier; the first solder pump is fixedly arranged on the top of the first lifting member; and the second solder pump is fixedly arranged on the top of the second lifting member.

[0016] The fixed ring frame is arranged outside the bottom of the rotary disc carrier and is installed on the two-dimensional moving table together with the rotary disc carrier, and an arc-shaped slope is arranged on the upper end surface of the fixed ring frame; the first lower convex member is arranged on the bottom of the first lifting member and can rotate on the upper end surface of the fixed ring frame; and the second lower convex member is arranged on the bottom of the second lifting member and can rotate on the upper end surface of the fixed ring frame.

[0017] When the rotary disc carrier rotates to the first position, the first lower convex member is arranged on the top surface of the arc-shaped slope to drive the first lifting member to rise and lift the first solder pump; and when the rotary disc carrier rotates to the second position, the second lower convex member is arranged on the top surface of the arc-shaped slope to drive the second lifting member to rise and lift the second solder pump.

[0018] According to one embodiment of the present application, the rotary disc carrier comprises a fixed base installed on the two-dimensional moving table, a lower rotary disc rotatably sleeved on the upper part of the fixed base, an upper rotary disc arranged above the lower rotary disc, a driving rotary motor fixedly arranged on the upper end surface of the lower rotary disc, and a gear coaxially fixedly arranged outside the lower end rotary shaft of the driving rotary motor.

[0019] The fixed base is installed on the two-dimensional moving table; the first lifting member and the second lifting member are movably installed on the upper rotary disc; the fixed ring frame is arranged outside the fixed base, and a gap is arranged between the inner surface of the fixed ring frame and the outer circumferential surface of the fixed base; and a row of rotary teeth is arranged on the inner surface of the fixed ring frame; the gear is located in the gap and is engaged with the rotary teeth.

[0020] According to one embodiment of the present application, the first lower convex member comprises a first fixed cylinder arranged on the bottom of the first lifting member and a first ball sleeved in the first fixed cylinder; and the second lower convex member comprises a second fixed cylinder arranged on the bottom of the second lifting member and a second ball sleeved in the second fixed cylinder.

[0021] The lower part of the first fixed cylinder is provided with a first necking portion; the lower part of the first ball is exposed from the first necking portion; the lower part of the second fixed cylinder is provided with a second necking portion; and the lower part of the second ball is exposed from the second necking portion.

[0022] According to one embodiment of the present application, the first lifting member comprises a first top supporting plate, a first bottom supporting plate, and a plurality of first guide columns uniformly connected between the lower circumferential surface of the first top supporting plate and the upper end circumferential surface of the first bottom supporting plate.

[0023] The first solder pump is fixed upward on the first top supporting plate; the upper rotating disc is provided with a plurality of first guide holes corresponding to the plurality of first guide columns; the first fixed cylinder of the first lower protruding piece is fixed vertically on the lower bottom surface of the first bottom supporting plate.

[0024] According to one embodiment of the present application, the second lifting piece comprises a second top supporting plate, a second bottom supporting plate and a plurality of second guide columns uniformly connected between the lower bottom surface periphery of the second top supporting plate and the upper end surface periphery of the second bottom supporting plate.

[0025] The second solder pump is fixed upward on the second top supporting plate; the upper rotating disc is provided with a plurality of second guide holes corresponding to the plurality of second guide columns; the second fixed cylinder of the second lower protruding piece is fixed vertically on the lower bottom surface of the second bottom supporting plate.

[0026] According to one embodiment of the present application, the rotating disc type bracket further comprises a jacking device.

[0027] The jacking device is connected between the lower rotating disc and the upper rotating disc; when the jacking device controls the upper rotating disc to rise by a preset stroke, it can jack up the first top supporting plate and / or the second top supporting plate.

[0028] According to one embodiment of the present application, the PCB board clamping and conveying device comprises a front clamping piece and a rear clamping piece.

[0029] The front clamping piece comprises a front support, a front driving motor and a plurality of front conveying pieces; the front support is uniformly provided with a plurality of front fixed holes vertically from left to right; the middle portions of the plurality of front conveying pieces are rotatably clamped in the plurality of front fixed holes, and the upper ends of the plurality of front conveying pieces are coaxially provided with front driven gears, and the lower ends are coaxially provided with front inverted T-shaped jacking portions for jacking the front side of the PCB board; the plurality of front driven gears are sleeved with a front transmission chain; the front driving motor is installed on the front support, and the rotating shaft thereof is sleeved with a front driving gear engaged with the front transmission chain.

[0030] The rear clamping piece comprises a rear support, a rear driving motor and a plurality of rear conveying pieces; the rear support is uniformly provided with a plurality of rear fixed holes vertically from left to right; the middle portions of the plurality of rear conveying pieces are rotatably clamped in the plurality of rear fixed holes, and the upper ends of the plurality of rear conveying pieces are coaxially provided with rear driven gears, and the lower ends are coaxially provided with rear inverted T-shaped jacking portions for jacking the rear side of the PCB board; the plurality of rear driven gears are sleeved with a rear transmission chain; the rear driving motor is installed on the rear support, and the rotating shaft thereof is sleeved with a rear driving gear engaged with the rear transmission chain.

[0031] According to one embodiment of the present application, the PCB clamping and conveying device further comprises a front-rear moving member;

[0032] The front-rear moving member is fixedly arranged at an upper portion of the machine cover, and the rear support is mounted on the front-rear moving member and can move forward and backward under the control of the front-rear moving member.

[0033] The present application has the following advantages:

[0034] Compared with the operation mode of the background art, the rotation mode for switching the positions of the two solder pumps can greatly reduce the occupied space of the entire device, so that the machine cover can also be greatly reduced, thereby greatly reducing the volume of the entire soldering machine device. Moreover, compared with the operation mode of the background art, the rotation mode for switching the positions of the two solder pumps is simple to operate, and the movement paths of the two solder pumps are relatively short, so that the operation speed is fast, and the working efficiency of the entire soldering machine can be effectively improved.

[0035] Additional aspects and advantages of the present application will be described in the following description and will become apparent from the following detailed description, or can be learned from practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0036] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in the drawings without creative labor.

[0037] Figure 1 is the overall structure schematic of the selective soldering machine with the solder pump capable of intelligent switching of the present application Figure 1 ;

[0038] Figure 2 is the overall structure schematic of the selective soldering machine with the solder pump capable of intelligent switching of the present application Figure 2 ;

[0039] Figure 3 is the overall structure schematic of the selective soldering machine with the solder pump capable of intelligent switching of the present application when the upper half of the machine cover is removed Figure 3 ;

[0040] Figure 4 is the overall structure schematic of the selective soldering machine with the solder pump capable of intelligent switching of the present application when the upper half of the machine cover is removed Figure 4 ;

[0041] Figure 5The PCB board clamping and conveying device is fixed together with the left and right hangers as a whole Figure 1 ;

[0042] Figure 6 The PCB board clamping and conveying device is fixed together with the left and right hangers as a whole Figure 2 ;

[0043] Figure 7 The overall structure of the solder pump intelligent switching device Figure 1 ;

[0044] Figure 8 The exploded view of the solder pump intelligent switching device Figure 1 ;

[0045] Figure 9 The overall structure of the solder pump intelligent switching device Figure 2 ;

[0046] Figure 10 The exploded view of the solder pump intelligent switching device Figure 2 ;

[0047] Reference signs:

[0048] The solder pump can be intelligently switched in the selective soldering machine 1000.

[0049] The machine cover 10.

[0050] The PCB board inlet 101; the PCB board outlet 102.

[0051] The PCB board clamping and conveying device 20.

[0052] The front clamping piece 201.

[0053] The front support 2011; the front fixed hole 20111; the front driving motor 2012; the front driving gear 20121; the front conveying piece 2013; the rear driving gear 20131; the rear inverted T-shaped lifting part 20132.

[0054] The rear clamping piece 202.

[0055] The rear support 2021; the rear fixed hole 20211; the rear driving motor 2022; the rear driving gear 20221; the rear conveying piece 2023; the rear driving gear 20231; the rear inverted T-shaped lifting part 20232.

[0056] The front and rear moving member 203.

[0057] Left front rotating seat 2031; left rear rotating seat 2032; left rotating screw 2033; left slide rail 2034; left slide block 2035; left turbine 2036; right front rotating seat 2037; right rear rotating seat 2038; right rotating screw 2039; right slide rail 2040; right slide block 2041; right turbine 2042; worm 2043; transmission motor 2044;

[0058] Solder pump intelligent switching device 30;

[0059] Rotary disc type bracket 301;

[0060] Fixed base 3011; lower rotary disc 3012; upper rotary disc 3013; first guide hole 30131; first through hole 30132; second guide hole 30133; second through hole 30134; driving motor 3014; gear 3015; jacking device 3016;

[0061] First solder pump 302;

[0062] Second solder pump 303;

[0063] First lifting piece 304;

[0064] First lower protruding piece 304a; first fixed cylinder 304a1; first ball 304a2; first top supporting plate 3041; first bottom supporting plate 3042; first guide column 3043;

[0065] Second lifting piece 305;

[0066] Second lower protruding piece 305a; second fixed cylinder 305a1; second ball 305a2; second top supporting plate 3051; second bottom supporting plate 3052; second guide column 3053;

[0067] Fixed ring 306;

[0068] Arcuate slope table 3061; rotary tooth 3062;

[0069] CCD camera 307;

[0070] Two-dimensional moving table 40;

[0071] Front and rear moving mechanism 401;

[0072] Left and right moving mechanism 402;

[0073] Left hanger 50;

[0074] Right hanger 60;

[0075] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0076] The embodiments of the present application will be described in detail below with reference to the accompanying drawings, examples of which are shown in the drawings, wherein the same or similar components have the same reference numerals throughout the specification. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application, and are not understood as limiting the present application, and all other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative labor fall within the scope of the present application.

[0077] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial" and the like are based on the orientation or positional relationship shown in the drawings of the specification, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0078] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0079] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be the communication inside two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0080] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature is "on", "above" and "over" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the first feature is higher in horizontal height than the second feature. The first feature is "under", "below" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the first feature is lower in horizontal height than the second feature.

[0081] The solder pump intelligent switching selective soldering machine 1000 provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0082] Referring to Figures 1 to 4 As shown, the solder pump intelligent switching selective soldering machine 1000 provided by the embodiment of the present application comprises:

[0083] A machine cover 10; the machine cover 10 is provided with a PCB feeding port 101 in the middle of the left end face and a PCB discharging port 102 opposite to the PCB feeding port 101 in the middle of the right end face;

[0084] A PCB clamping and conveying device 20; the PCB clamping and conveying device 20 is fixedly arranged in the machine cover 10 along the left-right direction, and the left and right ends thereof correspondingly connect with the PCB feeding port 101 and the PCB discharging port 102;

[0085] A solder pump intelligent switching device 30; the solder pump intelligent switching device 30 is fixedly arranged in the machine cover 10 and is located below the PCB clamping and conveying device 20, and has two solder pumps arranged upwards and capable of switching the welding position in a rotating manner.

[0086] In a specific implementation, the two solder pumps of the solder pump intelligent switching device 30 have different inner diameters of the soldering nozzles.

[0087] Based on the above description, it can be clearly understood that the present application is mainly used as the solder pump intelligent switching selective soldering machine 1000 in a specific implementation.

[0088] Specifically, in the application of the present application, the present application is assembled according to the above-mentioned structure, when it is needed to use the present application to weld the soldering points of a certain part on the PCB, the incoming PCB is pushed into the machine cover 10 from the PCB feeding port 101 to be horizontally clamped by the PCB clamping and conveying device 20, and then the soldering points of a certain part on the PCB can be welded by the solder pump intelligent switching device 30.

[0089] Due to the two solder pumps of the solder pump intelligent switching device 30 can switch the welding position in a rotating manner, for a certain welding position on the PCB, the larger solder joint can be welded by the solder pump with a larger nozzle inner diameter first, then the two solder pumps of the solder pump intelligent switching device 30 are rotated to switch the positions, at this time, the smaller solder joint can be welded by the solder pump with a smaller nozzle inner diameter, or the smaller solder joint can be welded by the solder pump with a smaller nozzle inner diameter first, then the two solder pumps of the solder pump intelligent switching device 30 are rotated to switch the positions, at this time, the larger solder joint can be welded by the solder pump with a larger nozzle inner diameter.

[0090] For the above-mentioned related operation, the positions of the two solder pumps are switched in a rotating manner, compared with the operation mode of the background art, the occupied space of the entire device can be greatly reduced, so that the machine cover 10 can also be greatly reduced, thereby the volume of the entire soldering machine device can be greatly reduced.

[0091] Moreover, the positions of the two solder pumps are switched in a rotating manner, compared with the operation mode of the background art, the operation is simple, and relatively, the movement paths of the two solder pumps are short, so that the running speed is fast, and the working efficiency of the entire soldering machine can be effectively improved.

[0092] Furthermore, through the above-mentioned optimization design, the entire application has strong practicability and good use effect.

[0093] Further, in specific implementation, referring to Figure 3 and Figure 4 , according to one embodiment of the application, the application further includes a two-dimensional moving table 40 for controlling the front and back movement and the left and right movement of the solder pump intelligent switching device 30.

[0094] Among them, the two-dimensional moving table 40 is fixedly arranged on the bottom of the machine cover 10; the solder pump intelligent switching device 30 is installed on the two-dimensional moving table 40.

[0095] It needs to be explained that when the two soldering nozzles of the soldering pump are used to solder the soldering points at a certain soldering position on the corresponding PCB, the left and right positions and the front and back positions need to be finely adjusted. Therefore, by arranging the two-dimensional moving table 40, the front and back movement and the left and right movement of the soldering pump intelligent switching device 30 can be well controlled, so as to finally drive the two soldering nozzles of the soldering pump intelligent switching device 30 to move forward and backward and left and right, thereby facilitating the soldering of the soldering points at a certain soldering position on the corresponding PCB.

[0096] Preferably, in the technical scheme of the present application, the two-dimensional moving table 40 comprises a front and back moving mechanism 401 and a left and right moving mechanism 402.

[0097] The front and back moving mechanism 401 is fixedly arranged on the inner bottom of the machine cover 10 in the front and back direction, the left and right moving mechanism 402 is fixedly arranged on the front and back moving mechanism 401 in the left and right direction, and the soldering pump intelligent switching device 30 is installed on the left and right moving mechanism 402.

[0098] Furthermore, under the driving of the front and back moving mechanism 401, the left and right moving mechanism 402 and the soldering pump intelligent switching device 30 fixedly arranged thereon can move forward and backward, and under the driving of the left and right moving mechanism 402, the soldering pump intelligent switching device 30 fixedly arranged thereon can move left and right.

[0099] Preferably, in the technical scheme of the present application, the front and back moving mechanism 401 and the left and right moving mechanism 402 are both screw rod transmission linear modules or cylinder transmission linear modules, which are mature technologies and are commonly used in various two-dimensional moving mechanisms and three-dimensional moving mechanisms, so details thereof will not be described here.

[0100] Further, in specific implementation, referring to Figures 7 to 10 According to one embodiment of the present application, the soldering pump intelligent switching device 30 comprises a rotating disc type bracket 301, a first soldering pump 302, a second soldering pump 303, a first lifting piece 304, a second lifting piece 305, and a fixing ring 306.

[0101] The first lifting piece 304 and the second lifting piece 305 are both installed on the rotating disc type bracket 301 and can move up and down, the first soldering pump 302 is fixedly arranged on the top of the first lifting piece 304, and the second soldering pump 303 is fixedly arranged on the top of the second lifting piece 305.

[0102] And, the fixed ring 306 is arranged outside the bottom of the turntable bracket 301, and is installed on the two-dimensional moving table 40 together with the turntable bracket 301, and is preferably installed on the left-right moving mechanism 402, and an arc-shaped slope 3061 is arranged around the upper end face thereof; the first lifting piece 304 is provided with a first lower protrusion 304a at the bottom thereof, which abuts against the upper end face of the fixed ring 306 and can rotate along the upper end face of the fixed ring 306; and the second lifting piece 305 is provided with a second lower protrusion 305a at the bottom thereof, which abuts against the upper end face of the fixed ring 306 and can rotate along the upper end face of the fixed ring 306.

[0103] And, in a specific implementation, the inner diameter of the soldering nozzle of the first soldering pump 302 is smaller than that of the second soldering pump 303.

[0104] When the turntable bracket 301 is rotated to the first position, the first lower protrusion 304a abuts against the top surface of the arc-shaped slope 3061, so as to drive the first lifting piece 304 to rise and lift the first soldering pump 302; and when the turntable bracket 301 is rotated to the second position, the second lower protrusion 305a abuts against the top surface of the arc-shaped slope 3061, so as to drive the second lifting piece 305 to rise and lift the second soldering pump 303.

[0105] For this purpose, it should be noted that, in a specific implementation, the present application is implemented by the following operation mode.

[0106] Firstly, when the position of a smaller soldering point on a PCB needs to be soldered, the turntable bracket 301 is rotated to the first position, at this time, the first lower protrusion 304a abuts against the top surface of the arc-shaped slope 3061, so as to drive the first lifting piece 304 to rise and lift the first soldering pump 302, and at this time, the second lower protrusion 305a is in a low position, so that the second soldering pump 303 fixedly arranged at the top of the second lifting piece 305 is also in a low position, thus, the soldering pump intelligent switching device 30 is driven by the two-dimensional moving table 40 to move to a suitable position, so that the soldering nozzle of the first soldering pump 302 is aligned with the position of a smaller soldering point on a PCB, and the soldering nozzle of the first soldering pump 302 can be used to solder the position of a smaller soldering point on a PCB, and at this time, since the second soldering pump 303 is in a low position, the soldering nozzle of the second soldering pump 303 is far away from the position of a smaller soldering point on a PCB, so as not to constitute an obstacle, thereby facilitating the stable and smooth operation of the first soldering pump 302.

[0107] Second, when the larger soldering position on the PCB needs to be soldered, the rotating disc bracket 301 is rotated to the second position, at this time, the second lower convex piece 305a will be on the top surface of the arched slope 3061 to drive the second lifting piece 305 to rise and lift the second solder pump 303, and at this time, the first lower convex piece 304a will be in a low position, so that the first solder pump 302 fixed on the top of the first lifting piece 304 is also in a low position, so that the soldering pump intelligent switching device 30 is driven by the two-dimensional moving table 40 to move to the appropriate position, so that the nozzle of the second solder pump 303 is aligned with the larger soldering position on the PCB, and the larger soldering position on the PCB can be soldered by the nozzle of the second solder pump 303. At this time, since the first solder pump 302 is in a low position, the nozzle of the first solder pump 302 is far away from the larger soldering position on the PCB, so as not to interfere with the work of the second solder pump 303.

[0108] For the above, it can be summarized as follows:

[0109] On the one hand, under the combination of the rotating disc bracket 301, the first lifting piece 304, the second lifting piece 305 and the fixed ring 306, the first solder pump 302 and the second electromagnetic pump can be lifted to a certain height according to actual needs without being in front of or behind each other to solder the soldering position on the PCB. In this process, the first solder pump 302 and the second electromagnetic pump are mainly switched in position and lifted by rotating the rotating disc bracket 301. Especially for the soldering position on the PCB, some soldering positions have large and small soldering positions, only the top surface of the arched slope 3061 is opposite to the corresponding soldering position, so that the first solder pump 302 is rotated to the corresponding soldering position and lifted to a predetermined stroke to solder the small soldering position of the corresponding soldering position, and the second solder pump 303 is rotated to the corresponding soldering position and lifted to a predetermined stroke to solder the large soldering position of the corresponding soldering position. For the above-mentioned operation, the first solder pump 302 and the second solder pump 303 are switched in position and switched in high position by rotating, which can greatly reduce the occupied space of the whole device compared with the operation mode of the background art, so that the machine cover 10 can be greatly reduced, so that the volume of the whole soldering machine device can be greatly reduced.

[0110] In another aspect, the first solder pump 302 and the second solder pump 303 are switched in position and height by rotation, which is simpler than the operation mode of the prior art, and the first solder pump 302 and the second solder pump 303 have short movement paths, so that they run fast and effectively improve the working efficiency of the soldering machine.

[0111] Furthermore, the optimization design makes the whole soldering machine have improved use effect.

[0112] Furthermore, in the specific implementation, according to one embodiment of the present application, the arc-shaped slope 3061 of the fixed ring 306 is smoothly connected to the upper end surface of the fixed ring 306. Figures 7 to 10 As shown, according to one embodiment of the present application, the rotating disc type bracket 301 comprises a fixed base 3011 installed on the left and right moving mechanism 402 of the two-dimensional moving table 40, a lower rotating disc 3012 rotatably sleeved on the upper part of the fixed base 3011, an upper rotating disc 3013 erected above the lower rotating disc 3012, a driving rotating motor 3014 fixed downward on the upper end surface of the lower rotating disc 3012, and a gear 3015 coaxially fixed outside the rotating shaft of the lower end of the driving rotating motor 3014.

[0113] Based on this, in the present technical solution, the first lifting piece 304 and the second lifting piece 305 are both installed on the upper rotating disc 3013 and can move up and down; the fixed ring 306 is framed outside the fixed base 3011, has a certain gap between the inner surface and the outer peripheral surface of the fixed base 3011, and is provided with a ring of rotating teeth 3062 on the inner surface; and the gear 3015 is located in the gap and engages with the rotating teeth 3062.

[0114] Therefore, the driving rotating motor 3014 drives the gear 3015 to rotate, at this time, the gear 3015 rotates around the fixed ring 306 in the fixed ring 306, so as to drive the lower rotating disc 3012 to rotate on the upper part of the fixed base 3011, drive the upper rotating disc 3013 fixed thereon to rotate, and then realize the rotation of the first lifting piece 304 and the second lifting piece 305 by the upper rotating disc 3013, so as to finally realize the switching of the first solder pump 302 and the second solder pump 303 in position and the synchronous switching of the lifting height.

[0115] Therefore, the rotating disc type bracket 301 and the fixed ring 306 are optimized and designed, so that they have good driving function and compact structure, and occupy small space.

[0116] Furthermore, in the specific implementation, according to one embodiment of the present application, the arc-shaped slope 3061 of the fixed ring 306 is smoothly connected to the upper end surface of the fixed ring 306.

[0117] Thus, when the first lower convex piece 304a rotates along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, it can smoothly rotate along one of the lower end surfaces of the arched slope 3061 to the upper top surface of the arched slope 3061 and smoothly rotate along the upper top surface of the arched slope 3061 to the other lower end surface of the arched slope 3061 until the upper end surface of the fixed ring 306. Similarly, when the second lower convex piece 305a rotates along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, it can also smoothly rotate along one of the lower end surfaces of the arched slope 3061 to the upper top surface of the arched slope 3061 and smoothly rotate along the upper top surface of the arched slope 3061 to the other lower end surface of the arched slope 3061 until the upper end surface of the fixed ring 306.

[0118] Thus, when the first lower convex piece 304a rotates along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, it can smoothly rotate along one of the lower end surfaces of the arched slope 3061 to the upper top surface of the arched slope 3061 and smoothly rotate along the upper top surface of the arched slope 3061 to the other lower end surface of the arched slope 3061 until the upper end surface of the fixed ring 306. Similarly, when the second lower convex piece 305a rotates along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, it can also smoothly rotate along one of the lower end surfaces of the arched slope 3061 to the upper top surface of the arched slope 3061 and smoothly rotate along the upper top surface of the arched slope 3061 to the other lower end surface of the arched slope 3061 until the upper end surface of the fixed ring 306.

[0119] In addition, in specific implementation, it is also necessary to Figures 7 to 10 As shown in the figure, according to one embodiment of the present application, the first lower convex piece 304a comprises a first fixed cylinder 304a1 arranged at the bottom of the first lifting piece 304 and a first ball 304a2 clamped in the first fixed cylinder 304a1; the second lower convex piece 305a comprises a second fixed cylinder 305a1 arranged at the bottom of the second lifting piece 305 and a second ball 305a2 clamped in the second fixed cylinder 305a1;

[0120] Based on this, in the present technical solution, the lower part of the first fixed cylinder 304a1 is provided with a first necking; the lower part of the first ball 304a2 is exposed to the first necking; the lower part of the second fixed cylinder 305a1 is provided with a second necking; and the lower part of the second ball 305a2 is exposed to the second necking.

[0121] Therefore, it can be understood that, in actual use, on one hand, when the first lower convex piece 304a rotates along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, it rotates in a rolling manner through the first rolling ball 304a2 along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, so that the friction between the bottom of the first lower convex piece 304a and the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061 is greatly reduced, so that the first lower convex piece 304a is not easy to wear, thereby having a long service life; on the other hand, when the second lower convex piece 305a rotates along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, it rotates in a rolling manner through the second rolling ball 305a2 along the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061, so that the friction between the bottom of the second lower convex piece 305a and the upper end surface of the fixed ring 306 and the upper top surface of the arched slope 3061 is greatly reduced, so that the second lower convex piece 305a is not easy to wear, thereby having a long service life.

[0122] Further, the above-mentioned optimization design enables the whole structure of the application to have a further improved use effect.

[0123] Furthermore, in specific implementation, still according to Figures 7 to 10 As shown in the figure, according to one embodiment of the application, the first lifting piece 304 comprises a first top supporting plate 3041, a first bottom supporting plate 3042, and a plurality of first guide columns 3043 uniformly connected between the lower periphery of the first top supporting plate 3041 and the upper periphery of the first bottom supporting plate 3042.

[0124] Among them, the first solder pump 302 is upwardly fixed on the first top supporting plate 3041; a plurality of first guide holes 30131 corresponding to the plurality of first guide columns 3043 are opened on the upper disc 3013; the first fixed cylinder 304a1 of the first lower convex piece 304a is vertically fixed on the lower surface of the first bottom supporting plate 3042.

[0125] Therefore, it can be understood that, when the first rolling ball 304a2 of the first lower convex piece 304a rotates in a rolling manner from the upper end surface of the fixed ring 306 to the upper top surface of the arched slope 3061, the plurality of first guide columns 3043 can be automatically lifted along the plurality of first guide holes 30131, so that the first solder pump 302 fixed on the first top supporting plate 3041 is lifted by a preset stroke, so that after being lifted, it can perform soldering on a small soldering point of a certain soldering position on the PCB through the soldering nozzle.

[0126] And for the above-mentioned related operations, the plurality of first guide columns 3043 are correspondingly lifted along the plurality of first guide holes 30131, so that they have good upward and downward direction guiding property and are not easy to be circumferentially displaced, and in turn, the first solder pump 302 is not easy to be circumferentially displaced when being lifted along the upward and downward direction, so that it has stable operation.

[0127] And in specific implementation, according to one embodiment of the present application, a first installation opening is formed in the middle of the first top supporting plate 3041 and penetrates the upper and lower end faces thereof; a first through opening 30132 is formed in the upper turntable 3013 and penetrates the upper and lower end faces thereof and faces the first installation opening; and the upper part of the first solder pump 302 is clamped in the first installation opening and the lower part thereof penetrates downward through the first through opening 30132.

[0128] Thus, through the above-mentioned optimized design, the lower part of the first solder pump 302 is limited between the first top supporting plate 3041 and the first bottom supporting plate 3042 and is surrounded by the plurality of first guide columns 3043, so that it has good protection effect and is not easy to be collided by external objects, and the connection structure between it and the turntable type bracket 301 and the first lifting member 304 is more compact.

[0129] Again, in specific implementation, continue to refer to Figures 7 to 10 As shown, according to one embodiment of the present application, the second lifting member 305 comprises a second top supporting plate 3051, a second bottom supporting plate 3052 and a plurality of second guide columns 3053 which are uniformly connected between the lower periphery of the second top supporting plate 3051 and the upper end face periphery of the second bottom supporting plate 3052.

[0130] Among them, the second solder pump 303 is upwardly fixed on the second top supporting plate 3051; the upper turntable 3013 is provided with a plurality of second guide holes 30133 for correspondingly sleeving the plurality of second guide columns 3053; and the second fixing cylinder 305a1 of the second lower convex member 305a is vertically fixed on the lower bottom face of the second bottom supporting plate 3052.

[0131] Thus, it can be understood that when the second rolling ball 305a2 of the second lower convex member 305a is rotated from the upper end face of the fixing ring 306 to the upper top face of the arched slope 3061 in a rolling manner, the plurality of second guide columns 3053 can be automatically lifted along the plurality of second guide holes 30133, so that the second solder pump 303 fixed on the second top supporting plate 3051 is lifted by a preset stroke, so as to perform soldering on a large soldering point of a certain soldering position on the PCB board through the soldering nozzle after being lifted.

[0132] And for the above-mentioned related operation, the plurality of the second guide column 3053 is corresponding along the plurality of the second guide hole 30133 lifting, so that it is good in the up and down direction and not easy to circumferential displacement, in turn, so that the second solder pump 303 in the up and down direction, also not easy to circumferential displacement, so that its stable operation.

[0133] And, in the specific implementation, according to one embodiment of the present application, the second top plate 3051 middle part is provided with a second installation opening through the upper and lower end surface; the upper turntable 3013 is also provided with a second through opening 30134 through the upper and lower end surface and opposite to the second installation opening; the second solder pump 303 is clamped on the upper part of the second installation opening, and the lower part passes through the second through opening 30134 downward.

[0134] Thus, through the above-mentioned structure optimization design, even if the second solder pump 303 is limited between the second top plate 3051 and the second bottom plate 3052, and is surrounded by the plurality of the second guide column 3053, so that it has good protection effect, not easy to be collided by external objects, and the connection structure between the second solder pump 303 and the turntable type bracket 301 and the second lifting piece 305 is more compact.

[0135] Therefore, through the above-mentioned optimization design, the connection structure between the first solder pump 302 and the turntable type bracket 301 and the second lifting piece 305 is very compact, and the connection structure between the second solder pump 303 and the turntable type bracket 301 and the second lifting piece 305 is also very compact, so that the whole of the solder pump intelligent switching device 30 occupies small space, and then the whole of the present application, including the machine cover 10 provided therein, can be greatly reduced, so that the volume of the whole soldering machine equipment can be greatly reduced, so that it can still be installed and used in a small space environment.

[0136] It should be noted that, in the specific implementation, still according to the above-mentioned Figures 7 to 10 It is shown that, according to one embodiment of the present application, the turntable type bracket 301 further comprises a jacking device 3016;

[0137] Among them, the jacking device 3016 is connected between the lower turntable 3012 and the upper turntable 3013; when the jacking device 3016 controls the upper turntable 3013 to rise a predetermined stroke, it can jack up the first top plate 3041 and / or the second top plate 3051.

[0138] For example, when the first solder pump 302 is kept in the high position and the second solder pump 303 is kept in the low position, the lifting device 3016 controls the upper turntable 3013 to rise a short stroke, so that the upper turntable 3013 horizontally lifts the second top supporting plate 3051 and the second solder pump 303 fixed thereon, so that the second solder pump 303 can be stably lifted and supported, and the pressure of the second lower convex part 305a on the upper end surface of the fixed ring 306 can be greatly reduced, so that the fixed ring 306 and the second lower convex part 305a have a long service life.

[0139] Similarly, when the second solder pump 303 is kept in the high position and the first solder pump 302 is kept in the low position, the lifting device 3016 controls the upper turntable 3013 to rise a short stroke, so that the upper turntable 3013 horizontally lifts the first top supporting plate 3041 and the first solder pump 302 fixed thereon, so that the first solder pump 302 can be stably lifted and supported, and the pressure of the first lower convex part 304a on the upper end surface of the fixed ring 306 can be greatly reduced, so that the fixed ring 306 and the second lower convex part 305a have a long service life.

[0140] In addition, when the application is not used, the lifting device 3016 controls the upper turntable 3013 to rise a long stroke, so that the upper turntable 3013 horizontally lifts the first top supporting plate 3041 and the first solder pump 302 fixed thereon, and horizontally lifts the second top supporting plate 3051 and the second solder pump 303 fixed thereon, so that the first solder pump 302 and the second solder pump 303 can be stably lifted and supported, and the pressure of the first lower convex part 304a and the second lower convex part 305a on the upper end surface of the fixed ring 306 and the upper end surface of the arched slope 3061 can be greatly reduced, so that the fixed ring 306 and the arched slope 3061 have a long service life.

[0141] On this basis, in the preferred technical solution, an arc-shaped slope 3061 is arranged on the outer periphery of the upper end surface of the fixed ring 306, and the outer periphery of the fixed ring 306, except the arc-shaped slope 3061, is cut to form a hollow area. In this way, on the one hand, the first solder pump 302 is kept at a high position and the second solder pump 303 is kept at a low position, and when the upper turntable 3013 is lifted by the jacking device 3016 to a short stroke, the second solder pump 303 can be stably lifted and supported, and the bottom of the second lower protrusion 305a is in a suspended state, so as not to abut against the upper end surface of the fixed ring 306, thereby greatly prolonging the service life of the fixed ring 306 and the second lower protrusion 305a. On the other hand, the second solder pump 303 is kept at a high position and the first solder pump 302 is kept at a low position, and when the upper turntable 3013 is lifted by the jacking device 3016 to a short stroke, the first solder pump 302 can be stably lifted and supported, and the bottom of the first lower protrusion 304a is in a suspended state, so as not to abut against the upper end surface of the fixed ring 306, thereby greatly prolonging the service life of the fixed ring 306 and the second lower protrusion 305a.

[0142] Moreover, during the switching of the first solder pump 302 and the second solder pump 303, when the second solder pump 303 at a low position is stably lifted and supported by the upper turntable 3013, the bottom of the second lower protrusion 305a is also in a suspended state during rotation and does not abut against the upper end surface of the fixed ring 306, so as to be less likely to be worn. Similarly, when the first solder pump 302 at a low position is stably lifted and supported by the upper turntable 3013, the bottom of the first lower protrusion 304a is also in a suspended state during rotation and does not abut against the upper end surface of the fixed ring 306, so as to be less likely to be worn.

[0143] Furthermore, the above optimization design enables the whole application to be used more effectively.

[0144] Furthermore, according to an embodiment of the present application, the first solder pump 302 and the second solder pump 303 are preferably electromagnetic solder pumps.

[0145] And, in a specific implementation, according to one embodiment of the present application, the first lifting member 304 and the second lifting member 305 are symmetrically arranged on both sides of the axis in the fixed ring 306, so that the first solder pump 302 and the second solder pump 303 are also symmetrically arranged, and thus, when the rotary disc type bracket 301 rotates from the first position to the second position, the rotation angle is 180 degrees, so that the first solder pump 302 and the second solder pump 303 can well realize synchronous switching of the rotation position and the lifting height during rotation.

[0146] And in a specific implementation, according to one embodiment of the present application, the jacking device 3016 is preferably a screw transmission linear module, an electric hydraulic lifting module or a cylinder transmission linear module, which is common in the prior art, so details thereof will not be described here.

[0147] It should also be added that, in a specific implementation, referring to Figure 5 And Figure 6 It is shown that, according to one embodiment of the present application, the PCB clamping and conveying device 20 includes a front clamping member 201 and a rear clamping member 202.

[0148] The front clamping member 201 includes a front support 2011, a front drive motor 2012 and a plurality of front conveying members 2013. The front support 2011 has a plurality of front fixing holes 20111 uniformly opened in the vertical direction from left to right. A plurality of the front conveying members 2013 are rotatably clamped in the plurality of front fixing holes 20111 in the middle. The upper end of each front conveying member 2013 is coaxially provided with a front driven gear 20131, and the lower end is coaxially provided with a front inverted T-shaped lifting part 20132 for lifting the front side of the PCB. A plurality of front driven gears 20131 are sleeved with a front transmission chain (not shown). The front drive motor 2012 is installed on the front support 2011, and the shaft thereof is sleeved with a front driving gear 20121 engaged with the front transmission chain (not shown).

[0149] And, the rear clamping piece 202 includes a rear support 2021, a rear driving motor 2022 and a plurality of rear conveying pieces 2023; the rear support 2021 is uniformly provided with a plurality of rear fixing holes 20211 along the vertical direction from left to right; the plurality of rear conveying pieces 2023 are rotatably clamped in the plurality of rear fixing holes 20211 at the middle part, and the upper end of each of the plurality of rear conveying pieces 2023 is coaxially provided with a rear driven gear 20231, and the lower end is coaxially provided with a rear inverted T-shaped lifting part 20232 for lifting the rear side of the PCB; a plurality of rear driven gears 20231 are provided with a rear transmission chain (not shown); the rear driving motor 2022 is installed on the rear support 2021, and the rotating shaft is provided with a rear driving gear 20221 which is engaged with the rear transmission chain (not shown).

[0150] Therefore, on the one hand, when the present application is applied, the clamping interval between the plurality of front inverted T-shaped lifting parts 20132 and the rear inverted T-shaped lifting parts 20232 is just suitable for clamping the PCB material to be welded, then the PCB material is pushed into the housing 10 from the PCB feeding port 101, the front side of the PCB is lifted by the plurality of front inverted T-shaped lifting parts 20132, and the rear side of the PCB is lifted by the plurality of rear inverted T-shaped lifting parts 20232, so that the PCB does not fall, on the other hand, the front driving motor 2012 and the rear driving motor 2022 are started synchronously, and the rotating frequency and rotating speed are kept consistent, then the rotating direction of the front driving motor 2012 and the rear driving motor 2022 is kept opposite, for example, the front driving motor 2012 rotates clockwise, which drives the plurality of front inverted T-shaped lifting parts 20132 to rotate clockwise synchronously, and the rear driving motor 2022 rotates counterclockwise, which drives the plurality of rear inverted T-shaped lifting parts 20232 to rotate counterclockwise synchronously, so that the PCB clamped and lifted by the plurality of front inverted T-shaped lifting parts 20132 and the plurality of rear inverted T-shaped lifting parts 20232 is conveyed to the right when the plurality of front inverted T-shaped lifting parts 20132 rotate clockwise synchronously and the plurality of rear inverted T-shaped lifting parts 20232 rotate counterclockwise synchronously, so as to be pushed out of the PCB discharging port 102, thus completing the welding of the lower surface welding points of the PCB.

[0151] Preferably, in the technical scheme of the present application, continue to refer to Figure 5 and Figure 6 As shown in the drawings, according to an embodiment of the present application, the PCB clamping and conveying device 20 further includes a front and rear moving member 203;

[0152] The front and rear moving member 203 is fixedly arranged in the upper portion of the machine cover 10; the rear support 2021 is arranged on the front and rear moving member 203 and can move forward and backward under the control of the front and rear moving member 203, so that the plurality of rear inverted T-shaped lifting portions 20232 fixedly arranged on the rear support 2021 can be synchronously adjusted in the forward and backward positions.

[0153] Therefore, in actual application, the soldering of the soldering points on the lower bottom surface of the PCB with different widths can be realized, and the PCB clamping and conveying device 20 in the application can be used to clamp and lift the PCB with different widths to realize the soldering of the soldering points at each position on the lower bottom surface of the PCB, so that the adaptability and flexibility of the application are strong.

[0154] Furthermore, the PCB clamping and conveying device 20 in the application can be used to clamp and lift the PCB with different widths to realize the soldering of the soldering points at each position on the lower bottom surface of the PCB, so that the adaptability and flexibility of the application are strong.

[0155] Preferably, in the technical scheme of the application, the left and right supports 50 and 60 are arranged in the front and rear direction and are fixedly arranged in the machine cover 10. Figure 5 and Figure 6 As shown in the left and right supports 50 and 60, the application further comprises a left hanging bracket 50 and a right hanging bracket 60 arranged in the front and rear direction and fixedly arranged in the machine cover 10.

[0156] Based on this, in the application, the front and rear moving member 203 comprises a left front rotating seat 2031, a left rear rotating seat 2032, a left rotating screw 2033, a left sliding rail 2034, a left sliding block 2035, a left turbine 2036, a right front rotating seat 2037, a right rear rotating seat 2038, a right rotating screw 2039, a right sliding rail 2040, a right sliding block 2041, a right turbine 2042, a worm 2043 and a transmission motor 2044.

[0157] The left front rotating seat 2031 is fixedly arranged in the front lower portion of the left hanging bracket 50; the left rear rotating seat 2032 is fixedly arranged in the rear lower portion of the left hanging bracket 50; the left rotating screw 2033 is rotatably fixedly arranged between the left front rotating seat 2031 and the left rear rotating seat 2032; the left sliding rail 2034 is fixedly arranged on the lower bottom surface of the left hanging bracket 50 in the front and rear direction; the left sliding block 2035 is fixedly arranged on the left sliding rail 2034 and can slide forward and backward, and a left screw hole penetrating through the front and rear end faces is formed in the lower middle portion of the left sliding block 2035, and the left screw hole is threadedly connected to the outer portion of the left rotating screw 2033; and the left turbine 2036 is coaxially fixedly arranged on the rear end of the left rotating screw 2033.

[0158] And, the right front rotating seat 2037 is fixedly arranged at the front lower portion of the right hanger 60; the right rear rotating seat 2038 is fixedly arranged at the rear lower portion of the right hanger 60; the right rotating screw rod 2039 is rotatably fixedly arranged between the right front rotating seat 2037 and the right rear rotating seat 2038; the right sliding rail 2040 is fixedly arranged at the lower bottom surface of the right hanger 60 in the front-rear direction; the right sliding block 2041 is slidably fixedly arranged on the right sliding rail 2040, and a right screw hole penetrating through the front-rear end surface is formed in the lower middle portion of the right sliding block 2041, and the right screw hole is threadedly connected to the outer portion of the right rotating screw rod 2039; and the right turbine 2042 is coaxially fixedly arranged at the rear end of the right rotating screw rod 2039.

[0159] Meanwhile, the front support 2011 is fixedly arranged at the bottom of the left front rotating seat 2031 and the bottom of the right front rotating seat 2037; the rear support 2021 is fixedly arranged at the bottom of the left sliding block 2035 and the bottom of the right sliding block 2041; the worm 2043 is rotatably fixedly arranged between the left rear rotating seat 2032 and the right rear rotating seat 2038, and is engaged with the left turbine 2036 and the right turbine 2042; and the transmission motor 2044 is fixedly arranged on the left rear rotating seat 2032 and is coaxially connected to the left end of the worm 2043.

[0160] Therefore, it can be clearly understood that the working principle of the front-rear moving member 203 is as follows:

[0161] When the transmission motor 2044 is started, the worm 2043 is driven to rotate, and the left turbine 2036 and the right turbine 2042 are simultaneously driven to rotate, and the left rotating screw rod 2033 and the right rotating screw rod 2039 are simultaneously driven to rotate, and the left sliding block 2035 is driven to move forward or backward along the left sliding rail 2034, and the right sliding block 2041 is driven to move forward or backward along the right sliding rail 2040, so that the rear support 2021 and the plurality of rear inverted T-shaped lifting portions 20232 fixedly arranged on the rear support 2021 are simultaneously driven to move forward or backward, and the front-rear position of the plurality of rear inverted T-shaped lifting portions 20232 is simultaneously adjustable, so that the gap between the plurality of rear inverted T-shaped lifting portions 20232 and the plurality of front inverted T-shaped lifting portions 20132 is adjustable.

[0162] For the above, it can be understood that the front and rear moving member 203 described in the application is a combination of worm gear 2043 transmission and screw rod transmission to control the synchronous forward movement or synchronous backward movement of the rear support 2021 and the plurality of rear inverted T-shaped lifting portions 20232 fixedly arranged thereon. In this control process, on the one hand, only one transmission motor 2044 is used to realize the conversion of power into the linear movement of the rear support 2021 and the plurality of rear inverted T-shaped lifting portions 20232 fixedly arranged thereon in the front and rear direction, so as to greatly save the cost of motor use and maintenance cost. On the other hand, the worm gear 2043 transmission and the screw rod transmission both have good stability and transmission accuracy, so as to stably and accurately control the synchronous forward movement of the rear support 2021 and the plurality of rear inverted T-shaped lifting portions 20232 fixedly arranged thereon by a preset stroke or the synchronous backward movement by a preset stroke, thereby greatly improving the reliability of the front and rear moving member 203 described in the application in actual work.

[0163] Further, the above optimization design enables the whole application to achieve the best use effect.

[0164] Other embodiments and the like are not exemplified here.

[0165] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "exemplary", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0166] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields under the inventive concept of the present application is included in the patent protection scope of the present application.

Claims

1. A solder pump intelligent switchable selective soldering machine, characterized in that, It comprises: a machine cover; a PCB plate feeding port is opened in the middle of the left end face of the machine cover, and a PCB plate discharging port is opened in the middle of the right end face of the machine cover and is opposite to the PCB plate feeding port; a PCB plate clamping and conveying device; the PCB plate clamping and conveying device is fixedly arranged in the machine cover along the left-right direction and is connected with the PCB plate feeding port and the PCB plate discharging port at the left and right ends thereof; an intelligent switching device of a soldering pump; the intelligent switching device of the soldering pump is fixedly arranged in the machine cover and is located below the PCB plate clamping and conveying device, and has two soldering pumps which are arranged upwards and can be switched with each other in a rotating manner; a two-dimensional moving table for controlling the forward and backward movement and the left and right movement of the intelligent switching device of the soldering pump; the two-dimensional moving table is fixedly arranged at the bottom of the machine cover; the intelligent switching device of the soldering pump is mounted on the two-dimensional moving table; the intelligent switching device of the soldering pump comprises a rotating disc type bracket, a first soldering pump, a second soldering pump, a first lifting piece, a second lifting piece and a fixing ring; the first lifting piece and the second lifting piece are movably mounted on the rotating disc type bracket; the first soldering pump is fixedly arranged at the top of the first lifting piece; the second soldering pump is fixedly arranged at the top of the second lifting piece; the fixing ring is arranged around the bottom of the rotating disc type bracket and is mounted on the two-dimensional moving table together with the rotating disc type bracket, and an arc-shaped slope is arranged on the upper end face of the fixing ring; the bottom of the first lifting piece is provided with a first lower protrusion which abuts against the upper end face of the fixing ring and can rotate along the upper end face of the fixing ring; the bottom of the second lifting piece is provided with a second lower protrusion which abuts against the upper end face of the fixing ring and can rotate along the upper end face of the fixing ring; when the rotating disc type bracket rotates to a first position, the first lower protrusion abuts against the top surface of the arc-shaped slope to drive the first lifting piece to rise and lift the first soldering pump; when the rotating disc type bracket rotates to a second position, the second lower protrusion abuts against the top surface of the arc-shaped slope to drive the second lifting piece to rise and lift the second soldering pump.

2. The solder pump selectively switchable intelligent soldering machine according to claim 1, characterized in that, the rotating disc type bracket comprises a fixed base mounted on the two-dimensional moving table, a lower rotating disc rotatably sleeved on the upper part of the fixed base, an upper rotating disc arranged above the lower rotating disc, a driving rotating motor fixedly arranged on the upper end face of the lower rotating disc downwards and a gear coaxially fixed on the rotating shaft outside the lower end of the driving rotating motor; the fixed base is mounted on the two-dimensional moving table; the first lifting piece and the second lifting piece are movably mounted on the upper rotating disc; the fixing ring is arranged around the fixed base, and a gap is formed between the inner surface of the fixing ring and the outer circumferential surface of the fixed base, and a ring of rotating teeth is arranged on the inner surface of the fixing ring; the gear is located in the gap and is engaged with the rotating teeth.

3. The selective soldering machine with intelligent switchable solder pump according to claim 1, characterized in that the first lower protrusion comprises a first fixed cylinder arranged at the bottom of the first lifting piece and a first ball sleeved in the first fixed cylinder; the second lower protrusion comprises a second fixed cylinder arranged at the bottom of the second lifting piece and a second ball sleeved in the second fixed cylinder; the lower part of the first fixed cylinder is provided with a first necking portion; the lower part of the first ball is exposed to the first necking portion; the lower part of the second fixed cylinder is provided with a second necking portion; the lower part of the second ball is exposed to the second necking portion.

4. The solder pump selectively switchable intelligent soldering machine according to claim 2, characterized in that, the first lifting piece comprises a first top supporting plate, a first bottom supporting plate and a plurality of first guide columns uniformly connected between the lower circumferential surface of the first top supporting plate and the upper end circumferential surface of the first bottom supporting plate; The first solder pump is fixed upward on the first top supporting plate; the upper rotating disc is provided with a plurality of first guide holes corresponding to a plurality of first guide columns; the first fixed cylinder of the first lower protruding part is fixed vertically on the lower bottom surface of the first bottom supporting plate.

5. The solder pump selectively switchable intelligent soldering machine according to claim 4, characterized in that, The second lifting part comprises a second top supporting plate, a second bottom supporting plate and a plurality of second guide columns evenly connected between the lower bottom surface of the second top supporting plate and the upper end surface of the second bottom supporting plate; The second solder pump is fixed upward on the second top supporting plate; the upper rotating disc is provided with a plurality of second guide holes corresponding to a plurality of second guide columns; the second fixed cylinder of the second lower protruding part is fixed vertically on the lower bottom surface of the second bottom supporting plate.

6. The solder pump selectively switchable intelligent soldering machine of claim 5, wherein, The rotating disc type bracket further comprises a jacking device; The jacking device is connected between the lower rotating disc and the upper rotating disc; when the jacking device controls the upper rotating disc to rise by a preset stroke, the first top supporting plate and / or the second top supporting plate can be jacked up.

7. The solder pump switchable selective soldering machine of any of claims 1-6, wherein, The PCB clamping and conveying device comprises a front clamping part and a rear clamping part; The front clamping part comprises a front support, a front driving motor and a plurality of front conveying parts; the front support is uniformly provided with a plurality of front fixed holes vertically from left to right; the middle parts of the plurality of front conveying parts are rotatably clamped in the plurality of front fixed holes, and the upper ends of the plurality of front conveying parts are coaxially provided with a front driven gear, and the lower ends are coaxially provided with a front inverted T-shaped lifting part for lifting the front side of the PCB; the plurality of front driven gears are sleeved with a front transmission chain; the front driving motor is installed on the front support, and the shaft thereof is sleeved with a front driving gear engaged with the front transmission chain; The rear clamping part comprises a rear support, a rear driving motor and a plurality of rear conveying parts; the rear support is uniformly provided with a plurality of rear fixed holes vertically from left to right; the middle parts of the plurality of rear conveying parts are rotatably clamped in the plurality of rear fixed holes, and the upper ends of the plurality of rear conveying parts are coaxially provided with a rear driven gear, and the lower ends are coaxially provided with a rear inverted T-shaped lifting part for lifting the rear side of the PCB; the plurality of rear driven gears are sleeved with a rear transmission chain; the rear driving motor is installed on the rear support, and the shaft thereof is sleeved with a rear driving gear engaged with the rear transmission chain.

8. The solder pump selectively switchable intelligent soldering machine according to claim 7, characterized in that, The PCB clamping and conveying device further comprises a front-rear moving member; The front-rear moving member is fixedly arranged in the upper part of the housing; the rear support is installed on the front-rear moving member, so as to move forward and backward under the control of the front-rear moving member.

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